A laminate, a laminate having a component for an electronic device, and a method for manufacturing an electronic device

Abstract

The present invention provides a method for manufacturing an electronic device, a laminate having a member for an electronic device, and an electronic device, wherein the substrate having the member for an electronic device can be peeled off by laser peeling after forming the member for an electronic device on a substrate by a method involving heat treatment (e.g., 200°C or higher), and further wherein the peeled substrate having the member for an electronic device has a seed layer for performing plating treatment. The laminate of the present invention comprises a support substrate, an adhesion layer, a metal layer, and a substrate in that order, and the metal layer comprises at least one metal selected from the group consisting of copper, titanium, palladium, gold, nickel, tungsten, and molybdenum.

Description

Technology Field

[0001] The present invention relates to a laminate, a laminate having a component for an electronic device, and a method for manufacturing an electronic device. Background Technology

[0002] Electronic devices such as solar cells (PV); liquid crystal panels (LCD); organic EL panels (OLED); and receiving sensor panels that detect electromagnetic waves, X-rays, ultraviolet rays, visible light, infrared rays, etc., are becoming thinner and lighter. Along with this, substrates used in electronic devices, such as glass substrates, are also becoming thinner. If the strength of the substrate is insufficient due to thinning, the handling properties of the substrate are reduced, and problems may occur in processes such as forming components for electronic devices on the substrate (component formation processes).

[0003] Recently, in order to address the above problem, a method has been proposed to prepare a glass laminate in which a glass substrate and a reinforcing plate are laminated, and to form a component for an electronic device such as a display device on the glass substrate of the glass laminate, and then to separate the reinforcing plate from the glass substrate (see, for example, Patent Document 1). The reinforcing plate has a support substrate and a silicone resin layer fixed on said support substrate, and in the glass laminate, the silicone resin layer and the glass substrate are adhered to each other in a way that allows them to be peeled off. Prior art literature

[0004] International Publication No. 2007 / 018028 The problem to be solved

[0005] In Patent Document 1, when peeling off a glass substrate on which an electronic device component is disposed from a reinforcing plate, mechanical peeling was mainly performed by applying a physical force to the glass substrate to peel it off from the reinforcing plate.

[0006] Meanwhile, in recent years, with the increase in functionality and complexity of components for electronic devices, it is necessary to handle components for electronic devices with greater caution. If mechanical peeling is performed as described in Patent Document 1, there is a risk of adverse effects on the components for electronic devices.

[0007] As a method different from the mechanical peeling described above, there is laser peeling, which involves irradiating a target object with a laser to cause peeling between two components. Laser peeling is desirable because it can suppress the application of physical force to the components for electronic devices. In addition, when forming components for electronic devices on a substrate, heat treatment is often involved. Therefore, it is desirable to be able to peel off the substrate containing the components for electronic devices from the obtained laminate by laser peeling after forming the components for electronic devices on the substrate by a method involving heat treatment.

[0008] In addition, if it is possible to perform a direct plating treatment on a substrate having a peeled electronic device component, it is desirable to be able to efficiently form a new circuit on the substrate.

[0009] Taking into account the above circumstances, the present invention aims to provide a laminate having a seed layer for performing plating treatment on a substrate, wherein a substrate having an electronic device component can be peeled off by laser peeling after forming an electronic device component on a substrate by a method involving heat treatment (e.g., 200°C or higher), and furthermore, the peeled substrate having an electronic device component has a seed layer for performing plating treatment.

[0010] The present invention also has the objective of providing a laminate having a component for an electronic device and a method for manufacturing an electronic device. means of solving the problem

[0011] The inventors have found that, as a result of careful consideration, the problem described above can be solved by the following configuration.

[0012] (1) A supporting substrate, an adhesive layer, a metal layer, and a substrate are formed in this order,

[0013] A laminate comprising a metal layer comprising at least one metal selected from the group consisting of copper, titanium, palladium, gold, nickel, tungsten, and molybdenum.

[0014] (2) A laminate described in (1) comprising at least one metal selected from the group consisting of copper, titanium, palladium, gold and nickel.

[0015] (3) The metal layer has a first metal layer and a second metal layer disposed on the first metal layer,

[0016] A laminate described in (1) or (2), wherein the type of metal included in the first metal layer and the type of metal included in the second metal layer are different.

[0017] (4) The first metal layer is positioned on the substrate side rather than the second metal layer, and

[0018] A laminate described in (3), in which the first metal layer comprises titanium.

[0019] (5) A laminate described in (4), in which the second metal layer contains copper.

[0020] (6) The metal layer has a first through hole extending in the thickness direction, and

[0021] The substrate has a second through hole extending in the thickness direction, and

[0022] A laminate described in any one of (1) to (5), in which the first through hole and the second through hole are in communication.

[0023] (7) A laminate described in (6) having a metal covering made of metal that covers at least a portion of the inner wall surface of the second through hole.

[0024] (8) A laminate described in any one of (1) to (7), wherein the adhesive layer is a silicone resin layer.

[0025] (9) A laminate described in any one of (1) to (8), wherein the substrate is a glass substrate.

[0026] (10) A laminate described in any one of (1) to (9), wherein the supporting material is a glass substrate.

[0027] (11) A laminate described in any one of (1) to (10), and

[0028] A laminate having an electronic device member disposed on a substrate in the laminate.

[0029] (12) A process for forming a component for an electronic device on the substrate surface of a laminate described in any one of (1) to (10) to obtain a laminate having a component for an electronic device, and

[0030] A method for manufacturing an electronic device comprising a separation process in which a laser is irradiated from the side of a supporting substrate of a laminate having an electronic device member, and the supporting substrate and the adhesion layer are peeled off from the laminate having an electronic device member, thereby obtaining an electronic device having an electronic device member, a substrate, and a metal layer. Effects of the invention

[0031] According to the present invention, taking into account the above circumstances, after forming a component for an electronic device on a substrate by a method involving heat treatment, the substrate having the component for an electronic device can be peeled off by laser peeling, and furthermore, the peeled substrate having the component for an electronic device can have a seed layer for performing plating treatment, thereby providing a laminate.

