Encapsulation composition and light emitting device

Abstract

The present invention provides a light-emitting device comprising an encapsulating composition comprising at least one polyfunctional monomer and at least one monofunctional monomer, and an organic film formed by curing the encapsulating composition.

Description

Technology Field

[0001] The present invention relates to a packaging material composition, and more specifically, to a packaging material composition, an organic cured film formed from the packaging material composition, and a light-emitting device comprising the organic cured film. Background Technology

[0002] Light-emitting devices, particularly Organic Light Emitting Devices (OLEDs), are self-emissive devices used in TVs, computers, and mobile communication devices. They possess advantages such as a wide viewing angle, excellent contrast, fast response time, superior characteristics in brightness, driving voltage, and response speed, and the ability to be multi-colored, making them widely used in a very diverse range of fields.

[0003] However, when organic light-emitting diodes are exposed to oxygen, moisture, and ultraviolet rays, problems arise in which physical properties and lifespan deteriorate due to degradation. Therefore, sealing means capable of protecting organic light-emitting diodes from oxygen, moisture, and ultraviolet rays are being introduced into the device. For example, a sealing means is being considered in which an organic layer having barrier properties against gas and moisture and an inorganic layer with excellent mechanical properties are alternately laminated. In this case, the inorganic layer can be formed through a deposition method, and the organic layer can be formed using inkjet printing.

[0004] Meanwhile, with the recent development of thin-film and high-resolution technologies for organic light-emitting diodes, various causes of driving failure have been raised. One of these is the influx of external static electricity, which interferes with electrical signals and causes driving failure. To resolve this, it is important to lower the dielectric constant of the encapsulation layer to eliminate the driving failure problem.

[0005] However, the encapsulating material composition for manufacturing the encapsulating layer includes a polymer formed by the polymerization reaction of photocurable monomers, but there is a problem in that the curability and dielectric constant of the photocurable monomers are incompatible with each other. That is, when using a photocurable monomer with low dielectric constant characteristics, there is a problem that it does not cure well, and when using a photocurable monomer with excellent curability, there is a problem that the dielectric constant is high.

[0006] Therefore, it is necessary to provide a packaging material composition that satisfies both curability and dielectric constant. The problem to be solved

[0007] The embodiments of the present invention for solving the aforementioned problems aim to provide a light-emitting device comprising an encapsulation composition and an organic cured film formed by curing the encapsulation composition, wherein the composition is optimized for improving curability and dielectric constant, thereby preventing interference with electrical signals even when external static electricity is introduced into the light-emitting device, thus resolving driving failure problems and preventing capacitance disturbance. means of solving the problem

[0008] According to one embodiment of the present invention, a packaging material composition is provided comprising at least one polyfunctional monomer; and at least one monofunctional monomer, wherein the polyfunctional monomer is represented by the following chemical formula 1.

[0009] [Chemical Formula 1]

[0010]

[0011] In the above chemical formula 1, X is hydrogen (H) or a methyl group, and

[0012] M1 can be expressed by the following chemical formula 2.

[0013] [Chemical Formula 2]

[0014]

[0015] In the above chemical formula 2, R 11is a hydrocarbon group having C3 to C64 carbon atoms, and the above R 11 comprises at least one of a linear structural part and an annular structural part, and R 12 is hydrogen (H); or a hydrocarbon group having C1 to C32 carbon atoms, wherein the hydrocarbon terminal is substituted with either an acrylate group or a methacrylate group, or is not substituted, and R 13 It may include a structure in which hydrogen (H); or a hydrocarbon group having C1 to C32 carbon atoms, wherein the hydrocarbon terminal is substituted with either an acrylate group or a methacrylate group, or is not substituted.

[0016] M2 can be expressed by the following chemical formula 3.

[0017] [Chemical Formula 3]

[0018]

[0019] In the above chemical formula 3, R 14 is a linear alkylene group having C1 to C4 carbon atoms, and R 15 is hydrogen (H) or an alkyl group having C1 to C32 carbon atoms, and R 16 The hydrogen (H) may be a C1 to C32 alkyl group.

[0020] According to one embodiment of the present invention, the R 11 , above R 12 , above R 13 , above R 14 , above R 15 and the above R 16 The sum of the carbon atoms can be 22 or more.

[0021] According to one embodiment of the present invention, the R 11 The above R on either of the two adjacent carbons included in 12 is bonded, and the above R is attached to another carbon.13 This can be combined.

[0022] According to one embodiment of the present invention, the R 11 It includes a ring-shaped structural part, and the R in the ring-shaped structural part 12 and the above R 13 This can be combined.

[0023] According to one embodiment of the present invention, the R 14 The above R on either of the two adjacent carbons included in 15 is bonded, and the above R is attached to another carbon. 16 This can be combined.

[0024] According to one embodiment of the present invention, the R 13 silver It includes a main chain and a side chain, wherein the main chain is linear, and the R 11 It can bond with any one carbon of, and the side chain is R 11 It is bonded to a carbon adjacent to one of the carbons of the main chain bonded to it, and the end may be substituted with either an acrylate group or a methacrylate group.

[0025] According to one embodiment of the present invention, the compound according to Formula 1 may include at least one of the compounds represented by Formulas 4 to 15 below.

[0026] [Chemical Formula 4]

[0027]

[0028] [Chemical Formula 5]

[0029]

[0030] [Chemical Formula 6]

[0031]

[0032] [Chemical Formula 7]

[0033]

[0034] [Chemical Formula 8]

[0035]

[0036] [Chemical Formula 9]

[0037]

[0038] [Chemical Formula 10]

[0039]

[0040] [Chemical Formula 11]

[0041]

[0042] [Chemical Formula 12]

[0043]

[0044] [Chemical Formula 13]

[0045]

[0046] [Chemical Formula 14]

[0047]

[0048] [Chemical Formula 15]

[0049]

[0050] According to one embodiment of the present invention, the monofunctional monomer can be represented by the following chemical formula 16.

[0051] [Chemical Formula 16]

[0052]

[0053] In the above chemical formula 16, X can be hydrogen (H) or a methyl group, and R 31 is a hydrocarbon group having C1 to C64 carbon atoms, and R 31 It may include at least one of a linear structural part and a ring-shaped structural part.

[0054] According to one embodiment of the present invention, the R 31 It can be expressed by the following chemical formula 17.

