Road lighting system that displays road surface conditions

Abstract

A buried sensor device for measuring the temperature and humidity of a road according to the present invention may include: a case portion that is buried in a buried groove formed in the road and has an open upper surface and an internal receiving space formed therein; a sensor portion that is received in the receiving space such that at least a portion is exposed to the outside and has a humidity measuring member through which a current flows that changes in a current value corresponding to road humidity, which is the humidity near the road surface, and a temperature measuring member through which a resistance value changes in a road temperature, which is the temperature near the road surface; and a processor that generates a road humidity value representing the road humidity based on the current value of the current flowing through the humidity measuring member, and generates a road temperature value representing the road temperature based on the resistance value of the temperature measuring member.

Description

Technology Field

[0001] The present invention relates to an embedded sensor device for measuring the temperature and humidity of a road, and more specifically, to an embedded sensor device that is embedded in a road to measure and generate a road humidity value representing road humidity and a road temperature value representing road temperature. Background Technology

[0003] In the United States, approximately 6 million traffic accidents occur annually. In particular, slippery road surfaces alone cause an average of over 1.2 million accidents per year in the U.S., resulting in more than 5,000 deaths annually. Consequently, slippery road surfaces are emerging as a social issue that places a significant burden on the government and insurance companies.

[0004] Korea is no exception. Black ice accidents occur every winter, with 6,500 incidents occurring in the last five years and approximately 200 deaths.

[0005] In Korea, the snow melting process consists of four stages, but the transmission of this entire process is manual and takes several hours to reach the final stage. In the case of past black ice accidents, they were man-made disasters caused by officials failing to request snow melting in advance, even though they had checked the forecast.

[0006] These accidents are caused by the absence of sensors capable of detecting road surface conditions in real time and a notification system utilizing them.

[0007] Meanwhile, there are broadly two methods proposed so far for estimating road surface types or friction coefficients.

[0008] One is a direct method of finding out by causing physical friction, and the other is an indirect method using radio waves or sound waves.

[0009] First, direct methods include wheel-based methods and vehicle dynamics-based methods.

[0010] The commonality of these two methods is that they apply the brakes regardless of the driver's intention to estimate the coefficient of friction of the road surface based on the degree of vehicle deceleration.

[0011] This method requires driving on the road surface where the coefficient of friction is to be determined, and a vehicle dynamics model is essential. Additionally, since the brakes must be applied, there are limitations in that it affects ride comfort and fuel efficiency.

[0012] Meanwhile, indirect methods include those utilizing electromagnetic and sound waves; since both of these methods do not require physical friction, they can be used independently of vehicle dynamics models and have the advantage of knowing the road surface condition in advance without contact with the road surface.

[0013] The aforementioned electromagnetic wave-based methods use cameras, lidar, radar, etc., which can see quite far, but their accuracy is relatively low, and the systems are very expensive, ranging from hundreds to thousands of dollars. In addition, there are difficulties in creating data sets due to the large amount of data.

[0014] There is also a method using image sensors, which are a type of electromagnetic wave technology, to distinguish road surface types using cameras. However, image sensors are significantly affected by lighting conditions, and just as black ice is difficult for the human eye to see, vision sensors cannot detect it. Due to these limitations, the average performance of methods using image sensors is less than 70%. Furthermore, since high-performance image processing units are required in addition to image sensors, the cost is relatively high.

[0015] Just as black ice is invisible to the human eye, it cannot be detected by image sensors. In other words, image sensor methods have limitations in that they cannot distinguish between various types of road surfaces.

[0016] Meanwhile, regarding the aforementioned sound wave-based methods, there are passive and active sensing methods. The passive sensing method involves recording tire noise with a microphone for a certain period and then classifying it using an artificial neural network. However, this method has limitations in that it can only identify the type of road surface the tire has passed over and requires a long time for classification. On the other hand, among active sensing methods, there is research that distinguishes reflected road surfaces using only distance and reflection intensity information; however, this has the disadvantage of being susceptible to ambient disturbances.

[0017] Meanwhile, many electric and hydrogen cars with sky-blue license plates are being seen on the roads these days. According to Bloomberg, it is predicted that by 2040, more than half of the vehicles sold will be electric, and one-third of the vehicles on the road will be electric.

[0018] Vehicle manufacturers are actively utilizing regenerative braking to increase the mileage of electric vehicles. However, it is not uncommon to hear news of accidents caused by cars skidding due to regenerative braking. Symptoms such as the rear wheels losing traction or the wheels locking up occur due to regenerative braking.