[0032] According to the present invention, a laminate having a member for an electronic device and a method for manufacturing an electronic device can be provided. Brief explanation of the drawing

[0033] FIG. 1 is a cross-sectional view schematically illustrating a first embodiment of the laminate of the present invention. FIG. 2 is a cross-sectional view schematically illustrating a second embodiment of the laminate of the present invention. Figure 3 is a top view of the laminate shown in Figure 2. FIG. 4 is a cross-sectional view schematically illustrating a modified example of a second embodiment of the laminate of the present invention. Figure 5 is a drawing for explaining the process of forming a member. Figure 6 is a diagram illustrating the separation process. Specific details for implementing the invention

[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the following embodiments are illustrative for explaining the present invention, and the present invention is not limited to the embodiments described below. Furthermore, various modifications and substitutions may be added to the following embodiments without departing from the scope of the present invention.

[0035] The numerical range indicated using "inner" refers to a range that includes the values ​​listed before and after "inner" as lower and upper limits.

[0036] A characteristic feature of the laminate of the present invention is that it uses a metal layer containing a predetermined metal.

[0037] It is known that the desired effect can be obtained by adopting the above configuration. First, when a laser is irradiated onto the laminate of the present invention, delamination occurs between the adhesion layer and the metal layer, making so-called laser delamination possible. In addition, the substrate having the delaminated electronic device member has a metal layer, and this metal layer can be used as a seed layer during plating treatment.

[0038] <First embodiment of the laminated body>

[0039] FIG. 1 is a cross-sectional view schematically illustrating a first embodiment of the laminate of the present invention.

[0040] The laminate (10A) comprises a support substrate (12), an adhesion layer (14), a metal layer (16A), and a substrate (18A) in this order.

[0041] As described below, after forming an electronic device component on a substrate (18A) of a laminate (10A) by a method involving heat treatment, when a laser is irradiated onto the laminate (10A) having the electronic device component, peeling occurs at the interface between the adhesion layer (14) and the metal layer (16A).

[0042] The two-layer portion including the support substrate (12) and the adhesion layer (14) has the function of reinforcing the substrate (18A). In addition, the two-layer portion including the support substrate (12) and the adhesion layer (14) that is prepared in advance for the manufacture of the laminate (10A) is also referred to as the support substrate (20) having an adhesion layer.

[0043] As described above, in this laminate (10A), the support substrate (20) having an adhesive layer is separated. The separated support substrate (20) having an adhesive layer can be laminated with a laminate substrate having a new metal layer (16A) and a substrate (18A) and reused as a new laminate (10A).

[0044] Below, each layer constituting the laminate (10A) will be described in detail, and then the manufacturing method of the laminate (10A) will be described in detail.

[0045] (Support entry)

[0046] The supporting material (12) is a member that supports and reinforces the substrate (18A).

[0047] Examples of supporting materials (12) include a glass substrate, a plastic plate, and a metal plate (e.g., a SUS plate). Among these, a glass substrate is preferred.

[0048] As for the type of glass, alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high-silica glass, and other oxide-based glasses having silicon oxide as the main component are preferred. As for the oxide-based glass, glass with a silicon oxide content of 40 to 90 mass% in terms of oxide equivalent is preferred.

[0049] As a glass substrate, more specifically, a glass substrate containing alkali-free borosilicate glass (product name “AN100”) manufactured by AGC Co., Ltd. can be cited.

[0050] A method for manufacturing a glass substrate can typically be obtained by melting glass raw materials and forming the molten glass into a plate. Such forming methods may be general, and examples include the float method, fusion method, and slot down-draw method.

[0051] The shape of the support material (12) (shape of the main surface) is not particularly limited, but a rectangular shape or a circular shape is preferred.

[0052] The thickness of the support substrate (12) may be thicker or thinner than the substrate (18A). In terms of handling of the laminate (10A), it is preferable that the thickness of the support substrate (12) be thicker than the substrate (18A).

[0053] It is preferable that the support substrate (12) is not flexible. Therefore, the thickness of the support substrate (12) is preferably 0.3 mm or more, and more preferably 0.5 mm or more.

[0054] Meanwhile, the thickness of the support substrate (12) is preferably 2.0 mm or less, and more preferably 1.0 mm or less.

[0055] (Adhesion layer)

[0056] The adhesion layer (14) is a layer that adheres to the metal layer (16A) to prevent misalignment of the metal layer (16A) and the substrate (18A) until laser peeling is performed. As described later, peeling occurs between the adhesion layer (14) and the metal layer (16A) by irradiation with a laser.

[0057] The adhesive layer (14) may be an organic layer or an inorganic layer.

[0058] Examples of materials for the organic layer include acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, polyimide silicone resin, and fluoropolymer resin. Additionally, the adhesion layer (14) may be formed by mixing several types of resins.

[0059] Examples of materials for the inorganic layer include oxides, nitrides, oxynitrides, carbides, carbonitrides, silicides, and fluorides. Examples of oxides (preferably metal oxides), nitrides (preferably metal nitrides), and oxynitrides (preferably metal oxynitrides) include one or more elemental oxides, nitrides, and oxynitrides selected from the group consisting of Si, Hf, Zr, Ta, Ti, Y, Nb, Na, Co, Al, Zn, Pb, Mg, Bi, La, Ce, Pr, Sm, Eu, Gd, Dy, Er, Sr, Sn, In, and Ba.

[0060] Examples of carbides (preferably metal carbides) and carbonitrides (preferably metal carbonitrides) include one or more elemental carbides, carbonitrides, and carbonates selected from the group consisting of Ti, W, Si, Zr, and Nb.

[0061] Examples of silicides (preferably metallic silicides) include one or more elemental silicides selected from the group consisting of Mo, W, and Cr.

[0062] As fluorides (preferably, metal fluorides), one or more elemental fluorides selected from the group consisting of, for example, Mg, Y, La, and Ba may be used.

[0063] The adhesion layer (14) may be a plasma polymerization membrane.

[0064] When the adhesion layer (14) is a plasma polymer film, the materials forming the plasma polymer film may include, for example, fluorocarbon monomers such as CF4, CHF3, C2H6, C3H6, C2H2, CH3F, C4H8, hydrocarbon monomers such as methane, ethane, propane, ethylene, propylene, acetylene, benzene, toluene, hydrogen, and SF6.

