Apparatus and method for inspecting of dry electrode

Abstract

The present disclosure relates to a dry electrode plate inspection apparatus and method. The technical problem to be solved is to provide a mechanism for detecting a substrate, a carbon layer, and an electrode plate film portion in a dry electrode plate during a dry electrode plate process, and for aligning the carbon layer and the electrode plate film portion. To this end, the present disclosure provides a sensor unit for acquiring sensor data for a dry electrode plate, and a processor for detecting position data of the electrode plate film portion, the carbon layer, and the substrate portion based on the sensor data, determining an alignment position where the electrode plate film portion is aligned with the upper part of a current collector and a current collector position based on the position data, and controlling the driving position of the current collector based on the alignment position and the current collector position.

Description

Technology Field

[0001] The present disclosure relates to a dry electrode plate inspection apparatus and method. Background Technology

[0003] Generally, a secondary battery refers to a battery capable of repeated charging and discharging, such as a lithium-ion battery, a lithium-polymer battery, a nickel-cadmium battery, a nickel-hydrogen battery, or a nickel-zinc battery. Such secondary batteries can be manufactured by housing an electrode assembly, comprising a positive electrode and a negative electrode stacked with a separator in between, and an electrolyte material in a case of various shapes, and sealing the case.

[0004] Electrodes such as positive or negative electrodes of such secondary batteries can be classified as wet electrodes or dry electrodes depending on their manufacturing method. Wet electrodes are manufactured by applying an electrode mixture in the form of a slurry containing a solvent to the surface of an electrode substrate, such as a current collector, to form a coating layer, and then drying the coating layer. On the other hand, dry electrodes are manufactured by pressing an electrode mixture in the form of a powder that does not contain a solvent onto the surface of an electrode substrate to form a coating layer.

[0005] Recently, due to problems such as the solvent included in the electrode mixture of the wet electrode generating harmful gases during the drying process and wrinkles, pinholes, and cracks occurring in the coating layer of the wet electrode after drying the solvent, research and development on dry electrode manufacturing technology that can replace wet electrodes is increasing.

[0006] The information described above disclosed in the background technology of this invention is intended only to enhance understanding of the background of the present invention and may therefore include information that does not constitute prior art. The problem to be solved

[0008] The objective of the present invention is to provide a dry electrode plate inspection apparatus and method that detects a substrate portion, a carbon layer, and an electrode plate film portion in a dry electrode plate during a dry electrode plate process, and ensures that the carbon layer and the electrode plate film portion align.

[0009] However, the technical problems that the present invention aims to solve are not limited to those described above, and other unmentioned problems can be clearly understood by those skilled in the art from the description of the invention below. means of solving the problem

[0011] A dry electrode plate inspection device according to an embodiment of the present invention for solving the above technical problem comprises: a sensor unit for acquiring sensor data for a dry electrode plate; and a processor for detecting position data of an electrode plate film unit, a carbon layer, and a substrate unit based on the sensor data, determining a matching position where the electrode plate film unit is matched to the upper part of a current collector and a current collector position based on the position data, and controlling the driving position of the current collector based on the matching position and the current collector position.

[0012] In the present invention, the sensor unit is characterized by including a shooting unit and a plurality of lights installed at different angles relative to the shooting unit.

[0013] In the present invention, the plurality of lights are characterized by being in the shape of a dome.

[0014] In the present invention, the imaging unit is characterized by sequentially illuminating the plurality of lights to sequentially acquire a plurality of image data for the dry electrode plate.

[0015] In the present invention, the processor is characterized by synthesizing and processing the plurality of image data to extract the brightness of the synthesized image, and using the difference in the extracted brightness to distinguish the electrode film portion, the carbon layer, and the substrate portion, respectively, and detecting position data.

[0016] In the present invention, the sensor unit is characterized by including a plurality of 3D scanning sensors of different specifications.

[0017] In the present invention, the plurality of 3D scanning sensors are characterized by acquiring thickness data of the dry electrode plate.

[0018] In the present invention, the processor is characterized by using thickness data of the dry electrode plate to distinguish the electrode plate film portion, the carbon layer, and the substrate portion, respectively, and detecting position data of the electrode plate film portion, the carbon layer, and the substrate portion.

[0019] In the present invention, the processor is characterized by determining the boundary where the carbon layer is in contact with the upper part of the substrate or the end part of the substrate as the current collector position.

[0020] In the present invention, the processor is characterized by calculating a correction value when the difference between the matching position and the current collector position exceeds a preset tolerance, and controlling the driving position of the current collector according to the correction value.

[0021] In the present invention, the processor is characterized by calculating the difference between the matching position and the current collector position as the correction value.

[0022] In the present invention, the processor is characterized by controlling the driving direction and driving position of the current collector according to the correction value so that the carbon layer and the electrode film portion are aligned.

[0023] A dry electrode plate inspection method according to another embodiment of the present invention comprises: a step in which a processor sequentially illuminates a plurality of lights installed at different angles to acquire a plurality of image data of a dry electrode plate through a shooting unit; a step in which the processor detects position data of an electrode plate film portion, a carbon layer, and a substrate portion based on the plurality of image data; a step in which the processor determines a matching position in which the electrode plate film portion is matched to the upper part of a current collector and a current collector position based on the position data; and a step in which the processor controls the driving position of the current collector based on the matching position and the current collector position.

