Electronic device including antenna

Abstract

According to one embodiment of the present document, an electronic device comprises: a housing forming the front surface of the electronic device, the rear surface of the electronic device, and the side surface of the electronic device; a printed circuit board comprising a first surface facing the front surface and a second surface facing in a direction opposite to the first surface; at least one antenna element positioned on the first surface or positioned inside the printed circuit board closer to the first surface than the second surface; an antenna structure positioned in the internal space of the housing; and a support member on which the antenna structure is disposed and coupled to the housing, wherein the support member on which the antenna structure is disposed is inserted into a recess formed in a side wall forming the side surface of the housing, and the side wall comprises a connection portion formed along the edge of the front plate to which a front plate forming the front surface of the housing is coupled and which overlaps with the front plate when viewed from above the front surface, and a non-conductive portion included in the connection portion is positioned between the first surface and the front plate, overlaps with the at least one element when viewed from above the front surface, and faces the first surface among the surfaces forming the recess. At least three sides are formed, and the support member may include a first support member inserted into a groove formed in the non-conductive portion. Various other embodiments may be possible.

Description

Technology Field

[0001] Various embodiments of this document relate to electronic devices including antennas. Background Technology

[0003] With the advancement of wireless communication technology, electronic devices are being universally used in daily life, leading to an increasing trend in content usage. This rapid increase in content usage may necessitate the expansion of network processing capacity. Electronic devices include multiple antennas to support various communication technologies. The problem to be solved

[0005] As the range of available applications expands for electronic devices such as smartphones, the number of antennas included in these devices is increasing. While electronic devices are becoming slimmer, the addition of components for various functions is making it increasingly difficult to position antennas within limited spaces while minimizing electrical interference with various internal elements and ensuring radiation performance or coverage (or communication range) for the desired frequency band.

[0006] Various embodiments of this document may provide an electronic device including an antenna for securing antenna radiation performance or coverage in a limited antenna design space.

[0007] Various embodiments of the present invention may provide an electronic device including an antenna for improving or securing antenna radiation performance or securing coverage in a limited antenna design space. means of solving the problem

[0009] According to one embodiment of the present document, an electronic device comprises: a housing forming the front surface of the electronic device, the rear surface of the electronic device, and the side surface of the electronic device; a printed circuit board comprising a first surface facing the front surface and a second surface facing in a direction opposite to the first surface; at least one antenna element positioned on the first surface or positioned inside the printed circuit board closer to the first surface than the second surface; an antenna structure positioned in the internal space of the housing; and a support member on which the antenna structure is disposed and coupled to the housing, wherein the support member on which the antenna structure is disposed is inserted into a recess formed in a side wall forming the side surface of the housing, and the side wall comprises a connection portion formed along the edge of the front plate to which a front plate forming the front surface of the housing is coupled and which overlaps with the front plate when viewed from above the front surface, and a non-conductive portion included in the connection portion is positioned between the first surface and the front plate, overlaps with the at least one element when viewed from above the front surface, and faces the first surface among the surfaces forming the recess. At least three sides are formed, and the support member may include a first support member inserted into a groove formed in the non-conductive portion.

[0010] According to one embodiment of the present document, an electronic device comprises: a housing forming the front surface of the electronic device, the rear surface of the electronic device, and the side surface of the electronic device; a printed circuit board comprising a first surface facing the front surface, a second surface facing in a direction opposite to the first surface, a first side facing the side surface of the electronic device, a second side positioned opposite to the first side surface, and a third side and a fourth side positioned perpendicular to the first side surface and opposite to each other; and at least one antenna element positioned on the first surface or positioned inside the printed circuit board closer to the first surface than the second surface, an antenna structure positioned in the internal space of the housing, and a support member in which the antenna structure is disposed and coupled to the housing, wherein the support member in which the antenna structure is disposed is inserted into a recess formed in a side wall forming the side surface of the electronic device in the housing, the side wall comprises a connection portion formed along the edge of the front plate to which a front plate forming the front surface of the housing is coupled and which overlaps with the front plate when viewed from above the front surface, and the connection portion The non-conductive portion is located between the first surface and the front plate, overlaps with at least one element when viewed from above on the front surface, and forms at least a third surface facing the first surface among the surfaces forming the recess, and the support member includes a first support portion located facing the third side or the fourth side, and a portion of the first support portion protrudes with respect to the first surface and can be inserted into a groove formed in the non-conductive portion in the form of a notch when viewed from above on the front surface. Effects of the invention

[0012] An electronic device including an antenna according to various embodiments of the present invention can facilitate the expansion of the display area by reducing the bezel area surrounding the display area on the front of the electronic device, and can secure radiation performance for the antenna forming a beam that transmits the bezel area.

[0013] Furthermore, other effects that can be obtained or predicted by the various embodiments of this document will be disclosed directly or implicitly in the detailed description of the embodiments of this document. For example, various effects predicted according to the various embodiments of this document will be disclosed in the detailed description that follows. Brief explanation of the drawing

[0015] FIG. 1 is a block diagram of an electronic device in a network environment in one embodiment. FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication in one embodiment. FIGS. 3 and 4 are perspective views relating to an electronic device according to one embodiment. FIG. 5 is an exploded view of a part of an electronic device in one embodiment. FIGS. 6 and 7 illustrate an antenna module included in an antenna module assembly according to one embodiment. FIGS. 8 and 9 illustrate an antenna module assembly in one embodiment. FIG. 10 is a drawing for illustrating the manufacturing flow regarding a case in one embodiment. FIG. 11 illustrates a state in which an antenna module assembly is separated from a case in one embodiment. FIGS. 12 and 13 illustrate, in one embodiment, a state in which an antenna module assembly is coupled to a case. FIG. 14 illustrates an antenna module assembly separated from a case according to another embodiment. FIG. 15 illustrates, for example, an antenna module assembly coupled to a case. FIG. 16 illustrates the cross-sectional structure of the yz plane with respect to the DD' line in FIG. 3 in one embodiment. FIG. 17 illustrates the cross-sectional structure of the yz plane for the DD' line in FIG. 3 in another embodiment. Specific details for implementing the invention

[0016] Hereinafter, various embodiments of this document are described with reference to the attached drawings.

[0017] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) in one embodiment.

[0018] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0019] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0020] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0021] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0022] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0023] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0024] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0025] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0026] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0027] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0028] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0029] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0030] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0031] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0032] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0033] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0035] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0036] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0037] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0038] At least some of the above components are connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., commands or data) with each other.

[0039] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0040] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0041] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., via wire), wirelessly, or through a third component.

[0042] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0043] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0044] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0045] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding components among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0046] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order).

[0047] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0048] FIG. 2 is a block diagram (200) of an electronic device (101) for supporting legacy network communication and 5G network communication in one embodiment.

[0049] Referring to FIG. 2, the electronic device (101) may include a first communication processor (212), a second communication processor (214), a first RFIC (radio frequency integrated circuit) (222), a second RFIC (224), a third RFIC (226), a fourth RFIC (228), a first radio frequency front end (RFFE) (232), a second RFFE (234), a first antenna module (242), a second antenna module (244), or an antenna (248). The electronic device (101) may further include a processor (120) and a memory (130). The network (199) may include a first network (292) and a second network (294). According to another embodiment, the electronic device (101) may further include at least one of the components described in FIG. 1, and the network (199) may further include at least one other network. According to one embodiment, a first communication processor (212), a second communication processor (214), a first RFIC (222), a second RFIC (224), a fourth RFIC (228), a first RFFE (232), and a second RFFE (234) may form at least a part of a wireless communication module (192). According to another embodiment, the fourth RFIC (228) may be omitted or included as part of a third RFIC (226).

[0050] The first communication processor (212) can establish a communication channel in a band to be used for wireless communication with the first network (292), and support legacy network communication through the established communication channel. According to various embodiments, the first network may be a legacy network including a second generation (2G), third generation (3G), fourth generation (4G), or long term evolution (LTE) network. The second communication processor (214) can establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second network (294), and support 5G network communication through the established communication channel. According to various embodiments, the second network (294) may be a fifth generation (5G) network as defined by 3GPP. Additionally, according to one embodiment, the first communication processor (212) or the second communication processor (214) may support the establishment of a communication channel corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second network (294), and 5G network communication through the established communication channel. According to one embodiment, the first communication processor (212) and the second communication processor (214) may be implemented within a single chip or a single package. According to various embodiments, the first communication processor (212) or the second communication processor (214) may be formed within a single chip or a single package with the processor (120), the auxiliary processor (123), or the communication module (190).

[0051] The first RFIC (222) can convert a baseband signal generated by the first communication processor (212) during transmission into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first network (292) (e.g., legacy network). During reception, the RF signal is acquired from the first network (292) (e.g., legacy network) through an antenna (e.g., first antenna module (242)) and can be preprocessed through an RFFE (e.g., first RFFE (232)). The first RFIC (222) can convert the preprocessed RF signal into a baseband signal so that it can be processed by the first communication processor (212).

[0052] The second RFIC (224) can convert a baseband signal generated by the first communication processor (212) or the second communication processor (214) into an RF signal of the Sub6 band (e.g., about 6 GHz or less) used in the second network (294) (e.g., 5G network) (hereinafter, 5G Sub6 RF signal). When receiving, the 5G Sub6 RF signal is acquired from the second network (294) (e.g., 5G network) through an antenna (e.g., the second antenna module (244)) and can be preprocessed through an RFFE (e.g., the second RFFE (234)). The second RFIC (224) can convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by the corresponding communication processor among the first communication processor (212) or the second communication processor (214).

[0053] The third RFIC (226) can convert a baseband signal generated by the second communication processor (214) into an RF signal of the 5G Above6 band (e.g., approximately 6 GHz to approximately 60 GHz) to be used in the second network (294) (e.g., 5G network) (hereinafter, 5G Above6 RF signal). Upon reception, the 5G Above6 RF signal may be acquired from the second network (294) (e.g., 5G network) through an antenna (e.g., antenna (248)) and preprocessed through the third RFFE (236). The third RFIC (226) can convert the preprocessed 5G Above6 RF signal into a baseband signal so that it can be processed by the second communication processor (214). According to one embodiment, the third RFFE (236) may be formed as part of the third RFIC (226).

[0054] According to one embodiment, the electronic device (101) may include a fourth RFIC (228) separately from or at least as part of the third RFIC (226). In this case, the fourth RFIC (228) may convert a baseband signal generated by the second communication processor (214) into an RF signal (hereinafter referred to as an IF signal) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the IF signal to the third RFIC (226). The third RFIC (226) may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second network (294) (e.g., a 5G network) through an antenna (e.g., antenna (248)) and converted into an IF signal by the third RFIC (226). The fourth RFIC (228) can convert the IF signal into a baseband signal so that the second communication processor (214) can process it.

[0055] According to one embodiment, the first RFIC (222) and the second RFIC (224) may be implemented as at least part of a single chip or a single package. According to one embodiment, the first RFFE (232) and the second RFFE (234) may be implemented as at least part of a single chip or a single package. According to one embodiment, at least one of the first antenna module (242) or the second antenna module (244) may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

[0056] According to one embodiment, the third RFIC (226) and the antenna (248) may be placed on the same substrate to form a third antenna module (246). For example, a wireless communication module (192) or a processor (120) may be placed on a first substrate (e.g., a main PCB). In this case, the third RFIC (226) may be placed on a portion of a second substrate (e.g., a sub PCB) separate from the first substrate (e.g., a bottom surface), and the antenna (248) may be placed on another portion of a second substrate (e.g., a sub PCB) to form a third antenna module (246). By placing the third RFIC (226) and the antenna (248) on the same substrate, it is possible to reduce the length of the transmission line between them. This can reduce the loss (e.g., attenuation) of signals in the high-frequency band (e.g., about 6 GHz to about 60 GHz) used for 5G network communication by the transmission line. As a result, the electronic device (101) can improve the quality or speed of communication with the second network (294) (e.g., 5G network).

[0057] According to one embodiment, the antenna (248) may be formed as an antenna array comprising a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC (226) may include a plurality of phase shifters (238) corresponding to the plurality of antenna elements, for example, as part of the third RFFE (236). During transmission, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device (101) (e.g., a base station of a 5G network) through the corresponding antenna element. During reception, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal received from the outside through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device (101) and the outside.

[0058] The second network (294) (e.g., 5G network) may be operated independently of the first network (292) (e.g., legacy network) (e.g., Stand-Alone (SA)) or connected to it (e.g., Non-Stand Alone (NSA)). For example, the 5G network may only have an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device (101) can access the access network of the 5G network and then access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., evolved packed core (EPC)). Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in memory (230) and can be accessed by other parts (e.g., processor (120), first communication processor (212), or second communication processor (214)).

[0059] FIGS. 3 and 4 are drawings of an electronic device (3) according to one embodiment viewed from various directions.

[0060] Referring to FIGS. 3 and 4, an electronic device (3) (e.g., electronic device (101) of FIG. 1) may include a housing (30) that forms the exterior of the electronic device (3). The housing (30) may include, for example, a front (30A) of the electronic device (3), a rear (30B) of the electronic device (3), and a side (30C) of the electronic device (3) that surrounds the space between the front (30A) and the rear (30B). In some embodiments, the housing (30) may refer to a structure (e.g., a housing structure) that forms at least some of the front (30A), the rear (30B), and the side (30C). In various embodiments of this document, for convenience of explanation, the direction in which the display (301) included in the electronic device (3) is visually exposed is defined as the front (30A) of the electronic device (3), and the opposite direction is defined as the rear (30B) of the electronic device (3).

