Camera actuator and camera device comprising the same

Abstract

An embodiment of the present invention discloses a camera device comprising: a camera actuator; a main substrate; and an image sensor disposed between the camera actuator and the main substrate along an optical axis direction, wherein the main substrate comprises: a first main substrate including a first surface on which the image sensor is mounted and a second surface opposite to the first surface; and a connecting substrate connected to the first main substrate, wherein a groove is formed on one side of the first main substrate, the connecting substrate is disposed in the groove, and the first main substrate includes an overlapping area in which a portion of the first surface and the groove overlap each other in a direction from the second surface toward the first surface.

Description

Technology Field

[0001] The present invention relates to a camera actuator and a camera device including the same. Background Technology

[0002] A camera is a device that captures subjects as photos or videos, and it is mounted on portable devices, drones, vehicles, etc. To improve image quality, a camera device or camera module may have an Image Stabilization (IS) function that corrects or prevents image shaking caused by user movement, an Auto Focusing (AF) function that automatically adjusts the distance between the image sensor and the lens to align the focal length of the lens, and a zooming function that increases or decreases the magnification of distant subjects through a zoom lens for shooting.

[0003] Meanwhile, as image sensors increase in pixel count, the resolution rises and the size of the pixels decreases; consequently, as pixels become smaller, the amount of light received over the same period of time decreases. Therefore, in high-pixel cameras, image blur caused by hand shake resulting from slow shutter speeds in dark environments can appear more severe. A representative example of image stabilization (IS) technology is optical image stabilization (OIS), which corrects motion by changing the path of light.

[0004] According to general OIS technology, camera movement can be detected through a gyro sensor, etc., and based on the detected movement, the lens can be tilted or moved, or the camera device including the lens and image sensor can be tilted or moved. When the lens or the camera device including the lens and image sensor is tilted or moved for OIS, additional space for tilting or moving needs to be secured around the lens or the camera device.

[0005] Meanwhile, actuators for OIS may be placed around the lens. In this case, the actuators for OIS may include two axes perpendicular to the optical axis Z, namely, an actuator responsible for X-axis tilting and an actuator responsible for Y-axis tilting.

[0006] However, due to the needs of ultra-slim and ultra-compact camera devices, there are significant spatial constraints for arranging actuators for OIS, and it may be difficult to ensure sufficient space for the lens or the camera device itself, including the lens and image sensor, to tilt or move for OIS. Additionally, as the resolution of the camera increases, it is desirable to increase the size of the lens to increase the amount of light received, but there may be a limit to increasing the size of the lens due to the space occupied by the actuator for OIS.

[0007] In addition, when zooming, AF, and OIS functions are all included within a camera device, there is also a problem where the magnet for OIS and the magnet for AF or zoom are placed in close proximity to each other, causing magnetic field interference.

[0008] In addition, there is a problem where the thickness of the camera module increases and the tolerance widens when the circuit board is bent for connection with external electronic devices. The problem to be solved

[0009] The technical problem that the present invention aims to solve is to provide a camera device in which the circuit board portion is bent once to have an area for placing a connector in order to improve reliability and ease of assembly.

[0010] In addition, the present invention can provide a camera device that secures a connection space with an image sensor without increasing the thickness of the camera module through a groove of a rigid circuit board disposed on the surface of a flexible circuit board.

[0011] In addition, the present invention can provide a camera actuator and a camera device applicable to ultra-slim, ultra-compact, and high-resolution cameras.

[0012] In addition, the present invention can provide a camera actuator and a camera device that improve the travel distance of a lens assembly through the shape of a driving coil.

[0013] The problems intended to be solved in the embodiments are not limited thereto, and may also include objectives or effects that can be identified from the means of solving the problems or the forms of implementation described below. means of solving the problem

[0014] A camera device according to an embodiment of the present invention comprises: a camera actuator; a main substrate; and an image sensor disposed between the camera actuator and the main substrate along the optical axis direction; wherein the main substrate comprises: a first main substrate including a first surface on which the image sensor is mounted and a second surface opposite to the first surface; and a connecting substrate connected to the first main substrate; wherein a groove is formed on one side of the first main substrate, the connecting substrate is disposed in the groove, and the first main substrate includes an overlapping area in which a portion of the first surface and the groove overlap each other in a direction toward the first surface from the second surface.

