Polishing apparatus, substrate processing apparatus, polishing method and determination apparatus

Abstract

The present invention detects particles that scratch a substrate more efficiently or more precisely. A polishing device is provided with a detector that detects a signal regarding at least one of the particle size, shape, dispersibility, and optical properties from a polishing liquid located on a polishing surface, or from a polishing liquid located in a channel or room connected to a pad opening formed in a polishing pad, and a control device is configured to perform particle determination, which determines whether the polishing liquid detected includes particles that scratch the substrate, based on particle data indicating at least one of the particle size, shape, dispersibility, and optical properties obtained based on the signal detected by the detector, and correspondence information indicating the correspondence between the particle size of the polishing liquid and whether the particle is a particle that scratches the substrate.

Description

Technology Field

[0001] The present invention relates to a polishing device, a substrate processing device, a polishing method, and a judgment device. Background Technology

[0002] In the manufacturing process of semiconductor devices, surface planarization technology is becoming increasingly important. Chemical Mechanical Polishing (CMP) is a well-known planarization technology. In this chemical mechanical polishing, polishing is performed by using a polishing device to supply a polishing liquid (slurry) containing abrasive particles such as silica (SiO2) and / or ceria (CeO2) to a polishing pad, while causing a substrate, such as a semiconductor wafer, to slide in contact with the polishing pad.

[0003] If the polishing liquid contains aggregates of abrasive particles or foreign substances, it may be impossible to perform the polishing intended in advance, or scratches may occur on the surface of the substrate, potentially causing damage to the substrate. Patent Document 1 discloses a polishing device in which, during polishing, ultrasonic waves are applied to the polishing surface of a wafer to measure the slurry particle size and monitor fluctuations in the slurry particle size, and an output signal is transmitted to a chemical supply control unit at the point when a change occurs in the particle size distribution profile. Patent Document 2 discloses a polishing method in which a sampled slurry is filtered, and foreign substances on the surface of the filter membrane are observed using a scanning electron microscope or the like. Prior art literature

[0004] Japanese Patent Publication No. 2004-363229 Japanese Patent Publication No. 2008-145102 The problem to be solved

[0005] In the polishing device of Patent Document 1, the state of the wafer polishing surface may change when measuring the particle size distribution. In addition, Patent Document 1 does not make a determination based on the particle size in the particle size distribution. In Patent Document 2, the state of the slurry may change while collecting the slurry or preparing for observation.

[0006] The present invention is made in consideration of the above-described circumstances, and one of its objectives is to provide a judgment device, a polishing device, a substrate processing device, or a polishing method capable of evaluating the state of a polishing liquid more efficiently or more precisely while suppressing changes in the state of the polishing liquid after it is placed on a polishing surface. means of solving the problem

[0007] According to one embodiment of the present invention, a polishing device comprises a polishing table for supporting a polishing pad having a polishing surface, a polishing head for holding and supporting a substrate, a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the substrate, and a control device, and performs polishing of the substrate by contacting the polishing pad and the substrate in the presence of the polishing liquid. The polishing device further comprises a detector that detects a signal regarding at least one of the particle size, shape, dispersibility, and optical characteristics from the polishing liquid located on the polishing surface, or from the polishing liquid located in a channel or room communicating with a pad opening formed in the polishing pad. The control device, based on particle data indicating at least one of the particle size, shape, dispersibility, and optical characteristics obtained based on the signal detected by the detector, and correspondence information indicating a correspondence between at least one of the particle size, shape, dispersibility, and optical characteristics of the polishing liquid and whether the particle is a particle that scratches the substrate, wherein the polishing liquid detected scratches the substrate It is configured to perform particle determination to determine whether it contains particles.

[0008] According to another embodiment of the present invention, a polishing method is a polishing method in which polishing is performed by contacting a polishing pad and a substrate in the presence of a polishing liquid by means of a polishing device comprising a polishing table for supporting a polishing pad having a polishing surface, a polishing head for holding and supporting a substrate, and a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the substrate, and further comprises detecting a signal regarding at least one of the particle size, shape, dispersibility, and optical properties from the polishing liquid located on the polishing surface or from the polishing liquid located in a channel or room communicating with a pad opening formed in the polishing pad, and performing particle determination to determine whether the polishing liquid detected includes a particle that scratches the substrate based on particle data indicating the particle size obtained based on the signal detected by the detector, and correspondence relationship information indicating a correspondence relationship between at least one of the particle size, shape, dispersibility, and optical properties of the polishing liquid and whether the particle is a particle that scratches the substrate.

[0009] According to another embodiment of the present invention, a determination device is a determination device for determining the state of a polishing liquid in a polishing device, wherein the polishing device comprises a polishing table for supporting a polishing pad having a polishing surface, a polishing head for holding and supporting a substrate, and a polishing liquid supply device for supplying the polishing liquid between the polishing pad and the substrate, and performs polishing of the substrate by contacting the polishing pad and the substrate in the presence of the polishing liquid, and the polishing device further comprises a detector for detecting a signal regarding at least one of the particle size, shape, dispersibility, and optical characteristics from the polishing liquid located on the polishing surface, or from the polishing liquid located in a channel or room communicating with a pad opening formed in the polishing pad, and the determination device, based on particle data indicating at least one of the particle size, shape, dispersibility, and optical characteristics obtained based on the signal detected by the detector, and correspondence relationship information indicating a correspondence relationship between at least one of the particle size, shape, dispersibility, and optical characteristics of the polishing liquid and whether the particle is a particle that scratches the substrate, the detection It is configured to perform particle determination to determine whether the polishing liquid used contains particles that scratch the substrate. Brief explanation of the drawing

[0010] FIG. 1 is a schematic diagram illustrating the overall configuration of a substrate processing apparatus according to one embodiment. FIG. 2 is a perspective view schematically illustrating the configuration of a grinding device according to one embodiment. Figure 3 is a cross-sectional view of a polishing device schematically illustrating a particle detection system of the polishing device. Figure 4 is a schematic diagram illustrating the detection of particles by a particle detection system. FIG. 5a is an enlarged plan view of a polishing pad schematically illustrating an example of a pad opening. FIG. 5b is an enlarged plan view of a grinding pad schematically illustrating another example of a pad opening. FIG. 6a is an enlarged plan view of a grinding table schematically illustrating an example of a table opening. FIG. 6b is an enlarged plan view of a grinding table schematically illustrating another example of a table opening. FIG. 7 is a flowchart showing the flow of a polishing method according to one embodiment. FIG. 8 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 1. FIG. 9 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 2-1. FIG. 10 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 2-2. FIG. 11 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variation Example 2-3. FIG. 12 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 2-4. FIG. 13 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 3-1. FIG. 14 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 3-2. FIG. 15 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 3-3. FIG. 16 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 3-4. FIG. 17 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 3-5. FIG. 18 is a cross-sectional view of a polishing device schematically illustrating a particle detection system according to Variant Example 3-6. FIG. 19 is a plan view of a polishing pad schematically illustrating an example of the arrangement of pad openings according to Variation Example 4. FIG. 20 is a cross-sectional view of a polishing device schematically illustrating the configuration of a particle detection system according to Variant Example 5. FIG. 21 is a cross-sectional view of a polishing device schematically illustrating the configuration of a particle detection system according to Variant Example 6. Specific details for implementing the invention

[0011] Embodiments of the present invention will be described below in conjunction with the accompanying drawings. In the accompanying drawings, identical or similar elements are denoted by identical or similar reference numerals, and redundant descriptions regarding identical or similar elements may be omitted in the description of each embodiment. Furthermore, features shown in each embodiment may be applied to other embodiments as long as they do not contradict each other.

[0012] In this specification, the term “substrate” includes semiconductor substrates, glass substrates, liquid crystal substrates, and printed circuit boards, as well as magnetic recording media, magnetic recording sensors, mirrors, optical elements, micromechanical elements, or partially fabricated integrated circuits and any other objects to be processed. The substrate includes any shape including polygons and circles.

[0013] FIG. 1 is a plan view illustrating one embodiment of a substrate processing device. The substrate processing device (10) is configured as a semiconductor manufacturing device and, as shown in FIG. 1, has a housing (1) of approximately rectangular shape, and the interior of the housing (1) is divided into a load / unload unit (2), a polishing unit (3), and a cleaning unit (4) by partitions (1a, 1b). The load / unload unit (2), the polishing unit (3), and the cleaning unit (4) are each assembled independently and are exhausted independently. In addition, the substrate processing device (10) has a control device (900) that controls the substrate processing operation.

[0014] The load / unload unit (2) is equipped with two or more (four in this embodiment) front load sections (20) in which wafer cassettes stocking a plurality of substrates (wafers) are loaded. These front load sections (20) are arranged adjacent to the housing (1) and are arranged along the width direction (a direction perpendicular to the length direction) of the substrate processing device (10). The front load sections (20) are capable of mounting an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod).

[0015] Additionally, a driving mechanism (21) is installed along the arrangement of the front load section (20) in the load / unload unit (2), and two transport robots (loaders, transport mechanisms) (22) capable of moving along the arrangement direction of the wafer cassette are installed on the driving mechanism (21). The transport robots (22) are configured to access the wafer cassettes mounted on the front load section (20) by moving along the driving mechanism (21).

[0016] The polishing unit (3) is an area where polishing (flattening) of the substrate is performed, and is equipped with a first polishing unit (3A), a second polishing unit (3B), a third polishing unit (3C), and a fourth polishing unit (3D). These first polishing unit (3A), second polishing unit (3B), third polishing unit (3C), and fourth polishing unit (3D) are arranged along the longitudinal direction of the substrate processing device (10), as shown in FIG. 1.

[0017] As illustrated in FIG. 1, the first polishing unit (3A) comprises a polishing table (30A) having a polishing pad (100) having a polishing surface, a polishing head (31A) for holding and supporting a substrate and polishing the substrate while pressing it against the polishing pad (100) on the polishing table (30A), a polishing liquid supply device (32A) for supplying a polishing liquid or a dressing liquid (e.g., pure water) between the polishing pad (100) and the substrate, a dresser (33A) for dressing the polishing surface of the polishing pad (100), and an atomizer (34A) for spraying a mixed fluid of liquid (e.g., pure water) and gas (e.g., nitrogen gas) or liquid (e.g., pure water) into a mist state onto the polishing surface.

[0018] Likewise, the second polishing unit (3B) is equipped with a polishing table (30B), a polishing head (31B), a polishing liquid supply device (32B), a dresser (33B), and an atomizer (34B). The third polishing unit (3C) is equipped with a polishing table (30C), a polishing head (31C), a polishing liquid supply device (32C), a dresser (33C), and an atomizer (34C). The fourth polishing unit (3D) is equipped with a polishing table (30D), a polishing head (31D), a polishing liquid supply device (32D), a dresser (33D), and an atomizer (34D).

