Apparatus for Supplying Electronic Components, and System for Supplying Electronic Components

Abstract

The present invention relates to an electronic component supply device and an electronic component supply system comprising: a feeder unit for supplying electronic components; an alignment unit for aligning electronic components supplied from the feeder unit so that they are arranged in parallel along a first row; and a picker unit for picking up a plurality of electronic components arranged in parallel along the first row at once in a pickup area of ​​the alignment unit and placing the picked electronic components on a tray.

Description

Technology Field

[0001] The present invention relates to an electronic component supply device and an electronic component supply system for supplying electronic components to subsequent equipment such as inspection equipment and mounting equipment. Background Technology

[0002] After undergoing the manufacturing process, electronic components undergo inspection and mounting processes before being applied to electronic devices. The inspection process checks whether the electronic component is functioning normally and whether its exterior is damaged or broken; this process can be performed by inspection equipment. The mounting process involves mounting the electronic component onto a substrate using Surface Mount Technology (SMT); this process can be performed by a mounter.

[0003] Recently, the development and application of Multi-Layer Ceramic Condensors (MLCCs) among electronic components have been actively underway. These MLCCs undergo an inspection process using stacking inspection equipment to check for stacking defects.

[0004] Here, the electronic component supply device according to the prior art supplied electronic components, such as multilayer ceramic capacitors, by picking them up and transporting them one by one. Consequently, the electronic component supply device according to the prior art has a problem of reduced productivity because the time required to supply electronic components, such as multilayer ceramic capacitors, increases, and this also delays the inspection process in which the stacking inspection equipment checks for stacking defects. The problem to be solved

[0005] The present invention is designed to solve the problems described above and aims to provide an electronic component supply device and an electronic component supply system capable of reducing the time required to supply electronic components such as multilayer ceramic capacitors. means of solving the problem

[0006] In order to solve the problem described above, the present invention may include the following configuration.

[0007] An electronic component supply device according to the present invention may include: a feeder unit for supplying electronic components; an alignment unit for aligning electronic components supplied from the feeder unit so that they are arranged in parallel along a first row; and a picker unit for picking up a plurality of electronic components arranged in parallel along the first row at once in a pickup area of ​​the alignment unit and placing the picked electronic components on a tray.

[0008] An electronic component supply system according to the present invention may include: a driving unit that moves a tray on which a plurality of electronic components are placed along a first axis direction; a main body to which the tray and the driving unit are coupled; and an electronic component supply device for placing electronic components on the tray. A plurality of the electronic component supply devices may be coupled to the main body. Among the electronic component supply devices, a first electronic component supply device and a second electronic component supply device may be arranged spaced apart from each other along a second axis direction perpendicular to the first axis direction. The driving unit may move the tray between the first electronic component supply device and the second electronic component supply device with respect to the second axis direction. Effects of the invention

[0009] According to the present invention, the following effects can be obtained.

[0010] The present invention is implemented to pick up multiple electronic components arranged side by side along a first row in a pickup area at once using a picker unit, and to place the picked electronic components onto a tray without a separate alignment operation. Accordingly, the present invention can reduce the time required to supply electronic components. Therefore, the electronic component supply device according to the present invention can prevent delays in subsequent processes by subsequent equipment, such as the stacking inspection equipment, and thus contribute to increasing productivity for electronic components after the subsequent process by the subsequent equipment has been completed. Brief explanation of the drawing

[0011] FIG. 1 is a schematic plan view of an electronic component supply device according to the present invention. FIG. 2 is a schematic perspective view of an alignment unit and a picker unit in an electronic component supply device according to the present invention. FIGS. 3 and 4 are schematic side cross-sectional views showing an alignment unit, a picker unit, and a cover unit in an electronic component supply device according to the present invention, based on line II of FIG. 2. FIG. 5 is a schematic cross-sectional view showing the feeder section, the connecting section, and the alignment section of an electronic component supply device according to the present invention along the line II-II of FIG. 2. FIG. 6 is a schematic plan view showing the arrangement relationship of a feeder section, a connecting section, an alignment section, and a sensing section in an electronic component supply device according to the present invention. FIG. 7 is a schematic block diagram of an electronic component supply device according to the present invention. FIG. 8 is a schematic plan view of an electronic component supply system according to the present invention. Specific details for implementing the invention

[0012] Hereinafter, an embodiment of an electronic component supply device according to the present invention will be described in detail with reference to the attached drawings. Meanwhile, the two parallel dashed lines in FIG. 2 are omitted lines. FIG. 6 is not a cross-sectional view, but hatching is indicated on the feeder part, the connecting part, and the alignment part, respectively, to distinguish them from the groove.

[0013] Referring to FIGS. 1 and 2, the electronic component supply device (1) according to the present invention supplies electronic components (200) (hereinafter shown in FIG. 2). The electronic components (200) may be multilayer ceramic capacitors (MLCC). The electronic component supply device (1) according to the present invention may supply electronic components (200) by positioning the tray (100) at a location where a subsequent device (not shown) can pick up the electronic components (200) after placing a plurality of electronic components (200) on the tray (100). The subsequent device may be an inspection device such as a stacking inspection device that inspects stacking defects of the electronic components (200), a mounter that mounts the electronic components (200) onto a substrate, etc. The above tray (100) can be implemented as an adhesive film to which electronic components (200) are adhered by adhesiveness.

[0014] The electronic component supply device (1) according to the present invention may include a feeder section (2), an alignment section (3), and a picker section (4).

[0015] Referring to FIGS. 1 and 2, the feeder unit (2) can supply electronic components (200). The feeder unit (2) can supply electronic components to the alignment unit (3). The feeder unit (2) can be installed on the main body (300). The main body (300) can be installed on the floor of a workplace or on a predetermined structure installed on the floor of a workplace. The feeder unit (2) can supply electronic components (200) using magnetic force, vibration, etc.

[0016] For example, the feeder unit (2) may include a bowl feeder (21) and a linear feeder (22).

[0017] The bowl feeder (21) can store electronic components (200). The bowl feeder (21) may include a storage groove in which electronic components (200) are stored, and a guide groove formed in a spiral shape. The bowl feeder (21) can sequentially supply the electronic components (200) stored in the storage groove to the linear feeder (22) using magnetic force, vibration, etc.

