Nozzle Moving Unit and Apparatus for treating substrate

Abstract

The present invention provides a substrate processing device. The substrate processing device comprises: a processing vessel having a processing space inside; a substrate support unit supporting a substrate within the processing vessel; and a liquid supply unit supplying a processing liquid to the substrate; wherein the liquid supply unit may include a plurality of nozzles disposed in a groove port; a nozzle moving member having a grip portion holding a selected nozzle among the plurality of nozzles; and a particle removal means installed on the grip portion to remove particles generated when the nozzle is held.

Description

Technology Field

[0001] The present invention relates to a device for liquid processing of a substrate. Background Technology

[0002] The photolithography process is a process of forming a desired pattern on a wafer during semiconductor manufacturing. The photolithography process is typically carried out in a spinner local facility connected to an exposure system, which continuously processes the coating, exposure, and development processes. This spinner local facility performs the HMDS (Hexamethyl disilazane) process, coating, baking, and development processes sequentially or selectively.

[0003] Here, the coating process is a process of applying a photoresist to the surface of a substrate. The photoresist is ejected onto the substrate through a nozzle, and multiple nozzles are generally provided. One of the multiple nozzles is gripped by a nozzle moving member to eject the photoresist onto the substrate.

[0004] However, there is a problem in that particles are generated due to friction between the nozzle moving member and the gripping part of the nozzle during the process in which the nozzle is gripped by the nozzle moving member. The problem to be solved

[0005] The present invention is intended to provide a device capable of preventing wear on a nozzle moving unit and a gripping part of the nozzle.

[0006] In addition, the present invention is intended to provide a device capable of minimizing the generation of particles.

[0007] The problems that the present invention aims to solve are not limited to those mentioned above. Other technical problems not mentioned will be clearly understood by those skilled in the art to which the present invention belongs from the description below. means of solving the problem

[0008] According to one aspect of the present invention, a substrate processing device may be provided, comprising: a processing vessel having a processing space inside; a substrate support unit supporting a substrate within the processing vessel; and a liquid supply unit supplying a processing liquid to the substrate; wherein the liquid supply unit comprises a plurality of nozzles disposed in a groove port; a nozzle moving member having a grip portion holding a selected nozzle among the plurality of nozzles; and a particle removal means installed on the grip portion to remove particles generated when the nozzle is held.

[0009] In addition, the particle removal means may include a suction nozzle that removes particles by suctioning them with a vacuum.

[0010] In addition, the particle removal means may include a magnetic material that captures particles by magnetic force.

[0011] In addition, the surface of the grip portion can be treated with DLC (Diamond Like Carbon).

[0012] Additionally, the grip portion includes a body fixedly installed on the arm; and a pair of fingers installed spaced apart from each other on the bottom surface of the body and for gripping a grip projection protruding from the upper part of the nozzle, and the suction nozzle may be positioned between the pair of fingers on the bottom surface of the body.

[0013] Additionally, the grip portion includes a body fixedly installed on the arm; a pair of fingers installed spaced apart from each other on the bottom surface of the body and for gripping a grip projection protruding from the upper part of the nozzle, and the magnetic body may be provided on the bottom surface of the body located between the pair of fingers.

[0014] Additionally, the grip portion includes a body fixedly installed on the arm; a pair of fingers installed spaced apart from each other on the bottom surface of the body and for gripping a grip projection protruding from the upper part of the nozzle, and the particle removal means may include a plurality of vacuum suction holes provided on the contact surface of the pair of fingers that contacts the grip projection.

[0015] In addition, the above-mentioned port is located outside the processing container, and the nozzle is waiting there, and the processing liquid discharged by the nozzle can be discharged to the outside.

[0016] According to another aspect of the present invention, a nozzle moving unit having a grip portion for holding a selected nozzle among a plurality of nozzles may be provided, wherein the grip portion comprises: a body fixedly installed on the arm; a pair of fingers installed spaced apart from each other on the bottom surface of the body and for gripping a grip projection protruding from the upper part of the nozzle; and a particle removal means installed on the grip portion for removing particles generated when the nozzle is held.

[0017] In addition, the particle removal means may include a suction nozzle positioned between the pair of fingers on the bottom surface of the body and removing particles by vacuum suction.

[0018] In addition, the particle removal means may include a magnetic body positioned between the pair of fingers on the bottom surface of the body and capturing particles by magnetic force.

[0019] In addition, the particle removal means may include a plurality of vacuum suction holes provided on the contact surface that contacts the grip protrusions of the pair of fingers.

[0020] In addition, the surface of the above pair of fingers can be treated with DLC (Diamond Like Carbon). Effects of the invention

[0021] According to an embodiment of the present invention, it has a special effect of effectively removing and capturing particles generated by friction between the grip portion and the nozzle, thereby preventing substrate contamination.

[0022] According to an embodiment of the present invention, wear of the gripping portion and the gripping portion of the nozzle can be prevented.

[0023] The effects of the present invention are not limited to the effects described above. Unmentioned effects will be clearly understood by those skilled in the art from this specification and the accompanying drawings. Brief explanation of the drawing

[0024] FIG. 1 is a plan view of a substrate processing facility according to a first embodiment of the present invention. Figure 2 is a cross-sectional view of the equipment of Figure 1 viewed from the AA direction. Figure 3 is a cross-sectional view of the equipment of Figure 1 viewed from the BB direction. Figure 4 is a cross-sectional view of the equipment of Figure 1 viewed from the CC direction. Figure 5 is a cross-sectional view showing a substrate processing device provided in the coating chamber of Figure 2. Figure 6 is a plan view showing the substrate processing apparatus of Figure 5. Figure 7 is a side view of the nozzle of Figure 6 waiting in the home port. FIGS. 8 to 11 are drawings showing various embodiments of particle removal means provided to a gripper. Specific details for implementing the invention

[0025] Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in describing preferred embodiments of the present invention in detail, specific descriptions of related known functions or configurations are omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the present invention. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and operations.

