Semiconductor harmful gas removal device for individual exhaust pipe installation
Patent Information
- Authority / Receiving Office
- KR · KR
- Patent Type
- Patents
- Current Assignee / Owner
- NIWIN
- Filing Date
- 2023-04-25
- Publication Date
- 2026-08-03
Smart Images

Figure 112025142802402-PAT00009_ABST
Abstract
Description
Technology Field
[0001] The present invention relates to a semiconductor harmful gas removal device for individual exhaust pipe installation that is effective in space efficiency through its compact size and is individually installed on each exhaust pipe, while being capable of separating and discharging a preset specific gas from semiconductor harmful gases. Background Technology
[0002] If we look at existing devices designed to remove isopropyl alcohol (IPA) components from gases emitted during semiconductor processes,
[0003] The discharged gas flows into a scrubber and passes through water and packing material to be discharged as gas from which isopropyl alcohol (IPA) has been removed. At this time, the packing material that combines water and isopropyl alcohol (IPA) gas is used in a single shape, and the interior of the scrubber is configured in a single or multi-stage form.
[0004] In other words, since the technology involves dissolving isopropyl alcohol (IPA) in water to allow it to fall to the bottom for removal, a multi-stage device was required, and it was inefficient because only one type of filler was used.
[0005] In addition, since the aforementioned harmful gas removal device has a structure that collects and processes exhaust gases collectively, there was also a problem requiring a separate, large installation space.
[0006] Attached below is a patent document regarding a scrubber system used in semiconductor processes as prior art. Prior art literature
[0007] Korean Patent Publication No. 10-0303989 (Registered July 16, 2001) The problem to be solved
[0008] The present invention has been devised to solve the aforementioned problems. The objective of the present invention is to provide a semiconductor hazardous gas removal device for individual exhaust pipe installation that enables the easy and convenient separation and discharge of specific mixed gases in semiconductor processing gases subject to environmental regulations. By utilizing various types of packing materials and filters configured in diverse forms to increase removal efficiency and installing the device individually on each hazardous gas exhaust pipe, the invention not only eliminates the reduction in space efficiency and installation constraints previously caused by the need for large installation spaces, but also reduces operating costs by using less water compared to existing methods.
[0009] Other objects and advantages of the present invention will be described below and will be known from the embodiments of the present invention. Additionally, the objects and advantages of the present invention may be realized by means and combinations set forth in the claims. means of solving the problem
[0010] As a means to solve the problem according to the present invention,
[0011] It is individually installed on each of the multiple exhaust pipes emitting hazardous gases during the semiconductor process, and separates a preset gas from the hazardous gas before discharging it.
[0012] A case (10) having an inlet (11) for mixed gas on one side and an outlet (12) on the other side;
[0013] A plurality of pre-spraying units (20) are installed on the inner wall of the inlet (11) side of the above case (10) to spray water and air into harmful gas in a spray form;
[0014] A cartridge filling part (30) that is detachably installed in a cartridge manner at the rear end of the pre-injection part (20) inside the case (10), so that as harmful gas containing water passes through the interior, the isopropyl alcohol (IPA) component inside the harmful gas falls and separates along with the water to the inner bottom of the case (10);
[0015] It is characterized by having . Effects of the invention
[0016] As examined above, the present invention has the effect of being a compact device that uses a significantly smaller installation space compared to existing devices while maintaining the same removal efficiency.
[0017] In addition, the present invention has the effect of increasing the isopropyl alcohol (IPA) removal efficiency by using various fillers and filters.
[0018] In addition, the present invention has the effect of allowing the internal structure to be configured and changed in various forms, materials, and numbers according to the user's embodiment.
[0019] In addition, the present invention has the effect of maximizing the dissolution efficiency of isopropyl alcohol (IPA) gas and water (fluid) by using a combination of various types of fillers and filters having a certain permeability.
