Printed circuit board and electronic device comprising the same

Abstract

The present disclosure relates to a printed circuit board and an electronic device including the same. A printed circuit board according to one embodiment of the present disclosure comprises, in the printed circuit board, a first ground layer having at least one first opening, a wiring layer spaced apart from the first ground layer and having a signal wiring pattern formed thereon, and an insulating layer disposed between the first ground layer and the wiring layer, wherein the signal wiring pattern comprises a first region having a first width and a second region having a second width different from the first width, wherein the first region and the second region are alternately arranged, and the first region may be disposed at a position corresponding to the first opening.

Description

Technology Field

[0001] Various embodiments of the present disclosure relate to printed circuit boards and electronic devices including the same. Background Technology

[0003] As the functions of electronic devices become more diverse due to the development of digital technology, various types of electronic components are placed inside these devices to perform diverse functions. The electronic components within the device can be electrically connected through printed circuit boards (PCBs) on which signal wiring is formed, and signals can be transmitted between the electronic components through these signal wirings.

[0004] Electronic devices can perform wireless communication with base stations through antenna modules, and in order to meet the rapidly increasing demand for wireless traffic in recent years, there is a growing number of electronic devices that support high-speed wireless communication technologies such as next-generation wireless communication technologies (e.g., 5G communication) or WIGIG (wireless gigabit alliance) (e.g., 802.11AD).

[0005] Since next-generation wireless communication technology uses millimeter waves (mmWave) of 20 GHz or higher, the frequency of signals processed by electronic components (e.g., antenna modules, antenna patches, etc.) must inevitably increase to support next-generation wireless communication technology. Accordingly, printed circuit boards with a micro-strip structure are increasingly being applied to electronic devices to transmit high-frequency signals. The problem to be solved

[0007] A printed circuit board having a microstrip structure may include signal wiring, ground and insulating layers, and the printed circuit board is generally formed to have an impedance suitable for the characteristics of the transmitted signal.

[0008] However, in order to maintain an impedance suitable for signal characteristics, as the thickness of the insulation layer between the signal wiring and the ground increases, the line width of the signal wiring inevitably becomes wider, and conversely, as the thickness of the insulation layer decreases, the line width of the signal wiring inevitably becomes narrower.

[0009] In order to connect electronic components mounted in a confined space inside an electronic device, a characteristic (e.g., flexibility or bending characteristic) is required to allow at least a portion of the printed circuit board to be formed flexibly, and the bending characteristic of the printed circuit board can be improved as the thickness of the insulating layer becomes thinner. For example, by thinning the thickness of the insulating layer, at least a portion of the printed circuit board can be configured to bend in order to connect electronic components arranged in various ways.

[0010] Furthermore, increasing the thickness of signal wiring can reduce signal loss (e.g., loss) occurring during RF (radio frequency) signal transmission, thereby improving the RF performance of the printed circuit board. However, if the line width of the signal wiring is widened to improve RF performance, the thickness of the insulating layer increases, which may deteriorate the bending characteristics of the printed circuit board. Conversely, if the thickness of the insulating layer is reduced to improve the bending characteristics of the printed circuit board, the line width of the signal wiring becomes narrower, which may also deteriorate the RF performance of the printed circuit board.

[0011] In other words, conventional printed circuit boards had a trade-off relationship between RF performance and bending performance, which limited the ability to simultaneously improve both.

[0012] Accordingly, the present disclosure may form a plurality of openings in at least a portion of the ground and arrange signal wiring at positions corresponding to the plurality of openings. Furthermore, by forming the width of the signal wiring arranged at positions corresponding to the plurality of openings to correspond to the shape of the openings, the present disclosure aims to provide a printed circuit board capable of simultaneously improving RF performance and bending performance. Additionally, various embodiments may provide, for example, a printed circuit board and an electronic device including the same. means of solving the problem

[0014] A printed circuit board according to various embodiments comprises a first ground layer including at least one first opening, a wiring layer spaced apart from the first ground layer and having a signal wiring pattern formed thereon, and an insulating layer disposed between the first ground layer and the wiring layer, wherein the signal wiring pattern includes a first region having a first width and a second region having a second width different from the first width, wherein the first region and the second region are alternately arranged, and the first region may be disposed at a position corresponding to the first opening.

[0015] An electronic device according to various embodiments comprises: a first electric element and a second electric element; and a printed circuit board electrically connecting the first electric element and the second electric element, wherein the printed circuit board comprises a first ground layer having at least one first opening, a wiring layer having a signal wiring pattern formed thereon, and a first insulating layer disposed between the first ground layer and the wiring layer, wherein the signal wiring pattern comprises a first region having a first width and a second region having a second width different from the first width, wherein the first region and the second region are alternately arranged, and the first region may be arranged to overlap at least partially with the first opening when viewed from the top of the printed circuit board.

[0016] A printed circuit board according to various embodiments comprises a ground layer including at least one opening and at least one via hole, at least one via electrically connected to the ground layer and penetrating the ground layer, a wiring layer spaced apart from the ground layer and having a signal wiring pattern formed thereon, and an insulating layer disposed between the ground layer and the wiring layer, wherein the signal wiring pattern includes a first region having a first width and a second region having a second width different from the first width, the first region and the second region are alternately arranged, and the first region may be disposed at a position corresponding to the at least one opening and spaced apart from the at least one via hole. Effects of the invention

[0018] A printed circuit board according to various embodiments can expand the line width of the signal wiring while maintaining a thin thickness of the insulating layer between the signal wiring and the ground, so the printed circuit board according to various embodiments can improve RF performance and bending performance. Brief explanation of the drawing

[0020] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 2a is a drawing showing the internal configuration of an electronic device according to one embodiment. FIG. 2b is a drawing showing the internal configuration of an electronic device according to another embodiment. FIG. 3a is a perspective view of a printed circuit board according to one embodiment, viewed from above. FIG. 3b is a side view of the printed circuit board of FIG. 3a, viewed from the side. FIG. 4a is a top view of a printed circuit board according to one embodiment. FIG. 4b is a bottom view of the printed circuit board of FIG. 4a viewed from below. FIG. 4c is a top view of a printed circuit board according to another embodiment. FIG. 4d is a top view of a printed circuit board according to yet another embodiment. FIG. 5a is a schematic exploded perspective view of a printed circuit board according to one embodiment. FIG. 5b is a side view of a printed circuit board according to one embodiment. FIG. 6a is a top-view perspective view of a printed circuit board according to various embodiments. FIG. 6b is a side-view perspective view of the printed circuit board of FIG. 6a. FIG. 7 is a side view of a printed circuit board according to one embodiment. Figure 8 is a graph illustrating the signal transmission performance of a printed circuit board depending on the presence or absence of a mesh pattern in the ground layer. Specific details for implementing the invention

[0021] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input device (150), sound output device (155), display device (160), audio module (170), sensor module (176), interface (177), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., display device (160) or camera module (180)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, a sensor module (176) (e.g., fingerprint sensor, iris sensor, or light sensor) can be implemented embedded in a display device (160) (e.g., display).

[0022] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) and an auxiliary processor (123) (e.g., a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). Additionally or generally, the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0023] The auxiliary processor (123) can control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display device (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)).

[0024] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input device (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input device (150) may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

[0027] The sound output device (155) can output a sound signal to the outside of the electronic device (101). The sound output device (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as multimedia playback or recording playback, and the receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0028] The display device (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display device (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display device (160) may include a touch circuitry configured to detect a touch, or a sensor circuitry configured to measure the intensity of the force generated by said touch (e.g., a pressure sensor).

[0029] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through an input device (150) or output sound through an audio output device (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0034] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0036] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi Direct, or IrDA (infrared data association)) or a second network (199) (e.g., a cellular network, the Internet, or a long-range communication network such as a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify and authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0038] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module may include a single antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., an RFIC) may be additionally formed as part of the antenna module (197).

[0039] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0040] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the electronic devices (102, 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

[0042] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0043] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., by wire), wirelessly, or through a third component.

[0044] As used in this document, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be a component formed as a whole, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0045] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' merely means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0046] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0047] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to the integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0049] FIG. 2a is a drawing showing the internal configuration of an electronic device (200) according to one embodiment (e.g., the electronic device (101) of FIG. 1). FIG. 2b is a drawing showing the internal configuration of an electronic device (200) according to another embodiment.