[0024] A dry electrode plate inspection method according to another embodiment of the present invention is characterized by comprising the steps of: a processor acquiring thickness data of a dry electrode plate through a plurality of 3D scanning sensors of different specifications; the processor detecting position data of an electrode plate film portion, a carbon layer, and a substrate portion based on the thickness data of the dry electrode plate; the processor determining a matching position in which the electrode plate film portion is matched to the upper part of a current collector and a current collector position based on the position data; and the processor controlling the driving position of the current collector based on the matching position and the current collector position. Effects of the invention

[0026] According to the present invention, position data of the electrode film portion, carbon layer, and substrate portion are detected based on sensor data obtained through 2.5D and 3D methods during the dry electrode process, and by controlling the driving position of the current collector so that the carbon layer and the electrode film portion align based on the detected position data, the quality and productivity of the electrode can be improved and the stability of the dry electrode process can be provided.

[0027] However, the effects obtainable through the present invention are not limited to those described above, and other unmentioned technical effects will be clearly understood by those skilled in the art from the description of the invention below. Brief explanation of the drawing

[0029] The following drawings attached to this specification illustrate preferred embodiments of the present invention and serve to further enhance understanding of the technical concept of the present invention together with the detailed description of the invention provided below; therefore, the present invention should not be interpreted as being limited only to the matters described in such drawings. FIG. 1 is a drawing for explaining a dry electrode manufacturing system according to one embodiment of the present invention. FIG. 2 is a block diagram schematically showing the configuration of a dry electrode plate inspection device according to one embodiment of the present invention. FIG. 3 is a diagram illustrating a case in which a sensor unit according to an embodiment of the present invention is implemented as a vision unit. Figure 4 is an example diagram illustrating the lighting shown in Figure 3. FIG. 5 is an exemplary diagram illustrating a method for acquiring image data through a vision unit according to an embodiment of the present invention. FIG. 6 is a diagram illustrating a case where a sensor unit according to an embodiment of the present invention is implemented as a 3D scanning sensor. FIG. 7 is an example diagram showing thickness data of a dry electrode plate using a 3D scanning sensor according to one embodiment of the present invention. FIG. 8 is an exemplary diagram illustrating the installation of a 3D scanning sensor for scanning a dry electrode plate according to one embodiment of the present invention. FIG. 9 is an illustrative diagram for explaining the position of the current collector in a dry electrode plate according to one embodiment of the present invention. FIG. 10 is a flowchart illustrating a dry electrode plate inspection method according to one embodiment of the present invention. FIG. 11 is a flowchart illustrating a method for inspecting a dry electrode plate using a plurality of image data according to an embodiment of the present invention. FIG. 12 is a flowchart illustrating a method for inspecting a dry electrode plate using thickness data according to one embodiment of the present invention. Specific details for implementing the invention

[0030] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. Prior to this, terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings. Instead, based on the principle that the inventor may appropriately define the concepts of terms to best describe his invention, they should be interpreted in a meaning and concept consistent with the technical spirit of the present invention. Therefore, it should be understood that the embodiments described in this specification and the configurations illustrated in the drawings are merely some of the most preferred embodiments of the present invention and do not represent all of the technical spirit of the present invention; thus, various equivalents and modifications that can replace them may exist at the time of filing this application. Furthermore, as used in this specification, "comprise" or "include" and / or "comprising" or "including" specify the presence of the mentioned features, numbers, steps, actions, parts, elements, and / or groups thereof, and do not exclude the presence or addition of one or more other features, numbers, actions, parts, elements, and / or groups. In addition, when describing embodiments of the present invention, "may" and "may be" may include "one or more embodiments of the present invention."

[0031] Additionally, to aid in understanding the invention, the attached drawings are not drawn to actual scale, and the dimensions of some components may be exaggerated. Furthermore, the same reference numerals may be assigned to identical components in different embodiments.

[0032] The statement that two subjects of comparison are 'identical' means that they are 'substantially identical.' Therefore, substantial identity may include deviations considered low in the industry, for example, deviations within 5%. Additionally, the statement that a parameter is uniform in a given area may mean that it is uniform from an average perspective.

[0033] Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless specifically stated otherwise, the first component may also be the second component.

[0034] Throughout the specification, unless specifically stated otherwise, each component may be singular or plural.

[0035] The fact that any configuration is placed on the "upper (or lower)" of a component or on the "upper (or lower)" of a component may mean not only that any configuration is placed in contact with the upper (or lower) surface of said component, but also that another configuration may be interposed between said component and any configuration placed on (or below) said component.

[0036] Furthermore, where it is stated that one component is "connected," "coupled," or "connected" to another component, it should be understood that while said components may be directly connected or connected to each other, another component may be "interposed" between each component, or that each component may be "connected," "coupled," or "connected" through another component. Additionally, when it is stated that a part is electrically coupled with another part, this includes not only cases where they are directly connected but also cases where they are connected with another component in between.

