Electronic device

Abstract

According to embodiments, the electronic device comprises a display panel including a light-emitting pixel, a first protective layer located on the back surface of the display panel, and a first adhesive layer located between the display panel and the first protective layer, wherein the first adhesive layer comprises a non-conductive film (NCF).

Description

Technology Field

[0001] The present disclosure relates to an electronic device. Background Technology

[0002] The electronic device may be activated according to an electrical signal and may include a display device that displays an image. According to an embodiment, the display device includes a light-emitting diode, and the light-emitting diode may implement deep and vivid colors and provide a wide viewing angle.

[0003] Meanwhile, the display device included in the electronic device may include a curved surface area in which each side and corner portion is bent at a predetermined angle. A display device including a curved surface area can enhance user convenience and provide a wide viewing angle. The problem to be solved

[0004] The embodiments can provide an electronic device capable of resolving buckling that may occur in the curved area of ​​a display device. means of solving the problem

[0005] An electronic device according to one embodiment comprises a display panel including a light-emitting pixel, a first protective layer located on the back surface of the display panel, and a first adhesive layer located between the display panel and the first protective layer, wherein the first adhesive layer comprises a non-conductive film (NCF).

[0006] The modulus of the first adhesive layer may be 20 MPa or more.

[0007] The adhesive strength of the first adhesive layer above may be 2800gf / in or more.

[0008] The first protective layer may include metal or glass.

[0009] The first protective layer can come into direct contact with the first adhesive layer.

[0010] It may further include a second protective layer located on the front surface facing the back surface of the above-mentioned display panel.

[0011] It may further include a second adhesive layer located between the display panel and the second protective layer.

[0012] The adhesive strength of the first adhesive layer may be greater than the adhesive strength of the second adhesive layer.

[0013] The display panel includes a flat area and a curved area bent at the corner, and the display panel bending angle at which the display panel is bent in the curved area may be 45° to 85°.

[0014] The above non-conductive film may include epoxy, polyacrylate, or urethane.

[0015] It may further include a support plate located on the back surface of the first protective layer.

[0016] An electronic device according to one embodiment comprises a display panel including a light-emitting pixel, a first protective layer located on the back surface of the display panel, a support plate located on the back surface of the first protective layer, and a third adhesive layer located between the first protective layer and the support plate, wherein the third adhesive layer comprises a non-conductive film (NCF).

[0017] The modulus of the third adhesive layer above may be 20 MPa or more.

[0018] The adhesive strength of the third adhesive layer above may be 2800gf / in or more.

[0019] It may further include a second protective layer located on the front surface facing the back surface of the above-mentioned display panel.

[0020] It may further include a second adhesive layer located between the display panel and the second protective layer.

[0021] The adhesive strength of the third adhesive layer may be greater than the adhesive strength of the second adhesive layer.

[0022] The second adhesive layer may include an optically transparent adhesive.

[0023] It may further include a first adhesive layer located between the above-mentioned display panel and the above-mentioned first protective layer.

[0024] The first adhesive layer may include a pressure-sensitive adhesive. Effects of the invention

[0025] According to the embodiments, buckling that may occur at the corner portion of an electronic device can be prevented.

[0026] In addition, according to the embodiments, there are advantageous effects that can be recognized throughout the specification. Brief explanation of the drawing

[0027] FIG. 1 is a perspective view illustrating an electronic device according to one embodiment. FIG. 2 is a perspective view showing a disassembled part of an electronic device according to one embodiment. FIG. 3 is a diagram showing the stacked structure of a display device of an electronic device according to one embodiment. FIG. 4 is a drawing showing the first to third layers of the first protective layer. Figure 5 is a cross-sectional view taken by cutting along the V-V' line of Figure 1. Figures 6 and 7 are diagrams illustrating the refraction and distortion of light according to surface wavyness. Figure 8 is an equivalent circuit diagram of a pixel circuit included in a display panel. FIG. 9 is a cross-sectional view illustrating a part of a display panel equipped with an electronic device. FIG. 10 is a drawing illustrating a stacked structure of a display device of an electronic device according to one embodiment. Figure 11 is simulation data illustrating the difference in interfacial pressure according to the material of the adhesive layer. FIG. 12 is a block diagram of an electronic device according to one embodiment. Specific details for implementing the invention

[0028] Hereinafter, various embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement them. The present disclosure may be embodied in various different forms and is not limited to the embodiments described herein.

[0029] To clearly explain the present disclosure, parts unrelated to the description have been omitted, and the same reference numerals are used for identical or similar components throughout the specification.

[0030] Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present disclosure is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, in the drawings, the thickness of some layers and regions has been exaggerated for convenience of explanation.

[0031] Furthermore, when it is said that a part, such as a layer, membrane, region, or plate, is "on" or "on" another part, this includes not only the case where it is "directly above" the other part, but also the case where there is another part in between. Conversely, when it is said that a part is "directly above" another part, it means that there is no other part in between. Also, saying that a part is "on" or "on" a reference part means that it is located above or below the reference part, and does not necessarily mean that it is located "on" or "on" in the direction opposite to gravity.

[0032] Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0033] Additionally, throughout the specification, "planar" means when the subject part is viewed from above, and "cross-sectional" means when the cross-section obtained by vertically cutting the subject part is viewed from the side.

[0034] An electronic device according to one embodiment will be examined below with reference to FIG. 1. FIG. 1 is a perspective view illustrating an electronic device according to one embodiment.

[0035] The electronic device (10) may be a device that performs various tasks using electricity. The electronic device (10) may have the function of processing or converting electrical signals to transmit, store, and compute information. The electronic device (10) including a display panel may perform the function of providing visual information. The electronic device (10) including a display panel may include a smartphone, camera, tablet, laptop computer, monitor, television, smart watch, e-book reader, PDA (personal digital assistant), PMP (portable multimedia player), game console, and car navigation system.

[0036] The electronic device (10) may have a roughly rectangular shape in a plane. The electronic device (10) may include two short sides extending in a first direction (D1) in a plane and two long sides extending in a second direction (D2) that intersects the first direction (D1). The corner (CA) where the long sides and short sides meet may have a curved shape in a plane.

