Electrically Conducting Structure (1) for Flexible Circuit Board

Abstract

An electrical conductive structure for a flexible circuit board comprises one flexible substrate, one circuit layer, at least one welded structure, and one electrical connection structure. The flexible substrate comprises one first surface, one second surface, one side, and a plurality of recesses. The first surface and the second surface are installed facing each other, the side connects the first surface and the second surface, and the recesses are formed on the side to connect the first surface and the second surface. The circuit layer is formed on the first surface, and the circuit layer forms at least one conductive structure at a location close to the side of the flexible substrate. The welded structure is installed on the second surface of the flexible substrate. The electrical connection structure connects the conductive structure and the welded structure, and the electrical connection structure extends from the first surface to the second surface of the flexible substrate.

Description

Technology Field

[0001] The present invention relates to the technical field of circuit board structures, and in particular to electrical conduction structures for flexible circuit boards. Background Technology

[0002] Since the recent design trend for electronic products is slimming down, multiple electronic modules of an electronic device must be installed in a space with very limited size; therefore, connecting electronic modules using flexible circuit boards or cables is an essential choice. Because the circuit layer of a conventional flexible circuit board is installed on only one surface, it cannot be applied to designs where the circuit layer and welded structure must be installed on two surfaces. Therefore, how to form circuit layers and welded structures on two surfaces of a flexible board and then establish conductivity is currently an important direction for the development of flexible circuit boards. The problem to be solved

[0003] With this in mind, the objective of the present invention is to provide an electrical conduction structure for a flexible circuit board that solves the problem of how to conduct circuits on both sides of a circuit board. means of solving the problem

[0004] In one embodiment of an electrical conductivity structure for a flexible circuit board according to the present invention, the structure comprises one flexible substrate, one circuit layer, at least one weld structure, and one electrical connection structure. The flexible substrate comprises one first surface, one second surface, one side, and a plurality of concave grooves, wherein the first surface and the second surface are installed facing each other, the side connects the first surface and the second surface, and the concave groove is formed on the side to connect the first surface and the second surface. The circuit layer is formed on the first surface, and the circuit layer forms at least one conductive structure at a location close to the side of the flexible substrate. The weld structure is installed on the second surface of the flexible substrate. The electrical connection structure connects the conductive structure and the weld structure, and the electrical connection structure extends from the first surface to the second surface of the flexible substrate.

[0005] In another embodiment, the electrical connection structure includes at least one conductor layer, the conductor layer is formed on the wall of a recessed groove, and the conductor layer is connected to a conductive structure and a welded structure.

[0006] In another embodiment, the flexible substrate further includes at least one through hole, the through hole penetrates the flexible substrate to communicate with the first surface and the second surface, and the electrical connection structure includes a conductive layer, the conductive layer is formed on the hole wall of the through hole, and the conductive layer is connected to the conductive structure and the welded structure.

[0007] In another embodiment, the electrical connection structure includes a plurality of conductor layers, and the conductor layers are also formed on the groove wall of at least one concave groove.

[0008] In another embodiment, the flexible substrate further comprises at least one receiving recess, and the receiving recess is formed on a first surface. The receiving recess is connected to a corresponding groove, and the at least one conductive structure is installed within the at least one receiving recess, and the upper surface of the at least one conductive structure is located coplanar with the first surface.

[0009] In another embodiment, the conductive structure is a metal bump installed on the first surface.

[0010] In another embodiment, the welded structure is a metal bump installed on the second surface.

[0011] In another embodiment, the conductive structure is a conductive node installed on the first surface.

[0012] The electrical conduction structure for a flexible circuit board of the present invention forms a recessed groove on the side of the flexible substrate and / or forms a through hole in the flexible substrate, and connects a circuit layer and a welded structure installed on two surfaces of the flexible substrate by forming an electrical connection structure that connects the circuit layer and the welded structure within the recessed groove and / or through hole. Effects of the invention

[0013] The electrical conduction structure for a flexible circuit board according to the present invention forms a recessed groove on the side of the flexible substrate and / or forms a through hole in the flexible substrate, and connects a circuit layer and a welded structure installed on two surfaces of the flexible substrate by forming an electrical connection structure that connects the circuit layer and the welded structure within the recessed groove and / or through hole. The electrical conduction structure for a flexible circuit board according to the present invention can obtain a conduction structure that conducts the circuit layer and the welded structure through a simple manufacturing process and can be applied to slimmed-down electronic devices without using components with relatively complex manufacturing processes, such as flexible flat cables (FFC). Brief explanation of the drawing

[0014] FIG. 1 is a perspective view of a first embodiment of an electrical conductivity structure for a flexible circuit board of the present invention. Figure 2 is a perspective view of an electrical conduction structure for a flexible circuit board of Figure 1 viewed from a different angle. Figure 3 is a cross-sectional view along line AA of Figure 1. FIG. 4 is a cross-sectional view of a second embodiment of an electrical conductivity structure for a flexible circuit board of the present invention. FIG. 5 is a cross-sectional view of a third embodiment of an electrical conductivity structure for a flexible circuit board of the present invention. FIG. 6 is a cross-sectional view of a fourth embodiment of an electrical conductivity structure for a flexible circuit board of the present invention. FIG. 7 is a cross-sectional view of a fifth embodiment of an electrical conductivity structure for a flexible circuit board of the present invention. Specific details for implementing the invention

