Lighting device and semiconductor detection equipment

Abstract

The present application belongs to the field of semiconductor device detection technology, and in particular relates to a lighting device and a semiconductor detection device. The lighting device is used in a semiconductor detection device and comprises a light-emitting device and a first optical path module; at least a portion of the light-emitting device is installed within a chamber of the semiconductor device to provide illumination to the chamber; and the first optical path module is installed within the chamber, but at least a portion of the first optical path module is located downstream of the light-emitting device and is used to change the direction of light emitted from the light-emitting device. The lighting device may be applied in a vacuum environment and provides illumination to a semiconductor device in a vacuum environment, which forms a better illumination effect on the semiconductor device, thereby enabling an image acquisition device to obtain clear image data, which helps in recognizing fine size features of the semiconductor device.

Description

Technology Field

[0001] This application belongs to the field of semiconductor device detection technology, and in particular relates to lighting devices and semiconductor detection devices. Background Technology

[0002] With the recent rapid advancement of the semiconductor industry, the demand for defect detection devices during the wafer manufacturing process is becoming increasingly widespread. All existing wafer detection devices utilize electron beam detection, and to ensure the clarity of electron beam detection imaging, illumination must be provided to the detection location.

[0003] It must be noted that wafers are placed in a vacuum environment when being detected, and the currently adopted lighting method involves installing a lighting device on the atmospheric side to illuminate the wafer located on the vacuum side. It should be understood that installing a lighting device on the vacuum side to illuminate the wafer provides a better illumination effect, which helps in recognizing the fine size features of the wafer. However, currently used lighting devices are not suitable for use in a vacuum environment. The problem to be solved

[0004] The present application provides a lighting device and a semiconductor detection device to solve the technical problem that existing lighting devices cannot be applied in a vacuum environment. means of solving the problem

[0005] According to one aspect of the present application, a lighting device used in a semiconductor detection device is provided, wherein the lighting device comprises a light-emitting device and a first optical path module; at least a portion of the light-emitting device is installed within a chamber of the semiconductor device to provide lighting to the chamber; and at least a portion of the first optical path module is installed within the chamber, wherein at least a portion of the first optical path module is located downstream of the light-emitting device and is used to change the direction of light emitted from the light-emitting device.

[0006] In an optional embodiment of the present application, the light-emitting mechanism comprises a light input member and a light output member, wherein the light output member is located within a chamber, and the light input member is connected to the light output member but is located outside the chamber; and a first light path module is connected to the light output member but is located downstream of the light output member.

[0007] In an optional embodiment of the present application, the light-emitting mechanism further comprises a connecting member, and a light input member and a light output member are connected to each other through the connecting member, and the connecting member can transmit light introduced through the light input member to the light output member.

[0008] In an optional embodiment of the present application, the first optical path module comprises a lens barrel assembly and a first lens group module, the optical output member is installed in the lens barrel assembly, and the first lens group module is installed in the lens barrel assembly but is located downstream of the optical output member.

[0009] In an optional embodiment of the present application, the lighting device further comprises a control mechanism, at least a portion of which is installed outside the chamber, and the control mechanism is connected to a lens barrel assembly and configured to control the position of the lens barrel assembly.

[0010] In an optional embodiment of the present application, the adjustment mechanism comprises a sealing assembly, a lens barrel adjustment frame, and a first adjustment structure; the sealing assembly is provided with a via hole, the lens barrel adjustment frame is movably connected to the sealing assembly and is located on one side of the axial direction of the via hole, and the lens barrel assembly is connected to the lens barrel adjustment frame; the first adjustment structure is installed in the sealing assembly, but at least a part of the first adjustment structure is located outside the chamber, the first adjustment structure is connected to the lens barrel adjustment frame through the via hole, and the first adjustment structure is drivable to move the lens barrel adjustment frame along the axial direction of the via hole.

[0011] In an optional embodiment of the present application, the control mechanism further comprises a second control structure, the second control structure being installed in a sealing assembly, at least a portion of the second control structure being located outside the chamber, and the second control structure being connected to a first control structure and capable of driving the first control structure to move along the radial direction of a via hole.

[0012] In an optional embodiment of the present application, the sealing assembly comprises a first mounting base and a movable sleeve, wherein the axial ends of the movable sleeve are respectively connected to the first mounting base and a lens barrel adjustment frame, and the first mounting base is installed on the outside of the chamber and connected to the side wall of the chamber.

[0013] In an optional embodiment of the present application, the first control structure comprises a movable column and a pressure block; the pressure block is located outside the chamber but connected to a sealing assembly; a portion of the movable column is located outside the chamber but an axial end of the movable column is connected to a lens barrel control frame through a via hole, and the movable column can be driven to move the lens barrel control frame along the axial direction of the via hole.

[0014] In an optional embodiment of the present application, the movable column is a stud, and a first male screw thread is provided at one axial end of the movable column to be screw-coupled to a lens barrel adjustment frame, and the other axial end of the movable column is rotatably connected to a pressure block.

[0015] In an optional embodiment of the present application, a second male thread is provided at an axial end away from the first male thread of the movable column and is screw-coupled to a pressure block; the pitch of the second male thread is not the same as the pitch of the first male thread.

[0016] In an optional embodiment of the present application, the second control structure comprises a plurality of contact members and a movable member; the movable member is installed in a sealing assembly and connected to the first control structure, and the plurality of contact members are all movably connected to the sealing assembly and can be pushed to move the movable member along the radial direction of the via hole.

[0017] In an optional embodiment of the present application, the movable member comprises a movable block, the movable block comprises a plurality of inclined walls, the plurality of inclined walls are arranged symmetrically with respect to the center of the movable block; and each contact member contacts each inclined wall in a one-to-one correspondence.

[0018] In an optional embodiment of the present application, the movable member further comprises a sleeve section, the sleeve section being connected to a movable block and located within a via hole.

[0019] In an optional embodiment of the present application, the second adjustment structure further comprises a plurality of elastic assemblies; the plurality of elastic assemblies are installed on a movable block and arranged symmetrically with respect to the axis of a via hole, and each elastic assembly is connected to a sealing assembly.

[0020] In an optional embodiment of the present application, the adjustment mechanism further comprises a first elastic member, the first elastic member wrapping around a movable column from the outside and sandwiched between a sleeve section and a lens barrel adjustment frame.

[0021] In an optional embodiment of the present application, the lens barrel assembly comprises a first lens barrel and a second lens barrel, wherein the second lens barrel is connected to the first lens barrel and installed coaxially with the first lens barrel; a light output member is installed at one end of the first lens barrel away from the second lens barrel, and a control mechanism is connected to the first lens barrel.

[0022] In an optional embodiment of the present application, the first lens group module comprises a first focusing lens group and a first reflector; the first focusing lens group is installed within a first lens barrel, and the first reflector is installed in a second lens barrel but is located at one end away from the first lens barrel.