[0018] The linear feeder (22) can transport electronic components (200) supplied from the bowl feeder (21) toward the alignment unit (3). One side of the linear feeder (22) may be connected to the bowl feeder (21) and the other side may be connected to the alignment unit (3). The linear feeder (22) can supply electronic components (200) to the alignment unit (3) by transporting them using magnetic force, vibration, etc. The linear feeder (22) may also supply electronic components (200) to the alignment unit (3) using gas injection, etc.

[0019] Referring to FIGS. 1 and 2, the alignment unit (3) can align electronic components (200) supplied from the feeder unit (2) so that they are arranged in parallel along a first row (R1, shown in FIG. 1). The first row (R1) may be parallel to the row (Raw) that the electronic components (200) must form while being placed on the tray (100). Accordingly, the electronic component supply device (1) according to the present invention can use the alignment unit (3) to align the electronic components (200) to a state where they must be placed on the tray (100) during the process in which the electronic components (200) are supplied from the feeder unit (2) to the alignment unit (3). The alignment unit (3) may be formed to have a long length along the first row (R1).

[0020] The first row (R1) may be parallel to the first axis direction (X-axis direction). The alignment part (3) may be formed such that the length based on the first axis direction (X-axis direction) is longer than the length based on the second axis direction (Y-axis direction). The second axis direction (Y-axis direction) and the first axis direction (X-axis direction) may be axial directions arranged orthogonally to each other on a horizontal plane. The alignment part (3) and the feeder part (2) may be arranged spaced apart from each other along the first axis direction (X-axis direction). The alignment part (3) may be installed on the main body (300).

[0021] The alignment section (3) may include an alignment groove (30). A plurality of electronic components (200) may be inserted into the alignment groove (30). The alignment groove (30) may be formed along the first row (R1). Accordingly, the electronic components (200) may be aligned so as to be arranged side by side along the first row (R1) while being sequentially inserted into the alignment groove (30). The alignment groove (30) may be formed such that the length based on the first axis direction (X-axis direction) is longer than the length based on the second axis direction (Y-axis direction). Based on the second axis direction (Y-axis direction), the alignment groove (30) and the electronic components (200) may be formed with lengths that roughly match. The alignment groove (30) may be formed as a groove machined to a certain depth on the upper surface of the alignment section (3). The alignment groove (30) may be formed to open one side of the alignment section (3) toward the feeder section (2). Through the open side of the alignment section (3), electronic components (200) can be supplied from the feeder section (2) to the alignment groove (30). The other side of the alignment section (3) may be formed to be closed. In this case, the alignment groove (30) may be formed with a shorter length than the alignment section (3) relative to the first axis direction (X-axis direction).

[0022] Referring to FIGS. 1 to 4, the picker unit (4) can pick up a plurality of electronic components (200) arranged in parallel along the first column (R1) in the pick-up area (PA) of the alignment unit (3) at once, and place the picked electronic components (200) on the tray (100). Accordingly, the electronic components (200) can be placed on the tray (100) in a row parallel to the first column (R1). The pick-up area (PA) is an area where the electronic components (200) can be picked up by the picker unit (4). The pick-up area (PA) can be placed on the path where the picker unit (4) moves. A number of electronic components (200) that the picker unit (4) can pick up at once can be placed in the pick-up area (PA). Based on the first axis direction (X-axis direction), the pickup area (PA) may be formed to be shorter than the length of the alignment groove (30). In this case, the picker unit (4) can pick up some of the electronic components (200) inserted into the alignment groove (30) at once. Based on the first axis direction (X-axis direction), the pickup area (PA) and the alignment groove (30) may be formed to have the same length. In this case, the picker unit (4) can pick up all of the electronic components (200) inserted into the alignment groove (30) at once.

[0023] In this way, the electronic component supply device (1) according to the present invention can pick up electronic components (200) arranged in parallel along the first row (R1) in the pickup area (PA) at once using the picker unit (4), and can place the picked electronic components (200) on the tray (100). In this case, since the electronic components (200) arranged in parallel along the first row (R1) in the pickup area (PA) are aligned in a state where they must be placed on the tray (100), the picker unit (4) can place the electronic components (200) on the tray (100) without a separate alignment operation after picking up the electronic components (200). Accordingly, the electronic component supply device (1) according to the present invention can reduce the time required to supply electronic components (200). Accordingly, the electronic component supply device (1) according to the present invention can prevent the inspection process of inspection equipment such as the stacking inspection equipment from being delayed, and thus can contribute to increasing the productivity of the electronic component (200) that has been inspected by inspection equipment such as the stacking inspection equipment.

[0024] The above picker part (4) may include a picker body (41) and a suction hole (42).

[0025] The above picker body (41) can be moved between the pickup area (PA) and the tray (100). Through the movement of the above picker body (41), the picker unit (4) can pick up electronic components (200) at once from the pickup area (PA) and then place the picked electronic components (200) onto the tray (100). When the tray (100) is positioned at the loading position (110), a loading process can be performed in which electronic components (200) are placed onto the tray (100). The loading process can be performed by the picker unit (4). The tray (100) can be moved between the loading position (110) and the unloading position (120) by the driving unit (11). With the tray (100) positioned at the unloading position (120), an unloading process in which electronic components (200) are unloaded from the tray (100) can be performed. The unloading process can be performed by the subsequent equipment. The loading position (110) and the unloading position (120) can be positioned at locations spaced apart from each other. Accordingly, the electronic component supply device (1) according to the present invention can reduce the degree of interference between the loading process and the unloading process, thereby improving the stability of the loading process and the unloading process. Although FIG. 1 shows the loading position (110) and the unloading position (120) spaced apart from each other along the first axis direction (X-axis direction), it is not limited thereto, and the loading position (110) and the unloading position (120) may be spaced apart from each other along other directions.

[0026] The above picker body (41) can be coupled to a gantry (40). The above gantry (40) can be installed on the above body (300). The above picker body (41) can be moved in the second axis direction (Y-axis direction) and can be raised and lowered in the third axis direction (Z-axis direction) through the gantry (40). The above third axis direction (Z-axis direction) may be an axis direction perpendicular to the first axis direction (X-axis direction) and the above second axis direction (Y-axis direction), respectively.

