Brush Roller Manufacturing Apparatus

Abstract

A brush roller manufacturing device according to one embodiment of the present invention comprises: a rotary driving unit for rotating a mandrel; a solution supply unit for spraying a liquid coating material onto the surface of the rotating mandrel; a thickness control unit for controlling the thickness of the sprayed liquid coating material; a curing unit for curing the thickness-controlled liquid coating material to form a main body; and a mold unit for forming a cleaning unit including a raised portion or a recessed portion on the surface of the main body; and can form a brush roller including the main body and the cleaning unit on the mandrel.

Description

Technology Field

[0001] One embodiment of the present invention relates to a brush roller manufacturing device, and more specifically, to a brush roller manufacturing device capable of automatically regenerating a wafer cleaning brush roller used in a post-cleaning process after Chemical Mechanical Polishing (CMP). Background Technology

[0002] In the semiconductor manufacturing process, CMP is a key process capable of performing planarization by chemically and mechanically polishing the wafer surface. After the CMP process, a post-CMP cleaning process may be performed to remove contaminants, such as slurry residue or polishing particles remaining on the wafer surface.

[0003] In the post-CMP cleaning process, a polymer brush roller rotates in contact with the wafer surface, effectively removing contaminants through chemical and electrostatic action. This physical contact method can be utilized as one of the most effective cleaning methods for removing slurry residues and fine particles.

[0004] Cleaning efficiency of brush rollers can decrease as contaminants gradually accumulate during use, requiring them to be replaced with new brushes after a certain period. Traditionally, workers have generally replaced the brushes manually, and the resulting downtime, labor costs, and brush purchase expenses can impact productivity and economic efficiency. The problem to be solved

[0005] One embodiment of the present invention aims to provide a brush roller manufacturing device capable of automatically regenerating a brush roller without manual intervention by an operator. means of solving the problem

[0006] A brush roller manufacturing device according to one embodiment of the present invention comprises: a rotary driving unit for rotating a mandrel; a solution supply unit for spraying a liquid coating material onto the surface of the rotating mandrel; a thickness control unit for controlling the thickness of the sprayed liquid coating material; a curing unit for curing the thickness-controlled liquid coating material to form a main body; and a mold unit for forming a cleaning unit including a raised portion or a recessed portion on the surface of the main body; and can form a brush roller including the main body and the cleaning unit on the mandrel.

[0007] A brush roller manufacturing device according to another embodiment of the present invention comprises: a rotary driving unit for rotating a mandrel disposed in a first chamber; a solution supply unit for spraying a liquid coating material onto the surface of the rotating mandrel; a thickness control unit for controlling the thickness of the sprayed liquid coating material; and a curing unit for curing the thickness-controlled liquid coating material to form a main body; and a mold unit disposed in a second chamber for forming a cleaning unit including a raised portion or a recessed portion on the surface of the main body; thereby forming a brush roller including a main body and a cleaning unit on the mandrel. Effects of the invention

[0008] According to one embodiment of the present invention, since the brush roller can be automatically regenerated within the equipment, equipment downtime can be minimized compared to the conventional manual replacement method, thereby improving overall productivity.

[0009] In addition, by removing the contaminated brush surface and forming a new brush surface, consistent cleaning performance can be continuously maintained, thereby ensuring quality stability of the cleaning process after CMP.

[0010] In addition, since the brush roller can be repeatedly regenerated, the frequency of purchasing consumable brushes can be reduced, resulting in lower operating costs. Furthermore, the brush condition can be maintained optimally without direct intervention by workers, thereby improving the efficiency of labor management.

[0011] Furthermore, by applying molds of various shapes, brush nodule forms optimized for the cleaning target can be realized, thereby maximizing the cleaning effect. Brief explanation of the drawing

[0012] FIG. 1 is a schematic diagram showing a brush roller manufacturing device according to one embodiment of the present invention. FIG. 2 is a schematic diagram showing a brush roller manufacturing device according to another embodiment of the present invention. FIG. 3a is a perspective view showing the mold part of FIG. 1 and FIG. 2 separated from the main body part. FIG. 3b is a perspective view showing the state in which the mold part presses the main body part to form the cleaning part. FIG. 3c is a perspective view schematically showing a brush roller formed by the mold part of FIG. 3a. FIG. 4a is a perspective view schematically showing another embodiment of the mold part. FIG. 4b is a perspective view schematically showing a brush roller formed by the mold part of FIG. 4a. FIG. 5a is a perspective view schematically showing another embodiment of the mold part. FIG. 5b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 5a. FIG. 6a is a perspective view schematically showing another embodiment of the mold part. FIG. 6b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 6a. FIG. 7a is a perspective view schematically showing another embodiment of the mold part. FIG. 7b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 7a. FIG. 8a is a perspective view schematically showing another embodiment of the mold part. FIG. 8b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 8a. FIG. 9a is a perspective view schematically showing another embodiment of the mold part. FIG. 9b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 9a. FIG. 10a is a perspective view schematically showing another embodiment of the mold part. FIG. 10b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 10a. FIG. 11a is a perspective view schematically showing another embodiment of the mold part. FIG. 11b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 11a. FIG. 12a is a perspective view schematically showing another embodiment of the mold part. FIG. 12b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 12a. FIG. 13a is a cross-sectional view schematically showing another embodiment of a brush roller. Figures 13b and 13c are step-by-step cross-sectional views illustrating a method for removing a brush roller. FIG. 14 is a cross-sectional view schematically showing one embodiment of a mandrel. FIG. 15 is a cross-sectional view schematically showing another embodiment of a mandrel. Specific details for implementing the invention

[0013] Hereinafter, embodiments of the present invention may be described in detail with reference to the attached drawings. In describing the embodiments of the present invention, if it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the essence of the present invention, such detailed description may be omitted.

[0014] FIG. 1 is a schematic diagram showing a brush roller manufacturing device according to one embodiment of the present invention, FIG. 2 is a schematic diagram showing a brush roller manufacturing device according to another embodiment of the present invention, FIG. 3a is a perspective view showing a state in which a mold part is spaced apart from a main body part, and FIG. 3b is a perspective view showing a state in which a mold part presses the main body part to form a cleaning part.

[0015] Referring to FIG. 1, a brush roller manufacturing device (100) according to one embodiment of the present invention may be configured to be disposed within a single chamber (110) and configured to automatically form a brush roller (500) on a mandrel (300).

[0016] As an embodiment, the brush roller manufacturing device (100) may include a rotation drive unit (120) for rotating a mandrel (300), a solution supply unit (130) for spraying a liquid coating material, a thickness control unit (140) for controlling the thickness of the sprayed liquid coating material, a curing unit (150) for curing the liquid coating material, a mold unit (160) for forming a cleaning unit, a solution recovery unit (170) for recovering excess solution, a solution purification unit (180) for purifying the recovered solution, and a surface sensing unit (190) for detecting the brush condition.

[0017] The mandrel (300) can serve as the central axis of the brush roller (500) and is configured in a cylindrical shape, having a diameter and length suitable for the cleaning process after CMP. A release layer (310) can be formed on the surface of the mandrel (300), which can facilitate the removal of the finished brush roller (500) as described later.

[0018] The rotary drive unit (120) can rotate the mandrel (300) around a central axis and maintain a constant rotational speed so that the liquid coating material can be uniformly distributed on the surface of the mandrel (300). The rotary drive unit (120) may include a motor and a gear system, and the rotational speed can be adjusted according to the viscosity of the coating material and the desired coating thickness.

[0019] The solution supply unit (130) is positioned on the upper part of the rotating mandrel (300) to spray a liquid coating material. The liquid coating material may be, for example, a thermosetting resin, a photocurable resin, or a composite resin thereof, and may have appropriate strength and elasticity after curing, exhibiting characteristics suitable for wafer cleaning.

