Manifold fluid module

Abstract

The present invention relates to a manifold fluid module. A manifold fluid module according to one embodiment of the present invention comprises: a manifold plate having a fluid flow path formed therein; and a heat exchanger coupled to the manifold plate and heat-exchanging a first fluid and a second fluid, the heat exchanger having a first inlet end for the first fluid to be introduced, a first outlet end for the first fluid to be discharged, a second inlet end for the second fluid to be introduced, and a second outlet end for the second fluid to be discharged, wherein the first inlet end and the first outlet end of the heat exchanger are connected to communicate with the fluid flow path, and either the first inlet end or the first outlet end may be directly connected to the manifold plate and the other may be connected to a fluid pipe.

Description

Technology Field

[0001] The present invention relates to a manifold fluid module, and more specifically, to a manifold fluid module in which components such as heat exchangers and valves are modularized into a single unit. Background Technology

[0002] Under the policy of environmentally friendly industrial development and the development of energy sources to replace fossil fuels, electric vehicles and hybrid vehicles are the sectors receiving the most attention in the automotive industry recently. Electric and hybrid vehicles are equipped with batteries to provide driving power, and these batteries are utilized not only for driving but also for heating and cooling.

[0003] In vehicles that provide driving power using batteries, the fact that the battery is used as a heat source for heating and cooling means that the driving range is reduced accordingly. To overcome this problem, a method has been proposed to apply a heat pump system, which has been widely used as a household heating and cooling device, to automobiles.

[0004] For reference, a heat pump refers to a device that absorbs heat at a low temperature and transfers the absorbed heat to a high temperature. As an example, a heat pump has a cycle in which a liquid fluid evaporates in an evaporator, absorbs heat from the surroundings to become a gas, and then liquefies again by releasing heat to the surroundings through a condenser. Applying this to electric or hybrid vehicles has the advantage of securing a heat source that is lacking in conventional air conditioning systems.

[0005] Currently, the modular configuration of heat pump systems for electric vehicles utilizes a partial modular approach, where critical components (valves, accumulators, chillers, condensers, internal heat exchangers, sensors, etc.) are connected via piping. This necessitates the separate configuration of fittings and connectors for these connections, resulting in specific spacing between components. Consequently, this presents disadvantages in terms of packaging, cost, and workability.

[0006] To address this, technology for modularizing manifolds is being developed, but there was a problem where performance degraded due to thermal interference between high-temperature and low-temperature fluids during the modularization process. Prior art literature

[65535] Republic of Korea Registered Patent No. 10-2541514 The problem to be solved

[0007] The present invention provides a manifold fluid module having a structure capable of minimizing thermal interference between a high-temperature fluid and a low-temperature fluid. means of solving the problem

[0008] A manifold fluid module according to one embodiment of the present invention comprises: a manifold plate having a fluid passage formed therein; and a heat exchanger coupled to the manifold plate and heat-exchanging a first fluid and a second fluid, the heat exchanger having a first inlet end for the first fluid to be introduced, a first outlet end for the first fluid to be discharged, a second inlet end for the second fluid to be introduced, and a second outlet end for the second fluid to be discharged, wherein the first inlet end and the first outlet end of the heat exchanger are connected to communicate with the fluid passage, and either the first inlet end or the first outlet end may be directly connected to the manifold plate and the other may be connected to a fluid pipe.

[0009] One end of the fluid piping is connected to the first inlet or first outlet, and the other end is connected to the manifold plate and can communicate with the fluid flow path.

[0010] The temperature of the first fluid flowing through the fluid piping and the temperature of the first fluid flowing through the fluid path may be different.

[0011] Multiple fluid passages are formed in the manifold plate, and the temperature of each fluid passage may be different.

[0012] Among the plurality of the above fluid passages, the temperature of the fluid passage adjacent to the fluid pipe may be the lowest.

[0013] Among the plurality of the above fluid passages, the temperature of the fluid passage adjacent to the fluid pipe may be the highest.