[0065] Among these, regarding heat resistance and peelability, silicone resin and polyimide silicone resin are preferred as the material of the adhesion layer (14), silicone resin is more preferred, and silicone resin formed by addition reaction type silicone or condensation reaction type silicone is even more preferred. That is, the adhesion layer (14) is preferably a silicone resin layer.

[0066] Below, an embodiment in which the adhesion layer (14) is a silicone resin layer will be described in detail.

[0067] The silicone resin constituting the silicone resin layer is a resin containing a predetermined organosiloxy unit and is typically obtained by curing curable silicone. Curable silicone is classified into addition-type silicone, condensation-type silicone, UV-curable silicone, and electron-beam-curable silicone based on its curing mechanism, but all of them can be used. Among these, addition-type silicone or condensation-type silicone is preferred.

[0068] The adhesion layer (14) is preferably formed using a curable composition containing curable silicone.

[0069] In addition to the curable silicon, the curable composition may include a solvent, a platinum catalyst (when using addition-reaction silicon as the curable silicon), a leveling agent, a metal compound, etc. Examples of metal elements included in the metal compound include 3d transition metals, 4d transition metals, lanthanoid metals, bismuth, aluminum, and tin. The content of the metal compound is not particularly limited and is appropriately adjusted.

[0070] It is preferable that the adhesion layer (14) be bonded to the support substrate (12) with a strong bonding force. As a method to increase the adhesion between the two, for example, when the adhesion layer (14) is a silicone resin layer, the silicone resin layer can be formed on the surface of the support substrate (12) (more specifically, by curing a curable silicone (organopolysiloxane) capable of forming a predetermined silicone resin on the support substrate (12)), thereby adhering the silicone resin in the silicone resin layer to the surface of the support substrate (12) and obtaining a high bonding force. In addition, the bonding force between the surface of the support substrate (12) and the silicone resin layer can be increased by performing a treatment that generates a strong bonding force between the surface of the support substrate (12) and the silicone resin layer (for example, a treatment using a coupling agent).

[0071] The thickness of the adhesive layer (14) is preferably 100 μm or less, more preferably 50 μm or less, and even more preferably 30 μm or less. Meanwhile, the thickness of the adhesive layer (14) is preferably greater than 1 μm, and more preferably 4 μm or more. The thickness is the result of measuring the thickness of the adhesive layer (14) at five or more arbitrary locations using a contact-type film thickness measuring device and averaging them.

[0072] (metal layer)

[0073] The metal layer (16A) is in contact with the adhesion layer (14) and is peeled off from the adhesion layer (14) together with the substrate (18A) after laser irradiation. The metal layer (16A) then functions as a seed layer for plating treatment.

[0074] The metal layer (16A) comprises at least one metal selected from the group consisting of copper, titanium, palladium, gold, nickel, tungsten and molybdenum.

[0075] Among them, in terms of good peelability during laser peeling, the metal layer (16A) preferably comprises at least one metal selected from the group consisting of copper, titanium, palladium, gold and nickel.

[0076] The metal layer (16A) may contain only one type of metal or may contain multiple types of metals.

[0077] The metal layer (16A) may be a single layer or a multi-layer structure.

[0078] In the case where the metal layer (16A) has a single-layer structure, after peeling off the substrate having the metal layer (16A) by laser peeling, the metal layer (16A) preferably comprises at least one metal selected from the group consisting of titanium, palladium, gold, nickel, tungsten, and molybdenum, in order to have better adhesion between the metal layer (16A) and the substrate (18A).

[0079] When the metal layer (16A) is a multilayer structure, the metal layer (16) may be a structure in which multiple layers containing different types of metals are stacked.

[0080] For example, if the metal layer (16A) has a two-layer structure, the metal layer (16A) has a first metal layer and a second metal layer disposed on the first metal layer, and the type of metal included in the first metal layer and the type of metal included in the second metal layer are different.

[0081] Although the above description explains in detail that the metal layer (16A) has a two-layer structure, the metal layer (16A) may have a stacked structure of three or more layers.

[0082] When the metal layer (16A) has a multilayer structure, after forming an electronic device member on a substrate (18A) by a method involving heat treatment, the metal layer (16A) has a first metal layer and a second metal layer disposed on the first metal layer, and the first metal layer is disposed on the substrate (18A) side more than the second metal layer, and it is preferable that the first metal layer includes titanium.

[0083] In addition, in this form, it is preferable that the second metal layer contains copper.

[0084] The thickness of the metal layer (16A) is not particularly limited, but 5 to 1000 nm is preferred and 10 to 500 nm is more preferred in that the adhesion between the metal layer (16A) and the substrate (18A) is better after the substrate having the metal layer (16A) is peeled off by laser peeling.

[0085] In addition, when the metal layer (16A) has a two-layer structure having a first metal layer and a second metal layer, and the first metal layer is positioned closer to the substrate (18A) than the second metal layer, the thickness of the first metal layer is preferably 5 to 300 nm, more preferably 10 to 200 nm, and the thickness of the second metal layer is preferably 5 to 600 nm, more preferably 10 to 400 nm.

[0086] (Circuit board)

[0087] The substrate (18A) is a component for forming a device component thereon.

[0088] The type of substrate (18A) is not particularly limited and may include, for example, a glass substrate, a plastic plate, or a metal plate (for example, a SUS plate). Among these, a glass substrate is preferred.

[0089] As a specific type of glass substrate, the description of the glass substrate described in the above-described support material (12) can be cited.

[0090] The thickness of the substrate (18A) is preferably 0.5 mm or less, more preferably 0.4 mm or less, even more preferably 0.2 mm or less, and particularly preferably 0.10 mm or less in terms of thinning and / or weight reduction. When the thickness is 0.5 mm or less, it is possible to impart good flexibility to the substrate (18A). When the thickness is 0.2 mm or less, it is possible to wind the substrate (18A) into a roll.

[0091] In addition, the thickness of the substrate (18A) is preferably 0.03 mm or more, in order to facilitate handling of the substrate (18A).

[0092] Additionally, the substrate (18A) may include two or more layers, and in this case, the material forming each layer may be of the same material or of a different material.

