Wafer loading and unloading structure and method, and wafer inspection apparatus and method

Abstract

The present application provides a wafer loading and unloading structure applied to a wafer inspection device. This includes an extension mechanism—configured to extend in a direction perpendicular to the cover plate of a dust isolation box, so as to be able to protrude out of or return in of the dust isolation box through an opening disposed in the cover plate—; and a spin chuck rotatably connected to the extension mechanism—the spin chuck switches between a vertical position and a horizontal position through rotation, and when in the horizontal position, combines with a stage supporting the wafer to be inspected to implement loading and / or unloading of the wafer to be inspected—wherein when in the vertical position, the spin chuck is perpendicular to the cover plate, and when in the horizontal position, the spin chuck is parallel to the cover plate. Since the spin chuck of the wafer loading and unloading structure protrudes from the center of the cover plate of the dust isolation box, it prevents center of gravity deviation caused by protruding outward from the side, reduces the probability of the dust isolation box shaking on the air bearing stage, and ensures the dust isolation performance of the dust isolation box, thereby improving inspection accuracy.

Description

Technology Field

[0001] The present application relates to the field of optical technology, and in particular to a wafer loading and unloading structure, a wafer inspection device, a wafer loading and unloading method, a wafer inspection method, a wafer inspection device, and a computer-readable storage medium. Background Technology

[0002] In conventional technology, a chuck of a wafer loading and unloading structure extends outward from the side of a dust isolation box to complete the loading or unloading of the wafer. However, since the dust isolation box is installed on an air bearing stage, extending the chuck outward from the side causes the center of gravity of the dust isolation box to shift, resulting in the dust isolation box wobbling on the air bearing stage. This affects the dust isolation effect and, consequently, impacts inspection accuracy. The problem to be solved

[0003] In light of this, embodiments of the present application provide a wafer loading and unloading structure, a wafer inspection device, a wafer loading and unloading method, a wafer inspection method, a wafer inspection device, and a computer-readable storage medium to solve the technical problem in which the center of gravity bias of a dust isolation box caused by loading and unloading wafers from the side in the prior art affects the inspection effect. means of solving the problem

[0004] According to a first aspect of an embodiment of the present application, a wafer loading and unloading structure applied to a wafer inspection device is provided. The wafer loading and unloading structure comprises: an extension mechanism configured to extend in a direction perpendicular to the cover plate of a dust isolation box, so as to be protruded out of or returned in of the dust isolation box through an opening disposed in the cover plate; and a spin chuck rotatably connected to the extension mechanism, wherein the spin chuck switches between a vertical position and a horizontal position through rotation, and when in the horizontal position, is coupled with a stage supporting the wafer to be inspected to implement loading and / or unloading of the wafer to be inspected, wherein when the spin chuck is in the vertical position, the spin chuck is perpendicular to the cover plate, and when the spin chuck is in the horizontal position, the spin chuck is parallel to the cover plate.

[0005] In one embodiment, the extension mechanism comprises: a guide rail disposed inside a dust isolation box; a sliding bracket that fits the guide rail and slides within the guide rail; and a rotation axis that rotatably connects the spin chuck and the sliding bracket, wherein the rotation end of the spin chuck is connected to the sliding bracket through the rotation axis, and the rotation end of the spin chuck rotates around the rotation axis to drive a driven end opposite to the rotation end of the spin chuck to switch between a vertical position and a horizontal position.

[0006] In one embodiment, the extension mechanism further comprises a sliding groove installed on the side of the sliding bracket close to the spin chuck; and a sliding connection that slides within the sliding groove, wherein a rotation axis is positioned on the side of the sliding connection close to the spin chuck, and by driving the spin chuck to be raised when the sliding connection slides within the sliding groove, loading and unloading of a wafer to be inspected in combination with a stage is achieved.

[0007] In one embodiment, the rotational end of the spin chuck is one end close to the cover plate of the spin chuck when the spin chuck is positioned in a vertical position.

[0008] In one embodiment, the rotational end of the spin chuck is the end far from the cover plate of the spin chuck when the spin chuck is positioned in a vertical position.

[0009] In one embodiment, the number of guide rails is two and the number of sliding brackets is two; wherein the two guide rails are each positioned at both ends near the opening of the spin chuck and are arranged in mirror images, and the two sliding brackets are also arranged in mirror images; and a set of parallel cross-sections corresponding to the rotational end of the spin chuck is connected to the rotation axis.

[0010] In one embodiment, the spin chuck includes a chuck body; and a wafer receiving portion disposed in the chuck body and configured to receive a wafer to be inspected.

[0011] In one embodiment, a U-shaped preset area is disposed in the chuck body to provide a space for accommodating the rise of the stage; wherein the thickness of the chuck body located in the U-shaped preset area is smaller than the thickness of the chuck body located outside the U-shaped preset area, and the wafer receiving opening is located within the U-shaped preset area; and when the spin chuck is positioned in a vertical position, the opening of the U-shaped preset area is close to the cover plate.

