Substrate transport apparatus with particle sealing function

Abstract

A substrate transfer device having a particle sealing function according to one embodiment of the present invention comprises: a housing having an arm for placing a wafer on the upper part; a linear module provided inside the housing; and a mover for transferring the arm in a straight direction according to the operation of the linear module while the linear module and the arm are connected through slots on both sides of the housing, wherein a particle barrier is provided in the space inside the slot of the housing, arranged along the length direction of the slot, and having a width greater than the width of the slot.

Description

Technology Field

[0001] The present invention relates to a substrate transfer device having a particle sealing function, and more specifically, to a substrate transfer device having a particle sealing function that effectively blocks multiple particles generated inside the substrate transfer device so that they do not leak outside the device when the substrate transfer device, which transfers a substrate such as a wafer to a specific location, is operated. Background Technology

[0002] Generally, in the manufacturing process of semiconductor devices or flat panel displays (FPDs) such as LCDs and OLEDs, wafers or transparent substrates are sequentially transported to each processing unit using a robot-type substrate transfer device, and at each processing unit, one or multiple substrates are processed in a predetermined process step by step.

[0003] For example, semiconductor devices are manufactured through a fabrication (Fab) process in which electrical circuits are formed on a semiconductor substrate, and among the above-mentioned Fab processes, in particular, the photolithography process involves returning a wafer to a coating device to form a photoresist film on the surface of the wafer, returning the wafer to an exposure device to expose the photoresist film, and returning the wafer to a developing device to develop the exposed photoresist film.

[0004] Therefore, in the above photolithography process, particle control is carried out very strictly to the extent that even very fine amounts of particles (impurities) are not tolerated within the fab space in order to accommodate circuit line widths that are becoming increasingly miniaturized to nanometer (nm) sizes.

[0005] Therefore, since particles generated inside the device leak outside the device when the substrate transfer device is operated, they can immediately cause fatal defects in semiconductor devices, particle sealing technology is required to effectively block particles generated inside the substrate transfer device from leaking outside. Prior art literature

[0006] Korean Patent No. 1334690 (Registered on November 25, 2013) The problem to be solved

[0007] Accordingly, the present invention has been devised to resolve the above-mentioned problems and aims to provide a substrate transfer device having a particle sealing function that effectively blocks multiple particles generated inside the substrate transfer device from leaking outside the device when the substrate transfer device, which transfers a substrate such as a wafer to a specific location, is operated. means of solving the problem

[0008] According to one embodiment, the present invention for achieving the above-mentioned purpose comprises a substrate transfer device including: a housing having an arm for placing a wafer on its upper portion; a linear module provided inside the housing; and a mover for moving the arm in a straight direction according to the operation of the linear module while the linear module and the arm are connected through slots on both sides of the housing, wherein a particle barrier is provided in the space inside the slot of the housing, arranged along the length direction of the slot, and having a width greater than the width of the slot.

[0009] Additionally, according to one embodiment, the particle barrier comprises: a first particle barrier disposed adjacent to the slot in the inner space of the slot of the housing; and a second particle barrier disposed at a certain distance from the slot with the first particle barrier in between in the inner space of the slot of the housing.

[0010] In addition, according to one embodiment, the particle blocking film is characterized by being fitted into a through hole formed in the mover and not hindering the movement of the mover.

[0011] In addition, according to one embodiment, an airflow blocking ridge is further formed between the first particle blocking film and the second particle blocking film to block airflow containing particles inside the housing from escaping through the slot. Effects of the invention

[0012] The present invention, as described above, effectively blocks multiple particles generated inside a substrate transfer device to prevent leakage to the outside of the device in order to accommodate circuit line widths that are becoming increasingly miniaturized to nanometer (nm) sizes, thereby contributing to the reduction of defect rates and increased yields of advanced semiconductor devices, as well as securing national semiconductor technology competitiveness.

