Manufacturing appratus for a display apparatus

Abstract

The present invention discloses a manufacturing apparatus for a display device. The present invention comprises a first chamber unit for loading or unloading a display substrate, a second chamber unit for depositing a deposition material on the display substrate, and a transfer unit disposed in at least one of the first chamber unit and the second chamber unit for transferring the display substrate from the first chamber unit to the second chamber unit or from the second chamber unit to the first chamber unit. The transfer unit comprises a carrier disposed opposite to a source unit and having a fixed display substrate to transfer the display substrate, a position adjustment unit disposed spaced apart from the carrier and adjusting the position of the carrier in a first direction, a transfer unit for transferring the carrier in a second direction, a guide unit disposed spaced apart from the carrier and adjusting the position of the carrier, and a shielding unit disposed in at least one of the position adjustment unit, the transfer unit, and the guide unit to block a magnetic field generated from at least one of the position adjustment unit, the transfer unit, and the guide unit. The carrier includes a protrusion protruding from a seating unit on which the display substrate is seated.

Description

Technology Field

[0001] Embodiments of the present invention relate to a device, and more specifically, to a device for manufacturing a display device. Background Technology

[0002] Mobile-based electronic devices are being widely used. In addition to small electronic devices such as mobile phones, tablet PCs have recently become widely used as mobile electronic devices.

[0003] Such portable electronic devices include a display device to support various functions and to provide visual information, such as images or videos, to the user. Recently, as other components for driving the display device have become miniaturized, the proportion of the display device within the electronic device is gradually increasing, and structures capable of bending from a flat state to a predetermined angle are also being developed. The problem to be solved

[0004] Generally, when manufacturing a display device, the display device is mounted on a carrier and can move the carrier in contact through rollers. In such cases, foreign substances may be generated due to the contact between the carrier and the rollers, and since these foreign substances can cause product defects during the manufacturing of the display device, embodiments of the present invention provide a manufacturing apparatus for a display device and a method for manufacturing a display device that transports a carrier in a non-contact manner to solve this problem. means of solving the problem

[0005] One embodiment of the present invention discloses a manufacturing apparatus for a display device comprising: a first chamber unit for loading or unloading a display substrate; a second chamber unit for depositing a deposition material on the display substrate; and a transfer unit disposed in at least one of the first chamber unit and the second chamber unit for transferring the display substrate from the first chamber unit to the second chamber unit or from the second chamber unit to the first chamber unit. The transfer unit comprises: a carrier disposed opposite to a source unit and having a display substrate fixed thereon for transferring the display substrate; a position adjustment unit disposed spaced apart from the carrier and adjusting the position of the carrier in a first direction; a transfer unit for transferring the carrier in a second direction; a guide unit disposed spaced apart from the carrier and adjusting the position of the carrier; and a shielding unit disposed in at least one of the position adjustment unit, the transfer unit, and the guide unit for blocking a magnetic field generated in at least one of the position adjustment unit, the transfer unit, and the guide unit. The carrier comprises a protrusion that protrudes from a mounting portion on which the display substrate is mounted. In the embodiment, the position adjustment unit and the guide unit may be fixed to the inner wall of the chamber. In the present embodiment, the distance from the end of the first transfer unit to the end of the second transfer unit may be smaller than the width of the carrier. In the present embodiment, the distance from the end of the first transfer unit to the end of the second transfer unit may be less than or equal to half the width of the carrier. In the present embodiment, the first direction may be an up-and-down direction. In the present embodiment, the second direction may be a direction perpendicular to the first direction. In the present embodiment, the guide may adjust the position of the carrier in a third direction different from the first direction and the second direction. Effects of the invention

[0006] The manufacturing apparatus for a display device according to the embodiments of the present invention can minimize foreign substances generated during the transfer of a display substrate.

[0007] The manufacturing apparatus for a display device according to the embodiments of the present invention makes it possible to manufacture a high-quality display device by uniformly applying a deposition material to a display substrate.

[0008] The manufacturing apparatus for a display device according to the embodiments of the present invention can maintain a constant orientation of the display substrate during transport and can transport the display substrate quickly and accurately along a predetermined path. Brief explanation of the drawing

[0009] FIG. 1 is a conceptual diagram showing a manufacturing apparatus for a display device according to one embodiment of the present invention. FIG. 2 is a front view showing an embodiment of the second transfer unit of the manufacturing device of the display device illustrated in FIG. 1. FIG. 3 is a side view showing the second transfer unit illustrated in FIG. 2 and the source unit illustrated in FIG. 1. FIG. 4 is a cross-sectional view showing the second shielding portion illustrated in FIG. 2 and FIG. 3. FIG. 5 is a front view showing another embodiment of the second transfer unit of the manufacturing device of the display device illustrated in FIG. 1. FIG. 6 is a side view showing the second transfer unit illustrated in FIG. 5. FIG. 7 is a front view showing another embodiment of the second transfer unit of the manufacturing device of the display device shown in FIG. 1. FIG. 8 is a side view showing the second transfer unit illustrated in FIG. 7. FIG. 9 is a front view showing another embodiment of the second transfer unit of the manufacturing device of the display device illustrated in FIG. 1. FIG. 10 is a front view showing another embodiment of the second transfer unit illustrated in FIG. 9. FIG. 11 is a front view showing another embodiment of the second transfer unit of the manufacturing device of the display device illustrated in FIG. 1. FIG. 12 is a side view showing a manufacturing device for the display device illustrated in FIG. 11. FIG. 13 is a plan view showing a display device manufactured by the manufacturing device of the display device shown in FIG. 1. FIG. 14 is a cross-sectional view taken along line AA shown in FIG. 13. Specific details for implementing the invention

[0010] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms.

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0012] In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0013] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0014] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0015] In the following embodiments, when a part such as a film, region, or component is described as being on or above another part, it includes not only cases where it is directly on top of another part, but also cases where another film, region, or component is interposed in between.

[0016] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is illustrated.

[0017] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to three axes in an orthogonal coordinate system and can be interpreted in a broader sense that includes them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but they may also refer to different directions that are not orthogonal to each other.

[0018] Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description.

[0019] FIG. 1 is a conceptual diagram showing a manufacturing apparatus for a display device according to an embodiment of the present invention. FIG. 2 is a front view showing an embodiment of a transfer unit of the manufacturing apparatus for a display device shown in FIG. 1. FIG. 3 is a side view showing the transfer unit shown in FIG. 2 and the source part shown in FIG. 1. FIG. 4 is a cross-sectional view showing a second shielding part shown in FIG. 2 and FIG. 3.