[0093] Method for manufacturing a laminate

[0094] The method of manufacturing the laminate (10A) is not particularly limited and known methods may be used.

[0095] Among these, it is preferable to have a process for forming an adhesive layer (14) on a support substrate (12) to obtain a support substrate having an adhesive layer, a process for forming a metal layer (16A) on a substrate (18A) to obtain a substrate having a metal layer, and a stacking process for stacking a support substrate having an adhesive layer and a substrate having a metal layer so that the adhesive layer (14) and the metal layer (16A) come into contact to obtain a stacked body (10A).

[0096] The adhesion layer formation process, metal layer formation process, and lamination process are described in detail below.

[0097] (Adhesion layer formation process)

[0098] The process of forming an adhesive layer is a process of forming an adhesive layer (14) on a support substrate (12) to obtain a support substrate having an adhesive layer. The method of forming the adhesive layer (14) is not particularly limited and may employ a known method, and varies depending on the type of material constituting the adhesive layer (14).

[0099] For example, when the adhesive layer (14) is an organic layer, methods for producing the organic layer may include, for example, a method of applying a curable resin composition containing a curable resin onto a support substrate (12) and curing the formed curable resin composition layer to form an adhesive layer (14) fixed on the support substrate (12) (application method), or a method of fixing a film-like adhesive layer (14) to the surface of the support substrate (12) (attachment method). Among these, the application method is preferred in that the adhesive strength of the adhesive layer (14) to the support substrate (12) is superior.

[0100] In the coating method, as a method for forming a curable resin composition layer on the surface of a support substrate (12), for example, a method of coating a curable resin composition on the surface of a support substrate (12). Examples of coating methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating.

[0101] The curing method is not particularly limited, and the optimal curing conditions are selected based on the resin used. Typically, heat treatment is employed as the curing method.

[0102] In addition to the above, the organic layer may also be produced using the disclosed method.

[0103] For example, the method of producing an adhesive layer containing a fluoropolymer resin is not particularly limited, and may include a method of producing an adhesive layer using a composition containing a fluoropolymer resin or a method of producing an adhesive layer on the surface of an object by irradiating plasma using a fluorine-based gas.

[0104] In addition, when the adhesion layer (14) is an inorganic layer, a known method may be adopted as the method for manufacturing the inorganic layer. For example, a method of providing an inorganic layer containing a predetermined component on a support substrate (12) by deposition, sputtering, or CVD may be cited.

[0105] In addition, as a method for producing an inorganic layer containing a carbon (carbon material), for example, a resin composition containing a resin component such as phenolic resin is applied onto a supporting substrate (12), and carbonized by performing a sintering treatment.

[0106] The manufacturing conditions for various methods are appropriately selected to be optimal depending on the materials used.

[0107] (Metal layer formation process)

[0108] The metal layer formation process is a process of forming a metal layer (16A) on a substrate (18A) to obtain a substrate having a metal layer.

[0109] The method of forming the metal layer (16A) is not particularly limited and known methods may be employed. For example, a method of forming a metal layer (16A) containing a predetermined component on a substrate (18A) by deposition, sputtering, or CVD may be used.

[0110] (Lamination process)

[0111] The lamination process is a process of laminating a support substrate having an adhesive layer and a substrate having a metal layer so that the adhesive layer (14) of the support substrate having an adhesive layer obtained in the above-described adhesive layer formation process and the metal layer (16A) of the substrate having a metal layer obtained in the above-described metal layer formation process come into contact, thereby obtaining a laminate (10A).

[0112] The method of laminating a support substrate having an adhesion layer and a substrate having a metal layer is not particularly limited, and known methods may be employed.

[0113] For example, a method may be used in which a support substrate having an adhesive layer and a substrate having a metal layer are overlapped under an atmospheric pressure environment. Additionally, if necessary, after overlapping the support substrate having an adhesive layer and the substrate having a metal layer, the support substrate having an adhesive layer and the substrate having a metal layer may be compressed using a roll or a press. It is preferable that air bubbles mixed between the adhesive layer (14) and the metal layer (16) are relatively easily removed by compression using a roll or a press.

[0114] Compression using vacuum lamination or vacuum pressing is more preferable because it suppresses the incorporation of air bubbles and ensures good adhesion. There is also the advantage that by compressing under vacuum, even if minute air bubbles remain, they do not grow due to heating, making it difficult to lead to deformation defects.

[0115] When laminating a support substrate having an adhesive layer and a substrate having a metal layer, it is preferable to sufficiently clean the surface of the adhesive layer (14) and the surface of the metal layer (16A) and to laminate in a high-cleanliness environment.

[0116] In addition, after laminating a support substrate having an adhesion layer and a substrate having a metal layer, a pre-annealing treatment (heat treatment) may be performed as needed. By performing the said pre-annealing treatment, the adhesion between the support substrate having an adhesion layer and the substrate having a metal layer is improved.

[0117] <Second embodiment of the laminate>

[0118] FIG. 2 is a cross-sectional view schematically illustrating a second embodiment of the laminate of the present invention. FIG. 3 is a top view of the laminate illustrated in FIG. 2. FIG. 2 corresponds to a cross-sectional view along line AA in FIG. 3.

[0119] The laminate (10B) comprises a support substrate (12), an adhesive layer (14), a metal layer (16B), and a substrate (18B) in this order.

[0120] In the laminate (10B) of the second embodiment, the metal layer (16B) and the substrate (18B) each have a through hole, except that they have the same configuration as the laminate (10A) of the first embodiment described above. Identical configurations in the laminate (10B) and the laminate (10A) are given the same reference numerals, and their descriptions are omitted.

[0121] The metal layer (16B) has a plurality of first through holes (22) that extend along the thickness direction of the metal layer (16B).

[0122] Additionally, the substrate (18B) has a plurality of second through holes (24) that extend along the thickness direction of the substrate (18B).

[0123] The first through hole (22) and the second through hole (24) are connected.

[0124] Additionally, the boundary between the first through hole (22) and the second through hole (24) is located at the interface in the thickness direction of the metal layer (16B) and the substrate (18B).

