Device inpection euipment

Abstract

The present invention relates to device inspection, and more specifically, to a device inspection device for performing an inspection of a device. The present invention provides a device inspection device characterized by comprising: a loading unit (100) that loads and supplies devices (10) to be inspected onto a tray (20); a plurality of test modules (300) arranged at intervals in the Y-axis direction from the loading unit (100) and arranged in a j×k array in the X-axis and Z-axis directions; an unloading unit (200) in which a tray (20) loaded with devices (10) that have been inspected in the test module (300) is loaded; and a device exchange unit (400) that picks up one or more trays (20) from the loading unit (100), delivers the devices (10) to be inspected to the test module (300), and places the devices (10) that have been inspected in the test module (300) onto the unloading unit (200) while they are loaded onto the tray (20).

Description

Technology Field

[0001] The present invention relates to device inspection, and more specifically, to a device inspection device for performing an inspection of a device. Background Technology

[0002] After completing the packaging process, the semiconductor device (hereinafter referred to as the "device") undergoes various tests, such as electrical characteristics and reliability tests regarding heat or pressure, by a semiconductor device inspection device.

[0003] Depending on the type of device, such as memory devices, non-memory devices like CPUs (Central Processing Units) and GPUs (Graphic Processing Units), LED devices, and solar devices, there are various types of inspections, including room temperature inspections performed in ambient environments and high-temperature inspections performed in high-temperature environments.

[0004] Meanwhile, as the variety and popularization of IT devices such as smartphones, smartpads, and smart TVs increase, the demand for non-memory components like CPUs—namely, LSI (Large Scale Integration)—is surging.

[0005] However, due to the characteristics of small-batch, high-variety production, LSIs have a problem in that the inspection volume is small compared to the inspection equipment for standardized memory devices, making it difficult to use expensive inspection equipment.

[0006] In addition, as smartphones become thinner and IoT devices using these components also become smaller, the size of the components is becoming finer, requiring great caution during component inspection.

[0007] In particular, as the size of the device becomes miniaturized, it needs to be seated in an aligned state in the test socket for device inspection.

[0008] In addition, there is a problem where inspection errors occur when the alignment between the terminals provided on the device and the terminals of the test socket on which the device is mounted is inaccurate as the pitch between the terminals provided on the device, such as BGA devices, decreases.

[0009] Meanwhile, with the increasing demand for small yet high-performance devices such as MPUs and HBMs, the demand for inspection of precision-specification devices is rising.

[0010] (Patent Document 1) KR 10-1417772 B1

[0011] (Patent Document 2) KR 10-2016-0051146 A

[0012] (Patent Document 3) KR 10-2019-0166349 B1

[0013] (Patent Document 4) KR 10-1177319 B1 The problem to be solved

[0014] The objective of the present invention is to provide a device inspection device capable of efficiently performing device inspection on a plurality of devices. means of solving the problem

[0015] The present invention is created to achieve the above-mentioned purpose of the present invention, and the present invention provides a device inspection device characterized by comprising: a loading unit (100) that supplies devices (10) to be inspected by loading them onto a tray (20); a plurality of test modules (300) arranged at intervals in the Y-axis direction from the loading unit (100) and arranged in a j×k (j and k are natural numbers greater than or equal to 2) array in the X-axis direction and Z-axis direction; an unloading unit (200) in which a tray (20) loaded with devices (10) that have been inspected in the test module (300) is loaded; and a device exchange unit (400) that picks up one or more trays (20) from the loading unit (100), delivers the devices (10) to be inspected to the test module (300), and places the devices (10) that have been inspected in the test module (300) onto the unloading unit (200) while they are loaded onto the tray (20).

[0016] The above test module (300) may include a stage section (320) in which a plurality of elements (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2); and an inspection section (310) that performs an inspection of the elements (10) by electrically contacting the terminals of the elements (10) through relative vertical movement with respect to the stage section (320).

[0017] The above stage unit (320) can be installed to be movable between a device exchange position (P1) for device exchange with the device exchange unit (400) and an inspection position (P2) for performing an inspection by the inspection unit (310).

[0018] The above test module (300) may include a test chamber (301) that isolates the outside so as to maintain a preset temperature atmosphere when the stage part (320) is positioned at the inspection position (P2).

[0019] The above stage portion (320) may include a main body portion (323) in which an element mounting portion (324) on which an element (10) is mounted is arranged in an n×m array (n and m are natural numbers greater than or equal to 2).