[0037] The long side and short side of the electronic device (10) may be bent in a third direction (D3) that intersects the first direction (D1) and the second direction (D2), respectively. Additionally, the corner portion (CA) of the electronic device (10) may be bent in the third direction (D3). The corner portion (CA) may be positioned between a curved surface area (BA) positioned along the long side and a curved surface area (BA) positioned along the short side. An electronic device (10) according to one embodiment may include four corner portions (CA). The curved surface area (BA) may include the long side, the short side, and the corner portion (CA) that are bent in the third direction (D3). The curved surface area (BA) may surround a flat surface area (PA) of the electronic device (10).

[0038] The electronic device (10) can display an image in a planar area (PA) toward a third direction (D3). Additionally, the electronic device (10) can display an image in a curved area (BA) toward the normal direction of the curve. The normal direction of the curve may be a direction perpendicular to the tangent of the curve. The image may include a still image as well as a dynamic image.

[0039] The electronic device (10) may include a display device (11) and a case (EDC). The case (EDC) may include a material with relatively high rigidity. For example, the case (EDC) may include glass, plastic, or metal, or a frame composed of a combination thereof. The case (EDC) can protect the display device housed in the case (EDC) by absorbing shocks applied from the outside or preventing foreign substances / moisture, etc. from penetrating from the outside.

[0040] Hereinafter, an example display device will be examined in more detail with reference to FIGS. 2 and 3. FIG. 2 is a perspective view showing a disassembled portion of an electronic device according to one embodiment, and FIG. 3 is a drawing showing the stacked structure of a display device of an electronic device according to one embodiment. Descriptions of components identical to those described above are omitted.

[0041] Referring to FIG. 2, an electronic device according to one embodiment may include a display device (11).

[0042] Referring to FIG. 2 and FIG. 3, the display device (11) may include a display panel (20), a first protective layer (30), a first adhesive layer (40), a second protective layer (50), a second adhesive layer (60), a support plate (70), and a third adhesive layer (80). The display device (11) may have the support plate (70), the third adhesive layer (80), the first protective layer (30), the first adhesive layer (40), the display panel (20), the second adhesive layer (60), and the second protective layer (50) stacked in order along a third direction (D3). If necessary, the display device (11) may further include other layers in addition to these.

[0043] In the following, the front surface of each layer of the display device (11) may refer to the upper surface, and the back surface may refer to the lower surface. The upper surface and the lower surface may face each other.

[0044] The display panel (20) may include a plurality of light-emitting pixels (PX). The display panel (20) may be a device for visually displaying information on a screen. The light-emitting pixels (PX) may include a light-emitting element and emit light. The light-emitting pixels (PX) may include red pixels, green pixels, and blue pixels. The red pixels may emit red light, the green pixels may emit green light, and the blue pixels may emit blue light. However, they are not limited thereto and may include pixels that emit white light. In addition, they may emit various colors to create a screen.

[0045] Although not illustrated in FIG. 3, the display device (11) may include a flexible printed circuit board (FPCB) that extends from one end surface of the display panel (20) and is attached to the end surface of one side of the support plate (70). The FPCB is a flexible circuit board and may be attached from the front of the display panel (20) to a portion of the back surface of the display device (11) or the back surface of the support plate (70) that constitutes the back surface of the display panel (20).

[0046] The specific structure of the display panel (20) will be explained in detail with reference to FIG. 9.

[0047] The first protective layer (30) may be located on the back surface of the display panel (20). The first protective layer (30) may act as a cushion to absorb shocks from the outside of the display device and prevent damage to the back surface of the display panel (20). Additionally, the first protective layer (30) may be applied in a dark color (e.g., black) to help with background display when the screen is off.

[0048] The first protective layer (30) may include a polymer member. For example, the first protective layer (30) may include polyethylene terephthalate (PET) or polyimide (PI). Additionally, the first protective layer (30) may include a metal. For example, it may include pure titanium (Pure Ti), titanium alloy (Ti alloy), stainless steel, aluminum alloy (Al alloy), copper (Cu), nickel alloy (Ni alloy), etc. Additionally, the first protective layer (30) may include a clad metal. The clad metal may be an integrated or single composite material in which a plurality of metals are laminated. The clad metal may be manufactured through various methods such as welding, pressing, casting, extruding, or laser cladding of a plurality of metals. For example, the clad metal may be Ni-Cu-Ni or phosphor bronze-Cu-phosphor bronze. Additionally, the first protective layer (30) may include glass. By having the first protective layer (30) include metal or glass, the overall modulus of the display device included in the electronic device according to one embodiment can be improved, which may be advantageous in preventing buckling that may occur at the corner portions of the display panel (20).

[0049] A first adhesive layer (40) may be located between the display panel (20) and the first protective layer (30). The first adhesive layer (40) may bond the display panel (20) and the first protective layer (30). The first protective layer (30) may come into direct contact with the first adhesive layer (40).

[0050] The first adhesive layer (40) may include a non-conductive film (NCF). The non-conductive film may be an adhesive film with an added underfill function. The non-conductive film can perform an underfill role at the interface where the two layers meet. This allows for the redistribution and alleviation of stress and deformation caused by the difference in the coefficient of thermal expansion between the two layers. The non-conductive film is a film that does not have electrical conductivity and can block the flow of electricity. The first adhesive layer (40) including the non-conductive film can minimize electrical interference to the display panel (20). In addition, since the non-conductive film has excellent thermal stability, it can maintain insulation performance even at high temperatures. Furthermore, because the non-conductive film is thin yet has high mechanical strength, it can serve to protect electronic components from external shocks or mechanical damage.

[0051] A non-conductive film may comprise a matrix polymer and a cross-linking agent dispersed in the matrix polymer. The non-conductive film can exhibit adhesion through various curing mechanisms, such as heating, light irradiation, or exposure to humidity, as a cross-linking reaction occurs between the matrix polymer and the cross-linking agent. In particular, thermosetting polymers undergo a cross-linking reaction upon heating, photocurable polymers undergo a cross-linking reaction through UV irradiation, and thermoplastic polymers achieve melt adhesion through heating. The matrix polymer may be an epoxy resin, for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a naphthalene type epoxy resin, an aminophenol type epoxy resin, a hydrogenated bisphenol type epoxy resin, an alicyclic epoxy resin, an alcohol ether type epoxy resin, a cyclic aliphatic type epoxy resin, a fluorene type epoxy resin, or a siloxane-based epoxy resin. Additionally, the matrix polymer may be a polyacrylate. In addition, the matrix polymer may be a urethane such as polyether polyurethane, polyester polyurethane, polycarbonate polyurethane, polyol-based polyurethane, etc. However, the matrix polymer is not limited to these. These may be used alone or two or more types may be mixed and used.