[0026] The term 'comprising' a component means that, unless specifically stated otherwise, it does not exclude other components but rather allows for the inclusion of additional components. Specifically, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0027] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0028] Singular expressions include plural expressions unless the context clearly indicates otherwise. Additionally, the shapes and sizes of elements in drawings may be exaggerated for clearer explanation.

[0029] The equipment of the present embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the equipment of the present embodiment can be connected to an exposure device to perform a coating process and a developing process on the substrate. Below, the case where a wafer is used as the substrate is described as an example.

[0030] The substrate processing facility of the present invention will be explained below through FIGS. 1 to 8.

[0031] FIG. 1 is a top view of a substrate processing facility, FIG. 2 is a top view of the facility of FIG. 1, FIG. 3 is a top view of the facility of FIG. 1, FIG. 4 is a top view of the facility of FIG. 1.

[0032] Referring to FIGS. 1 to 4, the substrate processing facility (1) includes a load port (100), an index module (200), a first buffer module (300), a coating and developing module (400), a second buffer module (500), a pre- and post-exposure processing module (600), and an interface module (700). The load port (100), the index module (200), the first buffer module (300), the coating and developing module (400), the second buffer module (500), the pre- and post-exposure processing module (600), and the interface module (700) are sequentially arranged in a line in one direction.

[0033] Hereinafter, the direction in which the load port (100), index module (200), first buffer module (300), coating and developing module (400), second buffer module (500), pre- and post-exposure processing module (600), and interface module (700) are arranged is referred to as the first direction (12), the direction perpendicular to the first direction (12) when viewed from above is referred to as the second direction (14), and the direction perpendicular to the first direction (12) and the second direction (14), respectively, is referred to as the third direction (16).

[0034] The substrate (W) is moved while stored inside the cassette (20). At this time, the cassette (20) has a structure that can be sealed from the outside. For example, a Front Open Unified Pod (FOUP) having a door at the front can be used as the cassette (20).

[0035] Below, the load port (100), index module (200), first buffer module (300), coating and developing module (400), second buffer module (500), pre- and post-exposure processing module (600), and interface module (700) will be described in detail.

[0036] The load port (100) has a mounting plate (120) on which a cassette (20) containing substrates (W) is placed. Multiple mounting plates (120) are provided, and the mounting plates (200) are arranged in a line along a second direction (14). In FIG. 1, four mounting plates (120) are provided.

[0037] The index module (200) transports a substrate (W) between a cassette (20) placed on a loading platform (120) of a load port (100) and a first buffer module (300). The index module (200) has a frame (210), an index robot (220), and a guide rail (230). The frame (210) is provided in the shape of a generally hollow rectangular prism and is placed between the load port (100) and the first buffer module (300). The frame (210) of the index module (200) may be provided at a lower height than the frame (310) of the first buffer module (300), which will be described later. The index robot (220) and the guide rail (230) are placed within the frame (210). The index robot (220) has a four-axis drive structure that allows a hand (221) that directly handles a substrate (W) to move and rotate in a first direction (12), a second direction (14), and a third direction (16). The index robot (220) has a hand (221), an arm (222), a support (223), and a base (224). The hand (221) is fixedly installed on the arm (222). The arm (222) is provided with a retractable structure and a rotatable structure. The support (223) is positioned along the third direction (16) in its longitudinal direction. The arm (222) is coupled to the support (223) so that it can move along the support (223). The support (223) is fixedly coupled to the base (224). A guide rail (230) is provided so that its longitudinal direction is positioned along the second direction (14). The base (224) is coupled to the guide rail (230) so that it can move in a straight line along the guide rail (230). Additionally, although not illustrated, the frame (210) is further provided with a door opener for opening and closing the door of the cassette (20).

[0038] The first buffer module (300) has a frame (310), a first buffer (320), a second buffer (330), a cooling chamber (350), and a first buffer robot (360). The frame (310) is provided in the shape of a hollow rectangular prism and is positioned between the index module (200) and the coating and developing module (400). The first buffer (320), the second buffer (330), the cooling chamber (350), and the first buffer robot (360) are located within the frame (310). The cooling chamber (350), the second buffer (330), and the first buffer (320) are sequentially positioned along the third direction (16) from the bottom. The first buffer (320) is positioned at a height corresponding to the coating module (401) of the coating and developing module (400) described later, and the second buffer (330) and the cooling chamber (350) are positioned at a height corresponding to the developing module (402) of the coating and developing module (400) described later. The first buffer robot (360) is positioned at a certain distance from the second buffer (330), the cooling chamber (350), and the first buffer (320) in the second direction (14).

[0039] The first buffer (320) and the second buffer (330) each temporarily store a plurality of substrates (W). The second buffer (330) has a housing (331) and a plurality of supports (332). The supports (332) are arranged within the housing (331) and are provided spaced apart from each other along a third direction (16). A substrate (W) is placed on each support (332). The housing (331) has openings (not shown) in the direction where the index robot (220) is provided, the direction where the first buffer robot (360) is provided, and the direction where the developing robot (482) is provided, so that the index robot (220), the first buffer robot (360), and the developing robot (482) of the developing module (402) described later can bring the substrate (W) into or take out of the supports (332) within the housing (331). The first buffer (320) has a structure generally similar to that of the second buffer (330). However, the housing (321) of the first buffer (320) has an opening in the direction in which the first buffer robot (360) is provided and in the direction in which the application robot (432) located in the application module (401) described later is provided. The number of supports (322) provided in the first buffer (320) and the number of supports (332) provided in the second buffer (330) may be the same or different. According to one example, the number of supports (332) provided in the second buffer (330) may be greater than the number of supports (322) provided in the first buffer (320).