[0020] The liquid coating material sprayed from the solution supply unit (130) can be spread over the entire surface by the rotation of the mandrel (300), and at this time, the thickness control unit (140) can perform the role of maintaining a constant coating thickness. The thickness control unit (140) can be configured in the form of a scraper or roller that maintains a constant distance from the surface of the mandrel (300). Through this, the thickness of the main body (510) can be uniformly controlled.

[0021] The curing section (150) can form the main body (510) by first curing a thickness-controlled liquid coating material. Depending on the type of coating material used, the curing section (150) may adopt a thermal curing method or a photocuring method. In the case of a thermal curing method, an infrared heater or a heating wire may be used, and in the case of a photocuring method, a UV lamp or an LED light source may be used.

[0022] The first curing may proceed in a partially cured state rather than a fully cured state, which is intended to facilitate the molding process in the subsequent mold part (160). The degree of curing can be controlled by adjusting the temperature, light intensity, curing time, etc.

[0023] The mold part (160) is a key component capable of forming a cleaning part (520) on the surface of the primary hardened main body part (510). The mold part (160) may include a mold main body part (161) and a molding protrusion part (162) or a molding groove part (163) corresponding to the shape of the cleaning part (520).

[0024] Referring to FIGS. 3a and 3b, the mold portion (160) may be composed of a first mold portion and a second mold portion positioned on both sides of the mandrel (300), and the cleaning portion (520) may be formed by pressing the main body portion (510) together. The molding protrusion portion (162) may form an intaglio-shaped cleaning portion (522) on the surface of the main body portion (510), and the molding groove portion (163) may form a relief-shaped cleaning portion (520).

[0025] The mold part (160) may include a heater or a light source inside, so that final curing can be performed simultaneously with molding. Through this, the shape of the cleaning part (520) can be stably fixed and excellent mechanical properties can be secured.

[0026] The solution recovery unit (170) is positioned below the mandrel (300) to recover excess liquid coating material that has flowed down during the thickness adjustment process. The solution recovery unit (170) is normally covered by a shutter to prevent back-contamination, and is opened only during the coating process to recover the solution.

[0027] The solution purification unit (180) can purify the recovered liquid coating material into a reusable state by removing contaminants. As an example, the solution purification unit (180) may include a filtering system. The solution purification unit (180) may utilize purification methods such as centrifugation or distillation as needed. The purified solution can be supplied back to the solution supply unit (130) for recirculation, thereby reducing operating costs.

[0028] The surface sensing unit (190) can monitor the surface condition of the mandrel (300) or brush roller (500) in real time. The surface sensing unit (190) may include a light sensor, a pressure sensor, or a non-contact distance measuring sensor, and through this, can detect the coating thickness, surface roughness, and the molding condition of the cleaning unit (520).

[0029] Information collected from the surface sensing unit (190) is transmitted to the control unit (191) and can be used to optimize each process step. For example, if the coating thickness deviates from the target value, the solution supply amount or the position of the thickness control unit (140) can be automatically adjusted.

[0030] Referring to FIG. 2, a brush roller manufacturing device (200) according to another embodiment of the present invention may be configured to perform each process step independently by adopting a structure separated into a first chamber (210) and a second chamber (220). This two-chamber method can enable more efficient process management and quality control compared to the one-chamber method described in FIG. 1.

[0031] The brush roller manufacturing device (200) may include a rotary drive unit (120), a solution supply unit (130), a thickness control unit (140), a curing unit (150), a mold unit (160), a solution recovery unit (170), a solution purification unit (180), and a surface sensing unit (190) that perform substantially the same functions as the components of FIG. 1 described above. However, it may be differentiated in that these components are distributed in a first chamber (210) and a second chamber (220) to enable a sequential process flow.

[0032] The first chamber (210) can primarily handle coating and primary curing processes, and may be equipped with a rotary drive unit (120), a solution supply unit (130), a thickness control unit (140), a curing unit (150), a solution recovery unit (170), and a solution purification unit (180). Within the first chamber (210), the mandrel (300) can rotate to sequentially undergo the spraying of liquid coating material, thickness control, and primary curing processes.

[0033] The environment of the first chamber (210) can be optimized for the coating process, and the temperature, humidity, and cleanliness can be strictly controlled. In particular, to satisfy the requirements of the semiconductor manufacturing process, a cleanroom level of cleanliness can be maintained, and the entry of fine particles or contaminants can be blocked.

[0034] The second chamber (220) is mainly equipped with a mold section (160) and a surface sensing section (190) and can handle the molding and final curing processes of the cleaning section (520). The mandrel (300), which has undergone primary curing in the first chamber (210), is transferred to the second chamber (220) to undergo precise molding.

[0035] The environment of the second chamber (220) can be specialized for the molding process, and equipment for precise position control of the mold part (160) and uniform pressure distribution can be provided. Meanwhile, the second chamber (220) can be designed to facilitate easy replacement of various molds, so that it is possible to manufacture brush rollers (500) having different shapes of cleaning parts (520).

[0036] A transfer unit (not shown) capable of safely transferring a mandrel (300) may be provided between the first chamber (210) and the second chamber (220). The transfer unit can move the mandrel (300), which has undergone primary hardening, to the second chamber (220) without damage using a vacuum chuck or a mechanical gripper.

[0037] During the transfer process, gradual changes in environmental conditions may be applied to prevent deformation of the coating layer due to pressure differences or temperature changes between chambers. Additionally, the transfer time may be minimized to prevent the primary cured main body (510) from becoming excessively cured.

[0038] The 2-chamber method can provide several technical advantages over the 1-chamber method. First, since each chamber is optimized for a specific process, more precise process control may be possible. The first chamber (210) can focus on coating quality and the second chamber (220) can focus on molding precision, thereby improving overall product quality.

[0039] In addition, the 2-chamber method can have an advantage in terms of productivity in that continuous production is possible. While one mandrel (300) undergoes a molding process in the second chamber (220), another mandrel can undergo a coating process in the first chamber (210), thereby shortening the overall production cycle time.

[0040] Furthermore, in the event of a problem, only the relevant chamber can be maintained independently, minimizing downtime for the entire system. This can be particularly advantageous in semiconductor manufacturing environments where continuous production is critical.

[0041] In a 2-chamber system, the process conditions of each chamber can be independently optimized, allowing for more precise quality control. In the first chamber (210), focus can be placed on coating uniformity and the degree of primary curing, while in the second chamber (220), focus can be placed on the shape precision of the clean section (520) and the final physical properties.

[0042] An independent control system can be established in each chamber, and optimal conditions can be maintained through real-time process monitoring. Process data from the first chamber (210) and the second chamber (220) can be managed in an integrated manner to ensure consistency and reproducibility of the entire process.

[0043] Referring to FIGS. 3a to 3c, the specific operation mechanism of the mold part (160) and the structure of the brush roller (500) formed thereby can be understood in detail. These drawings show a basic embodiment in which a cleaning part (520) in the shape of a raised part (521) is formed using a molding groove part (163).

[0044] Referring to FIG. 3a, the mold part (160) may be initially positioned at a certain distance from the mandrel (300) on which the main body part (510) formed after primary curing is completed. The mold part (160) may be composed of a first mold part (1601) and a second mold part (1602) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold main body part (161) and a molding groove part (163).

