Thermoelectric module, manufacturing method thereof and thermoelectric apparatus including the same

Abstract

As a technical means for achieving the aforementioned technical problem, according to one aspect of the present invention, a thermoelectric module comprises a lower substrate, a lower electrode on the lower substrate, a thermoelectric semiconductor on the lower electrode, an upper electrode on the thermoelectric semiconductor, and an upper substrate on the upper electrode, wherein the upper substrate and the lower substrate comprise a flexible material.

Description

Technology Field

[0001] The present invention relates to a thermoelectric module, a method for manufacturing the same, and a thermoelectric device including the same, and more specifically, to a thermoelectric module with improved reliability, a method for manufacturing the same, and a thermoelectric device including the same. Background Technology

[0002] Thermoelectric devices are devices utilizing thermoelectric materials that possess thermoelectric properties, which are a reversible energy conversion phenomenon between heat and electricity. There are thermoelectric devices utilizing the Seebeck effect to generate electricity from heat, and thermoelectric devices utilizing the Peltier effect to perform cooling or heating by converting electricity into heat.

[0003] A thermoelectric element consists of a thermoelectric semiconductor classified into N-type and P-type and electrodes connected to both ends of the thermoelectric semiconductor. Specifically, an N-type thermoelectric semiconductor and a P-type thermoelectric semiconductor are interconnected through electrodes to form a PN element.

[0004] The thermoelectric elements described above can be sealed to minimize the penetration of external dust and moisture. For example, the thermoelectric elements can be placed between an upper substrate and a lower substrate made of insulating ceramic material, and the edges of the upper and lower substrates can be sealed with insulating resin or the like, thereby modularizing the thermoelectric elements; furthermore, wiring is configured to be exposed to the outside of the thermoelectric module for electrical connection between the thermoelectric elements and external power.

[0005] However, as thermoelectric modules are used for extended periods, the insulating resin sealing the upper and lower substrates may detach. In particular, when used for a long time in high-temperature environments, thermal stress caused by the difference in thermal expansion coefficients between the insulating resin and the ceramic substrate can lead to the bonding between the resin and the substrate separating. If the bonding between the insulating resin and the substrate detaches, external moisture can penetrate and corrode the thermoelectric semiconductor, causing a rapid decline in the reliability of the thermoelectric module.

[0006] In addition, since the upper and lower substrates are made of rigid ceramic material, the thermoelectric module is inevitably formed in the shape of a rigid structure; therefore, when the thermoelectric module is used to cool a curved component, insufficient thermal contact between the thermoelectric module and the curved component may result in a problem of reduced cooling efficiency.

[0007] In addition, to interconnect multiple thermoelectric modules, the wiring of one thermoelectric module must be electrically connected to the wiring of another thermoelectric module; however, the wiring connection process can be cumbersome and complex, and if the connection is not smooth, sparks may occur, leading to various additional problems such as exposure to the risk of fire.

[0008] Accordingly, there is a need for technological development of thermoelectric modules that can be easily applied in various environments and provide excellent reliability.

[0009] Meanwhile, the aforementioned background technology is technical information that the inventor possessed for the derivation of the present invention or acquired during the process of deriving the present invention, and it cannot be considered as prior art disclosed to the general public prior to the filing of the present invention. Prior art literature

[0010] Korean Published Patent No. 2021-0017784 “Thermoelectric device” The problem to be solved

[0012] One embodiment of the present invention aims to provide a thermoelectric module with improved reliability by efficiently sealing a thermoelectric element, a method for manufacturing the same, and a thermoelectric device including the same.

[0013] Another embodiment of the present invention aims to provide a thermoelectric module that can be easily used in various environments, a method for manufacturing the same, and a thermoelectric device including the same. means of solving the problem

[0014] As a technical means for achieving the aforementioned technical problem, according to one aspect of the present invention, a thermoelectric module comprises a lower substrate, a lower electrode on the lower substrate, a thermoelectric semiconductor on the lower electrode, an upper electrode on the thermoelectric semiconductor, and an upper substrate on the upper electrode, wherein the upper substrate and the lower substrate comprise a flexible material.

[0015] According to another aspect of the present invention, the thermoelectric semiconductor is disposed in an element region of the lower substrate, and the upper substrate and the lower substrate may be bonded to each other in a peripheral region surrounding the element region.

[0016] According to another aspect of the present invention, a wiring portion may be further included that is connected to at least one of the lower electrode or the upper electrode and extends to the surrounding area.

[0017] According to another aspect of the present invention, the wiring portion is a flexible plate-shaped wiring portion connected to the lower electrode or the upper electrode, and can be exposed to the outside by passing through the joint portion of the upper substrate and the lower substrate.

[0018] According to another aspect of the present invention, the externally exposed portion of the plate-shaped wiring portion may be coated with an insulating layer.

[0019] According to another aspect of the present invention, the wiring portion is a wire wiring connected to the lower electrode or the upper electrode, and may be exposed to the outside through the joint portion of the upper substrate and the lower substrate.

[0020] According to another aspect of the present invention, the externally exposed portion of the wire wiring can be inserted into an insulating tube.

[0021] According to another aspect of the present invention, the lower substrate and the upper substrate may be FPCBs.