[0020] The above stage section (320) may include a base member (321) installed to be movable between a device exchange position (P1) for device exchange with the device exchange section (400) and an inspection position (P2) for performing an inspection by the inspection section (310), and an upper and lower moving section (322) installed on the upper side of the base member (321) to move the main body section (323) up and down relative to the inspection section (310).

[0021] The above main body (323) can be divided and installed to correspond to two or more elements (10) for an n×m element (n and m are natural numbers greater than or equal to 2).

[0022] The above divided main body (323) may be equipped with a force block (326) having elasticity so as to correspond to the relative distance error with respect to the inspection unit (310) when it is moved upward by the above moving unit (322).

[0023] The above-described element exchange unit (400) may include a tray loading unit (440) in which a plurality of trays (20) are stacked vertically; an element transfer tool (420) for picking up an element (10) to be inspected from a tray (20) loaded in the tray loading unit (440) and placing it on a stage unit (320) located at the element exchange position (P1), or picking up an element (10) that has finished inspecting from the stage unit (320) located at the element exchange position (P1) and placing it on a tray (20) loaded in the tray loading unit (440); a support member (412) to which the tray loading unit (440) and the element transfer tool (420) are combined, and a movement module (410) including an XZ robot (413) for moving the support member (412) in the Z-axis direction and the X-axis direction.

[0024] The above tray loading section (440) may include a first tray lifting / lowering section (441) and a second tray lifting / lowering section (442) arranged in the X-axis direction for lifting and lowering trays (20) stacked vertically, and a tray handling section (450) for transporting trays (20) between the first tray lifting / lowering section (441) and the second tray lifting / lowering section (442).

[0025] The number of trays (20) in a preset quantity is defined in lot units, and the first tray lifting / lowering unit (441) and the second tray lifting / lowering unit (442) receive the trays (20) in lot units from the loading unit (100) and can transfer the trays (20) in lot units to the unloading unit (200). Effects of the invention

[0026] The device inspection device according to the present invention has the advantage of being able to perform the loading and unloading of devices for device inspection more efficiently by transferring one or more trays to a device exchange position for a plurality of test modules arranged in a j×k (j and k are natural numbers greater than or equal to 2) array and then performing the loading and unloading of devices for the test modules.

[0027] In addition, the device inspection device according to the present invention has the advantage of improving the reliability of the device inspection by performing the device inspection under a preset temperature atmosphere.

[0028] In addition, the device inspection device according to the present invention has the advantage of minimizing device inspection failures caused by poor contact between the device and the probe pin by providing a force block having elasticity that can correspond to the relative distance error between the inspection unit and the stage unit in a block unit corresponding to one or more devices. Brief explanation of the drawing

[0029] FIG. 1 is a layout diagram showing a device inspection device according to the present invention. FIG. 2 is a side view showing the configuration of the test module and the component exchange unit of the component inspection device of FIG. 1. FIG. 3 is a plan view of the component exchange unit shown in FIG. 2. FIG. 4 is a side view of the component exchange unit shown in FIG. 2. FIG. 5 is a plan view showing an example of a stage portion of a test module of the device inspection device of FIG. 1. FIG. 6 is a side view showing an example of a tray exchange process between a loading / unloading unit and a device exchange unit in the device inspection device of FIG. 1. FIGS. 7 and 8 are front views showing examples of the stage portion of the test module of the device inspection device of FIG. 1. FIG. 5 is a front view showing examples of the stage portion of the test module of FIG. 1. Figure 9 is an enlarged view of part A in Figure 2. Specific details for implementing the invention

[0030] The device inspection device according to the present invention will be described below with reference to the attached drawings.

[0031] As illustrated in FIGS. 1 to 3, the device inspection device according to the present invention comprises: a loading unit (100) that supplies devices (10) to be inspected by loading them onto a tray (20); a plurality of test modules (300) arranged at intervals in the Y-axis direction from the loading unit (100) and arranged in a j×k (j and k are natural numbers greater than or equal to 2) array in the X-axis direction and Z-axis direction; an unloading unit (200) in which a tray (20) loaded with devices (10) that have been inspected in the test module (300) is loaded; and a device exchange unit (400) that picks up one or more trays (20) from the loading unit (100), delivers the devices (10) to be inspected to the test module (300), and places the devices (10) that have been inspected in the test module (300) onto the unloading unit (200) while they are loaded onto the tray (20).