[0040] The first buffer robot (360) transfers a substrate (W) between the first buffer (320) and the second buffer (330). The first buffer robot (360) has a hand (361), an arm (362), and a support (363). The hand (361) is fixedly installed on the arm (362). The arm (362) is provided with an extendable structure so that the hand (361) can move along the second direction (14). The arm (362) is coupled to the support (363) so that it can move linearly along the support (363) in the third direction (16). The support (363) has a length extending from a position corresponding to the second buffer (330) to a position corresponding to the first buffer (320). The support (363) may be provided longer in the upward or downward direction than this. The first buffer robot (360) may be provided so that the hand (361) is driven only in two axes along the second direction (14) and the third direction (16).

[0041] Each cooling chamber (350) cools the substrate (W). The cooling chamber (350) has a housing (351) and a cooling plate (352). The cooling plate (352) has an upper surface on which the substrate (W) is placed and a cooling means (353) for cooling the substrate (W). Various methods, such as cooling by cooling water or cooling using a thermoelectric element, can be used as the cooling means (353). Additionally, the cooling chamber (350) may be provided with a lift pin assembly (not shown) for positioning the substrate (W) on the cooling plate (352). The housing (351) has an opening (not shown) in the direction where the index robot (220) is provided and in the direction where the developing robot (482) is provided, so that the index robot (220) and the developing module (402) described later can bring the substrate (W) into or take out of the cooling plate (352). Additionally, the cooling chamber (350) may be provided with doors (not shown) for opening and closing the aforementioned opening.

[0042] The coating and developing module (400) performs the process of applying a photoresist on a substrate (W) before the exposure process and the process of developing the substrate (W) after the exposure process. The coating and developing module (400) generally has the shape of a rectangular parallelepiped. The coating and developing module (400) has a coating module (401) and a developing module (402). The coating module (401) and the developing module (402) are arranged to be separated by layers from each other. In one example, the coating module (401) is located on top of the developing module (402).

[0043] The coating module (401) includes a process of applying a photosensitive material, such as photoresist, to a substrate (W), and a heat treatment process, such as heating and cooling, to the substrate (W) before and after the resist coating process. The coating module (401) has a resist coating chamber (410), a bake chamber (420), and a return chamber (430). The resist coating chamber (410), the bake chamber (420), and the return chamber (430) are arranged sequentially along a second direction (14). Thus, the resist coating chamber (410) and the bake chamber (420) are positioned spaced apart from each other in the second direction (14) with the return chamber (430) in between. A plurality of resist coating chambers (410) are provided, with a plurality provided in each of the first direction (12) and the third direction (16). An example in which six resist coating chambers (410) are provided is illustrated in the drawing. Bake chambers (420) are provided in multiple numbers in the first direction (12) and the third direction (16), respectively. An example in which six bake chambers (420) are provided is shown in the drawing. However, alternatively, bake chambers (420) may be provided in a larger number.

[0044] The return chamber (430) is positioned parallel to the first buffer (320) of the first buffer module (300) in the first direction (12). A coating robot (432) and a guide rail (433) are positioned within the return chamber (430). The return chamber (430) generally has a rectangular shape. The coating robot (432) transfers the substrate (W) between the bake chambers (420), the resist coating chambers (410), the first buffer (320) of the first buffer module (300), and the first cooling chamber (520) of the second buffer module (500) described later. The guide rail (433) is positioned so that its length direction is parallel to the first direction (12). The guide rail (433) guides the coating robot (432) to move in a straight line in the first direction (12). The dispensing robot (432) has a hand (434), an arm (435), a support (436), and a base (437). The hand (434) is fixedly installed on the arm (435). The arm (435) is provided with an extendable structure so that the hand (434) can move in a horizontal direction. The support (436) is provided so that its length direction is arranged along a third direction (16). The arm (435) is coupled to the support (436) so that it can move linearly along the support (436) in a third direction (16). The support (436) is fixedly coupled to the base (437), and the base (437) is coupled to the guide rail (433) so that it can move along the guide rail (433).

[0045] All resist coating chambers (410) have the same structure. However, the type of photoresist used in each resist coating chamber (410) may differ from one another. As an example, a chemical amplification resist may be used as the photoresist. A substrate processing device (800) performs a coating process, and a detailed description thereof will be given with reference to the following FIGS. 5 to 11.

[0046] Referring again to FIGS. 1 to 4, the bake chamber (420) heat-treats the substrate (W). For example, the bake chambers (420) perform a pre-bake process, such as heating the substrate (W) to a predetermined temperature before applying photoresist to remove organic matter or moisture from the surface of the substrate (W), or a soft bake process, such as applying photoresist to the substrate (W), and perform a cooling process, such as cooling the substrate (W) after each heating process. The bake chamber (420) has a cooling plate (421) or a heating plate (422). The cooling plate (421) is provided with a cooling means (423), such as cooling water or a thermoelectric element. Additionally, the heating plate (422) is provided with a heating means (424), such as a heating wire or a thermoelectric element. The cooling plate (421) and the heating plate (422) may each be provided within a single bake chamber (420). Optionally, some of the bake chambers (420) may be equipped with only a cooling plate (421), and others may be equipped with only a heating plate (422).

[0047] The developing module (402) includes a developing process in which a developing solution is supplied to obtain a pattern on a substrate (W) to remove a portion of the photoresist, and a heat treatment process, such as heating and cooling, performed on the substrate (W) before and after the developing process. The developing module (402) has a developing chamber (460), a bake chamber (470), and a return chamber (480). The developing chamber (460), the bake chamber (470), and the return chamber (480) are arranged sequentially along a second direction (14). Thus, the developing chamber (460) and the bake chamber (470) are positioned spaced apart from each other in the second direction (14) with the return chamber (480) in between. A plurality of developing chambers (460) are provided, with a plurality provided in each of the first direction (12) and the third direction (16). An example in which six developing chambers (460) are provided is illustrated in the drawing. Bake chambers (470) are provided in multiple numbers in the first direction (12) and the third direction (16), respectively. An example in which six bake chambers (470) are provided is shown in the drawing. However, alternatively, bake chambers (470) may be provided in a larger number.