[0045] The molding groove (163) can be processed into an intaglio shape to form a cylindrical embossed portion (521) and can be arranged at regular intervals along the circumferential direction of the mandrel (300). Since the depth and diameter of the molding groove (163) can directly affect the cleaning performance of the final cleaning portion (520), they can be formed to meet the requirements of the cleaning process after CMP. At this stage, since the main body portion (510) is in a primary cured state and has not yet been fully cured, molding by the mold portion (160) can be easily performed. The spacing between the mold portion (160) and the main body portion (510) can be determined by considering the molding pressure and the shape precision of the final cleaning portion (520).

[0046] Referring to FIG. 3b, it can be seen that the mold part (160) moves toward the mandrel (300) and presses the main body part (510) from both sides. The first mold part and the second mold part can contact the main body part (510) simultaneously or sequentially to apply uniform pressure, thereby allowing the shape of the molding groove part (163) to be transferred to the surface of the main body part (510).

[0047] During the pressurization process, the material of the main body (510) flows into the molding groove (163) to form a cleaning portion (520) in the shape of a raised portion (521). The pressurizing force can be adjusted according to the material characteristics of the main body (510) and the desired dimensions of the cleaning portion (520), and since excessive pressure can cause deformation or cracking of the main body (510), it must be controlled to an appropriate level.

[0048] As previously described, the mold part (160) may include a heater or a light source inside, allowing for final curing to proceed simultaneously with pressurization. This simultaneous curing method can stably fix the shape of the molded clean part (520) and ensure excellent mechanical strength and durability.

[0049] Referring to FIG. 3c, the specific shape of the brush roller (500) completed through a molding operation using the molding groove (163) can be seen. The brush roller (500) may include a main body (510) formed on the mandrel (300) and a cleaning part (520) composed of a plurality of cylindrical raised parts (521) protruding from the surface of the main body (510).

[0050] The raised portions (521) can be regularly arranged in the circumferential and axial directions of the mandrel (300), and each raised portion (521) can have a constant diameter and height to provide uniform cleaning performance. The shape of the raised portions (521) can be designed to optimize the contact area with the wafer surface and cleaning power during the cleaning process after CMP.

[0051] The main body (510) and the cleaning part (520) can be integrally formed from the same material, thereby preventing peeling or separation problems at the interface. The surface of the embossed part (521) has a smooth and uniform finish, so that it does not cause scratches or damage to the wafer surface.

[0052] These cylindrical raised portions (521) can provide effective cleaning power through point contact with the wafer surface, and at the same time have appropriate elasticity so they can flexibly adapt to fine irregularities on the wafer surface.

[0053] FIG. 4a is a perspective view schematically showing another embodiment of the mold part, and FIG. 4b is a perspective view schematically showing a brush roller formed by the mold part of FIG. 4a.

[0054] Referring to FIGS. 4a and 4b, a modified structure of a mold part and a brush roller formed thereby according to another embodiment of the present invention can be seen. This embodiment adopts an approach opposite to the method of forming the raised part (521) described in FIGS. 3a to 3c, thereby enabling the realization of a cleaning part (520a) in the form of an intaglio part (522a).

[0055] Referring to FIG. 4a, the mold portion (160a) may be composed of a first mold portion (1601a) and a second mold portion (1602a) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold body portion (161a) and a molding projection portion (162a). The molding projection portion (162a) may be processed in a form that protrudes from the surface of the mold body portion (161a), contrary to the molding groove portion (163) described above. The molding projection portion (162a) may have a cylindrical shape and may be arranged at regular intervals along the circumferential direction of the mandrel (300).

[0056] The diameter and height of the molded protrusion (162a) can be important factors in determining the dimensions of the final formed indentation (522a). Since the molded protrusion (162a) can form an indentation (522a in FIG. 4b) by indenting the corresponding part when pressed against the main body (510), it must be precisely designed to meet the desired cleaning characteristics.

[0057] Meanwhile, the molded protrusion (162a) may come into direct contact with the material of the main body (510) when pressure is applied. Accordingly, a surface treatment considering surface roughness and mold release properties may be applied. Through this, the mold part (160a) can be easily separated after molding, and the surface quality of the intaglio part (522a in FIG. 4b) can be improved.

[0058] When the mold portion (160a) presses the main body portion (510), the molding protrusion portion (162a) can locally press into the surface of the main body portion (510) to form an intaglio portion (522a). During this process, the material of the main body portion (510) may be pushed out and redistributed around the molding protrusion portion (162a), which may form fine ridges around the intaglio portion (522a).

[0059] The molding pressure must be adjusted considering the shape of the molding protrusion (162a) and the material properties of the main body (510). Excessive pressure may cause damage to the main body (510), and insufficient pressure may lead to the formation of an incomplete indentation (522a). Therefore, detailed process control may be required to derive optimal molding conditions.

[0060] As one embodiment, vibration or ultrasonic waves can be applied to the molding protrusion (162a) to improve molding efficiency. This auxiliary molding method may be particularly effective for forming a complex shape of the intaglio (522a).

[0061] Referring to FIG. 4b, the brush roller (500a) formed by the molded protrusion (162a) may have a cleaning portion (520a) comprising a plurality of cylindrical indentations (522a) on the surface of the main body portion (510a). The indentations (522a) may appear in a recessed form on the surface of the main body portion (510a). As an example, the indentations (522a) may have a constant diameter and depth.

[0062] The intaglio cleaning section (520a) can provide a cleaning mechanism different from the embossed cleaning section (520) described earlier. The intaglio section (522a) can act as a pocket that captures contaminants upon contact with the wafer surface. This can be more effective for removing specific types of contaminants.

[0063] A cleaning solution can be stored inside the engraved portion (522a) to provide a continuous cleaning effect. Accordingly, the efficiency of the cleaning process can be improved. The depth and shape of the engraved portion (522a) can be formed in various ways depending on the size of the captured contaminants and the flow characteristics of the cleaning solution.

[0064] The intaglio cleaning section (520a) can provide several unique advantages over the embossed cleaning section (520). First, the intaglio section (522a) can prevent back-contamination by providing a discharge path for contaminants. Contaminants removed from the wafer surface can be introduced into the intaglio section (522a) and temporarily isolated, thereby suppressing re-diffusion to other cleaning areas.

[0065] The engraved portion (522a) can serve as a channel to guide the flow of cleaning solution generated during the cleaning process. This allows for a uniform distribution of cleaning solution across the entire wafer surface and improves cleaning efficiency.

[0066] The intaglio structure can provide local flexibility while maintaining the overall rigidity of the brush roller (500a). This allows it to effectively adapt to fine shape changes on the wafer surface.

[0067] FIG. 5a is a perspective view schematically showing another embodiment of a mold part, and FIG. 5b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 5a.

[0068] Referring to FIGS. 5a and 5b, the structure of a mold part and a brush roller according to another embodiment of the present invention can be seen. This embodiment can implement a cleaning part in the shape of a rectangular prism, which is different from the cylindrical shape described above.

[0069] Referring to FIG. 5a, the mold portion (160b) may be composed of a first mold portion (1601b) and a second mold portion (1602b) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold body portion (161b) and a molding groove portion (163a).

[0070] The mold portion (160b) may include a mold body portion (161b) and a rectangular prism-shaped molding groove portion (163a). The molding groove portion (163a) has a rectangular cross-section and may be regularly arranged in the axial and circumferential directions of the mandrel (300).

[0071] The rectangular prism-shaped molded groove (163a) can provide a wider contact area compared to the cylindrical shape. This changes the contact characteristics with the wafer surface, thereby affecting the cleaning mechanism. The horizontal and vertical dimensions of the molded groove (163a) can be configured differently depending on the target cleaning performance. In particular, the rectangular prism shape can exert concentrated cleaning power at the corners. This characteristic is advantageous for the removal of solid contaminants.

