Die bonding system including alignment and bonding actuators and a method of using the same

Abstract

A die bonding system comprises a frame, a movable platform configured to hold a die chuck, a set of bonding actuators operably connected to the frame and the movable platform, and a set of alignment actuators operably connected to the frame and the movable platform. In one embodiment, each bonding actuator is configured to apply a bonding force to the movable platform in a first direction parallel to a central axis, and each alignment actuator is configured to apply an alignment force to the movable platform along an alignment force plane perpendicular to the central axis. In another embodiment, the system further comprises a set of bonding flexers and a set of alignment flexers. Each flexer is connected to its corresponding actuator and movable platform. The die bonding system can achieve an adjustment cycle frequency of at least 50 Hz.

Description

Technology Field

[0001] The present disclosure relates to a die bonding system equipped with alignment and bonding actuators and a method of using the same. Background Technology

[0002] Hybrid bonding enables smaller dies to be bonded to a bonding substrate containing multiple dies. As dimensions decrease, hybrid bonding is becoming an increasingly challenging operation due to proper placement and high device throughput. The die bonding head is designed to move in the die bonding direction so that the die can be bonded to the die bonding site on the bonding substrate. The die bonding direction may be the Z direction.

[0003] A high-precision placement tool designed to move in the Z direction may achieve a straight travel range in the X direction of + / -4500 μm, a straight travel range in the Y direction of + / -4500 μm, and a straight travel range in the Z direction of -3000 μm to 2100 μm. The high-precision placement tool may achieve an angular travel range around an axis in the X direction of + / -68 microradians (mrad) (θx), an angular travel range around an axis in the Y direction of + / -59 mrad (θy), and an angular travel range around an axis in the Z direction of + / -127 mrad (θz). The problem to be solved

[0004] Such high-precision placement tools are not suitable for hybrid bonding in manufacturing environments, where precise reproducibility and high throughput of die bonding are required. In hybrid bonding, there is a need to achieve high device throughput while providing die placement precision and reproducibility. means of solving the problem

[0005] In one aspect, the apparatus comprises a frame, a movable platform configured to hold a die chuck, a set of bonding actuators operably connected to the frame and the movable platform, and a set of alignment actuators operably connected to the frame and the movable platform. Each bonding actuator is configured to apply a bonding force to the movable platform in a first direction parallel to a central axis passing through the center of the movable platform and offset from the central axis, and each alignment actuator is configured to apply an alignment force to the movable platform along an alignment force plane perpendicular to the central axis.

[0006] In one embodiment, the bonding actuator set is configured to adjust the position, tip, and tilt of the movable platform in the first direction relative to the frame, and the bonding actuator set is configured to supply a peak bonding force to the movable platform.

[0007] In another embodiment, the alignment actuator set is configured to adjust a position in a second direction along a plane perpendicular to the central axis of the movable platform relative to the frame, a position in a third direction, and rotation around the central axis, wherein the second direction is perpendicular to the first direction and the third direction is perpendicular to the first direction.

[0008] In another embodiment, the bonding actuator set is configured to apply the bonding force to the movable platform, which is at least twice the alignment force configured to be applied to the movable platform by the alignment actuator set.

[0009] In another embodiment, the peak bonding force of each bonding actuator in the bonding actuator set is at least 110 of the peak alignment force of each alignment actuator in the alignment actuator set.

[0010] In another embodiment, the die bonding system further comprises the die chuck, and the movable platform includes a die chuck holding area, and the arrangement of the die chuck within the die chuck holding area is adjustable.

[0011] In a specific embodiment, while the die chuck is retained within the die chuck retaining area, the center of the die retaining area of ​​the die chuck is located within a polygon, and the vertices of the polygon are positioned at the location where the bonding actuator set applies the bonding force to the movable platform.

[0012] In another embodiment, the die bonding system further comprises the die chuck, and the die chuck is configured to adjust the shape of the die during bonding. The bonding actuator set is configured to apply the bonding force sufficient to overcome the adjustment of the shape of the die so that the die follows the die bonding surface of the substrate.

[0013] In another embodiment, when the movable platform is in a neutral state, each alignment actuator in the alignment actuator set is configured to move the movable platform along a plane perpendicular to the central axis, and this plane passes through the center of mass of the movable platform.

[0014] In another embodiment, the bonding actuator set has a first number of actuators, and the alignment actuator set has a second number of actuators, and the first number is different from the second number.

[0015] In another aspect, the die bonding system may comprise a frame, a movable platform configured to hold a die chuck, a set of bonding actuators, a set of alignment actuators, and a set of bonding flexures. Each bonding flexure may have a corresponding bonding actuator, and each pair of bonding flexures and their corresponding bonding actuators are operably connected to the frame and the movable platform, and each alignment flexure may have a corresponding alignment actuator, and each pair of alignment flexures and their corresponding alignment actuators are operably connected to the frame and the movable platform. The above die bonding system may have an adjustment cycle frequency of at least 50 Hz, and the adjustment cycle frequency corresponds to a time from when a signal corresponding to the position of the operating platform for the current adjustment cycle begins to be processed until when the adjustment of the operating platform from the previous direction to the new direction is completed, and this adjustment is performed in response to the processing of the signal during the current adjustment cycle.

[0016] In one embodiment, the movable platform has a length in the X direction, a width in the Y direction, and a thickness in the Z direction, such that length ≥ width > thickness. The straight-line travel range in the X direction is a maximum of + / -0.90% of the length of the movable platform, and the straight-line travel range in the Y direction is a maximum of + / -0.90% of the width of the movable platform.

[0017] In another embodiment, the movable platform is configured to achieve a position within the XY plane, and the movable platform is characterized by including a first rotation around the z-axis extending in the Z direction through the center of mass of the movable platform, the Z direction being perpendicular to the XY plane, and the angular travel range of the first rotation being at most + / -50 mrad.

[0018] In a specific embodiment, the movable platform has a length in the X direction, a width in the Y direction, and a thickness in the Z direction, wherein length ≥ width > thickness. The movable platform has additional features including a second rotation around an x-axis extending in the X direction through the center of mass of the movable platform, the angular travel range of the second rotation is + / -50 mrad, and the movable platform has additional features including a third rotation around a y-axis extending in the Y direction through the center of mass of the movable platform, the angular travel range of the third rotation is + / -50 mrad, and in the Z direction perpendicular to the XY plane, the Z direction straight travel range is a maximum of + / -2.5% of the length of the movable platform and a maximum of + / -2.5% of the width of the movable platform.

[0019] In another embodiment, the adjustment cycle frequency is at least 200 Hz.

[0020] In another embodiment, each bonding actuator is configured to provide a force of at least 20 N.

[0021] In another aspect, the method may include the step of bonding a first die to a first die chuck of a die bonding system. The die bonding system may have a first frame, a first die chuck, a first movable platform holding the first die chuck, a first set of first bonding actuators operably connected to the first frame and the first movable platform, and a first set of first alignment actuators operably connected to the first frame and the first movable platform. Each first bonding actuator may be configured to apply a first bonding force to the first movable platform in a first direction parallel to a first central axis passing through the center of the first movable platform and offset from the first central axis, and each first alignment actuator may be configured to apply a first alignment force to the first movable platform along a first alignment force plane perpendicular to the first central axis.

[0022] This method may include the step of bonding a second die to a second die chuck of a die bonding system. The die bonding system may further include a second die bonding head spaced apart from a first die bonding head. The second die bonding head may have a second frame, a second die chuck, a second movable platform holding the second die chuck, a second set of second bonding actuators operably connected to the second frame and the second movable platform, and a second set of second alignment actuators operably connected to the second frame and the second movable platform. Each second bonding actuator may be configured to apply a second bonding force to the second movable platform in a second direction parallel to a second central axis passing through the center of the second movable platform and offset from the second central axis, and each second alignment actuator may be configured to apply a second alignment force to the second movable platform along a second alignment force plane perpendicular to the second central axis.

[0023] This method may further include the steps of: adjusting the first movable platform in a first adjustment direction using at least one actuator from among the first bonding actuators of the first set and the first alignment actuators of the first set; adjusting the second movable platform in a second adjustment direction using at least one actuator from among the second bonding actuators of the second set and the second alignment actuators of the second set; activating the first bonding actuator of the first set and bonding the first die to a first die bonding site of the substrate; and activating the second bonding actuator of the second set and bonding the second die to a second die bonding site of the substrate. The first die bonding portion may be spaced apart from the second die bonding portion, and the bonding of the first die and the bonding of the second die may be performed simultaneously at least at the same time.