[0050] Referring to FIG. 2a, an electronic device (200) according to one embodiment may include a foldable housing (203) comprising a first housing (201) and a second housing (202), a flexible display (not shown), a hinge structure (not shown), a hinge cover (204) covering the hinge structure, a plurality of electrical elements (e.g., components, circuits, etc.) disposed inside the foldable housing (203), and a printed circuit board (300) disposed inside the foldable housing (203) and electrically connecting the plurality of electrical elements.

[0051] According to one embodiment, the first housing (201) and the second housing (202) may be rotatably connected through a hinge structure, and the electronic device (200) may have a folding structure that transitions from a folded state to an unfolded state or from an unfolded state to a folded state as the first housing (201) and the second housing (202) rotate around a folding axis (R axis) through the hinge structure.

[0052] In one example (not shown), when the electronic device (200) is in an unfolded state, the first housing (201) and the second housing (202) may be positioned on both sides of the folding axis (R axis). In another example (e.g., see FIG. 2a), when the electronic device (200) is in a folded state, the first housing (201) and the second housing (202) may be positioned to face each other.

[0053] According to one embodiment, an electric element (e.g., 205, 206) for implementing various functions of an electronic device (200) may be disposed in the internal space of the first housing (201) and the second housing (202), and the electric element disposed inside the first housing (201) and the electric element disposed inside the second housing (202) may be electrically connected through a printed circuit board (300) that crosses a hinge structure.

[0054] In one example, a first printed circuit board (205) may be disposed in the internal space of a first housing (201), and a second printed circuit board (206) may be disposed in the internal space of a second housing (202). The first printed circuit board (205) and the second printed circuit board (206) may be electrically connected through a printed circuit board (300) formed by extending from one area of ​​the first housing (201) across a hinge structure to one area of ​​the second housing (202).

[0055] According to one embodiment, the printed circuit board (300) may include a plurality of layers and may serve as a connector that electrically connects electrical components. In this case, the plurality of layers of the printed circuit board (300) may, as an example, include a wiring layer in which signal wiring is formed, a ground layer in which ground is formed, and an insulating layer that fills the space between the wiring layer and the ground layer, and a detailed description thereof will be provided later. The first printed circuit board (205) may transmit a signal to the second printed circuit board (206) through the printed circuit board (300) that includes signal wiring, or receive a signal from the second printed circuit board (206). Similarly, the second printed circuit board (206) may transmit a signal to the first printed circuit board (205) through the printed circuit board (300) that includes signal wiring, or receive a signal from the first printed circuit board (205).

[0056] However, the electrical components electrically connected by the printed circuit board (300) are not limited to the embodiments described above, and according to various embodiments, the printed circuit board (300) may electrically connect the first printed circuit board (205) and the antenna module, or electrically connect the second printed circuit board (206) and the patch antenna module. However, a detailed explanation regarding this will be provided later.

[0057] A printed circuit board (300) according to one embodiment may include at least one flexible area (300a, 300b, 300c) and at least one rigid area (300d, 300e). In one example, the flexible area (e.g., 300a, 300c) may be placed in an area adjacent to an electrical element (e.g., first printed circuit board (205), second printed circuit board (206)), and a rigid area (300d, 300e) that is less flexible than the flexible area may be placed between the flexible areas (e.g., 300a, 300b, 300c).

[0058] As the printed circuit board (300) is formed across the hinge structure, a flexible area (e.g., 300b) may be disposed in a portion of the printed circuit board (300) corresponding to the hinge structure. Through the flexible area (300b) disposed in the portion corresponding to the hinge structure, the printed circuit board (300) may be flexibly bent or curved when the electronic device (200) is switched from a folded state to an unfolded state or from an unfolded state to a folded state.

[0059] That is, in one embodiment, the printed circuit board (300) may have flexible characteristics in the area adjacent to the electrical element (e.g., first printed circuit board (205), second printed circuit board (206)) and / or the area corresponding to the hinge structure to increase the bonding between the printed circuit board (300) and the electrical element, or prevent damage to the printed circuit board (300) during the folding process of the electronic device (200). The remaining area of ​​the printed circuit board (300) may be formed to have rigid characteristics to ensure the overall rigidity of the printed circuit board (300).

[0060] However, the printed circuit board (300) is not limited to the above-described embodiment, and according to other embodiments, the printed circuit board (300) may be formed only as a flexible area without distinction between a flexible area (e.g., 300a, 300b, 300c) and a rigid area (e.g., 300d, 300e). In one example, the area to be connected to the electrical element of the printed circuit board (300) may be formed as a rigid area, and the remaining area may be formed as a flexible area. However, a detailed description of the configuration for the printed circuit board (300) to have flexible characteristics and / or rigid characteristics will be examined below.

[0061] Referring to FIG. 2b, an electronic device (200) according to another embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210), a plurality of electrical elements (e.g., components, circuits, etc.) located inside the housing (210), and / or a printed circuit board (300) that electrically connects the plurality of electrical elements.

[0062] A housing (210) according to one embodiment may form at least a portion of the side (210A) or a rear (not shown) of an electronic device (200). In one example, the side (210A) may be formed by a side bezel structure (or "side member") comprising metal and / or polymer, and the rear may be formed by a substantially opaque rear plate and coupled to the side (210A). However, the structure of the housing (210) is not limited to the above-described embodiment, and depending on the embodiment, the side (210A) and the rear of the housing (210) may be formed integrally. According to one embodiment, the electronic device (200) may be configured without the side (210A) of the housing (210). For example, the side of the housing (210) may be configured such that a portion of the display placed on the front extends to the side. According to one embodiment, if the side of the housing (210) included in the electronic device (200) is formed as part of a display positioned on the front, a support member (not shown) for supporting the display may be positioned on at least a part of the housing (210).

[0063] According to one embodiment, various types of electrical components can be mounted in the internal space formed by the side (210A) and rear of the housing (210).

[0064] In one example, a patch antenna module (202), an antenna module (207), and / or a main circuit board (208) may be mounted in the internal space of the electronic device (200). According to various embodiments, the main circuit board (208) and the antenna module (207) and / or the main circuit board (208) and the patch antenna module (202) may be electrically connected through a printed circuit board (300). According to one embodiment, the printed circuit board (300) may include a first region (301) electrically connected to the antenna module (207), and may include a second region (302) branched from a portion of the first region (301) and electrically connected to the patch antenna module (202).

[0065] According to one embodiment, at least a portion of the patch antenna module (202) includes a structure that is electrically connected to at least a portion of the printed circuit board (300) (e.g., a portion of the second region (302)) in order to be electrically connected to the main circuit board (208), and at least a portion may be electrically connected to at least a portion of the housing (210). According to one embodiment, the patch antenna module (202) may be a microstrip patch antenna. According to one embodiment, the shape of the patch antenna may be formed in a rectangular, square, circular, or circular ring shape. According to one embodiment, the patch antenna module (202) may include an antenna made of a thin metal patch plate on at least a portion of a dielectric formed to have a thin, low loss or low dielectric constant.

[0066] A main circuit board (208) according to one embodiment may include a connection portion (211) coupled to a printed circuit board (300), and a processor (e.g., processor (120) of FIG. 1) and / or memory (e.g., memory (130) of FIG. 1) may be disposed on the main circuit board (208).

[0067] A wireless communication module (292) (e.g., the wireless communication module (192) of FIG. 1) may be disposed on the main circuit board (208), and the wireless communication module (292) may be electrically connected to the main circuit board (208). The wireless communication module (292) may be electrically connected to a connection part (211) on the main circuit board (208). At this time, the connection part (211) may be electrically connected to an antenna module (207) and / or a patch antenna module (202) through a printed circuit board (300). Accordingly, the wireless communication module (292) may also be electrically connected to the antenna module (207) and / or the patch antenna module (202).

[0068] According to one embodiment, the wireless communication module (292) may transmit power and / or signals to the antenna module (207) and / or patch antenna module (202), or receive signals from the antenna module (207) and / or patch antenna module (202). According to another example, the wireless communication module (292) may be configured to transmit or receive a wireless signal (e.g., a radio frequency (RF) signal (hereinafter referred to as "RF signal") through the antenna module (207) and / or patch antenna module (202).

[0069] An antenna module (207) according to one embodiment may be formed on an additional circuit board (209) and may include a feed portion (207-1), a ground portion (207-3), and a conductive member (207-2).