[0052] The curing agent is, for example, an acid anhydride-based curing agent such as tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexenedicarboxylic anhydride, phthalic anhydride, maleic anhydride, pyromellitic anhydride, etc.; an aromatic amine-based curing agent such as metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, etc.; an aliphatic amine-based curing agent such as diethylenetriamine, triethylenetetraamine, etc.; Phenolic curing agents such as phenol-aralkyl type phenol resin, phenol-novolak type phenol resin, xylock type phenol resin, cresol-novolak type phenol resin, naphthol type phenol resin, terpene type phenol resin, polyfunctional type phenol resin, dicyclopentadiene-based phenol resin, naphthalene type phenol resin, and novolak type phenol resin synthesized from bisphenol A and resol; latent curing agents such as dicyandiamide, but are not limited to these. These may be used alone or in a mixture of two or more types.

[0053] In particular, non-conductive films can easily form high values ​​for adhesive strength and modulus. Adhesive strength can be the force by which two objects stick together. The stronger the adhesive strength, the more strongly the two objects can be bonded. Modulus can be the ratio of stress to strain that an elastic body exhibits within its elastic limit. Objects with a high modulus can deform less in response to external forces.

[0054] By including a non-conductive film in the first adhesive layer (40), electrical interference with the display panel (20) can be minimized. Additionally, including a non-conductive film in the first adhesive layer (40) allows for a wide range of adjustment of the adhesive strength and modulus of the first adhesive layer (40). This can be advantageous in preventing buckling that may occur at the corners of the display panel (20).

[0055] The second protective layer (50) may be located on the front of the display panel (20). The front of the display panel (20) may face the back of the display panel (20). The front of the second protective layer (50) may correspond to the front of the electronic device (10). The second protective layer (50) may cover the entire upper surface of the display device (11). The second protective layer (50) may correspond to the shape of the display device (11). The second protective layer (50) may mitigate external shocks, thereby preventing the display device (11) from being damaged or malfunctioning due to external shocks.

[0056] The second protective layer (50) may include an optically transparent material. The second protective layer (50) may include an optically transparent substrate. For example, the second protective layer (50) may include a glass substrate, and the glass substrate may be a reinforced glass substrate.

[0057] A second adhesive layer (60) may be located between the display panel (20) and the second protective layer (50). The second adhesive layer (60) can bond the display panel (20) and the second protective layer (50).

[0058] The second adhesive layer (60) may include at least one of an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure-sensitive adhesive (PSA), a heat-reactive adhesive, or a double-sided tape.

[0059] The adhesive strength of the first adhesive layer (40) may be greater than the adhesive strength of the second adhesive layer (60).

[0060] A support plate (70) may be positioned on the back surface of the first protective layer (30). The support plate (70) may be used to help reinforce the rigidity of the electronic device, shield ambient noise, and dissipate heat emitted from surrounding heat dissipation components.

[0061] The support plate (70) may include metal. As an example, the support plate (70) may include at least one of stainless steel, Cu, Al, or clad metal (e.g., a laminated member in which stainless steel and aluminum are alternately arranged). Additionally, the support plate (70) may include other alloy materials.

[0062] The support plate (70) may include at least one reinforcing fiber composite according to the embodiment. For example, the support plate (70) may include at least one of carbon fiber reinforced plastic (CFRP) and glass fiber reinforced plastic (GFRP).

[0063] A third adhesive layer (80) may be located between the first protective layer (30) and the support plate (70). The third adhesive layer (80) can bond the first protective layer (30) and the support plate (70).

[0064] The third adhesive layer (80) may include at least one of an optically transparent adhesive, an optically transparent resin or a pressure-sensitive adhesive, a heat-reactive adhesive or a double-sided tape.

[0065] In addition, the adhesive strength of the first adhesive layer (40) may be greater than the adhesive strength of the third adhesive layer (80).

[0066] Hereinafter, with reference to FIG. 4, the case in which the first protective layer includes clad metal will be described. FIG. 4 is a drawing showing the first to third layers of the first protective layer.

[0067] The first protective layer (30) may include clad metal. When the first protective layer (30) includes clad metal, the first protective layer (30) may have a multilayer structure. FIG. 4 is a drawing showing the first protective layer (30) including clad metal.

[0068] When the first protective layer (30) includes clad metal, the first protective layer (30) may include a first layer (301), a second layer (302), and a third layer (303). The first layer (301), the second layer (302), and the third layer (303) may be stacked in order. That is, the second layer (302) may be located between the first layer (301) and the third layer (303).

[0069] For example, the clad metal included in the first protective layer (30) may be Ni-Cu-Ni. In other words, the first layer (301) may contain nickel, the second layer (302) may contain copper, and the third layer (303) may contain nickel.

[0070] Additionally, the clad metal included in the first protective layer (30) may be phosphor bronze-Cu-phosphor bronze. In other words, the first layer (301) may contain phosphor bronze, the second layer (302) may contain copper, and the third layer (303) may contain phosphor bronze.

[0071] The curved surface area is examined in more detail below with reference to FIG. 5. FIG. 5 is a cross-sectional view taken by cutting along the V-V' line of FIG. 1. FIG. 5 illustrates a portion of a laminated display panel (20), a first adhesive layer (40), a second protective layer (50), a second adhesive layer (60), and a first protective layer (30) at the corner portion of an electronic device.

[0072] In the curved area (BA), the second protective layer (50) can cover the display panel (20), the first adhesive layer (40), the second adhesive layer (60), and the first protective layer (30). The second protective layer (50) can be formed in an area larger than the display panel (20), the first adhesive layer (40), the second adhesive layer (60), and the first protective layer (30).

[0073] In the curved area (BA), the second protective layer (50) may be bent by a protective layer bending angle (50A). By having a protective layer bending angle (50A) of sufficient size, the display panel (20) can be easily protected. For example, the protective layer bending angle (50A) may be 80° to 90°.

[0074] The display panel (20) may be located on the back surface of the second protective layer (50). The display panel (20) may include a flat area (PA) and a curved area (BA). The display panel (20) may be bent toward a third direction (D3) in the curved area (BA). In the curved area (BA), the display panel (20) may have a display panel bending angle (20A). The protective layer bending angle (50A) may be greater than the display panel bending angle (20A). The display panel bending angle may be 45° to 85°.