[0023] According to another aspect of the present application, a semiconductor detection device comprising a chamber, an image acquisition device, and the aforementioned illumination device is provided, wherein at least a portion of the light-emitting mechanism of the illumination device is installed within the chamber to provide illumination to the chamber, and a first light path module is installed within the chamber to change the direction of the light path of light emitted from the light-emitting mechanism; and at least a portion of the image acquisition device is installed within the chamber.

[0024] In an optional embodiment of the present application, the image acquisition device comprises a camera module, a second optical path module, and a lens barrel mounting frame, wherein the camera module is located outside the chamber, and the second optical path module and the lens barrel mounting frame are located inside the chamber; the camera module is aligned with the lens barrel mounting frame along the longitudinal direction of the lens barrel mounting frame and is located at the end side of the lens barrel mounting frame; and the second optical path module is connected to the lens barrel mounting frame to guide light emitted from a lighting device to the camera module.

[0025] In an optional embodiment of the present application, the second optical path module comprises a third lens barrel and a second lens group module, wherein the third lens barrel is vertically connected to a lens barrel mounting frame, and the second lens group module is installed within the third lens barrel and used to change the optical path direction.

[0026] In an optional embodiment of the present application, the second lens group module comprises a second reflector, a second focusing lens group, and a third reflector; the second reflector, the second focusing lens group, and the third reflector are sequentially spaced apart within the third lens barrel along the axial direction of the third lens barrel.

[0027] In an optional embodiment of the present application, the camera module comprises a camera, a second mounting base, and a protective lens group; the second mounting base and the protective lens group are both connected to the side wall of the chamber, the camera is connected to the second mounting base, and the protective lens group is located between the second mounting base and the lens barrel mounting frame. Effects of the invention

[0028] In the lighting device provided in the present application, a light-emitting device is guided from the atmosphere side to the vacuum side and connected to a first optical path module on the vacuum side. Light emitted from the light-emitting device passes through the first optical path module, changes direction, and is irradiated onto a semiconductor device located in a vacuum environment. Clearly, the lighting device can be used in a vacuum environment and can provide illumination to a semiconductor device located in a vacuum environment, thereby forming a better illumination effect on the semiconductor device and enabling an image acquisition device to obtain clear image data, which helps in recognizing fine size features of the semiconductor device. Brief explanation of the drawing

[0029] To more clearly explain the specific embodiments of the present application or the technical methods of the prior art, drawings to be used in describing the specific embodiments or prior art are briefly introduced below. It will be evident that the drawings in the following description relate to some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative effort. FIG. 1 is a local cross-sectional view of a semiconductor detector device provided according to one embodiment of the present application. Figure 2 is a local enlarged view of part B1 of Figure 1. Figure 3 is a schematic diagram of the control mechanism of Figure 2. Figure 4 is a cross-sectional view of the control mechanism of Figure 3. Figure 5 is an exploded view of the control mechanism of Figure 3. Figure 6 is a schematic diagram of the movable column of Figure 5. Figure 7 is a local enlarged view of part B2 of Figure 1. Figure 8 is a schematic diagram of the image acquisition device of Figure 1. Figure 9 is an exploded view of the image acquisition device of Figure 8. Figure 10 illustrates a schematic diagram of a light path formed by a lighting device and an image acquisition device. Specific details for implementing the invention

[0030] In the description of the present application, it should be understood that, for example, in descriptions indicating orientation or positional relationships such as “center,” “vertical,” “horizontal,” “length,” “width,” “thickness,” “top,” “bottom,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inside,” “outside,” “clockwise,” “counterclockwise,” “axis,” “radial,” “circular,” etc., unless otherwise specified, the orientation or positional relationship depicted in the drawings is merely for the convenience of explanation and simplification of the description of the present application and is not intended to indicate or imply that the mentioned device or element must have a specific orientation or be configured and operated in a specific orientation, and therefore should not be interpreted as a limitation to the present application.

[0031] Furthermore, where features limited to "first" or "second" are used solely for illustrative purposes, they should not be understood as indicating relative importance or implicitly indicating the number of designated technical features. Features limited to "first" or "second" may explicitly or implicitly include at least one of the corresponding limited features. Where the expression "plural" appears, it generally indicates the inclusion of at least two (e.g., two, three, etc.) unless explicitly and specifically limited otherwise.

[0032] In this application, terms such as “mounting,” “connecting with one another,” “connecting,” and “fixing” should be interpreted in a broad sense unless otherwise specified or limited. For example, they may be fixed connections or detachable connections, mechanical or electrical connections, indirect connections through an intermediate medium, or communication within two elements or an interactive relationship between two elements. Those skilled in the art will understand the specific meaning of the above terms in this application depending on the specific circumstances.

[0033] In the description of this specification, where the terms “one embodiment,” “some embodiment,” “example,” “specific example,” or “some example” appear, they are intended to indicate that the specific features, structures, materials, or properties described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, general expressions of such terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or properties described may be combined in any suitable manner in any one or more embodiments or examples. Additionally, those skilled in the art may combine and combine features of different embodiments or examples described in this specification, provided that such combinations are not contradictory.

[0034] FIG. 1 is a local cross-sectional view of a semiconductor detection device (1000) provided according to one embodiment of the present application. Referring to FIG. 1, the semiconductor detection device (1000) includes a chamber (R), an image acquisition device (200), and a lighting device (100). The chamber (R) may be used to place semiconductor devices, and the chamber (R) may undergo vacuum processing to form a vacuum environment. The lighting device (100) may provide illumination to semiconductor devices located in the chamber (R), and the image acquisition device (200) is used to collect image data of semiconductor devices in the chamber (R). It should be understood that after the lighting device (100) provides illumination to the semiconductor devices, the image data collected by the image acquisition device (200) becomes clearer.

[0035] FIG. 2 is a local enlarged view of portion B1 of FIG. 1. Referring to FIG. 2, the lighting device (100) includes a light-emitting device (130) and a first light path module (110). At least a portion of the light-emitting device (130) is installed within the chamber (R) of the semiconductor detector device (1000) to provide illumination to the chamber (R). The first light path module (110) is installed within the chamber (R), but at least a portion is located downstream of the light-emitting device (130) and is used to change the direction of light emitted from the light-emitting device (130). At least a portion of the image acquisition device (200) is installed within the chamber (R) and is used to receive light emitted from the light-emitting device (130).

[0036] Specifically, the lighting device (100) and the image collection device (200) are mounted on the side wall of the chamber (R). Accordingly, a part of the image collection device (200) is inserted into the chamber (R), a part of the light-emitting device (130) is inserted into the chamber (R), and a first light path module (110) is placed inside the chamber (R). Light emitted from the light-emitting device (130) passes through the first light path module (110), changes direction, and can be irradiated onto a semiconductor device located in the chamber (R), and can pass through the semiconductor device and be reflected to the image collection device (200). Through this, a light spot is formed on the semiconductor device, and the image collection device (200) can collect image data from the light spot.