[0125] As described above, when a substrate in a laminate has a through hole, conductivity between electronic devices placed on both sides of the substrate can be achieved by filling the through hole with a conductor (e.g., metal). Additionally, as described below, plating treatment may be used as a method for filling the through hole with a conductor.

[0126] The diameter of the opening of the first through hole (22) is not particularly limited, but 5 to 500 μm is preferred and 10 to 200 μm is more preferred in terms of making it easier to fill the metal inside the first through hole (22). In addition, if the shape of the opening of the first through hole is not circular, the longer diameter is used as the diameter.

[0127] The diameter of the opening of the second through hole (24) is not particularly limited, but 10 to 500 μm is preferred and 15 to 200 μm is more preferred in terms of making it easier to fill the second through hole (24) with metal. In addition, if the shape of the opening of the second through hole is not circular, the longer diameter is used as the diameter.

[0128] The number of the first through hole (22) and the second through hole (24) may each be one or multiple.

[0129] When a plurality of first through holes (22) and second through holes (24) are provided, the distance between the centers in the in-plane direction between the through holes is selected as an optimal distance (e.g., 20 to 400 μm) depending on the application.

[0130] In FIG. 2, the opening of the first through hole (22) and the opening of the second through hole (24) are of the same size, but the present invention is not limited to this shape and the sizes of both may be different.

[0131] The method of manufacturing the laminate (10B) illustrated in FIG. 2 is not particularly limited, and there is a method of performing the above-described lamination process by performing the above-described metal layer formation process, then performing a through hole formation process to form through holes that penetrate the substrate and the metal layer respectively, and then using a substrate having a metal layer having the obtained through holes to perform the above-described lamination process.

[0132] As a variation of the second embodiment, the form shown in FIG. 4 can be cited.

[0133] The laminate (10C) shown in FIG. 4 has a support substrate (12), an adhesive layer (14), a metal layer (16C), and a substrate (18C) in that order, and the metal layer (16C) and the substrate (18C) each have a first through hole (22) and a second through hole (24).

[0134] The laminate (10C) further has a metal covering (26) made of metal that covers at least a portion of the inner wall surface of the second through hole (24) of the substrate (18C).

[0135] The metal covering portion (26) corresponds to a portion that covers at least a part of the inner wall surface of the second through hole (24) on the substrate (18C) side from the interface in the thickness direction of the metal layer (16C) and the substrate (18C).

[0136] By having a metal coating (26) on the laminate (10C), the peelability between the adhesion layer (14) and the metal layer (16C) is improved during laser peeling.

[0137] Although the details of the reason for the improved peelability are unclear, when the metal layer (16C) has a first through hole (22) and the substrate (18C) has a second through hole (24), the adhesive layer (14) may reach the inner wall surface of the second through hole (24) of the substrate (18C) through the first through hole (22). In particular, this phenomenon is likely to occur when the adhesive layer (14) is prone to plastic deformation, such as a resin layer (e.g., a silicone resin layer). When a part of the adhesive layer (14) reaches and contacts the inner wall surface of the second through hole (24) of the substrate (18C), the peelability from the adhesive layer (14) of the substrate having the metal layer may be affected. In contrast, when the metal coating portion (26) is provided, the adhesion layer (14) can be prevented from coming into direct contact with the inner wall surface of the second through hole (24) of the substrate (18C), thereby suppressing peeling defects of the substrate having a metal layer during laser peeling.

[0138] In the laminate (10C) shown in FIG. 4, the metal coating portion (26) and the metal layer (16C) are integrally continuous, but at least a portion of the metal coating portion (26) may be spaced apart from the metal layer (16C).

[0139] In the laminate (10C) illustrated in FIG. 4, the metal covering portion (26) is provided to cover the entire circumference of the inner wall surface on the metal layer (16C) side of the second through hole (24) of the substrate (18C), but the present invention is not limited to this form and may be provided on a part of the inner wall surface of the second through hole (24).

[0140] As shown in FIG. 4, it is preferable that the metal coating portion (26) be provided to extend toward the substrate (18C) side from the interface in the thickness direction of the metal layer (16C) and the substrate (18C).

[0141] The type of metal constituting the metal coating (26) is not particularly limited, but at least one metal selected from the group consisting of copper, titanium, palladium, gold, nickel, tungsten, and molybdenum, which is the metal constituting the metal layer (16C), is preferred.

[0142] The type of metal constituting the metal coating (26) and the type of metal constituting the metal layer (16C) may be the same or different, but in terms of productivity, it is preferable that they be the same.

[0143] The method of manufacturing the laminate (10C) illustrated in FIG. 4 is not particularly limited, and, for example, a substrate having a metal layer (16C) and a substrate (18C) can be formed by depositing a metal on one surface of a substrate having a through hole extending along the thickness direction using a deposition method, a sputtering method, or a CVD method, and the above-described lamination process can be carried out using the obtained substrate having the metal layer.

[0144] Uses of Laminates

[0145] The laminate (the laminate of the first and second embodiments described above) can be used for various purposes, such as manufacturing electronic components including display panels, PVs, thin-film secondary batteries, semiconductor wafers with circuits formed on their surfaces, and receiving sensor panels, as described below. In these applications, the laminate may be exposed to high temperature conditions (e.g., 450°C or higher) under an atmospheric environment (e.g., for 20 minutes or more).

[0146] Panels for display devices include LCD, OLED, electronic paper, plasma display panels, field emission panels, quantum dot LED panels, micro LED display panels, MEMS shutter panels, etc.

[0147] The receiving sensor panel includes an electromagnetic wave receiving sensor panel, an X-ray receiving sensor panel, an ultraviolet receiving sensor panel, a visible light receiving sensor panel, an infrared receiving sensor panel, etc. The substrate used for the receiving sensor panel may be reinforced by a reinforcing sheet such as resin.

[0148] Method for manufacturing an electronic device

[0149] An electronic device comprising a component for an electronic device described below is manufactured using a laminate.

[0150] A method for manufacturing an electronic device comprises, for example as illustrated in FIG. 5 and FIG. 6, a component forming process for obtaining an electronic device component (28) on a substrate (18A) of a laminate (10A) (on a surface opposite to the metal layer (16A) side of the substrate (18A)) to obtain a laminate (30) having an electronic device component, and a separation process for obtaining an electronic device (32) having an electronic device component (28), a substrate (18A), and a metal layer (16A) by irradiating a laser from the support substrate (12) side of the laminate (30) having an electronic device component to peel off the support substrate (12) and the adhesive layer (14) from the laminate (30) having an electronic device component (32).