[0075] The display panel depth (PD) may be the third direction (D3) length of the display panel (20) in the curved area (BA). The display panel depth (PD) may be a value obtained by measuring the third direction (D3) length of the display panel (20) located in the curved area (BA) relative to the display panel (20) located in the flat area (PA).

[0076] The bezel of the electronic device can be minimized by making the display panel depth (PD) at the corner portion of the electronic device sufficiently large. This is because as the display panel depth (PD) increases, the length of the display panel (20) extending from the curved area (BA) can increase. Conversely, as the display panel depth (PD) decreases, the length of the display panel (20) extending from the curved area (BA) decreases, so the bezel can increase. In order to make the display panel depth (PD) sufficiently large, the display panel bending angle (20A) also needs to be increased.

[0077] However, if the display panel bending angle (20A) increases, defects may occur in the display device. This may be because each layer of the display device has a difference in curvature in the corner portion including the curved area (BA). As the display panel bending angle (20A) increases, buckling may occur in the stress portion (20S) of the display panel (20). Buckling of the display panel (20) may be a phenomenon in which the display panel (20) is abnormally deformed by external pressure or load. In the corner portion of the electronic device, the display panel (20) may be laminated while being compressed inside the second protective layer (50). At this time, if a load exceeding the critical load is applied, partial tension or shrinkage may occur in the display panel (20). The part where shrinkage is concentrated can be called the stress portion (20S) of the display panel (20). The stress portion (20S) of the display panel (20) may be located at the end portion of the display panel (20). If buckling occurs in the display panel (20), the structural stability of the display device may be compromised. Additionally, the function and quality of the display panel (20) may be degraded, or the display panel (20) may be damaged.

[0078] To prevent buckling of the display panel (20) that may occur as the bending angle (20A) of the display panel is increased to minimize the bezel, a non-conductive film may be included in the first adhesive layer (40). The first adhesive layer (40) including the non-conductive film may be located between the display panel (20) and the first protective layer (30). The first adhesive layer (40) including the non-conductive film may support the display panel (20) by being located on the back surface of the display panel (20).

[0079] The first adhesive layer (40) including a non-conductive film can provide high adhesive strength and high modulus.

[0080] Non-conductive films can achieve a higher modulus through a specific curing process while maintaining structural strength. For example, it may be difficult to obtain a high modulus in pressure-sensitive adhesives because they are often inherently flexible, adhesive, and highly elastic. However, for example, non-conductive films containing epoxy can be controlled into a stronger and harder material by including more curing agents or fillers. Therefore, it may be easier to manufacture non-conductive films to have a relatively higher modulus compared to pressure-sensitive adhesives. For example, the modulus of the first adhesive layer (40) containing the non-conductive film may be 20 MPa or higher. Since a higher modulus provides greater resistance to deformation due to external forces, reliability regarding shape deformation can be improved.

[0081] In addition, the non-conductive film can be easily manufactured to have a relatively high adhesive strength compared to the pressure-sensitive adhesive. For example, the non-conductive film can be manufactured to have an adhesive strength about 5 times higher than that of the pressure-sensitive adhesive. For example, the adhesive strength of the first adhesive layer (40) can be 2800 gf / in or higher. The higher the adhesive strength, the better the interfacial delamination can be prevented.

[0082] By positioning a first adhesive layer (40) containing a non-conductive film on the back surface of a display panel (20), buckling that may occur in the display device (11) can be prevented. Since the first adhesive layer (40) containing a non-conductive film structurally and stably supports the display panel (20), buckling may not occur in the display panel (20) even if shrinkage is concentrated in the stress portion (20S) of the display panel (20). In addition, since the first adhesive layer (40) containing a non-conductive film is strongly bonded to the display panel (20), delamination between the display panel (20) and the first adhesive layer (40) can be prevented, and the display panel (20) can be continuously and stably supported.

[0083] A display device comprising a display panel (20), a first protective layer (30), a first adhesive layer (40), a second protective layer (50), and a second adhesive layer (60) can be laminated in a flat shape. Immediately after the lamination is completed, the display device has a flat shape and may not include a curved area.

[0084] A curing and forming device may be used to form a curved area. The curing and forming device may compress the display device by pressing it from above and below. The curing and forming device may apply heat to the display device to cure the first adhesive layer. Additionally, the curing and forming device may form the sides and corners of the display device so that they are curved. In other words, the curing and forming device may form a curved area (BA) on the display device.

[0085] A curved area (BA) of the display device can be formed to reduce the bezel range of the electronic device. A curing and forming device can form the curved area (BA) of the display device while compressing the display device.

[0086] The first adhesive layer (40) containing a non-conductive film can be cured by receiving heat from a curing and molding device. In other words, the first adhesive layer (40) containing a non-conductive film can have its modulus increased by receiving heat from a curing and molding device. The first adhesive layer (40) with increased modulus can prevent buckling occurring in the display panel (20). The curing and molding of the display device can be performed simultaneously.

[0087] The first adhesive layer (40) including a non-conductive film can compensate for refraction and distortion that may occur due to light entering from the outside. This is explained with reference to FIGS. 6 and FIGS. 7. FIGS. 6 and FIGS. 7 are drawings for explaining the refraction and distortion of light according to surface wavyness.

[0088] FIG. 6 illustrates a display device in which a display panel (20') is positioned on the front of a first adhesive layer (40') having relatively poor surface waviness according to a comparative example. For example, the first adhesive layer (40') may include a pressure-sensitive adhesive. FIG. 7 illustrates a display device in which a display panel (20) is positioned on the front of a first adhesive layer (40) having relatively excellent surface waviness according to an embodiment. For example, the first adhesive layer (40) may include a non-conductive film.

[0089] The first adhesive layer (40') according to the comparative example of FIG. 6 may have a relatively low modulus. If the modulus is low, deformation may occur easily due to external forces. This can be expressed as having a high surface waviness value. Additionally, it can be expressed as having poor surface waviness. The bending that occurs in the first adhesive layer (40') may cause bending in the display panel (20'). This is because the display panel (20') is supported by the first adhesive layer (40'). Due to the bending of the first adhesive layer (40') and the display panel (20'), distortion may occur depending on the position of the display panel (20') where external light (LP) is incident.