[0020] In addition, the present invention is configured with piping identical to that of a harmful gas exhaust pipe, thereby having the effect of minimizing the installation space. Brief explanation of the drawing
[0021] FIG. 1 is a drawing of an embodiment showing the internal structure of the present invention. FIG. 2 is a drawing of an embodiment showing the case where the present invention has a square tubular structure. FIG. 3 is a drawing of an embodiment showing the case where the present invention has a circular tubular structure. FIG. 4 is a drawing of an embodiment showing the installation form of the present invention. FIG. 5 is a drawing of an embodiment showing the present invention being individually installed on each exhaust pipe. FIG. 6 is a drawing of an embodiment showing the types of filler and filter according to the present invention. FIG. 7 is a drawing of an embodiment showing various internal arrangement structures of the cartridge filler section according to the present invention. FIG. 8 is a graph showing the results of the isopropyl alcohol (IPA) concentration reduction effect according to the present invention. Specific details for implementing the invention
[0022] Before describing various embodiments of the present invention in detail, it will be understood that the application is not limited to the details of the configuration and arrangement of components described in the following detailed description or illustrated in the drawings. The present invention may be embodied and practiced in other embodiments and may be carried out in various ways. Furthermore, it will be understood that the expressions and terms used herein regarding device or element orientations (e.g., "front," "back," "up," "down," "top," "bottom," "left," "right," "lateral") are used merely to simplify the description of the present invention and do not indicate or imply that the related device or element must simply have a specific orientation. Additionally, terms such as "first" and "second" are used in this and the appended claims for illustrative purposes and are not intended to indicate or imply relative importance or intent.
[0023] The present invention has the following features to achieve the above objective.
[0024] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. Prior to this, terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings. Instead, based on the principle that the inventor can appropriately define the concepts of terms to best describe his invention, they should be interpreted in a meaning and concept consistent with the technical spirit of the present invention.
[0025] Therefore, it should be understood that the embodiments described in this specification and the configurations illustrated in the drawings are merely the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention, and that various equivalents and modifications that can replace them may exist at the time of filing this application.
[0027] Hereinafter, a semiconductor harmful gas removal device (100) for individual exhaust pipe installation according to a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 8.
[0028] A semiconductor harmful gas removal device (100) for individual exhaust pipe installation according to the present invention is individually installed for each of the multiple exhaust pipes that discharge harmful gas during a semiconductor process, and separates a preset gas from the harmful gas and discharges it, and includes a case (10), a pre-injection part (20), a cartridge filling part (30), a drop-inducing separator plate (40), a droplet separation mesh (50), and a backflow plate (60).
[0031] The above case (10) has a mixed gas inlet (11) formed on one side and an outlet (12) formed on the other side, and a drain portion (13) formed on the bottom surface of the outlet (12). Although it is illustrated as a square tube shape with a hollow interior, it can be changed in various ways, such as a circular tube shape, depending on the user's embodiment.
[0032] In addition, this case (10) is configured to be installed in the same pipe shape as the individual exhaust pipe from which harmful gas is discharged, thereby enabling the minimization of the installation space.
[0033] This case (10) can be configured in a first installation form having a structure that is detachable from the harmful gas exhaust pipe with both ends in the form of flanges, or in a second installation form in which the cartridge filling part (30) described later is formed integrally with the harmful gas exhaust pipe and then the entire cartridge filling part (30) is detached and replaced, or only some of the multiple filling materials inside the cartridge filling part (30) are selectively replaced in the cartridge filling part (30). Of course, in order to detach the cartridge filling part (30) from the case (10), an opening / closing part (14) that can be opened and closed must be installed on the upper part of the case (10).
[0035] The above pre-spraying unit (20) is installed in multiple places on the inner wall of the inlet (11) side of the case (10) and is a spraying unit that sprays water and air in the form of a spray onto harmful gas.
[0036] This pre-spraying unit (20) generally sprays a mixture of water and air into the case (10), but if acid or alkali is to be removed along with isopropyl alcohol (IPA) in the harmful gas, a neutralizing agent may be further mixed with the water and air and sprayed. Depending on the user's embodiment, water and air may be sprayed toward the harmful gas entering through the inlet (11) inside the case (10), and a separate additional spraying unit may be installed on the inner wall of the case (10) where the inlet (11) is formed to spray into the inside of the case (10) and the bottom, so that a mixture of neutralizing agent + water + air is sprayed.