[0013] In addition, the present invention has the effect of contributing to a reduction in the footprint of the device by effectively blocking external leakage and scattering of airflow containing particles, as various parts are compactly arranged within the housing space of a very narrow device while maintaining mechanical stability. Brief explanation of the drawing

[0014] FIG. 1 is an overall perspective view of a substrate transfer device having a particle sealing function according to the present invention. FIG. 2 is a plan view showing the appearance after the arm has been removed from FIG. 1. FIG. 3 is a longitudinal section along line AA of FIG. 2. Figure 4 is an enlarged view of section 'C' in Figure 3. FIG. 5 is a longitudinal section along line BB of FIG. 2 FIG. 6 is an enlarged view of a key part showing the exhaust pipe of the housing bottom plate of FIG. 5. FIG. 7 is a longitudinal section of the DD line in FIG. 6 FIG. 8 is a bottom perspective view of a rotary transfer unit according to the present invention. Specific details for implementing the invention

[0015] The terms used herein are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as “comprising,” “having,” or “having” are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described herein, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0016] Unless otherwise defined in this specification, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains.

[0017] Terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this specification.

[0018] Hereinafter, the configuration and operational relationship of a substrate transfer device having a particle sealing function according to one embodiment of the present invention will be examined in detail with reference to the attached drawings as follows.

[0019] FIG. 1 is a perspective view showing the substrate transfer device having a particle sealing function according to the present invention in its entirety, FIG. 2 is a plan view showing the appearance after the arm is removed from FIG. 1, FIG. 3 is a cross-sectional view along line AA of FIG. 2, and FIG. 4 is an enlarged view of part 'C' of FIG. 3.

[0020] Referring to FIGS. 1 to 4 above, the configuration according to one embodiment of the present invention is broadly composed of a housing (1210), a linear module (1220), a mover (1230), and a particle barrier (1250).

[0021] First, the housing (1210) is composed of, for example, a rectangular metal housing, and an arm (1100-1, 1100-2) for placing a wafer (W) on the upper part of the housing (1210) is provided.

[0022] Referring to FIG. 1, according to one embodiment, the arms (1100-1, 1100-2) are provided as a pair, and when one of the arms unloads a processed wafer (W) from a substrate processing device (not shown), the other arm is configured to load an unprocessed wafer (W) into the substrate processing device (not shown). Here, the substrate processing device (not shown) may be, for example, a track system that performs a photolithography process of a semiconductor fab.

[0023] Additionally, the linear module may be a device assembly such as a motor or belt provided inside the housing (1210).

[0024] Referring to FIG. 3, according to one embodiment, the linear module (1220) is provided in pairs to drive a pair of arms (1100-1, 1100-2) respectively. That is, a pair of linear modules (1220) are arranged side by side inside the housing (1210), and each linear module (1220) is driven independently.

[0025] Additionally, the mover (1230) connects a pair of linear modules (1220, see FIG. 3) and a pair of arms (1100-1, 1100-2) respectively, extending outside the housing through the slots (1210a, see FIG. 4) on both sides of the housing. In this state, the arms (1100-1, 1100-2) are moved in a straight direction according to the operation of the linear modules (1220).

[0026] Referring to FIG. 2, according to one embodiment, the mover (1230) is provided in a pair and linearly transports the pair of arms (1100-1, 1100-2) by alternately pulling out or pulling in for loading or unloading operations of the wafer (W).

[0027] Additionally, the particle barrier (1250) is positioned along the length direction of the slot in the inner space of the slot (1210a) of the housing (1210). At this time, the width of the particle barrier (1250) is greater than the width of the slot (1210a) (the width open in the vertical direction of the slot). Accordingly, the airflow containing particles generated inside the housing (1210) according to the operation of the linear module (1220) is blocked by the particle barrier (1250) and sealed so that it cannot escape to the outside of the housing (1210) through the slot (1210a).

[0028] Referring to FIG. 4, according to one embodiment, the particle barrier (1250) comprises: a first particle barrier (1251) disposed adjacent to the slot in the space inside the slot (1210a) of the housing (1210); and a second particle barrier (1252) disposed at a certain distance from the slot (1210a) with the first particle barrier (1251) in between in the space inside the slot (1210a) of the housing (1210).

[0029] At this time, the first and second particle barriers (1251) (1252) are respectively fitted into the through holes (1230a) formed in the mover (1230) and do not hinder the movement of the mover.

[0030] Additionally, referring to FIG. 4, an airflow blocking ridge (1260) is further formed between the first particle blocking ridge (1251) and the second particle blocking ridge (1252) to prevent airflow containing particles inside the housing (1210) from escaping through the slot (1210a).