[0019] Next, a conveying mechanism for conveying a substrate is described. As shown in FIG. 1, a first linear transporter (6) is arranged adjacent to the first polishing unit (3A) and the second polishing unit (3B). This first linear transporter (6) is a mechanism for conveying a substrate between four conveying positions (in order from the load / unload unit side, first conveying position TP1, second conveying position TP2, third conveying position TP3, and fourth conveying position TP4) along the direction in which the polishing units (3A, 3B) are arranged.

[0020] Additionally, a second linear transporter (7) is positioned adjacent to the third polishing unit (3C) and the fourth polishing unit (3D). This second linear transporter (7) is a mechanism for transporting substrates between three transport positions (in order from the load / unload unit side, 5th transport position TP5, 6th transport position TP6, and 7th transport position TP7) along the direction in which the polishing units (3C, 3D) are arranged.

[0021] The substrate is transported to the polishing unit (3A, 3B) by the first linear transporter (6). The polishing head (31A) of the first polishing unit (3A) moves between the polishing position and the second transport position TP2 by a swinging motion. Accordingly, the transfer of the substrate to the polishing head (31A) is performed at the second transport position TP2.

[0022] Likewise, the polishing head (31B) of the second polishing unit (3B) moves between the polishing position and the third return position TP3, and the transfer of the substrate to the polishing head (31B) is performed at the third return position TP3. The polishing head (31C) of the third polishing unit (3C) moves between the polishing position and the sixth return position TP6, and the transfer of the substrate to the polishing head (31C) is performed at the sixth return position TP6. The polishing head (31D) of the fourth polishing unit (3D) moves between the polishing position and the seventh return position TP7, and the transfer of the substrate to the polishing head (31D) is performed at the seventh return position TP7.

[0023] At the first transfer position TP1, a lifter (11) is provided to receive a substrate from a transfer robot (22). The substrate is transferred from the transfer robot (22) to the first linear transporter (6) through this lifter (11). A shutter (not shown) is provided in the partition (1a) located between the lifter (11) and the transfer robot (22), so that when the substrate is transferred, the shutter is opened to transfer the substrate from the transfer robot (22) to the lifter (11).

[0024] A swing transporter (12) is positioned between the first linear transporter (6), the second linear transporter (7), and the cleaning unit (4). This swing transporter (12) has a hand that can move between the fourth transport position TP4 and the fifth transport position TP5, and the transfer of the substrate from the first linear transporter (6) to the second linear transporter (7) is performed by the swing transporter (12). The substrate is transported by the second linear transporter (7) to the third polishing unit (3C) and / or the fourth polishing unit (3D). Additionally, the substrate polished in the polishing unit (3) is transported to the cleaning unit (4) via the swing transporter (12).

[0025] The cleaning unit (4) is equipped with a first substrate cleaning device (190), a second substrate cleaning device (192), a substrate drying device (194), and a transport robot (191, 193) for transferring substrates between these devices. A substrate that has undergone polishing treatment in the polishing unit (3) is cleaned (first cleaning) in the first substrate cleaning device (190) and then further cleaned (finishing cleaning) in the second substrate cleaning device (192). After cleaning, the substrate is transferred from the second substrate cleaning device (192) to the substrate drying device (194) and spin-dried. After drying, the substrate is returned to the load / unload unit (2). Furthermore, as long as particle detection as described below can be performed in the following embodiments, the configuration of the substrate processing device (10) is not particularly limited.

[0026] FIG. 2 is a perspective view illustrating the schematic configuration of a polishing device according to the present embodiment. The polishing device (1000) may comprise at least one of the polishing units (3) described above. The polishing device (1000) and the polishing pad (100) constitute a polishing system (1100). The polishing device (1000) of the present embodiment is configured to perform polishing of a disc-shaped substrate (WF), such as a semiconductor wafer, as a polishing target using a polishing pad (100) having a polishing surface (102). As illustrated, the polishing device (1000) is provided with a polishing table (30) for supporting the disc-shaped polishing pad (100) and a polishing head (31) for holding and supporting the substrate (WF) and pressing it against the polishing surface (102) of the polishing pad (100). The polishing device (1000) performs polishing of the substrate (WF) by bringing the polishing pad (100) and the substrate (WF) into contact in the presence of a polishing liquid. Additionally, the polishing device (1000) is equipped with a movable member (60), the polishing liquid supply device (32) described above, a dresser, and an atomizer (omitted in FIG. 3). The movable member (60) is configured to be movable by a driving mechanism (68) and is driven so as not to come into contact with the polishing head (31) and the polishing liquid supply device (32). As described below, the movable member (60) may be a dresser or a member other than the dresser. The driving mechanism (68) may be equipped with a rotary mechanism including a motor or a linear actuator, etc.

[0027] The polishing device (1000) is equipped with a control device (900) for controlling each part of the polishing device (1000), such as a particle detection system described later. The control device (900) is equipped with at least one information processing device, such as a general computer or a dedicated computer. At least some of the data processed by the control device (900) may be stored on a remote server, etc. The control device (900) is equipped with an arithmetic unit (910), a memory (920), and a storage device (930). The arithmetic unit (910) is equipped with a processor, such as a central processing unit (CPU). The storage device (930) is equipped with a non-volatile storage medium, such as a solid-state drive, and may store a program for controlling the particle detection system, etc. This program may be obtained from a recording medium such as a DVD-ROM, or may be obtained through a network. The arithmetic unit (910) performs various processing by reading a program stored in a memory unit (930), etc., into memory (920) and executing it. Additionally, if control by the control unit (900) is possible, the physical configuration of the control unit (900) is not particularly limited.

[0028] The polishing table (30) is formed in the shape of a disc and is configured to be rotatable with its central axis as the rotation axis. A polishing pad (100) is installed on the polishing table (30) by means of attachment or the like. The surface of the polishing pad (100) forms a polishing surface (102). The polishing pad (100) rotates integrally with the polishing table (30) as the polishing table (30) rotates by means of a motor not shown. In this way, the polishing device (1000) is configured to perform polishing of the substrate (WF) by bringing the polishing pad (100) and the substrate (WF) into contact and rotating them relative to each other in the presence of a polishing liquid. Furthermore, the polishing table (30) is not limited to the shape of a disc and may be, for example, rectangular in shape. In this case, the polishing pad (100) wound in a roll shape may be configured to be sent to the polishing table (30).

[0029] The polishing head (31) holds and supports the substrate (WF) on its underside by means of vacuum suction or the like. The polishing head (31) is configured to rotate together with the substrate (WF) by power from a motor not shown. The upper part of the polishing head (31) is connected to the support arm (37) via a shaft (36). The polishing head (31) can move up and down by motor drive through an air cylinder or ball screw not shown, thereby allowing the distance from the polishing table (30) to be adjusted. By doing so, the polishing head (31) can press the held and supported substrate (WF) against the polishing surface (102). Additionally, the polishing head (31) has an airbag divided into multiple regions inside (not shown), and pressurizes the substrate (WF) from the back by supplying fluid pressure, such as air, to each airbag region. Additionally, the support arm (37) is configured to pivot by a motor not shown and moves the polishing head (31) in a direction parallel to the polishing surface (102). In this embodiment, the polishing head (31) is configured to be movable at the receiving position of the substrate and at the upper position of the polishing pad (100), and is also configured to be changeable at the pressing position of the substrate (WF) relative to the polishing pad (100).

[0030] As illustrated in FIG. 2, in this embodiment, a polishing pad (100) has a pad opening (101) formed therein that opens to a polishing surface (102). A polishing table (30) has a chamber (200) that communicates with the pad opening (101). The polishing table (30) is configured so that a polishing liquid placed on the polishing pad (100) is introduced into the chamber (200) through the pad opening (101).

[0031] FIG. 3 is a schematic cross-sectional view illustrating a particle detection system according to the present embodiment. FIG. 3 corresponds to a cross-sectional view of a polishing device (1000) perpendicular to a polishing surface (102). Each subsequent cross-sectional view also shows a cross-section of a polishing device perpendicular to a polishing surface (102). The polishing device (1000) is equipped with a particle detection system (700), and the particle detection system (700) is equipped with a measuring part (70) and a chamber (200) in which a polishing liquid is received. In the present embodiment, the polishing pad (100) is equipped with a through hole (110) that penetrates from the polishing surface (102) to the opposite side of the polishing surface (102) through a pad opening (101). The polishing table (30) is equipped with a pad placement surface (302) on which the polishing pad (100) is placed and an upper member (300) that defines the pad placement surface (302). A table opening (301) is formed in the pad placement surface (302). The table opening (301) is fluidly connected to a room (200) located below the polishing surface (102), in other words, on the side opposite to where the polishing pad (100) is located with respect to the table opening (301). When polishing the substrate (WF), the polishing pad (100) is placed on the polishing table (30) so that the pad opening (101) is fluidly connected to the room (200) through the through hole (110). In other words, the polishing pad (100) is placed so that the pad opening (101) and the table opening (301) are connected to each other, or so that the pad opening (101) and the table opening (301) overlap along the pad placement surface (302).

[0032] The measuring unit (70) is configured to acquire a signal regarding the size of particles contained in the polishing liquid contained in the room (200) by measurement. In this embodiment, as described below, it is determined whether the polishing liquid contains particles that scratch the substrate (WF). The type of particles is not particularly limited and may be aggregates of abrasive particles, fragments of the substrate (WF) or polishing pad (100), or foreign matter mixed in. The method of measuring particle size is not particularly limited and can be performed by laser diffraction / scattering, dynamic light scattering, ultrasonic attenuation, zeta potential measurement, spectroscopic measurement, or by the analysis of an image obtained by capturing the polishing liquid. In the polishing liquid, it is preferable to perform the measurement by dynamic light scattering in order to detect particles of a size that scratch the substrate (WF) with high precision. In addition, any two or more of these measurement methods may be combined. For example, measurements may be taken for a wider range of particle sizes by performing both laser diffraction and scattering methods and dynamic light scattering methods. Alternatively, multiple types of measurements may be performed, and when it is determined that the polishing liquid does not contain particles that scratch the substrate (WF) for all measurements, it may be considered as a final determination that the polishing liquid does not contain particles that scratch the substrate (WF).

[0033] As illustrated in FIG. 3, the measuring unit (70) may be equipped with an irradiation device (71) and a detector (72). Depending on the measurement method, the irradiation device (71) may include a laser light source, a visible light source, or an ultrasonic source such as a transducer. Depending on the measurement method, the detector (72) may include a photodetector including a photomultiplier tube or a photodiode, or an ultrasonic detector such as a transducer. Hereinafter, the detection of a signal regarding at least one of the size, shape, dispersibility, and optical characteristics of a particle from a polishing liquid by the detector (72) is referred to as particle detection. In this embodiment, the detector (72) detects a signal regarding the size of a particle from a polishing liquid. A signal regarding the size of a particle is a signal from which particle data indicating the size of a particle can be obtained by interpreting the signal. The signal regarding the particle size is, for example, light in optical measurement, sound waves in ultrasonic attenuation method, and visible light when analyzing the polishing liquid image. Particle data may include, for example, the particle diameter and the amount of particles having said particle diameter. The irradiation device (71) is configured to irradiate electromagnetic waves or ultrasound onto the polishing liquid (L1) for particle detection.