[0022] As a technical means for achieving the aforementioned technical problem, according to another aspect of the present invention, a method for manufacturing a thermoelectric module of the present invention comprises the steps of: placing a lower electrode on a lower substrate made of a flexible material; placing a thermoelectric semiconductor on the lower electrode; placing an upper electrode electrically connected to the thermoelectric semiconductor and an upper substrate facing the lower substrate; and joining the upper substrate and the lower substrate in a peripheral region surrounding a device region where the thermoelectric semiconductor is placed.

[0023] According to another aspect of the present invention, the step of joining the upper substrate and the lower substrate may include joining the upper surface of the lower substrate and the lower surface of the upper substrate through thermal fusion.

[0024] According to another aspect of the present invention, the step of joining the upper surface of the lower substrate and the lower surface of the upper substrate through the heat fusion can be performed in a vacuum.

[0025] According to another aspect of the present invention, the step of bonding the upper substrate and the lower substrate may include the step of placing an adhesive member on the lower surface of the upper substrate or on the upper surface of the lower substrate, and the step of bonding the lower surface of the upper substrate to the upper surface of the lower substrate.

[0026] As a technical means for achieving the technical problem described above, according to another aspect of the present invention, the thermoelectric device of the present invention comprises a lower substrate and a plurality of thermoelectric modules disposed on the lower substrate and each physically separated thereof, wherein the plurality of thermoelectric modules share one lower substrate, and each of the plurality of thermoelectric modules comprises a lower electrode on the lower substrate, a thermoelectric semiconductor on the lower electrode, an upper electrode on the thermoelectric semiconductor, and an upper substrate on the upper electrode.

[0027] According to another aspect of the present invention, a connecting electrode configured to interconnect adjacent lower electrodes among the lower electrodes of each of the plurality of thermoelectric modules may be further included.

[0028] According to another aspect of the present invention, the connecting electrode may be disposed on the same plane as the lower electrode.

[0029] According to another aspect of the present invention, the lower substrate includes a device region in which the thermoelectric semiconductor of each of the plurality of thermoelectric modules is disposed and a peripheral region surrounding the device region, and a portion of the upper substrate of each of the thermoelectric modules may be directly bonded to the lower substrate in the peripheral region. Effects of the invention

[0030] According to any one of the means for solving the problem of the present invention described above, the thermoelectric module of the present invention, the method for manufacturing the same, and the thermoelectric device including the same include a flexible upper substrate and a lower substrate, so that they can be flexibly applied to a device having a curved surface.

[0031] According to any one of the means for solving the problem of the present invention described above, the thermoelectric module of the present invention, the method for manufacturing the same, and the thermoelectric device including the same have an upper substrate and a lower substrate directly bonded in the surrounding area, so a sealing structure can be omitted, and the problem of sealing separation caused by the difference in thermal expansion coefficients between the sealing structure and the upper and lower substrates can be freed, and the lifespan and reliability of the thermoelectric module can be further improved.

[0032] According to any one of the means for solving the problem of the present invention described above, the thermoelectric module, the method for manufacturing the same, and the thermoelectric device including the same of the present invention seal the thermoelectric element in a manner in which a flexible upper substrate and a lower substrate are in direct contact. Therefore, even if there is a difference in the degree of thermal expansion between the upper substrate and the lower substrate, thermal stress can be relieved due to the flexibility of the upper substrate and the lower substrate, and the problem of the adhesion between the upper substrate and the lower substrate detaching can be minimized. Accordingly, the lifespan and reliability of the thermoelectric module can be improved.

[0033] According to any one of the means for solving the problem of the present invention described above, the thermoelectric device of the present invention is configured such that a plurality of thermoelectric modules share a single lower substrate, and since the lower substrate is composed of an FPCB, a plurality of standardized thermoelectric modules can be easily electrically connected to each other, and accordingly, there is an advantage that the thermoelectric device can be optimized and applied to various environments.

[0034] The effects obtainable from the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below. Brief explanation of the drawing

[0035] FIG. 1 is a schematic perspective view of a thermoelectric module according to one embodiment of the present invention. Figure 2 is a cross-sectional view according to II-II' of Figure 1. FIGS. 3a to 3c are cross-sectional views illustrating a method for manufacturing a thermoelectric module according to an embodiment of the present invention. FIG. 4 is a schematic perspective view for explaining a thermoelectric device including a thermoelectric module according to one embodiment of the present invention. Figure 5 is an exploded plan view of V-V' of Figure 4. FIG. 6 is a schematic perspective view for explaining a thermoelectric device according to another embodiment of the present invention. Specific details for implementing the invention

[0036] Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement the invention. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present invention in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification are denoted by similar reference numerals.

[0037] Throughout the specification, when a part is described as being "connected" to another part, this includes not only cases where they are "directly connected," but also cases where they are "indirectly connected" with other members or elements interposed between them. Furthermore, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0038] The present invention will be described in detail below with reference to the attached drawings.

[0039] FIG. 1 is a schematic perspective view of a thermoelectric module according to one embodiment of the present invention.

[0040] Figure 2 is a cross-sectional view according to II-II' of Figure 1.

[0041] Referring to FIGS. 1 and 2, the present invention relates to a thermoelectric module (100) and a thermoelectric device including the same. The thermoelectric module (100) of the present invention is an electronic module including a thermoelectric element (TD), and refers to an electronic module that uses the Seebeck effect, which converts thermal energy into electrical energy, or the Peltier effect, which converts electrical energy into thermal energy. For convenience of explanation, the present specification focuses on a thermoelectric module (100) that uses the Peltier effect of the thermoelectric element (TD). However, the thermoelectric module (100) of the present invention is not limited thereto and may be used as a thermoelectric module (100) that uses the Seebeck effect of the thermoelectric element (TD).

