Die bonding method and Die bonding equipment for performing the same

Abstract

A die bonding method and a die bonding facility for performing the same are disclosed. The die bonding method comprises the steps of: performing a die bonding process using a preset recipe for a first substrate stored in a magazine; inspecting whether a die bonded on the first substrate has been bonded normally; sequentially performing a die bonding process for the remaining substrates stored in the magazine if it is determined that the die has been bonded normally; correcting the recipe according to the inspection result if it is determined that the die has been bonded abnormally; and sequentially performing a die bonding process for the remaining substrates stored in the magazine using the corrected recipe.

Description

Technology Field

[0001] Embodiments of the present invention relate to a die bonding method and a die bonding facility for performing the same. More specifically, the invention relates to a die bonding method for bonding a die individualized by a dicing process onto a substrate and a die bonding facility suitable for performing the die bonding method. Background Technology

[0002] Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. The wafer on which the semiconductor devices are formed can be divided into a plurality of dies through a dicing process, and the dies can be bonded onto a substrate such as a printed circuit board or a lead frame through a die bonding process.

[0003] The apparatus for performing the above die bonding process may include a die transfer module for picking up dies from a wafer containing dies individualized by a dicing process and transferring them onto a die stage, and a die bonding module for picking up a die on the die stage and bonding it onto a substrate.

[0004] The die bonding module may include a bonding head for picking up a die on the die stage and bonding it onto a substrate, a substrate stage for supporting the substrate, a camera unit for detecting a bonding area on the substrate to be bonded to the die, etc. In particular, the die bonding module may bond the dies onto the substrate using a preset recipe.

[0005] Meanwhile, if the type of semiconductor device to be produced changes, substrates of new specifications and wafers having different dies formed thereon can be introduced into the die bonding device. When the type changes as described above, the die bonding process for the substrates can be performed using a new recipe, that is, a recipe pre-set corresponding to the changed type. Prior art literature

[0006] Republic of Korea Published Patent Application No. 10-2017-0039836 (Publication Date: April 12, 2017) Republic of Korea Registered Patent Application No. 10-1802080 (Registration Date: November 21, 2017) The problem to be solved

[0007] The embodiments of the present invention aim to provide a die bonding method and a die bonding facility for performing the same, which can automatically verify whether a pre-set recipe for the die bonding process is appropriate when the die bonding device is used for the first time or when the type of semiconductor device to be produced changes. means of solving the problem

[0008] A die bonding method according to one aspect of the present invention for achieving the above objective may include the steps of: performing a die bonding process using a preset recipe for a first substrate stored in a magazine; inspecting whether a die bonded on the first substrate has been bonded normally; sequentially performing a die bonding process for the remaining substrates stored in the magazine when it is determined that the die has been bonded normally; correcting the recipe according to the inspection result when it is determined that the die has been bonded abnormally; and sequentially performing a die bonding process for the remaining substrates stored in the magazine using the corrected recipe.

[0009] According to some embodiments of the present invention, the die bonding method of claim 1 may further include the step of storing the first substrate in a second magazine after performing a die bonding process on the first substrate, and the step of transferring the second magazine from a die bonding device for performing the die bonding process to an inspection device for inspecting the first substrate.

[0010] According to some embodiments of the present invention, the die bonding method may further include the step of storing the first substrate in the second magazine when it is determined that the die has been bonded normally, and the step of transferring the second magazine from the inspection device to the die bonding device.

[0011] According to some embodiments of the present invention, the second magazine can be transferred from the die bonding device to the inspection device via an overhead hoist transfer device.

[0012] According to some embodiments of the present invention, in the inspection step, the position and height of the die bonded on the first substrate can be inspected.

[0013] According to some embodiments of the present invention, in the step of correcting the recipe, offset values ​​for the die bonding position and the die bonding height can be corrected.

[0014] According to some embodiments of the present invention, a die bonding device for performing the die bonding process may be maintained in a standby state while inspecting whether the die bonded on the first substrate has been properly bonded.

[0015] A die bonding method according to another aspect of the present invention for achieving the above objective may include the steps of: performing a die bonding process using a preset recipe for a first substrate stored in a magazine; inspecting whether a die bonded on the first substrate is bonded normally; correcting the recipe according to the inspection result when it is determined that the die on the first substrate is bonded abnormally; performing a die bonding process using the corrected recipe for a second substrate stored in the magazine; inspecting whether a die bonded on the second substrate is bonded normally; and sequentially performing a die bonding process using the corrected recipe for the remaining substrates stored in the magazine when it is determined that the die on the second substrate is bonded normally.