[0070] According to one embodiment, the power supply portion (207-1) may be formed in a region of an additional circuit board (209), and the power supply portion (207-1) may be electrically connected to the conductive member (207-2) by contacting a point of the conductive member (207-2).

[0071] According to one embodiment, the ground portion (207-3) may be formed in an area of ​​an additional circuit board (209) spaced apart from the power supply portion (207-1), and the ground portion (207-3) may be electrically connected to the conductive member (207-2) by contacting one point and another point of the conductive member (207-2).

[0072] According to one embodiment, the conductive member (207-2) may form at least a portion of the side (210A) of the housing (210). Non-conductive members are formed at both ends of the conductive member (207-2) so that the conductive member (207-2) remains electrically isolated from the remaining portion of the side (210A). The conductive member (207-2), electrically connected to the feed unit (207-1), may be fed by the feed unit (207-1) and may operate as an antenna radiator of the antenna module (207). According to various embodiments, the conductive member (207-2) of the antenna module (207) may be omitted, in which case other components of the electronic device (200) other than the conductive member (207-2) may operate as an antenna radiator of the antenna module (207).

[0073] A patch antenna module (202) according to one embodiment may include a flexible printed circuit board (not shown), an antenna array and / or a radio frequency integrate circuit (RFIC) disposed on the flexible circuit board. In one example, the antenna array may arrange multiple antennas and combine the beam patterns of each antenna to make the beam pattern sharper. The patch antenna module (202) may, in one example, be a mmWave antenna module for 5G network communication. According to various embodiments, at least one of the components of the patch antenna module (202) may be omitted, or at least two of the components may be formed integrally.

[0074] The antenna array may be formed inside or on the surface of the patch antenna module (202) and may include various types of antenna arrays (e.g., patch antenna array, dipole antenna array).

[0075] The RFIC (or "IFIC (intermediate frequency integrate circuit)") may be configured to process RF signals transmitted and / or received through an antenna array. In one example, the RFIC may, upon transmission, convert an IF (intermediate frequency) signal or baseband signal obtained from a wireless communication module (292) into an RF signal of the 5G Above6 band (e.g., approximately 6 GHz to approximately 60 GHz) to be used in a 5G network of a specified band. In another example, upon reception, the RFIC may convert an RF signal obtained from the antenna array into an IF signal or baseband signal and provide it to the wireless communication module (292).

[0076] According to one embodiment, the printed circuit board (300) may be composed of a plurality of layers and may serve as a connector that electrically connects electrical components. According to one example, the plurality of layers may include a wiring layer in which signal wiring is formed, a ground layer in which ground is formed, and an insulating layer that fills the space between the wiring layer and the ground layer, and a detailed description thereof will be provided later.

[0077] According to one embodiment, a signal (e.g., RF signal) may be transmitted or received between a wireless communication module (292) and an antenna module (207) and / or a patch antenna module (202) through the signal wiring of a printed circuit board (300). However, the electrical components connected by the printed circuit board (300) are not limited to the wireless communication module (292), the antenna module (207), and / or the patch antenna module (202) described above, and various types of components inside an electronic device may be electrically connected through the printed circuit board (300).

[0078] According to one embodiment, the printed circuit board (300) may include at least one flexible area (e.g., 303, 304, 305) to connect electrical elements (e.g., components, circuits, etc.) mounted within a narrow space inside the housing (210). Accordingly, in the process of connecting a plurality of electrical elements, a portion of the printed circuit board (300) can be flexibly bent through the flexible area.

[0079] According to another embodiment, the printed circuit board (300) may include at least one flexible area (303, 304, 305) and a rigid area (306). In one example, a flexible area (303, 304, 305) that can be flexibly bent or folded is disposed in an area of ​​the printed circuit board (300) adjacent to an electrical element (e.g., main circuit board (208), patch antenna module (202), and / or antenna module (207)), and a rigid area (306) that is less flexible than the flexible area (303, 304, 305) may be disposed between the flexible areas (303, 304, 305).

[0080] That is, the printed circuit board (300) according to one embodiment can be formed such that the region adjacent to the electrical element has flexible characteristics to enhance the bonding between the printed circuit board (300) and the electrical element, and the remaining region has rigid characteristics to ensure the rigidity of the printed circuit board (300). However, the description of the configuration for the printed circuit board (300) to have flexible characteristics and / or rigid characteristics will be examined in detail below.

[0081] According to one embodiment, the printed circuit board (300) may be formed only as a flexible area without distinction between a flexible area (301, 303) and a rigid area. According to one embodiment, the printed circuit board (300) may be formed as a rigid area for connecting to a circuit board (e.g., main circuit board (208) or additional circuit board (209)) or an electrical component (e.g., patch antenna module (202)), and the remaining area may be composed of a flexible area.

[0083] FIG. 3a is a perspective view of a printed circuit board (300) according to one embodiment (e.g., the printed circuit board (300) of FIG. 2a and FIG. 2b) viewed from the top (e.g., direction ① of FIG. 3a). FIG. 3b is a side view of the printed circuit board (300) of FIG. 3a viewed from the side. Here, FIG. 3a is a perspective view showing the components of the printed circuit board (300) excluding the insulating layer.

[0084] Referring to FIGS. 3a and 3b, a printed circuit board (300) according to one embodiment may include a ground layer (310), a wiring layer (320), and an insulating layer (330) disposed between the ground layer (310) and the wiring layer (320). According to one embodiment, the printed circuit board (300) may have a micro strip line structure in which the wiring layer (320), the insulating layer (330), and the ground layer (310) are stacked in the order from the top (e.g., from direction ① to direction ② in FIG. 3a).

[0085] A ground layer (310) according to one embodiment is placed at the bottom of a printed circuit board (300) (e.g., the ② direction area of ​​FIG. 3a) to shield or reduce electromagnetic noise generated during the transmission or reception of signals and / or power between the printed circuit board (300) and an electrical element (e.g., the patch antenna module (202) and antenna module (207) of FIG. 2b).

[0086] In one example, the ground layer (310) may be formed by patterning a metal layer (e.g., a copper (Cu) layer) to form a ground, and at least a portion of the ground layer (310) may be etched so that a plurality of openings (310a) are formed on the ground layer (310).

[0087] According to one embodiment, a plurality of openings (310a) may be repeatedly formed on a ground layer (310) at regular intervals, and a mesh-shaped pattern may be formed on the ground layer (310) by the above-described arrangement structure of the plurality of openings (310a). According to one embodiment, a plurality of openings (310a) may be formed on the ground layer (310), and the spacing between the plurality of openings (310a) may be arranged differently depending on the position of the openings. For example, the spacing of the openings (310a) arranged in an area close to the bonding portion of the main circuit board (e.g., the main circuit board (208) of FIG. 2b) of the printed circuit board (300) and the spacing of the openings (310a) arranged in a rigid area may be formed differently from each other. According to one embodiment, the spacing between the plurality of openings (310a) may be formed differently depending on the curved (or bent) and uncurved portions of the printed circuit board (300).

[0088] The shape of the multiple openings (310a) is not limited to the illustrated embodiment (e.g., FIG. 3a), and according to various embodiments, the openings (310a) may be formed in shapes such as polygons, circles, or ellipses. However, a detailed explanation thereof will be provided later.

[0089] A wiring layer (320) according to one embodiment is disposed on the top of a printed circuit board (300) (e.g., direction ① in FIG. 3a) and may include a signal wiring pattern formed by patterning a metal layer (e.g., a copper (Cu) layer). According to one embodiment, a first electric element (e.g., a main circuit board (208) in FIG. 2b) and a second electric element (e.g., a patch antenna module (202) in FIG. 2b) may be electrically connected through the printed circuit board (300). The first electric element and the second electric element may transmit a signal (e.g., an RF signal) from the first electric element to the second electric element, or conversely, transmit a signal from the second electric element to the first electric element, by using the signal wiring pattern formed in the wiring layer (320) of the printed circuit board (300).

[0090] The signal wiring pattern formed on the wiring layer (320) may have its width, thickness, or shape adjusted in various ways according to the frequency characteristics of the transmitted signal. According to one embodiment, the signal wiring pattern may include at least one first region (321) having a first width (W1) and at least one second region (322) having a second width (W2) different from the first width (W1). For example, the second width may be formed to be smaller than the first width. The first region (321) and the second region (322) may be arranged alternately. Additionally, the first region (321) and the second region (322) may be arranged sequentially, for example, a plurality of first regions (321) and second regions (322) may be arranged sequentially. That is, the first region (321) may be formed in a shape that extends (or expands) the second region (322) in the width direction (e.g., W1 or W2 direction).