[0015] Referring to FIGS. 1, 2, and 3, these illustrate a first embodiment of an electrical conduction structure for a flexible circuit board according to the present invention. The electrical conduction structure for a flexible circuit board according to the present embodiment comprises one flexible substrate (10), one circuit layer (20), at least one weld structure (30), and one electrical connection structure (40). The flexible substrate (10) comprises one first surface (11), one second surface (12), one side surface (13), and a plurality of concave grooves (14). The first surface (11) and the second surface (12) are installed facing each other, the side surface (13) connects the first surface (11) and the second surface (12), and a plurality of concave grooves (14) are formed on the side surface (13) to connect the first surface (11) and the second surface (12), and the groove walls of the concave grooves (14) are formed in an arc shape. The manufacturing process for forming the concave groove (14) may be as follows: first, a plurality of circular holes are drilled in the flexible substrate (10), and then the flexible substrate (10) is cut along a straight line passing through the center of the circular holes, thereby forming a half-hole shaped concave groove (14) known as a stamp hole.

[0016] A circuit layer (20) is formed on a first surface (11), and the circuit layer (20) forms a conductive structure (21) at a position close to the side (13) of the flexible substrate (10). The flexible substrate (10) according to the present embodiment further includes a plurality of receiving recesses (15), and the receiving recesses (15) are formed on the first surface (11). The receiving recesses (15) according to the present embodiment are rectangular and communicate with the recess (14), and the conductive structure (21) is installed within the receiving recesses (15), and the conductive structure (21) has the same height as the first surface (11). In another embodiment, the conductive structure (21) may be a metal bump formed on the first surface (11).

[0017] A weld structure (30) is installed on a second surface (12) of a flexible substrate (10). The weld structure (30) according to the present embodiment is a metal bump formed on the second surface (12), and the weld structure (30) is connected to a concave groove (14).

[0018] The electrical connection structure (40) connects the conductive structure (21) and the welded structure (30), and the electrical connection structure (40) according to the present embodiment includes a single conductive layer (41), the conductive layer (41) is formed on the wall of the groove of the concave groove (14) and extends from the first surface (11) to the second surface (12) of the flexible substrate (10), and the conductive layer (41) is connected to the conductive structure (21) and the welded structure (30) so that the conductive structure (21) and the welded structure (30) form an electrical connection.

[0019] The circuit layer (20), weld structure (30), and electrical connection structure (40) according to the present embodiment are formed on a flexible substrate (10) through an electroplating manufacturing process. The material of the circuit layer (20), weld structure (30), and electrical connection structure (40) may be copper.

[0020] Referring to FIG. 4, this illustrates a second embodiment of an electrical conductivity structure for a flexible circuit board of the present invention. Since this embodiment is provided with a structure that is partially identical to the first embodiment, the same reference numerals are assigned to identical components and descriptions are omitted. The difference between this embodiment and the first embodiment is that a concave groove (14) is not installed on the side (13) of the flexible substrate (10) according to this embodiment, a through hole (16) is provided in the flexible substrate (10) according to this embodiment, a conductor layer (41) of the electrical connection structure (40) according to this embodiment is formed on the hole wall of the through hole (16), and the conductor layer (41) is connected to the conductive structure (21) and the welded structure (30) so that the conductive structure (21) and the welded structure (30) form an electrical connection. The circuit layer (20), the welded structure (30), and the electrical connection structure (40) according to this embodiment are formed on the flexible substrate (10) through an electroplating manufacturing process. The materials of the circuit layer (20), weld structure (30) and electrical connection structure (40) may be copper.

[0021] Referring to FIG. 5, this shows a third embodiment of an electrical conductivity structure for a flexible circuit board of the present invention. Since this embodiment is provided with a structure that is partially identical to the first embodiment, the same reference numerals are assigned to identical components and the description is omitted. The difference between this embodiment and the first embodiment is that, in addition to the concave groove (14) being installed on the side (13) of the flexible substrate (10) according to this embodiment, the flexible substrate (10) according to this embodiment is further provided with a through hole (16), and the conductor layer (41) of the electrical connection structure (40) according to this embodiment is formed on the groove wall of the concave groove (14) and the hole wall of the through hole (16), and the conductor layer (41) is connected to the conductive structure (21) and the welded structure (30) so that the conductive structure (21) and the welded structure (30) form an electrical connection. The circuit layer (20), weld structure (30), and electrical connection structure (40) according to the present embodiment are formed on a flexible substrate (10) through an electroplating manufacturing process. The material of the circuit layer (20), weld structure (30), and electrical connection structure (40) may be copper.