[0061] According to one embodiment, the housing (30) may include a front plate (31), a rear plate (32), and / or a side member (33). The front (30A) of the electronic device (3) may be formed at least partially by the front plate (31). The front plate (31) may be substantially transparent and may include, for example, a glass plate or a polymer plate including various coating layers. The rear (30B) of the electronic device (3) may be formed at least partially by the rear plate (32). The rear plate (32) may be substantially opaque. The rear plate (32) may be formed, for example, by coated or colored glass, ceramic, polymer, metal, or a combination of at least two of the materials. As another example, the rear plate (32) may include aluminum, an aluminum alloy, magnesium, a magnesium alloy, or an alloy including iron (e.g., stainless steel). The side member (33) may surround at least partially the space between the front plate (31) and the rear plate (32). The side (30C) of the electronic device (3) may be formed at least partially by a side member (33). In some embodiments, the side member (33) may be referred to as a 'side bezel structure' or 'bezel structure' as an element that substantially forms the side (30C) of the electronic device (3). The side member (33) may comprise, for example, a metal and / or a polymer. The side member (33) may be joined to the front plate (31) and the rear plate (32). For example, the side member (333) may be joined to the front plate (31) or the rear plate (32) by mechanical fastening using a mechanical fastening element such as a screw or by bonding using an adhesive material.

[0062] According to some embodiments, the rear plate (32) and the side member (33) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum and / or a non-metallic material such as a polymer). The structure (or housing structure) in which the rear plate (32) and the side member (33) are formed integrally may be referred to, for example, as a 'case'. The part of the case forming the rear (30B) of the electronic device (3) is not limited to the term 'rear plate' and may be referred to by various other terms such as 'bottom' or 'rear part'. The part of the case forming the side (30C) of the electronic device (3) is not limited to the term 'side member' and may be referred to by various other terms such as 'side wall', 'side', 'border', or 'side part'.

[0063] According to one embodiment, the side member (33) may include a first side wall (331), a second side wall (332), a third side wall (333), and / or a fourth side wall (334). When viewed from above on the front (30A) of the electronic device (3) (e.g., in the -z axis direction), the first side wall (331) and the second side wall (332) may be positioned spaced apart from each other in a first direction (e.g., in the y axis direction) and may be substantially parallel in a second direction (e.g., in the x axis direction) that is orthogonal to the first direction. The third side wall (333) may connect one end of the first side wall (331) and one end of the second side wall (332) and may be perpendicular to the first side wall (331) or the second side wall (332) when viewed from above on the front (30A) of the electronic device (3). The fourth side wall (334) can connect the other end of the first side wall (331) and the other end of the second side wall (332), and when viewed from above on the front (30A) of the electronic device (3), it can be perpendicular to the first side wall (331) or the second side wall (332) and substantially parallel to the third side wall (333). The first side wall (331) can form the first side of the side (30C) of the electronic device (3), and the second side wall (332) can form the second side of the side (30C) of the electronic device (3). The third side wall (333) can form the third side of the side (30C) of the electronic device (3), and the fourth side wall (334) can form the fourth side of the side (30C) of the electronic device (3). The first corner (C1), where the first side wall (331) and the third side wall (333) are connected, may be formed in a curved shape that seamlessly connects the first side and the third side. The second corner (C2), where the second side wall (332) and the third side wall (333) are connected, may be formed in a curved shape that seamlessly connects the second side and the third side. The third corner (C3), where the second side wall (332) and the fourth side wall (334) are connected, may be formed in a curved shape that seamlessly connects the second side and the fourth side.The fourth corner (C4), to which the first side wall (331) and the fourth side wall (334) are connected, can be formed in a curved shape that seamlessly connects the first side and the fourth side.

[0064] According to one embodiment, the electronic device (3) may include a display (301), a first audio module (302), a plurality of second audio modules (303), a first camera module (304), a plurality of second camera modules (305), a light-emitting module (306), a sensor module (307), a plurality of input modules (308), a first connection terminal module (309), a second connection terminal module (310), or a pen input device (311). In some embodiments, the electronic device (3) may omit at least one of the components or additionally include other components.

[0065] The display (301) may be located in the internal space of the housing (30), and the display area (e.g., screen display area or active area) (3011) of the display (301) may be visually exposed through the front plate (31). In one embodiment, the electronic device (3) may be implemented so that the display area (3011) visible through the front plate (31) appears as large as possible (e.g., large screen or full screen). For example, the display (301) may be implemented to have an outline that is generally the same shape as the outline of the front plate (31). In another example, the gap between the outline of the display (301) and the outline of the front plate (31) may be formed to be generally the same. In one embodiment, the display (301) may include a touch detection circuit. In some embodiments, the display (301) may include a pressure sensor capable of measuring the intensity (pressure) of the touch. In some embodiments, the display (301) may be combined with or positioned adjacent to a digitizer (e.g., an electromagnetic induction panel) that detects a magnetic field-type electronic pen (e.g., a stylus pen).

[0066] The first audio module (302) may include, for example, a microphone located in the internal space of the housing (30), and a microphone hole formed on the rear (30B) corresponding to the microphone. The location or number of the audio module with respect to the microphone may vary and is not limited to the illustrated example. In some embodiments, the electronic device (3) may include a plurality of microphones used to detect the direction of sound.

[0067] A plurality of second audio modules (303) may include, for example, a speaker located in the internal space of the housing (30), and a speaker hole formed on the side (30C) corresponding to the speaker. The location or number of the second audio modules may vary and is not limited to the illustrated example. In some embodiments, the microphone hole and the speaker hole may be implemented as a single hole. In some embodiments, the second audio module may include a piezo speaker with the speaker hole omitted.

[0068] A first camera module (304) (e.g., a front camera module) may be located in the internal space of the housing (30), for example, corresponding to the front (30A). A plurality of second camera modules (305) (e.g., rear camera modules) may be located in the internal space of the housing (30), for example, corresponding to the rear (30B). The first camera module (304) and / or the plurality of second camera modules (305) may include one or more lenses, an image sensor, and / or an image signal processor. The location or number of the first camera module or the second camera module may vary and is not limited to the illustrated example.

[0069] According to one embodiment, the first camera module (304) may be located in the internal space of the housing (30) corresponding to the bezel area (B) of the front plate (31). The bezel area (B) may be a portion of the front plate (31) that does not overlap with the display area (3011) when viewed from above (e.g., in the -z axis direction) of the front (30A) of the electronic device (3). The bezel area (B) may be formed in a shape that surrounds the display area (3011) when viewed from above (e.g., a rectangular annular shape when viewed from above the front (30A)). In one embodiment, the bezel area (B) may include a first bezel area (B1), a second bezel area (B2), a third bezel area (B3), and / or a fourth bezel area (B4). The first bezel area (B1) may be located adjacent to the first side wall (331) in correspondence with the first side wall (331). The second bezel area (B2) may be located adjacent to the second side wall (332) in correspondence with the second side wall (332). The third bezel area (B3) may be located adjacent to the third side wall (333) in correspondence with the third side wall (333). The fourth bezel area (B4) may be located adjacent to the fourth side wall (334) in correspondence with the fourth side wall (334). In one embodiment, the first camera module (304) may be located in the internal space of the housing (30) corresponding to the first bezel area (B1), and the first bezel area (B1) may include a first transparent area (or a first light-transmitting area) corresponding to the first camera module (304). External light may pass through the first transparent area of ​​the bezel area (B) and reach the first camera module (304).

[0070] According to some embodiments, the display area (3011) may be implemented as large as possible so that the bezel area (B) is reduced or substantially absent differently from the illustrated example. If the first bezel area (B1) is implemented as reduced or substantially absent differently from the illustrated example, the first camera module (304) may be located below or beneath the display area (3011). Functions associated with the first camera module (304) (e.g., image capture) may be performed without the location of the first camera module (304) being visually distinguishable (or exposed). For example, the first camera module (304) may be located on the back of the display area (3011) or below the display area (3011) and may include a hidden display back camera (e.g., under display camera (UDC)). In some embodiments, the first camera module (304) may be positioned aligned with a recess formed on the back of the display area (3011). The first camera module (304) is positioned to overlap the display area (3011) so as to acquire an image of an external subject without being visually exposed to the outside. The first camera module (304) and at least a portion of the display area (3011) that overlaps with it may include a different pixel structure and / or wiring structure compared to other areas. For example, the first camera module (304) and at least a portion of the display area (3011) that overlaps with it may have a different pixel density compared to other areas. The pixel structure and / or wiring structure formed in the portion of the first camera module (304) and at least a portion of the display area (3011) that overlaps with it may reduce light loss between the outside and the first camera module (304). In some embodiments, pixels may not be placed in the portion of the first camera module (304) and at least a portion of the display area (3011) that overlaps with it.In some embodiments, the display area (3011) may include a first opening aligned with the first camera module (304). External light may pass through the front plate (31) and the first opening of the display area (3011) to reach the first camera module (304). The first opening formed in the display area (3011) may be formed, for example, in the form of a through hole or a notch.

[0071] According to some embodiments, the electronic device (3) may further include a light-emitting module (or light source) (not shown) located in the internal space of the housing (30) corresponding to the front (30A). The light-emitting module may, for example, provide state information of the electronic device (3) in the form of light. In some embodiments, the light-emitting module may provide a light source that is coupled with the operation of the first camera module (304). The light-emitting module may include, for example, an LED, an IR LED, or a xenon lamp.

[0072] According to one embodiment, a plurality of second camera modules (305) may have different attributes (e.g., angle of view) or functions and may include, for example, a dual camera or a triple camera. The plurality of second camera modules (305) may include a plurality of camera modules including lenses having different angles of view, and the electronic device (3) may control the change of the angle of view of the camera module performed in the electronic device (3) based on the user's selection. The plurality of second camera modules (305) may include at least one of, for example, a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (e.g., a TOF (time of flight) camera, a structured light camera). In some embodiments, the IR camera may operate as at least part of the sensor module. A light-emitting module (306) (e.g., a flash) may include a light source for the plurality of second camera modules (305). The light-emitting module (306) may include, for example, an LED or a xenon lamp.

[0073] In one embodiment, when viewed from above on the rear (30B) (e.g., in the +z axis direction), a plurality of second camera modules (305), a first audio module (302), or a light-emitting module (306) may be positioned closer to the first side wall (331) than to the second side wall (332), and closer to the fourth side (334) than to the third side wall (333). A plurality of second camera modules (305), a first audio module (302), and a light-emitting module (306) may be arranged in a direction (e.g., in the +x axis direction) from the third side wall (333) to the fourth side wall (334) when viewed from above on the rear (30B). A first audio module (302) may be positioned between a plurality of second camera modules (305) and a light-emitting module (306) when viewed from above on the rear (30B).

[0074] The sensor module (307) can generate an electrical signal or data value corresponding to, for example, an internal operating state of the electronic device (3) or an external environmental state. In one embodiment, the sensor module (307) may include an optical sensor located in the internal space of the housing (30) corresponding to the front (30A). The optical sensor may include, for example, a proximity sensor or an illuminance sensor. The optical sensor may be located in the internal space of the housing (30) corresponding to the bezel area (B) of the front plate (31). In one embodiment, the optical sensor may be located within the housing (30) corresponding to the first bezel area (B1), and the first bezel area (B1) may include a second transparent area (or a second light-transmitting area) corresponding to the optical sensor. External light may pass through the second transparent area of ​​the bezel area (B) and reach the optical sensor. A first transparent area corresponding to the first camera module (304) in the first bezel area (B1) and a second transparent area corresponding to the sensor module (307) in the first bezel area (B1) may be located adjacent to each other. The remaining area of ​​the first bezel area (B1), excluding the first transparent area and the second transparent area, may be formed to be substantially opaque. For example, the front plate (31) may include a substantially transparent plate (e.g., a glass plate or a polymer plate) and a layer of an opaque material (e.g., a light-shielding sheet) disposed in the portion of the transparent plate corresponding to the bezel area (B), excluding the first transparent area and the second transparent area. The opaque area of ​​the bezel area (B) may correspond to the portion where the layer of the opaque material is disposed. The layer of the opaque material may be disposed on the transparent plate using various methods such as coating or printing.In some embodiments, a single transparent area may be formed by replacing the first transparent area corresponding to the first camera module (304) in the first bezel area (B1) and the second transparent area corresponding to the sensor module (307) in the first bezel area (B1).

[0075] According to some embodiments, the display area (3011) may be implemented as large as possible so that the bezel area (B) is reduced or substantially absent, unlike the illustrated example. If the first bezel area (B1) is reduced or substantially absent, unlike the illustrated example, the sensor module (307) (e.g., optical sensor) may be located on the back of the display area (3011) or below or beneath the display area (3011). Functions associated with the sensor module (307), such as sensing functions, may be performed without the location of the sensor module (307) being visually distinguishable (or exposed). In some embodiments, the sensor module (307) may be positioned aligned with a recess formed on the back of the display area (3011). The sensor module (307) may be placed overlapping the display area (3011) to perform sensing functions without being visually exposed to the outside. A portion of the display area (3011) that partially overlaps the sensor module (307) may include a pixel structure and / or wiring structure different from other areas. For example, a portion of the display area (3011) that partially overlaps the sensor module (307) may have a pixel density different from other areas. A pixel structure and / or wiring structure formed in a portion of the display area (3011) that partially overlaps the sensor module (307) may reduce light loss between the outside and the sensor module (307). In some embodiments, pixels may not be placed in a portion of the display area (3011) that partially overlaps the sensor module (307). In some embodiments, the electronic device (3) may include a biosensor (e.g., a fingerprint sensor) located below the display (301). The biosensor may be implemented in an optical, capacitive, or ultrasonic manner, and its location or number may vary. In some embodiments, the display area (3011) may include a second opening aligned with a sensor module (307) (e.g., an optical sensor).External light can pass through the second opening of the front plate (31) and the display area (3011) to reach the sensor module (307). The second opening formed in the display area (3011) may be formed, for example, in the form of a through hole or a notch. In some embodiments, a single opening may be formed in place of the first opening corresponding to the first camera module (304) and the second opening corresponding to the sensor module (307) in the display area (3011), and the single opening may be formed in the form of a through hole or a notch. The electronic device (3) may further include at least one of various other sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, or a humidity sensor.

[0076] A plurality of input modules (308) may include, for example, key input devices. The key input devices may be located, for example, in an opening formed on the side (30C). In some embodiments, the electronic device (3) may not include some or all of the key input devices, and the key input devices not included may be implemented as soft keys using the display (301). The location or number of input modules may vary, and in some embodiments, the input modules may include at least one sensor module.

