Resin composition

Abstract

[Problem] To provide a resin composition that is easy to apply even when applied using a jet dispenser or as a thin film, and also provides a cured product that can suppress the increase in contact resistance even when exposed to high temperature and high humidity conditions. [Solution] A resin composition comprising (A) an epoxy resin, (B) a latent curing accelerator, (C) silver powder, and (D) solder powder; wherein component (D) comprises (D-1) a tin-containing alloy solder powder; wherein the content of component (A) is 12 mass% or more relative to 100 mass% of the total components in the resin composition; wherein the content of component (D-1) is 5 mass% or more relative to 100 mass% of the total components in the resin composition; wherein the viscosity of the resin composition measured using an E-type viscometer under conditions of 25°C and 1 rpm is 300 Pa·s or less; and wherein the resistivity of the cured product obtained by curing the resin composition under conditions of 80°C and 60 minutes is 1×10⁻² Ω·cm or less.

Description

Technology Field

[0001] The present invention relates to a resin composition. It also relates to an electronic member and a semiconductor device. Background Technology

[0002] In some cases, resin compositions such as epoxy resin compositions are used as resin compositions for bonding electronic components. Typically, the bonding of electronic components is achieved by the cured product of the resin composition.

[0003] In addition, when bonding electronic components, a resin composition containing conductive metal powder is used as a connection method to replace solder (Patent Documents 1 to 3). Prior art literature

[0004] Japanese Patent Publication No. JP 2012-532942, Japanese Patent No. 6310954, Japanese Patent Publication No. JP 2015-42696 The problem to be solved

[0005] Regarding the resin compositions described in Patent Documents 1 to 3, there is room for improvement when used for bonding electronic components. For example, the resin compositions of Patent Documents 1 and 2 are difficult to form into a paste at room temperature, and in a reliability test in which the connection part formed by the cured product of the resin composition is exposed to high temperature and high humidity conditions, the contact resistance of the cured product increases, resulting in reduced conductivity.

[0006] In addition, Patent Document 3 discloses a resin composition containing one or more selected from the group consisting of an epoxy resin, a specific modified polyamine, silver particles, tin particles, zinc particles, and aluminum particles, in order to solve the problem of providing a conductive adhesive suitable for compact camera modules such as mobile phones, which has excellent adhesion and cost-effectiveness, does not increase contact resistance with metal terminals such as nickel, stainless steel, and nickel silver under high temperature and high humidity, can be cured at 80°C or lower, and has a suitable viscosity. In addition, in this specification, metal particles as described in Patent Document 3 may be referred to as "metal powders." For example, the term "tin powder" encompasses tin particles as described in Patent Document 3. The same applies to the terms "zinc powder" and "aluminum powder."

[0007] Recently, from the perspective of securing highly reliable conductive connection parts, the demand for suppressing the rise in contact resistance under high temperature and high humidity conditions has increased. Consequently, there is a tendency to find it difficult to adopt tin powder and aluminum powder, which have a weaker effect in suppressing the rise in contact resistance compared to zinc powder. Furthermore, since zinc powder and aluminum powder have higher melting points than tin powder, there is a tendency for them to be relatively difficult to achieve small-scale curing at the industrial level (large powders with a maximum diameter of several tens of micrometers exist). The inventors have discovered that resin compositions containing metal powders that are difficult to achieve small-scale curing tend to result in resin compositions with poor applicability, such as those that are difficult to apply using a jet dispenser or to apply as a thin film. Therefore, there is a demand for a resin composition that provides a cured product that is easy to apply whether using a jet dispenser or applying as a thin film, and can also suppress the rise in contact resistance even when exposed to high temperature and high humidity conditions. Such a resin composition is suitable because it can accommodate electronic components with narrow pitches between conductive connection parts, such as pads and lands.

[0008] The present invention was devised in consideration of the above problem and aims to provide a resin composition that is easy to apply even when applied using a jet dispenser or applied as a thin film, and also provides a cured product that can suppress an increase in contact resistance even when exposed to high temperature and high humidity conditions; an electronic member comprising the cured product of the resin composition; and a semiconductor device. means of solving the problem

[0009] The inventors have carefully investigated to solve the above problem. As a result, the inventors have provided a resin composition comprising (A) an epoxy resin, (B) a latent curing accelerator, (C) silver powder, and (D) solder powder; wherein component (D) comprises (D-1) a tin-containing alloy solder powder; the content of component (A) is 12 mass% or more with respect to 100 mass% of the total components in the resin composition; the content of component (D-1) is 5 mass% or more with respect to 100 mass% of the total components in the resin composition; the viscosity of the resin composition measured using an E-type viscometer under conditions of 25°C and 1 rpm is 300 Pa·s or less; and the resistivity of the cured product obtained by curing the resin composition under conditions of 80°C and 60 minutes is 1 × 10⁻⁶ -2 The present invention was completed by discovering that a resin composition having a value of Ω·cm or less can solve the above problem.

[0010] That is, the present invention includes the following.

[0011] <1>

[0012] A resin composition comprising (A) an epoxy resin, (B) a latent curing accelerator, (C) silver powder, and (D) solder powder, wherein

[0013] (D) The component comprises (D-1) tin-containing alloy solder powder, and

[0014] (A) The content of the component is 12 mass% or more with respect to 100 mass% of the total components in the resin composition, and

[0015] (D-1) The content of the component is 5 mass% or more with respect to 100 mass% of the total components in the resin composition, and

[0016] The viscosity of the resin composition measured using an E-type viscometer under conditions of 25℃ and 1rpm is 300 Pa·s or less, and

[0017] The resistivity value of the cured product obtained by curing a resin composition under conditions of 80°C for 60 minutes is 1×10 -2A resin composition having Ω·cm or less.

[0018] <2>

[0019] (A) The content of the component is greater than 70 mass% with respect to 100 mass% of the resin component in the resin composition, <1> Resin composition described in

[0020] <3>

[0021] (A) A component comprising an epoxy resin that is liquid at a temperature of 25°C, <1> or <2> Resin composition described in

[0022] <4>

[0023] (A) an epoxy resin comprising an aromatic backbone, <1> inside <3> A resin composition described in any one of the following.

[0024] <5>

[0025] (B) The component comprises a solid-dispersed amine adduct-based curing accelerator, <1> inside <4> A resin composition described in any one of the following.

[0026] <6>

[0027] (D-1) The component includes Sn-Bi alloy powder, <1> inside <5> A resin composition described in any one of the following.

[0028] <7>

[0029] The amount of bismuth included in component (D-1) is 30 mass% or more and 80 mass% or less with respect to 100 mass% of component (D-1), <6> Resin composition described in

[0030] <8>

[0031] (D-1) A component having a maximum particle diameter of 30㎛ or less, <1> inside <7> A resin composition described in any one of the following.

[0032] <9>

[0033] (D-1) The average particle diameter of the component is 10㎛ or less, <1> inside <8> A resin composition described in any one of the following.

[0034] <10>

[0035] (D-1) A value obtained by dividing the length of the major axis of a component by the length of the minor axis, such that it is between 1 and 2, <1> inside <9> A resin composition described in any one of the following.

[0036] <11>

[0037] (D-1) The component may or may not contain a metallic element selected from the group consisting of aluminum, zinc, iron and indium,

[0038] The content of aluminum, zinc, iron, and indium is less than 1 mass% with respect to 100 mass% of component (D-1), <1> inside <10> A resin composition described in any one of the following.

[0039] <12>

[0040] (C) The component contains pure silver powder,

[0041] The silver content contained in the pure silver powder is 90 mass% or more with respect to 100 mass% of the total amount of pure silver powder, <1> inside <11> A resin composition described in any one of the following.

[0042] <13>

[0043] containing organic fillers <1> inside <12> A resin composition described in any one of the following.

[0044] <14>

[0045] containing a silane coupling agent, <1> inside <13> A resin composition described in any one of the following.

[0046] <15>

[0047] containing a preservation stabilizer, <1> inside <14> A resin composition described in any one of the following.

[0048] <16>

[0049] With or without flux activator,

[0050] The content of the flux activator is less than 0.05 mass% with respect to 100 mass% of the total components in the resin composition, <1> inside <15> A resin composition described in any one of the following.

[0051] <17>

[0052] A reaction initiation temperature based on differential scanning calorimetry of 40°C or higher and 70°C or lower, <1> inside <16> A resin composition described in any one of the following.

[0053] <18>

[0054] Reaction peak temperature based on differential scanning calorimetry between 50°C and 140°C, <1> inside <17> A resin composition described in any one of the following.

[0055] <19>

[0056] When the reaction initiation temperature based on differential scanning calorimetry is set to T1[°C] and the reaction peak temperature based on differential scanning calorimetry is set to T2[°C], the temperature difference T2-T1 is 40°C or more and 80°C or less, <1> inside <18> A resin composition described in any one of the following.

[0057] <20>

[0058] <1> inside <19> An electronic member comprising a cured product of a resin composition described in any one of the above, and an electronic component mounted on said cured product.

[0059] <21>

[0060] <1> inside <19> A semiconductor device comprising a cured product of a resin composition described in any one of the following. Effects of the invention

[0061] According to the present invention, a resin composition that is easy to apply even when applied using a jet dispenser or applied as a thin film, and also provides a cured product that can suppress an increase in contact resistance even when exposed to high temperature and high humidity conditions; an electronic member comprising the cured product of the resin composition; and a semiconductor device can be provided. Brief explanation of the drawing

[0062] [Fig. 1] Fig. 1 is a schematic front view illustrating a method for measuring the contact resistance value of a cured resin composition. Specific details for implementing the invention

[0063] Hereinafter, the present invention will be described in detail by presenting embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and may be implemented with arbitrary modifications within the scope of the claims of the present invention and equivalent scopes without departing from the scope thereof.

[0064] The embodiments described in this specification may be used in combination with one another, regardless of expressions such as "preferred" or "more preferred." For example, when describing numerical ranges, a range combining the upper and lower limits of each range and the numerical values ​​of the embodiments may be used. Furthermore, terms such as "contain" and "include" may be read as "essentially composed of" or "consisting only of."

[0065] In this specification, "resin composition that is paste-like at room temperature" refers to a resin composition in which the viscosity of the resin composition, measured using an E-type viscometer under conditions of 25°C and 1 rpm, is 20 Pa·s or more and 300 Pa·s or less.

[0066] In this specification, the term “aromatic ring” refers to a ring according to Hückel’s rule in which the number of electrons included in the π-electron system on the ring is 4n+2 (where n is an integer greater than or equal to 1), and includes a monocyclic aromatic ring and a condensed aromatic ring formed by the condensation of two or more monocyclic aromatic rings. An aromatic ring may be an aromatic carbon ring having only carbon atoms as ring constituent atoms, or an aromatic complex ring having heteroatoms such as oxygen atoms, nitrogen atoms, and sulfur atoms in addition to carbon atoms as ring constituent atoms. In this specification, the term “heteroatom” refers to an atom other than carbon atoms and hydrogen atoms, and examples include oxygen atoms, nitrogen atoms, sulfur atoms, silicon atoms, etc.

[0067] In this specification, the term "non-volatile component" used with respect to a resin composition refers to a component among the components constituting the resin composition other than the organic solvent described below. Furthermore, in this specification, the term "resin component" used with respect to a resin composition refers to a component among the non-volatile components included in the resin composition, excluding inorganic particles such as metal powders.

[0068] In this specification, the term "liquidus temperature" used for solder powder refers to the temperature at which the solder powder completely melts (or the temperature at which the molten solder powder begins to solidify). Furthermore, the term "solidus temperature" used for solder powder refers to the temperature at which the solder powder begins to melt (or the temperature at which the molten solder powder completely solidifies). The liquidus temperature and solidus temperature of the solder powder can be measured according to the method described in JIS Z3198-1. For the solder powder, the liquidus temperature may coincide with the solidus temperature, or it may not coincide with the solidus temperature. If the liquidus temperature of the solder powder does not coincide with the solidus temperature, the liquidus temperature of the solder powder is typically higher than the solidus temperature of the solder powder. The liquidus and solidus temperatures of the solder powder can be adjusted by the type of element (furthermore, metallic element) contained in the solder powder or the content of said element.

[0069] In this specification, the term "resistivity value" used for a cured product of a resin composition refers to the magnitude of electrical resistance per unit volume of the cured product of a resin composition. The resistivity value of the cured product of a resin composition can be measured, for example, by the four-terminal method. Specifically, two current terminals and two voltage terminals are provided to the cured product of the resin composition. Here, the two voltage terminals are provided between the two current terminals. Subsequently, current is passed through the two current terminals, and by measuring the voltage generated between the two voltage terminals, the resistance value R of the cured product of the resin composition located between the two voltage terminals is calculated. Then, using the cross-sectional area S of the cured product of the resin composition and the distance L between the voltage terminals, the resistivity value ρ of the cured product of the resin composition can be calculated by the following equation (1').

[0070] Equation (1'): ρ=R×S÷L

[0071] When using a digital multimeter (sometimes called a "tester") to measure the resistivity value of a cured resin composition, if the digital multimeter is equipped with a setting suitable for the 4-terminal method (for example, "4-terminal mode," etc.), it is suitable to measure the resistivity value by adopting the said setting.

[0072] In this specification, the term "reaction initiation temperature based on differential scanning calorimetry" used for a resin composition refers to the temperature at the intersection of the baseline and the tangent at the inflection point from the reaction initiation temperature to the peak of the exothermic / endothermic curve in differential scanning calorimetry (DSC). Hereinafter, the term "reaction initiation temperature based on differential scanning calorimetry" may simply be referred to as "reaction initiation temperature." Furthermore, the term "reaction peak temperature based on differential scanning calorimetry" used for a resin composition refers to the temperature at which the exothermic reaction is maximum in differential scanning calorimetry (DSC). Hereinafter, the term "reaction peak temperature based on differential scanning calorimetry" may simply be referred to as "reaction peak temperature." During differential scanning calorimetry, the heating rate is not particularly limited as long as the reaction initiation temperature and reaction peak temperature of the resin composition can be accurately recorded, and may be, for example, 1 to 10°C / min (specifically, 5°C / min, etc.).

[0073] [Overview of Resin Composition]

[0074] The resin composition of the present invention comprises (A) an epoxy resin, (B) a latent curing accelerator, (C) silver powder, and (D) solder powder. Furthermore, in the resin composition of the present invention, (D) solder powder comprises (D-1) a tin-containing alloy solder powder. Additionally, in the resin composition of the present invention, the content of component (A) is 12 mass% or more with respect to 100 mass% of the total components in the resin composition, and the content of component (D-1) is 5 mass% or more with respect to 100 mass% of the total components in the resin composition. Furthermore, in the resin composition of the present invention, the viscosity of the resin composition measured using an E-type viscometer under conditions of 25°C and 1 rpm is 300 Pa·s or less, and the resistivity of the cured product obtained by curing the resin composition under conditions of 80°C and 60 minutes is 1 × 10⁻⁶ -2 It is less than Ω·cm.

[0075] According to the resin composition of the present invention, it is easy to apply even when using a jet dispenser or when applying as a thin film, and according to the resin composition, it is possible to provide a cured product that can suppress the increase in contact resistance even when exposed to high temperature and high humidity conditions.

[0076] The resin composition of the present invention may additionally include, as needed, (D-2) other solder powder, (E) other metal powder, (F) organic filler, (G) silane coupling agent, (H) preservation stabilizer, (I) flux activator, (J) organic solvent, and (K) other additives. Hereinafter, each component included in the resin composition of the present invention will be described in detail.

[0077] <(A) Epoxy Resin>

[0078] The resin composition of the present invention comprises (A) an epoxy resin as (A) component. (A) The epoxy resin may be used as a single type or in combination of two or more types.

[0079] (A) As an epoxy resin, a curable resin having epoxy groups can be used. As epoxy resins, for example, bixylenol-type epoxy resin, bisphenol A-type epoxy resin, bisphenol C-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol AF-type epoxy resin, bisphenol E-type epoxy resin, dicyclopentadiene-type epoxy resin, trisphenol-type epoxy resin, naphthol novolak-type epoxy resin, phenol novolak-type epoxy resin, tert-butyl-catechol-type epoxy resin, naphthalene-type epoxy resin, naphthol-type epoxy resin, anthracene-type epoxy resin, glycidylamine-type epoxy resin, glycidyl ester-type epoxy resin, cresol novolak-type epoxy resin, phenolaralkyl-type epoxy resin, biphenyl-type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro-ring containing epoxy resin, cyclohexane-type epoxy resin, cyclohexanedimethanol-type epoxy resin, naphthylene ether-type epoxy Examples include resins, trimethylol-type epoxy resins, tetraphenylethane-type epoxy resins, isocyanurate-type epoxy resins, phenolphthalimidine-type epoxy resins, etc.