[0015] The above connecting substrate may be spaced apart from the overlapping area within the groove.

[0016] The overlapping area of ​​the first surface may not overlap with the second surface in the direction from the second surface toward the first surface.

[0017] One side of the overlapping area may be positioned on the same line as one side of the first main substrate.

[0018] The width of the first surface of the first main board may be larger than the height.

[0019] The area of ​​the first surface of the first main board may be larger than the area of ​​the second surface.

[0020] The above connecting substrate can be formed integrally with the flexible substrate of the first main substrate.

[0021] The width of the flexible substrate of the first main substrate may be greater than the width of the connecting substrate.

[0022] A camera device according to an embodiment of the present invention comprises: a camera actuator; a main substrate; and an image sensor disposed between the camera actuator and the main substrate along the optical axis direction; wherein the main substrate comprises a first rigid substrate, a second rigid substrate, and a flexible substrate disposed between the first rigid substrate and the second rigid substrate, and the flexible substrate comprises a first flexible region and a second flexible region, wherein the second flexible region of the flexible substrate is exposed from the second rigid substrate, and the second flexible region overlaps with a part of the first rigid substrate in a direction toward the first rigid substrate from the second rigid substrate.

[0023] The exposed first flexible region or second flexible region of the flexible substrate may have a gap formed between it and the first rigid substrate.

[0024] The width of the second flexible region of the exposed flexible substrate may be greater than the width of the first flexible region.

[0025] A camera device according to an embodiment of the present invention comprises: a camera actuator; a main substrate; and an image sensor disposed between the camera actuator and the main substrate along the optical axis direction; wherein the main substrate comprises a first rigid substrate, a second rigid substrate, and a flexible substrate disposed between the first rigid substrate and the second rigid substrate, wherein the first rigid substrate comprises a first groove, the second rigid substrate comprises a second groove that corresponds at least partially to the first groove, and the first rigid substrate comprises a protrusion protruding toward the first groove, wherein the protrusion and the flexible substrate are disposed facing each other and spaced apart from one another, and the flexible substrate may be exposed by the second groove.

[0026] The first rigid substrate includes a first surface, and the second rigid substrate may include a second surface facing the first surface.

[0027] At least a portion of the first rigid substrate may be exposed by the first groove.

[0028] The above flexible substrate can extend from the bottom surface of the second groove.

[0029] The above flexible substrate may be spaced at least partially apart from the first rigid substrate in the optical axis direction.

[0030] The main substrate may include a first bonding layer in contact with the first rigid substrate and the flexible substrate.

[0031] The first bonding layer may not be disposed in the spaced-apart space located between the flexible substrate and the first rigid substrate in the direction of the optical axis.

[0032] At least a portion of the first bonding layer may not overlap with the first groove in the direction of the optical axis. Effects of the invention

[0033] According to an embodiment of the present invention, a camera device can be implemented by bending the circuit board once to have an area for placing a connector in order to improve reliability and ease of assembly.

[0034] In addition, the present invention can implement a camera device that secures a connection space with an image sensor without increasing the thickness of the camera module through a groove of a rigid circuit board placed on the surface of a flexible circuit board.

[0035] In addition, the bonding process can be reduced by reducing the area where electrical connections are made between substrates in a camera device including multiple actuators.

[0036] In addition, a camera device with an improved bonding process can be implemented by providing bonding grooves (e.g., pads) on both sides.

[0037] In addition, camera actuators and camera devices applicable to ultra-slim, ultra-compact, and high-resolution cameras can be implemented.

[0038] In particular, actuators for OIS can be efficiently positioned without increasing the overall size of the camera device.

[0039] According to an embodiment of the present invention, tilting in the X-axis direction and tilting in the Y-axis direction do not cause magnetic field interference with each other, and tilting in the X-axis direction and tilting in the Y-axis direction can be implemented with a stable structure, and since it does not cause magnetic field interference with actuators for AF or zooming, precise OIS function can be realized.

[0040] According to the present invention, a camera actuator and camera device applicable to ultra-slim, ultra-compact, and high-resolution cameras can be implemented.