[0037] Throughout the specification, "A and / or B" means A, B, or A and B unless specifically stated otherwise. That is, "and / or" includes any combination or any combination of the enumerated items. "C to D" means C or more and D or less, unless specifically stated otherwise.

[0038] The dry electrode plate described below may have the same meaning as a dry electrode.

[0040] FIG. 1 is a drawing for explaining a dry electrode manufacturing system according to one embodiment of the present invention.

[0041] Referring to FIG. 1, a dry electrode manufacturing system according to one embodiment of the present invention may include a powder supply unit (100a, 100b), a plurality of rolls (Roll, 200), a current collector supply unit (300), and a dry electrode inspection device (400).

[0042] The electrode film portion (20) is formed by heat-pressing an electrode powder (powder) containing one or more of an electrode active material, a binder resin, and a conductive material, and may have the shape of a sheet. Accordingly, the powder supply portion (100a, 100b) can supply a dry powder containing an active material, a conductive material, and a binder.

[0043] Since the electrode film portion (20) is adhered to both sides of the current collector (10), the powder supply portion (100a, 100b) may include a first powder supply portion (100a) and a second powder supply portion (100b).

[0044] The first powder supply unit (100a) can provide dry powder to form an electrode film unit (20) that is adhered to the first surface of the current collector (10). Here, the electrode film unit (20) may be a positive electrode or a negative electrode.

[0045] The second powder supply unit (100b) can provide dry powder to form an electrode film portion (20) that is adhered to the second surface of the current collector (10). Here, the electrode film portion (20) may be a positive electrode or a negative electrode.

[0046] The dry powder supplied by the powder supply unit (100a, 100b) can be rolled into a sheet-shaped electrode film portion (20) by the roll (200). That is, the dry powder supplied from the first powder supply unit (100a) can be rolled by the roll (200) into an electrode film portion (20) to be adhered to the first surface of the current collector (10) (A). The dry powder supplied from the second powder supply unit (100b) can be rolled by the roll (200) into an electrode film portion (20) to be adhered to the second surface of the current collector (10).

[0047] Subsequently, the electrode film portion (20) to be attached to the first surface and the electrode film portion (20) to be attached to the second surface can each have their thickness and density controlled while passing through a continuous roll (200) (B). At this time, a trimming knife (250) can cut off unnecessary parts from the electrode film portion (20). That is, when manufacturing the electrode film portion (20) by applying a calendering method to dry powder, the edges of both ends in the cross machine direction are uneven and have an uneven sawtooth shape, so the width dimensions of the electrode film portion (20) are not uniform and cracks may occur from the gaps between the sawtooth teeth. Accordingly, the trimming knife (250) can trim unnecessary parts in the cross machine direction of the electrode film portion (20).

[0048] The electrode film portion (20) to be attached to the first surface and the second surface, respectively, can be attached to the current collector (10) via a lamination roll (C). The lamination roll can perform the function of attaching and rolling the electrode film portion (20) to at least one surface of the current collector (10).

[0049] A dry electrode plate (electrode) can be manufactured by laminating the current collector (10) and the electrode plate film portion (20).

[0050] The entire house (10) can be supplied by the entire house supply unit (300).

[0051] The current collector (10) is not particularly limited as long as it has high conductivity without causing chemical changes in the battery, for example, stainless steel, aluminum, nickel, titanium, calcined carbon, copper, or aluminum or stainless steel surface treated with carbon, nickel, titanium, silver, etc. may be used. The current collector (10) may also increase the adhesion of the positive active material through fine irregularities formed on its surface, and the current collector (10) can be in various forms such as a film, sheet, foil, net, porous body, foam, nonwoven body, etc.

[0052] The current collector (10) may have a structure in which a primer layer is coated on a metal substrate. Accordingly, the current collector (10) may include a substrate portion (11) and a carbon layer (12). That is, the current collector (10) may have a carbon layer (12) on top of the substrate portion (11) to help attach the electrode film portion (20). Here, the carbon layer (12) may be named a CLF (Carbon Layered Foil) layer, a carbon coating layer, a primer layer, etc. However, in the current collector (10) including the carbon layer (12), the width of the carbon layer (12) and the width of the electrode film portion (20) must match. If the carbon layer (12) and the electrode film portion (20) do not match and the carbon layer (12) is exposed, a problem may occur with the quality of the electrode.

[0053] Therefore, a technique is required to detect the substrate (11), carbon layer (12), and electrode film portion (20) of the edge portion of the dry electrode plate, and to ensure that the carbon layer (12) and the electrode film portion (20) are aligned.

[0054] Accordingly, the dry electrode plate manufacturing system according to the present embodiment may include a dry electrode plate inspection device (400).

[0055] The dry electrode inspection device (400) acquires sensor data through the sensor unit (430), detects position data of the electrode film unit (20), carbon layer (12), and substrate unit (11) based on the sensor data, and can control the driving position of the current collector (10) so that the carbon layer (12) and the electrode film unit (20) are aligned based on the detected position data. That is, the dry electrode inspection device (400) can control the driving direction and driving position of the current collector (10) so that the carbon layer (12) and the electrode film unit (20) are aligned.