[0077] A first connection terminal module (e.g., a connector module or an interface terminal module) (309) may include, for example, a connector (or interface terminal) (e.g., a USB (universal serial bus) connector or an HDMI (high definition multimedia interface) connector) located in the internal space of the housing (30), and a connector hole formed on the side (30C) corresponding to the connector. A second connection terminal module (e.g., a second connector module or a second interface terminal module) (310) may include, for example, a plurality of terminals (or contact terminals) exposed on the side (30C). An electronic device (200) may transmit and / or receive power and / or data to and from an external electronic device electrically connected to the first connection terminal module (309) or the second connection terminal module (310). The location or number of connection terminal modules may vary and is not limited to the illustrated example. In some embodiments, the electronic device (3) may further include a connection terminal module for connecting a memory card (e.g., an SD (secure digital memory) card or a SIM (subscriber identity module) card).

[0078] According to one embodiment, a pen input device (311) (e.g., a stylus pen) may be detachably attached to the housing (30). For example, the pen input device (311) may be detachably attached to the rear (30B) of the housing (30). The rear (30B) may include a pen attachment area to which the pen input device (311) can be attached. The pen attachment area may be implemented so as to be visually distinguishable on the rear (30B). In one embodiment, a plurality of second camera modules (305), a first audio module (302), a light-emitting module (306), and the pen attachment area may be arranged in a direction (e.g., in the +x axis direction) from the third side wall (333) to the fourth side wall (334) when viewed from above on the rear (30B) (e.g., in the +z axis direction). The light-emitting module (306) can be positioned between the pen attachment area and the first audio module (302) when viewed from above on the rear (30B).

[0079] According to one embodiment, the pen input device (311) may be attached to the housing (30) using a magnetic material. For example, the pen input device (311) may be attached to the housing (30) due to the attractive force between the magnetic material located on the pen input device (311) and the magnetic material located on the housing (30). The pen input device (311) may be attached to the housing (30) in various other ways. For example (not shown), a method of inserting the pen input device (311) into the internal space of the housing (30) may be provided. In some embodiments, a method of attaching the pen input device (311) to the front (30A) or the side (30C) may be implemented. For example, in a method of attaching the pen input device (311) to the front (30A), the bezel area (B) may be utilized as the pen attachment area.

[0080] According to one embodiment, the pen input device (311) may be implemented using an electromagnetic induction method (e.g., an electromagnetic resonance (EMR) method). The pen input device (311) includes a resonant circuit, and the resonant circuit may be coupled with an electromagnetic induction panel placed in the internal space of the housing (30). In some embodiments, the pen input device (311) may be implemented using an active electrical stylus (AES) method or an electric coupled resonance (ECR) method.

[0081] FIG. 5 is an exploded view of a part of an electronic device (3) in one embodiment. FIG. 6 and 7 illustrate an antenna module (8) included in an antenna module assembly (7) according to one embodiment.

[0082] Referring to FIG. 5, the electronic device (3) may include a display assembly (5), a case (6), and an antenna module assembly (7). The display assembly (5) may include a front plate (31) and a display (301) disposed on the back surface of the front plate (31). An optically transparent adhesive material, such as OCA (optical clear resin), OCR (optical clear resin), or SVR (super view resin), may be positioned between the front plate (31) and the display (301). The front plate (31) may include a bezel area (B) that does not overlap with the display area (3011) of the display (301). The case (6) may include a rear plate (32), a first side wall (331), a second side wall (332), a third side wall (333), and / or a fourth side wall (334). The front plate (31) and the case (6) are combined to form an internal space of an electronic device (3) where a display (301), an antenna module assembly (7), or various components not shown can be located.

[0083] According to one embodiment, the case (6) may be implemented in a form comprising a rear plate (32), a first side wall (331), a second side wall (332), a third side wall (333), and a fourth side wall (334) by combining a conductive structure (61) and a non-conductive structure (62). A portion of the conductive structure (61) may be included in the rear plate (32), and another portion of the conductive structure (61) may be included in the first side wall (331), the second side wall (332), the third side wall (333), or the fourth side wall (334). A portion of the non-conductive structure (62) may be included in the rear plate (32), and another portion of the non-conductive structure (62) may be included in the first side wall (331), the second side wall (332), the third side wall (333), or the fourth side wall (334). The conductive structure (61) may include, for example, titanium, an amorphous alloy, a metal-ceramic composite material (e.g., cermet), or stainless steel. As another example, the conductive structure (61) may include magnesium, a magnesium alloy, aluminum, an aluminum alloy, a zinc alloy, or a copper alloy. The conductive structure (51) may include various other metallic materials. In one embodiment, the conductive structure (61) may be implemented using a processing method such as computer numerical control (CNC), die casting, or pressing. In one embodiment, the non-conductive structure (62) may be formed in a combined form with the conductive structure (61) using insert injection molding. For example, after positioning the conductive structure (61) in a mold, molten resin may be injected into the internal space of the mold, followed by cooling and ejection, to form an integrated structure in which the conductive structure (61) and the non-conductive structure (62) are combined. In some embodiments, an organic adhesive layer (e.g., a polymer adhesive material or sealant) is placed on a conductive structure (61), and then an insert injection molding is performed to produce a non-conductive structure (62) combined with the organic adhesive layer.The conductive structure (61) can be firmly and tightly bonded to the non-conductive structure (62) formed by injection molding due to an organic adhesive layer (e.g., TRI bonding). The organic adhesive layer can not only increase the bonding strength between the conductive structure (61) and the non-conductive structure (62) but also contribute to waterproofing. The organic adhesive layer may include various polymers or sealants, such as, for example, triazine thiol, dithiopyrimitine, or silane compounds. In some embodiments, the conductive structure (61) may be anodic oxidized to form an organic adhesive layer applied to the conductive structure (61), and then the non-conductive structure (62) bonded to the organic adhesive layer may be formed by insert injection molding. For example, the organic adhesive layer may be applied to the conductive structure (61) by passing an electric current through an electrolyte solution (e.g., sulfuric acid solution or nitric acid solution). The organic adhesive layer formed on the conductive structure (61) by applying an organic adhesive layer to the conductive structure (61) by passing an electric current through an electrolyte solution may contain metal oxides and / or carbon. In one embodiment, the conductive structure (61) may include a plurality of conductive parts physically separated by a non-conductive structure (61), and a portion of the non-conductive structure (61) may form an insulating part located at a segment between the plurality of conductive parts. Some of the plurality of conductive parts may be utilized as antenna radiators.

[0084] According to one embodiment, the antenna module assembly (7) may be positioned between the display assembly (5) and the rear plate (32). The antenna module assembly (7) may include an antenna module (8) (see FIG. 6 and 7) and a support member (e.g., the support member (9) in FIG. 8). The antenna module (8) may be positioned inside the electronic device (3) using the support member. The support member may contribute to the antenna module (8) being stably positioned inside the electronic device (3). The support member may contribute to the durability of the antenna module (8). In one embodiment, the antenna module (8) may be connected to the case (6) using the support member. The support member is an element for stably positioning the antenna module (8) inside the electronic device (3) and may be referred to by various other terms such as 'support structure', 'connection structure', 'connection member', 'bracket', 'antenna module support member', 'antenna module support structure', or 'antenna module bracket'. In one embodiment, when viewed from above the front plate (31) (e.g., in the -z axis direction), the antenna array included in the antenna module (8) may overlap with at least a portion of the first bezel area (B1). When the antenna module (8) transmits or receives a frequency signal through the antenna array, the radio waves regarding the frequency signal may pass through the first bezel area (B1) and proceed outside the electronic device (3). In some embodiments, the area of ​​the first bezel area (B1) that overlaps with the antenna array included in the antenna module (8) when viewed from above the front plate (31) may be referred to as the radio frequency window area. To reduce the impact of the front plate (31) on the radiation performance or coverage of the antenna module (8), the RF window area may include a non-conductive material. In one embodiment, the entire bezel area (B) may substantially include a non-conductive material.In some embodiments, the RF window region of the bezel region (B) may include a non-conductive material, and at least a portion of the remaining region of the bezel region (B) may include a conductive material.

[0085] Referring to FIGS. 6 and 7, the antenna module (8) may include an antenna structure (81), a communication circuit (82), a power management circuit (83), a connector (84), and / or an electrical path (85). The antenna module (8) may be, for example, the third antenna module (246) of FIG. 2.

[0086] According to one embodiment, the antenna structure (81) may include a printed circuit board (811) on which an antenna array (812) is disposed. The printed circuit board (811) may include a first surface (801) and a second surface (802) facing in the opposite direction to the first surface (801). The first surface (801) and the second surface (802) may, for example, be substantially parallel. The antenna array (812) may include a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) disposed on the first surface (801) or inside the printed circuit board (811) closer to the first surface (801) than to the second surface (802). A plurality of antenna elements (812a, 812b, 812c, 812d, 812e) may be, for example, the antenna (248) of FIG. 2. In one embodiment, the plurality of antenna elements (812a, 812b, 812c, 812d, 812e) may be substantially identical in shape and may be arranged at regular intervals. In one embodiment, the plurality of antenna elements (812a, 812b, 812c, 812d, 812e) may transmit and / or receive signals of substantially the same frequency band. The printed circuit board (811) may include a plurality of conductive layers (e.g., a plurality of conductive pattern layers) and a plurality of non-conductive layers (e.g., insulating layers) stacked alternately with the plurality of conductive layers. A plurality of antenna elements (812a, 812b, 812c, 812d, 812e) may be implemented, for example, as at least some of the plurality of conductive layers. In some embodiments, the number or location of antenna elements included in the antenna array (812) may vary and is not limited to the embodiment shown in FIG. 6.

[0087] According to one embodiment, a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) can operate as a patch antenna. In some embodiments, the shape of the plurality of antenna elements (812a, 812b, 812c, 812d, 812e) may vary and is not limited to the circular shape according to the embodiment of FIG. 6. For example, the plurality of antenna elements (812a, 812b, 812c, 812d, 812e) may be formed in a square or elliptical shape. In one embodiment, the antenna elements (812a, 812b, 812c, 812d, 812e) may be formed as a single-layer structure included in a printed circuit board (811). In some embodiments, the antenna elements (812a, 812b, 812c, 812d, 812e) may be implemented as a stacked structure comprising a plurality of conductive parts (e.g., conductive patches) located on different layers of the printed circuit board (811) and overlapping each other. In some embodiments, the number or location of the antenna array may vary and is not limited to the embodiment illustrated in FIG. 6. Although not illustrated, the antenna structure (81) may further include an antenna array comprising a plurality of antenna elements operating as a dipole antenna. In some embodiments, the plurality of antenna elements (812a, 812b, 812c, 812d, 812e) may operate as a patch antenna or an antenna other than a dipole antenna.

[0088] According to one embodiment, a communication circuit (or wireless communication circuit) (82) may be placed on a second surface (802) of a printed circuit board (811) using a conductive adhesive material such as solder. For example, the communication circuit (82) may be electrically connected to a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) through wiring included in the printed circuit board (811) (e.g., an electrical path consisting of a conductive pattern or a conductive via). As another example, the communication circuit (82) may be placed on a printed circuit board different from the printed circuit board (811) (e.g., a printed circuit board on which components such as the processor (120), memory (130), or communication module (190) shown in FIG. 1 are placed). In one embodiment, the communication circuit (82) may include a radio frequency integrate circuit (RFIC). For example, the communication circuit (82) may be the third RFIC (226) of FIG. 2.

[0089] According to one embodiment, the communication circuit (82) can transmit and / or receive a signal in at least some frequency band from about 3 GHz to about 100 GHz through the antenna array (812). The communication circuit (82) can up-convert or down-convert the frequency of the transmitted or received signal. The communication circuit (82) can receive an intermediate frequency (IF) signal from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) placed on another printed circuit board and up-convert the received IF signal into a radio frequency (RF) signal (e.g., millimeter wave). The communication circuit (82) can down-convert the RF signal received through the antenna array (812) into an IF signal, and the IF signal can be provided to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) placed on another printed circuit board.

[0090] According to one embodiment, a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) can be fed directly or indirectly from a communication circuit (82) and operate as antenna radiators.

[0091] According to some embodiments, a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) may be utilized as dummy elements (e.g., dummy antennas or dummy patches, or conductive patches). The dummy elements may be physically separated from other conductive elements and be in an electrically floating state. The antenna module (8) may include a plurality of feed antenna elements (not shown) that, when viewed from above on the first surface (801), overlap at least partially with the plurality of antenna elements (812a, 812b, 812c, 812d, 812e) and are physically separated from the plurality of antenna elements (812a, 812b, 812c, 812d, 812e). Multiple feed antenna elements are electrically connected to a communication circuit (82), and multiple antenna elements (812a, 812b, 812c, 812d, 812e) can be indirectly fed from multiple feed antenna elements and operate as antenna radiators.

[0092] According to one embodiment, the antenna structure (81) may include a ground plane (or ground layer) (not shown) implemented in at least some of the plurality of conductive layers included in the printed circuit board (811). The ground plane may be positioned between the antenna array (812) and the second surface (802) and may overlap at least partially with the antenna array (812) when viewed from above the first surface (801). In some embodiments (not shown), the antenna module (8) may further include an antenna array operating as a dipole antenna. In this case, the ground plane included in the printed circuit board (811) may not overlap with the antenna array operating as a dipole antenna.

[0093] According to one embodiment, the power management circuit (83) may be placed on a second side (802) of the printed circuit board (811) using a conductive adhesive material such as solder. As another example, the power management circuit (83) may be placed on a printed circuit board different from the printed circuit board (811) (e.g., a printed circuit board on which components such as the processor (120), memory (130), or communication module (190) shown in FIG. 1 are placed). The power management circuit (83) may be electrically connected to the communication circuit (82) or various other components placed on the printed circuit board (811) (e.g., a connector (84) or a passive component) through wiring included in the printed circuit board (811) (e.g., an electrical path consisting of a conductive pattern or a conductive via). In one embodiment, the power management circuit (83) may be a power management integrated circuit (PMIC).

