Apparatus for manufacturing the display device, method for manufacturing the display device and the display device

Abstract

A manufacturing device for a display device is provided. The manufacturing device for a display device comprises: a stage on which a substrate is placed; a sensor unit that captures and / or measures the substrate and the stage to obtain data; a pattern generation unit that analyzes the data to calculate the size of the substrate and position information of the substrate relative to the stage, and generates a pattern map based on the size and position information of the substrate; and an inkjet head unit including at least one inkjet head that sprays ink onto the substrate based on the pattern map, and attaches the substrate coated with ink onto one side of a display panel.

Description

Technology Field

[0001] The present invention relates to a device for manufacturing a display device, a method for manufacturing a display device, and a display device. Background Technology

[0002] As the information society develops, the demand for display devices for displaying images is increasing in various forms. Display devices may be flat panel display devices such as Liquid Crystal Displays, Field Emission Displays, and Light Emitting Displays. Light Emitting Displays may include organic light-emitting display devices comprising organic light-emitting diode elements as light-emitting elements, or light-emitting diode display devices comprising inorganic light-emitting diode elements such as LEDs as light-emitting elements.

[0003] The display device may include a cover window to protect the display panel. The cover window may be attached to the display panel using an optically clear adhesive. The optically clear adhesive may be applied to the display panel using an application method utilizing an inkjet device or a roller. The problem to be solved

[0004] The problem that the present invention aims to solve is to provide a manufacturing apparatus for a display device capable of applying an appropriate amount of optically transparent adhesive at an accurate location on a substrate using a pattern map based on the size and position of the substrate.

[0005] The problems of the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem

[0006] A manufacturing device for a display device according to one embodiment for solving the above problem comprises: a stage on which a substrate is placed; a sensor unit that captures and / or measures the substrate and the stage to obtain data; a pattern generation unit that analyzes the data to calculate the size of the substrate and position information of the substrate relative to the stage, and generates a pattern map based on the size and position information of the substrate; and an inkjet head unit including at least one inkjet head that sprays ink onto the substrate based on the pattern map, and attaches the substrate coated with ink onto one surface of a display panel.

[0007] The above data may include a line image of the substrate taken of the edge of the substrate.

[0008] The above stage includes a first alignment mark and a second alignment mark, wherein the first alignment mark includes a first sub-mark extending in a first direction and a second sub-mark extending in a second direction intersecting the first direction, and the second alignment mark may include a third sub-mark extending in a first direction and a fourth sub-mark extending in a second direction intersecting the first direction.

[0009] The pattern generating unit measures a first distance between the first sub-mark and the first side of the line image and a second distance between the second sub-mark and the second side of the line image, and can measure a third distance between the third sub-mark and the first side of the line image and a fourth distance between the fourth sub-mark and the third side of the line image.

[0010] The pattern generating unit measures a first angle formed by a virtual line extending in the first direction of the first sub-mark and a virtual line extending on the second side of the line image, and a second angle formed by a virtual line extending in the second direction of the second sub-mark and a virtual line extending on the first side of the line image; and measures a third angle formed by a virtual line extending in the first direction of the third sub-mark and a virtual line extending on the third side of the line image, and a fourth angle formed by a virtual line extending in the second direction of the fourth sub-mark and a virtual line extending on the first side of the line image.

[0011] Based on the information of the first distance, the second distance, the third distance, the fourth distance, the first angle, the second angle, the third angle, and the fourth angle, position information of the substrate relative to the stage can be calculated.

[0012] It may further include a light irradiation unit configured to irradiate light and positioned spaced apart from the inkjet head unit in one direction.

[0013] It may further include an alignment unit disposed between the stage and the sensor unit and aligning the substrate mounted on the stage.

[0014] The sensor unit may include at least one of a line scan camera, a vision camera, and a laser.

[0015] The pattern map can be generated by adding or subtracting an offset from the size and position information of the above substrate.

[0016] The above stage may further include a stage moving part that moves the stage along one direction.

[0017] A method for manufacturing a display device according to one embodiment for solving a problem may include: a step of placing a substrate on a stage; a step of obtaining data by photographing and / or measuring the substrate and the stage; a step of calculating the size of the substrate and position information of the substrate relative to the stage by analyzing the data; a step of generating a pattern map based on the size and position information of the substrate; a step of spraying ink onto the substrate based on the pattern map; and a step of attaching the substrate on which the ink has been sprayed onto one surface of a display panel.

[0018] The above data may include a line image of the substrate captured by a line scan camera of the edge of the substrate.

[0019] The above stage includes a first alignment mark and a second alignment mark, wherein the first alignment includes a first sub-mark extending in a first direction and a second sub-mark extending in a second direction intersecting the first direction, and the second alignment mark may include a third sub-mark extending in a first direction and a fourth sub-mark extending in a second direction intersecting the first direction.

[0020] The step of calculating position information of the substrate relative to the stage may include: a step of measuring a first distance between the first sub-mark and the first side of the line image and a second distance between the second sub-mark and the second side of the line image; and a step of measuring a third distance between the third sub-mark and the first side of the line image and a fourth distance between the fourth sub-mark and the third side of the line image.

[0021] The step of calculating position information of the substrate relative to the stage may further include the step of measuring a first angle formed by a virtual line extending in the first direction of the first sub-mark and a virtual line extending on the second side of the line image, and a second angle formed by a virtual line extending in the second direction of the second sub-mark and a virtual line extending on the first side of the line image, and the step of measuring a third angle formed by a virtual line extending in the first direction of the third sub-mark and a virtual line extending on the third side of the line image, and a fourth angle formed by a virtual line extending in the second direction of the fourth sub-mark and a virtual line extending on the first side of the line image.

[0022] The step of calculating position information of the substrate relative to the stage may further include the step of calculating position information of the substrate relative to the stage based on information of the first distance, the second distance, the third distance, the fourth distance, the first angle, the second angle, the third angle, and the fourth angle.

[0023] After the step of spraying ink onto the substrate, the method may further include the step of irradiating light onto the ink sprayed onto the substrate.

[0024] The step of aligning the substrate before the step of obtaining the above data may be further included.

[0025] An electronic device according to one embodiment for solving a problem comprises: a display device that provides an image; and a processor that transmits an image data signal to the display device. The display device may be manufactured by the steps of: placing a substrate on a stage; photographing and / or measuring the substrate and the stage to obtain data; analyzing the data to calculate the size of the substrate and position information of the substrate relative to the stage; generating a pattern map based on the size and position information of the substrate; spraying ink onto the substrate based on the pattern map; and attaching the substrate on which the ink has been sprayed onto one side of a display panel. Effects of the invention

[0026] A manufacturing device for a display device according to one embodiment of the present invention can generate a pattern map based on the size of the substrate and position information of the substrate relative to the stage, and spray an appropriate amount of ink onto the substrate in accordance with the size of the substrate. Since a pattern map generated according to the actual size of the substrate is used instead of an arbitrarily set pattern map, overflow or incomplete filling of the ink sprayed onto the substrate can be prevented.

[0027] In addition, an appropriate pattern map can be generated on the substrate without a separate alignment process.