[0072] When the mold part (160b) is pressed, the material of the main body part (510) can flow into the molding groove part (163a) in the shape of a square column. Due to the characteristics of the square cross-section, it can be completely filled up to the corner parts.

[0073] Molding pressure and curing conditions can be finely controlled for complete transfer of the square shape. In particular, the molding quality of the corners can determine the final cleaning performance. A heater or light source inside the mold part (160b) can provide uniform curing over the entire square prism shape. Non-uniform curing can lead to shape distortion or reduced durability.

[0074] Referring to FIG. 5b, the finished brush roller (500b) may include a plurality of rectangular prism-shaped raised portions (521a) on the surface of the main body (510b). The raised portions (521a) have a rectangular cross-section and may protrude to a predetermined height. The rectangular prism-shaped raised portions (521a) may have cleaning characteristics distinct from those of a cylinder. The four corners and the flat portion may come into contact with the wafer surface in various ways. The flat portion can provide uniform cleaning power through contact over a wide area. On the other hand, the corner portions can effectively remove hard contaminants through concentrated mechanical action.

[0075] The rectangular prism-shaped cleaning section (520b) can provide a complex cleaning mechanism compared to the cylindrical type. Planar contact and line contact occur simultaneously, enabling a multi-layered cleaning effect. The rectangular prism-shaped cleaning section (520b) can also exhibit excellent adaptability to fine patterns or trench structures on the wafer surface. More effective cleaning is possible when the orientation of the rectangular cross-section aligns with a specific pattern. Additionally, the rectangular prism structure influences the flow of the cleaning solution. Different hydrodynamic characteristics are exhibited at the planar and corner sections, creating a complex cleaning environment.

[0076] The rectangular prism-shaped embossed portion (521a) can perform well in a specific post-CMP cleaning process. It can be particularly effective for removing residual slurry after metal wiring CMP or removing particles after STI CMP.

[0077] The aspect ratio or height of the embossed portion (521a) can be adjusted according to the cleaning target. This allows for the provision of a customized cleaning solution. In some cases, rounding can be applied to the corners of the rectangular prism to prevent wafer damage while maintaining the cleaning effect.

[0078] FIG. 6a is a perspective view schematically showing another embodiment of a mold part, and FIG. 6b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 6a.

[0079] Referring to FIGS. 6a and 6b, another embodiment of the present invention may be presented. This relates to a mold part (160c) forming a square prism-shaped intaglio part (522b) and a resulting brush roller (500c).

[0080] Referring to FIG. 6a, the mold portion (160c) may be composed of a first mold portion (1601c) and a second mold portion (1602c) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold body portion (161c) and a molding projection portion (162b).

[0081] The mold portion (160c) may include a rectangular prism-shaped molding projection (162b) protruding from the mold body portion (161c). The molding projection (162b) has a rectangular cross-section and exhibits shape characteristics distinct from the cylindrical molding projection (162a) described earlier. The corner portions of the rectangular prism-shaped molding projection (162b) can play a particularly important role. When pressure is applied, these corners apply concentrated pressure to the body portion (510) to form a clearly rectangular indentation (522b in FIG. 6b). The height and cross-sectional dimensions of the molding projection (162b) can determine the depth and size of the final indentation (522b). These dimensions may be formed in various ways considering wafer cleaning characteristics.

[0082] When the mold part (160c) presses the main body part (510), the rectangular prism-shaped molding protrusion part (162b) may exhibit a more complex deformation pattern. Unlike a cylindrical shape, since the four corners and the flat part are pressed in simultaneously, precise control is required for uniform molding. The material of the main body part (510) can be redistributed to fit the rectangular shape as it is pushed around the molding protrusion part (162b). In this process, complete molding of the corner parts can be a key factor. The distribution of the pressure is also important. Even pressure must be transmitted across the entire rectangular cross-section to prevent deformation or incomplete molding.

[0083] Referring to FIG. 6b, the brush roller (500c) may include a plurality of rectangular prism-shaped indentations (522b) on the surface of the main body (510c). The indentations (522b) are recessed with a rectangular cross-section and can maintain a predetermined depth and dimensions. The rectangular indentations (522b) can provide a larger internal volume compared to the circular indentations (522a). This can lead to an improvement in the ability to collect contaminants. The corner portions of the indentations (522b) can form an effective discharge path for contaminants. As the flow of the cleaning liquid is guided along the corners, the removal of the collected contaminants can be facilitated.

[0084] The rectangular prism-shaped engraved portion (522b) can have four straight corners and a flat bottom portion that perform different functions. The flat bottom portion can provide a large-capacity contaminant collection space. On the other hand, the corner portions induce a concentrated fluid flow to help discharge the collected contaminants. When the pattern structure of the wafer surface matches the orientation of the engraved portion (522b), more effective cleaning is possible. In particular, it can exhibit excellent performance in line and space patterns.

[0085] The aspect ratio of the rectangular prism-shaped engraved portion (522b) can be adjusted according to the object to be cleaned. It can be designed with various ratios ranging from square to rectangular. Different functions are possible depending on the depth of the engraved portion (522b). A shallow depth enables rapid discharge of contaminants, while a deep depth enables large-capacity collection.

[0086] According to one embodiment, a fine texture may be added to the bottom of the engraved portion (522b) to further enhance the cleaning effect. This auxiliary structure may help in removing stubborn contaminants.

[0087] FIG. 7a is a schematic perspective view showing another embodiment of a mold part, and FIG. 7b is a schematic perspective view showing another embodiment of a brush roller formed by the mold part of FIG. 7a.

[0088] Referring to FIGS. 7a and 7b, another embodiment of the present invention has a structure forming a ring-shaped raised portion (521b). Unlike the individual columnar cleaning portions described above, this represents a different continuous structure.

[0089] Referring to FIG. 7a, the mold portion (160d) may be composed of a first mold portion (1601d) and a second mold portion (1602d) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold body portion (161d) and a molding groove portion (163b).

[0090] The mold portion (160d) may include a ring-shaped molding groove portion (163b) in the mold body portion (161d). The molding groove portion (163b) may consist of circular grooves that surround the entire circumference of the body portion (510) and may be arranged at regular intervals along the longitudinal direction of the mandrel (300). Each molding groove portion (163b) may be formed continuously along the entire circumference of the body portion (510). The width and depth of the molding groove portion (163b) may determine the dimensions of the ring-shaped embossed portion (521b) to be finally formed. The ring spacing may be set by simultaneously considering cleaning efficiency and brush rigidity.

[0091] When the mold portion (160d) presses the main body portion (510), the liquid coating material flows into the ring-shaped molding groove portion (163b), allowing a continuous ring structure to be formed. A uniform flow of material in the circumferential direction occurs, enabling the formation of a complete ring. During the curing process, uniform curing can proceed throughout the entire ring structure. Partial curing deviations may cause deformation or breakage of the ring.

[0092] Referring to FIG. 7b, the brush roller (500d) may include a plurality of ring-shaped raised portions (521b) protruding outward from the outer surface of the main body (510d). Each ring-shaped raised portion (521b) wraps around the entire circumference of the main body (510d) and can maintain a constant spacing along the length of the mandrel (300). The grooves between the ring-shaped raised portions (521b) can serve as channels for the discharge of contaminants. This structure allows contaminants removed during the cleaning process to be effectively discharged. The main body (510d) and the ring-shaped raised portions (521b) are integrally molded so there is no risk of interfacial separation. The continuous ring structure can provide excellent mechanical strength.

[0093] The ring-shaped cleaning section (520d) can provide consistent cleaning power by forming a continuous ring structure that forms line contact with the wafer surface. During relative movement between the wafer and the brush, the ring-shaped raised section (521b) can generate a continuous sweeping effect on the wafer surface. In particular, it can provide uniform cleaning conditions across the entire wafer surface, which can be advantageous for cleaning large-area wafers.