[0094] According to one embodiment, the connector (84) may be placed on a second side (802) of the printed circuit board (811) using a conductive adhesive material such as solder. One end of the electrical path (85), such as a flexible printed circuit board, may be connected to the connector (84) (e.g., an FPCB connector). In some embodiments, one end of the electrical path (85) may be electrically connected to conductive terminals (e.g., lands or copper pads) located on the second side (802) of the printed circuit board (811) using a conductive adhesive material such as solder, in which case the connector (84) may be omitted. The other end of the electrical path (85) may include a connector (851) for electrical connection to another printed circuit board (e.g., a printed circuit board on which components such as the processor (120), memory (130), or communication module (190) shown in FIG. 1 are placed).

[0095] According to some embodiments, the antenna module (8) is defined with at least one component (e.g., electrical path (85)) omitted, or one or more other components may be added to the antenna module (8).

[0096] According to some embodiments, the antenna module (8) may further include a shielding member (or electromagnetic shielding member) (86) located on a second surface (802) to enclose at least one of a communication circuit (82) and / or a second power management circuit (83). The shielding member (86) may electromagnetically shield the communication circuit (82) and / or the power management circuit (83). The shielding member (86) may include a conductive member, for example, such as a shield can. As another example, the shielding member (86) may include a protective member, such as urethane resin, and a conductive paint, such as an EMI paint, applied to the outer surface of the protective member. In some embodiments, the shielding member (86) may be implemented as various shielding sheets placed to cover the second surface (802).

[0097] According to some embodiments (not shown), the antenna module (8) may further include a frequency adjustment circuit placed on a printed circuit board (811). The frequency adjustment circuit, such as a tuner or a passive element, can adjust the impedance or shift the resonant frequency to a specified frequency or shift it by a specified amount.

[0098] According to one embodiment, when the antenna module (8) is positioned between the display assembly (5) and the case (6), the first side (801) of the printed circuit board (811) may face the front (30A) (see FIG. 3) or the front plate (301) (e.g., in the +z axis direction), and the second side (802) of the printed circuit board (811) may face the rear plate (32) (see FIG. 5) of the electronic device (3) (e.g., in the -z axis direction). The printed circuit board (811) may include a first side (S1), a second side (S2), a third side (S3), or a fourth side (S4). The first side (S1) and the second side (S2) may be located on opposite sides of each other. The third side (S3) and the fourth side (S4) may be located on opposite sides of each other. The first side (S1), the second side (S2), the third side (S3), and / or the fourth side (S4) may be perpendicular to the first side (801) or the second side (802). The third side (S3) or the fourth side (S4) may be perpendicular to the first side (S1) or the second side (S2), for example, when viewed from above the first side (801) (e.g., in the -z axis direction). When the antenna module (8) is positioned between the display assembly (5) and the case (6), the first side (S1) may be oriented toward the first side wall (331) of the case (6) (e.g., in the +y axis direction). When the antenna module (8) is positioned between the display assembly (5) and the case (6), the third side (S3) may face the third side wall (333) of the case (6) (e.g., in the -x axis direction), and the fourth side (S4) may face the fourth side wall (334) (e.g., in the +x axis direction).

[0099] According to one embodiment, the antenna structure (81) may be inserted into a recess (or recess structure) (not shown) formed in the case (6). The recess may include, for example, a recessed space formed in the first side wall (331) within the internal space of the housing (30) (see FIG. 3). A structure in which the antenna structure (81) is positioned in the recess of the case (6) can reduce the area where the first surface (801) of the antenna structure (81) overlaps with the display (301) when viewed from above the front plate (31) (e.g., in the -z axis direction) compared to a comparative example where it is not positioned. A structure in which the antenna structure (81) is positioned in the recess of the case (6) can contribute to preventing the antenna array (812) of the antenna structure (81) from overlapping with the display (301) when viewed from above the front plate (31). In one embodiment, the display (301) may include a bezel area (B) and a border area (3012) (see FIG. 5) that partially overlaps with the bezel area (B) when viewed from above the front plate (31). The border area (3012) may be formed extending from the display area (3011) when viewed from above the front plate (31). For example, the border area (3012) may be an annular shape surrounding the display area (3011) when viewed from above the front plate (31). The border area (3012) may include, for example, circuits or wiring associated with the display area (3011). In some embodiments, a display drive circuit (e.g., a DDI (display drive integrated circuit)) may be disposed on the back of the border area (3012). When viewed from above on the front plate (31), the bezel area (B) may include a first area (B01) that overlaps with the border area (3012) of the display (301) and a second area (B02) that does not overlap with the border area (3012) of the display (301).The second region (B02) may be formed in an annular shape surrounding the first region (B01) when viewed from above the front plate (31). The structure in which the antenna structure (81) is positioned in the recess of the case (6) may contribute to preventing the antenna array (812) of the antenna structure (81) from overlapping with the first region (B01) of the bezel region (B) and overlapping with the second region (B02) of the bezel region (B) when viewed from above the front plate (31). When the antenna structure (81) transmits or receives a frequency signal, the radio waves regarding the frequency signal may substantially penetrate the second region (B01) of the bezel region (B) and proceed to the outside of the electronic device (3). When viewed from above on the front plate (31), the antenna array (812) of the antenna structure (81) does not overlap with the first region (B01) of the bezel region (B), so the electromagnetic influence of the display (301) on the antenna structure (81) can be reduced. When viewed from above on the front plate (31), the region of the second region (B02) of the bezel region (B) that overlaps with the antenna array (812) of the antenna structure (81), or the region of the second region (B02) through which a beam (e.g., main beam) formed by the antenna structure (81) passes, may be referred to as the RF window region. In some embodiments, when viewed from above on the front plate (31), at least a portion of the border region (3012) of the display (301) that overlaps with the first surface (801) of the antenna structure (81) may be omitted.

[0100] FIGS. 8 and 9 illustrate an antenna module assembly (7) in one embodiment.

[0101] Referring to FIGS. 8 and 9, the antenna module assembly (7) may include an antenna module (8) and a support member (9) on which the antenna module (8) is placed or coupled. In one embodiment, the antenna structure (81) may be connected to a case (6) (see FIG. 5) using the support member (9). The support member (9) may be coupled or fixed to the case (6), and the antenna module (8) may be stably positioned in the internal space of the housing (30) (Fig. 3) due to the support member (9). The support member (9) may contribute to the durability of the antenna structure (8). In one embodiment, the support member (9) may include a pair of first support members (①), a second support member (②), a third support member (③), and / or a fourth support member (④). The third support member (③) may, for example, face the second side (802) (see FIG. 7) of the printed circuit board (811) or cover or support the second side (802). The second support member (②) may, for example, extend from the third support member (③) to face the first side (S1) of the printed circuit board (811) or cover or support the first side (S1). The fourth support member (④) may, for example, extend from the third support member (③) to face the second side (S2) of the printed circuit board (811) or cover or support the second side (S2). The second support member (②) and the fourth support member (④) may be located on opposite sides when viewed from above the first side (801) of the printed circuit board (811) and may be perpendicular to the third support member (③). A pair of first support members (①) may extend from a fourth support member (④). In some embodiments, a pair of first support members (①) may extend from a third support member (③). One of the pair of first support members (①) may face the third side (S3) of the printed circuit board (811) or cover or support the third side (S3).The other of the pair of first support members (①) may face the fourth side (S4) of the printed circuit board (811) or cover or support the fourth side (S4). The pair of first support members (①) may be located opposite each other when viewed from above on the first side (801) of the printed circuit board (811) and may be perpendicular to the second support member (②), the third support member (③), or the fourth support member (④). In one embodiment, the pair of first support members (①) may be located symmetrically with respect to the printed circuit board (811). The pair of first support members (①), the second support member (②), the third support member (③), or the fourth support member (④) may include a plate shape corresponding to each corresponding side of the printed circuit board (811). The support member (9) may be implemented as a single metal structure including, for example, a folded portion. The support member (9) may include various metallic materials such as stainless steel. In some embodiments, the support member (9) may include non-metallic materials such as engineering plastics. A pair of first support members (①), a second support member (②), a third support member (③), and a fourth support member (④) may contribute to stably positioning the antenna structure (81) on the support member (8). In some embodiments, the support member (9) on which the antenna structure (81) is placed may vary and is not limited to the illustrated example.

[0102] In some embodiments, the third support portion (③) of the support member (9) may include an opening or recess where a component (e.g., communication circuit (82), power management circuit (83), or connector (84) of FIG. 7) disposed on the second side (802) (see FIG. 7) of the printed circuit board (811) can be located.

[0103] According to one embodiment, an adhesive member may be positioned between the third support portion (③) of the support member (9) and the second surface (802) of the printed circuit board (811) (see FIG. 7). For example, the second surface (802) of the printed circuit board (811) may be placed or bonded to the third support portion (③) of the support member (9) using a thermal adhesive material, a photoreactive adhesive material, a general adhesive, or double-sided tape.

[0104] According to one embodiment, an adhesive member (e.g., a thermal adhesive material, a photoreactive adhesive material, a general adhesive, or double-sided tape) may be positioned between the second support portion (②) of the support member (9) and the first side (S1) of the printed circuit board (811), and / or between the fourth support portion (④) of the support member (9) and the second side (S2) of the printed circuit board (811).

[0105] According to some embodiments, an adhesive member (e.g., a thermal adhesive material, a photoreactive adhesive material, a general adhesive, or double-sided tape) may be positioned between one of a pair of support members (①) included in the support member (9) and a third side (S3) of the printed circuit board (811), and / or between the other of a pair of support members (①) included in the support member (9) and a fourth side (S4) of the printed circuit board (811).

[0106] According to one embodiment, the support member (9) may not overlap with the first surface (801) or the antenna array (812) when viewed from above (e.g., in the -z axis direction) of the first surface (801) of the printed circuit board (811), thereby reducing the effect of the support member (9) on the radiation performance of the antenna module (8). In some embodiments, the support member (9) may include a fifth support member (not shown) that covers an area of ​​the first surface (801) of the printed circuit board (811) that does not overlap with the antenna array (812) when viewed from above. The fifth support member may be positioned, for example, so as not to have a substantial effect on the radiation performance of the antenna module (8). The fifth support member may extend from at least one of the plurality of first support members (①), the second support member (②), or the fourth support member (④). In some embodiments, the fifth support may be formed in the shape of a hook that prevents the antenna structure (81) from moving away in the +z axis direction.

[0107] According to one embodiment, the second support portion (②) of the support member (9) may be placed or bonded to the case (6) (see FIG. 5) using an adhesive member (e.g., a thermal adhesive material, a photoreactive adhesive material, a general adhesive, or double-sided tape). The bonding of the second support portion (②) and the case (6) may contribute to the support member (9) having the antenna structure (81) placed thereon being stably positioned in the case (6).

[0108] According to one embodiment, the third support portion (③) of the support member (9) may be supported by a rear plate (32) (see FIG. 5). The rear plate (32) may support the support member (9) toward the front plate (31) (see FIG. 5). The rear plate (32) may, for example, substantially support the third support portion (③) of the support member (9) on which the antenna structure (81) is placed in the +z axis direction (e.g., vertical support). The structure in which the rear plate (32) supports the third support portion (③) of the support member (9) may contribute to the support member (9) on which the antenna structure (81) is placed being stably positioned in the case (6).

[0109] According to some embodiments, an adhesive material (e.g., a heat-reactive adhesive material, a photo-reactive adhesive material, a general adhesive, or double-sided tape) may be positioned between the rear plate (32) and the third support portion (③) of the support member (9). In some embodiments, a flexible material such as rubber may be positioned between the rear plate (32) and the third support portion (③) of the support member (9).

[0110] According to one embodiment, one of a pair of first supports (①) may include a first insert (or first protrusion) (901) protruding from a first surface (801) of a printed circuit board (811), and the other may include a second insert (or second protrusion) (902). The first insert (901) may be inserted into a first groove (e.g., a first notch) included in a case (6) (see FIG. 5), and the second insert (902) may be inserted into a second groove (e.g., a second notch) included in the case (6). The first insert (901) and the corresponding first groove, and the second insert (902) and the corresponding second groove may be used to guide the position when the support member (9) on which the antenna structure (81) is placed is positioned in the case (6). The first insert (901) and the corresponding first groove, and the second insert (902) and the corresponding second groove may contribute to the support structure (9) on which the antenna structure (81) is placed being stably placed in a designated position in the case (6). In some embodiments, the insert (e.g., the first insert (901) or the second insert (902)) formed in the first support portion (①) of the support member (9) may be referred to by various other terms such as 'guide portion' or 'guide projection'. In some embodiments, the grooves of the case (6) (e.g., the first groove or the second groove) may be referred to by various other terms such as 'guide groove' or 'guide notch'.

[0111] According to one embodiment, each of the pair of first support members (①) included in the support member (9) may include a hemming structure (or hemming). A part of the hemming structure included in one of the pair of support members (①) may include a first insert (901), and a part of the hemming structure included in the other of the pair of support members (①) may include a second insert (902).

[0112] FIG. 10 is a drawing for illustrating the manufacturing flow of a case (6) in one embodiment.

[0113] Referring to the reference numeral '1001' in FIG. 10, a metal structure (1010) manufactured using various processing methods such as CNC, die casting, or pressing can be shaped using a tool (1020). The metal structure (1010) may be a base metal for forming a conductive structure (61) (see FIG. 5) included in a case (6) (see FIG. 5). A portion of the metal structure (1010) shown may include, for example, a rear structure (1011) for a rear plate (32) of the case (6) (see FIG. 5), and a first side structure (1012) for a first side wall (331) of the case (6). The tool (1020) may be, for example, a cutter having a circular radius. The tool (1020) can be moved as indicated by reference numeral '1021' to remove an inner portion of the first side structure (1012) (refer to the area indicated by reference numeral '1013'). Referring to reference numeral '1002', a case (6) including a conductive structure (61) (refer to FIG. 5) and a non-conductive structure (62) (refer to FIG. 5) can be formed by externally processing the metal structure (1010) and then performing insert injection molding. FIG. 10 is merely a schematic representation of the manufacturing flow of the case (6), and various processing steps such as surface treatment may be performed.