[0041] The various and beneficial advantages and effects of the present invention are not limited to those described above and may be more easily understood in the process of explaining specific embodiments of the present invention. Brief explanation of the drawing

[0042] FIG. 1 is a perspective view of a camera device according to an embodiment, and FIG. 2 is an exploded perspective view of a camera device according to an embodiment, and FIG. 3 is a cross-sectional view cut along AA' in FIG. 1, and FIG. 4 is an exploded perspective view of a first camera actuator according to an embodiment, and FIG. 5 is a perspective view of a first camera actuator according to an embodiment in which the first shield can and substrate are removed, and FIG. 6 is a cross-sectional view cut along BB' in FIG. 5, and FIG. 7 is a cross-sectional view of FIG. 5 cut at CC', and FIG. 8 is a perspective view of a second camera actuator according to an embodiment, and FIG. 9 is an exploded perspective view of a second camera actuator according to an embodiment, and FIG. 10 is a cross-sectional view cut along DD' in FIG. 8, and FIG. 11 is a perspective view illustrating a circuit board according to an embodiment, and FIG. 12 is a perspective view of a circuit board and a second camera actuator according to an embodiment, and FIG. 13 is an exploded perspective view of a circuit board according to an embodiment, and FIG. 14 is a perspective view of a circuit board and an image sensor according to an embodiment, and FIG. 15 is a view taken by cutting through FIG. 11 at II', and FIG. 16 is a view taken by cutting through FIG. 11 at JJ', and FIG. 17 is a view taken by cutting through FIG. 11 at KK', and FIG. 18 is a cross-sectional view of a circuit board according to another embodiment, and FIG. 19 is a perspective view of a mobile terminal to which a camera device according to an embodiment is applied, and FIG. 20 is a perspective view of a vehicle equipped with a camera device according to an embodiment. Specific details for implementing the invention

[0043] The present invention is susceptible to various modifications and may have various embodiments, and specific embodiments are illustrated and described in the drawings. However, this does not specify the present invention.

[0044] It should be understood that the embodiments are not intended to be limited and include all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0045] Terms including ordinal numbers, such as second, first, etc., may be used to describe various components, but the components are not limited by the terms. The terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be named the first component, and similarly, the first component may be named the second component. The term "and / or" includes a combination of a plurality of related described items or any of a plurality of related described items.

[0046] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0047] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0048] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0049] Hereinafter, embodiments will be described in detail with reference to the attached drawings, provided that identical or corresponding components are given the same reference number regardless of the drawing symbols, and redundant descriptions thereof will be omitted.

[0050] FIG. 1 is a perspective view of a camera device according to an embodiment, FIG. 2 is an exploded perspective view of a camera device according to an embodiment, and FIG. 3 is a cross-sectional view cut along AA' in FIG. 1.

[0051] Referring to FIGS. 1 and 2, a camera device (1000) according to an embodiment may consist of a cover (CV), a first camera actuator (1100), a second camera actuator (1200), and a circuit board (1300). Here, the first camera actuator (1100) may be interchangeably referred to as the 'first actuator' and the second camera actuator (1200) as the 'second actuator'.

[0052] The cover (CV) can cover the first camera actuator (1100) and / or the second camera actuator (1200). The coupling force between the first camera actuator (1100) and the second camera actuator (1200) can be improved by the cover (CV).

[0053] Furthermore, the cover (CV) may be made of a material that performs electromagnetic shielding. Accordingly, the first camera actuator (1100) and the second camera actuator (1200) inside the cover (CV) can be easily protected.

[0054] And the first camera actuator (1100) may be an OIS (Optical Image Stabilizer) actuator.

[0055] In an embodiment, the first camera actuator (1100) can change the path of light. In an embodiment, the first camera actuator (1100) can change the path of light vertically through an internal optical element (e.g., a mirror or a prism). With this configuration, even if the thickness of the mobile terminal is reduced, a lens configuration larger than the thickness of the mobile terminal can be placed within the mobile terminal through the change of the path of light so that magnification, autofocus (AF), and OIS functions can be performed.

[0056] The first camera actuator (1100) can change the light path from the first direction to the third direction. In this specification, the optical axis direction corresponds to the direction of propagation of light provided to the image sensor in the third direction or the Z-axis direction.