[0019] Currently, Tesla's regenerative braking settings can be changed to Standard or Low, but there is no option to turn it off. The reason these accidents occur is that the control cycle of the regenerative braking module is 100ms, which is longer than other systems, and the reason manufacturers do not allow the regenerative braking function to be turned off is that the vehicle's driving range drops rapidly.

[0020] It would seem best to use regenerative braking based on the condition of the road surface, but this problem arises because the type of road surface cannot be known in advance before the vehicle passes over it.

[0021] Accordingly, technology capable of measuring various information about the road is required to monitor the condition of the road surface. Prior art literature

[0023] Korean Registered Patent No. 10-2330612 The problem to be solved

[0024] The objective of the present invention is to provide an embedded sensor device that is embedded in a road and measures and generates a road humidity value representing road humidity and a road temperature value representing road temperature.

[0025] The objects of the present invention are not limited to those mentioned above, and other unmentioned objects and advantages of the present invention may be understood from the following description and will be more clearly understood by the embodiments of the present invention. Furthermore, it will be readily apparent that the objects and advantages of the present invention can be realized by the means and combinations thereof set forth in the claims. means of solving the problem

[0027] A buried sensor device for measuring the temperature and humidity of a road according to the present invention may include: a case portion that is buried in a buried groove formed in the road and has an open upper surface and an internal receiving space formed therein; a sensor portion that is received in the receiving space such that at least a portion is exposed to the outside and has a humidity measuring member through which a current flows that changes in a current value corresponding to road humidity, which is the humidity near the road surface, and a temperature measuring member through which a resistance value changes in a road temperature, which is the temperature near the road surface; and a processor that generates a road humidity value representing the road humidity based on the current value of the current flowing through the humidity measuring member, and generates a road temperature value representing the road temperature based on the resistance value of the temperature measuring member.

[0028] The humidity measuring member is a plurality of humidity sensor rods spaced apart so that at least a portion of them is exposed to the outside and energized by moisture or water near the road surface, and the sensor unit may further include a current measuring module that measures the current value of the current flowing through the plurality of humidity sensor rods and outputs it to the processor.

[0029] The processor can identify a reference current value identical to the current value output from the current measurement module in current-humidity data in which a reference humidity value is mapped to each of a plurality of reference current values, and generate the reference humidity value mapped to the identified reference current value as the road humidity value.

[0030] The above temperature measuring member is a temperature sensing element in which at least a portion is exposed to the outside and the resistance value changes in response to the temperature near the road surface, and the sensor unit may further include a resistance measuring module that measures the resistance value of the temperature sensing element and outputs it to the processor.

[0031] The processor can identify a reference resistance value identical to the resistance value output from the resistance measurement module in resistance-temperature data in which a reference temperature value is mapped to each of a plurality of reference resistance values, and generate the reference temperature value mapped to the identified reference resistance value as the road temperature value.

[0032] The above processor can control the communication unit so that the road humidity value and the road temperature value are transmitted to an external device.

[0033] The embedded sensor device for measuring the temperature and humidity of the road according to the present invention may further include: a substrate portion in which the sensor portion and the processor are mounted and which is accommodated in the receiving space; and a cushioning portion that absorbs vibrations and shocks applied to the receiving space through the case portion by surrounding the remaining part of the sensor portion, the processor, and the substrate portion, which are accommodated in the receiving space but are not exposed to the outside within the receiving space. Effects of the invention

[0035] According to the present invention, by measuring and generating road humidity values ​​representing road humidity and road temperature values ​​representing road temperature that are embedded in the road, it is possible to stably detect the moisture and temperature conditions near the road surface in real time while minimizing the influence of direct external impacts or environmental factors.

[0036] In addition, according to the present invention, by precisely detecting changes in current based on the presence or absence of moisture or water through a plurality of humidity sensor rods and precisely measuring the road surface temperature through a temperature sensing member based on changes in resistance value for temperature measurement, data can be provided that can accurately determine the road surface condition according to weather changes.

[0037] In addition, according to the present invention, by converting measured analog data into a digital signal and inputting it into a processor, road temperature and humidity information can be collected and processed in real time, and can be effectively utilized for predicting freezing risks, determining the timing for spraying de-icing agents, and linking with traffic safety information systems. Brief explanation of the drawing