[0024] In one embodiment, the method may include the step of acquiring first signals from a first set of first position sensors, wherein the first signals correspond to a first previous direction of the first operating platform, and the adjustment of the first operating platform is performed before adjusting the first operating platform to the first adjustment direction; the method may further include the step of acquiring second signals from a second set of second position sensors, wherein the second signals correspond to a second previous direction of the second operating platform, and the adjustment of the second operating platform is performed before adjusting the second operating platform to the second adjustment direction. A first cycle begins at a first time point when the processing of the first signals begins and ends at a second time point when the adjustment of the first operating platform is completed, and a second cycle begins at a third time point when the processing of the second signals begins and ends at a fourth time point when the adjustment of the second operating platform is completed, and each of the first cycle and the second cycle has a main frequency of at least 50 Hz. In another embodiment, the surface of the substrate is laid along the XY plane and includes a first die bonding site and a second die bonding site, each of the first die and the first die bonding site has a center, and the maximum X-direction misalignment between the center of the first die and the center of the first die bonding site is 50 μm, and the maximum Y-direction misalignment between the center of the first die and the center of the first die bonding site is 50 μm.

[0025] In another embodiment, the first movable platform has a die chuck holding surface along the XY plane, and after adjustment of the first movable platform, the first movable platform is characterized by including a first rotation around a z-axis extending in a Z direction perpendicular to the XY plane through the center of mass of the first movable platform, a second rotation around an x-axis extending in a first X direction through the center of mass of the first movable platform, and a third rotation around a y-axis extending in a Y direction through the center of mass of the first movable platform, and for each of the first rotation, the second rotation and the third rotation, the angular travel range is at most + / -50 mrad. Brief explanation of the drawing

[0026] These implementations are given as examples and are not limited to the attached drawings. FIG. 1 includes a conceptual diagram of a die bonding system that can be used to bond a die to a die bonding portion of a bonding substrate. FIG. 2 includes an example of a side view showing a movable object, a flexure, and a force that can be applied to the movable object in the Z direction. FIG. 3 includes an example of a plan view showing the movable object of FIG. 2, the flexure, and the force that can be applied to the movable object in the X and Y directions. FIG. 4 includes an example of a perspective view of a part of the bonding head body. FIG. 5a includes an example of a perspective view of a part of the bonding head body of FIG. 4 after the part of the bonding head body has been flipped over. FIG. 5b includes an example of a perspective view of a part of the bonding head body of FIG. 5a with the lower frame member removed and the die chuck shown along the bottom surface of the movable platform. FIG. 6 includes an example of a perspective view of a part of a bonding head body comprising a lower frame, a movable platform, and a bonding actuator connected to the movable platform through a flexure. FIG. 7 includes an example of a plan view of the operating platform and bonding actuator of FIG. 6, further including an alignment actuator. FIG. 8 includes a process flowchart of a method for bonding a die to a bonding portion of a bonding substrate using the die bonding system of FIG. 1. FIG. 9 includes a processing flowchart of a more detailed part of the method of FIG. 8. FIG. 10 includes an example of a side view of a die bonding system of FIG. 1, further comprising a set of dies connected to an array of die chucks and a bonding substrate connected to a bonding substrate chuck. FIG. 11 includes an example of a cross-sectional view of a die chuck and a die from a set of dies of FIG. 10 before bending a specific die. FIG. 12 includes an example of a side view of the die bonding system of FIG. 10 before moving a set of dies over a corresponding die bonding site on a bonding substrate. FIG. 13 includes an example of a cross-sectional view of a die chuck and a die from a set of dies of FIG. 12 while the die is bending. FIG. 14 includes an example of a cross-sectional view of a die chuck, a specific die, and a bonding substrate when a specific die initially contacts the die bonding portion of the bonding substrate. FIG. 15 includes an example of a cross-sectional view of the die chuck, a specific die, and a bonding substrate of FIG. 14 when the die is bonded to the die bonding portion of the bonding substrate. FIG. 16 includes an example of a side view of the die bonding system, set of dies, and bonding substrate of FIG. 15 after the die chucks of the array of bonding heads are no longer connected to the set of dies. It is obvious to those skilled in the art that the components of the attached drawings are illustrative for brevity and are not necessarily drawn to scale. For example, to aid in understanding the embodiment of the concept of the present invention, the dimensions of some components of the attached drawings may be exaggerated compared to other components. Specific details for implementing the invention

[0027] The following description, in combination with the accompanying drawings, is provided to aid in understanding the technology described herein. The following description focuses on a specific implementation of the technology. This focus is provided to aid in explaining the technology and should not be interpreted as a limitation on the scope of protection or application of the invention.

[0028] Unless otherwise noted, all technical and scientific terms used in this invention have the same meaning as generally understood by those skilled in the art to which this invention pertains. Materials, methods, and examples are given by way of example and should not be interpreted restrictively. Unless otherwise described in this invention, all details regarding specific materials and treatments are general and can be found in books and other sources in the art.

[0029] A die bonding system may be used to bond a die to a bonding substrate. The die bonding system may include a die bonding head and a die chuck connected to the die bonding head. The die bonding head may include a frame, a movable platform configured to hold the die chuck, a set of bonding actuators operably connected to the frame and the movable platform, and a set of alignment actuators operably connected to the frame and the movable platform. Each bonding actuator may be connected to the frame via a corresponding bonding flexure, and each alignment actuator may be connected to the frame via a corresponding alignment flexure. In one embodiment, the set of bonding actuators may include at least three bonding actuators. For example, the set of bonding actuators may be three bonding actuators. In the same or different embodiments, the set of alignment actuators may be at least three alignment actuators. The alignment actuator set may consist of three or four alignment actuators. Accordingly, the number of bonding actuators may be equal to or different from the number of alignment actuators. The orientation of the set of bonding actuators may be determined so that the linear driving direction for the operating platform is the Z direction, and the alignment actuators can move the operating platform in an XY plane perpendicular to the Z direction.

[0030] The die bonding system can achieve high manufacturing throughput by achieving high precision in bonding the die to the bonding substrate. In one embodiment, the die bonding system can achieve a straight travel range in the X direction of up to + / -0.90% of the length of the operating platform and a straight travel range in the Y direction of up to + / -0.90% of the width of the operating platform. In the same or other embodiments, the die bonding system can have a straight travel range in the X direction of up to + / -50 µm, up to + / -100 µm, or up to + / -200 µm, and a straight travel range in the Y direction of up to + / -50 µm, up to + / -100 µm, or up to + / -200 µm. In either or both of the previous embodiments or other embodiments, the movable platform is characterized by including a first rotation around the z-axis extending in the Z direction through the center of mass of the movable platform, and the angular travel range of the first rotation is a maximum of + / -50 mrad, a maximum of + / -20 mrad, a maximum of + / -10 mrad, a maximum of + / -6 mrad, or a maximum of + / -3 mrad.

[0031] The die bonding system can achieve a control cycle frequency of at least 50 Hz, at least 200 Hz, at least 500 Hz, or at least 1.1 kHz. In one embodiment, the die bonding system (100) may be performed at a control cycle frequency of up to 5 kHz. The control cycle frequency corresponds to the time from when one or more signals corresponding to the position of a movable object, such as a movable platform, begin to be processed for the current control cycle until when the control of the movable object, such as a movable platform, is completed from the previous direction to the new direction, and this control is performed in response to the processing of signals during the current control cycle. The die bonding system and method will be more clearly understood from this specification in conjunction with the accompanying drawings.

[0032] The embodiments described herein are exemplary and do not limit the scope of protection of the present invention. Although most die chucks are described for an array of bonding heads and most die chucks are described for an array of die transfer seats, a die chuck for an array of bonding heads may be used for an array of die transfer seats, and a die chuck for an array of transfer seats may be used for an array of bonding heads. Most of the following description is for an array of die bonding heads. The concepts described in the present invention may also be applied to an array of die transfer seats.

[0033] FIG. 1 includes a conceptual diagram of a die bonding system (100) that can be used to bond a die to a die bonding portion of a bonding substrate connected to a substrate chuck (148). The die bonding system (100) may be a single device or more than one device. In one embodiment, the die bonding system (100) may be equipped with other devices or equipment not illustrated in FIG. 1.

[0034] FIG. 1 includes a device configuration of a die bonding system (100) and does not include a die and a bonding substrate. The die bonding system (100) includes a bridge (120), a base (140), a controller (160) connected to one or more components connected to the bridge (120), the base (140), or the bridge (120) or the base (140), and a memory (162) connected to the memory (160). The bridge (120) may be connected to an array (124) of bonding heads, a reference (126) having one or more alignment marks, and alignment hardware (128). The base (140) may be connected to a bonding carriage (146). Although not illustrated, the die bonding system (100) may include a die transfer sheet (e.g., a pickup head, part of a pick-and-place tool, etc.) that can be used to move the die to an array (124) of bonding heads, and optionally may further include a source chuck that can be used to hold a source substrate containing the die to be bonded to a bonding substrate.