[0028] The effects according to the embodiments are not limited to those exemplified above, and a wider variety of effects are included in this specification. Brief explanation of the drawing

[0029] FIG. 1 is a plan view showing a display device according to one embodiment. Figure 2 is a cross-sectional view taken along A1-A1' of Figure 1. FIG. 3 is a cross-sectional view showing an example of a display panel according to one embodiment. FIG. 4 is a cross-sectional view showing an example of a polarizing plate of different sizes according to one embodiment. Figure 5 is a drawing showing the polarizing plate of Figure 4 (a) and the adhesive member applied on the polarizing plate. Figure 6 is a cross-sectional view taken along A2-A2' of Figure 5. Figure 7 is a drawing showing the polarizing plate of Figure 4 (b) and the adhesive member applied on the polarizing plate. Figure 8 is a cross-sectional view taken along A3-A3' of Figure 7. FIG. 9 is a drawing showing the polarizing plate of FIG. 4 (c) and the adhesive member applied on the polarizing plate. Figure 10 is a cross-sectional view taken along A4-A4' of Figure 9. FIG. 11 is a perspective view showing a manufacturing apparatus for a display device according to one embodiment. FIG. 12 is a plan view showing a manufacturing apparatus for a display device according to one embodiment. FIG. 13 is a flowchart illustrating a method for manufacturing a display device according to one embodiment. FIG. 14 is a cross-sectional view showing the stage and polarizer in step S100 of FIG. 13. FIG. 15 is an example drawing for explaining data captured of a polarizer and a stage in step S200 of FIG. 13. FIG. 16 is an example diagram illustrating the calculation of position information of the polarizer relative to the stage from data captured of the polarizer and the stage in step S300 of FIG. 13. FIG. 17 is an example diagram illustrating the calculation of position information of the polarizer relative to the stage from data captured of the polarizer and the stage in step S300 of FIG. 13. FIG. 18 is an example drawing showing a pattern map of an adhesive member applied on a polarizer in step S400 of FIG. 13. FIG. 19 is an example drawing for explaining data captured of a polarizer and a stage in step S200 of FIG. 13. FIG. 20 is an example diagram illustrating the calculation of position information of a polarizer relative to a stage from data captured of a polarizer and a stage in step S300 of FIG. 13. FIG. 21 is an example diagram illustrating the calculation of position information of a polarizer relative to a stage from data captured of a polarizer and a stage in step S300 of FIG. 13. FIG. 22 is an example drawing showing a pattern map of an adhesive member applied on a polarizer in step S400 of FIG. 13. FIG. 23 is an example drawing showing a pattern map generated on a polarizer when there is no alignment part in a conventional display device manufacturing device. FIG. 24 is an example drawing showing a pattern map generated on a polarizer when there is no alignment part in a manufacturing device for a display device according to one embodiment of the present invention. FIG. 25 is an example drawing showing the spraying of an adhesive member onto a polarizing plate in step S500 of FIG. 13. Figure 26 is a drawing of an inkjet head. FIG. 27 is an example drawing showing the process of curing by irradiating light onto an adhesive member coated on a polarizing plate. FIG. 28 is a plan view showing a manufacturing apparatus for a display device according to one embodiment. FIG. 29 is an example drawing showing a pattern map generated after alignment of polarizers according to one embodiment. FIG. 30 is an exploded perspective view of a display device according to one embodiment. FIG. 31 is a block diagram of an electronic device according to one embodiment. FIG. 32 is a schematic diagram of an electronic device according to various embodiments. Specific details for implementing the invention

[0030] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims.

[0031] When an element or layer is referred to as being "on" another element or layer, it includes cases where another layer or element is interposed directly above or in between. Likewise, when referred to as "below," "left," and "right," it includes cases where they are interposed immediately adjacent to another element or where another layer or material is interposed in between. Throughout the specification, the same reference numerals refer to the same components.

[0032] Specific embodiments will be described below with reference to the attached drawings.

[0033] FIG. 1 is a plan view showing a display device according to one embodiment.

[0034] Referring to FIG. 1, the display device (DD) according to the present embodiment is a device for displaying video or still images and can be used as a display screen for various products such as televisions, laptops, monitors, billboards, and the Internet of Things (IOT), as well as portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, PMPs (portable multimedia players), navigation systems, and UMPCs (Ultra Mobile PCs). The display device (DD) may be any one of an organic light-emitting display device, a liquid crystal display device, a plasma display device, a field emission display device, an electrophoretic display device, an electrowetting display device, a quantum dot light-emitting display device, and a micro LED display device. Although the following description focuses on the case where the display device (DD) is an organic light-emitting display device, the present invention is not limited thereto.

[0035] The display device (DD) may have various shapes. For example, the display device (DD) may have a roughly rectangular shape on a plane along a first direction (DR1) and a second direction (DR2). For example, the display device (DD) may include two first sides extending in the first direction (DR1) and two second sides extending in the second direction (DR2) on the plane. In one embodiment, the first side may be shorter than the second side, but is not limited thereto.

[0036] In the illustrated drawings, the first direction (DR1) and the second direction (DR2) each intersect each other as horizontal directions. For example, the first direction (DR1) and the second direction (DR2) may be mutually orthogonal. Additionally, the third direction (DR3) intersects the first direction (DR1) and the second direction (DR2), and may be, for example, an orthogonal vertical direction. In this specification, one side of the first to third directions (DR1, DR2, DR3) refers to the direction indicated by the arrow in the drawings, and the other side may refer to the direction opposite to the direction indicated by the arrow. If only the first to third directions (DR1, DR2, DR3) are specified without mentioning one side or the other side of the first to third directions (DR1, DR2, DR3), it may include both the one side and the other side.

[0037] The display device (DD) may have angled corners or rounded corners. For example, the corner where the first side and the second side of the display device (DD) meet may be a right angle or a curved surface.

[0038] The planar shape of the display device (DD) is not limited to the example shown and may be changed to a circular, elliptical, or other shape. Additionally, while FIG. 1 illustrates an embodiment in which the display surface of the display device (DD), including the display area (DA), is flat, the embodiments are not limited thereto. For example, the display surface of the display device (DD) may include a curved surface in at least one part.

[0039] The display device (DD) may include a display area (DA) and a non-display area (NDA) located around the display area (DA).

[0040] The display area (DA) may include pixels for displaying an image. The display area (DA) may further include, in addition to the pixels, scan lines, data lines, and power lines connected to the pixels.

[0041] A non-display area (NDA) may be disposed on at least one side of a display area (DA) and may partially or wholly surround the display area (DA). In the non-display area (NDA), wiring, pads, and / or at least one driving circuit electrically connected to pixels of the display area (DA) may be disposed.

[0042] Figure 2 is a cross-sectional view taken along A1-A1' of Figure 1.

[0043] Referring to FIG. 2 in addition to FIG. 1, a display device (DD) according to one embodiment may include a display panel (DP), a polarizing film (PL), an adhesive member (ADH), a cover window (CW), and a panel lower cover (PB). The display panel (DP) may include a substrate (SUB), a display layer (DISL), an encapsulation layer (ENC), and a sensor electrode layer (SENL).

[0044] The substrate (SUB) may include a transparent material. For example, the substrate (SUB) may include a transparent insulating material such as glass, quartz, etc. The substrate (SUB) may be a rigid substrate. However, the substrate (SUB) is not limited thereto and may include a plastic such as polyimide, etc., and may have flexible properties that allow it to be bent, folded, or rolled.

[0045] A display layer (DISL) may be disposed on a first surface of a substrate (SUB). The display layer (DISL) may be a layer that displays an image. The display layer (DISL) may include a thin-film transistor layer (TFTL) (see FIG. 3) in which thin-film transistors are formed, and a light-emitting element layer (EML) (see FIG. 3) in which light-emitting elements are disposed in light-emitting regions.

[0046] The display layer (DISL) may include scan lines, data lines, power lines, etc. for light-emitting regions to emit light in the display area (DA). The display layer (DISL) may include a scan driving circuit that outputs scan signals to the scan lines in the non-display area (NDA), and fan-out lines connecting the data lines to the driving IC.

[0047] The encapsulation layer (ENC) may be a layer for encapsulating the light-emitting element layer of the display layer (DISL) to prevent oxygen or moisture from penetrating the light-emitting element layer of the display layer (DISL). The encapsulation layer (ENC) may be disposed on the display layer (DISL). The encapsulation layer (ENC) may be disposed on the top surface and sides of the display layer (DISL). The encapsulation layer (ENC) may be disposed to cover the display layer (DISL).