[0020] Referring to FIGS. 1 to 3, the manufacturing device (10) of the display device may form a certain layer by supplying a display substrate (D) from the outside and depositing a deposition material on the display substrate (D). At this time, the deposition material may be deposited on the display substrate (D) in a pattern shape that is pre-set on the display substrate (D), or it may be deposited on the display substrate (D) to cover the entire front surface of the display substrate (D). For example, the manufacturing device (10) of the display device may form a source electrode or a drain electrode on the display substrate (D). The manufacturing device (10) of the display device may form an inorganic layer among thin film encapsulation layers on the display substrate (D). At this time, the display substrate (D) may refer to a form in which various layers are formed on a substrate (not shown) before each layer is formed. For convenience of explanation, the manufacturing device (10) of the display device will be described in detail below, focusing on the case where an inorganic layer among thin film encapsulation layers is formed on the display substrate (D).

[0021] Meanwhile, the manufacturing device (10) of the display device may include a first chamber unit (100), at least one second chamber unit (200), and a transfer unit (300).

[0022] The first chamber unit (100) can load a display substrate (D) from the outside or unload a display substrate (D) with completed deposition to the outside.

[0023] The second chamber unit (200) is connected to the first chamber unit (100) and can deposit a deposition material on the display substrate (D). At this time, the source portion (220) of the second chamber unit (200) can form a magnetic field or an electric field to deposit the deposition material on the display substrate (D). This second chamber unit (200) can deposit the deposition material on the display substrate (D) in various ways. For example, the second chamber unit (200) can deposit the deposition material on the display substrate (D) using a plasma chemical vapor deposition (PECVD) method. As another embodiment, the second chamber unit (200) can deposit the deposition material on the display substrate (D) using an atomic layer deposition (ALD) method. As yet another embodiment, the second chamber unit (200) can deposit the deposition material on the display substrate (D) using a sputtering method.

[0024] Multiple second chamber units (200) may be provided. Multiple second chamber units (200) may be arranged spaced apart from each other. At this time, multiple second chamber units (200) may deposit a deposition material using the same deposition method, or they may deposit a deposition material using different deposition methods. Additionally, multiple second chamber units (200) may be connected to each other, and a separate gate valve (400) may be arranged between the multiple second chamber units (200) to separate each second chamber unit (200).

[0025] The first chamber unit (100) and the second chamber unit (200) described above can adjust the internal pressure to atmospheric pressure or a vacuum state. At this time, the first chamber unit (100) and the second chamber unit (200) may include a separate pressure control device.

[0026] The transfer unit (300) can transfer the display substrate (D). At this time, the transfer unit (300) can transfer the display substrate (D) while it is positioned to form a certain angle with respect to the ground. That is, the display substrate (D) can be transferred while tilted with respect to the ground. For example, the transfer unit (300) can transfer the display substrate (D) while it is arranged to form an angle with respect to the ground that is greater than 0 degrees and less than or equal to 90 degrees. At this time, the ground may refer to the surface where the first chamber unit (100) and the second chamber unit (200) are installed, and may refer to the bottom surface of the first chamber (not indicated) of the first chamber unit (100) and the bottom surface of the second chamber (210) of the second chamber unit (200).

[0027] It may be disposed in the first chamber unit (100) and the second chamber unit (200). At this time, the transfer unit (300) may include a first transfer unit (not shown) disposed in the first chamber unit (100) and a second transfer unit (300-2) disposed in the second chamber unit (200). In this case, the first transfer unit and the second transfer unit (300-2) may be disposed spaced apart from each other. At this time, since the first transfer unit and the second transfer unit (300-2) are identical or similar to each other, for the convenience of explanation, the following description will focus on the second transfer unit (300-2).

[0028] The second transfer unit (300-2) may include a carrier (310), a second position adjustment unit (320-2), a second carrier transfer unit (330-2), a second carrier guide unit (340-2), a second carrier attitude control unit (350-2), a second shielding unit (360-2), a second gap measuring sensor unit (371-2), and a second attitude measuring sensor unit (372-2).

[0029] The carrier (310) can move between the first chamber unit (100) and the second chamber unit (200). At this time, the carrier (310) can move from the first chamber unit (100) to the second chamber unit (200), and can move multiple second chamber units (200). Additionally, the carrier (310) can move from the second chamber unit (200) to the first chamber unit (100). At this time, one carrier (310) may be provided, and the first transfer unit and the second transfer unit (300-2) may share the carrier (310).

[0030] The carrier (310) described above can be fixed to a display substrate (D). At this time, the carrier (310) can fix the display substrate (D) in various ways. In one embodiment, the carrier (310) can fix the display substrate (D) through a clamp (311). In another embodiment, the carrier (310) may be equipped with an adhesive chuck to fix the display substrate (D). In yet another embodiment, the carrier (310) may be equipped with an electrostatic chuck to fix the display substrate (D). In this case, if the carrier (310) is equipped with an electrostatic chuck, a secondary battery, etc., may be provided inside the carrier (310), and a separate wireless charging module may be mounted on the carrier (310) to allow charging or power supply during transport. For convenience of explanation, the following description will focus on the case where the carrier (310) fixes the display substrate (D) through a clamp (311).

[0031] The second position adjustment unit (320-2) can adjust the position of the carrier (310) in the first direction (e.g., the up and down direction of FIG. 3). At this time, the second position adjustment unit (320-2) can adjust the position of the carrier (310) by applying an attractive force to the carrier (310) including a magnet or an electromagnet.

[0032] The second carrier transfer unit (330-2) can move the carrier (310) in a second direction (e.g., the left-right direction in FIG. 2). At this time, the second direction may be different from the first direction. In particular, the first direction and the second direction may be perpendicular to each other. Multiple second carrier transfer units (330-2) may be provided, and some of the multiple second carrier transfer units (330-2) may be placed on one side of the carrier (310). Other parts of the multiple second carrier transfer units (330-2) may be placed on the other side of the carrier (310).

[0033] The second carrier transfer unit (330-2) may include a first transfer unit (331-2) disposed on the carrier (310) and a second transfer unit (332-2) disposed spaced apart from the first transfer unit (331-2). At this time, the second transfer unit (332-2) may be installed to be fixed to the inner wall of the second chamber (210) of the second chamber unit (200). One of the first transfer unit (331-2) or the second transfer unit (332-2) as described above may include a permanent magnet. The other of the first transfer unit (331-2) or the second transfer unit (332-2) may include an electromagnet. At this time, if the first transfer unit (331-2) includes an electromagnet and the second transfer unit (332-2) includes a permanent magnet, the carrier (310) may be equipped with a wireless charging module as described above. However, for the sake of convenience of explanation, the following description will focus on the case where the first transfer unit (331-2) includes a permanent magnet and the second transfer unit (332-2) includes an electromagnet.

[0034] The first transfer unit (331-2) may include permanent magnets. In this case, the first transfer unit (331-2) may include multiple permanent magnets such that different poles alternate. In this case, the first transfer unit (331-2) may be in the form of multiple permanent magnets arranged in a line.