[0012] In one embodiment, the spin chuck further includes a clamping mechanism disposed at the edge of the wafer receiving hole, wherein the clamping mechanism is configured to fix the wafer to be inspected within the wafer receiving hole by clamping the wafer to be inspected by combining with a stage to implement opening and closing.

[0013] According to a second aspect of an embodiment of the present application, a wafer inspection device is provided. The wafer inspection device comprises: two interferometers arranged mirror-imagely—each of which is configured to measure surface parameters of two faces of a wafer to be inspected—; a dust isolation box isolating the two interferometers from the outside—the dust isolation box is configured to prevent vibration from affecting the precision of the two interferometers—; and a wafer loading and unloading structure according to the first aspect disposed between the two interferometers—the wafer loading and unloading structure is configured to load and / or unload the wafer to be inspected.

[0014] According to a third aspect of an embodiment of the present application, a wafer loading and unloading method is provided for loading and / or unloading a wafer to be inspected using a wafer loading and unloading structure according to the first aspect. The wafer loading and unloading method comprises: extending a retractable mechanism out of a dust-proof isolation box through an opening in response to a first retractable control command; rotating a spin chuck from a vertical position perpendicular to a cover plate to a horizontal position parallel to a cover plate in response to a first rotational control command; engaging the spin chuck with a stage that supports the wafer to be inspected to load the wafer to be inspected into a wafer receiving hole of the spin chuck or unloading the wafer to be inspected from the wafer receiving hole of the spin chuck; rotating the spin chuck from a horizontal position to a vertical position in response to a second rotational control command; and returning the retractable mechanism into a dust-proof isolation box through an opening in response to a second retractable control command.

[0015] According to a fourth aspect of an embodiment of the present application, a wafer inspection method is provided. The wafer inspection method comprises loading a wafer to be inspected based on a wafer loading and unloading method according to the third aspect; performing an inspection operation on the wafer to be inspected; and unloading the wafer to be inspected based on a wafer loading and unloading method according to the third aspect.

[0016] According to a fifth aspect of an embodiment of the present application, an electronic device is provided. The electronic device comprises a processor; and a memory, wherein computer program instructions are stored in the memory, and when executed by the processor, the computer program instructions cause the processor to perform a wafer loading and unloading method according to the third aspect or a wafer inspection method according to the fourth aspect.

[0017] According to a sixth aspect of an embodiment of the present application, a computer-readable storage medium is provided. The computer-readable storage medium stores computer program instructions, and when executed by a processor, the computer program instructions cause the processor to perform a wafer loading and unloading method according to the third aspect or a wafer inspection method according to the fourth aspect. Effects of the invention

[0018] The wafer loading and unloading structure provided by the embodiment of the present application comprises: a retractable mechanism configured to extend in a direction perpendicular to the cover plate of a dust isolation box and extending out of or returning inward to the dust isolation box through an opening disposed in the cover plate; and a spin chuck rotatably connected to the retractable mechanism, which switches between a vertical position and a horizontal position through rotation, and which implements loading and / or unloading of the wafer to be inspected by combining with a stage that supports the wafer to be inspected when in the horizontal position. Since the spin chuck of the wafer loading and unloading structure extends outward from the center of the cover plate of the dust isolation box, it prevents the center of gravity deviation caused by extending outward from the side, reduces the probability of the dust isolation box shaking on the air bearing stage, and improves inspection accuracy by ensuring the dust isolation performance of the dust isolation box.

[0019] In addition, a wafer inspection device equipped with a wafer loading and unloading structure according to an embodiment of the present application has several advantages in the following aspects. In the first aspect, space can be saved by reducing the occupied area. In the second aspect, the spin chuck becomes thinner than a conventional chuck due to the special installation position of the spin chuck. This effectively shortens the distance between two relative surfaces of the wafer to be inspected, as well as the distance between two optical interferometers, thereby reducing the influence of airflow on optical interferometer measurements and consequently improving measurement precision. In the third aspect, it satisfies various customer requirements by implementing switching between different loading and unloading methods through cooperation with a robot arm. Brief explanation of the drawing

[0020] FIG. 1 is a schematic diagram of the structure when a wafer loading and unloading structure according to one embodiment of the present application is mounted on a wafer inspection device. FIG. 2 is a schematic diagram of the rotational operation of a wafer loading and unloading structure according to one embodiment of the present application. FIG. 3a is a schematic diagram of a wafer loading and unloading structure according to one embodiment of the present application. FIG. 3b is a schematic diagram of a wafer loading and unloading structure according to one embodiment of the present application. FIG. 4a is a schematic diagram of a wafer loading and unloading structure according to one embodiment of the present application. FIG. 4b is a schematic diagram of the wafer loading and unloading structure according to the embodiment shown in FIG. 4a when it is positioned in a horizontal position. FIG. 5a is a schematic diagram of a wafer loading and unloading structure according to one embodiment of the present application. FIG. 5b is a schematic diagram of the wafer loading and unloading structure according to the embodiment shown in FIG. 5a when it is positioned in a horizontal position. FIG. 6 is a schematic diagram of the rotational operation of a wafer loading and unloading structure according to one embodiment of the present application. FIG. 7 is a schematic structural diagram of a spin chuck according to one embodiment of the present application. FIG. 8 is a schematic flowchart of a wafer loading and unloading method according to one embodiment of the present application. FIG. 9 is a schematic flowchart of a wafer inspection method according to one embodiment of the present application. FIG. 10 is a schematic structural diagram of an electronic device according to one embodiment of the present application. Specific details for implementing the invention

[0021] Wafer inspection is extremely sensitive to vibration. To ensure the accuracy of wafer inspection, dust isolation is performed using dust isolation boxes. However, since the dust isolation boxes are installed on air bearing stages, if a severe center of gravity deviation occurs in the boxes, shaking will occur on the air bearing stages, affecting the accuracy of the inspection.