[0048] A sensor electrode layer (SENL) may be disposed on a display layer (DISL). The sensor electrode layer (SENL) may include sensor electrodes. The sensor electrode layer (SENL) can detect a user's touch using the sensor electrodes.

[0049] A polarizing film (PL) may be disposed on a sensor electrode layer (SENL). The polarizing film (PL) may be disposed on a display panel (DP) to reduce external light reflection. The polarizing film (PL) may include a first base member, a linear polarizer, a phase delay film such as a λ / 4 plate (quarter-wave plate), and a second base member. The first base member, the phase delay film, the linear polarizer, and the second base member of the polarizing film (PL) may be sequentially laminated on the display panel (DP).

[0050] A cover window (CW) may be placed on a polarizing film (PL). The cover window (CW) may have transparent properties so that light generated from a display panel (DP) can be transmitted. The cover window (CW) may comprise glass or plastic material. In some embodiments, when the cover window (CW) comprises glass, it may comprise chemically ion-exchanged strengthened glass. In other embodiments, when the cover window (CW) comprises plastic, it may comprise a polyimide (PI) film.

[0051] A cover window (CW) can be attached to a polarizing film (PF) by an adhesive member (ADH). The adhesive member (ADH) may include any one of a pressure-sensitive adhesive (PSA), an optical clear adhesive (OCA), and an optical clear resin (OCR).

[0052] In one embodiment, the adhesive member (ADH) can be formed by applying and curing a liquid adhesive material (AM) (see FIG. 26) using a manufacturing device (1000) (see FIG. 11) for a display device described later.

[0053] A panel lower cover (PB) may be placed on a second surface of a substrate (SUB) of a display panel (DP). The second surface of the substrate (SUB) may be the opposite surface of the first surface. The panel lower cover (PB) may be attached to the second surface of the substrate (SUB) of the display panel (DP) through an adhesive member such as a pressure sensitive adhesive (PSA).

[0054] The panel lower cover (PB) may include at least one of a light-blocking member for absorbing light incident from the outside, a cushioning member for absorbing shock from the outside, and a heat dissipation member for efficiently dissipating heat from the display panel (DP).

[0055] A manufacturing device (1000) for a display device and a method for manufacturing a display device for forming an adhesive member (ADH) will be described later.

[0056] FIG. 3 is a cross-sectional view showing an example of a display panel according to one embodiment.

[0057] Referring to FIG. 3, in some embodiments, the display panel (DP) may be an organic light-emitting display panel having a light-emitting element (LEL) including an organic light-emitting layer (172). The display panel (DP) may include a substrate (SUB), a display layer (DISL), an encapsulation layer (ENC), and a sensor electrode layer (SENL). The display layer (DISL) may include a thin-film transistor layer (TFTL) including a plurality of thin-film transistors and a light-emitting element layer (EML) including a plurality of light-emitting elements.

[0058] The substrate (SUB) may include a transparent material. For example, the substrate (SUB) may include a transparent insulating material such as glass, quartz, etc. The substrate (SUB) may be a rigid substrate. However, the substrate (SUB) is not limited thereto and may include a plastic such as polyimide, etc., and may have flexible properties that allow it to be bent, folded, or rolled.

[0059] The display layer (DISL) may include a thin-film transistor layer (TFTL) comprising a plurality of thin-film transistors and a light-emitting element layer (EML) comprising a plurality of light-emitting elements.

[0060] The thin film transistor layer (TFTL) may include a first buffer layer (BF1), a thin film transistor (TFT), a gate insulating layer (130), a first interlayer insulating layer (141), a capacitor (Cst), a second interlayer insulating layer (142), a first data metal layer, a first organic layer (160), a second data metal layer, and a second organic layer (180).

[0061] The first buffer film (BF1) may be disposed on a substrate (SUB). The first buffer film (BF1) may be formed from an inorganic material such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer. Alternatively, the first buffer film (BF1) may be formed as a multilayer film in which a plurality of layers among a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked.

[0062] An active layer comprising a channel region (TCH), a source region (TS), and a drain region (TD) of a thin-film transistor (TFT) may be disposed on a first buffer film (BF1). The active layer may be formed of polycrystalline silicon, single-crystal silicon, low-temperature polycrystalline silicon, amorphous silicon, or an oxide semiconductor material. If the active layer comprises polycrystalline silicon or an oxide semiconductor material, the source region (TS) and the drain region (TD) in the active layer may be conductive regions that are doped with ions or impurities to provide conductivity.

[0063] A gate insulating film (130) can be placed on the active layer of a thin-film transistor (TFT). The gate insulating film (130) can be formed from an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0064] A first gate metal layer comprising a gate electrode (TG) of a thin-film transistor (TFT), a first capacitor electrode (CAE1) of a capacitor (Cst), and scan lines may be disposed on a gate insulating film (130). The gate electrode (TG) of the thin-film transistor (TFT) may overlap with a channel region (TCH) in a third direction (Z-axis direction). The first gate metal layer may be formed as a single layer or a multilayer composed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0065] The first interlayer insulating film (141) may be disposed on the first gate metal layer. The first interlayer insulating film (141) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating film (141) may include a plurality of inorganic films.

[0066] A second gate metal layer comprising a second capacitor electrode (CAE2) of a capacitor (Cst) may be disposed on a first interlayer insulating film (141). The second capacitor electrode (CAE2) may overlap with the first capacitor electrode (CAE1) in a third direction (Z-axis direction). Thus, a capacitor (Cst) may be formed by the first capacitor electrode (CAE1), the second capacitor electrode (CAE2), and an inorganic insulating dielectric film disposed between them that acts as a dielectric film. The second gate metal layer may be formed as a single layer or a multilayer composed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0067] The second interlayer insulating film (142) may be disposed on the second gate metal layer. The second interlayer insulating film (142) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating film (142) may include a plurality of inorganic films.

[0068] A first data metal layer comprising a first connection electrode (CE1) and data wirings may be disposed on a second interlayer insulating film (142). The first connection electrode (CE1) may be connected to a drain region (TD) through a first contact hole (CT1) penetrating the gate insulating film (130), the first interlayer insulating film (141), and the second interlayer insulating film (142). The first data metal layer may be formed as a single layer or a multilayer composed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0069] A first organic film (160) for flattening the step difference caused by thin-film transistors (TFTs) can be placed on a first connecting electrode (CE1). The first organic film (160) can be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0070] A second data metal layer including a second connecting electrode (CE2) may be disposed on a first organic film (160). The second data metal layer may be connected to the first connecting electrode (CE1) through a second contact hole (CT2) penetrating the first organic film (160). The second data metal layer may be formed as a single layer or a multilayer composed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0071] The second organic film (180) may be placed on the second connecting electrode (CE2). The second organic film (180) may be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0072] Meanwhile, the second data metal layer including the second connecting electrode (CE2) and the second organic film (180) may be omitted.

[0073] A light-emitting element layer (EML) is disposed on the thin-film transistor layer (TFTL). The light-emitting element layer (EML) may include light-emitting elements (LEL) and a pixel defining film (190).

[0074] Each of the light-emitting elements (LEL) may include a pixel electrode (171), a light-emitting layer (172), and a common electrode (173). Each of the light-emitting regions (EA) represents a region in which the pixel electrode (171), the light-emitting layer (172), and the common electrode (173) are sequentially stacked so that holes from the pixel electrode (171) and electrons from the common electrode (173) combine with each other in the light-emitting layer (172) to emit light. In this case, the pixel electrode (171) may be an anode electrode and the common electrode (173) may be a cathode electrode.