[0114] According to one embodiment, the case (6) may include a recess (1040) in which an antenna module assembly (7) can be positioned. The recess (1040) may include, for example, a space formed in the shape of a recess in the first side wall (331). The first side wall (331) of the case (6) may include a first connecting portion (1051) to which a portion corresponding to the first side wall (331) of the second region (BO2) (see FIG. 5) of the bezel region (B) included in the front plate (31) is joined. Although not illustrated, the second side wall (332) of the case (6) illustrated in FIG. 5 may include a second connecting portion to which a portion corresponding to the second side wall (332) of the second region (BO2) of the bezel region (B) included in the front plate (31) is joined. Although not illustrated, the third side wall (333) of the case (6) illustrated in FIG. 5 may include a third connection part to which a portion corresponding to the third side wall (333) of the second region (BO2) of the bezel region (B) included in the front plate (31) is joined. Although not illustrated, the fourth side wall (334) of the case (6) illustrated in FIG. 5 may include a fourth connection part to which a portion corresponding to the fourth side wall (334) of the second region (BO2) of the bezel region (B) included in the front plate (31) is joined. The case (6) may have an annular connection part including a first connection part (1051), a second connection part, a third connection part, and a fourth connection part. The annular connection part may be formed along the edge of the front plate (31) and may overlap with the front plate (31) when viewed from above (e.g., in the -z axis direction). The second region (B02) of the bezel region (B) can be combined with an annular connection. An adhesive material such as a thermal adhesive material, a photoreactive adhesive material, a general adhesive, or double-sided tape may be positioned between the second region (B02) of the bezel region (B2) and the annular connection.In one embodiment, a portion of the non-conductive structure (62) (see FIG. 5) may include a non-conductive portion (1060) located at the first connection portion (1051). The non-conductive portion (1060) may be part of defining the recess (1040).

[0115] According to one embodiment, the non-conductive portion (1060) may include a first groove (e.g., a first notch) (1061) into which a first insert (901) of the support member (9) (see FIG. 8 or 9) may be inserted. The non-conductive portion (1060) may include a second groove (e.g., a second notch) (1062) into which a second insert (902) of the support member (9) (see FIG. 8 or 9) may be inserted. The first insert (901) and the corresponding first groove (1061), and the second insert (902) and the corresponding second groove (1062) may be used to guide the position when the support member (9) on which the antenna structure (81) is placed is positioned in the case (6). The first insert (901) and the corresponding first groove (1061), and the second insert (902) and the corresponding second groove (1062) can contribute to stably placing the support structure (9), on which the antenna structure (81) is placed, at a designated location in the case (6). The first insert (901) of the support member (9) may include a curved bending end to form a hemming structure, and the curved bending end may contribute to smooth insertion into the first groove (1061) by reducing interference with the first groove (1061). The second insert (902) of the support member (9) may include a curved bending end to form a hemming structure, and the curved bending end may contribute to smooth insertion into the second groove (1062) by reducing interference with the second groove (1062). The first insert (901) of the support member (9) may have elasticity due to a bending end for forming a hemming structure, and the first insert (901) may be elastically inserted into the first groove (1061) to contribute to the bonding force between the first insert (901) and the first groove (1061).The second insert (902) of the support member (9) may have elasticity due to a bending end for forming a hemming structure, and the second insert (902) may be elastically inserted into the second groove (1062) to contribute to the bonding force between the second insert (902) and the second groove (1062).

[0116] According to one embodiment, the non-conductive portion (1060) may include a plurality of support ribs (or, ribs, protrusions, support protrusions, or support portions) (1063a, 1063b, 1063c, 1063d) that are extended outward toward a first surface (801) (see FIG. 8 or 9) of an antenna structure (81) disposed on a support member (9). The plurality of support ribs (1063a, 1063b, 1063c, 1063d) may be in contact with the first surface (801) of the antenna structure (81). Multiple support ribs (1063a, 1063b, 1063c, 1063d) can contribute to positioning the remaining portion of the non-conductive part (1060), excluding the multiple support ribs (1063a, 1063b, 1063c, 1063d), spaced apart from the antenna structure (81) or the first surface (801) of the antenna structure (81). Multiple support ribs (1063a, 1063b, 1063c, 1063d) can contribute to positioning the antenna module assembly (7) (see FIG. 8) stably in the case (6). For example, a plurality of support ribs (1063a, 1063b, 1063c, 1063d) may contribute to stably positioning the first surface (801) of the antenna structure (81) in a substantially +z axis direction without twisting (or tilting, or deviation). At least one of the number, location, and / or shape of the plurality of support ribs (1063a, 1063b, 1063c, 1063d) may vary and is not limited to the illustrated example.

[0117] FIG. 11 illustrates a state in which the antenna module assembly (7) is separated from the case (6) in one embodiment. FIG. 12 and 13 illustrate a state in which the antenna module assembly (7) is coupled to the case (6) in one embodiment.

[0118] Referring to FIGS. 11, 12, and 13, the antenna structure (81) and the support member (9) on which the antenna structure (81) is placed can be moved in the insertion direction (e.g., +y-axis direction) indicated by the reference numeral '1110' and inserted into the recess (1040) of the case (6) and positioned in the case (6). This arrangement method may be referred to, for example, as a sliding assembly.

[0119] According to one embodiment, the first surface (801) of the antenna structure (81) may partially overlap with the non-conductive portion (1060) included in the first connection portion (1051) of the case (6) when viewed from above the first surface (801) (e.g., in the -z axis direction). A plurality of antenna elements (812a, 812b, 812c, 812d, 812e) included in the antenna structure (81) may partially overlap with the non-conductive portion (106) when viewed from above the first surface (801). A plurality of antenna elements (812a, 812b, 812c, 812d, 812e) included in the antenna structure (81) may not overlap with the conductive portion of the case (6) when viewed from above on the first surface (801) (e.g., a conductive portion included in the first connecting portion (1051), for example, a conductive portion connected to the non-conductive portion (1060) of the first connecting portion (1051). The non-conductive portion (1060) may contribute to securing coverage while reducing the degradation of the radiation performance of the antenna structure (81) by the first connecting portion (1051). The non-conductive portion (1060) may contribute to securing an area for coupling with the front plate (31) (see FIG. 5) of the first connecting portion (1051) and securing the radiation performance of the antenna structure (81).

[0120] According to one embodiment, the portion of the non-conductive part (1060), excluding the plurality of support ribs (1063a, 1063b, 1063c, 1063d), may be positioned spaced apart from the first surface (801) of the antenna structure (81). The plurality of antenna elements (812a, 812b, 812c, 812d, 812e) may overlap at least partially with the portion of the non-conductive part (1060), excluding the plurality of support ribs (1063a, 1063b, 1063c, 1063d), when viewed from above the first surface (801) (e.g., in the -z axis direction). An air gap may be formed between the remaining portion of the non-conductive portion (1060), excluding a plurality of support ribs (1063a, 1063b, 1063c, 1063d), and the antenna structure (81) (or the first surface (801)). The air gap may reduce deformation or distortion of the beam pattern formed from the antenna structure (81) or enable coverage (communication range) toward the bezel area (B) of the front plate (31) (see FIG. 3 or 5). The antenna structure (81) may have directivity capable of concentrating electromagnetic energy in a specific direction or transmitting and receiving waves. For example, by means of a beamforming system, an antenna array (812) (see FIG. 6) comprising a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) can form a beam that radiates relatively more energy in the direction in which the first plane (801) faces (e.g., the +z axis direction). The air gap can contribute to ensuring the radiation performance of the antenna structure (81) at the operating frequency.

[0121] According to one embodiment, a plurality of support ribs (1063a, 1063b, 1063c, 1063d) included in a non-conductive portion (1060) may come into contact with regions (1101, 1102, 1103, 1104) that do not overlap with a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of the first surface (801) when viewed from above (e.g., in the -z axis direction) of the first surface (801) of the antenna structure (81). For example, the first support rib (1063a) may come into contact with and support the region (1101) between the first antenna element (812a) and the second antenna element (812b) when viewed from above the first surface (801). For example, the second support rib (1063b) can contact and support the area (1102) between the second antenna element (812b) and the third antenna element (812c) when viewed from above the first surface (801). For example, the third support rib (1063c) can contact and support the area (1103) between the third antenna element (812c) and the fourth antenna element (812d) when viewed from above the first surface (801). For example, the fourth support rib (1063d) can contact and support the area (1103) between the fourth antenna element (812d) and the fifth antenna element (812e) when viewed from above the first surface (801). A plurality of support ribs (1063a, 1063b, 1063c, 1063d) included in the non-conductive portion (1060) may not overlap with a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) when viewed from above on the first surface (801).A structure that supports an antenna structure (81) such that a plurality of support ribs (1063a, 1063b, 1063c, 1063d) do not overlap with a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) when viewed from above on the first surface (801) can reduce the degradation of the radiation performance of the antenna structure (81) while allowing the antenna structure (81) to be stably positioned in the case (6). The support ribs (1063a, 1063b, 1063c, or 1063d) of the non-conductive portion (1060) may be formed in various other shapes that do not overlap with the plurality of antenna elements (812a, 812b, 812c, 812d, 812e), not limited to the illustrated example.

[0122] According to some embodiments, a plurality of support ribs (1063a, 1063b, 1063c, 1063d) may be omitted, and in this case, the entire non-conductive portion (1060) may be positioned spaced apart from the antenna structure (81) or the first surface (801) of the antenna structure (81).

[0123] FIG. 14 illustrates an antenna module assembly (7) separated from a case (6) according to another embodiment. FIG. 15 illustrates, for example, an antenna module assembly (7) coupled to a case (6).

[0124] Referring to FIGS. 14 and 15, the support member (9) on which the antenna structure (81) of the antenna module assembly (7) is placed may include a first insert (1401) and a second insert (1402) that are respectively inserted into the first groove (1061) and the second groove (1062) of the non-conductive portion (1060) included in the first connecting portion (1051) of the case (6). In one embodiment, the first insert (1401) may include a first convex portion (1511) included in the hemming structure as another example of a modification of the first insert (901) according to the example of FIG. 9. The first insert (1401) may have elasticity due to a bending end for forming a hemming structure, and when the first insert (1401) is elastically inserted into the groove (1061), the first convex portion (1511) may contribute to the bonding force between the first insert (1401) and the first groove (1061). The second insert (1402) may include a second convex portion (1512) included in the hemming structure in substantially the same manner as the first insert (1401).

[0125] According to some embodiments, the non-conductive portion (1060) may include a first hook fastening portion (1520) for hook fastening to a first insert (1401) including a first convex portion (1511), such as the virtual line indicated by reference numeral '1520'. The first insert (1401) may be elastically inserted into the first groove (1061) due to, for example, a hemming structure, and interference between the first hooking portion (1520) and the first convex portion (1511) may reduce the phenomenon of the first insert (1401) coming out of the first groove (1061). The first convex portion (1511) may be formed in a convex shape having a curved surface so that, for example, the first insert (1401) can be smoothly inserted into or separated from the first groove (1061). Although not illustrated, the non-conductive portion (1060) may include a second locking portion corresponding to the second convex portion (1512) of the second insert (1402) in substantially the same manner as the first locking portion (1520) corresponding to the first convex portion (1511).

[0126] According to some embodiments, the portion of the first groove (1061) corresponding to the first convex portion (1511) may include a first recess in which the first convex portion (1511) can be positioned, as indicated by the reference numeral '1530'. The first insert (1401) can be elastically inserted into the first groove (1061), for example, due to a hemming structure, and the first convex portion (1511) can be positioned in the first recess (1530) to reduce the phenomenon of the first insert (1401) being displaced from the first groove (1061). Although not illustrated, the second groove (1062) may include a second recess corresponding to the second convex portion (1512) of the second insert (1402) in substantially the same manner as the first recess (1520) formed in the first groove (1061) corresponding to the first convex portion (1511). The first convex portion (1511) and the corresponding first recess (1530) may contribute to the first insert (1401) being placed in a designated position in the first groove (1061), and the second convex portion (1512) and the corresponding second recess may contribute to the second insert (1402) being placed in a designated position in the second groove (1062).

[0127] FIG. 16 illustrates, in one embodiment, a cross-sectional structure (1600) of the yz plane with respect to the DD' line in FIG. 3.

[0128] Referring to FIG. 16, the cross-sectional structure (1600) may include a front plate (31), a case (6), a display (301), an antenna structure (81), a support member (9), a first adhesive member (1610), a second adhesive member (1620), a third adhesive member (1630), and / or a printed circuit board (1640).

[0129] According to one embodiment, the first adhesive member (1610) may be positioned between the third support portion (③) of the support member (9) and the second surface (802) of the antenna structure (81). The first adhesive member (1610) may contribute to a stable connection between the antenna structure (81) and the support member (9).

[0130] According to one embodiment, the second support portion (②) of the support member (9) may be joined using a second adhesive member (1620) to a region corresponding to (or facing) the second support portion (②) among the surfaces forming the recess (1040) of the case (6). In some embodiments, the second support portion (②) of the support member (9) may be joined to the case (6) using a mechanical fastening element such as a screw. The joining of the second support portion (②) and the case (6) may contribute to the support member (9) having the antenna structure (81) placed thereon being stably positioned in the case (6). The joining of the second support portion (②) and the case (6) may contribute, for example, to the first surface (801) of the antenna structure (81) being stably formed in a substantially +z-axis direction without twisting (or tilting, or deviation).

[0131] According to one embodiment, the third support portion (③) of the support member (9) may be supported by the rear plate (32) of the case (6). The rear plate (32) may support the support member (9) in the +z axis direction (e.g., vertical support). The structure in which the rear plate (32) supports the third support portion (③) of the support member (9) may contribute to the support member (9) having the antenna structure (81) placed thereon being stably positioned in the case (6). The structure in which the rear plate (32) supports the third support portion (③) of the support member (9) may contribute, for example, to the first surface (801) of the antenna structure (81) being stably positioned substantially in the +z axis direction without twisting (or tilting, or deviation).

[0132] According to one embodiment, the third support member (③) of the support member (9) may include a convex structure (hereinafter, convex structure (1650)) protruding toward the rear plate (32). The convex structure (1650) may be supported by the rear plate (32). In some embodiments, the third support member (③) may be formed without a block structure (1650), in which case the rear plate (32) may include a block structure for supporting the third support member (③), or a separate support member may be positioned between the third support member (③) and the rear plate (32).