[0014] The above heat exchanger may be a water-cooled condenser or a chiller.

[0015] The above heat exchanger is composed of multiple units and may include a water-cooled condenser and a chiller.

[0016] The above water-cooled condenser may be positioned vertically on the manifold plate, and the chiller may be positioned horizontally on the manifold plate.

[0017] The above water-cooled condenser is positioned on one side of the manifold plate, and the chiller can be positioned on the side of the water-cooled condenser.

[0018] The apparatus further comprises a first expansion valve for expanding a first fluid flowing into the water-cooled condenser; and a second expansion valve for expanding a first fluid flowing into the chiller, wherein the first expansion valve is positioned above the water-cooled condenser and the second expansion valve is positioned above the chiller, so that the first fluid flowing into the water-cooled condenser and the chiller can move from the top to the bottom.

[0019] The apparatus further includes a first directional control valve and a second directional control valve for controlling the direction of a first fluid discharged from the water-cooled condenser, wherein the first directional control valve and the second directional control valve may be positioned above the water-cooled condenser.

[0020] The first expansion valve, the first directional valve, and the second directional valve are positioned on the upper part of the manifold plate, the water-cooled condenser is positioned on one side of the lower part of the manifold plate, and the chiller and the second expansion valve may be positioned on the other side of the lower part of the manifold plate.

[0021] A manifold fluid module according to another embodiment of the present invention may include: a manifold plate having a fluid passage formed therein; a heat exchanger coupled to the manifold plate and heat-exchanging a first fluid and a second fluid, the heat exchanger having a first inlet end for the first fluid to be introduced, a first outlet end for the first fluid to be discharged, a second inlet end for the second fluid to be introduced, and a second outlet end for the second fluid to be discharged; and a heat interference prevention member for preventing the first fluid introduced or discharged through the first inlet end or the first outlet end of the heat exchanger from having thermal interference with the fluid passage.

[0022] The above thermal interference prevention member may have an air insulation layer spaced apart from the fluid flow path at a constant distance. Effects of the invention

[0023] A manifold fluid module according to one embodiment of the present invention can improve heat pump performance by minimizing thermal interference with a low-temperature fluid through a thermal interference prevention part, such as a separate pipe, so that a high-temperature fluid forms a flow path. Brief explanation of the drawing

[0024] FIG. 1 is a perspective view showing the front of a manifold fluid module according to one embodiment of the present invention. FIG. 2 is a perspective view showing the rear side of a manifold fluid module according to one embodiment of the present invention. FIG. 3 is a diagram illustrating the flow of fluid in air conditioning mode according to one embodiment of the present invention. FIG. 4 is a diagram illustrating the flow of fluid in heat pump mode according to one embodiment of the present invention. Figure 5 is a diagram showing the temperature distribution of a manifold fluid module without fluid piping applied. FIG. 6 is a diagram illustrating the temperature distribution of a manifold fluid module with fluid piping applied according to one embodiment of the present invention. Specific details for implementing the invention

[0025] The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the present invention. In describing the present invention, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions may obscure the essence of the present invention.

[0026] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0027] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0028] Furthermore, throughout the specification, when the term "connected" is used, it does not mean only that two or more components are directly connected, but may also mean that two or more components are indirectly connected through other components, that they are connected not only physically but also electrically, or that they are a single unit although referred to by different names depending on their location or function.

[0029] Hereinafter, an embodiment of a manifold fluid module according to the present invention will be described in detail with reference to the accompanying drawings. In describing with reference to the accompanying drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0030] FIG. 1 is a perspective view showing the front of a manifold fluid module according to one embodiment of the present invention, and FIG. 2 is a perspective view showing the rear of a manifold fluid module according to one embodiment of the present invention.