[0035] The second transfer unit (332-2) may include a linear motion stage coil. In this case, the second transfer unit (332-2) may be in the form of an electromagnet and may be formed long in the longitudinal direction of the first transfer unit (331-2) so as to face the first transfer unit (331-2). In this case, the second transfer unit (332-2) may provide a driving force to enable the carrier (310) to move by varying the applied current.

[0036] The second carrier guide section (340-2) can maintain the posture of the carrier (310). At this time, the second carrier guide section (340-2) may include a first guide section (341-2) and a second guide section (342-2) arranged to face each other on both sides of the carrier (310). In this case, the first guide section (341-2) and the second guide section (342-2) may include electromagnets to adjust the attractive force acting on the carrier (310), thereby maintaining a constant distance between the first guide section (341-2) and one side of the carrier (310) and between the second guide section (342-2) and the other side of the carrier (310).

[0037] The second carrier posture control unit (350-2) can maintain the posture of the carrier (310) at a constant level. At this time, the second carrier posture control unit (350-2) may include a first posture control unit (351-2) disposed on the carrier (310) and a second posture control unit (352-2) disposed on the second chamber (210). A portion of the carrier (310) may protrude or be bent so that the first posture control unit (351-2) is disposed thereon. In this case, the position of the second posture control unit (352-2) may not overlap with the position of the second position adjustment unit (320-2).

[0038] The first posture control unit (351-2) and the second posture control unit (352-2) may include at least one of a permanent magnet and an electromagnet. In this case, the polarity of the surfaces facing each other of the first posture control unit (351-2) and the second posture control unit (352-2) may be different from each other. For example, if the polarity of one surface of the first posture control unit (351-2) is an S pole, the polarity of one surface of the second posture control unit (352-2) facing the surface of the first posture control unit (351-2) facing each other may be an N pole. As another embodiment, if the polarity of one surface of the first posture control unit (351-2) is an N pole, the polarity of one surface of the second posture control unit (352-2) facing the surface of the first posture control unit (351-2) facing each other may be an S pole. For the convenience of explanation, the following description will focus on the case where the first attitude control unit (351-2) and the second attitude control unit (352-2) are permanent magnets.

[0039] The second shielding part (360-2) may be placed in at least one of the second position adjustment part (320-2), the second carrier transfer part (330-2), and the second carrier guide part (340-2). At this time, the second shielding part (360-2) can block the magnetic field generated in at least one of the second position adjustment part (320-2), the second carrier transfer part (330-2), and the second carrier guide part (340-2). The second shielding part (360-2) as described above is indicated by a dotted line in FIGS. 3 and 4 so as not to obscure other components.

[0040] The second shielding part (360-2) may include a second blocking part (361-2) that blocks a magnetic field generated in at least one of the second position adjustment part (320-2), the second carrier transfer part (330-2), and the second carrier guide part (340-2). In this case, the second blocking part (361-2) can prevent the magnetic field generated in at least one of the second position adjustment part (320-2), the second carrier transfer part (330-2), and the second carrier guide part (340-2) from moving to the source part (220). In this case, at least a portion of the second blocking part (361-2) may include a non-magnetic material. In particular, the portion of the second blocking part (361-2) facing the source part (220) may be formed of a non-magnetic material.

[0041] The second blocking part (361-2) as described above can be formed in various forms. For example, the second blocking part (361-2) can be formed in the shape of a plate. In another embodiment, the second blocking part (361-2) may be formed so that one side is open, and at least one of the second position adjustment part (320-2), the second carrier transfer part (330-2), and the second carrier guide part (340-2) may be accommodated. For convenience of explanation, the second blocking part (361-2) will be described in detail below, focusing on the case where one side is open and a space is formed inside.

[0042] The second blocking unit (361-2) described above can shield the magnetic or electric field directed toward the source unit (220). Additionally, it can block the magnetic or electric field generated in the source unit (220) from affecting at least one of the second position control unit (320-2), the second carrier transfer unit (330-2), and the second carrier guide unit (340-2). In this case, precise control of the transfer unit (300) is possible when the transfer unit (300) is driven. Furthermore, when the transfer unit (300) is driven, the electric or magnetic field of the source unit (220) is not affected by the transfer unit (300), so the deposition efficiency of the deposition material can be the same or nearly similar as when the transfer unit (300) is not used.

[0043] The second shielding part (360-2) may include a second magnetic field guide part (262-2) disposed in the second blocking part (361-2) to guide the internal magnetic field in one direction. At this time, the second magnetic field guide part (262-2) may be formed of a magnetic material and may be disposed in the open part of the second blocking part (361-2). The second magnetic field guide part (262-2) may be disposed so as to be completely inserted into the interior of the second blocking part (361-2). Additionally, the second magnetic field guide (262-2) may be positioned to be in contact with at least one of the second position adjustment part (320-2), the second carrier transfer part (330-2), and the second carrier guide part (340-2), or spaced apart from at least one of the second position adjustment part (320-2), the second carrier transfer part (330-2), and the second carrier guide part (340-2).

[0044] The second gap measuring sensor unit (371-2) can measure the gap between the carrier (310) and the second position adjustment unit (320-2) measured in the first direction. At this time, the second gap measuring sensor unit (371-2) may include various types of sensors, such as ultrasonic sensors, laser sensors, and optical sensors.

[0045] The second attitude measuring sensor unit (372-2) can measure the distance (or gap) between the second carrier guide unit (340-2) and one side of the carrier (310). At this time, the second attitude measuring sensor unit (372-2) may be provided in multiple units, and some of the multiple second attitude measuring sensor units (372-2) may be positioned in the part where the first guide unit (341-2) is positioned relative to the carrier (310), and other parts of the multiple second attitude measuring sensor units (372-2) may be positioned in the part where the second guide unit (342-2) is positioned relative to the carrier (310).

[0046] Meanwhile, regarding the operation method of the manufacturing device (10) of the display device as described above, the display substrate (D) can be supplied from the outside to the first chamber unit (100). At this time, the display substrate (D) can be supplied to the first chamber unit (100) in various ways. For example, the display substrate (D) can be supplied to the first chamber unit (100) via a robot arm, etc. and fixed to a carrier (310) inside the first chamber unit (100). In another embodiment, the carrier (310) can be withdrawn from the first chamber unit (100), and it is also possible to fix the display substrate (D) on the withdrawn carrier (310) by means of human power or a robot arm, etc. For convenience of explanation, the following will focus on the method of withdrawing the carrier (310) from the first chamber unit (100) and supplying the display substrate (D).

[0047] The first chamber unit (100) is equipped with a device for regulating internal pressure, so that the internal pressure can be changed to atmospheric pressure or vacuum depending on the inflow and outflow of the display substrate (D). The carrier (310) can be removed from the first chamber unit (100) when the internal pressure of the first chamber unit (100) is changed from a vacuum state to atmospheric pressure. On the other hand, when the carrier (310) enters the first chamber unit (100), the first chamber unit (100) can change the internal pressure from an atmospheric pressure state to a vacuum state.