[0039] FIG. 1 is an upper perspective view of a buried sensor device for measuring the temperature and humidity of a road according to one embodiment of the present invention. FIG. 2 is a lower perspective view of an embedded sensor device for measuring the temperature and humidity of a road according to one embodiment of the present invention. FIG. 3 is a block diagram of a buried sensor device for measuring the temperature and humidity of a road according to one embodiment of the present invention. FIG. 4 is an upper exploded perspective view of a buried sensor device for measuring the temperature and humidity of a road according to one embodiment of the present invention. FIG. 5 is a lower exploded perspective view of an embedded sensor device for measuring the temperature and humidity of a road according to one embodiment of the present invention. FIG. 6 is a diagram showing a state in which circuit components are mounted on a substrate of a buried sensor device for measuring the temperature and humidity of a road according to one embodiment of the present invention. FIG. 7 is a perspective view of an embedded sensor device for measuring the temperature and humidity of a road according to another embodiment of the present invention. FIG. 8 is an exploded perspective view of the bracket portion of an embedded sensor device for measuring the temperature and humidity of a road according to another embodiment of the present invention. FIG. 9 is a diagram illustrating the process of a buried sensor device for measuring the temperature and humidity of a road according to another embodiment of the present invention being further inserted into a buried groove. Specific details for implementing the invention

[0040] Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments and should be understood to include various modifications, equivalents, and / or alternatives of the embodiments of the present invention. In connection with the description of the drawings, similar reference numerals may be used for similar components.

[0041] In this document, expressions such as "have," "may have," "include," or "may include" refer to the existence of the relevant feature (e.g., numerical values, functions, operations, or components, etc.) and do not exclude the existence of additional features.

[0042] In this document, expressions such as “A or B”, “at least one of A or / and B”, or “one or more of A or / and B” may include all possible combinations of items listed together. For example, “A or B”, “at least one of A and B”, or “at least one of A or B” may refer to cases including (1) at least one A, (2) at least one B, or (3) both at least one A and at least one B.

[0043] Expressions such as "first," "second," "first," or "second" used in this document may modify various components regardless of order and / or importance, and are used merely to distinguish one component from another without limiting such components. For example, the first user device and the second user device may represent different user devices regardless of order or importance. As another example, without departing from the scope of rights set forth in this document, the first component may be named the second component, and similarly, the second component may be renamed the first component.

[0044] When it is stated that a certain component (e.g., a first component) is "(operatively or communicatively) coupled with / to" or "connected to" another component (e.g., a second component), it should be understood that said certain component is directly connected to said other component or may be connected through said other component (e.g., a third component). On the other hand, when it is stated that a certain component (e.g., a first component) is "directly connected" or "directly connected" to said other component (e.g., a second component), it may be understood that no other component (e.g., a third component) exists between said certain component and said other component.

[0045] As used in this document, the expression "configured to" may be replaced, depending on the context, with, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" does not necessarily mean "specifically designed to" in hardware. Instead, in some situations, the expression "device configured to" may mean that the device is "capable of" in conjunction with other devices or components. For example, the phrase “a control unit configured (or set) to perform A, B, and C” may mean a dedicated processor for performing said operations (e.g., an embedded processor), or a generic-purpose processor (e.g., a CPU or an application processor) capable of performing said operations by executing one or more software programs stored in memory.

[0046] In particular, in this specification, the “~device” may include one or more of a Central Processing Unit (CPU), an Application Processor (AP), and a Communication Processor (CP).

[0047] In this specification, “~device” means any type of hardware device including at least one processor, and according to the embodiments, it may be understood to include software configurations operating on said hardware device.

[0048] The terms used in this document are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this document. Terms used in this document that are defined in general dictionaries may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this document. In some cases, even terms defined in this document may not be interpreted to exclude the embodiments of this document.

[0049] FIG. 1 is an upper perspective view of a buried sensor device for measuring the temperature and humidity of a road according to an embodiment of the present invention, FIG. 2 is a lower perspective view of a buried sensor device for measuring the temperature and humidity of a road according to an embodiment of the present invention, and FIG. 3 is a block diagram of a buried sensor device for measuring the temperature and humidity of a road according to an embodiment of the present invention.

[0050] Referring to FIGS. 1 to 3, a buried sensor device for measuring the temperature and humidity of a road according to one embodiment of the present invention (hereinafter referred to as the "buried sensor device") is buried in a buried groove formed in the road and can generate a road humidity value representing the humidity near the road surface and a road temperature value representing the temperature near the road surface.

[0051] Here, the recessed groove is formed in the road, but can be formed in the outer side of the lane where vehicles travel.

[0052] The embedded sensor device according to one embodiment of the present invention operates by receiving driving power from an external source and can transmit the generated road humidity value and road temperature value to the outside.

[0053] The embedded sensor device according to one embodiment of the present invention may include a case part (110), a substrate part (120), a sensor part (130), a processor (140), a notification part (150), a communication part (160), a buffer part (170), a bracket part (180), a power supply part (P), and a storage part (M) so as to be embedded in an embedded groove formed in the road and to generate and transmit road humidity and road temperature values ​​to the outside.