[0075] A pixel electrode layer including a pixel electrode (171) may be formed on a second organic film (180). The pixel electrode (171) may be connected to a second connecting electrode (CE2) through a third contact hole (CT3) penetrating the second organic film (180). The pixel electrode layer may be formed as a single layer or a multilayer composed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0076] In a top emission structure that emits light in the direction of a common electrode (173) based on a light-emitting layer (172), the pixel electrode (171) may be formed as a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or, to increase reflectivity, may be formed as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0077] The pixel defining film (190) serves to define the light-emitting regions (EA) of the pixels. To this end, the pixel defining film (190) may be formed to expose a portion of the pixel electrode (171) on the second organic film (180). The pixel defining film (190) may cover the edge of the pixel electrode (171). The pixel defining film (190) may be placed within the third contact hole (CT3). That is, the third contact hole (CT3) may be filled by the pixel defining film (190). The pixel defining film (190) may be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0078] A spacer (191) may be placed on the pixel definition film (190). The spacer (191) may serve to support the mask during the process of manufacturing the light-emitting layer (172). The spacer (191) may be formed from an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0079] A light-emitting layer (172) is formed on the pixel electrode (171). The light-emitting layer (172) may include an organic material and emit a predetermined color. For example, the light-emitting layer (172) may include a hole transporting layer, an organic material layer, and an electron transporting layer. The organic material layer may include a host and a dopant. The organic material layer may include a material that emits a predetermined light and may be formed using a phosphorescent material or a fluorescent material.

[0080] A common electrode (173) is formed on the light-emitting layer (172). The common electrode (173) may be formed to cover the light-emitting layer (172). The common electrode (173) may be a common layer formed commonly in the light-emitting regions (EA). A capping layer may be formed on the common electrode (173).

[0081] In the upper light-emitting structure, the common electrode (173) can be formed from a transparent conductive material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the common electrode (173) is formed from a semi-transmissive conductive material, the light emission efficiency can be increased by the micro cavity.

[0082] An encapsulation layer (ENC) may be disposed on a light-emitting element layer (EML). The encapsulation layer (ENC) may include at least one inorganic film (TFE1, TFE3) to prevent oxygen or moisture from penetrating into the light-emitting element layer (EML). Additionally, the encapsulation layer (ENC) may include at least one organic film (TFE2) to protect the light-emitting element layer (EML) from foreign substances such as dust. For example, the encapsulation layer (ENC) may include a first encapsulation inorganic film (TFE1), an encapsulation organic film (TFE2), and a second encapsulation inorganic film (TFE3).

[0083] A first encapsulating inorganic film (TFE1) may be disposed on a common electrode (173), an encapsulating organic film (TFE2) may be disposed on the first encapsulating inorganic film (TFE1), and a second encapsulating inorganic film (TFE3) may be disposed on the encapsulating organic film (TFE2). The first encapsulating inorganic film (TFE1) and the second encapsulating inorganic film (TFE3) may be formed as a multilayer film in which one or more inorganic films selected from a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The encapsulating organic film (TFE2) may be an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0084] The sensor electrode layer (SENL) may be disposed on the encapsulation layer (ENC). The sensor electrode layer (SENL) may include a second buffer layer (BF2), a first connection (BE1), a first sensor insulating layer (TINS1), sensor electrodes (TE, RE), and a second sensor insulating layer (TINS2).

[0085] The second buffer layer (BF2) may be disposed on the encapsulation layer (ENC). The second buffer layer (BF2) may include at least one inorganic film. For example, the second buffer layer (BF2) may be formed as a multilayer in which one or more inorganic films selected from a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The second buffer layer (BF2) may be omitted.

[0086] The first connections (BE1) can be placed on the second buffer film (BF2). The first connections (BE1) can be formed as a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO).

[0087] The first sensor insulating film (TINS1) may be disposed on the first connection portions (BE1). The first sensor insulating film (TINS1) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0088] Sensor electrodes, namely driving electrodes (TE) and sensing electrodes (RE), may be disposed on the first sensor insulating film (TNIS1). Additionally, dummy patterns may be disposed on the first sensor insulating film (TNIS1). The driving electrodes (TE), sensing electrodes (RE), and dummy patterns do not overlap with the light-emitting regions (EA). The driving electrodes (TE), sensing electrodes (RE), and dummy patterns may be formed as a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO).

[0089] The second sensor insulating film (TINS2) may be disposed on driving electrodes (TE), sensing electrodes (RE), and dummy patterns. The second sensor insulating film (TINS2) may include at least one of an inorganic film and an organic film. The inorganic film may be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic film may be an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0090] Hereinafter, a manufacturing apparatus for a display device and a method for manufacturing a display device according to one embodiment are described. In the following embodiments, components identical to those in the previously described embodiments are referred to by the same reference numerals, and redundant descriptions are omitted or simplified, with the focus on the differences.

[0091] In a conventional manufacturing device (1000) for a display device, a pattern map (PM) for spraying ink onto a substrate (SUB) was constant. The substrate (SUB) is manufactured according to a predetermined drawing, but due to manufacturing tolerances, the substrate (SUB) may be slightly smaller or larger than the drawing. If the substrate (SUB) is manufactured slightly smaller than the drawing, an overflow phenomenon may occur where the ink sprayed by the constant pattern map (PM) overflows the substrate (SUB). If the substrate (SUB) is manufactured slightly larger than the drawing, an underfill phenomenon may occur where the ink sprayed by the constant pattern map (PM) does not completely fill the substrate (SUB).

[0092] FIG. 4 is a cross-sectional view showing an example of a polarizing plate of different sizes according to one embodiment.

[0093] FIG. 4(a) is a polarizing plate (PL) manufactured according to specified drawing dimensions, FIG. 4(b) is a polarizing plate (PL) manufactured smaller than specified drawing dimensions, and FIG. 4(c) is a polarizing plate (PL) manufactured larger than specified drawing dimensions. In FIG. 4(a), W a1 is the length of the side extended in the first direction (DR1) of the polarizer (PL), and W b1 ε is the length of the side extended in the second direction (DR2) of the polarizer (PL). In FIG. 4(b), W a2 is the length of the side extended in the first direction (DR1) of the polarizer (PL), and W b2 ε is the length of the side extended in the second direction (DR2) of the polarizer (PL). In FIG. 4(c), W a3 is the length of the side extended in the first direction (DR1) of the polarizer (PL), and W b3 is the length of the side extended in the second direction (DR2) of the polarizer (PL). In FIG. 4, the length of the side extended in the first direction (DR1) of the polarizer (PL) is W a2 < W a1 < W a3 It may be. In FIG. 4, the length of the side extended in the second direction (DR2) of the polarizer (PL) is W b2 < W b1 < W b3 It could be.

[0094] FIG. 5 is a drawing showing the polarizing plate of FIG. 4 (a) and the adhesive member applied on the polarizing plate. FIG. 6 is a cross-sectional view taken along A2-A2' of FIG. 5.

[0095] FIG. 5(a) is a polarizing plate (PL) manufactured according to a specified drawing standard. FIG. 5(b) shows an adhesive member (ADH) applied to the polarizing plate (PL) manufactured according to the specified drawing standard using a designed pattern map (PM). The designed pattern map (PM) can be designed to be smaller than the size of the polarizing plate (PL) by an offset. The offset can account for the position where the adhesive member (ADH) spreads on the polarizing plate (PL) due to the fluidity of the adhesive member (ADH). In FIG. 5(b), the offsets can be a1 and b1. FIG. 5(c) is a drawing showing the adhesive member (ADH) applied on the polarizing plate (PL) when it has spread naturally.