[0055] [Chemical Formula 17]

[0056]

[0057] In the above chemical formula 17, n can be an integer from 1 to 30, and m can be an integer from 1 to 30.

[0058] According to one embodiment of the present invention, the compound according to Formula 16 may include at least one of the compounds represented by Formulas 18 to 20 below.

[0059] [Chemical Formula 18]

[0060]

[0061] [Chemical Formula 19]

[0062]

[0063] [Chemical Formula 20]

[0064]

[0065] According to one embodiment of the present invention, the weight ratio of the polyfunctional monomer to the monofunctional monomer may be 5 to 95:95 to 5.

[0066] A packaging material composition according to one embodiment of the present invention may have a liquid phase dielectric constant of 4.20 or less at 25°C.

[0067] A packaging material composition according to one embodiment of the present invention may have a solid-phase dielectric constant of 2.90 or less upon curing.

[0068] A packaging material composition according to one embodiment of the present invention may have a viscosity of 1 to 50 cPs at 25°C.

[0069] According to another embodiment of the present invention, a light-emitting element is provided having one or more surfaces formed by curing of the aforementioned encapsulating composition, an organic film. Effects of the invention

[0070] The encapsulation material composition according to the embodiments of the present invention exhibits a low dielectric constant, thereby resolving the problem where external static electricity is introduced into the substrate during thin film formation and high resolution, interfering with electrical signals and affecting operation.

[0071] In addition, the encapsulation material composition according to the embodiments of the present invention exhibits a low dielectric constant, so capacitance disturbance can be prevented.

[0072] In addition, the encapsulation material composition according to the embodiments of the present invention has secured curing characteristics known as properties incompatible with dielectric constant while having a low dielectric constant, and provides improved storage stability and jetting spreadability, thereby enabling use in inkjet processes and having the effect of improving reliability stability and lifespan characteristics regarding the properties of light-emitting devices.

[0073] In addition, the encapsulating composition according to the embodiments of the present invention has the effect of providing encapsulating material characteristics even without additionally forming an encapsulating film. Brief explanation of the drawing

[0074] FIG. 1 is a cross-sectional view of a part of a display device including a light-emitting element according to another embodiment of the present invention. Specific details for implementing the invention

[0075] Embodiments of the present invention are described in detail below. However, the embodiments described below are presented for illustrative purposes only to aid in a clear understanding of the present invention and do not limit the scope of the present invention.

[0076] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and therefore the present invention is not limited to the matters shown in the drawings. Throughout the specification, identical components may be referred to by the same reference numerals. In describing the present invention, if it is determined that a detailed description of related known technology may unnecessarily obscure the essence of the present invention, such detailed description is omitted.

[0077] Where terms such as "includes," "has," or "consists of" are used in this specification, other parts may be added unless the expression "only" is used. Where a component is expressed in the singular, it includes the plural unless specifically stated otherwise. Furthermore, in interpreting a component, it is interpreted to include a margin of error even without separate explicit description.

[0078] In the case of describing a positional relationship, for example, when the positional relationship between two parts is described using expressions such as 'on,' 'upper,' 'lower,' or 'next to,' one or more other parts may be located between the two parts unless expressions such as 'immediately' or 'directly' are used.

[0079] Spatially relative terms such as "below" or "beneath," "lower," "above," and "upper" may be used to facilitate the description of the relationship between one element or component and another, as illustrated in the drawings. Spatially relative terms should be understood as terms that include different orientations of the element during use or operation, in addition to the orientations illustrated in the drawings. For example, if an element illustrated in the drawings is flipped, the element described as "below" or "beneath" of another element may be placed "above" of that other element. Therefore, the exemplary term "below" may include both the lower and upper directions. Similarly, the exemplary terms "above" or "upper" may include both the upper and lower directions.

[0080] In the case of an explanation of a temporal relationship, for example, when the temporal sequence is explained using expressions such as 'after', 'following', 'next', or 'before', it may include cases where the sequence is not continuous unless expressions such as 'immediately' or 'directly' are used.

[0081] Although terms such as "first," "second," etc. are used to describe various components, these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of the present invention.

[0082] The term “at least one” should be understood to include all combinations that can be presented from one or more related items. For example, the meaning of “at least one of the first item, the second item, and the third item” may mean not only the first item, the second item, or the third item individually, but also all combinations of items that can be presented from two or more of the first item, the second item, and the third item.

[0083] The features of each of the various embodiments of the present invention may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0084] Before describing the present invention in detail below, it should be understood that the terms used in this specification are intended only to describe specific embodiments and are not limited solely to the appended claims. Unless otherwise stated, all technical and scientific terms used in this specification have the same meaning as generally understood by those skilled in the art.

[0085] Furthermore, in interpreting the terms and words used in the following specification and claims, based on the principle that the inventor may appropriately define the concept of the terms to best describe his invention, they should not be interpreted strictly in their ordinary or dictionary meanings, but rather in the meaning and concept consistent with the technical spirit of the invention as described in this specification.

[0086] According to one embodiment of the present invention, the present invention relates to an encapsulating composition capable of being printed on a substrate and photocured. Specifically, the encapsulating composition relates to an organic composition capable of forming an organic film of the encapsulating material.

[0087] In this specification, "printing" may mean various coatings including printing and inkjetting.

[0088] An encapsulation material comprising a cured product of the above organic composition can be placed on an organic light-emitting device to inhibit or prevent the organic layer of the organic light-emitting device from being damaged by physical impact or by external penetrating substances such as oxygen or moisture.

[0089] In addition, the encapsulation material composition according to one embodiment of the present invention is configured to effectively prevent the inflow of static electricity, which acts as an electrical signal interference factor, in addition to the inherent light-emitting element protection function of the encapsulation material.

[0090] In the present invention, the encapsulant composition may be a solvent-free photocurable composition. That is, the composition used to form the organic cured film for the encapsulant described below may be a solvent-free composition containing a photocurable component.

[0091] In this specification, "solvent-free composition" means that the composition does not contain a solvent, such as an organic solvent or an aqueous solvent.

[0092] In this specification, "photocurable composition" means a composition that can be cured by radical polymerization upon light irradiation. Photocuring may be performed by irradiation of electromagnetic waves, such as microwaves, infrared rays, ultraviolet rays, and gamma rays, for example, or particle beams, such as electron beams, alpha-particle beams, proton beams, and neutron beams.

