System including at least two different types of flexures

Abstract

The system may be equipped with different types of flexures. In a non-limiting embodiment, one of the flexures may be a guiding flexure and the other may be a decoupling flexure. The guiding flexure may allow translational movement of the moving body in a desired direction. The decoupling flexure may help reduce movement in an unwanted direction and rotational movement. In the same or different embodiments, the actuator system may be equipped with an actuator coupled to the flexures. The actuator system may be embedded as a subassembly of a larger system. In one embodiment, the larger system may be a die bonding system. Using a die bonding system may allow the position of the movable platform to position the die more precisely relative to the die bonding site of the bonding substrate.

Description

Technology Field

[0001] The present disclosure relates to a system having at least two different types of flexures. Background Technology

[0002] Axial actuators are designed to perform linear motion, supply force along a single axis, or perform both. Lateral motion in the actuator can degrade the actuator's performance and, consequently, reduce bandwidth, force output, linearity, and stability. Bandwidth refers to the response speed of the axial actuator for the required change in the desired motion and the force supplied by the actuator, or for both the change in the desired motion and the force supplied by the actuator. A low bandwidth results in lower equipment throughput. The force output of the axial actuator can be degraded by lateral motion or the force applied to the actuator, which alters the current-to-force relationship in the actuator's intended direction of motion, thereby affecting the linearity and repeatability of the bonding system's motion. Linearity refers to the ability of the axial actuator to move along its central axis. As linearity deteriorates, the end of the moving part may not remain within tolerances when extending from the actuator body. Furthermore, in closed-loop control, the stability and robustness of high-bandwidth multi-degree-of-freedom motion systems are influenced by the proper isolation of the axial actuator from the motion of the moving platform. There is a need for a system that allows movement in the linear drive direction, possessing characteristics of acceptable bandwidth, force output, linearity, and stability.

[0003] In a first aspect, the die bonding system may comprise a first frame; a first movable platform configured to hold a first die chuck; and a first actuator for moving the first movable platform relative to the first frame. The first actuator may comprise a first fixed part attached to the first frame and a first moving part configured to supply a first force in a first direction relative to the first fixed part. The die bonding system may further comprise a first flexure having a first degree of freedom in the first direction and connected to the first moving part of the first actuator and the first frame, and a second flexure having a plurality of degrees of freedom in a direction other than the first direction and connected to the first moving part of the first actuator and the first movable platform.

[0004] In one implementation, the first degree of freedom of the first flexure is a single degree of freedom of the first flexure, and the second flexure has five degrees of freedom.

[0005] In another implementation, the first flexure comprises a parallelogram, a double parallelogram, or multiple parallelograms, and the second flexure is a wire flexure.

[0006] In a specific implementation, the first flexure comprises one double parallelogram and does not comprise the other double parallelogram.

[0007] In another specific embodiment, the wire flexer comprises an intermediate section, a first end section along a first end of the intermediate section, and a second end section along a second end opposite the first end of the intermediate section, wherein the diameter of the intermediate section is larger than the diameter of each of the first end section and the second end section.

[0008] In a further implementation, the first flexure comprises a base connected to the first frame, a first flexure moving part connected to the first moving part of the first actuator, an intermediate body, a first blade connecting the base to the intermediate body, and a second blade connecting the first flexure moving part to the intermediate body. The second flexure passes through the first blade and the second blade without contacting the first blade or the second blade of the first flexure.

[0009] In a specific implementation, the first blade is configured such that the second flexure passes through the center of the compliance of the first flexure.

[0010] In another specific implementation, the second flexer comprises a wire flexer having an intermediate portion, a first end section along a first end of the intermediate portion, and a second end section along a second end opposite to the first end of the intermediate portion. The diameter of the intermediate portion is greater than the diameter of each of the first end section and the second end section. The intermediate portion extends through the first blade and the second blade.

[0011] In another implementation, the second flexure is configured to be coupled between the first flexure and the first die chuck.

[0012] In another embodiment, the first actuator comprises a voice coil actuator, a piezoelectric actuator, a stepper motor, a servo motor, or a thermal expansion actuator.

[0013] In a further implementation, the first die bonding head comprises the first movable platform, the first actuator, the first flexure, and the second flexure, and the die bonding system further comprises a second die bonding head substantially identical to the first die bonding head.

[0014] In another embodiment, the die bonding system further comprises a second frame, a second movable platform configured to be spaced apart from the first movable platform and to hold a second die chuck, and a second actuator for moving the second movable platform relative to the second frame. The second actuator comprises a second fixed part attached to the second frame and a moving part configured to supply a second force in the first direction relative to the second fixed part. The die bonding system further comprises a third flexure having a double parallelogram, wherein the double parallelogram is a single double parallelogram of the third flexure, and the third flexure is connected to the moving part of the second actuator and the second frame, and a fourth flexure is connected to the third flexure and the second movable platform, wherein the fourth flexure is a wire flexure.

[0015] In a further implementation, the die bonding system further comprises a second frame, a second movable platform configured to be spaced apart from the first movable platform and to hold a second die chuck, and a second actuator for moving the second movable platform with respect to the second frame. The second actuator comprises a second fixed part attached to the second frame and a moving part configured to supply a second force in the first direction with respect to the second fixed part. The die bonding system further comprises a third flexure having a first blade and a second blade and connected to the moving part of the second actuator and the second frame, and a fourth flexure extending through the first blade and the second blade without contacting the first blade and the second blade of the third flexure and connected to the third flexure and the second movable platform.

[0016] In another aspect, the system may comprise a first flexure configured to be connected to a frame and having a double parallelogram which is a single double parallelogram of the first flexure; and a second flexure coupled to the first flexure and being a wire flexure.

[0017] In one embodiment, the system further comprises an actuator having a moving part coupled to the first flexure, and the second flexure is configured to be coupled to a moving body.

[0018] In a specific implementation, the second flexure is configured to be coupled between the first flexure and the movable body.

[0019] In another implementation, the first flexure is a guiding flexure, and the second flexure is a decoupling flexure.

[0020] In another aspect, the system may have a first flexure having a first blade, and a second flexure coupled to the first flexure and extending through the first blade without contacting the first blade.

[0021] In one embodiment, the first flexure has a plurality of blades having the first blade and the second blade, and the second flexure extends through the second blade without contacting the second blade.

[0022] In another implementation, the system further comprises an actuator having a moving part coupled to the first flexure, and the second flexure is configured to be coupled to a moving body.

[0023] In an additional aspect, a method for manufacturing a plurality of articles may include the step of bonding a die to a substrate using a die bonding system. The die bonding system may comprise a first frame; a first movable platform configured to hold a first die chuck; and a first actuator for moving the first movable platform relative to the first frame. The first actuator may comprise a first fixed part attached to the first frame; and a first moving part configured to supply a first force in a first direction relative to the first fixed part. The die bonding system may further comprise a first flexure having a first degree of freedom in the first direction and connected to the first moving part of the first actuator and the first frame; and a second flexure having a plurality of degrees of freedom in directions other than the first direction and connected to the first moving part of the first actuator and the first movable platform. The method may further include the step of processing the substrate to manufacture the plurality of articles. Brief explanation of the drawing

