Device inpection euipment

Abstract

The present invention relates to device inspection, and more specifically, to a device inspection device for performing an inspection of a device. The present invention provides a device inspection device characterized by comprising: a plurality of stage sections (210) in which a plurality of devices (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2); a reciprocating movement section (290) that reciprocates the plurality of stage sections (210) to an inspection position (T) and one or more device transfer positions (U, L) for performing at least one of device loading and unloading; and an inspection module (300) positioned at the inspection position (T) and simultaneously performing an inspection of the devices (10) loaded on the stage sections (210) by relative movement with respect to the stage sections (210).

Description

Technology Field

[0001] The present invention relates to device inspection, and more specifically, to a device inspection device for performing an inspection of a device. Background Technology

[0002] After completing the packaging process, the semiconductor device (hereinafter referred to as the "device") undergoes various tests, such as electrical characteristics and reliability tests regarding heat or pressure, by a semiconductor device inspection device.

[0003] Depending on the type of device, such as memory devices, non-memory devices like CPUs (Central Processing Units) and GPUs (Graphic Processing Units), LED devices, and solar devices, there are various types of inspections, including room temperature inspections performed in ambient environments and high-temperature inspections performed in high-temperature environments.

[0004] Meanwhile, as the variety and popularization of IT devices such as smartphones, smartpads, and smart TVs increase, the demand for non-memory components like CPUs—namely, LSI (Large Scale Integration)—is surging.

[0005] However, due to the characteristics of small-batch, high-variety production, LSIs have a problem in that the inspection volume is small compared to the inspection equipment for standardized memory devices, making it difficult to use expensive inspection equipment.

[0006] In addition, as smartphones become thinner and IoT devices using these components also become smaller, the size of the components is becoming finer, requiring great caution during component inspection.

[0007] In particular, as the size of the device becomes miniaturized, it needs to be seated in an aligned state in the test socket for device inspection.

[0008] In addition, there is a problem where inspection errors occur when the alignment between the terminals provided on the device and the terminals of the test socket on which the device is mounted is inaccurate as the pitch between the terminals provided on the device, such as BGA devices, decreases.

[0009] Meanwhile, with the increasing demand for small yet high-performance devices such as MPUs and HBMs, the demand for inspection of precision-specification devices is rising.

[0010] (Patent Document 1) KR 10-1417772 B1

[0011] (Patent Document 2) KR 10-2016-0051146 A

[0012] (Patent Document 3) KR 10-2019-0166349 B1

[0013] (Patent Document 4) KR 10-1177319 B1 The problem to be solved

[0014] The objective of the present invention is to provide a device inspection device capable of efficiently performing device loading and inspection. means of solving the problem

[0015] The present invention is created to achieve the above-mentioned purpose of the present invention, and the present invention provides a device inspection device characterized by comprising: a plurality of stage sections (210) in which a plurality of devices (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2), and a reciprocating movement section (290) that reciprocates the plurality of stage sections (210) to an inspection position (T) and one or more device transfer positions (U, L) for performing at least one of device loading and unloading; and an inspection module (300) positioned at the inspection position (T) and simultaneously performing an inspection of the devices (10) loaded on the stage sections (210) by relative movement with respect to the stage sections (210).

[0016] The above reciprocating movement unit (290) may include a rotary motor (293) that generates rotational force and a plurality of rotating arms (281) coupled to the drive shaft (291) of the rotary motor (293) and coupled to the stage unit (210).

[0017] The above reciprocating movement unit (290) may have the rotating arm (281) installed in multiple numbers along the circumferential direction around the drive shaft (291) of the rotation motor (293).

[0018] The above-mentioned element transfer positions (U, L) include an element loading position (L) that receives the element (10) directly or indirectly from the element loading member (20), and an element unloading position (U) that transfers the elements (10) that have been inspected at the inspection position (T) to the element unloading member (30), and the plurality of stage units (210) may be configured in three such that they can be positioned at the inspection position (T), the element loading position (L), and the element unloading position (U), respectively.

[0019] The above-mentioned element transfer position (U, L) is set as a single position for transferring elements (10) that have finished being inspected at the above-mentioned inspection position (T) to the element unloading member (30) and receiving elements (10) directly or indirectly from the element loading member (20), and the above-mentioned plurality of stage members (210) may be configured in two such that they can be positioned at the above-mentioned inspection position (T) and the above-mentioned element transfer position (U, L), respectively.