[0094] The groove portion between the rings can guide the axial flow of the cleaning liquid. This allows the cleaning liquid to be evenly distributed over the entire length of the brush roller. The cross-sectional shape of the ring-shaped raised portion (521b) can be varied. Cleaning characteristics can be controlled by applying profiles such as rectangular, semicircular, or trapezoidal. The ring spacing and height can be modified to suit the characteristics of the object to be cleaned. A dense spacing can provide strong cleaning power, while a wide spacing can provide effective discharge of contaminants.

[0095] FIG. 8a is a perspective view schematically showing another embodiment of a mold part, and FIG. 8b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 8a.

[0096] Referring to FIGS. 8a and 8b, a structure forming a ring-shaped intaglio (522c) can be presented as another embodiment of the present invention. This adopts an approach opposite to that of the ring-shaped relief (521b in FIG. 7b) described above.

[0097] Referring to FIG. 8a, the mold portion (160e) may be composed of a first mold portion (1601e) and a second mold portion (1602e) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold body portion (161e) and a molding projection portion (162c).

[0098] The mold portion (160e) may include ring-shaped molded protrusions (162c) protruding from the mold body portion (161e). The molded protrusions (162c) are composed of circular protrusions that surround the entire circumference of the body portion (510) and may be arranged at regular intervals along the longitudinal direction of the mandrel (300). Each molded protrusion (162c) may have a continuous ring shape. This structure may form a uniform ring-shaped depression on the surface of the body portion (510) when pressure is applied. The height and width of the molded protrusions (162c) may determine the depth and width of the final indentation (522c in FIG. 8b). The ring spacing may be set considering cleaning performance and the mechanical strength of the brush.

[0099] When the mold portion (160e) presses the main body portion (510), the ring-shaped molding projection portion (162c) continuously presses into the surface of the main body portion (510). During this process, the material of the main body portion (510) is pushed out around the projection, and a ring-shaped indentation may be formed. Due to the characteristics of the ring-shaped structure, material movement in the circumferential direction occurs during the press-in process. This can contribute to the formation of a more uniform indentation. The pressure must be evenly distributed over the entire ring. Local pressure variations may result in uneven depth of the indentation.

[0100] Referring to FIG. 8b, the brush roller (500e) may include a plurality of ring-shaped recesses (522c) on the surface of the main body (510e). Each recess (522c) is formed continuously along the entire circumference of the main body (510e) and can maintain a constant spacing along the length of the mandrel (300). The protrusions between the ring-shaped recesses (522c) can form a main contact surface with the wafer. This structure can simultaneously achieve concentration and dispersion of contact pressure. The interior of the recess (522c) can serve as a contaminant collection space. Due to the continuous ring structure, large-capacity collection is possible.

[0101] The ring-shaped engraving (522c) can effectively capture contaminants by creating a vacuum effect when in contact with the wafer. The protrusions between the rings can form line contact with the wafer surface. This provides concentrated cleaning power while minimizing wafer damage. During the cleaning process, cleaning fluid can be stored inside the engraving (522c) to create a continuous cleaning environment. This can be particularly effective for removing stubborn contaminants.

[0102] The ring-shaped engraved portion (522c) can serve as a channel to guide the axial flow of the cleaning fluid. As the cleaning fluid flows along the engraved portion, it can continuously discharge the collected contaminants. Circumferential circulation of the cleaning fluid is also possible. The centrifugal force generated by the rotation of the brush can facilitate the replacement of the cleaning fluid inside the engraved portion. The depth and shape of the engraved portion (522c) can be formed by considering the balance between the collection capacity and the discharge efficiency.

[0103] The cross-sectional shape of the ring-shaped indentation (522c) can be varied in many ways. Profiles such as V-shape, U-shape, or trapezoidal shape may be applied. The spacing and depth of the indentation can be adjusted according to the characteristics of the object to be cleaned. Close spacing enables high collection density, while deep indentation enables large-capacity collection. In some cases, a fine texture or additional grooves may be formed on the bottom of the indentation to further enhance the cleaning effect.

[0104] FIG. 9a is a perspective view schematically showing another embodiment of a mold part, and FIG. 9b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 9a.

[0105] Referring to FIGS. 9a and 9b, as another embodiment of the present invention, a structure forming a raised portion (521c) extended along the longitudinal direction of the mandrel (300) may be presented. This implements a clean portion having a different directionality from the ring-shaped structure described above.

[0106] Referring to FIG. 9a, the mold portion (160f) may be composed of a first mold portion (1601f) and a second mold portion (1602f) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold body portion (161f) and a molding groove portion (163c).

[0107] The mold portion (160f) may include a molding groove portion (163c) that extends parallel to the longitudinal direction of the mandrel (300) in the mold body portion (161f). The molding groove portions (163c) are arranged at regular intervals along the circumferential direction of the body portion (510), and each may extend over the entire length or a partial length of the mandrel (300). The longitudinal molding groove portions (163c) have a continuous linear structure. This shape exhibits linear characteristics that distinguish it from existing point-shaped or ring-shaped structures. The width and depth of the molding groove portions (163c) can determine the dimensions of the final embossed portion (521c). The groove spacing can be set by simultaneously considering the rigidity of the brush and the cleaning efficiency. Since each molding groove portion (163c) is machined parallel to the mandrel axis, high straightness and parallelism may be required during the manufacturing process.

[0108] When the mold portion (160f) pressurizes the main body portion (510), the liquid coating material can flow into the longitudinal molding groove portion (163c). Due to the characteristics of the longitudinal structure, the axial flow of the material occurs smoothly. The continuous longitudinal groove structure enables uniform distribution when filling the material. Consistent embossing is formed from the start point to the end point of the groove. The molding pressure must be evenly distributed over the entire length of each groove. As the length is long, consistency in pressure transmission is important.

[0109] Referring to FIG. 9b, the brush roller (500f) may include a plurality of raised portions (521c) extending along the longitudinal direction of the mandrel (300) on the surface of the main body (510f). Each raised portion (521c) protrudes in a straight line and may be arranged at regular intervals along the circumferential direction of the main body (510f). The grooves between the longitudinal raised portions (521c) may form axially extended channels. This structure enables efficient flow of cleaning fluid and contaminants. Each raised portion (521c) may maintain continuity over the entire length of the mandrel. This may contribute to improving the rigidity of the brush roller.

[0110] The longitudinal cleaning section (520f) can provide continuous and consistent cleaning power by having the raised section (521c) form longitudinal line contact with the wafer surface. During relative movement between the wafer and the brush, the longitudinal raised section (521c) can create a directional cleaning pattern on the wafer surface. This is particularly effective for removing contaminants in a specific direction. The grooves between the raised sections (521c) serve as discharge paths for the removed contaminants. Contaminants can be rapidly discharged through the longitudinal channels.

[0111] The longitudinal structure can promote axial flow of the cleaning fluid. As the cleaning fluid flows smoothly along the channels between the raised portions (521c), a uniform cleaning environment can be created along the entire length of the brush. The centrifugal force generated by the rotation of the brush and the axial flow can be combined to form a complex cleaning fluid flow pattern. These flow characteristics can contribute to improving cleaning efficiency and optimizing cleaning fluid consumption.

[0112] The number and spacing of the longitudinal embossed portions (521c) can be adjusted according to the characteristics of the object to be cleaned. A large number of embossed portions can provide high cleaning density, while a small number can provide strong individual cleaning power. The cross-sectional shape of the embossed portions (521c) can also be varied. Cleaning characteristics can be controlled by applying profiles such as rectangular, triangular, or semicircular shapes. In some cases, the embossed portions (521c) can be arranged in a spiral shape to implement a more complex cleaning mechanism. This can improve the uniform cleaning effect across the entire surface of the wafer.