[0080] (A) It is preferable that the epoxy resin comprises an epoxy resin containing two or more epoxy groups per molecule. With respect to 100 mass% of the epoxy resin, the proportion of the epoxy resin containing two or more epoxy groups per molecule is preferably 50 mass% or more, more preferably 60 mass% or more, even more preferably 70 mass% or more, and typically 100 mass% or less.

[0081] (A) It is preferable that the epoxy resin comprises an epoxy resin containing an aromatic backbone. Here, an aromatic backbone refers to a backbone containing a chemical structure generally defined as an aromatic ring. The aromatic ring may be an aromatic carbon ring or an aromatic heteroring. Furthermore, the aromatic ring may be a monocyclic aromatic ring, a condensed aromatic ring formed by the condensation of two or more monocyclic aromatic rings, or a condensed aromatic ring formed by the condensation of one or more monocyclic aromatic rings with one or more monocyclic non-aromatic rings. Among these, the aromatic ring contained in component (A-1) is preferably an aromatic carbon ring. The number of carbon atoms in the aromatic carbon ring is preferably 6 or more and 10 or less.

[0082] As epoxy resins containing an aromatic backbone, examples include bisphenol A type epoxy resin, bisphenol C type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, bisphenol E type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol novolak type epoxy resin, phenol novolak type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, biscilenol type epoxy resin, triphenylmethane type epoxy resin, glycidylamine type epoxy resin having an aromatic ring, glycidyl ester type epoxy resin having an aromatic ring, cresol novolak type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin containing an aromatic ring, epoxy resin having a butadiene structure containing an aromatic ring, alicyclic epoxy resin containing an aromatic ring, heterocyclic epoxy resin, spiro-ring containing epoxy resin containing an aromatic ring, Examples include cyclohexanedimethanol-type epoxy resins containing an aromatic ring, naphthylene ether-type epoxy resins, trimethylol-type epoxy resins containing an aromatic ring, and tetraphenylethane-type epoxy resins containing an aromatic ring.

[0083] Epoxy resins include epoxy resins that are in a liquid state at a temperature of 25°C (hereinafter referred to as "liquid epoxy resin") and epoxy resins that are in a solid state at a temperature of 25°C (hereinafter referred to as "solid epoxy resin"). The resin composition preferably includes (A) liquid epoxy resin as the epoxy resin, and more preferably includes only liquid epoxy resin.

[0084] As for the liquid epoxy resin, a liquid epoxy resin containing two or more epoxy groups per molecule is preferred.

[0085] As for the liquid epoxy resin, one or more liquid epoxy resins selected from the group consisting of bisphenol A type epoxy resin, bisphenol C type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, bisphenol E type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolak type epoxy resin, alicyclic epoxy resin having an ester backbone, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, and epoxy resin having a butadiene structure are preferred.

[0086] Specific examples of liquid epoxy resins include “HP-4032”, “HP-4032-D”, and “HP-4032-SS” (naphthalene-type epoxy resins) manufactured by DIC Corporation; “828US”, “828”, “828EL”, and “825” (bisphenol A-type epoxy resins) manufactured by Mitsubishi Chemical Corporation; “807”, “1750”, and “YDF-8170” (bisphenol F-type epoxy resins) manufactured by Mitsubishi Chemical Corporation; “152” (phenol novolak-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and “630”, “630LSD”, and “604” (glycidylamine-type epoxy resins) manufactured by Mitsubishi Chemical Corporation. "N-730A" manufactured by DIC, "ZX-1059" manufactured by Nittetsu Chemical & Materials (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); "EXA-7250" manufactured by DIC (triphenylmethane type epoxy resin); "EX-721" manufactured by Nagase Chemtex (glycidyl ester type epoxy resin); "Celoxide 2021P" manufactured by Daicel (alicyclic epoxy resin having an ester backbone); "PB-3600" manufactured by Daicel (epoxy resin having a butadiene structure); "ZX-1658" and "ZX-1658GS" manufactured by Nittetsu Chemical & Materials (liquid 1,4-glycidylcyclohexane type epoxy resin); "Shopri PETG" manufactured by Resonac (pentaerythritol type epoxy resin); Examples include "X-22-163" (siloxane-type epoxy resin) manufactured by Shin-Etsu Kagaku Kogyo Co., Ltd.; and "EPOX MK R710" and "EPOX MK R1710" (bisphenol E-type epoxy resin) manufactured by Printec. Liquid epoxy resins may be used as a single type or in combination of two or more types.

[0087] (A) As the epoxy resin, an organic filler dispersed in a liquid epoxy resin (hereinafter referred to as "dispersion of organic filler in epoxy resin") may be used. Examples of commercially available products of dispersion of organic filler in epoxy resin include Kane-Ace "MX-120," "MX-125," "MX-130," "MX-135," and "MX-153" manufactured by Kaneka (containing 25 mass% of a rubbery core-shell polymer (a styrene-butadiene copolymer with a rubber particle core); and "RKB-3040," "RKB-3040H," and "RKB-5810" manufactured by Reginas Casey (containing 25 mass% to 35 mass% of a rubbery core-shell polymer (a butadiene rubber with a rubber particle core)). The dispersion of the organic filler in the epoxy resin may be used as a single type or as a combination of two or more types.

[0088] (A) The epoxy equivalent of the epoxy resin is preferably 50 g / eq. or more, more preferably 80 g / eq. or more, even more preferably 110 g / eq. or more, preferably 5,000 g / eq. or less, more preferably 3,000 g / eq. or less, even more preferably 2,000 g / eq. or less, and even more preferably 1,000 g / eq. or less. When the epoxy equivalent of the epoxy resin is within the above range, a cured product of the resin composition can provide a cured body with a sufficient crosslinking density. The epoxy equivalent is the mass of an epoxy resin containing 1 equivalent of an epoxy group. This epoxy equivalent can be measured according to JIS K7236.

[0089] (A) The weight average molecular weight (Mw) of the epoxy resin is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, preferably 5,000 or less, more preferably 3,000 or less, and even more preferably 1,500 or less. The weight average molecular weight of the epoxy resin is the weight average molecular weight in polystyrene equivalent measured by gel permeation chromatography (GPC).

[0090] In the resin composition of the present invention, the content of (A) epoxy resin is 12 mass% or more with respect to 100 mass% of the total components in the resin composition. The content of (A) epoxy resin in the resin composition is preferably 13 mass% or more, more preferably 14 mass% or more, even more preferably 15 mass% or more, preferably 40 mass% or less, more preferably 30 mass% or less, even more preferably 25 mass% or less, and even more preferably 20 mass% or less, from the perspective of significantly obtaining the desired effect of the present invention. According to the composition of the resin composition of the present invention in which the content of component (A) is 12 mass% or more with respect to 100 mass% of the total components in the resin composition, a resin composition that is in the form of a paste at room temperature can be achieved, so it can be applied favorably even when applied using a jet dispenser or when applied as a thin film.

[0091] In addition, according to the composition of the resin composition of the present invention, the content of component (A) is 12 mass% or more relative to 100 mass% of the total components in the resin composition, it is suitable because it can accommodate electronic components with a narrow pitch between conductive connection parts such as pads or lands.

[0092] As described below, the resin composition of the present invention, in a suitable embodiment, does not contain (I) an organic solvent. Accordingly, in such a suitable embodiment, the numerical range of the content of (A) epoxy resin relative to 100 mass% of the non-volatile component in the resin composition may correspond to the numerical range of the content of (A) epoxy resin relative to 100 mass% of the total component in the resin composition. Hereinafter, in an embodiment in which the resin composition of the present invention does not contain (I) an organic solvent, the suitable numerical range of the content of each component (except for (I) organic solvent) relative to 100 mass% of the total component in the resin composition, which is not limited to (A) epoxy resin, may be read and applied as the suitable numerical range of the content of said component relative to 100 mass% of the non-volatile component in the resin composition.

[0093] The content of (A) epoxy resin in the resin composition is, with respect to 100 mass% of the resin component in the resin composition, preferably greater than 70 mass%, more preferably greater than 73 mass%, even more preferably greater than or greater than 75 mass%, and preferably less than or equal to 90 mass%, more preferably less than or equal to 85 mass%, and even more preferably less than or equal to 80 mass%, with respect to 100 mass% of the resin component in the resin composition, in order to significantly obtain the desired effect of the present invention.

[0094] <(B) Potential hardening accelerator>

[0095] The resin composition of the present invention includes a (B) latent curing accelerator as a (B) component. The (B) latent curing accelerator does not include the component corresponding to (A) above. The (B) latent curing accelerator may be used as a single type or in combination of two or more types.

[0096] A latent curing accelerator generally does not contribute to the curing of the epoxy resin at room temperature (25°C) but has the function of accelerating the curing of the epoxy resin upon heating.

[0097] The latent curing accelerator may be a liquid latent curing accelerator or a solid-dispersed latent curing accelerator, but a solid-dispersed latent curing accelerator is more preferable. A liquid latent curing accelerator refers to a compound that is a liquid soluble in epoxy resin at room temperature (25°C) and functions as a curing accelerator for the epoxy resin upon heating. On the other hand, a solid-dispersed latent curing accelerator refers to a compound that is a solid insoluble in epoxy resin at room temperature (25°C) and becomes soluble in epoxy resin upon heating, thereby functioning as a curing accelerator for the epoxy resin.

[0098] Examples of solid-dispersed latent curing accelerators include solid-dispersed amine adduct-based latent curing accelerators and imidazole compounds that are solid at room temperature (25°C). Among these, it is preferable that the (B) latent curing accelerator includes a solid-dispersed amine adduct-based latent curing accelerator. In combination with component (A), component (C), and component (D), including a solid-dispersed amine adduct-based latent curing accelerator as component (B) is suitable because it is easy to achieve a resin composition that is paste-like at room temperature, and also to achieve a resin composition with particularly excellent low-temperature curing properties.

[0099] Suitable examples of solid-dispersed amine adduct-based latent curing accelerators include amine-epoxy adduct-based latent curing accelerators, urea adduct-based latent curing accelerators of amine compounds, and compounds formed by adding an isocyanate compound to the hydroxyl group of an epoxy adduct. Among these, amine-epoxy adduct-based latent curing accelerators are preferred.

[0100] Epoxy compounds that can be used as one of the raw materials for manufacturing solid-dispersed amine adduct-based latent curing accelerators include, for example, polyglycidyl ethers obtained by reacting epichlorohydrin with polyvalent phenols (bisphenol A, bisphenol F, catechol, resorcinol, etc.) or polyvalent alcohols (glycerin, polyethylene glycol, etc.); glycidyl ether esters obtained by reacting epichlorohydrin with hydroxycarboxylic acids such as p-hydroxybenzoic acid, β-hydroxynaphthoic acid; polyglycidyl esters obtained by reacting epichlorohydrin with polycarboxylic acids such as phthalic acid, terephthalic acid; glycidylamine compounds obtained by reacting epichlorohydrin with 4,4'-diaminodiphenylmethane or m-aminophenol, etc.; and multifunctional epoxy compounds such as epoxidized phenol novolak resins, epoxidized cresol novolak resins, and epoxidized polyolefins. Examples of monofunctional epoxy compounds include butylglycidyl ether, phenylglycidyl ether, and glycidyl methacrylate.

[0101] An amine compound that can be used as a raw material for manufacturing a solid-dispersed amine adduct-based latent curing accelerator may be a compound having at least one active hydrogen in the molecule capable of addition reaction with an epoxy group, and also having at least one functional group selected from primary amino groups, secondary amino groups, and tertiary amino groups in the molecule. Examples of such amine compounds include aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane; aromatic amine compounds such as 4,4'-diaminodiphenylmethane and 2-methylaniline; and nitrogen-containing heterocyclic compounds such as 2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazoline, 2,4-dimethylimidazoline, piperidine, and piperazine.

[0102] Among the above amine compounds, amine compounds having a tertiary amino group in their molecule are raw materials that impart a potential curing accelerator having excellent curing accelerating ability. Examples of amine compounds having a tertiary amino group in their molecule include primary or secondary amines having a tertiary amino group in their molecule; alcohols, phenols, thiols, carboxylic acids, and hydrazides having a tertiary amino group in their molecule. Examples of primary or secondary amines having a tertiary amino group in their molecule include amine compounds such as dimethylaminopropylamine, diethylaminopropylamine, di-n-propylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, and N-methylpiperazine; and imidazole compounds such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, and 2-phenylimidazole.In addition, alcohols, phenols, thiols, carboxylic acids, and hydrazides having a tertiary amino group within the molecule include, for example, 2-dimethylaminoethanol, 1-methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol, 1-(2-hydroxy-3-phenoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-ethyl-4-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-ethyl-4-methylimidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-phenylimidazoline, Examples include 1-(2-hydroxy-3-butoxypropyl)-2-methylimidazoline, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, N-β-hydroxyethylmorpholine, 2-dimethylaminoethanethiol, 2-mercaptopyridine, 2-benzimidazole, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 4-mercaptopyridine, N,N-dimethylaminobenzoic acid, N,N-dimethylglycine, nicotinic acid, isonicotinic acid, picolinic acid, N,N-dimethylglycine hydrazide, N,N-dimethylpropionic acid hydrazide, nicotinic acid hydrazide, and isonicotinic acid hydrazide.

[0103] When preparing a latent curing accelerator by adding an epoxy compound and an amine compound, an active hydrogen compound having two or more additional active hydrogens within the molecule may be reacted. Examples of such active hydrogen compounds include polyphenols such as bisphenol A, bisphenol F, bisphenol S, hydroquinone, catechol, resorcinol, pyrogallol, and phenol novolak resin; polyhydric alcohols such as trimethylolpropane; polycarboxylic acids such as adipic acid and phthalic acid; 1,2-dimercaptoethane, 2-mercaptoethanol, 1-mercapto-3-phenoxy-2-propanol, mercaptoacetic acid, anthranilic acid, lactic acid; etc.

[0104] Examples of isocyanate compounds that can be used as raw materials for manufacturing solid dispersed amine adduct-based latent curing accelerators include monofunctional isocyanate compounds such as n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, and benzyl isocyanate; polyfunctional isocyanate compounds such as hexamethylene diisocyanate, toluylene diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, isophorone diisocyanate, xylylene diisocyanate, paraphenylene diisocyanate, 1,3,6-hexamethylene triisocyanate, and bicycloheptane triisocyanate; and terminal isocyanate group-containing compounds obtained by the reaction of these polyfunctional isocyanate compounds with active hydrogen compounds. Specific examples of compounds containing terminal isocyanate groups include an addition compound having terminal isocyanate groups obtained by the reaction of toluylene diisocyanate with trimethylolpropane, and an addition compound having terminal isocyanate groups obtained by the reaction of toluylene diisocyanate with pentaerythritol.

[0105] Examples of urea compounds that can be used as raw materials for manufacturing solid dispersed amine adduct-based latent curing accelerators include urea, thiourea, etc.

[0106] The above-mentioned solid dispersed amine adduct-based latent curing accelerator may be prepared by, for example, a method of mixing the above-mentioned raw materials, reacting them at a temperature from room temperature to 200°C, cooling and solidifying them, and then grinding them; or a method of reacting the above-mentioned raw materials in a solvent such as methyl ethyl ketone, dioxane, or tetrahydrofuran, desolvating the solids, and then grinding the solids.

[0107] Commercially available solid-dispersed amine adduct-based latent curing accelerators include, for example, "Amicure PN-FJ" (manufactured by Ajinomoto Fine Techno), "Amicure PN-23" (manufactured by Ajinomoto Fine Techno), "Amicure PN-H" (manufactured by Ajinomoto Fine Techno), "Hardner X-3661S" (manufactured by ACR), "Hardner X-3670S" (manufactured by ACR), "FXR-1081" (manufactured by T&K TOKA), "Fujicure FXR-1000" (manufactured by T&K TOKA), "Fujicure FXR-1030" (manufactured by T&K TOKA), "Novacure HX-3721" (manufactured by Asahi Kasei), "HX-3722" (manufactured by Asahi Kasei), and "Novacure Examples include the "HX-3742" (manufactured by Asahi Kasei Co., Ltd.).