[0151] In addition, although the laminate (10A) described in the first embodiment was used as a representative example of the laminate above, the laminate (10B) and laminate (10C) described in the second embodiment can be used to manufacture an electronic device in the same manner.

[0152] Hereinafter, the process of forming a component (28) for an electronic device is called the “component forming process,” and the process of separating the electronic device (32) and the support substrate (20) having an adhesive layer is called the “separation process.”

[0153] The materials and procedures used in each process are described in detail below.

[0154] (Component formation process)

[0155] The component formation process is a process of forming a component for an electronic device on a substrate (18A) of a laminate (10A). More specifically, as shown in FIG. 5, a component (28) for an electronic device is formed on a substrate (18A) (on a surface opposite to the metal layer (16A) side of the substrate (18A)) to obtain a laminate (30) having a component for an electronic device.

[0156] First, the electronic device component (28) used in this process will be described in detail, and the subsequent process steps will be described in detail.

[0157] (Component for electronic devices)

[0158] The electronic device component (28) is a component that constitutes at least a part of an electronic device formed on a substrate (18A) of a laminate (10A). More specifically, the electronic device component (28) may be a component used in electronic components such as a display panel, a solar cell, a thin-film secondary battery, or a semiconductor wafer having a circuit formed on its surface, a receiving sensor panel, etc. (e.g., a display device component such as a thin-film transistor, a solar cell component, a thin-film secondary battery component, a circuit for an electronic component, a receiving sensor component), and may be, for example, a solar cell component described in paragraph

[0192] of U.S. Patent Application Publication No. 2018 / 0178492, a thin-film secondary battery component described in paragraph

[0193] of the same specification, and a circuit for an electronic component described in paragraph

[0194] of the same specification.

[0159] (Procedure of the process)

[0160] The method of manufacturing the laminate (30) having the above-described electronic device component is not particularly limited, and the electronic device component (28) is formed on the substrate (18) of the laminate (10A) by a conventionally known method depending on the type of constituent component of the electronic device component.

[0161] The electronic device component (28) may be a part of the entire component (hereinafter referred to as a “partial component”) rather than the entire component (hereinafter referred to as the “entire component”) that is finally formed on the substrate (18A). A substrate having a partial component peeled off from the adhesion layer (14) may be made into a substrate having the entire component (equivalent to the electronic device described later) in a subsequent process.

[0162] On a substrate having a whole member that has been peeled off from an adhesive layer (14), another electronic device member may be formed on the peeled surface. Additionally, the electronic device members (28) of a laminate (30) having two electronic device members may be placed facing each other and joined to assemble a laminate having a whole member, and then a support substrate (20) having two adhesive layers may be peeled off from the laminate having a whole member to manufacture an electronic device.

[0163] For example, in the case of manufacturing an OLED, various layer formations or treatments are performed to form an organic EL structure on a surface opposite to the metal layer (16A) side of the substrate (18A) of the laminate (10A), such as forming a transparent electrode, depositing a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, etc. on the surface where the transparent electrode is formed, forming a back electrode, and sealing using a sealing plate. Specifically, these layer formations or treatments may include, for example, film formation treatment, deposition treatment, and bonding treatment of a sealing plate.

[0164] In addition, when using a laminate (10B) and a laminate (10C), through holes are provided in the substrate (18B) and the substrate (18C), so that when forming a component for an electronic device, plating treatment can be performed to fill the through holes with a conductor (metal).

[0165] (Separation process)

[0166] The separation process is a process of obtaining an electronic device (32) comprising an electronic device member (28), a substrate (18A), and a metal layer (16A) by irradiating a laser from the side of the support substrate (12) of a laminate (30) having an electronic device member as shown in FIG. 6, and peeling off the support substrate (12) and the adhesion layer (14) from the laminate (30) having an electronic device member.

[0167] If the electronic device component (28) on the peeled substrate (18A) is part of the formation of the entire required component, the remaining component may be formed on the substrate (18A) after separation.

[0168] When a laser is irradiated from the side of the support substrate (12) of a laminate (30) having a component for an electronic device, absorption of the laser occurs in the metal layer (16A), and delamination occurs between the adhesive layer (14) and the metal layer (16A). Although the detailed reason for the delamination is unclear, it is believed that as the metal layer (16A) absorbs the laser, the temperature of the metal layer (16A) rises locally, causing decomposition of the adhesive layer (14) adjacent to the metal layer (16A), and thus delamination occurs between the two.

[0169] The irradiation conditions of the laser are not particularly limited, but the laser wavelength is preferably 193 to 10600 nm, and more preferably 300 to 1064 nm.

[0170] The beam size (area) of the laser is preferably 10 to 500 mm².

[0171] The repetition frequency of the laser is preferably 10 to 10,000 Hz.

[0172] The overlap rate of the laser is preferably 10 to 90%.

[0173] The irradiation energy is preferably 10 to 300 mJ / cm².

[0174] Since the electronic device obtained by separation includes a metal layer, it becomes possible to further perform plating treatment on the obtained electronic device.

[0175] Examples

[0176] The present invention will be specifically described below by way of examples, etc., but the present invention is not limited by these examples.

[0177] Below, Examples 1 to 17 are embodiments, and Examples 18 to 22 are comparative examples.

[0178] In the following, a glass plate ("AN100", manufactured by AGC Co., Ltd.) with dimensions of 200×200 mm and a thickness of 0.5 mm was used as a support material.

[0179] As a substrate, a glass plate with dimensions of 200×200mm and a thickness of 0.15mm ("AN100", manufactured by AGC Co., Ltd.) and a glass plate with dimensions of 200×200mm and a thickness of 0.13mm ("AN100", manufactured by AGC Co., Ltd.) with a through hole (hole diameter 100㎛, hole pitch (distance between centers of holes) 200㎛) formed in the central 180×180mm portion were used.