[0016] According to another aspect of the present invention for achieving the above objective, a die bonding facility for performing a die bonding process for bonding a die on a substrate and controlling the die bonding process may include: a die bonding device for performing the die bonding process on substrates stored in a magazine; an inspection device for inspecting a substrate on which the die bonding process has been performed by the die bonding device; and a control device for controlling the operation of the die bonding device and the inspection device. The die bonding device may perform the die bonding process on a first substrate among the substrates using a preset recipe, and the inspection device may inspect whether a die has been properly bonded on the first substrate. The control device may control the operation of the die bonding device so that if it is determined that the die has been properly bonded, it performs the die bonding process on the remaining substrates among the substrates using the recipe, and if it is determined that the die has been abnormally bonded, it corrects the recipe according to the inspection result and performs the die bonding process on the remaining substrates using the corrected recipe.

[0017] According to some embodiments of the present invention, the first substrate on which the die bonding process is performed can be transferred from the die bonding device to the inspection device after being stored in the second magazine.

[0018] According to some embodiments of the present invention, when it is determined that the die is normally bonded, the first substrate may be stored in the second magazine and then transferred from the inspection device to the die bonding device.

[0019] According to some embodiments of the present invention, the die bonding facility may further include an overhead hoist transfer device for transferring the second magazine between the die bonding device and the inspection device, and the operation of the overhead hoist transfer device may be controlled by the control device.

[0020] According to some embodiments of the present invention, while checking whether the die is normally bonded on the first substrate, the control device may keep the die bonding device in a standby state. Effects of the invention

[0021] According to the embodiments of the present invention as described above, after performing a die bonding process on the first substrate, it is possible to inspect whether the die has been properly bonded on the first substrate, and the correction of the recipe can be determined based on the inspection result. Consequently, a verification operation for the pre-set recipe can be automatically performed using the inspection result for the first substrate, and the defect rate of the die bonding process for subsequent substrates can be significantly reduced. Furthermore, the die bonding device can be kept in a standby state while inspecting the first substrate, and if there is no abnormality in the inspection result, the die bonding device can be operated immediately, thereby significantly improving the operating rate of the die bonding device. In addition, even if there is an abnormality in the inspection result, the die bonding device can be operated immediately after the automatic correction of the recipe, so in this case as well, the operating rate of the die bonding device can be significantly improved. Brief explanation of the drawing

[0022] FIG. 1 is a flowchart illustrating a die bonding method according to one embodiment of the present invention. FIG. 2 is a schematic diagram illustrating a die bonding facility for performing the die bonding method illustrated in FIG. 1. FIG. 3 is a schematic plan view for explaining the die bonding device illustrated in FIG. 2. Specific details for implementing the invention

[0023] Hereinafter, embodiments of the present invention are described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below and may be embodied in various other forms. The following embodiments are provided not so as to fully complete the present invention, but rather to sufficiently convey the scope of the present invention to those skilled in the art.

[0024] In embodiments of the present invention, where one element is described as being disposed on or connected to another element, the element may be directly disposed on or connected to the other element, and other elements may be interposed between them. Alternatively, where one element is described as being directly disposed on or connected to another element, there may not be any other elements between them. Terms such as first, second, third, etc., may be used to describe various items such as various elements, compositions, regions, layers, and / or parts, but said items will not be limited by these terms.

[0025] The technical terms used in the embodiments of the present invention are used solely for the purpose of describing specific embodiments and are not intended to limit the invention. Furthermore, unless otherwise limited, all terms, including technical and scientific terms, have the same meaning as understood by a person skilled in the art with ordinary knowledge in the technical field of the present invention. Such terms, such as those defined in ordinary dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the description of the present invention, and shall not be interpreted by ideal or overly superficial intuition unless explicitly limited.

[0026] Embodiments of the present invention are described with reference to schematic drawings of ideal embodiments of the present invention. Accordingly, variations from the shapes in the drawings, such as variations in manufacturing methods and / or tolerances, are readily expected. Therefore, embodiments of the present invention are not described as being limited to specific shapes of the regions described in the drawings, but include variations in shapes; the elements described in the drawings are entirely schematic, and their shapes are not intended to describe the exact shapes of the elements, nor are they intended to limit the scope of the present invention.

[0027] FIG. 1 is a flowchart for explaining a die bonding method according to an embodiment of the present invention, and FIG. 2 is a schematic diagram for explaining a die bonding facility for performing the die bonding method illustrated in FIG. 1.