[0090] FIG. 6 illustrates a first adhesive layer (40') in which bending deformation occurs due to a low modulus. Due to the bending of the first adhesive layer (40'), bending may also occur in the display panel (20'). The bending may occur in a third direction (D3). External light (LP) incident on area A may be reflected from the first adhesive layer (40') and the display panel (20'), respectively, resulting in an A1 light path difference (LPA1). External light (LP) incident on area B may be reflected from the first adhesive layer (40') and the display panel (20'), respectively, resulting in a B1 light path difference (LPB1). Different light path differences may occur in areas A and B due to the bent shape of the display panel (20') and the first adhesive layer (40'). That is, since different light path differences occur depending on the position of the display panel (20'), a distorted image may be displayed in the electronic device.

[0091] FIG. 7 illustrates a first adhesive layer (40) in which no bending deformation occurs due to a high modulus according to an embodiment. Since no bending occurs in the first adhesive layer (40), no bending may occur in the display panel (20). External light (LP) incident on area A may be reflected from the first adhesive layer (40) and the display panel (20), respectively, resulting in an A2 light path difference (LPA2). External light (LP) incident on area B may be reflected from the first adhesive layer (40) and the display panel (20), respectively, resulting in a B2 light path difference (LPB2). Since no bending occurs in the display panel (20) and the first adhesive layer (40) in areas A and B, the same light path difference may occur. That is, since the same light path difference occurs depending on the position of the display panel (20), image distortion in the electronic device can be prevented.

[0092] Below, we will examine the pixels included in the display panel with reference to FIGS. 8 and FIGS. 9. FIGS. 8 is an equivalent circuit diagram of a single pixel circuit included in the display panel. FIGS. 9 is a cross-sectional view illustrating a part of the display panel provided in an electronic device.

[0093] Referring to FIG. 8, the pixel circuit (PC) may include a driving transistor (T1), a switching transistor (T2), and a storage capacitor (Cst). Additionally, the pixel circuit (PC) may be electrically connected to an organic light-emitting diode (OLED).

[0094] The switching transistor (T2) can be connected to the data line (DL) and the scan line (SL). The switching transistor (T2) can transmit a data signal or data voltage input from the data line (DL) to the driving transistor (T1) based on a scan signal or switching voltage input from the scan line (SL).

[0095] The storage capacitor (Cst) is connected to the switching transistor (T2) and the driving voltage line (PL), and can store a voltage corresponding to the difference between the voltage received from the switching transistor (T2) and the first power supply voltage (ELVDD) supplied to the driving voltage line (PL).

[0096] The driving transistor (T1) is connected to the driving voltage line (PL) and the storage capacitor (Cst), and can control the driving current flowing from the driving voltage line (PL) to the organic light-emitting diode (OLED) in correspondence with the voltage value stored in the storage capacitor (Cst). The counter electrode (e.g., cathode) of the organic light-emitting diode (OLED) can be supplied with a second power supply voltage (ELVSS). The organic light-emitting diode (OLED) can emit light having a predetermined brightness by the driving current.

[0097] In FIG. 8, a case in which the pixel circuit (PC) includes two transistors and one storage capacitor has been described, but the present disclosure is not limited thereto. For example, the pixel circuit (PC) may include three or more transistors. In addition, it may include two or more storage capacitors. As an example, the pixel circuit (PC) may include seven transistors and one storage capacitor. The number of transistors and storage capacitors may vary depending on the design of the pixel circuit (PC).

[0098] In the foregoing, it has been described that the electronic device includes an organic light-emitting diode as a light-emitting element, but the electronic device is not limited thereto. As another example, the electronic device may be a light-emitting display device including an inorganic light-emitting diode, i.e., an inorganic light-emitting display. As yet another example, the electronic device may be a quantum dot light-emitting display.

[0099] Referring to FIG. 9, the display panel (20) may include a substrate (100), a pixel circuit layer (PCL), a display layer (DISL), a thin film encapsulation layer (TFE), and a touch sensing layer (TSL).

[0100] The substrate (100) may have a multilayer structure including a base layer containing a polymer resin and an inorganic layer. For example, the substrate (100) may include a barrier layer of an inorganic insulating layer and a base layer containing a polymer resin. For example, the substrate (100) may include a first base layer (101), a first barrier layer (102), a second base layer (103), and a second barrier layer (104) that are sequentially stacked. The first base layer (101) and the second base layer (103) may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), or / and cellulose acetate propionate (CAP), etc. The first barrier layer (102) and the second barrier layer (104) may include inorganic insulating materials such as silicon oxide, silicon oxynitride, and / or silicon nitride. Such a substrate (100) may have flexible properties.

[0101] A pixel circuit layer (PCL) may be disposed on the substrate (100). The pixel circuit layer (PCL) may include a pixel circuit (PC) comprising a transistor (TFT) and a storage capacitor (Cst). Additionally, the pixel circuit layer (PCL) may include a buffer layer (111), a first gate insulating layer (112), a second gate insulating layer (113), an interlayer insulating layer (114), a first insulating layer (115), and a second insulating layer (116) disposed below or / and above the components of the pixel circuit (PC).

[0102] The buffer layer (111) can reduce or block the penetration of foreign matter, moisture, or outside air from the bottom of the substrate (100) and can provide a flat surface on the substrate (100). The buffer layer (111) may include an inorganic insulating material such as silicon oxide, silicon oxynitride, or / and silicon nitride, and may be formed as a single layer or a multilayer structure including the aforementioned material.

[0103] A transistor (TFT) on a buffer layer (111) includes a semiconductor layer (Act), and the semiconductor layer (Act) may include polysilicon. Alternatively, the semiconductor layer (Act) may include amorphous silicon, an oxide semiconductor, an organic semiconductor, etc. The semiconductor layer (Act) may include a channel region (C) and a drain region (D) and a source region (S) respectively disposed on both sides of the channel region (C). A gate electrode (GE) may overlap with the channel region (C).

[0104] The gate electrode (GE) may include a low-resistance metal material. The gate electrode (GE) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer including the above materials.

[0105] The first gate insulating layer (112) between the semiconductor layer (Act) and the gate electrode (GE) is silicon oxide (SiO2) or silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO x It may include inorganic insulating materials such as ). In this case, zinc oxide (ZnO x ) may be zinc oxide (ZnO), and / or zinc peroxide (ZnO2).