[0022] In conventional technology, a chuck of a wafer loading and unloading structure extends outward from the side of a dust isolation box to complete the loading or unloading of the wafer. During the process of the chuck extending outward from the side of the dust isolation box, a bias in the center of gravity of the dust isolation box is caused, resulting in the dust isolation box shaking on an air bearing stage. This affects the dust isolation effect and, consequently, impacts inspection accuracy.

[0023] To solve the above problem, the embodiment of the present application provides a wafer loading and unloading structure applied to a wafer inspection device. Since the spin chuck of the wafer loading and unloading structure protrudes outward from the center of the cover plate of the dust isolation box, it prevents the deviation of the center of gravity caused by protruding outward from the side, reduces the probability of the dust isolation box shaking on the air bearing stage, and guarantees the dust isolation performance of the dust isolation box, thereby improving inspection accuracy.

[0024] Hereinafter, the technical means of the embodiments of the present application are described clearly and completely with reference to the drawings of the embodiments of the present application. By way, the described embodiments are merely some embodiments of the present application, not all. All other embodiments obtained without creative effort by a person skilled in the art based on the embodiments of the present application fall within the scope of protection of the present application.

[0025] Exemplary wafer loading and unloading structure

[0026] It should be noted that the wafer loading and unloading structure according to the embodiment of the present application is applied to a wafer inspection device.

[0027] FIG. 1 is a schematic diagram of a wafer loading and unloading structure according to one embodiment of the present application when mounted on a wafer inspection device. As shown in FIG. 1, the wafer loading and unloading structure (1) includes an extension mechanism (11) and a spin chuck (12) rotatably connected to the extension mechanism (11). The extension mechanism (11) is configured to extend in a direction perpendicular to the cover plate (21) of a dust isolation box (2) so as to protrude out of or return inward from the dust isolation box (2) through an opening (211) disposed in the cover plate (21). The spin chuck (12) switches between a vertical position and a horizontal position through rotation and, when in the horizontal position, is coupled with a stage that supports the wafer to be inspected to implement loading and / or unloading of the wafer to be inspected. When the spin chuck is in the vertical position, the spin chuck is perpendicular to the cover plate (21), and when the spin chuck is in the horizontal position, the spin chuck is parallel to the cover plate (21).

[0028] The cover plate (21) of the dust isolation box (2) is a dust-proof structural layer located at the top of the dust isolation box (2).

[0029] Specifically, FIG. 2 is a schematic diagram of the rotational operation of a wafer loading and unloading structure according to one embodiment of the present application. As shown in FIG. 2, when loading or unloading a wafer to be inspected, the extension mechanism (11) is extended out of the dust isolation box (2), and the spin chuck (12) is also extended out together from the geometric center of the cover plate (21) of the dust isolation box (2) (refer to the process from a to b in FIG. 2). At this time, the spin chuck (12) is perpendicular to the cover plate (21) of the dust isolation box (2), and the spin chuck (12) rotates from a vertical position perpendicular to the cover plate (21) to a horizontal position parallel to the cover plate (21) (refer to the process from b to c in FIG. 2). After the spin chuck (12) becomes parallel to the cover plate (21), the loading or unloading of the wafer to be inspected is implemented through the combination of the spin chuck (12) and the stage (refer to the process from c to d in FIG. 2). After the loading or unloading of the wafer to be inspected is completed, the spin chuck (12) rotates back from a horizontal position parallel to the cover plate (21) to a vertical position perpendicular to the cover plate (21), and the extension mechanism (11) returns to the dustproof isolation box (2) together with the spin chuck (12).

[0030] In an embodiment of the present application, the spin chuck (12) of the wafer loading and unloading structure (1) protrudes outward from the center of the cover plate (21) of the dust isolation box (2), thereby preventing center of gravity deviation caused by protruding outward from the side, reducing the probability of shaking of the dust isolation box (2) on the air bearing stage, and ensuring the dust isolation performance of the dust isolation box (2), thereby improving inspection accuracy.