[0027] For example, the gantry (40) may include a first frame (40a), a second frame (40b), a first driving mechanism (40c), and a second driving mechanism (40d). The first frame (40a) may be arranged parallel to the first axis direction (X-axis direction). The first frame (40a) may be coupled to the second frame (40b) so as to be movable along the second axis direction (Y-axis direction). The second frame (40b) may be arranged parallel to the second axis direction (Y-axis direction). The second frame (40b) may be installed on the main body (300). The first driving mechanism (40c) may move the first frame (40a) along the second axis direction (Y-axis direction). The first driving mechanism (40c) may be coupled to the second frame (40b) or the first frame (40a). The second driving mechanism (40d) may raise and lower the picker body (41) along the third axis direction (Z-axis direction). The second driving mechanism (40d) may be coupled to the first frame (40a) or the picker body (41). The picker body (41) may be coupled to the first frame (40a) so as to be raised and lowered along the third axis direction (Z-axis direction). Through the gantry (40), the picker body (41) may move along the second axis direction (Y-axis direction) and the third axis direction (Z-axis direction) to transfer electronic components (200) from the alignment unit (3) to the tray (100). In this case, movement in the first axis direction (X-axis direction) can be achieved by the drive unit (11) moving the tray (100). Each of the first drive mechanism (40c) and the second drive mechanism (40d) can be implemented using a cylinder type using a hydraulic cylinder or a pneumatic cylinder, a belt type using a motor and a pulley, a rack and pinion type using a rack gear and a pinion gear, a linear motor type using a permanent magnet and a coil, etc.

[0028] The suction hole (42) may be formed by penetrating the lower part of the picker body (41). When electronic components (200) are in contact with the picker body (41), the electronic components (200) can be adsorbed to the picker body (41) by generating suction force through the suction hole (42) by a suction part (not shown). The suction part may be coupled to the picker body (41). The suction part may be positioned at a location spaced apart from the picker body (41) and connected to the suction hole (42) through a hose, etc.

[0029] The adsorption hole (42) may be formed to extend along the first axial direction (X-axis direction). Accordingly, the adsorption hole (42) can adsorb electronic components (200) arranged in parallel along the first row (R1) in the pickup area (PA). Therefore, the electronic component supply device (1) according to the present invention can adsorb all electronic components (200) arranged in parallel along the first row (R1) in the pickup area (PA) using a single adsorption hole (42), thereby improving the ease of transferring electronic components (200) from the alignment unit (3) to the tray (100). Based on the first axial direction (X-axis direction), the adsorption hole (42) and the pickup area (PA) may be formed with the same length. Based on the first axial direction (X-axis direction), the adsorption hole (42) may be formed with a shorter length than the pickup area (PA). Based on the first axis direction (X-axis direction), the adsorption hole (42) may be formed with a length capable of adsorbing all electronic components (200) located in the pickup area (PA). The length of the adsorption hole (42) based on the first axis direction (X-axis direction) may be formed to be longer based on the second axis direction (Y-axis direction). In this case, the adsorption hole (42) may be formed in the shape of a slit having a long length in the first axis direction (X-axis direction).

[0030] The above picker part (4) may include a buffer member (43).

[0031] The above cushioning member (43) can be coupled to the lower surface of the picker body (41). The above cushioning member (43) can be formed of a material capable of elastic deformation. The above cushioning member (43) can absorb shocks, vibrations, etc. that occur during the process in which the picker part (4) picks up electronic components (200) located in the pickup area (PA) by utilizing elastic deformation. The above cushioning member (43) can absorb shocks, vibrations, etc. that occur during the process in which the picker part (4) places electronic components (200) on the tray (100) by utilizing elastic deformation. Accordingly, the electronic component supply device (1) according to the present invention can improve the stability and accuracy of the operation of transferring electronic components (200) from the alignment part (3) to the tray (100).

[0032] When the above buffer member (43) is provided, the suction hole (42) can be formed by penetrating the above buffer member (43). Accordingly, even if the above buffer member (43) is coupled to the lower surface of the above picker body (41), the above picker part (4) can adsorb and transport electronic components (200) through the above suction hole (42).

[0033] Referring to FIGS. 1 to 4, the electronic component supply device (1) according to the present invention may include a cover part (5) and a moving part (6).

[0034] The cover portion (5) can be moved between a covering position (CP, illustrated in FIG. 3) and an unlocking position (RP, illustrated in FIG. 4). When the cover portion (5) is positioned at the covering position (CP), the cover portion (5) is positioned above the alignment groove (30) to cover the upper side of the electronic component (200) inserted into the alignment groove (30). Accordingly, the cover portion (5) can prevent the electronic component (200) inserted into the alignment groove (30) from detaching from the alignment groove (30) at the covering position (CP). The unlocking position (RP) can be positioned spaced apart from the covering position (CP). When the cover portion (5) is positioned at the unlocking position (RP), the cover portion (5) can open the upper side of the electronic component (200) inserted into the alignment groove (30). Accordingly, when the cover part (5) is positioned at the release position (RP), the picker part (4) can pick up electronic components (200) inserted into the alignment groove (30).

[0035] The cover portion (5) may be positioned so as to be spaced upward from the electronic component (200) inserted into the alignment groove (30) at the covering position (CP). Accordingly, the cover portion (5) may be positioned so as not to interfere with the operation of supplying the electronic component from the feeder portion (2) to the alignment portion (3) while preventing the electronic component (200) from being dislodged from the alignment groove (30) at the covering position (CP). Based on the third axis direction (Z-axis direction), the distance at which the cover portion (5) is spaced upward from the electronic component (200) inserted into the alignment groove (30) at the covering position (CP) may be shorter than the thickness of the electronic component (200).

[0036] The cover portion (5) may be formed with a length capable of covering the upper side of all electronic components (200) arranged in parallel along the first row (R1) in the pickup area (PA) based on the first axis direction (X-axis direction) at the covering position (CP). The cover portion (5) may be formed with a length longer than the length of the electronic components (200) based on the second axis direction (Y-axis direction) at the covering position (CP). The cover portion (5) may be formed with a length based on the first axis direction (X-axis direction) that is longer than the length based on the second axis direction (Y-axis direction). The cover portion (5) may be formed in the shape of a rectangular plate overall.