[0024] Implementations are illustrated by example and are not limited to the attached drawings. FIG. 1 has a conceptual diagram of an actuator system having different types of flexures. FIG. 2 provides a side view of a flexure having a parallelogram-based structure having a parallelogram that is not a double parallelogram. FIG. 3 provides a side view of the flexure of FIG. 2 when a force is applied in the Z-direction. FIG. 4 provides a side view of a flexure having a parallelogram-based structure having one double parallelogram. FIG. 5 provides a side view of the flexure of FIG. 4 when a force is applied in the Z-direction. FIG. 6 provides a side view of a flexure having a parallelogram-based structure having a plurality of double parallelograms. FIG. 7 provides a perspective view of a flexure having a parallelogram-based structure having one double parallelogram. FIG. 8 includes a bottom view of the flexure of FIG. 7. FIG. 9 includes a side view of the flexure of FIG. 7. FIG. 10 has a conceptual diagram of a wire flexer having a middle section having a larger diameter compared to the end sections along the opposite ends of the middle section. FIG. 11 has a perspective view of a wire flexer having a middle section, end sections and mounting plates. FIG. 12 includes a side view of the flexure of FIG. 11. FIG. 13 includes a bottom view of the flexure of FIG. 11. FIG. 14 has a perspective view of an actuator coupled to the wire flexures of FIG. 11 to 13. FIG. 15 has a perspective view of an actuator system comprising the actuator and wire flexer of FIG. 14 and the flexer of FIG. 7 to 9 coupled to the wire flexer. FIG. 16 provides a perspective view of the actuator system of FIG. 15, wherein the perspective view of FIG. 16 is a view from a different viewing angle compared to FIG. 15. FIG. 17 includes a perspective view of a lower frame member. FIG. 18a provides a perspective view of a part of a module having a lower frame member and further having a movable platform, a die chuck holder, and a die chuck. FIG. 18b provides a perspective view of a part of the module of FIG. 18a seen from a different viewing angle. FIG. 19 has a part of the module of FIG. 18a and 18b having actuator systems coupled to the top surface of a movable platform. FIG. 20 has a part of the module of FIG. 19 having other actuator systems coupled to the tabs of a movable platform. FIG. 21 includes a perspective view of an internal frame member. FIG. 22 has a bottom view of the inner frame member of FIG. 21. FIG. 23 includes examples of a part of the module of FIG. 20 and an internal frame member of FIG. 21 and 22, wherein the internal frame member is coupled to components within the part of the module. FIG. 24 includes a perspective view of an upper frame member and position sensors. FIG. 25 has a perspective view of the module having a part of the module of FIG. 23 and the upper frame member and position sensors of FIG. 24. FIG. 26 has a conceptual diagram of a die bonding system that can be used to bond dies to die bonding portions of a bonding substrate, wherein the die bonding system comprises the module of FIG. 25. FIG. 27 has a process flowchart of a method for bonding dies to bonding portions of a bonding substrate using the die bonding system of FIG. 26. FIG. 28 includes a process flowchart for a more detailed part of the method of FIG. 27. FIG. 29 provides an example of a side view of a die bonding system of FIG. 26, further comprising a set of dies bonded to an array of bonding heads and a bonding substrate bonded to a bonding substrate chuck, wherein the set of dies is positioned on registration hardware. FIG. 30 provides an example of a die chuck before a specific die among the set of dies of FIG. 29 is bent, and a cross-sectional view of the specific die. FIG. 31 includes an example of a die bonding system, a set of dies, and a side view of the bonding substrate of FIG. 29 after moving a set of dies over corresponding die bonding sites of the bonding substrate. FIG. 32 provides an example of a die chuck and a cross-sectional view of the specific die during the time the specific die of FIG. 31 is bent. FIG. 33 provides an example of a cross-sectional view of a die chuck, a specific die, and a bonding substrate when the specific die of FIG. 32 initially contacts the die bonding portion of the bonding substrate. FIG. 34 provides an example of a cross-sectional view of the die chuck, a specific die, and a bonding substrate of FIG. 33 when a specific die is bonded to a die bonding portion of a bonding substrate. FIG. 35 provides an example of a side view of a die bonding system, a set of dies, and a bonding substrate after the die chucks of the bonding head array are no longer bonded to a set of dies. Those skilled in the art will understand that the elements of the drawings are depicted for simplification and clarification and are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be exaggerated compared to others to aid in understanding the embodiment of the concept of the present invention. Specific details for implementing the invention

[0025] The following description, combined with the drawings, is provided to aid in understanding the teachings disclosed herein. The following discussion will focus on specific implementations of the teachings. This focus is provided to aid in explaining the teachings and should not be construed as limiting the scope or applicability of the teachings.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as generally understood by those skilled in the art to which this invention pertains. Materials, methods, and examples are illustrative and not intended to be limiting. To the extent not described herein, many details regarding specific materials and processing practices are customary and can be found in textbooks and other sources in the relevant art.

[0027] The system may be equipped with different types of flexures. In a non-limiting implementation, one of the flexures may be a guiding flexure, and the other may be a decoupling flexure. The guiding flexure may allow translational motion of the moving body in a desired direction. An example of a guiding flexure may be a parallelogram-based flexure. The decoupling flexure may help reduce movement in unwanted directions and rotational movement. An example of a decoupling flexure may be a wire flexure. In a specific implementation, one of the flexures, e.g., a wire flexure, may pass through another flexure, e.g., a guiding flexure, to help reduce the space occupied by that flexure.

[0028] In identical or different implementations, the actuator system may have actuators coupled to the flexures. The actuator system may be embedded as a subassembly in a larger system. In one implementation, the larger system may be a module within the die bonding head of the die bonding system. A method of using the die bonding system may allow for the positioning of a movable platform so that the die can be positioned more precisely relative to the die bonding site of the bonding substrate when the die is bonded to the corresponding die bonding site.

[0029] The embodiments described below are exemplary and do not limit the scope of the concept of the invention. Some die chucks are described primarily for arrays of bonding heads and others for arrays of die transfer seats, but die chucks for arrays of bonding heads may be used for arrays of die transfer seats, and die chucks for arrays of die transfer seats may be used for arrays of bonding heads.

[0030] FIG. 1 provides a conceptual diagram of a system (100) that can be used in a linear drive application. In the illustrated implementation, the system (100) is an actuator system. The system (100) may have an actuator (120) which may be an axial actuator. The actuator (120) may be a voice coil actuator, a piezoelectric actuator, a stepper motor, a servo motor, or a thermal expansion actuator. The actuator (120) has a fixed part (122) coupled to a frame and a moving part (124) configured to supply force in a linear direction. In the implementation, the moving part (124) is configured to move in the Z-direction. In the following specification, the conceptual drawings represent the fixed part (e.g., the frame) in a standard manner as a single line connected by multiple hatching lines.

[0031] The system (100) may have one or more flexers. In FIG. 1, the system (100) has flexer 142 and flexer 144. Flexer 142 and flexer 144 have different numbers of degrees of freedom. In a specific implementation, flexer 142 may have 1 degree of freedom, and flexer 144 may have 5 degrees of freedom. In one implementation, flexer 142 may be a guiding flexer that allows movement in a desired direction, the Z-direction in FIG. 1. In the same or different implementations, flexer 144 may be a decoupling flexer that helps ensure movement and rotation in other directions do not exceed tolerances. The other directions may include the X-direction and the Y-direction, and the rotation may include rotation about the axes of the X-direction, the Y-direction, and the Z-direction. Such rotation is, for example, θ X , θ Y , and θ Z It can be expressed as.

[0032] The flexure 142 may be coupled to the actuator (120), more specifically to the moving part (124) of the actuator (120), and to the flexure 144. In one embodiment, the flexure 142 may have a base and a moving part. The base may be coupled to the same frame or a different frame compared to the actuator (120). The moving part of the flexure 142 may be connected to the flexure 144 and may also be connected to the moving part (124) of the actuator (120). In one embodiment, the flexure 142 may have a parallelogram base structure.

[0033] Flexer 144 may be a decoupling flexer. Flexer 144 may have a proximal end coupled to flexer 142 and a distal end coupled to a movable object (160). In an alternative embodiment, both the proximal end of flexer 144 and the movable end of flexer 142 are connected in parallel to the movable end (124) of the actuator. In another alternative embodiment, the proximal end of flexer 144 is connected to the movable end (124) of the actuator (120), and the movable end of flexer 142 is connected to the proximal end of flexer 144. In one implementation, the proximal end of the flexer 144 may be connected to the flexer 142, and the distal end of the flexer 144 may be connected to the movable body (160). The movable body (160) may or may not be part of the system (100).

[0034] As used herein, coupling may comprise a connection between two or more objects. However, not all couplings are connections. If the movement of the first object does not result in the same movement simultaneously in the other object, the two or more objects are coupled but not connected. The actuator (120) may be coupled to the moving body (160) via the flexures 142 and flexure 144. The actuator (120) may not be connected to the moving body (160) but may be coupled to each other. Thus, connections are a subset of couplings, and not all couplings are connections.

[0035] Regarding connection, if two or more objects maintain a fixed position relative to each other and do not move to a degree that can be detected relative to each other, those two or more objects are connected. The connection may or may not involve physical contact between the two objects. For example, regarding the case where there is no physical contact, the two objects may be spaced apart and not physically in contact because a washer or gasket is placed between the two objects. The two objects and the washer or gasket are part of the physical connection because they maintain a fixed position relative to each other. In other embodiments, the washer or gasket may not be present, and the two objects are in contact with each other. Thus, the connection between the two objects may or may not involve physical contact between the two objects.