[0031] As illustrated herein, a manifold fluid module according to one embodiment of the present invention may include a manifold plate (10) having fluid passages (14, 16, 18) formed therein, and a heat exchanger having a first inlet end (21) into which the first fluid is introduced, a first outlet end (22) into which the first fluid is discharged, a second inlet end (23) into which the second fluid is introduced, and a second outlet end (24) into which the second fluid is discharged, for heat exchange between a first fluid and a second fluid. Furthermore, the first inlet end (21) and the first outlet end (22) of the heat exchanger are connected to communicate with the fluid passages (14, 16, 18), and either the first inlet end (21) or the first outlet end (22) may be directly connected to the manifold plate (10) and the other may be connected to a fluid pipe (26).

[0032] The heat exchanger mentioned above can be any device that facilitates heat exchange between the first fluid, the refrigerant, and the second fluid, the cooling water. For convenience, a water-cooled condenser (20) and a chiller (60) will be used as examples for the following description. The manifold plate (10) has multiple fluid passages (14, 16, 18) formed inside, and can be formed with a variety of temperature distributions ranging from high to low depending on the heat exchange of the fluid flowing along the fluid passages. Multiple components constituting a heat pump system can be coupled to the manifold plate (10). In this embodiment, a water-cooled condenser (20) for heat exchange, a first expansion valve (30), a first directional control valve (40), a second directional control valve (50), a chiller (60), and a second expansion valve (70) can be coupled and arranged to the manifold plate (10).

[0033] The manifold plate (10) is formed such that a fluid flow path is recessed into the interior and has a plate shape with a predetermined thickness. In this way, the manifold plate (10) is modularized by combining a water-cooled condenser (20), a chiller (60), an expansion valve (30, 60), and a directional valve (40, 50), which are heat exchange devices of the heat pump system, thereby reducing the labor cost for product manufacturing and reducing the labor cost of the vehicle assembly line. In addition, since the manifold plate (10) simultaneously performs the functions of piping, fittings, and housing, it can reduce costs and improve workability.

[0034] Referring to FIG. 2, a fluid inlet (12) is provided on the rear surface of the manifold plate (10) to receive high-temperature, high-pressure gaseous fluid discharged from a compressor or internal condenser. Additionally, a plurality of fluid passages (14, 16, 18) are formed on the rear surface of the manifold plate (10) to guide the movement of the fluid. The fluid passages (14, 16, 18) are formed by making the rear surface of the manifold plate (10) recessed to facilitate heat exchange, expansion, inflow, and outflow of the fluid.

[0035] In this embodiment, the fluid passages (14, 16, 18) form three main fluid passages according to the temperature distribution of the fluid. First, the first fluid passage (14) is a section where a high-temperature fluid flows, and may include the path where the first high-temperature, high-pressure fluid initially introduced into the manifold plate (10) is discharged from the water-cooled condenser (20). The second fluid passage (16) is a section where a low-temperature, low-pressure first fluid flows, and may include the path where the first fluid is discharged to the evaporator (not shown). The third fluid passage (18) is a section where a low-temperature, low-pressure first fluid flows, and may include the path where the first fluid introduced from the evaporator is discharged after heat exchange with the cooling water in the chiller (60).

[0036] The first to third fluid channels (14, 16, 18) examined above are distinguished according to the temperature distribution of the fluid, and the first fluid channel (14) may have a distribution of approximately 65°C, the second fluid channel (16) may have a distribution of 5°C, and the third fluid channel (18) may have a distribution of 20°C.

[0037] The water-cooled condenser (20) serves to condense a high-temperature, high-pressure gaseous fluid discharged from a compressor or internal condenser into a high-pressure liquid by exchanging heat with an external heat source. The high-temperature, high-pressure gaseous fluid flows into the water-cooled condenser (20) through the fluid inlet (12). In this way, the water-cooled condenser (20) can be viewed as a first heat exchanger that performs heat exchange in the fluid module.

