Electronic device including antenna

Abstract

According to one embodiment of the present document, an electronic device comprises a housing and an antenna structure including a printed circuit board located within the housing and comprising a first surface and a second surface opposite to the first surface, and a conductive pattern located inside the printed circuit board, wherein the printed circuit board comprises a first conductive layer including a first antenna element and a second antenna element located closer to the first surface than the second surface and not overlapping when viewed from above the first surface, a ground plane, a second conductive layer located closer to the second surface than the first conductive layer, and a dielectric located between the first conductive layer and the second conductive layer, wherein the conductive pattern is electrically connected to the ground plane through one or more conductive vias included in the printed circuit board, is located between the first conductive layer and the second conductive layer, is physically separated from the first conductive layer and the second conductive layer, and is viewed from above the first surface At that time, it may overlap at least partially with the first antenna element and include an opening. Various other embodiments may be possible.

Description

Technology Field

[0001] Various embodiments of this document relate to electronic devices including antennas. Background Technology

[0003] The electronic device may include multiple antennas. The problem to be solved

[0005] Electromagnetic influence between multiple antennas can degrade antenna radiation performance. For example, if it is difficult to ensure separation distances between multiple antennas due to spatial constraints, interference may occur between the antennas.

[0006] Various embodiments of this document may provide an electronic device including an antenna for improving isolation of the antenna.

[0007] The technical problems to be solved in this document are not limited to those mentioned above, and other unmentioned technical problems will be understood by those skilled in the art to which this invention belongs from the description below. means of solving the problem

[0009] According to one embodiment of the present document, an electronic device comprises a housing and an antenna structure including a printed circuit board located within the housing and comprising a first surface and a second surface opposite to the first surface, and a conductive pattern located inside the printed circuit board, wherein the printed circuit board comprises a first conductive layer including a first antenna element and a second antenna element located closer to the first surface than the second surface and not overlapping when viewed from above the first surface, a ground plane, a second conductive layer located closer to the second surface than the first conductive layer, and a dielectric located between the first conductive layer and the second conductive layer, wherein the conductive pattern is electrically connected to the ground plane through one or more conductive vias included in the printed circuit board, is located between the first conductive layer and the second conductive layer, is physically separated from the first conductive layer and the second conductive layer, and is viewed from above the first surface At that time, it may overlap at least partially with the first antenna element and include an opening.

[0010] According to one embodiment of the present document, an antenna structure comprises a printed circuit board including a first surface and a second surface opposite to the first surface, and a conductive pattern located inside the printed circuit board, wherein the printed circuit board comprises a first conductive layer including a first antenna element and a second antenna element located closer to the first surface than the second surface and not overlapping when viewed from above the first surface, a ground plane, a second conductive layer located closer to the second surface than the first conductive layer, and a dielectric located between the first conductive layer and the second conductive layer, and wherein the conductive pattern is electrically connected to the ground plane through one or more conductive vias included in the printed circuit board, is located between the first conductive layer and the second conductive layer, is physically separated from the first conductive layer and the second conductive layer, and when viewed from above the first surface, at least a portion of the first antenna element It can be nested and include openings. Effects of the invention

[0012] An electronic device including an antenna according to various embodiments of this document can improve the isolation of the antenna and reduce the degradation of antenna radiation performance.

[0013] In addition, other effects that can be obtained or predicted by the various embodiments of this document may be disclosed directly or implicitly in the detailed description of the embodiments of this document. Brief explanation of the drawing

[0015] FIG. 1 is a block diagram of an electronic device in a network environment in one embodiment. FIG. 2 is a perspective view of the front of an electronic device according to one embodiment. FIG. 3 is a perspective view of the rear of the electronic device of FIG. 2 according to one embodiment. FIGS. 4 and 5 are exploded views of the electronic device of FIG. 2 according to one embodiment. FIG. 6 schematically illustrates the cross-sectional structure of the yz plane relating to a part of the electronic device shown in FIG. 3 in one embodiment. FIG. 7 is an xy plan view relating to an antenna structure in one embodiment. FIG. 8 shows, for example, an enlarged view of the portion indicated by reference numeral 'A' in FIG. 7. FIG. 9 illustrates components included in a printed circuit board of a second antenna structure in one embodiment. FIG. 10 illustrates the cross-sectional structure of the xz plane for the CC' line in FIG. 8 in one embodiment. FIG. 11 shows the electric field in the xy planar view of the antenna structure regarding the effect of the second antenna on the first antenna when a radiated current is provided with a second feed pattern in an antenna structure of a comparative example that does not include a conductive pattern, for example. FIG. 12 shows the electric field in a cross-sectional view of the yz plane of an antenna structure regarding the effect of the second antenna on the first antenna when a radiated current is provided in a second feeding pattern in an antenna structure of a comparative example, for example. FIG. 13 shows the magnetic field in a cross-sectional view of the yz plane of the antenna structure regarding the effect of the second antenna on the first antenna when a radiated current is provided in a second feeding pattern in the antenna structure of a comparative example, for example. FIG. 14 shows the flow of surface current in the xy plan view of the antenna structure regarding the effect of the second antenna on the first antenna when a radiated current is provided in a second feeding pattern in the antenna structure of a comparative example, for example. FIG. 15 shows the electric field in the xy planar view of the antenna structure regarding the effect of the second antenna on the first antenna when a radiated current is provided in a second feeding pattern in the antenna structure according to one embodiment. FIG. 16 shows the electric field in a cross-sectional view of the xz plane of an antenna structure regarding the effect of the second antenna on the first antenna when a radiated current is provided in a second feeding pattern in an antenna structure according to one embodiment. FIG. 17 shows the flow of surface current in the xy planar view of an antenna structure regarding the influence of the second antenna on the first antenna when a radiated current is provided in a second feeding pattern in an antenna structure according to one embodiment. FIG. 18 shows the flow of surface current in the xy planar view of an antenna structure when a radiated current is provided in a second feeding pattern in an antenna structure according to one embodiment. FIG. 19 shows the flow of surface current in a part of an antenna structure when a radiated current is provided in a second feeding pattern in the antenna structure in another embodiment. FIG. 20 shows the flow of surface current in a part of an antenna structure when a radiated current is provided in a second feeding pattern in the antenna structure in another embodiment. FIG. 21 is a graph showing, for example, radiation characteristics of a first antenna when fed to a second antenna in an antenna structure according to one embodiment, and radiation characteristics of a first antenna when fed to a second antenna in an antenna structure according to a comparative example. FIGS. 22 and 23 show radiation patterns relating to the antenna structure of FIG. 7 according to one embodiment. FIGS. 24 and 25 show radiation patterns for the antenna structure of FIG. 11 according to a comparative example. FIG. 26 is an xy plan view of a portion of a printed circuit board included in an antenna structure according to another embodiment. FIG. 27 is an xy plan view of a second conductive layer included in a printed circuit board in relation to an embodiment of FIG. 26. FIG. 28 is an xy plan view relating to a second conductive layer included in a printed circuit board in relation to the embodiment of FIG. 26 in another embodiment. FIG. 29 is an xy plan view relating to a second conductive layer included in a printed circuit board in relation to the embodiment of FIG. 26 in another embodiment. Specific details for implementing the invention

[0016] Hereinafter, various embodiments of this document are described with reference to the attached drawings.

[0017] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) in one embodiment.

[0018] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0019] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0020] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0021] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0022] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0023] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0024] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0025] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0026] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0027] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0028] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0029] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0030] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0031] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0032] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0033] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0035] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0036] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0037] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0038] At least some of the above components are connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., commands or data) with each other.

[0039] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0040] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0041] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., via wire), wirelessly, or through a third component.

[0042] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0043] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0044] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0045] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding components among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0046] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order).

[0047] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0048] FIG. 2 is a front perspective view of an electronic device (200) according to one embodiment. FIG. 3 is a rear perspective view of the electronic device (200) of FIG. 2 according to one embodiment.

[0049] Referring to FIGS. 2 and 3, in one embodiment, an electronic device (200) (e.g., electronic device (101) of FIG. 1) may include a housing (300) that forms the exterior of the electronic device (200). The housing (300) may form, for example, a front (300A) of the electronic device (200), a rear (300B) of the electronic device (200), and a side (300C) of the electronic device (200) that surrounds the space between the front (300A) and the rear (300B). In some embodiments, the housing (300) may refer to a structure (e.g., a housing structure) that forms at least some of the front (300A), the rear (300B), and the side (300C). In various embodiments of this document, for convenience of explanation, the direction in which the display (201) included in the electronic device (200) is visually exposed is defined as the front (300A) of the electronic device (200), and the opposite direction is defined as the rear (300B) of the electronic device (200).

[0050] According to one embodiment, the housing (300) may include a front plate (310), a rear plate (320), and / or a bezel structure (330). The front (300A) of the electronic device (200) may be formed at least partially by the front plate (310). The front plate (310) may be substantially transparent and may include, for example, a glass plate or a polymer plate including various coating layers. The rear (300B) of the electronic device (200) may be formed at least partially by the rear plate (320). In one embodiment, the rear plate (320) may include a first rear plate (321) forming part of the rear (300B) and a second rear plate (322) forming another part of the rear (300B). The first rear plate (321) and the second rear plate (322) may be substantially opaque. The first rear plate (321) and / or the second rear plate (322) may be formed, for example, by coated or colored glass, ceramic, polymer, metal, or a combination of at least two of the materials. As another example, the first rear plate (321) and / or the second rear plate (322) may comprise aluminum, aluminum alloy, magnesium, magnesium alloy, or an alloy containing iron (e.g., stainless steel). The bezel structure (330) may surround at least part of the space between the front plate (310) and the rear plate (320). The side (300C) of the electronic device (200) may be formed at least part of the bezel structure (330). In some embodiments, the bezel structure (330) may be referred to as a 'side bezel structure' or 'side member' as an element that substantially forms the side (300C) of the electronic device (200). The bezel structure (330) may include, for example, metal and / or polymer.

[0051] According to one embodiment, the front plate (310) may include a first curved portion (3001) and a second curved portion (3002) that are curved from the front (300A) toward the rear (300B) and extend seamlessly. The first curved portion (3001) and the second curved portion (3002) may be formed adjacent to both edges of the front plate (310) located on opposite sides. The first curved portion (3001) and the second curved portion (3002) may be arranged symmetrically, for example, with a flat portion (not shown) of the front plate (310) in between.

[0052] According to one embodiment, the first rear plate (321) may include a third curved portion (3003) and a fourth curved portion (3004) that are curved and seamlessly extended from the rear (300B) toward the front (300A). The third curved portion (3003) may be formed adjacent to one edge of the first rear plate (321) corresponding to the first curved portion (3001) of the front plate (310). The fourth curved portion (3004) may be formed adjacent to the other edge of the first rear plate (321) corresponding to the second curved portion (3002) of the front plate (310). In one embodiment, a portion (331) of the bezel structure (330) may include a fifth curved portion (3005) that is smoothly connected to the fourth curved portion (3004) of the first rear plate (321) corresponding to the second curved portion (3002) of the front plate (310). For example, one side curved portion including the fourth curved portion (3004) and the fifth curved portion (3005) may be arranged symmetrically with respect to the other side third curved portion (3003). In one embodiment, the second rear plate (322) may be positioned corresponding to the fifth curved portion (3005). For example, a portion (331) of the bezel structure (330) forming the fifth curved portion (3005) may extend along a portion of the edge (or edge or border) of the second rear plate (322) (an edge following the dotted line indicated by the reference numeral 'E') of the rear plate (320) and may come into contact with the second rear plate (320). In some embodiments, the fifth curved portion (3005) may be formed by the first rear plate (321) or the second rear plate (322). In some embodiments, the first rear plate (321) and the second rear plate (322) may be formed integrally.In some embodiments, the first rear plate (321) and / or the second rear plate (322) may be formed integrally with the bezel structure (330) and may include the same material as the bezel structure (330) (e.g., a metallic material such as aluminum).

[0053] According to some embodiments, the housing (300) may be implemented without at least one of the curved portions including the first curved portion (3001), the second curved portion (3002), the third curved portion (3003), or the fourth curved portion (3004) and the fifth curved portion (3005).

[0054] According to one embodiment, the electronic device (200) may include at least one of a display (201), a first audio module (202), a second audio module (203), a third audio module (204), a fourth audio module (205), a sensor module (206), a first camera module (207), a plurality of second camera modules (208), a light-emitting module (209), an input module (210), a first connection terminal module (211), or a second connection terminal module (212). In some embodiments, the electronic device (200) may omit at least one of the components or additionally include other components.

[0055] A display area (e.g., screen display area or active area) of the display (201) may be visually exposed, for example, through a front plate (310). In one embodiment, the electronic device (200) may be implemented so that the display area visible through the front plate (310) appears as large as possible (e.g., large screen or full screen). For example, the display (201) may be implemented to have an outline that is generally the same shape as the outline of the front plate (310). In another example, the gap between the outline of the display (201) and the outline of the front plate (310) may be formed to be generally the same. In one embodiment, the display (201) may include a touch detection circuit. In some embodiments, the display (201) may include a pressure sensor capable of measuring the intensity (pressure) of a touch. In some embodiments, the display (201) may be combined with or positioned adjacent to a digitizer (e.g., an electromagnetic induction panel) that detects a magnetic field-type electronic pen (e.g., a stylus pen).

[0056] The first audio module (202) may include, for example, a first microphone located inside the electronic device (200), and a first microphone hole formed on the side (300C) corresponding to the first microphone. The second audio module (203) may include, for example, a second microphone located inside the electronic device (200), and a second microphone hole formed on the rear (300B) corresponding to the second microphone. The second microphone hole may be formed, for example, on the first rear plate (321). In some embodiments, the second microphone hole may be formed on the second rear plate (322). The location or number of the audio modules regarding the microphones may vary and is not limited to the illustrated examples. In some embodiments, the electronic device (200) may include a plurality of microphones used to detect the direction of sound.