[0036] FIG. 2 provides a side view of a flexure 242, which is an example of a flexure 142. The flexure 242 may have a parallelogram-based structure and may have a single parallelogram. A base (260) may be attached to the frame, and a moving part (268) may be attached to the proximal end of the flexure 144. The moving part (268) may be attached to the base (260) by blade(s) (262). The blade (262) may be attached to the end of the moving part (268) or near thereto. In FIG. 3, when a force F in the Z-direction is applied to the moving part (268), the moving part (268) moves a distance δ in the Z-direction. Z by that amount, distance δ in the X-direction X It moves by that amount, which is illustrated by the dotted line feature in Fig. 3.

[0037] FIG. 4 provides a side view of a flexure 442, which is an example of a flexure 142. The flexure 442 may have a parallelogram-based structure and may have a double parallelogram. A base (460) may be attached to the frame, and a moving part (468) may be attached to the proximal end of the flexure 144. The base (460) may be attached to an intermediate body (464) by a blade 462, and the moving part (468) may be attached to an intermediate body (464) by a blade 466. The blade 462 may be attached to the end of or near the intermediate body (464), and the blade 466 may be attached to the end of or near the moving part (468).

[0038] In FIG. 5, only a portion of the base (460) is shown. When a Z-direction force F is applied to the moving part (468), the moving part (468) moves δ in the Z-direction Z It moves by a certain amount. Blade 462 can be bent in one direction, and Blade 466 can be bent in another direction. Unlike the flexer 242 of FIG. 2, the moving part (468) of the flexer 442 may not have any measurable movement in the X-direction. The intermediate (464) can move in the Z-direction and the X-direction. The amount of movement may depend on the design of the blades (462 and 466) and the relative position of the base (460), the intermediate (464), and the moving part (468).

[0039] The flexure has a parallelogram-based structure and may have two or more double parallelograms. FIG. 6 has a flexure 642 having two double parallelograms. The base 660, blades 662, 666, and intermediate 664 are, respectively, similar to the base 460, blades 462, 466, and intermediate 464 of FIG. 4. The base 670, blade 672, blade 676, and intermediate 674 are, respectively, similar to the base 460, blades 462, 466, and intermediate 464 of FIG. 4. The moving part (668) is coupled to blades 666 and 676. Flexer 642 can provide greater stiffness than Flexer 442 when blades 462, 466, 662, 666, 672, and 676 are made of the same material and have the same thickness and geometry. Flexer 642 occupies more volume than Flexer 442. After reading this specification, a person skilled in the art will be able to determine a specific design for a guiding flexer that meets the needs and desires for a specific application.

[0040] FIGS. 7 through 13 describe specific flexures that may be used in specific applications with axial actuators. The concept of a flexure as described herein is not limited to the designs and features illustrated and described in FIGS. 7 through 13.

[0041] FIGS. 7, 8, and 9 provide a perspective, bottom, and side view of the flexer (742). The flexer (742) may have a single double parallelogram structure. In the illustrated embodiment, the base (760) extends through an opening in the moving part (768). The base (760) may have openings that allow the base (760) to be fixed to a frame (not illustrated). The base (760) may be coupled to a blade 762 that can be coupled to an intermediate body (764). The intermediate body (764) may be coupled to a blade 766 that can be coupled to the moving part (768). A post (769) may allow the flexer (742) to be coupled to an actuator, another flexer, or another object.

[0042] The flexer (742) may have an opening (844) into which a portion of another flexer can be positioned. The opening (844) may be in the form of a slot, as illustrated in FIGS. 7 and 8. The slot may extend to the right of the flexer (742) near the center of the blades (762 and 766). The intermediate body (764) is spaced apart from each other by the opening (844). The opening (844) allows the flexer (742) and the other flexer to occupy a smaller area than when the opening (844) is absent. In other embodiments (not shown), the opening (844) does not need to extend to the right end of the flexer (742). In the top view or bottom view, the opening (844) may have a closed shape such as a circle, a rectangle (may or may not be a square), a hexagon, an octagon, or an irregular polygon.

[0043] FIG. 10 provides a conceptual diagram of a flexure 1044 that can be used in the flexure 144 of FIG. 1. The flexure 1044 may be a wire flexure and may have a middle section (1064) and an end section (1062) located at the opposite end of the middle section (1064). Each of the middle section (1064) and the end section (1062) may have a cylindrical shape. The middle section (1064) may have a diameter larger than the diameter of the end section (1062). The larger diameter may help reinforce the middle of the flexure 1044. The buckling capacity of the flexure 1044 may increase approximately proportionally to the square of the quotient obtained by dividing the diameter of the middle section (1064) by the diameter of the end section (1062). When the diameter of the middle section (1064) is twice the diameter of the end section (1062), the buckling load capacity of the flexer 1044 can be increased fourfold, and when the diameter of the middle section (1064) is three times the diameter of the end section (1062), the buckling load capacity of the flexer 1044 can be increased ninefold.

[0044] FIGS. 11, 12, and 13 provide a perspective view, a side view, and a bottom view of a flexer 1144 having the flexer design shown in FIG. 10. The flexer 1144 may be a decoupling flexer, and in particular may be a wire flexer. The flexer 1144 may have an intermediate section (1164) and an end section (1162). The structure of the intermediate section (1164) and the end section (1162) may have any of the structures described for the flexer 1044 of FIG. 10. The flexer 1144 may have mounting plates (1167 and 1169) spaced apart from the intermediate section (1164) by the end section (1162). Mounting plate 1167 may be located at the proximal end of flexer 1144 to be coupled to the moving part (768) of flexer 742 of FIGS. 7 to 9. Mounting plate 1169 may be located at the distal end of flexer 1144 to be coupled to the moving body.

[0045] FIG. 14 provides a perspective view of an actuator (1420) coupled to the proximal plate (1167) of a flexure 1144. In FIG. 14 through 25, electrical connections and other electrical couplings, possibly excluding wiring, are present but may not be illustrated to aid in understanding the positional relationships between components within a module that can be used in a die bonding head.

[0046] Actuator 1420 may be any of the actuators previously described for Actuator 120 of FIG. 1. In one embodiment, Actuator 1420 and the flexure (1144) may be connected to each other. In a more specific embodiment, a mounting plate (1167) at the proximal end of the flexure (1144) may be in physical contact with the moving part of Actuator 1420. In the same or different embodiments, Actuator 1420 may be connected to the flexure (1144) using a fastener (1444). The fastener (1444) may be a bolt, a screw, or any other suitable fastener for connecting Actuator 1420 to the flexure (1144). In other implementations, the actuator 1420 and the flexer (1144) may be connected using adhesive or welded together.

[0047] FIGS. 15 and 16 provide perspective views of an actuator system (1500) comprising the actuator (1420) and flexure 1144 of FIG. 14, and further comprising a flexure 742. The coupling between the actuator (1420) and the flexure 1144 is described with respect to FIG. 14. The flexure 742 is coupled to the flexure 1144 and the actuator (1420). In one embodiment, the flexure 742, the flexure 1144, and the actuator (1420) are connected together. In one embodiment, the flexure 742 and the actuator (1420) are spaced apart from each other and do not come into contact with each other. In identical or different implementations, the mounting plate (1167) of the flexer 1144 is located between the flexer 742 and the actuator (1420).

[0048] The combination of the actuator (1420) of FIG. 14 and the flexer 1144 can be inserted into the opening (844) of the flexer 742. Referring to FIGS. 7 and 8, the opening (844) is open and extends in the X-direction between the intermediates (764) to enter the blades (762 and 766). The open opening (844) allows the flexer 1144 to be inserted more easily into the opening (844) during assembly. In other implementations, a closed opening that does not extend to the right of the flexer 742 may be used (compare with the opening 844 of FIG. 8). A single intermediate may replace the intermediates (764). Although such an implementation may be used; After at least one of the middle section (1164) and end section (1162) of the flexer 1144 passes through the closed opening of another flexer, it may be necessary to assemble or disassemble and reassemble at least a part of the flexer 1144. The flexer 1144 passes through the blades (762 and 766) without contacting the blades. This is achieved by installing an opening (844) in the corresponding blades (762 and 764) and placing the flexer within the opening. The shape of the blades (762 and 764) defines an opening (844) that is large enough to allow the flexer (1162) to move within the opening (844) without contacting the blades (762 and 764).