[0048] When the display substrate (D) is fixed to the carrier (310) and enters the first chamber unit (100), the first transfer unit can transfer the carrier (310) to the second chamber unit (200). At this time, since the method of the first transfer unit transferring the carrier (310) is the same or similar to the method of transferring the carrier (310) in the second transfer unit (300-2), the following description will focus on the method of transferring the carrier (310) through the second transfer unit (300-2).

[0049] When a display substrate (D) enters the second chamber unit (200), a deposition material can be deposited on the display substrate (D) by spraying the deposition material onto the display substrate (D) while a magnetic field or electric field is formed in the source unit (220).

[0050] When the above process is completed, the display substrate (D) can be transferred to another second chamber unit (200) or to the first chamber unit (100). In particular, when multiple second chamber units (200) are provided, after forming various layers in each second chamber unit (200), the display substrate (D) can be transferred to the first chamber unit (100) by transferring it in the direction opposite to the initial transfer direction. At this time, the second transfer unit (300-2) can provide a moving force to the carrier (310).

[0051] Specifically, the direction of the current can be varied after power is applied to the second transfer unit (332-2). In this case, the polarity of the second transfer unit (332-2) can be varied. At this time, due to the varying polarity of the second transfer unit (332-2), a moving force can be generated in the carrier (310) through interaction with the first transfer unit (331-2).

[0052] As described above, while the carrier (310) is being transported, the second gap measuring sensor unit (371-2) can measure the gap between the carrier (310) and the second position adjustment unit (320-2). At this time, the result measured by the second gap measuring sensor unit (371-2) can be transmitted to the second position adjustment unit (320-2) or to a separately provided control unit (not shown). If the control unit is separately provided, the control unit can control all components of the manufacturing device (10) of the display device. However, for convenience of explanation, the following description will focus on cases where the control unit is not provided and the components are directly controlled according to the measured result. As described above, the current applied to the second position adjustment unit (320-2) can be controlled so that the measured result becomes the same as the preset value. For example, if the preset value is greater than the measured result, the current applied to the second position adjustment unit (320-2) can be controlled to become smaller than the initial value. In addition, if the preset value is smaller than the measured result, the current applied to the second position control unit (320-2) can be controlled to be larger than the initial value. When controlled as described above, the carrier (310) can move while being spaced a certain distance from the bottom surface (or ground) of the second chamber (210).

[0053] While the above-mentioned operation is being performed, the second attitude measurement sensor unit (372-2) can measure the distance between one side of the carrier (310) and the first guide unit (341-2) and the distance between the other side of the carrier (310) and the second guide unit (342-2). The results measured as above can be transmitted to the first guide unit (341-2) and the second guide unit (342-2). At this time, the first guide unit (341-2) and the second guide unit (342-2) can adjust the attractive force exerted by the first guide unit (341-2) on the carrier (310) and the attractive force exerted by the second guide unit (342-2) on the carrier (310) by varying the applied current based on the measured results. Through this, the gap between the first guide unit (341-2) and the carrier (310) and the gap between the second guide unit (342-2) and the carrier (310) can be adjusted. Therefore, the carrier (310) can move along a certain path by means of the first guide part (341-2) and the second guide part (342-2).

[0054] As described above, when the carrier (310) moves, the second carrier posture control unit (350-2) can maintain the posture of the carrier (310) at a constant level. Specifically, the first posture control unit (351-2) and the second posture control unit (352-2) can prevent the posture of the carrier (310) from changing by forming an attractive force with each other. In particular, the second carrier posture control unit (350-2) can prevent the carrier (310) from tilting while moving.

[0055] The second transfer unit (300-2) described above can also transfer the carrier (310) while it is tilted relative to the ground. In this case, by forming the current applied to the second position adjustment unit (320-2), the second carrier guide unit (340-2), and the second carrier transfer unit (330-2) differently from the existing one, it is possible to transfer the carrier (310) while maintaining the tilt of the carrier (310).

[0056] In the above case, the second blocking unit (361-2) can minimize the mutual influence of magnetic or electric fields generated from each component. In particular, the second blocking unit (361-2) can block not only the magnetic or electric field of the source unit (220) but also the magnetic or electric field generated from adjacent components.

[0057] When a display substrate (D) is transferred from the second chamber unit (200) to the first chamber unit (100) through the second transfer unit (300-2), the carrier (310) can move from the second transfer unit (300-2) to the first transfer unit. In this case, the first chamber unit (100) and the second chamber unit (200) are connected to each other, but the end of the first transfer unit and the end of the second transfer unit (300-2) may be separated from each other. At this time, the distance between the end of the first transfer unit and the end of the second transfer unit (300-2) may be smaller than the width of the carrier (310) measured in the second direction. In particular, the distance between the end of the first transfer unit and the end of the second transfer unit (300-2) may be less than half the width of the carrier (310). In such cases, if the distance between the end of the first transfer unit and the end of the second transfer unit (300-2) exceeds half the width of the carrier (310), the carrier (310) may not be able to move along a fixed path and may deviate from the path.

[0058] The carrier (310) transferred to the first transfer unit can be withdrawn from the first chamber unit (100) after varying the pressure inside the first chamber unit (100) from a vacuum state to an atmospheric pressure state as described above. Subsequently, the display substrate (D) on which the deposition material is deposited can be separated from the carrier (310) to perform other processes.

[0059] Meanwhile, in the case of the manufacturing device (10) for a display device that deposits a deposition material on a display substrate (D) as described above, the display substrate (D) was conventionally transported in a manner where the display substrate (D) was in direct contact. In this case, foreign matter may be generated due to contact between the display substrate (D) and the transporting device, and such foreign matter may be deposited or adsorbed onto the display substrate (D) during the deposition of the deposition material, thereby increasing the defect rate of the display device.

[0060] However, by transporting the display substrate (D) in a non-contact manner as described above, foreign substances generated during the transport of the display substrate (D) can be minimized.

[0061] Therefore, the manufacturing device (10) of the display device can improve deposition quality by minimizing the generation of foreign substances during the transport of the display substrate (D). In addition, the manufacturing device (10) of the display device can minimize the external force applied to the display substrate (D) during transport by transporting the display substrate (D) in a non-contact manner.

[0062] The manufacturing device (10) of the display device can prevent malfunctions caused by magnetic field or electric field disturbances by supplying magnetic force used to implement a non-contact method only to the necessary parts.

[0063] The manufacturing device (10) of the display device enables precise control by minimizing the influence of the magnetic field between the components. The manufacturing device (10) of the display device can maintain the deposition quality similar to the existing one by minimizing the magnetic field applied to the source part (220).