[0031] In addition, a wafer inspection device equipped with a wafer loading and unloading structure (1) according to an embodiment of the present application has several advantages as follows. In a first aspect, space can be saved by reducing the occupied area. In a second aspect, the spin chuck (12) is thinner than a conventional chuck due to the special installation position of the spin chuck (12). This effectively shortens the distance between two relative surfaces of the wafer to be inspected, as well as the distance between two optical interferometers, thereby reducing the influence of airflow on optical interferometer measurements and consequently improving measurement precision. In a third aspect, it satisfies various customer requirements by implementing switching between different loading and unloading methods through cooperation with a robot arm. For example, after the spin chuck (12) is extended outward from the center of the cover plate (21) of the dustproof isolation box (2), the robot arm rotates the wafer to be inspected by 90 degrees while it is not rotated, and directly loads and unloads it onto the spin chuck (12) located in a vertical position, or after the spin chuck (12) is rotated to a horizontal position, the robot arm is used to load and unload the wafer to be inspected. Since both of the above loading and unloading methods are possible, various customer requirements are met.

[0032] FIG. 3a is a schematic diagram of a wafer loading and unloading structure according to one embodiment of the present application. As shown in FIG. 3a, the expansion mechanism (11) includes a guide rail (111) disposed inside a dust isolation box (2); a sliding bracket (112) that fits the guide rail (111) and slides within the guide rail (111); and a rotation axis (113) that rotatably connects the spin chuck (12) and the sliding bracket (112). The rotation end of the spin chuck (12) is connected to the sliding bracket (112) through the rotation axis (113), and the rotation end of the spin chuck (12) rotates around the rotation axis (113) to drive the driven end opposite the rotation end of the spin chuck (12) to switch between a vertical position and a horizontal position.

[0033] Specifically, the rotating end of the spin chuck (12) is one end connected to the rotation axis (113), and the driven end of the spin chuck (12) is one end facing the rotating end on the spin chuck (12) and thus rotating.

[0034] In one optional embodiment, the rotation axis (113) is fixedly connected to the rotation end of the spin chuck (12), and the rotation axis (113) is rotatably connected to the sliding bracket (112), and the rotation of the rotation axis (113) on the sliding bracket (112) drives the rotation of the spin chuck (12).

[0035] In an embodiment of the present application, the extension mechanism (11) is extended in a direction perpendicular to the cover plate (21) through the reciprocating sliding of the sliding bracket (112) within the guide rail (111), a rotatable connection between the rotating end of the spin chuck (12) and the sliding bracket (112) is implemented through the rotation of the rotation axis (113), and the spin chuck (12) is switched between a vertical position and a horizontal position through the driven rotation of the driven end.

[0036] It should be noted that FIG. 3b is a schematic diagram of a wafer loading and unloading structure (1) according to one embodiment of the present application. As shown in FIG. 3b, the number and position of the guide rail (111) and the sliding bracket (112) may be such that there is one guide rail (111) and one sliding bracket (112), and the guide rail (111) and the sliding bracket (112) are arranged on one cross-section of the spin chuck (12).

[0037] The number and position of the guide rails (111) and sliding brackets (112) may also be such that there are two guide rails (111) and two sliding brackets (112) (as in FIG. 3a). Two guide rails (111) are each positioned at both ends close to the opening (211) and are positioned in a mirror image, and two sliding brackets (112) are also positioned in a mirror image. A set of parallel cross-sections corresponding to the rotational end of the spin chuck (12) is connected to the rotation axis (113). For convenience of explanation, the following description will focus on the case where there are two guide rails (111) and two sliding brackets (112), and will not mention this further later.

[0038] In one embodiment, as shown in FIG. 3a, the extension mechanism (11) further comprises a sliding groove (114) positioned on the side of the sliding bracket (112) near the spin chuck (12); and a sliding connection (115) that slides within the sliding groove (114). A rotation axis (113) is positioned on the side of the sliding connection (115) near the spin chuck (12), and drives the spin chuck (12) to be raised and lowered when the sliding connection (115) slides within the sliding groove (114), thereby enabling loading and unloading of a wafer to be inspected by engaging with a stage.

[0039] Specifically, referring to FIG. 3a, a sliding groove (114) is disposed on the side of the sliding bracket (112) near the spin chuck (12) (i.e., the inner side of FIG. 3a). The sliding connection (115) can slide within the sliding groove (114) and drives the spin chuck (12) to be raised when the sliding connection (115) slides within the sliding groove (114). A rotation axis (113) is disposed on the side of the sliding connection (115) near the spin chuck (12), and the rotation axis (113) can rotate within the sliding connection (115), and the rotation of the rotation axis (113) is not affected.

[0040] In an embodiment of the present application, when the sliding bracket (112) slides along the guide rail (111) and is pushed out of the cover plate (21), the spin chuck (12) rotates from a vertical position to a horizontal position via the rotation axis (113) on the sliding connection part (115), and by utilizing the sliding connection part (115) sliding within the sliding groove (114), the lifting and lowering of the spin chuck (12) is implemented, thereby enabling the loading and unloading of a wafer to be inspected in combination with a stage.