[0042] The thermoelectric module (100) of the present invention includes a lower substrate (110), an upper substrate (150), and a thermoelectric element (TD).

[0043] The lower substrate (110) is a substrate that supports a thermoelectric element (TD), is formed in a plate shape where the thermoelectric element (TD) can be placed, and may be composed of an insulator. Additionally, the lower substrate (100) may be composed of a material with excellent thermal conductivity so that heat generated or absorbed by the thermoelectric element (TD) can be effectively transferred or introduced to the outside.

[0044] The lower substrate (110) has flexibility. For example, the lower substrate (100) may be composed of a flexible plastic material and may be made of a polymer material such as polyimide (PI), polyethersulfone (PES), polyetherimide (PEI), polyacrylate, polyethylene naphtalate (PEN), polyethylene terepthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), cellulose acetate propionate (CAP), cyclic olefin polymer, or cyclic olefin copolymer. It can be formed into a single-layer or multi-layer structure including the aforementioned material.

[0045] The lower substrate (110) includes a device region (CA) where a thermoelectric element (TD) is placed and a peripheral region (PA) excluding the device region (CA). For example, the device region (CA) may be a region located in the central part of the lower substrate (100), and the peripheral region (PA) may be a border region surrounding the device region (CA). However, it is not limited thereto, and the device region (CA) and the peripheral region (PA) may be defined in various ways depending on the placement design of the thermoelectric element (TD).

[0046] The shape of the lower substrate (110) is not particularly limited. For example, as shown in FIG. 1, the lower substrate (110) may be configured as a rectangular plate. However, it is not limited thereto, and the lower substrate (110) may be configured as a plate having various shapes of surfaces such as polygons, circles, and ellipses.

[0047] A thermoelectric element (TD) is placed in the element region (CA) of the lower substrate (110). Specifically, as shown in FIG. 1, a plurality of thermoelectric elements (TD) may be placed on the lower substrate (100) and arranged at regular intervals to form an array. The plurality of thermoelectric elements (TD) may be electrically connected to each other and may be controlled to operate as a single element by interlocking with each other.

[0048] As shown in FIG. 2, the thermoelectric element (TD) includes a lower electrode (120), a thermoelectric semiconductor (131, 132), and an upper electrode (140). The thermoelectric elements (TD1, TD2) can be classified into an N-type thermoelectric element (TD1) and a P-type thermoelectric element (TD2) depending on the type of thermoelectric semiconductor (131, 132). For example, the lower electrode (120), the N-type thermoelectric semiconductor (131), and the upper electrode (140) constitute the N-type thermoelectric element (TD1), and the lower electrode (120), the P-type thermoelectric semiconductor (132), and the upper electrode (140) constitute the P-type thermoelectric element (TD2).

[0049] The lower electrode (120) is disposed on the lower substrate (110). The lower electrode (120) may be composed of a plurality of conductive patterns and may be disposed at regular intervals on the lower substrate (110) to form an array of lower electrodes (120).

[0050] The lower electrode (120) may be composed of a conductive material and is electrically connected to the lower surface of the thermoelectric semiconductor (131, 132). The lower electrode (120) may be electrically connected to two or more thermoelectric semiconductors (131, 132). For example, one end of the lower electrode (120) may be connected to an N-type thermoelectric semiconductor (131), and the other end may be connected to a P-type thermoelectric semiconductor (132) adjacent to the N-type thermoelectric semiconductor (131).

[0051] The thermoelectric semiconductors (131, 132) may be composed of thermoelectric materials. For example, in the case of the N-type thermoelectric semiconductor (131), it may be formed from a Bi-Te-based thermoelectric material containing bismuth (Bi) and tellurium (Te) as main raw materials. In addition, in the case of the P-type thermoelectric semiconductor (132), it may be formed from a Bi-Te-based thermoelectric material containing at least one of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), Te, Bi, and indium (In). However, it is not limited thereto, and the thermoelectric semiconductors (131, 132) may be formed from various thermoelectric materials such as cobalt (Co)-Sb-based, Pb-Te-based, silicon (Si)-germanium (Ge)-based, iron (Fe)-Si-based, and Sb-Te-based materials.

[0052] The thermoelectric semiconductor (131, 132) may further include various types of additives to improve thermoelectric performance in addition to the thermoelectric material described above.

[0053] The upper electrode (140) is positioned on the upper side of the thermoelectric semiconductor (131, 132) and on the lower side of the upper substrate (150). The upper electrode (140) may be composed of conductive patterns spaced apart at a predetermined interval from the upper side of the thermoelectric semiconductor (131, 132). In this case, a plurality of upper electrode (140) patterns may be spaced apart from each other to form an upper electrode (140) array.

[0054] The upper electrode (140) may be composed of a conductive material similar to the lower electrode (120) and is electrically connected to the upper surface of the thermoelectric semiconductors (131, 132). The upper electrode (140) may be electrically connected to two or more thermoelectric semiconductors (131, 132). For example, one end of the upper electrode (140) may be connected to an N-type thermoelectric semiconductor (131), and the other end may be connected to a P-type thermoelectric semiconductor (132) adjacent to the N-type thermoelectric semiconductor (131).