[0049] Flexer 742 can be connected to Flexer 1144 using a fastener (1524) which is one of those shown in FIG. 15. The fastener (1524) may be a bolt, a screw, or any other suitable fastener for connecting Flexer 742 to Flexer 1144. In other embodiments, Flexer 742 and Flexer 1144 may be connected using an adhesive or welded together.

[0050] In FIGS. 14 through 16, the flexure 1144 is coupled to the actuator (1420) before the flexure 742 is coupled to the combination of the flexure 1144 and the actuator (1420). In other embodiments, the order may be reversed, where the flexure 742 and 1144 are coupled together before the actuator (1420) is coupled to the combination of the flexure 742 and 1144.

[0051] The actuator system (1500) can be used as a subassembly within a larger system, such as a module within a die bonding head within a die bonding system. In the description below, the parts of the die bonding head are described with respect to the actuator system (1500), and the die bonding system will be illustrated and described for bonding a set of dies to the die bonding portions of a bonding substrate. FIG. 26 provides a conceptual diagram of an unrestricted die bonding system (2600).

[0052] A plurality of actuator systems (1500) may be coupled to a frame having any one or a combination of a lower frame member (Fig. 17), an inner frame member (Figs. 21 and 22), and an upper frame member (Fig. 24). Fig. 17 includes a lower frame member (1760).

[0053] FIGS. 18a and 18b provide examples of a lower frame member (1760), a movable platform (1800), a die chuck holder (1824), and a die chuck (1844). FIGS. 18a and 18b are perspective views from different viewing angles to provide a better understanding of the positional relationship between the components in the drawings. The movable platform (1800) has an upper surface as shown in FIG. 18a. FIG. 18b shows a die chuck holder (1824) coupled to a lower surface opposite the upper surface to which the die chuck holder (1824) is coupled. The die chuck (1844) may be coupled to the bottom surface of the movable platform (1800). In one embodiment, the die chuck holder (1824) is connected to the movable platform (1800) and may or may not be in contact with the movable platform (1800). A die chuck holder (1824) is positioned between a movable platform (1800) and a die chuck (1844). The die chuck (1844) can be releasedly coupled to a die chuck retention zone along the bottom surface of the die chuck holder (1824). The movable platform (1800) can allow a die coupled to the die chuck (1844), which can be coupled to the movable platform (1800), to be precisely positioned with respect to the corresponding die bonding site of the bonding substrate. Different dies may use the same die chuck as the die chuck (1844) or different die chucks. Thus, the die chuck (1844) may be retained by the die chuck holder (1824) when bonding the first die and released after the first die is bonded. After that, when a second die different from the first die is bonded to the same or different bonding substrate, a different die chuck (not shown) may be held by a die chuck holder (1824).

[0054] The movable platform (1800) further comprises tabs 1802 and 1804. Tabs 1802 and 1804 are configured to be coupled to an actuator system to be oriented for movement in the XY plane. In FIG. 18, the movable platform (1800) is not connected to any or all of the lower frame member (1760) and the jig (1840).

[0055] FIG. 19 provides a perspective view of a portion of the module and further comprises an actuator system 1920. One or more actuator systems 1920 may have the same structure as actuator system 1500. For example, part or all of the actuator system 1920 may comprise an actuator (1420) and a flexure (742 and 1144). The actuator system 1920 may be coupled to the upper surface of the movable platform (1800). In one embodiment, the distal plate of the actuator system 1920 is connected to the upper surface of the movable platform (1800). The combination of actuator system 1920 enables movement of the movable platform (1800) in the Z-direction, and rotation θ about the X-direction axis passing through the center of compliance of the movable platform. X (also called the tip), and rotation θ about the Y-direction axis passing through the center of compliance of the movable platform Y It can control (also called tilt).

[0056] FIG. 20 provides a perspective view of a portion of the module and further comprises actuator systems 2022 and 2024. One or more actuator systems 2022 and 2024 may have the same structure as actuator system 1500. For example, some or all of actuator systems 2022 and 2024 may comprise an actuator (1420) and a flexure (742 and 1144). Actuator system 2022 may be coupled to tab 1802, and actuator system 2024 may be coupled to tab 1804. In one embodiment, the distal plate of actuator system 2022 may be connected to tab 1802, and the distal plate of actuator system 2024 may be connected to tab 1804. Actuator system 2022 may be oriented to drive the movable platform (1800) primarily in the X-direction, and actuator system 2024 may be oriented to drive the movable platform (1800) primarily in the Y-direction. The combination of actuator systems 2022 and 2024 enables motion of the movable platform (1800) in the X-direction and Y-direction, and rotation about a Z-direction axis passing through the center of compliance of the movable platform, θ Z It can control.

[0057] FIGS. 21 and FIGS. 22 each provide a perspective view and a bottom view of an internal frame member (2120). The internal frame member (2120) may have a cross member (2124) and a leg (2122) extending from the cross member (2124).

[0058] FIG. 23 provides a perspective view of a portion of the module and further comprises an inner frame member (2120). The inner frame member (2120) may be coupled to a lower frame member (1760). In one embodiment, the inner frame member (2120) may be connected to the lower frame member (1760). In the same or different embodiments, the inner frame member (2120) and the lower frame member (1760) may be connected together using a fastener (not shown). The fastener may be a bolt, screw, or other suitable fastener for connecting the inner frame member (2120) to the lower frame member (1760). In different embodiments, the inner frame member (2120) and the lower frame member (1760) may be connected using an adhesive or welded together.

[0059] The actuator system (2022 and 2024) can be coupled to the inner frame member (2120). In one embodiment, the actuator system (2022 and 2024) can be connected to the inner frame member (2120). In a specific embodiment, the fixed part of the actuator (1420) can be connected to the leg (2122) of the inner frame member (2120), and the base of the flexer 742 can be connected to the cross member (2124) of the inner frame member (2120).

[0060] The actuator system (2022 and 2024) can be coupled to the movable platform (1800). In one embodiment, the actuator system (2022 and 2024) can be connected to the movable platform (1800). In a specific embodiment, a mounting plate (1169), one of which is shown in FIG. 23 and located near the distal end of the flexure 1144, can be connected to tabs 1802 and 1804 of the movable platform (1800), respectively.

[0061] In the same or different implementations, the actuator system (2022 and 2024) may be connected to the inner frame member (2120) and the tap (1802 and 1804) using a fastener. The fastener may be a bolt, screw, or other suitable fastener for connecting the actuator system (2022 and 2024) to the inner frame member (2120) and the tap (1802 and 1804). In different implementations, one or more of the actuator system (2022 and 2024), the inner frame member (2120), and the movable platform (1800) may be connected using an adhesive or welded together.

[0062] FIG. 24 provides a perspective view of an upper frame member (2440) having an upper portion (2442) and a leg portion (2444) extending from the corner of the upper portion (2442). FIG. 24 further provides position sensors (2431, 2432, 2433, 2434, 2435, 2436, 2437 and 2438) that can be used to determine the position of a movable platform (1800) (shown in FIG. 18 through 20). The position sensors (2431, 2432, 2433, 2434, 2435, 2436, 2437 and 2438) may be based on capacitance, light received by the sensor, or proximity between any sensor and an object detected by the sensor. The position sensors (2431, 2432, 2433, 2434, 2435, 2436, 2437, and 2438) may be one or more types of position sensors comprising a capacitive sensor; an inductive proximity sensor; a Hall effect sensor; a magnetostrictive sensor; an optical micrometer; a spectral interference displacement sensor; and a confocal displacement sensor. Each position sensor is a non-contact sensor that supplies a signal regarding the position of a movable platform (1800) along one or more axes to a controller (2660). In one embodiment, the position sensors (2431, 2432, 2433, 2434, 2435, 2436, 2437, and 2438) may be connected to other parts of the bonding head body (not shown in FIG. 24) and may pass through any one or more of the frame members 2120, 2440, and 1760. In another implementation, the position sensors (2431, 2432, 2433, 2434, 2435, 2436, 2437, and 2438) may be connected to any one of frame members 2120, 2440, and 1760. In additional implementations, more or fewer position sensors may exist.

[0063] FIG. 25 provides a perspective view of a die chuck holding and positioning module (2500). The module (2500) comprises a part of the module of FIG. 23 and may further comprise an upper frame member (2440) that can be coupled to other components within the module (2500). A die chuck holder (1824) and a die chuck (1844) are not shown in FIG. 25 to aid in understanding the module (2500).