[0048] The return chamber (480) is positioned parallel to the second buffer (330) of the first buffer module (300) in the first direction (12). A developing robot (482) and a guide rail (483) are positioned within the return chamber (480). The return chamber (480) generally has a rectangular shape. The developing robot (482) transports the substrate (W) between the bake chambers (470), the developing chambers (460), the second buffer (330) and cooling chamber (350) of the first buffer module (300), and the second cooling chamber (540) of the second buffer module (500). The guide rail (483) is positioned so that its length direction is parallel to the first direction (12). The guide rail (483) guides the developing robot (482) to move in a straight line in the first direction (12). The developing robot (482) has a hand (484), an arm (485), a support (486), and a base (487). The hand (484) is fixedly installed on the arm (485). The arm (485) is provided with an extendable structure so that the hand (484) can move in a horizontal direction. The support (486) is provided so that its length direction is arranged along a third direction (16). The arm (485) is coupled to the support (486) so that it can move linearly along the support (486) in the third direction (16). The support (486) is fixedly coupled to the base (487). The base (487) is coupled to a guide rail (483) so that it can move along a guide rail (483).

[0049] All developing chambers (460) have the same structure. However, the type of developer used in each developing chamber (460) may differ from one another. The developing chamber (460) removes the light-irradiated area of ​​the photoresist on the substrate (W). At this time, the light-irradiated area of ​​the protective film is also removed. Depending on the type of photoresist used optionally, only the light-irradiated area of ​​the photoresist and protective film may be removed.

[0050] The developing chamber (460) is provided as a substrate processing device that removes a portion of photoresist by supplying a developing solution to obtain a pattern on a substrate (W).

[0051] A bake chamber (470) heat-treats a substrate (W). For example, bake chambers (470) perform a post-baking process to heat the substrate (W) before a developing process is performed, a hard-baking process to heat the substrate (W) after a developing process is performed, and a cooling process to cool the heated wafer after each baking process. A bake chamber (470) has a cooling plate (471) or a heating plate (472). A cooling means (473), such as cooling water or a thermoelectric element, is provided on the cooling plate (471). Or, a heating means (474), such as a heating wire or a thermoelectric element, is provided on the heating plate (472). A cooling plate (471) and a heating plate (472) may each be provided within a single bake chamber (470). Optionally, some of the bake chambers (470) may have only a cooling plate (471), and others may have only a heating plate (472).

[0052] As described above, in the coating and developing module (400), the coating module (401) and the developing module (402) are provided to be separated from each other. Additionally, when viewed from above, the coating module (401) and the developing module (402) may have the same chamber arrangement.

[0053] The second buffer module (500) is provided as a passage through which a substrate (W) is transported between the coating and developing module (400) and the pre- and post-exposure processing module (600). Additionally, the second buffer module (500) performs a predetermined process, such as a cooling process or an edge exposure process, on the substrate (W). The second buffer module (500) has a frame (510), a buffer (520), a first cooling chamber (530), a second cooling chamber (540), an edge exposure chamber (550), and a second buffer robot (560). The frame (510) has the shape of a rectangular parallelepiped. The buffer (520), the first cooling chamber (530), the second cooling chamber (540), the edge exposure chamber (550), and the second buffer robot (560) are located within the frame (510). The buffer (520), the first cooling chamber (530), and the edge exposure chamber (550) are positioned at a height corresponding to the coating module (401). The second cooling chamber (540) is positioned at a height corresponding to the developing module (402). The buffer (520), the first cooling chamber (530), and the second cooling chamber (540) are sequentially arranged in a line along the third direction (16). When viewed from above, the buffer (520) is positioned along the first direction (12) with respect to the return chamber (430) of the coating module (401). The edge exposure chamber (550) is positioned at a certain distance in the second direction (14) from the buffer (520) or the first cooling chamber (530).

[0054] The second buffer robot (560) transports the substrate (W) between the buffer (520), the first cooling chamber (530), and the edge exposure chamber (550). The second buffer robot (560) is positioned between the edge exposure chamber (550) and the buffer (520). The second buffer robot (560) may be provided with a structure similar to that of the first buffer robot (360). The first cooling chamber (530) and the edge exposure chamber (550) perform subsequent processes on the wafers (W) that have been processed in the coating module (401). The first cooling chamber (530) cools the substrate (W) that has been processed in the coating module (401). The first cooling chamber (530) has a structure similar to that of the cooling chamber (350) of the first buffer module (300). The edge exposure chamber (550) exposes the edges of wafers (W) that have undergone a cooling process in the first cooling chamber (530). The buffer (520) temporarily stores the substrates (W) that have undergone a process in the edge exposure chamber (550) before they are transported to the preprocessing module (601) described later. The second cooling chamber (540) cools the wafers (W) that have undergone a process in the postprocessing module (602) described later before they are transported to the developing module (402). The second buffer module (500) may have an additional buffer added at a height corresponding to the developing module (402). In this case, the wafers (W) that have undergone a process in the postprocessing module (602) may be temporarily stored in the added buffer and then transported to the developing module (402).

[0055] The pre- and post-exposure processing module (600) can perform a process of applying a protective film to protect the photoresist film applied to the substrate (W) during immersion exposure when the exposure device (1000) performs an immersion exposure process. Additionally, the pre- and post-exposure processing module (600) can perform a process of cleaning the substrate (W) after exposure. Furthermore, when the coating process is performed using a chemically amplified resist, the pre- and post-exposure processing module (600) can perform a baking process after exposure.