[0037] The moving unit (6) can move the cover unit (5) between the covering position (CP) and the release position (RP). When an electronic component (200) is supplied from the feeder unit (2) to the alignment unit (3), the moving unit (6) can move the cover unit (5) to the covering position (CP). Accordingly, the cover unit (5) is positioned to cover the upper side of the electronic component (200) inserted into the alignment groove (30), thereby preventing the electronic component (200) from being dislodged from the alignment groove (30). When the picker unit (4) picks up the electronic components (200) arranged side by side along the first row (R1) in the pickup area (PA) at once, the moving unit (6) can move the cover unit (5) to the release position (RP). Accordingly, the cover portion (5) can be positioned so as not to interfere with the picker portion (4) picking up electronic components (200) from the alignment portion (3) by opening the upper side of the electronic component (200) inserted into the alignment groove (30). After the moving portion (6) moves the cover portion (5) to the release position (RP), the picker portion (4) can be lowered toward the alignment portion (3). After the picker portion (4) picks up the electronic component (200) from the alignment portion (3) and rises, the moving portion (6) can move the cover portion (5) to the cover position (CP). The moving portion (6) can be implemented using a cylinder type using a hydraulic cylinder or a pneumatic cylinder, a belt type using a motor and a pulley, a rack and pinion type using a rack gear and a pinion gear, a linear motor type using a permanent magnet and a coil, etc.

[0038] The above moving part (6) may be installed on the main body (300). The above cover part (5) may be coupled to the above moving part (6). The above moving part (6) may move the above cover part (5) along the above second axis direction (Y-axis direction). Since the above feeder part (2) and the above alignment part (3) are arranged spaced apart from each other along the above first axis direction (X-axis direction), the above cover part (5) is implemented to move between the above covering position (CP) and the above release position (RP) at a position that does not interfere with the operation of supplying electronic components (200) from the above feeder part (2) to the above alignment part (3).

[0039] Referring to FIGS. 1 to 7, the electronic component supply device (1) according to the present invention may include a connection part (7).

[0040] The connecting part (7) may be positioned between the feeder part (2) and the alignment part (3). Accordingly, electronic components (200) may be supplied from the feeder part (2) to the alignment part (3) via the connecting part (7). Based on the first axis direction (X-axis direction), the connecting part (7) may be positioned spaced apart from each of the feeder part (2) and the alignment part (3) between the feeder part (2) and the alignment part (3). The connecting part (7) may also be positioned to be in contact with each of the feeder part (2) and the alignment part (3). The connecting part (7) may be installed on the main body (300). The connecting part (7) and the alignment part (3) may be formed integrally.

[0041] The above connecting part (7) may include a connecting groove (70).

[0042] The above connecting groove (70) may be positioned on the same line as the alignment groove (30). The above connecting groove (70) may be positioned on the same line as the feeder groove (20) of the feeder section (2). Accordingly, the electronic component (200) can be supplied from the feeder section (2) through the connecting section (7) to the alignment section (3) by being sequentially inserted into the feeder groove (20), the connecting groove (70), and the alignment groove (30). The above connecting groove (70), the alignment groove (30), and the feeder groove (20) may be positioned on the same line. In this case, the above connecting groove (70) and the above feeder groove (20) may be positioned on an extension line extending the first row (R1) along the first axis direction (X-axis direction). The above connecting groove (70) may be formed as a groove machined to a certain depth on the upper surface of the connecting section (7). The feeder groove (20) may be formed as a groove machined to a certain depth on the upper surface of the feeder section (2). If the feeder section (2) includes the linear feeder (22), the feeder groove (20) may be implemented as a groove machined to a certain depth on the upper surface of the linear feeder (22).

[0043] A plurality of electronic components (200) may be inserted into the above connecting groove (70). The connecting groove (70) may be formed such that its length relative to the first axis direction (X-axis direction) is longer than its length relative to the second axis direction (Y-axis direction). Based on the second axis direction (Y-axis direction), the connecting groove (70) and the electronic components (200) may be formed to have approximately the same length. The connecting groove (70) may be formed to open both one side facing the feeder part (2) and the other side facing the alignment part (3). Based on the first axis direction (X-axis direction), the connecting groove (70) may be formed to have a shorter length than the alignment groove (30).

[0044] The electronic component supply device (1) according to the present invention may include an adsorption part (71).

[0045] The adsorption unit (71) can adsorb an electronic component (200) supported by the connection unit (7). The adsorption unit (71) can block the supply of the electronic component (200) to the alignment unit (3) by adsorbing the electronic component (200) supported by the connection unit (7). In this case, the electronic component (200) adsorbed by the adsorption unit (71) can function as a stopper for the electronic components (200) supplied to the feeder unit (2). While the picker unit (4) is picking up the electronic components (200) located in the pickup area (PA), the adsorption unit (71) can adsorb the electronic component (200) supported by the connection unit (7). Accordingly, the electronic component supply device (1) according to the present invention can block the supply of electronic components (200) toward the alignment unit (3) while the picker unit (4) picks up electronic components (200) located in the pickup area (PA). Therefore, the electronic component supply device (1) according to the present invention can further improve the stability of the operation in which the picker unit (4) picks up electronic components (200) located in the pickup area (PA).

[0046] The above-mentioned adsorption part (71) may be positioned on the lower side of the above-mentioned connection part (7). A suction hole (711) may be formed in the above-mentioned connection part (7). The suction hole (711) may be formed through the above-mentioned connection part (7) and connected to the above-mentioned connection groove (70). Accordingly, the suction force generated by the above-mentioned adsorption part (71) may be transmitted to the electronic component (200) inserted into the above-mentioned connection groove (70) through the suction hole (711). Thus, the above-mentioned adsorption part (71) can adsorb the electronic component (200) inserted into the above-mentioned connection groove (70) to the above-mentioned connection part (7). A plurality of the above-mentioned suction holes (711) may be formed in the above-mentioned connection part (7). The above-mentioned suction holes (711) may be positioned at locations spaced apart from each other along the above-mentioned first-axis direction (X-axis direction). The adsorption part (71) can adsorb a plurality of electronic components (200) inserted into the connection groove (70) to the connection part (7) through the suction holes (711). Although FIG. 5 shows that three suction holes (711) are formed in the connection part (7), it is not limited thereto, and two or four or more suction holes (711) may be formed in the connection part (7). The adsorption part (71) can be coupled to the lower surface of the connection part (7).

[0047] The electronic component supply device (1) according to the present invention may include a detachment prevention part (72).

[0048] The above anti-detachment member (72) may be positioned above the connection groove (70). Accordingly, the anti-detachment member (72) can prevent the electronic component (200) inserted into the connection groove (70) from detaching from the connection groove (70). The anti-detachment member (72) may be positioned so as to be spaced upward from the electronic component (200) inserted into the connection groove (70). Accordingly, the anti-detachment member (72) can be positioned so as not to interfere with the operation of supplying the electronic component from the feeder part (2) to the connection part (7) while preventing the electronic component (200) from detaching from the connection groove (70). Based on the above third axis direction (Z-axis direction), the distance at which the above anti-detachment part (72) is spaced upward from the electronic component (200) inserted into the connecting groove (70) may be shorter than the thickness of the electronic component (200).