[0064] The upper frame member (2440) may be coupled to the inner frame member (2120) and the lower frame member (1760). In one embodiment, the upper frame member (2440) may be connected to the inner frame member (2120), and this inner frame member may be connected to the lower frame member (1760). In the illustrated embodiment, the upper frame member (2440) is spaced apart from and does not come into contact with the lower frame member (1760). The fixed portion of the actuator (1420) in the actuator system (1920) (Fig. 23) may be coupled to the bottom surface of the upper portion (2442) of the upper frame member (2440). In one embodiment, the fixed portion of the actuator (1420) may be connected to the bottom surface of the upper portion (2442). In the same or different implementations, a fastener may be used to connect the fixed portion of the actuator (1420) to the upper portion (2442). The fastener may be a bolt, screw, or other suitable fastener for connecting the fixed portion of the actuator (1420) to the upper portion (2442). In different implementations, the fixed portion of the actuator (1420) and the upper portion (2442) may be connected using an adhesive or welded together.

[0065] The above module (2500) can be used with the die bonding system (2600) of FIG. 26. The die bonding system (2600) may be a single device or two or more devices. In one embodiment, the die bonding system (2600) may be equipped with other devices or equipment not shown in FIG. 26.

[0066] A die bonding system (2600) comprises a bridge (2620), a base (2640), and a controller (2660) coupled to one or more components coupled to the bridge (2620), the base (2640), or the bridge (2620) or the base (2640). The bridge (2620) may be coupled to an array of bonding heads (2624), a reference section (2626) having one or more alignment marks, and registration hardware (2628). The base (2640) may be coupled to a bonding carriage (2646). Although not illustrated, the die bonding system (2600) may also have a die transfer sheet (e.g., a pickup head, part of a pick-and-place tool, etc.) that can be used to transfer a die to the array of bonding heads (2624). The die bonding system (2600) may optionally further comprise a source chuck (not shown) coupled to a bridge (2620), wherein the source chuck may be used to hold a source substrate having a die to be bonded to a bonding substrate.

[0067] In FIG. 26 and other drawings, the bridge (2620), the base (2640), and the components physically located between the bridge (2620) or the base (2640) may be configured along the X-direction, Y-direction, Z-direction, or a combination thereof. For a cross-sectional view or a side view, the X-direction is between the left and right sides of the drawing, the Z-direction is between the top and bottom sides of the drawing, and the Y-direction is between the inside and outside sides of the drawing paper.

[0068] An array of bonding heads (2624) may be arranged as a vector (rows or columns of bonding heads) or a matrix (at least two rows and at least two columns of bonding heads). With respect to the matrix, the number of bonding heads within the array of bonding heads (2624) may differ between rows, between columns, or between rows and columns. Some array configurations may have a 3x1, 6x1, 2x2, 2x3, 2x4, 4x2, 10x10, or other rectangular shape, where the first number corresponds to the number of bonding heads along a row or column, and the second number corresponds to the number of bonding heads along the other row or column. Theoretically, dies from an entire wafer may be transferred at once. For such a configuration, as viewed from the bottom view, the array of bonding heads (2624) may have fewer bonding heads along rows closer to the top and bottom of the array compared to rows or pairs of rows closest to the center of the array, and the array of bonding heads (2624) may have fewer bonding heads along columns closer to the left and right sides of the array compared to columns or pairs of columns closest to the center of the array. After reading this specification, a person skilled in the art will be able to determine an arrangement of the array of bonding heads (2624) that meets the needs or desires for a particular application.

[0069] Some or all of the bonding heads within a plurality of bonding heads (2624) may be equipped with a bonding head body (26242) and a die chuck (26244). The bonding head body (26242) may be equipped with a die chuck holding and positioning module (2500) and a die chuck holder (1824). The bonding head body (26242) may be coupled to a die chuck (26244) within a die chuck holding area along the bottom surface of a movable platform (1800) (shown in FIG. 18). The die chuck 26244 may be the same as or different from the die chuck 1844 of the previous drawing. The die chuck 26244 may be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, an edge-grabbing chuck, or a Bernoulli chuck. The die chuck (26244) can be configured to modulate the shape of the die during the die bonding sequence.

[0070] The registration hardware (2628) is coupled to the bridge (2620). The registration hardware (2628) may be equipped with an optical component and may provide information to a controller (2660) and, or to a local controller located within the registration hardware (2628), the bridge (2620), or other components coupled to the bridge (2620), the base (2640), or components coupled to the base (2640), or a combination thereof. Information from the registration hardware (2628) may be used to determine the bonding pitch for the die bonding site of the bonding substrate (2948) (shown in FIG. 29). Additionally, the information may be used to identify or verify whether the bonding substrate (2948) is the correct substrate on which the die will be transferred and the bonding site on the bonding substrate (2948).

[0071] Registration hardware (2650) may be coupled to the bonding carriage (2646). Registration hardware (2650) may be equipped with an optical component and may provide information to a controller (2660) and, or to a local controller located within the registration hardware (2650), the bonding carriage (2646), the bridge (2620) or a component coupled to the bridge (2620), the base (2640) or another component coupled to the base (2640), or a combination thereof. Registration hardware (2650) may be used to align the bonding carriage (2646) to one or more alignment marks of the reference section (2626), to align the bonding carriage (2646) to an array of bonding heads (2624), or to align both. Registration hardware (2650) may provide information used to adjust the position of the die chuck (26244) within the array of bonding heads (2624).

[0072] The die bonding system (2600) may be controlled by a controller (2660) communicating with a bridge (2620), any component coupled to the bridge (2620), a base (2640), any component coupled to the base (2640), or a combination thereof. The controller (2660) may optionally operate using a computer-readable program stored in memory (2662). The controller (2660) may have a processor (e.g., a central processing unit of a microprocessor or microcontroller), a field programmable gate array (FPGA), an application-oriented integrated circuit (ASIC), or other electrical components configured to execute commands in hardware, software, or firmware. The controller (2660) may further have internal memory such as a register set, cache memory, flash memory, or other suitable memory. The controller (2660) may be located within the die bonding system (2600). In another implementation of the die bonding system (not shown), the controller (2660) may be at least part of a computer located outside the die bonding system (2600), and such computer is coupled to the die bonding system (2600) bidirectionally. The controller (2660) may have one or more processors communicating over a bus, a local area intranet, or a wide area internet. In another implementation, the bridge (2620), the component coupled to the bridge (2620), the base (2640), or the component coupled to the base (2640) may have a local controller that provides some of the functions otherwise provided by the controller (2660).

[0073] The memory (2662) may have a non-transient computer-readable medium having instructions for performing operations associated with hybrid bonding operations. The memory (2662) may have a non-transient computer-readable medium having instructions for performing operations associated with die bonding operations. The memory (2662) may have a register set, a cache memory, a flash memory, a hard drive, or other memory. The memory (2662) may further have a data table that the controller (2660) can access to help determine operation parameters, for example, determining the position of a movable platform in the XY plane, bonding a die to a bonding substrate within the die bonding system (2600), or both as described below.

[0074] Note the method of bonding the dies to the die bonding portion of the bonding substrate using a die bonding system (2600) when transferring a set of dies to the die bonding portion of the bonding substrate. The process flow of the method is illustrated in FIG. 27. FIG. 28 provides details of at least some of the operations that may occur when performing the operation in block 2742 of FIG. 27.

[0075] The method may include the step of transferring a set of dies to an array of bonding heads in block 2722 of FIG. 27. In FIG. 29, the die transfer carriage (not shown) and the bonding carriage (2646) are moved to the right. The die transfer carriage is moved so that the array of bonding heads (2624) is positioned over the array of die transfer sheets. If necessary or desired, registration hardware (2628, 2650) or both can be used to verify that the array of die transfer sheets (not shown) is properly positioned relative to the array of bonding heads (2624). The controller (2660) or local controller may transmit a signal to cause the die transfer sheets within the array of die transfer sheets to extend toward the bonding heads within the array of bonding heads (2624), or to cause the bonding heads within the array of bonding heads (2624) to extend toward the die transfer sheets within the array of die transfer sheets, or to transmit a signal for both. A set of dies (2922) is held by a die chuck (26244). A bonding substrate (2948) can be bonded to the substrate chuck (2648). A dark band along the set of dies (2922) and the bonding substrate (2948) indicates an activated surface to help bond the set of dies (2922) to the bonding substrate (2948). In a non-limiting embodiment, the activated surface may be a hydrolyzed surface of a silicon oxide material.