[0057] The third audio module (204) may include, for example, a first speaker located inside the electronic device (200), and a first speaker hole formed on the side (300C) corresponding to the first speaker. The fourth audio module (205) may include, for example, a second speaker located inside the electronic device (200), and a second speaker hole formed on the front (300A) corresponding to the second speaker. In one embodiment, the first speaker may include an external speaker. In one embodiment, the second speaker may include a receiver for calls, and the second speaker hole may be referred to as a receiver hole. The location or number of the third audio module (204) or the fourth audio module (205) may vary and are not limited to the illustrated examples. In some embodiments, the microphone hole and the speaker hole may be implemented as a single hole. In some embodiments, the third audio module (204) or the fourth audio module (205) may include a piezo speaker with the speaker hole omitted.

[0058] The sensor module (206) can generate an electrical signal or data value corresponding to, for example, an internal operating state of the electronic device (200) or an external environmental state. In one embodiment, the sensor module (206) may include an optical sensor located inside the electronic device (200) corresponding to the front (300A). The optical sensor may include, for example, a proximity sensor or an illuminance sensor. The optical sensor may be aligned with an opening formed in the display (201). External light may enter the optical sensor through the front plate (310) and the opening of the display (201). In some embodiments, the optical sensor may be placed at the bottom of the display (201) and may perform its related function without the location of the optical sensor being visually distinguishable (or exposed). For example, the optical sensor may be located on the back of the display (201) or below or beneath the display (201). In some embodiments, the optical sensor may be positioned aligned in a recess formed on the back surface of the display (201). The optical sensor may be positioned overlapping at least a portion of the screen to perform a sensing function without being exposed to the outside. In this case, the portion of the display (201) that overlaps at least a portion with the optical sensor may have a different pixel structure and / or wiring structure compared to other areas. For example, the portion of the display (201) that overlaps at least a portion with the optical sensor may have a different pixel density compared to other areas. In some embodiments, multiple pixels may not be placed in the portion of the display (201) that overlaps at least a portion with the optical sensor. In some embodiments, the electronic device (200) may include a biosensor (e.g., a fingerprint sensor) located below the display (201). The biosensor may be implemented in an optical, capacitive, or ultrasonic manner, and its location or number may vary.The electronic device (200) may further include at least one of various other sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, or a humidity sensor.

[0059] A first camera module (207) (e.g., a front camera module) may be located inside the electronic device (200), for example, corresponding to the front (300A). A plurality of second camera modules (208) (e.g., rear camera modules) may be located inside the electronic device (200), for example, corresponding to the rear (300B). In one embodiment, a plurality of second camera modules (208) may be located corresponding to a second rear plate (322). The first camera module (207) and / or a plurality of second camera modules (208) may include one or more lenses, an image sensor, and / or an image signal processor. The location or number of the first camera module or the second camera module may vary and is not limited to the illustrated example.

[0060] According to one embodiment, the display (201) may include an opening aligned with the first camera module (207). External light may reach the first camera module (207) through the front plate (310) and the opening of the display (201). In some embodiments, the opening of the display (201) may be formed in the shape of a notch depending on the position of the first camera module (207). In some embodiments, the first camera module (207) may be positioned at the bottom of the display (201) and may perform related functions (e.g., image capture) without the position of the first camera module (207) being visually distinguishable (or exposed). For example, the first camera module (207) may be positioned on the back of the display (201) or below or beneath the display (201) and may include a hidden display back camera (e.g., under display camera (UDC)). In some embodiments, the first camera module (207) may be positioned aligned with a recess formed on the back surface of the display (201). The first camera module (207) may be positioned overlapping at least a portion of the screen to acquire an image of an external subject without being visually exposed to the outside. In this case, the portion of the display (201) that overlaps at least a portion of the first camera module (207) may include a different pixel structure and / or wiring structure compared to other areas. For example, the portion of the display (201) that overlaps at least a portion of the first camera module (207) may have a different pixel density compared to other areas. The pixel structure and / or wiring structure formed in the portion of the display (201) that overlaps at least a portion of the first camera module (207) may reduce light loss between the outside and the first camera module (207). In some embodiments, pixels may not be placed in the portion of the display (201) that overlaps at least a portion of the first camera module (207).In some embodiments, the electronic device (200) may further include a light-emitting module (e.g., a light source) located inside the electronic device (200) corresponding to the front (300A). The light-emitting module may, for example, provide state information of the electronic device (200) in the form of light. In some embodiments, the light-emitting module may provide a light source that is coupled with the operation of the first camera module (207). The light-emitting module may include, for example, an LED, an IR LED, or a xenon lamp.

[0061] According to one embodiment, a plurality of second camera modules (208) may have different attributes (e.g., angle of view) or functions, and may include, for example, a dual camera or a triple camera. The plurality of second camera modules (208) may include a plurality of camera modules including lenses having different angles of view, and the electronic device (200) may control the change of the angle of view of the camera module performed in the electronic device (200) based on the user's selection. The plurality of second camera modules (208) may include at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (e.g., a TOF (time of flight) camera, a structured light camera). In some embodiments, the IR camera may operate as at least part of a sensor module. A light-emitting module (209) (e.g., a flash) may include a light source for the plurality of second camera modules (208). The light-emitting module (209) may include, for example, an LED or a xenon lamp.

[0062] The input module (210) may include, for example, one or more key input devices. One or more key input devices may be located, for example, in an opening formed on the side (300C). In some embodiments, the electronic device (200) may not include some or all of the key input devices, and the key input devices not included may be implemented as soft keys using the display (201). The location or number of the input module (210) may vary, and in some embodiments, the input module (210) may include at least one sensor module.

[0063] A first connection terminal module (e.g., a first connector module or a first interface terminal module) (211) may include, for example, a first connector (or a first interface terminal) located inside the electronic device (200), and a first connector hole formed on a side (300C) corresponding to the first connector. A second connection terminal module (e.g., a second connector module or a second interface terminal module) (212) may include, for example, a second connector (or a second interface terminal) located inside the electronic device (200), and a second connector hole formed on a side (300C) corresponding to the second connector. The electronic device (200) may transmit and / or receive power and / or data to an external electronic device electrically connected to the first connector or the second connector. In one embodiment, the first connector may include a USB (universal serial bus) connector or an HDMI (high definition multimedia interface) connector. In one embodiment, the second connector may include a connector for a memory card (e.g., an SD (secure digital memory) card or a SIM (subscriber identity module) card). In some embodiments, the second connector may include an audio connector (e.g., a headphone connector or an earset connector). The location or number of connection terminal modules may vary and is not limited to the illustrated examples.

[0064] According to one embodiment, the electronic device (200) may include an antenna structure (5) located inside a housing (300). For example, the electronic device (200) may use the antenna structure (5) to perform a positioning function (e.g., angle of arrival (AOA)) for a signal source (e.g., responder, transmitter, or Tx device). The electronic device (200) may include a wireless communication circuit (e.g., wireless communication module (192) of FIG. 1) electrically connected to the antenna structure (5) and a processor (e.g., processor (120) of FIG. 1) electrically connected to the wireless communication circuit. The processor may simultaneously perform angle-measuring positioning (AOA) and distance-measuring positioning (ranging). In one embodiment, the processor may use a first antenna element (①) to determine (or estimate) the distance between the electronic device and the signal source. In one embodiment, the processor can determine (or estimate) the reception angle of a signal (e.g., direction of the signal) with respect to a set axis of the electronic device (200) by using at least one of the difference in arrival time of a response message to a request message, the difference in arrival distance between received signals, or the phase difference through at least two antenna elements of the antenna structure (5) (e.g., a first antenna element (①) and a second antenna element (②), or a first antenna element (①) and a third antenna element (③)). The electronic device (200) can support a positioning function using a wideband bandwidth (e.g., UWB). UWB may refer to a technology that communicates with a wideband bandwidth, for example, a technology that follows the international standard of IEEE 802.15.4.In one embodiment, an electronic device (200) (e.g., an initiator, receiver, or Rx (receiver) device) can identify or estimate the location of a signal source (e.g., a responder, transmitter, or Tx (transmitter) device) by using the phase difference of a signal received through a plurality of antenna elements (e.g., a first antenna element (①), a second antenna element (②), and a third antenna element (③)) included in an antenna structure (5). The antenna structure (5) may be implemented as a printed circuit board (e.g., a flexible printed circuit board (FPCB)), and the plurality of antenna elements (①, ②, ③) may include a patch antenna.

[0065] The electronic device (200) may further include various components depending on the form of provision. These components cannot all be listed as they vary according to the convergence trend of the electronic device (200), but components equivalent to the components mentioned above may be additionally included in the electronic device (200). In various embodiments, specific components from the above-mentioned components may be excluded or replaced with other components depending on the form of provision.

[0066] FIGS. 4 and 5 are exploded views of the electronic device (200) of FIG. 2 according to one embodiment.

[0067] Referring to FIGS. 4 and 5, in one embodiment, the electronic device (200) may include a front plate (310), a rear plate (320), a bezel structure (330), a first support member (410), a second support member (420), a third support member (430), a display (201), a first substrate assembly (440), a second substrate assembly (450), a battery (460), or a plurality of antenna structures (470, 5). In some embodiments, the electronic device (200) may omit at least one of the components or additionally include other components.

[0068] According to one embodiment, the bezel structure (or side member) (330) may include a first bezel portion (or first side portion) (411), a second bezel portion (or second side portion) (412), a third bezel portion (or third side portion) (413), or a fourth bezel portion (or fourth side portion) (414). The first bezel portion (411) and the third bezel portion (413) may extend parallel to each other while being spaced apart. The second bezel portion (412) may connect one end of the first bezel portion (411) and one end of the third bezel portion (413). The fourth bezel portion (414) can connect the other end of the first bezel portion (411) and the other end of the third bezel portion (413), and can be extended parallel to and spaced apart from the second bezel portion (412). At least a portion of the first corner portion (415) where the first bezel portion (411) and the second bezel portion (412) are connected, the second corner portion (416) where the second bezel portion (412) and the third bezel portion (413) are connected, the third corner portion (417) where the third bezel portion (413) and the fourth bezel portion (414) are connected, and / or the fourth corner portion (418) where the first bezel portion (411) and the fourth bezel portion (414) are connected may be formed in a rounded shape. The first bezel portion (411) and the third bezel portion (413) may have a first length extended in the x-axis direction, and the second bezel portion (412) and the fourth bezel portion (414) may have a second length extended in the y-axis direction that is smaller than the first length. In some embodiments, the first length and the second length may be formed substantially the same. The first support member (410) may be located inside the electronic device (200) and connected to the bezel structure (330), or may be formed integrally with the bezel structure (330). The first support member (410) may be formed of, for example, a metal material and / or a non-metal material (e.g., a polymer).In one embodiment, the conductive portion included in the first support member (410) may serve as electromagnetic shielding for the display (201), the first substrate assembly (440), and / or the second substrate assembly (450). The first support member (410) and the bezel structure (330) may be referred to as a front case (400). The first support member (410) may contribute to the durability or rigidity (e.g., torsional rigidity) of the electronic device (200) as a portion of the front case (400) where components such as the display (201), the first substrate assembly (440), the second substrate assembly (450), or the battery (460) are placed. In some embodiments, the first support member (410) may be referred to as a 'bracket', a 'mounting plate', or a 'support structure'. In some embodiments, the first support member (410) may be defined as part of the housing (300) (see FIG. 2).

[0069] The display (201) may be positioned, for example, between the first support member (410) and the front plate (310) and may be disposed on one side of the first support member (410). In one embodiment, the front plate (310) and the display (201) may be formed integrally. The first substrate assembly (440) and the second substrate assembly (450) may be positioned, for example, between the first support member (410) and the rear plate (320) and may be disposed on the other side of the first support member (410). The battery (460) may be positioned, for example, between the first support member (410) and the rear plate (320) and may be disposed on the first support member (410).

[0070] According to one embodiment, the first substrate assembly (440) may include a first printed circuit board (441) (e.g., a printed circuit board (PCB), or a printed circuit board assembly (PBA). The first substrate assembly (440) may include various electronic components electrically connected to the first printed circuit board (441). The electronic components may be placed on the first printed circuit board (441) or may be electrically connected to the first printed circuit board (441) through an electrical path such as a cable or a flexible printed circuit board (FPCB). Referring to FIGS. 2 and 3, the electronic components may include, for example, a second microphone included in a second audio module (203), a second speaker included in a fourth audio module (205), a sensor module (206), a first camera module (207), a plurality of second camera modules (208), a light-emitting module (209), or an input module (210).

[0071] According to one embodiment, the second substrate assembly (450) may be spaced apart from the first substrate assembly (440) with the battery (460) in between when viewed from above the front plate (310) (e.g., when viewed in the +z axis direction). The second substrate assembly (450) may include a second printed circuit board (451) electrically connected to the first printed circuit board (441) of the first substrate assembly (440). The second substrate assembly (450) may include various electronic components electrically connected to the second printed circuit board (451). The electronic components may be placed on the second printed circuit board (451) or may be electrically connected to the second printed circuit board (451) through an electrical path such as a cable or FPCB. Referring to FIGS. 2 and 3, the electronic components may include, for example, a first microphone included in a first audio module (202), a first speaker included in a third audio module (204), a first connector included in a first connection terminal module (211), or a second connector included in a second connection terminal module (212).

[0072] According to some embodiments, the first substrate assembly (440) or the second substrate assembly (450) may include a primary PCB (e.g., primary PCB (611) of FIG. 6) (or, main PCB or master PCB), a secondary PCB (e.g., secondary PCB (612) of FIG. 6) (or slave PCB) disposed partially overlapping with the primary PCB, and / or an interposer substrate (e.g., interposer substrate (613) of FIG. 6) between the primary PCB and the secondary PCB.