[0032] First, the object to be inspected by the device inspection device according to the present invention is a target whose electrical characteristics are inspected in the device inspection area (200), and in particular, may be a so-called BGA device having a ball terminal formed on the bottom surface.

[0033] And the above tray (20) is configured to load a plurality of elements (10), and various configurations are possible depending on the element specifications.

[0034] The above loading unit (100) is configured to load and supply the elements (10) to be inspected onto a tray (20), and various configurations are possible depending on the loading method of the tray.

[0035] In particular, the loading unit (100) may be configured to deliver a plurality of trays (20), for example, a lot-unit tray (20), to the component exchange unit (400) described later, particularly to the tray loading unit (440). Here, the lot unit may be set to a number determined within the manufacturer, such as 8 or 10, for convenience.

[0036] And the above loading unit (100) is loaded with lot-unit trays (20) so that lot-unit trays (20) can be exchanged, and as shown in FIG. 6, lot-unit trays (20) can be delivered to the element exchange unit (400) described later, particularly the tray loading unit (440) by a push method.

[0037] The above unloading unit (200) is configured such that a tray (20) loaded with components (10) that have been inspected in the above test module (300) is loaded, and various configurations are possible depending on the unloading method of the tray.

[0038] In particular, the unloading unit (200) may be configured to receive a plurality of trays (20), for example, trays (20) in lot units, from the component exchange unit (400) described later, particularly the tray loading unit (440). Here, the lot unit may be set to a number determined within the manufacturer, such as 8 or 10, for convenience.

[0039] And the above unloading unit (200) can be loaded with lot-unit trays (20) so that lot-unit trays (20) can be exchanged, and as shown in FIG. 6, lot-unit trays (20) can be received from the component exchange unit (400) described later, particularly the tray loading unit (440), by a push method.

[0040] Meanwhile, the tray (20) delivered to the unloading unit (200) can be classified according to a classification grade pre-set by the sorting tool (500).

[0041] To this end, the unloading unit (200) may have a plurality of trays (20) positioned at multiple locations in the lateral direction, for example, in the X-axis direction.

[0042] And a tray transfer (not shown) for transporting the trays (20) can be installed so that the trays (20) can be positioned at multiple locations.

[0043] The above test modules (300) are spaced apart in the Y-axis direction from the loading unit (100) to perform tests on a large number of components, and can be arranged in multiple j×k (j and k are natural numbers greater than or equal to 2) arrays in the X-axis and Z-axis directions.

[0044] For example, the test module (300) may include a stage section (320) in which a plurality of elements (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2); and an inspection section (310) that performs an inspection of the elements (10) by electrically contacting the terminals of the elements (10) through relative vertical movement with respect to the stage section (320).

[0045] The inspection unit (310) may be configured to include a probe card (311) for performing an inspection of a component (10), as shown in FIG. 9, and a socket unit (312) in which probe pins (313) are installed for inspecting each component (10) of the stage unit (320).

[0046] The probe card (310) above is configured to perform an inspection of the element (10), and can be configured in various ways depending on the type of element (10) and the inspection content.

[0047] Meanwhile, the probe card (310) is equipped with terminals (311a) that are electrically in contact with the probe pin (313) described later.

[0048] The above socket portion (312) is configured such that probe pins (313) are installed for inspecting each component (10) of the stage portion (320), and various configurations are possible.

[0049] For example, the socket portion (312) may have a plurality of probe pins (313) installed corresponding to the terminals (11) of the element (10).

[0050] The probe pin (313) is installed corresponding to the terminals (11) of the element (10) and electrically connects the terminals (11) of the element (10) and the terminal (311a) of the probe card (311) by contacting both the terminals (11) of the element (10) and the terminal (311a) of the probe card (311) through the relative vertical movement of the stage portion (320).

[0051] The above stage section (320) is configured such that a plurality of elements (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2), and various configurations are possible depending on the element loading structure and the method of vertical movement of the inspection section (310).

[0052] For example, the stage unit (320) may be installed to be movable between a device exchange position (P1) for device exchange with the device exchange unit (400) and an inspection position (P2) for performing an inspection by the inspection unit (310).

[0053] At this time, movement between the element exchange position (P1) and the inspection position (P2) of the stage unit (320) can be performed by various methods such as a pulling method or a pushing method.

[0054] And the above stage portion (320) may include a main body portion (323) in which an element mounting portion (324) on which an element (10) is mounted is arranged in an n×m arrangement (n and m are natural numbers greater than or equal to 2).