[0064] FIG. 5 is a front view showing another embodiment of the second transfer unit of the manufacturing device of the display device illustrated in FIG. 1. FIG. 6 is a side view showing the second transfer unit illustrated in FIG. 5.

[0065] Referring to FIGS. 5 and 6, the second transfer unit (300A-2) may include a carrier (310A), a second position adjustment unit (320A-2), a second carrier transfer unit (330A-2), a second carrier guide unit (340A-2), a second carrier attitude control unit (350A-2), a second shielding unit (360A-2), a second gap measuring sensor unit (371A-2), and a second attitude measuring sensor unit (372A-2). At this time, the carrier (310A), the second position adjustment unit (320A-2), the second carrier attitude control unit (350A-2), the second shielding unit (360A-2), the second gap measuring sensor unit (371A-2), and the second attitude measuring sensor unit (372A-2) are identical or similar to those described in FIGS. 1 to 3, so a detailed description is omitted.

[0066] The second carrier transfer unit (330A-2) may be disposed on only one side of the carrier (310A). In this case, the second carrier transfer unit (330A-2) may include a first transfer unit (331A-2) disposed on the carrier (310A) and a second transfer unit (332A-2) disposed spaced apart from the first transfer unit (331A-2). In this case, since the first transfer unit (331A-2) and the second transfer unit (332A-2) are identical or similar to those described above, a detailed description will be omitted.

[0067] Only one second carrier guide section (340A-2) may be provided. In this case, the second carrier guide section (340A-2) may be positioned at a different location from the part where the second carrier transport section (330A-2) is positioned, centered on the carrier (310A). The second carrier guide section (340A-2) may be positioned at a different height from the second carrier transport section (330A-2). Additionally, if the carrier (310A) is arranged at an angle relative to the ground, the second carrier guide section (340A-2) may be positioned at a higher location than the second carrier transport section (330A-2). In this case, the second carrier guide section (340A-2) can prevent the carrier (310A) from falling or the carrier (310A) from changing its movement path by applying force to the carrier (310A).

[0068] Meanwhile, the second transfer unit (300A-2) described above may operate in the same or similar manner as described above. Specifically, when the carrier (310A) is being transferred, the second transfer unit (332A-2) may transfer the carrier (310A) by forming an electromagnetic field and applying force to the first transfer unit (331A-2). At this time, the second position adjustment unit (320A-2) may adjust the distance between the carrier (310A) and the second position adjustment unit (320A-2) based on the value measured by the second distance measuring sensor unit (371A-2). At this time, the second position adjustment unit (320A-2) may vary the applied current.

[0069] The second attitude measurement sensor unit (372A-2) can measure the distance between the second carrier guide unit (340A-2) and the carrier (310A). The second carrier guide unit (340A-2) can control the attitude of the carrier (310A) based on the value measured by the second attitude measurement sensor unit (372A-2).

[0070] As described above, while the carrier (310A) is moving, the second carrier attitude control unit (350A-2) can maintain the attitude of the carrier (310A) at a constant level. In particular, the first attitude control unit (351A-2) and the second attitude control unit (352A-2) can control the attitude of the carrier (310A) as described in FIGS. 1 to 4.

[0071] As described above, while the second transfer unit (300A-2) transfers the display substrate (D), the second shielding part (360A-2) can block some of the magnetic fields generated in each part of the second transfer unit (300A-2). At this time, since the method by which the second shielding part (360A-2) shields the magnetic field is the same or similar as described above, a detailed description will be omitted.

[0072] Therefore, the second transfer unit (300A-2) can quickly and easily transfer the display substrate (D) in a non-contact manner. In addition, the second transfer unit (300A-2) may not affect the operation of the source unit (220).

[0073] FIG. 7 is a front view showing another embodiment of the second transfer unit of the manufacturing device of the display device illustrated in FIG. 1. FIG. 8 is a side view showing the second transfer unit illustrated in FIG. 7.

[0074] Referring to FIGS. 7 and 8, the second transfer unit (300B-2) may include a carrier (310B), a second position adjustment unit (320B-2), a second carrier transfer unit (330B-2), a second carrier guide unit (340B-2), a second carrier attitude control unit (350B-2), a second shielding unit (360B-2), a second gap measuring sensor unit (371B-2), and a second attitude measuring sensor unit (372B-2). At this time, the carrier (310B), the second position adjustment unit (320B-2), the second carrier guide unit (340B-2), the second carrier attitude control unit (350B-2), the second shielding unit (360B-2), the second gap measuring sensor unit (371B-2), and the second attitude measuring sensor unit (372B-2) are identical or similar to those described in FIGS. 1 to 3, so a detailed description is omitted.

[0075] The second carrier transfer unit (330B-2) may include a first transfer unit (331B-2) disposed on the carrier (310B) and a second transfer unit (332B-2) disposed spaced apart from the carrier (310B). In this case, the second carrier transfer unit (330B-2) may be disposed on the lower surface of the carrier (310B). For example, the first transfer unit (331B-2) may be attached to the lower surface of the carrier (310B), and the second transfer unit (332B-2) may be disposed on the lower surface of the second chamber (210). In this case, the first transfer unit (331B-2) may be in the form of an electromagnet, and the second transfer unit (332B-2) may be in the form of a permanent magnet array.

[0076] In the above case, the second carrier transfer unit (330B-2) can be positioned between the first guide unit (341B-2) and the second guide unit (342B-2).

[0077] Meanwhile, the method by which the second transfer unit (300B-2) transfers the display substrate (D) can be formed similarly to that described above.

[0078] Specifically, the carrier (310B) can be transported by applying force to the first transfer unit (331B-2) by varying the polarity of a plurality of electromagnets of the second transfer unit (332B-2). When the carrier (310B) is transported as described above, the display substrate (D) can be transported together with the carrier (310B).

[0079] When the carrier (310B) is transported, the second carrier guide part (340B-2) can prevent the carrier (310B) from shaking. At this time, the second carrier guide part (340B-2) can adjust the distance between the second carrier guide part (340B-2) and the carrier (310B) by including an electromagnet as described above.

[0080] The second attitude measuring sensor unit (372B-2) can measure the distance between the carrier (310B) and the second carrier guide unit (340B-2). At this time, the current applied to the second carrier guide unit (340B-2) can be varied based on the value measured by the second attitude measuring sensor unit (372B-2).

[0081] The second position adjustment unit (320B-2) can adjust the height at which the carrier (310B) floats from the bottom surface of the second chamber (210). At this time, the second attitude measurement sensor unit (372B-2) can measure the distance between the second position adjustment unit (320B-2) and the upper surface of the carrier (310B), and the second position adjustment unit (320B-2) can control the applied current based on the result measured by the second attitude measurement sensor unit (372B-2).