[0049] The above anti-detachment part (72) may be formed with a length that covers the upper side of all electronic components (200) inserted into the connecting groove (70) based on the first axis direction (X-axis direction). The above anti-detachment part (72) may be formed with a length longer than the length of the electronic components (200) based on the second axis direction (Y-axis direction). The above anti-detachment part (72) may be formed with a length based on the first axis direction (X-axis direction) that is longer than the length based on the second axis direction (Y-axis direction). The above anti-detachment part (72) may be formed in the shape of a square plate overall.

[0050] Referring to FIGS. 1 to 7, the electronic component supply device (1) according to the present invention may include a sensing unit (8).

[0051] The above-mentioned sensing unit (8) can detect an electronic component (200) passing through the above-mentioned connecting unit (7). The above-mentioned sensing unit (8) can be coupled to the above-mentioned connecting unit (7). The above-mentioned sensing unit (8) can detect an electronic component (200) passing through the above-mentioned connecting unit (7) using light, magnetic force, etc. When the above-mentioned sensing unit (8) detects an electronic component (200) passing through the above-mentioned connecting unit (7) using light, the above-mentioned sensing unit (8) may include a light-emitting sensor (81) and a light-receiving sensor (82).

[0052] The light-emitting sensor (81) can emit light toward the connection part (7). In this case, a detection groove (80) may be formed in the connection part (7). The detection groove (80) may be formed in the connection part (7) so as to be connected to the connection groove (70). The light-emitting sensor (81) can emit light toward the connection groove (70) through the detection groove (80).

[0053] The light receiving sensor (82) may be positioned on the opposite side of the light emitting sensor (81) with respect to the connection part (7). The light receiving sensor (82) can detect an electronic component (200) passing through the connection part (7) by utilizing the amount of light received from the light emitting sensor (81). When the electronic component (200) is located in the part where the detection groove (80) is formed, the light emitted by the light emitting sensor (81) is not received by the light receiving sensor (82). When the electronic component (200) is not located in the part where the detection groove (80) is formed, the light emitted by the light emitting sensor (81) can be received by the light receiving sensor (82). In this way, the detection unit (8) can detect electronic components (200) passing through the connection unit (7) by utilizing the amount of light received by the light receiving sensor (82), and thereby can determine the number of electronic components (200) supplied to the alignment unit (3) via the connection unit (7). The light emitting sensor (81) and the light receiving sensor (82) may be positioned at a distance from each other along the second axis direction (Y-axis direction). Based on the second axis direction (Y-axis direction), the connection unit (7) may be positioned between the light emitting sensor (81) and the light receiving sensor (82).

[0054] Although not shown, the light receiving sensor (82) and the light emitting sensor (81) may be placed on the same side with respect to the connection part (7). In this case, when an electronic component (200) is located in the part where the detection groove (80) is formed, the light emitted by the light emitting sensor (81) and the light reflected by the electronic component (200) can be received by the light receiving sensor (82). When an electronic component (200) is not located in the part where the detection groove (80) is formed, the light emitted by the light emitting sensor (81) is not received by the light receiving sensor (82). In this way, the detection part (8) can detect the electronic component (200) passing through the connection part (7) using the amount of light received by the light receiving sensor (82), and through this, the number of electronic components (200) supplied to the alignment part (3) via the connection part (7) can be confirmed.

[0055] The above detection unit (8) can check whether electronic components (200) have been supplied to the pickup area (PA) in a preset standard number. The standard number is the number of electronic components (200) that the picker unit (4) can pick up at once, and can be preset by an operator.

[0056] When the detection unit (8) confirms that the electronic components (200) have been supplied to the pickup area (PA) in the reference number, the moving unit (6) can move the cover unit (5) to the release position (RP). Accordingly, the picking unit (4) can perform the task of picking up the electronic components (200) located in the pickup area (PA). When the picking unit (4) picks up the electronic components (200) located in the pickup area (PA), the moving unit (6) can move the cover unit (5) to the cover position (CP). When the detection unit (8) confirms that the electronic components (200) have been supplied to the pickup area (PA) in the reference number, it can generate a detection signal and provide it to the moving unit (6). The detection unit (8) can provide the detection signal to the moving unit (6) via wired communication, wireless communication, etc.

[0057] When the detection unit (8) confirms that the electronic components (200) are supplied to the pickup area (PA) in the reference number, the adsorption unit (71) can adsorb the electronic components (200) supported by the connection unit (7). Accordingly, the adsorption unit (71) can improve the stability and accuracy of the operation in which the picker unit (4) picks up the electronic components (200) located in the pickup area (PA) by blocking the electronic components (200) supported by the connection unit (7) from moving toward the alignment unit (3). When the picker unit (4) picks up the electronic components (200) located in the pickup area (PA), the adsorption unit (71) can release the adsorption on the electronic components (200) supported by the connection unit (7). Accordingly, the adsorption unit (71) can allow the electronic components (200) to be supplied to the alignment unit (3). When the detection unit (8) confirms that electronic components (200) have been supplied to the pickup area (PA) in the reference number, it can provide the detection signal to the adsorption unit (71). The detection unit (8) can provide the detection signal to the adsorption unit (71) via wired communication, wireless communication, etc. The detection unit (8) can provide the detection signal to each of the adsorption unit (71), the moving unit (6), and the picker unit (4).

[0058] The above detection unit (8) may also check whether an electronic component (200) located at a detection position (8a, illustrated in FIG. 6) is detected at the detection position (8a) for a predetermined reference time or longer. The reference time is the time taken until the electronic component (200) located at the detection position (8a) is supplied to the alignment unit (3), and can be pre-set by an operator. The detection position (8a) may be a location where any one of the electronic components (200) located in the connection unit (7) is located. In FIG. 6, the middle of the connection unit (7) is shown as the detection position (8a) based on the first axis direction (Y-axis direction), but it is not limited thereto, and the detection position (8a) may be a location spaced apart from the middle of the connection unit (7) toward the alignment unit (3) or a location spaced apart from the middle of the connection unit (7) toward the feeder unit (2). The above detection location (8a) may be a location where a plurality of electronic components (200) located in the connection part (7) are located. In this case, the detection part (8) can check whether all of the electronic components (200) located in the detection location (8a) are detected at the detection location (8a) for a period of time longer than the reference time.