[0056] The pre- and post-exposure processing module (600) has a pre-processing module (601) and a post-processing module (602). The pre-processing module (601) performs a process of processing the substrate (W) before performing the exposure process, and the post-processing module (602) performs a process of processing the substrate (W) after the exposure process. The pre-processing module (601) and the post-processing module (602) are arranged to be separated by layers from each other. According to one example, the pre-processing module (601) is located above the post-processing module (602). The pre-processing module (601) is provided at the same height as the coating module (401). The post-processing module (602) is provided at the same height as the developing module (402). The pre-processing module (601) has a protective film coating chamber (610), a bake chamber (620), and a return chamber (630). The protective film coating chamber (610), the return chamber (630), and the bake chamber (620) are arranged sequentially along the second direction (14). Thus, the protective film coating chamber (610) and the bake chamber (620) are positioned spaced apart from each other in the second direction (14) with the return chamber (630) in between. Multiple protective film coating chambers (610) are provided and arranged along the third direction (16) to form layers with respect to each other. Optionally, multiple protective film coating chambers (610) may be provided in the first direction (12) and the third direction (16), respectively. Multiple bake chambers (620) are provided and arranged along the third direction (16), respectively to form layers with respect to each other. Optionally, multiple bake chambers (620) may be provided in the first direction (12) and the third direction (16), respectively.

[0057] The return chamber (630) is positioned parallel to the first cooling chamber (530) of the second buffer module (500) in the first direction (12). A preprocessing robot (632) is positioned within the return chamber (630). The return chamber (630) generally has a square or rectangular shape. The preprocessing robot (632) transfers a substrate (W) between the protective film coating chambers (610), the bake chambers (620), the buffer (520) of the second buffer module (500), and the first buffer (720) of the interface module (700) described later. The preprocessing robot (632) has a hand (633), an arm (634), and a support (635). The hand (633) is fixedly installed on the arm (634). The arm (634) is provided with an extendable structure and a rotatable structure. The arm (634) is connected to the support (635) so that it can move in a straight line along the support (635) in a third direction (16).

[0058] The protective film application chamber (610) applies a protective film onto a substrate (W) to protect the resist film during immersion exposure. The protective film application chamber (610) has a housing (611), a support plate (612), and a nozzle (613). The housing (611) has a cup shape with an open top. The support plate (612) is located within the housing (611) and supports the substrate (W). The support plate (612) is provided to be rotatable. The nozzle (613) supplies a protective liquid for forming a protective film onto the substrate (W) placed on the support plate (612). The nozzle (613) has a circular tubular shape and can supply the protective liquid to the center of the substrate (W). Optionally, the nozzle (613) has a length corresponding to the diameter of the substrate (W), and the discharge port of the nozzle (613) may be provided as a slit. In this case, the support plate (612) may be provided in a fixed state. The protective liquid contains a foaming material. The protective liquid may be a material with low affinity for photoresist and water. For example, the protective liquid may contain a fluorine-based solvent. The protective film application chamber (610) supplies the protective liquid to the central region of the substrate (W) while rotating the substrate (W) placed on the support plate (612).

[0059] A bake chamber (620) heat-treats a substrate (W) coated with a protective film. The bake chamber (620) has a cooling plate (621) or a heating plate (622). The cooling plate (621) is provided with a cooling means (623), such as cooling water or a thermoelectric element. Or the heating plate (622) is provided with a heating means (624), such as a heating wire or a thermoelectric element. The heating plate (622) and the cooling plate (621) may each be provided within a single bake chamber (620). Optionally, some of the bake chambers (620) may have only a heating plate (622), and others may have only a cooling plate (621).

[0060] The post-processing module (602) has a cleaning chamber (660), a post-exposure bake chamber (670), and a return chamber (680). The cleaning chamber (660), the return chamber (680), and the post-exposure bake chamber (670) are arranged sequentially along a second direction (14). Thus, the cleaning chamber (660) and the post-exposure bake chamber (670) are positioned spaced apart from each other in the second direction (14) with the return chamber (680) in between. Multiple cleaning chambers (660) are provided and can be arranged along a third direction (16) to form layers with each other. Optionally, multiple cleaning chambers (660) may be provided in the first direction (12) and the third direction (16), respectively. Multiple post-exposure bake chambers (670) are provided and can be arranged along a third direction (16) to form layers with each other. Optionally, the post-exposure bake chamber (670) may be provided in multiple numbers in the first direction (12) and the third direction (16), respectively.

[0061] The return chamber (680) is positioned parallel to the second cooling chamber (540) of the second buffer module (500) in the first direction (12) when viewed from above. The return chamber (680) generally has a square or rectangular shape. A post-processing robot (682) is located within the return chamber (680). The post-processing robot (682) transports the substrate (W) between the cleaning chambers (660), the post-exposure bake chambers (670), the second cooling chamber (540) of the second buffer module (500), and the second buffer (730) of the interface module (700) described later. The post-processing robot (682) provided in the post-processing module (602) may be provided with the same structure as the pre-processing robot (632) provided in the pre-processing module (601).

[0062] The cleaning chamber (660) cleans the substrate (W) after the photolithography process. The cleaning chamber (660) has a housing (661), a support plate (662), and a nozzle (663). The housing (661) has a cup shape with an open top. The support plate (662) is located within the housing (661) and supports the substrate (W). The support plate (662) is provided to be rotatable. The nozzle (663) supplies a cleaning solution onto the substrate (W) placed on the support plate (662). Water, such as deionized water, may be used as the cleaning solution. The cleaning chamber (660) supplies the cleaning solution to the central region of the substrate (W) while rotating the substrate (W) placed on the support plate (662). Optionally, while the substrate (W) is rotated, the nozzle (663) may move linearly or rotated from the central region of the substrate (W) to the edge region.

[0063] The post-exposure bake chamber (670) heats the substrate (W) on which the exposure process has been performed using far ultraviolet rays. The post-exposure bake process heats the substrate (W) to amplify the acid generated in the photoresist by exposure, thereby completing the change in the properties of the photoresist. The post-exposure bake chamber (670) has a heating plate (672). The heating plate (672) is provided with a heating means (674), such as a heating wire or a thermoelectric element. The post-exposure bake chamber (670) may further have a cooling plate (671) inside it. The cooling plate (671) is provided with a cooling means (673), such as cooling water or a thermoelectric element. Additionally, a bake chamber having only a cooling plate (671) may be optionally provided.