[0091] In one example (e.g., FIG. 3a), at least one first region (321) may be positioned at a location corresponding to a plurality of openings (310a) formed on the ground layer (310), and at least one second region (322) may be positioned in a manner connecting the first regions (321) positioned at a location corresponding to the openings (310a).

[0092] According to one embodiment, the first region (321) may be formed in a shape substantially corresponding to a plurality of openings (310a) formed on the ground layer (310). For example, if the openings (310a) are formed in a hexagonal shape (e.g., B in FIG. 3a), the first region (321) may also be formed in a hexagonal shape (e.g., A in FIG. 3a) to correspond to the openings (310a).

[0093] That is, a printed circuit board (300) according to one embodiment may form a plurality of openings (310a) on a ground layer (310), and may arrange a signal wiring pattern area (e.g., a first area (321)) having a shape substantially corresponding to the openings (310a) at a position corresponding to the openings (310a). Accordingly, the printed circuit board (300) may increase the width (or "line width") of the signal wiring pattern to minimize the loss (hereinafter "signal loss") occurring during the transmission of a signal (e.g., RF signal) through the signal wiring pattern, and a detailed explanation thereof will be provided later.

[0094] An insulating layer (330) according to one embodiment is positioned between a ground layer (310) at the bottom of the printed circuit board (300) (e.g., direction ② in FIG. 3a) and a wiring layer (320) at the top of the printed circuit board (300) (e.g., direction ① in FIG. 3a), so as to fill the space between the ground layer (310) and the wiring layer (320). In one example, the insulating layer (330) is formed of a dielectric (e.g., polyimide (PI)), so that the printed circuit board (300) may have flexible characteristics (or "bending characteristics"). Accordingly, at least a portion of the printed circuit board (300) of the microstrip line structure may be flexibly bent or curved.

[0095] According to one embodiment, the printed circuit board (300) may further include an external insulating layer (e.g., 307, 308) disposed outside of a copper foil (cropper) composed of a ground layer (310), an insulating layer (330), and a wiring layer (320). In one example, the external insulating layer may include a first external insulating layer (307) disposed above the wiring layer (320) and a second external insulating layer (308) disposed below the ground layer (310). The first external insulating layer (307) and the second external insulating layer (308) are disposed above and below the copper foil, respectively, to insulate the ground layer (310), the insulating layer (330), and the wiring layer (320).

[0096] The impedance value required of the printed circuit board (300) is determined according to the type of signal transmitted through the signal wiring pattern of the printed circuit board (300), and the impedance value can be determined according to the thickness of the insulating layer (330) (e.g., d in FIG. 3b) and the width of the signal wiring pattern formed on the wiring layer (320) (e.g., W1, W2 in FIG. 3a).

[0097] As the thickness of the insulating layer (330) decreases, the flexible characteristics of the printed circuit board (300) can be improved, and the printed circuit board (300) according to one embodiment can control the flexible characteristics of the printed circuit board (300) by controlling the thickness of the insulating layer (330).

[0098] In conventional printed circuit boards, when the thickness (d) of the insulating layer (330) is reduced to improve flexible characteristics, the width of the signal wiring pattern of the wiring layer (320) inevitably decreases in order to maintain the impedance value. On the other hand, the printed circuit board (300) according to one embodiment can maintain the width of the signal wiring pattern while reducing the thickness (d) of the insulating layer (320) through a plurality of openings (310a) formed in the ground layer (310) and a signal wiring pattern area (e.g., a first area (321)) disposed at a position corresponding to the openings (310a), and a detailed explanation thereof will be provided later.

[0100] FIG. 4a is a top view of a printed circuit board (300) according to one embodiment (e.g., the printed circuit board (300) of FIG. 2a, FIG. 2b, FIG. 3a) viewed from the upper side (e.g., the ① direction area of ​​FIG. 3a), FIG. 4b is a bottom view of the printed circuit board (300) of FIG. 4a viewed from the lower side (e.g., the ② direction area of ​​FIG. 3a). FIG. 4c is a top view of a printed circuit board (300) according to another embodiment, FIG. 4d is a top view of a printed circuit board (300) according to yet another embodiment.

[0101] Referring to FIGS. 4a, 4b, 4c, and 4d, a printed circuit board (300) according to one embodiment may include a ground layer (310), an insulating layer (not shown) (e.g., the insulating layer (330) of FIG. 3b), and a wiring layer (320) having a signal wiring pattern formed thereon. Since at least one of the components of the printed circuit board (300) according to one embodiment is identical or similar to at least one of the components of the printed circuit board (300) of FIG. 3a and FIG. 3b, a redundant description thereof will be omitted below.

[0102] According to one embodiment, the signal wiring pattern of the wiring layer (320) may be formed by alternately arranging at least one first region (321) having a first width (W1) and at least one second region (322) having a second width (W2) smaller than the first width (W1).

[0103] A plurality of openings (310a) may be repeatedly spaced apart on the grounding layer (310) located at the bottom of the wiring layer (320), and as a result, a mesh pattern may be formed on the grounding layer (310). At this time, the plurality of openings (310a) may be spaced at regular intervals as an example, but are not limited thereto, and depending on the embodiment, the plurality of openings (310a) may be spaced at irregular intervals.

[0104] According to one example (e.g., FIG. 4a, FIG. 4b), at least one first region (321) of the signal wiring pattern may be placed in an area that overlaps at least partially with an area where a plurality of openings (310a) are formed when viewed from above (e.g., when viewed from area ① in FIG. 3a), and at least one second region (322) may be placed between the at least one first region (321) to connect the first region (321).

[0105] According to one embodiment, the shape of the first region (321) may be formed to be substantially the same shape as the shape of the opening (310a) formed in the region corresponding to the region where the first region (321) is formed. That is, the outer surface of the first region (321) (e.g., A in FIG. 3a) may be formed to be the same shape as the outer surface of the opening (310a) (e.g., B in FIG. 3a). In the present disclosure, the outer surface of the first region (321) (e.g., A in FIG. 3a) or the outer surface of the opening (310a) (e.g., B in FIG. 3a) refers to a surface formed by a closed curve formed along the edge of the first region (321) or the opening (310a), and may be used with the same meaning below. In one example (e.g., FIG. 4a), if the outer surface of the opening (310a) is formed in a hexagonal shape, the outer surface of the first region (321) may also be formed in a hexagonal shape corresponding to the outer surface of the opening (310a) (e.g., substantially the same size). Accordingly, when the printed circuit board (300) is viewed from the top (e.g., FIG. 4a) and / or the bottom (e.g., FIG. 4b), the outer surface of the first region (321) and the outer surface of the opening (310a) may overlap at least partially or entirely.

[0106] However, the outer surface shape of the opening (310a) and the first region (321) is not limited to the above-described embodiment, and depending on the embodiment, the outer surface of the first region (321) and the outer surface of the opening (310a) may be designed in various shapes. In one example (e.g., FIG. 4c), the outer surface of the opening (310a) and the first region (321) may be formed in a circular or elliptical shape, and according to another example (e.g., FIG. 4d), the outer surface of the opening (310a) and the first region (321) may be formed in a rhombus shape. According to another example (not shown), the outer surface of the opening (310a) and the first region (321) may be formed in a polygonal shape (e.g., a square shape or an octagonal shape, etc.).

[0107] Depending on the characteristics of the signal transmitted through the signal wiring pattern of the printed circuit board (300), the impedance (Z) value of the printed circuit board (300) can be determined, and the impedance (Z) value can be determined by the thickness (e.g., d in FIG. 3b) of the insulating layer (e.g., insulating layer (330) in FIG. 3b) and the width of the signal wiring pattern as described above.

[0109]

[0111] In the present disclosure, R in Equation 1 represents the resistance value of the signal wiring pattern itself formed in the wiring layer (320), and L represents the inductance value of the signal wiring pattern itself. Additionally, G in Equation 1 represents the resistance value of the insulating layer (330) disposed between the wiring layer (320) and the ground layer (310), and C represents the capacitance value (C) formed between the wiring layer (320) and the ground layer (310).

