Pogo-pin socket
The pogo pin socket design addresses noise interference in semiconductor chip testing by employing a metal body, ground pins, and dielectric-insulated signal pins to enhance signal quality.
Patent Information
- Authority / Receiving Office
- KR · KR
- Patent Type
- Patents
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2022-06-09
- Publication Date
- 2026-07-29
AI Technical Summary
Existing pogo pin sockets fail to effectively minimize or prevent noise of high-frequency power supplied to signal pins during electrical testing of semiconductor chip packages.
A pogo pin socket design incorporating a metal socket body, ground pins with barrel electrodes and terminals, signal pins with dielectric and metal sheath layers, and grounding plates to reduce noise interference.
The design minimizes or prevents noise of high-frequency power by using a metal socket body and dielectric insulation, enhancing signal integrity.
Smart Images
Figure 112022060044563-PAT00003_ABST
Abstract
Description
Technology Field
[0001] The present invention relates to a socket, and more specifically to a pogo pin socket. Background Technology
[0002] A semiconductor chip package undergoes an electrical test process before being provided to a user. The electrical test process can be performed by a test device. The test device may include a pogo pin socket. The pogo pin socket can electrically connect external terminals, such as solder balls of the semiconductor chip package, to a printed circuit board (also called a load board). The problem to be solved
[0003] The objective of the present invention is to provide a pogo pin socket capable of minimizing or preventing noise of high-frequency power supplied to signal pins. means of solving the problem
[0004] The present invention discloses a pogo pin socket. The socket comprises a socket body; a ground pin including a first barrel electrode provided within the socket body and first terminals connected to both ends of the first barrel electrode; and a first signal pin provided within the socket body adjacent to the ground pin. The first signal pin may include: a second barrel electrode; second terminals connected to both ends of the second barrel electrode; and a dielectric layer and a metal sheath layer disposed on the outer surface of the second barrel electrode. Effects of the invention
[0005] As described above, the pogo pin socket according to an embodiment of the present invention can minimize or prevent noise of the high-frequency power provided to the signal pins by using a metal socket body. Brief explanation of the drawing
[0006] Fig. 1 This is a perspective view showing an example of a pogo pin socket according to the concept of the present invention. Fig. 2 Is Fig. 1 This is a perspective view showing an example of a grounding pin. Fig. 3 silver Fig. 1 class Fig. 4 This is a perspective view showing an example of the first signal pins. Fig. 4 This is a perspective view showing an example of a pogo pin socket according to the concept of the present invention. Fig. 6 and Fig. 7 These are perspective views showing an example of a pogo pin socket according to the concept of the present invention. Fig. 5 Is Fig. 1 This is a perspective view showing an example of the first signal pin. Fig. 8 silver Fig. 6 and Fig. 7 This is a perspective view showing an example of a grounding plate. Fig. 9 Is Fig. 6 and Fig. 7 Shows an example of a grounding plate. Specific details for implementing the invention
[0007] Fig. 1 This shows an example of a pogo pin socket (100) according to the concept of the present invention.
[0008] Fig. 1 Referring to the above, the pogo pin socket (100) of the present invention may include a socket body (10), ground pins (20), and first signal pins (30).
[0009] The socket body (10) can secure the ground pins (20) and the first signal pins (30). The socket body (10) may have the shape of a rectangular parallelepiped. The socket body (10) may include metal. Alternatively, the socket body (10) may include a dielectric such as ceramic or a polymer such as plastic.
[0010] Ground pins (20) may be provided within the center of the socket body (10). Ground pins (20) may extend vertically through the upper and lower surfaces of the socket body (10). Ground pins (20) may be arranged in a first direction.
[0011] The first signal pins (30) may be provided adjacent to the ground pins (20). The first signal pins (30) may be provided on one edge of the socket body (10). The first signal pins (30) may be parallel to the ground pins (20). The first signal pins (30) may extend in the vertical direction of the socket body (10). The first signal pins (30) may transmit a high-frequency signal of 5 GHz or higher.
[0012] Fig. 2 Is Fig. 1 Shows an example of the ground pin (20).
[0013] Fig. 2 Referring to the ground pin (20), the ground pin (20) may include a first barrel electrode (22) and first terminals (24).
[0014] The first barrel electrode (22) may extend in one direction. The first barrel electrode (22) may include copper wiring or a copper tube. The first barrel electrode (22) Fig. 1 It can be provided within the socket body (10).
[0015] The first terminals (24) can be connected to both ends of the first barrel electrode (22). The first terminals (24) Fig. 1 The first terminals (24) can protrude from the lower and upper surfaces of the socket body (10). Fig. 1 It can protrude from the upper and lower surfaces of the socket body (10).
[0016] Fig. 3 silver Fig. 1 class Fig. 4 Shows an example of the first signal pins (30).
[0017] Fig. 3Referring to the first signal pin (30), the first signal pin (30) may include a second barrel electrode (32), second terminals (34), and a dielectric layer (36). The first signal pin (30) may further include a metal sheath layer (38). The metal sheath layer (38) may be provided on the outer surface of the dielectric layer (36). The metal sheath layer (38) may include copper (Cu), aluminum (Al), or gold (Au). Fig. 1 When the socket body (10) includes a dielectric or polymer, the metal outer layer (38) can prevent interference and / or noise of the second barrel electrodes (32).
[0018] The second barrel electrode (32) is Fig. 2 It may be identical to the first barrel electrode (22). The second barrel electrode (32) may extend in one direction. The second barrel electrode (32) may include copper wiring or a copper tube. The second barrel electrode (32) Fig. 1 It can be provided within the socket body (10).
[0019] The second terminals (34) can be connected to both ends of the second barrel electrode (32). The second terminals (34) Fig. 1 It can protrude from the upper and lower surfaces of the socket body (10).