[0037] To aid in understanding the present invention, in each embodiment provided in this application, the inside of the chamber (R) is the vacuum side, and the outside of the chamber (R) is the air side. Next, the semiconductor detection device (1000) is described as an example of being applied to wafer detection. Referring to FIG. 1, a wafer (300) is placed inside the chamber (R), and the wafer (300) is positioned below the lighting device (100) and the image collection device (200). The light-emitting device (130) is introduced from the air side to the vacuum side, and the light emitted from the light-emitting device (130) changes direction through the first light path module (110) and is irradiated onto the wafer (300) located below to form a light spot on the wafer (300). The surface of the wafer (300) is smooth and reflects the light to the image collection device (200), thereby allowing the image collection device (200) to easily perform recognition.

[0038] Clearly, the lighting device (100) provided in the present application can be applied in a vacuum environment and can provide lighting to a semiconductor device in a vacuum environment, thereby forming a better lighting effect on the semiconductor device, which helps the image acquisition device (200) to obtain clear image data and thus helps to recognize fine size features of the semiconductor device.

[0039] In some optional embodiments, the light-emitting mechanism (130) includes a light input member (131) and a light output member (132), the light output member (132) is located within a chamber (R), and the light input member (131) is connected to the light output member (132) and is located outside the chamber (R). A first light path module (110) is connected to the light output member (132), but at least a portion is located downstream of the light output member (132).

[0040] In this embodiment, the light-emitting mechanism (130) further includes a light emitter (not shown), the light emitter is located on the atmospheric side, the light input member (131) is connected to the light emitter, and light emitted from the light emitter passes through the light input member (131) and the light output member (132), then passes through the downstream first light path module (110) and is irradiated onto the wafer (300).

[0041] Furthermore, the light-emitting device (130) further includes a connecting member (133), and the light input member (131) is connected to the light output member (132) through the connecting member (133), and the connecting member (133) can transmit light introduced through the light input member (131) to the light output member (132).

[0042] It should be understood that the connecting member (133) is a photoconductive member that conducts light received from the optical input member (131) to the optical output member (132). In this embodiment, the light emitter is a laser, the connecting member (133) is an optical fiber, and the optical input member (131) and the optical output member (132) are plug-in connectors connected to both ends of the optical fiber; in other words, the light-emitting mechanism (130) is a light source based on a laser layout, and by using the laser as the light source of the lighting device (100), not only is it high brightness, but the formed light spot is also small, which helps in recognizing fine size features. In a specific application, the optical input member (131) may be, for example, a semiconductor laser, an optical fiber laser, etc., and may be selected according to design requirements.

[0043] In this embodiment, the light-emitting device (130) further includes a flange assembly (134), and a through hole (H5) is provided in the side wall of the chamber (R). The flange assembly (134) is connected to the side wall of the chamber (R) to seal the through hole (H5), thereby ensuring the sealability of the chamber (R). One end of the connecting member (133) is connected to the light input member (131) on the atmospheric side, and the other end passes through the flange assembly (134) and then through the through hole (H5) to be connected to the light output member (132) located on the vacuum side.

[0044] In some optional embodiments, the first optical path module (110) comprises a lens barrel assembly (111) and a first lens group module (112), and the optical output member (132) is installed in the lens barrel assembly (111), and the first lens group module (112) is installed in the lens barrel assembly (111) but is located downstream of the optical output member (132).

[0045] In this embodiment, a first lens group module (112) is mounted on the lens barrel assembly (111), which supports and protects the first lens group module (112) and prevents scratching of the lens of the first lens group module (112), and the direction of light can be changed after passing through the first lens group module (112) on the downstream side. It should be understood that by adjusting the depth of the light output member (132) inserted into the lens barrel assembly (111), the light path can be changed, and accordingly, the size of the light spot formed on the wafer (300) can be changed.

[0046] Furthermore, the lighting device (100) further includes a control mechanism (120), at least a portion of which is installed outside the chamber (R), and the control mechanism (120) is connected to a lens barrel assembly (111) and used to control the position of the lens barrel assembly (111).

[0047] In this embodiment, the control mechanism (120) is installed on the side wall of the chamber (R), and part of the control mechanism (120) is located outside the chamber (R) and other part is located inside the chamber (R) and contacts the lens barrel assembly (111), and the position and size of the light spot on the wafer (300) can be controlled by controlling the position of the control lens barrel assembly (111).

[0048] In some optional embodiments, the lens barrel assembly (111) comprises a first lens barrel (1111) and a second lens barrel (1112), wherein the second lens barrel (1112) is connected to the first lens barrel (1111) and installed coaxially with the first lens barrel (1111). A light output member (132) is installed at one end of the second lens barrel (1112) of the first lens barrel (1111), and a control mechanism (120) is connected to the first lens barrel (1111).

[0049] Specifically, the lens barrel assembly (111) is configured such that a first lens barrel (1111) and a second lens barrel (1112) are joined along the axial direction of the lens barrel assembly (111), a light output member (132) is mounted within the first lens barrel (1111), and the second lens barrel (1112) is located downstream along the light path direction of the first lens barrel (1111).

[0050] Furthermore, the first lens group module (112) includes a first focusing lens group (1121) and a first reflector (1122), the first focusing lens group (1121) is installed within the first lens barrel (1111), and the first reflector (1122) is installed at one end of the second lens barrel (1112) away from the first lens barrel (1111).

[0051] Specifically, a light output member (132) and a second lens barrel (1112) are respectively connected to both ends of the first lens barrel (1111), a first reflector (1122) is located at one end of the second lens barrel (1112) away from the first lens barrel (1111), and a first focusing lens group (1121) is located downstream of the light output member (132) and upstream of the first reflector (1122).

[0052] Light emitted from the light output member (132) is focused through the first focusing lens group (1121) and then irradiated onto the first reflector (1122). After the light path direction is changed through the first reflector (1122), it is irradiated onto the wafer (300) located below, thereby forming a light spot on the wafer (300). In a specific application, the first focusing lens group (1121) includes at least one convex lens and is used to focus the light emitted from the light output member (132). The first reflector (1122) is a flat lens that forms an acute angle with the axis of the second lens barrel (1112) and serves to guide the light to the wafer (300) by changing the light direction.

[0053] In this embodiment, the acute angle formed by the axis of the first reflector (1122) and the second lens barrel (1112) is 20° to 70° and can be set as needed.

[0054] FIG. 3 illustrates a schematic diagram of the adjustment mechanism (120) of FIG. 2, and FIG. 4 illustrates a cross-sectional view of the adjustment mechanism (120) of FIG. 3. Referring to FIG. 3, in some optional embodiments, the adjustment mechanism (120) includes a sealing assembly (121), a lens barrel adjustment frame (122), and a first adjustment structure (123). The sealing assembly (121) is provided with a via hole (H0), the lens barrel adjustment frame (122) is movably connected to the sealing assembly (121) and is located on one axial side of the via hole (H0), and the lens barrel assembly (111) is connected to the lens barrel adjustment frame (122).