[0093] Although specific photocuring conditions are not particularly limited, for example, if photocuring is performed by ultraviolet light, the wavelength may be within a range including the near-ultraviolet region of 290 to 400 nm. The light intensity during the total time of ultraviolet irradiation is 400 mW / cm². 2 Below, more specifically, 100 to 400 mW / cm² 2 It may be in the range, and the light intensity is 300 to 2500 mJ / cm² 2 , more specifically, 500 to 1500 mJ / cm² 2 It can be a range.

[0094] Compared to solvent-based compositions, using a solvent-free composition allows for the omission of the solvent drying process, thereby improving process efficiency and resolving the disadvantages of bubble generation caused by the solvent and the resulting degradation of the encapsulating material's function.

[0095] In addition, the solvent-free composition can reduce the inherent moisture content within the encapsulation material composition, which has the advantage of being suitable for organic light-emitting diodes that are vulnerable to moisture.

[0096] In addition, the above composition may be a composition applied onto a substrate by inkjet printing. Typically, inkjet printing is advantageous for mass production, etc., as it uses a multi-head connecting multiple nozzles. The above composition is configured to satisfy the viscosity and surface energy (surface tension) described below so that it can be applied to inkjet printing.

[0097] The above composition may include a compound having a photocurable functional group to enable photocuring. Specifically, the above composition may be provided as a composition with a lower dielectric constant by including a polyfunctional monomer.

[0098] As used in this specification, the term "dielectric constant" refers to the liquid-phase dielectric constant unless otherwise specified. Specific measurement methods are disclosed in the experimental examples described below.

[0099] In order to lower the dielectric constant, a monomer with low polarity must be used. However, even if a monomer with low polarity has a low dielectric constant, there is often only one functional group that generates radicals during photocuring, so the dielectric constant and the curing characteristics are incompatible, such as when a cured film is not formed even after photocuring.

[0100] Therefore, when a monomer capable of compensating for insufficient curing characteristics is used in combination, for example, a monomer having a high dielectric constant but sufficient functional groups that generate radicals during photocuring and capable of forming a desired cured film during photocuring, it is possible to provide a packaging material composition having excellent storage stability and sufficient jetting spreadability while significantly lowering the dielectric constant by more than 20% compared to conventional methods.

[0101] According to one embodiment of the present invention, a packaging material composition can be prepared using at least one polyfunctional monomer and at least one monofunctional monomer.

[0102] A packaging material composition according to one embodiment of the present invention may include at least one polyfunctional monomer and at least one monofunctional monomer, and the polyfunctional monomer may be represented by the following chemical formula 1.

[0103] [Chemical Formula 1]

[0104]

[0105] In the above chemical formula 1, X can be hydrogen (H) or a methyl group.

[0106] According to the above chemical formula 1, the polyfunctional monomer may have an acrylate group or a (meth)acrylate group as a photocurable functional group.

[0107] According to one embodiment of the present invention, M1 can be represented by the following chemical formula 2.

[0108] [Chemical Formula 2]

[0109]

[0110] In the above Chemical Formula 2, * indicates a bonding position. In the above Chemical Formula 2, R 11 can be a hydrocarbon group with 3 to 64 carbon atoms, and R 11 It may include at least one of a linear structural part and an annular structural part. More specifically, R 11 The carbon number can be C8 to C32.

[0111] In the present invention, the linear structure portion means that at least a part of the overall structure comprises a structure in which the structure is linear, and the annular structure portion means that at least a part of the overall structure comprises a structure in which the structure is annular.

[0112] Therefore, if a linear structural part is included, the entire structure may be a linear structure, or a partial structure may be a linear structure. Additionally, if a ring-shaped structural part is included, the entire structure may be a ring-shaped structure, or a partial structure may be a ring-shaped structure. Here, the ring-shaped structure may include a singular ring or a plurality of rings.

[0113] R 12 It may include a structure in which hydrogen (H); or a hydrocarbon group having C1 to C32 carbon atoms, wherein the hydrocarbon terminal is substituted with either an acrylate group or a methacrylate group, or is not substituted. More specifically, R 12It may be a linear alkyl group having C5 to C15 carbon atoms.

[0114] R 13 It may include a structure in which hydrogen (H); or a hydrocarbon group having C1 to C32 carbon atoms, wherein the hydrocarbon terminal is substituted with either an acrylate group or a methacrylate group, or is not substituted. More specifically, R 13 It can be a linear alkyl group having C5 to C27 carbon atoms.

[0115] According to one embodiment of the present invention, M2 can be represented by the following chemical formula 3.

[0116] [Chemical Formula 3]

[0117]

[0118] In the above Chemical Formula 3, * indicates a bonding position. In the above Chemical Formula 3, R 14 It may be a linear alkylene group having C1 to C4 carbon atoms.

[0119] R 15 ≠ hydrogen (H) or an alkyl group having C1 to C32 carbon atoms. More specifically, R 13 It can be a linear alkyl group having C5 to C15 carbon atoms.

[0120] R 16 ≠ hydrogen (H) or an alkyl group having C1 to C32 carbon atoms. More specifically, R 13 It can be a linear alkyl group having C5 to C15 carbon atoms.

[0121] According to one embodiment of the present invention, for example, R 11 , R 12 , R 13 , R 14 , R 15 and R 16 The sum of the carbon atoms can be 22 or more.

[0122] According to one embodiment of the present invention, for example, R 11 and R 14 The sum of the carbon atoms can be 22 or more.

[0123] According to one embodiment of the present invention, R 11 It may include a ring-shaped structural portion, and the ring-shaped structural portion may include at least one cycloaliphatic ring.

[0124] According to one embodiment of the present invention, R 11 It may include a ring-shaped structural portion, and the ring-shaped structural portion may include at least one aromatic ring.

[0125] Generally, polyfunctional monomers with a simple linear structure exhibit a solid form at room temperature when the number of carbon atoms is C14 or higher. Therefore, when preparing a packaging material composition using these monomers, the use of a solvent may be required.

[0126] Meanwhile, even if a polyfunctional monomer with a simple linear structure and C14 or more carbon atoms exhibits a liquid form at room temperature, the encapsulation composition prepared using it may lack storage stability.