[0034] In this embodiment, the irradiation device (71) and the detector (72) are located below the pad placement surface (302). As a result, since the irradiation device (71) and the detector (72) are not located in the upper region of the polishing surface (102), more members can be placed in that region. Additionally, the detector (72) is configured to detect a signal regarding the size of particles from the polishing liquid (L1) located in the room (200) connected to the pad opening (101). With this configuration, the polishing liquid (L1) can be introduced into the room (200) more reliably using gravity. Furthermore, particle detection can be performed quickly on the polishing liquid (L1) placed on the polishing surface (102), and particle detection can be performed more efficiently, or more precisely by suppressing changes in the state of the polishing liquid (L1). In addition, since the room (200) extends downward from the table opening (301), the adverse effect on particle detection caused by thickness variation due to other polishing pads (100) can be reduced compared to the case where the polishing liquid (L1) is placed only on the polishing pad (100) described later. In addition, it becomes easier to adjust polishing conditions, such as blocking light from the outside of the polishing device (1000). In addition, detection can be performed more precisely compared to the case where ultrasonic waves are irradiated onto the wafer polishing surface on the wafer as in Patent Document 1.

[0035] FIG. 4 is a cross-sectional view schematically illustrating a particle detection system (700) when particle detection is being performed. The detector (72) of the present embodiment detects a signal regarding the size of a particle from a polishing liquid (L1) located in a room (200). The room (200) functions as a polishing liquid receiving section that receives the polishing liquid (L1) for particle detection. The room (200) may be a measuring cell. The room (200) is composed of a light-transmitting wall or has a light-transmitting window (not illustrated), so that light emitted from the irradiation device (71) is incident on the polishing liquid (L1) inside the room (200). The light incident on the polishing liquid (L1) is scattered or reflected by a particle (P1) in the polishing liquid (L1), or passes through the polishing liquid (L1) and is incident on the detector (72). The detection signal obtained by detecting the size of the particle (P1) by the detector (72) is appropriately converted into analog / data (A / D) and output to the control device (900), or is interpreted by the detector (72) and the obtained particle data is output to the control device (900), etc. In the illustrated example, the liquid surface S1 of the polishing liquid (L1) is located at the same height as the polishing pad (100), but as long as particle detection can be performed with the desired precision, the amount of polishing liquid (L1) introduced into the room (200) is not particularly limited. When particle detection is performed during polishing, in order to suppress uneven polishing, it is preferable that the liquid surface S1 be flat with the polishing surface (102) or near the polishing surface (102). Additionally, FIG. 3 shows a transmissive arrangement in which the irradiation device (71) and the detector (72) are on opposite sides with the room (200) in between, but the irradiation device (71) and the detector (72) may be integrated or on the same side. Also, depending on the measurement method, a lateral detector may be arranged to capture scattered or reflected light at any angle.In this way, the detector (72) can detect electromagnetic waves or ultrasonic waves that are irradiated from the irradiation device (71) and pass through the polishing liquid (L1), or electromagnetic waves or ultrasonic waves generated by scattering or reflection of the irradiated electromagnetic waves or ultrasonic waves in the polishing liquid (L1).

[0036] As illustrated in FIG. 4, the particle detection system (700) may be equipped with a movable member (60). The movable member (60) is configured to be movable between the upper portion of the polishing surface (102) and the retraction position on the side of the polishing table (30). In this embodiment, the movable member (60) comprises a movable member body (61) and a light-blocking member (62). The light-blocking member (62) is a member that absorbs or reflects light, such as a light-blocking plate. As described above, the movable member (60) may be a dresser, and in this case, more members can be placed in the area above the polishing surface (102) as the number of members in that area is reduced. The control device (900) may stop the rotation of the polishing table (30) when performing particle detection and move the movable member (60) to cover the pad opening (101) with the movable member (60). In this way, the movable member (60) may be a shutter for blocking light from the pad opening (101). By doing so, noise in particle detection can be reduced, and particle detection can be performed more accurately. Alternatively, the movable member (60) may selectively introduce polishing liquid (L1) from the pad opening (101) into the room (200), etc., or adjust the amount of polishing liquid (L1) introduced. In this way, the movable member (60) may be a shutter for preventing the inflow of polishing liquid (L1) from the pad opening (101). The shape of the movable member (60) and the material of the light-blocking member (62) are not particularly limited as long as particle detection can be performed with the desired precision, and for example, the movable member (60) may have a shape such as a cover.

[0037] Additionally, when using a measurement method other than optical measurement, or when the light from the pad opening (101) is weak enough to detect particles with desired precision, the particle detection system (700) does not need to be equipped with a movable member (60). This configuration is suitable for detecting particles while polishing the substrate (WF).

[0038] As illustrated in FIGS. 3 and 4, the particle detection system (700) may be equipped with a pump (90). The pump (90) is connected to the room (200) so as to be suctionable. By suctioning with the pump (90), the introduction of polishing liquid (L1) from the polishing surface (102) into the room (200) and the discharge of polishing liquid (L1) from the room (200) can be promoted, thereby enabling more reliable particle detection. Additionally, if the polishing liquid (L1) can be introduced into the room (200) by gravity or the action of the polishing head (31) crossing the pad opening (101), the particle detection system (700) may not be equipped with a pump (90).

[0039] FIG. 5a is a plan view schematically illustrating an example of the shape of a pad opening (101). As shown in FIG. 5a, the pad opening (101) preferably has a circular shape. Additionally, the through hole (110) (Fig. 3) preferably has a circular cross-section perpendicular to the flow path. With such a configuration, when compared with the same cross-sectional area, the length or area in which the polishing liquid (L1) contacts the pad opening (101) or the through hole (110) is smaller, thereby reducing the resistance when the polishing liquid (L1) flows. From the perspective of making it easier to introduce the polishing liquid (L1), the diameter (D10) of the pad opening (101) is preferably 1 mm or more. Since there is a concern that if the pad opening (101) is excessively large, it may adversely affect polishing efficiency or uniformity, the diameter (D10) of the pad opening (101) is preferably 10 mm or less. As such, the polishing system (1100) (Fig. 1) of the present embodiment is equipped with a polishing device (1000) and a polishing pad (100), and the diameter (D10) of the polishing pad (100) is preferably 1 mm or more and 10 mm or less.

[0040] FIG. 5b is a plan view schematically illustrating another example of the shape of the pad opening (101). As shown in FIG. 5b, the pad opening (101) may have an elliptical shape. The shape of the pad opening (101) is not particularly limited as long as the polishing liquid (L1) can be introduced into the room (200) through the pad opening (101). From the perspective of making it easier to introduce the polishing liquid (L1), the minimum diameter (D11) of the pad opening (101) is preferably 1 mm or more. Since there is a concern that if the pad opening (101) is excessively large, it may adversely affect polishing efficiency or uniformity, the maximum diameter (D12) of the pad opening (101) is preferably 10 mm or less.

[0041] FIG. 6a is a plan view schematically illustrating an example of the shape of a table opening (301). As shown in FIG. 6a, the table opening (301) preferably has a circular shape. Accordingly, when compared with the same cross-sectional area, the contact length of the polishing liquid (L1) is small, thereby reducing the resistance when the polishing liquid (L1) flows. From the perspective of making it easier to introduce the polishing liquid (L1), the diameter (D30) of the table opening (301) is preferably 1 mm or more. Since there is a risk that if the table opening (301) is excessively large, it may adversely affect polishing efficiency or uniformity, the diameter (D30) of the table opening (301) is preferably 10 mm or less.

[0042] FIG. 6b is a plan view schematically illustrating another example of the shape of the table opening (301). As shown in FIG. 6b, the table opening (301) may have an elliptical shape. The shape of the table opening (301) is not particularly limited as long as the polishing liquid (L1) can be introduced into the room (200) through the table opening (301). From the perspective of making it easier to introduce the polishing liquid (L1), the minimum diameter (D31) of the table opening (301) is preferably 1 mm or more. Since there is a concern that if the table opening (301) is excessively large, it may adversely affect polishing efficiency or uniformity, the maximum diameter (D32) of the table opening (301) is preferably 10 mm or less.

[0043] In FIG. 3, the through hole (110) of the polishing pad (100) and the part of the polishing table (30) connecting the through hole (110) and the room (200) are in the shape of a truncated cone that tapers upward or toward the side where the polishing pad (100) is placed, but are not limited to this, and may be cylindrical, or may be in the shape of a truncated cone that tapers downward or toward the room (200).

[0044] As illustrated in FIG. 2, the pad opening (101) is preferably positioned so that when a substrate (WF) contacts the polishing surface (102) of the polishing pad (100) and polishing is performed, the substrate (WF) covers the pad opening (101) at least temporarily, or the pad opening (101) passes under the substrate (WF). In other words, it is preferable that the polishing pad (100) be positioned on the pad placement surface (302) so that the pad opening (101) is positioned in such a location. By doing so, polishing debris generated by polishing the substrate (WF) can be efficiently detected. In the same regard, it is preferable that the table opening (301) be positioned so that, in the polishing table (30), when the substrate (WF) is in contact with the polishing surface (102) and polishing is performed, the substrate (WF) covers the table opening (301) at least temporarily, or the table opening (301) passes under the substrate (WF).

[0045] The control device (900) (Fig. 2) is configured to determine whether the polishing liquid (L1) on which particle detection is performed contains particles that scratch the substrate (WF) based on particle data obtained from particle detection. This determination is referred to as particle determination. In particle determination, the determination is made based on particle data and correspondence relationship information. Correspondence relationship information is information indicating a correspondence relationship between at least one of the size, shape, dispersibility, and optical characteristics of the particles (P1) of the polishing liquid (L1) and whether the particles (P1) are particles that scratch the substrate (WF). In the present embodiment, the correspondence relationship information is information indicating a correspondence relationship between the size of the particles (P1) of the polishing liquid (L1) and whether the particles (P1) are particles that scratch the substrate (WF). The correspondence relationship information may include only a threshold, or the threshold may be correlated with various polishing conditions or types of polishing liquids. The corresponding relationship information may be stored in advance in a memory device (930) or may be obtained by communication from a remote server, etc. In this way, the control device (900) may be a determination device for determining the state of the polishing liquid (L1) in the polishing device (1000).

[0046] The control device (900) acquires particle data. The control device (900) receives a detection signal obtained from the detection of a signal regarding the size of a particle (P1) by the detector (72), and generates particle data indicating the size of the particle (P1) contained in the polishing liquid (L1) by an algorithm according to the measurement method. Alternatively, the control device (900) receives particle data generated by the detector (72).