[0073] The battery (460) is a device for supplying power to at least one component of the electronic device (200) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (460) may be integrally disposed inside the electronic device (200) or may be detachably disposed from the electronic device (200).

[0074] According to one embodiment, the second support member (420) may be positioned between the first support member (410) and the rear plate (320) and may be coupled to the first support member (410) and / or the first substrate assembly (440) using a fastening element such as a bolt (or screw). At least a portion of the first substrate assembly (440) may be positioned between the first support member (410) and the second support member (420), and the second support member (420) may cover and protect the first substrate assembly (440). The third support member (430) may be positioned at least partially spaced apart from the second support member (420) with the battery (460) in between, when viewed from above the rear plate (320) (e.g., in the -z axis direction). The third support member (430) may be positioned between the first support member (410) and the rear plate (320) and may be joined to the first support member (410) and / or the second substrate assembly (450) using fastening elements such as bolts (or screws). At least a portion of the second substrate assembly (450) may be positioned between the first support member (410) and the third support member (430), and the third support member (430) may cover and protect the second substrate assembly (450). The second support member (420) and / or the third support member (430) may be formed of a metal material and / or a non-metal material (e.g., a polymer). In some embodiments, the second support member (420) may serve as electromagnetic shielding for the first substrate assembly (440), and the third support member (430) may serve as electromagnetic shielding for the second substrate assembly (450). In some embodiments, the second support member (420) and / or the third support member (430) may be referred to as a rear case. In some embodiments, the second support member (420) and / or the third support member (430) may be defined as part of the housing (300) (see FIG. 2).

[0075] According to some embodiments, an integral substrate assembly comprising a first substrate assembly (440) and a second substrate assembly (450) may be implemented. For example, when viewed from above the rear plate (320) (e.g., in the -z axis direction), the substrate assembly may include a first portion, a second portion, positioned spaced apart from each other with the battery (460) in between, and a third portion extending between the battery (460) and the bezel structure (330) and connecting the first portion and the second portion. The third portion may be implemented substantially rigidly. In some embodiments, the third portion may be implemented substantially flexiblely. In some embodiments, an integral support member comprising a second support member (420) and a third support member (430) may be implemented.

[0076] According to one embodiment, the second support member (420) (e.g., rear case) may include a non-conductive member (not shown) formed of a non-metallic material (e.g., polymer) and / or a plurality of conductive patterns (not shown) disposed on the non-conductive member. For example, the conductive patterns may be implemented by laser direct structuring (LDS). LDS may be a method of forming a conductive pattern by, for example, using a laser to design a pattern on the non-conductive member and plating a conductive material such as copper or nickel thereon. The plurality of conductive patterns may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) included in the first substrate assembly (440) and may operate as an antenna radiator. In one embodiment, at least some of the conductive parts included in the bezel structure (330) may operate as an antenna radiator electrically connected to the wireless communication circuit. The wireless communication circuit may process a transmitted signal or a received signal in at least one selected or designated frequency band through at least one antenna radiator. The selected or specified frequency band may include, for example, at least one of LB (low band) (approx. 600 MHz to approx. 1 GHz), MB (middle band) (approx. 1 GHz to approx. 2.3 GHz), HB (high band) (approx. 2.3 GHz to approx. 2.7 GHz), or UHB (ultra-high band) (approx. 2.7 GHz to approx. 6 GHz). The specified frequency band may include various other frequency bands.

[0077] According to one embodiment, the antenna structure (470) may be positioned at least partially between the battery (460) and the back plate (320). The antenna structure (470) may be implemented in the form of a film, for example, such as an FPCB. The antenna structure (470) may include at least one conductive pattern utilized as a loop-shaped radiator. For example, the at least one conductive pattern may include a planar helical conductive pattern (e.g., a planar coil, or a pattern coil). The at least one conductive pattern included in the antenna structure (470) may be electrically connected to a wireless communication circuit (or wireless communication module) included in the first substrate assembly (440). For example, the at least one conductive pattern may be utilized for near-field communication, such as NFC. As another example, the at least one conductive pattern may be utilized for magnetic secure transmission (MST) that transmits and / or receives magnetic signals. In some embodiments, at least one conductive pattern included in the antenna structure (470) may be electrically connected to a power transmission and reception circuit included in the first substrate assembly (440). The power transmission and reception circuit may wirelessly receive power from an external electronic device or wirelessly transmit power to an external electronic device using at least one conductive pattern. The power transmission and reception circuit may include a power management module, for example, a power management integrated circuit (PMIC) or a charger integrated circuit (CIC). The power transmission and reception circuit may charge the battery (460) using the power received wirelessly using the conductive pattern.

[0078] According to one embodiment, an antenna structure (5) comprising a plurality of antenna elements (①, ②, ③) may be positioned at least partially between the first substrate assembly (440) and the rear plate (320). In some embodiments, the antenna structure (5) may be positioned between the second support member (420) and the battery (460) when viewed from above the rear plate (320) (e.g., in the -z axis direction). The antenna structure (5) may be positioned so as not to substantially overlap with the second support member (420), another antenna structure (470), the battery (460), a plurality of second camera modules (208), or the light-emitting module (209) when viewed from above the rear plate (320). For example, the antenna structure (5) may not substantially overlap with the plurality of conductive patterns used as antenna radiators among the second support member (420) or the conductive patterns of other antenna structures (470) when viewed from above the rear plate (320).

[0079] In one embodiment, a plurality of antenna elements (①, ②, ③) may differ in size or shape. The size of the plurality of antenna elements (①, ②, ③) may be determined by considering the resonant frequency band of the antenna structure (5). In one embodiment, the antenna structure (5) is described as including a first antenna element (①), a second antenna element (②), and a third antenna element (③), but is not limited thereto. For example, the antenna structure (5) may include a larger number of antennas.

[0080] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but is not limited thereto. For example, the electronic device (200) may be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and / or a rollable electronic device.

[0081] FIG. 6 schematically illustrates a cross-sectional structure (600) in the yz plane relating to a part of the electronic device (200) shown in FIG. 3 in one embodiment.

[0082] Referring to FIG. 6, the cross-sectional structure (600) may include a bezel structure (330), a first support member (410), a front plate (310), a rear plate (320), a display (201), a plurality of second camera modules (208), a first substrate assembly (440), an antenna structure (5), a cover member (620), or a buffer member (630). A display (201) may be positioned between the first support member (410) and the front plate (310). A plurality of second camera modules (208), a first substrate assembly (440), an antenna structure (5), a cover member (620), or a buffer member (630) may be positioned between the first support member (410) and the rear plate (320). In one embodiment, the cover member (620) may be positioned between the first substrate assembly (440) and the rear plate (320). The antenna structure (5) may be positioned at least partially between the cover member (620) and the rear plate (320). The buffer member (630) may be positioned between the antenna structure (5) and the rear plate (320). The second camera modules (208) may not substantially overlap with the first substrate assembly (440), the cover member (620), the antenna structure (5), or the buffer member (630) when viewed from above the rear plate (320) (e.g., when viewed in the -z axis direction).

[0083] According to one embodiment, the first substrate assembly (440) may include a primary PCB (611), a secondary PCB (612), and an interposer substrate (613) between the primary PCB (611) and the secondary PCB (612). The primary PCB (611) may be placed on the first support member (410). The secondary PCB (612) may be placed with at least partial overlap with the primary PCB (611) when viewed from above the back plate (320) (e.g., when viewed in the -z axis direction). The interposer substrate (613) may electrically connect the primary PCB (611) and the secondary PCB (612). The interposer substrate (613) may include, for example, a plurality of conductive vias (not shown) that electrically connect the primary PCB (611) and the secondary PCB (612). At least some of the plurality of conductive vias included in the interposer substrate (613) may be part of a signal line through which a signal is transmitted between a first electronic component placed on the primary PCB (611) and a second electronic component placed on the secondary PCB (612). In some embodiments, some of the plurality of conductive vias included in the interposer substrate (613) may be part of a ground path that electrically connects a first ground plane included in the primary PCB (611) and a second ground plane included in the secondary PCB (612).

[0084] According to one embodiment, the cover member (or, or, cover structure or support structure) (620) may comprise a metal and / or a polymer and may be joined to the first substrate assembly (440) and / or the first support member (410) using a joining member such as a bolt (or screw). When viewed from above the rear plate (320) (e.g., in the -z axis direction), a portion of the first substrate assembly (440) may overlap with the second support member (420) (see FIG. 4 or 5), and another portion of the first substrate assembly (440) may overlap with the cover member (620). The cover member (620) may be in contact with the secondary PCB (612). In one embodiment, the antenna structure (5) may be placed on the cover member (620). For example, an adhesive material of polymer may be placed between the antenna structure (5) and the cover member (620). For example, the adhesive material may include at least one of OCA (optical clear adhesive), PSA (pressure sensitive adhesive), heat-reactive adhesive, general adhesive, or double-sided tape.

[0085] According to one embodiment, the antenna structure (5) may include a first portion (not shown) comprising a plurality of antenna elements (①, ②, ③) (see FIG. 5), and a second portion (not shown) extending from the first portion and electrically connected to a first substrate assembly (440). The first portion of the antenna structure (5) may be disposed on a cover member (620). The second portion of the antenna structure (5) may be electrically connected to the first substrate assembly (440), for example, through an opening (e.g., a notch-shaped opening) (not shown) formed in the cover member (620). In some embodiments, the second support member (420) (see FIG. 4 or 5) and the cover member (620) may be formed integrally.

[0086] According to one embodiment, the cushioning member (630) may be placed on the antenna structure (5) or on the rear plate (320). The cushioning member (630) may be located in the gap between the antenna structure (5) and the rear plate (320). The cushioning member (630) may press the antenna structure (5) toward the first substrate assembly (440) between the antenna structure (5) and the rear plate (320). The cushioning member (630) may reduce the impact (e.g., scratching) between the antenna structure (5) and the rear plate (320). The cushioning member (630) may reduce frictional noise between the antenna structure (5) and the rear plate (320). The cushioning member (630) may include a non-conductive material that can reduce the degradation of antenna radiation performance when the antenna structure (5) transmits or receives a frequency signal toward the rear (300B) of the electronic device (200). The buffer member (630) may have a dielectric constant (e.g., low dielectric constant) that can reduce the degradation of the antenna radiation performance of the antenna structure (5). The buffer member (630) may include, for example, a film or a flexible member such as a sponge.

[0087] According to one embodiment, the back plate (320) may be formed of a non-conductive material such as a polymer or glass.

[0088] According to some embodiments, the rear plate (320) may comprise a metallic material, and in this case, may include a plurality of openings (not shown) positioned corresponding to a plurality of antenna elements (①, ②, ③) (see FIG. 5) of the antenna structure (5). In one embodiment, the plurality of openings may be formed as a single opening. The plurality of openings may overlap with the plurality of antenna elements (①, ②, ③) when viewed from above the rear plate (320) (e.g., when viewed in the -z axis direction). A non-conductive member (not shown) may be positioned in the plurality of openings to form a portion of the rear surface (300B) of the electronic device (200). In one embodiment, the non-conductive member positioned in the plurality of openings may be a radio frequency window area (or radiating aperture area). When the antenna structure (5) transmits or receives a frequency signal, the radio waves regarding the frequency signal may pass through the non-conductive member. The non-conductive member can secure coverage while reducing the degradation of the radiation performance of the antenna structure (5) on the rear plate (320). In one embodiment, when viewed from above on the rear plate (320), the plurality of openings may have a size such that the entire plurality of antenna elements (①, ②, ③) can overlap.

[0089] According to one embodiment, the antenna structure (5) may include a circuit board (or substrate) (not shown) on which a plurality of antenna elements (①, ②, ③) (see FIG. 5) are located. The circuit board may refer to an insulating material capable of arranging a conductive pattern (e.g., a pattern of copper foil) (or circuit) such as the plurality of antenna elements (①, ②, ③). In one embodiment, the antenna structure (5) may include, for example, a printed circuit board (PCB) in which a circuit (e.g., a conductive pattern) is located on the circuit board (e.g., an insulating substrate). The printed circuit board of the antenna structure (5) may include, for example, a rigid printed circuit board (RPCB), a flexible printed circuit board (FPCB), or a rigid flexible printed circuit board (RFPCB).

[0090] FIG. 7 is an xy plan view of an antenna structure (5) in one embodiment. FIG. 8 is an enlarged view of the portion indicated by reference numeral 'A' in FIG. 7, for example.

[0091] Referring to FIG. 7, in one embodiment, the antenna structure (5) may include a printed circuit board (7), a connector (8), and a conductive pattern (9).

[0092] A printed circuit board (7) may have a plurality of conductive layers, for example, each containing at least one conductive pattern, stacked thereon, and a dielectric (or insulator) may be positioned between the plurality of conductive layers. At least a portion of the printed circuit board (7) may be implemented, for example, using a flexible copper clad laminate (FCCL). The flexible copper clad laminate, as a laminate used in the printed circuit board (7), may include a structure in which copper foil is attached to one or both sides of a flexible insulating film (or dielectric film) using an adhesive material (e.g., acrylic adhesive). The flexible insulating film may include various non-conductive materials, such as a polyimide film or a polyester film. The flexible insulating film may include, for example, a prepreg (preimpregnated materials) (e.g., an insulating resin layer). One or more conductive patterns included in the plurality of conductive layers may be utilized as antenna radiators. One or more conductive patterns included in multiple conductive layers can be utilized as electrical paths (e.g., signal lines). One or more conductive patterns included in multiple conductive layers can be utilized as ground planes. A conductive pattern utilized as an antenna radiator may be referred to as an 'antenna element' or a 'radiation pattern'. A conductive pattern utilized as at least part of an electrical path may be referred to as a 'path pattern'. A conductive pattern utilized as at least part of a ground plane may be referred to as a 'ground pattern'. A printed circuit board (7) may include multiple conductive vias. A conductive via may be a conductive hole drilled to allow a connecting wire to be placed to electrically connect the conductive patterns of different conductive layers.Conductive vias may include, for example, PTH (plated through hole), LVH (laser via hole), BVH (buried via hole), or stacked vias. The printed circuit board (7) may include a first side (7A) and a second side (7B) located opposite to the first side (7A). The first side (7A) may substantially face the back plate (320) (see FIG. 6). The second side (7B) may substantially face the front plate (310) (see FIG. 6). A connector (8) may be placed on the second side (7B). In one embodiment, the printed circuit board (7) may include a first portion (71) comprising a plurality of antenna elements (①, ②, ③) and a second portion (72) extending from the first portion (71) and electrically connected to a first board assembly (440) (Fig. 4, 5, or 6). A connector (8) may be located in the second portion (72). The second portion (72) of the printed circuit board (7) may be electrically connected to the first board assembly (440), for example, through an opening (e.g., a notch-shaped opening) formed in a cover member (620) (see Fig. 6). In some embodiments, a flexible member such as a sponge may be located between the back plate (320) (see Fig. 6) and the connector (8). The flexible member can elastically press the connector (8) toward the first substrate assembly (440) so that the connector (8) is not separated from the first substrate assembly (440) between the connector (8) and the rear plate (320).