[0127] On the other hand, the polyfunctional monomer according to one embodiment of the present invention has a linear R 11 Even if the main chain has a linear structure including R 11 R combined with 12 and R 13 At least one of them may be a hydrocarbon group having C1 to C32 carbon atoms. In addition, R 11 R forming the main chain together with 14 R combined with 15 and R 16 At least one of them may be an alkyl group having C1 to C32 carbon atoms.

[0128] In this case, since the polyfunctional monomer has a chain structure containing branched chains within a linear main chain rather than a simple linear structure, it appears in a liquid form at room temperature. Therefore, when preparing a packaging material composition using a chain-structured polyfunctional monomer, solvents may not be required, and the preparation of the packaging material composition may be easy.

[0129] According to one embodiment of the present invention, the polyfunctional monomer is R 11 R on one of the carbons 12 is combined, and R 12 R combined with 11 R on a carbon adjacent to any one of the carbons 13 This combined R 11 It may include.

[0130] More specifically, R of the polyfunctional monomer 11 R on either of the two adjacent carbons included in 12 is bonded, and R is attached to the other carbon. 13 This can be combined.

[0131] In the present invention, "two adjacent carbons" refers to carbons that form a bond with each other.

[0132] According to one embodiment of the present invention, R of a polyfunctional monomer 11 R on either of the two adjacent carbons included in 12 is bonded, and R is attached to the other carbon. 13 When combined, the polyfunctional monomer contains a large number of carbon atoms. Therefore, a packaging material composition prepared using this can have a low dielectric constant, and the solution stability of the packaging material composition can be improved.

[0133] According to one embodiment of the present invention, R of a polyfunctional monomer 11 It may include a ring-shaped structural part, and R 11 R in the ring-shaped structural part that includes this 12 and R 13 This can be combined.

[0134] According to one embodiment of the present invention, R of a polyfunctional monomer 11 When this ring-shaped structural portion is included, the encapsulant composition manufactured using it can minimize the increase in dielectric constant, and the film strength of the organic cured film for encapsulant formed by the curing of the encapsulant composition can be improved.

[0135] According to one embodiment of the present invention, R of a polyfunctional monomer 11 R in the ring-shaped structural part that includes this 12 and R 13 When combined, the solution stability of a packaging material composition prepared using a polyfunctional monomer containing this can be improved.

[0136] According to one embodiment of the present invention, the polyfunctional monomer is R 14 R on one of the carbons 15 is combined, and R 15 R combined with 14 R on a carbon adjacent to any one of the carbons 16 This combined R 14 It may include.

[0137] More specifically, R of the polyfunctional monomer 14 R on either of the two adjacent carbons included in 15 is bonded, and R is attached to the other carbon. 16 This can be combined.

[0138] According to one embodiment of the present invention, R of a polyfunctional monomer 14 R on either of the two adjacent carbons included in 15 is bonded, and R is attached to the other carbon. 16 When combined, the polyfunctional monomer contains a large number of carbon atoms. Therefore, the encapsulation material composition manufactured using this can have a reduced dielectric constant and improved solution stability.

[0139] According to one embodiment of the present invention, R 13 silver It may include a main chain and side chains. The main chain is linear, and R 11 It can bond to any one of the carbons. The side chain is R 11 It is bonded to a carbon adjacent to one of the carbons of the main chain bonded to it, and the end may be substituted with either an acrylate group or a methacrylate group.

[0140] According to one embodiment of the present invention, the polyfunctional monomer may have two or more photocurable functional groups. When using the polyfunctional monomer, the curing speed can be secured quickly, which can shorten the curing time and may be advantageous for securing the physical properties required for organic cured films for encapsulation materials.

[0141] According to one embodiment of the present invention, a compound according to Formula 1 may include at least one of the compounds represented by Formulas 4 to 15 below.

[0142] [Chemical Formula 4]

[0143]

[0144] [Chemical Formula 5]

[0145]

[0146] [Chemical Formula 6]

[0147]

[0148] [Chemical Formula 7]

[0149]

[0150] [Chemical Formula 8]

[0151]

[0152] [Chemical Formula 9]

[0153]

[0154] [Chemical Formula 10]

[0155]

[0156] [Chemical Formula 11]

[0157]

[0158] [Chemical Formula 12]

[0159]

[0160] [Chemical Formula 13]

[0161]

[0162] [Chemical Formula 14]

[0163]

[0164] [Chemical Formula 15]

[0165]

[0166] According to the above chemical formula 1, the polyfunctional monomer may have at least two acrylate groups or (meth)acrylate groups as photocurable functional groups.

[0167] According to one embodiment of the present invention, when a polyfunctional monomer has the structure of Formula 1, it may have a bulky structure. A polyfunctional monomer with a bulky structure can lower the dielectric constant of the encapsulant composition.

[0168] According to one embodiment of the present invention, two or more types of polyfunctional monomers may be used to appropriately control the dielectric constant of the encapsulating material composition.

[0169] According to one embodiment of the present invention, when a polyfunctional monomer is used together with a monofunctional monomer as a packaging material composition, a packaging material composition with excellent curability can be provided. For example, a polyfunctional monomer having the structure of Formula 13 and a monofunctional monomer having the structure of Formula 18 below may be used together.

[0170] When a polyfunctional monomer includes the structure described above, the problem of compatibility between curing and dielectric constant can be resolved, and at the same time, the dielectric constant measured in the composition can be lowered by more than 20% compared to conventional methods, and excellent jetting spreadability and solid-phase permeability can be provided.

[0171] According to one embodiment of the present invention, the polyfunctional monomer may be in a liquid state at room temperature. When the polyfunctional monomer is in a liquid state at room temperature, the storage stability of the encapsulant composition is good.

[0172] According to one embodiment of the present invention, the monofunctional monomer may include a compound represented by the following chemical formula 16.

[0173] [Chemical Formula 16]

[0174]

[0175] In the above chemical formula 16, X is hydrogen (H) or a methyl group, and R 31 The carbon group may be a hydrocarbon group having C1 to C64 carbon atoms, and may include at least one of a linear structure portion and a cyclic structure portion.

[0176] According to the above chemical formula 16, the monofunctional monomer may have an acrylate group or a (meth)acrylate group as a photocurable functional group.

[0177] According to one embodiment of the present invention, R 31 It can be expressed by the following chemical formula 17.