[0133] According to some embodiments, an adhesive material may be positioned between the rear plate (32) and the third support portion (③) of the support member (9). In some embodiments, a flexible material such as rubber may be positioned between the rear plate (32) and the third support portion (③) of the support member (9). The adhesive material or flexible material between the rear plate (32) and the third support portion (③) of the support member (9) can reduce the stress effect on the antenna module assembly (7) (see FIG. 8) or the stress effect on the bonding structure between the support member (9) and the case (6) when an external impact is applied to the housing (30) (see FIG. 3).

[0134] According to one embodiment, the display (301) may include a bezel area (B) and a border area (3012) that partially overlaps with the bezel area (B) when viewed from above the front plate (31) (e.g., in the -z axis direction). The bezel area (B) shown in the cross-sectional structure (1600) of FIG. 16 may refer to a first bezel area (B1) (see FIG. 3). When viewed from above the front plate (31), the bezel area (B) may include a first area (B01) that overlaps with the border area (3012) of the display (301) and a second area (B02) that does not overlap with the border area (3012) of the display (301). The second area (B02) may be formed in an annular shape that surrounds the first area (B01) when viewed from above the front plate (31). In one embodiment, the antenna structure (81) may be inserted into a recess (or recess structure) (1040) formed in the case (6) using a support member (9). The recess (1040) may include, for example, a space formed in the shape of a first side wall (331). The structure in which the antenna structure (81) is positioned in the recess (1040) of the case (6) using the support member (9) may contribute to ensuring that the antenna structure (81), the first surface (801) of the antenna structure (81), or the antenna array (812) of the antenna structure (812) (see FIG. 8) do not overlap with the display area (301) when viewed from above the front plate (31). A structure in which an antenna structure (81) is positioned in a recess (1040) of a case (6) using a support member (9) can contribute to the antenna array (812) (see FIG. 8) of the antenna structure (81) being overlapping with the second region (B02) of the first region (B01) and the second region (B2) of the bezel area (B) when viewed from above the front plate (31). A third adhesive member (1630) can be positioned between the second region (B02) of the bezel area (B) included in the front plate (31) and the side wall of the case (6) (e.g., the first side wall (331) in the illustrated cross-sectional structure (1600).

[0135] According to one embodiment, the surface forming the recess (1040) in the illustrated cross-sectional structure (1600) may include a third surface (1041), a fourth surface (1042), and a fifth surface (1043). The third surface (1041) may face the first surface (801) of the antenna structure (8). The third surface (1041) may include, for example, a non-conductive region formed by a non-conductive portion (1060) of the first sidewall (331) and a conductive region formed by a conductive portion (1070) of the first sidewall (331). The conductive portion (1070) may form at least a portion of the side (30C) (see FIG. 3) of the electronic device (3). The fourth surface (1042) may be located opposite to the third surface (1041) and may face the third support portion (③) of the support member (9). The fourth surface (1042) may include a conductive area formed, for example, by the conductive portion (1070) of the first side wall (331). The fifth surface (1043) may be joined to the second support portion (②) of the support member (9) using the second adhesive member (1620). The fifth surface (1043) may include a conductive area formed, for example, by the conductive portion (1070) of the first side wall (331). In some embodiments, at least a portion of the fourth surface (1042) or the fifth surface (1053) may include a non-conductive area formed by the non-conductive portion of the first side wall (331).

[0136] According to one embodiment, a plurality of support ribs (1063a, 1063b, 1063c, 1063d) (see FIG. 11, 12, or 14) may extend outward from a third surface (1041) of the recess (1040). The third surface (1041) may be, for example, substantially parallel to the first surface (801). In some embodiments, the third surface (1041) may include an inclined surface, a curved surface, or a surface including irregularities that is not parallel to the first surface (801). Hereinafter, the surfaces of the plurality of support ribs (1063a, 1063b, 1063c, 1063d) are described separately from the third surface (1041). In some embodiments, the surfaces of a plurality of support ribs (1063a, 1063b, 1063c, 1063d) may be defined as part of a third surface (1041), in which case the third surface (1041) may be referred to as a surface including irregularities.

[0137] According to one embodiment, when viewed from above on the front plate (31) (e.g., in the -z axis direction), the conductive area formed by the conductive portion (1070) of the first side wall (331) of the third surface (1041) of the recess (1040) may not overlap with the first surface (801) of the antenna structure (81) or the antenna array (812) (see FIG. 8). In some embodiments, when viewed from above on the front plate (31), the conductive area formed by the conductive portion (1070) of the first side wall (331) of the third surface (1041) may partially overlap with the first surface (801) of the antenna structure (81), but may not overlap with the antenna array (812) of the antenna structure (81). The first surface (801) of the antenna structure (81) may include a third area and a fourth area based on the antenna array (812) when viewed from above the front plate (31). The antenna array (812) may be located between the third area and the fourth area. The third area may be connected to the first side (S1) of the antenna structure (81), and the fourth area may be connected to the second side (S2) of the antenna structure (81). In one embodiment, when viewed from above the front plate (31), the conductive area formed by the conductive portion (1070) of the first side wall (331) of the third surface (1041) may overlap with the third area, but may not overlap with the antenna array (812) of the antenna structure (81). The width (L) of the third surface (1041) extended in the y-axis direction may be, for example, one of a value of about 2.0 mm to about 3 mm, but is not limited thereto and may vary.

[0138] According to one embodiment, a portion (1071) of the conductive portion (1070) included in the first side wall (331) may be positioned toward the front plate (31) with respect to the first surface (801) of the antenna structure (81) and connected to the non-conductive portion (1060). The portion (1071) of the conductive portion (1070) included in the first side wall (331) may not overlap with the antenna array (812) of the antenna structure (81) (see FIG. 8) when viewed from above the front plate (31) (e.g., in the -z axis direction). In some embodiments, when viewed from above the front plate (31), a portion (1071) of the conductive portion (1070) included in the first side wall (331) may overlap with a portion (e.g., a third region) of the first surface (801) of the antenna structure (81), but may not overlap with the antenna array (812) of the antenna structure (81). In some embodiments, a portion (1071) of the conductive portion (1070) included in the first side wall (331) may not overlap with the first surface (801) of the antenna structure (81) when viewed from above the front plate (31).

[0139] According to some embodiments, the entire third side (1041) of the recess (1040) may be formed by a non-conductive portion (1060).

[0140] According to one embodiment, the non-conductive portion (1060) of the first side wall (331) may be located at least partially between the first surface (801) of the antenna structure (81) and the second area (B02) of the bezel area (B). The non-conductive portion (1060) may be utilized as part of the area for connection with the front plate (31) of the case (6). For example, some of the third gradual member (1630) (e.g., annular adhesive member) connecting the case (6) and the front plate (31) may be located between the non-conductive portion (1060) and the second area (B02) of the bezel area (B).

[0141] According to one embodiment, by means of a beamforming system, an antenna structure (81) can form a beam pattern (or antenna radiation pattern) formed by combining beams (or lobes) formed from a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of an antenna array (812) (see FIG. 8). The beam pattern can be formed by combining the radiated power of a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of the antenna array (812), as an effective area in which the antenna array (812) can radiate or detect electromagnetic waves. The beam pattern may include a main beam (or main lobe) (1660) toward the maximum radiation direction (boresight). For example, the main beam (1660) refers to a beam that radiates relatively high energy, and the antenna structure (81) can substantially transmit and / or receive frequency signals through the main beam (1660). In one embodiment, the antenna structure (81) can form the main beam (1660) in a direction toward the bezel area (B) (e.g., in the +z axis direction). When viewed in the direction in which the main beam (1660) of the antenna structure (81) radiates, the antenna array (812) of the antenna structure (81) may overlap at least partially with the bezel area (B) or a second area (B02) of the bezel area (B). In one embodiment, the width of the second area (B02) (e.g., the width in the y-axis direction in the illustrated example) may be a value included in about 2 mm to about 3 mm. When viewed in the direction in which the main beam (1660) of the antenna structure (81) is radiated, the area of ​​the second area (B02) of the bezel area (B) that overlaps with the antenna array (812), or the area of ​​the second area (B02) of the bezel area (B) through which the main beam (1660) passes, may be referred to as the RF window area (3013).The RF window area (3013) may not overlap with the display (301) when viewed from above the front plate (31) (e.g., in the -z axis direction). The RF window area (3013) may partially overlap with the non-conductive portion (1060) when viewed from above the front plate (31) or when viewed in the direction in which the main beam (1660) of the antenna structure (81) is radiated. A portion of the main beam (1660) formed in the antenna structure (81) may be directed toward the non-conductive portion (1060), and the non-conductive portion (1060) may reduce the influence of the first side wall (331) on the main beam (1660). When viewed in the direction in which the main beam (1660) of the antenna structure (81) is radiated, the antenna array (812) of the antenna structure (81) (see FIG. 8) may overlap at least partially with the non-conductive portion (1060). In the case of a comparative example where the non-conductive portion (1060) is replaced by a conductive portion and overlapped with the antenna array (812), the conductive portion may cause deformation or distortion of the beam pattern or shield or obstruct the propagation of radio waves radiated from the antenna structure (81). The non-conductive portion (1060) not only enables securing an area for coupling with the front plate (31), but also reduces the influence of the first side wall (331) on the radio waves radiated from the antenna structure (81), thereby reducing deformation or distortion of the beam pattern or enabling securing coverage (communication range).

[0142] According to one embodiment, a portion (1071) of the conductive portion (1070) of the first sidewall (331) that is located on the front plate (31) side with respect to the first surface (801) of the antenna structure (81) and connected to the non-conductive portion (1060) may not overlap with the RF window area (3013) when viewed from above the front plate (31). As a result, the effect of the conductive portion (1070) of the first sidewall (331) on the radiation performance of the antenna structure (81) may be substantially non-existent or negligible to the extent that the radiation performance of the antenna structure (81) can be secured.

[0143] According to one embodiment, the remaining portion of the non-conductive portion (1060), excluding the plurality of support ribs (1063a, 1063b, 1063c, 1063d) (see FIG. 11), may be positioned spaced apart from the antenna structure (81) or the first surface (801) of the antenna structure (81). For example, an air gap (G) may be formed between the remaining portion of the non-conductive portion (1060), excluding the plurality of support ribs (1063a, 1063b, 1063c, 1063d), and the antenna structure (81) (or the first surface (801)). In the case of a comparative example where there is substantially no air gap (G) or the height of the air gap (G) (e.g., height in the z-axis direction) is not within a critical range, deformation or distortion of the beam pattern formed from the antenna array (812) (see FIG. 8) may occur. In the case of a comparative example where there is substantially no air gap (G) or the height of the air gap (G) is not within a critical range, for example, the radiation performance of the antenna structure (81) may be degraded due to the permittivity of the non-conductive portion (1060). Deformation or distortion of the beam pattern may degrade the coverage (communication range) performance toward the front plate (31). The height of the air gap (G) may be formed to ensure the radiation performance of the antenna structure (81). The radio waves radiated from the antenna structure (81) toward the bezel area (B) (or RF window area (3013)) may include, for example, horizontal polarization and vertical polarization as dual polarization. When transmitting or receiving a signal having an operating frequency (e.g., about 28 GHz or about 39 GHz) using the antenna structure (81), the radiation performance regarding vertical polarization and / or horizontal polarization may vary depending on the height of the air gap (G). The height of the air gap (G) can be formed to ensure radiation performance by taking into account power loss (e.g., return loss) and / or antenna gain (e.g., peak gain). In the illustrated example, it is approximately 0.An air gap (G) can be formed with a value of 1 mm to about 0.5 mm to ensure radiation performance at the operating frequency. In various embodiments, the height of the air gap (G) for ensuring radiation performance of the antenna structure (81) can be formed in various ways depending on at least one of the material, shape, and / or boundary conditions of the surrounding components corresponding to the radio waves radiated from the antenna structure (81). In some embodiments, the air gap (G) is implemented to a minimum within the range of ensuring radiation performance at the operating frequency, which can contribute to slimming down the electronic device (3) (see FIG. 3).

[0144] According to one embodiment, the non-conductive portion (1060) may comprise various polymers such as engineering plastics (e.g., polycarbonate (PC) or polymethyl methacrylate (PMMA)). For example, the non-conductive portion (1060) may comprise polymer resins such as polyether ether ketone, polyphenylene sulfide, polybutylene terephthalate, polyimide, or polycarbonate. In some embodiments, the non-conductive portion (1060) may comprise a material in which the engineering plastic is mixed with various reinforcing materials such as glass fibers or carbon fibers (e.g., fiber reinforced plastic (FRP)). The non-conductive portion (1060) may have a relative dielectric constant value included in, for example, about 3.3 to about 3.7.

[0145] According to some embodiments, a non-conductive material (not shown) may be disposed between the non-conductive portion (1060) and the antenna structure (81) (or the first surface (801)). The non-conductive material may have a dielectric constant that does not substantially affect the radiation performance of the antenna structure (81). The non-conductive material may have a dielectric constant that does not affect the radiation performance of the antenna structure (81) to a level below the level to be achieved. The non-conductive material may include various adhesive materials, for example, as a low dielectric constant material, and the antenna structure (81) may be bonded to the non-conductive portion (1060) using the adhesive material. The non-conductive material may include adhesive materials such as a thermal adhesive material, a photo-reactive adhesive material, a general adhesive, or double-sided tape. Due to the non-conductive material, there may be substantially no air gap between the non-conductive portion (1060) and the antenna structure (81) (or the first surface (801)). In some embodiments, the non-conductive material between the non-conductive portion (1060) and the antenna structure (81) (or the first surface (801)) may have a heat dissipation function.