[0113] FIG. 10a is a perspective view schematically showing another embodiment of a mold part, and FIG. 10b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 10a.

[0114] Referring to FIG. 10a and FIG. 10b, as another embodiment of the present invention, a structure forming an intaglio portion (522d) extending along the longitudinal direction of the mandrel (300) may be presented. This adopts an approach opposite to the longitudinal relief portion (521c in FIG. 9b) described above.

[0115] Referring to FIG. 10a, the mold portion (160g) may be composed of a first mold portion (1601g) and a second mold portion (1602g) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold body portion (161g) and a molding projection portion (162d).

[0116] The mold portion (160g) may include longitudinal molding protrusions (162d) protruding from the mold body portion (161g). The molding protrusions (162d) extend parallel to the axial direction of the mandrel (300) and may be arranged at regular intervals along the circumferential direction of the body portion (510). Each molding protrusion (162d) may have a continuous linear structure. These may form longitudinal depressions on the surface of the body portion (510) upon pressure. The height and width of the molding protrusions (162d) may determine the depth and width of the final engraved portion (522d). The spacing of the protrusions may be determined according to the mechanical strength and cleaning performance of the brush. The longitudinal protrusions require high straightness during manufacturing. This is because the degree of parallelism with the mandrel axis directly affects the quality of the final engraved portion.

[0117] When the mold portion (160g) presses the main body portion (510), the longitudinal molding protrusion portion (162d) can continuously press into the surface of the main body portion (510). During this process, the material of the main body portion (510) may be pushed out to both sides of the protrusion, forming a longitudinal depression. Due to the characteristics of the longitudinal structure, axial movement of the material may occur during the press-in process. Since this can affect the shape of the end portion of the intaglio, precise control may be required. The pressing force must be evenly distributed over the entire length of each protrusion. In particular, consistency in pressure transmission is important for long protrusions.

[0118] Referring to FIG. 10b, the brush roller (500g) may include a plurality of recessed portions (522d) extending along the longitudinal direction of the mandrel (300) on the surface of the main body (510g). Each recessed portion (522d) is recessed in a straight line and may be arranged at regular intervals along the circumferential direction of the main body (510g). The protrusions between the longitudinal recessed portions (522d) may form a primary contact surface with the wafer. This structure allows for the capture of contaminants through the recessed portions while concentrating contact pressure. Each recessed portion (522d) may maintain continuity along the entire length of the mandrel. This enables the simultaneous capture of large volumes of contaminants and efficient discharge.

[0119] The longitudinal engravings (522d) can capture contaminants upon contact with the wafer while simultaneously providing an axial discharge path. The protrusions between the engravings (522d) can form longitudinal line contact with the wafer surface. This provides consistent cleaning power while minimizing wafer damage. During the cleaning process, cleaning fluid can be stored within the engravings (522d) to create a continuous cleaning environment. Due to the longitudinal structure, the residence time of the cleaning fluid is increased, which is advantageous for removing stubborn contaminants.

[0120] The longitudinal engraved portion (522d) can serve as a channel to guide the axial flow of the cleaning fluid. As the cleaning fluid flows along the engraved portion, it can continuously discharge the collected contaminants. The centrifugal force generated by the rotation of the brush can facilitate the replacement of the cleaning fluid inside the engraved portion. This can improve the self-cleaning action of the engraved portion. The depth and width of the engraved portion (522d) can be formed by considering the balance between the collection capacity and the discharge efficiency.

[0121] The cross-sectional shape of the longitudinal engraved portion (522d) can be varied in many ways. Profiles such as V-shape, U-shape, or trapezoidal shape may be applied. The number and spacing of the engraved portions can be adjusted according to the characteristics of the object to be cleaned. A large number of engraved portions can provide high collection density, while a small number can provide strong individual cleaning power. In some cases, fine textures or additional grooves may be formed on the bottom of the engraved portions to further enhance the cleaning effect. It is also possible to implement a complex cleaning mechanism by arranging the engraved portions in a spiral shape.

[0122] FIG. 11a is a perspective view schematically showing another embodiment of a mold part, and FIG. 11b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 11a.

[0123] Referring to FIG. 11a and FIG. 11b, another embodiment of the present invention presents a structure forming a plurality of spaced-apart raised portions (521d) along the longitudinal direction of a mandrel (300). This adopts a segmented structure that is differentiated from the continuous longitudinal raised portion (521c in FIG. 9b) described above.

[0124] Referring to FIG. 11a, the mold portion (160h) may be composed of a first mold portion (1601h) and a second mold portion (1602h) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold body portion (161h) and a molding groove portion (163d).

[0125] The mold section (160h) may include a molding groove section (163d) that is divided and arranged along the longitudinal direction of the mandrel (300) in the mold body section (161h). The molding groove section (163d) may consist of multiple sections spaced apart in the longitudinal direction, rather than a single continuous groove. Each section of the molding groove section (163d) has a constant length, and there may be an area (S1) between the sections where no groove is formed. This structure allows for a clear distinction between the area where the raised portion is formed and the area where it is not formed at the final brush roller. The length and spacing of the molding groove section (163d) can be optimized according to the cleaning application. Generally, it is divided into two main sections and may be placed near both ends of the mandrel or at a specific location. This divided structure allows for independent processing of each section during mold manufacturing.

[0126] When the mold portion (160h) presses the main body portion (510), the liquid coating material may flow in only in the section where the molding groove portion (163d) is formed. In the section without the groove, the surface of the main body portion (510) remains unchanged. Axial flow of the material occurs within each molding groove portion (163d) section, but the flow may be blocked at the section boundaries. This contributes to forming clear raised boundary lines. Since independent molding is performed for each section, the molding conditions for each section can be individually optimized.

[0127] Referring to FIG. 11b, the brush roller (500h) may include a plurality of raised portions (521d) spaced apart in the longitudinal direction on the surface of the main body (510h). Each raised portion (521d) is formed only in a specific section and may be arranged alternately with a section (S1a) without raised portions. The section where the raised portions (521d) are formed can provide enhanced cleaning capabilities. On the other hand, the section (S1a) without raised portions provides a relatively soft contact surface, enabling delicate protection of the wafer surface. This structure can achieve differentiated cleaning performance along the longitudinal direction of the brush roller. Different cleaning intensities can be applied to different areas of the wafer.

[0128] The separated cleaning section (520h) can provide a unique multi-stage cleaning mechanism. Strong mechanical cleaning is primarily performed in the section with the raised section (521d), while gentle chemical cleaning is primarily performed in the section without it. During relative movement between the wafer and the brush, different areas of the wafer surface are exposed to different cleaning environments, which can produce a complex cleaning effect. At the boundary between the raised section (521d) and the general section, the flow pattern of the cleaning solution may change. This change in flow can provide an additional cleaning effect.

[0129] In the section with raised portions (521d), the turbulence of the cleaning liquid increases, resulting in a powerful cleaning action. In the general section, a soft, laminar flow can be formed. The difference in cleaning liquid flow between sections can create an overall balanced cleaning environment. Appropriate treatment is possible for both stubborn contaminants and sensitive surfaces. The number and location of the raised portions (521d) can be adjusted according to the characteristics of the cleaning target. In addition to two sections, it can be expanded to three or more sections to enable more precise cleaning control. The cleaning characteristics of each section can also be differentiated by designing the shape or size of the raised portions (521d) differently for each section. This is advantageous for implementing customized cleaning solutions.