[0178] [Chemical Formula 17]

[0179]

[0180] In Chemical Formula 17, n can be an integer from 1 to 30, and m can be an integer from 1 to 30. More specifically, in Chemical Formula 17, n can be an integer from 2 to 12, and m can be an integer from 4 to 16.

[0181] According to one embodiment of the present invention, R 31 It may include a ring-shaped structural portion. The ring-shaped structural portion is C3 to C20 and may include at least one cycloaliphatic ring.

[0182] According to one embodiment of the present invention, R 31It may include a cyclic structure portion. The cyclic structure has a carbon number of C5 to C18 and may include at least one aromatic ring.

[0183] According to one embodiment of the present invention, the compound according to Formula 16 may include at least one of the compounds represented by Formulas 18 to 20 below.

[0184] [Chemical Formula 18]

[0185]

[0186] [Chemical Formula 19]

[0187]

[0188] [Chemical Formula 20]

[0189]

[0190] According to one embodiment of the present invention, the weight ratio of a polyfunctional monomer to a monofunctional monomer may be 5 to 95:95 to 5. More specifically, the weight ratio of a polyfunctional monomer to a monofunctional monomer may be 20 to 80:80 to 20, and may be 40 to 60:60 to 40.

[0191] When the weight ratio of polyfunctional monomers to monofunctional monomers is 5 to 95:95 to 5, the dielectric constant of the encapsulating material composition can be reduced to a predetermined range while having excellent storage stability and jetting spreadability. In addition, even if external static electricity is introduced into a thin-film, high-resolution light-emitting device, the touch performance does not deteriorate, and the viscosity range of 1 to 50 cPs, which is suitable for use as an encapsulating material composition, can be satisfied.

[0192] According to one embodiment of the present invention, the encapsulation material composition may further include an initiator. The initiator may provide radicals to the acrylic terminals of each monomer that absorb light energy from the outside and photocur the monomer compound.

[0193] For example, an initiator may use a material comprising a backbone containing heteroatoms within the molecule and providing radicals, and a carbonyl linkage connected to the backbone by at least one aryl terminal group.

[0194] As a specific example, the above initiator may have a skeletal structure represented by either Chemical Formula 21 or 22 below. However, the present invention is not limited thereto, and any material that can generally be used as a photocuring initiator may be used.

[0195] [Chemical Formula 21]

[0196]

[0197] [Chemical Formula 22]

[0198]

[0199] In addition, the photocuring effect can be improved by using a material that has an absorption wavelength of 500 nm or less, more specifically in the range of 380 to 410 nm.

[0200] Specific examples include hydroxyketone series compounds such as 1-hydroxycyclohexylphenyl ketone (Irgacure 184), aminoketone series compounds such as 2-benzyl-2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl]-1-butanone (Irgacure 369) and alpha-aminoacetophenone (Irgacure 907), benzyldimethylketal series compounds such as benzyldimethylketal (Irgacure-651), bis-acyl phosphine series compounds such as phenyl bis(2,4,6-trimethylbenzoyl) (Irgacure 819), and mono-acyl phosphine series compounds such as 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO). there is.

[0201] In addition, it may include one or more additives selected from the group consisting of heat stabilizers, UV stabilizers, and antioxidants, and various other types of additives may be used.

[0202] According to one embodiment of the present invention, the initiator may be 10 parts by weight or less, more specifically 0.1 to 10 parts by weight, based on 100 parts by weight of the total monomer. Within this range, when light energy is introduced from the outside into the encapsulating composition, radicals suitable for forming a film can be appropriately supplied to the acrylic terminals of each of the polyfunctional monomer and monofunctional monomer constituting the encapsulating composition.

[0203] In this case, the light energy is, for example, when the light intensity is 400 mW / cm² 2 Specifically, 100 to 400 mW / cm² 2 , more specifically, 200 to 400 mW / cm² 2 It may be provided from a laser or plasma. However, it is not limited thereto.

[0204] According to one embodiment of the present invention, within a range that does not adversely affect the encapsulation material composition, additionally may include a surfactant, an adhesion aid to enhance adhesion with a substrate, a stabilizer, an adhesion promoter, a curing promoter, a thermal polymerization inhibitor, a dispersant, a plasticizer, a filler, an antifoaming agent, etc.

[0205] These additives may be used in an amount of 0.001 to 10 weight percent relative to the total weight of the encapsulation material composition. In this case, if the amount falls outside the above range, the permeability, heat resistance, adhesion to the inorganic barrier layer, and jetting stability of the cured film may be poor.

[0206] At this time, the surfactant can improve coating properties, antifoaming properties, leveling properties, etc. Examples of fluorine-based surfactants include BM-1000, BM-1100, Megapak F142D, Megapak F172, Megapak F173, Megapak F183, Florad FC-135, Florad FC-170C, Florad FC-430, Florad FC-431, Saffron S-112, Saffron S-113, Saffron S-131, Saffron S-141, Saffron S-145, SH-28PA, SH-190, SH-193, SZ-6032, and SF-8428.

[0207] In addition, silane coupling agents having reactive substituents such as carboxyl groups, methacryloyl groups, isocyanate groups, and epoxy groups can be used as adhesion aids. Specific examples include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane.

[0208] According to one embodiment of the present invention, the encapsulation material composition may not include silicon-derived units. If silicon-derived units are included, siloxane-based outgas may be generated under high temperature conditions, potentially damaging the light-emitting element.

[0209] According to one embodiment of the present invention, the encapsulation material composition may be a composition that satisfies a moisture content of 20 ppm or less before curing. Since conventional light-emitting devices are susceptible to moisture, if necessary, the moisture content before curing can be controlled to 20 ppm or less through a moisture removal process.

[0210] In relation to the inkjet process, the encapsulant composition may have a viscosity suitable for the inkjet process, for example, a viscosity measured by a Brookfield viscometer at 25°C of 1 to 50 cPs.

[0211] When the viscosity of the encapsulant composition is 1 to 50 cPs under room temperature conditions, both printing performance and curing performance can be improved. For reference, if the viscosity is too high, it is difficult to eject from the inkjet nozzle, and if the viscosity is too low, flowability increases, making it difficult to form a film of appropriate thickness.

[0212] According to one embodiment of the present invention, the surface tension of the encapsulating material composition was measured to verify the surface energy of the encapsulating material composition.