[0054] FIG. 4 is an upper exploded perspective view of an embedded sensor device for measuring the temperature and humidity of a road according to an embodiment of the present invention, FIG. 5 is a lower exploded perspective view of an embedded sensor device for measuring the temperature and humidity of a road according to an embodiment of the present invention, and FIG. 6 is a drawing showing a state in which circuit components are mounted on a substrate portion of an embedded sensor device for measuring the temperature and humidity of a road according to an embodiment of the present invention.

[0055] Referring further to FIGS. 4 to 6, the case portion (110) is embedded in a recessed groove formed in the road, and the upper surface is open and a receiving space can be formed inside.

[0056] Such a case part (110) is formed in the shape of a rectangular prism with a hollow interior, and as described above, the upper surface can be open.

[0057] Additionally, the case portion (110) can accommodate a substrate portion (120) surrounded by a buffer portion (170) in an inner receiving space.

[0058] At this time, circuit components such as a sensor unit (130), a processor (140), a notification unit (150), a communication unit (160), a power supply unit (P), and a storage unit (M) are mounted on the substrate unit (120), and the buffer unit (170) can surround the substrate unit (120) in which the sensor unit (130), processor (140), notification unit (150), communication unit (160), power supply unit (P), and storage unit (M) are mounted.

[0059] Meanwhile, the case part (110) may have bracket parts (180) attached to both sides.

[0060] The bracket part (180) will be described later.

[0061] Meanwhile, the case portion (110) may have a plurality of fixing pins formed therein that protrude from the inner surface toward the substrate hole of the substrate portion (120) and are inserted so as to fix the substrate portion (120) that is accommodated in the inner receiving space.

[0062] Such a fixing pin can be inserted into a substrate hole to fix the substrate part (120) in the inner receiving space.

[0063] Meanwhile, the case portion (110) may have a first cable hole formed through it to allow a first cable (CA) through which data, information, signals, and driving power are input / received, and a second cable hole formed through it to allow a second cable (CA) through which data, information, signals, and driving power are output / transmitted, formed on the side.

[0064] Such, the case part (110) can be formed of a material that is rigid and corrosion-resistant to resist impact.

[0065] For example, the case part (110) can be formed from SUS 304 material with a thickness of 1.0t.

[0066] As described above, the substrate (120) is equipped with circuit components such as a sensor unit (130), a processor (140), a notification unit (150), a communication unit (160), a power supply unit (P), and a storage unit (M), and a substrate circuit may be formed to electrically connect the sensor unit (130), the processor (140), the notification unit (150), the communication unit (160), the power supply unit (P), and the storage unit (M).

[0067] The substrate circuit of the substrate portion (120) can be electrically connected to the first cable (CA) and the second cable (CA).

[0068] Additionally, the substrate portion (120) has a substrate hole formed through it into which a fixing pin is inserted, and the fixing pin can be inserted into the substrate hole and fixed in the receiving space.

[0069] Meanwhile, the substrate portion (120) can be surrounded on the outside by the buffer portion (170) while located in the receiving space.

[0070] At this time, at least a portion of each of the humidity measuring member (132) and temperature measuring member (131) provided in the sensor unit (130), and the first lighting module (151) and second lighting module (152) provided in the notification unit (150), may be exposed to the outside without being surrounded by the buffer unit (170).

[0071] Specifically, at least a portion of each of the humidity measuring member (132) and temperature measuring member (131) provided in the sensor unit (130), and the first lighting module (151) and second lighting module (152) provided in the notification unit (150), is accommodated in the receiving space of the case unit (110) without being surrounded by the buffer unit (170), and can be exposed to the outside as the upper surface of the case unit (110) is opened.

[0072] That is, at least a portion of each of the humidity measuring member (132) and temperature measuring member (131) provided in the sensor unit (130), and the first lighting module (151) and second lighting module (152) provided in the notification unit (150), may be located in an area within the inner receiving space of the case unit (110) where the buffer unit (170) is not located, and thus be exposed to the outside.

[0073] The sensor unit (130) may be equipped with a humidity measuring member (132), a current measuring module, a temperature measuring member (131), and a resistance measuring module.

[0074] As described above, the humidity measuring member (132) is housed in a receiving space such that at least a portion is exposed to the outside, and a current can flow through which the current value changes in response to road humidity, which is the humidity near the road surface.

[0075] Specifically, the humidity measuring member (132) may be a plurality of humidity sensor rods (132) spaced apart so that at least a portion is exposed to the outside and energized by moisture or water near the road surface to allow electricity to flow.