[0093] According to one embodiment, the printed circuit board (7) may include a first notch (731) and a second notch (732). The first notch (731) may be formed between the area containing the first antenna element (①) of the first part (71) of the printed circuit board (7) and the second part (72) of the printed circuit board (7). The second notch (732) may be formed between the area containing the second antenna element (②) of the first part (71) of the printed circuit board (7) and the second part (72) of the printed circuit board (7). The second part (72) of the printed circuit board (7) may be formed due to the first notch (731) and the second notch (732).

[0094] According to one embodiment, the first part (71) and the second part (72) of the printed circuit board (7) may be substantially flexible.

[0095] According to some embodiments, a second part (72) of a printed circuit board (7) may have greater flexibility than a first part (71) of a printed circuit board (7). The second part (72) may have bending characteristics (e.g., flexibility) that allow it to bend without breakage while reducing stress generation under the same conditions compared to the first part (71). In one embodiment, the first part (71) and the second part (72) may be substantially flexible, and the second part (72) may have greater flexibility than the first part (71). For example, the second part (72) may have a thinner thickness or fewer layers than the first part (71), and thus may be implemented to be more flexible than the first part (71). In another example, the second part (72) may be implemented to be more rigid than the first part (71) by including a different material from the first part (71). In some embodiments, the second part (72) may be a substantially flexible part (or flexible section) of the printed circuit board (7), and the first part (71) may be substantially rigid parts (or rigid sections) of the printed circuit board (7). A printed circuit board (7) comprising a flexible part and a rigid part, or parts having different flexibility, may be formed using various other structures.

[0096] According to one embodiment, the printed circuit board (7) may include a first antenna element (①), a second antenna element (②), a third antenna element (③), a first path pattern (PP1), a second path pattern (PP2), a third path pattern (PP3), a first conductive via (V1), a second conductive via (V2), and / or a third conductive via (V3). The first conductive via (V1), the second conductive via (V2), and the third conductive via (V3) may be located in a second portion (72) of the printed circuit board (7). The first path pattern (or, first signal line pattern) (PP1) may electrically connect the first antenna element (①) and the first conductive via (V1). The first path pattern (PP1) may be electrically connected to a connector (8) through the first conductive via (V1). A second path pattern (or, second signal line pattern) (PP2) can electrically connect the second antenna element (②) and the second conductive via (V2). The second path pattern (PP2) can be electrically connected to the connector (8) through the second conductive via (V2). A third path pattern (or, third signal line pattern) (PP3) can electrically connect the third antenna element (③) and the third conductive via (V3). The third path pattern (PP3) can be electrically connected to the connector (8) through the third conductive via (V3). A first electrical path (EP1) comprising a first path pattern (PP1) and a first conductive via (V1) can form a first signal line connecting the first antenna element (①) and the connector (8). A second electrical path (EP2) including a second path pattern (PP2) and a second conductive via (V2) can form a second signal line connecting the second antenna element (②) and the connector (8).A third electrical path (EP3) including a third path pattern (PP3) and a third conductive via (V3) can form a third signal line connecting a third antenna element (③) and a connector (8). A wireless communication circuit (e.g., wireless communication module (192) of FIG. 1) included in a first substrate assembly (440) (see FIG. 4, 5, or 6) can provide a radiated current (or electromagnetic signal) (e.g., UWB signal) to a first antenna element (①) through a first electrical path (EP1), and the first antenna element (①) can radiate radio waves. The first antenna element (①) can radiate an electromagnetic signal fed through the first electrical path (EP1) (e.g., a first feed line) to the outside or receive an electromagnetic signal from the outside. A wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) can provide a radiated current (or electromagnetic signal) (e.g., UWB signal) to a second antenna element (②) through a second electrical path (EP2), and the second antenna element (②) can radiate radio waves. The second antenna element (②) can radiate an electromagnetic signal fed through the second electrical path (EP2) (e.g., the second feed line) to the outside or receive an electromagnetic signal from the outside. A wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) can provide a radiated current (or electromagnetic signal) (e.g., UWB signal) to a third antenna element (③) through a third electrical path (EP3), and the third antenna element (③) can radiate radio waves. The third antenna element (③) can radiate an electromagnetic signal fed to the third electrical path (EP3) (e.g., the third feed line) to the outside or receive an electromagnetic signal from the outside. In some embodiments, the first path pattern (PP1) may be referred to as the 'first feed pattern', the second path pattern (PP2) as the 'second feed pattern', and the third path pattern (PP3) as the 'third feed pattern'.In one embodiment, the first antenna element (①) to the third antenna element (③) are connected to a communication circuit (e.g., the processor (120) of FIG. 1, a communication processor) through the first to third feed patterns, thereby securing frequency resonance characteristics. The first to third feed patterns are spaced apart from each other, so that coupling characteristics can be improved.

[0097] According to one embodiment, it may be referred to as a first antenna (51) including a first antenna element (①) and a first electrical path (EP1). It may be referred to as a second antenna (52) including a second antenna element (②) and a second electrical path (EP2). It may be referred to as a third antenna (53) including a third antenna element (③) and a third electrical path (EP3). The first electrical path (EP1) may be referred to as a first feed part (e.g., a first feed line) that provides an electromagnetic signal (or radiated current) to the first antenna element (①), and the first antenna element (①) may be referred to as a first radiation part (or, a first radiator or a first antenna radiator) that radiates the fed electromagnetic signal to the outside or receives an electromagnetic signal from the outside. The second electrical path (EP2) may be referred to as a second feed section (e.g., a second feed line) that provides an electromagnetic signal (or radiated current) to the second antenna element (②), and the second antenna element (②) may be referred to as a second radiating section (or, a second radiator or a second antenna radiator) that radiates the fed electromagnetic signal to the outside or receives an electromagnetic signal from the outside. The third electrical path (EP3) may be referred to as a third feed section (e.g., a third feed line) that provides an electromagnetic signal (or radiated current) to the third antenna element (③), and the third antenna element (③) may be referred to as a third radiating section (or, a third radiator or a third antenna radiator) that radiates the fed electromagnetic signal to the outside or receives an electromagnetic signal from the outside.

[0098] According to one embodiment, a first antenna element (①), a second antenna element (②), and a third antenna element (③) may be included in a first conductive layer (not shown) among a plurality of conductive layers included in a printed circuit board (7). The first conductive layer may be located closer to the first surface (7A) than to the second surface (7B) of the printed circuit board (7). A first path pattern (PP1), a second path pattern (PP2), and a third path pattern (PP3) may be included in the first conductive layer. The first path pattern (PP1) may extend from the edge of the first antenna element (①) when viewed from above the first surface (7A) (e.g., in the -z axis direction). The second path pattern (PP2) may extend from the edge of the second antenna element (②) when viewed from above the first surface (7A). The third path pattern (PP3) may extend from the edge of the third antenna element (③) when viewed from above the first surface (7A), for example. When viewed from above the first surface (7A), the third path pattern (PP3) may extend from the third antenna element (③) between the first path pattern (PP1) and the second path pattern (PP2) and be electrically connected to the third conductive via (V3).

[0099] According to some embodiments (not shown), if the first path pattern (PP1) is included in a conductive layer different from the first antenna element (①), the first electrical path (EP) may include a conductive via electrically connecting the first path pattern (PP1) and the first antenna element (①). If the second path pattern (PP2) is included in a conductive layer different from the second antenna element (②), the second electrical path (EP2) may include a conductive via electrically connecting the second path pattern (PP2) and the second antenna element (②). If the third path pattern (PP3) is included in a conductive layer different from the third antenna element (③), the third electrical path (EP3) may include a conductive via electrically connecting the third path pattern (PP3) and the third antenna element (③). Any two of the first path pattern (PP1), the second path pattern (PP2), and the third path pattern (PP3) may be included in the same conductive layer or in different conductive layers, respectively.

[0100] According to some embodiments (not shown), when a first path pattern (PP1), a second path pattern (PP2), or a third path pattern (PP3) includes a first pattern and a second pattern respectively included in different layers, the printed circuit board (7) may include a conductive via electrically connecting the first pattern and the second pattern.

[0101] According to one embodiment, an electronic device (200) (see FIG. 2) can communicate with a signal source using a first antenna element (①), a second antenna element (②), and a third antenna element (③). The first antenna element (①), the second antenna element (②), and the third antenna element (③) may be referred to as an antenna array (AR). For example, the electronic device (200) can perform a positioning function (e.g., AOA) for a signal source (e.g., responder, transmitter, or Tx device) using the antenna array (AR). In one embodiment, the antenna array (AR) may be arranged in an 'L' shape. For example, according to an 'L'-shaped arrangement, the first antenna element (①) and the third antenna element (③) of the antenna array (AR) may be aligned spaced apart in the x-axis direction, and the first antenna element (①) and the second antenna element (②) of the antenna array (AR) may be aligned spaced apart in the y-axis direction. A processor (e.g., the processor (120) of FIG. 1) can identify or estimate a first angle (e.g., a first signal reception angle) at which a signal is received with respect to a set x-axis of the electronic device (200) by using the time difference between signals received through the first antenna element (①) and the third antenna element (③) aligned in the x-axis direction and the resulting phase difference. The set x-axis of the electronic device (200) may be, for example, a direction in which the first bezel portion (411) and the third bezel portion (413) of FIG. 5 extend parallel to each other. The processor can identify or estimate a second angle (e.g., a second signal reception angle) at which a signal is received with respect to the set y-axis of the electronic device (200) by using the time difference between signals received through the first antenna element (①) and the second antenna element (②) aligned in the y-axis direction and the resulting phase difference.The set y-axis of the electronic device (200) may be, for example, the direction in which the second bezel portion (412) and the fourth bezel portion (414) of FIG. 5 extend parallel to each other. The processor may identify or estimate the direction of the signal source to the electronic device (200) using the first angle and the second angle. The electronic device (200) may identify or estimate the distance between the electronic device (200) and the signal source using the time between signals received through the antenna array (AR) and the resulting phase difference. In some embodiments, when the first antenna element (①) and the third antenna element (③) are in a misaligned state in the x-axis direction, or when the first antenna element (①) and the second antenna element (②) are in a misaligned state in the y-axis direction, the electronic device (200) may be implemented to correct by applying an offset value based on the misalignment distance between the antennas in order to reduce the recognition error of position positioning. In some embodiments, the number or location of antenna elements included in the antenna array (AR) may vary and is not limited to the illustrated example. In some embodiments, the antenna array (AR) may be arranged in various shapes different from the illustrated 'L' shape. In one embodiment, the processor can identify and estimate the first angle and the second angle at which signals are received with respect to the set x-axis and y-axis of the electronic device (200) by using the time difference or phase difference between signals received through all of the first antenna element (①) to the third antenna element. More reliable AOA positioning can be performed when 3D AOA (measured in all directions) is measured through all of the first antenna element (①) to the third antenna element.

[0102] According to one embodiment, the first antenna element (①) may include a first edge (E1), a second edge (E2), a third edge (E3), a fourth edge (E4), and / or a plurality of notches (N1, N2, N3, N4) when viewed from above (e.g., in the -z axis direction) of the first surface (7A) of the printed circuit board (7). The first edge (E1) and the third edge (E3) may be positioned apart from each other in the x-axis direction, for example, and may extend substantially parallel. The second edge (E2) and the fourth edge (E4) may be positioned apart from each other in the y-axis direction, for example, and may extend substantially parallel. The first edge (E1) and the third edge (E3) may be substantially perpendicular to the second edge (E2) and the fourth edge (E4). In one embodiment, the first distance in the x-axis direction between the first edge (E1) and the third edge (E3) may be substantially the same as the second distance in the y-axis direction between the second edge (E2) and the fourth edge (E4). In some embodiments, the first distance and the second distance may be different. A plurality of notches (or slits) (N1, N2, N3, N4) may be openings formed in a recessed shape in each of the first edge (E1), the second edge (E2), the third edge (E3), and the fourth edge (E4). The second antenna element (②) and / or the third antenna element (③) may be formed in substantially the same manner as the first antenna element (①). Multiple notches included in the antenna elements (e.g., first antenna element (①), second antenna element (②), or third antenna element (③)) may contribute to the antenna elements generating dual-band radio waves. For example, the first antenna element (①), second antenna element (②), and third antenna element (③) may have a first operating frequency (e.g., about 8 GHz) and a second operating frequency (e.g., 6 GHz).It can substantially resonate at 5 GHz. Depending on the shape of the antenna element (e.g., first antenna element (①), second antenna element (②), or third antenna element (③)) or the shape of the notch included in the antenna element, the resonant frequency band in which the antenna element can transmit and receive signals may change.