[0082] The second carrier attitude control unit (350B-2) can prevent the attitude of the carrier (310B) from changing by forming an attractive force on the carrier (310B). Additionally, the second shielding unit (360B-2) can prevent the operation of each part of the second transfer unit (300B-2) from being disturbed by shielding some of the magnetic fields generated in each part of the second transfer unit (300B-2). Furthermore, the second shielding unit (360B-2) can block the magnetic fields of each part of the second transfer unit (300B-2) that could disturb the magnetic or electric fields generated during the operation of the source unit (220).

[0083] Therefore, the second transfer unit (300B-2) may not affect the operation of the source unit when depositing the display substrate (D) through the source unit (220). In addition, the second transfer unit (300B-2) can transfer the display substrate (D) along an accurate path while forming a certain angle with respect to the ground.

[0084] FIG. 9 is a front view showing another embodiment of the second transfer unit of the manufacturing device of the display device illustrated in FIG. 1. FIG. 10 is a side view showing the second transfer unit illustrated in FIG. 9.

[0085] Referring to FIGS. 9 and 10, the second transfer unit (300C-2) may include a carrier (310C), a second position adjustment unit (320C-2), a second carrier transfer unit (330C-2), a second carrier guide unit (340C-2), a second shielding unit (360C-2), a second gap measuring sensor unit (371C-2), and a second attitude measuring sensor unit (372C-2). At this time, the carrier (310C), the second position adjustment unit (320C-2), the second carrier guide unit (340C-2), the second shielding unit (360C-2), the second gap measuring sensor unit (371C-2), and the second attitude measuring sensor unit (372C-2) are identical or similar to those described in FIGS. 1 to 3, so a detailed description is omitted.

[0086] The second carrier transfer unit (330C-2) may be positioned on a protruding portion of the carrier (310C). At this time, the second carrier transfer unit (330C-2) may include a first transfer unit (331C-2) positioned on the carrier (310C) and a second transfer unit (332C-2) positioned opposite to the first transfer unit (331C-2). The second transfer unit (332C-2) may be installed to be fixed to the inner wall of the second chamber (210).

[0087] The second transfer unit (332C-2) may include a motor (322C-2a) and a magnetic roller (322C-2b) that rotates in connection with the motor (322C-2a). In this case, the magnetic roller (322C-2b) may be arranged such that permanent magnets of different polarities alternate. As another embodiment, the magnetic roller (322C-2b) may be formed in the shape of an electromagnet. However, for the sake of convenience of explanation, the following description will focus on the case where the magnetic roller (322C-2b) is arranged such that permanent magnets of different polarities alternate.

[0088] Meanwhile, the method by which the second transfer unit (300C-2) transfers the display substrate (D) may be formed in the same or similar way as described above.

[0089] Specifically, when the motor (322C-2a) rotates, the magnetic roller (322C-2b) can rotate. At this time, depending on the rotation of the magnetic roller (322C-2b), the magnetic roller (322C-2b) and the first transfer unit (331C-2) can transfer the carrier (310C) by generating a repulsive or attractive force against each other.

[0090] When the carrier (310C) is transported, the second carrier guide part (340C-2) can prevent the carrier (310C) from shaking. At this time, the second carrier guide part (340C-2) includes an electromagnet as described above, so that the gap between the second carrier guide part (340C-2) and the carrier (310C) can be adjusted.

[0091] The second attitude measuring sensor unit (372C-2) can measure the distance between the carrier (310C) and the second carrier guide unit (340C-2). At this time, the current applied to the second carrier guide unit (340C-2) can be varied based on the value measured by the second attitude measuring sensor unit (372C-2).

[0092] The second position adjustment unit (320C-2) can adjust the height at which the carrier (310C) floats from the bottom surface of the second chamber (210). At this time, the second gap measuring sensor unit (371C-2) can measure the distance between the second position adjustment unit (320C-2) and the upper surface of the carrier (310C), and the second position adjustment unit (320C-2) can control the applied current based on the result measured by the second gap measuring sensor unit (371C-2).

[0093] The second shielding part (360C-2) can prevent the operation of each part of the second transfer unit (300C-2) from being disturbed by shielding some of the magnetic fields generated in each part of the second transfer unit (300C-2). In addition, the second shielding part (360C-2) can block the magnetic fields of each part of the second transfer unit (300C-2) that may disturb the magnetic or electric fields generated during the operation of the source part (220).

[0094] Therefore, the second transfer unit (300C-2) may not affect the operation of the source unit when depositing the display substrate (D) through the source unit. In addition, the second transfer unit (300C-2) can transfer the display substrate (D) along an accurate path while forming a certain angle with respect to the ground.

[0095] FIG. 11 is a front view showing another embodiment of the second transfer unit of the manufacturing device of the display device shown in FIG. 1. FIG. 12 is a side view showing the manufacturing device of the display device shown in FIG. 11.

[0096] Referring to FIGS. 11 and 12, the second transfer unit (300D-2) may include a carrier (310D), a second carrier transfer section (330D-2), a second carrier guide section (340D-2), a second shielding section (360D-2), and a second attitude measurement sensor section (372D-2).

[0097] The carrier (310D) may include a mounting portion (312D) on which a display substrate (D) is mounted and a protrusion (313D) formed protruding from the mounting portion (312D).

[0098] The second carrier transfer unit (330D-2) may include a first transfer unit (331D-2) disposed in the carrier (310D) and a second transfer unit (332D-2) disposed in the second chamber (210). At this time, since the first transfer unit (331D-2) and the second transfer unit (332D-2) are identical or similar to those described in FIGS. 1 to 4, a detailed description will be omitted.

[0099] The first transfer section (331D-2) and the second transfer section (332D-2) may be positioned on one side of the seating section (312D). For example, the first transfer section (331D-2) and the second transfer section (332D-2) may be positioned on the upper surface of the seating section (312D).

[0100] The second carrier guide section (340D-2) may include a first guide section (341D-2) and a second guide section (342D-2). In this case, the first guide section (341D-2) and the second guide section (342D-2) may be arranged to face the protrusion (313D). In particular, the first guide section (341D-2) and the second guide section (342D-2) may be arranged symmetrically with respect to the second carrier transfer section (330D-2). In this case, the first guide section (341D-2) and the second guide section (342D-2) can not only guide the movement of the carrier (310D) but also control the posture of the carrier (310D).

[0101] The second attitude measuring sensor unit (372D-2) can measure the distance between the protrusion (313D) and the first guide unit (341D-2) and the second guide unit (342D-2). At this time, based on the results measured by the second attitude measuring sensor unit (372D-2), the distance between the protrusion (313D) and the first guide unit (341D-2) and the protrusion (313D) and the second guide unit (342D-2) can be adjusted, and it is also possible to control the attitude of the carrier (310D).

[0102] Meanwhile, the method by which the second transfer unit (300D-2) transfers the display substrate (D) can be formed in the same or similar way as described above.