[0076] These multiple humidity sensor rods (132) are formed in a rod shape, with one end and the other end mounted on a substrate (120) and electrically connected to the substrate circuit of the substrate (120), and only the portion connected to the substrate circuit is surrounded by a buffer (170), while the remaining portion is not surrounded by the buffer (170) and can be exposed to the outside.

[0077] These multiple humidity sensor rods (132) may be two in number and may be formed of SUS 304 material to have conductivity and corrosion resistance.

[0078] Meanwhile, a plurality of humidity sensor rods (132) can have a current flowing through them such that the current value increases as the humidity of the road in the space between them increases.

[0079] Conversely, a plurality of humidity sensor rods (132) can have a current flowing through them such that the current value decreases as the humidity of the road in the space between them decreases.

[0080] Additionally, when multiple humidity sensor rods (132) become conductive due to moisture in the space between them, a current can flow that exceeds a critical current value.

[0081] The current measurement module can measure the current value of the current flowing through a plurality of humidity sensor rods (132) and output it to the processor (140).

[0082] Such a current measuring module may be a current sensor that outputs a voltage having a voltage value corresponding to a current value.

[0083] As described above, the temperature measuring member (131) is housed in a receiving space such that at least a portion is exposed to the outside, and the temperature value can change in response to the road temperature, which is the temperature near the road surface.

[0084] Specifically, the temperature measuring member (131) may be a temperature sensing element (Thermistor, 131) in which at least a portion is exposed to the outside and the resistance value changes in response to the temperature near the road surface.

[0085] Such a temperature sensing element (131) is mounted on a substrate (120) and electrically connected to a substrate circuit of the substrate (120), and only the portion connected to the substrate circuit is surrounded by a buffer (170), while the remaining portion is not surrounded by the buffer (170) and can be exposed to the outside.

[0086] For example, the temperature sensing element (131) may be an NTC (Negative Temperature Coefficient) thermistor in which the resistance value decreases as the road temperature increases and the temperature value increases as the road temperature decreases, or a PTC (Positive Temperature Coefficient) thermistor in which the resistance value increases as the road temperature increases and the temperature value decreases as the road temperature decreases.

[0087] The resistance measurement module can measure the resistance value of the temperature sensing element (131) and output it to the processor (140).

[0088] Such a resistance measuring module may be a resistance sensor that outputs a voltage having a voltage value corresponding to a resistance value.

[0089] Meanwhile, the processor (140) can control the power supply (P) so that voltage is applied individually to each of the humidity measuring member (132), which is a plurality of humidity sensor rods (132), and the temperature measuring member (131), which is a temperature sensing element (131).

[0090] The processor (140) can generate a road humidity value representing road humidity based on the current value of the current flowing through the humidity measuring member (132), and generate a road temperature value representing road temperature based on the resistance value of the temperature measuring member (131).

[0091] That is, the processor (140) can generate a road humidity value representing road humidity based on the current value of the current flowing through the plurality of humidity sensor rods (132), and generate a road temperature value representing road temperature based on the resistance value of the temperature sensing element (131).

[0092] Specifically, the processor (140) can identify a reference current value identical to the current value output from the current measurement module in current-humidity data in which a reference humidity value is mapped to each of a plurality of reference current values, and can generate a reference humidity value mapped to the identified reference current value as a humidity value.

[0093] Such current-humidity data may be data prepared in advance by measuring the change in current value of the current flowing through a plurality of humidity sensor rods (132) according to the change in humidity.

[0094] Meanwhile, the processor (140) can identify a reference resistance value identical to the resistance value output from the resistance measurement module in the resistance-temperature data in which a reference temperature value is mapped to each of the multiple reference resistance values, and generate the reference temperature value mapped to the identified reference resistance value as a temperature value.

[0095] Such resistance-humidity data may be data prepared in advance by measuring the change in resistance value of the temperature sensing element (131) according to the change in temperature.

[0096] The processor (140) can control the communication unit (160) so that road humidity values ​​and road temperature values ​​are transmitted to an external device.

[0097] Here, the external device may be a control server that monitors the road surface condition, or a manager's device that manages the road surface condition.

[0098] Meanwhile, the processor (140) determines whether road humidity values ​​and road temperature values ​​are being transmitted through the second cable (CA), and if it is determined that transmission is in progress, it can generate transmission status notification information indicating that road humidity values ​​and road temperature values ​​are being transmitted.

[0099] Afterwards, the processor (140) can control the notification unit (150) so that the first lighting module (151) provided in the notification unit (150) outputs transmission status notification information as light.

[0100] Meanwhile, the processor (140) determines whether driving power is being input through the first cable (CA), and if it determines that driving power is not being input, it can generate power cut-off notification information indicating that driving power is not being input.