[0103] According to some embodiments, the antenna elements (e.g., the first antenna element (①), the second antenna element (②), or the third antenna element (③)) may be formed in a shape that does not include a notch. In this case, the first antenna (51), the second antenna (52), and the third antenna (53) may resonate at substantially one frequency (e.g., a first operating frequency (e.g., about 8 GHz) or a second operating frequency (e.g., about 6.5 GHz)).

[0104] According to some embodiments (not shown), antenna elements (e.g., first antenna element (①), second antenna element (②), or third antenna element (③)) may be formed in various other shapes (e.g., circular, elliptical, polygonal, or ring shape) and are not limited to the illustrated examples.

[0105] The printed circuit board (7) may include a second conductive layer (not shown) including a ground plane. The second conductive layer may be located closer to the second surface (7B) than to the first surface (7A) of the printed circuit board (7). The ground plane may reduce electromagnetic effects (e.g., electromagnetic interference (EMI)) on the circuit (or circuit pattern) of the printed circuit board (7). The ground plane may, for example, reduce the effect of external electromagnetic noise on the circuit of the printed circuit board (7). The ground plane may, for example, reduce the effect of the electromagnetic field generated when current flows through the circuit of the printed circuit board (7) on electrical elements around the printed circuit board (7). The ground plane may function as an antenna ground for the first antenna (51), the second antenna (52), and the third antenna (53). The ground plane can be electrically connected to the ground included in the first substrate assembly (440) of FIG. 4, 5, or 6 (e.g., the ground plane included in the first printed circuit board (441)) through the connector (8).

[0106] According to one embodiment, the conductive pattern (9) may be located inside a first portion (71) included in the printed circuit board (7). The conductive pattern (9) may overlap at least partially with the first antenna element (①) when viewed from above the first surface (7A) of the printed circuit board (7) (e.g., when viewed in the -z axis direction). The conductive pattern (9) may not overlap with the first electrical path (EP1), the second electrical path (EP2), and the third electrical path (EP3) when viewed from above the first surface (7A) of the printed circuit board (7). The conductive pattern (9) may be located at least partially between a first conductive layer comprising the first antenna element (①), the second antenna element (②), and the third antenna element (③) and a second conductive layer comprising a ground plane. The conductive pattern (9) may be physically separated from the first conductive layer and the second conductive layer. The printed circuit board (7) may include a plurality of fourth conductive vias (V41, V42, V43, V44) (see FIG. 8) that electrically connect the conductive pattern (9) and the ground plane of the printed circuit board (7). In some embodiments, the conductive pattern (9) may be defined as a component of the printed circuit board (7) as part of a plurality of conductive layers included in the printed circuit board (7). The conductive pattern (9) may be a conductive layer located between the first conductive layer (701) and the second conductive layer (702). A dielectric layer may be included between the conductive pattern (9) and the second conductive layer (702). The conductive pattern (9) and the second conductive layer (702) may be electrically connected using a plurality of fourth conductive vias (V41, V42, V43, V44) passing through the dielectric layer between the conductive pattern (9) and the second conductive layer (702). In some embodiments, the conductive pattern (9) may be referred to as a micro strip.

[0107] According to one embodiment, the conductive pattern (9) may include a first conductive layer comprising a first antenna element (①), a second antenna element (②), and a third antenna element (③) of the printed circuit board (7), or a conductive layer or conductive plate substantially parallel to a second conductive layer comprising a ground plane of the printed circuit board (7). For example, one side of the conductive pattern (9) facing the first conductive layer and the other side of the conductive pattern (9) facing the second conductive layer may include a plane and be parallel to each other. In some embodiments, the one side of the conductive pattern (9) facing the first conductive layer or the other side of the conductive pattern (9) facing the second conductive layer may include an uneven surface or a curved surface. In some embodiments, any two regions of the conductive pattern (9) may have different thicknesses in the z-axis direction.

[0108] According to one embodiment, the conductive pattern (9) may include a first region (91) that overlaps with the first antenna element (①) and a second region (92) that does not overlap with the first antenna element (①) when viewed from above (e.g., in the -z axis direction) of the first surface (7A) of the printed circuit board (7). A plurality of fourth conductive vias (V41, V42, V43, V44) may electrically connect the second region (92) of the conductive pattern (9) and the ground plane of the printed circuit board (7).

[0109] According to one embodiment, the conductive pattern (9) may include a rectangular border when viewed from above (e.g., in the -z axis direction) on the first surface (7A) of the printed circuit board (7). For example, when viewed from above on the first surface (7A) of the printed circuit board (7), the conductive pattern (9) may include a first border (B1) and a third border (B3) parallel to the y-axis, and a second border (B2) and a fourth border (B4) parallel to the x-axis. When viewed from above on the first surface (7A) of the printed circuit board (7), the first distance at which the third border (B3) is spaced from the first border (B1) in the +x axis direction may be greater than the second distance at which the fourth border (B4) is spaced from the second border (B2) in the +y axis direction. For example, the first distance may be a value included in the range of about 2 mm to about 10 mm (e.g., about 4.55 mm). For example, the second distance may be a value included in the range of about 0.3 mm to about 1.2 mm (e.g., about 0.8 mm). In some embodiments, the first distance and the second distance may be implemented substantially the same. When viewed from above on the first surface (7A) of the printed circuit board (7), the first region (91) and the second region (92) of the conductive pattern (9) may be distinguished based on the first edge (E1) of the first antenna element (①). When viewed from above on the first surface (7A) of the printed circuit board (7), the first edge (B1) of the conductive pattern (9) may be positioned so as to be spaced apart in the -x axis direction from the first edge (E1) of the first antenna element (①) so as not to overlap with the first antenna element (①). When viewed from above on the first surface (7A) of the printed circuit board (7), the third edge (B3) of the conductive pattern (9) may be positioned so as to be spaced apart in the +x axis direction from the first edge (E1) of the first antenna element (①) so as to overlap with the first antenna element (①).In one embodiment, the second region (92) of the conductive pattern (9) may be located between the first antenna element (①) and the third antenna element (③) when viewed from above the first surface (7A) of the printed circuit board (7). In one embodiment, a plurality of fourth conductive vias (V41, V42, V43, V44) may be located closer to the first edge (B1) of the conductive pattern (9) than to the third edge (B3) of the conductive pattern (9) which is close to the first edge (E1) of the first antenna element (①) when viewed from above the first surface (7A) of the printed circuit board (7). For example, a plurality of fourth conductive vias (V41, V42, V43, V44) may be located adjacent to the first edge (B1) of the conductive pattern (9). A plurality of fourth conductive vias (V41, V42, V43, V44) may be arranged in the y-axis direction. In some embodiments, a plurality of fourth conductive vias (V41, V42, V43, V44) may be referred to as a conductive via structure (or a single row of conductive via structures). The location or number of the fourth conductive vias may vary and is not limited to the illustrated example. In some embodiments, a plurality of fourth conductive vias may be located adjacent to the second edge (B2) or the fourth edge (B4) of the conductive pattern (9) and may be arranged in the x-axis direction. When viewed from above on the first surface (7A) of the printed circuit board (7), the conductive pattern (9) may be formed in various other polygons or circles, not limited to a shape including a rectangular edge according to the illustrated example.

[0110] According to one embodiment, the conductive pattern (9) may include an opening (or slot) (901) extending from a first region (91) to a second region (92). The opening (901) may be formed, for example, inside the rectangular border of the conductive pattern (9) when viewed from above on the first surface (7A) of the printed circuit board (7).

[0111] According to one embodiment, the opening (901) may be formed as a meander-shaped pattern (hereinafter referred to as the 'meander pattern') (902). An opening (901) formed as a pattern such as the meander pattern (902) may be referred to as the opening pattern. The meander pattern (902) may include, for example, a series of sinuous curves, bends, loops, turns, or windings. In one embodiment, the meander pattern (902) may include a corrugated pattern including patterns extended in the x-axis direction and patterns extended in the y-axis direction. The opening (901) may be formed in various other shapes.

[0112] FIG. 9 illustrates components included in the printed circuit board (7) of the antenna structure (5) in one embodiment. FIG. 10 illustrates a cross-sectional structure (1000) of the xz plane with respect to the CC' line in FIG. 8 in one embodiment.

[0113] Referring to FIGS. 9 and 10, the printed circuit board (7) may include a first conductive layer (701), a second conductive layer (702), and a dielectric (or a layer of dielectric material) (703). The first conductive layer (701) may be located closer to the first surface (7A) (see FIG. 7) of the printed circuit board (7) than to the second surface (7B) (see FIG. 7) of the printed circuit board (7). The first conductive layer (701) may include a first antenna element (①), a second antenna element (②), a third antenna element (③), a first path pattern (PP1), a second path pattern (PP2), and a third path pattern (PP3). The second conductive layer (702) may be located closer to the second surface (7B) than to the first surface (7A) of the printed circuit board (7). The second conductive layer (702) can be utilized as a ground plane. A dielectric (703) can be positioned between the first conductive layer (701) and the second conductive layer (702). Although not illustrated, the printed circuit board (7) may further include a first surface protection layer forming at least a portion of the first surface (7A) (see FIG. 7), or a second surface protection layer forming at least a portion of the second surface (7B) (see FIG. 7). The first surface protection layer (e.g., a first coverlay) or the second surface protection layer (e.g., a second coverlay) serves to protect the circuit (or circuit pattern) of the printed circuit board (7) and may include, for example, an insulating layer or a non-conductive layer. The first surface protection layer or the second surface protection layer may include various insulating materials, for example, such as epoxy-based solder mask insulating ink (e.g., PSR ink (photo imageable solder resist mask ink)). In some embodiments, the first surface protection layer may include an electromagnetic shielding component (or electromagnetic shielding component), and in this case, may be positioned so as not to overlap with the antenna array (AR) when viewed in the -z axis direction.

[0114] According to one embodiment, the conductive pattern (9) may be located at least partially between the first conductive layer (701) and the second conductive layer (702). The conductive pattern (9) may be electrically connected to the second conductive layer (702) (e.g., ground plane) through a plurality of fourth conductive vias (V41, V42, V43, V44) (see FIG. 8 and 10). In some embodiments, the conductive pattern (9), the second conductive layer (702), and the plurality of fourth conductive vias (V41, V42, V43, V44) may be referred to as a ground structure. In some embodiments, the second conductive layer (702) may be referred to as the first ground pattern, and the conductive pattern (9) may be referred to as the second ground pattern. In some embodiments, the second conductive layer (702) may be referred to as the first ground plane, and the conductive pattern (9) may be referred to as the second ground plane.

[0115] According to one embodiment, the first conductive layer (701) and the second conductive layer (702) can form a coplanar waveguide (CPW) that transmits a frequency signal.

[0116] According to one embodiment, the first distance (D1) at which the conductive pattern (9) is spaced from the first antenna element (①) in the -z axis direction may be greater than the second distance (D2) at which the conductive pattern (9) is spaced from the second conductive layer (702) (e.g., ground plane) in the +z axis direction. For example, the first distance (D1) may be a value included in the range of about 0.2 mm to about 0.3 mm (e.g., about 0.245 mm). For example, the second distance (D2) may be a value included in the range of about 0.03 mm to about 0.06 mm (e.g., about 0.05 mm). In one embodiment, the second distance (D2) may be greater than the thickness of the first conductive layer (701) or the second conductive layer (702) (e.g., thickness in the z axis direction).

[0117] According to one embodiment, the thickness (T) of the conductive pattern (9) (e.g., thickness in the z-axis direction) may be greater than that of the first conductive layer (701) or the second conductive layer (702). For example, the thickness (T) of the conductive pattern (9) may be a value included in the range of about 0.03 mm to about 0.1 mm (e.g., about 0.06 mm).

[0118] According to one embodiment, the conductive pattern (9) can improve the isolation between the first antenna (51) and the second antenna (52) by reducing the energy (or electromagnetic energy) transmitted (or excited) to the first antenna (51) due to electromagnetic coupling between the first antenna (51) (see FIG. 7) and the second antenna (52). For example, energy transferred to the first antenna (51) due to electromagnetic coupling between the first antenna (51) and the second antenna (52) (e.g., 'coupled energy', 'coupled energy component', 'coupled electromagnetic wave', or 'coupled electromagnetic wave energy') flows through the conductive pattern (9) and a plurality of fourth conductive vias (V41, V42, V43, V44) (see FIG. 8) to the second conductive layer (702) (e.g., ground plane) of the printed circuit board (7) and can be absorbed in the second conductive layer (702). The conductive pattern (9) is an element through which energy is transferred in an electromagnetic coupling manner, and in some embodiments, may be referred to by various other terms such as 'coupling conductive pattern' or 'coupling conductive region'. In one embodiment, the opening (901) of the meander pattern (902) included in the conductive pattern (9) (see FIG. 8) can reduce the energy transmitted to the first antenna (51) due to electromagnetic coupling between the first antenna (51) and the second antenna (52). A comparative example not including the conductive pattern (9) will be described below with reference to FIG. 11, 12, 13, and 14.

[0119] FIG. 11 shows the electric field in the xy plane view of the antenna structure (1100) regarding the effect of the second antenna (52) on the first antenna (51) when a radiating current is provided to the second feed pattern (PP2) in the antenna structure (1100) of a comparative example that does not include a conductive pattern (9), for example. FIG. 12 shows the electric field in the yz plane cross-sectional view of the antenna structure (1100) regarding the effect of the second antenna (52) on the first antenna (51) when a radiating current is provided to the second feed pattern (PP2) (see FIG. 11) in the antenna structure (1100) of a comparative example, for example. FIG. 13 shows a magnetic field (H-field) in a cross-sectional view in the yz plane of an antenna structure (1100) regarding the effect of the second antenna (52) on the first antenna (51) when a radiating current is provided to the second feed pattern (PP2) (see FIG. 11) in the antenna structure (1100) of the comparative example, for example. FIG. 14 shows the flow of a surface current in an xy plane view of an antenna structure (1100) regarding the effect of the second antenna (52) on the first antenna (51) when a radiating current is provided to the second feed pattern (PP2) in the antenna structure (1100) of the comparative example, for example. The antenna structure (1100) of the comparative example is presented merely for comparison with the antenna structure (5) according to one embodiment, and the components included in the antenna structure (1100) of the comparative example should be understood as being included in the various embodiments presented in this document and do not have a prior status with respect to the various embodiments of this document.