[0076] FIG. 29 comprises a set of dies (2922) after being transferred from an array of die transfer sheets to an array of bonding heads (2624). FIG. 30 comprises a specific die (3022) within the set of dies (2922) held by a die chuck (26244). The operation described for the specific die (3022) is also performed for other dies within the set of dies (2922). Referring to FIG. 26, 29 and 30, a controller (2660) or a local controller may transmit a signal to activate a pressure actuator for a bonding head within the array of bonding heads (2624) to evacuate Euro 3035 and zone 3065 between Lands 3052 and 3054. The vacuum within zone 3065 may be sufficient to hold the specific die (3022). Euro 3039 may be at or near ambient pressure or exhausted similarly to Euro 3035. The controller (2660) or local controller may or may not transmit a signal to activate the pressure actuator for Euro 3039 to achieve the desired pressure (vacuum or near ambient pressure) in Euro 3039 and zone 3069.

[0077] The above method may further include the step of performing registration and measurement of the set of dies and the bonding portion of the bonding substrate in block 2742 of FIG. 27. FIG. 28 comprises at least some of the operations performed in block 2742. Additional operations may or may not be performed in addition to the operations listed in FIG. 28. Thus, (1) one or more operations may occur after block 2722 of FIG. 27 and before block 2822, (2) one or more operations may occur before block 2762 of FIG. 27 and along the YES branch of the crystal diamond (2842), or both (1) and (2) may occur.

[0078] Referring to FIG. 28, the method may include the step of receiving a signal from the registration hardware in block 2822 at the controller (2660). The registration hardware (2628) may obtain information regarding the bonding substrate (2948), and the registration hardware (2650) may obtain information regarding the set of dies (2922).

[0079] The controller (2660) or local controller may receive a signal regarding information about the bonding substrate (2948) from the registration hardware (2628). This signal may contain information that may or may not correspond to the part number(s) of the bonding substrate (2948). This information may be used to verify that the correct bonding substrate (2948) is bonded to the substrate chuck (2648). If the information contains part numbers, the controller (2660) or local controller may obtain additional information regarding the bonding substrate (2948) from memory (2662) or other memory, such as the location of the die bonding site on the bonding substrate (2948), the size of the bonding pad on the bonding substrate (2948), the topography of the bonding substrate (2948) to which the set of dies (2922) will be bonded to the substrate (2948), or other information related to the surface of the bonding substrate (2948). This information may be based on the design of the bonding substrate (2948). Thus, information related to the bonding substrate (2948) may represent design values ​​rather than actual values ​​for the parameters. Since design information is not required for every implementation, obtaining design information may or may not be performed.

[0080] Alternatively, or in addition to the design values, information regarding actual values ​​for the location of the die bonding site on the bonding substrate (2948), the size of the bonding pad on the bonding substrate (2948), the topography of the bonding substrate (2948) to which the set of dies (2922) will be bonded to the substrate (2948), or other information related to the surface of the bonding substrate (2948) may be determined by the controller (2660) or the local controller at least partially based on a signal transmitted by the registration hardware (2628) and received by the controller (2660) or the local controller.

[0081] The controller (2660) or local controller may receive a signal regarding information about the set of dies (2922) from the registration hardware (2650). This signal may contain information that may or may not correspond to the part number(s) of the set of dies (2922). This information may be used to verify that the correct die is to be bonded to the bonding substrate (2948). If the information includes part number(s), the controller (2660) or local controller may obtain additional information about the set of dies (2922) from memory (2662) or another memory, for example, area dimensions of the dies within the set of dies (2922), locations of bonding pads within the dies of the set of dies (2922), bonding pad sizes for the set of dies (2922), or other information related to the surface of the set of dies (2922). This information may be based on the design of the set of dies (2922). Therefore, information related to the set of dies (2922) may represent design values ​​rather than actual values ​​for the parameters. Design information may or may not help to perform registration or measurement more quickly. Since design information is not required for every implementation, obtaining design information may or may not be performed.

[0082] Alternatively, or in addition to design values, actual value information regarding the area dimensions of the die (2922), the location of bonding pads within the die for the set of dies (2922), the size of the bonding pads for the set of dies (2922), or other information related to the surface of the set of dies (2922) may be determined by the controller (2660) or the local controller, at least partially based on a signal transmitted by the registration hardware (2628) and received by the controller (2660) or the local controller.

[0083] The controller (2660) or local controller can use information generated from signals from the registration hardware (2628 and 2650) to determine whether the relative position of the die bonding site within the set (2922) of the bonding substrate (2948) and dies is within the tolerance in the crystal diamond (2842) of FIG. 28. The position is the X-direction difference, Y-direction difference, Z-direction difference, θ X Difference, θ Y Difference and θ Z One or more differences may be provided. The differences can be compared with the corresponding tolerance to determine whether the difference is within the tolerance.

[0084] The Z-direction tolerance may be up to + / -2.5% of the length of the movable platform (1800) or up to + / -2.5% of the width of the movable platform (1800). In the same or different implementations, the X-direction and Y-direction tolerances, respectively, may be up to + / -0.90%, up to + / -0.50%, or up to + / -0.25% of the length of the movable platform (1800) or up to + / -0.90%, up to + / -0.50%, or up to + / -0.25% of the width of the movable platform (1800). The tolerances may be expressed in terms of actual distances compared to relative values. In one implementation, depending on the die being bonded, the tolerance in the X-direction, Y-direction, or Z-direction may be up to + / -100nm, up to + / -50nm, up to + / -20nm, up to + / -10nm, up to + / -5nm, up to + / -2nm, or up to + / -1nm.

[0085] The X-direction, Y-direction, and Z-direction described above may have corresponding angular tolerances. Rotation about these directions is θ X , θ Y or θ Z It may be equipped with. In one implementation, θ X , θ Y and θ Z The angular tolerance for any of the above may be up to + / -50 milliradians (mrad), up to + / -20 mrad, up to + / -10 mrad, up to + / -6 mrad, or up to + / -3 mrad.

[0086] If all differences are below the tolerance, the process can proceed along the YES branch from the decision diamond (2842).

[0087] If one or more of the above differences are greater than the corresponding tolerance(s), the process proceeds along the NO branch from the crystal diamond (2842). The method may include the step of determining the adjustment(s) to be performed on the movable platform in block 2862. Position sensors (2431, 2432, 2433, 2434, 2435, 2436, 2437, and 2438) may provide information regarding the position of the movable platform (1800) before the adjustment is made. Accordingly, the method may include the step of processing signals from the position sensors of the movable platform in a controller in block 2864. The controller (2660) or local controller may receive signals from the position sensors (2431, 2432, 2433, 2434, 2435, 2436, 2437, and 2438). If information regarding the location has previously been received from the location sensors (2431, 2432, 2433, 2434, 2435, 2436, 2437, and 2438), the operation in block 2864 may be omitted.

[0088] The above method may further include the step of adjusting the position of the movable platform in block 2866. The controller (2660) or local controller may send one or more signals to one or more of the actuator systems 1920, 2022 and 2024 capable of moving the platform (1800).

[0089] The actuator system (1920) is in the Z-direction, θ X and θ Y It may affect the movement of. Ideally, as shown in FIG. 29, the bonding surface of the set of dies (2922) and the bonding surface within the bonding substrate (2948) are perfectly parallel to each other. In reality, the bonding surface of the set of dies (2922) and the bonding surface within the bonding substrate (2948) may not be perfectly parallel to each other. Z-direction, θ X and θ YThe movement in is such that the relative position of the bonding surface of the set of dies (2922) and the bonding surface of the bonding substrate (2948) is in the Z-direction, θ X and θ Y It may affect whether it is within the previously described tolerance. Adjustments made for this movement may help reduce the likelihood of damage to any one die in the set of dies (2922), any one bonding site in the bonding substrate (2948), or any combination of any die in the set of dies (2922), any bonding site in the bonding substrate (2948), or any combination of any die in the set of dies (2922) and bonding sites in the bonding substrate (2948) due to uneven contact when force is applied during bonding of any one or more dies in the set of dies (2922) and any one or more bonding sites in the bonding substrate (2948).