[0213] According to one embodiment of the present invention, the encapsulating material composition may have a surface energy (surface tension) within the range of 20 to 50 mN / m to facilitate ejection from an inkjet head. Within this range, ink characteristics that allow for smooth ejection from an inkjet device may be provided. For reference, if the surface energy (surface tension) of the ink is high, a phenomenon of ink droplet scattering occurs, and if the surface energy (surface tension) is low, the spreadability or dispersibility of the solution may increase upon collision with a substrate.

[0214] The above surface energy (surface tension) can be measured by various known methods. For example, it can be measured by the Ring Method at 25°C.

[0215] According to one embodiment of the present invention, the encapsulating material composition may have a liquid phase dielectric constant of 4.20 or less measured at 25°C. More specifically, the encapsulating material composition may have a liquid phase dielectric constant of 3.20 to 4.00 measured at 25°C. Under the above conditions, the encapsulating material composition having a liquid phase dielectric constant of 4.20 or less does not cause driving failure in the light-emitting element even if external static electricity is introduced into the coating film, and can effectively protect the coating film from oxygen, moisture, and ultraviolet rays without additionally providing an encapsulating material.

[0216] The liquid phase dielectric constant of conventionally mass-produced compositions is in the range of approximately 4.60 to 6.20, which has unsuitable aspects such as the occurrence of parasitic capacitance between electrodes or insufficient prevention of capacitance disturbance. However, the encapsulating material composition formed with the above configuration can have a dielectric constant of 4.20 or less, more specifically, in the range of 3.20 to 4.00. However, since lowering the dielectric constant is advantageous for preventing capacitance disturbance, the lower limit is not specifically restricted.

[0217] The liquid phase dielectric constant of a packaging material composition according to one embodiment of the present invention can be measured using a Dielectric Constant Meter model 871, for example, under conditions of 25°C and a frequency of 10 kHz.

[0218] A packaging material composition according to one embodiment of the present invention has a degree of curing of 95% or more when cured at 1000 mJ under a wavelength of 395 nm and an N2 atmosphere, making it suitable for forming an organic packaging layer of a light-emitting device.

[0219] Since the encapsulation material composition according to one embodiment of the present invention has optical properties of 95% or more as measured using a UV-Vis spectrometer, when applied as an organic encapsulation layer of a light-emitting device, it can improve the physical properties of the light-emitting device and the light-emitting properties.

[0220] According to one embodiment of the present invention, the light intensity of the encapsulation material composition is 400 mW / cm² 2 A method for photopolymerizing a compound containing an ethylene-based unsaturated double bond is provided, comprising the step of irradiating a laser or plasma with light, wherein the surface hardness is increased by the action of radicals generated by the light irradiation.

[0221] A packaging material composition according to one embodiment of the present invention may be cured into an organic film state, and the solid-state dielectric constant measured in the cured film may be 2.90 or less. When a packaging material composition having a solid-state dielectric constant of 2.90 or less is applied to an organic light-emitting device, the light-emitting device can be protected from external static electricity, thereby preventing or suppressing driving failure of the light-emitting device.

[0222] The solid dielectric constant of a packaging material composition according to one embodiment of the present invention can be measured after curing into an organic film state, for example, using a Precision Impedance Analyzer under conditions of 25°C and a frequency of 100 kHz.

[0223] According to one embodiment of the present invention, the encapsulating material composition has a wavelength range of 290 to 400 nm and a light intensity of 100 to 400 mW / cm² 2 , light intensity 300 to 2500 mJ / cm² 2 Under these conditions, it can be UV cured.

[0224] A packaging material composition according to one embodiment of the present invention exists in a liquid form at room temperature and can have excellent storage stability.

[0225] A packaging material composition according to one embodiment of the present invention can be applied to an organic film (592) of a thin film packaging material (590).

[0226] According to another embodiment of the present invention, a light-emitting element (570) is provided that includes at least one organic film (592) formed by curing of a packaging material composition.

[0227] FIG. 1 is a cross-sectional view of a part of a display device (100) including a light-emitting element (570) according to another embodiment of the present invention.

[0228] Referring to FIG. 1, a display device (100) includes a substrate (510), a thin-film transistor (TFT) on the substrate (510), and a light-emitting element (570) connected to the thin-film transistor (TFT). The light-emitting element (570) includes a first electrode (571), an organic light-emitting layer (572) on the first electrode (571), and a second electrode (573) on the organic light-emitting layer (572). The display device (100) disclosed in FIG. 1 is an organic light-emitting display device including a light-emitting element (570) according to another embodiment of the present invention.

[0229] The substrate (510) may be made of glass or plastic. Specifically, the substrate (510) may be made of plastic such as a polyimide resin or a polyimide film. Although not illustrated, a buffer layer may be disposed on the substrate (510).

[0230] A thin-film transistor (TFT) is disposed on a substrate (510). The thin-film transistor (TFT) includes a semiconductor layer (520), a gate electrode (530) spaced apart from the semiconductor layer (520) and overlapping with at least a portion of the semiconductor layer (520), a source electrode (541) connected to the semiconductor layer (520), and a drain electrode (542) spaced apart from the source electrode (541) and connected to the semiconductor layer (520).

[0231] Referring to FIG. 1, a gate insulating film (535) is disposed between the gate electrode (530) and the semiconductor layer (520). An interlayer insulating film (551) is disposed on the gate electrode (530), and a source electrode (541) and a source electrode (541) can be disposed on the interlayer insulating film (551).

[0232] A flattening film (552) is placed on a thin film transistor (TFT) to flatten the top of the thin film transistor (TFT).

[0233] The first electrode (571) can be placed on the planarization film (552). The first electrode (571) is connected to a thin-film transistor (TFT) through a contact hole provided in the planarization film (552).

[0234] The bank layer (580) is disposed on a part of the first electrode (571) and on the planarization film (552) to define a pixel area or a light-emitting area. For example, the bank layer (580) may be disposed in a matrix structure in the boundary area between a plurality of pixels, so that the pixel area can be defined by the bank layer (580).

[0235] The organic light-emitting layer (572) is disposed on the first electrode (571). The organic light-emitting layer (572) may also be disposed on the bank layer (580). The organic light-emitting layer (572) may include a single light-emitting layer or two or more light-emitting layers stacked vertically. Light having any one of red, green, and blue colors may be emitted from the organic light-emitting layer (572), and white light may also be emitted.

[0236] The second electrode (573) is placed on the organic light-emitting layer (572).