[0130] FIG. 12a is a perspective view schematically showing another embodiment of a mold part, and FIG. 12b is a perspective view schematically showing another embodiment of a brush roller formed by the mold part of FIG. 12a.

[0131] Referring to FIGS. 12a and 12b, another embodiment of the present invention presents a structure forming a plurality of spaced-apart intaglio portions (522e) along the longitudinal direction of a mandrel (300). This adopts an approach opposite to the spaced-apart embossed portion (521d in FIG. 11b) described above.

[0132] Referring to FIG. 12a, the mold portion (160i) may be composed of a first mold portion (1601i) and a second mold portion (1602i) arranged symmetrically with respect to the axial direction of the mandrel (300), each of which may include a mold body portion (161i) and a molding projection portion (162e).

[0133] The mold portion (160i) includes molding protrusions (162e) protruding from the mold body portion (161i), and these may be divided and arranged along the longitudinal direction of the mandrel (300). The molding protrusions (162e) may consist of multiple divided protrusions formed only in specific sections, rather than a single continuous protrusion. Each section of the molding protrusion (162e) has a certain length, and there may be an area (S2) between the sections where no protrusion is formed. This structure clearly distinguishes between the area where the intaglio is formed and the area where it is not formed at the final brush roller. The length and spacing of the molding protrusions (162e) can be optimized according to the cleaning application. Generally, they may be arranged in two main sections near both ends of the mandrel to form a symmetrical structure. The divided protrusion structure enables localized pressure concentration upon pressurization and allows for independent molding control for each section.

[0134] When the mold portion (160i) presses the main body portion (510), indentation may occur only in the section where the molding protrusion portion (162e) is formed. In the section without the protrusion, the surface of the main body portion (510) may remain intact. Within each section of the molding protrusion portion (162e), the material of the main body portion (510) may be pushed around the protrusion to form a depression. Indentation may be stopped at the boundary of the section, thereby forming a clear boundary of the indentation portion. Since independent molding is performed for each section, the molding pressure and curing conditions for each section can be individually optimized.

[0135] Referring to FIG. 12b, the brush roller (500i) may include a plurality of recessed portions (522e) spaced apart in the longitudinal direction on the surface of the main body portion (510i). Each recessed portion (522e) is formed only in a specific section and may be arranged alternately with a general section (S2a) without recessed portions. The section where the recessed portions (522e) are formed can collect contaminants. On the other hand, the section without recessed portions can provide uniform cleaning power through direct surface contact with the wafer. This structure can implement a differentiated cleaning mechanism along the longitudinal direction of the brush roller. Since collection and cleaning are divided by section, a combined cleaning effect can be achieved.

[0136] The spaced-out engraved cleaning section (520i) can provide a unique composite cleaning mechanism. Contaminant collection can be primarily performed in the section with the engraved section (522e), while direct cleaning can be primarily performed in the section without it. During relative movement between the wafer and the brush, the wafer surface can alternately pass through the collection section and the cleaning section. This enables a stepwise cleaning process. Contaminants collected in the engraved section (522e) can be discharged as they move to the normal section by the rotation of the brush. This self-cleaning action can continuously maintain the brush's performance.

[0137] In the section with the engraved portion (522e), the cleaning solution can be stored to create a continuous cleaning environment. In the general section, the cleaning solution can flow smoothly to provide a fresh cleaning environment. The difference in cleaning solution flow between sections enables the implementation of an overall balanced cleaning process. The capture of stubborn contaminants and the removal of general contaminants can be achieved simultaneously. The number and location of the engraved portion (522e) can be adjusted according to the characteristics of the cleaning target. In addition to two sections, it can be expanded to multiple sections to enable more precise cleaning control. The depth or width of the engraved portion (522e) in each section can be designed differently to differentiate the capture characteristics of each section. This enables customized capture of contaminants of various sizes.

[0138] FIG. 13a is a cross-sectional view schematically illustrating another embodiment of a brush roller. FIG. 13b and FIG. 13c are step-by-step cross-sectional views illustrating a method for removing the brush roller of FIG. 13a.

[0139] Referring to FIGS. 13a to 13c, a specific method for removing a conventional brush roller (500) from a mandrel (300) is presented in the present invention. This allows for the effective removal of a brush roller that has been worn or contaminated during a cleaning process after CMP.

[0140] Referring to FIG. 13a, the brush roller (500j) may have a structure in which a removal groove (530) is pre-formed in the main body (510j). The removal groove (530) is formed continuously along the circumferential direction of the main body (510j) and may be located near the interface between the mandrel (300) and the main body (510j). The removal groove (530) may be formed during the brush roller manufacturing process for future brush replacement. The removal groove (530) can be realized simultaneously with molding by adding a projection for forming the removal groove to the mold part (160). The depth and width of the removal groove (530) may be determined according to the size of the blade required for brush removal and the cutting efficiency. If it is too deep, the brush strength may decrease, and if it is too shallow, the removal efficiency may decrease.

[0141] Referring to FIG. 13b, the step at which the brush removal process begins can be observed. A blade (600) is precisely inserted into the removal groove (530) and positioned at the interface between the brush roller (500j) and the mandrel (300). The blade (600) may be a dedicated tool designed to fit the shape of the removal groove (530). The thickness and shape of the blade are precisely matched to the removal groove (530) to enable effective cutting. After inserting the blade (600), relative rotation between the mandrel (300) and the blade (600) may begin. That is, the blade (600) may rotate while the mandrel (300) is fixed, or the mandrel (300) may rotate while the blade (600) is fixed. At this time, the direction and speed of rotation may be determined according to the characteristics of the brush material.

[0142] Cutting is performed in the removal groove (530) portion by the relative rotation of the mandrel (300) and the blade (600). As the blade (600) moves along the removal groove (530), it separates the brush roller (500j) from the mandrel (300). The relative rotation is continuous, allowing for uniform cutting across the entire circumference of the brush roller (500j). During this process, an appropriate rotational speed can be maintained to minimize cutting resistance of the brush material. Brush fragments generated during the cutting process can be collected by a separate collection device to maintain the cleanliness of the working environment.

[0143] Referring to FIG. 13c, it can be seen that the brush roller (500j) is completely separated from the mandrel (300) after the cutting by relative rotation is completed. The removed brush roller (500j) is discharged to the outside and disposed of. A clean state can be created on the surface of the mandrel (300) for manufacturing a new brush roller. If necessary, the surface of the mandrel (300) can be cleaned or a new release layer (310 in FIG. 14) can be formed. This removal method allows for the complete removal of the brush roller (500j) without damaging the mandrel (300), thereby enabling repeated brush regeneration.

[0144] The brush removal method using the removal groove (530) can provide several technical advantages. The durability of the equipment can be improved by selectively removing only the brush without damaging the mandrel (300). In addition, effective removal is possible without chemical treatment through a mechanical cutting method. This is environmentally friendly and prevents the generation of additional chemical waste. The removal process is carried out quickly, which can shorten the brush regeneration cycle time. This contributes to an improvement in overall productivity.

[0145] FIG. 14 is a cross-sectional view schematically showing one embodiment of a mandrel.

[0146] Referring to FIG. 14, an internal structure of a mandrel (300a) according to one embodiment of the present invention is presented. This is a structure that implements a thermal mechanism for removing brush rollers.

[0147] The mandrel (300a) may have a hierarchical structure in which a heating element (320) is embedded in the center and a release layer (310) is formed on the outer surface. The release layer (310) forms an interface between the mandrel (300a) and the brush roller (500) and may selectively soften or melt when the brush is removed by heat.

[0148] The mandrel (300a) may have a structure in which a heating element (320) is arranged inside. The heating element (320) may be arranged radially from the center of the mandrel (300a) toward the outer surface. This arrangement enables a uniform heat distribution over the entire surface of the mandrel (300a).