[0064] As described above, in the pre- and post-exposure processing module (600), the pre-processing module (601) and the post-processing module (602) are provided to be completely separated from each other. Additionally, the return chamber (630) of the pre-processing module (601) and the return chamber (680) of the post-processing module (602) are provided with the same size so that they completely overlap each other when viewed from above. Additionally, the protective film coating chamber (610) and the cleaning chamber (660) are provided with the same size so that they completely overlap each other when viewed from above. Furthermore, the bake chamber (620) and the post-exposure bake chamber (670) are provided with the same size so that they completely overlap each other when viewed from above.

[0065] The interface module (700) transfers a substrate (W) between the pre-exposure processing module (600) and the exposure device (1000). The interface module (700) has a frame (710), a first buffer (720), a second buffer (730), and an interface robot (740). The first buffer (720), the second buffer (730), and the interface robot (740) are located within the frame (710). The first buffer (720) and the second buffer (730) are spaced apart from each other by a certain distance and are arranged to be stacked on top of each other. The first buffer (720) is positioned higher than the second buffer (730). The first buffer (720) is positioned at a height corresponding to the pre-processing module (601), and the second buffer (730) is positioned at a height corresponding to the post-processing module (602). When viewed from above, the first buffer (720) is positioned in a line along the first direction (12) with the return chamber (630) of the preprocessing module (601), and the second buffer (730) is positioned in a line along the first direction (12) with the return chamber (630) of the postprocessing module (602).

[0066] The interface robot (740) is positioned spaced apart from the first buffer (720) and the second buffer (730) in the second direction (14). The interface robot (740) transports a substrate (W) between the first buffer (720), the second buffer (730), and the exposure device (1000). The interface robot (740) has a structure generally similar to that of the second buffer robot (560).

[0067] The first buffer (720) temporarily stores the substrates (W) that have been processed in the preprocessing module (601) before they are transferred to the exposure device (1000). The second buffer (730) temporarily stores the substrates (W) that have been processed in the exposure device (1000) before they are transferred to the postprocessing module (602). The first buffer (720) has a housing (721) and a plurality of supports (722). The supports (722) are placed within the housing (721) and are provided spaced apart from each other along a third direction (16). One substrate (W) is placed on each support (722). The housing (721) has an opening (not shown) in the direction provided by the interface robot (740) and the direction provided by the preprocessing robot (632) so that the interface robot (740) and the preprocessing robot (632) can bring the substrate (W) into or out of the housing (721) from the support (722). The second buffer (730) has a structure generally similar to the first buffer (720). However, the housing (4531) of the second buffer (730) has an opening (not shown) in the direction provided by the interface robot (740) and the direction provided by the postprocessing robot (682). The interface module may be provided with only buffers and robots as described above, without providing a chamber for performing a predetermined process on the wafer.

[0068] The resist coating chamber (410) may be provided as a substrate processing device for applying photoresist on a substrate (W) described below.

[0069] FIG. 5 is a cross-sectional view showing a substrate processing device provided in the coating chamber of FIG. 2, and FIG. 6 is a plan view showing the substrate processing device of FIG. 5.

[0070] Referring to FIGS. 5 and 6, the substrate processing device (800) is a device for applying photoresist on a substrate (W). The substrate processing device (800) includes a housing (810), a substrate support unit (830), a processing container (850), a lifting unit (840), a liquid supply unit (890), and a groove port (900).

[0071] The housing (810) is provided in the shape of a rectangular tube having a processing space (812) inside. An opening (not shown) is formed on one side of the housing (810). The opening functions as an inlet for the substrate (W) to be taken in and out. A door is installed at the opening, and the door opens and closes the opening. When the substrate processing process proceeds, the door blocks the opening to seal the processing space (812) of the housing (810). An inner exhaust port (814) and an outer exhaust port (816) are formed on the lower surface of the housing (810). Air flow formed inside the housing (810) is exhausted to the outside through the inner exhaust port (814) and the outer exhaust port (816). According to one example, air flow provided inside the processing container (850) can be exhausted through the inner exhaust port (814), and air flow provided outside the processing container (850) can be exhausted through the outer exhaust port (816).

[0072] A substrate support unit (830) supports a substrate (W) in a processing space (812) of a housing (810). The substrate support unit (830) rotates the substrate (W). The substrate support unit (830) includes a spin chuck (832), a rotation axis (834), and a driver (836). The spin chuck (832) is provided as a substrate support member (832) that supports the substrate. The spin chuck (832) is provided to have a circular plate shape. The substrate (W) contacts the upper surface of the spin chuck (832). The spin chuck (832) is provided to have a diameter smaller than that of the substrate (W). In one example, the spin chuck (832) can chuck the substrate (W) by vacuum suction. Optionally, the spin chuck (832) may be provided as an electrostatic chuck that chucks the substrate (W) using static electricity. In addition, the spin chuck (832) can chuck the substrate (W) with physical force.

[0073] The rotation axis (834) and the actuator (836) are provided as rotational driving members (834, 836) that rotate the spin chuck (832). The rotation axis (834) supports the spin chuck (832) from below. The rotation axis (834) is provided such that its longitudinal direction faces upward and downward. The rotation axis (834) is provided to be rotatable around its central axis. The actuator (836) provides driving force to rotate the rotation axis (834). For example, the actuator (836) may be a motor capable of varying the rotational speed of the rotation axis. The rotational driving members (834, 836) can rotate the spin chuck (832) at different rotational speeds depending on the substrate processing step.

[0074] The processing container (850) provides a processing space (812) in which a development process is performed. The processing container (850) is provided to enclose a substrate support unit (830). The processing container (850) is provided to have a cup shape with an open top. The processing container (850) includes an inner cup (852) and an outer cup (862).