[0031] Accordingly, the airflow containing particles is blocked multiple times by colliding with the first and second particle blocking screens (1251) (1252) and the airflow blocking jaw (1260), thereby minimizing particle leakage through the slot (1210a) of the housing (1210).

[0033] Meanwhile, FIG. 5 is a longitudinal cross-sectional view along line BB of FIG. 2, FIG. 6 is an enlarged view showing the exhaust pipe of the housing bottom plate of FIG. 5, FIG. 7 is a longitudinal cross-sectional view along line DD of FIG. 6, and FIG. 8 is a bottom perspective view of the rotary transfer unit according to the present invention.

[0034] Referring to the drawings above, a substrate transfer device (1000) according to one embodiment of the present invention comprises: a pair of arms (1100-1, 1100-2) for placing a wafer; a linear transfer unit (1200) provided on the bottom surface of the arms for transferring the arms in a straight direction; and a rotary transfer unit (1300) provided on the bottom surface of the linear transfer unit for rotating the pair of arms (1100-1, 1100-2) and the linear transfer unit (1200) by a certain angle in a clockwise or counterclockwise direction.

[0035] Here, the configuration of the linear transfer unit (1200) is the same as that previously described in FIGS. 1 to 4, so a detailed description will be omitted.

[0036] Meanwhile, the rotary transfer unit (1300) is equipped with a pair of arms (1100-1, 1100-2) and a rotary motor (1310, see FIG. 5) for rotating the linear transfer unit (1200), and the rotation axis (1311, see FIG. 1 and FIG. 8) of the rotary motor (1310) is rotatably coupled to the housing bottom plate (1240) of the linear transfer unit (1200), and a through hole (1311a) is formed at the center of the rotation axis (1311) so that a cable (not shown) can be connected.

[0037] Additionally, referring to FIG. 6, a first exhaust fan (1270) is provided at both ends of the housing bottom plate (1240) to forcibly induce an airflow containing particles into the through hole (1311a), and an airflow exhaust conduit (1241) is formed in the housing bottom plate (1240) between the first exhaust fan (1270) and the through hole (1311a) to guide the airflow toward the through hole (1311a).

[0038] Additionally, referring to FIG. 7, the through hole (1311a) is provided with a cone-shaped guide cone member (1320) having a hollow (1320a) into which a cable (not shown) is inserted. That is, the guide cone member (1320) surrounds the outer surface of the guide cone member (1320) and the cable (not shown) connected through the through hole (1311a), thereby excluding interference with the airflow discharged downward from the through hole (1311a).

[0039] Accordingly, the airflow forcibly blown by the first exhaust fan (1270) surrounds the outer surface of the guide cone member (1320) and settles in a cyclone form through the through hole (1311a) and is discharged downwards to the bottom plate of the housing (1240). At this time, since the cable (not shown) is inserted into the hollow (1320a, see FIG. 7) of the guide cone member (1320), the airflow discharged while surrounding the outer surface of the guide cone member (1320) does not interfere with the cable (not shown).

[0040] Next, referring to FIG. 8, a pair of second exhaust fans (1330) are provided facing each other on both sides of the through hole (1311a) on the bottom surface of the rotary transfer unit (1300), and an exhaust duct (1340) is connected to the air exhaust side (the opposite side facing away from each other) of the second exhaust fans (1330).

[0041] Subsequently, the airflow containing particles (dust) discharged downward through the above-mentioned opening (1311a) is diverted to the side by the second exhaust fan (1330) and then sucked in through the above-mentioned exhaust duct (1340), and the airflow transmitted through the above-mentioned exhaust duct (1340) is finally exhausted to the outside of the fab through the exhaust line (1400) of the semiconductor fab (not shown) as shown in FIG. 5.

[0042] Accordingly, in the substrate transfer device (1000) of the present invention, the airflow containing particles generated inside the housing (1210) is completely discharged to the outside of the fab through the first exhaust fan (1270, forcibly blowing airflow), the exhaust pipe (1241, guiding airflow), the outer surface of the guide cone member (1320) (settlement of airflow in a cyclone form), the through hole (1311a, sucking and discharging to the outside of the housing), the second exhaust fan (1330, changing the direction of airflow), the exhaust duct (1340, guiding airflow to the exhaust line), and finally the exhaust line (1400) of the semiconductor fab, thereby preventing leakage of particles to the outside of the housing (1210).