[0037] Of course, as a result, the inner bottom of the case (10) is filled to a certain level with water sprayed through the pre-spraying section (20) or the additional spraying section, and the water and isopropyl alcohol (IPA) that fell through the cartridge filling section (30) are further dissolved in the water on the inner bottom of the case (10) and discharged to the outside through the bottom drain section (13) of the case (10).
[0039] The above cartridge filling part (30) is installed so as to be detachably attached in a cartridge manner at the rear end of the pre-injection part (20) inside the case (10), and is an isopropyl alcohol (IPA) separation device that allows harmful gas containing water to pass through the interior, and causes the isopropyl alcohol (IPA) component inside the harmful gas to fall and separate to the bottom of the case (10) together with the water. As can be seen from the usage result table shown in the drawing, the present invention enables the concentration of isopropyl alcohol (IPA) gas in the harmful gas to be reduced from 3000 or 3000 or higher to 100 ppm or less within 50 seconds.
[0040] The above-mentioned cartridge filling material part (30) is in the form of a tubular body (31) with a plurality of perforated holes formed on its outer surface (the perforated holes must be formed so that harmful gases can pass through to the front and rear, and the perforated holes must also be formed on the bottom surface so that the isopropyl alcohol (IPA) of the harmful gas passing through the interior can fall to the bottom surface of the case (10) along with water). Inside this tubular body (31), multiple types of filling materials and filters of different shapes are arranged in a pre-set sequential order according to type to increase the contact area of the exhaust gas, thereby allowing the exhaust gas to pass through multiple types of filling materials and filters sequentially.
[0041] The cartridge filling section (30) above can have a filling material or filter placed in any one of four types facing the direction of harmful gas discharge.
[0042] Case 1: Among multiple types of packing materials and filters, a form in which they are continuously arranged in order from smallest pores to largest pores,
[0043] Case 2: Among multiple types of fillers and filters, they are spaced apart in order from smallest pore size to largest pore size, and a buffer space (S) is formed between them (between fillers, between fillers and filters, between filters, etc., which applies equally to Case 4 below).
[0044] Third case: Among multiple types of packing materials and filters, a form in which they are spaced out and continuously arranged in order from largest pores to smallest pores,
[0045] Fourth case: Among the various types of fillers and filters, they are spaced apart from each other in order from the largest pore size to the smallest pore size, and a buffer space (S) of empty space is formed between them.
[0046] The filler used here includes a first filler (F1) in the shape of a rhombus made of PP (Polypropylene) with a pore size of 2 mm and a second filler (F2) in the shape of a compression spring made of PFA (Perfluoroalkoxy) with a pore size of 80 μm, and the filter used is a third filter (F3) made of PTFE (Polytetrafluoroethylene) with a pore size of 1 mm. Of course, if the pore sizes and shapes of the multiple fillers and filters differ from one another, the types used can be varied according to the user's embodiment, and the number and types of fillers or filters used can also be changed. Various changes in usage are possible, such as using multiple types of fillers without using filters, or using multiple types of filters without using fillers.
[0047] In addition, the aforementioned buffer space (S) is intended to compensate for pressure loss caused by the internal pressure dropping as harmful gas passes through multiple types of fillers and filters. The buffer space (S) may be connected to the outside of the case (10) so that wind can be injected, and although the buffer space (S) is formed between each filler (in the order of filler-buffer space (S)-filler-buffer space (S)) as in the second and fourth cases, it may also be formed at various locations inside the cartridge filler section (30) (e.g., in the order of filler-filler-buffer space (S)-filler-filler).
[0048] In addition, depending on various embodiments of the user, in addition to installing only one of these cartridge filling parts (30) inside the case (10), multiple such parts may be installed in succession, such as two or three.