[0096] Referring to Fig. 6, when an adhesive member (ADH) is applied to a polarizing plate (PL) manufactured according to a specified drawing standard using a designed pattern map (PM), it can be seen that the adhesive member (ADH) is evenly applied to the polarizing plate (PL).

[0097] FIG. 7 is a drawing showing the polarizing plate of FIG. 4 (b) and the adhesive member applied on the polarizing plate. FIG. 8 is a cross-sectional view taken along A3-A3' of FIG. 7.

[0098] FIG. 7(a) shows an adhesive member (ADH) applied to a polarizing plate (PL) manufactured to be smaller than the specified drawing dimensions using a designed pattern map (PM). In FIG. 7(a), the offsets may be a2 and b2. In FIG. 7, the designed pattern map (PM) is the same, but the offset may be smaller because the polarizing plate (PL) is manufactured to be smaller than the specified drawing dimensions. a2 may be smaller than a1, and b2 may be smaller than b1. FIG. 7(b) is a drawing showing the adhesive member (ADH) applied to the polarizing plate (PL) when it has spread naturally.

[0099] Referring to FIG. 8, when an adhesive member (ADH) is applied to a polarizer (PL) made smaller than the specified drawing dimensions using a designed pattern map (PM), the adhesive member (ADH) may accumulate on the edge portion of the polarizer (PL). This may occur because more adhesive member (ADH) is applied relative to the size of the polarizer (PL).

[0100] FIG. 9 is a drawing showing the polarizing plate of FIG. 4 (c) and the adhesive member applied on the polarizing plate. FIG. 10 is a cross-sectional view taken along A4-A4' of FIG. 9.

[0101] FIG. 9(a) shows an adhesive member applied with a designed pattern map (PM) on a polarizing plate (PL) manufactured larger than the specified drawing dimensions. In FIG. 9(a), the offsets may be a3 and b3. In FIG. 9, the designed pattern map (PM) is the same, but the offset may be larger because the polarizing plate (PL) is manufactured larger than the specified drawing dimensions. a3 may be larger than a1, and b3 may be larger than b1. FIG. 9(b) is a drawing showing the adhesive member (ADH) applied on the polarizing plate (PL) when it has spread naturally.

[0102] Referring to FIG. 10, when an adhesive member (ADH) is applied to a polarizing plate (PL) made larger than the specified drawing dimensions using a designed pattern map (PM), the adhesive member (ADH) may not spread sufficiently to the edge portion of the polarizing plate (PL). This may occur because less adhesive member (ADH) is applied relative to the size of the polarizing plate (PL).

[0103] The manufacturing device (1000) of the display device of the present invention can generate a pattern map (PM) based on the size of the substrate (SUB) and position information of the substrate (SUB) relative to the stage (1100), and spray an appropriate amount of ink onto the substrate (SUB) according to the size of the substrate (SUB). Since a pattern map (PM) generated according to the actual size of the substrate (SUB) is used instead of an initially set pattern map (PM), overflow or incomplete filling of the ink sprayed onto the substrate (SUB) can be prevented.

[0104] FIG. 11 is a perspective view showing a manufacturing apparatus for a display device according to one embodiment. FIG. 12 is a plan view showing a manufacturing apparatus for a display device according to one embodiment.

[0105] Referring to FIGS. 11 and 12, a manufacturing device (1000) for a display device according to one embodiment may include a stage (1100), a sensor unit (1200), an inkjet head unit (1300), a light irradiation unit (1400), a pattern generation unit (1500), and a moving unit (RR).

[0106] The stage (1100) can provide a space for placing a substrate (SUB). The substrate (SUB) can be placed on the stage (1100) during the printing process. The overall planar shape of the stage (1100) can follow the planar shape of the substrate (SUB). For example, if the substrate (SUB) is rectangular, the overall shape of the stage (1100) becomes rectangular, and if the substrate (SUB) is circular, the overall shape of the stage (1100) becomes circular.

[0107] The stage (1100) may include a first alignment mark (AM1) and a second alignment mark (AM2). The first alignment mark (AM1) may include a first sub-mark (SM1) extending in a first direction (DR1) and a second sub-mark (SM2) extending in a second direction (DR2) that intersects the first direction (DR1). The second alignment mark (AM2) may include a third sub-mark (SM3) extending in a first direction (DR1) and a fourth sub-mark (SM4) extending in a second direction (DR2) that intersects the first direction (DR1).

[0108] The first alignment mark (AM1) and the second alignment mark (AM2) may be fixed on the stage (1100). When a substrate (SUB) is placed on the stage (1100), position information of the substrate (SUB) relative to the stage (1100) can be calculated based on the distance and angle from the substrate (SUB) to the first alignment mark (AM1) and the second alignment mark (AM2).

[0109] The sensor unit (1200) can obtain data by photographing and / or measuring the stage (1100) on which the substrate (SUB) is mounted. The sensor unit (1200) may include a sensor (1220). The sensor (1220) may include at least one of a line scan camera, a vision camera, and a laser. The sensor unit (1200) may include a first support (1210) capable of supporting the sensor (1220). The first support (1210) may include a first horizontal support (1211) and a first vertical support (1212).

[0110] A line scan camera can photograph a stage (1100) on which a substrate (SUB) is mounted to obtain the edges of the substrate (SUB) as a line image. The length of the edges of the substrate (SUB) can be determined from the line image. For example, if the substrate (SUB) is rectangular, the length of the long side and the length of the short side of the substrate (SUB) can be determined. If the substrate (SUB) is circular, the arc of the substrate (SUB) can be determined. If the substrate (SUB) is rectangular with rounded corners, the shortest length between two opposite sides can be defined as the side length.

[0111] The pattern generation unit (1500) can receive data from the sensor unit (1200) and calculate the size of the substrate (SUB) and the position information of the substrate (SUB) relative to the stage (1100). The pattern generation unit (1500) can generate a pattern map (PM) based on the size and position information of the substrate (SUB). The pattern generation unit (1500) can be connected to the sensor unit (1200) and / or the inkjet head unit (1300) via wired or wireless connection. The pattern generation unit (1500) can receive data from the sensor unit (1200), generate a pattern map (PM) based on the size and position information of the substrate (SUB), and transmit the pattern map (PM) information to the inkjet head unit (1300).

[0112] The inkjet head unit (1300) may include at least one inkjet head (1320) that receives pattern map (PM) information from the pattern generation unit (1500) and sprays ink onto a substrate (SUB). The inkjet head unit (1300) may include a second support (1310) capable of supporting the inkjet head (1320). The second support (1310) may include a second horizontal support (1311) and a second vertical support (1312).

[0113] An inkjet head (1320) can eject ink. The inkjet head (1320) can apply ink onto a substrate (SUB) fixed on a stage (1100). The inkjet head (1320) may include a main body (1321), an ejection drive part (1322), and a stirring part (1323) (see FIG. 25).

[0114] The light irradiation unit (1400) can irradiate light onto ink coated on a substrate (SUB) to pre-cur it. The ink may contain a material capable of photocuring. The light irradiation unit (1400) may include a light source (1420). The light source (1420) may irradiate light of the ultraviolet series. The light irradiation unit (1400) may include a third support (1410) capable of supporting the light source (1420). The third support (1410) may include a third horizontal support (1411) and a third vertical support (1412).

[0115] The light source (1420) may have a shape that extends in a first direction (DR1). The light emitted by the light source (1420) may be emitted in the form of linear light that extends in the first direction (DR1). However, not limited thereto, the light emitted by the light source (1420) may be emitted in the form of planar light that extends in the first direction (DR1) but also has a predetermined width in the second direction (DR2).

[0116] The moving unit (RR) may include a first rail (RR1) and a second rail (RR2) extended in a second direction (DR2). A stage (1100) may be placed on the moving unit (RR). The moving unit (RR) may reciprocate the stage (1100) in the second direction (DR2) along the moving unit (RR). The stage (1100) may perform a printing process over the entire area of ​​the substrate (SUB) while moving in the second direction (DR2).