[0041] FIG. 4a is a schematic diagram of a wafer loading and unloading structure according to one embodiment of the present application. FIG. 4b is a schematic diagram of the wafer loading and unloading structure according to the embodiment shown in FIG. 4a when it is positioned in a horizontal position. Referring to FIG. 4a and FIG. 4b, the rotating end of the spin chuck (12) is one end close to the cover plate (21) of the spin chuck (12) when the spin chuck (12) is positioned in a vertical position (i.e., end A in FIG. 4a and FIG. 4b). The driven end of the spin chuck (12) is one end far from the cover plate (21) of the spin chuck (12) when the spin chuck (12) is positioned in a vertical position (i.e., end B in FIG. 4a and FIG. 4b). When the sliding bracket (112) is pushed out of the dust isolation box (2), end A is driven to rotate around the rotation axis (113) to switch end B from a vertical position to a horizontal position. That is, the spin chuck (12) has its lower end as the center of rotation. After the spin chuck (12) becomes parallel to the cover plate (21), loading or unloading of the wafer to be inspected is implemented through the combination of the spin chuck (12) and the stage. The process of the spin chuck (12) rotating its lower end as the center of rotation is as illustrated in FIG. 2.

[0042] FIG. 5a is a schematic diagram of a wafer loading and unloading structure according to one embodiment of the present application. FIG. 5b is a schematic diagram of the wafer loading and unloading structure according to the embodiment shown in FIG. 5a when it is positioned in a horizontal position. Referring to FIG. 5a and FIG. 5b, the rotating end of the spin chuck (12) is the end far from the cover plate (21) of the spin chuck (12) when the spin chuck (12) is positioned in a vertical position (i.e., end C in FIG. 5a and FIG. 5b). The driven end of the spin chuck (12) is the end close to the cover plate (21) of the spin chuck (12) when the spin chuck (12) is positioned in a vertical position (i.e., end D in FIG. 5a and FIG. 5b). When the sliding bracket (112) is pushed out of the dust isolation box (2), end C is driven to rotate around the rotation axis (113) to switch end D from a vertical position to a horizontal position. That is, the spin chuck (12) has its upper portion as the center of rotation. After the spin chuck (12) becomes parallel to the cover plate (21), loading or unloading of the wafer to be inspected is implemented through the combination of the spin chuck (12) and the stage. The process of the spin chuck (12) rotating its upper portion as the center of rotation is as illustrated in FIG. 6 (Fig. 6 is a schematic diagram of the rotational operation of a wafer loading and unloading structure according to one embodiment of the present application).

[0043] FIG. 7 is a schematic structural diagram of a spin chuck (12) according to one embodiment of the present application. As shown in FIG. 7, the spin chuck (12) comprises a chuck body (121) and a wafer receiving portion (122) disposed in the chuck body (121), and the wafer receiving portion (122) is configured to receive a wafer to be inspected.

[0044] Specifically, the shape of the wafer receiving portion (122) matches the shape of the wafer to be inspected.

[0045] In one embodiment, as shown in FIG. 7, a U-shaped preset area (1211) is disposed in the chuck body (121) to provide space for accommodating the rise of the stage. The thickness of the chuck body (121) located in the U-shaped preset area (1211) is smaller than the thickness of the chuck body (121) located in the non-U-shaped preset area (1212) (i.e., the area outside the U-shaped preset area), and the wafer receiving area (122) is located within the U-shaped preset area (1211).

[0046] In one optional embodiment, when the spin chuck (12) is positioned in a vertical position, the opening of the U-shaped preset area (1211) (i.e., the U-shaped opening end) is close to the cover plate (21).

[0047] For example, referring to FIGS. 4a and 4b, when the spin chuck (12) is positioned in a vertical position, the rotational end of the spin chuck (12) is close to the cover plate (21), and the opening of the U-shaped preset area (1211) is also close to the cover plate (21). That is, the rotational end of the spin chuck (12) is located at the opening of the U-shaped preset area (1211). Since the thickness of the chuck body (121) in the U-shaped preset area (1211) is smaller than the thickness of the chuck body (121) in the non-U-shaped preset area (1212), the wafer receiving hole (122) is slightly deflected from the center position of the spin chuck (12) toward the driven end to ensure stability.

[0048] Referring to FIGS. 5a and 5b, when the spin chuck (12) is positioned in a vertical position, the rotational end of the spin chuck (12) is far from the cover plate (21), and the opening of the U-shaped preset area (1211) is close to the cover plate (21). The rotational end of the spin chuck (12) is located in the non-U-shaped preset area (1212). Since the thickness of the chuck body (121) in the non-U-shaped preset area (1212) is greater than the thickness of the chuck body (121) in the U-shaped preset area (1211), the wafer receiving hole (122) is slightly deflected from the center position of the spin chuck (12) toward the rotational end to ensure stability.

[0049] In one embodiment, as illustrated in FIG. 7, the spin chuck (12) further includes a clamping mechanism (123) positioned at the edge of the wafer receiving portion (122). The clamping mechanism (123) is configured to secure the wafer to be inspected within the wafer receiving portion (122) by clamping the wafer to be inspected by operating it in conjunction with a stage to open and close.

[0050] Specifically, the clamping mechanism (123) includes, but is not limited to, a buckle structure.