[0056] A detailed description of such a dry electrode plate inspection device (400) will be made by referring to FIG. 2.

[0058] FIG. 2 is a block diagram schematically showing the configuration of a dry electrode plate inspection device according to an embodiment of the present invention; FIG. 3 is a diagram explaining the case where the sensor unit according to an embodiment of the present invention is implemented as a vision unit; FIG. 4 is an exemplary diagram explaining the lighting shown in FIG. 3; FIG. 5 is an exemplary diagram explaining a method of acquiring image data through a vision unit according to an embodiment of the present invention; FIG. 6 is a diagram explaining the case where the sensor unit according to an embodiment of the present invention is implemented as a 3D scanning sensor; FIG. 7 is an exemplary diagram showing thickness data of a dry electrode plate using a 3D scanning sensor according to an embodiment of the present invention; FIG. 8 is an exemplary diagram explaining the installation of a 3D scanning sensor for scanning a dry electrode plate according to an embodiment of the present invention; FIG. 9 is an exemplary diagram explaining the position of a current collector on a dry electrode plate according to an embodiment of the present invention.

[0059] Referring to FIG. 2, a dry electrode plate inspection device (400) according to one embodiment of the present invention may include a memory (410), a communication module (420), a sensor unit (430), and a processor (440).

[0060] At least one instruction executed by the processor (440) may be stored in the memory (410). In particular, the memory (410) may store instructions (programs, applications, applets), etc., for detecting position data of the electrode film portion (20), carbon layer (12), and substrate portion (11) based on sensor data, determining the alignment position and current collector position where the electrode film portion (20) is aligned with the upper part of the current collector based on the position data, and controlling the driving position of the current collector (10) based on the alignment position and current collector position, and the information stored may be selected by the processor (440) as needed. The memory (410) may be implemented as a volatile storage medium and / or a non-volatile storage medium, and may be implemented as, for example, a Read Only Memory (ROM), Random Access Memory (RAM), Flash Memory, or Electrically Erasable Programmable Read-Only Memory (EEPROM).

[0061] The communication module (420) may provide a communication interface necessary to provide transmission and reception signals between the dry electrode plate inspection device (400) and an external device (e.g., a current collector driving unit (not shown)) in the form of packet data in conjunction with a communication network. Here, the current collector driving unit drives the current collector (10) and can adjust the driving direction and driving position of the current collector according to the control of the processor (440). Furthermore, the communication module (420) may perform the role of transmitting driving position control information (correction value) of the current collector (10) to the current collector driving unit. Here, the communication network refers to a medium that performs the role of connecting the dry electrode plate inspection device (400) and an external device, and may include a path that provides a connection path so that the external device can transmit and receive information after connecting to the dry electrode plate inspection device (400). In addition, the communication module (420) may be a device that includes hardware and software necessary to transmit and receive signals, such as control signals or data signals, through wired or wireless connections with other network devices. In addition, the communication module (420) can be implemented in various forms, such as a short-range communication module, a wireless communication module, a mobile communication module, and a wired communication module.

[0062] The sensor unit (430) can acquire sensor data from the dry electrode plate. Here, the sensor data may include multiple image data of the dry electrode plate captured by illumination (432) at different angles, thickness data of the dry electrode plate, etc.

[0063] These sensor parts (430) can be implemented as vision parts (431, 432), 3D scanning sensors (433, 434), etc.

[0064] When the sensor unit (430) is implemented as a vision unit (431, 432), the vision unit (431, 432) can be installed on each side to photograph the dry electrode plate on each side as shown in FIG. 3.

[0065] The vision unit (431, 432) includes a plurality of lights (432) and a shooting unit (431) and can implement 2.5D vision. At this time, the plurality of lights (432) may be installed at different angle intervals per shooting unit (431). For example, if the vision unit includes one shooting unit (431) and four lights (432), the four lights (432) may be installed at 90-degree intervals. That is, the vision unit (431, 432) is implemented in a structure in which N lights (432) are provided per shooting unit (431), so that dry electrode plates can be photographed from multiple angles.

[0066] The lighting (432) can be implemented as a dome-shaped light (432) to spread light evenly in a 360-degree direction. When using a dome-shaped light (432), the overall brightness can be maintained evenly as shown in FIG. 4.

[0067] For example, as illustrated in FIG. 5, a case in which four lights (432a, 432b, 432c, 432d) are installed at 90-degree intervals will be described. In this case, the imaging unit (431) can turn on the first light (432a) to photograph the dry electrode plate and obtain first image data, and then turn off the first light (432a). After that, the imaging unit (431) can turn on the second light (432b) to photograph the dry electrode plate and obtain second image data, turn off the second light (432b), turn on the third light (432c) to photograph the dry electrode plate and obtain third image data, and then turn off the third light (432c). Then, the camera unit (431) can turn on the fourth light (432d) to photograph the dry electrode plate to obtain fourth image data, and turn off the fourth light (432d). The vision unit (431, 432) can transmit the first image data, second image data, third image data, and fourth image data to the processor (440).