[0117] Below, the driving method of the display device manufacturing device (1000) can be explained in detail by referring to the manufacturing method of the display device.

[0118] FIG. 13 is a flowchart illustrating a method for manufacturing a display device according to one embodiment. FIG. 14 is a cross-sectional view illustrating a stage and a polarizer in step S100 of FIG. 13.

[0119] First, a substrate (SUB) can be placed on a stage (1100) (S100). In the present invention, a polarizing plate (PL) can be used as the substrate (SUB). Although the present invention describes a polarizing plate (PL) as the substrate (SUB), it is not limited thereto, and various types can be used as long as they are suitable for a process requiring ink application on the substrate (SUB).

[0120] Referring to FIG. 14, it can be seen that a polarizing plate (PL) is placed on a stage (1100) placed on the first rail (RR1) and the second rail (RR2).

[0121] As a first embodiment, FIGS. 15 to 18 show that the size of the polarizer (PL) and the position of the polarizer (PL) relative to the stage (1100) are calculated and a pattern map is generated while the polarizer (PL) is aligned on the stage (1100).

[0122] FIG. 15 is an example drawing for explaining data captured of a polarizer and a stage in step S200 of FIG. 13.

[0123] Next, data can be obtained by photographing and / or measuring the polarizer (PL) and the stage (1100) (S200). Referring to FIG. 15, when a line scanner camera is used as the sensor (1220), a line image of the edge of the polarizer (PL) drawn on the stage (1100) can be obtained. In FIG. 15, the length of the first direction (DR1) of the polarizer (PL) is W, which is the shortest distance from the second side (PL2) to the third side (PL3) of the polarizer (PL). x1And, the length of the second direction (DR2) is W, which is the shortest distance from the first side (PL1) to the fourth side (PL4) of the polarizer (PL). y1 You can confirm that it is.

[0124] Next, image data (line image) can be analyzed to calculate the size of the polarizer (PL) and the position information of the polarizer (PL) relative to the stage (1100) (S300).

[0125] FIG. 16 is an example diagram illustrating the calculation of position information of a polarizer relative to a stage from data capturing a polarizer and a stage in step S300 of FIG. 13. FIG. 17 is an example diagram illustrating the calculation of position information of a polarizer relative to a stage from data capturing a polarizer and a stage in step S300 of FIG. 13.

[0126] Referring to FIG. 16, the pattern generating unit (1500) can measure a first distance (d1) between a first sub-mark (SM1) and a first side (PL1) of a line image and a second distance (d2) between a second sub-mark (SM2) and a second side (PL2) of a line image. Additionally, the pattern generating unit (1500) can measure a third distance (d3) between a third sub-mark (SM3) and a first side (PL1) of a line image and a fourth distance (d4) between a fourth sub-mark (SM4) and a third side (PL3) of a line image.

[0127] Referring to FIG. 17, the pattern generating unit (1500) can measure a first angle (θ1) formed by a virtual line extending in a first direction (DR1) from the center of a first sub-mark (SM1) and a virtual line extending on the second side (PL2) of the line image, and a second angle (θ2) formed by a virtual line extending in a second direction (DR2) from the center of a second sub-mark (SM2) and a virtual line extending on the first side (PL1) of the line image. The pattern generating unit (1500) can measure a third angle (θ3) formed by a virtual line extending in a first direction (DR1) from the center of a third sub-mark (SM3) and a virtual line extending on the third side (PL3) of the line image, and a fourth angle (θ4) formed by a virtual line extending in a second direction (DR2) from the center of a fourth sub-mark (SM4) and a virtual line extending on the first side (PL1) of the line image.

[0128] The pattern generation unit (1500) can calculate position information of the polarizer (PL) relative to the stage (1100) based on the first distance (d1), the second distance (d2), the third distance (d3), the fourth distance (d4), the first angle (θ1), the second angle (θ2), the third angle (θ3), and the fourth angle (θ4).

[0129] Next, a pattern map (PM) can be generated based on the size and position information of the polarizer (PL) (S400).

[0130] FIG. 18 is an example drawing showing a pattern map of an adhesive member applied on a polarizer in step S400 of FIG. 13.

[0131] Referring to FIG. 18, the pattern map (PM) may be generated by adding or subtracting an offset from the size and position information of the polarizer (PL). The offset may be determined by considering the viscosity of the adhesive member (ADH). If the viscosity of the adhesive member (ADH) is high, the offset may be set small, and if the viscosity of the adhesive member (ADH) is low, the offset may be set large. In FIG. 18, the offset may be x1 from the second side (PL2) and the third side (PL3) in the first direction (DR1), and y1 from the first side (PL1) and the fourth side (PL4) in the second direction (DR2).

[0132] As a second embodiment, FIGS. 19 to 22 illustrate the calculation of the size of the polarizer (PL) and the position of the polarizer (PL) relative to the stage (1100) and the generation of a pattern map while the polarizer (PL) is not aligned on the stage (1100). Content that overlaps with that described in the first embodiment will be omitted or simplified, and the explanation will focus on the differences.

[0133] FIG. 19 is an example drawing for explaining data captured of a polarizer and a stage in step S200 of FIG. 13.

[0134] In FIG. 19, the length of the first direction (DR1) of the polarizer (PL) is W, which is the shortest distance from the second side (PL2) to the third side (PL3) of the polarizer (PL). x2 And, the length of the second direction (DR2) is W, which is the shortest distance from the first side (PL1) to the fourth side (PL4) of the polarizer (PL). y2 You can confirm that it is.

[0135] FIG. 20 is an example diagram illustrating the calculation of position information of a polarizer relative to a stage from data capturing a polarizer and a stage in step S300 of FIG. 13. FIG. 21 is an example diagram illustrating the calculation of position information of a polarizer relative to a stage from data capturing a polarizer and a stage in step S300 of FIG. 13.

[0136] Referring to FIG. 20, the pattern generating unit (1500) can measure a first distance (d1) between the first side (PL1) of the line image closest to the center of the first sub-mark (SM1) and a second distance (d2) between the extended virtual line of the second side (PL2) of the line image closest to the center of the second sub-mark (SM2). Additionally, the pattern generating unit (1500) can measure a third distance (d3) between the first side (PL1) of the line image closest to the center of the third sub-mark (SM3) and a fourth distance (d4) between the extended virtual line of the third side (PL3) of the line image closest to the center of the fourth sub-mark (SM4).

[0137] Referring to FIG. 21, the pattern generating unit (1500) can measure a first angle (θ1) formed by a virtual line extending in a first direction (DR1) from the center of a first sub-mark (SM1) and a virtual line extending on the second side (PL2) of the line image, and a second angle (θ2) formed by a virtual line extending in a second direction (DR2) from the center of a second sub-mark (SM2) and a virtual line extending on the first side (PL1) of the line image. The pattern generating unit (1500) can measure a third angle (θ3) formed by a virtual line extending in a first direction (DR1) from the center of a third sub-mark (SM3) and a virtual line extending on the third side (PL3) of the line image, and a fourth angle (θ4) formed by a virtual line extending in a second direction (DR2) from the center of a fourth sub-mark (SM4) and a virtual line extending on the first side (PL1) of the line image.

[0138] The pattern generation unit (1500) can calculate position information of the polarizer (PL) relative to the stage (1100) based on the first distance (d1), the second distance (d2), the third distance (d3), the fourth distance (d4), the first angle (θ1), the second angle (θ2), the third angle (θ3), and the fourth angle (θ4). In particular, the position can be accurately calculated even when the polarizer (PL) is not aligned.