[0108] As imidazole compounds that are solid at room temperature (25°C), examples include 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-undecylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4-benzyl-5-hydroxymethylimidazole, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5-triazine, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5-triazine·isocyanuric acid adduct, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, Examples include 1-cyanoethyl-2-methylimidazole-trimellitate, 1-cyanoethyl-2-phenylimidazole-trimellitate, N-(2-methylimidazolyl-1-ethyl)urea.

[0109] The content of (B) latent curing accelerator in the resin composition is preferably 1 mass% or more, more preferably 2 mass% or more, even more preferably 3 mass% or more, preferably 10 mass% or less, more preferably 7 mass% or less, even more preferably 5 mass% or less, and even more preferably 4 mass% or less, based on 100 mass% of the total components in the resin composition. When the content of component (B) is above a suitable lower limit, it is suitable because it is easy to achieve a resin composition with particularly excellent low-temperature curing properties. In addition, when the content of component (B) is above a suitable lower limit, it is suitable because it is easy to adjust the curing rate of the cured product of the resin composition to an appropriate range, and thus it is easy to achieve a conductive connection part with particularly excellent reliability. In addition, when the content of component (B) is below a suitable upper limit, it is suitable because it is easy to adjust the content of (C) silver powder in the resin composition to an appropriate range, and thus it is easy to achieve particularly good conductivity in the cured product of the resin composition. In addition, when the content of component (B) is below a suitable upper limit, it is easy to achieve a resin composition that is paste-like at room temperature in the cured product of the resin composition, and it is suitable for application even when using a jet dispenser or when applying as a thin film.

[0110] The content of (B) latent curing accelerator in the resin composition is preferably 5 mass% or more, more preferably 10 mass% or more, even more preferably 15 mass% or more, preferably 30 mass% or less, more preferably 25 mass% or less, even more preferably 20 mass% or less or 18 mass% or less, with respect to 100 mass% of the resin component in the resin composition. When the content of component (B) is above a suitable lower limit, it is suitable because it is easy to achieve a resin composition with particularly excellent low-temperature curing properties. In addition, when the content of component (B) is above a suitable lower limit, it is suitable because it is easy to adjust the curing rate of the cured product of the resin composition to an appropriate range, and thus it is easy to achieve a conductive connection part with particularly excellent reliability. In addition, when the content of component (B) is below a suitable upper limit, it is suitable because it is easy to adjust the content of (C) silver powder in the resin composition to an appropriate range, and thus it is easy to achieve particularly good conductivity in the cured product of the resin composition. In addition, when the content of component (B) is below a suitable upper limit, it is easy to achieve a resin composition that is paste-like at room temperature in the cured product of the resin composition, and it is suitable for application even when using a jet dispenser or when applying as a thin film.

[0111] When the content of (A) epoxy resin relative to 100 mass% of the non-volatile component in the resin composition is set as M(A) and the content of (B) latent curing accelerator relative to 100 mass% of the non-volatile component in the resin composition is set as M(B), the mass ratio represented by M(A) / M(B) is preferably 1 or more, more preferably 3 or more, even more preferably 4 or more, preferably 15 or less, more preferably 10 or less, even more preferably 7 or less, and even more preferably 5 or less, from the viewpoint of significantly obtaining the desired effect of the present invention.

[0112] <(C) Silver powder>

[0113] The resin composition of the present invention includes a silver powder (C) as component (C). The silver powder (C) does not include components corresponding to (A) and (B). The silver powder (C) may be used as a single type or in combination of two or more types.

[0114] (C) The silver powder may be a solid silver powder or a silver powder having a hollow structure. In this specification, a solid silver powder refers to a silver powder that does not substantially have pores or voids, and includes cases where pores are inevitably incorporated during the manufacture of the solid silver powder. A silver powder having a hollow structure may be a single-hollow powder having only one void inside the powder, a multi-hollow powder having two or more voids inside the powder, or a mixture of a single-hollow powder and a multi-hollow powder.

[0115] The average porosity P [volume %] of the hollow silver powder is, for example, 20 volume % or more, and also, for example, 95 volume % or less. The average porosity P [volume %] of the hollow inorganic powder is defined as the volume-based ratio of the total volume of one or more pores existing inside the powder to the total volume of the powder based on the outer surface of the inorganic powder (total volume of pores / total volume of powder), and, for example, the measured value D of the actual density (apparent density) of the inorganic powder M [g / cm 3 ] and the theoretical value D of the material density of the material forming the inorganic powder T [g / cm 3 Using ], it is calculated by the following formula (Y).

[0116] [Essence (Y)]

[0117]

[0118] The actual density (apparent density) of the metal powder can be measured, for example, using a true density measuring device. Examples of true density measuring devices include the "ULTRAPYCNOMETER 1000" manufactured by QUANTACHROME. For example, nitrogen can be used as the measuring gas.

[0119] As described above, the solid silver powder is a silver powder that substantially does not have voids or pores. The average void ratio P [volume%] of the solid silver powder may be, for example, less than 0.5 volume%. The average void ratio P [volume%] of the solid silver powder can be calculated by the above formula (Y).

[0120] In addition, (C) the silver powder may be an inorganic powder (inorganic filler) in which part or all of its surface is coated with silver, or a resin particle (organic filler) in which part or all of its surface is coated with silver. Examples of inorganic powders in which part or all of its surface is coated with silver include silver-coated copper powder, silver-coated silica powder, etc. Examples of resin particles in which part or all of their surface is coated with silver include resin particles made of silicone resin, (meth)acrylic resin, polystyrene resin, melamine resin, polyamide resin, polyimide resin, polyamideimide resin, fluorinated resin (e.g., polytetrafluoroethylene resin, etc.), polyether resin, phenolic resin, etc. in which part or all of their surface is coated with silver. Here, in order to distinguish it from inorganic powders or resin particles whose surface is partially or entirely coated with silver, a powder composed of silver metal may be referred to as "pure silver powder." Here, the pure silver powder may contain elements derived from impurities that may inevitably be incorporated according to the manufacturing method of the pure silver powder.

[0121] The silver content included in the pure silver powder is, with respect to 100 mass% of the total amount of pure silver powder, preferably 90 mass% or more, more preferably 95 mass% or more, even more preferably 97 mass% or more, 98 mass% or more, or 99 mass% or more, and even more preferably 99.5 mass% or more, in order to significantly obtain the desired effect of the present invention. The upper limit of the silver content included in the pure silver powder may be 100 mass% or less than 100 mass% (for example, it may be 99.999 mass% or less).

[0122] (C) In order to significantly obtain the desired effect of the present invention, it is preferable that the silver powder comprises one or more silver powders selected from the group consisting of solid silver powder, silver powder having a hollow structure, inorganic powder with its entire surface coated with silver, and resin particles with its entire surface coated with silver; it is more preferable that the silver powder comprises one or more silver powders selected from the group consisting of solid silver powder, silver powder having a hollow structure, and inorganic powder with its entire surface coated with silver; it is even more preferable that the silver powder comprises one or more silver powders selected from the group consisting of solid pure silver powder, pure silver powder having a hollow structure, and inorganic powder with its entire surface coated with silver; and it is even more preferable that the silver powder comprises solid pure silver powder.

[0123] (C) There are no particular restrictions on the shape of the silver powder, and examples include spherical, flake-shaped (scale-shaped), needle-shaped, filament-shaped (resin-shaped), etc. (C) The silver powder may include two or more types of silver powders with different shapes. (C) From the viewpoint of significantly obtaining the desired effect of the present invention, it is preferable that the silver powder includes flake-shaped (scale-shaped) silver powder, and it is more preferable that it includes only flake-shaped (scale-shaped) silver powder. The shapes of metal powders such as silver powder can be classified according to JIS Z2500.

[0124] (C) The average particle diameter of the powder is preferably 15 μm or less, more preferably 12 μm or less, even more preferably 10 μm or less, even more preferably 8 μm or less, even more preferably 6 μm or less, and even more preferably 5 μm or less, from the viewpoint of significantly obtaining the desired effect of the present invention. The lower limit of the average particle diameter is preferably 0.1 μm or more, more preferably 1 μm or more, even more preferably 1.5 μm or more, even more preferably 2 μm or more, even more preferably 2.5 μm or more, and even more preferably 3 μm or more. (C) The average particle diameter of the powder can be measured by a laser diffraction scattering method based on the Mie scattering theory. Specifically, it can be measured by creating a particle diameter distribution of the metal powder on a volume basis using a laser diffraction scattering type particle diameter distribution measuring device and taking the median diameter thereof as the average particle diameter. For the measurement sample, 100 mg of metal powder and 10 g of methyl ethyl ketone can be weighed into a vial and dispersed by ultrasound for 10 minutes. Using a laser diffraction particle diameter distribution measuring device, the wavelength of the light source used was set to blue and red, and the volume-based particle diameter distribution of the inorganic filler was measured using a flow cell method. From the obtained particle diameter distribution, the average particle diameter was calculated as the median diameter. Examples of laser diffraction particle diameter distribution measuring devices include the “LA-960” manufactured by Horiba Seisakusho Co., Ltd.

[0125] The content of the silver powder (C) in the resin composition is preferably 50 mass% or more, more preferably 55 mass% or more, even more preferably 60 mass% or more, even more preferably 65 mass% or more or 67 mass% or more, with respect to 100 mass% of the total components in the resin composition, and preferably 90 mass% or less, more preferably 85 mass% or less, even more preferably 80 mass% or less, and even more preferably 76 mass% or less. When the content of component (C) is above a suitable lower limit, it is suitable because it is easy to effectively reduce the resistivity value in the cured product of the resin composition, and thus, it is easy to achieve particularly good conductivity. In addition, when the content of component (C) is below a suitable upper limit, it is suitable because it is easy to achieve a resin composition that is paste-like at room temperature, and it can be applied well even when applied using a jet dispenser or applied as a thin film.

[0126] The content of (C) silver powder in the resin composition is preferably 60 mass% or more, more preferably 70 mass% or more, even more preferably 80 mass% or more, even more preferably 85 mass% or more or 87 mass% or more, with respect to 100 mass% of all metal powders in the resin composition, and preferably 98 mass% or less, more preferably 96 mass% or less, even more preferably 95 mass% or less or 94 mass% or less. When the content of component (C) is within the above suitable range, it is suitable because it is easy to effectively reduce the resistivity value in the cured product of the resin composition, and thus, it is easy to achieve particularly good conductivity.

[0127] When (C) in the resin composition contains 100 mass% of a non-volatile component, the mass ratio represented as M(C) / M(A) is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more or 4 or more, and preferably 10 or less, more preferably 7 or less, even more preferably 5 or less, from the viewpoint of significantly obtaining the desired effect of the present invention.

[0128] <(D) Solder Powder>

[0129] The resin composition of the present invention includes (D) solder powder as component (D). The (D) solder powder does not include components corresponding to (A) to (C). One type of (D) solder powder may be used alone, or two or more types may be used in combination.

[0130] (D) The solder powder is a metal powder with a liquidus temperature of less than 450°C (refer to JIS Z3282). (D) The solder powder may be a solder powder made of a single metal, or a solder powder made of an alloy containing two or more types of metal elements. (D) The solder powder may be a powder made of solder containing lead (Pb), or a powder made of lead-free solder. Here, lead-free solder refers to a solder metal or alloy that does not substantially contain lead. However, the presence of lead as an unavoidable impurity in the lead-free solder may be permitted. In such cases, the amount of lead in the lead-free solder is 1,000 mass ppm or less, preferably 500 mass ppm or less, and more preferably 300 mass ppm or less. Among these, from the perspective of safety, it is preferable that (D) the solder powder be a powder made of lead-free solder.

[0131] (D) The liquidus temperature of the solder powder is preferably 400°C or lower, more preferably 350°C or lower, even more preferably 300°C or lower, even more preferably 290°C or lower, even more preferably 280°C or lower, even more preferably 270°C or lower, 260°C or lower, or 250°C or lower. (D) The lower limit of the liquidus temperature of the solder powder is not particularly limited and can be, for example, 100°C or higher, 105°C or higher, 110°C or higher, etc. (D) When the liquidus temperature of the component is within the above suitable range, the resin composition provides a cured product that can suppress the increase in contact resistance even when exposed to high temperature and high humidity conditions, and furthermore, can enjoy good processability of the component (D), so it can be suitably used as an adhesive resin composition for narrow-pitch conductive connection parts such as pads or lands with narrow pitch.

[0132] (D) The solidus temperature of the solder powder (hereinafter referred to as the "melting point") is preferably 400°C or lower, more preferably 350°C or lower, even more preferably 300°C or lower, and even more preferably 290°C or lower, 280°C or lower, 270°C or lower, 260°C or lower, or 250°C or lower. (D) The lower limit of the melting point of the solder powder is not particularly limited and can be, for example, 100°C or higher, 105°C or higher, 110°C or higher, etc. When the melting point (solidus temperature) of the component (D) is within the above suitable range, it provides a cured product that can suppress the rise in contact resistance even when exposed to high temperature and high humidity conditions, and furthermore, because it allows for good processability of the component (D), it can be suitably used as an adhesive resin composition for narrow-pitch conductive connection parts such as pads or lands with narrow pitch.

[0133] (D) It is preferable that the solder powder be spherical or ellipsoidal. According to a resin composition containing spherical or ellipsoidal (D) solder powder, the (D) solder powder can be uniformly dispersed within the resin composition, so the increase in contact resistance in the cured product of the resin composition can be particularly suppressed even when exposed to high temperature and high humidity conditions. The value obtained by dividing the length of the major axis of the particle of (D) solder powder (furthermore, the (D-1) tin-containing alloy solder powder described below) by the length of the minor axis (aspect ratio) is preferably 2 or less, more preferably 1.5 or less, and even more preferably 1.3 or less. The lower limit of the aspect ratio may be 1 or greater than 1.

[0134] (D) The length of the major axis and the length of the minor axis of the solder powder particles can be measured by observing a polished sample with a scanning electron microscope (SEM) after embedding (D) solder powder in an acrylic resin and analyzing the cross-sectional image of the powder particles. (D) The aspect ratio of the solder powder is preferably calculated by measuring 30 randomly selected (D) solder powder particles and calculating the average value.

[0135] (D) The average particle diameter of the solder powder is preferably 10 μm or less, more preferably 9 μm or less, even more preferably 8.5 μm or less, 8 μm or less, 7.5 μm or less, 7 μm or less, 6.5 μm or less, or 6 μm or less. The lower limit of the average particle diameter is preferably 0.1 μm or more, more preferably 0.5 μm or more, even more preferably 1 μm or more, even more preferably 1.5 μm or more, even more preferably 2 μm or more, and even more preferably 2.5 μm or more. (D) When the average particle diameter of the component is within the above suitable range, it is suitable because it provides a cured product capable of suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions, and furthermore, it is suitable because it is possible to obtain a resin composition that is particularly easy to apply when applied using a jet dispenser or applied as a thin film.

[0136] (D) The 90% particle diameter of the solder powder is preferably 25 μm or less, more preferably 20 μm or less, and even more preferably 17 μm or less, 16 μm or less, 15 μm or less, 14 μm or less, 13 μm or less, 12 μm or less, or 11 μm or less. The lower limit of the 90% particle diameter is not particularly limited and can be, for example, 2 μm or more, 3 μm or more, 4 μm or more, 5 μm or more, etc. (D) When the 90% particle diameter of the component is within the above suitable range, it is suitable because it provides a cured product capable of suppressing the increase in contact resistance even when exposed to high temperature and high humidity conditions, and furthermore, it is suitable because it is possible to obtain a resin composition that is particularly easy to apply when applied using a jet dispenser or applied as a thin film.