[0112] The capacitance (C) formed between the ground layer (310) and the wiring layer (320) can increase as the overlapping area between the ground layer (310) and the wiring layer (320) increases when the printed circuit board (300) is viewed from above (e.g., when viewed from area ① in FIG. 3a). In one embodiment, the printed circuit board (300) can be made so that the ground layer (310) and the wiring layer (320) overlap only in the area corresponding to the second area (322) by forming an opening (310a) on one area of ​​the ground layer (310) corresponding to the first area (321) when the printed circuit board (300) is viewed from above. Accordingly, the overlapping area between the ground layer (310) and the wiring layer (320) is reduced, and the capacitance value between the ground layer (310) and the wiring layer (320) can be reduced.

[0113] Referring to mathematical formula 1, if the capacitance value between the ground layer (310) and the wiring layer (320) decreases, the impedance (Z) value of the printed circuit board (300) may increase. However, the printed circuit board (300) according to one embodiment can maintain the impedance (Z) value constant while lowering the capacitance value between the ground layer (310) and the wiring layer (320) by forming the first region (321) of the wiring layer (320) in a shape substantially corresponding to the first opening (310a). The printed circuit board (300) according to one embodiment can expand the area of ​​the first region (321) compared to the second region (322) by forming the first region (321) in a shape substantially corresponding to the first opening (310a). As the area on which the signal wiring pattern is placed increases, the conductor loss (e.g., R, L) of the signal wiring pattern itself can be reduced. That is, the printed circuit board (300) according to one embodiment can maintain a constant impedance (Z) value by lowering the capacitance value between the ground layer (310) and the wiring layer (320), while also lowering the conductor loss (e.g., R, L) of the signal wiring pattern.

[0114] As the width of the signal wiring pattern increases, signal loss (or RF loss) occurring during the signal transmission process can be reduced; therefore, widening the signal wiring pattern is essential for improving RF performance.

[0115] A printed circuit board (300) according to one embodiment may have a plurality of openings (310a) formed on a ground layer (310), and a first region (321) of a signal wiring pattern disposed on the openings (310a), so that when the printed circuit board (300) is viewed from above (e.g., when viewed from region ① of FIG. 3a), the first region (321) and the ground layer (310) are not overlapped.

[0116] That is, by arranging the printed circuit board (300) such that only the second region (322) of the signal wiring pattern of the wiring layer (320) overlaps with the ground layer (310) when viewed from above, the area overlapping between the ground layer (310) and the signal wiring pattern can be maintained constant when viewed from above. According to one embodiment, when increasing the area (or width) of the signal wiring pattern, the size of the first region (321) corresponding to the opening (310a) is increased, and the size of the second region (322) is maintained constant, the area overlapping between the signal wiring pattern and the ground layer (310) can be maintained constant when viewed from above. For example, the printed circuit board (300) can increase the average width of the signal wiring pattern by forming a first region (321) having a wider width (W1) than the second region (322) at a position corresponding to the opening (310a) formed in the ground layer (310), while maintaining a constant area where the ground layer (310) and the signal wiring pattern overlap.

[0117] A printed circuit board (300) according to one embodiment can maximize the average width of a signal wiring pattern by forming a first region (321) and an opening (310a) in substantially corresponding shapes. As a result, the printed circuit board (300) according to one embodiment can simultaneously improve flexible characteristics (or "bending characteristics") and RF performance as shown in Table 1 below.

[0119] Insulation layer specifications Wiring layer thickness Signal wiring width MIT test value Case 1 Low Df 9μm 60μm 1413 Case 2 Low Df 9μm 120μm 2011

[0121] Table 1 shows the change in flexible characteristics of the printed circuit board (300) when the width of the signal wiring pattern of the printed circuit board (300) is adjusted under the same conditions.

[0122] In the present disclosure, Df (dissipation factor) refers to an indicator representing how much energy an insulating material absorbs from an alternating current signal, and an insulating layer having a Low Df means that there is little energy loss or signal loss due to the insulating layer. Additionally, the MIT test value refers to the number of times the test object begins to break when the test object is repeatedly bent through a bending tester.

[0123] Referring to Table 1, when comparing the case where a signal wiring pattern with a width of 60 μm is placed on the ground layer (310) (e.g., Case 1 of Table 1) with the case where an opening (310a) is formed in the ground layer (310) and the width of the signal wiring pattern is doubled from 60 μm to 120 μm (e.g., Case 2 of Table 1), when the width of the signal wiring pattern is doubled, the MIT test value increases by approximately 1.4 times from 1413 times to 2011 times. Since the size of the corresponding opening (310a) area also increases by the increased width of the signal wiring pattern, it can be seen that the flexibility of the printed circuit board (300) is improved. That is, increasing the width of the signal wiring pattern may include increasing the size of the first region (321) of the signal wiring pattern corresponding to the opening (310a) (e.g., the first region (321) of FIG. 3a), and increasing the size of the opening (310a) in correspondence with the increase in the size of the first region (321). Through the test results of Table 1 described above, it can be confirmed that the printed circuit board (300) according to one embodiment can improve RF performance by increasing the width of the signal wiring pattern and additionally improve flexible characteristics.

[0125] FIG. 5a is a schematic exploded perspective view of a printed circuit board (300) according to one embodiment. FIG. 5b is a side view of a printed circuit board (300) according to one embodiment. Here, FIG. 5a is an exploded perspective view showing the components of the printed circuit board (300) excluding the insulating layer.

[0126] Referring to FIGS. 5a and 5b, a printed circuit board (300) according to one embodiment may include a first ground layer (310) (e.g., the ground layer (310) of FIG. 3a), a wiring layer (320) (e.g., the wiring layer (320) of FIG. 3a), a second ground layer (340), a first insulating layer (330) (e.g., the insulating layer (330) of FIG. 3a), and a second insulating layer (350). At least one of the components of the printed circuit board (300) according to one embodiment may be identical or similar to at least one of the components of the printed circuit board (300) of FIG. 3a and FIG. 3b and / or the printed circuit board (300) of FIG. 4a to FIG. 4d, and redundant descriptions below will be omitted.

[0127] According to one embodiment, the printed circuit board (300) may have a strip line structure in which a first ground layer (310), a first insulating layer (330), a wiring layer (320), a second insulating layer (350), and a second ground layer (340) are arranged in order from the bottom (e.g., from direction ② of FIG. 5a). In other words, the printed circuit board (300) may have a structure that further includes an additional ground layer (e.g., a second ground layer (340)) and an additional insulating layer (e.g., a second insulating layer (350)) in the printed circuit board having the microstrip line structure of FIG. 3a and FIG. 3b (e.g., the printed circuit board (300) of FIG. 3a and FIG. 3b).

[0128] According to one embodiment, a second ground layer (340) is located on the top of a printed circuit board (300) (e.g., the area in direction ① of FIG. 5a), and a ground can be formed by patterning a metal layer (e.g., a copper (Cu) layer). At least a portion of the second ground layer (340) may be etched to form a plurality of second openings (340a) on the second ground layer (340), and the plurality of second openings (340a) may be formed repeatedly at intervals on the second ground layer (340) similar to a plurality of first openings (310a) on the first ground layer (310) (e.g., the openings (310a) of FIG. 3a and FIG. 4a). Accordingly, a mesh-shaped pattern may be formed on the second ground layer (340). At this time, the plurality of openings (310a) may be arranged at regular intervals as an example, but are not limited thereto, and depending on the embodiment, the plurality of openings (310a) may be arranged at irregular intervals. According to one embodiment, the plurality of second openings (340a) on the second ground layer (340) may be arranged at a position corresponding to the plurality of first openings (310a) of the first ground layer (310) described above and / or the first area (321) constituting the signal wiring pattern of the wiring layer (320). According to one embodiment, the second opening (340a) is positioned at a location corresponding to a plurality of first openings (310a) and / or a first region (321), and may include the first opening (310a), the first region (321), and the second opening (340a) being positioned so that they overlap at least partially or wholly when viewed from above the printed circuit board (300) (e.g., when viewed from region ① in FIG. 5a). The second opening (340a) may, in one example, be formed in a shape substantially corresponding to the first opening (310a) and the first region (321), in which case the outer surface of the second opening (340a) (e.g., C in FIG. 5a) may be formed in a shape corresponding to the outer surface of the first opening (310a) (e.g., A in FIG. 5a) and the outer surface of the first region (321) (e.g., B in FIG. 5a).As described above, the second opening (340a) has the same shape as the first opening (310a) and the first region (321) and is located on a region corresponding to the first opening (310a) and the first region (321), so that the impedance value between the second ground layer (340) and the wiring layer (320) can be maintained constant.