[0038] A first inlet section (21) and a first outlet section (22) are provided at the upper and lower rear ends of the water-cooled condenser (20), respectively. The first inlet section (21) is the part into which the first fluid flowing into the first fluid path (14) flows, and the first outlet section (22) is the part into which the first fluid that has undergone heat exchange in the water-cooled condenser (20) is discharged. The first inlet section (21) and the first outlet section (22) may be formed in the shape of holes at the upper and lower ends of the water-cooled condenser (20), respectively.

[0039] In addition, a second inlet section (23) and a second outlet section (24) are provided at the rear bottom and top of the water-cooled condenser (20), respectively. The second inlet section (23) is the part where the second fluid is introduced, and the second outlet section (24) is the part where the second fluid, which has exchanged heat with the first fluid, is discharged. The second fluid exchanges heat with the first fluid while flowing in the opposite direction (bottom to top) to the first fluid.

[0040] Meanwhile, as described above, since the first fluid channel (14) is at a relatively high temperature compared to the second and third fluid channels (16, 18), thermal interference occurs between the fluid channels during the fluid flow process. In this case, the most effective solution is to design the system to secure a gap between the first fluid channel (14) and the second and third fluid channels (16, 18), but there are limitations to securing space due to the characteristics of modular products.

[0041] Accordingly, in this embodiment, as shown in FIG. 2, a separate fluid pipe (26) can be connected to the first discharge end (22) of the water-cooled condenser (20). One end of the fluid pipe (26) is connected to the first discharge end (22), and the other end is directly connected to the manifold plate (10), so that it can be substantially connected to the first fluid path (14).

[0042] As described above, when connected to the manifold plate (10) through the fluid pipe (26), the flow path through which the high-temperature first fluid passes can be spaced as far as possible from the manifold plate (10), thereby minimizing thermal interference between the second and third fluid flow paths (16, 18), which are sections where the low-temperature first fluid moves, and the high-temperature first fluid.

[0043] For example, if a high-temperature first fluid flows into the second fluid path (16) of the manifold plate (10) without passing through a separate fluid pipe (26), direct thermal interference occurs with the low-temperature first fluid moving within the manifold plate (10) (caused by the heat conduction of the manifold plate (10) itself), but if separated through the fluid pipe (26), thermal interference occurs indirectly, thus minimizing the influence of the high-temperature fluid. In this way, by allowing the first fluid to flow through a separate line via the fluid pipe (26), the temperature of the first fluid flowing through the fluid pipe (26) and the temperature of the first fluid flowing through the fluid paths (14, 16, 18) may be different. In particular, among the multiple fluid paths (14, 16, 18), the temperature of the fluid path (14, 16, 18) adjacent to the fluid pipe (26) may be the lowest or the highest.

[0044] Additionally, in FIG. 2, the fluid pipe (26) is connected only to the first discharge end (22), but it can also be configured to be connected to the first inlet end (21). This is because, in the arrangement of the water-cooled condenser (20), the section where the first fluid is discharged and connected to the manifold plate (10) is longer than the section where the first fluid is introduced. If the section where the first fluid is introduced is longer than the section where it is discharged, it would also be possible to configure the fluid pipe (26) to be connected to the first inlet end (21).

[0045] The important thing is to connect a fluid pipe (26) to the first inlet end (21) or the first outlet end (22) to separate the section where the high-temperature first fluid travels from the manifold plate (10), thereby minimizing thermal interference between the high-temperature and low-temperature fluids. Through such a structure, the heat exchange performance of the heat pump system can be improved.

[0046] As described above, in this embodiment, a fluid pipe (26) is described as an example of a thermal interference prevention part to prevent the first fluid flowing in or out through the first inlet end (21) or the first outlet end (22) of the water-cooled condenser (20) from having thermal interference with the fluid flow path (14, 16, 18). However, any configuration capable of separating the flow path of the first fluid, other than the fluid pipe (26) described above, may be adopted as the thermal interference prevention part.

[0047] Additionally, the thermal interference prevention section may have an air insulation layer (28) spaced apart from the fluid passages (14, 16, 18) at a constant distance. Since there is a space for air to flow between the manifold plate (10) and the fluid pipe (26), thermal interference of the first fluid can be prevented by the air.