[0180] The support material and substrate were cleaned using a water-based glass cleaner ("PK-LCG213", manufactured by Parker Corporation) and then cleaned with pure water.

[0181] <Evaluation>

[0182] (Evaluation of the presence or absence of a metal coating on the inner wall surface of a through hole in the substrate)

[0183] In Examples 12 to 17, the cross-section of the through hole portion of a substrate having a through hole with a metal layer formed thereon was observed using a scanning electron microscope (SEM) to evaluate the presence or absence of a metal coating on the inner wall surface of the through hole of the substrate.

[0184] Cases with a metal coating were evaluated as "present," and cases without a metal coating were evaluated as "absent." Cases where it was not evaluated were marked as "-".

[0185] (Exfoliation evaluation)

[0186] A peel test was performed on the laminate after heat treatment using a laser device with a laser wavelength of 355 nm, a beam size of 40 × 0.4 mm, and a laser repetition frequency of 20 Hz.

[0187] For the laminate, a laser beam was incident from the side of the supporting substrate, and the overlap rate of the laser beam's irradiation shape was adjusted to 50 to 90%, and the irradiation energy density was adjusted to 10 to 260 mJ / cm².

[0188] After laser irradiation, the state of peeling from the adhesion layer of a substrate comprising a metal layer and a substrate, with the peeling interface between the adhesion layer and the metal layer, was visually confirmed and evaluated according to the following criteria. Under the following evaluation criteria, if the evaluation is A or B, it can be determined that it is within the practical acceptable range.

[0189] A: Peeled off from the entire surface between the adhesion layer and the metal layer.

[0190] B: There were partially existing spots between the adhesion layer and the metal layer where delamination was not occurring.

[0191] C: There was no delamination between the adhesion layer and the metal layer.

[0192] (Seed layer function evaluation)

[0193] On the surface of the metal layer of a substrate having the metal layer peeled off by the above (peeling evaluation), an attempt was made to form a copper or gold plating film by electroplating or electroless plating. The state of the plating film formation was visually confirmed and evaluated according to the following criteria. According to the following evaluation criteria, if the evaluation is A or B, it can be judged to be within the practical acceptable range.

[0194] A: A plating film was formed over the entire surface of the metal layer.

[0195] B: A plating film was partially formed on the metal layer.

[0196] C: No plating film was formed on the metal layer at all.

[0197] (Evaluation of metal layer adhesion)

[0198] An adhesive tape ("600-1-18DN", manufactured by 3M Japan Co., Ltd.) was attached to the surface of the metal layer of a substrate having the metal layer peeled off by performing the above (peeling evaluation). The tape was pulled perpendicular to the film surface and peeled off. The condition of the metal layer after peeling off the tape was visually inspected and evaluated according to the following criteria. According to the following evaluation criteria, if the evaluation is A or B, it can be judged to be within the practical acceptable range.

[0199] A: No peeling of the metal layer was visible.

[0200] B: Partial delamination was observed on the metal layer.

[0201] C: Delamination was observed on the entire surface of the metal layer.

[0202] <Preparation of Curable Silicone 1 and Curable Composition 1>

[0203] (Preparation of Curable Silicone 1)

[0204] Curable silicone 1 was obtained by mixing organohydrogensiloxane and alkenyl group-containing siloxane. The composition of curable silicone 1 was such that the molar ratio of M, D, and T units was 9:59:32, the molar ratio of the methyl group and phenyl group of the organic group was 44:56, the molar ratio of the total alkenyl group and the hydrogen atom bonded to the total silicon atom (hydrogen atom / alkenyl group) was 0.7, and the average number of OX groups was 0.1. The average number of OX groups is a numerical value indicating how many OX groups (where X is a hydrogen atom or hydrocarbon group) are bonded to one Si atom on average.

[0205] (Preparation of Curable Composition 1)

[0206] Mixture A was obtained by adding Platinum (0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane (CAS No. 68478-92-2) to a solution mixed with diethylene glycol diethyl ether ("Highsolve EDE", manufactured by Toho Chemical Co., Ltd.) (84.9 g) and curable silicone 1 (200 g), such that the platinum element content relative to curable silicone 1 was 120 ppm. Methylphenyl modified silicone ("AP1000", manufactured by Asahi Kasei Wacker Silicone Co., Ltd.) (0.500 g) was mixed into Mixture A, and the resulting mixture was filtered using a filter with a hole diameter of 0.45 μm to obtain curable composition 1.

[0207] <Example 1>

[0208] A prepared curable composition 1 was applied to a support substrate, and a silicone resin layer with a thickness of 10 μm was formed by heating at 140°C for 5 minutes using a hot plate and then at 250°C for 30 minutes using an oven, thereby obtaining a support substrate having a silicone resin layer.

[0209] Next, a metal layer was formed on the surface of a separately prepared substrate using a sputtering device. In addition, in Example 1, a Ti layer was formed as the first layer and a Cu layer as the second layer, thereby obtaining a substrate having a metal layer.

[0210] After that, a supporting substrate having a silicone resin layer and a substrate having a metal layer were bonded using a bonding device so that the silicone resin layer and the metal layer were in contact, thereby obtaining a laminate.

[0211] The obtained laminate was heated at 300°C for 30 minutes under a nitrogen atmosphere using an inert gas oven.

[0212] Various evaluations described above were performed on the obtained laminate.

[0213] <Examples 2 to 22>

[0214] As shown in the table below, various evaluations were performed following the same procedure as in Example 1, except that the type of substrate and the type of metal film used were changed.

[0215] In addition, for Examples 12 to 15, a substrate having through holes was used, and a metal layer was formed on the surface of the substrate using a sputtering device.

[0216] In addition, for Examples 16 and 17, a substrate having a metal layer was obtained by following the same procedure as in Example 1, a through hole penetrating the substrate and the metal layer was formed, and then bonding was performed with a supporting substrate having a silicone resin layer.

[0217] In Tables 1 to 4, the notation in the column “Metal layer” indicates the type of metal and thickness of the metal layer. For example, “Ti / 50nm” indicates a Ti layer with a thickness of 50nm.

[0218] In Tables 1 to 4, the column “Evaluation of Adhesion of Metal Coating” shows the results of the above-described (evaluation of the presence or absence of metal coating on the inner wall surface of the through hole of the substrate).