[0035] In FIG. 1 and other drawings, the bridge (120), the base (140), and the components physically between the bridge (120) or the base (140) may be configured along the X direction, the Y direction, the Z direction, or a combination thereof. For a cross-sectional view or a side view, the X direction lies between the left and right sides of the drawing, the Z direction lies between the top and bottom sides of the drawing, and the Y direction lies inside and outside the paper of the drawing. Unless explicitly stated otherwise, rotation occurs along the XY plane defined by the X direction and the Y direction.

[0036] An array (124) of bonding heads may be arranged as a vector (rows or columns of bonding heads) or as a matrix (at least two rows and at least two columns of bonding heads). With respect to the matrix, the number of bonding heads in the array (124) of bonding heads may vary by row, by column, or by row and by column. Some array configurations may include 3x1, 6x1, 2x2, 2x3, 2x4, 4x2, 10x10, or other rectangular shapes, where the first number corresponds to the number of bonding heads along a row or column and the second number corresponds to the number of bonding heads along the remainder of the row or column. Theoretically, dies from the entire wafer may be transported all at once. In such a configuration, from the bottom view, the array of bonding heads (124) may have fewer bonding heads along rows closer to the top or bottom of the array compared to rows or pairs of rows closer to the center of the array, and the array of bonding heads (124) may have fewer bonding heads along columns closer to the left or right of the array compared to columns or pairs of columns closer to the center of the array. Through this specification, a configuration of the array of bonding heads (124) that satisfies the requirements of a specific application can be determined.

[0037] Any one or all of the multiple bonding heads (124) may include a bonding head body (1242). Further details regarding the bonding head body (1242) will be illustrated and described in greater detail later in this specification. The bonding head body (1242) may be connected to a die chuck (1244). The die chuck (1244) may be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, an edge-gripping chuck, an ultrasonic chuck, or a Bernoulli chuck. The die chuck (1244) may be configured to adjust the shape of the die during the die bonding process.

[0038] Alignment hardware (128) is connected to the bridge (120). Alignment hardware (128) includes optical components and may provide information to a controller (160), or to a local controller located within the alignment hardware (128), the bridge (120), the base (140), or a component connected to the base, or a combination thereof. Information from the alignment hardware (128) may be used to determine the bonding pitch for the die bonding site on the bonding substrate (1048) (shown in FIG. 9). Furthermore, this information may be used to identify or verify whether the bonding substrate (1048) is the correct substrate on which the die will be transferred, and to identify or verify the location of the bonding site for the die on the bonding substrate (1048).

[0039] Alignment hardware (158) is connected to the bonding trolley (146). The alignment hardware (158) may include optical components and provide information to a controller (160), or to a local controller positioned within the alignment hardware (158), the bonding trolley (146), the base (140), or a combination thereof. The alignment hardware (158) may be used to align the bonding trolley (146) to one or more alignment marks of the reference (126), to align the bonding trolley (146) to an array (124) of bonding heads, or to perform both. The alignment hardware (158) may provide information used to adjust the position of the die chuck (1244) within the array (124) of bonding heads.

[0040] The die bonding system (100) may be controlled by a controller (160) by communicating with a bridge (120), a component connected to the bridge (120), a base (140), a component connected to the base (140), or a combination thereof. The controller (160) may optionally operate using a computer-readable program stored in memory (162). The controller (160) may include a processor (e.g., a microprocessor or a central processing unit of a microcontroller), a field programmable gate array (FPGA), an application-specific integrated circuit (ASIC), or other electrical components configured to execute commands in hardware, software, or firmware. The controller (160) may further include internal memory such as a set of registers, cache memory, flash memory, or other memory. The controller (160) may be placed inside the die bonding system (100). In another embodiment (not shown) of the die bonding system (100), the controller (160) may be at least part of a computer outside the die bonding system (100), such computer being connected to the die bonding system (100) bidirectionally. The controller (160) may have one or more processors communicating via a bus, a local area intranet, or a wide area internet. In another embodiment, a component connected to the bridge (120), a base (140), or a component connected to the base (140) may have a local controller that provides some of the functions not provided by the controller (160).

[0041] Memory (162) may include a non-transient computer-readable medium containing instructions for executing operations related to hybrid bonding operations. Memory (162) may include a non-transient computer-readable medium containing instructions for executing operations related to die bonding operations. Memory (162) may include a set of registers, cache memory, flash memory, hard drive, or other memory. Memory (162) may further include a data table accessible by a controller (160) to help determine operation parameters such as the placement of a moving platform in an XY plane, the bonding of a die to a bonding substrate inside the die bonding system (100), or all of these, as described below, for example.

[0042] FIGS. 2 and 3 include side and top views of a movable body (200) and flexers 243, 244, 246, 342, 344, 346, and 348. In one embodiment, flexers 242, 244, and 246 are a set of bonding flexers that can be connected to a corresponding bonding actuator described below in this specification. In the same or different embodiments, flexers 342, 344, 346, and 348 are a set of alignment flexers that can be connected to a corresponding alignment actuator described below in this specification.

[0043] As force is applied, F in FIGS. 2 and FIGS. 3 X1 , F X2 , F Y1 , F Y2 , F Z1 , F Z2 , F Z3 It is indicated as such. In one implementation, force may be applied by actuators (shown in subsequent drawings). Each actuator may be a voice coil actuator, a piezoelectric actuator, a stepper motor, a servo motor, or a thermal expansion actuator.

[0044] When a force is applied in a specific linear direction, e.g., the Z direction, its corresponding flexure is in one or more other directions, e.g., the X direction, the Y direction, θ Z (Rotation around an axis extending in the Z direction (perpendicular to the XY plane) through the center of the movable object), θ X (Rotation around an axis extending in the X direction through the center of a movable object, also called a tip), θ Y It can help reduce unwanted movement (rotation around an axis extending in the Y direction through the center of a moving object, also called tilt), or a combination thereof. A flexure may include one or more flexures. For example, a flexure may include a wire flexure, a parallelogram-based flexure, a lead hinge flexure, a notch hinge flexure, or a combination thereof. Each flexure has a center of stiffness. The center of stiffness is a specific point within the flexure where applying force causes linear translational motion at the moving end of the flexure and reduces parasitic motion.

[0045] In Fig. 2, three forces in the Z direction, F Z1 , F Z2 and F Z3 A can be applied to the ends of the flexors 242, 244, and 246. The ends of the flexors 242, 244, and 246 can be connected, and in a specific embodiment, are connected to a movable body (220) at positions 262, 264, and 266.

[0046] As used herein, a connection may include a connection between two or more objects. However, not all connections are connections. Two or more objects are connected but not connected when the movement of the first object does not cause the same movement in another object simultaneously. As described below, one or more actuators may be connected to a movable object (200) via flexures 242, 244, 246, 342, 344, 346, and 348. Such actuator(s) are not connected to the movable object (220) but may be connected to one another. Thus, a connection is a subset of connections, and not all connections are connections.

[0047] In relation to the connection, two or more objects are connected when they are maintained in a fixed position relative to each other and do not move detectably relative to each other. The connection may or may not involve physical contact between the two objects. For example, in relation to the absence of physical contact, the two objects are separated from each other and do not have to physically contact each other because a washer or gasket is placed between the two objects. Since the two objects and the washer or gasket are maintained in a fixed position relative to each other, the two objects and the washer or gasket are part of the physical connection. In another embodiment, the washer or gasket may or may not be present, and the two objects are in contact with each other. Thus, the connection between the two objects may or may not involve physical contact between the two objects.

[0048] Referring to Fig. 3, there are two forces in the X direction, namely F X! and F X2 A can be applied to the ends of flexors 342 and 344, and two forces in the Y direction, namely F Y1 and F Y2A can be applied to the ends of flexers 346 and 348. The bases of flexers 342, 344, 346 and 348 can be connected to a movable body (220) at positions 362, 364, 366 and 368.

[0049] In another implementation, the force and flexure pairs along the XY plane may have three force and flexure pairs instead of the four pairs shown in FIG. 3. The forces may be applied toward the center, wherein the forces are offset from each other by 120 degrees (e.g., in the 4 o'clock, 8 o'clock, and 12 o'clock directions).