[0055] Meanwhile, the upper electrode (140) and the lower electrode (120) are configured to connect different thermoelectric semiconductors (131, 132). That is, if the lower electrode (120) electrically connects the first N-type thermoelectric semiconductor (131) and the adjacent first P-type thermoelectric semiconductor (132), the upper electrode (140) can electrically connect the first N-type thermoelectric semiconductor (131) and the adjacent second P-type thermoelectric semiconductor. The N-type thermoelectric semiconductor (131) and the P-type thermoelectric semiconductor (132) are arranged alternately, and through the connection of the lower electrode (120) and the upper electrode (140) described above, the N-type thermoelectric element (TD1) and the P-type thermoelectric element (TD2) can be interconnected in an NPN or PNP format.

[0056] Meanwhile, in some embodiments, the lower electrode (120) may be patterned and printed on the upper surface of the lower substrate (110), and the upper electrode (140) may be patterned and printed on the lower surface of the upper substrate (150). In this case, the lower substrate (110) and the upper substrate (150) may be composed of a Flexible Printed Circuit Board (FPCB) with a conductive pattern printed thereon.

[0057] The upper substrate (150) is a substrate placed on top of the thermoelectric element (TD) and is configured to cover the upper surface of the thermoelectric element (TD).

[0058] The upper substrate (150) has a size larger than the size of the element area (CA) where the thermoelectric element (TD) is placed. For example, the upper substrate (150) may be configured to have substantially the same size as the lower substrate (110). However, it is not limited thereto, and it may be configured to have a size smaller than the size of the lower substrate (110) or a size larger than the size of the lower substrate (110) so as to cover the element area (CA).

[0059] The upper substrate (150) may have substantially the same characteristics as the lower substrate (110). Specifically, the upper substrate (150) may be plate-shaped and may be composed of an insulator. Additionally, the upper substrate (100) may be composed of a material with excellent thermal conductivity.

[0060] The upper substrate (150) has the same flexibility as the lower substrate (110). Accordingly, the upper substrate (150) may be composed of a flexible plastic material, just like the lower substrate (110), and an example thereof is as described above.

[0061] As illustrated in FIG. 2, the upper substrate (150) and the lower substrate (110) are bonded to each other in a peripheral area (PA). Specifically, in the peripheral area (PA), a portion of the lower surface of the upper substrate (150) is bonded to a portion of the upper surface of the lower substrate (110). Since the upper substrate (150) and the lower substrate (110) have flexibility, the upper substrate (150) can be bent downwards and the lower substrate (110) can be bent upwards in the peripheral area (PA). Accordingly, the lower surface of the upper substrate (150) and the upper surface of the lower substrate (110) can come into contact with each other in the peripheral area (PA) and form a bond.

[0062] As described above, since the surrounding region (PA) is configured to surround the device region (CA), the device region (CA) can be sealed due to the adhesive structure of the upper substrate (150) and the lower substrate (110) as the upper substrate (150) and the lower substrate (110) are bonded to each other in the surrounding region (PA).

[0063] Meanwhile, as illustrated in FIG. 1, a wiring portion (170) exposed to the outside is positioned through the joint portion between the upper substrate (150) and the lower substrate (110). The wiring portion (170) is configured to be electrically connected to external power. For example, the wiring portion (170) may be composed of a positive wiring portion connected to the positive electrode of the external power and a negative wiring portion connected to the negative electrode of the external power.

[0064] The wiring portion (170) is electrically connected to at least one of the upper electrode (140) or the lower electrode (120). When the thermoelectric element (TD) is composed of a Peltier element, it can generate or absorb heat based on the current flowing through the wiring portion (170).

[0065] As illustrated in FIG. 1, the wiring portion (170) may be composed of a plate-shaped wiring portion. In this case, the wiring portion (170) may be placed on the same plane as the lower electrode (120) or upper electrode (140) formed on the lower substrate (110) or upper substrate (150).

[0066] To insulate the portion of the wiring portion (170) that is exposed to the outside, the exposed portion may be coated with an insulating layer. For example, at least a portion of the lower substrate (110) or the upper substrate (150) may extend outward beyond the bonding portion, and the wiring portion (170) may be positioned along the extended portion of the lower substrate (110) or the upper substrate (150). Additionally, the exposed portion of the wiring portion (170) may be coated with an insulating layer.

[0067] In this case, since the wiring portion (170) is composed of a plate-shaped wiring having a thin thickness, the step difference caused by the wiring portion (170) can be minimized, and the sealing of the joint portion between the lower substrate (110) and the upper substrate (150) can be made more airtight.

[0068] In some embodiments, the wiring section (170) may be composed of wire wiring, and the exposed portion of the wire wiring may be inserted into an insulating tube. That is, the wire wiring is electrically connected to at least one of the lower electrode (120) or the upper electrode (140) in the device area (CA), and is exposed to the outside by penetrating the joint area of ​​the lower substrate (110) and the upper substrate (150) in the peripheral area (PA). The exposed portion of the wire wiring is inserted into an insulating tube so that unnecessary electrical contact and corrosion caused by moisture that may occur from the outside can be suppressed. In addition, since the insulating tube is configured to wrap only the portion of the wire wiring exposed to the outside by penetrating the joint area, the space caused by the wire wiring at the joint area can be minimized, and the airtightness of the joint area of ​​the lower substrate (110) and the upper substrate (150) can be further improved. In particular, since the wire wiring is thicker than plate wiring, it can be resistant to impact, and the breakage of the wiring section (170) due to external impact can be minimized.