[0047] In particle determination, it may be determined whether the polishing liquid (L1) contains particles that scratch the substrate (WF) based on the size of the particles (P1) indicated by the particle data and the threshold included in the corresponding relationship information. For example, the particle data may include particle size distribution data indicating the amount of particles (P1) of a predetermined size included in the polishing liquid (L1). In the particle size distribution data, bins may be set for each particle diameter within a certain range, and the numerical value of the particle diameter corresponding to the bin may be related to the amount or ratio of particles (P1) of the particle diameter within the range of the bin. If the corresponding relationship information includes only a threshold, the control device (900) may determine, based on the particle data, that the polishing liquid (L1) contains particles that scratch the substrate (WF) when the polishing liquid (L1) contains particles (P1) of a particle diameter greater than or equal to the threshold at a predetermined ratio. The numerical value of this predetermined ratio may be included in the corresponding relationship information. The control device (900) may determine, based on particle data, that the polishing liquid (L1) does not contain particles (P1) with a particle diameter greater than or equal to a given threshold in a predetermined ratio, when the polishing liquid (L1) contains only particles (P1) with a particle diameter greater than or equal to a given threshold. Alternatively, the particle data may include statistical values ​​indicating the size of the particles (P1), such as the arithmetic mean of the particle diameters of the particles (P1) contained in the polishing liquid (L1). Such statistical values ​​may be selected to be suitable depending on the measurement method. In this case, the control device (900) may determine that the polishing liquid (L1) contains particles that cause scratches on the substrate (WF) if the statistical value is greater than or equal to the threshold included in the corresponding relationship information, and may determine that the polishing liquid (L1) does not contain particles that cause scratches on the substrate (WF) if the statistical value is less than the given threshold.

[0048] When the control device (900) determines, by particle determination, that the polishing liquid (L1) contains particles that scratch the substrate (WF), it may perform at least one of cleaning the polishing surface (102) and displaying a warning on a display device not shown. In cleaning the polishing surface (102), the polishing surface (102) may be dressed, for example, by a dresser. When it is determined, by particle determination during polishing, that the polishing liquid (L1) contains particles that scratch the substrate (WF), the control device (900) preferably stops polishing. When polishing is not being performed, if it is determined by particle determination that the polishing liquid (L1) contains particles that scratch the substrate (WF), the execution of polishing may not be permitted. In the warning, text or shapes may be used to indicate that there is a problem with the polishing fluid (L1), recommend inspecting the flow path of the polishing fluid supply device (32), and recommend replacing the polishing pad (100). Additionally, the warning may be given verbally.

[0049] In this way, in the present embodiment, the control device (900) is configured to perform at least one of warning, stopping polishing, and cleaning of the polishing surface (102) when it is determined by particle determination that the polishing liquid (L1) for which particle detection has been performed contains particles that scratch the substrate (WF). By doing so, scratching the substrate (WF) or performing polishing different from what was intended can be prevented.

[0050] When the control device (900) determines that the polishing liquid (L1) contains particles that scratch the substrate (WF), it may determine whether to perform cleaning of the polishing surface (102) based on particle data and corresponding relationship information. In this case, if the degree of abnormality of the polishing liquid (L1) is so great that it cannot be restored by cleaning the polishing surface (102) such as dressing, the control device (900) may not perform cleaning of the polishing surface (102) and may only perform a warning light. For example, the corresponding relationship information may include a first threshold and a second threshold greater than the first threshold. If a statistical value indicating the size of the particles, such as the average value of the particle diameter included in the particle data, is smaller than the first threshold, the control device (900) may determine that the polishing liquid (L1) does not contain particles that scratch the substrate (WF). If the statistical value is greater than the first threshold and less than the second threshold, the control device (900) may determine that the polishing liquid (L1) contains particles that scratch the substrate (WF) and may start cleaning the polishing surface (102). If the statistical value is greater than the second threshold, the control device (900) may determine that the polishing liquid (L1) contains particles that scratch the substrate (WF) and may not clean the polishing surface (102) and may display a warning or the like. In addition, the determination using corresponding relationship information is not limited to the method described above, and the threshold may be different depending on, for example, polishing conditions. In addition, the control device (900) may set the cleaning conditions of the polishing surface (102) based on particle data and corresponding relationship information. For example, the control device (900) can increase the dressing time or the amount of liquid used during dressing based on the threshold, etc. included in the corresponding relationship information, when the degree of abnormality of the polishing liquid (L1) is large.

[0051] The control device (900) can detect particles and determine particles when the polishing liquid (L1) is supplied to the polishing pad (100). By doing so, the condition of the supplied polishing liquid (L1) can be determined with high precision. The control device (900) may also detect particles and determine particles while polishing is being performed. By doing so, if the condition of the polishing liquid (L1) or the polishing pad (100) deteriorates during polishing, the deterioration can be detected, thereby preventing scratches on the substrate (WF) or polishing that is different from what was intended. Alternatively, the control device (900) may detect particles and determine particles when the polishing liquid (L1) remains on the polishing pad after polishing is finished. By doing so, cleaning of the polishing surface (102) or replacement of the polishing pad (100) is performed before resuming polishing, thereby preventing scratches on the substrate (WF) or polishing different from the intended state during the resumed polishing.

[0052] As described above, particle detection and acquisition of particle data are performed by at least one of the following: laser diffraction and scattering method, dynamic light scattering method, ultrasonic attenuation method, zeta potential measurement, spectroscopic measurement, and analysis of an image obtained by capturing the polishing liquid (L1). By utilizing the characteristics of each measurement method, it is possible to detect particles that scratch the substrate (WF) in the polishing liquid (L1) more reliably.

[0053] FIG. 7 is a flowchart illustrating the flow of a polishing method according to the present embodiment. This polishing method can be executed by a computing device (910), etc., of a control device (900). In step S101, the control device (900) controls a polishing table (30), a polishing head (31), and a polishing liquid supply device (32), etc., to perform polishing of a substrate (WF). After step S201, step S202 is performed. In step S202, the control device (900) determines whether the conditions for performing particle detection are satisfied. For example, the control device (900) may perform particle detection when polishing a predetermined number of substrates (WF). This predetermined number is not particularly limited, but can be, for example, 100 sheets. If the control device (900) determines that the conditions for performing particle detection are satisfied, step S203 is initiated. The control device (900) initiates step S201 when it determines that the condition for performing particle detection is not satisfied.

[0054] In step S203, the control device (900) prepares for particle detection. For example, the control device (900) introduces polishing liquid (L1) into the room (200) by suctioning with the pump (90) as needed. When particle detection is performed by covering the pad opening (101) with the movable member (60), the control device (900) stops the rotation of the polishing table (30) and controls the movable member (60) to cover the pad opening (101). After step S203, step S204 is performed. In step S204, the control device (900) controls the measuring unit (70) to perform particle detection. After step S204, step S205 is performed.

[0055] In step S205, the control device (900) performs a determination (particle determination) as to whether the polishing liquid (L1) contains particles that scratch the substrate (WF). If the control device (900) determines in the particle determination that the polishing liquid (L1) contains particles that scratch the substrate (WF), it initiates step S206. In this case, if the particle determination is performed during polishing, the polishing is stopped. If the control device (900) determines in the particle determination that the polishing liquid (L1) does not contain particles that scratch the substrate (WF), it initiates step S201.

[0056] In step S206, the control device (900) determines whether to clean the polished surface (102). The control device (900) may make this determination based on particle data and corresponding relationship information as described above, or may make this determination based on user input. If the control device (900) cleans the polished surface (102), it initiates step S207. If the control device (900) does not clean the polished surface (102), it initiates step S208.

[0057] In step S207, the control device (900) cleans the polishing surface (102). The control device (900) can control the dresser to perform dressing of the polishing surface (102). After step S207, step S203 is performed. In step S208, the control device (900) issues a warning. After the warning, the user of the polishing device (1000) investigates the cause of the abnormality of the polishing liquid (L1) or replaces consumables.

[0058] In the polishing method of the present embodiment, the polishing device (1000) detects a signal (particle detection) regarding the size of a particle (P1) from a polishing liquid (L1) located in a room (200) connected to a pad opening (101), and determines whether the polishing liquid (L1) for which particle detection was performed contains a particle that scratches the substrate (WF) based on particle data indicating the size of the particle (P1) obtained based on the signal detected by the detector (72), and correspondence information indicating the correspondence between the size of the particle (P1) of the polishing liquid (L1) and whether the particle is a particle that scratches the substrate (WF). By doing so, regarding the polishing liquid (L1) after being placed on the polishing surface (102), the state of the polishing liquid (L1) can be evaluated more efficiently or more precisely while suppressing changes in the state of the polishing liquid (L1).

[0059] Variant Example 1

[0060] FIG. 8 is a schematic diagram illustrating a particle detection system (700A) according to the present modification. The particle detection system (700A) according to the present modification has a configuration roughly similar to that of the particle detection system (700) according to the above-described embodiment, but differs in that it is provided with a pipe (91) between the table opening (301) and the room (200). The pipe (91) defines a flow path (92) passing through its interior. The flow path (92) fluidly connects the table opening (301) and the room (200). The polishing pad (100) is arranged so that the through hole (110) fluidly connects with the flow path (92). In other words, the polishing pad (100) is arranged so that the through hole (110) and the flow path (92) overlap along the pad placement surface (302). The polishing liquid (L1) on the polishing surface (102) is introduced into the room (200) through the through hole (110) and the flow path (92), and particle detection is performed on the introduced polishing liquid (L1). It is preferable that the introduction of the polishing liquid (L1) into the room (200) be facilitated by suction by the pump (90). In this modified example, the measuring unit (70) and the room (200) may be located within the polishing table (30). In this modified example as well, the particle detection system (700) may be provided with a movable member (60). However, in this modified example, it may be difficult for light from the pad opening (101) to reach the position of the polishing liquid (L1) when particle detection is performed. In this case, the particle detection system (700A) may not be provided with a movable member (60) covering the pad opening (101).

[0061] In this modified example, the polishing device (1000) is provided with a fluid passage (92) that fluidly connects the table opening (301) and the room (200). By doing so, it is possible to make it difficult for light from the pad opening (101) to reach the room (200), thereby allowing for precise particle detection by optical measurement without covering the pad opening (101). Additionally, since the measuring unit (70) and the room (200) can be positioned at various locations, the degree of freedom during design can be increased. Furthermore, the polishing device (1000) of this modified example is provided with a pump (90) connected to the fluid passage (92) or the room (200) so as to be able to suck the fluid passage (92). By doing so, the polishing liquid (L1) can be moved more reliably to the room (200), which is the detection location.