[0051] In an embodiment of the present application, when the spin chuck (12) is positioned in a horizontal position, the wafer to be inspected is placed on a stage. The stage advances toward the spin chuck (12) to support the clamping mechanism (123), and when the clamping mechanism (123) is released, the wafer to be inspected is received. After the stage is separated from the clamping mechanism (123), the clamping mechanism (123) is closed, and the clamping mechanism (123) secures the wafer to be inspected.

[0052] Exemplary wafer inspection device

[0053] In one embodiment, referring to FIG. 1, the wafer inspection device comprises: two mirror-image interferometers—each configured to measure surface parameters of two faces of a wafer to be inspected—; a dust isolation box (2) that isolates the two interferometers from the outside—the dust isolation box (2) is configured to prevent vibration from affecting the precision of the two interferometers—; and a wafer loading and unloading structure (1) positioned between the two interferometers—the wafer loading and unloading structure (1) is configured to load and / or unload the wafer to be inspected.

[0054] A wafer inspection device according to an embodiment of the present application loads or unloads a wafer to be inspected at the center of the cover plate of a dust isolation box (2) through a wafer loading and unloading structure (1) positioned between two interferometers. Since the spin chuck (12) of the wafer loading and unloading structure (1) extends outward from the center of the cover plate of the dust isolation box (2), it prevents center of gravity deviation caused by extending outward from the side, reduces the probability of shaking of the dust isolation box (2) on the air bearing stage, and ensures the dust isolation performance of the dust isolation box (2), thereby improving inspection accuracy.

[0055] In addition, the wafer inspection device according to the embodiment of the present application has several advantages in the following aspects. In the first aspect, space can be saved by reducing the occupied area compared to a chuck protruding outward from the side. In the second aspect, the spin chuck (12) is thinner than a conventional chuck due to the special installation position of the spin chuck (12). This effectively shortens the distance between two relative surfaces of the wafer to be inspected, as well as effectively shortens the distance between two optical interferometers, thereby reducing the influence of airflow on optical interferometer measurements and consequently improving measurement precision. In the third aspect, it satisfies various customer requirements by implementing switching between different loading and unloading methods through cooperation with a robot arm. For example, after the spin chuck (12) is extended outward from the center of the cover plate of the dustproof isolation box (2), the robot arm rotates the wafer to be inspected 90 degrees while it is not rotated to directly load and unload it onto the spin chuck (12) located in a vertical position, or after the spin chuck (12) is rotated to a horizontal position, the robot arm is used to load and unload the wafer to be inspected. Since both of the above loading and unloading methods are possible, various customer requirements are met.

[0056] Exemplary wafer loading and unloading method

[0057] A wafer loading and unloading method according to an embodiment of the present application loads and / or unloads a wafer to be inspected using a wafer loading and unloading structure according to any one of the above embodiments.

[0058] FIG. 8 is a schematic flowchart of a wafer loading and unloading method according to one embodiment of the present application. As shown in FIG. 8, the wafer loading and unloading method comprises the following steps.

[0059] In step S101, in response to the first extension control command, the extension mechanism extends out of the dustproof isolation box through the opening.

[0060] Specifically, referring to FIG. 2, after the wafer loading and unloading method receives a first extension control command, the extension mechanism extends out through the opening of the dust isolation box (refer to the process from a to b in FIG. 2).

[0061] In step S102, in response to the first rotation control command, the spin chuck rotates from a vertical position perpendicular to the cover plate to a horizontal position parallel to the cover plate.

[0062] Specifically, referring to FIG. 2, after receiving a first rotation control command, the wafer loading and unloading method rotates the spin chuck from a vertical position perpendicular to the cover plate to a horizontal position parallel to the cover plate (refer to the process from b to c in FIG. 2).

[0063] In step S103, the spin chuck is combined with a stage that supports the wafer to be inspected, so that the wafer to be inspected is loaded into the wafer receiving portion of the spin chuck, or the wafer to be inspected is unloaded from the wafer receiving portion of the spin chuck.

[0064] Specifically, the wafer to be inspected is placed on a stage, and after the spin chuck is positioned in a horizontal position, the spin chuck is raised and coupled with the stage, thereby loading the wafer to be inspected into the wafer receiving port of the spin chuck or unloading the wafer to be inspected from the wafer receiving port of the spin chuck (refer to the process from c to d in FIG. 2).

[0065] In step S104, in response to the second rotation control command, the spin chuck rotates from a horizontal position to a vertical position; and in response to the second extension control command, the extension mechanism returns to the dust isolation box through the opening.

[0066] Specifically, after the wafer loading and unloading method receives a second rotation control command, the spin chuck is rotated from a horizontal position to a vertical position, and the retractable structure returns to the dustproof isolation box.

[0067] In an embodiment of the present application, the loading and unloading of a wafer to be inspected are implemented through the above steps. Since the wafer loading and unloading structure protrudes outward from the center of the cover plate of the dust isolation box, it prevents the center of gravity bias caused by protruding outward from the side, reduces the probability of the dust isolation box shaking on the air bearing stage, and guarantees the dust isolation performance of the dust isolation box, thereby improving inspection accuracy.