[0103] Specifically, when current is applied to the first transfer unit (331D-2), the first transfer unit (331D-2) can apply force to the second transfer unit (332D-2) to transfer the carrier (310D). In this case, the carrier (310D) can move in the X direction (or second direction) of FIG. 11.

[0104] When moving as described above, the second attitude measuring sensor unit (372D-2) can measure the distance between the carrier (310D) and the second carrier guide unit (340D-2). At this time, the buoyancy height of the carrier (310D) can be determined based on the value measured by the second attitude measuring sensor unit (372D-2).

[0105] In addition, it is also possible to control the posture of the carrier (310D) based on the results measured by the second posture measuring sensor unit (372D-2). Specifically, the degree of inclination (or inclination, angle) of the carrier (310D) can be determined based on the results measured by a pair of second posture measuring sensor units (372D-2), and by comparing the degree of inclination of the carrier (310) with a preset value and controlling the current applied to the second carrier guide unit (340D-2), the carrier (310D) can be made to maintain a constant predetermined posture (for example, the degree of elongation of the carrier (310D)).

[0106] As described above, while the display substrate (D) is being transported through the second transport unit (300D-2), the second shielding part (360D-2) can prevent the operation of each part of the second transport unit (300D-2) from being disturbed by shielding a portion of the magnetic field generated in each part of the second transport unit (300D-2). In addition, the second shielding part (360D-2) can block the magnetic field of each part of the second transport unit (300D-2) that could disturb the magnetic field or electric field generated during the operation of the source part (220).

[0107] Therefore, the second transfer unit (300D-2) may not affect the operation of the source unit when depositing the display substrate (D) through the source unit (220). In addition, the second transfer unit (300D-2) can transfer the display substrate (D) along an accurate path while forming a certain angle with respect to the ground.

[0108] FIG. 13 is a plan view showing a display device manufactured by the manufacturing device of FIG. 1. FIG. 14 is a cross-sectional view taken along line AA shown in FIG. 13.

[0109] Referring to FIGS. 13 and 14, the display device (20) may define a display area (DA) and a non-display area on the outer edge of the display area (DA) on a substrate (21). A light-emitting part (not shown) may be placed in the display area (DA), and power wiring (not shown), etc. may be placed in the non-display area. Additionally, a pad part (C) may be placed in the non-display area.

[0110] The display device (20) may include a display substrate (D) and a thin film encapsulation layer (E). In this case, the display substrate (D) may include a substrate (21), a buffer layer (22), a thin film transistor (TFT), a passivation film (27), a pixel electrode (28A), a pixel defining film (29), an intermediate layer (28B), and a counter electrode (28C).

[0111] The substrate (21) may be made of plastic, or may be made of metal such as SUS or Ti. Additionally, the substrate (21) may be made of polyimide (PI). For convenience of explanation, the following description will focus on the case where the substrate (21) is formed of polyimide.

[0112] A light-emitting part (not shown) may be formed on a substrate (21). At this time, the light-emitting part is provided with a thin-film transistor (TFT), a passivation film (27) is formed to cover them, and an organic light-emitting element (28) may be formed on the passivation film (27).

[0113] A buffer layer (22) composed of an organic compound and / or an inorganic compound is further formed on the upper surface of the substrate (21), and may be formed of SiOx (x≥1) or SiNx (x≥1).

[0114] After an active layer (23) arranged in a predetermined pattern is formed on this buffer layer (22), the active layer (23) is buried by a gate insulating layer (24). The active layer (23) has a source region (23C) and a drain region (23A), and further includes a channel region (23B) between them.

[0115] This active layer (23) can be formed to contain various materials. For example, the active layer (23) may contain an inorganic semiconductor material such as amorphous silicon or crystalline silicon. As another example, the active layer (23) may contain an oxide semiconductor. As yet another example, the active layer (23) may contain an organic semiconductor material. However, for convenience of explanation, the following description will focus on the case where the active layer (23) is formed of amorphous silicon.

[0116] This active layer (23) can be formed by forming an amorphous silicon film on a buffer layer (22), then crystallizing it to form a polycrystalline silicon film, and then patterning the polycrystalline silicon film. Depending on the type of TFT, such as a driving TFT (not shown) or a switching TFT (not shown), the source region (23C) and drain region (23A) of the active layer (23) are doped with impurities.

[0117] On the upper surface of the gate insulating layer (24), a gate electrode (25) corresponding to the active layer (23) and an interlayer insulating layer (26) that embeds it are formed.

[0118] Then, after forming contact holes (H1) in the interlayer insulating layer (26) and the gate insulating layer (24), a source electrode (27B) and a drain electrode (27A) are formed on the interlayer insulating layer (26) so as to be in contact with the source region (23C) and the drain region (23A), respectively.

[0119] A passivation film (27) is formed on the upper portion of the thin-film transistor formed in this manner, and a pixel electrode (28A) of an organic light-emitting diode (28, OLED) is formed on the upper portion of the passivation film (27). This pixel electrode (28A) is contacted to the drain electrode (27A) of the TFT by means of a via hole (H2) formed in the passivation film (27). The passivation film (27) may be formed of an inorganic and / or organic material, a single layer, or two or more layers. It may be formed as a flattening film so that the upper surface is flat regardless of the curvature of the lower film, or it may be formed to have a curvature following the curvature of the film located below. Furthermore, it is preferable that the passivation film (27) be formed as a transparent insulator to achieve a resonance effect.

[0120] After forming a pixel electrode (28A) on the passivation film (27), a pixel defining film (29) is formed by an organic and / or inorganic material to cover the pixel electrode (28A) and the passivation film (27), and is opened so that the pixel electrode (28A) is exposed.

[0121] And, at least an intermediate layer (28B) and a counter electrode (28C) are formed on the pixel electrode (28A).

[0122] The pixel electrode (28A) functions as an anode electrode and the counter electrode (28C) functions as a cathode electrode, and of course, the polarity of the pixel electrode (28A) and the counter electrode (28C) may be reversed.

[0123] The pixel electrode (28A) and the counter electrode (28C) are insulated from each other by the intermediate layer (28B), and voltages of different polarities are applied to the intermediate layer (28B) to cause light emission in the organic light-emitting layer.

[0124] The intermediate layer (28B) may comprise an organic emission layer. As another optional example, the intermediate layer (28B) may comprise an organic emission layer and additionally comprise at least one of a hole injection layer (HIL), a hole transport layer, an electron transport layer, and an electron injection layer. The present embodiment is not limited thereto, and the intermediate layer (28B) may comprise an organic emission layer and additionally comprise various other functional layers (not shown).

[0125] At this time, the intermediate layer (28B) as described above can be formed through the manufacturing device (10 not shown) of the display device described above.

[0126] Meanwhile, a single unit pixel is composed of multiple subpixels, and the multiple subpixels can emit light of various colors. For example, the multiple subpixels may each include a subpixel that emits red, green, and blue light, and may include a subpixel (not indicated) that emits red, green, blue, and white light.