[0106] A second gate insulating layer (113) may be provided to cover the gate electrode (GE). Similar to the first gate insulating layer (112), the second gate insulating layer (113) may be silicon oxide (SiO2) or silicon nitride (SiN2). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO x It may include inorganic insulating materials such as ). In this case, zinc oxide (ZnO x ) may be zinc oxide (ZnO), and / or zinc peroxide (ZnO2).

[0107] An upper electrode (Cst2) of a storage capacitor (Cst) may be disposed on the upper portion of the second gate insulating layer (113). The upper electrode (Cst2) may overlap with the gate electrode (GE) below it. At this time, the gate electrode (GE) and the upper electrode (Cst2) that overlap with the second gate insulating layer (113) in between can form a storage capacitor (Cst). That is, the gate electrode (GE) can function as the lower electrode (Cst1) of the storage capacitor (Cst).

[0108] In this way, the storage capacitor (Cst) and the transistor (TFT) can be formed in overlap. In some examples, the storage capacitor (Cst) may be formed so as not to overlap with the transistor (TFT).

[0109] The upper electrode (Cst2) may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may be a single layer or a multilayer of the aforementioned materials.

[0110] The interlayer insulating layer (114) can cover the upper electrode (Cst2). The interlayer insulating layer (114) is silicon oxide (SiO2) or silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO x It may include ) etc. In this case, zinc oxide (ZnO x ) may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2). The interlayer insulating layer (114) may be a single layer or a multilayer comprising the aforementioned inorganic insulating material.

[0111] The drain electrode (DE) and the source electrode (SE) may each be located on the interlayer insulating layer (114). The drain electrode (DE) and the source electrode (SE) may each be connected to the drain region (D) and the source region (S) through contact holes in the insulating layers below them. The drain electrode (DE) and the source electrode (SE) may include a highly conductive material. The drain electrode (DE) and the source electrode (SE) may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu) and / or titanium (Ti), and may be formed as a multilayer or single layer including the above materials. As an example, the drain electrode (DE) and the source electrode (SE) may have a multilayer structure of Ti / Al / Ti.

[0112] The first insulating layer (115) may cover the drain electrode (DE) and the source electrode (SE). The first insulating layer (115) may include an organic insulating material such as a general-purpose polymer like polymethylmethacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, or / and blends thereof.

[0113] A second insulating layer (116) may be disposed on the first insulating layer (115) and the contact metal (CM). The second insulating layer (116) may include the same material as the first insulating layer (115) and may include organic insulating materials such as general-purpose polymers like polymethylmethacrylate (PMMA) or polystyrene (PS), polymer derivatives having a phenolic group, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, or / and blends thereof.

[0114] A display layer (DISL) may be disposed on a pixel circuit layer (PCL) of the structure described above. The display layer (DISL) may include a light-emitting element (200) and a pixel defining film (120). The light-emitting element (200) may include, for example, an organic light-emitting diode (OLED), and the organic light-emitting diode (OLED) may include a stacked structure of a first electrode (210), an intermediate layer (220), and a counter electrode (230). The organic light-emitting diode (OLED) may emit, for example, red, green, or blue light, or emit red, green, blue, or white light. The organic light-emitting diode (OLED) emits light through a light-emitting region, and the light-emitting region may be defined as a light-emitting pixel (PX).

[0115] The first electrode (210) may be disposed on the second insulating layer (116). The first electrode (210) is connected to a contact metal (CM) disposed on the first insulating layer (115) through a contact hole formed in the second insulating layer (116) and the first insulating layer (115), and may be electrically connected to a transistor (TFT) through the contact metal (CM). Although the present specification illustrates an example in which the transistor (TFT) and the first electrode (210) are connected through the contact metal (CM), it is not limited thereto, and the contact metal (CM) and the second insulating layer (116) may be omitted, and the first electrode (210) may be directly connected to one electrode of the transistor (TFT).

[0116] The first electrode (210) may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). As another example, the first electrode (210) may include a reflective film comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compound thereof. As another example, the first electrode (210) may further include a film formed of ITO, IZO, ZnO, or / and In2O3 above / below the aforementioned reflective film.

[0117] A pixel defining film (120) having an opening (120OP) that exposes the central portion of the first electrode (210) is disposed on the first electrode (210). The pixel defining film (120) may include an organic insulating material and / or an inorganic insulating material. The opening (120OP) may define a light-emitting region of light emitted from the light-emitting element (200). For example, the size / width of the opening (120OP) may correspond to the size / width of the light-emitting region. Accordingly, the size and / or width of the light-emitting pixel (PX) may depend on the size and / or width of the opening (120OP) of the corresponding pixel defining film (120).

[0118] The intermediate layer (220) may include a light-emitting layer (222) formed to correspond to the first electrode (210). The light-emitting layer (222) may include a polymer or low-molecular-weight organic material that emits light of a predetermined color. Alternatively, the light-emitting layer (222) may include an inorganic light-emitting material or quantum dots.

[0119] A first functional layer (221) and a second functional layer (223) may be disposed respectively below and above the light-emitting layer (222). The first functional layer (221) may, for example, include a hole transport layer (HTL) or include a hole transport layer and a hole injection layer (HIL). The second functional layer (223) is a component disposed on the light-emitting layer (222) and may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The first functional layer (221) and / or the second functional layer (223) may be a common layer formed to cover the entire substrate (100), similar to the opposing electrode (230) to be described later.

[0120] The counter electrode (230) is disposed on the first electrode (210) and may overlap with the first electrode (210). The counter electrode (230) may be made of a conductive material with a low work function. For example, the counter electrode (230) may include a transparent layer or a translucent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca) or / and alloys thereof. Alternatively, the counter electrode (230) may further include a layer such as ITO, IZO, ZnO or / and In2O3 on the transparent layer or translucent layer comprising the aforementioned materials. The counter electrode (230) may be integrally formed to cover the substrate (100) entirely.

[0121] The display panel (20) includes a plurality of light-emitting elements (200), and the plurality of light-emitting elements (200) can provide an image by emitting light through light-emitting pixels (PX).

[0122] A thin film encapsulation layer (TFE) is disposed on the opposing electrode (230) of a light-emitting element (200) and can cover the light-emitting elements (200) of a display layer (DISL). The thin film encapsulation layer (TFE) may include at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0123] The first inorganic encapsulation layer (310) and the second inorganic encapsulation layer (330) may include one or more inorganic materials selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer (320) may include a polymer-based material. Polymer-based materials may include acrylic resin, epoxy resin or / and polyimide and polyethylene. As an example, the organic encapsulation layer (320) may include acrylate. The organic encapsulation layer (320) may be formed by curing a monomer or by applying a polymer. The organic encapsulation layer (320) may be transparent.