[0048] Meanwhile, one end of the fluid pipe (26) is connected to the condenser discharge end (24) located at the bottom of the water-cooled condenser (20), and the other end is extended upward and connected to the manifold plate (10). The other end of the fluid pipe (26) can be extended approximately to the top of the water-cooled condenser (20). Since a long section of the fluid module is guided by the fluid pipe (26), which is a separate component, thermal interference can be minimized more effectively.

[0049] The first expansion valve (30) can be positioned above the water-cooled condenser (20) and can expand or pass the first fluid introduced through the fluid inlet (12). The fluid introduced through the first expansion valve (30) can pass through the water-cooled condenser (20), undergo heat exchange, or move to an external heat exchanger.

[0050] The first fluid, which passes through the water-cooled condenser (20) and flows into the fluid pipe (26), flows into the first directional valve (40). The first fluid flowing into the first directional valve (40) can be moved to an evaporator or an external heat exchanger. Additionally, the first fluid flowing into the first expansion valve (30) can be moved to the second directional valve (50) in dehumidification mode and then to the evaporator or to the first directional valve (40).

[0051] The chiller (60) is supplied with a low-temperature, low-pressure fluid and exchanges heat with the cooling water moving in the cooling water circulation line (not shown). The cold cooling water exchanged in the chiller (60) can circulate through the cooling water circulation line and exchange heat with the battery. The first fluid, which has exchanged heat with an external heat exchanger, flows into the second expansion valve (70), and the first fluid expanded in the second expansion valve (70) flows into the chiller (60). The first fluid, which has exchanged heat in the chiller (60), is discharged through the bottom and flows into the accumulator (not shown). The chiller (60) can be viewed as a second heat exchanger that performs heat exchange in the fluid module.

[0052] To this end, a first inlet section (61) and a first outlet section (62) are provided at the upper and lower rear ends of the chiller (60), respectively. The first inlet section (61) is the part where the first fluid is introduced, and the first outlet section (62) is the part where the first fluid that has undergone heat exchange in the chiller (60) is discharged. The first inlet section (61) and the first outlet section (62) may be formed in the shape of holes at the upper and lower ends of the chiller (60), respectively.

[0053] Additionally, a second inlet section (63) and a second outlet section (64) are provided at the rear bottom and top of the chiller (60), respectively. The second inlet section (63) is the part where the second fluid is introduced, and the second outlet section (64) is the part where the second fluid, which has exchanged heat with the first fluid, is discharged. The second fluid exchanges heat with the first fluid while flowing in the opposite direction (bottom to top) to the first fluid.

[0054] Referring again to FIG. 1, in this embodiment, the first expansion valve (30), the first directional valve (40), and the second directional valve (50) are positioned on the upper side of the manifold plate (10), the water-cooled condenser (20) is positioned on one side of the lower part of the manifold plate (10), and the chiller (60) and the second expansion valve (70) can be positioned on the other side of the lower part of the manifold plate (10).

[0055] When the above components are placed on the manifold plate (10), the components can be optimally placed in the minimum space, thereby maximizing space efficiency, and the fluid flow can also be optimized because the fluid flow is formed from the top to the bottom overall.

[0056] In particular, the fluid module package can be optimized by positioning the water-cooled condenser (20) vertically on one side of the lower portion of the manifold plate (10) and the chiller (60) horizontally on the other side of the lower portion of the manifold plate (10). That is, space efficiency can be increased by positioning the chiller (60) on the side of the water-cooled condenser (20).

[0057] The first expansion valve (30) is positioned above the water-cooled condenser (20), and the second expansion valve (40) is positioned above the chiller (60), so that the first fluid flowing into the water-cooled condenser (20) and the chiller (60) can be moved from the top to the bottom.

[0058] In this way, the portion where the valve is placed on the manifold plate (10) has the thickness of the valve itself, so by placing it in the upper and central portions of the manifold plate (10), ease of manufacturing can be ensured in manufacturing methods such as forging.