[0137] (D) The maximum particle diameter of the solder powder is preferably 30 μm or less, more preferably 25 μm or less, even more preferably 22 μm or less, 21 μm or less, 20 μm or less, 19 μm or less, 18 μm or less, 17 μm or less, 16 μm or less, or 15 μm or less. The lower limit of the maximum particle diameter is not particularly limited and can be, for example, 3 μm or more, 5 μm or more, etc. (D) When the maximum particle diameter of the component is within the above suitable range, it is suitable because it provides a cured product that can suppress the increase in contact resistance even when exposed to high temperature and high humidity conditions, and furthermore, it is suitable because it is possible to obtain a resin composition that is particularly easy to apply when applied using a jet dispenser or applied as a thin film.

[0138] (D) The average particle diameter and maximum particle diameter of the solder powder can be measured by the laser diffraction scattering method based on Mie scattering theory. Specifically, the particle diameter distribution of (D) the solder powder is prepared on a volume basis using a laser diffraction scattering particle diameter distribution measuring device. Then, the median diameter D of the particle diameter distribution 50 is the average particle diameter, and the maximum particle diameter D of the particle diameter distribution. 100 can be measured as the maximum particle diameter. In addition, in the particle diameter distribution, the particle diameter D at which the accumulated volume from the smaller particle diameter side reaches 90%. 90 (D) The particle diameter distribution of the solder powder can be measured as the 90% particle diameter. (C) The particle diameter distribution of the powder can be measured in the same way as the particle diameter distribution of the powder.

[0139] (C) is the average particle diameter of the powder D 50 (C) and (D) the average particle diameter of the solder powder is D 50 In the case of (D), D 50 (D) / D 50The ratio of average particle diameters represented by (C) is preferably 0.1 or more, more preferably 0.5 or more, even more preferably 0.8 or more, preferably 7 or less, more preferably 5 or less, even more preferably 3 or less, even more preferably 2 or less, and even more preferably 1.6 or less, in order to significantly obtain the desired effect of the present invention.

[0140] (D) The solder powder includes (D-1) a tin-containing alloy solder powder as a component. (D-1) The tin-containing alloy solder powder refers to a solder powder composed of an alloy containing tin (Sn) and a metal element other than tin. Examples of metal elements other than tin include, for instance, bismuth (Bi), silver (Ag), copper (Cu), indium (In), antimony (Sb), zinc (Zn), nickel (Ni), germanium (Ge), and gallium (Ga). (D-1) The tin-containing alloy solder powder may be used as a single type or in combination of two or more types.

[0141] According to the composition of the present invention, in combination with components (A) to (C), component (D) comprises (D-1) tin-containing alloy solder powder, a resin composition that is easy to apply when applied using a jet dispenser or when applied as a thin film can be obtained. Furthermore, according to the composition of the present invention, in combination with components (A) to (C), component (D) comprises (D-1) tin-containing alloy solder powder, a cured product capable of suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions can be provided. Specifically, since (D-1) tin-containing alloy solder powder has a smaller ionization tendency compared to zinc powder or aluminum powder known to be suitable for the resin composition described in Patent Document 3 (i.e., tin-containing alloy solder has a higher standard electrode potential at 25°C than zinc or aluminum), the resin composition of the present invention can provide a cured product capable of suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions.

[0142] In addition, since the resin composition of the present invention can maintain good processability of tin-containing alloy solder powder, it can be suitably used as an adhesive resin composition for narrow-pitch conductive connection parts such as pads or lands with narrow pitch.

[0143] In addition, zinc powder or aluminum powder, which are known to be suitable in the resin composition described in Patent Document 3, are prone to oxidation, resulting in poor handling properties for metal powders. In this regard, tin-containing alloy solder powder is less prone to oxidation compared to metal powders with poor handling properties, and thus offers excellent handling properties for metal powders. Therefore, according to the composition of the present invention, in combination with components (A) to (C), component (D) comprises (D-1) tin-containing alloy solder powder, it is suitable because a cured product capable of suppressing an increase in contact resistance can be stably obtained even when exposed to high temperature and high humidity conditions.

[0144] In addition, since tin-containing alloy solder powder has a lower melting point than zinc powder or aluminum powder, the resin composition of the present invention is suitable because it can provide a cured product that can suppress the increase in contact resistance even when exposed to high temperature and high humidity conditions, and furthermore, achieve a resin composition with particularly excellent low-temperature curing properties.

[0145] (D-1) As a component, specifically, alloy powders such as Sn-Bi alloy powder, Sn-Ag alloy powder, Sn-Cu alloy powder, Sn-Ag-Bi alloy powder, Sn-Ag-Cu alloy powder, Sn-Ag-Sb-Bi alloy powder, Sn-Ag-Cu-Bi alloy powder, Sn-Ag-Cu-Ni alloy powder, Sn-Ag-Bi-In alloy powder, Sn-Ag-Cu-Bi-Sb alloy powder, and Sn-Ag-Cu-Bi-In-Sb alloy powder may be cited. In addition, in this specification, "E 1 -E 2 The term "alloy powder" refers to the metallic element E 1 and metallic element E 2 Indicates an alloy containing, and 「E 1 -E 2 -E 3 The term "alloy powder" refers to the metallic element E 1 , E 2 and E 3(D-1) In order to significantly obtain the desired effect of the present invention, the component preferably comprises one or more alloy powders selected from the group consisting of Sn-Bi alloy powder, Sn-Ag alloy powder, Sn-Cu alloy powder, Sn-Ag-Bi alloy powder, and Sn-Ag-Cu alloy powder, more preferably comprises one or more alloy powders selected from the group consisting of Sn-Bi alloy powder and Sn-Ag-Cu alloy powder, and even more preferably comprises Sn-Bi alloy powder.

[0146] Any element that may be included in component (D-1) may be, for example, an element derived from impurities that may inevitably be incorporated depending on the manufacturing method of component (D-1). Specific examples of elements derived from impurities that may inevitably be incorporated include phosphorus (P), aluminum (Al), cadmium (Cd), and arsenic (As). However, from the viewpoint of obtaining the effects of the present invention significantly, it is preferable that the amount of the element derived from impurities included in component (D-1) be less than 1 mass% with respect to 100 mass% of component (D-1).

[0147] In component (D-1), it is preferable that metal elements other than tin substantially not include metal elements selected from the group consisting of aluminum, zinc, iron, and indium. Specifically, in component (D-1), the content of aluminum, zinc, iron, and indium is preferably less than 1 mass%, more preferably 0.5 mass% or less, even more preferably 0.1 mass% or less, and even more preferably 0.01 mass% or less, with respect to 100 mass% of component (D-1). The lower limit of the content of the metal elements is more preferable as it approaches 0 mass%, and more preferably 0 mass%. In other words, in a suitable embodiment, solder powder made of an alloy containing tin and a metal element selected from the group consisting of aluminum, zinc, iron, and aluminum is excluded from component (D-1). By making component (D-1) in this manner, it is suitable to particularly suppress the increase in contact resistance in the cured product of the resin composition even when exposed to high temperature and high humidity conditions. In addition, by making the (D-1) component in this manner, it is easy to achieve a resin composition with particularly excellent low-temperature curing properties, and also easy to achieve a conductive connection part with particularly excellent reliability, so it is suitable.

[0148] (D-1) The amount of each element contained in the metal powder, such as the component, can be measured by an inductively coupled plasma emission spectroscopic analyzer (e.g., "ICP-OES 720ES" manufactured by Agilent Technologies).

[0149] The amount of tin included in component (D-1) is preferably 30 mass% or more, more preferably 40 mass% or more, even more preferably 45 mass% or more, with respect to 100 mass% of component (D-1), and preferably 99 mass% or less, more preferably 98 mass% or less, and even more preferably 97 mass% or less, with respect to 100 mass% of component (D-1). In one embodiment, the amount of tin included in component (D-1) may be 95 mass% or less, 90 mass% or less, 85 mass% or less, 80 mass% or less, 75 mass% or less, 70 mass% or less, 65 mass% or less, 60 mass% or less, 55 mass% or less, or 50 mass% or less, with respect to 100 mass% of component (D-1).

[0150] When component (D-1) includes Sn-Bi alloy powder, the amount of bismuth that may be included in component (D-1) is, with respect to obtaining the desired effect of the present invention significantly, preferably 30 mass% or more, more preferably 40 mass% or more, even more preferably 50 mass% or more, even more preferably 55 mass% or more, preferably 80 mass% or less, more preferably 70 mass% or less, and even more preferably 60 mass% or less.

[0151] When component (D-1) includes Sn-Ag-Cu alloy powder, the amount of silver that may be included in component (D-1) is, with respect to obtaining the desired effect of the present invention significantly, preferably 0.1 mass% or more, more preferably 1 mass% or more, even more preferably 2 mass% or more, even more preferably 2.5 mass% or more, preferably 10 mass% or less, more preferably 7 mass% or less, even more preferably 5 mass% or less or 4 mass% or less.

[0152] When component (D-1) includes Sn-Ag-Cu alloy powder, the amount of copper that may be included in component (D-1) is, with respect to 100 mass% of component (D-1), preferably 0.01 mass% or more, more preferably 0.1 mass% or more, even more preferably 0.3 mass% or more or 0.4 mass% or more, preferably 5 mass% or less, more preferably 3 mass% or less, and even more preferably 1 mass% or less, in order to significantly obtain the desired effect of the present invention.

[0153] It is preferable that the melting point of component (D-1) be within a suitable range of the melting point of the solder powder (D) above. Accordingly, the melting point of component (D-1) is preferably 400°C or lower, more preferably 350°C or lower, even more preferably 300°C or lower, and even more preferably 290°C or lower, 280°C or lower, 270°C or lower, 260°C or lower, and 250°C or lower. There is no particular limit on the lower limit of the melting point of component (D-1), and it can be, for example, 100°C or higher, 105°C or higher, 110°C or higher, etc. When the melting point of component (D-1) is within the suitable range above, it provides a cured product capable of suppressing the increase in contact resistance even when exposed to high temperature and high humidity conditions, and furthermore, because it allows for good processability of component (D-1), it can be suitably used as an adhesive resin composition for narrow-pitch conductive connection parts such as pads or lands with narrow pitch.

[0154] The average particle diameter of component (D-1) is preferably within a suitable range of the average particle diameter of the solder powder (D). Accordingly, the average particle diameter of component (D-1) is preferably 10 μm or less, more preferably 9 μm or less, even more preferably 8.5 μm or less, 8 μm or less, 7.5 μm or less, 7 μm or less, 6.5 μm or less, or 6 μm or less. The lower limit of the average particle diameter is preferably 0.1 μm or more, more preferably 0.5 μm or more, even more preferably 1 μm or more, even more preferably 1.5 μm or more, even more preferably 2 μm or more, and even more preferably 2.5 μm or more. When the average particle diameter of component (D-1) is within the suitable range, it is suitable because it provides a cured product capable of suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions, and also allows for obtaining a resin composition that is particularly easy to apply when using a jet dispenser or when applying as a thin film.

[0155] (D-1) The 90% particle diameter of the component is preferably 25 μm or less, more preferably 20 μm or less, and even more preferably 17 μm or less, 16 μm or less, 15 μm or less, 14 μm or less, 13 μm or less, 12 μm or less, or 11 μm or less. The lower limit of the 90% particle diameter is not particularly limited and can be, for example, 2 μm or more, 3 μm or more, 4 μm or more, 5 μm or more, etc. (D-1) When the 90% particle diameter of the component is within the above suitable range, it is suitable because it provides a cured product capable of suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions, and also allows for obtaining a resin composition that is particularly easy to apply when applied using a jet dispenser or applied as a thin film.

[0156] It is preferable that the maximum particle diameter of component (D-1) be within a suitable range of the maximum particle diameter of the solder powder (D). Accordingly, the maximum particle diameter of component (D-1) is preferably 30 μm or less, more preferably 25 μm or less, even more preferably 22 μm or less, 21 μm or less, 20 μm or less, 19 μm or less, 18 μm or less, 17 μm or less, 16 μm or less, or 15 μm or less. There is no particular limitation on the lower limit of the maximum particle diameter, and it can be, for example, 3 μm or more, 5 μm or more, etc. When the maximum particle diameter of component (D-1) is within the suitable range, it is suitable because it provides a cured product capable of suppressing the increase in contact resistance even when exposed to high temperature and high humidity conditions, and also allows for obtaining a resin composition that is particularly easy to apply when applied using a jet dispenser or applied as a thin film.

[0157] The content of the (D-1) tin-containing alloy solder powder in the resin composition is 5 mass% or more with respect to 100 mass% of the total components in the resin composition. The upper limit of the content of the (D-1) component is preferably 25 mass% or less, more preferably 20 mass% or less, even more preferably 15 mass% or less, and even more preferably 13 mass% or less, 12 mass% or less, or 11 mass% or less, from the view of significantly obtaining the desired effect of the present invention. According to the composition of the resin composition of the present invention in which the content of the (D-1) component is 5 mass% or more with respect to 100 mass% of the total components in the resin composition, compared with a resin composition that does not satisfy the above composition, a cured product capable of suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions can be provided.

[0158] The content of (D-1) tin-containing alloy solder powder in the resin composition is, with respect to 100 mass% of all metal powders in the resin composition, preferably 1 mass% or more, more preferably 3 mass% or more, even more preferably 5 mass% or more or 6 mass% or more, and preferably 30 mass% or less, more preferably 20 mass% or less, even more preferably 15 mass% or less or 13 mass% or less, in order to significantly obtain the desired effect of the present invention.

[0159] When the content of (D-1) tin-containing alloy solder powder relative to 100 mass% of the non-volatile component in the resin composition is denoted as M(D-1), the mass ratio represented as M(A) / M(D-1) is preferably 0.5 or more, more preferably 1 or more, even more preferably 1.5 or more, preferably 10 or less, more preferably 7 or less, even more preferably 5 or less or 4 or less, from the viewpoint of significantly obtaining the desired effect of the present invention.

[0160] In the resin composition of the present invention, the mass ratio represented by M(C) / M(D-1) is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more or 6 or more, from the viewpoint of significantly obtaining the desired effect of the present invention, and preferably 30 or less, more preferably 20 or less, and even more preferably 16 or less.

[0161] (D) The solder powder may additionally include (D-2) other solder powder as an optional component. (D-2) other solder powder as a component may be used as a single type or in combination of two or more types.

[0162] (D-2) Other solder powders include, for example, solder powders made of monometals such as pure tin powder and pure indium powder; solder powders made of alloys that do not contain tin, such as In-Ag alloys.

[0163] The content of component (D-2) in the resin composition is preferably 20 mass% or less, more preferably 15 mass% or less, even more preferably 10 mass% or less, and even more preferably 5 mass% or less, based on 100 mass% of the total components in the resin composition, in order to significantly obtain the desired effect of the present invention. The lower limit of the content of component (D-2) may be 0 mass% or greater than 0 mass%. Among these, it is preferable that the content of component (D-2) be 0 mass%. That is, in a suitable embodiment, the solder powder (D) in the resin composition does not include (D-2) other solder powder. In other words, in a suitable embodiment, the resin composition of the present invention excludes a resin composition containing (D-2) other solder powder.

[0164] In the resin composition of the present invention, the total amount of (C) silver powder and (D-1) tin-containing alloy solder powder is, with respect to 100 mass% of the total components in the resin composition, preferably 70 mass% or more, more preferably 73 mass% or more, even more preferably 75 mass% or more, even more preferably 77 mass% or more or 78 mass% or more, and preferably 95 mass% or less, more preferably 90 mass% or less, even more preferably 85 mass% or less, and even more preferably 81 mass% or less.

[0165] <(E) Other metal powders>

[0166] The resin composition of the present invention may additionally include (E) other metal powder as an optional component. The (E) other metal powder as component (E) does not include components (A) to (D) above. One type of (E) other metal powder may be used alone, or two or more types may be used in combination.

[0167] (E) Other metal powders may include, for example, metal powders made of single metals such as copper (Cu), gold (Au), platinum (Pt), aluminum (Al), zinc (Zn), nickel (Ni), cobalt (Co), tungsten (W), and molybdenum (Mo); alloy powders made of two or more metals selected from the group consisting of silver (Ag), copper (Cu), gold (Au), platinum (Pt), aluminum (Al), zinc (Zn), nickel (Ni), cobalt (Co), tungsten (W), and molybdenum (Mo).

[0168] (E) There are no particular restrictions on the shape of other metal powders, and various shapes such as spherical, teardrop-shaped, angular, fibrous, granular, flake-shaped, needle-shaped, filamentous (dendritic), and irregular shapes may be used. (E) Other metal powders may include two or more types of silver powders with different shapes.