[0028] Referring to FIGS. 1 and 2, a die bonding method according to one embodiment of the present invention and a die bonding facility (2) suitable for performing the same can be used to bond individualized dies (12) by a dicing process in a semiconductor device manufacturing process onto a substrate (30), such as a printed circuit board or a lead frame. In particular, the die bonding method according to one embodiment of the present invention can be used to verify a new recipe set up to perform a die bonding process when the die bonding device (100) is used for the first time or when the type of semiconductor device to be produced changes.

[0029] A die bonding facility (2) for performing a die bonding method according to one embodiment of the present invention may include a die bonding device (100) for performing a die bonding process, an inspection device (200) for inspecting a substrate (30) on which the die bonding process has been performed by the die bonding device (100), and a control device (300) for controlling the operation of the die bonding device (100) and the inspection device (200). Additionally, the die bonding device (100) may be equipped with a control unit (102) for controlling the die bonding process, that is, for performing the die bonding process according to a preset recipe, and the inspection device (200) may be equipped with a control unit (202) for controlling an inspection process for the substrate (30) on which the die bonding process has been performed.

[0030] FIG. 3 is a schematic plan view for explaining the die bonding device illustrated in FIG. 2.

[0031] Referring to FIG. 3, the die bonding device (100) may include a die transfer module (110) for picking up and transferring a die (12) from a wafer (10), a die stage (130) on which the transferred die (12) is placed, and a die bonding module (140) for picking up the die (12) on the die stage (130) and bonding it onto the substrate (30). As an example, although not illustrated, the wafer (10) may be provided attached to a dicing tape, and the dicing tape may be mounted on a mount frame in the shape of a roughly circular ring.

[0032] The die transfer module (110) may include a stage unit (112) for supporting the wafer (10), a die ejector (not shown) for selectively separating dies (12) from the dicing tape, a picker (120) for picking up the die (12) that has been at least partially separated from the dicing tape by the die ejector, a picker drive unit for moving the picker (120), etc.

[0033] Although not illustrated, the stage unit (112) may include a wafer stage configured to be movable in a horizontal direction, an extension ring disposed on the wafer stage to support the edge portion of the dicing tape, and a clamp for expanding the dicing tape by lowering the mount frame.

[0034] The picker (120) may be placed on top of the wafer (10) supported by the stage unit (112) and may pick up the die (12) using vacuum pressure. Additionally, the picker (120) may be configured to be movable in vertical and horizontal directions by the picker drive unit and may be configured to be rotatable to adjust the angle of the die (12) picked up by the picker (120). The picker drive unit may move the picker (120) in horizontal and vertical directions to pick up the dies (12) one by one and transfer them onto the die stage (130).

[0035] The die ejector can separate the die (12) from the dicing tape by raising the die (12) to be picked up. For example, although not illustrated, the die ejector can vacuum-adsorb the lower surface of the dicing tape using vacuum pressure and may include ejector pins for raising the die (12) to separate it from the dicing tape while the dicing tape is vacuum-adsorbed.

[0036] The wafer stage may be moved horizontally by a stage drive unit (not shown) to selectively pick up the dies (12), and may also be configured to be rotatable to adjust the angle of the dies (12). A camera unit for detecting the die (12) to be picked up may be disposed on the upper part of the wafer stage, and the stage drive unit may adjust the position of the wafer stage so that the die (12) to be picked up is positioned between the die ejector and the camera unit.

[0037] The die bonding device (100) may include a load port (150) that supports a cassette (20) containing a plurality of wafers (10), and a wafer transfer unit (152) for transferring the wafer (10) from the cassette (20) onto the stage unit (110). The wafer (10) may be transferred along a wafer guide rail (154) extending horizontally from the load port (150), and the stage unit (110) may be moved to a position adjacent to the ends of the wafer guide rail (154) for loading and unloading the wafer (10).

[0038] The die bonding module (140) may include a bonding head (142) for picking up the die (12) from the die stage (130) and bonding the die (12) onto the substrate (30), a head driving unit (144) for moving the bonding head (142) in vertical and horizontal directions, and a substrate stage (146) for supporting the substrate (30). At this time, a bonding tool (not shown) on which the die (12) is adsorbed may be mounted on the lower part of the bonding head (142).