[0055] The first adjustment structure (123) is installed in the sealing assembly (121), but at least a portion is installed outside the chamber (R), and the first adjustment structure (123) is connected to the lens barrel adjustment frame (122) through the via hole (H0), and the first adjustment structure (123) can drive the lens barrel adjustment frame (122) to move along the axial direction of the via hole (H0).

[0056] Specifically, when combining Fig. 2, a through hole (H3) through which a lens barrel adjustment frame (122) passes is provided in the side wall of the chamber (R), and a sealing assembly (121) is mounted on the side wall of the chamber (R) and positioned in the through hole (H3), so that the lens barrel adjustment frame (122) connected to the sealing assembly (121) passes through the through hole (H3) and is inserted into the chamber (R), and is connected to the lens barrel assembly (111) inside the chamber (R) to fix the lens barrel assembly (111).

[0057] It should be noted that the lens barrel adjustment frame (122) is positioned on one side of the axial direction of the via hole (H0) to provide sealing for the via hole (H0), and the sealing assembly (121) seals the through hole (H3) to ensure airtightness of the chamber (R).

[0058] The first adjustment structure (123) is mounted on the sealing assembly (121), with a portion located outside the chamber (R), and a portion of the first adjustment structure (123) passes through the via hole (H0) and is connected to the lens barrel adjustment frame (122). The lens barrel adjustment frame (122) moves along the axial direction of the via hole (H0) through the first adjustment structure (123), thereby driving the lens barrel assembly (111) to move along the axial direction of the via hole (H0), thereby changing the position and size of the light spot on the wafer (300). In the embodiment illustrated in FIG. 1, the fact that the first adjustment structure (123) adjusts the position of the lens barrel assembly (111) along the axial direction of the via hole (H0) means that it adjusts the vertical distance between the lens barrel assembly (111) and the wafer (300).

[0059] In a specific application, a through hole (H1) is provided at one end of the lens barrel adjustment frame (122) that is away from the sealing assembly (121), and one end of the first lens barrel (1111) is fixed in the through hole (H1), and the second lens barrel (1112) is connected to the first lens barrel (1111), that is, the lens barrel assembly (111) is mounted on the lens barrel adjustment frame (122).

[0060] Furthermore, the control mechanism (120) further includes a second control structure (124), the second control structure (124) is installed in the sealing assembly (121) but at least part of it is located outside the chamber (R), and the second control structure (124) is connected to the first control structure (123) to drive the first control structure (123) to move along the radial direction of the via hole (H0).

[0061] Specifically, the second adjustment structure (124) is mounted on the sealing assembly (121) and connected to the first adjustment structure (123), thereby allowing the second adjustment structure (124) to act on the first adjustment structure (123), causing the first adjustment structure (123) to move along the radial direction of the via hole (H0). Correspondingly, the lens barrel adjustment frame (122) connected to the first adjustment structure (123) also moves along the radial direction of the via hole (H0). Through this, the lens barrel assembly (111) moves along the radial direction of the via hole (H0) together with the lens barrel adjustment frame (122), thereby changing the position of the light spot on the wafer (300). In the embodiment illustrated in FIG. 1, the fact that the second adjustment structure (124) adjusts the position of the lens barrel assembly (111) along the radial direction of the via hole (H0) means that the front, back, left, and right positions of the lens barrel assembly (111) are adjusted.

[0062] In the method disclosed in the present application, some of the first adjustment structure (123) and the second adjustment structure (124) are positioned on the standby side so that an operator can work, and it can be seen that the position of the lens barrel adjustment frame (122) is adjusted through the combination of the first adjustment structure (123) and the second adjustment structure (124), and the position of the lens barrel assembly (111) is changed, thereby allowing the position and size of the light spot to be changed. Through this, the size and position of the adjustment light spot can be adjusted as needed, and the image data collected by the image acquisition device (200) becomes clearer.

[0063] In some optional embodiments, the sealing assembly (121) comprises a first mounting base (1211) and a movable sleeve (1212), the axial ends of the movable sleeve (1212) are respectively connected to the first mounting base (1211) and the lens barrel adjustment frame (122), and the first mounting base (1211) is installed on the outside of the chamber (R) and connected to the side wall of the chamber (R).

[0064] Specifically, the first mounting base (1211) is mounted in the through hole (H3), and the movable sleeve (1212) is installed within the through hole (H3), with one end connected to the first mounting base (1211) and the other end connected to the lens barrel adjustment frame (122). As can be seen above, the lens barrel adjustment frame (122) can move forward, backward, left, right, up, and down. In this embodiment, the movable sleeve (1212) can extend and retract up and down and can swing forward, backward, left, and right, thereby realizing a movable connection between the lens barrel adjustment frame (122) and the sealing assembly (121) to ensure the freedom of movement of the lens barrel adjustment frame (122).

[0065] In a specific application, the movable sleeve (1212) may be a bellows, and the bellows may extend up and down and swing back and forth and left and right, but is not limited thereto, and, for example, a rubber tube may be used. In addition, to ensure sealing performance, a first sealing ring (1213) is installed on the side wall near the chamber (R) of the first mounting base (1211).

[0066] It should be noted that a through hole is installed in the first mounting base (1211), and the lumen of the movable sleeve (1212) is connected to the through hole on the first mounting base (1211) to form the aforementioned via hole (H0).

[0067] FIG. 5 illustrates an exploded view of the control mechanism (120) of FIG. 3. Referring to FIG. 4 and FIG. 5, in some optional embodiments, the first control structure (123) includes a movable column (1231) and a pressure block (1232). The pressure block (1232) is located outside the chamber (R) and connected to the sealing assembly (121). A portion of the movable column (1231) is located outside the chamber (R), but one axial end passes through the via hole (H0) and is connected to the lens barrel control frame (122), and the movable column (1231) can drive the lens barrel control frame (122) to move along the axial direction of the via hole (H0).

[0068] In this embodiment, the pressure block (1232) is connected to the first mounting base (1211) and has a through hole installed coaxially with the via hole (H0), and the movable column (1231) is connected to the lens barrel adjustment frame (122) by passing through the pressure block (1232) and the sealing assembly (121), and correspondingly, the movable sleeve (1212) wraps the movable column (1231) to the outside. By driving the movable column (1231) to move along the axial direction of the via hole (H0), the lens barrel adjustment frame (122) is driven so that the lens barrel assembly (111) moves along the axial direction of the via hole (H0), that is, by driving it to move in the up and down direction, the position and size of the light spot are changed.