[0068] In this way, the camera unit (431) can sequentially light up multiple lights to sequentially acquire multiple image data of the dry electrode plate.

[0069] When the sensor unit (430) is implemented as a 3D scanning sensor (433, 434), the 3D scanning sensor (433, 434) can be installed on each side to measure thickness data of the dry electrode plate as shown in FIG. 6.

[0070] The 3D scanning sensor (433, 434) may include, for example, a laser profile sensor, laser scanning, optical scanning, structured light scanning, etc.

[0071] In a dry electrode plate, the carbon layer (12) and the electrode film portion (20) are combined in a form applied to the upper surface of the substrate portion (11) based on the substrate portion (11), and accordingly, there is a difference in thickness. When thickness data is detected for the dry electrode plate using 3D scanning sensors (433, 434), the substrate portion (11), the carbon layer (12), and the electrode film portion (20) all have different thickness data as shown in FIG. 7. Using the thickness data, position data of the substrate portion (11), the carbon layer (12), and the electrode film portion (20) of the dry electrode plate can be detected. However, the thickness difference between the substrate portion (11) and the carbon layer (12) is at the level of a few micrometers, and the thickness difference is small compared to the electrode film portion (20), so it may be difficult to detect the thickness difference with the same 3D scanning sensor.

[0072] Accordingly, the sensor unit (430) may use a plurality of 3D scanning sensors (433, 434) of different specifications. For example, the sensor unit (430) may include a first 3D scanning sensor (433) with relatively high resolution and a second 3D scanning sensor (434) with low resolution, as shown in FIG. 8.

[0073] The first 3D scanning sensor (433) can acquire first thickness data of the scanning area and transmit it to the processor (440), and the second 3D scanning sensor (434) can acquire second thickness data of the scanning area and transmit it to the processor (440).

[0074] The processor (440) acts as the main component for inspecting dry electrode plates and can be implemented as a Central Processing Unit (CPU) or a System on Chip (SoC). It can control multiple hardware or software components connected to the processor (440) by running an operating system or application, and can perform various data processing and calculations. The processor (440) can be configured to execute at least one instruction stored in memory (410) and store the execution result data in memory (410).

[0075] The processor (440) detects position data of the electrode film portion (20), carbon layer (12), and substrate portion (11) based on sensor data obtained through the sensor portion (430), obtains a matching position and a current collector position where the electrode film portion (20) is matched to the upper part of the current collector based on the position data, and can control the driving position of the current collector (10) based on the matching position and the current collector position.

[0076] Below, the operation of the processor (440) will be described in detail.

[0077] The processor (440) can detect position data of the electrode film portion (20), carbon layer (12), and substrate portion (11) based on sensor data. Here, the sensor data may be multiple image data of the dry electrode plate captured by illumination at different angles or thickness data of the dry electrode plate.

[0078] First, when sensor data is multiple image data of a dry electrode plate captured by lighting at different angles, a method for the processor (440) to detect position data of the electrode film portion (20), carbon layer (12), and substrate portion (11) will be explained.

[0079] The processor (440) can synthesize multiple image data of a dry electrode plate captured by lighting at different angles to extract the brightness of the synthesized image.

[0080] Image data captured by lighting at different angles can provide images captured at different angles. Images captured at different angles may react differently depending on the surface texture and material properties. For example, since the carbon layer (12) and the electrode film portion (20) may reflect light in different ways, even the same object may appear differently depending on the angle of lighting. This allows for a clearer understanding of the characteristics of each surface.

[0081] Since the carbon layer (12) and the electrode film portion (20) are made of different materials, there is a difference in the way they reflect light or the texture of their surfaces. This difference may appear as a difference in brightness or reflectivity in an image. Therefore, when a processor (440) synthesizes or processes images taken from different angles, the brightness and reflectivity of each surface can be extracted. For example, by analyzing the difference in brightness of the surface according to the angle, it is possible to distinguish whether a specific area is the carbon layer (12) or the electrode film portion (20).

[0082] The processor (440) can distinguish the electrode film portion (20), carbon layer (12), and substrate portion (11) respectively by utilizing the difference in brightness of the composite image, and detect position data.

[0083] The processor (440) may detect position data of the electrode film portion (20), carbon layer (12), and substrate portion (11) using the number of pixels of the composite image, etc.

[0084] Next, when the sensor data is thickness data of a dry electrode plate, a method for the processor (440) to detect position data of the electrode film portion (20), carbon layer (12), and substrate portion (11) will be explained.

[0085] The processor (440) can distinguish the electrode film portion (20), the carbon layer (12), and the substrate portion (11) using the thickness data of the dry electrode plate, and detect the position data of the electrode film portion (20), the carbon layer (12), and the substrate portion (11).

[0086] When position data of the electrode film portion (20), carbon layer (12), and substrate portion (11) is detected, the processor (440) can determine the alignment position and the current collector position based on the position data. Here, the alignment position may refer to the boundary where the electrode film portion (20) is aligned with the upper part of the current collector, as shown in FIG. 9. The current collector position may refer to the end portion of the substrate portion (11) or the boundary where the carbon layer (12) is in contact with the upper part of the substrate portion (11), as shown in FIG. 9. The carbon layer (12) may not be aligned with the electrode film portion (20) and may be identical to the substrate portion (11). In this case, the current collector position may be the end portion of the substrate portion (11). When the electrode film portion (20), carbon layer (12), and substrate portion (11) are clearly distinguished, the current collector position may be the boundary where the carbon layer (12) is in contact with the upper part of the substrate portion.