[0101] Afterward, the processor (140) can control the notification unit (150) so that the second lighting module (152) provided in the notification unit (150) outputs power cut-off notification information as light.

[0102] As described above, the communication unit (160) can transmit low humidity values ​​and road temperature values ​​to an external device under the control of the processor (140).

[0103] The communication unit (160) can perform wired communication through the first cable (CA) and the second cable (CA).

[0104] The power supply unit (P) receives driving power from the outside, converts the voltage of the driving power in response to the embedded sensor device, and can cut off surge power.

[0105] In addition, the power supply unit (P) can supply power (voltage, current) required for the operation of each of the sensor unit (130), processor (140), notification unit (150), communication unit (160), power supply unit (P), and storage unit (M).

[0106] The power supply unit (P) can receive driving power from the outside via a wire through the first cable (CA) and the second cable (CA).

[0107] As described above, the buffer section (170) is accommodated in the internal receiving space of the case section (110) together with the substrate section (120), and by surrounding the substrate section (120) within the receiving space, it can absorb vibrations and shocks applied from the outside through the case section (110) into the receiving space, thereby protecting the circuit components mounted on the substrate section (120), such as the sensor section (130), processor (140), notification section (150), communication section (160), power supply section (P), and storage section (M).

[0108] Specifically, the buffer (170) can be injected into the receiving space in a liquid state after the substrate (120) on which the circuit components are mounted is fixed in the receiving space of the case (110).

[0109] To this end, the buffer (170) is formed by mixing a liquid epoxy resin and a liquid curing agent before being injected into the receiving space, and after being injected into the receiving space in a liquid state, it can be hardened into a solid due to intermolecular cross-linking resulting from a chemical reaction between the liquid epoxy resin and the liquid curing agent.

[0110] At this time, the buffer (170) can be injected into the receiving space in a liquid state to such an extent that at least a portion of each of the humidity measuring member (132) and temperature measuring member (131) provided in the sensor unit (130) and the first lighting module (151) and second lighting module (152) provided in the notification unit (150) is not submerged.

[0111] Meanwhile, the bracket portion (180) is formed by bending a plate-shaped metal plate at a right angle and can be attached to both sides of the case portion (110).

[0112] Specifically, there may be two bracket portions (180), and each bracket portion (180) may have a first bracket plate and a second bracket plate that are vertical, and the first bracket plate may be coupled to the side of the case portion (110) and the second bracket plate may be arranged so as to be vertical to the side of the case portion (110).

[0113] Accordingly, even if an external force is applied in an upward or downward direction due to shock and vibration occurring on the road after the case part (110) is buried in the burial groove, the second bracket plate is caught by the soil below the road surface, thereby preventing the case part (110) from moving downward from the initial burial point and being inserted further into the burial groove, or moving upward from the initial burial point and protruding from the burial groove.

[0114] Meanwhile, the processor (140) can control the overall operation of the embedded sensor device using various programs stored in the storage unit (M). The processor (140) may be composed of RAM, ROM, a graphics processing unit, a main CPU, first to n interfaces, and a bus. At this time, the RAM, ROM, graphics processing unit, main CPU, first to n interfaces, etc., may be connected to each other through a bus.

[0115] RAM stores the operating system and application programs. Specifically, when the embedded sensor device boots up, the operating system is stored in RAM, and various application data selected by the user can be stored in RAM.

[0116] The ROM stores instruction sets for system booting, etc. When a turn-on command is input and power is supplied, the main CPU copies the O / S stored in the storage unit (M) to the RAM according to the instructions stored in the ROM, and executes the O / S to boot the system. When booting is complete, the main CPU copies various application programs stored in the storage unit (M) to the RAM, and executes the application programs copied to the RAM to perform various operations.

[0117] The main CPU accesses the storage unit (M) and performs booting using the OS stored in the storage unit (M). Additionally, the main CPU performs various operations using various programs, content, data, etc. stored in the storage unit (M).

[0118] The first to n interfaces are connected to the various components described above. One of the first to n interfaces may be a network interface connected to an external device through a network.

[0119] Meanwhile, the processor (140) may include one or more cores (not shown) and a graphics processing unit (not shown) and / or other components, and a connection channel (e.g., a bus, etc.) for transmitting and receiving signals.

[0120] Meanwhile, the processor (140) may further include RAM (Random Access Memory, not shown) and ROM (Read-Only Memory, not shown) for temporarily and / or permanently storing signals (or data) processed within the processor (140). Additionally, the processor (140) may be implemented in the form of a system-on-chip (SoC) including at least one of a graphics processing unit, RAM, and ROM.