[0039] The die bonding device (100) may include a substrate transfer unit (160) for providing the substrate (30) onto a substrate stage (146). Although not illustrated in detail, the substrate transfer unit (160) may include a substrate guide rail (162) for guiding the substrate (30) from a first magazine (40) containing a plurality of substrates (30) onto the substrate stage (146) and also for guiding the substrate (30) from the substrate stage (146) to a second magazine (42) after the die bonding process is completed, grippers (164) for gripping the substrate (30) in various sections of the substrate guide rail (162), and a gripper drive unit (not shown) for moving the grippers (164). Meanwhile, the substrate stage (146) may have a built-in heater for heating the substrate (30) to a preset bonding temperature, and may also be provided with vacuum holes (not shown) for vacuum adsorbing the substrate (30). In addition, a camera unit (not shown) for detecting the area where the die (12) is to be bonded on the substrate (30) may be disposed on the upper part of the substrate stage (146).

[0040] Additionally, as an example, the die bonding device (100) may include a first magazine handling unit (170) for handling the first magazine (40) and a second magazine handling unit (180) for handling the second magazine (42). Additionally, the die bonding device (100) may include a first magazine load port (172) on which the first magazine (40) is placed, a second magazine load port (182) on which the second magazine (42) is placed, a first magazine transfer unit (174) for transferring the first magazine (40) between the first magazine load port (170) and the first magazine handling unit (170), and a second magazine transfer unit (184) for transferring the second magazine (42) between the second magazine load port (182) and the second magazine handling unit (180).

[0041] The inspection device (200) may include, although not illustrated in detail, a magazine load port (not illustrated) for supporting a magazine containing the substrates (30), for example, a second magazine (42), as shown in FIG. 2, an inspection stage (210) for supporting the substrate (30) to be inspected, and an inspection camera (220) positioned above the inspection stage (210). Additionally, although not illustrated, as an example, the inspection device (200) may be equipped with a distance sensor (not illustrated) for measuring the bonding height of the die (12) by measuring the height at which the die (12) is bonded on the substrate (30), that is, the height between the upper surface of the substrate (30) and the upper surface of the bonded die (12).

[0042] Referring again to FIG. 1, a first magazine (40) containing substrates (30) to be fed into the die bonding process and a second magazine (42) for containing substrates (30) on which the die bonding process has been performed may be supplied to the die bonding device (100), and a cassette (20) containing a plurality of wafers (10) may also be supplied to the die bonding device (100).

[0043] According to one embodiment of the present invention, in step S102, the die bonding device (100) may perform a die bonding process using a pre-set recipe for the first substrate (30), i.e., the first substrate, among the substrates (30) stored in the first magazine (40). At this time, the recipe may include position information regarding the location where the die (12) is to be bonded, i.e., the bonding area, and information regarding the bonding height, bonding pressure, etc. of the die (12).

[0044] Subsequently, in step S104, the inspection device (200) can inspect whether the die (12) bonded on the first substrate (30) has been properly bonded. In particular, although not illustrated, according to one embodiment of the present invention, a step (not illustrated) of storing the first substrate (30) in the second magazine (42) after performing a die bonding process on the first substrate (30) and a step (not illustrated) of transferring the second magazine (42) from the die bonding device (100) to the inspection device (200) may be performed.

[0045] According to one embodiment of the present invention, the die bonding facility (2) may include a transfer device (400) for transferring the second magazine (42) between the die bonding device (100) and the inspection device (200), as an example, an overhead hoist transport (OHT) device, and the overhead hoist transport device (400) may be controlled by the control device (300). For example, the control device (300) may command the overhead hoist transport device (400) to transfer the second magazine (42), and the overhead hoist transport device (400) may transfer the second magazine (42) from the die bonding device (100) to the inspection device (200) in accordance with the command.

[0046] Although not described in detail, the overhead hoist transfer device (400) may include a travel rail extending from the upper part of the die bonding device (100) and the inspection device (200), a travel module configured to be movable on the travel rail, and a hoist module connected to the lower part of the travel module for lifting the second magazine (42).

[0047] The inspection device (200) can inspect whether the die (12) is accurately bonded to a predetermined position, i.e., a predetermined bonding area, on the first substrate (30), and the height at which the die (12) is bonded to the first substrate (30). As an example, the bonding position of the die (12) can be inspected by an inspection camera (220) positioned above the inspection stage (210), and the bonding height of the die (12) can be measured by a distance sensor (not shown) positioned above the inspection stage (210).

