Novel diamine compounds, polyamide polymer and polybenzooxazole formed therefrom
A novel diamine compound facilitates the synthesis of a polyamide polymer that is converted into polybenzoxazole at lower temperatures, addressing degradation issues and enhancing flexibility and heat resistance, suitable for semiconductor and flexible substrate applications.
Patent Information
- Authority / Receiving Office
- KR · KR
- Patent Type
- Patents
- Current Assignee / Owner
- 한인정밀화학(주)
- Filing Date
- 2023-05-17
- Publication Date
- 2026-07-21
AI Technical Summary
Existing polybenzoxazole manufacturing processes face issues with degradation at high temperatures and incomplete cyclization, leading to reduced moisture resistance and corrosion resistance, and there is a need for a polybenzoxazole film with improved flexibility and heat resistance.
A novel diamine compound is used to synthesize a polyamide polymer, which is then converted into polybenzoxazole at lower temperatures, avoiding degradation and enhancing flexibility and heat resistance through structural units that suppress charge transfer complexes and reduce crystallinity.
The process results in a polybenzoxazole film with improved optical properties, dielectric constant, and heat resistance, suitable for applications in semiconductor devices and flexible substrates.
Smart Images
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