[0121] The storage unit (M) can store various programs and data required for the operation of the embedded sensor device. The storage unit (M) can be implemented as non-volatile memory, volatile memory, flash memory, hard disk drive (HDD), or solid-state drive (SSD).

[0122] The storage unit (M) can store programs (one or more instructions) for processing and controlling the processor (140). The programs stored in the storage unit (M) can be divided into multiple modules according to their function.

[0123] The communication unit (160) can communicate with other devices. In particular, the communication unit (160) may include various communication chips such as a Wi-Fi chip, a Bluetooth chip, a wireless communication chip, an NFC chip, and a low-power Bluetooth chip (BLE chip). At this time, the Wi-Fi chip, the Bluetooth chip, and the NFC chip each perform communication in a LAN method, a Wi-Fi method, a Bluetooth method, and an NFC method, respectively. When using a Wi-Fi chip or a Bluetooth chip, various connection information such as an SSID and a session key is first transmitted and received, and then various information can be transmitted and received after establishing a communication connection using this information. A wireless communication chip refers to a chip that performs communication according to various communication standards such as IEEE, Zigbee, 3G (3rd Generation), 3GPP (3rd Generation Partnership Project), LTE (Long Term Evolution), and 5G (1st Generation).

[0124] FIG. 7 is a perspective view of a buried sensor device for measuring the temperature and humidity of a road according to another embodiment of the present invention, FIG. 8 is an exploded perspective view of a bracket portion of a buried sensor device for measuring the temperature and humidity of a road according to another embodiment of the present invention, and FIG. 9 is a drawing illustrating the process of a buried sensor device for measuring the temperature and humidity of a road according to another embodiment of the present invention being further inserted into a buried groove.

[0125] In a buried sensor device according to another embodiment of the present invention, compared to a buried sensor device according to one embodiment of the present invention, the bracket part (180') is different and the processor (140) performs an additional role, so a repetitive description is omitted.

[0126] Referring further to FIGS. 7 to 9, the bracket portion (180') is provided with a first bracket plate and a second bracket plate that are vertically formed, wherein the first bracket plate is not coupled to the side of the case portion (110) and can be separated.

[0127] Additionally, the bracket portion (180') may further be provided with a rotational coupling projection (181) that allows the first bracket plate and the second bracket plate to be rotatably coupled to the side of the case portion (110).

[0128] Such a rotational coupling projection (181) is formed protruding from one side of the bracket portion (180) and can be inserted into a rotational coupling groove (H) formed in the side of the case portion (110) to be rotatably coupled.

[0129] Meanwhile, the bracket portion (180') may further be provided with an elastic member (182) having one end connected to the first bracket plate and the other end connected to the case portion (110).

[0130] The elastic member (182) can apply an elastic restoring force to the first bracket plate and the case part (110) to maintain the state in which the side of the first bracket plate and the case part (110) are in contact.

[0131] At this time, when the case part (110) is subjected to external force due to shock and vibration occurring on the road and is further inserted downward from the initial burial point, the first bracket plate may be caught by the soil and rotated.

[0132] Here, a bracket resistor having a predetermined reference resistance value is formed on the first bracket plate, and a resistance contact terminal may be formed on the side of the case part (110) that contacts the bracket resistor.

[0133] Accordingly, when the position of the case part (110) maintains the initial buried point, the first bracket plate is not rotated so that the first bracket plate contacts the side of the case part (110) and the bracket resistance and the resistance contact terminal come into contact, so that the resistance value measured through the resistance contact terminal can be the same as the reference resistance value.

[0134] Alternatively, when the position of the case part (110) is moved downward from the initial burial point, the first bracket plate is rotated so that the first bracket plate is separated from the side of the case part (110), and the bracket resistance and the resistance contact terminal are separated, so that the resistance value measured through the resistance contact terminal can be less than the reference resistance value.

[0135] Using this, the processor (140) can determine that the case part (110) is inserted further downward from the initial burial point if the resistance value measured through the resistance contact terminal is less than the reference resistance value.

[0136] Alternatively, the processor (140) can determine that the case part (110) is located at the initial buried point if the resistance value measured through the resistance contact terminal is the reference resistance value.

[0137] Afterwards, if the processor (140) determines that the case part (110) has been inserted further downward from the initial burial point, it can generate over-insertion notification information indicating the over-insertion of the case part (110), and control the notification part (150) so that the first lighting module (151) or the second lighting module (152) of the notification part (150) outputs the over-insertion notification information as light.