[0069] FIG. 6 is a schematic diagram of the movable column (1231) of FIG. 5. Furthermore, referring to FIG. 6, the movable column (1231) is a stud, and a first male screw thread (A1) is installed at one axial end of the movable column (1231) to be screw-coupled to the lens barrel adjustment frame (122), and the other axial end of the movable column (1231) is rotatably connected to the pressure block (1232).

[0070] Specifically, a female thread blind hole is provided at one end of the lens barrel adjustment frame (122) that is away from the lens barrel assembly (111), and a first male thread (A1) is located in the female thread blind hole of the lens barrel assembly (111), and one end of the movable column (1231) is rotatably connected to a pressure block (1232) but restricts the axial position of the movable column (1231) through the pressure block (1232), that is, the movable column (1231) cannot move along the axial direction of the via hole (H0).

[0071] For example, if the movable column (1231) is rotated clockwise, the movable column (1231) cannot move along the axial direction, so the lens barrel adjustment frame (122) moves upward, and if the movable column (1231) is rotated counterclockwise, the lens barrel adjustment frame (122) moves downward, that is, the position of the lens barrel adjustment frame (122) can be adjusted along the axial direction of the via hole (H0).

[0072] In one optional embodiment, the through hole on the pressure block (1232) is a stepped hole, and the movable column (1231) is provided with an annular projection, the movable column (1231) is spaced apart from the stepped hole to ensure rotational freedom, and the annular projection contacts the inner wall of the stepped hole to limit axial freedom.

[0073] In another optional embodiment, a rolling bearing is provided inside the through hole on the pressure block (1232), and the movable column (1231) is connected to the rolling bearing to ensure rotational freedom but cannot move along the axial direction.

[0074] Furthermore, a second male thread (A2) is provided at an axial end extending away from the first male thread (A1) of the movable column (1231) and is screw-coupled to the pressure block (1232). The pitch of the second male thread (A2) is not the same as the pitch of the first male thread (A1).

[0075] Specifically, the through hole on the pressure block (1232) is a female threaded through hole, and the second male thread (A2) is connected to the female threaded through hole of the pressure block (1232). Since the pressure block (1232) is fixed to the first mounting base (1211) and the lens barrel adjustment frame (122) is movable while floating, the movable column (1231) can be released from the pressure block (1232) only when the first male thread (A1) is completely separated from the lens barrel adjustment frame (122).

[0076] It can be understood that the lens barrel adjustment frame (122) can be driven by rotating the movable column (1231). In this embodiment, the pitch of the first male thread (A1) is not the same as the pitch of the second male thread (A2), and if the pitches of the two threads are different, the adjustment accuracy is higher.

[0077] To aid in understanding the present method, an example is provided below. For instance, the pitch of the first male thread (A1) is 0.8 mm and the pitch of the second male thread (A2) is 1 mm. When the movable column (1231) is rotated one full clockwise, the movable column (1231) moves 1 mm downward relative to the pressure block (1232). In response, the lens barrel adjustment frame (122) moves 0.8 mm upward relative to the pressure block (1232), that is, the lens barrel adjustment frame (122) moves 0.2 mm downward. Similarly, when the movable column (1231) is rotated one full counterclockwise, the movable column (1231) moves 1 mm upward relative to the pressure block (1232), and the lens barrel adjustment frame (122) moves 0.8 mm downward relative to the pressure block (1232), that is, the lens barrel adjustment frame (122) moves 0.2 mm upward. Clearly, the double thread scheme with different pitches has higher adjustment accuracy.

[0078] It should be understood that, compared to a technical method using a single thread, in a double thread method, the movable column (1231) can move along the axial direction of the via hole (H0). Additionally, the method provided in this embodiment is a manual adjustment method, and of course, the movable column (1231) is not limited to a stud, and the vertical position can be automatically adjusted, for example, through an electric push rod.

[0079] In some optional embodiments, the second control structure (124) comprises a plurality of contact members (1241) and a movable member (1242), the movable member (1242) is installed in the sealing assembly (121) and connected to the first control structure (123), and all of the plurality of contact members (1241) are movably connected to the sealing assembly (121) so as to push the movable member (1242) to move along the radial direction of the via hole (H0).

[0080] In this embodiment, the movable member (1242) is installed on the first mounting base (1211) and surrounds the movable column (1231) from the outside, and the movable member (1242) is located below the pressure block (1232) so that its position is limited along the axial direction of the via hole (H0) through the pressure block (1232). Each contact member (1241) passes through the first mounting base (1211) and then comes into contact with the movable member (1242). The contact member (1241) can be moved to push the movable member (1242) to move along the radial direction of the via hole (H0). The movable member (1242) drives the movable column (1231) to move along the radial direction of the via hole (H0). The movable column (1231) drives the lens barrel adjustment frame (122) to move. The lens barrel assembly (111) moves together with the lens barrel adjustment frame (122), that is, moves forward, backward, left, and right to adjust the position and size of the light spot on the wafer (300).

[0081] In a specific application, the contact member (1241) is screw-coupled to the first mounting base (1211), and when the contact member (1241) is rotated, the contact member (1241) moves along the radial direction of the via hole (H0) and pushes the movable member (1242) to move. For example, the contact member (1241) includes a screw, a jack screw, etc.

[0082] Referring to FIG. 5, in some optional embodiments, the movable member (1242) includes a movable block (12421), the movable block (12421) includes a plurality of inclined walls (P), and the plurality of inclined walls (P) are arranged symmetrically with respect to the center of the movable block (12421). Each contact member (1241) is in contact with each inclined wall (P) in a one-to-one correspondence.

[0083] In this embodiment, a groove is formed in the first mounting base (1211) that communicates with the via hole (H0), and the movable block (12421) is positioned in the groove of the first mounting base (1211) to restrict the movement of the movable block (12421) in cooperation with the pressure block (1232). As can be seen above, since the movable member (1242) surrounds the movable column (1231) to the outside, a through hole is installed in the movable block (12421) so that the movable column (1231) can pass through, and the through hole on the movable block (12421) is located at the center position of the movable block (12421), that is to say, each inclined wall (P) is arranged symmetrically around the axis of the through hole on the movable block (12421).

[0084] Each contact member (1241) applies thrust in a one-to-one correspondence with each inclined wall (P), and the thrust is classified into radial thrust along the radial direction of the via hole (H0) and axial thrust along the axial direction of the via hole (H0). Radial thrust acts on the movable block (12421) to cause the movable block (12421) to move along the radial direction of the via hole (H0), and axial thrust acts on the movable block (12421) to prevent shaking of the movable block (12421) along the axial direction of the via hole (H0).

[0085] Referring to FIGS. 3 to 5, in the illustrated embodiment, the number of contact members (1241) is 2 and is installed facing each other on both the left and right sides of the movable block (12421), and the number of inclined walls (P) of the movable block (12421) is 2 and is arranged facing each other, and the 2 contact members (1241) penetrate the first mounting base (1211) and then come into contact with the 2 inclined walls (P) in a corresponding manner, and by adjusting the 2 contact members (1241), left and right direction control of the movable block (12421) is achieved.