[0057] Additionally, the first camera actuator (1100) may include a lens disposed in a predetermined barrel (not shown). For example, the lens may include a fixed focal length lens. Such a fixed focal length lens may also be referred to as a “single focal length lens” or a “single lens.”

[0058] The second camera actuator (1200) may be positioned at the rear end of the first camera actuator (1100). The second camera actuator (1200) may be coupled with the first camera actuator (1100). And the coupling between them may be achieved in various ways.

[0059] Additionally, the second camera actuator (1200) may be a zoom actuator or an AF (Auto Focus) actuator. For example, the second camera actuator (1200) may support one or more lenses and move the lenses according to a control signal from a predetermined control unit to perform an auto-focusing function or a zoom function.

[0060] The circuit board (1300) may be placed at the rear end of the second camera actuator (1200). The circuit board (1300) may be electrically connected to the second camera actuator (1200) and the first camera actuator (1100). Additionally, there may be multiple circuit boards (1300).

[0061] This circuit board (1300) is connected to the second housing of the second camera actuator (1200), and an image sensor may be provided. Furthermore, a base portion including a filter may be mounted on the circuit board (1300). This will be described later.

[0062] The camera device according to the embodiment may consist of a single or multiple camera devices. For example, the multiple camera devices may include a first camera device and a second camera device. Additionally, as described above, the camera device may be used interchangeably with terms such as 'camera module', 'camera device', 'imaging device', 'imaging module', 'imaging apparatus', etc.

[0063] And the first camera device may include a single or multiple actuators. For example, the first camera device may include a first camera actuator (1100) and a second camera actuator (1200).

[0064] The second camera device may be disposed in a predetermined housing (not shown) and may include an actuator (not shown) capable of driving a lens portion. The actuator may be a voice coil motor, a micro actuator, a silicon actuator, etc., and may be applied in various ways such as electrostatic, thermal, bimorphic, electrostatic force methods, etc., but is not limited thereto. In addition, in this specification, the camera actuator may be referred to as an actuator, etc. Furthermore, the camera device composed of a plurality of camera devices may be mounted in various electronic devices such as mobile terminals.

[0065] Referring to FIG. 3, a camera device according to an embodiment may include a first camera actuator (1100) that performs an OIS function and a second camera actuator (1200) that performs a zooming function and an AF function.

[0066] Light can be incident into the camera device through an aperture region located on the upper surface of the first camera actuator (1100). That is, light is incident into the interior of the first camera actuator (1100) along the optical axis direction (e.g., X-axis direction) and can be changed to a direction perpendicular to the optical path (e.g., Z-axis direction) through an optical member. Then, light passes through the second camera actuator (1200) and can be incident on an image sensor (IS) located at one end of the second camera actuator (1200) (PATH).

[0067] In this specification, the bottom surface refers to one side in the first direction. The first direction is the X-axis direction in the drawing and may be used interchangeably with the second axis direction, etc. The second direction is the Y-axis direction in the drawing and may be used interchangeably with the first axis direction, etc. The second direction is a direction perpendicular to the first direction. Additionally, the third direction is the Z-axis direction in the drawing and may be used interchangeably with the third axis direction, etc. It is a direction perpendicular to both the first direction and the second direction. Here, the third direction (Z-axis direction) corresponds to the direction of the optical axis, and the first direction (X-axis direction) and the second direction (Y-axis direction) are directions perpendicular to the optical axis and can be tilted by the second camera actuator. A detailed explanation thereof will be provided later. In addition, in the description of the first camera actuator (1100) and the second camera actuator (1200) below, the optical axis direction corresponds to the optical path, and in particular, the optical axis direction is the third direction (Z-axis direction), and the description below is based on this.

[0068] And by this configuration, the camera device according to the embodiment can improve the spatial limitations of the first camera actuator and the second camera actuator by changing the light path. That is, the camera device according to the embodiment can expand the light path while minimizing the thickness of the camera device in response to the change in the light path. Furthermore, it should be understood that the second camera actuator can provide a high range of magnification by controlling focus, etc., in the expanded light path.

[0069] In addition, the camera device according to the embodiment can implement OIS by controlling the optical path through the first camera actuator, thereby minimizing the occurrence of decent or tilt phenomena and producing optimal optical characteristics.