[0020] The above stage section (210) can sequentially position the inspection position (T), the element loading position (L), and the element unloading position (U) by at least one movement among rotation and linear movement.

[0021] The above reciprocating movement unit (290) can reciprocate the stage units (210) along a path (270) connecting the inspection position (T) and the element transfer position (U, L).

[0022] The above reciprocating moving part (290) can move the stage part (210) along the path (270) using magnetic force.

[0023] The above path (270) can form a closed loop.

[0024] The above stage module (200) may include a stage moving part (220, 230, 240) that moves the stage part (210) at the inspection position (T) by at least one of linear movement and rotational movement.

[0025] The above stage moving unit (220, 230, 240) may include an XY moving unit (220) that moves the stage unit (210) directly or indirectly in the XY axis direction, a Z axis moving unit (240) that moves the stage unit (210) directly or indirectly in the Z axis direction, and a rotation moving unit (230) that rotates the stage unit (210) directly or indirectly around a rotation axis in the Z direction.

[0026] It may include one or more buffer units (610) that receive the element (10) from the element loading member (20), temporarily load it, and then transfer it to the stage unit (210) located at the element transfer position (U, L).

[0027] The above element loading member (20) is a wafer divided into a plurality of elements (10), and the above element unloading member (30) may be a tray (30) in which a plurality of elements (10) are loaded in an arrangement of j×k (j and k are natural numbers greater than or equal to 2). Effects of the invention

[0028] The device inspection device according to the present invention has the advantage of being able to efficiently perform an inspection of a device by comprising a stage module that reciprocates between an inspection position and a device exchange position, and an inspection module positioned at the inspection position to perform a device inspection.

[0029] In particular, the device inspection device according to the present invention can significantly increase the inspection speed of a device by moving the stage part relative to the inspection module at the inspection position. Brief explanation of the drawing

[0030] FIG. 1 is a layout diagram showing a device inspection device according to the present invention. FIG. 2a is a front view showing an example of a stage module and an inspection module among the device inspection devices of FIG. 1, and FIG. 2b is a partially enlarged view of part A in FIG. 2a. FIG. 3 is a plan view showing an example of a stage module among the device inspection devices illustrated in FIG. 1. FIGS. 4 and FIGS. 5 are plan views showing different examples of stage modules among the device inspection devices shown in FIG. 1, respectively. FIG. 6 is a plan view showing the stage portion of the stage module illustrated in FIG. 3 to FIG. 5. FIG. 7 is a conceptual diagram showing the process of transferring a device from the device loading section to the stage section of the stage module in the device inspection device illustrated in FIG. 1. Specific details for implementing the invention

[0031] The device inspection device according to the present invention will be described below with reference to the attached drawings.

[0032] As shown in FIGS. 1 to 7, the device inspection device according to the present invention comprises a plurality of stage sections (210) in which a plurality of devices (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2), a reciprocating movement section (290) that reciprocates the plurality of stage sections (210) to an inspection position (T) and one or more device transfer positions (U, L) for performing at least one of device loading and unloading; and an inspection module (300) located at the inspection position (T) and simultaneously performing an inspection of the devices (10) loaded on the stage sections (210) by relative movement with respect to the stage sections (210).

[0033] First, the object to be inspected by the device inspection device according to the present invention is an object whose electrical characteristics are inspected at an inspection position (T), and in particular, may be a so-called BGA device having a ball terminal formed on its bottom surface.

[0034] The above inspection location (T) is defined as an area where the inspection module (300) described later is located, where the stage section (210) described later is located, and where an inspection of the element (10) loaded on the stage section (210) is performed.

[0035] The above-mentioned device transfer location (U, L) is configured such that the stage portion (210) is positioned for performing at least one of device loading and unloading, and may be configured as a device loading location (L) and a device unloading location (U), or set as a single location so that both device loading and unloading can be performed, and may be configured in various ways depending on the device loading and unloading method.

[0036] For example, the above-mentioned element transfer location (U, L) may include an element loading location (L) that receives the element (10) directly or indirectly from the element loading member (20), and an element unloading location (U) that transfers the elements (10) that have finished inspecting at the above-mentioned inspection location (T) to the element unloading member (30).

[0037] The above element loading position (L) is a position where the element (10) is received directly or indirectly from the element loading member (20), and can be set in various ways depending on the element delivery method.

[0038] The above element loading member (20) may be composed of a wafering divided into a plurality of elements (10).