[0059] When the detection unit (8) confirms that the electronic component (200) located at the detection position (8a) has been detected at the detection position (8a) for a period of time longer than the reference time, it can confirm that the electronic components (200) have been supplied to the pickup area (PA) in the reference number. This is examined in detail as follows.

[0060] First, if the electronic components (200) supplied to the pickup area (PA) are less than the reference number, the electronic components (200) located at the connection part (7) are supplied to the alignment part (3), so the electronic components (200) located at the detection position (8a) are moved toward the alignment part (3). Accordingly, the detection part (8) detects the electronic components (200) located at the detection position (8a) for less than the reference time, and subsequently detects the electronic components (200) that are moved to the detection position (8a). Therefore, if the electronic components (200) located at the detection position (8a) are detected for less than the reference time, the detection part (8) can confirm that the electronic components (200) supplied to the pickup area (PA) are less than the reference number.

[0061] Next, if the electronic components (200) are supplied to the pickup area (PA) in the reference number, the electronic components (200) located at the connection part (7) cannot be supplied to the alignment part (3), and thus the electronic components (200) located at the detection position (8a) do not move toward the alignment part (3). Accordingly, the detection part (8) detects the electronic components (200) located at the detection position (8a) for longer than the reference time. Therefore, when the electronic components (200) located at the detection position (8a) are detected for longer than the reference time, the detection part (8) can confirm that the electronic components (200) are supplied to the pickup area (PA) in the reference number.

[0062] When the detection unit (8) confirms that the electronic component (200) located at the detection position (8a) has been detected at the detection position (8a) for a period of time longer than the reference time, the moving unit (6) can move the cover unit (5) to the release position (RP). Accordingly, the picking unit (4) can perform the task of picking up the electronic components (200) located in the pickup area (PA). When the picking unit (4) picks up the electronic components (200) located in the pickup area (PA), the moving unit (6) can move the cover unit (5) to the covering position (CP). When the detection unit (8) confirms that the electronic component (200) located at the detection position (8a) has been detected at the detection position (8a) for a period of time longer than the reference time, it can generate a detection signal and provide it to the moving unit (6). The above detection unit (8) can provide the detection signal to the moving unit (6) through wired communication, wireless communication, etc.

[0063] When it is confirmed that the electronic component (200) located at the detection position (8a) has been detected at the detection position (8a) for a period of time longer than the reference time, the adsorption unit (71) can adsorb the electronic component (200) supported by the connection unit (7). Accordingly, the adsorption unit (71) can improve the stability and accuracy of the operation in which the picker unit (4) picks up the electronic component (200) located in the pickup area (PA) by blocking the electronic component (200) supported by the connection unit (7) from moving toward the alignment unit (3). When the picker unit (4) picks up the electronic components (200) located in the pickup area (PA), the adsorption unit (71) can release the adsorption on the electronic component (200) supported by the connection unit (7). Accordingly, the adsorption unit (71) can allow the electronic component (200) to be supplied to the alignment unit (3). The above detection unit (8) can provide a detection signal to the adsorption unit (71) when it confirms that the electronic component (200) located at the detection position (8a) has been detected at the detection position (8a) for a period of time longer than the reference time. The above detection unit (8) can provide the detection signal to the adsorption unit (71) via wired communication, wireless communication, etc. The above detection unit (8) may also provide the detection signal to each of the adsorption unit (71), the moving unit (6), and the picker unit (4).

[0064] Meanwhile, if the detection unit (8) fails to detect the electronic component (200) at the detection position (8a) for more than the reference time, it can confirm that a problem has occurred in the supply of the electronic component (200). In this case, the detection unit (8) can generate an abnormal signal and provide it to at least one of the feeder unit (2), the alignment unit (3), the adsorption unit (71), the moving unit (6), and the picker unit (4). The detection unit (8) can provide the abnormal signal via wired communication, wireless communication, etc. The unit among the feeder unit (2), the alignment unit (3), the adsorption unit (71), the moving unit (6), and the picker unit (4) that receives the abnormal signal may stop operating. The detection unit (8) may also provide the abnormal signal to an alarm unit (not shown). When the alarm unit receives the abnormal signal, it can notify that a problem has occurred in the supply of the electronic component (200) by outputting at least one of video and sound. The above alarm unit may include at least one of a display device and a speaker.

[0065] The electronic component supply device (1) according to the present invention may include a control unit (9).

[0066] The control unit (9) receives the detection signal from the detection unit (8) and can use it to control the picker unit (4), the moving unit (6), and the adsorption unit (71). When the detection unit (8) provides the detection signal by confirming that electronic components (200) are supplied to the pickup area (PA) in the reference number or that an electronic component (200) located at the detection position (8a) has been detected at the detection position (8a) for more than the reference time, the control unit (9) can control the adsorption unit (71) so that the adsorption unit (71) adsorbs the electronic component (200) supported by the connection unit (7), control the moving unit (6) so that the moving unit (6) moves the cover unit (5) to the release position (RP), and control the picker unit (4) so ​​that the picker unit (4) picks up the electronic components (200) located in the pickup area (PA). When the picker unit (4) picks up the electronic components (200) and rises, the control unit (9) can control the adsorption unit (71) to release the adsorption of the electronic components (200) supported by the connection unit (7), and can control the moving unit (6) to move the cover unit (5) to the covering position (CP). The control unit (9) can receive the detection signal from the detection unit (8) via wired communication, wireless communication, etc., and control the picker unit (4), the moving unit (6), and the adsorption unit (71).

[0067] Meanwhile, if the detection unit (8) fails to detect the electronic component (200) at the detection position (8a) for longer than the reference time, it may generate the abnormal signal and provide it to the control unit (9). When the control unit (9) receives the abnormal signal, it may stop the overall operation of the electronic component supply device (1) according to the present invention. When the control unit (9) receives the abnormal signal, it may also control the alarm unit so that the alarm unit outputs at least one of video and sound.

[0068] Hereinafter, an embodiment of an electronic component supply system according to the present invention will be described in detail with reference to the attached drawings.