[0050] The above-mentioned drop-inducing separator plate (40) (Water drop plate) is in the form of a plate and is installed at the rear end of the cartridge filling section (30) inside the case (10). It is installed upright on the upper part of the inner wall of the case (10) and is a partition plate that vertically blocks about half the diameter of the case (10) from the top to the bottom of the case (10).
[0051] This drop-inducing separator (40) is a plate for inducing the liquefaction of mist by causing the mist-shaped moisture containing isopropyl alcohol (IPA) in the harmful gas to fall as it collides with the harmful gas moving toward the outlet (12) in the form of mist (water mixed with the harmful gas and moving).
[0053] The above-mentioned droplet separation mesh (50) (Mist Catch Mesh) is a mesh having 1 μm pores (transmittance 98%) that is installed in front of the outlet (12) inside the aforementioned case (10) with the same diameter as the outlet (12), and prevents mist-shaped moisture containing isopropyl alcohol (IPA) in the harmful gas that is not separated by the cartridge filling material part (30) and the drop-inducing separator plate (40) installed at the rear end of the cartridge filling material part (30) from being filtered out and discharged to the outside.
[0055] The above backflow plate (60) is horizontally installed at a preset height on the inner wall of a case (10) in which a discharge port (12) is formed, and is a plate that prevents water filled in the inner bottom of the case (10) from flowing back toward the discharge port (12) due to a cyclone phenomenon occurring around the drain portion (13) of the bottom of the case (10).
[0058] In addition, the semiconductor harmful gas removal device (100) for individual exhaust pipe installation of the present invention has the above-mentioned structure
[0059] A pipe leak sensor (71) can be installed at each of the inlet (11), outlet (12), and drain section (13) to detect whether there is a leak in advance. An auto damper (72) can be installed at the inlet (11) so that the pressure inside the harmful gas removal device (100) (or inside the case (10)) does not drop and can be maintained at a preset pressure value at all times, identical to when harmful gas is introduced. Additionally, a fluorine-coated exhaust pressure control fan (70) can be connected to the rear end of the outlet (12).
[0061] As described above, although the present invention has been explained by limited embodiments and drawings, the present invention is not limited thereto and it is obvious that various modifications and changes are possible within the scope of the technical spirit of the present invention and the equivalent scope of the claims described below by those skilled in the art to which the present invention belongs. Explanation of the symbols
[0062] 10: Case 11: Inlet 12: Outlet 13: Drain section 14: Opening / closing section 20: Pre-injection section 30: Cartridge filling section 31: Pipe body 40: Falling guide separator plate 50: Droplet separation mesh 60: Backflow plate 70: Exhaust pressure regulating fan 71: Leak sensor 72: Auto damper 100: Semiconductor hazardous gas removal device for individual exhaust pipe installation F1: 1st filling section F2: 2nd filling section F3: 3rd filter section S: Buffer space
Claims
Claim 1 A case (10) that is individually installed on each of the multiple exhaust pipes that discharge harmful gases during a semiconductor process, separates a preset gas from the harmful gas and discharges it, and has an inlet (11) for the mixed gas formed on one side and an outlet (12) formed on the other side; and a pre-spray unit (20) that is installed in multiple places on the inner wall of the case (10) on the side of the inlet (11) and sprays water and air into the harmful gas in a spray form. A semiconductor harmful gas removal device for individual exhaust pipe installation, characterized by being provided with: a cartridge filling material part (30) that is detachably installed in a cartridge manner at the rear end of the pre-injection part (20) inside the case (10), so that as harmful gas containing water passes through the interior, the isopropyl alcohol (IPA) component inside the harmful gas falls and separates along with the water to the inner bottom of the case (10); and a backflow plate (60) that is horizontally installed at a preset height on the inner wall of the case (10) where the discharge port (12) is formed, so that the water filling the inner bottom of the case (10) does not flow back toward the discharge port (12) from around the drain part (13) of the bottom of the case (10). Claim 2 A semiconductor harmful gas removal device for individual exhaust pipe installation, characterized in that, in the first paragraph, the pre-injection unit (20) is used to remove acid or