[0039] Specifically, the element loading member (20) is configured such that a plurality of elements (10) are loaded, and can be a tray, as well as a wafering as described in Patent Document 3.

[0040] In particular, the above-mentioned element loading member (20) may be composed of a wafer ring loaded such that the ball terminals face upward.

[0041] Meanwhile, if the above-mentioned element loading member (20) is formed as a wafer, element pickup is possible only at the location where the needle pin (190) is located, i.e., the pickup location.

[0042] Accordingly, the above-mentioned element loading member (20), i.e., the wafering, needs to be moved horizontally so that each element (10) is positioned at the pickup location.

[0043] Accordingly, a moving table (not shown) may be installed to move the element loading member (20) in a horizontal direction so that the pickup tool (530) can pick up the element (10) at a preset pickup position, which is positioned adjacent to the element loading position (L).

[0044] The above moving table is configured to move the element loading member (20) in a horizontal direction so as to be positioned adjacent to the element loading position (L) and to pick up the element (10) at a preset pickup position, and can be configured similarly to the loading member table presented in Patent Document 3.

[0045] The above pickup tool (530) may include one or more pickers that pick up the element (10) by means of vacuum pressure, etc., and is configured to pick up the element (10) at a pickup position and then directly transfer it to a stage unit (210) located at the element loading position (L) or to a buffer unit (610) described later.

[0046] Meanwhile, the element loading member (20) can be transferred to the moving table from the element loading member loading unit (100) installed adjacent to the moving table.

[0047] Meanwhile, it may include one or more buffer units (610) that receive the element (10) from the element loading member (20), temporarily load it, and then transfer it to the stage unit (210) located at the element transfer position (U, L).

[0048] The above buffer unit (610) is configured to receive the element (10) from the element loading member (20), temporarily load it, and then transfer it to the stage unit (210) located at the element transfer position (U, L), and various configurations are possible.

[0049] The above buffer section (610) is configured to temporarily load elements (10) received from the element loading member (20) in order to transfer the elements (10) from the element loading member (20) to the stage section (210), and various configurations are possible depending on the number of elements (10) loaded.

[0050] For example, the above buffer section (610) may be installed in two units with the structure of Fig. 3 of Patent Document 4, taking into account the transfer efficiency of the element (10).

[0051] And, the buffer unit (610) can be reciprocated between a first position (P1) received by a pickup tool (530) and a second position (P2) picked up by a first transfer tool (510).

[0052] The first transfer tool (510) above is configured to pick up an element (10) at a second position (P2) and place the element (10) on a stage part (210) located at the element loading position (L), and may be configured to include one or more pickers.

[0053] The above-mentioned element unloading position (U) is a position set to transfer elements (10) that have finished being inspected at the above-mentioned inspection position (T) to the element unloading member (30), and as shown in FIGS. 3 and 5, it may be set as a separate position from the element loading position (L), or as shown in FIG. 4, it may be set as the same position as the element loading position (L).

[0054] Meanwhile, the elements (10) placed on the stage portion (210) located at the element unloading position (U) are transferred to the element unloading member (30) located at the unloading portion (700) by the second transfer tool (520).

[0055] The above-mentioned element unloading member (30) can be configured in any way that allows for element unloading, such as being composed of a tray (30) in which a plurality of elements (10) are loaded in an arrangement of j×k (j and k are natural numbers greater than or equal to 2).

[0056] Here, the element unloading member (30) can be configured in the same way as the element loading member (20) described above, depending on the element loading structure.

[0057] The above unloading unit (700) is configured such that a component unloading member (30) is positioned on which a component (10) that has been inspected in the inspection module (300) is loaded, and various configurations are possible depending on the handling method of the component unloading member (30).

[0058] For example, the unloading unit (700) may be configured such that a first unloading position (Z1) is set to receive an element (10) from a stage unit (210) located at the element unloading position (U), and a second unloading position (Z2) is set to load trays (20) filled with elements (10) that have completed element inspection. The trays (20) may be configured to move between the first unloading position (Z1) and the second unloading position (Z2).

[0059] Meanwhile, the above-mentioned unloading unit (700) may additionally include a sorting unit (400) that classifies and loads the elements (10) into the corresponding tray (30) according to the classification grade based on the inspection results.

[0060] The sorting unit (400) above can be configured so that each tray (30) can be arranged according to the number of classification grades.