[0069] Referring to FIGS. 1 to 8, the electronic component supply system (10) according to the present invention may include the driving unit (11), the main body (300), and the electronic component supply device (1). The electronic component supply device (1) may be implemented as the electronic component supply device (1) according to the present invention described above.

[0070] The above drive unit (11) can move the tray (100) along the first axis direction (X-axis direction). The above drive unit (11) can be coupled to the main body (300). The above drive unit (11) can be implemented as a cylinder type using a hydraulic cylinder or a pneumatic cylinder, a belt type using a motor and a pulley, a rack and pinion type using a rack gear and a pinion gear, a linear motor type using a permanent magnet and a coil, etc.

[0071] The main body (300) can support the tray (100), the driving unit (11), and the electronic component supply device (1). The tray (100), the driving unit (11), and the electronic component supply device (1) can be coupled to the main body (300). A plurality of the electronic component supply devices (1) can be coupled to the main body (300).

[0072] Among the electronic component supply devices (1) above, the first electronic component supply device (1a) and the second electronic component supply device (1b) may be spaced apart from each other along the second axis direction (Y-axis direction). In this case, the driving unit (11) may move the tray (100) between the first electronic component supply device (1a) and the second electronic component supply device (1b) based on the second axis direction (Y-axis direction). Accordingly, the electronic component supply system (10) according to the present invention may be implemented such that each of the first electronic component supply device (1a) and the second electronic component supply device (1b) picks up a plurality of electronic components (200) at once and places them on the tray (100). Accordingly, the electronic component supply system (10) according to the present invention can further reduce the time required to supply the electronic component (200), thereby preventing delays in the subsequent process of the subsequent equipment and contributing to further increasing productivity for the electronic component (200) for which the subsequent process is completed. In addition, since the electronic component supply system (10) according to the present invention allows the first electronic component supply device (1a) and the second electronic component supply device (1b) to share the tray (100), it can not only reduce construction costs but also contribute to improving the space utilization of the workplace through a reduction in overall size.

[0073] The first electronic component supply device (1a) and the second electronic component supply device (1b) may be arranged symmetrically with respect to a first symmetry line (410) parallel to the first axis direction (X-axis direction). Accordingly, the electronic component supply system (10) according to the present invention can implement the distance traveled by the first picker part (4a) of the first electronic component supply device (1a) and the distance traveled by the second picker part (4b) of the second electronic component supply device (1b) to place electronic components (200) on the tray (100) to roughly match, thereby improving the efficiency of the operation of placing electronic components (200) on the tray (100). The first symmetry line (410) may be positioned at a distance equal to that from each of the first electronic component supply device (1a) and the second electronic component supply device (1b) with respect to the second axis direction (Y-axis direction).

[0074] Among the electronic component supply devices (1) above, the third electronic component supply device (1c) may be arranged spaced apart from the first electronic component supply device (1a) along the first axis direction (X-axis direction). The third electronic component supply device (1c) and the first electronic component supply device (1a) may be arranged symmetrically with respect to a second symmetry line (420) parallel to the second axis direction (Y-axis direction). Accordingly, the electronic component supply system (10) according to the present invention can implement the distance traveled by the first picker part (4a) of the first electronic component supply device (1a) and the distance traveled by the third picker part (4c) of the third electronic component supply device (1c) to place electronic components (200) on the tray (100) to roughly match, thereby improving the efficiency of the operation of placing electronic components (200) on the tray (100). The second symmetry line (420) may be positioned at a distance equal to that from each of the first electronic component supply device (1a) and the third electronic component supply device (1c) with respect to the first axis direction (X-axis direction). Meanwhile, in the electronic component supply system (10) according to the present invention, the tray (100) may be formed with a size such that it can be positioned along both the path where the third picker part (4c) moves along the second axis direction (Y-axis direction) and the path where the first picker part (4a) moves along the second axis direction (Y-axis direction).

[0075] Among the electronic component supply devices (1) above, the fourth electronic component supply device (1d) may be arranged spaced apart from the second electronic component supply device (1b) along the first axis direction (X-axis direction). The fourth electronic component supply device (1d) and the second electronic component supply device (1b) may be arranged symmetrically with respect to the second symmetry line (420). Accordingly, the electronic component supply system (10) according to the present invention can implement the distance traveled by the second picker part (4b) of the second electronic component supply device (1b) and the distance traveled by the fourth picker part (4d) of the fourth electronic component supply device (1d) to place electronic components (200) on the tray (100) to roughly match, thereby improving the efficiency of the operation of placing electronic components (200) on the tray (100). Meanwhile, in the electronic component supply system (10) according to the present invention, the tray (100) may be formed with a size such that it can be positioned along both the path where the fourth picker part (4d) moves along the second axis direction (Y-axis direction) and the path where the second picker part (4b) moves along the second axis direction (Y-axis direction).

[0076] The third electronic component supply device (1c) and the fourth electronic component supply device (1d) may be arranged symmetrically with respect to the first symmetry line (410). Accordingly, the electronic component supply system (10) according to the present invention can implement the distance traveled by the third picker part (4c) of the third electronic component supply device (1c) and the distance traveled by the fourth picker part (4d) of the fourth electronic component supply device (1d) to place electronic components (200) on the tray (100) to roughly match, thereby improving the efficiency of the operation of placing electronic components (200) on the tray (100). The first symmetry line (410) may be positioned at a location spaced equally from each of the third electronic component supply device (1c) and the fourth electronic component supply device (1d) with respect to the second axis direction (Y-axis direction).

[0077] It will be obvious to those skilled in the art that the invention described above is not limited to the aforementioned embodiments and attached drawings, and that various substitutions, modifications, and changes are possible within the scope of the technical concept of the invention. Explanation of the symbols

[0078] 1 : Electronic component supply device 2 : Feeder Booth 20 : Feeder Home 21 : Bowl feeder 22 : Linear feeder 3 : Alignment section 30 : Alignment groove 4 : Picker unit 41 : Picker main body 42 : Adsorption hole 43 : Buffer member 5 : Cover part 6 : Moving part 7 : Connection part 70 : Connection groove 71 : Adsorption part 711 : Suction port 72 : Detachment prevention unit 8 : Detection unit 8a: Detection position 80: Detection groove 81: Light emitting sensor 82: Light receiving sensor 9 : Control unit 100 : Tray 200 : Electronic components 300 : Main body 10: Electronic component supply system 11: Driving unit