[0070] Furthermore, the second camera actuator (1200) may include an optical system and a lens driving unit. For example, at least one of the first lens assembly, the second lens assembly, the third lens assembly, and a guide pin may be disposed in the second camera actuator (1200).

[0071] Additionally, the second camera actuator (1200) is equipped with a coil and a magnet to perform a high-magnification zooming function.

[0072] For example, the first lens assembly and the second lens assembly may be moving lenses that move via coils, magnets, and guide pins, and the third lens assembly may be a fixed lens, but is not limited thereto. For example, the third lens assembly may perform the function of a focuser that forms an image of light at a specific location, and the first lens assembly may perform the function of a variationator that re-forms the image formed by the third lens assembly (focuser) at a different location. Meanwhile, the first lens assembly may be in a state where the magnification changes significantly due to a large change in the distance to the subject or the image distance, and the first lens assembly (variator) may play an important role in the change of focal length or magnification of the optical system. On the other hand, the image formed by the first lens assembly (variator) may differ slightly depending on the location. Accordingly, the second lens assembly may perform a position compensation function for the image formed by the variationator. For example, the second lens assembly can perform the function of a compensator that accurately forms the image formed by the first lens assembly (which acts as a transducer) at the actual image sensor location. For example, the first lens assembly and the second lens assembly can be driven by electromagnetic force resulting from the interaction between a coil and a magnet. The above description may be applied to the lens assembly described below.

[0073] Meanwhile, according to an embodiment of the present invention, when an actuator for OIS and an actuator for AF or Zoom are arranged, magnetic field interference with the magnet for AF or Zoom can be prevented during OIS operation. Since the first driving magnet of the first camera actuator (1100) is arranged separately from the second camera actuator (1200), magnetic field interference between the first camera actuator (1100) and the second camera actuator (1200) can be prevented. In this specification, OIS may be used interchangeably with terms such as hand shake correction, optical image stabilization, optical image correction, and shake correction.

[0074] FIG. 4 is an exploded perspective view of a first camera actuator according to an embodiment.

[0075] Referring to FIG. 4, the first camera actuator (1100) according to the embodiment includes a first shield can (not shown), a first housing (1120), a mover (1130), a rotating part (1140), and a first driving part (1150).

[0076] The mover (1130) may include a holder (1131) and an optical member (1132) seated on the holder (1131). The rotating part (1140) includes a rotating plate (1141), a first magnetic body (1142) having a bonding force with the rotating plate (1141), and a second magnetic body (1143) located within the rotating plate (1141). Additionally, the first driving part (1150) includes a first driving magnet (1151), a first driving coil (1152), a first Hall sensor part (1153), and a first substrate part (1154).

[0077] The first shield can (not shown) may be positioned at the outermost side of the first camera actuator (1100) to surround the rotating part (1140) and the first driving part (1150) described later.

[0078] This first shield can (not shown) can block or reduce electromagnetic waves generated from the outside. Accordingly, the occurrence of malfunction in the rotating part (1140) or the first driving part (1150) can be reduced.

[0079] The first housing (1120) may be located inside the first shield can (not shown). Additionally, the first housing (1120) may be located inside the first substrate part (1154) described later. The first housing (1120) may be joined or fitted together with the first shield can (not shown).

[0080] The first housing (1120) may be composed of a plurality of housing sides. It may include a first housing side (1121), a second housing side (1122), a third housing side (1123), and a fourth housing side (1124).

[0081] The first housing side (1121) and the second housing side (1122) may be arranged to face each other. Additionally, the third housing side (1123) and the fourth housing side (1124) may be arranged between the first housing side (1121) and the second housing side (1122).

[0082] The third housing side (1123) may be in contact with the first housing side (1121), the second housing side (1122), and the fourth housing side (1124). Additionally, the third housing side (1123) may include a bottom surface extending downward from the first housing (1120).

[0083] And the first housing side (1121) may include a first housing hole (1121a). A first coil (1152a), which will be described later, may be located in the first housing hole (1121a).

[0084] Additionally, the second housing side (1122) may include a second housing hole (1122a). And a second coil (1152b), which will be described later, may be located in the second housing hole (1122a).