[0062] Additionally, the particle detection system (700A) may not be provided with a room (200), and may perform particle detection on the polishing liquid (L1) located in the flow path (92) by installing a measuring part (70) around a pipe (91) that defines a flow path (92) that is in fluid communication with the table opening (301). By doing so, the particle detection system (700A) can be configured more compactly, and the degree of freedom in design can be increased. The polishing device (1000) may be configured to have at least one of the above-described flow path (92) and room (200).

[0063] Variant Example 2-1

[0064] FIG. 9 is a cross-sectional view of a polishing table (30) schematically illustrating a particle detection system (700B) according to the present modification example. The particle detection system (700B) according to the present modification example differs from the particle detection system (700) of the above-described embodiment in that it has a table window (320) instead of the table opening (301) described above, and a measuring part (70) is arranged so as to detect particles in the polishing liquid (L1) located between the table window (320) and the pad opening (101).

[0065] In the upper member (300) of the polishing table (30), a table window portion (320) is formed to define the pad placement surface (302) of the polishing table (30). It is preferable that an irradiation device (71) and a detector (72) be placed on the side opposite to the side where the polishing pad (100) is placed in the table window portion (320). In other words, it is preferable that the irradiation device (71) and the detector (72) be located below the table window portion (320). In this modified example, particle detection is performed on the polishing liquid (L1) located in the through hole (110) of the polishing pad (100). The irradiation device (71) is configured to irradiate electromagnetic waves or ultrasonic waves onto the polishing liquid (L1) through the table window portion (320). The detector (72) is configured to detect signals such as electromagnetic waves or ultrasonic waves from the polishing liquid (L1) that have passed through the table window portion (320). Additionally, the table window portion (320) may be positioned at a downward offset from the pad placement surface (302). In the case of this modified example, since reflected light from the light-blocking member (62) may affect the precision of particle detection, it is desirable to appropriately select a light-blocking member (62) with high light absorption properties, depending on the measurement method.

[0066] The polishing method of the present variation is performed as follows. A polishing pad (100) is placed on a polishing table (30) such that the table window (320) and the pad opening (101) overlap along the pad placement surface (302). Then, by gravity or the action of a polishing head (31) moving along the polishing surface (102), a polishing liquid (L1) is introduced into the through hole (110), and the pad opening (101) is covered by an appropriately movable member (60), and particle detection is performed on the polishing liquid (L1) introduced into the through hole (110). In the present variation, the detector (72) is configured to detect a signal regarding the size of the particle (P1) from the polishing liquid (L1) located in the through hole (110) formed in the polishing pad (100). By doing so, the reduction of polishing efficiency or uniformity caused by the table opening (301) can be suppressed. Additionally, the polishing device (1000) may additionally be equipped with an unillustrated film thickness measuring device including an optical sensor or an eddy current sensor, and said film thickness measuring device may be positioned below the table window portion (320).

[0067] Variant Example 2-2

[0068] FIG. 10 is a cross-sectional view schematically illustrating a particle detection system (700C) according to the present modification example. The particle detection system (700C) according to the present modification example is different from the particle detection system (700B) of the above-described modification example 2-1 in that it is equipped with a movable member (60A) instead of a movable member (60) and an irradiation device (71A) instead of an irradiation device (71). The movable member (60A) is equipped with an irradiation device (71A), and the irradiation device (71A) is configured to irradiate electromagnetic waves, etc., onto a polishing liquid (L1) placed between the table window portion (320) and the pad opening (101). Signals such as electromagnetic waves from the polishing liquid (L1) are detected by a detector (72) placed below the table window portion (320).

[0069] In this modified example, the movable member (60A) is equipped with an irradiation device (71A) that irradiates electromagnetic waves or ultrasound into the polishing liquid (L1) for particle detection. This makes maintenance of the irradiation device (71A) easier. In addition, even when a plurality of pad openings (101) are formed on the polishing surface (102), particle detection can be performed on the polishing liquid (L1) introduced from all pad openings (101) by a smaller number of, for example, one irradiation device (71A).

[0070] Variation Example 2-3

[0071] FIG. 11 is a cross-sectional view schematically illustrating a particle detection system (700D) according to the present modification example. The particle detection system (700D) according to the present modification example is different from the particle detection system (700B) of the above-described modification example 2-1 in that it is equipped with a movable member (60B) instead of a movable member (60) and a detector (72A) instead of a detector (72). The movable member (60B) is equipped with a detector (72A), and the detector (72A) is configured to detect signals such as electromagnetic waves from a polishing liquid (L1) placed between the table window portion (320) and the pad opening (101). Electromagnetic waves such as those from an irradiation device (71) placed below the table window portion (320) are irradiated onto the polishing liquid (L1).

[0072] In this modified example, the movable member (60A) is equipped with a detector (72A) that detects a signal regarding the size of a particle (P1) from the polishing liquid (L1). This makes maintenance of the detector (72A) easier. In addition, even when a plurality of pad openings (101) are formed on the polishing surface (102), particle detection can be performed on the polishing liquid (L1) introduced from all pad openings (101) by a smaller number of detectors, for example, one detector (72A).

[0073] Variation Example 2-4

[0074] FIG. 12 is a cross-sectional view schematically illustrating a particle detection system (700E) according to the present modification example. The particle detection system (700E) according to the present modification example is different from the particle detection system (700B) of the above-described modification example 2-1 in that it is equipped with a movable member (60C) instead of a movable member (60), and with an irradiation device (71A) and a detector (72A) respectively instead of an irradiation device (71) and a detector (72). The movable member (60C) is equipped with an irradiation device (71A) and a detector (72A). The irradiation device (71A) is configured to irradiate electromagnetic waves, etc., onto a polishing liquid (L1) placed between the table window portion (320) and the pad opening (101), and the detector (72A) is configured to detect a signal of electromagnetic waves, etc., from the polishing liquid (L1). It is preferable that the polishing table (30) be equipped with a light-blocking member (620) that defines the side on which the polishing pad (100) is placed. It is preferable that the light-blocking member (620) be appropriately selected to have high light absorption properties to suppress the influence of reflected light, etc., depending on the measurement method.

[0075] In this modified example, the movable member (60C) is equipped with an irradiation device (71A) that irradiates electromagnetic waves or ultrasound into the polishing liquid (L1) for particle detection, and a detector (72A) that detects a signal regarding the size of the particle (P1) from the polishing liquid (L1). Accordingly, particle detection can be made possible by installing the movable member (60) on the polishing device (1000) without having a measuring unit (70) or the like on the polishing table (30).

[0076] Variation Example 3-1

[0077] FIG. 13 is a cross-sectional view schematically illustrating a particle detection system (700F) of the present variation. The particle detection system (700F) of the present variation comprises a measuring part (70) positioned below a table opening (301) and a movable member (60D). The movable member (60D) comprises a movable member body (61), a recess (63), a light-blocking member (62), a pump (90A), and a flow path (92A and 92B). The pump (90A) is fluidly connected to the recess (63) so as to be suctioned through the flow path (92A). The Euro (92B) is configured to fluidly connect the concave portion (63) and the opening (93) formed on the outer surface of the movable member (60D), and to allow the polishing liquid (L1) to be sucked from the opening (93) to the concave portion (63) by the pump (90A) when the movable member (60D) is placed on the polishing surface (102). The opening (93) is formed at a position lower than the liquid level of the polishing liquid (L1) on the polishing surface (102) as is typically assumed. The polishing pad (100A) is provided with a pad window portion (120) that penetrates the sheet-shaped polishing pad (100A) in the thickness direction.

[0078] The concave portion (63) functions as a polishing liquid receiving portion for receiving polishing liquid (L1) for particle detection. In the illustrated example, the concave portion (63) is formed on the bottom surface of the movable member (60D) and is defined by the movable member body (61). A polishing pad (100A) is placed on the pad placement surface (302) so that the table opening (301) and the pad window portion (120) overlap along the pad placement surface (302). Under the control of the control device (900), a movable member (60D) is placed on the polishing surface (102) so that the concave portion (63) and the pad window portion (120) overlap along the polishing surface (102). By the suction of the pump (90), the polishing liquid (L1) on the polishing surface (102) is introduced into the area enclosed by the concave portion (63) and the polishing surface (102), and particle detection is performed on the introduced polishing liquid (L1). In particle detection, electromagnetic waves emitted by the irradiation device (71) are incident on the polishing liquid (L1) within the concave portion (63) through the pad window portion (120). The signal of electromagnetic waves from the polishing liquid (L1) within the concave portion (63) is detected by the detector (72) through the pad window portion (120). The movable member (60D) may be provided with a chamber that receives the polishing liquid (L1) instead of the concave portion (63), and in this case, the chamber is configured so that electromagnetic waves can be incident or emitted through the window portion.

[0079] The movable member (60D) according to the present modification example is equipped with a concave portion (63) and a pump (90A) for introducing polishing liquid (L1) into the concave portion (63). By doing so, it is easy to discharge the polishing liquid (L1) after particle detection. The polishing device (1000) of the present modification example is equipped with a detector (72) that detects a signal regarding the size of the particle (P1) from the polishing liquid (L1) located on the polishing surface (102). By doing so, when collecting the polishing liquid (L1), the concern that the state of the polishing liquid (L1) may change and thus prevent accurate detection can be suppressed.

[0080] Variation Example 3-2

[0081] FIG. 14 is a cross-sectional view schematically illustrating a particle detection system (700G) according to the present modification example. The particle detection system (700G) according to the present modification example has a configuration roughly similar to the particle detection system (700F) of the above modification example, but differs from the particle detection system (700F) in that the polishing table (30) is provided with a table window (320) on the side where the polishing pad (100) of the polishing table (30) is placed. In the present modification example, a polishing pad (100) having a pad opening (101) may be placed on the pad placement surface (302). In this case, the polishing pad (100) is placed on the pad placement surface (302) such that the pad opening (101) and the table window (320) overlap along the pad placement surface (302). A movable member (60D) is positioned on the polishing surface (102) so that the pad opening (101) and the concave portion (63) overlap along the polishing surface (102). The polishing liquid (L1) is introduced by a pump (90A) into an area including the concave portion (63) and the through hole (110) of the polishing pad (100), and particle detection is performed on the introduced polishing liquid (L1). The concave portion (63) and the through hole (110) function as a polishing liquid receiving portion that receives the polishing liquid (L1) for particle detection. In particle detection, electromagnetic waves emitted by the irradiation device (71) are incident on the polishing liquid (L1) through the table window portion (320). Signals such as electromagnetic waves from the polishing liquid (L1) within the concave portion (63) and the through hole (110) are detected by a detector (72) through the table window portion (320).

[0082] In this modified example, the amount of polishing liquid (L1) to be detected as a particle can be increased compared to the modified example 3-1 described above, so that particle detection can be performed more reliably.