[0139] FIG. 22 is an example drawing showing a pattern map of an adhesive member applied on a polarizer in step S400 of FIG. 13.

[0140] In FIG. 22, the offset may be x2 from the second side (PL2) and the third side (PL3) in the first direction (DR1), and y2 from the first side (PL1) and the fourth side (PL4) in the second direction (DR2).

[0141] FIG. 23 is an example drawing showing a pattern map generated on a polarizer when there is no alignment part in a conventional display device manufacturing device.

[0142] FIG. 23 (a) is a drawing showing a polarizing plate (PL) placed on a stage (1100) in an unaligned state. FIG. 23 (b) is a drawing showing a pattern map designed in a conventional display device manufacturing device (1000) being generated on a polarizing plate (PL). Since the initially set pattern map (PM) is used as is without considering the position and size of the polarizing plate (PL) placed on the stage (1100), it can be seen that the position of the polarizing plate (PL) and the position of the pattern map (PM) do not match.

[0143] FIG. 24 is an example drawing showing a pattern map generated on a polarizer when there is no alignment part in a manufacturing device for a display device according to one embodiment of the present invention.

[0144] FIG. 24 (a) is a drawing showing a polarizing plate (PL) placed on a stage (1100) in an unaligned state. FIG. 24 (b) is a drawing showing a pattern map (PM) generated based on the size and position information of the polarizing plate (PL) in the manufacturing device (1000) of the display device of the present invention. Since the pattern map (PM) generated by considering the size and position of the polarizing plate (PL) placed on the stage (1100) is used, an appropriate pattern map (PM) can be generated on the polarizing plate (PL) without separate alignment.

[0145] The manufacturing device (1000) of the display device of the present invention can generate a pattern map (PM) based on the size of the substrate (SUB) and the position information of the substrate (SUB) relative to the stage (1100), so that an appropriate pattern map (PM) can be generated on the substrate (SUB) without a separate alignment process.

[0146] FIG. 25 is an example drawing showing the spraying of an adhesive member onto a polarizing plate in step S500 of FIG. 13. FIG. 26 is a drawing of an inkjet head.

[0147] Next, an adhesive member (ADH) can be applied to the polarizing plate (PL) based on the pattern map (PM) (S500). The adhesive member (ADH) may be applied as an ink on the polarizing plate (PL). In this invention, an adhesive material (AM) is described as an ink, but it is not limited thereto and various materials that can be applied as ink may be used.

[0148] Referring to FIG. 26, the main body (1321) may include an internal space for receiving an adhesive material (AM). The main body (1321) may have a shape extending in a first direction (DR1). The main body (1321) may include a receiving portion (1321b) and a discharge portion (1321a).

[0149] The receiving portion (1321b) can receive an adhesive material (AM). Specifically, the internal space of the receiving portion (1321b) can receive an adhesive material (AM).

[0150] The discharge section (1321a) may be located between the receiving section (1321b) and the stage (1100). For example, the discharge section (1321a) may be positioned on the other side of the third direction (DR3) of the receiving section (1321b). The discharge section (1321a) may be spatially connected to the receiving section (1321b).

[0151] The discharge section (1321a) may include a discharge port (OL) that is opened toward the other side of the third direction (DR3). The discharge port (OL) may have a shape that extends toward the first direction (DR1). The discharge port (OL) may be positioned to face one side of the third direction (DR3) of the stage (1100).

[0152] The discharge drive unit (1320) may be connected to the main body (1321). The discharge drive unit (1320) may transmit a driving force to the main body (1321) to discharge an adhesive material (AM) contained inside the main body (1321) to the outside. For example, the discharge drive unit (1320) may include a syringe or a pump.

[0153] The discharge drive unit (1320) can provide a discharge drive force to push the adhesive material (AM) of the discharge unit (1321a) outward. That is, the adhesive material (AM) can be discharged outward by the discharge drive force provided by the discharge drive unit (220).

[0154] The discharge drive unit (1320) can assist in the discharge of the adhesive material (AM) of the discharge unit (1321a) to the outside. The adhesive material (AM) of the discharge unit (1321a) can move toward the polarizing plate (PL) due to the attractive force with the polarizing plate (PL). At this time, when the adhesive material (AM) placed in the discharge unit (1321a) moves toward the target polarizing plate (PL), the discharge drive unit (1320) can move the ink placed in the receiving unit (1321b) toward the discharge unit (1321a).

[0155] A stirring part (1323) may be disposed inside the main body part (1321). In some embodiments, the stirring part (1323) may include a roller extending in a first direction (DR1). The stirring part (1323) can control the viscosity of the adhesive material (AM) through the rotation of the roller. For example, the roller included in the stirring part (1323) may rotate at a constant number of times per unit time to maintain the viscosity of the adhesive material (AM). Additionally, to maintain the viscosity of the adhesive material (AM), the number of rotations per unit time of the roller may be increased when the viscosity of the adhesive material (AM) increases, and conversely, the number of rotations per unit time of the roller may be decreased when the viscosity of the adhesive material (AM) decreases.

[0156] FIG. 27 is an example drawing showing the process of curing by irradiating light onto an adhesive member coated on a polarizing plate.

[0157] The method may further include a step of pre-curing by irradiating light onto an adhesive member (ADH) coated on a polarizing plate (PL). As the stage (1100) placed on the moving part (RR) moves in the second direction (DR2), the adhesive member (ADH) on the polarizing plate (PL) receives light (LGT) irradiated by the light source (1420) evenly, allowing pre-curing to proceed.

[0158] FIG. 28 is a plan view showing a manufacturing apparatus for a display device according to one embodiment.

[0159] The manufacturing device (1000) of the display device may further include an alignment unit (1600) for aligning a substrate (SUB) placed on a stage (1100). The alignment unit (1600) may be positioned between the stage (1100) and the sensor unit (1200). Although the alignment unit (1600) is disclosed as a separate configuration in the present invention, the alignment unit (1600) may be included on the stage (1100). The alignment unit (1600) may include a first aligner (1611) and a second aligner (1612). The first aligner (1611) and the second aligner (1612) may be spaced apart from each other. Although two aligners (1611, 1612) are shown in the present invention, the number and arrangement of aligners may vary depending on the shape or type of the substrate (SUB).

[0160] FIG. 29 is an example drawing showing a pattern map generated after alignment of polarizers according to one embodiment.

[0161] FIG. 29 is a diagram illustrating the process of generating a pattern map (PM) in a manufacturing device (1000) of a display device including an alignment unit (1600). FIG. 29 (a) shows an unaligned polarizer (PL) placed on a stage (1100). FIG. 29 (b) shows the polarizer (PL) placed on the stage (1100) aligned by the alignment unit (1600). FIG. 29 (c) shows the pattern map (PM) generated according to the size of the aligned polarizer (PL).

[0162] Next, a polarizing plate (PL) coated with an adhesive member (ADH) can be attached to one side of a display device (DD) (S600). After the adhesive member (ADH) is cured, a cover window (CW) can be attached to the polarizing plate (PL).

[0163] FIG. 30 is an exploded perspective view of a display device according to one embodiment.

[0164] Referring to FIG. 30, a partially cured adhesive member (ADH) is placed on a polarizing plate (PL) placed on a display panel (DP), and the polarizing plate (PL) and the cover window (CW) can be attached using the adhesive member (ADH). When additional light (LGT) is irradiated while the cover window (CW) is attached on the polarizing plate (PL), the adhesive member (ADH) between the polarizing plate (PL) and the cover window (CW) becomes more cured, and the adhesion strength can be increased.

[0165] The display device according to the embodiment can be applied to various electronic devices. An electronic device according to one embodiment includes the display device described above and may further include a module or device having other additional functions in addition to the display device.