[0146] According to one embodiment, when the antenna structure (81) is positioned in the recess (1040) of the case (6) using a support member (9), the area where the first surface (801) of the antenna structure (81) overlaps with the display (301) when viewed from above the front plate (31) (e.g., in the -z axis direction) can be reduced compared to a comparative example where it is not. The structure in which the antenna structure (81) is positioned in the recess (1040) of the case (6) using a support member (9) can contribute to preventing the antenna array (812) of the antenna structure (81) (see FIG. 8) from overlapping with the display (301) when viewed from above the front plate (31). In one embodiment, the border area (3012) of the display (301) can be positioned between the bezel area (B) of the front plate (31) and the first surface (801) of the antenna structure (8). In the case of a comparative example where the conductive material included in the display (301) (e.g., a copper layer forming the back surface of the display (301)) overlaps with the antenna array (812) when viewed from above the front plate (31), the conductive material included in the display (301) may cause deformation or distortion of the beam pattern formed from the antenna array (812) of the antenna structure (81), or may shield or obstruct the propagation of radio waves radiated from the antenna structure (81). In the case of a comparative example where the conductive material included in the display (301) overlaps with the antenna array (812) when viewed from above the front plate (31), for example, a surface waver may be generated through the display (301) by radio waves radiated from the antenna array (812) of the antenna structure (81). The display (301) is a waveguide through which radio waves radiated from the antenna array (812) of the antenna module (81) flow, and, for example, can be a path of a medium through which radio waves flow.A beam pattern may be configured to be formed through the antenna array (812) of the antenna module (81), but surface waves guided to the display (301) may cause deformation (or distortion) of the beam pattern or reduce the beam coverage (communication range). At least a portion of the electromagnetic field formed from the antenna array (812) of the antenna module (81) may be reflected from the display (301), and the reflected component may cause compensation and / or interference in the direction of maximum radiation (e.g., the direction of the main beam (1660), thereby causing deformation (or distortion) of the beam pattern. In one embodiment, a structure in which the antenna structure (81) is positioned in the recess (1040) of the case (6) using a support member (9) may contribute to forming electromagnetic isolation between the display (301) and the antenna array (812) so as to secure the radiation performance of the antenna structure (81). For example, based on the wavelength of the antenna structure (81), the antenna array (812) may be positioned at a distance greater than that from the display (301). In some embodiments, the border area (3012) of the display (301) may be implemented in a shape that can reduce the degradation of the radiation performance of the antenna structure (81).

[0147] According to one embodiment, a printed circuit board (1640) may be positioned at least partially between a display (301) and a back plate (32). Components such as a processor (120), memory (130), or communication module (190) shown in FIG. 1 may be placed on the printed circuit board (1640). An antenna structure (81) may be electrically connected to the printed circuit board (1640) using an electrical path (85) (see FIG. 8). The printed circuit board (1640) may be referred to as a 'first printed circuit board,' and the printed circuit board (811) (see FIG. 8) included in the antenna structure (81) may be referred to as a 'second printed circuit board.' When viewed from above the front plate (31) (e.g., in the -z axis direction), the printed circuit board (1640) may not overlap with the antenna structure (81). The fourth support portion (④) of the support member (9) can be positioned between the printed circuit board (1640) and the antenna structure (81).

[0148] According to one embodiment, the printed circuit board (1640) may be placed on a back plate (32) using mechanical fastening elements such as screws. The back plate (32) may include a mounting surface on which components such as the printed circuit board (1640) or a battery (e.g., the battery (189) of FIG. 1) may be placed.

[0149] According to some embodiments, the electronic device (3) (see FIG. 3) may further include another support member (hereinafter, bracket) (not shown) extending from the side wall of the case (6) (e.g., the first side wall (331), the second side wall (332), the third side wall (333), and / or the fourth side wall (334) shown in FIG. 5). The bracket may contribute to the durability or rigidity (e.g., torsional rigidity) of the electronic device (3) as a portion on which components such as a display (301), a printed circuit board (1640), or a battery are placed. For example, the display (301) may be placed on one side of the bracket facing the front plate (31), and the printed circuit board (1640) may be placed on the other side of the bracket facing the rear plate (32). In some embodiments, the bracket may extend between the third support portion (③) of the support member (9) and the rear plate (32), in which case the third support portion (③) may be supported by the bracket. In some embodiments, the third support portion (③) may be joined to the bracket using an adhesive material or may be joined to the bracket using a mechanical fastening element such as a screw. In some embodiments, the bracket may include an opening (e.g., an opening in the form of a through hole or an opening in the form of a notch), and the support member (9) may be positioned in the opening and the third support portion (③) of the support member (9) may be supported by the rear plate (32).

[0150] FIG. 17 illustrates a cross-sectional structure (1700) of the yz plane with respect to the DD' line in FIG. 3 in another embodiment.

[0151] Referring to FIG. 17, the cross-sectional structure (1700) may include a front plate (31), a case (6), a display (301), an antenna structure (81), a support member (17), a first adhesive member (1610), a second adhesive member (1620), a third adhesive member (1630), and / or a printed circuit board (1640). The support member (17) may be implemented by omitting the second support member (②) compared to the support member (9) according to the example of FIG. 16. The first side (S1) of the antenna structure (81) may be joined to the fifth side (1043) of the recess (1040) using the second adhesive member (1620). Since the support member (17) is implemented by omitting the second support member (②) compared to the support member (19) of FIG. 16, the antenna structure (81) located in the case (6) using the support member (17) can be positioned further in the +y axis direction compared to the example of FIG. 16. In the example of FIG. 17, the RF window area (3013) can be formed further in the +y axis direction compared to the example of FIG. 16. As a result, the example of FIG. 17 can make it easier to design an expanded display area (3011) by reducing the bezel area (B) surrounding the display area (3011) compared to the example of FIG. 16. The example of FIG. 17 can further reduce the possibility of the display (301) affecting the main beam (1660) formed by the antenna structure (81) compared to the example of FIG. 16. The RF window area (3013) may partially overlap with the non-conductive portion (1060) when viewed from above the front plate (31) (e.g., in the -z axis direction), and the non-conductive portion (1060) may reduce the effect of the first side wall (331) on the main beam (1660). A portion (1071) of the conductive portion (1070) of the first side wall (331) that extends in the +z axis direction with respect to the first surface (801) of the antenna structure (81) may not overlap with the RF window area (3013) when viewed from above the front plate (31).As a result, the effect of the conductive portion (1070) of the first side wall (331) on the radiation performance of the antenna structure (81) may be substantially non-existent or insignificant enough to ensure the radiation performance of the antenna structure (81).

[0152] According to one embodiment of the present document, an electronic device (e.g., the electronic device (3) of FIG. 3) may include a housing (e.g., the housing (30) of FIG. 3). The housing may form a front surface of the electronic device (e.g., the front surface (30A) of FIG. 3), a rear surface of the electronic device (e.g., the rear surface (30B) of FIG. 3), and a side surface of the electronic device (e.g., the side surface (30C) of FIG. 3). The electronic device may include an antenna structure (e.g., the antenna structure (81) of FIG. 6 or 7) located in the internal space of the housing. The antenna structure may include a printed circuit board (e.g., the printed circuit board (811) of FIG. 6 or 7) comprising a first surface facing the front surface (e.g., the first surface (801) of FIG. 6) and a second surface facing in the opposite direction to the first surface (e.g., the second surface (802) of FIG. 7). The antenna structure may include at least one antenna element (e.g., a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of FIG. 6) located on the first surface or located inside the printed circuit board closer to the first surface than to the second surface. The electronic device may include a support member coupled to the housing. The antenna structure may be disposed on the support member. The support member on which the antenna structure is disposed may be inserted into a recess (e.g., recess (1040) of FIG. 16) formed in a side wall forming the side of the housing (e.g., the first side wall (331) of FIG. 16). The side wall may include a connection (e.g., the first connection (1051) of FIG. 12 or 13). A front plate forming the front of the housing (e.g., the front plate (31) of FIG. 16)) may be coupled to the connection. The above connection may be formed along the edge of the front plate. The connection may overlap with the front plate when viewed from above the front.A non-conductive portion included in the above connection (e.g., a non-conductive portion (1060) of FIG. 16) may be located between the first surface and the front plate. The non-conductive portion may overlap with at least one element when viewed from above on the front surface. The non-conductive portion may form at least a portion of a third surface (e.g., a third surface (1041) of FIG. 16) facing the first surface among the surfaces forming the recess. The support member may include a first support member (e.g., a pair of first support members (①) of FIG. 8 or 9) inserted into a groove formed in the non-conductive portion (e.g., a first groove (1061) or a second groove (1062) of FIG. 10, 11, 12, or 13).

[0153] According to one embodiment of the present document, the electronic device may further include a display (e.g., the display (301) of FIG. 16). The display may be located in the internal space of the housing (e.g., the housing (30) of FIG. 3). The display may be placed on the front plate (e.g., the front plate (31) of FIG. 16). The display may be located spaced apart from the non-conductive portion (e.g., the non-conductive portion (1060) of FIG. 16) when viewed from above the front (e.g., the front (30A) of FIG. 3). The front plate may include a bezel portion (e.g., the bezel portion (B) of FIG. 16) coupled to the connection portion, which does not overlap with the display area (e.g., the display area (3011) of FIG. 16) when viewed from above the front. The above at least one antenna element (e.g., a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of FIG. 8 or 9) may overlap with the bezel area when viewed from above on the front surface and may not overlap with the display area.

[0154] According to one embodiment of the present document, the display (e.g., the display (301) of FIG. 16) may further include a border area (e.g., the border area (3012) of FIG. 16) that overlaps with the bezel area (e.g., the bezel area (B) of FIG. 16) when viewed from above the front (e.g., the front (30A) of FIG. 3). The border area may not overlap with the at least one antenna element (e.g., the plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of FIG. 8 or 9) when viewed from above the front.

[0155] According to one embodiment of the present document, the bezel area (e.g., bezel area (B) of FIG. 16) may include a first area (e.g., first area (B01) of FIG. 16) that overlaps with the border area (e.g., border area (3012) of FIG. 16) when viewed from above the front (e.g., front (30A) of FIG. 3), and a second area (e.g., second area (B02) of FIG. 16) that is not overlapped with the border area and is coupled with the connecting part (e.g., first connecting part (1051) of FIG. 10, 11, 12, or 13). The antenna structure (e.g., antenna structure (81) of FIG. 16) may radiate a main beam (e.g., main beam (1660) of FIG. 16) in the direction toward which the first surface (e.g., first surface (801) of FIG. 16) faces. The above main beam can penetrate the above second region.

[0156] According to one embodiment of the present document, the support member (e.g., the support member (9) of FIG. 8 or 9) may include a metallic material.

[0157] According to one embodiment of the present document, the printed circuit board (e.g., the printed circuit board (811) of FIG. 6 or 7) may include a side connecting the first surface (e.g., the first surface (801) of FIG. 6) and the second surface (e.g., the second surface (802) of FIG. 7). The side of the printed circuit board may include a first side facing the side wall (e.g., the first side wall (331) of FIG. 16) (e.g., the first side (S1) of FIG. 9), a second side located opposite to the first side (e.g., the second side (S2) of FIG. 9), and a third side (e.g., the third side (S3) of FIG. 9) and a fourth side (e.g., the fourth side (S4) of FIG. 9) located perpendicular to the first side and opposite to each other. The first support member (e.g., a pair of first support members (①) of FIG. 8 or 9) may be positioned facing the third side or the fourth side. A part of the first support member (e.g., the first insert (901) or the second insert (902) of FIG. 8 or 9) may protrude with respect to the first surface (e.g., the first surface (801) of FIG. 8) and be inserted into the groove (e.g., the first groove (1061) or the second groove (1062) of FIG. 11 or 12).

[0158] According to one embodiment of the present document, the support member (e.g., the support member (9) of FIG. 8 or 9) may further include a third support member (e.g., the third support member (③) of FIG. 8) facing the second surface (e.g., the second surface (802) of FIG. 7) or a fourth support member (e.g., the fourth support member (④) of FIG. 9) facing the second side (e.g., the second side (S2) of FIG. 9). The first support member (e.g., a pair of support members (①) of FIG. 9) may extend from the third support member or the fourth support member.

[0159] According to one embodiment of the present document, a part of the first support member (e.g., the first insert (901) or the second insert (902) of FIG. 11, 12, or 13) inserted into the groove (e.g., the first groove (1061) or the second groove (1062) of FIG. 11, 12, or 13) may include a hemming structure.

[0160] According to one embodiment of the present document, the groove (e.g., the first groove (1061) or the second groove (1062) of FIG. 11, 12, or 13) may be formed in a notch shape when viewed from above on the front surface (e.g., the front surface (30A) of FIG. 3).

[0161] According to one embodiment of the present document, the third surface (e.g., the third surface (1041) of FIG. 16) may be positioned spaced apart from the first surface (e.g., the first surface (801) of FIG. 16). The non-conductive portion (e.g., the non-conductive portion (1060) of FIG. 16) may include one or more support ribs (e.g., a plurality of support ribs (1063a, 1063b, 1063c, 1063d) of FIG. 11 or 12). The one or more support ribs may extend outward from the third surface to support the first surface. The above one or more support ribs may not overlap with the at least one antenna element (e.g., the plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of FIG. 11 or 13) when viewed from above on the front (e.g., the front (30A) of FIG. 3).

[0162] According to one embodiment of the present document, the surface forming the recess (e.g., the recess (1040) of FIG. 16) may include a fourth surface (e.g., the fourth surface (1042) of FIG. 16) located opposite to the third surface (e.g., the third surface (1041) of FIG. 16), and a fifth surface (e.g., the fifth surface (1043) of FIG. 16) connecting the third surface and the fourth surface. The support member (e.g., the support member (9) of FIG. 16) may further include a second support member (e.g., the second support member (②) of FIG. 16) located between the printed circuit board and the fifth surface. An adhesive material (e.g., the second adhesive member (1620) of FIG. 16) may be located between the second support member and the fifth surface.

[0163] According to one embodiment of the present document, the support member (e.g., the support member (9) of FIG. 16) may further include a third support member (e.g., the third support member (③) of FIG. 16) facing the second surface (e.g., the second surface (802) of FIG. 16). An adhesive material (e.g., the first adhesive member (1610) of FIG. 16) may be positioned between the second surface and the third support member.

[0164] According to one embodiment of the present document, the support member (e.g., support member (9) of FIG. 16) may further include a third support member (e.g., third support member (③) of FIG. 16) facing the second surface (e.g., second surface (802) of FIG. 16). The third support member may be supported by a rear plate (e.g., rear plate (32) of FIG. 16) forming the rear surface (e.g., rear surface (30B) of FIG. 3) of the housing (e.g., housing (30) of FIG. 3).