[0068] Exemplary wafer inspection method

[0069] FIG. 9 is a schematic flowchart of a wafer inspection method according to one embodiment of the present application. As illustrated in FIG. 9, the wafer inspection method comprises the following steps.

[0070] It should be noted that the entity executing the wafer inspection method according to the embodiment of the present application is the wafer inspection device according to the embodiment.

[0071] In step S201, a wafer to be inspected is loaded based on the wafer loading and unloading method according to the above embodiment.

[0072] In step S202, an inspection operation is performed on the wafer to be inspected.

[0073] In step S203, the wafer to be inspected is unloaded based on the wafer loading and unloading method according to the above embodiment.

[0074] In an embodiment of the present application, when a wafer to be inspected is loaded and unloaded using the wafer loading and unloading method, the center of gravity is effectively prevented, and the dust isolation performance of the dust isolation box is ensured, thereby improving inspection accuracy.

[0075] Exemplary electronic device

[0076] FIG. 10 is a schematic structural diagram of an electronic device according to one embodiment of the present application. As shown in FIG. 10, the electronic device (300) includes one or more processors (310) and memory (320).

[0077] The processor (310) may be a central processing unit (CPU) or another type of processing unit equipped with data processing capabilities and / or instruction execution capabilities, and may also control other components of the electronic device (300) to perform expected functions.

[0078] The memory (320) may include one or more computer program products, and the computer program products may include various forms of computer-readable storage media such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored in the computer-readable storage media, and the processor (310) may execute the program instructions to implement the wafer loading and unloading method according to each embodiment of the present application described above, or the wafer inspection method according to each embodiment and / or other expected functions.

[0079] In one example, the electronic device (300) may further include an input device (330) and an output device (340), and these components are interconnected through a bus system and / or other forms of connection mechanism (not shown).

[0080] Of course, for the sake of simplification, FIG. 10 illustrates only some components of the electronic device (300) related to the present application, and components such as a bus and an input / output interface have been omitted. Additionally, depending on the specific application situation, the electronic device (300) may include other suitable components.

[0081] Exemplary computer program product and computer-readable storage medium

[0082] In addition to the above methods and apparatus, embodiments of the present application may also be computer program products comprising computer program instructions. When executed by a processor, the computer program instructions cause the processor to perform steps of the wafer loading and unloading method according to each embodiment of the present application described in the “Exemplary Wafer Loading and Unloading Method” section of the present specification, or to perform steps of the wafer inspection method according to each embodiment of the present application described in the “Exemplary Wafer Inspection Method” section of the present specification.

[0083] The above computer program product may be written using program code for executing operations according to an embodiment of the present application, using any combination of one or more programming languages. The programming languages ​​include object-oriented programming languages ​​such as Java, C++, etc., and also include conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code may be executed entirely on a user computing device, partially on a user device, as an independent software package, partially on a user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0084] Additionally, embodiments of the present application may be computer-readable storage media, said computer-readable storage media having computer program instructions stored therein. When said computer program instructions are executed by a processor, said processor may cause the processor to perform steps of the wafer loading and unloading method according to each embodiment of the present application described in the “Exemplary Wafer Loading and Unloading Method” portion of the present specification, or to perform steps of the wafer inspection method according to each embodiment of the present application described in the “Exemplary Wafer Inspection Method” portion of the present specification.

[0085] The computer-readable storage medium may use any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may include, for example, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or elements, or any combination thereof, but is not limited thereto. More specific examples (non-comprehensive list) of the readable storage medium may include electrical connections having one or more conductors, portable disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any and appropriate combination of the above.

[0086] It should be understood that the terms “comprising” and variations thereof as used in this application have an open meaning of “comprising but not limited thereto.” The term “one embodiment” means “at least one embodiment”; and the term “another embodiment” means “at least one other embodiment.” In this specification, exemplary expressions of the terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or properties described may be combined in an appropriate manner in any one or more embodiments or examples. Additionally, within the scope of non-contradiction, a person skilled in the art may combine and combine the various embodiments or examples and the features of the various embodiments or examples described in this specification.

[0087] Terms such as "first" or "second," etc., may be used in this application to describe various elements (e.g., chamber, positioning part, installation part, etc.), but these elements are not limited by said terms, and said terms are used merely for the purpose of distinguishing one element from another.

[0088] In this application, terms such as “installation,” “connection,” “connection,” “fixing,” etc., are to be interpreted broadly unless explicitly defined and limited otherwise. For example, they may be fixed connections, detachable connections, or integrally formed; mechanical connections, electrical connections, or capable of communicating with each other; direct connections, or indirect connections through an intermediate medium; or communication within two elements or an interactive relationship between two elements. Unless explicitly limited otherwise, a person skilled in the art will understand the specific meaning of the above terms in this application according to the specific circumstances.