[0050] FIG. 4 includes a perspective view of a portion of a bonding head body (1242) when the upper frame member (440) is on top of the lower frame member (460), and FIG. 5a includes a perspective view of a portion of a bonding head body (1242) when the lower frame member (460) is on top of the upper frame member (440). That is, FIG. 5a includes an example of this portion after the portion of the bonding head body (1242) of FIG. 4 has been inverted. The bonding head body (1242) may include an inner frame member (420), an upper frame member (440), and a lower frame member (460). The inner frame member (420), the upper frame member (440), and the lower frame member (460) are connected to each other. In one embodiment, the inner frame member (420), the upper frame member (440), and the lower frame member (460) are connected to each other such that the frame members are in a fixed position relative to each other.

[0051] In an implementation such as that shown in FIG. 4 and FIG. 5a, the movable object is a movable platform (480). The movable platform (480) is connected to one or more frame members 420, 440 and 460 but is not connected to any of the frame members 420, 440 and 460. Since the movable platform (480) is not connected to any of the frame members 420, 440 and 460, it may be considered a floating object.

[0052] Referring to FIGS. 1, 5a, and 5b, a die chuck (1244) may be connected to a bonding head body (1242) and, in particular, to the bottom surface of a movable platform (480) via a die chuck retaining plate (560). The die chuck (1244) includes a die retaining area (572) configured to maintain and adjust the shape of the die. In FIG. 5b, the die retaining area (572) is centered at the center of the die chuck (1244), but this is not an essential feature. The die retaining area (572) may instead be offset from the center of the die chuck (1244). This may be done to allow the pitch between adjacent bonding heads to be reduced. In FIG. 5b, the lower frame member (460) is not shown to better illustrate the relationship between the die chuck (1244) and the movable platform (480). In the same or different implementations, the operating platform (480) may be configured to hold the die chuck (1244) within the die chuck holding area (482). The die chuck holding area (482) may include at least a portion of the exposed surface along the bottom of the operating platform (48). The placement of the die chuck (1244) is adjustable within the die chuck holding area (482). In one implementation, while the die chuck (1244) is held within the die chuck holding area (482), the center of the die holding area (572) of the die chuck (1244) is placed within a polygon, such as a triangle or a square, wherein the polygon may or may not be a square, hexagon, octagon, irregular polygon, or other two-dimensional formation. The vertices of the polygon are placed at the locations where the set of bonding actuators 462, 644, and 646 apply bonding force to the operating platform (480).

[0053] In one embodiment, the movable platform (480) has a length in the X direction, a width in the Y direction, and a thickness in the Z direction, wherein length ≥ width > thickness. In a non-limiting embodiment, the movable platform (480) may have a length dimension of 125 mm and a Y direction dimension of 125 mm. Many other sizes may be used.

[0054] The position of the operating platform (480) can be determined using position sensors 431, 432, 433, 434, 435, 436, 437, and 438. Position sensors 431, 432, 433, 434, 435, 436, 437, and 438 may be based on capacitance, induction, Hall effect, magnetostriction, optical interference, light received by the sensor, or proximity sensor. Position sensors 431, 432, 433, 434, 435, 436, 437, and 438 may be one or more types of position sensors, including capacitive sensors, inductive proximity sensors, Hall effect sensors, magnetostriction sensors, optical micrometers, spectroscopic interference placement sensors, confocal placement sensors, and interferometric displacement sensors. Each position sensor is a non-contact sensor that provides the position of a movable body along one or more axes to a controller (160). In one embodiment, position sensors 431, 432, 433, 434, 435, 436, 437 and 438 may be connected to any one of frame members 420, 440 and 460. In another embodiment, there may be more or fewer position sensors than this.

[0055] FIGS. 4, FIGS. 5a, and FIGS. 5b further comprise actuators 442, 444, 446, and 448, which may be any one of the types of actuators described above. Actuators 442, 444, 446, and 448 are a set of alignment actuators that can be operably connected to a frame such as an internal frame member (420) and a movable platform (480). Actuators 442, 444, 446, and 448 can be connected to the internal frame member (420). Each of the alignment actuators 442, 444, 446, and 448 may be configured to apply an alignment force to the movable platform (480) along an alignment force plane perpendicular to a central axis passing through the center of the movable platform (480). In the same or different embodiments, actuators 442, 444, 446 and 448 move the operating platform (480) in the X direction, Y direction and θ Z It can be used to move to.

[0056] In one embodiment, when the movable platform (480) is in a neutral state (when no net force is applied in the X and Y directions, respectively), each alignment actuator within the alignment actuators 442, 444, 446, and 448 may be configured to move the movable platform (480) along a plane perpendicular to the central axis passing through the movable platform (480) in the Z direction. This plane passes through the center of mass of the movable platform (480). Such a configuration is such that when the alignment actuator applies force to the movable platform (480), θ X and θ Y It is useful for reducing the possibility of unintended rotation of the row.

[0057] In any one or additional embodiment of the above-described embodiments, actuators 442, 444, 446 and 448 are operably connected to the operating platform (480) and are not connected. Actuator 442 may be operably connected to the operating platform (480) via flexure 342, actuator 444 may be operably connected to the operating platform (480) via flexure 344, actuator 446 may be operably connected to the operating platform (480) via flexure 346, and actuator 448 may be operably connected to the operating platform (480) via flexure 348. Each pair of alignment actuators and their corresponding alignment flexures are operably connected and, in a particular embodiment, connected to the frame and the operating platform (480).

[0058] FIG. 6 includes a planar perspective view of a portion of the bonding head body (1242) of FIG. 4, FIG. 5a, and FIG. 5b. Compared to FIG. 4, to illustrate the relationship between the movable platform (480) and the bonding actuator-flexer pair along the bonding direction, FIG. 6 removes the upper frame member (440), position sensors 431, 432, 433, 434, 435, 436, 437, and 438, and actuator-flexer pairs (actuators 442, 444, 446, and 448 and flexers 342, 344, 346, and 348) positioned along the XY plane.

[0059] Actuators 642, 644, and 646 are a set of bonding actuators that can be operably connected to a frame, such as an upper frame member (440) and a movable platform (480). Each of the bonding actuators 642, 644, and 646 may be configured to apply a bonding force to the movable platform in a z-direction parallel to a central axis passing through the center of the movable platform (480) and offset from the central axis. The set of bonding actuators 642, 644, and 646 is the z-direction, θ of the movable platform (480) relative to the frame. Xand θ Y It can be configured to adjust the position. The position where the bonding actuators 642, 644, and 646 (exemplified in FIG. 6) apply bonding force to the operating platform (480) can be the vertex of the die chuck holding area (482).

[0060] Any one or all of the bonding actuators 642, 644, and 646 may be configured to apply a bonding force to the operating platform (480) that is different from the alignment force applied to the operating platform (480) by any one or more of the alignment actuators 442, 444, 446, and 448. The bonding actuators 642, 644, and 646 may be configured to supply a peak bonding force to the operating platform (480). In one embodiment, the peak bonding force of one or more of the bonding actuators 642, 644, and 646 may be at least 110 times the peak alignment force of any one or more of the alignment actuators 442, 444, 446, and 448. Bonding actuators 642, 644, and 646 may be configured to apply a bonding force sufficient to overcome the adjustment of the die shape so that the die follows the die bonding plane of the bonding substrate. Bonding actuators 642, 644, and 646 together supply the bonding force and the force required to overcome the flexures. The bonding force has a range of 20 N to 100 N. The force required to overcome the flexure stiffness in the bonding direction has a range of 5 N to 10 N. Each of the alignment actuators 442, 444, 446, and 448 only needs to overcome the flexure stiffness perpendicular to the bonding direction, which has a range of 1 N to 7 N per actuator. Each of the bonding actuators 642, 644, and 646 is designed to supply a peak force greater than the peak force supplied by each of the alignment actuators. In one embodiment, each of the bonding actuators supplies 2 to 100 times the force of each of the alignment actuators.

[0061] In either of the aforementioned embodiments or additional embodiments, actuators 642, 644, and 646 are operablely connected to the operating platform (480) but are not connected. Actuator 642 may be operablely connected to the operating platform (480) via flexure 242, actuator 644 may be operablely connected to the operating platform (480) via flexure 244, and actuator 646 may be operablely connected to the operating platform (480) via flexure 246. Each pair of bonding actuators and their corresponding bonding flexures are operablely connected and, in a particular embodiment, connected to the frame and the operating platform (480). Actuators 442, 444, 446, 448, 642, 644, and 646 can each be connected to the ends of flexors 342, 344, 346, 348, 242, 244, and 246. Each of actuators 442, 444, 446, 448, 642, 644, and 646 is configured to apply force through the center of rigidity of the flexor to which it is connected.