[0090] The actuator systems (2022 and 2024) have X-direction, Y-direction and θ Z It can affect the motion of. X-direction, Y-direction, and θ Z The movement in is such that the relative positions of the bonding pads of the set of dies (2922) and the bonding pads of the bonding substrate (2948) are in the X-direction, Y-direction and θ Z It may affect whether it is within the previously described tolerances. Adjustments made to this movement can help achieve good electrical and physical contact and acceptable low contact resistance compared to not making any adjustments.

[0091] The above method may include the step of receiving a signal from the registration hardware at the controller in block 2868 of FIG. 28. In one implementation, after adjustment of the movable platform (1800) is made, the registration hardware (2650) may obtain information regarding the set of dies (2922). In the same or different implementations, the registration hardware (2628) may obtain information regarding the bonding substrate (2948). The above method continues by returning to the crystal diamond (2842) to determine whether all dimensional differences are within tolerance. When the dimensional difference between the set of dies (2922) and the bonding substrate (2948) is within tolerance, the set of dies (2922), the bonding substrate (2948), or both are moved so that the set of dies (2922) overlaps with the corresponding die bonding site within the bonding substrate (2948), as shown in FIG. 31. The process continues in block 2762 of FIG. 27.

[0092] The above method may further include a step of bowing a set of dies while being held by an array of bonding heads in block 2762 of FIG. 27. Data may be useful for determining how much pressure to use to bow the set of dies (2922). For example, the larger the area (X-direction and Y-direction dimensions) and the thinner the die (Z-direction dimension), the less pressure is required to bow the die compared to a die that occupies a smaller area and is thicker. If the die is attached to a backing plate, the combined thickness of the die and the backing plate may be used to determine the pressure required to achieve the desired amount of bowing. Data may be obtained for many different die areas and thicknesses. A table or database outside of memory (2662) or the die bonding system (2600) may have data correlating the different areas and thicknesses of the die with the amount of pressure or range of pressure to be used to sufficiently bow the die.

[0093] Referring to FIGS. 26 and 32, a controller (2660) or a local controller may transmit a signal that allows a pressure actuator to be activated and pressurized gas to increase the pressure within a zone (3069) which can be defined at least partially by a flow path (3039) and a land (3054). A pressure sensor detects the pressure within the flow path (3039) and the zone (3069) and transmits a signal to the controller (2660) or the local controller, thereby enabling the controller (2660) or the local controller to control the pressure so that it is within an acceptable tolerance of the target pressure or becomes the target pressure. As the pressure within the zone (3069) increases, the die moves away from the die chuck (26244) and bends toward the base (2640) or the bonding substrate (2948) attached to the base (2640). FIG. 32 illustrates a specific die (3022), and other dies in a set of dies (2922) may also have a curved shape similar to the specific die (3022) illustrated in FIG. 32.

[0094] The above method may include the step of bringing a set of dies and a die bonding site into contact while the die is bent in block 2764 of FIG. 27. Referring to FIG. 26 and FIG. 33, an array of die chucks (26244) within an array of bonding heads (2624) may extend toward a bonding substrate (2948), and a substrate chuck (2648) may extend toward the array of bonding heads (2624), or both. As shown in FIG. 33, the center of a specific die (3022) contacts the die bonding site of the bonding substrate (2948) before other parts of the specific die (3022) contact the die bonding site. Thus, the possibility of air being trapped between the specific die (3022) and the bonding substrate (2948) during bonding is substantially less than when bending is not performed.

[0095] The above method may further include the step of bonding a set of dies in block 2766 of FIG. 27 to a corresponding die bonding site of a bonding substrate. Referring to FIG. 26 and FIG. 34, the die chuck (26244) within the array of bonding heads (2624) may be further extended toward the bonding substrate (2948), and the substrate chuck (2648) may be extended toward the array of bonding heads (2624), or both. The amount of bending may be reduced as the contact area between a specific die (3022) and the corresponding die bonding site of the bonding substrate (2948) increases.

[0096] Pressure is applied to bond a set of dies (2922) to a corresponding bonding site on a bonding substrate (2948). In one embodiment, the bond may be an oxide-to-oxide bond. The force at bonding may be at least 5 N, at least 10 N, at least 20 N, at least 50 N, or at least 100 N. In one embodiment, with respect to pressure, the pressure at bonding may be in the range of 0.5 N / cm² to 20 N / cm². A controller (2660) or a local controller may transmit a signal to a motor, hydraulic system, or other mechanical component that can be used to drive an array of bonding heads (2624), a substrate chuck (2648), or both in the Z-direction to achieve the bonding pressure. At bonding, if necessary or desired, the pressure within zone (3069) may be within or within the tolerance of the pressure applied by a motor, hydraulic system, or other mechanical component to allow for a more uniform pressure along the surface of a set of dies (2922) having a specific die (3022) as illustrated in FIG. 34. In other embodiments, the pressure within zone (3069) may be ambient pressure or near it. In the same or different embodiments, the pressure within zone (3065) may be maintained as vacuum pressure, ambient pressure or near it, or substantially the same pressure as within zone (3069).

[0097] Bonding may be performed at room temperature (e.g., a temperature in the range of 20°C to 25°C) or higher. Bonding is performed at a temperature lower than that for subsequent annealing to expand the conductive metal in the die and the die bonding site. The temperature may be limited depending on the film present at the time of bonding or the components within the die bonding system (2600). For example, the temperature may not be higher than about 200°C. After reading this specification, a person skilled in the art will be able to determine the pressure and temperature used for bonding.

[0098] FIG. 35 provides a cross-sectional view of a die bonding system (2600) after a set of dies (2922) has been bonded to a corresponding die bonding site on a bonding substrate (2948). At this point, the method completes one transfer cycle. In one embodiment, for each die in the set of dies (2922), the maximum X-direction alignment error between the center of the die and the center of the corresponding die bonding site is 50 microns. In the same or different embodiments, for each die in the set of dies (2922), the maximum Y-direction alignment error between the center of the die and the center of the corresponding die bonding site is 50 microns. In any of the above or other embodiments, for each die in the set of dies (2922), the maximum θ between the die and the corresponding die bonding site Z The alignment error can be up to 3 mrad.

[0099] In the crystal diamond (2768) of FIG. 27, it is determined whether more dies need to be bonded to the bonding substrate. If more dies need to be transferred ("YES" branch), the method continues in block 2722 with the next set of dies transferred during another transfer cycle. This method can be repeated as many times as necessary until the bonding substrate (2948) has the desired number of dies. If there are no more dies to transfer ("NO" branch in the crystal diamond (2768) of FIG. 27), the transfer operation is completed.

[0100] The hybrid bonding process may comprise three steps, including a bonding operation, a first annealing in which the metals in the die and the die bonding site expand to come into contact with each other, and an optional second annealing in which metal atoms reduce contact resistance across the metal-metal interface. The previously described methods correspond to the bonding operation.

[0101] After all transfer cycles are performed and the transfer operation is completed, the bonding substrate (2948) and the corresponding bonded die may be annealed at a temperature ranging from 180°C to 400°C. In one embodiment, annealing may be performed at one or more temperatures. As the temperature of the conductive metal rises, the conductive metal expands. The conductive metal in the electrical component within the bonding substrate (2948) comes into contact with the conductive metal of the bonded die to create a physical and electrical bond between the conductive materials. If necessary or desired, the annealing temperature may be increased further so that atoms from the conductive metal can cross the interface between the electrical component of the bonding substrate (2948) and the bonded die to reduce contact resistance. In one embodiment, the physical and electrical bond may be a physical and electrical connection. Thus, the bonded die and the set of electrical components of the bonding substrate (2948) may allow voltage to be transmitted and current to flow between the bonded die and the set of electrical components. The bonding substrate (2948) may be removed from the die bonding system (2600) or moved to a different part of the die bonding system (2600) or a different tool to perform an annealing operation.

[0102] The above method may further include the step of performing one or more post-bonding operations in block 2782 of FIG. 27. Non-limiting examples of post-bonding operations include electrical testing of an electronic device having a bonded die, dicing the bonding substrate into individual electronic devices, cleaning the electronic devices, packaging the electronic devices, or performing other appropriate post-bonding operations. The order of the post-bonding operations may or may not depend on the specific electronic device. For example, the packaging operation may be performed before or after the dicing operation. Additionally, two or more electrical tests may be performed at different times, during which an intervention operation may or may not be performed between the electrical tests. For example, a first electrical test for an electrical short or electrical open may be performed before packaging. After packaging, a second electrical test may be performed to test whether the memory can write and retrieve data or whether the processor can properly execute instructions. At this point, the electronic device has been manufactured in the above method.