[0169] (E) The average particle diameter of the other metal powder is preferably 15 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the average particle diameter is preferably 0.1 μm or more, more preferably 1 μm or more, even more preferably 2 μm or more, and even more preferably 3 μm or more.

[0170] (E) The average particle diameter of other metal powders can be measured by a laser diffraction scattering method based on Mie scattering theory, just like (C) silver powder and (D) solder powder. Specifically, the particle diameter distribution of (E) other metal powders is prepared on a volume basis by a laser diffraction scattering particle diameter distribution measuring device. Then, the median diameter of the particle diameter distribution can be measured as the average particle diameter. The particle diameter distribution of (E) other metal powders can be measured in the same way as the particle diameter distribution of (C) silver powder.

[0171] When the resin composition of the present invention includes (E) other metal powder, the content of (E) other metal powder in the resin composition is, for example, 0.1 mass% or more, preferably 1 mass% or more, more preferably 3 mass% or more, even more preferably 5 mass% or more, with respect to 100 mass% of the total components in the resin composition, preferably 15 mass% or less, more preferably 10 mass% or less, and even more preferably 7 mass% or less.

[0172] <(F) Organic Filler>

[0173] The resin composition of the present invention may additionally include an organic filler (F) as an optional component. The organic filler (F) as component (F) does not include components (A) to (E) above. The organic filler (F) may be used as a single type or in combination of two or more types.

[0174] (F) Examples of organic fillers include rubber particles, polyamide microparticles, silicone particles, core-shell type particles, etc. Among these, (E) it is preferable that the organic filler includes either rubber particles or core-shell type particles, and it is more preferable that it includes core-shell type rubber particles.

[0175] Examples of rubber components included in rubber particles include olefin-based thermoplastic elastomers such as polybutadiene, polyisoprene, polychlorobutadiene, ethylene-vinyl acetate copolymer, styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-isobutylene copolymer, acrylonitrile-butadiene copolymer, isoprene-isobutylene copolymer, isobutylene-butadiene copolymer, ethylene-propylene-diene ternary copolymer, and ethylene-propylene-butene ternary copolymer; and acrylic-based thermoplastic elastomers such as poly(meth)acrylate propyl, poly(meth)acrylate butyl, poly(meth)acrylate cyclohexyl, and poly(meth)acrylate octyl.

[0176] As for the rubber particles, commercially available products may be used, for example, “EXL-2655” manufactured by Dow Chemical Nippon, “Starfiloid AC3401N” and “Starfiloid AC3816N” manufactured by Aika Kogyo. “Starfiloid AC3816N” also corresponds to core-shell type rubber particles. These may be used as a single type or in combination of two or more types.

[0177] A core-shell type particle is a particulate organic filler comprising a core particle containing a rubber component as exemplified above and one or more shell layers covering it. Furthermore, it is preferable that the core-shell type particle be a core-shell type graft copolymer particle comprising a core particle containing a rubber component as exemplified above and a shell layer formed by graft copolymerizing a monomer component copolymerizable with the rubber component contained in the core particle. The term "core-shell type" as used herein does not necessarily refer only to cases where the core particle and the shell layer can be clearly distinguished, but also includes cases where the boundary between the core particle and the shell layer is indistinct, and the core particle does not need to be completely covered by the shell layer.

[0178] The content ratio of the rubber component in the core-shell type graft copolymer particles is preferably 40 mass% or more, more preferably 50 mass% or more, and even more preferably 60 mass% or more, when the total mass of the core-shell type graft copolymer particles is 100 mass%. The upper limit of the content ratio of the rubber component in the core-shell type graft copolymer particles is not particularly limited, but it is preferable to be 95 mass% or less or 90 mass% from the perspective of sufficiently coating the core particles with the shell portion.

[0179] As monomer components forming the shell portion of core-shell type graft copolymer particles, examples include (meth)acrylic acid esters such as (meth)acrylate methyl, (meth)acrylate ethyl, (meth)acrylate butyl, (meth)acrylate cyclohexyl, (meth)acrylate octyl, (meth)acrylate glycidyl; (meth)acrylic acid; N-substituted maleimides such as N-methylmaleimide, N-phenylmaleimide; maleimides; α,β-unsaturated carboxylic acids such as maleic acid, itaconic acid; aromatic vinyl compounds such as styrene, 4-vinyltoluene, α-methylstyrene; (meth)acrylonitrile, etc., and (meth)acrylic acid esters are preferred, and (meth)acrylate methyl is more preferred.

[0180] Commercially available core-shell type graft copolymer particles include, for example, “CHT” manufactured by Samsung SDI; “B602” manufactured by Techno UMG; “Pararoid EXL2602”, “Pararoid EXL2603”, “Pararoid EXL-2655”, “Pararoid EXL2311”, “Pararoid EXL2313”, “Pararoid EXL2315”, “Pararoid KM330”, “Pararoid KM336P”, “Pararoid KCZ201” manufactured by Dow Chemical Nippon; and “Metablen C-223A”, “Metablen E-901”, “Metablen S-2001”, “Metablen W-450A”, “Metablen SRK-200” manufactured by Mitsubishi Chemical. Examples include “JF-001” and “JF-003” manufactured by Mitsubishi Chemical Corporation (formerly Mitsubishi Rayon Corporation); and “Kane-Ace M-511”, “Kane-Ace M-600”, “Kane-Ace M-400”, “Kane-Ace M-580”, and “Kane-Ace MR-01” manufactured by Kaneka Corporation. These may be used individually or in combination of two or more types.

[0181] The average particle diameter (average primary particle diameter) of the core-shell type graft copolymer particles is not particularly limited, but is preferably 20 nm or more, more preferably 50 nm or more, even more preferably 80 nm or more, and even more preferably 100 nm or more. The upper limit of the average particle diameter (average primary particle diameter) of the core-shell type graft copolymer particles is preferably 5,000 nm or less, more preferably 2,000 nm or less, even more preferably 1,000 nm or less, and even more preferably 500 nm or less. The average particle diameter (average primary particle diameter) of the core-shell type graft copolymer particles can be measured using a zeta potential particle size distribution measuring device, etc.

[0182] As described above, the resin composition of the present invention may include (A) a dispersion of an organic filler in an epoxy resin as an epoxy resin. Commercial products of dispersions in an organic filler in an epoxy resin are as described above.

[0183] When the resin composition of the present invention includes an organic filler (F), the content of the organic filler (F) in the resin composition is, for example, 0.1 mass% or more, preferably 0.5 mass% or more, more preferably 0.8 mass% or more, even more preferably 1 mass% or more, with respect to 100 mass% of the total components in the resin composition, preferably 10 mass% or less, more preferably 5 mass% or less, even more preferably 3 mass% or less or 2 mass% or less.

[0184] When the resin composition of the present invention includes an organic filler (F), the content of the organic filler (F) in the resin composition is, for example, 0.1 mass% or more, preferably 1 mass% or more, more preferably 3 mass% or more, even more preferably 5 mass% or more, with respect to 100 mass% of the resin component in the resin composition, preferably 20 mass% or less, more preferably 10 mass% or less, and even more preferably 6 mass% or less.

[0185] When the resin composition of the present invention includes an organic filler (F), the content of the organic filler (F) relative to 100 mass% of the non-volatile component in the resin composition is denoted as M(F). In this case, the mass ratio represented as M(C) / M(F) is preferably 40 or more, more preferably 45 or more, even more preferably 50 or more, even more preferably 54 or more or 55 or more, and preferably 72 or less, more preferably 70 or less, and even more preferably 68 or less, from the viewpoint of significantly obtaining the desired effect of the present invention.

[0186] When the resin composition of the present invention includes an organic filler (F), the mass ratio represented as M(D-1) / M(F) is preferably 1 or more, more preferably 3 or more, even more preferably 4 or more, preferably 9 or less, more preferably 8.7 or less, even more preferably 8.5 or less, and even more preferably 8.3 or less or 8.2 or less, from the viewpoint of significantly obtaining the desired effect of the present invention.

[0187] <(G) Silane coupling agent>

[0188] The resin composition of the present invention may additionally include a (G) silane coupling agent as an optional component. The (G) silane coupling agent as the (G) component does not include components corresponding to (A) to (F) above. The (G) silane coupling agent may be used as a single type or in combination of two or more types.

[0189] (G) It is preferable that the silane coupling agent has a structure represented by the following chemical formula (X).

[0190] [Chemical formula (X)]

[0191]

[0192] (among chemical formula (X),

[0193] R X1 Each independently represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an acyl group having 1 to 20 carbon atoms;

[0194] R X2 Each independently represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms;

[0195] R X3 It represents a monovalent organic group;

[0196] n X represents an integer from 1 to 3.)

[0197] In chemical formula (X), R X1 Each represents, independently, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an acyl group having 1 to 20 carbon atoms. R X1 Specific examples of the group represented by include straight-chain, branched, or cyclic alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, neopentyl, n-hexyl, n-octyl, and cyclohexyl groups; aryl groups such as phenyl, tolyl, xylyl, and naphthyl groups; and acyl groups such as formyl, acetyl, and propionyl groups. Among these, R X1 The group represented by is preferably an alkyl group having 1 to 8 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, even more preferably a methyl group or an ethyl group, and even more preferably a methyl group.

[0198] In chemical formula (X), R X2 Each represents, independently, an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms. R X2 Specific examples of the group represented by include straight-chain, branched, or cyclic alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, neopentyl, n-hexyl, n-octyl, and cyclohexyl groups; and aryl groups such as phenyl, tolyl, xylyl, and naphthyl groups. Among these, R X2 The group represented by is preferably an alkyl group having 1 to 8 carbon atoms or a phenyl group, more preferably an alkyl group having 1 to 6 carbon atoms or a phenyl group, and even more preferably a methyl group, an ethyl group, or a phenyl group.

[0199] In chemical formula (X), R X3 represents a monovalent organic group. R X3There are no particular restrictions on the monovalent organic group represented by [the formula], and it may contain, for example, one or more of an epoxy group, a group that reacts with an epoxy group to form a cross-linked structure, and a radical polymerizable group. Examples of groups that react with an epoxy group to form a cross-linked structure include, for example, highly reactive ester groups such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds; hydroxyl groups (phenolic hydroxyl groups) bonded to aromatic rings such as benzene rings and naphthalene rings; groups containing a carbodiimide structure; cyanate groups; groups containing a benzoxazine ring; acid anhydride groups; amino groups; mercapto groups, etc. A radical polymerizable group is a group containing a radical polymerizable ethylenically unsaturated bond. Ethyleneenically unsaturated bonds do not include reactively inactive unsaturated bonds that constitute aromatic groups such as benzene rings. Examples of radical polymerizable groups include, for instance, unsaturated hydrocarbon groups such as vinyl groups, propenyl groups (allyl groups, 1-propenyl groups, isopropenyl groups), butenyl groups (1-butenyl groups, crotyl groups, metallyl groups, isocrotyl groups, etc.), pentenyl groups (1-pentenyl groups, etc.), hexenyl groups (1-hexenyl groups, etc.), cyclopentenyl groups (2-cyclopentenyl groups, etc.), and cyclohexenyl groups (3-cyclohexenyl groups, etc.); and α,β-unsaturated carbonyl groups such as acryloyl groups, methacryloyl groups, and maleimide groups (2,5-dihydro-2,5-dioxo-1H-pyrrole-1-yl groups). Among these, R X3 The monovalent organic group represented by is preferably one that contains an epoxy group, and more preferably one that contains a glycidyl ether group.

[0200] In the chemical formula (X), n X represents an integer from 1 to 3, preferably 2 or 3, and more preferably 3.

[0201] (G) Commercially available silane coupling agents may be used. Commercially available silane coupling agents include, for example, “KBM-403” (3-glycidoxypropyltrimethoxysilane), “KBM-803” (3-mercaptopropyltrimethoxysilane), “KBE-903” (3-aminopropyltriethoxysilane), “KBM-573” (N-phenyl-3-aminopropyltrimethoxysilane), “SZ-31” (hexamethyldisilazane), “KBM-103” (phenyltrimethoxysilane), “KBM-4803” (8-glycidoxyoctyltrimethoxysilane), “KBM-7103” (3,3,3-trifluoropropyltrimethoxysilane), “LS1375” (3-mercaptopropylmethyldimethoxysilane), and “LS3610” (N-(3-triethoxysilylpropyl)urea) manufactured by Shin-Etsu Kagaku Kogyo Co., Ltd. Examples include "Syraace S810" (3-mercaptopropyltrimethoxysilane) manufactured by Chixo Co., Ltd.; "SIM6475.0" (3-mercaptopropyltriethoxysilane), "SIM6474.0" (3-mercaptopropylmethyldimethoxysilane), "SIM6473.5C" (mercaptomethyltrimethoxysilane), "SIM6473.0" (mercaptomethylmethyldimethoxysilane), "SIU9055.0" (N-(3-triethoxysilylpropyl)urea), "SIU9058.0" (N-(3-trimethoxysilylpropyl)urea) manufactured by Azmax Co., Ltd.; and "VD-5" (a compound having an aminotriazine ring and an ethoxysilyl group) manufactured by Shikoku Kasei Kogyo Co., Ltd.

[0202] When the resin composition of the present invention includes a (G) silane coupling agent, the content of the (G) silane coupling agent in the resin composition is, for example, 0.01 mass% or more, preferably 0.05 mass% or more, more preferably 0.1 mass% or more, even more preferably 0.15 mass% or more, even more preferably 0.2 mass% or more with respect to 100 mass% of the total components in the resin composition, and preferably 5 mass% or less, more preferably 3 mass% or less, even more preferably 1 mass% or less, even more preferably 0.5 mass% or less, and even more preferably 0.3 mass% or less.

[0203] When the resin composition of the present invention includes a (G) silane coupling agent, the content of the (G) silane coupling agent in the resin composition is, for example, 0.1 mass% or more, preferably 0.5 mass% or more, more preferably 0.7 mass% or more, even more preferably 0.9 mass% or more or 1 mass% or more with respect to 100 mass% of the resin component in the resin composition, and preferably 10 mass% or less, more preferably 5 mass% or less, even more preferably 3 mass% or less or 2 mass% or less.

[0204] <(H) Preservative Stabilizer>

[0205] The resin composition of the present invention may additionally include a (H) preservative stabilizer as an optional component. The (H) preservative stabilizer as the (H) component does not include components corresponding to (A) to (G) above. The (H) preservative stabilizer may be used as a single type or in combination of two or more types.

[0206] (H) Examples of preservative stabilizers include borate compounds, titanate compounds, aluminate compounds, zirconate compounds, isocyanate compounds, etc. Among these, (H) it is preferable that the preservative stabilizer includes a borate compound.

[0207] Examples of borate compounds include trimethylborate, triethylborate (TEB), tri-n-propylborate, triisopropylborate, tri-n-butylborate, tripentylborate, trialylborate, trihexylborate, tricyclohexylborate, trioctylborate, trinonylborate, tridecylborate, tridodecylborate, trihexadecylborate, trioctadecylborate, tris(2-ethylhexyloxy)borane, bis(1,4,7,10-tetraoxaudecyl)(1,4,7,10,13-pentaoxatetradecyl)(1,4,7-trioxaudecyl)borane, tribenzylborate, triphenylborate, tri-o-tolylborate, tri-m-tolylborate, triethanolamineborate, etc.

[0208] Examples of titanate compounds include tetraethyl titanate, tetrapropyl titanate, tetraisoproprutitanate, tetrabutyl titanate, tetraoctyl titanate, etc.

[0209] Examples of aluminate compounds include triethylaluminate, tripropylaluminate, triisopropylaluminate, tributylaluminate, trioctylaluminate, etc.

[0210] Examples of zirconate compounds include tetraethyl zirconate, tetrapropyl zirconate, tetraisopropyl zirconate, tetrabutyl zirconate, etc.

[0211] Examples of isocyanate compounds include, for instance, n-butyl isocyanate, isopropyl isocyanate, 2-chloroethyl isocyanate, phenyl isocyanate, p-chlorophenyl isocyanate, benzyl isocyanate, hexamethylene diisocyanate, 2-ethylphenyl isocyanate, 2,6-dimethylphenyl isocyanate, tolylene diisocyanate (e.g., 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate), 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, tolidin diisocyanate, isophorone diisocyanate, xylylene diisocyanate, paraphenylene diisocyanate, bicycloheptane triisocyanate, etc.