[0062] Electrical connections to actuators 442, 444, 446, 448, 642, 644, and 646 exist, but are not shown in the drawing to facilitate understanding of the positional relationship between actuators 442, 444, 446, 448, 642, 644, and 646, flexors 242, 244, 246, 342, 344, 346, and 348 and the operating platform (480).

[0063] Any one or more of actuators 442, 444, 446, 448, 642, 644, and 646 may include a stop portion and a moving portion. The stop portion may be connected to any of frame members 420, 440, and 460. In one embodiment, the stop portion of alignment actuators 442, 444, 446, and 448 is connected to an inner frame member (420), and the stop portion of bonding actuators 642, 644, and 646 is connected to an upper frame member (440). In the same or different embodiments, the moving part of actuator 442 may be connected to the end of flexer 342, the moving part of actuator 444 may be connected to the end of flexer 344, the moving part of actuator 446 may be connected to the end of flexer 346, the moving part of actuator 448 may be connected to the end of flexer 348, the moving part of actuator 642 may be connected to the end of flexer 242, the moving part of actuator 644 may be connected to the end of flexer 244, and the moving part of actuator 646 may be connected to the end of flexer 246. The bases of the flexors 242, 244, 246, 342, 344, 346 and 348 are connected to the operating platform (480).

[0064] FIG. 7 includes a simplified plan view to illustrate a movable platform (480), actuators 442, 444, 446, 448, 642, 644, and 646, and flexors 36, 342, 344, 346, and 348. FIG. 7 may be a specific embodiment of a part of the die bonding system illustrated in FIG. 2. Although flexors 242, 244, and 246 exist between actuators 642, 644, and 646 and the movable platform (480), these flexors 242, 244, and 246 are not visible in the plan view illustrated in FIG. 7.

[0065] The die bonding system exemplified and described in the present invention can achieve good performance required for high-precision hybrid bonding. The linear travel range described below is for a movable object that can move linearly in a first direction, also called the bonding direction. The second and third directions are perpendicular to the first direction and to each other. In one embodiment, the movable object may be a movable platform (480) of the die bonding system (100). The bonding direction may be the Z direction, and the second and third directions may be the X direction and the Y direction. The movable platform (480) may be configured to achieve a position within the XY plane.

[0066] The straight travel range of the operating platform (480) in the Z direction is sufficient so that the die held by the die chuck (1244) can be bonded to the die bonding portion of the bonding substrate. In the X and Y directions, the operating platform (480) may not need to move that much. The straight travel range of the operating platform (480) in the die bonding direction, in this example, the Z direction, is greater than the straight travel range in the two vertical directions, in this example, the X direction and the Y direction. The straight travel range of the operating platform (480) in the Z direction may be at least 1.1 times, at least 2.0 times, at least 3.0 times, or at least 5.0 times the straight travel range of the operating platform (480) in the X direction and the Y direction, respectively. In one embodiment, the straight travel range of the operating platform (480) in the Z direction may be up to 40 times the straight travel range of the operating platform (480) in the X direction and the Y direction, respectively.

[0067] The straight travel range in the first direction may be up to + / -2.5% of the length of the operating platform (480) or up to + / -2.5% of the width of the operating platform (480). In the same or different implementations, the straight travel ranges in the second and third directions may be up to + / -0.90%, up to + / -0.50%, or up to + / -0.25% of the length of the operating platform (480) or up to + / -0.90%, up to + / -0.50%, or up to + / -0.25% of the width of the operating platform (480).

[0068] The straight-line travel range can be expressed as an actual distance relative to a relative value. In one embodiment, the straight-line travel range in the first direction may be up to + / -2000 µm, up to + / -500 µm, or up to + / -50 µm. In the same or different embodiments, the straight-line travel ranges in the second and third directions may be up to + / -2000 µm, up to + / -50 µm, or up to + / -10 µm.

[0069] The aforementioned first, second, and third directions may have corresponding angular travel ranges. Rotation for these directions is θ DD , θ Tip and θ Tilt It may include, where θ DD is rotation around the axis in the driving direction, and θ Tip is a rotation about the axis in the second direction, and θ Tilt is rotation around the axis in the third direction. In one implementation, θ DD The angular travel range for may be up to + / -50 mrad, up to + / -3 rad, or up to + / -0.1 mrad. In the same or different implementations, θ Tip and θ Tilt Each may have an angular travel range of up to + / -50 mrad, up to + / -1 rad, or up to + / -0.1 mrad. Referring to FIGS. 2 through 7, the die bonding system (100) is configured so that the operating platform (380) moves in the Z direction. Because of this, θDD is θ Z It can be, and θ Tip is θ X It can be, and θ Tilt is θ Y It may be. The inventors have discovered that the reproducibility of the bonding head is as follows: the absolute value of the straight travel range in the X direction is less than 10 nm, the absolute value of the straight travel range in the Y direction is less than 10 nm, the absolute value of the straight travel range in the Z direction is less than 30 nm, and θ DD The absolute value of the directional angle travel range is less than 3 mrad, and θ Tip The absolute value of the directional angle travel range is less than 3 mrad, and θ Tilt The absolute value of the angle of travel range of the direction is less than 3 mrad.

[0070] When transferring a set of dies to a die bonding site on a bonding substrate, attention is turned to a method of bonding the dies to the die bonding site on the bonding substrate using a die bonding system (100). A processing flow for this method is shown in FIG. 8. FIG. 9 includes details of at least some of the operations that may occur when performing the operation of block 842 of FIG. 8.

[0071] This method may involve transferring a set of dies to an array of bonding heads in block 822 of FIG. 8. In FIG. 10, the die transfer trolley (not shown) and the bonding trolley (146) are moved to the right. The die transfer trolley is moved so that the array of bonding heads (124) is placed on top of the array of die transfer sheets. If necessary or desirable, alignment hardware 28, alignment hardware 158, or both can be used to ensure that the array of die transfer sheets (not shown) is properly positioned relative to the array of bonding heads (124). The controller (160) or local controller may transmit a signal to cause the die transfer sheets within the array of die transfer sheets to extend toward the bonding heads within the array of bonding heads (124), or the bonding heads within the array of bonding heads (124) to extend toward the die transfer sheets within the array of die transfer sheets, or both. A set of dies (1022) is held by die chucks (1244). A bonding substrate (1048) is connected to a substrate chuck (148). A black band along the set of dies (1022) and the bonding substrate (1048) indicates an activated surface that helps bond the set of dies (1022) to the bonding substrate (1048). In a non-limiting embodiment, the activated surface may be a hydrolyzed surface of silicon oxide material.

[0072] FIG. 10 includes a set of dies (1022) after being transferred from a die transfer sheet to an array of bonding heads (124). FIG. 11 includes a specific die (1122) within the set of dies (1022) held by a bonding head (124). Referring to FIG. 1, FIG. 10 and FIG. 11, a controller (160) or a local controller may transmit a signal for a bonding head within the array of bonding heads (124) to operate a pressure actuator to depressurize zone 1165 between Euro 1135 and lands 1152 and 1154. The vacuum within zone 1165 may be sufficient to hold a specific die (1122), which is one die within the set of dies (1022). Euro 1139 and Zone 1169 may be at atmospheric pressure or near atmospheric pressure, or depressurized as Euro 1135 and Zone 1165. The controller (160) or local controller may or may not transmit a signal to achieve the desired pressure (vacuum, atmospheric pressure, or near atmospheric pressure) by operating the pressure actuator for Euro 1139.

[0073] The method may further include the step of performing registration, alignment, and measurement on the set of dies and the bonding portions of the bonding substrate in block 842 of FIG. 8. FIG. 9 includes at least some of the operations performed in block 842. Additional operations may or may not be performed in addition to the operations listed in FIG. 9. Thus, (1) one or more operations may occur after block 822 of FIG. 8, (2) one or more operations may occur before block 862 along the YES branch diamond (942) of FIG. 8, or both (1) and (2) may occur.

[0074] Referring to FIG. 9, the method may include the step of receiving a controller signal from alignment hardware in block 922. Alignment hardware 128 can obtain information regarding the bonding substrate (1048), and alignment hardware 158 can obtain information regarding the set of dies (1022).

[0075] A controller (160) or a local controller may receive a signal regarding information about a bonding substrate (1048) from alignment hardware 128. This signal may include information that may or may not correspond to part number(s) for the bonding substrate (1048). Using such information, it may be possible to verify whether the correct bonding substrate (1048) is connected to the substrate chuck (148). If the information includes part numbers, the controller (160) or the local controller may obtain additional information about the bonding substrate (1048) from memory (162) or another memory, such as the location of bonding pads for the bonding substrate (1048), the size of bonding pads for the bonding substrate (1048), the topology of the bonding substrate (1048) to which a set of dies (1022) is bonded to the substrate (1048), or other information related to the surface of the bonding substrate (1048). Such information may be based on the design of the bonding substrate (1048). Thus, area dimensions or positions may represent design values ​​rather than actual values ​​for the parameters. Since design information is not required for all implementations, obtaining design information may or may not be performed.