[0103] The actuator system described herein is highly suitable for a multi-degree-of-freedom motion mechanism, such as a module (2500) that can be used within the die bonding head of a die bonding system (2600). The actuator system can enable the die bonding system (2600) to achieve high precision and high production throughput for bonding a die to a bonding substrate. In one embodiment, the die bonding system may move in the X-direction, Y-direction, or Z-direction, or θ X , θ Y or θ Z The previously described tolerance can be achieved.

[0104] The actuator system within the die bonding system (2600) is well suited for adjusting the position of the die chuck (26244) within the array (2624) of bonding heads relatively quickly compared to conventional die bonding systems. For the registration and measurement operation, the adjustment cycle may start at a first point in time when a signal from the registration hardware (2650) during the current adjustment cycle is processed by the controller (2660) for the current position of the set of dies, and end at a second point in time when the position adjustment of the movable platform (1800) is completed. In one implementation, the adjustment cycle may correspond to blocks 2864 and 2866 of FIG. 28. The die bonding system (2600) may perform an adjustment cycle frequency of at least 50 Hz, at least 200 Hz, at least 500 Hz, or at least 1.1 kHz. In one implementation, the die bonding system (2600) may be able to perform at an adjustment cycle frequency of up to 5 kHz.

[0105] In one embodiment, the arrangement of flexures 742 and 1144 may occupy a relatively small space compared to a conventional actuator system. Flexure 742 has an opening (844) that allows flexure 1144 to pass completely through flexure 742. In a specific embodiment, the opening (844) within flexure 742 may be an open slot that allows flexure 1144 to be easily inserted into flexure 742 when flexures 742 and 1144 are combined.

[0106] It should be noted that not all activities described in the general description or examples are required, that some specific activities may not be required, and that at least one additional activity may be performed in addition to those described. Furthermore, the order in which the activities are listed is not necessarily the order in which they are performed.

[0107] The advantages, other advantages, and solutions to problems have been described in detail with respect to specific implementation. However, the advantages, advantages, solutions to problems, and any feature(s) that may give rise to or make more prominent the advantages, advantages, or solutions shall not be interpreted as important, required, or essential features of any part or all of the claims.

[0108] The specifications and drawings of the embodiments described herein are intended to provide a general understanding of the structures of various embodiments. The specifications and drawings are not intended to serve as a definitive and comprehensive description of all elements and features of systems and devices using the structures or methods described herein. Separate implementations may also be provided as combinations of a single implementation, and conversely, for the sake of brevity, various features described in the context of a single implementation may also be provided separately or in any sub-combination. Additionally, references to values ​​specified in a range include each and all values ​​within that range. Many other implementations may become apparent to those skilled in the art only after reading this specification. Other implementations may be used and derived from this disclosure so that structural substitutions, logical substitutions, or other modifications may be made without departing from the scope of this disclosure. Accordingly, this disclosure should be regarded as illustrative rather than limiting.

Claims

Claim 1 A die bonding system comprising: a first frame; a first movable platform configured to hold a first die chuck; a first actuator for moving the first movable platform with respect to the first frame, wherein the first actuator comprises a first fixed part attached to the first frame and a first moving part configured to supply a first force in a first direction with respect to the first fixed part; a first flexure having a first degree of freedom in the first direction and connected to the first moving part of the first actuator and the first frame; and a second flexure having a plurality of degrees of freedom in a direction other than the first direction and connected to the first moving part of the first actuator and the first movable platform. Claim 2 A die bonding system according to claim 1, wherein the first degree of freedom of the first flexure is a single degree of freedom of the first flexure, and the second flexure has five degrees of freedom. Claim 3 A die bonding system according to claim 1, wherein the first flexure comprises a parallelogram, a double parallelogram, or a plurality of parallelograms, and the second flexure is a wire flexure. Claim 4 In claim 1, the first flexure is, A base connected to the first frame above; A first flexure moving part connected to the first moving part of the first actuator; Intermediate; A first blade connecting the above base to the above intermediate; and A die bonding system comprising a second blade connecting the first flexure moving part to the intermediate body, wherein the second flexure passes through the first blade and the second blade without contacting the first blade or the second blade of the first flexure. Claim 5 In claim 4, the first blade is configured such that the second flexure passes through the center of the compliance of the first flexure, forming a die bonding system. Claim 6 In claim 4, the second flexer comprises a wire flexer having an intermediate portion, a first end section along a first end of the intermediate portion, and a second end section along a second end opposite to the first end of the intermediate portion, wherein the diameter of the intermediate portion is greater than the diameter of each of the first end section and the second end section, and the intermediate portion extends through the first blade and the second blade, a die bonding system. Claim 7 A die bonding system according to claim 1, wherein the second flexure is configured to be coupled between the first flexure and the first die chuck. Claim 8 A die bonding system according to claim 1, wherein the first actuator comprises a voice coil actuator, a piezoelectric actuator, a stepper motor, a servo motor, or a thermal expansion actuator. Claim 9 A die bonding system according to claim 1, wherein the first die bonding head comprises the first movable platform, the first actuator, the first flexure, and the second flexure, and the die bonding system further comprises a second die bonding head identical to the first die bonding head. Claim 10 A die bonding system according to claim 1, further comprising: a second frame; a second movable platform configured to be spaced apart from the first movable platform and to hold a second die chuck; a second actuator for moving the second movable platform with respect to the second frame, wherein the second actuator comprises: a second fixed part attached to the second frame; and a second moving part configured to supply a second force in the first direction with respect to the second fixed part; a third flexure having a double parallelogram, wherein the double parallelogram is a single double parallelogram of the third flexure, and the third flexure is connected to the second moving part of the second actuator and the second frame; and a fourth flexure connected to the third flexure and the second movable platform, wherein the fourth flexure is a wire flexure. Claim 11 A die bonding system according to claim 1, comprising: a second frame; a second movable platform configured to be spaced apart from the first movable platform and to hold a second die chuck; a second actuator for moving the second movable platform with respect to the second frame, wherein the second actuator comprises: a second fixed part attached to the second frame; and a second moving part configured to supply a second force in the first direction with respect to the second fixed part; a third flexure comprising a first blade and a second blade and connected to the second moving part of the second actuator and the second frame; and a fourth flexure extending through the first blade and the second blade without contacting the first blade and the second blade of the third flexure and connected to the third flexure and the second movable platform. Claim 12 A system comprising: a first flexure configured to be connected to a frame and having a single double parallelogram of the first flexure; and a second flexure coupled to the first flexure and being a wire flexure. Claim 13 A system according to claim 12, further comprising an actuator having a moving part coupled to the first flexure, wherein the second flexure is configured to be coupled to a moving body. Claim 14 In claim 13, the system is configured such that the second flexure is coupled between the first flexure and the movable body. Claim 15 A system according to claim 12, wherein the first flexure is a guiding flexure and the second flexure is a decoupling flexure. Claim 16 A system comprising: a first flexure having a first blade; and a second flexure coupled to the first flexure and extending through the first blade without contacting the first blade. Claim 17 In claim 16, the system wherein the first flexure comprises a plurality of blades having the first blade and the second blade, and the second flexure extends through the second blade without contacting the second blade. Claim 18 A system according to claim 16, further comprising an actuator having a moving part coupled to the first flexure, wherein the second flexure is configured to be coupled to a moving body. Claim 19 A method for manufacturing multiple articles, comprising the step of bonding a die to a substrate using a die bonding system - said die bonding system, First frame; A first movable platform configured to maintain a first die chuck; A first actuator for moving the first movable platform with respect to the first frame (wherein the first actuator comprises: a first fixed part attached to the first frame; and a first moving part configured to supply a first force in a first direction with respect to the first fixed part); A first flexure having a first degree of freedom in the first direction and connected to the first moving part of the first actuator and the first frame; and A method for manufacturing a plurality of articles, comprising: a second flexure having a plurality of degrees of freedom in a direction other than the first direction and connected to the first moving part of the first actuator and the first movable platform; and a step of processing the substrate to manufacture the plurality of articles.

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