[0061] For example, the sorting unit (400) may have various locations set, such as a plurality of sorting locations (410 to 440) corresponding to classification grades and empty tray locations where empty trays are located.

[0062] In addition, the sorting unit (400) may have a buffer location (not shown) where the elements (10) are temporarily loaded in order to perform an efficient sorting operation by the sorting tool (540).

[0063] The sorting tool (540) is configured to pick up and transport an element (10) from a tray (30) located in the sorting section (400) to perform a sorting operation, and may be composed of one or more pickers.

[0064] The above stage module (200) includes a stage section (210) in which a plurality of elements (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2), and the stage section (210) can be configured to move back and forth between an inspection position (T) and one or more element transfer positions (U, L) for performing at least one of element loading and unloading.

[0065] As an example, the stage module (200) may be configured to include a plurality of stage sections (210) in which a plurality of elements (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2), as shown in FIGS. 1 to 6, and a reciprocating section (290) that reciprocates the plurality of stage sections (210) to an inspection position (T) and one or more element transfer positions (U, L) for performing at least one of element loading and unloading.

[0066] The above stage section (210) is configured such that a plurality of elements (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2), and is configured to move to an inspection position (T) and an element transfer position (U, L) by the reciprocating movement section (290) described later, and various configurations are possible depending on the method of loading the elements.

[0067] For example, the above stage portion (210) may be provided with a mounting means, such as a mounting groove, that can be stably mounted according to the size or specifications of the element (10).

[0068] The above stage section (210) may be equipped with a temperature control means to account for cases where temperature control is required, such as performing heating or cooling before the device inspection and cooling or heating after the device inspection.

[0069] The above temperature control means is configured to change the temperature of a mounted element (10), such as by preheating according to an element inspection, and can be configured in various ways depending on the temperature control method, such as a thermoelectric module, a heater, or temperature control by the flow of a refrigerant.

[0070] Meanwhile, when inspecting the element (10) at the above inspection position (T), an inspection module (300) is installed on the upper side, and at this time, the terminal (11) of the element (10) can be placed on the stage part (210) so that the element inspection can be performed by the inspection module (300) and the element (10) can be directed upward.

[0071] At this time, the stage portion (210) may be equipped with a vacuum adsorption means so as to adsorb and fix the element (10) by vacuum pressure.

[0072] Meanwhile, it is preferable that the above stage part (210) moves up and down relative to the inspection module (300) when positioned at the inspection position (T).

[0073] For example, the stage module (300) may include a stage moving part (220, 230, 240) that moves the stage part (210) by at least one of linear movement and rotational movement.

[0074] For example, the stage moving part (220, 230, 240) may include a Z-axis moving part (240) that moves the stage part (210) directly or indirectly in the Z-axis direction.

[0075] The above Z-axis moving part (240) is configured to move the stage part (210) directly or indirectly in the Z-axis direction so as to make electrical contact with the probe card (310) through contact with the prop pin (321) of the inspection module (300), and various configurations are possible depending on the vertical movement method.

[0076] Meanwhile, the terminal (11) and the probe pin (321) of the element (10) mounted on the stage portion (210) need to be aligned horizontally with each other.

[0077] Here, the method of aligning the terminal (11) and the probe pin (321) of the element (10) mounted on the stage portion (210) in a horizontal direction can be performed in various ways depending on the alignment method, such as a camera.

[0078] And the above stage moving unit (220, 230, 240) may additionally include an XY moving unit (220) that moves the stage unit (210) directly or indirectly in the XY axis direction.

[0079] The above XY moving unit (220) is configured to move the stage unit (210) directly or indirectly in the XY axis direction so that the terminal (11) and the probe pin (321) of the element (10) mounted on the stage unit (210) are aligned horizontally with each other, and various configurations are possible.

[0080] Meanwhile, as the above stage unit (210) moves back and forth between the inspection position (T) and the element exchange position (U, L), a rotational error with respect to the inspection module (300) with the Z-axis as the rotation axis may occur, so in order to align this, the above stage moving unit (220, 230, 240) may include a rotation moving unit (230) that rotates the above stage unit (210) directly or indirectly around the rotation axis in the Z direction.

[0081] The above-mentioned rotary moving part (230) and the above-mentioned stage moving part (220, 230, 240) are configured to rotate the stage part (210) directly or indirectly around a rotation axis in the Z direction, and various configurations are possible depending on the rotary driving method.