[0076] Alternatively, information regarding actual values ​​for the positions of bonding pads on the bonding substrate (1048), the size of the bonding pads on the bonding substrate (1048), and the topology of the bonding substrate (1048) on which a set of dies (1022) is bonded to the substrate (1048) may be determined by the controller (160) or the local controller based at least in part on signals transmitted by the alignment hardware 128 and received by the controller (160) or the local controller, in addition to design values.

[0077] A controller (160) or a local controller may receive a signal regarding information about a set of dies (1022) from alignment hardware 158. This signal may include information that may or may not correspond to part number(s) for the set of dies (1022). Using such information, the correct dies to be bonded to a bonding substrate (1048) can be identified. If the information includes part number(s), the controller (160) or the local controller may obtain additional information about the set of dies (1022), such as area dimensions of the dies within the set of dies (1022), locations of bonding pads within the set of dies (1022), sizes of bonding pads within the set of dies (1022), or other information related to the surfaces of the dies within the set of dies (1022), from memory (162) or another memory. Such information may be based on the design of the set of dies (1022). Thus, information related to the set of dies (1022) may display design values ​​rather than actual values. Design information may or may not help to perform registration or measurement more quickly. Since design information is not required for every implementation, obtaining design information may or may not be done.

[0078] Alternatively, or in addition to design values, information regarding actual values ​​for the area dimensions of the dies (1022), the positions of bonding pads inside the dies for the set of dies (1022), the sizes of bonding pads for the set of dies (1022), or other information related to the surface of the dies inside the set of dies (1022) may be determined by the controller (160) or the local controller based at least in part on signals transmitted by the alignment hardware (158) and received by the controller (160) or the local controller. In one embodiment, alignment information of the dies is collected together with the dies positioned in a plane that coincides with the bonding plane to reduce unobservable alignment errors caused by the Z-motion of the bonding head. In one embodiment, alignment information of the dies is collected when the dies are positioned in the bonding plane while the substrate chuck (148) is not on the opposite side of the array of bonding pads.

[0079] The controller (160) or local controller can determine whether the relative positions of the die bonding sites within the bonding substrate (1048) and the set of dies (1022) are within the tolerance on the determination diamond 942 of FIG. 9 using information generated from signals from the alignment hardware 128 and 158. These positions include the difference in the X direction, the difference in the Y direction, the difference in the Z direction, and θ X Difference, θ Y Difference, and θ Z One or more of the differences may be included. If all differences are equal to or smaller than the tolerance, processing may proceed along the YES branch from judgment diamond 942. The tolerance is selected based on the size and pitch of the bonding pads to be bonded. In one embodiment, the tolerance may be up to 100 nm, up to 50 nm, up to 20 nm, up to 10 nm, up to 5 nm, up to 2 nm, or up to 1 nm depending on the die being bonded.

[0080] If one or more of the differences are greater than their corresponding tolerance, processing proceeds along the NO branch from the determination diamond 942. This method includes the step of determining the adjustment(s) to be performed on the operating platform in block 962. Position sensors 431, 432, 433, 434, 435, 436, 437, and 438 may provide information regarding the position of the operating platform (480) before the adjustment is performed. Accordingly, this method may include the step of processing signals from the position sensors for the operating platform in a controller in block 964. The controller (160) or local controller may receive signals from position sensors 431, 432, 433, 434, 435, 436, 437, and 438. If information regarding the location has previously been received from location sensors 431, 432, 433, 434, 435, 436, 437, and 438, the acquisition of information at this time may be omitted. A controller or local controller can determine the current location of the operating platform (480) by processing the information received from location sensors 431, 432, 433, 434, 435, 436, 437, and 438.

[0081] This method may further include the step of adjusting the position of the operating platform in block 966. The controller (160) or local controller may transmit one or more signals to one or more actuators 442, 444, 446, 448, 642, 644, and 646 that can move the platform (480).

[0082] Actuators 442, 44, 446, and 448 are in the X direction, Y direction, and θ Z It can affect the motion of. X direction, Y direction and θ Z The movement of is the aforementioned straight-line travel range for the X and Y directions and θ ZThe relative position of the bonding pads of the set of dies (1022) and the bonding pads of the bonding substrate (1048) within the angle travel range can be affected. The adjustment made to such movement can help achieve good electrical and physical contact and acceptablely low contact resistance compared to the case where no adjustment is made.

[0083] Actuators 642, 644, and 646 are in the Z direction, θ X and θ Y It may affect the movement of. Ideally, as shown in FIGS. 10 and 11, the bonding surface of the set of dies (1022) and the bonding pads inside the bonding substrate (1048) are completely parallel to each other. In reality, the bonding surface of the set of dies (1022) and the bonding pads inside the bonding substrate (1048) may or may not be completely parallel to each other. Z direction, θ X and θ Y The movement is such that the relative positions of the bonding pads of the bonding substrate (1048) and the bonding surface of the set of dies (1022) are in the Z direction, θ X and θ Y to The allowable range may be affected. Adjustments made for such movement may help reduce the likelihood of damage to any die in the set of dies (1022), any bonding site in the bonding substrate (1048), or a combination of any die in the set of dies (1022) and bonding sites in the bonding substrate (1048) due to non-uniform contact when force is applied during bonding of one or more dies in the set of dies (1022), one or more bonding sites in the bonding substrate (1048).

[0084] This method may include the step of receiving a signal from the alignment hardware at the controller in block 968 of FIG. 9. In one embodiment, after the alignment is performed on the operating platform (480), the alignment hardware 158 may obtain information regarding the set of dies (1022). In the same or different embodiments, the alignment hardware 128 may obtain information regarding the bonding substrate (1048). The method continues by returning to the judgment diamond 942 to determine whether all dimensional differences are within the tolerance. If the dimensional difference between the set of dies (1022) and the bonding substrate (1048) is within the tolerance, the set of dies (1022), the bonding substrate (1048), or both are moved so that the set of dies (1022) overlaps with the corresponding die bonding site within the bonding substrate (1048) as shown in FIG. 12. Processing continues in block 862 of FIG. 8.

[0085] This method may further include the step of bending a set of dies while being held by an array of bonding heads in block 862 of FIG. 8. Data may be useful in determining how much pressure should be used to bend the set of dies (1022). For example, if a die occupies a larger area (X and Y direction dimensions) and is thinner (Z direction dimension), less pressure is required to bend the die compared to a die that occupies a smaller area, is thinner, or is both. If the die is attached to a support plate, the bonding thickness of the die and the support plate may be used to determine the pressure required to achieve the desired amount of bending. Data may be acquired for a number of different die areas and thicknesses. A memory (162), table, or database outside the die bonding system (100) may contain data associating the various areas and thicknesses of the die to be used with a positive pressure or a range of positive pressures to allow for sufficient bending of the die.

[0086] Referring to FIGS. 1 and 13, the controller (160) or local controller may transmit a signal to activate the pressure actuator so that the pressurized gas can increase the pressure within the path 1139 and zone 1169. By the pressure sensor detecting the pressure within the path 1139 and transmitting a signal to the controller (160) or local controller, the controller (160) or local controller may control the pressure to be within an acceptable tolerance or tolerance of the target pressure. When the pressure within zone 1169 increases, a specific die (1122) is bent away from the die chuck (1244) toward the base (140) or the bonding substrate (1048) connected to the base (140) (shown in FIG. 12). Fig. 13 shows a specific die (1122), and other dies within the set of dies (1022) may have a curved shape similar to the specific die (1122) shown in Fig. 13.

[0087] This method may include the step of bringing a set of dies and a die bonding site into contact while the dies are being bent in block 864 of FIG. 8. Referring to FIG. 1 and FIG. 14, an array of die chucks (1244) within an array of bonding heads (124) may be extended toward the bonding substrate (1048), or a substrate chuck (148) may be extended toward the array of bonding heads (124), or both may be done. As shown in FIG. 14, the center of a specific die (1122) contacts the die bonding site of the bonding substrate (1048) before other parts of a specific die contact the die bonding site. Because of this, there is substantially less chance of trapping air between the specific die (1122) and the bonding substrate (1048) than in the case where bending is not performed.