[0048] Referring again to FIG. 1, in step S106, if the inspection device (200) determines that the die (12) is properly bonded, the die bonding process for the remaining substrates (30) stored in the first magazine (40) can be performed sequentially according to the preset recipe. Specifically, the inspection device (200) can transmit the inspection result to the control device (300) after the inspection process for the die (12) bonded on the first substrate (30) is completed, and the control device (300) can control the operation of the die bonding device (100) so that the die bonding process for the remaining substrates (30) stored in the first magazine (40) is performed sequentially when the inspection result confirms that the die (12) is properly bonded on the first substrate (30).

[0049] According to one embodiment of the present invention, although not illustrated, when it is determined that the die (12) has been properly bonded, a step (not illustrated) of storing the first substrate (30) in the second magazine (42) and a step (not illustrated) of transferring the second magazine (42) from the inspection device (200) to the die bonding device (100) may be performed. That is, after the die bonding process is performed on the remaining substrates (30) stored in the first magazine (40), the remaining substrates (30) may be sequentially stored in the second magazine (42). However, unlike the above, considering the time required for transferring the second magazine (42), the remaining substrates (30) may be stored in a third magazine (not illustrated) that is additionally provided after the die bonding process is performed.

[0050] Unlike the above, in step S108, if it is determined that the die (12) is abnormally bonded, the recipe can be corrected according to the inspection result. Specifically, the inspection device (200) can transmit the inspection result for the die (12) bonded on the first substrate (30) to the control device (300), and the control device (300) can correct the recipe according to the inspection result. Subsequently, in step S110, the control device (300) can control the operation of the die bonding device (100) so that the die bonding device (100) sequentially performs the die bonding process for the remaining substrates (30) stored in the first magazine (40) using the corrected recipe.

[0051] For example, the control device (300) can correct offset values ​​for the die bonding position and the die bonding height according to the inspection result. Consequently, by performing the die bonding process for the remaining substrates (30) using the corrected recipe, the die bonding process for the remaining substrates (30) can be performed normally.

[0052] According to one embodiment of the present invention, the die bonding device (100) may be kept in a standby state while performing an inspection step (S104) for the first substrate (30). Specifically, the control device (300) may keep the die bonding device (100) in a standby state while performing the S104 step, and may control the operation of the die bonding device (100) so that if the inspection result shows that the die (12) is normally bonded on the first substrate (30), the die bonding process for the remaining substrates (30) stored in the first magazine (40) is performed immediately.

[0053] As another example, although not illustrated, a step (not illustrated) of performing a die bonding process for a second substrate (30) among the substrates (30) stored in the first magazine (40) using the corrected recipe, and a step (not illustrated) of inspecting whether the die (12) bonded on the second substrate (30) has been properly bonded may be additionally performed. That is, the verification step for the corrected recipe can be performed using the second substrate (30), and through this, it can be confirmed whether the correction of the recipe has been properly performed.

[0054] Meanwhile, while the die bonding step for the second substrate (30) and the inspection step for the second substrate (30) are being performed, the die bonding device (100) may be kept in a standby state, and if the inspection result for the second substrate (30) determines that the die is normally bonded on the second substrate (30), the die bonding process for the remaining substrates (30) stored in the first magazine (40) may be performed using the corrected recipe. Alternatively, if the die (12) is determined to be abnormally bonded on the second substrate (30), a second correction of the recipe may be performed according to the inspection result for the second substrate (30), and the die bonding process for the remaining substrates (30) stored in the first magazine (40) may be performed sequentially using the second corrected recipe.

[0055] According to the embodiments of the present invention as described above, after performing a die bonding process on the first substrate (30), it is possible to inspect whether the die (12) is properly bonded on the first substrate (30), and the correction of the recipe can be determined based on the inspection result. Consequently, a verification operation for the pre-set recipe can be automatically performed using the inspection result for the first substrate (30), and accordingly, the defect rate of the die bonding process for subsequent substrates (30) can be significantly reduced. In addition, the die bonding device (100) can be kept in a standby state while inspecting the first substrate (30), and if there is no abnormality in the inspection result, the die bonding device (100) can be operated immediately, thereby significantly improving the operating rate of the die bonding device (100). In addition, even if there is an abnormality in the above inspection result, the die bonding device (100) can be operated immediately after automatic correction of the above recipe, so in this case, the operating rate of the die bonding device (100) can also be greatly improved.