[0085] The first coil (1152a) and the second coil (1152b) can be coupled with the first substrate portion (1154). In an embodiment, the first coil (1152a) and the second coil (1152b) are electrically connected to the first substrate portion (1154) so ​​that current can flow. This current is an element of electromagnetic force that allows the first camera actuator to tilt with respect to the X-axis.

[0086] Additionally, the third housing side (1123) may include a third housing hole (1123a). A third coil (1152c), described later, may be located in the third housing hole (1123a). The third coil (1152c) may be coupled with the first substrate part (1154). The third coil (1152c) may be electrically connected to the first substrate part (1154) so ​​that current may flow. This current is an element of electromagnetic force that enables the first camera actuator to tilt with respect to the Y-axis.

[0087] The fourth housing side (1124) may include a first housing groove (1124a). A first magnetic body (1142), described later, may be disposed in the area facing the first housing groove (1124a). Accordingly, the first housing (1120) may be coupled with the rotating plate (1141) by magnetic force, etc.

[0088] Additionally, the first housing groove (1124a) according to the embodiment may be located on the inner or outer surface of the fourth housing side (1124). Accordingly, the first magnetic body (1142) may also be positioned to correspond to the location of the first housing groove (1124a).

[0089] Additionally, the first housing (1120) may include a receiving portion (1125) formed by the first to fourth housing sides (1121 to 1224). A mover (1130) may be located in the receiving portion (1125).

[0090] The mover (1130) includes a holder (1131) and an optical member (1132) that sits on the holder (1131).

[0091] The holder (1131) can be seated in the receiving portion (1125) of the first housing (1120). The holder (1131) may include first to fourth prism outer surfaces corresponding to the first housing side (1121), the second housing side (1122), the third housing side (1123), and the fourth housing side (1124), respectively.

[0092] A mounting groove in which a second magnetic body (1143) can be seated may be arranged on the outer surface of the fourth prism facing the fourth housing side (1124).

[0093] The optical member (1132) can be seated on the holder (1131). To this end, the holder (1131) may have a seating surface, and the seating surface may be formed by a receiving groove. The optical member (1132) may include a reflector disposed inside. However, it is not limited thereto. The optical member (1132) may reflect light reflected from the outside (e.g., an object) into the camera device. In other words, the optical member (1132) can improve the spatial limitations of the first camera actuator and the second camera actuator by changing the path of the reflected light. Thus, it should be understood that the camera device may provide a high range of magnification by extending the light path while minimizing thickness.

[0094] The rotating part (1140) includes a rotating plate (1141), a first magnetic body (1142) having a bonding force with the rotating plate (1141), and a second magnetic body (1143) located within the rotating plate (1141).

[0095] The rotating plate (1141) can be combined with the aforementioned mover (1130) and the first housing (1120). The rotating plate (1141) may include an additional magnetic body (not shown) located inside.

[0096] Additionally, the rotating plate (1141) may be positioned adjacent to the optical axis. Thus, the actuator according to the embodiment can easily change the optical path according to the first and second axis tilts described later.

[0097] The rotating plate (1141) may include a first protrusion spaced apart in a first direction (X-axis direction) and a second protrusion spaced apart in a second direction (Y-axis direction). Additionally, the first protrusion and the second protrusion may protrude in opposite directions to each other. A detailed explanation thereof will be provided later.

[0098] Additionally, the first magnetic body (1142) includes a plurality of yokes, and the plurality of yokes may be positioned facing each other with respect to the rotating plate (1141). In an embodiment, the first magnetic body (1142) may be composed of a plurality of facing yokes. And the rotating plate (1141) may be positioned between the plurality of yokes.

[0099] The first magnetic body (1142) may be located within the first housing (1120) as described above. Additionally, as described above, the first magnetic body (1142) may be placed on the inner or outer surface of the fourth housing side (1124). For example, the first magnetic body (1142) may be placed in a groove formed on the outer surface of the fourth housing side (1124). Alternatively, the first magnetic body (1142) may be placed in the first housing groove (1124a) described above.

[0100] And the second magnetic body (1143) can be located on the outer surface of the mover (1130), particularly the holder (1131). With this configuration, the rotating plate (1141) can be easily coupled to the first housing (1120) and the mover (1130) by the coupling force due to the magnetic force between the second magnetic body (1143) and the first magnetic body (1142) inside. In the present invention, the positions of the first magnetic body (1142) and the second magnetic body (1143) can be moved relative to each other.