[0138] The present invention has been described above with reference to preferred embodiments. Those skilled in the art will understand that the present invention can be implemented in modified forms without departing from the essential characteristics of the invention. Therefore, the disclosed embodiments should be considered in an illustrative rather than a restrictive sense. The scope of the invention is defined by the claims, not by the foregoing description, and all variations within the scope of the claims should be interpreted as being included in the invention.

[0139] As described above, although the present invention has been explained by limited embodiments and drawings, the present invention is not limited thereto, and it is obvious that various modifications and variations are possible within the scope of the technical spirit of the present invention and the equivalent scope of the claims described below by those skilled in the art to which the present invention belongs. Explanation of the symbols

[0141] 110: Case section 120: Substrate section 130: Sensor section 140: Processor 150: Notification Department 160: Input / Output Section 170: Buffer 180: Bracket section P: Power supply M: Storage unit C: Communications Department

Claims

Claim 1 A buried sensor device for measuring the temperature and humidity of a road comprises: a case portion buried in a buried groove formed in the road, having an open upper surface and an internal receiving space; a sensor portion that is received in the receiving space such that a portion is exposed to the outside, and comprises a humidity measuring member through which a current flows, the current value of which changes in response to road humidity, which is the humidity near the road surface, and a temperature measuring member through which a resistance value of which changes in response to road temperature, which is the temperature near the road surface; and a processor that generates a road humidity value representing the road humidity based on the current value of the current flowing through the humidity measuring member, and generates a road temperature value representing the road temperature based on the resistance value of the temperature measuring member.The humidity measuring member comprises a plurality of humidity sensor rods spaced apart such that at least a portion thereof is exposed to the outside and conducts electricity by moisture or water near the road surface, and the sensor part further comprises a current measuring module that measures the current value of the current flowing through the plurality of humidity sensor rods and outputs it to the processor, and the case part comprises a bracket part having a first bracket plate and a second bracket plate coupled in a vertical arrangement, and the bracket part comprises a rotational coupling projection inserted into a rotational coupling groove formed in the side of the case part so as to be rotatable from the side of the case part and rotatably coupled thereto, and an elastic member having one end coupled to the first bracket plate and the other end coupled to the case part, and applying an elastic restoring force to the first bracket plate and the case part to maintain a state in which the first bracket plate and the side of the case part are in contact at the initial buried point of the case part, and when the first bracket plate is in contact with the side of the case part, a bracket resistor is formed that contacts a resistance contact terminal formed on the side of the case part and has a predetermined reference resistance value, and the bracket A buried sensor device for measuring the temperature and humidity of a road, characterized in that when the case part is inserted further downward from the initial buried point, the first bracket plate is rotated to be separated from the side of the case part, thereby being separated from the resistance contact terminal; the processor determines that the case part is inserted further downward from the initial buried point if the resistance value measured through the resistance contact terminal is less than the reference resistance value; and when it is determined that the case part is inserted further downward from the initial buried point, generates over-insertion notification information indicating the over-insertion of the case part and controls the notification unit to output the over-insertion notification information as light. Claim 2 delete Claim 3 A buried sensor device for measuring the temperature and humidity of a road, characterized in that, in claim 1, the processor identifies a reference current value identical to the current value output from the current measurement module in current-humidity data in which a reference humidity value is mapped to each of a plurality of reference current values, and generates the reference humidity value mapped to the identified reference current value as the road humidity value. Claim 4 A buried sensor device for measuring road temperature and humidity, characterized in that, in claim 1, the temperature measuring member is a temperature sensing element in which at least a portion is exposed to the outside and the resistance value changes in response to the temperature near the road surface, and the sensor part further comprises a resistance measuring module that measures the resistance value of the temperature sensing element and outputs it to the processor. Claim 5 A buried sensor device for measuring the temperature and humidity of a road, characterized in that, in paragraph 4, the processor identifies a reference resistance value identical to the resistance value output from the resistance measurement module in resistance-temperature data in which a reference temperature value is mapped to each of a plurality of reference resistance values, and generates the reference temperature value mapped to the identified reference resistance value as the road temperature value. Claim 6 A buried sensor device for measuring road temperature and humidity, characterized in that, in claim 1, the processor controls a communication unit so that the road humidity value and the road temperature value are transmitted to an external device. Claim 7 The embedded sensor device for measuring the temperature and humidity of a road according to claim 1 further comprises: a substrate portion in which the sensor portion and the processor are mounted and the substrate portion is accommodated in the receiving space; and a cushioning portion that absorbs vibrations and shocks applied to the receiving space through the case portion by surrounding the remaining part of the sensor portion, the processor, and the substrate portion that is accommodated in the receiving space but is not exposed to the outside within the receiving space.

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