[0129] The shape of the second opening (340a) is not limited to the embodiment described above, and according to various embodiments, the second opening (340a) may be formed with a shape different from the first opening (310a) and the first region (321), or may be formed with a shape smaller than the first opening (310a) and the first region (321).

[0130] A printed circuit board (300) according to one embodiment may be formed of a conductive material and may include at least one via (381) that electrically connects a first ground layer (310) and a second ground layer (340). The at least one via (381) penetrates the first ground layer (310), the first insulating layer (330), the second insulating layer (350), and the second ground layer (340), and can electrically connect the first ground layer (310) and the second ground layer (340). Accordingly, the first ground layer (310) and the second ground layer (340) may have the same potential. For example, if the first ground layer (310) and the second ground layer (340) are made to have the same potential, a reference potential can be stably set. Through this, a stable ground can be formed, and as a result, the impedance can be set low, thereby suppressing noise generation. According to one embodiment, at least one first via hole (311) through which at least one via (381) can pass is formed on the first ground layer (310), and at least one second via hole (341) through which at least one via (381) can pass is formed on the second ground layer (340). According to various embodiments, at least one via (381) may be arranged at a constant interval or at a different interval between the first ground layer (310) and the second ground layer (340).

[0131] A second insulating layer (350) according to one embodiment may be formed of a dielectric (e.g., polyimide) and may be located between the second ground layer (340) and the wiring layer (320) to fill the space between the second ground layer (340) and the wiring layer (320).

[0132] According to an embodiment, the second insulating layer (350) may be formed from a dielectric having a different dielectric constant from the first insulating layer (330), and the printed circuit board (300) may have a rigid characteristic (or rigidity) overall through the second insulating layer (350) described above. According to another embodiment, the first insulating layer (330) and the second insulating layer (350) may be formed from the same dielectric having a less flexible characteristic. That is, the printed circuit board (300) having a strip structure may have a higher rigidity compared to a printed circuit board with a microstrip structure (e.g., the printed circuit board (300) of FIG. 3a and FIG. 3b). Accordingly, the printed circuit board (300) according to one embodiment may not be easily bent or bent by an external force.

[0133] According to one embodiment, the printed circuit board (300) may further include an external insulating layer (e.g., 307, 308) disposed outside of a copper foil (cropper) composed of a first ground layer (310), a first insulating layer (330), a wiring layer (320), a second insulating layer (350), and a second ground layer (340). In one example, the external insulating layer may include a first external insulating layer (307) disposed above the second ground layer (340) and a second external insulating layer (308) disposed below the first ground layer (310). The first external insulating layer (307) and the second external insulating layer (308) are disposed above and below the copper foil, respectively, to insulate the first ground layer (310), the first insulating layer (330), the wiring layer (320), the second insulating layer (350), and the second ground layer (340).

[0135] FIG. 6a is a perspective view of a printed circuit board (300) according to various embodiments, viewed from the top (e.g., the area in direction ① of FIG. 6a). FIG. 6b is a side view of the printed circuit board of FIG. 6a, viewed from the side. Here, FIG. 6a is a perspective view showing the components of the printed circuit board (300) excluding the insulating layer.

[0136] Referring to FIG. 6a and FIG. 6b, a printed circuit board (300) according to one embodiment may include at least one flexible region (300-1, 300-3) and at least one rigid region (300-2).

[0137] According to one embodiment (e.g., FIG. 6a), a first flexible region (300-1) is disposed on one side of a printed circuit board (300), a second flexible region (300-3) is disposed on the other side, and a rigid region (300-2) may be disposed between the first flexible region (300-1) and the second flexible region (300-3). In other words, the printed circuit board may be disposed in the order of the first flexible region (300-1) (e.g., 300a in FIG. 2a), the rigid region (300-2) (e.g., 300d in FIG. 2a), and the second flexible region (300-3) (e.g., 300b in FIG. 2a) starting from one side.

[0138] However, the arrangement structure of the flexible region (e.g., 300-1, 300-3) and the rigid region (e.g., 300-2) of the printed circuit board (300) is not limited to the above-described embodiment, and the printed circuit board (300) according to one embodiment may be configured such that the rigid region (300-2) is located at both ends of the flexible region (e.g., 300-1), and the wiring of the flexible region is connected to another circuit board through vias.

[0139] According to one embodiment, the first flexible region (300-1) and the second flexible region (300-3) may have a microstrip line structure (e.g., the printed circuit board (300) of FIG. 3A and FIG. 3B) comprising a first ground layer (310) (e.g., the ground layer (310) of FIG. 3A), a wiring layer (320) (e.g., the wiring layer (320) of FIG. 3A), and a first insulating layer (330) between the first ground layer (310) and the wiring layer (320) (e.g., the insulating layer (330) of FIG. 3B).

[0140] According to another embodiment, the rigid region (300-2) may be a region that further includes a second insulating layer (350) (e.g., the second insulating layer (350) of FIG. 5b) and a second ground layer (340) (e.g., the second ground layer (340) of FIG. 5a and 5b) in the flexible region (300-1, 300-3). That is, the rigid region (300-2) may have a strip line structure (e.g., the printed circuit board (300) of FIG. 5a and 5b) that is stacked in the order of the first ground layer (310), the first insulating layer (330), the wiring layer (320), the second insulating layer (350), and the second ground layer (340) from the bottom.

[0141] The rigid region (300-2) may include at least one via (381) electrically connecting the first ground layer (310) and the second ground layer (340), and at least one via (381) may penetrate the first ground layer (310), the first insulating layer (330), the second insulating layer (350), and the second ground layer (340). A first via hole (311) through which the via (381) can penetrate may be formed in the first ground layer (310) of the rigid region (300-2), and a second via hole (341) through which the via (381) can penetrate may be formed in the second ground layer (340).

[0142] According to one embodiment, the first insulating layer (330) and / or the second insulating layer (350) may be formed of a dielectric having less flexible properties, and accordingly, the rigid region (300-2) may be easily bent or not bent compared to the first flexible region (300-1) and / or the second flexible region (300-2).

[0143] According to one embodiment (e.g., FIG. 6b), the printed circuit board (300) may further include a first external insulating layer (307) (e.g., the first external insulating layer (307) of FIG. 5b) disposed on top of the second ground layer (340) and a second external insulating layer (308) (e.g., the second external insulating layer (308) of FIG. 5b) disposed on the bottom of the first ground layer (310), and a redundant description thereof will be omitted.

[0144] A printed circuit board (300) according to one embodiment has a flexible region (e.g., 300-1, 300-3) disposed in an area adjacent to an electric element to facilitate coupling (or connection) between the electric element and the printed circuit board (300), and a rigid region (e.g., 300-2) disposed in other areas to ensure overall rigidity of the printed circuit board (300).

[0145] However, the structure in which at least one flexible region (300-1, 300-3) and at least one rigid region (300-2) of a printed circuit board (300) according to one embodiment are arranged is not limited to the above-described embodiment, and the arrangement structure of the flexible region (300-1, 300-3) and the rigid region (300-2) may vary depending on the embodiment. As an example, a flexible region (e.g., 300-1 or 300-3) may be arranged only on one side of the printed circuit board (300), and according to another embodiment, a flexible region (e.g., 300-1 or 300-3) may be arranged between two rigid regions (e.g., 300-2).

[0146] That is, the printed circuit board (300) according to one embodiment may have different characteristics (e.g., flexible characteristics, rigid characteristics) depending on the region of the printed circuit board (300) by combining a microstrip line structure and a strip line structure.

[0148] FIG. 7 is a side view of a printed circuit board (300) according to one embodiment, viewed from the side.

[0149] Referring to FIG. 7, a printed circuit board (300) according to one embodiment may include a first ground layer (310), a wiring layer (320), a second ground layer (340), a third ground layer (360), a first insulating layer (330) filling between the first ground layer (310) and the wiring layer (320), a second insulating layer (350) filling between the wiring layer (320) and the second ground layer (340), and a third insulating layer (370) filling between the second ground layer (340) and the third ground layer (360). Since at least one of the components of the printed circuit board (300) according to one embodiment may be identical or similar to at least one of the components of the printed circuit board of FIG. 3a and FIG. 3b and / or the printed circuit board of FIG. 5a and FIG. 5b, redundant descriptions below will be omitted.