[0120] Referring to FIGS. 11, 12, and 13, when a radiated current is provided to the second feed pattern (PP2), energy may be excited to the first antenna (51) due to electromagnetic coupling between the second antenna (52) and the first antenna (51). For example, there may be an energy component excited from the second feed pattern (PP2) of the second antenna (52) to the first feed pattern (PP1) of the first antenna (51) (e.g., see the part indicated by reference numeral '1101' in FIG. 11). For example, there may be an energy component excited from the second antenna element (②) of the second antenna (52) to the first antenna element (①) of the first antenna (51) (e.g., see the part indicated by reference numeral '1102' in FIG. 11). When a radiated current is provided in the second feed pattern (PP2), a surface current may flow as illustrated in FIG. 14. For example, when radio waves radiated from the second antenna (52) reach the first antenna (51), an alternating current may be excited and flow. As the radio waves encounter the first antenna (51) during their progression, they may momentarily convert virtually all of their energy into a current on the surface of the conductor as they reach the electrically conductive first antenna (51). This alternating surface current can generate radio waves (radiated energy) depending on the change in current. For example, when a radiated current is provided in the second feed pattern (PP2), the surface current formed due to the electromagnetic influence exerted by the second antenna (52) on the first antenna (51) can generate radio waves (radiated energy) at the edge of the first antenna element (①). Surface current and radio waves resulting from the electromagnetic influence of the second antenna (52) on the first antenna (51) can degrade the antenna radiation performance of the first antenna (51).

[0121] FIG. 15 shows the electric field in the xy plane of the antenna structure (5) regarding the effect of the second antenna (52) on the first antenna (51) when a radiating current is provided to the second feed pattern (PP2) in the antenna structure (5) according to one embodiment. FIG. 16 shows the electric field in the cross-sectional view of the xz plane of the antenna structure (5) regarding the effect of the second antenna (52) on the first antenna (51) when a radiating current is provided to the second feed pattern (PP2) (see FIG. 15) in the antenna structure (5) according to one embodiment. FIG. 17 shows the flow of surface current in the xy plane of the antenna structure (5) regarding the effect of the second antenna (52) on the first antenna (51) when a radiating current is provided to the second feed pattern (PP2) (see FIG. 15) in the antenna structure (5) according to one embodiment.

[0122] Referring to FIGS. 15, 16, and 17, an antenna structure (5) according to one embodiment can reduce the electromagnetic influence exerted by the second antenna (52) on the first antenna (51) due to a conductive pattern (9) electrically connected to a ground plane (e.g., the second conductive layer (702) of FIG. 10) compared to the antenna structure (1100) of the comparative example described with reference to FIGS. 11, 12, 13, and 14. An antenna structure (5) according to one embodiment can reduce the formation of energy (or surface current) excited to the first antenna (51) in the first antenna (51) due to electromagnetic coupling between the second antenna (52) and the first antenna (51) compared to the antenna structure (1100) of the comparative example. For example, when a radiated current is provided to the second feed pattern (PP2), the energy (or surface current) excited to the first antenna (51) due to electromagnetic coupling between the second antenna (52) and the first antenna (51) may be transferred to (or, transferred, excited, or induced to) the conductive pattern (9) due to electromagnetic coupling between the first antenna (51) and the conductive pattern (9) and absorbed in the ground plane. Because the conductive pattern (9) is electrically connected to the ground plane, the electromagnetic influence of the second antenna (52) on the first antenna (51) can be reduced, so that the isolation of the first antenna (51) from the second antenna (52) can be formed to a specified value or greater than a level that can secure antenna radiation performance.

[0123] According to one embodiment, the distance between the first antenna element (①) of the first antenna (51) and the second antenna element (②) of the second antenna (52) may be greater than the distance between the third antenna element (③) of the third antenna (53) and the second antenna element (②) of the second antenna (52). For example, the second antenna element (②) and the third antenna element (③) may be positioned apart from each other to have an isolation value of a specified value or greater than that which can secure antenna radiation performance. Referring to the electric field distribution illustrated in FIG. 16, when a radiating current is provided with a second feed pattern (PP2), the electromagnetic influence exerted by the second antenna (52) on the third antenna (53) may be smaller than the electromagnetic influence exerted by the second antenna (52) on the first antenna (51), or may be weak enough to secure antenna radiation performance. There may be energy (or surface current) excited to the third feed pattern (PP3) due to electromagnetic coupling between the second feed pattern (PP2) of the second antenna (52) and the third feed pattern (PP3) of the third antenna (53), but in one embodiment, a large portion (1501) (e.g., transformer line) of the third feed pattern (PP3) compared to other portions (see FIG. 15) may contribute to reducing the effect of the second antenna (52) on the third antenna (53) based on the phase difference of the current.

[0124] According to one embodiment, the opening (901) of the meander pattern (902) included in the conductive pattern (9) (see FIG. 8) can reduce the energy (or surface current) transferred to the first antenna (51) due to electromagnetic coupling between the first antenna (51) and the second antenna (52). This will be explained with reference to FIG. 18.

[0125] FIG. 18 shows the flow of surface current in the xy planar view of an antenna structure (5) when a radiated current is provided to a second feed pattern (PP2) (see FIG. 15) in an antenna structure (5) according to one embodiment.

[0126] Referring to FIG. 18, when a radiated current is provided to the second feed pattern (PP2), the surface current excited to the first antenna (51) due to electromagnetic coupling between the first antenna (51) and the second antenna (52) may be moved (or transferred, excited, or induced) to the conductive pattern (9) which is electrically connected to the second conductive layer (702) (e.g., ground plane) of the printed circuit board (7) due to electromagnetic coupling between the first antenna element (①) and the conductive pattern (9). In one embodiment, the surface current may flow relatively large along the surface of the opening (901) of the conductive pattern (9) or the surface around it. A surface current in the form of an alternating current flowing along the surface of the opening (901) or the surface around it may flow along the meander pattern (902) of the opening (901) (see FIG. 8) and may include, for example, a first current component, a second current component, and a third current component. The first current component may flow in a first direction of travel (e.g., -x axis direction) along a pattern extending in a first direction (e.g., x axis direction) of the meander pattern (902), as indicated by reference numeral '1801'. The second current component may flow in a second direction of travel (e.g., -y axis direction) along a pattern extending in a second direction (e.g., y axis direction) different from the first direction of the meander pattern (902), as indicated by reference numeral '1802'. The third current component may flow in a third direction of propagation (e.g., +y-axis direction) substantially opposite to the second direction of propagation, along a pattern extended in the second direction (e.g., y-axis direction) of the meander pattern (902), as indicated by the reference numeral '1803'. The first current component may emit first wave energy according to a change in current. The second current component may emit second wave energy according to a change in current. The third current component may emit third wave energy according to a change in current.The first wave energy, the second wave energy, and the third wave energy can be combined through cancellation and / or compensation based on the phase of the current. For example, the second wave energy based on the surface current in the second propagation direction and the third wave energy based on the surface current in the third propagation direction can be combined and substantially canceled out. The first wave energy based on the surface current in the first propagation direction can flow through a plurality of fourth conductive vias (V41, V42, V43, V44) (see FIG. 8) to the ground plane of the printed circuit board (7) (e.g., the second conductive layer (702) in FIG. 9) and be absorbed in the ground plane. If there is any uncanceled portion of the second wave energy or the third wave energy, it flows into the ground plane of the printed circuit board (7) through a plurality of fourth conductive vias (V41, V42, V43, V44) (see FIG. 8) and can be absorbed in the ground plane.

[0127] FIG. 19 shows the flow of surface current in a part of the antenna structure (5) when a radiated current is provided to the second feed pattern (PP2) (see FIG. 15) in the antenna structure (5) in another embodiment.

[0128] Referring to FIG. 19, the antenna structure (5) may include a plurality of fourth conductive vias (V41, V42, V43, V44) and a plurality of fifth conductive vias (V51, V52, V53). The plurality of fourth conductive vias (V41, V42, V43, V44) and the plurality of fifth conductive vias (V51, V52, V53) may electrically connect the conductive pattern (9) and the second conductive layer (702) (e.g., ground plane) of the printed circuit board (7). The plurality of fourth conductive vias (V41, V42, V43, V44) may be located adjacent to the first edge (B1) of the conductive pattern (9) and may be arranged in the y-axis direction. A plurality of fifth conductive vias (V51, V52, V53) may be positioned spaced apart from a plurality of fourth conductive vias (V41, V42, V43, V44) in the +x axis direction and arranged in the y axis direction. In one embodiment, a pattern (1901) extending in the y axis direction, which is positioned closest to the first edge (B1) of the conductive pattern (9) among the meander pattern (902) (see FIG. 8) of the opening (901), may be positioned between a plurality of fourth conductive vias (V41, V42, V43, V44) and a plurality of fifth conductive vias (V51, V52, V53) when viewed from above (e.g., in the -z axis direction) of a first surface (7A) (see FIG. 7) of the printed circuit board (7). Due to electromagnetic coupling between the first antenna (51) (see FIG. 7) and the second antenna (52) (see FIG. 7), the surface current excited to the first antenna (51) can be moved (or, transferred, excited, or induced) to the conductive pattern (9) and flow due to electromagnetic coupling between the first antenna (51) and the conductive pattern (9).The surface current flowing in the conductive pattern (9) flows to the second conductive layer (702) (e.g., ground plane) through a plurality of fourth conductive vias (V41, V42, V43, V44) and a plurality of fifth conductive vias (V51, V52, V53) and can be absorbed in the second conductive layer (702). In one embodiment, the embodiment of FIG. 19, which includes a plurality of fifth conductive vias (V51, V52, V53), can reduce the energy (or reflected energy or reflected energy component) returned from the first edge (B1) of the conductive pattern (9) and its surroundings compared to the embodiment of FIG. 8, which includes a plurality of fourth conductive vias (V41, V42, V43, V44). The illustrated example illustrates two rows of conductive vias (e.g., two rows of conductive via structures (1900)) comprising a plurality of fourth conductive vias (V41, V42, V43, V44) and a plurality of fifth conductive vias (V51, V52, V53), but in some embodiments, a conductive via structure comprising three or more rows of conductive vias may be implemented. The location or number of the fourth conductive vias or the fifth conductive vias may vary and is not limited to the illustrated example. In some embodiments, the plurality of fourth conductive vias or the plurality of fifth conductive vias may be located adjacent to the second edge (B2) or the fourth edge (B4) of the conductive pattern (9) and may be arranged in the x-axis direction. In some embodiments, a plurality of fourth conductive vias may be arranged in the x-axis direction adjacent to the second edge (B2) of the conductive pattern (9), and a plurality of fifth conductive vias may be arranged in the x-axis direction adjacent to the fourth edge (B4) of the conductive pattern (9).

[0129] FIG. 20 shows the flow of surface current in a part of the antenna structure (5) when a radiated current is provided to the second feed pattern (PP2) (see FIG. 15) in the antenna structure (5) in another embodiment.

[0130] Referring to FIG. 20, the antenna structure (5) may include a two-row conductive via structure (2000) (e.g., the two-row conductive via structure (1900) of FIG. 19) comprising a plurality of sixth conductive vias (V61, V62, V63, V64) and a plurality of seventh conductive vias (V71, V72, V73) that electrically connect the conductive pattern (9) and the second conductive layer (702) (e.g., ground plane). The conductive pattern (9) of FIG. 20 may include a portion (hereinafter, an extension) (2002) that is further extended in the -x axis direction from the two-row conductive via structure (2000) relative to the conductive pattern (9) of FIG. 19, as an example of a modification of the conductive pattern (9) of FIG. 19. The opening (901) may be extended to the extension (2002). In some embodiments, the extension (2002) may be implemented to include at least one conductive pattern. The extension (2002) may include a plurality of vias. Surface current excited to the first antenna (51) due to electromagnetic coupling between the first antenna (51) (see FIG. 7) and the second antenna (52) (see FIG. 7) may be moved (or transferred, excited, or induced) to flow in the conductive pattern (9) due to electromagnetic coupling between the first antenna (51) and the conductive pattern (9). Surface current flowing in the conductive pattern (9) may flow to the second conductive layer (702) (e.g., ground plane) through two rows of conductive via structures (2000) and be absorbed in the second conductive layer (702). Since surface current does not substantially flow in the extension (202) of the conductive pattern (9), energy (or radio waves) radiated through the extension (202) may not substantially occur.

[0131] FIG. 21 is a graph showing radiation characteristics (e.g., S-parameters) for a first antenna (51) when fed to a second antenna (52) in an antenna structure (5) (see FIG. 7) according to one embodiment, for example, and radiation characteristics for a first antenna (51) when fed to a second antenna (52) in an antenna structure (1100) (see FIG. 11) according to a comparative example.

[0132] Referring to FIGS. 7, 11, and 21, an antenna structure (5) according to one embodiment can improve the isolation of the first antenna (51) from the second antenna (52) compared to the antenna structure (1100) according to a comparative example, due to a conductive pattern (9) that is electrically connected to a ground plane (e.g., the second conductive layer (702) of FIG. 9) and electromagnetically coupled to the first antenna (51). For example, when the second antenna (52) is fed in the antenna structure (1100) according to the comparative example, the isolation of the first antenna (51) from the second antenna (52) in a specified or selected frequency band (or usage frequency band) (e.g., a band including usage frequencies of about 8 GHz to about 8.3 GHz) may be a peak value of about -7 dB, which is difficult to secure antenna radiation performance. For example, when fed to the second antenna (52) in an antenna structure (5) according to one embodiment, the isolation of the first antenna (51) for the second antenna (52) in a specified or selected frequency band (e.g., a band including a frequency of use of about 8 GHz) may be a specified value (e.g., about -15 dB) or a peak value of about -21 dB, which is a value greater than or equal to a value that can secure antenna radiation performance.