[0124] A touch sensing layer (TSL) may be disposed on the thin film encapsulation layer (TFE). As an example, as shown in FIG. 9, the touch sensing layer (TSL) may be formed directly on the thin film encapsulation layer (TFE), in which case the adhesive layer may not be interposed between the touch sensing layer (TSL) and the thin film encapsulation layer (TFE).

[0125] The touch sensing layer (TSL) can acquire coordinate information based on external input, such as a touch event. The touch sensing layer (TSL) may include, for example, a sensing electrode and signal lines connected to the sensing electrode. The touch sensing layer (TSL) can detect external input using a mutual capping method or a self capping method.

[0126] FIG. 10 is a drawing illustrating a stacked structure of a display device of an electronic device according to one embodiment. Descriptions of components identical to the components described above will be omitted.

[0127] The display device (11) may include a third adhesive layer (80) comprising a non-conductive film. The third adhesive layer (80) may be located between the first protective layer (30) and the support plate (70).

[0128] The first adhesive layer (40) may include at least one of an optically transparent adhesive, an optically transparent resin or a pressure-sensitive adhesive, a heat-reactive adhesive or a double-sided tape.

[0129] The third adhesive layer (80) can prevent buckling of the display panel (20) by including a non-conductive film. That is, by including a non-conductive film in the third adhesive layer (80), buckling of the display panel (20) can be prevented even when the first adhesive layer (40) does not include a non-conductive film. The third adhesive layer (80) is not in direct contact with the display panel (20). However, the high modulus and adhesive strength of the third adhesive layer (80) can prevent buckling of the display panel (20). For example, this may be because using a non-conductive film with a higher modulus and higher adhesive strength than using a pressure-sensitive adhesive in the third adhesive layer (80) can improve the overall rigidity of the display device (11) and maintain excellent surface waviness. The adhesive strength of the third adhesive layer (80) may be greater than the adhesive strength of the second adhesive layer (60).

[0130] It is also possible to use a first adhesive layer (40) containing a non-conductive film and a third adhesive layer (80) containing a non-conductive film at the same time.

[0131] The third adhesive layer (80) may be in direct contact with the first protective layer (30). The first protective layer (30) may include a polymer material, a metal, or glass. By including a metal or glass in the first protective layer (30), the overall modulus of the display device included in the electronic device according to one embodiment may be improved, which may be advantageous in preventing buckling that may occur at the corner portion of the display panel (20).

[0132] Figure 11 is simulation data illustrating the difference in interfacial pressure according to the material of the adhesive layer.

[0133] Figure 11 shows the interfacial pressure difference between the first adhesive layer and the display panel. The interfacial pressure difference may refer to the difference in pressure occurring at the interface where the two layers meet. The interfacial pressure difference affects structural strength and stability and may be related to defects at the interface or the bonding of the layers. The smaller the interfacial pressure difference between the first adhesive layer and the display panel, the more advantageous it is to prevent delamination between the first adhesive layer and the display panel. In this simulation, the case where the interfacial pressure difference between the first adhesive layer and the display panel is 0.354 MPa or less is defined as the acceptance criterion.

[0134] When the adhesive strength of the pressure-sensitive adhesive (PSA) at 25°C is 500 gf / in and the modulus is 0.08 MPa, the difference in interfacial pressure between the first adhesive layer and the display panel is calculated to be 1.090 MPa. This does not satisfy the acceptance criteria of this simulation.

[0135] When the adhesive strength of the pressure-sensitive adhesive at 25°C is 500 gf / in and the modulus is 0.2 MPa, the difference in interfacial pressure between the first adhesive layer and the display panel is calculated to be 0.863 MPa. This does not satisfy the acceptance criteria of this simulation.

[0136] When the adhesive strength of the non-conductive film (NCF) at 25°C is 2800 gf / in and the modulus is 0.3 MPa, the difference in interfacial pressure between the first adhesive layer and the display panel is calculated to be 0.774 MPa. This does not satisfy the acceptance criteria of this simulation.

[0137] When the adhesive strength of the non-conductive film at 25°C is 2800 gf / in and the modulus is 5 MPa, the difference in interfacial pressure between the first adhesive layer and the display panel is calculated to be 0.723 MPa. This does not satisfy the acceptance criteria of this simulation.

[0138] When the adhesive strength of the non-conductive film at 25°C is 2800 gf / in and the modulus is 10 MPa, the difference in interfacial pressure between the first adhesive layer and the display panel is calculated to be 0.544 MPa. This does not satisfy the acceptance criteria of this simulation.

[0139] When the adhesive strength of the non-conductive film at 25°C is 2800 gf / in and the modulus is 20 MPa, the difference in interfacial pressure between the first adhesive layer and the display panel is calculated to be 0.329 MPa. This satisfies the acceptance criteria of the present simulation.

[0140] In conclusion, a satisfactory interfacial pressure difference can be obtained when the adhesive strength is 2800 gf / in or higher and the modulus is 20 MPa or higher. In addition, it may be advantageous to use a non-conductive film to obtain the required adhesive strength and modulus of the first adhesive layer.

[0141] FIG. 12 is a block diagram of an electronic device according to one embodiment.

[0142] Referring to FIG. 12, an electronic device (10) according to one embodiment may include a display device (11), a power supply module (PM), a first electronic module (EM1), and a second electronic module (EM2). The display device (11), the power supply module (PM), the first electronic module (EM1), and the second electronic module (EM2) may be electrically connected to each other.

[0143] The display device (11) may include a light-emitting pixel (PX) and a touch sensor (TS). The display device (11) may be visible to the user from the outside by including a light-emitting pixel (PX), which is a unit for displaying an image. The touch sensor (TS) may overlap with the display panel and detect external input.

[0144] The power supply module (PM) can supply power necessary for the overall operation of the electronic device (10). The power supply module (PM) may include a battery module.

[0145] The first electronic module (EM1) and the second electronic module (EM2) may include various functional modules for operating the electronic device (10). The first electronic module (EM1) may be directly mounted on a motherboard electrically connected to the display device (11) or mounted on a separate board and electrically connected to the motherboard through a connector, etc.