[0059] Meanwhile, although the above description mainly used a water-cooled condenser (20), which is the first heat exchanger, as an example, it is not necessarily limited to this, and a configuration in which a fluid pipe (26) is connected to the first inlet end (61) or the first outlet end (62) of a chiller (60), which is the second heat exchanger, is also possible.

[0060] FIG. 3 is a diagram illustrating fluid flow in air conditioner mode according to one embodiment of the present invention, and FIG. 4 is a diagram illustrating fluid flow in heat pump mode according to one embodiment of the present invention.

[0061] Referring to FIG. 3, in the case of the air conditioner mode, the first fluid introduced from the compressor or internal condenser through the fluid inlet (12) passes through the first expansion valve (30) in an open state, flows into the upper part of the water-cooled condenser (20), and then moves to the lower part. Then, the first fluid discharged through the first discharge end (22) of the water-cooled condenser (20) flows through the fluid pipe (26) and into the first directional control valve (40).

[0062] The first fluid flowing into the first directional control valve (40) moves to an external heat exchanger, and at this time, the second directional control valve (50) is closed so that the first fluid does not flow in.

[0063] Meanwhile, the first fluid flowing into the second expansion valve (70) flows into the chiller (60) and exchanges heat with the cooling water circulating in the cooling water circulation line. The cold cooling water that has exchanged heat in the chiller (60) can circulate in the cooling water circulation line and exchange heat with the battery. The first fluid discharged from the bottom of the chiller (60) flows into an accumulator (not shown), and the first fluid flowing into the accumulator is separated into gas and liquid, so that the gaseous fluid flows into the compressor and then the first fluid circulates through the heat pump system.

[0064] In the case of dehumidification mode, the first fluid flows from the first expansion valve (30) to the second directional control valve (50), and the first fluid can be discharged to the evaporator.

[0065] Referring to FIG. 4, in the case of the heat pump mode, the first fluid introduced through the fluid inlet (12) can be expanded after passing through the first expansion valve (30) and then introduced into the water-cooled condenser (20) and the second directional valve (50).

[0066] The first fluid flowing into the second directional valve (50) can flow into an external heat exchanger, and the first fluid passing through the water-cooled condenser (20) can flow into the first directional valve (40). Additionally, the first fluid flowing from the external heat exchanger into the second expansion valve (70) flows into the chiller (60), and the first fluid passing through the chiller (60) is moved to the accumulator.

[0067] FIG. 5 is a diagram showing the temperature distribution of a manifold fluid module without fluid piping applied, and FIG. 6 is a diagram showing the temperature distribution of a manifold fluid module with fluid piping applied according to an embodiment of the present invention.

[0068] Referring to FIG. 5, it can be seen that when fluid piping (26) is not applied, the sky blue section, which is relatively hotter than the blue section, is distributed in the area where the second and third fluid channels (16, 18) are arranged. This means that the second and third fluid channels (16, 18), which are sections where low-temperature fluid flows, are directly affected by the first fluid channel (14), which is a section where high-temperature fluid flows.

[0069] Referring to FIG. 6, it can be seen that when fluid piping (26) is applied, the blue area is relatively widely distributed in the region where the second and third fluid channels (16, 18) are arranged. This means that the second and third fluid channels (16, 18), which are sections where low-temperature fluid flows, are indirectly affected by the first fluid channel (14), which is a section where high-temperature fluid flows, thereby reducing the temperature change. In fact, temperature simulation results confirmed that the inlet and outlet temperature difference of the first to third fluid channels (14, 16, 18) is reduced to 0.5 to 4°C.