[0055] The above-mentioned element mounting portion (324) is configured such that the element (10) is mounted thereon, and can be configured in various ways depending on the mounting structure of the element, such as being a virtual configuration where the position is simply set on the main body portion (323), or being configured as a mounting groove so that the mounting position of the element (10) is fixed.

[0056] In particular, the above-mentioned element mounting portion (324) may be equipped with a heater for heating the element (10).

[0057] The above main body (323) is configured such that the element mounting portion (324), on which the element (10) is mounted, is arranged in an n×m array (n and m are natural numbers greater than or equal to 2), and various configurations are possible.

[0058] In addition, the main body (323) may be equipped with a temperature control means to account for cases where temperature control is required, such as performing heating or cooling before the element inspection and cooling or heating after the element inspection.

[0059] The above temperature control means is configured to change the temperature of a mounted element (10), such as by preheating according to an element inspection, and can be configured in various ways depending on the temperature control method, such as a thermoelectric module, a heater, or temperature control by the flow of a refrigerant.

[0060] Additionally, as illustrated in FIGS. 7 and 8, the stage portion (320) may include a base member (321) installed to be movable between a device exchange position (P1) for device exchange with the device exchange portion (400) and an inspection position (P2) for performing an inspection by the inspection portion (310), and an upper and lower moving portion (322) installed on the upper side of the base member (321) to move the main body portion (323) up and down relative to the inspection portion (310).

[0061] Meanwhile, there is a problem in that when the main body (323) rises due to an error in the relative distance of each element (10) to the inspection unit (310), only some of the terminals (11) of the elements (10) come into electrical contact with the terminal (311a) of the probe card (311), so that an inspection failure may occur.

[0062] Accordingly, the above main body (323) can be divided and installed to correspond to two or more elements (10) for an n×m element (n and m are natural numbers greater than or equal to 2).

[0063] And the above-described divided main body (323) may be equipped with a force block (326) having elasticity so as to correspond to the relative distance error with respect to the inspection unit (310) when it is moved upward by the above-described upper and lower moving unit (322).

[0064] With the above configuration, even if there is an error in the relative distance of each element (10) to the inspection unit (310), when the main body (323) rises, only the terminals (11) of all elements (10) are electrically contacted with the terminal (311a) of the probe card (311), thereby greatly improving the reliability of the element inspection.

[0065] The above-mentioned component exchange unit (400) is configured to pick up one or more trays (20) from the loading unit (100), transfer components (10) to be tested in the test module (300), and place components (10) that have been tested in the test module (300) onto the unloading unit (200) while they are loaded in the trays (20), and various configurations are possible.

[0066] For example, the above-described element exchange unit (400) may include a tray loading unit (440) in which a plurality of trays (20) are stacked vertically; an element transfer tool (420) for picking up an element (10) to be inspected from a tray (20) loaded in the tray loading unit (440) and placing it on a stage unit (320) located at the element exchange position (P1), or picking up an element (10) that has finished inspecting from a stage unit (320) located at the element exchange position (P1) and placing it on a tray (20) loaded in the tray loading unit (440); a support member (412) to which the tray loading unit (440) and the element transfer tool (420) are combined, and a movement module (410) including an XZ robot (413) for moving the support member (412) in the Z-axis direction and the X-axis direction.

[0067] The above tray loading section (440) is configured such that a plurality of trays (20) are stacked vertically, and a tray containing an element (10) to be inspected is loaded in each tray (20), or an empty tray can be loaded so that an element (10) that has been inspected in the test module (300) is loaded.

[0068] Meanwhile, the number of trays (20) loaded with the device (10) to be inspected and empty trays can be appropriately combined depending on the method, such as when the device loading process for the test module (300) and the device extraction process from the test module (300) are performed simultaneously or individually.

[0069] For example, the tray loading section (440) may include a first tray lifting / lowering section (441) and a second tray lifting / lowering section (442) arranged in the X-axis direction for lifting and lowering a tray (20) stacked vertically, and a tray handling section (450) for transporting the tray (20) between the first tray lifting / lowering section (441) and the second tray lifting / lowering section (442).

[0070] With the above configuration, the loading and unloading of the component (10) for the test module (300) can be performed as follows.

[0071] As an example, either of the first tray lifting / lowering unit (441) and the second tray lifting / lowering unit (442) may have a tray (20) loaded with elements (10) to be inspected loaded in a lot unit.