[0212] When the resin composition of the present invention includes a (H) preservative stabilizer, the content of the (H) preservative stabilizer in the resin composition is, for example, 0.01 mass% or more, preferably 0.05 mass% or more, more preferably 0.1 mass% or more, even more preferably 0.15 mass% or more with respect to 100 mass% of the total components in the resin composition, preferably 5 mass% or less, more preferably 3 mass% or less, even more preferably 1 mass% or less, even more preferably 0.5 mass% or less, even more preferably 0.3 mass% or less or 0.2 mass% or less.

[0213] When the resin composition of the present invention includes a (H) preservation stabilizer, the content of the (H) preservation stabilizer in the resin composition is, for example, 0.1 mass% or more, preferably 0.3 mass% or more, more preferably 0.5 mass% or more, even more preferably 0.7 mass% or more or 0.8 mass% or more with respect to 100 mass% of the resin component in the resin composition, and preferably 10 mass% or less, more preferably 5 mass% or less, even more preferably 3 mass% or less, and even more preferably 1 mass% or less.

[0214] When the resin composition of the present invention includes a (H) preservative stabilizer, the content of the (H) preservative stabilizer relative to 100 mass% of the non-volatile component in the resin composition is denoted as M(H). In this case, the mass ratio represented as M(A) / M(H) is preferably 60 or more, more preferably 75 or more, even more preferably 85 or more, and even more preferably 89 or more, and preferably 150 or less, more preferably 120 or less, and even more preferably 100 or less, from the viewpoint of significantly obtaining the desired effect of the present invention.

[0215] <(I) Flux Activator>

[0216] The resin composition of the present invention may additionally include (I) a flux activator as an optional component. The (I) flux activator as component (I) does not include components (A) to (H) above. One type of (I) flux activator may be used alone, or two or more types may be used in combination.

[0217] (I) A flux activator may be a component that has the function of removing an oxide film that may be formed on a metal surface. (I) Examples of flux activators include organic acids such as monocarboxylic acids and dicarboxylic acids; salts of organic acids and amines; and non-dissolving halogenated compounds.

[0218] The content of (I) flux activator in the resin composition is, with respect to significantly obtaining the desired effect of the present invention, preferably 10 mass% or less, more preferably 5 mass% or less, even more preferably 1 mass% or less, even more preferably 0.1 mass% or less, even more preferably 0.05 mass% or less or less than 0.05 mass%, and even more preferably 0.04 mass% or less, 0.03 mass% or less, 0.02 mass% or less, or 0.01 mass% or less, with respect to 100 mass% of the total components in the resin composition. The lower limit of the content of the above (I) component may be 0 mass% or greater than 0 mass%. Among these, the content of the above (I) component is more preferable as it approaches 0 mass%, and even more preferable as it is 0 mass%. That is, in a suitable embodiment, the resin composition of the present invention does not contain (I) flux activator. In other words, in a suitable embodiment, the resin composition of the present invention excludes a resin composition comprising (I) a flux activator. A resin composition that includes or does not include such an amount of (I) flux activator in combination with components (A) to (D) is suitable because it can effectively reduce the resistivity value of the cured product of the resin composition.

[0219] Likewise, the content of an organic acid (as an example, adipic acid) and an amine salt in the resin composition is, with respect to 100 mass% of the total components in the resin composition, preferably 10 mass% or less, more preferably 5 mass% or less, even more preferably 1 mass% or less, even more preferably 0.1 mass% or less, even more preferably 0.05 mass% or less or less than 0.05 mass%, and even more preferably 0.04 mass% or less, 0.03 mass% or less, 0.02 mass% or less, or 0.01 mass% or less. The lower limit of the content of the organic acid and amine salt may be 0 mass% or greater than 0 mass%. Among these, the content of the organic acid and amine salt is more preferable as it approaches 0 mass%, and is even more preferable to be 0 mass%. That is, in a suitable embodiment, the resin composition of the present invention does not contain salts of organic acids and amines. In other words, in a suitable embodiment, the resin composition of the present invention excludes resin compositions containing salts of organic acids and amines. A resin composition containing or not containing such amounts of salts of organic acids and amines is suitable because it can effectively reduce the resistivity value of the cured product of the resin composition.

[0220] <(J) Organic Solvents>

[0221] The resin composition of the present invention may additionally include an organic solvent (J) as an optional component. The organic solvent (J) as component (J) does not include components (A) to (I) above. The organic solvent (J) may be used as a single type or in combination of two or more types.

[0222] (J) As organic solvents, ketone-based solvents such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, cyclohexanone, etc.; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, γ-butyrolactone, etc.; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, anisole, etc.; alcohol-based solvents such as methanol, ethanol, propanol, butanol, ethylene glycol, etc.; Ether ester solvents such as 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, methyl methoxypropionate, etc.; ester alcohol solvents such as methyl lactate, ethyl lactate, 2-methyl hydroxyisobutyrate, etc.; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, diethylene glycol monobutyl ether (butyl carbitol), etc.; amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, etc.; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile, propionitrile, etc.; Examples include aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene.

[0223] The content of the organic solvent (J) in the resin composition is preferably 20 mass% or less, more preferably 10 mass% or less, even more preferably 5 mass% or less, and even more preferably 1 mass% or less, based on 100 mass% of the total components in the resin composition, in order to significantly obtain the desired effect of the present invention. The lower limit of the content of the above (J) component may be 0 mass% or greater than 0 mass%. Among these, it is preferable that the content of the above (J) component be 0 mass%. That is, in a suitable embodiment, the resin composition of the present invention is a solvent-free resin composition that does not contain the organic solvent (J). When the content of the organic solvent in the resin composition is low or does not contain the organic solvent, the occurrence of voids due to the volatilization of the organic solvent can be suppressed, and a resin composition with excellent handling and workability can be obtained.

[0224] <(K) Other Additives>

[0225] The resin composition of the present invention may additionally include (K) other additives as optional components. The (K) other additives as component (K) do not include those corresponding to components (A) to (J) above. One type of (K) other additive may be used alone, or two or more types may be used in combination.

[0226] (K) Other additives include, for example, thermosetting resins other than epoxy resins; thermoplastic resins; curing accelerators other than latent curing accelerators; polymerization initiators; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; coloring agents such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as benton and montmorillonite; defoaming agents such as silicone-based defoaming agents, acrylic-based defoaming agents, fluorine-based defoaming agents, and vinyl resin-based defoaming agents; UV absorbers such as benzotriazole-based UV absorbers; adhesion improvers such as ureasilane; adhesion promoters such as triazole-based adhesion promoters, tetrazole-based adhesion promoters, and triazine-based adhesion promoters; Examples include antioxidants such as hindered phenol-based antioxidants; fluorescent whitening agents such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; and flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide). When the resin composition of the present invention includes (K) other additives, the content of (K) other additives in the resin composition may be determined according to the characteristics required for the resin composition.In addition, the above (A) epoxy resin, (B) latent curing accelerator, (C) silver powder, (D) solder powder, (E) other metal powder, (F) organic filler, (G) silane coupling agent, (H) preservation stabilizer, (I) flux activator, and (J) organic solvent may have functions such as thermosetting resin, thermoplastic resin, curing accelerator, polymerization initiator, organometallic compound, coloring agent, polymerization inhibitor, leveling agent, thickener, defoamer, UV absorber, adhesion enhancer, adhesion imparter, antioxidant, fluorescent whitening agent, surfactant, flame retardant, etc. In such cases, the above components are considered to be the components of (A) epoxy resin, (B) latent curing accelerator, (C) silver powder, (D) solder powder, (E) other metal powder, (F) organic filler, (G) silane coupling agent, (H) preservation stabilizer, (I) flux activator, and (J) organic solvent, rather than (K) other additives.

[0227] [Method for manufacturing a resin composition]

[0228] The resin composition of the present invention can be prepared, for example, by mixing components that may be included in the resin composition. Some or all of the components may be mixed simultaneously, or they may be mixed in sequence. In one embodiment, the resin composition of the present invention is preferably prepared by mixing (A) an epoxy resin and (B) a latent curing accelerator (optional, (F) an organic filler, (G) a silane coupling agent, (H) a preservation stabilizer, (I) a flux activator, and (J) an organic solvent) to obtain a mixture, and then mixing metal powders such as (C) silver powder and (D) solder powder (optional, (E) other metal powder) into the mixture. During the process of mixing each component, the temperature may be appropriately set, and thus, heating and / or cooling may be performed temporarily or over time. Additionally, during the process of mixing each component, stirring or shaking may be performed, and degassing may also be performed.

[0229] [Characteristics of Resin Composition and Cured Product thereof]

[0230] The resin composition of the present invention may, for example, be a paste-type resin composition using (J) an organic solvent, or, for example, be a paste-type resin composition that does not contain (J) an organic solvent by using a liquid resin component such as a liquid epoxy resin, or may be a paste-type resin composition that contains only a small amount of (J) an organic solvent. As described above, since it is preferable that the resin composition of the present invention does not contain (J) an organic solvent, it is more preferable that the resin composition of the present invention be a paste-type resin composition that does not contain (J) an organic solvent.

[0231] By curing the resin composition of the present invention, a cured product of the resin composition can be obtained. Typically, since heat is applied during the curing of the resin composition, volatile components such as (J) organic solvents among the components included in the resin composition may volatilize due to the heat during curing. Therefore, the cured product obtained by curing the resin composition may include non-volatile components such as components (A) to (I) and component (K) or reaction products thereof.

[0232] The resin composition of the present invention comprises (A) an epoxy resin, (B) a latent curing accelerator, (C) silver powder, and (D) solder powder. Furthermore, in the resin composition of the present invention, (D) solder powder comprises (D-1) a tin-containing alloy solder powder. Additionally, in the resin composition of the present invention, the content of component (A) is 12 mass% or more with respect to 100 mass% of the total components in the resin composition, and the content of component (D-1) is 5 mass% or more with respect to 100 mass% of the total components in the resin composition. Furthermore, in the resin composition of the present invention, the viscosity of the resin composition measured using an E-type viscometer under conditions of 25°C and 1 rpm is 300 Pa·s or less, and the resistivity of the cured product obtained by curing the resin composition under conditions of 80°C and 60 minutes is 1 × 10⁻⁶ -2 The resistance is Ω·cm or less. According to the composition of the resin composition above, it is easy to apply even when using a jet dispenser or when applying as a thin film, and it is also possible to provide a cured product that can suppress the increase in contact resistance even when exposed to high temperature and high humidity conditions.

[0233] As described above, in the resin composition of the present invention, the viscosity of the resin composition measured using an E-type viscometer under conditions of 25°C and 1 rpm satisfies a specific numerical range. When measured using an E-type viscometer under conditions of 25°C and 1 rpm, the viscosity of the resin composition of the present invention is 300 Pa·s or less, preferably less than 270 Pa·s, more preferably less than 250 Pa·s, and even more preferably less than 230 Pa·s. In one embodiment, the viscosity of the resin composition of the present invention is more preferably less than 210 Pa·s or less than 200 Pa·s. The lower limit of the viscosity of the resin composition is not particularly limited and can be, for example, 20 Pa·s or more, 30 Pa·s or more, 40 Pa·s or more, 50 Pa·s or more, 60 Pa·s or more, 70 Pa·s or more, 80 Pa·s or more, 90 Pa·s or more, 100 Pa·s or more, 110 Pa·s or more, 120 Pa·s or more, 130 Pa·s or more, 140 Pa·s or more, 150 Pa·s or more, 160 Pa·s or more, 170 Pa·s or more, 180 Pa·s or more, or 190 Pa·s or more. According to the composition of the resin composition of the present invention having a viscosity satisfying a specific numerical range, a resin composition that is paste-like at room temperature can be achieved, and it can be applied well even when applied using a jet dispenser or applied as a thin film, and it can also accommodate electronic components with a narrow pitch between conductive connection parts such as pads and lands. The viscosity of the resin composition can be adjusted, for example, by the composition of the resin composition.Specifically, the viscosity of the resin composition can be adjusted by combining a specific amount of (A) epoxy resin, (B) latent curing accelerator, (C) silver powder, and a specific amount of (D-1) tin-containing alloy solder powder, (D) solder powder (if necessary, (D-2) other solder powder, (E) other metal powder, (F) organic filler, (G) silane coupling agent, (H) preservation stabilizer, (I) flux activator, (J) organic solvent, and (K) other additive). For example, if the total content of component (C) and component (D) (if necessary, additionally (E) other metal powder) in the resin composition increases, the viscosity of the resin composition tends to increase. In addition, for example, when the total content of component (C) and component (D) (and additionally (E) other metal powder, if necessary) in the resin composition is constant, the viscosity of the resin composition tends to decrease as the content of component (A) in the resin composition increases. In addition, for example, when component (A) includes a liquid epoxy resin, the viscosity of the resin composition tends to decrease as the content of the liquid epoxy resin in the resin composition increases.

[0234] As described above, in the resin composition of the present invention, the resistivity value of the cured product obtained by curing the resin composition under conditions of 80°C for 60 minutes satisfies a specific numerical range. The resistivity value of the cured product obtained by curing the resin composition under conditions of 80°C for 60 minutes is 1×10⁻⁶ -2 Ω·cm or less, preferably 5×10 -3 Less than Ω·cm, more preferably 1×10⁻⁶ -3 Less than Ω·cm, more preferably 5×10 -4 It is less than Ω·cm. There is no particular limit to the lower limit of the resistivity value of the cured product of the resin composition under the above conditions, and, for example, 1×10⁻⁶ -7The resistivity can be expressed in Ω·cm, etc. According to the composition of the resin composition of the present invention having a resistivity value within a specific numerical range in the cured product of the resin composition under the above conditions, when bonding electronic components, it is possible to cure at a low temperature and achieve low contact resistance and good conductivity. The resistivity value of the cured product of the resin composition under the above conditions can be adjusted, for example, by the composition of the resin composition. Specifically, the resistivity value of the cured product of the resin composition under the above conditions can be adjusted by combining and including a specific amount of (A) epoxy resin, (B) latent curing accelerator, (C) silver powder, and (D) solder powder (D-1) tin-containing alloy solder powder, which includes a specific amount of (D-2) other solder powder, (E) other metal powder, (F) organic filler, (G) silane coupling agent, (H) preservation stabilizer, (I) flux activator, (J) organic solvent, and (K) other additives. For example, if the content of component (C) in the resin composition increases, the resistivity value of the cured product of the resin composition under the above conditions tends to decrease. Also, for example, if the content of component (D) in the resin composition increases, the resistivity value of the cured product of the resin composition under the above conditions may decrease. Also, for example, if the content of component (B) in the resin composition increases, the resistivity value of the cured product of the resin composition under the above conditions tends to decrease. Also, for example, if component (B) includes a solid-dispersed amine adduct-based latent curing accelerator, if the content of said solid-dispersed amine adduct-based latent curing accelerator in the resin composition increases, the resistivity value of the cured product of the resin composition under the above conditions tends to increase. Also, for example, if the resin composition includes component (I) or does not include it, if the content of component (I) in the resin composition decreases, the resistivity value of the cured product of the resin composition under the above conditions tends to decrease.

[0235] The cured product of the resin composition of the present invention can suppress the increase in contact resistance even when exposed to high temperature and high humidity conditions. Therefore, the cured product of the resin composition of the present invention can provide a connection part with excellent reliability. For example, as described in <Test Example 3: Evaluation of Contact Resistance Before and After Exposure to High Temperature and High Humidity Conditions> below, the resin composition of the present invention is applied to nickel-plated stainless steel. Subsequently, the resin composition is cured under conditions of 80°C for 60 minutes to prepare a sample for measuring contact resistance. Using eight such samples, the contact resistance values ​​of the cured resin composition and nickel are measured before and after exposure to conditions of 85°C and 85%RH humidity for 1,000 hours. That is, the contact resistance value CR between the cured resin composition and nickel before exposure 0h Measure the contact resistance value CR between the cured resin composition and nickel after exposure, and subsequently, expose the sample to conditions of 85°C and 85%RH for 1,000 hours. 1000h Measures the resistance ratio CR 1000h / CR 0h The number of samples that make up 10 or more is preferably 5 or fewer or 4 or fewer, more preferably 3 or fewer or 2 or fewer, and even more preferably 1 or 0.