[0237] A first electrode (571), an organic light-emitting layer (572), and a second electrode (573) can be stacked to form a light-emitting element (570).

[0238] Although not illustrated, when the organic light-emitting layer (572) emits white light, individual pixels may include a color filter for filtering the white light emitted from the organic light-emitting layer (572) by wavelength. The color filter is formed on the path of the light.

[0239] A sealing material (590) may be disposed on the second electrode (573). The sealing material (590) may be composed of a multilayer thin film. A sealing material (590) composed of a multilayer thin film is also referred to as a thin film sealing layer. Referring to FIG. 1, the sealing material (590) may include at least one organic film (592) and at least one inorganic film (591, 593). At least one organic film (592) and at least one inorganic film (591, 593) may be disposed alternately.

[0240] The encapsulating material (590) covers the display area of ​​the display device (100) and may extend to the outside of the display area. The encapsulating material (590) may include a first inorganic film (591), an organic film (592), and a second inorganic film (593).

[0241] The first inorganic film (591) covers the second electrode (573). The first inorganic film (591) may include at least one of ceramic, metal oxide, metal nitride, metal carbide, metal oxynitride, silicon oxide, silicon nitride, and silicon oxynitride.

[0242] An organic film (592) is placed on the first inorganic film (591). The upper surface of the organic film (592) may be a flat surface. Specifically, the organic film (592) may be made such that the upper surface of the portion corresponding to the display area is approximately flat. The organic film (592) may comprise one or more materials selected from the group consisting of acrylic, methacrylic, polyester, polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane.

[0243] According to another embodiment of the present invention, the organic film (592) can be made by the encapsulating composition. More specifically, the organic film (592) can be made by the polymerization and curing of the encapsulating composition.

[0244] The second inorganic film (593) covers the organic film (592). The second inorganic film (593) may include at least one of ceramic, metal oxide, metal nitride, metal carbide, metal oxynitride, silicon oxide, silicon nitride, and silicon oxynitride.

[0245] According to another embodiment of the present invention, since the encapsulating material (590) has a multilayer structure including a first inorganic film (591), an organic film (592), and a second inorganic film (593), even if a crack occurs within the encapsulating material (590), such cracks can be prevented from connecting between the first inorganic film (591) and the organic film (592) or between the organic film (592) and the second inorganic film (593). This prevents or minimizes the formation of a path through which moisture or oxygen from the outside penetrates into the light-emitting element (570).

[0246] Referring to FIG. 1, a touch panel (110) may be placed on the packaging material (590). Additionally, a protective film or window, etc., may be placed on the packaging material (590).

[0247] A packaging material composition according to one embodiment of the present invention may be applied to printing inks and various resists.

[0248] The transmittance of the organic film (592) formed by the curing of the encapsulation material composition according to one embodiment of the present invention was measured using a UV-Vis spectrometer in accordance with ASTM D1003 and showed a value of 95% or higher, and it can be confirmed that the surface hardness shows a significantly improved curing difference compared to the existing one.

[0249] Non-limiting examples of the substrate of the above organic film (592) include a substrate for electronic components or one having a predetermined wiring pattern formed thereon. Examples of the above substrate include a glass or plastic substrate coated with silicon, silicon nitride, silicon oxide, titanium, tantalum, palladium, tungsten titanium, copper, chromium, aluminum, AlNd, ITO, IGZO, etc.

[0250] The present invention will be explained in more detail below through examples. These examples are intended to illustrate the present invention and do not limit the invention thereto.

[0251] <Manufacture of Bag Material Composition>

[0252] Compositions of examples and comparative examples with different contents as shown in Table 2 below were prepared using the photocurable monomers shown in Table 1 below. 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (TPO) was used as a polymerization initiator. The polymerization initiator was used in an amount of 3 parts by weight per 100 parts by weight of the total monomer.

[0253] Photocurable monomer Liquid phase dielectric constant (25℃) Viscosity (cps, 25℃) polyfunctional monomer A 3.37 131 B 3.30 148 C 4.88 113 D 4.48 20 E 3.45 139 F 3.55 145 monofunctional monomer G 3.36 6 H 3.14 12 Comparison Monomer I 5.65 2 J 7.86 450

[0254] Photocurable monomer A: Chemical formula 4

[0255] Photocurable monomer B: Chemical formula 15

[0256] Photocurable monomer C: Chemical formula 13

[0257] Photocurable monomer D: Chemical formula 14

[0258] Photocurable monomer E: Chemical formula 8

[0259] Photocurable monomer F: Chemical formula 10

[0260] Photocurable monomer G: Chemical formula 18

[0261] Photocurable monomer H: Chemical formula 19

[0262] Photocurable monomer I: 1,6-Hexanediol Dimethacrylate (HDDMA)

[0263] Photocurable monomer J: Bisphenol A (EO) 10 Dimethacrylate (BPA(EO) 10 DMA)

[0264] Monomer (weight%) A B C D E F G H I J Example 1 40 - - - - - 60 - - - Example 2 40 - - - - - - 60 - - Example 3 - 40 - - - - 60 - - - Example 4 - 40 - - - - - 60 - - Example 5 - - 40 - - - 60 - - - Example 6 - - 40 - - - - 60 - - Example 7 25 - 15 - - - 60 - - - Example 8 - - - 40 - - 60 - - - Example 9 - - - 40 - - - 60 - - Example 10 - - - - 40 - 60 - - - Example 11 - - - - 40 - - 60 - - Example 12 - - - - - 40 60 - - - Example 13 - - - - - 40 - 60 - - Comparative Example 1 - - - - - - - - 50 50

[0265] In Table 2, the above weight% refers to the weight% of each monomer relative to the total monomer.

[0267] Methods for Measuring Physical Properties

[0268] 1. Physical properties before curing

[0269] The physical properties of the encapsulation material compositions according to Examples 1 to 13 and Comparative Example 1, prepared according to Table 2 above, were measured before curing as follows.

[0270] (1) Liquid phase permittivity

[0271] The liquid phase dielectric constant of the packaging material compositions according to Examples 1 to 13 and Comparative Example 1 was measured at 25°C using a Dielectric Constant Meter model 871, at 10KHz, for each sample.

[0272] (2) Viscosity

[0273] The viscosity of the packaging material compositions according to Examples 1 to 13 and Comparative Example 1 was measured as follows.