[0086] It should be understood that if it is necessary to add a direction of adjustment, the number of contact members (1241) and the number of inclined walls (P) can be increased. For example, two additional contact members (1241) can be installed facing the front and rear directions of the movable block (12421), and both the front and rear sides of the first mounting base (1211) are inclined walls (P). By connecting the two contact members (1241) on both the front and rear sides in a one-to-one correspondence, the movable block (12421) can be adjusted in the front, rear, left, and right directions through four contact members (1241).

[0087] In this embodiment, the movable block (12421) is a block structure having a through hole and an inclined wall (P), but is not limited thereto. For example, the movable block (12421) is formed by assembling a block structure having a plurality of inclined walls (P), and each block structure is assembled so that the movable column (1231) passes through the through hole.

[0088] Furthermore, the movable member (1242) further includes a sleeve section (12422), the sleeve section (12422) is connected to the movable block (12421) and is located within the via hole (H0).

[0089] Specifically, the sleeve section (12422) extends downward from the through-hole position of the movable block (12421) and is inserted into the via hole (H0), and the lumen of the sleeve section (12422) communicates with the through-hole on the movable block (12421), so that the movable column (1231) can pass through the sleeve section (12422). As can be seen above, the contact member (1241) acts on a point of the movable block (12421), so the contact area between the movable block (12421) and the movable column (1231) is small, and when the movable block (12421) is pushed along the radial direction of the via hole (H0), there is a risk that the movable column (1231) will shake. In this method, the sleeve section (12422) wraps the movable column (1231) to the outside and ensures a large contact area with the movable column (1231), thereby preventing shaking of the movable column (1231) and ensuring translational movement of the movable column (1231), through which the lens barrel adjustment frame (122) drives the lens barrel assembly (111) to translate.

[0090] Furthermore, the adjustment mechanism (120) further includes a first elastic member (125), the first elastic member (125) wraps around the movable column (1231) externally and is fitted between the sleeve section (12422) and the lens barrel adjustment frame (122).

[0091] As can be seen above, in one optional embodiment, both ends of the movable column (1231) are threaded studs, and both ends are screw-coupled to the pressure block (1232) and the lens barrel adjustment frame (122), respectively, and the first elastic member (125) is in a compressed state, one end of which acts on the pressure block (1232) through the movable member (1242), and the other end of which acts on the lens barrel adjustment frame (122), so that both ends of the movable column (1231) are tightly coupled to the threads of the pressure block (1232) and the lens barrel adjustment frame (122), and the position of the adjustment lens barrel adjustment frame (122) can be adjusted through the movable column (1231) to respond quickly. In this embodiment, the first elastic member (125) may be, for example, a compression spring and elastic rubber.

[0092] In some optional embodiments, the second control structure (124) further comprises a plurality of elastic assemblies (1243), the plurality of elastic assemblies (1243) are installed in a movable block (12421) and arranged symmetrically about the axis of a via hole (H0), and each elastic assembly (1243) is connected to a sealing assembly (121).

[0093] Specifically, a plurality of elastic assemblies (1243) are all connected to the first mounting base (1211) and arranged symmetrically around the axis of the via hole (H0), and the plurality of elastic assemblies (1243) are installed in the movable block (12421) to form a compressed state, thereby applying pressure to the movable block (12421) along the axial direction of the via hole (H0) to prevent shaking of the movable member (1242).

[0094] In this embodiment, the elastic assembly (1243) includes a bolt (12431), a second elastic member (12432), and two gaskets (12433). The bolt (12431) penetrates the movable block (12421) and is screw-coupled to the first mounting base (1211). Both the second elastic member (12432) and the two gaskets (12433) surround the bolt (12431) from the outside and are located on the upper part of the movable block (12421). The two gaskets (12433) are each located at both ends of the second elastic member (12432). The lower gasket (12433) is in contact with the movable block (12421), and the upper gasket (12433) is in contact with the nut of the bolt (12431). By tightening the bolt (12431), the second elastic The member (12432) is sandwiched between two gaskets (12433) to maintain the second elastic member (12432) in a compressed state, thereby applying pressure to the movable block (12421) along the axial direction of the via hole (H0).

[0095] As can be seen above, in the lighting device (100) provided in the present application, the first adjustment structure (123) and the second adjustment structure (124) cooperate to finely move the lens barrel adjustment frame (122) to drive the lens barrel assembly (111) and finely adjust the position and size of the light spot on the wafer (300).

[0096] Additionally, since the area of ​​the light spot is small, only a portion of the wafer (300) can be illuminated. In a specific application, the chamber (R) is equipped with a transfer mechanism to move the position of the wafer (300) and to detect the entire wafer (300) by changing the relative position of the light spot on the wafer (300).

[0097] FIG. 7 is a local enlarged view of portion B2 of FIG. 1. Referring to FIG. 7, in some optional embodiments, the image acquisition device (200) includes a camera module (210), a second optical path module (220), and a lens barrel mounting frame (230), wherein the camera module (210) is located outside the chamber (R), and the second optical path module (220) and the lens barrel mounting frame (230) are located inside the chamber (R).

[0098] The camera module (210) is aligned with the lens barrel mounting frame (230) in the longitudinal direction of the lens barrel mounting frame (230) and is located at the end side of the lens barrel mounting frame (230). The second light path module (220) is connected to the lens barrel mounting frame (230) and is used to guide light emitted from the lighting device (100) to the camera module (210).

[0099] Specifically, light emitted from the lighting device (100) forms a light spot after being irradiated onto the wafer (300), is reflected by the second light path module (220), and is guided to the camera module (210) by changing the direction of light through the second light path module (220), and from this, it can be seen that the camera module (210) can collect image data of the light spot portion on the wafer (300).

[0100] In this embodiment, the camera module (210) is mounted on the side wall of the chamber (R) and is located outside the chamber (R), and the lens barrel mounting frame (230) is mounted on the side wall of the chamber (R) and is located inside the chamber (R), and the camera module (210) is aligned with the lens barrel mounting frame (230).

[0101] FIG. 8 illustrates a schematic diagram of the image acquisition device (200) of FIG. 1, and FIG. 9 is an exploded view of the image acquisition device (200) of FIG. 8. Furthermore, referring to FIG. 7 through FIG. 9, the second optical path module (220) includes a third lens barrel (221) and a second lens group module (222), the third lens barrel (221) is vertically connected to a lens barrel mounting frame (230), and the second lens group module (222) is installed within the third lens barrel (221) and used to change the optical path direction.

[0102] Specifically, the third lens barrel (221) is fixedly mounted on the lens barrel mounting frame (230) and used to fix and support the second lens group module (222). Light emitted from the lighting device (100) is reflected through the wafer (300) and then flows into the third lens barrel (221), and the direction of the light is changed through the second lens group module (222) and flows into the camera module (210). In this embodiment, a through hole (H2) is provided at one end of the lens barrel mounting frame (230) that is away from the camera module (210), and the third lens barrel (221) is fixed by passing through the through hole (H2), thereby vertically fixing the third lens barrel (221) to the lens barrel mounting frame (230).