[0101] The first driving unit (1150) includes a first driving magnet (1151), a first driving coil (1152), a first Hall sensor unit (1153), and a first substrate unit (1154).

[0102] The first driving magnet (1151) may include a plurality of magnets. In an embodiment, the first driving magnet (1151) may include a first magnet (1151a), a second magnet (1151b), and a third magnet (1151c).

[0103] The first magnet (1151a), the second magnet (1151b), and the third magnet (1151c) may each be located on the outer surface of the holder (1131). Additionally, the first magnet (1151a) and the second magnet (1151b) may be positioned to face each other. Furthermore, the third magnet (1151c) may be located on the bottom surface of the outer surface of the holder (1131). A detailed explanation thereof will be provided later.

[0104] The first driving coil (1152) may include a plurality of coils. In an embodiment, the first driving coil (1152) may include a first coil (1152a), a second coil (1152b), and a third coil (1152c).

[0105] The first coil (1152a) may be positioned opposite the first magnet (1151a). Accordingly, the first coil (1152a) may be positioned in the first housing hole (1121a) of the first housing side (1121) as described above.

[0106] Additionally, the second coil (1152b) may be positioned opposite the second magnet (1151b). Accordingly, the second coil (1152b) may be positioned in the second housing hole (1122a) of the second housing side (1122) as described above.

[0107] The first coil (1152a) may be positioned to face the second coil (1152b). That is, the first coil (1152a) may be positioned symmetrically with respect to the second coil (1152b) with respect to the first direction (X-axis direction). This may be applied equally to the first magnet (1151a) and the second magnet (1151b). That is, the first magnet (1151a) and the second magnet (1151b) may be positioned symmetrically with respect to the first direction (X-axis direction). Additionally, the first coil (1152a), the second coil (1152b), the first magnet (1151a), and the second magnet (1151b) may be arranged to overlap at least partially in the second direction (Y-axis direction). With this configuration, X-axis tilting can be accurately achieved without tilting to one side by means of the electromagnetic force between the first coil (1152a) and the first magnet (1151a) and the electromagnetic force between the second coil (1152b) and the second magnet (1151b).

[0108] The third coil (1152c) may be positioned opposite the third magnet (1151c). Accordingly, the third coil (1152c) may be positioned in the third housing hole (1123a) of the third housing side (1123) as described above. By generating an electromagnetic force with the third magnet (1151c), the third coil (1152c) can perform Y-axis tilting of the mover (1130) and the rotating part (1140) relative to the first housing (1120).

[0109] Here, X-axis tilting means tilting with respect to the X-axis, and Y-axis tilting means tilting with respect to the Y-axis.

[0110] The first Hall sensor unit (1153) may include a plurality of Hall sensors. The Hall sensors correspond to the 'sensor unit' described later and are used in combination with it. In an embodiment, the first Hall sensor unit (1153) may include a first Hall sensor (1153a), a second Hall sensor (1153b), and a third Hall sensor (1153c).

[0111] The first Hall sensor (1153a) may be located inside the first coil (1152a). The second Hall sensor (1153b) may be symmetrically positioned with respect to the first Hall sensor (1153a) in the first direction (X-axis direction) and the third direction (Z-axis direction). Additionally, the second Hall sensor (1153b) may be located inside the second coil (1152b).

[0112] The first Hall sensor (1153a) can detect a change in magnetic flux inside the first coil (1152a). And the second Hall sensor (1153b) can detect a change in magnetic flux in the second coil (1152b). Thus, position sensing between the first and second magnets (1151a, 1151b) and the first and second Hall sensors (1153a, 1153b) can be performed. The first camera actuator according to the embodiment can, for example, detect the position through the first and second Hall sensors (1153a, 1153b) to control a more accurate X-axis tilt.

[0113] Additionally, the third Hall sensor (1153c) may be located inside the third coil (1152c). The third Hall sensor (1153c) can detect changes in magnetic flux inside the third coil (1152c). Thus, position sensing between the third magnet (1151c) and the third Hall sensor (1153bc) can be performed. The first camera actuator according to the embodiment can control the Y-axis tilt through this. There may be at least one of these first to third Hall sensors.