[0133] A conductive pattern (9) included in the antenna structure (5) may affect the resonance characteristics of the first antenna (51). In one embodiment, the effect of the conductive pattern (9) on the resonance characteristics of the first antenna (51) may be no more than to prevent the antenna radiation performance from substantially deviating from the desired level or range. For example, the resonance frequency of the first antenna element (①) (see FIG. 7) may be shifted up by about 50 MHz (see S11) or up by about 40 MHz (see S22) due to the conductive pattern (9), but may not deviate from the selected or designated frequency band. In some embodiments, at least one matching circuit (e.g., a frequency adjustment circuit implemented with various elements or conductive patterns) included in the antenna structure (5) may be further included, which is connected to a transmission line between the antenna structure (5) and a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). For example, a matching circuit included in the antenna structure (5) may be placed on a printed circuit board (7) (see FIG. 7) and electrically connected to a first electrical path (EP1). The matching circuit may contribute to the first antenna element (①) resonating substantially at the operating frequency. In some embodiments, a desired resonance characteristic (e.g., resonance frequency) may be formed by using a method of modifying (or adjusting) the shape of the first antenna element (①) in consideration of the influence of the conductive pattern (9).

[0134] According to one embodiment, since the conductive pattern (9) included in the antenna structure (5) can affect the resonance characteristics of the first antenna (51), the conductive pattern (9) may have an electrical length (e.g., a length expressed as a ratio of wavelengths) that can contribute to the first antenna element (①) (see FIG. 7) resonating at a substantially usable frequency. For example, the meander pattern (902) of the opening (901) included in the conductive pattern (9) may contribute to reducing the physical size (or physical length) of the conductive pattern (9) while maintaining the electrical length.

[0135] In one embodiment, referring to FIG. 8, when viewed from above (e.g., in the -z axis direction) on the first surface (7A) of the printed circuit board (7), the resonance characteristics of the first antenna (51) may vary depending on the degree to which the conductive pattern (9) overlaps with the first antenna element (①) (e.g., parameter sweep). For example, if the conductive pattern (9) is positioned in the +x axis direction differently from the example shown in FIG. 8, the first region (91) overlapping with the first antenna element (①) may be increased and the second region (92) not overlapping with the first antenna element (①) may be decreased, and the resonance frequency of the first antenna element (①) may be shifted to a high frequency. For example, if the conductive pattern (9) is positioned in the -x axis direction differently from the example shown in FIG. 8, the first region (91) that overlaps with the first antenna element (①) may be reduced and the second region (92) that does not overlap with the first antenna element (①) may be increased, and the resonant frequency of the first antenna element (①) may be shifted to a high frequency. When viewed from above on the first surface (7A) of the printed circuit board (7), the position in which the conductive pattern (9) is placed in the y-axis direction may be determined so that the first antenna (51) can resonate in a selected or designated frequency band.

[0136] FIGS. 22 and 23 show a radiation pattern relating to the antenna structure (5) of FIG. 7 according to one embodiment. FIGS. 24 and 25 show a radiation pattern relating to the antenna structure (11) of FIG. 11 according to a comparative example.

[0137] Referring to FIGS. 22, 23, 24, and 25, an antenna structure (11) according to one embodiment may have a radiation pattern (or beam pattern) (e.g., an omni-directional radiation pattern) that is radiated more widely and uniformly in space in the +z axis direction (e.g., the direction in which the rear (300B) of the electronic device (200) in FIG. 3 faces) compared to an antenna structure (1100) of a comparative example, due to a conductive pattern (9) that is electrically connected to the ground plane (e.g., the second conductive layer (702) in FIG. 9) to improve the isolation of the first antenna (51) from the second antenna (52). In an antenna structure (5) according to one embodiment, the main lobe may be formed at an angle of about 99.7 degrees with respect to the xy plane and may have a radiation energy value of about 4.77 dB. In the antenna structure (1100) according to the comparative example, the main lobe may be formed at an angle of about 75 degrees with respect to the xy plane and may have a radiation energy value of about 5.48 dB. The main lobe refers to a beam in which energy is relatively high in the maximum radiation direction (boresight) of the beam pattern, for example, and the antenna structure (5) may substantially transmit and / or receive a frequency signal through the main lobe. In the case of the antenna structure (5) according to one embodiment, at an operating frequency of about 8.2 GHz, the main lobe magnitude may be about -4.77 dBi and the 3 dB angular width may be about 99.7 degrees. In the case of the antenna structure (11) according to the comparative example of FIG. 25, at an operating frequency of about 8.2 GHz, the main lobe magnitude may be about -5.48 dBi and the 3 dB angular width may be about 16.0 degrees. An antenna structure (5) according to one embodiment can form a main lobe that can secure radio wave transmission and reception performance at the operating frequency compared to an antenna structure (1100) according to a comparative example.An antenna structure (5) according to one embodiment can have a more omnidirectional radiation pattern (or beam pattern) by improving the 3dB angular width, that is, the half power beam width, compared to the antenna structure (1100) according to the comparative example.

[0138] FIG. 26 is an xy plan view relating to a portion of a printed circuit board (see FIG. 7) included in an antenna structure (5) according to another embodiment. FIG. 27 is an xy plan view relating to a second conductive layer (2700) included in a printed circuit board (7) in relation to the embodiment of FIG. 26. FIG. 28 is an xy plan view relating to a second conductive layer (2800) included in a printed circuit board (7) in relation to the embodiment of FIG. 26 in another embodiment. FIG. 29 is an xy plan view relating to a second conductive layer (2900) included in a printed circuit board (7) in relation to the embodiment of FIG. 26 in another embodiment.

[0139] Referring to FIGS. 26 and 27, the antenna structure (5) may include a conductive pattern (9), a first antenna element (①), a first conductive via structure (or at least one first conductive via) (2601), a second conductive via structure (or at least one second conductive via) (2602), a second conductive layer (2700), and / or a switching circuit (2704). The conductive pattern (9), the first antenna element (①), the first conductive via structure (2601), the second conductive via structure (2602), and the second conductive layer (2700) may be included in a printed circuit board (7). The switching circuit (2704) may be located on a second surface of the printed circuit board (7) (e.g., the second surface (7B) of FIG. 7). When viewed from above on the first surface (7A) (e.g., in the -z axis direction), a portion of the conductive pattern (9) may overlap with the first antenna element (①). The first conductive via structure (2601) or the second conductive via structure (2602) may be formed in substantially the same manner as, for example, the two-column conductive via structure (1900) of FIG. 19 or the two-column conductive via structure (2000) of FIG. 20. In some embodiments, the first conductive via structure (2601) or the second conductive via structure (2602) may be modified into a one-column conductive via structure (see FIG. 8), a three-column conductive via structure, or a conductive via structure with more than one column. The second conductive layer (2700) differs in shape from the second conductive layer (702) of FIG. 9 and can be electrically connected to the conductive pattern (9) through the first conductive via structure (2601) and the second conductive via structure (2602). In one embodiment, the first conductive via structure (2601) may be located closer to the first antenna element (①) than the second conductive via structure (2602) when viewed from above the first surface (7A).

[0140] According to one embodiment, the second conductive layer (2700) may include a first conductive region (2701), a second conductive region (2702), a third conductive region (2703), a first path pattern (2711), a second path pattern (2712), and / or a third path pattern (2713). The first conductive region (2701), the second conductive region (2702), and the third conductive region (2703) may be physically separated. The first conductive region (or, first ground pattern) (2701) may be electrically connected to the conductive pattern (9) through a first conductive via structure (2601). The second conductive region (or, second ground pattern) (2702) may be electrically connected to the conductive pattern (9) through a second conductive via structure (2602). A first path pattern (2711) can electrically connect the switching circuit (2704) and the first conductive region (2701). A second path pattern (2712) can electrically connect the switching circuit (2704) and the second conductive region (2702). A third path pattern (2713) can electrically connect the switching circuit (2704) and the third conductive region (or, third ground pattern) (2703). The third conductive region (2703) is electrically connected to the ground included in the first substrate assembly (440) (see FIG. 4, 5, or 6) so as to have a substantial effect on the radiation performance of the antenna structure (5) or the electromagnetic shielding function for the antenna structure (5). The switching circuit (2704) can optionally electrically connect the third path pattern (2713) to the first path pattern (2711) or the second path pattern (2712) under the control of a processor (e.g., the processor (120) of FIG. 1). The antenna structure (5) can resonate at a first operating frequency (e.g., about 8 GHz) and a second operating frequency (e.g., about 6.5 GHz). The processor can control the switching circuit (2704) according to the frequency of the signal transmitted and / or received through the antenna structure (5).

[0141] According to one embodiment, when transmitting and / or receiving a signal of a first operating frequency (e.g., about 8 GHz) through an antenna structure (5), a switching circuit (2704) can electrically connect a third path pattern (2713) and a first path pattern (2711) under the control of a processor. When the third path pattern (2713) and the first path pattern (2711) are electrically connected by the switching circuit (2704), a first conductive region (2701) corresponding to a first conductive via structure (2601) can be electrically connected to a third conductive region (2703). When the conductive pattern (9) is electrically connected to the third conductive region (2703) through the first conductive via structure (2601), the isolation of the first antenna (51) from the second antenna (52) (see FIG. 7) can be formed to a specified value or greater than the level at which antenna radiation performance can be secured at the first operating frequency by means of the first electrical length at which the conductive pattern (9) acts electromagnetically on the first antenna (51) (see FIG. 7).

[0142] According to one embodiment, when transmitting and / or receiving a signal of a second operating frequency (e.g., about 6.5 GHz) through an antenna structure (5), a switching circuit (2704) can electrically connect a third path pattern (2713) and a second path pattern (2712) under the control of a processor. When the third path pattern (2713) and the second path pattern (2712) are electrically connected by the switching circuit (2704), a second conductive region (2702) corresponding to a second conductive via structure (2602) can be electrically connected to a third conductive region (2703). When the conductive pattern (9) is electrically connected to the third conductive region (2703) through the second conductive via structure (2602), the isolation of the first antenna (51) from the second antenna (52) (see FIG. 7) can be formed to a specified value or greater than the level at which antenna radiation performance can be secured at the second operating frequency by means of the second electrical length at which the conductive pattern (9) acts electromagnetically on the first antenna (51) (see FIG. 7).

[0143] According to some embodiments, the antenna structure (5) may include a conductive pattern (9), a first antenna element (①), a first conductive via structure (or at least one first conductive via) (2601), and a second conductive via structure (or at least one second conductive via) (2602). The second conductive layer (2700) may be electrically connected using the conductive pattern (9), the first antenna element (①), the first conductive via structure (2601), and the second conductive via structure (2602). Referring to FIG. 28, the second conductive layer (2800) may be formed in an integral form in which a third conductive region (2703) is physically connected to the first conductive region (2701) and the second conductive region (2702).

[0144] According to one embodiment, the second conductive layer (2700) may include a first conductive region (2701), a second conductive region (2702), and a third conductive region (2703). The first conductive region (2701), the second conductive region (2702), and the third conductive region (2703) may be physically separated. The first conductive region (or, first ground pattern) (2701) may be electrically connected to the conductive pattern (9) through a first conductive via structure (2601). The second conductive region (or, second ground pattern) (2702) may be electrically connected to the conductive pattern (9) through a second conductive via structure (2602). In the embodiment of FIG. 29, unlike the embodiment of FIG. 27, the first path pattern (2711), the second path pattern (2712), and the third path pattern (2713) may be omitted. According to the embodiment of FIG. 29, the first switching circuit (2901) may selectively electrically connect the first conductive region (2701) and the third conductive region (2703) under the control of a processor (e.g., the processor (120) of FIG. 1). According to the embodiment of FIG. 29, the second switching circuit (2902) may selectively electrically connect the second conductive region (2702) and the third conductive region (2703) under the control of a processor. In some embodiments, an all-switching circuit including a first switching circuit (2901) and a second switching circuit (2902) may be implemented, and the all-switching circuit may optionally electrically connect a third conductive region (2703) to the first conductive region (2701) or the second conductive region (2702) under the control of a processor.

[0145] According to one embodiment of the present document, an electronic device (e.g., the electronic device (200) of FIG. 2) may include a housing (e.g., the housing (300) of FIG. 2). The electronic device may include an antenna structure (e.g., the antenna structure (5) of FIG. 3) located within the housing. The antenna structure may include a printed circuit board (e.g., the printed circuit board (7) of FIG. 7). The printed circuit board may include a first surface (e.g., the first surface (7A) of FIG. 7) and a second surface opposite to the first surface (e.g., the second surface (7B) of FIG. 7). The antenna structure may include a conductive pattern (e.g., the conductive pattern (9) of FIG. 7) located inside the printed circuit board. The printed circuit board may include a first conductive layer (e.g., the first conductive layer (701) of FIG. 9). The first conductive layer may be positioned closer to the first surface than to the second surface. The first conductive layer may include a first antenna element (e.g., the first antenna element (①) in FIG. 7) and a second antenna element (e.g., the second antenna element (②) in FIG. 7) that do not overlap each other when viewed from above the first surface. The printed circuit board may include a second conductive layer (e.g., the second conductive layer (702) in FIG. 9) positioned closer to the second surface than to the first conductive layer. The second conductive layer may include a ground plane. The printed circuit board may include a dielectric (e.g., the dielectric (703) in FIG. 9) positioned between the first conductive layer and the second conductive layer. The conductive pattern may be electrically connected to the ground plane through one or more conductive vias included in the printed circuit board (e.g., a plurality of fourth conductive vias (V41, V42, V43, V44) of FIG. 8).The conductive pattern may be located between the first conductive layer and the second conductive layer and may be physically separated from the first conductive layer and the second conductive layer. The conductive pattern may overlap at least partially with the first antenna element when viewed from above the first surface. The conductive pattern may include an opening (e.g., the opening (901) of FIG. 8).