[0069] Meanwhile, the bonding of the lower substrate (110) and the upper substrate (150) can be achieved through thermal fusion. For a more detailed explanation of this, refer to FIGS. 3a to 3c together.

[0070] FIGS. 3a to 3c are cross-sectional views illustrating a method for manufacturing a thermoelectric module according to an embodiment of the present invention.

[0071] Referring to FIG. 3a, first, a lower electrode (120) is placed on a lower substrate (110).

[0072] The lower electrode (120) can be formed on the lower substrate (110) using a conductive material through methods such as printing or deposition, or a pre-manufactured lower electrode (120) can be placed by adhering it to the lower substrate (110).

[0073] Afterwards, a thermoelectric semiconductor (130) is placed on the lower electrode (120).

[0074] For example, a columnar thermoelectric semiconductor (130) may be manufactured using a thermoelectric material, and the thermoelectric semiconductor (130) may be placed on the lower electrode (120) by soldering or welding the thermoelectric semiconductor (130) and the lower electrode (120). However, this is not limited thereto, and the thermoelectric semiconductor (130) may also be placed by directly forming (or growing) the thermoelectric semiconductor (130) on the lower electrode (120) using a thermoelectric material.

[0075] Subsequently, an upper electrode (140) and an upper substrate (150) are placed on the thermoelectric semiconductor (130).

[0076] For example, an upper electrode (140) may be formed on the lower surface of an upper substrate (150) using a conductive material through methods such as printing or deposition, and then the upper electrode (140) and the upper substrate (150) may be placed on the thermoelectric semiconductor (130) by soldering or welding the upper electrode (140) and the thermoelectric semiconductor (130). However, this is not limited thereto, and the upper electrode (140) and the upper substrate (150) may be placed by forming the upper electrode (140) directly on the thermoelectric semiconductor (130) and then attaching the upper substrate (150) to the upper electrode (140).

[0077] Referring to FIG. 3b, an adhesive member (390) may subsequently be placed on the lower surface of the upper substrate (150) or on the upper surface of the lower substrate (110).

[0078] The adhesive member (390) refers to a material configured to increase bonding strength when heat is applied. The adhesive member (390) may be made of a thermoplastic or thermosetting resin, and any material capable of bonding the upper substrate (150) and the lower substrate (120) by heat, such as acrylic, epoxy, or silicone resins, may be used without limitation.

[0079] Since the upper substrate (150) and the lower substrate (110) are joined together in the surrounding area (PA), the adhesive member (390) may be placed only in the surrounding area (PA), and may be placed to cover the entire joining area of ​​the upper substrate (150) and the lower substrate (110), or partially placed to cover only a part of the joining area.

[0080] In some embodiments, the adhesive member (390) may be omitted. That is, when the upper substrate (150) and the lower substrate (110) are made of a thermoplastic or thermosetting polymer that can melt and chemically bond with each other in a high-temperature environment, the upper substrate (150) and the lower substrate (110) may be bonded by thermal fusion without a separate adhesive member (390).

[0081] Referring to FIG. 3c, the upper substrate (150) and the lower substrate (110) are joined.

[0082] The bonding of the upper substrate (150) and the lower substrate (110) can be achieved through thermal fusion. For example, a thermal fusion method applicable to plastic materials can be appropriately selected, such as thermal plate fusion, which uses a heating plate to apply heat to a part of the upper substrate (150) and a part of the lower substrate (110) and induces thermal fusion of the heated part, or vibration or ultrasonic thermal fusion, which vibrates a part of the upper substrate (150) and a part of the lower substrate (110) to generate heat and then induces thermal fusion of the heated part.

[0083] In some embodiments, the bonding of the upper substrate (150) and the lower substrate (110) may be performed in a vacuum atmosphere. In this case, during the bonding process of the upper substrate (150) and the lower substrate (110), the inflow of external dust, gas, or moisture into the device region (CA) can be blocked, so the sealing of the device region (CA) can be performed more stably.

[0084] A joint (WR) is formed by thermal fusion of the upper substrate (150) and the lower substrate (110). The joint (WR) can be formed along the edge of the device region (CA) to surround the device region (CA), and through the joint (WR), the upper substrate (150) and the lower substrate (110) can form a single connected body.

[0085] As described above, the thermoelectric module (100) of the present invention is characterized in that the upper substrate (150) and the lower substrate (110) have flexibility, and such technical features provide an advantage that can further increase the reliability and usability of the thermoelectric module (100).