[0150] In one example, the printed circuit board (300) may be arranged in the order of a first ground layer (310), a first insulating layer (330), a wiring layer (320), a second insulating layer (350), a second ground layer (340), a third insulating layer (370), and a third ground layer (360) from the bottom. That is, the printed circuit board (300) according to one embodiment may have a structure in which the third insulating layer (370) and the third ground layer (360) are added to the printed circuit board of FIG. 5a and 5b.

[0151] According to one embodiment, a third ground layer (360) is located on the second ground layer (340), and a ground can be formed by patterning a metal layer. In one example, at least a portion of the third ground layer (360) may be etched so that a plurality of third openings (not shown) may be formed on the third ground layer (360). At this time, the plurality of third openings may be formed repeatedly at intervals, and accordingly, a mesh-shaped pattern may be formed on the third ground layer. At this time, the plurality of third openings may be arranged at regular intervals, but may also be arranged at irregular intervals depending on the embodiment.

[0152] In one example, a plurality of third openings may be formed at positions corresponding to a plurality of first openings (310a) of the first grounding layer (310), a first region (321) of the wiring layer (320), and a plurality of second openings (340a) of the second grounding layer (340). Additionally, the third openings may be formed in a shape substantially corresponding to the first openings (310a), the first region (321), and the second openings (340a), so that the impedance value between the third grounding layer (360) and the wiring layer (320) can be maintained constant.

[0153] However, the structure of the third grounding layer (360) is not limited to the above-described embodiment, and depending on the embodiment, the third opening may be formed at a position that does not correspond to the plurality of second openings (340a) of the first region (321) and the second grounding layer (340), or the structure may have no separate opening formed on the third grounding layer (360).

[0154] According to one embodiment, the third insulating layer (370) is positioned between the second ground layer (340) and the third ground layer (360) to fill the space between the second ground layer (340) and the third ground layer (360). The third insulating layer (370) is formed of a dielectric material to protect the second ground layer (340) and the third ground layer (360). According to one embodiment, the first insulating layer (330), the second insulating layer (350), and the third insulating layer (370) may be formed of a dielectric material having the same dielectric constant. According to another embodiment, at least one insulating layer among the first insulating layer (330), the second insulating layer (350), and the third insulating layer (370) may be formed of a dielectric material having a dielectric constant different from that of the other insulating layers.

[0155] A printed circuit board (300) according to one embodiment may include at least one via (382) that electrically connects a first ground layer (310), a second ground layer (340), and a third ground layer (360). The at least one via (382) may be arranged regularly at regular intervals according to the embodiment, but is not limited thereto.

[0156] At least one via (382) penetrates the first ground layer (310), the first insulating layer (330), the second insulating layer (350), the second ground layer (340), the third insulating layer (370), and the third ground layer (360), and can electrically connect the first ground layer (310), the second ground layer (340), and the third ground layer (360). Accordingly, the first ground layer (310), the second ground layer (340), and the third ground layer (360) can have the same potential.

[0157] According to one embodiment, at least one first via hole (311) through which at least one via (382) can pass may be formed on the first ground layer (310). Similarly, at least one second via hole (341) through which a via (382) can pass may be formed on the second ground layer (340), and at least one third via hole (361) through which a via (382) can pass may be formed on the third ground layer (360).

[0158] According to one embodiment, the printed circuit board (300) may further include a first external insulating layer (307) disposed on a third ground layer (360) and a second external insulating layer (308) disposed at the bottom of the first ground layer (310), and a redundant description thereof will be omitted.

[0160] Figure 8 is a graph illustrating the signal transmission performance of a printed circuit board depending on the presence or absence of a mesh pattern in the ground layer.

[0161] FIG. 8 is a graph comparing the signal transmission performance of a printed circuit board having a signal wiring pattern disposed on a ground layer without a separate opening, and a printed circuit board having a mesh pattern having a plurality of openings (e.g., the opening (310a) of FIG. 3a) formed on a ground layer (e.g., the ground layer (310) of FIG. 3a), and an expanded area of ​​the signal wiring pattern corresponding to the plurality of openings (e.g., the printed circuit board (300) of FIG. 3a and 3b or the printed circuit board (300) of FIG. 5a and 5b). In the present disclosure, the vertical axis (y-axis) of FIG. 8 represents a signal loss value, and the horizontal axis (x-axis) of FIG. 8 represents a value in which the frequency of the signal is expressed as a dimensionless number, and the insulating layer of the printed circuit boards described above has the same thickness.

[0162] A printed circuit board (e.g., the printed circuit board (300) of FIG. 3a and 3b) can transmit signals having various frequencies to an electrical component (e.g., the patch antenna module (202) or antenna module (207) of FIG. 2) mounted within an electronic device (e.g., the electronic device (200) of FIG. 2) through a signal wiring pattern. However, signal loss may occur during the signal transmission process through the signal wiring pattern.

[0163] Referring to FIG. 8, it can be seen that a printed circuit board in which a plurality of openings are formed in a mesh pattern on a ground layer and an area of ​​a signal wiring pattern corresponding to the plurality of openings (e.g., the first area (321) of FIG. 3a) is extended is formed, results in less signal loss during the signal transmission process compared to a printed circuit board in which a signal wiring pattern is placed on a ground layer where no mesh pattern is formed. For example, when looking at the graph in FIG. 8, the graph indicated by the solid line is a graph showing the loss measured by actual measurement when the openings on the ground layer are not formed in a mesh pattern, and the graph indicated by the dotted line is a graph showing the loss measured by actual measurement when the openings on the ground layer are formed in a mesh pattern. When comparing the two graphs, it can be seen that at the same frequency, the ground layer with openings formed in a mesh pattern has less loss than the ground layer without openings formed in a mesh pattern.

[0164] That is, the printed circuit board according to the above-described embodiment (e.g., the printed circuit board (300) of FIG. 3a and FIG. 3b or the printed circuit board (300) of FIG. 5a and FIG. 5b) can form a mesh pattern having a plurality of openings on a ground layer and expand the area of ​​the signal wiring pattern corresponding to the plurality of openings, thereby widening the average width of the signal wiring pattern. As a result, the printed circuit board can improve signal transmission performance (RF performance) by reducing signal loss that occurs during the process of transmitting signals of various frequencies as shown in FIG. 8, while maintaining the flexible characteristics of the printed circuit board.

[0166] A printed circuit board according to one embodiment of the present disclosure (e.g., printed circuit board (300) of FIG. 3a and 3b) comprises, in the printed circuit board, a first ground layer (e.g., ground layer (310) of FIG. 3a) having at least one first opening (e.g., opening (310a) of FIG. 3a), a wiring layer (e.g., wiring layer (320) of FIG. 3a) spaced apart from the first ground layer and having a signal wiring pattern formed thereon, and a first insulating layer (e.g., insulating layer (330) of FIG. 3b) disposed between the first ground layer and the wiring layer, wherein the signal wiring pattern comprises a first region (e.g., first region (321) of FIG. 3a) having a first width (e.g., W1 of FIG. 3a), and a second region (e.g., second region (322) of FIG. 3a) having a second width (e.g., W2 of FIG. 3a) different from the first width, and the first region and The second region is arranged alternately, and the first region may be arranged at a position corresponding to the first opening.

[0167] According to one embodiment, the first ground layer may be formed as a mesh pattern.

[0168] According to one embodiment, the first region may be formed in a shape corresponding to the first opening.

[0169] According to one embodiment, the first width may be larger than the second width.

[0170] According to one embodiment, the first ground layer may have the first openings arranged repeatedly.

[0171] According to one embodiment, when viewed from the top of the wiring layer, the first region may be formed to overlap at least partially with the first opening.

[0172] According to one embodiment, a second ground layer (e.g., the second ground layer (340) of FIG. 5a and 5b) may be further included, which is spaced apart from the wiring layer and has a mesh pattern formed therein having at least one second opening (e.g., the second opening (340a) of FIG. 5a).

[0173] According to one embodiment, a second insulating layer (e.g., the second insulating layer (350) of FIG. 5b) disposed between the wiring layer and the second ground layer may be further included.

[0174] According to one embodiment, the second ground layer may have the second openings arranged repeatedly.

[0175] According to one embodiment, the second opening may be formed in a shape substantially corresponding to the first region or the first opening.