[0075] The inner cup (852) is provided in the shape of a circular cup that encloses the rotation axis (834). When viewed from above, the inner cup (852) is positioned to overlap with the inner exhaust port (814). When viewed from above, the upper surface of the inner cup (852) is provided such that its outer region and inner region are each inclined at different angles. In one example, the outer region of the inner cup (852) is provided to face a downward inclined direction as it moves away from the substrate support unit (830), and the inner region is provided to face an upward inclined direction as it moves away from the substrate support unit (830). The point where the outer region and the inner region of the inner cup (852) meet is provided to correspond in the up and down direction to the side edge of the substrate (W). The outer region of the upper surface of the inner cup (852) is provided to be rounded. The outer region of the upper surface of the inner cup (852) is provided to be concave downward. The upper outer region of the inner cup (852) can be provided as a region through which the processing fluid flows.

[0076] The outer cup (862) is provided to have a cup shape that encloses the substrate support unit (830) and the inner cup (852). The outer cup (862) has a bottom wall (864), a side wall (866), a top wall (870), and an inclined wall (870). The bottom wall (864) is provided to have a circular plate shape that has a hollow interior. A recovery line (865) is formed in the bottom wall (864). The recovery line (865) recovers the processing liquid supplied onto the substrate (W). The processing liquid recovered by the recovery line (865) can be reused by an external liquid regeneration system. The side wall (866) is provided to have a circular tube shape that encloses the substrate support unit (830). The side wall (866) extends vertically from the side end of the bottom wall (864). The side wall (866) extends upward from the bottom wall (864).

[0077] The inclined wall (870) extends from the top of the side wall (866) toward the inside of the outer cup (862). The inclined wall (870) is provided to be closer to the substrate support unit (830) as it rises. The inclined wall (870) is provided to have a ring shape. The top of the inclined wall (870) is positioned higher than the substrate (W) supported by the substrate support unit (830).

[0078] The lifting unit (840) moves the inner cup (852) and the outer cup (862) up and down, respectively. The lifting unit (840) includes an inner moving member (842) and an outer moving member (844). The inner moving member (842) moves the inner cup (852) up and down, and the outer moving member (844) moves the outer cup (862) up and down.

[0079] The liquid supply unit (890) can selectively supply various types of processing fluids onto the substrate (W).

[0080] For example, the liquid supply unit (890) may include a nozzle (892) and a nozzle moving member (893) for supplying a processing liquid to a substrate (W). The nozzle (892) may be provided in multiple numbers. If the nozzle (892) is provided in multiple numbers, a processing liquid supply line is connected to each of the nozzles (892). Among the multiple nozzles (892), the nozzles (892) excluding the nozzle held by the nozzle moving member (893) to discharge the processing liquid onto the substrate are waiting at the home port (900). One of the multiple nozzles (892) can be moved to a process position and a waiting position by the nozzle moving member (893). Here, the process position is a position facing the substrate (W) on which the nozzle (892) is placed on the spin chuck (832). The waiting position is a position where the nozzle (892) is waiting at the home port (900). For example, the processing liquid may be a photosensitive liquid such as photoresist.

[0081] The nozzle moving member (893) holds and moves a selected nozzle (892) among a plurality of nozzles (892). The nozzle (892) is provided to be detachably attached to the nozzle moving member (893). According to one embodiment, the nozzle moving member (893) includes a guide rail (894), an arm (896), a grip portion (hereinafter referred to as a gripper; Gripper, 880), and an actuator (not shown).

[0082] A guide rail (894) is located on one side of a processing vessel (850). The guide rail (894) is provided such that its longitudinal direction faces the first direction (12). An arm (896) is installed on the guide rail (894). The arm (896) is provided to have a bar shape. One end of the arm (896) is fixedly installed on the guide rail (894), and a gripper (880) is fixedly installed on the other end.

[0083] The actuator can provide driving force to the guide rail (894) to reciprocate the arm (896) and the nozzle (892) in the first direction (12) or the opposite direction. The arm (896) and the nozzle (892) mounted thereon can be moved to a process position and a standby position by the guide rail (894) and the actuator. For example, the actuator may be a motor.

[0084] The home port (900) is provided as a place where nozzles (892) that are not performing the coating process are kept in standby and stored. Each nozzle (892) in standby at the home port (900) discharges the treatment liquid continuously or intermittently. The home port (900) discharges the treatment liquid discharged by the nozzles (892) to the outside. The home port (900) is located outside the treatment container (850). Each nozzle (892) discharges the treatment liquid to prevent the treatment liquid provided inside from adhering.

[0085] A plurality of openings (932) are formed on the upper surface of the port body (930) of the home port (900). The openings (932) are provided in a number that corresponds one-to-one with the nozzles (892). The openings (932) function as insertion holes into which nozzles (892) that are not used in the process are inserted. The openings (932) are formed to be arranged in a line along the first direction (12). A nozzle (892) is inserted into each opening (932) in a one-to-one correspondence.

[0086] FIG. 7 is a side view of the nozzle of FIG. 6 waiting in the home port. Referring to FIG. 6 and FIG. 7, the support (1000) supports the nozzles (892) when they are waiting in the home port (900). In order for the nozzles (892) to be placed stably on the support (1000), a seating projection (892b) is formed on either the bottom surface of the nozzle (892) or the support (1000), and a seating hole (1010) into which the seating projection (892b) is inserted is formed on the other. According to one embodiment, the seating projection (892b) is formed to protrude downward on the bottom surface of the nozzle (892), and the seating hole (1010) is formed on the support (1000). The seating projection (892b) may be provided in a single or multiple number. The mounting holes (1010) are provided in a number corresponding to the number of nozzles (892) provided to the substrate processing device (800) and the number of mounting protrusions (892b) formed on one nozzle (892).

[0087] Referring again to FIGS. 5 through 7, the gripper (880) is provided so that the nozzle (892) can be detachably attached. For example, the upper part of the nozzle (892) is provided with an upwardly protruding grip projection (892a), and the gripper (880) is provided to grip the grip projection (892a).