[0043] Therefore, by means of the above-described configuration, the present invention effectively blocks multiple particles generated inside the substrate transfer device from leaking outside the device in order to accommodate circuit line widths that are becoming increasingly miniaturized to nanometer (nm) sizes, thereby achieving the effect of contributing to securing national semiconductor technology competitiveness along with reducing the defect rate and increasing the yield of advanced semiconductor devices.

[0044] In addition, the present invention allows various parts to be compactly arranged within the housing space of a very narrow device while maintaining mechanical stability, thereby effectively blocking external leakage and scattering of airflow containing particles, and thus contributing to a reduction in the footprint of the device.

[0045] Furthermore, the present invention is not limited solely to the embodiment described above. Since the same effect can be achieved even when changing the detailed configuration, number, or arrangement structure of the device, it is hereby specified that those skilled in the art can add, delete, or modify various configurations within the scope of the technical concept of the present invention. Explanation of the symbols

[0046] 1000 : (The present invention) Substrate transfer device 1100-1, 1100-2 : Aam 1200 : Linear transfer unit 1210, 1220, 1230: Housing, Linear module, Mover 1250 : Particle Barrier 1251, 1252: 1st particle barrier, 2nd particle barrier 1240, 1260, 1270: Housing bottom plate, particle barrier lip, first exhaust fan 1241 : Discharge pipe 1300 : Rotary transfer unit 1310, 1320, 1330, 1340: Rotary motor, guide cone component, second exhaust fan, exhaust duct 1311, 1311a: Rotating shaft (of a rotary motor), through hole 1400 : Exhaust line W : Wafer

Claims

Claim 1 A housing having an arm for placing a wafer on the upper part; a linear module provided inside the housing; A substrate transfer device comprising: a linear transfer unit including a mover for transferring an arm in a linear direction according to the operation of a linear module while the linear module and the arm are connected through slots on both sides of the housing; and a rotary transfer unit provided at the bottom of the linear transfer unit for rotating the arm and the linear transfer unit by a certain angle in a clockwise or counterclockwise direction, wherein a particle barrier is provided in the inner space of the slot of the housing along the length direction of the slot and has a width greater than the width of the slot, and a rotary motor is provided in the rotary transfer unit for rotating the arm and the linear transfer unit, wherein the rotation axis of the rotary motor is rotatably coupled to a housing bottom plate forming the bottom surface of the housing, and a through hole is formed at the center of the rotation axis so as to allow a cable to be connected, and a first exhaust fan is provided at both ends of the housing bottom plate to forcibly induce an airflow containing particles into the through hole, and an airflow discharge conduit is formed in the housing bottom plate between the first exhaust fan and the through hole so that the airflow A substrate transfer device having a particle sealing function, characterized in that it is guided toward a through hole along a discharge conduit, and a cone-shaped guide cone member having a hollow into which a cable is inserted is provided in the through hole, so that an airflow containing particles generated inside the housing of the linear transfer unit surrounds the outer surface of the guide cone member and settles in a cyclone form, thereby being discharged downward through the through hole. Claim 2 A substrate transfer device having a particle sealing function according to claim 1, wherein the particle barrier comprises: a first particle barrier disposed adjacent to the slot in the inner space of the slot of the housing; and a second particle barrier disposed at a certain distance from the slot with the first particle barrier in between in the inner space of the slot of the housing. Claim 3 A substrate transfer device having a particle sealing function according to claim 1, characterized in that the particle blocking film is fitted into a through hole formed in the mover and does not hinder the movement of the mover. Claim 4 A substrate transfer device having a particle sealing function according to claim 1, wherein a pair of second exhaust fans are provided facing each other on both sides of the through hole on the bottom surface of the rotary transfer part, and an exhaust duct is connected to each of the second exhaust fans, so that the airflow discharged downward through the through hole is diverted to flow laterally by the second exhaust fans and then exhausted to the outside through the exhaust duct.

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