[0070] Although the present invention has been described above with reference to specific embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims. Explanation of the symbols

[0071] 10: Manifold plate 12: Fluid inlet 14: First fluid path 16: Second fluid path 18: Third fluid path 20: Water-cooled condenser 21: 1st Inlet 22: 1st Discharge 23: Second inlet 24: Second outlet 26: Fluid piping 28: Air insulation layer 30: 1st expansion valve 40: 1st directional control valve 50: Second directional control valve 60: Chiller 61: 1st Inlet 62: 1st Discharge 63: Second inlet 64: Second outlet 70: Second expansion valve

Claims

Claim 1 A manifold plate having a fluid passage formed therein; and a heat exchanger coupled to the manifold plate and heat-exchanging a first fluid and a second fluid, wherein the heat exchanger is provided with a first inlet end for the first fluid to be introduced, a first outlet end for the first fluid to be discharged, a second inlet end for the second fluid to be introduced, and a second outlet end for the second fluid to be discharged, wherein the first inlet end and the first outlet end of the heat exchanger are connected to communicate with the fluid passage, and either the first inlet end or the first outlet end is directly connected to the manifold plate and the other is connected to a fluid pipe. Claim 2 In claim 1, the fluid piping has one end connected to the first inlet or first outlet and the other end connected to the manifold plate and communicating with the fluid flow path, forming a manifold fluid module. Claim 3 In claim 1, the temperature of the first fluid flowing through the fluid piping and the temperature of the first fluid flowing through the fluid path are different in the manifold fluid module. Claim 4 In claim 1, the fluid passages are formed in plurality on the manifold plate, and each fluid passage has a different temperature in the manifold fluid module. Claim 5 In paragraph 4, the manifold fluid module in which the temperature of the fluid path adjacent to the fluid pipe among the plurality of fluid paths is the lowest. Claim 6 In paragraph 4, the manifold fluid module in which the temperature of the fluid path adjacent to the fluid pipe among the plurality of fluid paths is the highest. Claim 7 In paragraph 1, the heat exchanger is a manifold fluid module that is a water-cooled condenser or chiller. Claim 8 In claim 1, the heat exchanger is composed of a plurality of units, and the manifold fluid module includes a water-cooled condenser and a chiller. Claim 9 In claim 8, the water-cooled condenser is positioned vertically on the manifold plate, and the chiller is positioned horizontally on the manifold plate in a manifold fluid module. Claim 10 In claim 8, the water-cooled condenser is disposed on one side of the manifold plate, and the chiller is disposed on the side of the water-cooled condenser in a manifold fluid module. Claim 11 A manifold fluid module according to claim 8, further comprising: a first expansion valve for expanding a first fluid flowing into the water-cooled condenser; and a second expansion valve for expanding a first fluid flowing into the chiller, wherein the first expansion valve is positioned above the water-cooled condenser and the second expansion valve is positioned above the chiller, so that the first fluid flowing into the water-cooled condenser and the chiller moves from the top to the bottom. Claim 12 In claim 11, the invention further comprises a first directional control valve and a second directional control valve for controlling the direction of a first fluid discharged from the water-cooled condenser, wherein the first directional control valve and the second directional control valve are a manifold fluid module disposed above the water-cooled condenser. Claim 13 A manifold fluid module according to claim 12, wherein the first expansion valve, the first directional valve, and the second directional valve are positioned on the upper side of the manifold plate, the water-cooled condenser is positioned on one side of the lower side of the manifold plate, and the chiller and the second expansion valve are positioned on the other side of the lower side of the manifold plate. Claim 14 A manifold fluid module comprising: a manifold plate having a fluid passage formed therein; a heat exchanger coupled to the manifold plate and heat-exchanging a first fluid and a second fluid, the heat exchanger having a first inlet end for the first fluid to be introduced, a first outlet end for the first fluid to be discharged, a second inlet end for the second fluid to be introduced, and a second outlet end for the second fluid to be discharged; and a heat interference prevention member for preventing the first fluid introduced or discharged through the first inlet end or the first outlet end of the heat exchanger from having thermal interference with the fluid passage. Claim 15 In claim 14, the thermal interference prevention part is a manifold fluid module having an air insulation layer spaced apart from the fluid path at a constant distance.

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