[0086] Specifically, as the upper substrate (150) and the lower substrate (110) have flexibility, the upper substrate (150) and the lower substrate (110) can be bent and come into direct contact in the surrounding area (PA). As the upper substrate (150) and the lower substrate (110) are directly bonded in the surrounding area (PA), the device area (CA) can be sealed without a separate sealing structure. If the device area (CA) is sealed by a separate sealing structure or by a sealing resin, a problem may occur where the adhesion between the sealing structure and the upper and lower substrates separates. Generally, thermoelectric modules are utilized as cooling elements to cool high-temperature components, or as energy harvesting elements that recycle leaked thermal energy by extracting thermal energy from high-temperature devices and converting it into electrical energy. Accordingly, thermoelectric modules are generally used while exposed to high-temperature environments for a long time. When a thermoelectric module is exposed to a high-temperature environment for a long time, the adhesion between the upper and lower substrates and the sealing structure may detach due to thermal stress caused by the difference in the coefficient of thermal expansion between the upper and lower substrates and the sealing structure. In particular, since one side of the thermoelectric module is exposed to a relatively high-temperature environment and the other side is exposed to a relatively low-temperature environment, the degree of thermal expansion of the upper and lower surfaces of the thermoelectric module differs, and in a general thermoelectric module composed of upper and lower substrates made of hard ceramic or metal materials, damage to the sealing structure can be induced more easily. In contrast, in the case of the thermoelectric module (100) of the present invention, since the upper substrate (150) and the lower substrate (120) are directly bonded, a separate sealing resin or sealing structure is not required, so damage to the sealing structure due to the difference in the coefficient of thermal expansion may not easily occur.In addition, since the upper substrate (150) and lower substrate (120) of the thermoelectric module (100) of the present invention have flexibility, even if the heat applied to the upper substrate (150) and the lower substrate (120) is different and the thermal expansion is different from each other, the bond between the upper substrate (150) and the lower substrate (120) can be stably maintained due to the flexibility, so that the destruction of the sealing structure can be minimized.

[0087] Meanwhile, the thermoelectric module (100) of the present invention can be flexibly applied to various environments because the upper substrate (150) and the lower substrate (120) have flexibility. For example, when a heat dissipation target has a curved surface, a conventional thermoelectric module has a structure in which a thermoelectric element is sealed between rigid upper and lower substrates, so it is difficult to apply to the curved surface, and a thermoelectric module made in a small size must be attached to the curved surface and each thermoelectric module must be connected with wiring. In contrast, the thermoelectric module (100) of the present invention includes a flexible upper substrate (150) and a lower substrate (110), so it can be easily bent compared to a conventional thermoelectric module. Specifically, the upper substrate (150) and the lower substrate (110) can be flexibly bent in the space between the patterned upper electrode (140) and the lower electrode (120). Although the thermoelectric semiconductor (130) has a rigid characteristic that makes it difficult to deform its shape, the bending of the upper substrate (150) and the lower substrate (110) mainly occurs between the spacing of the upper electrode (140) patterns and the spacing of the lower electrode (120) patterns. Therefore, the thermoelectric semiconductor (130) can maintain contact with the lower electrode (120) and the upper electrode (140), and the thermoelectric module (100) can be bent by the bending of the upper substrate (150) and the lower substrate (110) in the spacing between the thermoelectric element (TD) arrays while maintaining the structure of the thermoelectric element (TD). Accordingly, the thermoelectric module (100) of the present invention can flexibly respond to the bent surface compared to a conventional thermoelectric module.

[0088] In addition, since the thermoelectric module (100) of the present invention can have a lower substrate (110) or an upper substrate (150) configured in the form of an FPCB, printing of various wiring patterns can be facilitated, and by utilizing this advantage, it can be made easier to electrically connect a plurality of thermoelectric modules to each other. Refer to FIGS. 4 to 6 for a detailed explanation thereof.

[0089] FIG. 4 is a schematic perspective view for explaining a thermoelectric device including a thermoelectric module according to one embodiment of the present invention.

[0090] Figure 5 is an exploded plan view of V-V' of Figure 4.

[0091] Referring to FIG. 4, the thermoelectric device (10) of the present invention includes a plurality of thermoelectric modules (100, 200, 300).

[0092] Specifically, a first thermoelectric module (100), a second thermoelectric module (200), and a third thermoelectric module (300) are disposed on a lower substrate (110). The thermoelectric elements constituting the first thermoelectric module (100), the second thermoelectric module (200), and the third thermoelectric module (300) are disposed on a single lower substrate (110), and the first to third thermoelectric modules (100, 200, 300) are disposed in a structure that shares the same lower substrate (110) with each other.

[0093] The first to third thermoelectric modules (100, 200, 300) can be electrically connected to each other through a connecting electrode (160) disposed on a lower substrate (110). Specifically, as shown in FIG. 5, the first lower electrode (120) of the first thermoelectric module (100) is disposed in the first element region (CA1) of the lower substrate (110), the second lower electrode of the second thermoelectric module (200) is disposed in the second element region (CA2), and the third lower electrode of the third thermoelectric module (300) is disposed in the third element region (CA3). A connecting electrode (160) is positioned on the same plane as the lower electrodes (120) to electrically connect two or more adjacent lower electrodes (120) among the lower electrodes (120), thereby providing an electrical connection between the first to third thermoelectric modules (100, 200, 300). For example, two lower electrodes positioned on the outer edge of the first lower electrode (120) can be electrically connected through the connecting electrode (160) to two lower electrodes positioned on the outer edge of the adjacent second lower electrode. In the same way, a portion of the second lower electrode and a portion of the third lower electrode can be electrically connected through the connecting electrode (160). In this case, the connecting electrode (160) can be configured to extend from one end of the lower electrode (120) positioned at the outermost edge of each element region (CA1, CA2, CA3) of the lower electrode (120) array, as shown in FIG. 5.

[0094] Meanwhile, the upper substrates (150, 250, 350) of the first to third thermoelectric modules (100, 200, 300) can be configured separately, and the thermoelectric elements of the first to third thermoelectric modules (100, 200, 300) can be sealed by being directly bonded to the lower substrate (110) in the first peripheral area (PA1), the second peripheral area (PA2), and the third peripheral area (PA3). In this case, a portion of the connecting electrode (160) may pass through the bonding portion between the upper substrates (150, 250, 350) and the lower substrate (110) and be exposed to the outside, and the exposed portion of the connecting electrode (160) may be insulated through an insulating layer.