[0072] At this time, when all the elements (10) to be inspected are withdrawn from the tray (20) by the element transfer tool (420) described later, the empty tray (20) is moved to the other of the first tray lifting / lowering unit (441) and the second tray lifting / lowering unit (442) by the tray handling unit (450).

[0073] And either of the first tray lifting / lowering unit (441) and the second tray lifting / lowering unit (442) raises the next tray (20) so that the element (10) can be drawn out from the next tray (20) as the empty tray (20) moves.

[0074] Meanwhile, the other one of the first tray lifting / lowering unit (441) and the second tray lifting / lowering unit (442) is lowered by the tray handling unit (450) according to the stacking of the tray (20).

[0075] And the number of trays (20) in a preset quantity is defined in lot units, and the first tray lifting / lowering unit (441) and the second tray lifting / lowering unit (442) receive the trays (20) in lot units from the loading unit (100) and can transfer the trays (20) in lot units to the unloading unit (200).

[0076] Meanwhile, the first tray lifting / lowering unit (441) and the second tray lifting / lowering unit (442) can effectively perform the exchange of elements of the element transfer tool (420) for each test module (300) by moving up and down together with the element transfer tool (420).

[0077] As described above, the tray exchange unit (400) can receive the tray (20) in lot units and perform loading and unloading of the tray more efficiently.

[0078] The above tray handling unit (450) is configured to transport the tray (20) between the first tray lifting / lowering unit (441) and the second tray lifting / lowering unit (442), and various configurations are possible.

[0079] For example, the tray handling part (450) may include a tray grip part (451) that moves in the X-axis direction along a guide rail (452) fixedly coupled to a support member (412).

[0080] Meanwhile, the tray grip portion (451) may be positioned at a location outside the movement area of ​​the device transfer tool (420), for example, sufficiently spaced apart in the X-axis direction, in order to avoid movement interference when performing device exchange of the device transfer tool (420) for each test module (300).

[0081] The above-mentioned device transfer tool (420) is configured to pick up a device (10) to be inspected from a tray (20) loaded in the tray loading section (440) and place it on a stage section (320) located at the device exchange position (P1), or to pick up a device (10) that has been inspected from the stage section (320) located at the device exchange position (P1) and place it on a tray (20) loaded in the tray loading section (440), and various configurations are possible.

[0082] For example, the device transfer tool (420) may be configured to include a plurality of pickers so as to be able to pick up a plurality of devices (10) loaded in the tray (20), and the pitch between the pickers picking up the devices (10) may be configured to be variable, taking into account that the pitch between the devices (10) in the tray (20) and the pitch between the devices (10) on the stage (320) may be set differently.

[0083] Meanwhile, the above-mentioned element transfer tool (420) can be moved by an XY transfer robot (423).

[0084] The above XY transfer robot (423) may include an X-axis moving part (423b) and a Y-axis moving part (423a) as a configuration for moving the element transfer tool (420) in the XY direction.

[0085] And the above-mentioned device transfer tool (420) can be configured to move the device in an accurate position by means of a Z-axis direction moving part (not shown) for moving in the Z-axis direction, a rotation moving part (not shown) with the Z-axis as the rotation axis, etc.

[0086] The above-mentioned moving module (410) is configured to include a support member (412) to which the tray loading section (440) and the element transfer tool (420) are combined, and an XZ robot (413) for moving the support member (412) in the Z-axis direction and the X-axis direction, and various configurations are possible.

[0087] The above support member (412) is configured such that the tray loading section (440) and the element transfer tool (420) are combined, and various configurations are possible.

[0088] In particular, the support member (412) can move the tray loading section (440) and the element transfer tool (420) simultaneously in the Z-axis direction and the X-axis direction by combining the tray loading section (440) and the element transfer tool (420).

[0089] The above XZ robot (413) is configured to move the support member (412) in the Z-axis direction and the X-axis direction, and various configurations are possible.

[0090] The above XZ robot (413) may include an X-axis direction moving block (413) that moves in the X-axis direction, an X-axis direction moving drive unit (not shown) for moving the X-axis direction moving block (413) in the X-axis direction, a Z-axis direction guide unit (411) installed on the X-axis direction moving block (413) and guiding the Z-axis direction of the support member (412), and a Z-axis direction moving drive unit (not shown) for moving the support member (412) to the Z-axis direction guide unit (411).