[0103] Furthermore, the second lens group module (222) includes a second reflector (2221), a second focusing lens group (2222), and a third reflector (2223). The second reflector (2221), the second focusing lens group (2222), and the third reflector (2223) are sequentially spaced apart within the third lens barrel (221) along the axial direction of the third lens barrel (221).

[0104] In this embodiment, a second reflector (2221) and a third reflector (2223) are respectively connected to both ends of the third lens barrel (221), the second reflector (2221) is located on one side close to the lighting device (100), and a second focusing lens group (2222) is located between the second reflector (2221) and the third reflector (2223). The second focusing lens group (2222) is perpendicular to the axis of the third lens barrel (221), and the second reflector (2221) and the third reflector (2223) form an acute angle with the axis of the third lens barrel (221).

[0105] Light reflected from the wafer (300) first passes through the second reflector (2221), then changes direction through the second reflector (2221) and enters the second focusing lens group (2222), and after being focused through the second focusing lens group (2222), is irradiated onto the third reflector (2223), changes direction again, and is irradiated onto the camera module (210).

[0106] In a specific application, the acute angle between the axis of the second mirror (2221) and the third lens barrel (221) is 20° to 70°, and the acute angle between the axis of the third mirror (2223) and the third lens barrel (221) is also 20° to 70°, and the second focusing lens group (2222) includes at least one convex lens.

[0107] In some optional embodiments, the camera module (210) includes a camera (211), a second mounting base (212), and a protective lens group (213). Both the second mounting base (212) and the protective lens group (213) are connected to the side wall of the chamber (R), the camera (211) is connected to the second mounting base (212), and the protective lens group (213) is located between the second mounting base (212) and the lens barrel mounting frame (230).

[0108] Specifically, a through hole (H4) is installed in the side wall of the chamber (R), and the camera (211) is mounted on the outside of the side wall of the chamber (R) through a second mounting base (212) and is positioned in the through hole (H4), and the protective lens group (213) is provided within the through hole (H4) and is positioned below the camera (211), so as to seal the through hole (H4) and also protect the lens of the camera (211).

[0109] In this embodiment, the lens barrel mounting frame (230) is provided on the inner side wall of the chamber (R) and is located in the through hole (H4). The lens barrel mounting frame (230) is provided with a channel that communicates with the through hole (H4), and a light ray is incident on the camera (211) through the channel and the through hole (H4). In a specific application, the camera (211) is an industrial camera such as a CCD camera or a CMOS camera.

[0110] Furthermore, referring to FIG. 9, the protective lens group (213) includes a lens holder (2131), a pressure gasket (2132), a flat lens (2133), and a second sealing ring (2134), and the lens holder (2131), the pressure gasket (2132), the flat lens (2133), and the second sealing ring (2134) are stacked along the longitudinal direction of the lens barrel mounting frame (230).

[0111] Specifically, after the lens holder (2131) is seated in the through hole (H4) and connected to the side wall of the chamber (R), the pressure gasket (2132) and the second sealing ring (2134) grip the flat lens (2133), and the pressure gasket (2132) is positioned in the through hole (H4) and in contact with the side wall of the chamber (R), thereby sealing the through hole (H4) in cooperation with the flat lens (2133), thereby ensuring the sealability of the chamber (R).

[0112] FIG. 10 illustrates a schematic diagram of a light path formed by a lighting device (100) and an image collection device (200). Referring to FIG. 10, light emitted from a light output member (132) is emitted in a horizontal direction, focused through a first focusing lens group (1121), and then irradiated onto a first reflector (1122). By changing the direction through the first reflector (1122), the light is irradiated downward at an angle onto a wafer (300), and the light is reflected through the wafer (300) and then irradiated upward at an angle onto a second reflector (2221).

[0113] The light is directed horizontally to the second focusing lens group (2222) by changing its direction through the second reflector (2221), and after being focused through the second focusing lens group (2222), the light is directed to the third reflector (2223), and by changing its direction through the third reflector (2223), the light is directed vertically downward, passes through the flat lens (2133), and is directed to the camera (211).

[0114] In summary, in the semiconductor detection device (1000), the lighting device (100) provides illumination to the wafer (300) located on the vacuum side, and the first light path module (110) of the lighting device (100) and the second light path module (220) of the image collection device (200) cooperate to form a light path system that changes the direction of light, so that light emitted from the light output member (132) is irradiated onto the wafer (300) and then guided to the camera module (210), allowing the camera module (210) to collect image data of the wafer (300). Additionally, the control mechanism (120) of the lighting device (100) can finely adjust the position of the first light path module (110) to change the position and size of the light spot on the wafer (300).

[0115] It should be noted that the above semiconductor detection device (1000) is not limited to the detection of wafers and can also be used for, for example, microelectronic components.

[0116] Although embodiments of the present application have been illustrated and described above, the aforementioned embodiments are exemplary and should not be understood as a limitation of the present application, and changes, modifications, substitutions, and variations to the embodiments may be made within the scope of the present application. Explanation of the symbols

[0117] 1000: Semiconductor detection device; 100: Illumination device; 200: Image acquisition device; 300: Wafer; R: Chamber; 110: First optical path module; 111: Lens barrel assembly; 1111: First lens barrel; 1112: Second lens barrel; 112: First lens group module; 1121: First focusing lens group; 1122: First reflector; 120: Adjustment mechanism; 121: Sealing assembly; 1211: First mounting base; 1212: Movable sleeve; 1213: First sealing ring; 122: Lens barrel adjustment frame; 123: First adjustment structure; 1231: Movable column; 1232: Pressure block; 124: Second adjustment structure; 1241: Contact member; 1242: Movable member; 12421: Movable block; 12422: Sleeve section; 1243: Elastic assembly; 12431: Bolt; 12432: Second elastic member; 12433: Gasket; 125: First elastic member; H0: via hole; H1, H2, H3, H4, H5: through hole; A1: first male thread; A2: second male thread; 130: Light-emitting device; 131: Light input member; 132: Light output member; 133: Connecting member; 134: Flange assembly; 210: Camera module; 211: Camera; 212: Second mounting base; 213: Protective lens group; 2131: Lens holder; 2132: Press gasket; 2133: Flat lens; 2134: Second sealing ring; 220: Second optical path module; 221: Third lens barrel; 222: Second lens group module; 2221: Second reflector; 2222: Second focusing lens group; 2223: Third reflector; 230: Lens barrel mounting frame.