[0166] FIG. 31 is a block diagram of an electronic device according to one embodiment. Referring to FIG. 31, an electronic device (2) according to one embodiment may include a display module (21), a processor (22), a memory (23), and a power module (24).

[0167] The processor (22) may include at least one of a central processing unit (CPU), an application processor (AP), a graphic processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0168] The memory (23) may store data information necessary for the operation of the processor (22) or the display module (21). When the processor (22) executes an application stored in the memory (23), a video data signal and / or an input control signal is transmitted to the display module (21), and the display module (21) can process the received signal and output video information through a display screen.

[0169] The power module (24) may include a power supply module, such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate power necessary for the operation of the electronic device (20).

[0170] At least one of each component of the electronic device (2) described above may be included within the display device (10) according to the embodiments described above. Additionally, some of the individual modules functionally included within a single module may be included within the display device (10), while others may be provided separately from the display device (10). For example, the display device (10) may include a display module (21), and the processor (22), memory (23), and power module (24) may be provided in the form of other devices within the electronic device (2) rather than the display device (10).

[0171] FIG. 32 is a schematic diagram of an electronic device according to various embodiments.

[0172] Referring to FIG. 32, various electronic devices (2) to which display devices according to embodiments are applied may include not only image display electronic devices such as smartphones (2_1a), tablet PCs (2_1b), laptops (2_1c), TVs (2_1d), and desk monitors (2_1e), but also wearable electronic devices including display modules such as smart glasses (2_2a), head-mounted displays (2_2b), and smart watches (2_2c), and automotive electronic devices (2_3) including display modules such as CID (Center Information Display) and room mirror displays placed on the instrument panel, center fascia, and dashboard of a car.

[0173] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing the technical concept or essential features thereof. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. Explanation of the symbols

[0174] DD: Display device DP: Display Panel ADH: Adhesive member CW: Cover Window 1000: Manufacturing device for display devices 1100: Stage 1200: Sensor section 1300: Inkjet head unit 1400: Light Irradiation Unit 1500: Pattern generation section 1600: Alignment

Claims

Claim 1 A manufacturing apparatus for a display device comprising: a stage on which a substrate is placed; a sensor unit for obtaining data by photographing and / or measuring the substrate and the stage; a pattern generation unit for calculating the size of the substrate and position information relative to the stage by analyzing the data, and generating a pattern map based on the size and position information of the substrate; and an inkjet head unit including at least one inkjet head for spraying ink onto the substrate based on the pattern map, wherein the substrate coated with ink is attached to one side of a display panel. Claim 2 In claim 1, the manufacturing apparatus for a display device comprising the data including a line image of the substrate captured by the edge of the substrate. Claim 3 A manufacturing apparatus for a display device according to claim 2, wherein the stage comprises a first alignment mark and a second alignment mark, the first alignment mark comprises a first sub-mark extending in a first direction and a second sub-mark extending in a second direction intersecting the first direction, and the second alignment mark comprises a third sub-mark extending in a first direction and a fourth sub-mark extending in a second direction intersecting the first direction. Claim 4 In claim 3, the pattern generating unit measures a first distance between the first sub-mark and the first side of the line image and a second distance between the second sub-mark and the second side of the line image, and measures a third distance between the third sub-mark and the first side of the line image and a fourth distance between the fourth sub-mark and the third side of the line image. Claim 5 A manufacturing apparatus for a display device according to claim 4, wherein the pattern generating unit measures a first angle formed by a virtual line extending in the first direction of the first sub-mark and a virtual line extending on the second side of the line image, a second angle formed by a virtual line extending in the second direction of the second sub-mark and a virtual line extending on the first side of the line image, a third angle formed by a virtual line extending in the first direction of the third sub-mark and a virtual line extending on the third side of the line image, and a fourth angle formed by a virtual line extending in the second direction of the fourth sub-mark and a virtual line extending on the first side of the line image. Claim 6 A manufacturing apparatus for a display device according to claim 5, which calculates position information of the substrate relative to the stage based on information of the first distance, the second distance, the third distance, the fourth distance, the first angle, the second angle, the third angle, and the fourth angle. Claim 7 A manufacturing apparatus for a display device according to claim 1, further comprising a light irradiation unit disposed spaced apart from the inkjet head unit in one direction and configured to irradiate light. Claim 8 A manufacturing apparatus for a display device according to claim 1, further comprising an alignment unit disposed between the stage and the sensor unit and aligning the substrate mounted on the stage. Claim 9 In claim 1, the sensor unit comprises at least one of a line scan camera, a vision camera, and a laser, in a manufacturing device for a display device. Claim 10 A manufacturing apparatus for a display device according to claim 1, which generates the pattern map by adding or subtracting an offset from the size and position information of the substrate. Claim 11 A manufacturing apparatus for a display device according to claim 1, further comprising a stage moving part that moves the stage along one direction. Claim 12 A method for manufacturing a display device comprising: a step of placing a substrate on a stage; a step of obtaining data by photographing and / or measuring the substrate and the stage; a step of calculating the size of the substrate and the position information of the substrate relative to the stage by analyzing the data; a step of generating a pattern map based on the size and position information of the substrate; a step of spraying ink onto the substrate based on the pattern map; and a step of attaching the substrate on which the ink has been sprayed onto one side of a display panel. Claim 13 In claim 12, the method of manufacturing a display device comprises the data including a line image of the substrate captured by a line scan camera of the edge of the substrate. Claim 14 A method for manufacturing a display device according to claim 13, wherein the stage comprises a first alignment mark and a second alignment mark, the first alignment comprises a first sub-mark extending in a first direction and a second sub-mark extending in a second direction intersecting the first direction, and the second alignment mark comprises a third sub-mark extending in a first direction and a fourth sub-mark extending in a second direction intersecting the first direction. Claim 15 A method for manufacturing a display device according to claim 14, wherein the step of calculating position information of the substrate relative to the stage comprises: a step of measuring a first distance between the first sub-mark and the first side of the line image and a second distance between the second sub-mark and the second side of the line image; and a step of measuring a third distance between the third sub-mark and the first side of the line image and a fourth distance between the fourth sub-mark and the third side of the line image. Claim 16 A method for manufacturing a display device according to claim 15, wherein the step of calculating position information of the substrate relative to the stage further comprises the step of measuring a first angle formed by a virtual line extending in the first direction of the first sub-mark and a virtual line extending on the second side of the line image, and a second angle formed by a virtual line extending in the second direction of the second sub-mark and a virtual line extending on the first side of the line image, and the step of measuring a third angle formed by a virtual line extending in the first direction of the third sub-mark and a virtual line extending on the third side of the line image, and a fourth angle formed by a virtual line extending in the second direction of the fourth sub-mark and a virtual line extending on the first side of the line image. Claim 17 A method for manufacturing a display device according to claim 16, wherein the step of calculating position information of the substrate relative to the stage further comprises the step of calculating position information of the substrate relative to the stage based on information of the first distance, the second distance, the third distance, the fourth distance, the first angle, the second angle, the third angle, and the fourth angle. Claim 18 A method for manufacturing a display device according to claim 12, further comprising the step of irradiating light onto the ink sprayed on the substrate after the step of spraying ink onto the substrate. Claim 19 A method for manufacturing a display device according to claim 12, further comprising the step of aligning the substrate prior to the step of obtaining the data. Claim 20 An electronic device comprising: a display device that provides an image; and a processor that transmits an image data signal to the display device, wherein the display device comprises the steps of: placing a substrate on a stage; photographing and / or measuring the substrate and the stage to obtain data; analyzing the data to calculate the size of the substrate and position information of the substrate relative to the stage; generating a pattern map based on the size and position information of the substrate; spraying ink onto the substrate based on the pattern map; and attaching the substrate on which the ink has been sprayed onto one side of a display panel.

Images