[0146] The first electronic module (EM1) may include a control module (CTM), a wireless communication module (TM), an image input module (IIM), an audio input module (AIM), a memory (MM), and an external interface (IF). Some of the modules may not be mounted on the motherboard but may be electrically connected to the motherboard through a flexible printed circuit board connected thereto.

[0147] The control module (CTM) can control the overall operation of the electronic device (10). The control module (CTM) may be a microprocessor. For example, the control module (CTM) enables or disables the display device (11). The control module (CTM) can control other modules, such as an image input module (IIM) or an audio input module (AIM), based on a touch signal received from the display device (11).

[0148] The wireless communication module (TM) can transmit and receive wireless signals with another terminal using a Bluetooth or Wi-Fi line. The wireless communication module (TM) can transmit and receive voice signals using a general communication line. The wireless communication module (TM) includes a transmitter (TM1) that modulates and transmits a signal to be transmitted, and a receiver (TM2) that demodulates a received signal.

[0149] The video input module (IIM) can process a video signal and convert it into video data that can be displayed on a display device (11). The audio input module (AIM) can receive an external audio signal via a microphone in a recording mode, voice recognition mode, etc., and convert it into electrical audio data.

[0150] The external interface (IF) can serve as an interface connected to an external charger, wired / wireless data port, card socket (e.g., memory card, SIM / UIM card), etc.

[0151] The second electronic module (EM2) may include an acoustic output module (AOM), a light-emitting module (LM), a light-receiving module (LRM), and a camera module (CMM), and at least some of these may be located on the back of the display device (11) as optical elements. The optical elements may include a light-emitting module (LM), a light-receiving module (LRM), and a camera module (CMM). Additionally, the second electronic module (EM2) may be mounted directly on the motherboard or mounted on a separate substrate and electrically connected to the display device (11) or electrically connected to the first electronic module (EM1) through a connector (not shown).

[0152] The acoustic output module (AOM) can convert acoustic data received from the wireless communication module (TM) or acoustic data stored in memory (MM) and output it externally.

[0153] The light-emitting module (LM) can generate and output light. The light-emitting module (LM) can output infrared light. For example, the light-emitting module (LM) may include an LED element. For example, the light-receiving module (LRM) can detect infrared light. The light-receiving module (LRM) may be activated when infrared light above a predetermined level is detected. The light-receiving module (LRM) may include a CMOS sensor. After the infrared light generated by the light-emitting module (LM) is output, it may be reflected by an external subject (e.g., a user's finger or face), and the reflected infrared light may be incident on the light-receiving module (LRM). The camera module (CMM) may capture an external image.

[0154] An electronic device according to one embodiment can minimize electrical interference to a display panel by including a non-conductive film in a first adhesive layer located between a display panel and a first protective layer. Additionally, including a non-conductive film in the first adhesive layer allows for a wide range of control over the adhesive strength and modulus of the first adhesive layer. This can be advantageous in preventing buckling that may occur at the corners of the display panel.

[0155] Although embodiments of the present disclosure have been described in detail above, the scope of the present disclosure is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concepts of the present disclosure as defined in the following claims also fall within the scope of the present disclosure. Explanation of the symbols

[0156] 10: Electronic devices 11: Display device 20: Display panel 20A: Display panel bending angle 20S: Stress Department 30: 1st Protection Layer 40: First adhesive layer 50: Second protective layer 50A: Protective layer bending angle 60: Second adhesive layer 70: Support plate 80: Third adhesive layer PA: Planar area BA: Surface area CA: Corner section PD: Display panel depth PX: Light-emitting pixel

Claims

Claim 1 An electronic device comprising a display panel including a light-emitting pixel, a first protective layer located on the back surface of the display panel, and a first adhesive layer located between the display panel and the first protective layer, wherein the first adhesive layer comprises a non-conductive film (NCF). Claim 2 An electronic device according to claim 1, wherein the modulus of the first adhesive layer is 20 MPa or more. Claim 3 An electronic device according to paragraph 2, wherein the adhesive strength of the first adhesive layer is 2800 gf / in or more. Claim 4 An electronic device according to claim 1, wherein the first protective layer comprises metal or glass. Claim 5 An electronic device according to claim 1, wherein the first protective layer is in direct contact with the first adhesive layer. Claim 6 An electronic device according to claim 1, further comprising a second protective layer located on the front surface facing the back surface of the display panel. Claim 7 An electronic device according to claim 6, further comprising a second adhesive layer located between the display panel and the second protective layer. Claim 8 An electronic device according to claim 7, wherein the adhesive strength of the first adhesive layer is greater than the adhesive strength of the second adhesive layer. Claim 9 An electronic device according to claim 1, wherein the display panel includes a flat area and a curved area bent at a corner, and the display panel bending angle at which the display panel is bent in the curved area is 45° to 85°. Claim 10 An electronic device according to claim 1, wherein the non-conductive film comprises epoxy, polyacrylate, or urethane. Claim 11 An electronic device according to claim 1, further comprising a support plate located on the back surface of the first protective layer. Claim 12 An electronic device comprising a display panel including a light-emitting pixel, a first protective layer located on the back surface of the display panel, a support plate located on the back surface of the first protective layer, and a third adhesive layer located between the first protective layer and the support plate, wherein the third adhesive layer comprises a non-conductive film (NCF). Claim 13 An electronic device according to claim 12, wherein the modulus of the third adhesive layer is 20 MPa or more. Claim 14 An electronic device according to claim 13, wherein the adhesive strength of the third adhesive layer is 2800 gf / in or more. Claim 15 In paragraph 12, the electronic device, wherein the first protective layer comprises metal or glass. Claim 16 In paragraph 12, the electronic device, wherein the first protective layer is in direct contact with the third adhesive layer. Claim 17 An electronic device comprising, in paragraph 12, a second protective layer located on the front surface facing the back surface of the display panel. Claim 18 An electronic device according to claim 15, further comprising a second adhesive layer located between the display panel and the second protective layer. Claim 19 In paragraph 16, an electronic device in which the adhesive strength of the third adhesive layer is greater than the adhesive strength of the second adhesive layer. Claim 20 An electronic device according to claim 12, wherein the display panel comprises a flat area and a curved area bent at the corner, and the display panel bending angle at which the display panel is bent in the curved area is 45° to 85°.

Images