[0088] This method may further include the step of bonding a set of dies to a corresponding die bonding site on a bonding substrate in block 866 of FIG. 8. Referring to FIG. 1 and FIG. 15, the die chucks (1244) inside the array of bonding heads (124) may be extended further toward the bonding substrate (1048), or the substrate chuck (148) may be extended further toward the array of bonding heads (124), or both may be done. As the contact area between a specific die (1122) and the die bonding site of the corresponding bonding substrate (1048) increases, the amount of bending may be reduced.

[0089] Pressure is applied to bond a set of dies (1022) to a corresponding bonding site on a bonding substrate (1048). In one embodiment, the bonding may be oxide-oxide bonding. The force during bonding may be at least 5 N, at least 10 N, at least 20 N, at least 50 N, or at least 100 N. In one embodiment, regarding pressure, the pressure during bonding may be in the range of 0.5 N / cm² to 20 N / cm². A controller (160) or a local controller may transmit a signal to a motor, a hydraulic pressurization system, or other mechanical part that can be used to achieve bonding pressure by driving an array of bonding heads (124), a substrate chuck (148), or all of these in the Z direction. During bonding, if necessary or desirable, the pressure within zone 1169 may be an amount of pressure that is within or at an acceptable range of pressure applied by a motor, hydraulic pressurization system, or other mechanical part to allow for more uniform pressure along the surface of a set of dies (1022) including the specific die (1122) shown in FIG. 15. In other embodiments, the pressure within zone 1169 may be atmospheric pressure or near atmospheric pressure. In the same or different embodiments, the pressure within zone 1169 may be maintained at vacuum pressure, atmospheric pressure or near atmospheric pressure, or at a pressure nearly equal to that within zone 1169.

[0090] Bonding can be performed at room temperature (e.g., a temperature within the range of 20°C to 25°C). Bonding is performed at a lower temperature than the subsequent annealing to expand the conductive metal inside the die and the die bonding area. The temperature may be limited depending on the film present during bonding or the parts inside the die bonding system (100). For example, the temperature does not need to be higher than approximately 200°C. By reading this specification, a person skilled in the art will be able to determine the pressure and temperature used for bonding.

[0091] FIG. 16 includes a cross-sectional view of a die bonding system (100) after a set of dies (1022) has been bonded to a corresponding die bonding site on a bonding substrate (1048). At this point in the method, one transfer cycle has been completed. In one embodiment, for each die in the set of dies (1022), the maximum X-direction alignment error between the center of the die and the center of its corresponding die bonding site is 50 μm. In the same or other embodiment, for each die in the set of dies (1022), the maximum Y-direction alignment error between the center of the die and the center of its corresponding die bonding site is 50 μm. In either of the aforementioned or other embodiments, for each die in the set of dies (1022), the maximum θ between the die and its corresponding die bonding site Z It can be up to 3 mrad.

[0092] At decision diamond 868 of FIG. 8, a decision is made as to whether to bond more dies to the bonding substrate. If more dies are to be transferred ("YES" branch), the method continues at block 822, and the next set of dies is transferred during another transfer cycle. This method can be repeated as many times as necessary to have the desired number of dies on the bonding substrate (1048). If no more dies need to be transferred ("NO" branch from decision diamond 868 of FIG. 8), the transfer operation ends.

[0093] The hybrid bonding process may include three steps, including a bonding operation, an initial annealing in which the metals inside the die and at the die bonding site expand to come into contact with each other, and an optional second annealing in which metal atoms cross the metal-metal interface to reduce contact resistance. The aforementioned method corresponds to the bonding operation.

[0094] After all transfer cycles are performed and the transfer operation is completed, the bonding substrate (1048) and its corresponding bonded die may be annealed at a temperature in the range of 180°C to 400°C. In one embodiment, annealing may be performed at one or more temperatures. As the temperature of the conductive metal increases, the conductive metal expands. The conductive metal in the electrical component within the bonding substrate (1048) comes into contact with the conductive metal in the bonded die, creating a physical and electrical coupling between the conductive metals. If necessary or desirable, the annealing temperature may be further increased so that the conductive metal can cross the interface between the bonding substrate (1048) and the electrical component within the bonded die, thereby reducing contact resistance. In one embodiment, the physical and electrical coupling may be a physical and electrical connection. Thus, the set of electrical components within the bonded die and the bonding substrate (1048) allows voltage to pass between the bonded substrate and the set of electrical components, thereby allowing current to flow. The bonding substrate (1048) can be removed by the die bonding system (100), moved to another part of the die bonding system (100), or annealed using other tools.

[0095] This method may further include the step of performing one or more post-bonding operations in block 882 of FIG. 8. Non-limiting examples include testing an electrical device including a bonded die, dicing the bonding substrate into individual electronic devices, cleaning the electronic devices, packaging the electronic devices, or other suitable post-bonding operations. The order in which the post-bonding operations are performed may or may not depend on a specific electronic device. For example, the packaging operation may be performed before or after the dicing operation. Furthermore, more than one electrical test may be performed at different times, and intermediate operations may or may not be performed between these electrical tests. For example, the first operation for an electrical short or electrical open may be performed before packaging. After packaging, a second electrical test may be performed to test the memory to verify that data can be written and retrieved, or to test the processor to verify that instructions can be executed properly. At this point in this method, the electronic device is manufactured.

[0096] A die bonding system (100) as illustrated in FIGS. 1 through 7 is better suited for adjusting the position of a die chuck (1244) within an array (124) of bonding heads relatively more quickly than a conventional die bonding system. For registration and measurement operations, the adjustment cycle starts at a first point in time when a signal from alignment hardware 158 is processed by the controller (160) during the current adjustment cycle for the current position of the set of dies, and ends at a second point in time when the adjustment of the position of the operating platform (480) is completed. In one embodiment, the adjustment cycle may correspond to blocks 964 and 966 of FIG. 9. The die bonding system (100) may be performed at an adjustment cycle frequency of at least 50 Hz, at least 200 Hz, at least 500 Hz, or at least 1.1 kHz. In one embodiment, the die bonding system (100) may be performed at an adjustment cycle frequency of up to 5 kHz.

[0097] In the same or different implementations, the operating platform (480) can be moved in the XY plane using three alignment actuators instead of four. Thus, the number of alignment actuators may be equal to or different from the number of bonding actuators. An implementation using three alignment actuators may be able to achieve the aforementioned adjustment cycle frequency. Due to the ability to achieve such a high adjustment cycle frequency, the throughput of the die bonding system (100) can be significantly increased. The inventors have discovered that this bonding system can be achieved at a high bonding rate that provides high throughput with submicro positional precision. Previous bonding tools have difficulty achieving both high submicro precision and high throughput.

[0098] The aforementioned die bonding system can achieve high precision and high manufacturing throughput for die bonding to a bonding substrate. In one embodiment, the die bonding system can achieve a straight travel range in the X direction of up to + / -0.25% of the length of the operating platform and a straight travel range in the X direction of up to + / -0.25% of the width of the operating platform. In the same or other embodiments, the die bonding system can achieve a straight travel range in the X direction of up to + / -50 µm, up to + / -100 µm, or up to + / -200 µm, and a straight travel range in the Y direction of up to + / -50 µm, up to + / -100 µm, or up to + / -200 µm. In any one or both of the aforementioned embodiments or other embodiments, the movable platform is characterized by including a first rotation around the z-axis extending in the Z direction through the center of mass of the movable platform, and the angular travel range of the first rotation is at most + / -3 mrad, at most + / -6 mrad, at most + / -10 mrad, at most + / -20 mrad, or at most + / -50 mrad. The die bonding system can achieve an adjustment cycle frequency of at least 50 Hz. A better understanding of the die bonding system and method can be obtained by reading this specification in conjunction with the accompanying drawings.

[0099] In this case, the entirety of the aforementioned tasks in the overall description or example is not required, and parts of specific tasks may not be necessary; furthermore, at least one additional task may be performed in addition to those mentioned above. Moreover, the order in which the tasks are listed is not necessarily the order in which they are performed.

[0100] Advantages, other benefits, and solutions to problems have been described in relation to specific embodiments. However, advantages, benefits, solutions to problems, and other feature(s) that may give rise to or further refine advantages, other benefits, or solutions shall not be construed as essential, required, or necessary features of any or all of the claims.

[0101] The description and examples of the embodiments described in this invention are intended to provide an overall understanding of the structures of various embodiments. The descriptions and examples are not intended to serve as a complete and comprehensive description of the entirety of the components and features of systems and devices using the structures or methods described in this invention. Separate embodiments may be given in combination with one embodiment, and conversely, various features described for brevity in relation to one embodiment may be given separately or in any combination. Furthermore, references to numerical values ​​described in the range include all values ​​within that range. A multitude of various embodiments are obvious to those skilled in the art of this invention from this specification. Since other embodiments may be used or derived from this disclosure, structural substitutions, logical substitutions, or other modifications may be made without departing from the scope of protection of this disclosure. Accordingly, this disclosure should be regarded as illustrative rather than restrictive.