Claims

Claim 1 An electronic component supply device comprising: a feeder unit for supplying electronic components; an alignment unit for aligning electronic components supplied from the feeder unit so as to be arranged in parallel along a first row; and a picker unit for picking up a plurality of electronic components arranged in parallel along the first row in a pickup area of ​​the alignment unit at once and placing the picked electronic components on a tray, wherein the picker unit comprises a picker body that moves between the pickup area and the tray, and a single suction hole formed by penetrating the lower part of the picker body, wherein the single suction hole is formed to extend along a first axis direction parallel to the first row so as to suction electronic components arranged in parallel along the first row in the pickup area. Claim 2 delete Claim 3 An electronic component supply device according to claim 1, wherein the picker part includes a cushioning member formed of a material capable of elastic deformation, the cushioning member is coupled to the lower surface of the picker body, and the single suction hole is formed by penetrating the cushioning member. Claim 4 An electronic component supply device comprising: a feeder unit for supplying electronic components; an alignment unit for aligning electronic components supplied from the feeder unit so as to be arranged in a first row; a picker unit for picking up a plurality of electronic components arranged in a first row in a pickup area of ​​the alignment unit at once and placing the picked electronic components on a tray; a cover unit that moves between a cover position located above an alignment groove formed in the alignment unit and a release position spaced apart from the cover position; and a moving unit that moves the cover unit between the cover position and the release position, wherein when electronic components are supplied from the feeder unit to the alignment unit, the moving unit moves the cover unit to the cover position so as to cover the upper side of the electronic components inserted into the alignment groove, and when the picker unit picks up electronic components arranged in a first row in the pickup area at once, the cover unit moves the cover unit to the release position so as to open the upper side of the electronic components inserted into the alignment groove. Claim 5 An electronic component supply device according to claim 4, wherein the cover portion is positioned so as to be spaced upward from the electronic component inserted into the alignment groove at the covering position. Claim 6 An electronic component supply device according to claim 1, characterized by comprising: a connecting portion disposed between the feeder portion and the alignment portion; and a sensing portion for detecting an electronic component passing through the connecting portion. Claim 7 An electronic component supply device comprising: a feeder unit for supplying electronic components; an alignment unit for aligning electronic components supplied from the feeder unit so that they are arranged in parallel along a first row; a picker unit for picking up a plurality of electronic components arranged in parallel along the first row in a pickup area of ​​the alignment unit at once and placing the picked electronic components on a tray; a connecting unit disposed between the feeder unit and the alignment unit; a sensing unit for detecting electronic components passing through the connecting unit; a cover unit that moves between a covering position located above an alignment groove formed in the alignment unit and a release position spaced apart from the covering position; and a moving unit that moves the cover unit between the covering position and the release position, wherein the sensing unit checks whether electronic components have been supplied to the pickup area in a predetermined reference number, and the moving unit moves the cover unit to the release position when it is confirmed by the sensing unit that electronic components have been supplied to the pickup area in the reference number. Claim 8 An electronic component supply device comprising: a feeder unit for supplying electronic components; an alignment unit for aligning electronic components supplied from the feeder unit so that they are arranged in parallel along a first row; a picker unit for picking up a plurality of electronic components arranged in parallel along the first row in a pickup area of ​​the alignment unit at once and placing the picked electronic components on a tray; a connecting unit disposed between the feeder unit and the alignment unit; a sensing unit for detecting electronic components passing through the connecting unit; a cover unit that moves between a covering position located above an alignment groove formed in the alignment unit and a release position spaced apart from the covering position; and a moving unit that moves the cover unit between the covering position and the release position; wherein the sensing unit checks whether an electronic component located at the detection position is detected at the detection position for a predetermined reference time or longer, and the moving unit moves the cover unit to the release position when it is confirmed by the sensing unit that the electronic component located at the detection position is detected at the detection position for a reference time or longer. Claim 9 An electronic component supply device according to claim 1, comprising: a connecting portion disposed between the feeder portion and the alignment portion; and an adsorption portion for adsorbing an electronic component supported by the connecting portion, wherein the adsorption portion adsorbs the electronic component supported by the connecting portion and blocks the supply of the electronic component to the alignment portion. Claim 10 An electronic component supply device according to claim 9, comprising a sensing unit for detecting electronic components passing through the connection part, wherein the sensing unit checks whether electronic components have been supplied to the pickup area in a preset reference number, and the adsorption unit adsorbs the electronic components supported by the connection part when it is confirmed by the sensing unit that electronic components have been supplied to the pickup area in the reference number. Claim 11 An electronic component supply device according to claim 9, comprising a sensing unit for detecting an electronic component passing through the connection part, wherein the sensing unit checks whether an electronic component located at the detection position is detected at the detection position for a period of time longer than a preset reference time, and the adsorption unit adsorbs the electronic component supported by the connection part when it is confirmed by the sensing unit that the electronic component located at the detection position is detected at the detection position for a period of time longer than the reference time. Claim 12 An electronic component supply device according to claim 1, comprising: a connecting portion disposed between the feeder portion and the alignment portion; and an anti-detachment portion located above a connecting groove formed in the connecting portion, wherein the anti-detachment portion is disposed spaced upward from an electronic component inserted into the connecting groove. Claim 13 An electronic component supply system comprising: a driving unit for moving a tray on which a plurality of electronic components are placed along a first axis direction; a main body to which the tray and the driving unit are coupled; and an electronic component supply device according to any one of claims 1 or 3 to 12 for placing electronic components on the tray, wherein a plurality of the electronic component supply devices are coupled to the main body, and among the electronic component supply devices, a first electronic component supply device and a second electronic component supply device are arranged spaced apart from each other along a second axis direction perpendicular to the first axis direction, and the driving unit moves the tray between the first electronic component supply device and the second electronic component supply device based on the second axis direction. Claim 14 An electronic component supply system according to claim 13, wherein the first electronic component supply device and the second electronic component supply device are arranged symmetrically with respect to a first symmetry line parallel to the first axis direction. Claim 15 An electronic component supply system according to claim 13, wherein among the electronic component supply devices, a third electronic component supply device is arranged spaced apart from the first electronic component supply device along the first axis direction, and the first electronic component supply device and the third electronic component supply device are arranged symmetrically with respect to a second symmetry line parallel to the second axis direction, and among the electronic component supply devices, a fourth electronic component supply device is arranged spaced apart from the second electronic component supply device along the first axis direction, and the fourth electronic component supply device and the second electronic component supply device are arranged symmetrically with respect to the second symmetry line.

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