[0219]

[0220]

[0221]

[0222]

[0223] As shown in Tables 1 to 4, the laminate of the present invention exhibited the desired effect.

[0224] From a comparison of Example 5 and Examples 1 to 4, it was confirmed that when the metal layer has a multilayer structure, the adhesion of the metal layer is superior.

[0225] From a comparison of Example 14 and Example 16, it was confirmed that peelability is superior when there is a metal coating on the inner wall surface of the through hole.

[0226] Manufacture of Organic EL Display Devices (Equated to Electronic Devices)

[0227] Using the laminated substrates obtained in Examples 1 to 17, an organic EL display device was manufactured following the following steps.

[0228] First, silicon nitride, silicon oxide, and amorphous silicon were deposited in that order by plasma CVD on the surface opposite to the support substrate side of the laminated substrate. Subsequently, a low concentration of boron was injected into the amorphous silicon layer using an ion doping device, and a dehydrogenation treatment was performed by heat treatment. Subsequently, a crystallization treatment of the amorphous silicon layer was performed using a laser annealing device. Subsequently, a low concentration of phosphorus was injected into the amorphous silicon layer using an etching and ion doping device with photolithography, and N-type and P-type TFT areas were formed.

[0229] Next, a silicon oxide film was formed by plasma CVD on the surface opposite to the support substrate side of the laminated substrate to form a gate insulating film, then molybdenum was formed by sputtering, and a gate electrode was formed by etching using photolithography. Subsequently, high concentrations of boron and phosphorus were injected into the desired N-type and P-type regions, respectively, using photolithography and an ion doping device to form a source region and a drain region.

[0230] Next, on the surface opposite to the substrate support side of the laminate, an interlayer insulating film was formed by depositing silicon oxide by the plasma CVD method, and a TFT electrode was formed by depositing aluminum by the sputtering method and etching using photolithography. Subsequently, after performing heat treatment and hydrogenation treatment under a hydrogen atmosphere, a passivation layer was formed by depositing silicon nitrogen by the plasma CVD method.

[0231] Next, a UV-curable resin was applied to the surface opposite to the substrate support side of the laminate, and a planarization layer and contact holes were formed by photolithography. Subsequently, indium tin oxide was deposited by sputtering, and pixel electrodes were formed by etching using photolithography. Next, by deposition, on the side opposite to the glass plate side of the polyimide resin layer, 4,4',4"-tris(3-methylphenylphenylamino)triphenylamine as a hole injection layer, bis[(N-naphthyl)-N-phenyl]benzidine as a hole transport layer, 40 volume% of 2,6-bis[4-[N-(4-methoxyphenyl)-N-phenyl]aminostyryl]naphthalene-1,5-dicarbonitrile (BSN-BCN) mixed with 8-quinolinol aluminum complex (Alq3) as a light-emitting layer, and Alq3 as an electron transport layer were deposited in this order. Subsequently, aluminum was deposited by sputtering, and a counter electrode was formed by etching using photolithography.

[0232] Next, another glass plate was bonded and sealed on the surface opposite to the substrate support side of the laminate through a UV-curable adhesive layer. By the above procedure, an organic EL structure was formed on a polyimide resin layer. A structure having an organic EL structure on a substrate (hereinafter referred to as Panel A) is a laminate having an electronic device member of the present invention.

[0233] Next, the sealing side of Panel A was vacuum-adsorbed onto a surface plate, and then a laser was irradiated from the supporting substrate side to perform peeling between the adhesion layer (silicone resin layer) and the metal layer. As a result, the supporting substrate having the silicone resin layer could be peeled off.

[0234] Although the present invention has been described in detail with reference to specific embodiments, it is clear to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. This application is based on Japanese patent application filed on June 11, 2020 (Japanese Patent Application No. 2020-101638), the contents of which are incorporated herein by reference. Explanation of the symbols

[0235] 10A, 10B, 10C: Laminate 12: Supporting material 14: Adhesion layer 16A, 16B, 16C: Metal layer 18A, 18B, 18C: Substrate 20: Supporting material having an adhesive layer 22: First through hole 24: Second penetration hole 26: Metal cladding 28: Components for electronic devices 30: A laminate having a component for an electronic device 32: Electronic Devices

Claims

Claim 1 A laminate having a support substrate, an adhesive layer, a metal layer, and a substrate in this order, wherein the metal layer comprises at least one metal selected from the group consisting of copper, titanium, palladium, gold, nickel, tungsten, and molybdenum, wherein the adhesive layer is a silicone resin layer, wherein the metal layer has a first through hole extending in the thickness direction, wherein the substrate has a second through hole extending in the thickness direction, wherein the first through hole and the second through hole are in communication and the metal coating portion is composed of a metal covering at least a portion of the inner wall surface of the second through hole, and wherein the substrate is a glass substrate. Claim 2 A laminate according to claim 1, wherein the metal layer comprises at least one metal selected from the group consisting of copper, titanium, palladium, gold, and nickel. Claim 3 A laminate according to claim 1 or 2, wherein the metal layer comprises a first metal layer and a second metal layer disposed on the first metal layer, and the type of metal included in the first metal layer and the type of metal included in the second metal layer are different. Claim 4 In paragraph 3, the first metal layer is disposed on the substrate side rather than the second metal layer, and the first metal layer comprises titanium, forming a laminate. Claim 5 In paragraph 4, the laminate, wherein the second metal layer comprises copper. Claim 6 delete Claim 7 delete Claim 8 delete Claim 9 delete Claim 10 A laminate according to claim 1 or 2, wherein the supporting substrate is a glass substrate. Claim 11 A laminate having a laminate described in claim 1 or 2 and an electronic device member disposed on the substrate among the laminates. Claim 12 A method for manufacturing an electronic device comprising: a member forming process of forming an electronic device member on the surface of the substrate of the laminate described in claim 1 or 2 to obtain a laminate having the electronic device member; and a separation process of irradiating a laser from the side of the support substrate of the laminate having the electronic device member to peel off the support substrate and the adhesion layer from the laminate having the electronic device member to obtain an electronic device having the electronic device member, the substrate, and the metal layer.

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