Semiconductor harmful gas removal device for individual exhaust pipe installation

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The compact semiconductor gas removal device addresses space inefficiency and high costs by using diverse packing materials and filters on each exhaust pipe, achieving efficient IPA removal with minimal space and cost.

KR102999041B1Active Publication Date: 2026-08-03NIWIN

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Patent Information

Application Number: KR1020230053918
Authority / Receiving Office: KR · KR
Patent Type: Patents
Current Assignee / Owner
Filing Date: 2023-04-25
Publication Date: 2026-08-03
Estimated Expiration: 2043-04-25

Application Information

Patent Timeline

25 Apr 2023

Application

KR1020230053918

03 Aug 2026

Publication

KR102999041B1

IPC: B01D47/06; B01D53/14; B01D53/75; B01D53/78

CPC: B01D47/06; B01D53/1431; B01D53/1456; B01D53/1487; B01D53/75; B01D53/78; B01D2258/0216

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Application Domain

Gas treatment Using liquid separation agent

Technology Topics

Process engineering Environmental engineering

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AI Technical Summary

Technical Problem

Existing semiconductor gas removal devices require large installation spaces and are inefficient due to the use of a single type of filler and a single-stage configuration, leading to reduced space efficiency and increased operating costs.

Method used

A compact semiconductor gas removal device is individually installed on each exhaust pipe, utilizing various types of packing materials and filters in diverse configurations to enhance removal efficiency, minimizing installation space and water usage.

Benefits of technology

The device achieves high isopropyl alcohol (IPA) removal efficiency with reduced installation space and operating costs by using multiple types of fillers and filters, minimizing IPA concentration to 100 ppm within 50 seconds.

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Abstract

The present invention relates to a semiconductor hazardous gas removal device for individual exhaust pipe installation, and more specifically, to a device capable of removing specific gas components of a preset type from hazardous gases generated during a semiconductor process. It comprises a filling section formed with multiple types of filling materials and filters arranged and configured in various forms, and a cartridge-type filling section that can be easily detached and replaced, thereby increasing the removal efficiency of isopropyl alcohol (IPA). Furthermore, the device is installed individually in the form of a pipe for each hazardous gas exhaust pipe, thereby providing a compact structure that eliminates installation space constraints compared to conventional devices.

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