[0022] Referring to FIG. 6, this shows a fourth embodiment of an electrical conduction structure for a flexible circuit board of the present invention. Since this embodiment is provided with a structure that is partially identical to the first embodiment, the same reference numerals are assigned to the same components and the description is omitted. The difference between this embodiment and the first embodiment is that the conductive structure (21) according to this embodiment is a conductive node formed on the first surface (11), the conductor layer (41) of the electrical connection structure (40) is formed on the groove wall of the concave groove (14), and the conductor layer (41) is connected to the conductive structure (21) and the welded structure (30) so that the conductive structure (21) and the welded structure (30) form an electrical connection.

[0023] Referring to FIG. 7, this shows a fifth embodiment of an electrical conduction structure for a flexible circuit board of the present invention. Since this embodiment is provided with a structure that is partially identical to the second embodiment, the same reference numerals are assigned to the same components and the description is omitted. The difference between this embodiment and the second embodiment is that the conductive structure (21) according to this embodiment is a conductive node formed on the first surface (11), the conductor layer (41) of the electrical connection structure (40) is formed on the wall of the groove of the concave groove (14), and the conductor layer (41) is connected to the conductive structure (21) and the welded structure (30) so that the conductive structure (21) and the welded structure (30) form an electrical connection.

[0024] The electrical conduction structure for a flexible circuit board according to the present invention forms a recessed groove on the side of the flexible substrate and / or forms a through hole in the flexible substrate, and connects a circuit layer and a welded structure installed on two surfaces of the flexible substrate by forming an electrical connection structure that connects the circuit layer and the welded structure within the recessed groove and / or through hole. The electrical conduction structure for a flexible circuit board according to the present invention can obtain a conduction structure that conducts the circuit layer and the welded structure through a simple manufacturing process and can be applied to slimmed-down electronic devices without using components with relatively complex manufacturing processes, such as flexible flat cables (FFC).

[0025] The foregoing description is merely a preferred embodiment of the present invention and the scope of the present invention is not limited thereto. Simple equivalent modifications and amendments based on the claims and new descriptions of the present invention are all included within the scope of protection of the present invention. Furthermore, any single embodiment or claim of the present invention does not necessarily achieve all purposes, advantages, or features disclosed in the present invention. Additionally, the abstract and the title of the invention are used solely to aid in patent document search and are not used to limit the scope of rights of the present invention. Moreover, terms such as "first," "second," etc., mentioned in this specification or claims are used solely to name elements or to distinguish different embodiments or scopes, and are not used to limit the upper or lower limits of the quantity of elements. Explanation of the symbols

[0026] 10: Flexible substrate 11: First surface 12: Second Surface 13: Side 14: Concave groove 15: Receiving depression 20: Circuit layer 21: Conductive structure 30: Welded structure 40: Electrical connection structure 41: Conductor layer

Claims

Claim 1 An electrical conductive structure for a flexible circuit board comprises one flexible substrate, one circuit layer, at least one weld structure, and one electrical connection structure, wherein the flexible substrate comprises one first surface, one second surface, one side, and a plurality of concave grooves, wherein the first surface and the second surface are installed opposite each other, the side connects the first surface and the second surface, and the plurality of concave grooves are formed on the side to connect the first surface and the second surface; the circuit layer forms at least one conductive structure formed on the first surface; the weld structure is installed on the second surface of the flexible substrate; the electrical connection structure connects the at least one conductive structure and the at least one weld structure, and the electrical connection structure extends from the first surface to the second surface through the plurality of concave grooves, and the flexible substrate further comprises at least one receiving concave portion formed on the first surface, the receiving concave portion is connected to the corresponding concave groove, and the at least one conductive structure is within the at least one receiving concave portion An electrical conductive structure for a flexible circuit board, characterized in that it is installed, and the upper surface of at least one conductive structure is located on the same plane as the first surface. Claim 2 An electrical conductive structure for a flexible circuit board according to claim 1, wherein the flexible substrate further comprises at least one through hole, the at least one through hole penetrates the flexible substrate to communicate with the first surface and the second surface, and the electrical connection structure is formed on the hole wall of at least one through hole and connected to the at least one conductive structure and the at least one welded structure. Claim 3 An electrical conductive structure for a flexible circuit board according to claim 1, wherein the electrical connection structure comprises at least one conductor layer, the at least one conductor layer is formed on the wall of at least one concave groove, and the at least one conductor layer is connected to the at least one conductive structure and the at least one welded structure. Claim 4 An electrical conduction structure for a flexible circuit board according to claim 3, wherein the electrical connection structure comprises a plurality of conductor layers, and the conductor layers are also formed on the groove wall of at least one of the concave grooves. Claim 5 delete Claim 6 An electrical conductive structure for a flexible circuit board, characterized in that, in claim 1, at least one conductive structure is a metal bump installed on the first surface. Claim 7 An electrical conductivity structure for a flexible circuit board, characterized in that, in claim 1, the at least one welded structure is a metal bump installed on the second surface. Claim 8 delete

Images