[0146] According to one embodiment of the present document, the opening (e.g., the opening (901) of FIG. 8) may be formed as a meander pattern (e.g., the meander pattern (902) of FIG. 8).

[0147] According to one embodiment of the present document, the conductive pattern (e.g., the conductive pattern (9) of FIG. 8) may include a first region (e.g., the first region (91) of FIG. 8) that overlaps with the first antenna element (e.g., the first antenna element (①) of FIG. 8) when viewed from above the first surface (e.g., the first surface (7A) of FIG. 7)) and a second region (e.g., the second region (92) of FIG. 8) that does not overlap with the first antenna element. The one or more conductive vias (e.g., a plurality of fourth conductive vias (V41, V42, V43, V44) of FIG. 8) may electrically connect the second region and the ground plane (e.g., the second conductive layer (702) of FIG. 9).

[0148] According to one embodiment of the present document, the opening (e.g., the opening (901) of FIG. 8) may extend from the second region (e.g., the second region (92) of FIG. 8) to the first region (e.g., the first region (91) of FIG. 8).

[0149] According to one embodiment of the present document, the printed circuit board (e.g., the printed circuit board (7) of FIG. 7) may further include a first electrical path (e.g., the first electrical path (EP1) of FIG. 7) for providing a radiated current to the first antenna element (e.g., the first antenna element (①) of FIG. 7)) and a second electrical path (e.g., the second electrical path (EP2) of FIG. 7) for providing a radiated current to the second antenna element (e.g., the second antenna element (②) of FIG. 7). The first electrical path and the second electrical path may extend between the first antenna element and the second antenna element when viewed from above the first surface (e.g., the first surface (7A) of FIG. 7).

[0150] According to one embodiment of the present document, the electronic device may further include a matching circuit located on the printed circuit board. The matching circuit may be electrically connected to the first electrical path (e.g., the first electrical path (EP1) of FIG. 7).

[0151] According to one embodiment of the present document, the one or more conductive vias may include at least one first conductive via (e.g., the first conductive via structure (2601) of FIG. 26) and at least one second conductive via (e.g., the second conductive via structure (2602) of FIG. 26). The at least one first conductive via may be located closer to the first antenna element (e.g., the first antenna element (①) of FIG. 26) than the at least one second conductive via when viewed from above the first surface (e.g., the first surface (7A) of FIG. 26).

[0152] According to one embodiment of the present document, the first distance (e.g., the first distance (D1) in FIG. 10) at which the conductive pattern (e.g., the conductive pattern (9) in FIG. 10) is spaced from the first antenna element (e.g., the first antenna element (①) in FIG. 10) in a first direction (e.g., the +z axis direction in FIG. 10) toward the first surface toward the second surface, may be greater than the second distance (e.g., the second distance (D2) in FIG. 10) at which the conductive pattern is spaced from the second conductive layer (e.g., the second conductive layer (702) in FIG. 10) in a second direction (e.g., the -z axis direction in FIG. 10) opposite to the first direction.

[0153] According to one embodiment of the present document, the antenna structure (e.g., antenna structure (5) of FIG. 7) may further include a switching circuit (e.g., switching circuit (2704) of FIG. 27) located on the printed circuit board (e.g., printed circuit board (7) of FIG. 7). The one or more conductive vias may include at least one first conductive via (e.g., first conductive via structure (2601) of FIG. 6) and at least one second conductive via (e.g., second conductive via structure (2062) of FIG. 6). The switching circuit may electrically connect the conductive pattern to the ground plane (e.g., third conductive region (2703) of FIG. 27) through the at least one first conductive via, or electrically connect the conductive pattern to the ground plane through the at least one second conductive via.

[0154] According to one embodiment of the present document, the electronic device may further include a processor (e.g., processor (120) of FIG. 1). The processor may control the switching circuit (e.g., switching circuit (2704) of FIG. 27) according to the frequency of the signal transmitted and / or received through the antenna structure (e.g., antenna structure (5) of FIG. 7).

[0155] According to one embodiment of the present document, the antenna structure (e.g., antenna structure (5) of FIG. 7) can transmit and / or receive signals in a frequency band related to UWB.

[0156] According to one embodiment of the present document, the electronic device may further include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) configured to transmit and / or receive a signal of a selected or specified frequency band through the antenna structure (e.g., the antenna structure (5) of FIG. 7). The electronic device may be configured to perform a positioning function for a signal source based on signals received through the first antenna element (e.g., the first antenna element (①) of FIG. 7) and the second antenna element (e.g., the second antenna element (②) of FIG. 7).

[0157] According to one embodiment of the present document, the printed circuit board (e.g., the printed circuit board (7) of FIG. 7) may further include a third antenna element (e.g., the third antenna element (③) of FIG. 7) included in the first conductive layer (e.g., the first conductive layer (701) of FIG. 9). When viewed from above the first surface (e.g., the first surface (7A) of FIG. 7), the first antenna element (e.g., the first antenna element (①) of FIG. 7) and the second antenna element (e.g., the second antenna element (②) of FIG. 7) may be aligned spaced apart in a first direction (e.g., the y-axis direction of FIG. 7), and the first antenna element and the third antenna element may be aligned spaced apart in a second direction (e.g., the x-axis direction of FIG. 7) perpendicular to the first direction. The conductive pattern (e.g., the conductive pattern (9) of FIG. 8) may include a first region (e.g., the first region (91) of FIG. 8) that overlaps with the first antenna element when viewed from above the first surface, and a second region (e.g., the second region (92) of FIG. 8) located between the first antenna element and the third antenna element.

[0158] According to one embodiment of the present document, the printed circuit board (e.g., the printed circuit board (7) of FIG. 7) may include a flexible printed circuit board.

[0159] According to one embodiment of the present document, the housing (e.g., the housing (300) of FIG. 2) may form a front surface of the electronic device (e.g., the front surface (300A) of FIG. 2), a rear surface of the electronic device (e.g., the rear surface (300B) of FIG. 3), and a side surface of the electronic device (e.g., the side surface (300C) of FIG. 3). The electronic device may further include a display located within the housing, and the display may be visually exposed through the front surface. The first surface (e.g., the first surface (7A) of FIG. 7) may face the rear surface.

[0160] According to one embodiment of the present document, an antenna structure (e.g., antenna structure (5) of FIG. 3) may include a printed circuit board (e.g., printed circuit board (7) of FIG. 7). The printed circuit board may include a first surface (e.g., first surface (7A) of FIG. 7) and a second surface opposite to the first surface (e.g., second surface (7B) of FIG. 7). The antenna structure may include a conductive pattern (e.g., conductive pattern (9) of FIG. 7) located inside the printed circuit board. The printed circuit board may include a first conductive layer (e.g., first conductive layer (701) of FIG. 9). The first conductive layer may be located closer to the first surface than to the second surface. The first conductive layer may include a first antenna element (e.g., the first antenna element (①) in FIG. 7) and a second antenna element (e.g., the second antenna element (②) in FIG. 7) that do not overlap each other when viewed from above the first surface. The printed circuit board may include a second conductive layer (e.g., the second conductive layer (702) in FIG. 9) located closer to the second surface than the first conductive layer. The second conductive layer may include a ground plane. The printed circuit board may include a dielectric (e.g., the dielectric (703) in FIG. 9) located between the first conductive layer and the second conductive layer. The conductive pattern may be electrically connected to the ground plane through one or more conductive vias (e.g., a plurality of fourth conductive vias (V41, V42, V43, V44) in FIG. 8) included in the printed circuit board. The conductive pattern may be located between the first conductive layer and the second conductive layer and may be physically separated from the first conductive layer and the second conductive layer. The conductive pattern may overlap at least partially with the first antenna element when viewed from above the first surface.The above conductive pattern may include an opening (e.g., the opening (901) of FIG. 8).

[0161] According to one embodiment of the present document, the opening (e.g., the opening (901) of FIG. 8) may be formed as a meander pattern (e.g., the meander pattern (9020) of FIG. 8).

[0162] According to one embodiment of the present document, the conductive pattern (e.g., the conductive pattern (9) of FIG. 8) may include a first region (e.g., the first region (91) of FIG. 8) that overlaps with the first antenna element (e.g., the first antenna element (①) of FIG. 8) when viewed from above the first surface (e.g., the first surface (7A) of FIG. 8)) and a second region (e.g., the second region (92) of FIG. 8) that does not overlap with the first antenna element. The one or more conductive vias (e.g., a plurality of fourth conductive vias (V41, V42, V43, V44) of FIG. 8) may electrically connect the second region and the ground plane (e.g., the second conductive layer (702) of FIG. 9).

[0163] According to one embodiment of the present document, the opening (e.g., the opening (901) of FIG. 8) may extend from the second region (e.g., the second region (92) of FIG. 8) to the first region (e.g., the first region (91) of FIG. 8).

[0164] According to one embodiment of the present document, the printed circuit board (e.g., the printed circuit board (7) of FIG. 7) may further include a first electrical path (e.g., the first electrical path (EP1) of FIG. 7) for providing a radiated current to the first antenna element (e.g., the first antenna element (①) of FIG. 7)) and a second electrical path (e.g., the second electrical path (EP2) of FIG. 7) for providing a radiated current to the second antenna element (e.g., the second antenna element (②) of FIG. 7). The first electrical path and the second electrical path may extend between the first antenna element and the second antenna element when viewed from above the first surface (e.g., the first surface (7A) of FIG. 7).

[0165] The embodiments disclosed in this document and drawings are provided merely as specific examples to facilitate the explanation of the technical content and to aid in understanding the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of the various embodiments of this document should be interpreted to include modified or altered forms in addition to the embodiments disclosed herein. Explanation of the symbols

[0167] 5: Antenna structure 7: Printed circuit board 7A: Page 1 7B: Side 2 51: First antenna 52: Second Antenna 53: Third Antenna ①: First antenna element EP1: First Electrical Path ②: Second antenna element EP2: Second Electrical Path ③: Third antenna element EP3: Third Electrical Path 9: Challenging Patterns

Claims

Claim 1 An electronic device comprises: a housing; an antenna structure including a printed circuit board located within the housing and comprising a first surface and a second surface opposite to the first surface, and a conductive pattern located within the printed circuit board, wherein the printed circuit board comprises: a first conductive layer including a first antenna element and a second antenna element located closer to the first surface than to the second surface and not overlapping each other when viewed from above the first surface; and a second conductive layer including a ground plane located closer to the second surface than to the first conductive layer. An electronic device comprising a dielectric located between the first conductive layer and the second conductive layer, wherein the conductive pattern is electrically connected to the ground plane through one or more conductive vias included in the printed circuit board, is located between the first conductive layer and the second conductive layer, is physically separated from the first conductive layer and the second conductive layer, and, when viewed from above the first surface, overlaps at least partially with the first antenna element and includes an opening. Claim 2 In claim 1, the opening is an electronic device formed in a meander-shaped pattern. Claim 3 In claim 1, the conductive pattern comprises, when viewed from above the first surface, a first region that overlaps with the first antenna element and a second region that does not overlap with the first antenna element, the one or more conductive vias electrically connect the second region and the ground plane, and the opening extends from the second region to the first region, an electronic device. Claim 4 In claim 1, the printed circuit board further comprises a first electrical path for providing a radiated current to the first antenna element and a second electrical path for providing a radiated current to the second antenna element, wherein the first electrical path and the second electrical path are an electronic device extending between the first antenna element and the second antenna element when viewed from above the first surface. Claim 5 An electronic device according to claim 1, wherein the one or more conductive vias include at least one first conductive via and at least one second conductive via, and the at least one first conductive via is located closer to the first antenna element than the at least one second conductive via when viewed from above the first surface. Claim 6 An electronic device according to claim 1, wherein the first distance at which the conductive pattern is spaced from the first antenna element in a first direction toward the first surface toward the second surface is greater than the second distance at which the conductive pattern is spaced from the second conductive layer in a second direction opposite to the first direction. Claim 7 The electronic device according to claim 1, wherein the antenna structure further comprises a switching circuit located on the printed circuit board, and the one or more conductive vias comprise at least one first conductive via and at least one second conductive via, and the switching circuit electrically connects the conductive pattern to the ground plane through the at least one first conductive via or electrically connects the conductive pattern to the ground plane through the at least one second conductive via, and the electronic device further comprises a processor configured to control the switching circuit according to the frequency of a signal transmitted or received through the antenna structure. Claim 8 An electronic device according to claim 1, further comprising: a wireless communication circuit configured to transmit or receive a signal of a selected or designated frequency band through the antenna structure; and a processor electrically connected to the wireless communication circuit, wherein the processor is configured to perform a positioning function for a signal source based on signals received through the first antenna element and the second antenna element. Claim 9 An electronic device according to claim 1, wherein the printed circuit board further comprises a third antenna element included in the first conductive layer, and when viewed from above the first surface, the first antenna element and the second antenna element are aligned spaced apart in a first direction, and the first antenna element and the third antenna element are aligned spaced apart in a second direction perpendicular to the first direction, and the conductive pattern comprises, when viewed from above the first surface, a first region overlapping with the first antenna element and a second region located between the first antenna element and the third antenna element. Claim 10 In claim 1, the housing forms the front surface of the electronic device, the rear surface of the electronic device, and the side surface of the electronic device, and further comprises a display positioned within the housing and visually exposed through the front surface, and the first surface of the electronic device facing the rear surface. Claim 11 delete Claim 12 delete Claim 13 delete Claim 14 delete Claim 15 delete Claim 16 delete Claim 17 delete Claim 18 delete Claim 19 delete Claim 20 delete

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