[0095] In some embodiments, a wiring portion (170) electrically connected to an external power unit for providing a driving voltage or current for the first to third thermoelectric modules (100, 200, 300) may be disposed at one end of the thermoelectric device (10). As described with reference to FIGS. 1 and 2, the wiring portion (170) may be a plate-type wiring portion and may be a wire wiring portion, and the exposed portion of the wiring portion (170) may be coated with an insulating film or an insulating tube.

[0096] As described above, the thermoelectric device (10) of the present invention includes a plurality of thermoelectric modules (100, 200, 300) that share a single lower substrate (110), and the plurality of thermoelectric modules (100, 200, 300) can be electrically connected to each other through a connecting electrode (160) formed on the lower substrate (110). Accordingly, the lower substrate (110) can be utilized as a mother board or a flat form for arranging the thermoelectric modules (100, 200, 300). Specifically, as shown in FIG. 2, a plurality of element regions (CA1, CA2, CA3) are formed in a standardized form on the lower substrate (110), and a plurality of lower electrode (120) patterns and connecting electrode (160) patterns are formed in each element region (CA1, CA2, CA3). Afterwards, by placing standardized thermoelectric modules (100, 200, 300) on the lower substrate (110) in the element areas (CA1, CA2, CA3) where they are to be placed, the number of thermoelectric modules (100, 200, 300) constituting the thermoelectric device (10) can be freely changed. In this case, by designing the connecting electrode (160) so that the element areas (CA1, CA2, CA3) where the thermoelectric modules (100, 200, 300) are not placed are bypassed, the thermoelectric device (10) can be configured to be electrically operable even if some of the thermoelectric modules (100, 200, 300) are omitted. In particular, when the lower substrate (110) is composed of an FPCB, the patterns of the connecting electrode (160) and the lower electrode (120) can all be configured to be printed on the flexible lower substrate (110), so the thickness of the thermoelectric device (10) can be reduced, and the step difference caused by the connecting electrode (160) and the lower electrode (120) can be almost eliminated, so the adhesion between the flexible upper substrate (150, 250, 350) and the lower substrate (110) can be made easier, and the sealing effect can be maximized.

[0097] In addition, since the thermoelectric device (10) of the present invention includes a flexible lower substrate (110) and an upper substrate (150, 250, 350), each of the plurality of thermoelectric modules (100, 200, 300) can have its element region (CA1, CA2, CA3) sealed by bending the upper substrate (150, 250, 350) in the surrounding region (PA1, PA2, PA3) and directly bonding it to the lower substrate (110). Accordingly, each of the plurality of thermoelectric modules (100, 200, 300) can be sealed without a separate sealing structure, and the internal thermoelectric element can be effectively protected safely from external dust or external moisture.

[0098] In addition, since the lower substrate (110) has flexibility and the plurality of thermoelectric modules (100, 200, 300) can be maintained in a state of being adhered along the curved surface of the lower substrate (110), the thermoelectric device (10) of the present invention can be bent overall and can be easily applied to various curved surfaces.

[0099] FIG. 6 is a schematic perspective view for explaining a thermoelectric device according to another embodiment of the present invention.

[0100] Referring to FIG. 6, a first thermoelectric device (10) according to another embodiment of the present invention may be electrically connected to a second thermoelectric device (20). In this case, the first thermoelectric device (10) and the second thermoelectric device (20) may each include a plurality of thermoelectric modules (100, 200, 300, 400, 500).

[0101] Specifically, as described with reference to FIGS. 4 and 5, the first thermoelectric device (10) may include first to third thermoelectric modules (100, 200, 300) connected in series. That is, the first thermoelectric module (100) and the second thermoelectric module (200) are electrically connected through a connecting electrode, and the second thermoelectric module (200) and the third thermoelectric module (300) are electrically connected through a connecting electrode, so that the first to third thermoelectric modules (100, 200, 300) can be connected in series with each other. Additionally, as shown in FIG. 6, the second thermoelectric device (20) may include four thermoelectric modules (400, 500) connected in parallel with each other. That is, the fourth thermoelectric module (400) and the fifth thermoelectric module (500) can be electrically separated from each other and operated independently.

[0102] Meanwhile, the first thermoelectric device (10) and the second thermoelectric device (20) are electrically connected to each other through wire wiring (171). For example, one end of the first thermoelectric module (100) of the first thermoelectric device (10) and the fourth and fifth thermoelectric modules (400, 500) of the second thermoelectric device (20) may be electrically connected through wire wiring (171). However, this is not limited thereto, and the first thermoelectric device (10) and the second thermoelectric device (20) may also be electrically connected through plate-shaped wiring (170).

[0103] The thermoelectric modules (100, 200, 300) of the first thermoelectric device (10) are arranged by sharing one first lower substrate, and the thermoelectric modules (400, 500) of the second thermoelectric device (20) are arranged by sharing one second lower substrate. The upper substrates of each thermoelectric module (100, 200, 300, 400, 500) are directly bonded to the lower substrate in the peripheral area of ​​each thermoelectric module (100, 200, 300, 400, 500). Since both the upper substrate and the lower substrate of each thermoelectric module (100, 200, 300, 400, 500) have flexibility, each upper substrate can be bent in the peripheral area to enable direct bonding with the lower substrate.