[0236] The resin composition of the present invention provides a cured product capable of suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions, and also possesses the characteristic of having particularly excellent curability at low temperatures such as 80°C. For example, as described in <Test Example 4: Evaluation of the curing rate of the resin composition under conditions of 80°C and 60 minutes> below, differential scanning calorimetry is performed on the resin composition of the present invention under measurement conditions of a temperature range of 25°C to 220°C and a heating rate of 5°C / minute. Additionally, differential scanning calorimetry is performed on the cured product obtained by curing the resin composition of the present invention under conditions of 80°C and 60 minutes under the same measurement conditions. In these two differential scanning calorimetry measurements, the reaction heat of the resin composition and the reaction heat of the cured product of the resin composition are compared to calculate the curing rate of the cured product of the resin composition. The curing rate (%) of the resin composition under conditions of 80°C for 60 minutes is preferably 70% or more, more preferably 75% or more, and even more preferably 80% or more. In one embodiment, the curing rate (%) of the resin composition under conditions of 80°C for 60 minutes is more preferably 85% or more. The upper limit of the curing rate (%) of the resin composition under the above conditions may be 100% or less than 100%. The curing rate of the resin composition under the above conditions can be adjusted, for example, by the composition of the resin composition. Specifically, the curing rate of the resin composition under the above conditions can be adjusted by combining (D) solder powder (D-1) containing a specific amount of (A) epoxy resin, (B) latent curing accelerator, (C) silver powder, and a specific amount of (D-2) tin-containing alloy solder powder (D-2) other solder powder, (E) other metal powder, (F) organic filler, (G) silane coupling agent, (H) preservation stabilizer, (I) flux activator, (J) organic solvent, and (K) other additives).For example, if the content of component (B) in the resin composition increases, the curing rate of the resin composition under the above conditions tends to increase. Also, for example, if component (B) includes a solid-dispersed amine adduct-based latent curing accelerator, if the content of the solid-dispersed amine adduct-based latent curing accelerator in the resin composition increases, the curing rate of the resin composition under the above conditions tends to increase. Also, for example, if the resin composition includes component (I) or does not include it, if the content of component (I) in the resin composition decreases, the curing rate of the resin composition under the above conditions tends to increase.

[0237] As described above, since the resin composition of the present invention may have the characteristic of having particularly excellent curability at low temperatures such as 80°C, the resin composition of the present invention may have the characteristic of a low reaction initiation temperature. For example, as described in <Test Example 4: Evaluation of the curing rate of the resin composition under conditions of 80°C and 60 minutes> below, differential scanning calorimetry is performed on the resin composition of the present invention under measurement conditions of a temperature range of 25°C to 220°C and a heating rate of 5°C / min. In this measurement, the reaction initiation temperature based on differential scanning calorimetry is preferably 70°C or lower, more preferably 65°C or lower, and even more preferably 60°C or lower. The lower limit of the reaction initiation temperature of the resin composition is not particularly limited, but can be, for example, 40°C or higher, 45°C or higher, 50°C or higher, 55°C or higher, etc. When the reaction initiation temperature based on differential scanning calorimetry is within the above suitable range, a resin composition can be obtained that provides a cured product capable of suppressing the increase in contact resistance even when exposed to high temperature and high humidity conditions, and also has significantly excellent curability at low temperatures.

[0238] As described above, since the resin composition of the present invention may have the characteristic of having particularly excellent curability at low temperatures such as 80°C, the resin composition of the present invention may have the characteristic of having a low reaction peak temperature. For example, as described in <Test Example 4: Evaluation of the curing rate of the resin composition under conditions of 80°C and 60 minutes> below, differential scanning calorimetry is performed on the resin composition of the present invention under measurement conditions of a temperature range of 25°C to 220°C and a heating rate of 5°C / min. In this measurement, the reaction peak temperature based on differential scanning calorimetry is preferably 140°C or lower, more preferably 135°C or lower, even more preferably 130°C or lower, even more preferably 125°C or lower, and even more preferably 120°C or lower. The lower limit of the reaction peak temperature of the resin composition is not particularly limited, but can be, for example, 50°C or higher, 55°C or higher, 60°C or higher, 65°C or higher, 70°C or higher, 75°C or higher, etc. In addition, by utilizing the property that the curability at low temperatures can be significantly excellent, the lower limit of the reaction peak temperature of the resin composition may be 80°C or higher, 85°C or higher, 90°C or higher, 95°C or higher, 100°C or higher, 105°C or higher, 110°C or higher, 115°C or higher, etc. When the reaction initiation temperature based on differential scanning calorimetry is within the above suitable range, it is possible to provide a cured product capable of suppressing the increase in contact resistance even when exposed to high temperature and high humidity conditions, and furthermore, obtain a resin composition with significantly excellent curability at low temperatures.

[0239] In addition, in differential scanning calorimetry of the resin composition of the present invention, when the reaction initiation temperature based on differential scanning calorimetry is set to T1 (°C) and the reaction peak temperature based on differential scanning calorimetry is set to T2 (°C), the temperature difference T2-T1 is preferably 80°C or less, more preferably 70°C or less, even more preferably 65°C or less, and even more preferably 60°C or less. When the upper limit of the temperature difference T2-T1 is within the above suitable range, a cured product capable of suppressing the increase in contact resistance even when exposed to high temperature and high humidity conditions can be provided, and furthermore, a resin composition with significantly excellent curability at low temperatures can be obtained. In addition, the lower limit of the temperature difference T2-T1 is preferably 40°C or more, more preferably 45°C or more, even more preferably 50°C or more, and even more preferably 55°C or more. When the lower limit of the temperature difference T2-T1 is within the above suitable range, the rapid curing reaction can be suppressed, thereby suppressing residual curing stress during the curing of the resin composition. That is, when the lower limit of the temperature difference T2-T1 is within the above suitable range, the cured product of the resin composition of the present invention provides a cured product capable of suppressing the increase in contact resistance even when exposed to high temperature and high humidity conditions, and furthermore, can provide a cured product having good adhesive strength.

[0240] The reaction initiation temperature of the resin composition, the reaction peak temperature of the resin composition, and the difference between the reaction initiation temperature and the reaction peak temperature of the resin composition can be adjusted, for example, by the composition of the resin composition. Specifically, by combining and including a specific amount of (A) epoxy resin, (B) latent curing accelerator, (C) silver powder, and a specific amount of (D-1) tin-containing alloy solder powder, (D) solder powder (if necessary, (D-2) other solder powder, (E) other metal powder, (F) organic filler, (G) silane coupling agent, (H) preservation stabilizer, (I) flux activator, (J) organic solvent, and (K) other additives), the reaction initiation temperature of the resin composition, the reaction peak temperature of the resin composition, and the difference between the reaction initiation temperature and the reaction peak temperature of the resin composition can be adjusted.

[0241] [Uses of Resin Composition]

[0242] The resin composition of the present invention can provide a cured product capable of suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions. Taking advantage of these excellent benefits, the resin composition is preferably used as an adhesive resin composition that requires suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions. In addition, since the resin composition can maintain good processability of tin-containing alloy solder powder, it can be suitably used as an adhesive resin composition for narrow-pitch conductive connection parts, such as narrow-pitch pads or lands.

[0243] The resin composition of the present invention is preferably used as an adhesive provided to a semiconductor device. Specific examples of semiconductor devices include various semiconductor devices provided to electrical products (e.g., computers, mobile phones, smartphones, tablet devices, wearable devices, digital cameras, camera modules, medical devices, televisions, etc.) and vehicles (e.g., motorcycles, automobiles, trams, ships, aircraft, etc.). Generally, a semiconductor device comprises an electronic component. Furthermore, generally, the electronic component includes an electronic component and a component other than the electronic component. Specific examples of the electronic component include a semiconductor chip, a power semiconductor, a module containing electronic components such as an LED-PKG (e.g., a camera module), a semiconductor chip package, etc., but are not limited thereto. In one example, the resin composition of the present invention is used to bond a first electronic component constituting an electronic component and a second electronic component constituting an electronic component. In such bonding, the first electronic component constituting an electronic component and the second electronic component constituting an electronic component are electrically connected by a cured product of the resin composition. Among these, the resin composition of the present invention is more preferably used to bond between components of a camera module. That is, in a more suitable embodiment, the resin composition of the present invention is used to bond a first electronic component constituting a camera module and a second electronic component constituting a camera module.

[0244] In addition, as another example of a preferred use of the resin composition, a resin composition for bonding a substrate and an electronic component in a semiconductor device may be cited. Specifically, the resin composition of the present invention may be used as an adhesive resin composition in a method for manufacturing a semiconductor device comprising bonding an electrode provided on a substrate, such as a circuit board, housing, and frame, to an electronic component, such as a semiconductor module. In such bonding, the electrode provided on the substrate and the electronic component, such as a semiconductor module, are electrically connected by a cured product of the resin composition. In such bonding, the resin composition of the present invention can provide a cured product capable of suppressing an increase in contact resistance even when exposed to high temperature and high humidity conditions, thereby suppressing corrosion of the electrode provided on the substrate. Taking advantage of these excellent benefits, the electrode provided on the substrate may be an electrode comprising a metal with a high ionization tendency, such as tin or nickel (i.e., a metal whose standard electrode potential at a temperature of 25°C is less than 0V). Furthermore, as described above, it is preferable to use the resin composition of the present invention for bonding between components of a camera module. Accordingly, in another more suitable embodiment, the resin composition of the present invention is used to bond a substrate constituting a camera module and an electronic component constituting a camera module.

[0245] [Electronic Absence]

[0246] An electronic member according to one embodiment of the present invention comprises a cured resin composition and an electronic component mounted on the cured resin.

[0247] As described above, the resin composition of the present invention is used to bond a first electronic component and a second electronic component constituting an electronic member. Accordingly, in one example, the electronic member includes a first electronic component, a second electronic component, and an adhesive portion for bonding the first electronic component and the second electronic component.

[0248] An electronic component can be manufactured by a method comprising, for example, a process of applying a resin composition to one or both of a first electronic component and a second electronic component, a process of bonding the first electronic component and the second electronic component with the resin composition in between, and a process of curing the resin composition. For example, the resin composition may be applied using a dispensing device such as a syringe or a dispenser, and if necessary, the resin composition may be applied to a uniform thickness by applying pressure.

[0249] Curing of the resin composition is typically performed by thermal curing. The thermal curing conditions of the resin composition layer may vary depending on the type of resin composition. For example, the curing temperature is preferably 50°C or higher, more preferably 60°C or higher, and even more preferably 70°C or higher; preferably 240°C or lower, more preferably 220°C or lower, and even more preferably 200°C or lower. As described above, the resin composition of the present invention may have the characteristic of excellent curability at low temperatures such as 80°C. Utilizing this excellent advantage, the upper limit of the curing temperature may be, for example, 190°C or lower, 180°C or lower, 170°C or lower, 160°C or lower, 150°C or lower, 140°C or lower, 130°C or lower, 120°C or lower, 110°C or lower, 100°C or lower, 90°C or lower, or 80°C or lower. In addition, the curing time may preferably be 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes. Furthermore, the process of curing the resin composition may include preheating the resin composition at a temperature lower than the curing temperature before heat-curing the resin composition.

[0250] [Semiconductor device]

[0251] A semiconductor device according to one embodiment of the present invention comprises a cured product of the resin composition. Examples of such a semiconductor device include a semiconductor device having the electronic member. Specific examples of the semiconductor device are as described above.

[0252] Additionally, in a semiconductor device, the resin composition may be used to bond components of the semiconductor device. For example, the semiconductor device may comprise a substrate, a cured product of the resin composition provided on the substrate, and an electronic component or electronic member mounted on the cured product. Examples of substrates include circuit boards, housings, and frames. In such a semiconductor device, the electronic component or electronic member is bonded to the substrate by the cured product of the resin composition. The bonding surface of the substrate (the surface bonded to the cured product) may be formed by a non-adhesive material.

[0253] [Example]

[0254] The present invention will be described in detail below by presenting examples. However, the present invention is not limited to these examples. In the following description, "parts" and "%" indicating amounts refer to "parts by mass" and "% by mass," respectively, unless otherwise specified. Additionally, unless otherwise specified, the temperature and pressure conditions were room temperature (25°C) and atmospheric pressure (1 atm).

[0255] <Examples 1 to 4, Comparative Examples 1 to 7: Preparation of Resin Compositions>

[0256] In each resin composition of Examples 1 to 4 and Comparative Examples 1 to 7, components other than component (C) and component (D) (i.e., components other than metal powder) were weighed in the mass portions listed in Tables 1 to 3 below, and each component was fed into a planetary mixer ("PLM-0.5" manufactured by Seisakusho Inoue) and mixed for 30 minutes. Subsequently, components (C) and component (D) were weighed in the mass portions listed in Tables 1 to 3 below, and each component was fed into a planetary mixer and mixed for 20 minutes. Subsequently, degassing was performed using a planetary mixer for 30 minutes to prepare each resin composition. The details of each component listed in Tables 1 to 3 below are as follows. In addition, “RKB-3040H” is a mixture of (A) epoxy resin and (F) organic filler, but in Tables 1 to 3 below, the mass portions of (A) epoxy resin and (F) organic filler are listed separately.

[0257] (A) Epoxy resin:

[0258] · "ZX-1059": Liquid epoxy resin, manufactured by Nittetsu Chemical & Materials, a 1:1 mixture of Bisphenol A type epoxy resin and Bisphenol F type epoxy resin

[0259] · "YDF-8170": Liquid epoxy resin, manufactured by Nittetsu Chemical & Materials, Bisphenol F type epoxy resin

[0260] · "RKB-3040H": A mixture in which an organic filler is dispersed in an epoxy resin, manufactured by Reginas Casey, containing 70 mass% of bisphenol A type epoxy resin and bisphenol F type epoxy resin as liquid epoxy resins, and containing 30 mass% of core-shell type rubber particles (rubber particle core is butadiene rubber) as an organic filler.

[0261] · "X-22-163": Liquid epoxy resin, manufactured by Shin-Etsu Kagaku Kogyo Co., Ltd., siloxane-type epoxy resin

[0262] (B) Potential curing accelerator:

[0263] · "PN-H": Solid-dispersed amine adduct-based latent curing accelerator, manufactured by Ajinomoto Fine Techno Co., Ltd. "Amicure PN-H"

[0264] · "2P4MHZ-PW": An imidazole compound that is solid at room temperature (25℃), manufactured by Shikoku Kasei Kogyo Co., Ltd., "Curezol 2P4MHZ-PW", 2-phenyl-4-methyl-5-hydroxymethylimidazole

[0265] (C) is a powder:

[0266] · "FA-8-1": Silver powder, DOWA Electronics, average particle diameter 3.5㎛

[0267] (D) Solder powder:

[0268] (D-1) Tin-containing alloy solder powder:

[0269] · "Sn42Bi58(ST-5)": Sn-Bi alloy powder, manufactured by Mitsui Kinzoku Kogyo Co., Ltd., average particle diameter 5.5㎛, 90% particle diameter 8.5㎛, spherical, melting point 139℃, liquidus temperature 139℃

[0270] · "Sn42Bi58(ST-3)": Sn-Bi alloy powder, manufactured by Mitsui Kinzoku Kogyo Co., Ltd., average particle diameter 3.1㎛, 90% particle diameter 8.5㎛, spherical, melting point 139℃, liquidus temperature 139℃

[0271] · "Sn96.5Ag3Cu0.5(ST-3)": Sn-Ag-Cu alloy powder, manufactured by Mitsui Kinzoku Kogyo Co., Ltd., average particle diameter 3.1㎛, 90% particle diameter 5㎛, spherical, melting point 217℃, liquidus temperature 219℃

[0272] (D-2) Other solder powder:

[0273] · "Sn100(ST-3)": Tin powder, manufactured by Mitsui Kinzoku Kogyo Co., Ltd., average particle diameter 3.3㎛, melting point 232℃

[0274] · "Indium Powder": Indium powder, manufactured by Kojundo Kagaku Kenkyusho Co., Ltd., average particle diameter 25.9㎛, melting point 156℃

[0275] (F) Organic filler

[0276] · "JF-003": Core-shell type rubber particles, manufactured by Mitsubishi Chemical Corporation (formerly Mitsubishi Rayon Corporation),

[0277] · "RKB-3040H": A mixture in which an organic filler is dispersed in an epoxy resin, manufactured by Reginas Casey, containing 70 mass% of bisphenol A type epoxy resin and bisphenol F type epoxy resin as liquid epoxy resins, and containing 30 mass% of core-shell type rubber particles (rubber particle core is butadiene rubber) as an organic filler.