alkali in addition to isopropyl alcohol (IPA) in the harmful gas, and a neutralizing agent is further mixed with water and air and injected. Claim 3 A semiconductor harmful gas removal device for individual exhaust pipe installation according to claim 1, characterized in that the inner bottom of the case (10) is filled to a certain level with water sprayed through the pre-spraying part (20) or the additional spraying part, and isopropyl alcohol (IPA) that has fallen with water through the cartridge filling part (30) is further dissolved in the water on the inner bottom of the case (10) and discharged to the outside through the bottom drain part (13) of the case (10). Claim 4 A semiconductor harmful gas removal device for individual exhaust pipe installation, characterized in that, in the first paragraph, the cartridge filling material part (30) has a tubular body (31) with a plurality of perforated holes formed on its outer surface, and a plurality of types of filling materials and filters having different shapes or pore sizes are arranged inside in a predetermined sequential order to increase the contact area of the exhaust gas, thereby allowing the exhaust gas to pass through the plurality of types of filling materials and filters sequentially. Claim 5 In claim 1 or 2, the cartridge filling material portion (30) is configured in any one of the following cases: a first case in which a plurality of types of filling materials and filters are arranged continuously in order from small pores to large pores among a plurality of types of filling materials and filters facing the direction of harmful gas discharge; a second case in which a plurality of types of filling materials and filters are arranged spaced apart in order from small pores to large pores, with a buffer space (S) of empty space formed between them; a third case in which a plurality of types of filling materials and filters are arranged spaced continuously in order from large pores to small pores among a plurality of types of filling materials and filters, with a buffer space (S) of empty space formed between them; and the filling material comprises a first filling material (F1) in the shape of a rhombus having a pore size of 2 mm made of PP (Polypropylene). A semiconductor harmful gas removal device for individual exhaust pipe installation, characterized in that a second filler (F2) in the form of a compression spring having a pore size of 80㎛ made of PFA (Perfluoroalkoxy) material is used, and a third filter (F3) having a pore size of 1mm made of PTFE (Polytetrafluoroethylene) material is used as the filter. Claim 6 In claim 5, the above buffer space (S) is intended to compensate for pressure loss caused by the internal pressure dropping as harmful gas passes through a plurality of types of fillers and filters, and the above buffer space (S) is connected to allow a bladeless windless fan to communicate with the outside of the case (10), thereby injecting wind into the semiconductor harmful gas removal device for individual exhaust pipe installation. Claim 7 A semiconductor harmful gas removal device for individual exhaust pipe installation, characterized in that, in claim 1, a drop-inducing separator plate (40) is installed at the rear end of the cartridge filling material part (30) inside the case (10) and is installed upright on the upper part of the inner wall of the case (10) so that harmful gas moving toward the discharge port (12) in the form of mist strikes it, causing moisture in the form of mist containing isopropyl alcohol (IPA) in the harmful gas to fall, thereby inducing the liquefaction of the mist. Claim 8 A semiconductor harmful gas removal device for individual exhaust pipe installation, characterized in that, in claim 1 or 7, a droplet separation mesh (50) is installed in front of the discharge port (12) inside the case (10) with the same diameter as the discharge port (12), and prevents mist-shaped moisture containing isopropyl alcohol (IPA) in the harmful gas that is not separated by the cartridge filling material part (30) and the drop-inducing separator plate (40) installed at the rear end of the cartridge filling material part (30) from being filtered out and discharged to the outside. Claim 9 A semiconductor harmful gas removal device for individual exhaust pipe installation, characterized in that, in claim 1, a pipe leak sensor (71) installed at each of the inlet (11), outlet (12), and drain section (13) of the case (10) to detect whether there is a leak in advance; an auto damper (72) installed on the side of the inlet (11) to maintain the pressure inside the case (10) at a preset pressure value identical to that when harmful gas is introduced, without the pressure dropping; and an exhaust pressure regulating fan (70) installed at the rear end of the outlet (12). Claim 10 delete