[0082] As an example, the stage moving unit (220, 230, 240) may be configured to include an XY moving unit (220) that directly or indirectly moves a stage unit (210) in which a plurality of elements (20) are loaded in an n×m (n and m are natural numbers greater than or equal to 2) in the XY axis direction, a Z axis moving unit (240) that indirectly moves the stage unit (210) in the Z axis direction by moving the XY moving unit (220) in the Z axis direction, and a rotation moving unit (230) that indirectly rotates the stage unit (210) around a rotation axis in the Z direction by rotating the XY moving unit (220) in the Z axis direction by rotating the Z axis moving unit (240).

[0083] Meanwhile, the above-mentioned rotary moving part (230) can be installed by being supported on a base member (250) that is moved by the reciprocating moving part (290) described later.

[0084] The above reciprocating movement unit (290) is configured to reciprocate the plurality of stage units (210) to an inspection position (T) and one or more element transfer positions (U, L) for performing at least one of element loading and unloading, and various configurations are possible depending on the movement of the stage units (210).

[0085] As an example of the above reciprocating movement unit (290), the above reciprocating movement unit (290) may rotate the stage unit (210) so that it can be positioned sequentially at the inspection position (T) and the element transfer position (U, L).

[0086] As a more specific example, the reciprocating movement unit (290) may include a rotary motor (293) that generates rotational force and a plurality of rotating arms (281) coupled to the drive shaft (291) of the rotary motor (293) and to which the stage unit (210) is coupled.

[0087] The above rotary motor (293) is configured to sequentially position the inspection position (T) and the element transfer position (U, L) by rotating a pivot arm (281) coupled to the drive shaft (291) by having a drive shaft (291), and various configurations such as a stepper motor are possible.

[0088] The above-mentioned pivot arm (281) is configured to be coupled to the drive shaft (291) of the rotary motor (293) and to which the stage part (210) is coupled, and can be installed corresponding to the number of the stage part (210).

[0089] Specifically, the rotational arm (281) can be installed in multiple numbers along the circumferential direction around the drive shaft (291) of the rotational drive unit (290).

[0090] Meanwhile, in order to efficiently perform device inspection and device loading and unloading, it is preferable that the stage module (200) be installed in multiple numbers along the circumferential direction centered on the drive shaft (291) of the rotary drive unit (290).

[0091] For example, the plurality of stage sections (210) may be configured in three such that they can be positioned at each of the inspection position (T), the element loading position (L), and the element unloading position (U), as shown in FIGS. 1 and FIGS. 3.

[0092] As another example, the element transfer location (U, L) can be set as a single location that transfers the elements (10) that have finished inspecting at the inspection location (T) to the element unloading member (30) and receives the elements (10) directly or indirectly from the element loading member (20). In this case, the plurality of stage members (210) can be configured in two such that they can be positioned at the inspection location (T) and the element transfer location (U, L), respectively, as shown in FIG. 4.

[0093] As another example of the above reciprocating movement unit (290), the reciprocating movement unit (290) may be configured to reciprocate the stage unit (210) along a path (270) connecting the inspection position (T) and the element transfer position (U, L).

[0094] At this time, the above-mentioned reciprocating movement unit (290) can be configured in various ways depending on the movement direction of the stage unit (210), and can be configured to move the stage unit (210) along the path (270) using magnetic force.

[0095] And, the above path (270) is a path in which the stage unit (210) moves sequentially to the inspection position (T) and the element transfer position (U, L), and various configurations are possible depending on the movement of the stage unit (210).

[0096] For example, the above path (270) can form a closed loop.

[0097] The inspection module (300) is configured to be positioned at the inspection position (T) and to simultaneously perform inspection of the elements (10) loaded on the stage portion (210) by relative movement with respect to the stage portion (210), and various configurations are possible.

[0098] For example, the inspection module (300) may be configured to include a probe card (310) that is located at the inspection position (T) and performs an inspection of the element (10), as shown in FIGS. 2a and 2b, and a socket part (320) in which probe pins (321) are installed for inspecting each element (10) of the stage part (210) located at the inspection position (T).

[0099] The probe card (310) above is configured to perform an inspection of the element (10), and can be configured in various ways depending on the type of element (10) and the inspection content.

[0100] Meanwhile, the probe card (310) is equipped with terminals (311) that are electrically in contact with the probe pin (321) described later.

[0101] The above socket portion (320) is configured such that probe pins (321) are installed for inspecting each component (10) of the stage portion (210) located at the inspection position (T), and various configurations are possible.