[0176] According to one embodiment, the first region may be positioned at a location corresponding to the at least one first opening and the second opening.

[0177] According to one embodiment, at least one via (e.g., via (381) of FIG. 5a and FIG. 5b) that electrically connects the first ground layer and the second ground layer may be further included.

[0178] According to one embodiment, a third grounding layer (e.g., the third grounding layer (360) of FIG. 7) disposed on the second grounding layer may be further included.

[0179] According to one embodiment, at least one via (e.g., via (382) of FIG. 7) that electrically connects the first ground layer, the second ground layer, and the third ground layer may be further included.

[0180] An electronic device according to one embodiment of the present disclosure (e.g., the electronic device (200) of FIG. 2b) comprises, in the electronic device, a first electric element (e.g., a main circuit board (208) of FIG. 2b), a second electric element (e.g., an antenna module (207) of FIG. 2b), and a printed circuit board (e.g., a printed circuit board (300) of FIG. 2b) electrically connecting the first electric element and the second electric element, wherein the printed circuit board comprises a first ground layer (e.g., a ground layer (310) of FIG. 3a) comprising at least one first opening (e.g., an opening (310a) of FIG. 3a), a wiring layer (e.g., a wiring layer (320) of FIG. 3a) having a signal wiring pattern formed thereon, and a first insulating layer (e.g., an insulating layer (330) of FIG. 3b) disposed between the first ground layer and the wiring layer, wherein the signal wiring pattern has a first width (e.g., W1 of FIG. 3a) It includes a first region having (e.g., the first region (321) of FIG. 3a) and a second region having a second width different from the first width (e.g., W2 of FIG. 3a) (e.g., the second region (322) of FIG. 3a), wherein the first region and the second region are arranged alternately, and the first region may be arranged to overlap at least partially with the first opening when the printed circuit board is viewed from the top.

[0181] According to one embodiment, the first ground layer may be formed as a mesh pattern.

[0182] According to one embodiment, the first region may be formed in a shape corresponding to the first opening.

[0183] According to one embodiment, the outer surface of the first region may be formed in a shape corresponding to the outer surface of the first opening.

[0184] According to one embodiment, the printed circuit board may include at least one flexible region (e.g., 300-1, 300-3 of FIG. 6b) and at least one rigid region (e.g., 300-2 of FIG. 6b).

[0185] According to one embodiment, the rigid region may further include a second ground layer disposed on the first ground layer (e.g., the second ground layer (340) of FIG. 6b), a second insulating layer (e.g., the second insulating layer (350) of FIG. 6b) filling the space between the first ground layer and the second ground layer, and at least one via (e.g., the via (381) of FIG. 6b) electrically connecting the first ground layer and the second ground layer.

[0186] A printed circuit board according to one embodiment of the present disclosure (e.g., printed circuit board (300) of FIG. 5a and 5b) comprises, in the printed circuit board, a ground layer (e.g., ground layer (310) of FIG. 5a) having at least one opening (e.g., opening (310a) of FIG. 5a) and at least one via hole (e.g., via hole (311) of FIG. 5a), at least one via (e.g., via (381) of FIG. 5a) electrically connected to the ground layer and penetrating the ground layer, a wiring layer (e.g., wiring layer (320) of FIG. 5a) spaced apart from the ground layer and having a signal wiring pattern formed thereon (e.g., wiring layer (320) of FIG. 5a), and an insulating layer (e.g., insulating layer (330) of FIG. 5b) disposed between the ground layer and the wiring layer, wherein the signal wiring pattern comprises a first region (e.g., first region (321) of FIG. 3a) having a first width (e.g., W1 of FIG. 3a), and the first It includes a second region (e.g., second region (322) of FIG. 3a) having a second width different from the width (e.g., W2 of FIG. 3a), wherein the first region and the second region are alternately arranged, and the first region may be positioned at a location corresponding to the at least one opening and spaced apart from the at least one via hole.

[0187] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0188] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

Claims

Claim 1 A printed circuit board comprising: a first ground layer including at least one first opening; a wiring layer spaced apart from the first ground layer and having a signal wiring pattern formed thereon; and a first insulating layer disposed between the first ground layer and the wiring layer; wherein the signal wiring pattern comprises: a first region having a first width; a second region having a second width different from the first width; and a second ground layer spaced apart from the wiring layer and having a mesh pattern formed thereon having at least one second opening; wherein the first region and the second region are alternately arranged, the first region is arranged at a position corresponding to the first opening, and the outer surface of the first opening and the outer surface of the first region are formed with the same shape. Claim 2 A printed circuit board according to claim 1, wherein the first ground layer is formed in a mesh pattern, and the first region is formed in a shape corresponding to the first opening. Claim 3 In claim 1, the printed circuit board in which the first width is larger than the second width. Claim 4 In claim 1, the first ground layer is a printed circuit board in which the first openings are repeatedly arranged. Claim 5 A printed circuit board according to claim 1, wherein, when viewed from the top of the wiring layer, the first region is formed to overlap at least partially with the first opening. Claim 6 delete Claim 7 A printed circuit board according to claim 1, further comprising a second insulating layer disposed between the wiring layer and the second ground layer. Claim 8 In claim 1, the second ground layer is a printed circuit board in which the second openings are repeatedly arranged. Claim 9 In claim 8, the second opening is a printed circuit board formed in a shape substantially corresponding to the first region or the first opening. Claim 10 In claim 9, the first region is a printed circuit board disposed at a position corresponding to at least one first opening and the second opening. Claim 11 A printed circuit board according to claim 7, further comprising at least one via electrically connecting the first ground layer and the second ground layer. Claim 12 ◈Claim 12 was abandoned upon payment of the registration fee.◈ A printed circuit board according to Claim 7, further comprising a third ground layer disposed on the second ground layer. Claim 13 ◈Claim 13 was abandoned upon payment of the registration fee.◈ A printed circuit board according to Claim 12, further comprising a third insulating layer filling the space between the second ground layer and the third ground layer. Claim 14 ◈Claim 14 was abandoned upon payment of the registration fee.◈ A printed circuit board according to Claim 13, further comprising at least one via electrically connecting the first ground layer, the second ground layer, and the third ground layer. Claim 15 ◈Claim 15 was abandoned upon payment of registration fee.◈ An electronic device comprising: a first electric element and a second electric element; and a printed circuit board electrically connecting the first electric element and the second electric element, wherein the printed circuit board comprises: a first ground layer having at least one first opening; a wiring layer having a signal wiring pattern formed thereon; and a first insulating layer disposed between the first ground layer and the wiring layer; wherein the signal wiring pattern comprises: a first region having a first width; a second region having a second width different from the first width; and a second ground layer having a mesh pattern formed thereon having at least one second opening spaced apart from the wiring layer, wherein the first region and the second region are alternately arranged, and the first region is arranged to overlap at least partially with the first opening when viewed from the top of the printed circuit board, and the outer surface of the first opening and the outer surface of the first region are formed with the same shape. Claim 16 ◈Claim 16 was abandoned upon payment of the registration fee.◈ In claim 15, the first region is an electronic device formed in a shape corresponding to the first opening. Claim 17 delete Claim 18 ◈Claim 18 was abandoned upon payment of the registration fee.◈ In claim 15, the printed circuit board comprises at least one flexible region and at least one rigid region, an electronic device. Claim 19 ◈Claim 19 was abandoned upon payment of registration fee.◈ An electronic device according to claim 18, wherein the at least one rigid region further comprises: the second grounding layer disposed on the first grounding layer; the second insulating layer filling the space between the first grounding layer and the second grounding layer; and at least one via electrically connecting the first grounding layer and the second grounding layer. Claim 20 ◈Claim 20 was abandoned upon payment of registration fee.◈ A printed circuit board comprising: a ground layer including at least one first opening and at least one via hole; at least one via electrically connected to the ground layer and penetrating the ground layer; a wiring layer spaced apart from the ground layer and having a signal wiring pattern formed thereon; and an insulating layer disposed between the ground layer and the wiring layer; wherein the signal wiring pattern comprises: a first region having a first width; a second region having a second width different from the first width; and a second ground layer spaced apart from the wiring layer and having a mesh pattern formed thereon having at least one second opening; wherein the first region and the second region are alternately arranged; wherein the first region is disposed at a position corresponding to the at least one first opening and spaced apart from the at least one via hole, and the outer surface of the at least one first opening and the outer surface of the first region are formed with the same shape.

Images