[0165] According to one embodiment of the present document, the third support member (e.g., the third support member (③) of FIG. 16) may include a convex shape (e.g., the convex structure (1650) of FIG. 16) protruding toward the rear plate (e.g., the rear plate (32) of FIG. 16).

[0166] According to one embodiment of the present document, the sidewall (e.g., the first sidewall (331) of FIG. 16) may include a conductive portion (e.g., the conductive portion (1070) of FIG. 16) connected to the non-conductive portion (e.g., the non-conductive portion (1060) of FIG. 16). The conductive portion may form at least a portion of the side of the electronic device (e.g., the side (30C) of FIG. 3). The third surface (e.g., the third surface (1041) of FIG. 16) may include a non-conductive region formed by the non-conductive portion and a conductive region formed by the conductive portion. A portion of the conductive part that is located on the front plate side with respect to the first surface and connected to the non-conductive part may not overlap with at least one antenna element (e.g., a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of FIG. 8 or 9) when viewed from above the front (e.g., the front (30A) of FIG. 3).

[0167] According to one embodiment of the present document, an electronic device (e.g., the electronic device (3) of FIG. 3) may include a housing (e.g., the housing (30) of FIG. 3). The housing may form a front surface of the electronic device (e.g., the front surface (30A) of FIG. 3), a rear surface of the electronic device (e.g., the rear surface (30B) of FIG. 3), and a side surface of the electronic device (e.g., the side surface (30C) of FIG. 3). The electronic device may include an antenna structure (e.g., the antenna structure (81) of FIG. 6 or 7) located in an internal space of the housing. The antenna structure may include a printed circuit board (e.g., the printed circuit board (811) of FIG. 6 or 7). The printed circuit board may include a first surface facing the front (e.g., the first surface (801) of FIG. 6), a second surface facing in the opposite direction to the first surface (e.g., the second surface (802) of FIG. 7), a first side facing the side of the electronic device (e.g., the first side (S1) of FIG. 9), a second side located opposite to the first side (e.g., the second side (S2) of FIG. 6), and a third side (e.g., the third side (S3) of FIG. 9) and a fourth side (e.g., the fourth side (S4) of FIG. 9) located perpendicular to the first side and opposite to each other. The antenna structure may include at least one antenna element (e.g., a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of FIG. 9) located on the first surface or located inside the printed circuit board closer to the first surface than to the second surface. The electronic device may include a support member (e.g., support member (9) of FIG. 8 or 9) coupled to the housing. The antenna structure may be placed on the support member. The support member on which the antenna structure is placed may be inserted into a recess (e.g., recess (1040) of FIG. 16) formed in a sidewall (e.g., first sidewall (331) of FIG. 16) forming the side of the electronic device in the housing.The above side wall may include a connecting portion (e.g., the connecting portion (1051) of FIG. 11, 12, or 13). A front plate forming the front of the housing (e.g., the front plate (31) of FIG. 16) may be joined to the connecting portion. The connecting portion may be formed along the edge of the front plate and may overlap with the front plate when viewed from above the front. A non-conductive portion included in the connecting portion (e.g., the non-conductive portion (1060) of FIG. 16) may be located between the first surface and the front plate. The non-conductive portion may overlap with the at least one element when viewed from above the front and may form at least a portion of a third surface (e.g., the third surface (1041) of FIG. 16) that faces the first surface among the surfaces forming the recess. The support member may include a first support member positioned facing the third side or the fourth side (e.g., a pair of first support members (①) of FIG. 8 or 9). A part of the first support member (e.g., the first insert (901) or the second insert (902) of FIG. 8 or 9) may protrude from the first surface and be inserted into a groove formed in the non-conductive portion in the form of a notch when viewed from above on the front surface (e.g., the first groove (1061) or the second groove (1062) of FIG. 11, 12, or 13).

[0168] According to one embodiment of the present document, a part of the first support member (e.g., the first insert (901) or the second insert (902) of FIG. 8 or 9) inserted into the groove (e.g., the first groove (1061) or the second groove (1062) of FIG. 11, 12, or 13) may include a hemming structure.

[0169] According to one embodiment of the present document, the third surface (e.g., the third surface (1041) of FIG. 16) may be positioned spaced apart from the first surface (e.g., the first surface (801) of FIG. 16). The non-conductive portion (e.g., the non-conductive portion (1060) of FIG. 16) may further include one or more support ribs (e.g., a plurality of support ribs (1063a, 1063b, 1063c, 1063d) of FIG. 11) that protrude and extend from the third surface to support the first surface. The above one or more support ribs may not overlap with the at least one antenna element (e.g., the plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of FIG. 13) when viewed from above on the front (e.g., the front (30A) of FIG. 3).

[0170] According to one embodiment of the present document, the surface forming the recess (e.g., the recess (1040) of FIG. 16) may include a fourth surface (e.g., the fourth surface (1042) of FIG. 16) located opposite to the third surface (e.g., the third surface (1041) of FIG. 16), and a fifth surface (e.g., the fifth surface (1043) of FIG. 16) connecting the third surface and the fourth surface. The support member (e.g., support member (9) of FIG. 16) may further include a second support member (e.g., second support member (②) of FIG. 16) located between the first side (e.g., first side (S1) of FIG. 9) and the fifth side, and a third support member (e.g., third support member (③) of FIG. 16) facing the second side (e.g., second side (802) of FIG. 16). An adhesive material (e.g., second adhesive member (1620) of FIG. 16) may be located between the second support member and the fifth side. The third support member may be supported by a rear plate (e.g., second rear plate (32) of FIG. 16) forming the rear side (e.g., rear side (30B) of FIG. 3) of the housing (e.g., housing (30) of FIG. 3).

[0171] According to one embodiment of the present document, the electronic device may further include a display (e.g., the display (301) of FIG. 16). The display may be located in the internal space of the housing (e.g., the housing (30) of FIG. 3) and may be placed on the front plate (e.g., the front plate (31) of FIG. 16). The display may be located spaced apart from the non-conductive portion (e.g., the non-conductive portion (1060) of FIG. 16) when viewed from above on the front. The front plate may include a bezel area (e.g., the bezel area (B) of FIG. 16) coupled with the connection portion (e.g., the first connection portion (1051) of FIG. 11, 12, or 13) without overlapping with the display area (e.g., the display area (3011) of FIG. 16)) when viewed from above on the front (e.g., the front (30A) of FIG. 3). The above at least one antenna element (e.g., a plurality of antenna elements (812a, 812b, 812c, 812d, 812e) of FIG. 13) may overlap with the bezel area and not overlap with the display area when viewed from above the front (e.g., the front (30A) of FIG. 3). The antenna structure (e.g., the antenna structure (81) of FIG. 16) radiates a main beam (e.g., the main beam (1660) of FIG. 16) in the direction toward which the first surface (e.g., the first surface (801) of FIG. 16)) faces, and the main beam may penetrate the bezel area.

[0172] The embodiments disclosed in this document and drawings are provided merely as specific examples to facilitate the explanation of the technical content and to aid in understanding the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of the various embodiments of this document should be interpreted to include modified or altered forms in addition to the embodiments disclosed herein. Explanation of the symbols

[0174] 1600: Cross-sectional structure 31: Front plate 6: Case 32: Rear plate 331: First side wall 1040: Recess 81: Antenna structure 9: Lack of support 1610: First adhesive member 1620: Second adhesive member 1630: Third adhesive member 1060: Non-conductive part 1070: Challenging part B: Bezel area B01: Area 1 B02: Area 2 3011: Display area 3012: Border area 3013: RF Window Area

Claims

Claim 1 An electronic device comprises: a housing forming the front surface of the electronic device, the rear surface of the electronic device, and the side surface of the electronic device; a printed circuit board comprising a first surface facing the front surface and a second surface facing in a direction opposite to the first surface; and an antenna structure positioned in the internal space of the housing, comprising at least one antenna element positioned on the first surface or positioned inside the printed circuit board closer to the first surface than to the second surface. An electronic device comprising an antenna structure disposed therein and a support member coupled to the housing, wherein the support member on which the antenna structure is disposed is inserted into a recess formed in a side wall forming the side of the housing, the side wall is coupled to a front plate forming the front of the housing and is formed along the edge of the front plate and includes a connection portion that overlaps with the front plate when viewed from above the front, the non-conductive portion included in the connection portion is located between the first surface and the front plate and overlaps with the at least one element when viewed from above the front, and forms at least a third surface facing the first surface among the surfaces forming the recess, the support member includes a first support portion inserted into a groove formed in the non-conductive portion, and a portion of the first support portion inserted into the groove includes a hemming structure. Claim 2 An electronic device according to claim 1, further comprising a display positioned in the internal space of the housing and disposed on the front plate, wherein the display is positioned spaced apart from the non-conductive portion when viewed from above the front, the front plate includes a bezel area coupled to the connection portion that does not overlap with the display area of ​​the display when viewed from above the front, and the at least one antenna element overlaps with the bezel area and does not overlap with the display area when viewed from above the front. Claim 3 In claim 2, the display further includes a border area that overlaps with the bezel area when viewed from above on the front surface, and the border area does not overlap with the at least one antenna element when viewed from above on the front surface. Claim 4 In claim 3, the bezel area includes a first area that overlaps with the border area when viewed from above on the front surface, and a second area that is not overlapped with the border area and is coupled to the connecting part, and the antenna structure radiates a main beam in the direction facing the first surface, and the main beam penetrates the second area, an electronic device. Claim 5 In claim 1, the support member is an electronic device comprising a metal material. Claim 6 In claim 1, the printed circuit board includes a side connecting the first surface and the second surface, and the side of the printed circuit board includes a first side facing the side wall, a second side located opposite to the first side, and a third side and a fourth side located perpendicular to the first side and opposite to each other, the first support member is positioned facing the third side or the fourth side, a part of the first support member protrudes with respect to the first surface, and an electronic device inserted into the groove. Claim 7 In claim 6, the support member further comprises a third support member facing the second surface or a fourth support member facing the second side, and the first support member is an electronic device extending from the third support member or the fourth support member. Claim 8 delete Claim 9 In claim 1, the groove is formed in the shape of a notch when viewed from above on the front surface of the electronic device. Claim 10 An electronic device according to claim 1, wherein the third surface is positioned spaced apart from the first surface, and the non-conductive portion further comprises one or more support ribs that protrude from the third surface and support the first surface, and wherein the one or more support ribs do not overlap with the at least one antenna element when viewed from above on the front surface. Claim 11 An electronic device according to claim 1, wherein the surface forming the recess includes a fourth surface located opposite to the third surface and a fifth surface connecting the third surface and the fourth surface, and the support member further includes a second support located between the printed circuit board and the fifth surface, and an adhesive material located between the second support and the fifth surface. Claim 12 An electronic device according to claim 1, wherein the support member further comprises a third support member facing the second surface, and an adhesive material is positioned between the second surface and the third support member. Claim 13 In claim 1, the support member further comprises a third support member facing the second surface, and the third support member is an electronic device supported by a rear plate forming the rear surface of the housing. Claim 14 In claim 13, the electronic device wherein the third support member comprises a convex shape protruding toward the rear plate. Claim 15 In claim 1, the sidewall includes a conductive portion connected to the non-conductive portion and forming at least a portion of the side of the electronic device, and the third surface includes a non-conductive region formed by the non-conductive portion and a conductive region formed by the conductive portion, wherein the portion of the conductive portion located toward the front plate with respect to the first surface and connected to the non-conductive portion does not overlap with the at least one antenna element when viewed from above on the front surface. Claim 16 An electronic device comprises: a housing forming the front surface of the electronic device, the rear surface of the electronic device, and the side surface of the electronic device; a printed circuit board comprising a first surface facing the front surface, a second surface facing in a direction opposite to the first surface, a first side facing the side surface of the electronic device, a second side positioned opposite to the first side surface, and a third side and a fourth side positioned perpendicular to the first side surface and opposite to each other; and an antenna structure positioned in the internal space of the housing, comprising at least one antenna element positioned on the first surface or positioned inside the printed circuit board closer to the first surface than to the second surface. The electronic device comprises an antenna structure disposed therein and a support member coupled to the housing, wherein the support member on which the antenna structure is disposed is inserted into a recess formed in a side wall forming a side of the electronic device in the housing, the side wall is coupled to a front plate forming the front of the housing, is formed along the edge of the front plate, and includes a connection portion that overlaps with the front plate when viewed from above the front, the non-conductive portion included in the connection portion is located between the first surface and the front plate, overlaps with the at least one element when viewed from above the front, and forms at least a third surface facing the first surface among the surfaces forming the recess, the support member includes a first support portion located facing the third side or the fourth side, a portion of the first support portion protrudes with respect to the first surface and is inserted into a groove formed in the non-conductive portion in a notch shape when viewed from above the front, and the portion of the first support portion inserted into the groove includes a hemming structure. Claim 17 delete Claim 18 An electronic device according to claim 16, wherein the third surface is positioned spaced apart from the first surface, and the non-conductive portion further comprises one or more support ribs that protrude from the third surface and support the first surface, and wherein the one or more support ribs do not overlap with the at least one antenna element when viewed from above on the front surface. Claim 19 In claim 16, the surface forming the recess includes a fourth surface located opposite to the third surface, and a fifth surface connecting the third surface and the fourth surface, and the support member further includes a second support located between the first side and the fifth surface and a third support facing the second surface, an adhesive material located between the second support and the fifth surface, and the third support is supported by a rear plate forming the rear surface of the housing. Claim 20 An electronic device according to claim 16, further comprising a display positioned in the internal space of the housing and disposed on the front plate, wherein the display is positioned spaced apart from the non-conductive portion when viewed from above the front, the front plate includes a bezel area coupled to the connection portion that does not overlap with the display area of ​​the display when viewed from above the front, and the at least one antenna element overlaps with the bezel area and does not overlap with the display area when viewed from above the front, and the antenna structure radiates a main beam in the direction facing the first surface, and the main beam penetrates the bezel area.

Images