[0102] For example, the socket portion (320) may have a plurality of probe pins (321) installed corresponding to the terminals (11) of the element (10).

[0103] The probe pin (321) is installed corresponding to the terminals (11) of the element (10) and electrically connects the terminals (11) of the element (10) and the terminal (211) of the probe card (310) by contacting both the terminals (11) of the element (10) and the terminal (211) of the probe card (310) through the relative vertical movement of the stage portion (210).

[0104] The foregoing merely describes some preferred embodiments that can be implemented by the present invention. As is well known, the scope of the present invention should not be interpreted as being limited to the above embodiments, and all technical concepts that share the fundamental principles with the technical concept of the present invention described above shall be included within the scope of the present invention. Explanation of the symbols

[0105] 10 : Element 200 : Stage Module 210 : Stage Section 290 : Round-trip movement unit 300 : Inspection module

Claims

Claim 1 A device inspection device characterized by comprising: a plurality of stage sections (210) in which a plurality of devices (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2), and a reciprocating movement section (290) that reciprocates the plurality of stage sections (210) to an inspection position (T) and one or more device transfer positions (U, L) for performing at least one of device loading and unloading; and an inspection module (300) positioned at the inspection position (T) and simultaneously performing an inspection of the devices (10) loaded on the stage sections (210) by relative movement with respect to the stage sections (210). Claim 2 A device inspection device according to claim 1, wherein the reciprocating moving part (290) comprises a rotary motor (293) that generates rotational force and a plurality of rotating arms (281) coupled to the drive shaft (291) of the rotary motor (293) and coupled to the stage part (210). Claim 3 The device inspection device according to claim 2, wherein the reciprocating moving part (290) is characterized in that the rotating arm (281) is installed in a plurality along the circumferential direction around the drive shaft (291) of the rotary motor (293). Claim 4 A device inspection device according to claim 1, wherein the device transfer position (U, L) includes a device loading position (L) that receives a device (10) directly or indirectly from a device loading member (20), and a device unloading position (U) that transfers devices (10) that have been inspected at the inspection position (T) to a device unloading member (30), and wherein the plurality of stage members (210) are configured in three such that they can be positioned at each of the inspection position (T), the device loading position (L), and the device unloading position (U). Claim 5 A device inspection device according to claim 1, wherein the device transfer position (U, L) is set as a single position for transferring devices (10) that have been inspected at the inspection position (T) to a device unloading member (30) and receiving devices (10) directly or indirectly from a device loading member (20), and wherein the plurality of stage members (210) are configured in two such that they can be positioned at the inspection position (T) and the device transfer position (U, L), respectively. Claim 6 A device inspection device according to claim 1, wherein the stage portion (210) sequentially positions the inspection position (T), the device loading position (L), and the device unloading position (U) by at least one movement among rotation and linear movement. Claim 7 A device inspection device according to claim 1, wherein the reciprocating movement unit (290) reciprocates the stage units (210) along a path (270) connecting the inspection position (T) and the device transfer position (U, L). Claim 8 A device inspection device according to claim 7, wherein the reciprocating moving part (290) moves the stage part (210) along the path (270) using magnetic force. Claim 9 A device inspection device according to claim 7, wherein the path (270) forms a closed loop. Claim 10 A device inspection device according to claim 1, wherein the stage module (200) comprises a stage moving part (220, 230, 240) that moves the stage part (210) at the inspection position (T) by at least one of linear movement and rotational movement. Claim 11 A device inspection device according to claim 10, wherein the stage moving part (220, 230, 240) comprises an XY moving part (220) that moves the stage part (210) directly or indirectly in the XY axis direction, a Z axis moving part (240) that moves the stage part (210) directly or indirectly in the Z axis direction, and a rotation moving part (230) that rotates the stage part (210) directly or indirectly around a rotation axis in the Z direction. Claim 12 A device inspection device according to any one of claims 1 to 11, characterized by including one or more buffer units (610) that receive a device (10) from the device loading member (20), temporarily load it, and then transfer it to the stage unit (210) located at the device transfer position (U, L). Claim 13 A device inspection device according to any one of claims 1 to 11, wherein the device loading member (20) is a wafering divided into a plurality of devices (10), and the device unloading member (30) is a tray (30) in which a plurality of devices (10) are loaded in an arrangement of j×k (j and k are natural numbers greater than or equal to 2).

Images