[0087] When the alignment position and the total collection position are determined, the processor (440) can calculate the difference between the alignment position and the total collection position and determine whether the difference exceeds a preset tolerance. At this time, the tolerance may vary depending on the total collection position. For example, if the total collection position is at the end of the substrate (11), the tolerance may be a first tolerance. If the total collection position is at the boundary where the carbon layer (12) is in contact with the upper part of the substrate, the tolerance may be a second tolerance that is smaller than the first tolerance.

[0088] If the difference between the alignment position and the overall house position exceeds the allowable error, the processor (440) can calculate a correction value. At this time, the processor (440) can calculate the difference between the alignment position and the overall house position as a correction value.

[0089] When a correction value is calculated, the processor (440) can adjust the driving position of the current collector (10) according to the correction value. That is, the processor (440) can use the correction value as the adjustment direction and adjustment amount of the current collector (10). In this way, by adjusting the driving alignment of the current collector of the current collector driving part (not shown), the processor (440) can ensure that the electrode film part (20) and the carbon layer (12) are aligned even while the current collector (10) is driving.

[0091] FIG. 10 is a flowchart illustrating a dry electrode plate inspection method according to one embodiment of the present invention.

[0092] Referring to FIG. 10, when sensor data is acquired (S902), the processor (440) detects position data of the electrode film portion (20), carbon layer (12), and substrate portion (11) based on the sensor data (S904). Here, the sensor data may be multiple image data of the dry electrode plate captured by illumination at different angles or thickness data of the dry electrode plate.

[0093] When step S904 is performed, the processor (440) determines the alignment position (a) and the current collector position (b) based on the position data of the electrode film portion (20), the carbon layer (12), and the substrate portion (11) (S906). Here, the alignment position refers to the boundary where the electrode film portion (20) is aligned with the upper part of the current collector, and the current collector position may refer to the end portion of the substrate portion (11) or the boundary where the carbon layer (12) is in contact with the upper part of the substrate portion.

[0094] When step S906 is performed, the processor (440) determines whether the difference between the matching position (a) and the collection position (b) exceeds a preset tolerance (S908).

[0095] At this time, if the current collector location is at the end of the substrate (11), the processor (440) can determine whether the difference between the matching location (a) and the current collector location (b) exceeds the first allowable error. If the current collector location is at the boundary where the carbon layer (12) is in contact with the upper part of the substrate, the processor (440) can determine whether the difference between the matching location (a) and the current collector location (b) exceeds the second allowable error.

[0096] If, as a result of the judgment in step S908, the difference between the matching position (a) and the entire house position (b) exceeds a preset tolerance, the processor (440) calculates a correction value (S910). At this time, the processor (440) can calculate the difference between the matching position and the entire house position as the correction value.

[0097] When step S910 is performed, the processor (440) adjusts the position of the collector (10) according to the correction value (S912). That is, the processor (440) can use the correction value as the adjustment direction and adjustment amount of the collector (10).

[0098] If, as a result of the judgment in step S908, the difference between the matching position (a) and the entire house position (b) does not exceed a preset tolerance, the processor (440) performs step S902.

[0100] FIG. 11 is a flowchart illustrating a method for inspecting a dry electrode plate using a plurality of image data according to an embodiment of the present invention.

[0101] Referring to FIG. 11, the processor (440) sequentially lights up a plurality of lights installed at different angles to acquire a plurality of image data of a dry electrode plate through the shooting unit (431) (S1002).

[0102] For example, if four lights are installed at 90-degree intervals, the processor (440) can turn on the first light to photograph the dry electrode plate through the shooting unit (431) to obtain first image data, turn off the first light, turn on the second light to photograph the dry electrode plate through the shooting unit (431) to obtain second image data, turn off the second light, turn on the third light to photograph the dry electrode plate through the shooting unit (431) to obtain third image data, turn off the third light, turn on the fourth light to photograph the dry electrode plate through the shooting unit (431) to obtain fourth image data, and turn off the fourth light.

[0103] When step S1002 is performed, the processor (440) processes multiple image data to synthesize and extract the brightness of the synthesized image (S1004).

[0104] When step S1004 is performed, the processor (440) detects position data by distinguishing the electrode film portion (20), carbon layer (12), and substrate portion (11) respectively using the difference in brightness of the composite image (S1006).

[0105] When step S1006 is performed, the processor (440) determines the alignment position (a) and the current collector position (b) based on the position data of the electrode film portion (20), the carbon layer (12), and the substrate portion (11) (S1008). Here, the alignment position refers to the boundary where the electrode film portion (20) is aligned with the upper part of the current collector, and the current collector position may refer to the end portion of the substrate portion (11) or the boundary where the carbon layer (12) is in contact with the upper part of the substrate portion.