[0127] Meanwhile, the thin film encapsulation layer (E) described above may include a plurality of inorganic layers or may include an inorganic layer and an organic layer.

[0128] The organic layer of the thin film encapsulation layer (E) is formed of a polymer and, preferably, may be a single film or a laminated film formed of any one of polyethylene terephthalate, polyimide, polycarbonate, epoxy, polyethylene, and polyacrylate. More preferably, the organic layer may be formed of polyacrylate, and specifically, may include a monomer composition polymerized from a diacrylate monomer and a triacrylate monomer. A monoacrylate monomer may be further included in the monomer composition. Additionally, a known photoinitiator such as TPO may be further included in the monomer composition, but is not limited thereto.

[0129] The inorganic layer of the thin film encapsulation layer (E) may be a single film or a stacked film comprising a metal oxide or a metal nitride. Specifically, the inorganic layer may include any one of SiNx, Al2O3, SiO2, and TiO2.

[0130] The uppermost layer of the thin film encapsulation layer (E) exposed to the outside can be formed as an inorganic layer to prevent moisture penetration into the organic light-emitting device.

[0131] The thin film encapsulation layer (E) may include at least one sandwich structure in which at least one organic layer is inserted between at least two inorganic layers. As another example, the thin film encapsulation layer (E) may include at least one sandwich structure in which at least one inorganic layer is inserted between at least two organic layers. As yet another example, the thin film encapsulation layer (E) may include a sandwich structure in which at least one organic layer is inserted between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is inserted between at least two organic layers.

[0132] The thin film encapsulation layer (E) may sequentially include a first inorganic layer, a first organic layer, and a second inorganic layer from the top of the organic light-emitting diode (OLED).

[0133] As another example, the thin film encapsulation layer (E) may sequentially include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer from the top of the organic light-emitting diode (OLED).

[0134] As another example, the thin film encapsulation layer (E) may sequentially include a first inorganic layer, a first organic layer, a second inorganic layer, the second organic layer, a third inorganic layer, a third organic layer, and a fourth inorganic layer from the top of the organic light-emitting diode (OLED).

[0135] A metal halide layer containing LiF may be additionally included between the organic light-emitting diode (OLED) and the first inorganic layer. The metal halide layer can prevent the organic light-emitting diode (OLED) from being damaged when the first inorganic layer is formed by a sputtering method.

[0136] The first organic layer may have a smaller area than the second inorganic layer, and the second organic layer may also have a smaller area than the third inorganic layer.

[0137] When forming an inorganic layer as described above, it can be manufactured through the manufacturing device (not shown) of the display device described above. In this case, the display substrate (D) can be transferred to the second chamber unit (not shown) through the first chamber unit (not shown) to deposit a deposition material onto the display substrate (D) via the source unit (not shown).

[0138] In this case, when transporting the display substrate (D), the carrier (not shown) is transported without contacting other objects, so that no foreign substances are generated, and thus the deposition quality of the display substrate (D) can be improved.

[0139] Therefore, the display device (20) does not have defects because foreign substances are not adsorbed to the display substrate (D) during the deposition of the deposition material, and accurate image realization is possible.

[0140] As such, the present invention has been described with reference to an embodiment illustrated in the drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and variations of the embodiments are possible therefrom. Accordingly, the true technical scope of protection of the present invention should be determined by the technical spirit of the appended claims. Explanation of the symbols

[0141] 10: Manufacturing device for display devices 20: Display device 100: First chamber unit 200: Second chamber unit 210: Second chamber 220: Sauce section 262-2: Second Magnetic Field Guide 300: Transfer unit 300-2, 300A-2, 300B-2, 300C-2, 300D-2: 2nd Transfer Unit 310, 310A, 310B, 310C, 310D: Carrier 320-2, 320A-2, 320B-2, 320C-2: Second position adjustment unit 330-2, 330A-2, 330B-2, 330C-2, 330D-2: 2nd Carrier Transfer Unit 331-2, 331A-2, 331B-2, 331C-2, 331D-2: 1st Transfer Section 332-2, 332A-2, 332B-2, 332C-2, 332D-2: 2nd Transfer Section 340-2, 340A-2, 340B-2, 340C-2, 340D-2: 2nd Carrier Guide Section 341-2, 341B-2, 341D-2: 1st guide section 342-2, 342B-2, 342D-2: Second guide section 350-2, 350A-2, 350B-2: Second Carrier Attitude Control Unit 351-2, 351A-2: First attitude control unit 352-2, 352A-2: Second attitude control unit 360-2, 360A-2, 360B-2, 360C-2, 360D-2: Second shielding section 371-2, 371A-2, 371B-2, 371C-2: Second gap measuring sensor unit 372-2, 372A-2, 372B-2, 372C-2, 372D-2: Second attitude measurement sensor unit 400: Gate valve

Claims

Claim 1 A manufacturing apparatus for a display device comprising: a first chamber unit for loading or unloading a display substrate; a second chamber unit for depositing a deposition material on the display substrate; a transfer unit disposed in at least one of the first chamber unit and the second chamber unit for transferring the display substrate from the first chamber unit to the second chamber unit or from the second chamber unit to the first chamber unit; wherein the transfer unit comprises: a carrier disposed opposite to a source unit and having a display substrate fixed thereon to transfer the display substrate; a position adjustment unit disposed spaced apart from the carrier and adjusting the position of the carrier in a first direction; a transfer unit for transferring the carrier in a second direction; a guide unit disposed spaced apart from the carrier and adjusting the position of the carrier; and a shielding unit disposed in at least one of the position adjustment unit, the transfer unit, and the guide unit to block a magnetic field generated from at least one of the position adjustment unit, the transfer unit, and the guide unit; wherein the carrier comprises a protrusion protruding from a mounting unit on which the display substrate is mounted. Claim 2 In claim 1, the position adjustment part and the guide part are a manufacturing device for a display device fixed to the inner wall of the chamber. Claim 3 A manufacturing apparatus for a display device according to claim 1, wherein the transfer unit comprises a first transfer unit and a second transfer unit arranged spaced apart from each other, and the distance from the end of the first transfer unit to the end of the second transfer unit is smaller than the width of the carrier. Claim 4 A manufacturing apparatus for a display device according to claim 3, wherein the distance from the end of the first transfer unit to the end of the second transfer unit is less than or equal to half the width of the carrier. Claim 5 A manufacturing device for a display device in which the first direction is the up-and-down direction, according to claim 1. Claim 6 A manufacturing apparatus for a display device, wherein the second direction is a direction perpendicular to the first direction. Claim 7 In claim 1, the guide is a manufacturing device for a display device that adjusts the position of the carrier in a third direction different from the first direction and the second direction.

Images