[0083] Variation Example 3-3

[0084] FIG. 15 is a cross-sectional view schematically illustrating a particle detection system (700H) according to the present modification example. The particle detection system (700H) according to the present modification example has a configuration almost identical to the particle detection system (700F) of the above-described modification example 3-1, but differs from the particle detection system (700F) in that it is equipped with a movable member (60E) instead of a movable member (60D). A pump (90A) is disposed in a fluid path (92B) that fluidly connects the concave portion (63) and the opening (93) formed on the outer surface of the movable member (60E). The pump (90A) is configured to introduce a polishing liquid (L1) on the polishing surface (102) into the concave portion (63) by suction.

[0085] Variation Example 3-4

[0086] FIG. 16 is a cross-sectional view schematically illustrating a particle detection system (700I) according to the present modification example. The particle detection system (700I) according to the present modification example is different from the particle detection system (700B) of the above-described modification example 3-1 in that it is equipped with a movable member (60F) instead of a movable member (60D) and an irradiation device (71A) instead of an irradiation device (71). The movable member (60F) is equipped with an irradiation device (71A) and is configured so that the irradiation device (71A) irradiates electromagnetic waves, etc., to a polishing liquid (L1) placed in an area surrounded by a concave portion (63) and a polishing surface (102). Signals such as electromagnetic waves from the polishing liquid (L1) are detected by a detector (72) placed below the table opening (301) through the pad window portion (120) of the pad (100A). In addition, as in the example of FIG. 14, a pad (100) having a through hole (110) instead of a pad (100A) may be used, and the irradiation device (71A) may be configured to irradiate electromagnetic waves, etc. onto a polishing liquid (L1) located in the concave portion (63) and the through hole (110). The same applies to the following variations 3-5 and 3-6.

[0087] Variation Example 3-5

[0088] FIG. 17 is a cross-sectional view schematically illustrating a particle detection system (700J) according to the present modification example. The particle detection system (700J) according to the present modification example is different from the particle detection system (700F) of the above-described modification example 3-1 in that it is equipped with a movable member (60G) instead of a movable member (60D) and a detector (72A) instead of a detector (72). The movable member (60G) is equipped with a detector (72A) and is configured so that the detector (72A) detects signals such as electromagnetic waves from a polishing liquid (L1) placed in an area surrounded by the concave portion (63) and the polishing surface (102). Electromagnetic waves such as those from an irradiation device (71) placed below the table opening (301) are irradiated onto the polishing liquid (L1).

[0089] Variation Example 3-6

[0090] FIG. 18 is a cross-sectional view schematically illustrating a particle detection system (700K) according to the present modification example. The particle detection system (700K) according to the present modification example is different from the particle detection system (700F) of the above-described modification example 3-1 in that it is equipped with a movable member (60H) instead of a movable member (60), and is equipped with an irradiation device (71A) and a detector (72A) respectively instead of an irradiation device (71) and a detector (72). The movable member (60H) is equipped with an irradiation device (71A) and a detector (72A). The irradiation device (71A) is configured to irradiate electromagnetic waves, etc., onto a polishing liquid (L1) placed in an area surrounded by the concave portion (63) and the polishing surface (102), and the detector (72A) is configured to detect a signal of electromagnetic waves, etc., from the polishing liquid (L1). In order to suppress adverse effects caused by reflected light, etc., it is preferable that the polishing table (30) be equipped with a light-blocking member (620) that defines the side on which the polishing pad (100) is placed. If particle detection can be performed with desired precision by appropriately reducing noise, the polishing table (30) may not be equipped with a light-blocking member (620), and the polishing pad (100A) may not be equipped with a pad window (120).

[0091] Variant Example 4

[0092] FIG. 19 is a plan view illustrating a polishing pad (100B) according to the present variation. The polishing pad (100B) has a plurality of pad openings (101A, 101B, 101C, 101D, and 101E). A polishing table (30) has a plurality of table openings (301A, 301B, 301C, 301D, and 301E) so as to overlap each of the plurality of pad openings (101A, 101B, 101C, 101D, and 101E).

[0093] The polishing pad (100B) is configured to be positioned such that the center position (C1) aligns with the rotation axis of the polishing table (30). It is preferable that the polishing pad (100B) has four or more pad openings (101) positioned at different locations in the circumferential direction relative to the center position (C1). Additionally, it is preferable that the polishing table (30) has four or more table openings (301) positioned at different locations in the circumferential direction relative to the rotation axis of the polishing table (30). By doing so, even if there is a circumferential deviation in the state of the polishing liquid (L1) on the polishing surface (102), abnormalities in the polishing liquid (L1) can be detected more reliably. In the same regard, it is preferable that the plurality of pad openings (101) are positioned rotationally symmetrically around an axis perpendicular to the polishing pad (100B) passing through the center position (C1). In the example of the city, multiple pad openings (101A, 101B, 101C, and 101D) are arranged at equal intervals along the circumference along the circle indicated by dashed line B1.

[0094] In FIG. 19, the approximate location where the substrate (WF) is placed during polishing on the polishing pad (100B) is schematically represented by the dotted circle DL. The pad openings (101A, 101B, 101C, and 101D) are located on the polishing pad (100B) at a position where the central portion of the substrate (WF) passes through. The pad opening (101E) is located closer to the center position (C1) of the polishing pad (100B) than the pad opening (101A), and is located at a position where the edge portion of the substrate (WF) passes through. In this way, it is preferable that the plurality of pad openings (101) are placed at multiple positions corresponding to multiple different positions on the substrate (WF). Likewise, it is preferable that the plurality of table openings (301) are placed at multiple positions corresponding to multiple different positions on the substrate (WF). By doing so, abnormalities in the polishing liquid (L1) can be detected so that adverse effects caused by the polishing liquid (L1) do not occur over a wider area of ​​the substrate (WF). The particle detection system (700) may be equipped with a plurality of measuring units (70) corresponding to each of the plurality of pad openings (101) and the plurality of table openings (301). In addition, the number and location of the pad openings (101) in the polishing pad (100) and the number and location of the table openings (301) in the polishing table (30) are not limited to the contents of the present variation, and one or more of any number of pad openings (101) and table openings (301) may be provided at any location.

[0095] Variant Example 5

[0096] FIG. 20 is a cross-sectional view schematically illustrating a particle detection system (700L) of the present variation. The particle detection system (700L) of the present variation has a configuration roughly similar to the particle detection system (700A) of the above-described variation 1, but differs from the particle detection system (700A) in that it has a flow path (92C) that extends from the pad placement surface (302) through the interior of the polishing table (30) to the exterior of the polishing table (30) instead of a flow path (92). As shown in FIG. 20, the polishing table (30) may be equipped with a polishing table body (351), a table shaft (352), a rotary joint (353), and a table driving device (360) including a motor, etc. The table shaft (352) supports the polishing table body (351) and extends along the rotation axis AX to surround the rotation axis AX of the polishing table (30). The table shaft (352) is rotatably supported by the table drive unit (360). The fluid path (92C) can be introduced from the pad placement surface (302) through the interior of the polishing table body (351), the table shaft (352), and the rotary joint (353) into the room (200) outside the polishing table (30). A signal from the polishing liquid (L1) inside the room (200) at the detection location is detected by the detection unit (72). Within the rotary joint (353), the rotating part of the fluid path (92C) is rotatably fluidly connected to another part of the fluid path (92C). More specifically, the rotary joint (353) fluidly connects a portion of the fluid path (92C) that rotates integrally with the polishing table body (351) and the table shaft (352), and a portion outside the polishing table body (351) and the table shaft (352) that does not rotate integrally with the polishing table body (351), etc., regardless of whether such rotation occurs. Since the fluid path (92C) can be longer than when there is a room (200) inside the polishing table (30), the flow of polishing liquid (L1) may be promoted by the pump (90) at any position.

[0097] In this modified example, the flow path (92C) extends to a detection position outside the polishing table (30), and the detector (72) is configured to detect a signal regarding the size of a particle (P1) from the polishing liquid (L1) at the detection position. At least one of the irradiation device (71), the detector (72), and the room (200) may be placed outside the polishing table (30). With this configuration, the measuring unit (70) can be installed without constraints such as the size of the space for placing the measuring unit (70), and a measuring unit (70) with higher performance can be installed, or a plurality of detectors (72) can be placed at desired locations.

[0098] Variant Example 6

[0099] In the above-described embodiment, particle detection and particle determination regarding the size of the particle (P1) are not limited to the detection of a signal regarding at least one of the size, shape, dispersibility, and optical properties of the particle (P1). In this case, the control device (900) may perform particle determination to determine whether the polishing liquid (L1) for which particle detection has been performed contains a particle that scratches the substrate (WF), based on particle data indicating at least one of the size, shape, dispersibility, and optical properties of the particle (P1) obtained based on the signal detected by the detector (72), and correspondence relationship information indicating a correspondence relationship between at least one of the size, shape, dispersibility, and optical properties of the polishing liquid particle and whether the particle is a particle that scratches the substrate.

[0100] Variant Example 6-1

[0101] In this modified example, an example is described in which the detector (72) detects a signal regarding the shape of a particle (P1) as a particle detection. In this case, the control device (900) can determine the particle based on particle data representing the shape of the particle (P1) obtained based on the signal, and correspondence information representing the correspondence between the shape of the polishing liquid particle and whether the particle is a particle that scratches the substrate. The signal regarding the shape of the particle (P1) is a signal from which particle data representing the shape of the particle (P1) can be obtained by interpreting the signal.

[0102] FIG. 21 is a schematic diagram illustrating a particle detection system (700M) according to the present modification example. The particle detection system (700M) of the present modification example includes a detector (72) equipped with an imaging device (800), and the imaging device (800) is configured to capture an image of a polishing liquid (L1). In the illustrated example, the imaging device (800) is configured to capture a polishing liquid (L1) located in a room (200) connected to a pad opening (101). The imaging device (800) may capture a polishing liquid (L1) in a flow path (91), etc. The imaging device (800) may be a camera capable of converting visible light into photoelectric power, or an infrared camera.

[0103] The control device (900) generates particle data representing the shape of a particle from image data obtained from the image of the polishing liquid (L1) by the imaging device (800). In the image data, for example, the position of a pixel corresponds to the intensity of the received light. The control device (900) processes the image data and derives a characteristic value representing the shape of a particle (P1) contained in the polishing liquid (L1), particularly the shape of the particle (P1), from the image of the polishing liquid (L1). The control device (900) can store the characteristic value representing the shape of the particle (P1) as particle data in a memory device (930), etc. This characteristic value is not particularly limited as long as it affects the ease with which the particle scratches the substrate. The control device (900) performs particle determination based on the particle data obtained in this way and the corresponding relationship information. The corresponding relationship information may represent a numerical range of characteristic values ​​representing the shape of a particle such that the particle becomes a particle that scratches the substrate. The corresponding relationship information may include, for example, a threshold of a characteristic value representing the shape of a particle, and the control device (900) may determine the particle by whether the characteristic value representing the shape of the particle (P1) is greater than or equal to the threshold.