[0278] (G) Silane coupling agent

[0279] · "KBM-403": 3-Glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Kagaku Kogyo Co.

[0280] (H) Preservative stabilizer

[0281] · "TEB": Triethylborate (Alternative: Triethyl Borate), Manufactured by Junsei Kagaku Co.

[0282] (I) Flux activator

[0283] · "Adipic Acid": Manufactured by Tokyo Kasei Kogyo Co.

[0284] · "n-Butylamine Adipate": Manufactured by Showa Kagaku Kogyosha, a salt of n-butylamine and adipic acid

[0285] <Test Example 1: Measurement of Resistivity Value of Cured Resin Composition>

[0286] An FR-4 substrate (a substrate in which epoxy resin, etc., is impregnated into glass fibers and then heat-cured) was prepared. On the FR-4 substrate, the resin compositions obtained in each example and comparative example were applied using a bar coat to a width of 2 mm, a thickness of 80 μm, and a length of 12 cm. Subsequently, the FR-4 substrate coated with each resin composition was heated using a thermal circulating oven ("DF-610" manufactured by Yamato Kagaku Co., Ltd.) under conditions of 80°C for 60 minutes. Through this operation, a sample for measuring resistivity was prepared, having a cured product of the resin composition on the FR-4 substrate. In addition, the resin compositions of Comparative Examples 4 and 5 could not be applied using a bar coat, so a sample for measuring resistivity could not be obtained.

[0287] The resistivity of the cured resin composition was measured using a digital multimeter (R6552 manufactured by Advan Test Co., Ltd.). Specifically, the 4-terminal mode of the digital multimeter was selected to measure the resistivity of the cured resin composition at a length of 10 cm. Subsequently, using the measured resistivity, the resistivity [Ω·cm] of the cured resin composition heat-cured under conditions of 80°C for 60 minutes was calculated from the following equation (1).

[0288] Equation (1): Resistivity [Ω·cm] = Resistance [Ω] × Width [cm] × Thickness [cm] / Length [cm]

[0289] The resistivity [Ω·cm] of the cured resin composition heat-cured under conditions of 80°C for 60 minutes was evaluated according to the following evaluation criteria. In addition, for the resin compositions of Comparative Examples 4 and 5 for which samples for resistivity measurement could not be obtained, they are indicated as "-" in Tables 2 and 3 below.

[0290] [Evaluation Criteria for Resistivity Value in Cured Resin Compositions]

[0291] 「◎」: The resistivity value of the cured product of the resin composition is 1×10 -3 It is less than Ω·cm.

[0292] "○": The resistivity of the cured product of the resin composition is 1×10 -3 Ω·cm or more 5×10 -3 It is less than Ω·cm.

[0293] 「△」: The resistivity of the cured product of the resin composition is 5×10 -3 Ω·cm or more 1×10 -2 It is less than Ω·cm.

[0294] "×": The resistivity of the cured product of the resin composition is 1×10 -2 It exceeds Ω·cm.

[0295] <Test Example 2: Measurement of Viscosity of Resin Composition>

[0296] The viscosity of the resin compositions obtained in each example and comparative example was measured. Specifically, each resin composition was maintained at a temperature within the range of 25°±2° (i.e., 23° to 27°), and an E-type viscometer (using a "RE-85U" manufactured by Toki Sangyo, with a 3°×R14 rotor) was used to measure the viscosity for 2 minutes under conditions of 0.4 ml of each resin composition and a rotation speed of 1 rpm. In addition, the resin compositions of Comparative Examples 4 and 5 had high viscosity and could not be formed into a paste, so the viscosity of the resin compositions could not be measured. Furthermore, the resin compositions of Comparative Examples 6 and 7 were not measured because, based on the resistivity value of the cured product obtained in Test Example 1, they were expected to be unsuitable as resin compositions for adhesive in conductive connection parts.

[0297] The viscosity [Pa·s] of the measured resin composition was evaluated according to the following evaluation criteria. In addition, the resin compositions of Comparative Examples 4 and 5, for which the viscosity of the resin composition could not be measured, and the resin compositions of Comparative Examples 6 and 7, for which the viscosity of the resin composition was not measured, are indicated by "-" in Tables 2 and 3 below.

[0298] [Evaluation Criteria for Viscosity of Resin Compositions]

[0299] "◎": The viscosity of the resin composition is less than 230 Pa·s.

[0300] "○": The viscosity of the resin composition is 230 Pa·s or more and less than 270 Pa·s.

[0301] "△": The viscosity of the resin composition is 270 Pa·s or more and 300 Pa·s or less.

[0302] "×": The viscosity of the resin composition is greater than 300 Pa·s.

[0303] <Test Example 3: Evaluation of Contact Resistance Before and After Exposure to High Temperature and High Humidity Conditions>

[0304] (3-1) Preparation of a sample for measuring contact resistance

[0305] As shown in FIG. 1, a wire (2) was connected and fixed onto a 100mm × 25mm × 1.5mm stainless steel (4) that had been nickel-plated. Subsequently, a resin composition (resin composition 3 shown in FIG. 1) obtained in each example and comparative example was applied to the wire (2) to make contact with the nickel surface with a diameter of 1mm. Subsequently, the stainless steel coated with each resin composition was heated using a thermal circulating oven ("DF-610" manufactured by Yamato Kagaku Co., Ltd.) under conditions of 80°C for 60 minutes. Through this operation, a sample for measuring contact resistance values ​​was obtained, having a cured product of the resin composition on the nickel-plated stainless steel. Eight samples were prepared for each of the resin compositions obtained in each example and comparative example. In addition, the resin compositions of Comparative Example 4 and Comparative Example 5 could not be applied because they had high viscosity, so samples for measuring contact resistance values ​​could not be obtained. In addition, the resin compositions of Comparative Examples 6 and 7 have a resistivity value of 1×10⁻⁶ of the cured resin composition. -2 Since it was expected that the initial contact resistance value with nickel would increase because it was greater than Ω·cm, a sample for measuring the contact resistance value was not prepared.

[0306] (3-2) Measurement of initial contact resistance with nickel

[0307] In the sample for measuring contact resistance, a digital multimeter (1) ("R6552" manufactured by Advan Test Co., Ltd.) was installed as shown in FIG. 1, and the resistance value [Ω] was measured between the wire and the nickel-plated surface. The measured value is the initial contact resistance value CR of the cured resin composition and nickel. 0h did it.

[0308] (3-3) Measurement of contact resistance with nickel after exposure to high temperature and high humidity conditions

[0309] A sample for measuring contact resistance was stored for 1,000 hours in a constant temperature and humidity chamber (Espect "PR-1J") set to a temperature of 85°C and a humidity of 85%RH. Subsequently, the sample exposed to high temperature and high humidity conditions for 1,000 hours was dried at 60°C for 15 minutes. Afterward, the dried sample was left standing at room temperature and atmospheric pressure and allowed to cool for 1 hour. On the cooled sample, the same procedure as described in "(3-2) Measurement of initial contact resistance with nickel" above was performed, and the resistance value [Ω] was measured between the wire and the nickel-plated surface. The measured value is the contact resistance value CR of the cured resin composition and nickel after high temperature and high humidity conditions. 1000h did it.

[0310] (3-4) Evaluation of contact resistance before and after exposure to high temperature and high humidity conditions

[0311] For 8 samples for measuring contact resistance, the initial contact resistance value CR 0h Wow, contact resistance value CR after high temperature and high humidity conditions 1000h From, the ratio of resistance values ​​CR 1000h / CR 0hSamples with a value of 10 or more were counted. For the cured products of resin compositions heat-cured under conditions of 80°C for 60 minutes, the contact resistance before and after exposure to high temperature and high humidity conditions was evaluated according to the following evaluation criteria. In addition, for the resin compositions of Comparative Examples 4 and 5 for which samples for measuring contact resistance values ​​could not be obtained, and for the resin compositions of Comparative Examples 6 and 7 for which samples for measuring contact resistance values ​​were not prepared, they are indicated as “-” in Tables 2 and 3 below.

[0312] [Evaluation Criteria for Contact Resistance Before and After Exposure to High Temperature and High Humidity Conditions in Cured Resin Compositions]

[0313] 「◎」: Ratio of resistance values ​​CR 1000h / CR 0h There are 0 or 1 sample where the value is 10 or more.

[0314] "○": Ratio of resistance values ​​CR 1000h / CR 0h There are 2 or 3 samples where the value is 10 or more.

[0315] 「△」: Ratio of resistance values ​​CR 1000h / CR 0h There are 4 or 5 samples where the value is 10 or more.

[0316] "×": Ratio of resistance values ​​CR 1000h / CR 0h There are 5 or more samples where the value is 10 or higher.

[0317] <Test Example 4: Evaluation of Curing Rate of Resin Composition under Conditions of 80℃ for 60 Minutes>

[0318] (4-1) Measurement of reaction heat of resin composition

[0319] For the resin compositions for which the resistivity of the cured product of the resin composition could be measured (i.e., the resin compositions of Examples 1 to 4, Comparative Examples 1, 2, 6, and 7), 10 mg of each resin composition was weighed. Subsequently, the weighed resin compositions were sealed in simple sealing containers made of chromate-treated aluminum (manufactured by Hitachi High-Tech Science Co., Ltd.) to prepare sample A for thermal analysis. Sample A for thermal analysis was mounted on a high-sensitivity differential scanning calorimeter ("DSC7000X" manufactured by Hitachi High-Tech Science Co., Ltd.), and differential scanning calorimetry was performed under measurement conditions of a temperature range of 25°C to 220°C and a heating rate of 5°C / min. From the measured results, the reaction heat [mJ / mg], reaction initiation temperature [°C], and reaction peak temperature [°C] during the thermal curing of the resin composition were recorded. In addition, the measured reaction heat was designated as reaction heat α.

[0320] (4-2) Measurement of the reaction heat of the cured resin composition

[0321] 10 mg of the resin composition obtained in each example and comparative example was weighed. Subsequently, the weighed resin compositions were each sealed in simple sealing containers made of chromate-treated aluminum (manufactured by Hitachi High-Tech Science Co., Ltd.). Then, using a thermal circulation oven (manufactured by Yamato Kagaku Co., Ltd. “DF-610”), the simple sealing containers containing the resin compositions were heated at 80°C for 60 minutes. Through this operation, sample B for thermal analysis was prepared. Sample B for thermal analysis was mounted on a high-sensitivity differential scanning calorimeter (manufactured by Hitachi High-Tech Science Co., Ltd. “DSC7000X”), and differential scanning calorimetry was performed under measurement conditions of a temperature range of 25°C to 220°C and a heating rate of 5°C / min. From the measured results, the reaction heat (mJ / mg) during the thermal curing of the resin composition was recorded. In addition, the measured reaction heat was designated as reaction heat β.

[0322] (4-3) Calculation of the curing rate of the resin composition under conditions of 80℃ for 60 minutes

[0323] Using reaction heat α and reaction heat β, the curing rate (%) of the resin composition under conditions of 80°C and 60 minutes was calculated from the following equation (2).

[0324] Equation (2): Hardening rate (%) = (Reaction heat α [mJ / mg] - Reaction heat β [mJ / mg]) / Reaction heat α [mJ / mg] × 100

[0325] The curing rate of the resin composition under conditions of 80°C for 60 minutes was evaluated according to the following evaluation criteria. In addition, for the resin compositions of Comparative Examples 4 and 5, for which the reaction heat of the resin composition and the cured product was not measured, "-" is indicated in Tables 2 and 3 below.

[0326] [Evaluation Criteria for Curing Rate of Resin Composition under Conditions of 80℃ for 60 Minutes]

[0327] "◎": The curing rate under conditions of 80℃ for 60 minutes is 80% or more.

[0328] "○": The curing rate under conditions of 80℃ for 60 minutes is 75% or more and less than 80%.

[0329] "△": The curing rate under conditions of 80℃ for 60 minutes is 70% or more and less than 75%.

[0330] "×": The curing rate under conditions of 80℃ for 60 minutes is less than 70%.

[0331] For the resin compositions obtained in each example and comparative example, the results of Test Examples 1 to 4 are shown in Tables 1 to 3 below.

[0332]

[0333]

[0334] Explanation of the symbols

[0335] 1 Digital Multimeter 2 lines 3. Resin composition 4. Stainless steel with nickel plating on the surface

Claims

Claim 1 A resin composition comprising (A) an epoxy resin, (B) a latent curing accelerator, (C) silver powder, and (D) solder powder, wherein component (D) comprises (D-1) a tin-containing alloy solder powder, the content of component (A) is 12 mass% or more with respect to 100 mass% of the total components in the resin composition, the content of component (D-1) is 5 mass% or more with respect to 100 mass% of the total components in the resin composition, the viscosity of the resin composition measured using an E-type viscometer under conditions of 25°C and 1 rpm is 300 Pa·s or less, and the resistivity of the cured product obtained by curing the resin composition under conditions of 80°C and 60 minutes is 1 × 10⁻⁶ -2 A resin composition having Ω·cm or less. Claim 2 A resin composition according to claim 1, wherein the content of component (A) is greater than 70 mass% with respect to 100 mass% of the resin component in the resin composition. Claim 3 A resin composition according to claim 1, wherein (A) the component comprises an epoxy resin that is in a liquid state at a temperature of 25°C. Claim 4 A resin composition according to claim 1, wherein (A) a component comprises an epoxy resin containing an aromatic backbone. Claim 5 A resin composition according to claim 1, wherein component (B) comprises a solid dispersed amine adduct-based curing accelerator. Claim 6 A resin composition according to claim 1, wherein (D-1) component comprises Sn-Bi alloy powder. Claim 7 A resin composition according to claim 6, wherein the amount of bismuth included in component (D-1) is 30 mass% or more and 80 mass% or less with respect to 100 mass% of component (D-1). Claim 8 A resin composition according to claim 1, wherein the maximum particle diameter of component (D-1) is 30㎛ or less. Claim 9 A resin composition according to claim 1, wherein the average particle diameter of component (D-1) is 10㎛ or less. Claim 10 A resin composition according to claim 1, wherein the value obtained by dividing the length of the major axis of component (D-1) by the length of the minor axis is 1 or more and 2 or less. Claim 11 A resin composition according to claim 1, wherein component (D-1) comprises or does not comprise a metal element selected from the group consisting of aluminum, zinc, iron, and indium, and the content of aluminum, zinc, iron, and indium is less than 1 mass% with respect to 100 mass% of component (D-1). Claim 12 A resin composition according to claim 1, wherein component (C) comprises pure silver powder, and the silver content contained in the pure silver powder is 90 mass% or more with respect to 100 mass% of the total amount of pure silver powder. Claim 13 A resin composition comprising an organic filler in claim 1. Claim 14 A resin composition comprising a silane coupling agent in claim 1. Claim 15 A resin composition comprising a preservation stabilizer in claim 1. Claim 16 A resin composition according to claim 1, comprising or not comprising a flux activator, wherein the content of the flux activator is less than 0.05 mass% with respect to 100 mass% of the total components in the resin composition. Claim 17 A resin composition according to claim 1, wherein the reaction initiation temperature based on differential scanning calorimetry is 40°C or higher and 70°C or lower. Claim 18 A resin composition according to claim 1, wherein the reaction peak temperature based on differential scanning calorimetry is 50°C or higher and 140°C or lower. Claim 19 A resin composition according to claim 1, wherein the reaction initiation temperature based on differential scanning calorimetry is T1[°C] and the reaction peak temperature based on differential scanning calorimetry is T2[°C], and the temperature difference T2-T1 is 40°C or more and 80°C or less. Claim 20 An electronic member comprising a cured product of a resin composition described in any one of claims 1 to 19, and an electronic component mounted on said cured product. Claim 21 A semiconductor device comprising a cured product of a resin composition described in any one of claims 1 to 19.

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