[0274] Measurement Standard: Measured according to the method specified in ASTM D 2196

[0275] Measuring device: Brookfield DV2T model

[0276] Measurement Condition: Cone Plate Mode

[0277] Measured temperature: 25℃

[0278] Measurement method: 0.5 ml of the bag material composition was loaded, and the measurement was taken by setting the torque to 50%.

[0279] (3) Surface energy (surface tension)

[0280] The surface energy (surface tension) of the encapsulation material compositions according to Examples 1 to 13 and Comparative Example 1 was measured as follows.

[0281] Measurement Standard: Measured according to the method specified in ISO 304

[0282] Measuring device: KRUSS Tension Meter K9

[0283] Measurement Mode: O-Ring, Max Mode

[0284] Measured temperature: 25℃

[0285] Measurement method: Using a KRUSS Tension Meter K9, 20g of the polymerizable composition was applied to the O-ring, and the surface energy (surface tension) was measured in Max measurement mode.

[0286] 2. Physical properties after curing

[0287] The solid dielectric constant after curing of the encapsulation material compositions according to Examples 1 to 13 and Comparative Example 1, prepared according to Table 2 above, was measured as follows.

[0288] 1) Sample preparation

[0289] The solid dielectric constant samples were prepared by spin-coating each of the encapsulating material compositions according to Examples 1 to 13 and Comparative Example 1, prepared according to Tables 1 and 2, onto a Cr glass (Cr thickness 1600 Å) substrate and curing them (thickness 8.0 µm, exposure dose 1000 mJ / cm²). 2 ), Al (Al thickness 1000Å, Al size 3.0 x 3.0mm 2 ) was deposited on the organic cured film.

[0290] 2) Measurement method

[0291] The solid dielectric constant of the packaging material composition was measured using a Precision Impedance Analyzer at 25°C and 100 kHz.

[0292] <Physical Property Measurement Results>

[0293] Table 3 below shows the physical properties of the encapsulation material composition or cured product measured according to the above evaluation items.

[0294] Liquid permittivity High-phase permittivity viscosity Surface energy (surface tension) Example 1 3.36 2.39 19.60 32.30 Example 2 3.23 2.29 20.86 32.20 Example 3 3.34 2.37 21.98 32.30 Example 4 3.20 2.27 23.24 32.10 Example 5 3.97 2.82 17.08 32.90 Example 6 3.84 2.72 18.34 32.80 Example 7 3.59 2.55 18.66 32.50 Example 8 3.81 2.70 13.52 33.78 Example 9 3.68 2.61 15.22 33.64 Example 10 3.40 2.41 19.82 32.34 Example 11 3.26 2.32 20.11 32.40 Example 12 3.44 2.44 19.97 32.80 Example 13 3.30 2.35 20.18 32.98 Comparative Example 1 6.76 4.80 28.00 36.80

[0295] According to the results of Table 3 above, it can be confirmed that the dielectric constant of the encapsulating material composition according to Examples 1 to 13, which includes a composition appropriately blended considering the compatibility between curing characteristics and dielectric constant, is smaller than the dielectric constant of the encapsulating material composition according to Comparative Example 1, which includes a composition that is not blended or is improperly blended, or a monomer having a different structure. Specifically, Examples 1 to 13 show solid-state dielectric constant values ​​within the range of 2.27 to 2.82, whereas Comparative Example 1 showed a solid-state dielectric constant value of 4.80.

[0296] In addition, it can be confirmed that the encapsulation material composition according to Examples 1 to 13, which includes a composition appropriately blended considering the compatibility between curing characteristics and dielectric constant, has a solid dielectric constant reduced by up to 53% compared to Comparative Example 1.

[0297] The features, structures, effects, etc. exemplified in each of the aforementioned embodiments may be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments belong. Therefore, details regarding such combinations and modifications should be interpreted as being included within the scope of the present invention. Explanation of the symbols

[0298] 100: Display device 110: Touch panel 510: Substrate 520: Semiconductor layer 530: Gate electrode 541: Source electrode 542: Drain electrode 570: Light-emitting element 571: First electrode 572: Organic light-emitting layer 573: Second electrode 590: Encapsulant 591: 1st Inorganic Membrane 592: Organic Membrane 593: Second Weapon Barrier

Claims

Claim 1 Encapsulating material composition comprising at least one polyfunctional monomer; and at least one monofunctional monomer, wherein the composition does not contain a solvent, the polyfunctional monomer comprises at least one of compounds represented by the following chemical formulas 4 to 7, 9, 10, 12 and 15, wherein at 25°C, the composition has a viscosity of 1 to 50 cPs and a surface energy of 20 to 50 mN / m, and is suitable for inkjet processes: [Chemical Formula 4] [Chemical Formula 5] [Chemical Formula 6] [Chemical Formula 7] [Chemical Formula 9] [Chemical Formula 10] [Chemical Formula 12] [Chemical Formula 15] Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 delete Claim 8 In claim 1, the encapsulation composition comprising a compound represented by the following chemical formula 16, wherein the monofunctional monomer comprises: [Chemical Formula 16] In the above chemical formula 16, X is hydrogen (H) or a methyl group, and R 31 is a hydrocarbon group having C1 to C64 carbon atoms, and the above R 31 It includes at least one of a linear structural part and an annular structural part. Claim 9 In paragraph 8, the above R 31 Encapsulation composition represented by the following chemical formula 17: [Chemical Formula 17] In the above chemical formula 17, n is an integer from 1 to 30, and m is an integer from 1 to 30. Claim 10 In claim 8, the encapsulating composition comprising at least one of the compounds represented by the following chemical formulas 18 to 20, wherein the compound according to chemical formula 16 comprises: [Chemical formula 18] [Chemical Formula 19] [Chemical Formula 20] Claim 11 A packaging material composition according to claim 1, wherein the weight ratio of the polyfunctional monomer to the monofunctional monomer is 5 to 95:95 to 5. Claim 12 A packaging material composition according to claim 1, wherein the liquid phase dielectric constant is 4.20 or less at 25℃. Claim 13 A packaging material composition according to claim 1, wherein the solid-phase dielectric constant after curing is 2.90 or less. Claim 14 delete Claim 15 A light-emitting device comprising at least one organic film formed by curing a packaging material composition according to any one of claims 1 and 8 to 13.

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