[0149] The specific configuration of the heating wire (320) can be implemented in various ways. A main heating wire can be arranged along the central axis of the mandrel (300a), and multiple branch heating wires branching from it can be extended radially. A method can be adopted in which radial grooves are machined inside the mandrel (300a) and individual heating wires (320) are inserted into these grooves. Radial heat distribution can also be achieved by embedding a heating wire (320) wound spirally inside the mandrel (300a). Each method exhibits different manufacturing complexity and heat distribution characteristics. A branched structure is easy to manufacture but may have limitations in heat distribution uniformity, while an individual insertion type provides high uniformity but the manufacturing process becomes complex. A spiral structure provides continuous heat distribution while allowing for relatively simple manufacturing.

[0150] When the brush roller is removed, power is supplied to the heating wire (320) to heat the surface of the mandrel (300a). The heat generated at this time selectively melts or softens the release layer (310) on the surface of the mandrel (300a). Since the release layer (310) is composed of a heat-sensitive material, the adhesive strength may rapidly decrease when a specific temperature is reached.

[0151] Looking at the specific operation process, in the initial stage, the heating wire (320) is preheated with low power to uniformly raise the temperature of the entire mandrel (300a). Then, in the high-power heating stage, the release layer (310) is rapidly heated to its softening temperature to weaken the bonding force with the brush roller (500). Finally, in the holding stage, the brush roller (500) is naturally separated by its own weight or a slight external force while maintaining a constant temperature.

[0152] Temperature control can be feedback controlled by a temperature sensor installed inside or on the surface of the mandrel (300a). The temperature profile is optimized to enable effective removal while preventing overheating.

[0153] FIG. 15 is a cross-sectional view schematically showing another embodiment of a mandrel.

[0154] Referring to FIG. 15, an internal structure of a mandrel (300b) according to another embodiment of the present invention is presented. This is a structure that implements an optical mechanism for removing brush rollers.

[0155] The mandrel (300b) may have a hierarchical structure in which a light path (330) is formed in the center and a release layer (310) is formed on the outer surface. The release layer (310) is located between the mandrel (300b) and the brush roller (500) and may be composed of a photoactive material in which the bonding force changes in response to light of a specific wavelength.

[0156] The mandrel (300b) may have a structure in which an optical path (330) is formed inside. The optical path (330) may extend radially from a central light source toward the outer surface of the mandrel (300b). This structure enables IR light or visible light to be transmitted uniformly across the entire surface of the mandrel (300b).

[0157] The specific configuration method of the optical path (330) can be implemented in various ways. A method of embedding radial optical fibers inside the mandrel (300b) can be adopted. Multiple optical fibers extend radially from a central optical distributor to transmit light to each point on the surface of the mandrel (300b). A method of forming an air-filled optical waveguide inside the mandrel (300b) can be used. An optical path (330) satisfying total reflection conditions can be implemented by using materials with different refractive indices. Additionally, the mandrel (300b) itself can be made of a transparent or translucent material, and a light diffuser can be placed inside to achieve a uniform light distribution.

[0158] Each method can exhibit different characteristics in terms of light transmission efficiency and uniformity. Optical fiber methods offer high light transmission efficiency but have high manufacturing costs, while waveguide methods have a simple structure but can suffer from significant light loss. Transparent mandrel methods provide the most uniform light distribution, but ensuring mechanical strength can be a challenge.

[0159] When the brush roller is removed, IR light or light of a specific wavelength is generated from a light source in the center and can be transmitted to the surface of the mandrel (300b) through the light path (330). At this time, the irradiated light can induce photodecomposition or photosoftening of the release layer (310). The release layer (310) is composed of a photoactive material sensitive to light of a specific wavelength, so that molecular bonds may be weakened or physical properties may change upon light irradiation.

[0160] Looking at the specific operation process, in the initial irradiation stage, the entire release layer (310) can be uniformly irradiated with low light intensity to initiate a photodecomposition reaction. Subsequently, in the intensive irradiation stage, the bonding force of the release layer (310) can be rapidly weakened with high light intensity to release the adhesion with the brush roller (500). Finally, in the post-processing stage, additional light irradiation can be performed to remove the remaining release layer (310) and clean the surface of the mandrel (300b).

[0161] The light irradiation conditions are optimized according to the material properties and thickness of the release layer (310). Parameters such as wavelength, light intensity, and irradiation time are precisely controlled so that effective removal can be achieved without damaging the mandrel (300b).

[0162] The present invention has been described above with reference to the embodiments illustrated in the drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims. Explanation of the symbols

[0163] 100, 200: Brush roller manufacturing device 110: Chamber 210: First chamber 220: Second chamber 120: Rotary drive unit 130: Solution supply unit 140: Thickness adjustment section 150: Hardened part 160: Mold part 170: Solution recovery unit 180: Solution purification unit 190: Surface sensing unit 161: Mold main body 162: Molded projection 163: Molded Home 300: Mandrel 310: Release layer 320: Heating element 330: Gwanghwang-ro 500: Brush Roller 510: Main body 520: Clean Department 521: Embossed 522: Engraved part 530: Remove Home 600: Blade

Claims

Claim 1 A brush roller manufacturing apparatus comprising: a rotary drive unit for rotating a mandrel; a solution supply unit for spraying a liquid coating material onto the surface of the rotating mandrel; a thickness control unit for controlling the thickness of the liquid coating material sprayed onto the surface of the mandrel; a curing unit for curing the thickness-controlled liquid coating material to form a main body; and a mold unit for forming a cleaning unit including an embossed or intaglio on the surface of the main body; and forming a brush roller including the main body and the cleaning unit on the mandrel. Claim 2 A brush roller manufacturing apparatus according to claim 1, wherein the mandrel includes a path portion through which a heating element or IR light passes inside, and a release layer is formed on the surface of the mandrel so that the brush roller is removed by the heating element or IR light. Claim 3 A brush roller manufacturing apparatus according to claim 1, further comprising a solution recovery unit disposed below the mandrel to recover liquid coating material flowing down from the mandrel. Claim 4 A brush roller manufacturing apparatus according to paragraph 3, further comprising a solution purification unit for removing contaminants within the liquid coating material recovered from the solution recovery unit. Claim 5 A brush roller manufacturing apparatus according to claim 1, characterized in that the mold part includes a heater or light source inside to mold and simultaneously cure the cleaning part. Claim 6 A brush roller manufacturing apparatus comprising: a rotary drive unit for rotating a mandrel disposed in a first chamber; a solution supply unit for spraying a liquid coating material onto the surface of the rotating mandrel; a thickness control unit for controlling the thickness of the sprayed liquid coating material; a curing unit for curing the thickness-controlled liquid coating material to form a main body; and a mold unit disposed in a second chamber for forming a cleaning unit including a raised portion or a recessed portion on the surface of the main body; and a brush roller manufacturing apparatus comprising a main body and a cleaning unit on the mandrel. Claim 7 A brush roller manufacturing apparatus according to claim 6, wherein the mandrel includes a path portion through which a heating element or IR light passes inside, and a release layer is formed on the surface of the mandrel so that the existing brush roller is removed by the heating element or IR light. Claim 8 A brush roller manufacturing apparatus according to claim 6, further comprising a transfer unit for transferring the mandrel between the first chamber and the second chamber. Claim 9 A brush roller manufacturing apparatus according to claim 6, further comprising a solution recovery unit disposed below the mandrel within the first chamber to recover liquid coating material flowing down from the mandrel. Claim 10 A brush roller manufacturing apparatus according to claim 6, characterized in that the mold part includes a heater or light source inside to mold and simultaneously cure the cleaning part.

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