[0056] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as described in the following claims. Explanation of the symbols

[0057] 2 : Die bonding equipment 10 : Wafer 12 : Die 20 : Cassette 30: Substrate 40: 1st Magazine 42: 2nd Magazine 100: Die Bonding Device 110: Die transfer module 112: Stage unit 120 : Picker 130 : Die Stage 140: Die bonding module 142: Bonding head 146 : Substrate stage 200 : Inspection device 210: Inspection Stage 220: Inspection Camera 300: Control unit 400: Transfer unit

Claims

Claim 1 A step of performing a die bonding process on a first substrate among the substrates stored in a first magazine using a pre-set recipe; a step of storing the first substrate in a second magazine after performing the die bonding process on the first substrate; a step of transferring the second magazine from a die bonding device for performing the die bonding process to an inspection device for inspecting the first substrate via an overhead hoist transfer device; a step of inspecting whether the die bonded on the first substrate is bonded normally; a step of storing the first substrate in the second magazine and transferring the second magazine from the inspection device to the die bonding device if it is determined that the die is bonded normally, and sequentially performing a die bonding process on the remaining substrates stored in the first magazine; a step of correcting the recipe according to the inspection result if it is determined that the die is bonded abnormally. A die bonding method comprising the step of sequentially performing a die bonding process for the remaining substrates stored in the first magazine using the corrected recipe, wherein the die bonding device is maintained in a standby state so that the die bonding process for the remaining substrates stored in the first magazine is not performed while inspecting whether the die bonded on the first substrate has been properly bonded. Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 A die bonding method according to claim 1, characterized in that, in the inspection step, the position and height of the die bonded on the first substrate are inspected. Claim 6 A die bonding method according to claim 5, characterized by correcting offset values ​​for the die bonding position and die bonding height in the step of correcting the recipe. Claim 7 delete Claim 8 A step of performing a die bonding process on a first substrate stored in a first magazine using a preset recipe; a step of storing the first substrate in a second magazine after performing the die bonding process on the first substrate; a step of transferring the second magazine from a die bonding device for performing the die bonding process to an inspection device for inspecting the first substrate via an overhead hoist transfer device; a step of inspecting whether the die bonded on the first substrate is bonded normally; a step of storing the first substrate in the second magazine and transferring it from the inspection device to the die bonding device if it is determined that the die is bonded normally; a step of correcting the recipe according to the inspection result if it is determined that the die on the first substrate is bonded abnormally; a step of performing a die bonding process on a second substrate stored in the first magazine using the corrected recipe; a step of inspecting whether the die bonded on the second substrate is bonded normally. A die bonding method comprising the step of sequentially performing a die bonding process using the corrected recipe on the remaining substrates stored in the first magazine when it is determined that the die bonded on the second substrate has been properly bonded, wherein the die bonding device is maintained in a standby state so that the die bonding process for the remaining substrates stored in the first magazine is not performed while inspecting whether the die bonded on the first substrate has been properly bonded. Claim 9 A die bonding facility for performing a die bonding process for bonding a die onto a substrate and controlling the die bonding process, comprising: a die bonding device for performing the die bonding process on substrates stored in a first magazine; and an inspection device for inspecting a substrate on which the die bonding process has been performed by the die bonding device. The apparatus includes a control device for controlling the operation of the die bonding device and the inspection device, wherein the die bonding device performs the die bonding process on a first substrate among the substrates stored in the first magazine using a preset recipe, the inspection device inspects whether a die is properly bonded on the first substrate, and if the control device determines that the die is properly bonded, it performs the die bonding process on the remaining substrates among the substrates stored in the first magazine using the recipe, and if the die is determined to be abnormally bonded, it corrects the recipe according to the inspection result and performs the die bonding process on the remaining substrates stored in the first magazine using the corrected recipe, and controls the operation of the die bonding device so that the die bonding device is kept in a standby state so that the die bonding process on the remaining substrates stored in the first magazine is not performed while the inspection is being conducted to determine whether the die bonded on the first substrate is properly bonded, the first substrate on which the die bonding process has been performed is stored in a second magazine and then transferred from the die bonding device to the inspection device, and the die is normally A die bonding facility characterized in that, when it is determined that the first substrate is bonded, the first substrate is stored in the second magazine and then transferred from the inspection device to the die bonding device, and further includes an overhead hoist transfer device for transferring the second magazine between the die bonding device and the inspection device, wherein the operation of the overhead hoist transfer device is controlled by the control device. Claim 10 delete Claim 11 delete Claim 12 delete Claim 13 delete Claim 14 A die bonding facility according to claim 9, wherein the inspection device comprises an inspection camera for inspecting the position where the die is bonded on the substrate, and a distance sensor for measuring the bonding height of the die by measuring the height of the upper surface of the substrate and the height of the upper surface of the die bonded on the substrate.

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