[0091] The foregoing merely describes some preferred embodiments that can be implemented by the present invention. As is well known, the scope of the present invention should not be interpreted as being limited to the above embodiments, and all technical concepts that share the fundamental principles with the technical concept of the present invention described above shall be included within the scope of the present invention. Explanation of the symbols

[0092] 10 : Element 20 : Tray 100 : Loading section 200 : Unloading section 300 : Test module 400 : Component exchange unit

Claims

Claim 1 A device inspection device characterized by comprising: a loading unit (100) that supplies devices (10) to be inspected by loading them onto a tray (20); a plurality of test modules (300) arranged at intervals in the Y-axis direction from the loading unit (100) and arranged in a j×k (j and k are natural numbers greater than or equal to 2) array in the X-axis direction and Z-axis direction; an unloading unit (200) in which a tray (20) loaded with devices (10) that have been inspected in the test module (300) is loaded; and a device exchange unit (400) that picks up one or more trays (20) from the loading unit (100), delivers the devices (10) to be inspected to the test module (300), and places the devices (10) that have been inspected in the test module (300) onto the unloading unit (200) while they are loaded onto the tray (20). Claim 2 A device inspection device according to claim 1, wherein the test module (300) comprises: a stage portion (320) in which a plurality of devices (10) are loaded in an n×m arrangement (n and m are natural numbers greater than or equal to 2); and an inspection portion (310) that performs an inspection of the devices (10) by electrically contacting the terminals of the devices (10) through relative vertical movement with respect to the stage portion (320). Claim 3 A device inspection device according to claim 2, wherein the stage portion (320) is installed to be movable between a device exchange position (P1) for device exchange with the device exchange portion (400) and an inspection position (P2) for performing inspection by the inspection portion (310). Claim 4 A device inspection device according to claim 3, wherein the test module (300) includes a test chamber (301) that isolates the test module from the outside so as to maintain a preset temperature atmosphere when the stage portion (320) is positioned at the inspection position (P2). Claim 5 A device inspection device according to claim 2, wherein the stage portion (320) comprises a main body portion (323) in which a device mounting portion (324) on which a device (10) is mounted is arranged in an n×m arrangement (n and m are natural numbers greater than or equal to 2). Claim 6 A device inspection device according to claim 5, wherein the stage portion (320) comprises a base member (321) installed to be movable between a device exchange position (P1) for device exchange with the device exchange portion (400) and an inspection position (P2) for performing an inspection by the inspection portion (310), and an upper and lower moving portion (322) installed on the upper side of the base member (321) to move the main body portion (323) up and down relative to the inspection portion (310). Claim 7 A device inspection device according to claim 5, wherein the main body (323) is divided and installed to correspond to two or more devices (10) for n×m devices (n and m are natural numbers greater than or equal to 2). Claim 8 A device inspection device according to claim 7, wherein the divided main body (323) is equipped with a force block (326) having elasticity so as to correspond to the relative distance error with respect to the inspection unit (310) when the upper and lower moving unit (322) moves upward. Claim 9 In any one of claims 1 to 8, the element exchange unit (400) comprises: a tray loading unit (440) in which a plurality of trays (20) are stacked vertically; an element transfer tool (420) for picking up an element (10) to be inspected from a tray (20) loaded in the tray loading unit (440) and placing it on a stage unit (320) located at the element exchange position (P1), or picking up an element (10) that has finished inspecting from the stage unit (320) located at the element exchange position (P1) and placing it on a tray (20) loaded in the tray loading unit (440); and a movement module (410) comprising a support member (412) to which the tray loading unit (440) and the element transfer tool (420) are coupled, and an XZ robot (413) for moving the support member (412) in the Z-axis direction and the X-axis direction. Device inspection device. Claim 10 The device inspection device according to claim 9, wherein the tray loading section (440) is arranged in the X-axis direction and includes a first tray lifting / lowering section (441) and a second tray lifting / lowering section (442) for lifting / lowering a tray (20) stacked vertically, and a tray handling section (450) for transporting the tray (20) between the first tray lifting / lowering section (441) and the second tray lifting / lowering section (442). Claim 11 A device inspection device according to claim 10, wherein a predetermined number of trays (20) are defined in lot units, and the first tray lifting / lowering unit (441) and the second tray lifting / lowering unit (442) receive the trays (20) in lot units from the loading unit (100) and transfer the trays (20) in lot units to the unloading unit (200).

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