[0020] A dielectric layer (36) may be provided on the outer surface of the second barrel electrode (32). The dielectric layer (36) may include a ceramic of Al2O3 or Y2O3. If the socket body (10) includes a metal, the dielectric layer (36) may insulate the second barrel electrode (32) from the socket body (10).
[0021] Accordingly, the pogo pin socket (100) of the present invention can minimize or prevent high-frequency power noise by using a metal socket body (10).
[0022] Fig. 4This shows an example of a pogo pin socket (100) according to the concept of the present invention.
[0023] Fig. 4 Referring to the, the pogo pin socket (100) may further include a metal coating layer (40) and second signal pins (60).
[0024] A metal coating layer (40) may be provided on the upper and lower surfaces of the socket body (10). The socket body (10) may include a dielectric or a polymer. The metal coating layer (40) may minimize or prevent noise generated by the first signal pins (30) and the second signal pins (60).
[0025] The second signal pins (60) may be provided on the other side of the ground pins (20) opposite the first signal pins (30). The second signal pins (60) may be DC pins. The second signal pins (60) may be identical to the first signal pins (30). Alternatively, the second signal pins (60) may be identical to the ground pins (20), and the invention is not limited thereto. Although not illustrated, the second signal pins (60) may include a third barrel electrode, third terminals, and a dielectric layer.
[0026] Fig. 5 Is Fig. 1 Shows an example of the first signal pin (30).
[0027] Fig. 5 Referring to the first signal pin (30), the first signal pin (30) can be used without including a metal outer layer (38). Fig. 1 When the socket body (10) includes copper (Cu), aluminum (Al), or gold (Au), such as the metal outer layer (38), the socket body (10) itself acts as the metal outer layer (38) to prevent interference and / or noise of the second barrel electrodes (32). Fig. 1 The socket body (10) may include a metal other than the material described above.
[0028] Fig. 6 and Fig. 7 This shows an example of a pogo pin socket (100) according to the concept of the present invention.
[0029] Fig. 6 and Fig. 7 Referring to the above, the pogo pin socket (100) of the present invention may further include ground plates (50).
[0030] Grounding plates (50) may be provided within the two edges of the socket body (10). The grounding plates (50) may connect the grounding pins (20) in one direction. The grounding plates (50) may be parallel to each other. The grounding plates (50) may accommodate the grounding pins (20). The grounding plates (50) may be parallel to the grounding pins (20). Each of the grounding plates (50) may comprise copper (Cu), aluminum (Al), or gold (Au).
[0031] The socket body (10) may have a plurality of socket holes (18). The socket holes (18) may be parallel to each other. The socket holes (18) may be arranged in a direction perpendicular to the upper and lower surfaces of the socket body (10). The socket holes (18) may accommodate first signal pins (30) and second signal pins (60). According to one example, the socket body (10) may include a center signal region (12) and edge signal regions (14).
[0032] The center signal area (12) may be provided between the ground plates (50). The center signal area (12) may be provided between the ground pins (20), but the invention is not limited thereto.
[0033] Edge signal regions (14) may be provided on the outer sides of both sides of the ground plates (50). Edge signal regions (14) may be provided on the outer sides of both sides of the ground pins (20), but the invention is not limited thereto. First signal pins (30) may be provided within the edge signal regions (14).
[0034] Fig. 8 silver Fig. 6 and Fig. 7 Shows an example of a grounding plate (50).
[0035] Fig. 2 and Fig. 6 inside Fig. 8 Referring to the above, the grounding plate (50) may have the same height as the first barrel electrodes (22) of the grounding pins (20). The grounding plate (50) may be exposed from the upper surface, lower surface, and side of the socket body (10).
[0036] Fig. 9 Is Fig. 6 and Fig. 7 Shows an example of a grounding plate (50).
[0037] Fig. 2 and Fig. 9 Referring to the, the ground plate (50) may have a height smaller than the height of the first barrel electrodes (22) of the ground pins (20).
[0038] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments and applications described above should be understood as illustrative in all respects and not restrictive.
Claims
Claim 1 A pogo pin socket comprising: a socket body; a ground pin including a first barrel electrode provided within the socket body and first terminals connected to both ends of the first barrel electrode; and a first signal pin provided within the socket body adjacent to the ground pin, wherein the first signal pin comprises: a second barrel electrode; second terminals connected to both ends of the second barrel electrode; a dielectric layer disposed on the outer surface of the second barrel electrode; and a metal sheath layer disposed on the outer surface of the dielectric layer. Claim 2 delete Claim 3 A pogo pin socket comprising: a socket body; a ground pin including a first barrel electrode provided within the socket body and first terminals connected to both ends of the first barrel electrode; ground plates provided within the socket body and connected to the first barrel electrode; and a first signal pin provided within the socket body adjacent to the ground pin, wherein the first signal pin comprises: a second barrel electrode; second terminals connected to both ends of the second barrel electrode; and a dielectric layer disposed on the outer surface of the second barrel electrode, and each of the ground plates has a height equal to the height of the first barrel electrode. Claim 4 delete Claim 5 delete Claim 6 In claim 3, the socket body comprises: a central signal area between the ground plates; and edge signal areas on the outer sides of the ground plates. Claim 7 In claim 1, the socket body is a pogo pin socket comprising metal. Claim 8 A pogo pin socket according to claim 1, wherein the socket body comprises ceramic or a polymer, and further comprises a metal shielding layer provided on the upper surface and the lower surface of the socket body. Claim 9 A pogo pin socket according to claim 1, further comprising a second signal pin disposed on one side of the ground pin opposite the first signal pin. Claim 10 In claim 1, the first terminals and the second terminals are pogo pin sockets protruding from the upper and lower surfaces of the socket body.