Claims

Claim 1 A lighting device used in a semiconductor detection device, wherein the lighting device comprises: a light-emitting device; and a first light path module; wherein at least a portion of the light-emitting device is installed within the chamber of the semiconductor detection device to provide illumination to the chamber, and the first light path module is installed within the chamber, and at least a portion of the first light path module is located downstream of the light-emitting device and is used to change the direction of light emitted from the light-emitting device, and the light-emitting device comprises: a light input member; and a light output member - located within the chamber -; wherein the light input member is connected to the light output member and is located outside the chamber, and the first light path module is connected to the light output member and at least a portion of the first light path module is located downstream of the light output member, and the first light path module comprises: a lens barrel assembly; and a first lens group module; wherein the light output member is installed in the lens barrel assembly, and the first lens group module is installed in the lens barrel assembly and is located downstream of the light output member. Claim 2 A lighting device according to claim 1, wherein the light-emitting mechanism further comprises a connecting member, and the light input member and the light output member are connected to each other through the connecting member, and the connecting member is capable of transmitting light introduced through the light input member to the light output member. Claim 3 A lighting device according to claim 1, wherein the lighting device further comprises a control mechanism, wherein at least a portion of the control mechanism is installed outside the chamber, and the control mechanism is configured to be connected to the lens barrel assembly to control the position of the lens barrel assembly. Claim 4 A lighting device according to claim 3, wherein the adjustment mechanism comprises: a sealing assembly; a lens barrel adjustment frame; and a first adjustment structure; wherein the sealing assembly is provided with a via hole, the lens barrel adjustment frame is movably connected to the sealing assembly and is located on one side in the axial direction of the via hole, the lens barrel assembly is connected to the lens barrel adjustment frame, the first adjustment structure is installed in the sealing assembly and at least a part of the first adjustment structure is located outside the chamber, and the first adjustment structure is connected to the lens barrel adjustment frame by penetrating the via hole, and the first adjustment structure is drivable to move the lens barrel adjustment frame along the axial direction of the via hole. Claim 5 A lighting device according to claim 4, wherein the sealing assembly comprises a first mounting base; and a movable sleeve; wherein the axial ends of the movable sleeve are respectively connected to the first mounting base and the lens barrel adjustment frame, and the first mounting base is installed on the outside of the chamber and connected to the side wall of the chamber. Claim 6 A lighting device according to claim 4, wherein the first adjustment structure comprises: a movable column; and a pressure block; wherein the pressure block is located outside the chamber and is connected to the sealing assembly, and a part of the movable column is located outside the chamber, and one axial end of the movable column penetrates the via hole and is connected to the lens barrel adjustment frame, and the movable column is drivable to move the lens barrel adjustment frame along the axial direction of the via hole. Claim 7 A lighting device according to claim 6, wherein the control mechanism further comprises a second control structure, the second control structure being installed in the sealing assembly, at least a portion of the second control structure being located outside the chamber, and the second control structure being connected to the first control structure and drivable to move the first control structure along the radial direction of the via hole. Claim 8 A lighting device according to claim 6, wherein the movable column is a stud, and a first male screw thread is provided at one axial end of the movable column to be screw-coupled to the lens barrel adjustment frame, and the other axial end of the movable column is rotatably connected to the pressure block. Claim 9 A lighting device according to claim 8, wherein a second male screw thread is provided at an axial end of the movable column away from the first male screw thread and is screw-coupled to the pressure block, and the pitch of the second male screw thread is not the same as the pitch of the first male screw thread. Claim 10 A lighting device according to claim 7, wherein the second adjustment structure comprises a plurality of contact members; and a movable member; wherein the movable member is installed in the sealing assembly and connected to the first adjustment structure, and the plurality of contact members are all movably connected to the sealing assembly and are pushable to move the movable member along the radial direction of the via hole. Claim 11 A lighting device according to claim 10, wherein the movable member comprises a movable block, the movable block comprises a plurality of inclined walls, the plurality of inclined walls are arranged symmetrically with respect to the center of the movable block, and each of the contact members contacts each of the inclined walls in a one-to-one correspondence. Claim 12 A lighting device according to claim 11, wherein the movable member further comprises a sleeve section, and the sleeve section is connected to the movable block and is located within the via hole. Claim 13 A lighting device according to claim 11, wherein the second adjustment structure further comprises a plurality of elastic assemblies, the plurality of elastic assemblies are installed on the movable block and arranged symmetrically with respect to the axis of the via hole, and each of the elastic assemblies is connected to the sealing assembly. Claim 14 A lighting device according to claim 12, wherein the adjustment mechanism further comprises a first elastic member, the first elastic member externally wrapping the movable column and sandwiched between the sleeve section and the lens barrel adjustment frame. Claim 15 A lighting device according to claim 3, wherein the lens barrel assembly comprises a first lens barrel and a second lens barrel, wherein the second lens barrel is connected to the first lens barrel and installed coaxially with the first lens barrel, the light output member is installed at one end of the first lens barrel away from the second lens barrel, and the adjustment mechanism is connected to the first lens barrel. Claim 16 A lighting device according to claim 15, wherein the first lens group module comprises a first focusing lens group; and a first reflector; wherein the first focusing lens group is installed within the first lens barrel, and the first reflector is installed in the second lens barrel and is located at one end away from the first lens barrel. Claim 17 A semiconductor detection device comprising: a chamber; an image acquisition device; and a lighting device according to any one of claims 1 to 16; wherein at least a portion of the light-emitting mechanism of the lighting device is installed within the chamber to provide illumination to the chamber, the first light path module is installed within the chamber to change the light path direction of the light emitted from the light-emitting mechanism, and at least a portion of the image acquisition device is installed within the chamber. Claim 18 A semiconductor detection device according to claim 17, wherein the image acquisition device comprises: a camera module; a second optical path module; and a lens barrel mounting frame; wherein the camera module is located outside the chamber, and the second optical path module and the lens barrel mounting frame are located inside the chamber, wherein the camera module is aligned with the lens barrel mounting frame in the longitudinal direction of the lens barrel mounting frame and is located at the end side of the lens barrel mounting frame, and the second optical path module is connected to the lens barrel mounting frame and used to guide light emitted from the lighting device to the camera module. Claim 19 A semiconductor detection device according to claim 18, wherein the second optical path module comprises a third lens barrel and a second lens group module, wherein the third lens barrel is vertically connected to the lens barrel mounting frame and the second lens group module is installed within the third lens barrel and used to change the optical path direction. Claim 20 A semiconductor detection device according to claim 19, wherein the second lens group module comprises a second reflector; a second focusing lens group; and a third reflector; wherein the second reflector, the second focusing lens group, and the third reflector are sequentially spaced apart within the third lens barrel along the axial direction of the third lens barrel. Claim 21 A semiconductor detection device according to claim 18, wherein the camera module comprises: a camera; a second mounting base; and a protective lens group; wherein the second mounting base and the protective lens group are both connected to the side wall of the chamber, the camera is connected to the second mounting base, and the protective lens group is located between the second mounting base and the lens barrel mounting frame. Claim 22 delete Claim 23 delete

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