[0106] When step S1008 is performed, the processor (440) determines whether the difference between the matching position (a) and the collection position (b) exceeds a preset tolerance (S1010).

[0107] At this time, if the current collector location is at the end of the substrate (11), the processor (440) can determine whether the difference between the matching location (a) and the current collector location (b) exceeds the first allowable error. If the current collector location is at the boundary where the carbon layer (12) is in contact with the upper part of the substrate, the processor (440) can determine whether the difference between the matching location (a) and the current collector location (b) exceeds the second allowable error.

[0108] If, as a result of the judgment in step S1010, the difference between the matching position (a) and the entire house position (b) exceeds a preset tolerance, the processor (440) calculates a correction value (S1012). At this time, the processor (440) can calculate the difference between the matching position and the entire house position as the correction value.

[0109] When step S1012 is performed, the processor (440) adjusts the position of the collector (10) according to the correction value (S1014). That is, the processor (440) can use the correction value as the adjustment direction and adjustment amount of the collector (10).

[0110] If, as a result of the judgment in step S1010, the difference between the matching position (a) and the entire house position (b) does not exceed a preset tolerance, the processor (440) performs step S1002.

[0112] FIG. 12 is a flowchart illustrating a method for inspecting a dry electrode plate using thickness data according to one embodiment of the present invention.

[0113] Referring to FIG. 12, the processor (440) acquires thickness data of a dry electrode plate through a plurality of 3D scanning sensors (433, 434) of different specifications (S1102).

[0114] For example, the processor (440) can acquire thickness data of the dry electrode plate through a first 3D scanning sensor (433) with relatively high resolution and acquire thickness data of the dry electrode plate through a second 3D scanning sensor (434) with low resolution.

[0115] When step S1102 is performed, the processor (440) detects position data by distinguishing the electrode film portion (20), the carbon layer (12), and the substrate portion (11) based on the thickness data (S1104).

[0116] When step S1104 is performed, the processor (440) determines the alignment position (a) and the current collector position (b) based on the position data of the electrode film portion (20), the carbon layer (12), and the substrate portion (11) (S1106). Here, the alignment position refers to the boundary where the electrode film portion (20) is aligned with the upper part of the current collector, and the current collector position may refer to the end portion of the substrate portion (11) or the boundary where the carbon layer (12) is in contact with the upper part of the substrate portion.

[0117] When step S1106 is performed, the processor (440) determines whether the difference between the matching position (a) and the collection position (b) exceeds a preset tolerance (S1108).

[0118] At this time, if the current collector location is at the end of the substrate (11), the processor (440) can determine whether the difference between the matching location (a) and the current collector location (b) exceeds the first allowable error. If the current collector location is at the boundary where the carbon layer (12) is in contact with the upper part of the substrate, the processor (440) can determine whether the difference between the matching location (a) and the current collector location (b) exceeds the second allowable error.

[0119] If, as a result of the judgment in step S1108, the difference between the matching position (a) and the entire house position (b) exceeds a preset tolerance, the processor (440) calculates a correction value (S1110). At this time, the processor (440) can calculate the difference between the matching position and the entire house position as the correction value.

[0120] When step S1110 is performed, the processor (440) adjusts the position of the collector (10) according to the correction value (S912). That is, the processor (440) can use the correction value as the adjustment direction and adjustment amount of the collector (10).

[0121] If, as a result of the judgment in step S1108, the difference between the matching position (a) and the entire house position (b) does not exceed a preset tolerance, the processor (440) performs step S1102.

[0123] As such, according to the present invention, position data of the electrode film portion, carbon layer, and substrate portion are detected based on sensor data obtained through 2.5D and 3D methods during the dry electrode process, and by controlling the driving position of the current collector so that the carbon layer and the electrode film portion coincide based on the detected position data, the quality and productivity of the electrode can be improved and the stability of the dry electrode process can be provided.

[0124] As used herein, the term “part” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. The “part” may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, the “part” may be implemented in the form of an Application-Specific Integrated Circuit (ASIC).

[0125] The implementations described herein may be implemented, for example, as methods or processes, devices, software programs, data streams, or signals. Even if discussed only in the context of a single form of implementation (e.g., discussed only as a method), the implementation of the discussed features may also be implemented in other forms (e.g., devices or programs). Devices may be implemented in appropriate hardware, software, and firmware, etc. Methods may be implemented in devices such as processors, which generally refer to processing devices including, for example, computers, microprocessors, integrated circuits, or programmable logic devices. Processors also include communication devices such as computers, cell phones, portable / personal digital assistants ("PDAs"), and other devices that facilitate the communication of information between end-users.