[0089] The foregoing description is merely a preferred embodiment of the present application and is not intended to limit the application. All modifications, equivalent substitutions, etc. made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

Claim 1 A wafer loading and unloading structure applied to a wafer inspection device, comprising: an extendable mechanism configured to extend in a direction perpendicular to the cover plate of a dust isolation box, so as to be protruded out of or returned inward to the dust isolation box through an opening disposed in the cover plate; and a spin chuck rotatably connected to the extendable mechanism, wherein the spin chuck switches between a vertical position and a horizontal position through rotation, and when in the horizontal position, combines with a stage supporting a wafer to be inspected to implement loading and / or unloading of the wafer to be inspected, wherein when the spin chuck is in the vertical position, the spin chuck is perpendicular to the cover plate, and when the spin chuck is in the horizontal position, the spin chuck is parallel to the cover plate. Claim 2 A wafer loading and unloading structure according to claim 1, wherein the expansion mechanism comprises: a guide rail disposed inside the dust isolation box; a sliding bracket that fits the guide rail and slides within the guide rail; and a rotation axis that rotatably connects the spin chuck and the sliding bracket, wherein the rotation end of the spin chuck is connected to the sliding bracket through the rotation axis, and the rotation end of the spin chuck rotates around the rotation axis to drive a driven end opposite to the rotation end of the spin chuck to switch between the vertical position and the horizontal position. Claim 3 A wafer loading and unloading structure according to claim 2, wherein the above-described extension mechanism further comprises: a sliding groove disposed on the side of the sliding bracket close to the spin chuck; and a sliding connection that slides within the sliding groove, wherein the rotation axis is disposed on the side of the sliding connection close to the spin chuck, and the sliding connection drives the spin chuck to be raised and lowered when sliding within the sliding groove, thereby enabling loading and unloading of the wafer to be inspected in combination with the stage. Claim 4 A wafer loading and unloading structure according to paragraph 2, wherein the rotating end of the spin chuck is one end close to the cover plate of the spin chuck when the spin chuck is positioned in the vertical position. Claim 5 A wafer loading and unloading structure according to paragraph 2, wherein the rotating end of the spin chuck is one end far from the cover plate of the spin chuck when the spin chuck is positioned in the vertical position. Claim 6 A wafer loading and unloading structure according to claim 2, wherein the number of guide rails is two and the sliding brackets are two; wherein the two guide rails are each positioned at both ends near the opening of the spin chuck and are positioned in a mirror image, and the two sliding brackets are also positioned in a mirror image; and a set of parallel cross-sections corresponding to the rotational end of the spin chuck are connected to the rotational axis. Claim 7 A wafer loading and unloading structure according to claim 1, wherein the spin chuck comprises: a chuck body; and a wafer receiving portion disposed in the chuck body and configured to receive the wafer to be inspected. Claim 8 A wafer loading and unloading structure according to claim 7, wherein the chuck body has a U-shaped preset area provided for accommodating the rise of the stage; wherein the thickness of the chuck body located in the U-shaped preset area is smaller than the thickness of the chuck body located outside the U-shaped preset area, and the wafer receiving opening is located within the U-shaped preset area; and when the spin chuck is located in the vertical position, the opening of the U-shaped preset area is close to the cover plate. Claim 9 A wafer loading and unloading structure according to claim 7, wherein the spin chuck further comprises a clamping mechanism disposed at the edge of the wafer receiving hole, and the clamping mechanism is configured to fix the wafer to be inspected within the wafer receiving hole by clamping the wafer to be inspected by combining with the stage to implement opening and closing. Claim 10 A wafer inspection device comprising: two interferometers arranged in mirror images—each of which is configured to measure surface parameters of two faces of a wafer to be inspected—; a dust isolation box isolating the two interferometers from the outside—the dust isolation box is configured to prevent vibration from affecting the precision of the two interferometers—; and a wafer loading and unloading structure according to any one of claims 1 to 9 disposed between the two interferometers—the wafer loading and unloading structure is configured to load and / or unload the wafer to be inspected. Claim 11 A wafer loading and unloading method comprising loading and / or unloading a wafer to be inspected using a wafer loading and unloading structure according to claim 1, wherein the method comprises: extending a retractable mechanism out of a dust-proof isolation box through an opening in response to a first retractable control command; rotating a spin chuck from a vertical position perpendicular to a cover plate to a horizontal position parallel to the cover plate in response to a first rotational control command; coupling the spin chuck with a stage supporting the wafer to be inspected to install the wafer to be inspected in a wafer receiving hole of the spin chuck or unloading the wafer to be inspected from the wafer receiving hole of the spin chuck; rotating the spin chuck from the horizontal position to the vertical position in response to a second rotational control command; and returning the retractable mechanism into the dust-proof isolation box through the opening in response to a second retractable control command. Claim 12 A wafer inspection method comprising: loading a wafer to be inspected based on a wafer loading and unloading method according to claim 11; performing an inspection operation on the wafer to be inspected; and unloading the wafer to be inspected based on a wafer loading and unloading method according to claim 11. Claim 13 A wafer inspection device comprising: a processor; and a memory, wherein the memory stores computer program instructions, and the computer program instructions, when executed by the processor, cause the processor to perform a method according to claim 11 or 12. Claim 14 A computer-readable storage medium, wherein the computer-readable storage medium stores computer program instructions, and wherein the computer program instructions, when executed by a processor, cause the processor to perform a method according to claim 11 or 12.

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