Claims

Claim 1 A die bonding system comprising a frame, a movable platform configured to maintain a die chuck, a set of bonding actuators operably connected to the frame and the movable platform, and a set of alignment actuators operably connected to the frame and the movable platform, wherein each bonding actuator is configured to apply a bonding force to the movable platform in a first direction parallel to a central axis passing through the center of the movable platform and offset from the central axis, and each alignment actuator is configured to apply an alignment force to the movable platform along an alignment force plane perpendicular to the central axis. Claim 2 A die bonding system according to claim 1, wherein the bonding actuator set is configured to adjust the position, tip, and tilt of the movable platform in the first direction relative to the frame, and the bonding actuator set is configured to supply a peak bonding force to the movable platform. Claim 3 In claim 1, the alignment actuator set is configured to adjust a position in a second direction along a plane perpendicular to the central axis of the movable platform relative to the frame, a position in a third direction, and rotation around the central axis, wherein the second direction is perpendicular to the first direction and the third direction is perpendicular to the first direction, forming a die bonding system. Claim 4 In claim 1, the bonding actuator set is a die bonding system configured to apply the bonding force to the movable platform, which is at least twice the alignment force configured to be applied to the movable platform by the alignment actuator set. Claim 5 A die bonding system according to claim 1, wherein the peak bonding force of each bonding actuator in the bonding actuator set is at least 110 times the peak alignment force of each alignment actuator in the alignment actuator set. Claim 6 A die bonding system according to claim 1, further comprising the die chuck, wherein the movable platform includes a die chuck holding area, and the position of the die chuck within the die chuck holding area is adjustable. Claim 7 A die bonding system according to claim 6, wherein while the die chuck is maintained within the die chuck holding area, the center of the die holding area of ​​the die chuck exists within a polygon, and the vertices of the polygon are positioned at locations where the bonding actuator set applies the bonding force to the movable platform. Claim 8 A die bonding system according to claim 1, further comprising the die chuck, wherein the die chuck is configured to adjust the shape of the die during bonding, and the bonding actuator set is configured to apply the bonding force sufficient to overcome the adjustment of the shape of the die so that the die follows the die bonding surface of the substrate. Claim 9 In claim 1, when the movable platform is in a neutral state, each alignment actuator in the alignment actuator set is configured to move the movable platform along a plane perpendicular to the central axis, and this plane passes through the center of mass of the movable platform, in a die bonding system. Claim 10 In claim 1, the bonding actuator set has a first number of actuators, the alignment actuator set has a second number of actuators, and the first number is a die bonding system different from the second number. Claim 11 A die bonding system comprises a frame, a movable platform configured to hold a die chuck, a set of bonding actuators, and a set of bonding flexures, each bonding flexure having a corresponding bonding actuator, and each pair of bonding flexures and their corresponding bonding actuators are operably connected to the frame and the movable platform, the die bonding system further comprises an alignment actuator set and a set of alignment flexures, each alignment flexure having a corresponding alignment actuator, and each pair of alignment flexures and their corresponding alignment actuators are operably connected to the frame and the movable platform, the die bonding system has an adjustment cycle frequency of at least 50 Hz, the adjustment cycle frequency corresponds to a period from a start time when a signal corresponding to the position of the movable platform for a current adjustment cycle begins to be processed until an end time when the adjustment of the movable platform from the previous direction to a new direction is completed, and this adjustment is of the signal during the current adjustment cycle A die bonding system performed in response to processing. Claim 12 A die bonding system according to claim 11, wherein the movable platform has a length in the X direction, a width in the Y direction, and a thickness in the Z direction, wherein length ≥ width > thickness, the straight travel range in the X direction is a maximum of + / -0.90% of the length of the movable platform, and the straight travel range in the Y direction is a maximum of + / -0.90% of the width of the movable platform. Claim 13 A die bonding system according to claim 11, wherein the movable platform is configured to achieve a position within the XY plane, and the movable platform is characterized by including a first rotation around a z-axis extending in the Z direction through the center of mass of the movable platform, wherein the Z direction is perpendicular to the XY plane, and the angular travel range of the first rotation is at most + / -50 mrad. Claim 14 A die bonding system according to claim 13, wherein the movable platform has a length in the X direction, a width in the Y direction, and a thickness in the Z direction, wherein length ≥ width > thickness; the movable platform has additional features including a second rotation around an x-axis extending in the X direction through the center of mass of the movable platform, the angular travel range of the second rotation is + / -50 mrad; the movable platform further has additional features including a third rotation around a y-axis extending in the Y direction through the center of mass of the movable platform, the angular travel range of the third rotation is + / -50 mrad; and in the Z direction perpendicular to the XY plane, the Z direction linear travel range is a maximum of + / -2.5% of the length of the movable platform or a maximum of + / -2.5% of the width of the movable platform. Claim 15 A die bonding system according to claim 11, wherein the adjustment cycle frequency is at least 200 Hz. Claim 16 In claim 11, a die bonding system configured such that each bonding actuator provides a force of at least 20 N. Claim 17 A die bonding system comprising a first frame, a first die chuck, a first movable platform holding the first die chuck, a first set of first bonding actuators operably connected to the first frame and the first movable platform, and a first set of first alignment actuators operably connected to the first frame and the first movable platform, wherein each first bonding actuator is configured to apply a first bonding force to the first movable platform in a first direction parallel to a first central axis passing through the center of the first movable platform and offset from the first central axis, and each first alignment actuator is configured to apply a first alignment force to the first movable platform along a first alignment force plane perpendicular to the first central axis, and a first bonding head A step of bonding a second die to a second die chuck of a die bonding system comprising a second set of second bonding actuators operably connected to the second movable platform, and a second set of second alignment actuators operably connected to the second frame and the second movable platform, wherein each second bonding actuator is configured to apply a second bonding force to the second movable platform in a second direction parallel to a second central axis passing through the center of the second movable platform and offset from the second central axis, and each second alignment actuator is configured to apply a second alignment force to the second movable platform along a second alignment force plane perpendicular to the second central axis, and further comprising a second bonding head spaced apart from the first bonding head; and any one or more of the first bonding actuators of the first set and the first alignment actuators of the first set. Using at least one actuator from the actuators,A method comprising the steps of: adjusting the first operating platform in a first adjustment direction; adjusting the second operating platform in a second adjustment direction using at least one actuator from among the second bonding actuators of the second set and the second alignment actuators of the second set; activating the first bonding actuator of the first set and bonding the first die to a first die bonding site of the substrate; activating the second bonding actuator of the second set and bonding the second die to a second die bonding site of the substrate, wherein the first die bonding site is spaced apart from the second die bonding site, and the step of bonding the first die and the step of bonding the second die are performed simultaneously at least at the same time. Claim 18 In claim 17, the method further comprises the step of acquiring first signals from a first set of first position sensors, wherein the first signals correspond to a first previous direction of the first operating platform, and the step of adjusting the first operating platform is performed before adjusting the first operating platform to the first adjustment direction, and the method further comprises the step of acquiring second signals from a second set of second position sensors, wherein the second signals correspond to a second previous direction of the second operating platform, and the step of adjusting the second operating platform is performed before adjusting the second operating platform to the second adjustment direction, and the first cycle starts at a first time point when processing of the first signals begins and ends at a second time point when adjustment of the first operating platform is completed, and the second cycle starts at a third time point when processing of the second signals begins and ends at a fourth time point when adjustment of the second operating platform is completed, and each of the first cycle and the second cycle corresponds to a frequency of at least 50 Hz. Claim 19 A method according to claim 17, wherein the surface of the substrate is laid along the XY plane and includes a first die bonding portion and a second die bonding portion, each of the first die and the first die bonding portion has a center, the maximum X-direction misalignment between the center of the first die and the center of the first die bonding portion is 50 μm, and the maximum Y-direction misalignment between the center of the first die and the center of the first die bonding portion is 50 μm. Claim 20 In claim 17, the first movable platform has a die chuck holding surface along the XY plane, and after the step of adjusting the first movable platform, the first movable platform is characterized by including a first rotation around a z-axis extending in a Z direction perpendicular to the XY plane through the center of mass of the first movable platform, a second rotation around an x-axis extending in a first X direction through the center of mass of the first movable platform, and a third rotation around a y-axis extending in a Y direction through the center of mass of the first movable platform, wherein for each of the first rotation, the second rotation, and the third rotation, the angular travel range is at most + / -50 mrad.

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