[0126] Although the present invention has been described above by limited embodiments and drawings, the present invention is not limited thereto, and it is obvious that various modifications and variations are possible within the scope of the technical spirit of the present invention and the equivalent scope of the claims described below by those skilled in the art to which the present invention belongs. Explanation of the symbols

[0128] 10 : Whole house 11 : Ministry of Economy and Finance 12: Carbon layer 20: Plate Film Section 100a, 100b: Powder supply unit 200 : LoL 300 : Whole House Supply Unit 400 : Dry electrode plate inspection device 410 : Memory 420 : Communication module 430 : Sensor section 431 : Camera Department 432 : Lighting 434, 434: 3D scanning sensor 440 : Processor

Claims

Claim 1 A dry electrode inspection device characterized by comprising: a sensor unit for acquiring sensor data for a dry electrode; and a processor for detecting position data of an electrode film unit, a carbon layer, and a substrate unit based on the sensor data, determining a matching position where the electrode film unit is matched to the upper part of a current collector and a current collector position based on the position data, and controlling the driving position of the current collector based on the matching position and the current collector position. Claim 2 A dry electrode plate inspection device according to claim 1, wherein the sensor unit comprises: a shooting unit; and a plurality of lights installed at different angles with respect to the shooting unit. Claim 3 A dry electrode plate inspection device according to paragraph 2, wherein the plurality of lights are dome-shaped. Claim 4 A dry electrode plate inspection device according to paragraph 2, wherein the above-mentioned imaging unit sequentially illuminates the plurality of lights to sequentially acquire a plurality of image data for the dry electrode plate. Claim 5 A dry electrode inspection device according to claim 4, wherein the processor processes the plurality of image data to extract the brightness of the synthesized image, and uses the difference in the extracted brightness to distinguish the electrode film portion, the carbon layer, and the substrate portion, respectively, and detects position data. Claim 6 A dry electrode plate inspection device according to claim 1, wherein the sensor unit comprises a plurality of 3D scanning sensors of different specifications. Claim 7 A dry electrode plate inspection device according to claim 6, wherein the plurality of 3D scanning sensors acquire thickness data of the dry electrode plate. Claim 8 A dry electrode inspection device according to claim 7, wherein the processor distinguishes the electrode film portion, carbon layer, and substrate portion using thickness data of the dry electrode plate, and detects position data of the electrode film portion, carbon layer, and substrate portion. Claim 9 A dry electrode plate inspection device according to claim 1, wherein the processor determines the boundary where the carbon layer is in contact with the upper part of the substrate or the end part of the substrate as the current collector position. Claim 10 A dry electrode plate inspection device according to claim 9, wherein the processor calculates a correction value when the difference between the matching position and the current collector position exceeds a preset tolerance, and controls the driving position of the current collector according to the correction value. Claim 11 A dry electrode plate inspection device according to claim 10, wherein the processor calculates the difference between the aforementioned matching position and the aforementioned current collector position as the aforementioned correction value. Claim 12 A dry electrode plate inspection device according to claim 10, wherein the processor controls the driving direction and driving position of the current collector according to the correction value so that the carbon layer and the electrode plate film portion are aligned. Claim 13 A dry electrode inspection method characterized by comprising: a step in which a processor sequentially illuminates a plurality of lights installed at different angles to acquire a plurality of image data of a dry electrode plate through a shooting unit; a step in which the processor detects position data of an electrode plate film portion, a carbon layer, and a substrate portion based on the plurality of image data; a step in which the processor determines a matching position in which the electrode plate film portion is matched to the upper part of a current collector and a current collector position based on the position data; and a step in which the processor controls the driving position of the current collector based on the matching position and the current collector position. Claim 14 A dry electrode inspection method according to claim 13, wherein, in the step of detecting the position data, the processor synthesizes the plurality of image data to extract the brightness of the synthesized image, and uses the difference in the extracted brightness to distinguish the electrode film portion, the carbon layer, and the substrate portion, respectively, and detects the position data. Claim 15 A dry electrode plate inspection method according to claim 13, wherein in the step of controlling the driving position of the current collector, the processor calculates a correction value when the difference between the matching position and the current collector position exceeds a preset tolerance, and controls the driving position of the current collector according to the correction value. Claim 16 A dry electrode plate inspection method according to claim 15, wherein, in the step of controlling the driving position of the current collector, the processor calculates the difference between the matching position and the current collector position as the correction value. Claim 17 A dry electrode inspection method characterized by comprising: a step in which a processor acquires thickness data of a dry electrode through a plurality of 3D scanning sensors of different specifications; a step in which the processor detects position data of an electrode film portion, a carbon layer, and a substrate portion based on the thickness data of the dry electrode; a step in which the processor determines a matching position in which the electrode film portion is matched to the upper part of a current collector and a current collector position based on the position data; and a step in which the processor controls the driving position of the current collector based on the matching position and the current collector position. Claim 18 A dry electrode inspection method according to claim 17, wherein, in the step of detecting the above position data, the processor distinguishes the electrode film portion, carbon layer, and substrate portion using the thickness data of the dry electrode plate, and detects the position data of the electrode film portion, carbon layer, and substrate portion. Claim 19 A dry electrode plate inspection method according to claim 17, wherein in the step of controlling the driving position of the current collector, the processor calculates a correction value when the difference between the matching position and the current collector position exceeds a preset tolerance, and controls the driving position of the current collector according to the correction value. Claim 20 A dry electrode plate inspection method according to claim 19, wherein, in the step of controlling the driving position of the current collector, the processor calculates the difference between the matching position and the current collector position as the correction value.

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