[0088] For reference, it is desirable that the gripper surface, particularly the surface of a pair of fingers and grip protrusions, be treated with DLC (Diamond Like Carbon) to minimize friction. Through this surface treatment, particle generation can be minimized by increasing the hardness of the finger and grip protrusion surfaces and reducing the coefficient of friction.

[0089] For example, the gripper (880) may include a body (882), a pair of fingers (883), and a particle removal means.

[0090] The body (882) can be fixedly installed on the arm (896). A pair of fingers (883) are installed spaced apart from each other on the bottom surface of the body (882) and are provided to grip the grip projection (892a) protruding from the top of the nozzle (892). A particle removal means is installed on the gripper (880) and is provided to remove particles generated when the nozzle (892) is held.

[0091] FIGS. 8 to 11 are drawings showing various embodiments of particle removal means provided to a gripper.

[0092] As illustrated in FIG. 8, the particle removal means according to the first embodiment may include a suction hole (885) for vacuum-removing particles. The suction hole (885) may be located between a pair of fingers (883) on the bottom surface of the body (882).

[0093] As illustrated in FIG. 9, the particle removal means according to the second embodiment may include a magnetic body (886) that captures particles by magnetic force. The magnetic body (886) may be provided on the bottom surface of a body (882) located between a pair of fingers (883).

[0094] As illustrated in FIGS. 10 and 11, the particle removal means according to the third embodiment may include a plurality of vacuum suction holes (887) provided on a contact surface that contacts a grip projection on a pair of fingers (883). As shown in FIG. 11, as the pair of fingers (883) grip the grip projection (892a), particles around the grip projection and around the pair of fingers can be sucked into the vacuum suction holes (887) and removed.

[0095] As described above, by implementing a particle removal means adjacent to a pair of fingers of the gripper, the diffusion of particles generated during the process of the gripper holding the nozzle can be prevented.

[0096] The above embodiments are provided to aid in understanding the present invention and do not limit the scope of the invention; it should be understood that various modified embodiments derived therefrom also fall within the scope of the present invention. The technical scope of protection of the present invention should be determined by the technical concept of the patent claims, and it should be understood that the technical scope of protection of the present invention is not limited to the literal description of the patent claims themselves, but extends substantially to inventions of equivalent technical value. Explanation of the symbols

[0097] 810: Housing 830: Substrate support unit 890: Liquid supply unit 850: Processing container 900: Home port

Claims

Claim 1 A substrate processing device comprising: a processing vessel having a processing space inside; a substrate support unit supporting a substrate within the processing vessel; and a liquid supply unit supplying a processing liquid to the substrate; wherein the liquid supply unit comprises a plurality of nozzles disposed in a groove port; and a nozzle moving member having a grip portion installed on an arm for holding a selected nozzle among the plurality of nozzles; wherein the grip portion comprises a body fixedly installed on the arm; a pair of fingers installed spaced apart from each other on the bottom surface of the body and for gripping a grip projection protruding from the upper part of the nozzle; and a particle removal means for removing particles generated during the process of the pair of fingers gripping the grip projection, and wherein the particle removal means comprises a suction hole for vacuum-suctioning and removing particles around the grip projection and around the pair of fingers. Claim 2 delete Claim 3 A substrate processing device comprising: a processing vessel having a processing space inside; a substrate support unit supporting a substrate within the processing vessel; and a liquid supply unit supplying a processing liquid to the substrate; wherein the liquid supply unit comprises a plurality of nozzles disposed in a groove port; and a nozzle moving member having a grip portion installed on an arm for holding a selected nozzle among the plurality of nozzles; and wherein the grip portion comprises a body fixedly installed on the arm; and a pair of fingers installed spaced apart from each other on the bottom surface of the body and for gripping a grip projection protruding from the upper part of the nozzle; and a particle removal means for removing particles generated during the process in which the pair of fingers grip the grip projection, wherein the particle removal means comprises a magnetic body that captures particles by magnetic force. Claim 4 In claim 1 or 3, the grip portion surface is a DLC (Diamond Like Carbon) treated substrate processing device. Claim 5 In claim 1, the suction hole is a substrate processing device located between the pair of fingers on the bottom surface of the body. Claim 6 In claim 3, the magnetic body is a substrate processing device provided on the bottom surface of the body located between the pair of fingers. Claim 7 In claim 1, the suction hole is provided on a contact surface that contacts the grip projection of the pair of fingers, in a substrate processing device. Claim 8 A substrate processing device according to claim 1 or 3, wherein the groove port is located outside the processing container, the nozzle is waiting, and the processing liquid discharged by the nozzle is discharged to the outside. Claim 9 A nozzle moving unit having a grip portion for holding a selected nozzle among a plurality of nozzles, wherein the grip portion comprises: a body fixedly installed on an arm; a pair of fingers installed spaced apart from each other on the bottom surface of the body and for gripping a grip projection protruding from the upper part of the nozzle; and a particle removal means for removing particles generated during the process of the pair of fingers gripping the grip projection, wherein the particle removal means comprises a suction hole for vacuum-suctioning and removing particles around the grip projection and around the pair of fingers. Claim 10 In claim 9, the suction hole is a nozzle moving unit located between the pair of fingers on the bottom surface of the body. Claim 11 A nozzle moving unit having a grip portion for holding a selected nozzle among a plurality of nozzles, wherein the grip portion comprises: a body fixedly installed on an arm; a pair of fingers installed spaced apart from each other on the bottom surface of the body and for gripping a grip projection protruding from the upper surface of the nozzle; and a particle removal means for removing particles generated during the process of the pair of fingers gripping the grip projection, wherein the particle removal means comprises a magnetic body positioned between the pair of fingers on the bottom surface of the body and capturing particles by magnetic force. Claim 12 In claim 9, the suction hole is a nozzle moving unit provided on a contact surface that contacts the grip projection of the pair of fingers. Claim 13 In claim 9 or 11, the pair of fingers is a nozzle moving unit with a surface treated with DLC (Diamond Like Carbon).

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