[0104] Variant Example 6-2

[0105] In this modified example, an example is described in which a detector (72) detects a signal regarding the dispersibility of a particle (P1) in a polishing liquid (L1) as a particle detection. In this case, the control device (900) can determine the particle based on particle data indicating the dispersibility of the particle (P1) obtained based on the signal, and correspondence information indicating the correspondence between the dispersibility of the particle in the polishing liquid and whether the particle is a particle that scratches the substrate. A signal regarding the dispersibility of the particle (P1) is a signal from which particle data indicating the dispersibility of the particle (P1) can be obtained by interpreting the signal. In this modified example, particle detection can be performed by the particle detection system (700M) described above.

[0106] The control device (900) generates particle data indicating the dispersibility of particles (P1) from image data obtained from the image of the polishing liquid (L1) of the imaging device (800). The control device (900) processes the image data to derive the positions of a plurality of particles (P1) contained in the polishing liquid (L1) from the image of the polishing liquid (L1), and derives a characteristic value indicating the dispersibility of particles (P1) based on the said position distribution. The control device (900) may store the characteristic value indicating the dispersibility of particles (P1) as particle data in a memory device (930), etc. This characteristic value is not particularly limited as long as it affects the ease of scratching the substrate by the particles. This characteristic value may also be the amount of settled particles (P1). For example, if the particles (P1) are distributed relatively uniformly in the polishing liquid (L1), the particles (P1) are small or light enough to be dispersed in the polishing liquid (L1), so the risk of scratching the substrate (WF) is relatively low. If the particles (P1) are settled or localized, the risk of scratching the substrate (WF) is relatively high. The control device (900) performs particle determination based on the particle data obtained in this way and corresponding relationship information. The corresponding relationship information may represent a numerical range of characteristic values ​​indicating the dispersibility of the particles, such that the particles become particles that scratch the substrate. The corresponding relationship information may include, for example, a threshold of characteristic values ​​indicating the dispersibility of the particles (P1), and the control device (900) may perform particle determination based on whether the characteristic value indicating the dispersibility of the particles (P1) is greater than or equal to the threshold.

[0107] Variant Example 6-3

[0108] In this modified example, an example is described in which a detector (72) detects a signal regarding the optical characteristics of a particle (P1) as a particle detection. In this case, the control device (900) can determine the particle based on particle data representing the optical characteristics of the particle (P1) obtained based on the signal, and correspondence information representing the correspondence between the optical characteristics of the particles of the polishing liquid and whether the particles are particles that scratch the substrate. A signal regarding the optical characteristics of a particle (P1) is a signal from which particle data representing the optical characteristics of the particle (P1) can be obtained by interpreting the signal. In this modified example, particle detection can be performed by the particle detection system (700M) described above.

[0109] The control device (900) generates particle data representing the optical characteristics of a particle (P1) from image data obtained from the image of the polishing liquid (L1) of the imaging device (800). This optical characteristic may be, for example, the wavelength of light reflected or scattered by the particle (P1), in other words, the color of the surface of the particle (P1), or the surface reflectance of the particle (P1). The control device (900) processes the image data and derives the wavelength, or the surface reflectance of the particle (P1) contained in the polishing liquid (L1), from the image of the polishing liquid (L1) as a characteristic value representing the optical characteristics of the particle (P1). The control device (900) may store the characteristic value representing the optical characteristics of the particle (P1) as particle data in a memory device (930), etc. This characteristic value is not particularly limited as long as it affects the ease of scratching the substrate by the particle. For example, depending on the color or reflectance of the surface of the particle (P1), the surface condition of the particle (P1) may differ, and the risk of scratching the substrate (WF) may change. The control device (900) performs particle determination based on the particle data obtained in this way and corresponding relationship information. The corresponding relationship information may represent a numerical range of characteristic values ​​representing the optical properties of the particle, such that the particle becomes a particle that scratches the substrate. The corresponding relationship information may include, for example, a threshold of characteristic values ​​representing the optical properties of the particle (P1), and the control device (900) may perform particle determination based on whether the characteristic value representing the optical properties of the particle (P1) is greater than or equal to the threshold.

[0110] The embodiments described above may also be described in the following forms.

[0111] [Form 1] According to Form 1, a polishing device is proposed, wherein the polishing device comprises a polishing table for supporting a polishing pad having a polishing surface, a polishing head for holding and supporting a substrate, a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the substrate, and a control device, and performs polishing of the substrate by contacting the polishing pad and the substrate in the presence of the polishing liquid, wherein the polishing device further comprises a detector for detecting a signal regarding at least one of the particle size, shape, dispersibility, and optical properties from the polishing liquid located on the polishing surface, or from the polishing liquid located in a channel or room communicating with a pad opening formed in the polishing pad, and the control device, based on particle data indicating at least one of the particle size, shape, dispersibility, and optical properties obtained based on the signal detected by the detector, and correspondence information indicating a correspondence between at least one of the particle size, shape, dispersibility, and optical properties of the polishing liquid and whether the particle is a particle that scratches the substrate, wherein the detection is performed The polishing liquid is configured to perform particle determination to determine whether it contains particles that scratch the substrate. According to Embodiment 1, with respect to the polishing liquid after it is placed on the polishing surface, a polishing device can be provided that can evaluate the state of the polishing liquid more efficiently or more precisely while suppressing changes in the state of the polishing liquid.

[0112] [Form 2] According to Form 2, in Form 1, the polishing table has a table opening arranged to communicate with the pad opening, and the polishing device further has at least one of a channel and a room communicating with the table opening, and the detector is configured to detect the polishing liquid located in the channel or the room. According to Form 2, the polishing liquid can be quickly placed at the detection location, and also, by blocking light from outside the polishing device, it becomes easier to adjust the polishing conditions.

[0113] [Form 3] According to Form 3, in Form 2, the polishing device further comprises a pump connected to the flow path or the chamber to enable suction. According to Form 3, the introduction of polishing liquid from the polishing surface into the flow path or chamber and the discharge of polishing liquid from the flow path or chamber can be facilitated, thereby enabling more reliable particle detection.

[0114] [Form 4] According to Form 4, in Form 2 or 3, the minimum diameter of the table opening is 1 mm or more. According to Form 4, it becomes easier to introduce the abrasive liquid into the channel or room.

[0115] [Form 5] According to Form 5, in any one of Forms 2 to 4, the maximum diameter of the table opening is 10 mm or less. According to Form 5, the risk of adverse effects on the efficiency or uniformity of polishing by the table opening can be suppressed.

[0116] [Form 6] According to Form 6, in any one of Forms 2 to 5, the table opening is positioned such that the substrate covers the table opening during the polishing process on the polishing table. According to Form 6, polishing debris generated by the polishing of the substrate can be efficiently detected.

[0117] [Form 7] According to Form 7, any of Forms 2 to 6 is further provided with a shutter to block light from the pad opening or to prevent the inflow of the polishing liquid from the pad opening. According to Form 7, noise caused by light is reduced, so particle detection can be performed more accurately.

[0118] [Form 8] According to Form 8, in Form 1, the detector is configured to detect the polishing liquid located in the through hole formed in the polishing pad. According to Form 8, the reduction of the efficiency or uniformity of polishing by the table opening can be suppressed.

[0119] [Form 9] According to Form 9, in any one of Forms 2 to 7, the detector detects the signal from the polishing liquid located in the channel or room connected to the pad opening, and the detector is located below the surface on which the polishing pad is placed on the polishing table. According to Form 9, the detector can be not located in the upper region of the polishing surface, so that more members can be placed in the said region. In addition, the polishing liquid can be introduced more reliably into the channel or room by using gravity, etc.

[0120] [Form 10] According to Form 10, any of Forms 1 to 9 further comprises an irradiation device for irradiating the polishing liquid with electromagnetic waves or ultrasound for detection, wherein the detector detects the electromagnetic waves or ultrasound that have passed through the polishing liquid, or the electromagnetic waves or ultrasound generated by scattering or reflection of the electromagnetic waves or ultrasound in the polishing liquid, and the irradiation device is located below the surface on which the polishing pad is placed on the polishing table. According to Form 10, the irradiation device may not be located in the upper region of the polishing surface, thereby allowing more members to be placed in the said region.

[0121] [Form 11] According to Form 11, any of Forms 1 to 10 further comprises a movable member configured to be movable between the upper portion of the polishing surface and the lateral portion of the polishing table, wherein the movable member comprises at least one detector and an irradiation device that irradiates the polishing liquid with electromagnetic waves or ultrasound for detection. According to Form 11, maintenance of the irradiation device or detector can be facilitated. Furthermore, even when a plurality of pad openings are formed on the polishing surface, particle detection can be performed on all pad openings by a smaller number of irradiation devices or detectors.

[0122] [Form 12] According to Form 12, in any one of Forms 2 to 7, 9 and 10, the flow path extends to a detection position outside the polishing table, and the detector is configured to detect the signal from the polishing liquid at the detection position. According to Form 12, the irradiation device or detector can be installed without constraints such as the size of the space for placing the irradiation device or detector, and a higher performance irradiation device or detector can be installed, or a plurality of detectors can be placed at desired positions relative to the polishing liquid.

[0123] [Form 13] According to Form 13, in any one of Forms 1 to 12, the control device is configured to detect by the detector when (1) the polishing liquid is supplied to the polishing pad, (2) while the polishing is being performed, or (3) when the polishing liquid remains on the polishing pad after the polishing is finished. According to Form 13, by detecting particles when the influence of the polishing liquid on the polishing is significant, or when cleaning or replacement of consumables is easy, scratching of the substrate or polishing different from the intended state can be suppressed.

[0124] [Form 14] According to Form 14, in any one of Forms 1 to 13, the detection and acquisition of particle data are performed by at least one of laser diffraction and scattering, dynamic light scattering, ultrasonic attenuation, zeta potential measurement, spectroscopic measurement, and the analysis of an image obtained by capturing the polishing liquid. According to Form 14, by utilizing the characteristics of these measurement methods, particles that scratch the substrate in the polishing liquid can be detected more reliably.

[0125] [Form 15] According to Form 15, in any one of Forms 1 to 14, the control device is configured to perform at least one of warning, stopping the polishing, and cleaning the polished surface when it is determined by the particle determination that the polishing liquid detected contains particles that scratch the substrate. According to Form 15, based on the particle detection result, it is possible to more reliably prevent scratching the substrate (WF) or performing polishing different from what was intended.

[0126] [Form 16] According to Form 16, in any one of Forms 1 to 15, the detector is equipped with an imaging device that captures an image of the polishing liquid. According to Form 16, particle detection can be performed with a simple configuration. In addition, particle detection can be performed not only when polishing is not being performed, but also during polishing.

[0127] [Form 17] According to Form 17, in any one of Forms 1 to 16, the polishing device performs the polishing of the substrate by bringing the polishing pad and the substrate into contact and rotating them relative to each other in the presence of the polishing liquid. According to Form 17, polishing can be performed more efficiently or more uniformly.