[0104] The thermoelectric devices (10, 20) of the present invention can be electrically connected to each other and expanded in various forms. For example, in a device requiring cooling of a large area using a plurality of thermoelectric modules (100, 200, 300) connected in series, a first thermoelectric device (10) is placed, and in a device requiring cooling subdivided by each area, or in a device requiring continuous cooling through the remaining thermoelectric modules (400, 500) even if one thermoelectric module (400, 500) is damaged, a second thermoelectric device (20) including a plurality of thermoelectric modules (400, 500) connected in parallel can be placed to provide efficient cooling.

[0105] In addition, since the thermoelectric devices (10, 20) of the present invention are all composed of upper and lower substrates having flexibility, they can provide the same advantages as the thermoelectric module (100) and thermoelectric device (10) described with reference to FIGS. 1 to 5.

[0106] The foregoing description of the present invention is for illustrative purposes only, and those skilled in the art will understand that other specific forms can be easily modified without altering the technical spirit or essential features of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as a single unit may be implemented in a distributed manner, and components described as distributed may likewise be implemented in a combined form.

[0107] The scope of the present invention is defined by the claims set forth below rather than by the detailed description above, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts thereof should be interpreted as being included within the scope of the present invention. Explanation of the symbols

[0109] 10, 20: Thermoelectric device 100, 200, 300, 400, 500: Thermoelectric module 110: Lower substrate 120: Lower electrode 130, 131, 132: Thermoelectric semiconductor 140: Upper electrode 150, 250, 350: Upper substrate 160: Connecting electrode 170, 171: Wiring section 390: Adhesive member CA, CA1, CA2, CA3: Device region PA, PA1, PA2, PA3: surrounding areas

Claims

Claim 1 A thermoelectric module comprising: a lower substrate; a lower electrode on the lower substrate; a thermoelectric semiconductor on the lower electrode; an upper electrode on the thermoelectric semiconductor; and an upper substrate on the upper electrode, wherein the upper substrate and the lower substrate comprise a flexible material, the thermoelectric semiconductor is disposed in a device region of the lower substrate, and the upper substrate and the lower substrate are bonded to each other in a peripheral region surrounding the device region. Claim 2 delete Claim 3 A thermoelectric module according to claim 1, further comprising a wiring portion connected to at least one of the lower electrode or the upper electrode and extending into the surrounding area. Claim 4 In paragraph 3, the wiring portion is a flexible plate-shaped wiring portion connected to the lower electrode or the upper electrode, and is exposed to the outside through the joint portion of the upper substrate and the lower substrate, a thermoelectric module. Claim 5 In paragraph 4, the externally exposed portion of the plate-shaped wiring portion is coated with an insulating layer, forming a thermoelectric module. Claim 6 In paragraph 3, the wiring portion is a wire wiring connected to the lower electrode or the upper electrode, and is a thermoelectric module that passes through the joint portion of the upper substrate and the lower substrate and is exposed to the outside. Claim 7 In paragraph 6, the externally exposed portion of the wire wiring is a thermoelectric module inserted into an insulating tube. Claim 8 A thermoelectric module according to claim 1, wherein the lower substrate and the upper substrate are FPCBs. Claim 9 A method for manufacturing a thermoelectric module comprising: a step of placing a lower electrode on a lower substrate made of a flexible material; a step of placing a thermoelectric semiconductor on the lower electrode; a step of placing an upper electrode electrically connected to the thermoelectric semiconductor and an upper substrate facing the lower substrate; and a step of joining the upper substrate and the lower substrate in a peripheral region surrounding a device region where the thermoelectric semiconductor is placed. Claim 10 A method for manufacturing a thermoelectric module according to claim 9, wherein the step of joining the upper substrate and the lower substrate includes the step of joining the upper surface of the lower substrate and the lower surface of the upper substrate through thermal fusion. Claim 11 A method for manufacturing a thermoelectric module according to claim 10, wherein the step of joining the upper surface of the lower substrate and the lower surface of the upper substrate through the above thermal fusion is performed in a vacuum. Claim 12 A method for manufacturing a thermoelectric module according to claim 9, wherein the step of bonding the upper substrate and the lower substrate comprises: a step of placing an adhesive member on the lower surface of the upper substrate or on the upper surface of the lower substrate; and a step of bonding the lower surface of the upper substrate to the upper surface of the lower substrate. Claim 13 A thermoelectric device comprising: a lower substrate; and a plurality of thermoelectric modules disposed on the lower substrate and each physically separated thereof, wherein each of the plurality of thermoelectric modules comprises: a lower electrode on the lower substrate; a thermoelectric semiconductor on the lower electrode; an upper electrode on the thermoelectric semiconductor; and an upper substrate on the upper electrode, wherein the plurality of thermoelectric modules share one lower substrate, and each of the plurality of thermoelectric modules further comprises a connecting electrode that interconnects adjacent lower electrodes among the lower electrodes, wherein the connecting electrode is disposed on the same plane as the lower electrode, and the lower substrate comprises a device region in which the thermoelectric semiconductor of each of the plurality of thermoelectric modules is disposed and a peripheral region surrounding the device region, and a portion of the upper substrate of each of the thermoelectric modules is directly bonded to the lower substrate in the peripheral region. Claim 14 delete Claim 15 delete Claim 16 delete

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