[0128] [Form 18] According to Form 18, a substrate processing device is proposed, and the substrate processing device comprises a polishing device of any one of Forms 1 to 17. According to Form 18, a substrate processing device can be provided that can process the substrate more efficiently, or reduce the risk of damage to the substrate or the risk of polishing being performed differently from what is expected.

[0129] [Form 19] According to Form 19, a polishing method is proposed, wherein the polishing method is a polishing method in which the polishing pad and the substrate are brought into contact in the presence of the polishing liquid by means of a polishing device comprising a polishing table for supporting a polishing pad having a polishing surface, a polishing head for holding and supporting a substrate, and a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the substrate, and the polishing method is a polishing method in which at least one of the particle size, shape, dispersibility, and optical properties is detected from the polishing liquid located on the polishing surface, or from the polishing liquid located in a channel or room communicating with a pad opening formed in the polishing pad, and particle data indicating at least one of the particle size, shape, dispersibility, and optical properties obtained based on the signal detected by the detector, and correspondence information indicating a correspondence between at least one of the particle size, shape, dispersibility, and optical properties of the polishing liquid and whether the particle is a particle that scratches the substrate, wherein the polishing liquid detected scratches the substrate It includes performing a particle determination to determine whether it contains particles. According to Form 19, with respect to the polishing liquid after it has been placed on the polishing surface, the state of the polishing liquid can be evaluated more efficiently or more precisely while suppressing changes in the state of the polishing liquid.

[0130] [Form 20] According to Form 20, a determination device is proposed, wherein the determination device is a determination device for determining the state of a polishing liquid in a polishing device, and the polishing device comprises a polishing table for supporting a polishing pad having a polishing surface, a polishing head for holding and supporting a substrate, and a polishing liquid supply device for supplying the polishing liquid between the polishing pad and the substrate, and performs polishing of the substrate by contacting the polishing pad and the substrate in the presence of the polishing liquid, and the polishing device further comprises a detector for detecting a signal regarding at least one of the particle size, shape, dispersibility, and optical properties from the polishing liquid located on the polishing surface, or from the polishing liquid located in a channel or room communicating with a pad opening formed in the polishing pad, and the determination device comprises particle data indicating at least one of the particle size, shape, dispersibility, and optical properties obtained based on the signal detected by the detector, and a correspondence indicating whether the particle is a particle that scratches the substrate with at least one of the particle size, shape, dispersibility, and optical properties of the polishing liquid. Based on the corresponding relationship information, the particle determination is performed to determine whether the polishing liquid detected above contains particles that scratch the substrate. According to Embodiment 20, with respect to the polishing liquid after being placed on the polishing surface, the state of the polishing liquid can be evaluated more efficiently or more precisely while suppressing changes in the state of the polishing liquid.

[0131] Although several embodiments of the present invention have been described above, the above-described embodiments are intended to facilitate understanding of the present invention and do not limit the present invention. The present invention may be modified or improved without departing from its intent, and it is understood that the present invention includes equivalents thereof. Furthermore, any combination or omission of each component described in the claims and specification is possible within the scope of solving at least some of the problems described above or within the scope of exhibiting at least some of the effects. Explanation of the symbols

[0132] 3, 3A, 3B, 3C, 3D: Polishing Unit 10: Substrate Processing Unit 30: Grinding table 31: Grinding head 32: Polishing fluid supply device 60, 60A, 60B, 60C, 60D, 60E, 60F, 60G, 60H: Movable parts 62, 620: Shading member 63: Concave part 70: Measuring unit 71, 71A: Irradiation device 72, 72A, 72B: Detectors 90, 90A: Pumps 92, 92A, 92B, 92C: Euro 100, 100A, 100B: Grinding pad 101, 101A, 101B, 101C, 101D, 101E: Pad opening 102: Grinded surface 110: Through hole 120: Pad prostitute 200: Room 301, 301A, 301B, 301C, 301D, 301E: Table opening 302: Pad placement surface 320: Table prostitute 700, 700A, 700B, 700C, 700D, 700E, 700F, 700G, 700H, 700I, 700J, 700K, 700L, 700M: Particle detection system 800: Imaging device 900: Control device 910: Arithmetic Unit 920: Memory 930: Memory unit 1000: Polishing unit 1100: Polishing System C1: Center Position of Polishing Pad D10: Diameter of the pad opening D11: Minimum diameter of the pad opening D12: Maximum diameter of the pad opening D30: Diameter of the table opening D31: Minimum diameter of the table opening D32: Maximum diameter of the table opening L1: Polishing liquid P1: Particles WF: Substrate

Claims

Claim 1 A polishing device comprising a polishing table for supporting a polishing pad having a polishing surface, a polishing head for holding and supporting a substrate, a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the substrate, and a control device, wherein the polishing device performs polishing of the substrate by contacting the polishing pad and the substrate in the presence of the polishing liquid; the polishing device further comprises a detector for detecting a signal regarding at least one of the particle size, shape, dispersibility, and optical characteristics from the polishing liquid located on the polishing surface, or from the polishing liquid located in a channel or room communicating with a pad opening formed in the polishing pad; and the control device determines whether the polishing liquid detected includes a particle that scratches the substrate based on particle data representing at least one of the particle size, shape, dispersibility, and optical characteristics obtained based on the signal detected by the detector, and correspondence information representing a correspondence between at least one of the particle size, shape, dispersibility, and optical characteristics of the polishing liquid and whether the particle is a particle that scratches the substrate. A grinding device configured to perform grinding. Claim 2 A polishing device according to claim 1, wherein the polishing table has a table opening arranged to communicate with the pad opening, the polishing device further has at least one of a fluid path and a chamber communicating with the table opening, and the detector is configured to perform the detection on the polishing liquid located in the fluid path or the chamber. Claim 3 In paragraph 2, the polishing device further comprises a pump connected to the fluid path or the chamber to enable suction. Claim 4 A grinding device according to claim 2 or 3, wherein the minimum diameter of the table opening is 1 mm or more. Claim 5 A grinding device according to claim 2 or 3, wherein the maximum diameter of the table opening is 10 mm or less. Claim 6 A polishing device according to claim 2 or 3, wherein the table opening is positioned such that the substrate covers the table opening during polishing on the polishing table. Claim 7 A polishing device according to claim 2 or 3, further comprising a shutter to block light from the pad opening or to prevent the inflow of the polishing liquid from the pad opening. Claim 8 A polishing device according to claim 1, wherein the detector is configured to detect the polishing liquid located in a through hole formed in the polishing pad. Claim 9 A polishing device according to claim 2 or 3, wherein the detector detects the signal from the polishing liquid located in the fluid path or room connected to the pad opening, and the detector is located below the surface on which the polishing pad is placed on the polishing table. Claim 10 A polishing device according to any one of claims 1 to 3, further comprising an irradiation device that irradiates electromagnetic waves or ultrasound into the polishing liquid for detection, wherein the detector performs detection of the electromagnetic waves or ultrasound that have passed through the polishing liquid, or the electromagnetic waves or ultrasound generated by scattering or reflection of the electromagnetic waves or ultrasound in the polishing liquid, and wherein the irradiation device is located below the surface on which the polishing pad is placed on the polishing table. Claim 11 A polishing device according to any one of claims 1 to 3, further comprising a movable member configured to be movable between the upper portion of the polishing surface and the lateral portion of the polishing table, wherein the movable member comprises at least one of the detector and an irradiation device that irradiates electromagnetic waves or ultrasound into the polishing liquid for detection. Claim 12 A polishing device according to any one of claims 1 to 3, wherein the fluid path extends to a detection position outside the polishing table, and the detector is configured to detect the signal from the polishing liquid at the detection position. Claim 13 A polishing device according to any one of claims 1 to 3, wherein the control device is configured to perform detection by the detector when (1) the polishing liquid is supplied to the polishing pad, (2) while the polishing is being performed, or (3) when the polishing liquid remains on the polishing pad after the polishing is finished. Claim 14 A polishing apparatus according to any one of claims 1 to 3, wherein the detection and acquisition of particle data are performed by at least one of laser diffraction / scattering method, dynamic light scattering method, ultrasonic attenuation method, zeta potential measurement, spectroscopic measurement, and analysis of an image obtained by capturing the polishing liquid. Claim 15 A polishing device according to any one of claims 1 to 3, wherein the control device is configured to perform at least one of warning, stopping the polishing, and cleaning the polishing surface when it is determined by the particle determination that the polishing liquid detected contains particles that scratch the substrate. Claim 16 A polishing device according to any one of claims 1 to 3, wherein the detector comprises an imaging device for capturing an image of the polishing liquid. Claim 17 A polishing device according to any one of claims 1 to 3, wherein the polishing device performs the polishing of the substrate by bringing the polishing pad and the substrate into contact and rotating them relative to each other in the presence of the polishing liquid. Claim 18 A substrate processing device having a polishing device as described in any one of paragraphs 1 to 3. Claim 19 A polishing method comprising: a polishing table for supporting a polishing pad having a polishing surface; a polishing head for holding and supporting a substrate; and a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the substrate, wherein the polishing pad and the substrate are contacted in the presence of the polishing liquid to perform polishing of the substrate; and a polishing method comprising detecting a signal regarding at least one of the particle size, shape, dispersibility, and optical properties from the polishing liquid located on the polishing surface or from the polishing liquid located in a channel or room communicating with a pad opening formed in the polishing pad, and performing particle determination to determine whether the polishing liquid detected includes a particle that scratches the substrate based on particle data indicating at least one of the particle size, shape, dispersibility, and optical properties obtained based on the signal detected by the detector, and correspondence relationship information indicating the correspondence relationship between the particle size of the polishing liquid and whether the particle is a particle that scratches the substrate. Claim 20 A determination device for determining the state of a polishing liquid in a polishing device, wherein the polishing device comprises a polishing table for supporting a polishing pad having a polishing surface, a polishing head for holding and supporting a substrate, and a polishing liquid supply device for supplying the polishing liquid between the polishing pad and the substrate, and performs polishing of the substrate by contacting the polishing pad and the substrate in the presence of the polishing liquid, wherein the polishing device further comprises a detector for detecting a signal regarding at least one of the particle size, shape, dispersibility, and optical characteristics from the polishing liquid located on the polishing surface, or from the polishing liquid located in a channel or room communicating with a pad opening formed in the polishing pad, and wherein the determination device, based on particle data indicating at least one of the particle size, shape, dispersibility, and optical characteristics obtained based on the signal detected by the detector, and correspondence relationship information indicating a correspondence relationship between at least one of the particle size, shape, dispersibility, and optical characteristics of the polishing liquid and whether the particle is a particle that scratches the substrate, wherein the polishing liquid for which the detection was performed scratches the substrate A judgment device configured to perform particle judgment, which determines whether the particle contains a particle.

Images