[0114] The first substrate portion (1154) may be located at the bottom of the first driving portion (1150). The first substrate portion (1154) may be electrically connected to the first driving coil (1152) and the first Hall sensor portion (1153). For example, the first substrate portion (1154) may be coupled to the first driving coil (1152) and the first Hall sensor portion (1153) via SMT. However, it is not limited to this method.

[0115] The first substrate portion (1154) is positioned between the first shield can (not shown) and the first housing (1120) so as to be coupled with the first shield can and the first housing (1120). The coupling method can be varied as described above. Through the coupling, the first driving coil (1152) and the first Hall sensor portion (1153) can be positioned within the outer surface of the first housing (1120).

[0116] This first substrate portion (1154) may include a circuit board having a wiring pattern that can be electrically connected, such as a rigid printed circuit board (Rigid PCB), a flexible printed circuit board (Flexible PCB), or a rigid-flexible printed circuit board (RigidFlexible PCB). However, it is not limited to these types.

[0117] FIG. 5 is a perspective view of a first camera actuator according to an embodiment in which the first shield can and substrate are removed, FIG. 6 is a cross-sectional view cut at BB' in FIG. 5, and FIG. 7 is a cross-sectional view cut at CC' in FIG. 5.

[0118] Referring to FIGS. 5 to 7, the first coil (1152a) may be located on the first housing side (1121).

[0119] And the first coil (1152a) and the first magnet (1151a) may be positioned facing each other. The first magnet (1151a) may overlap with the first coil (1152a) in at least a portion in the second direction (Y-axis direction).

[0120] Additionally, it may be located on the second housing side (1122) of the second coil (1152b). Accordingly, the second coil (1152b) and the second magnet (1151b) may be positioned facing each other. The second magnet (1151b) may overlap at least partially with the second coil (1152b) in the second direction (Y-axis direction).

[0121] Additionally, the first coil (1151a) and the second coil (1152b) may overlap in the second direction (Y-axis direction). Additionally, the first magnet (1151a) and the second magnet (1151b) may overlap in the second direction (Y-axis direction). With this configuration, the electromagnetic force applied to the outer surfaces of the holder (the outer surface of the first holder and the outer surface of the second holder) is positioned on an axis parallel to the second direction (Y-axis direction), so that X-axis tilt can be performed accurately and precisely.

[0122] Additionally, a first receiving groove (not shown) may be located on the outer surface of the fourth holder. A first protrusion (PR1a, PR1b) may be disposed in the first receiving groove. Accordingly, when performing an X-axis tilt, the first protrusion (PR1a, PR1b) may serve as the reference axis (or rotation axis) of the tilt. Accordingly, the rotation plate (1141) and the mover (1130) may move left and right.

[0123] As described above, the second protrusion (PR2) can be seated in the groove on the inner surface of the fourth housing side (1124). And when performing a Y-axis tilt, the rotation plate and the mover can rotate with the second protrusion (PR2) as the reference axis for the Y-axis tilt.

[0124] According to the embodiment, OIS can be performed by the first protrusion and the second protrusion.

[0125] Referring to FIG. 6, Y-axis tilt can be performed. That is, OIS can be implemented by rotating in the first direction (X-axis direction).

[0126] In an example, a third magnet (1151c) positioned at the bottom of the holder (1131) can form an electromagnetic force with the third coil (1152c) to tilt or rotate the mover (1130) in the first direction (X-axis direction).

[0127] Specifically, the rotating plate (1141) can be coupled to the first housing (1120) and the mover (1130) by the first magnetic body (1142) in the first housing (1120) and the second magnetic body (1143) in the mover (1130). And the first protrusion (PR1) can be spaced apart in the first direction (X-axis direction) and supported by the first housing (1120).

[0128] And the rotating plate (1141) can rotate or tilt the second protrusion (PR2) protruding toward the mover (1130) with the reference axis (or rotation axis). That is, the rotating plate (1141) can perform Y-axis tilt with the second protrusion (PR2) as the reference axis.

[0129] For example, OIS can be implemented by rotating the mover (1130) at a first angle (θ1) in the X-axis direction (X1->X1a or X1b) by a first electromagnetic force (F1A, F1B) between a third magnet (1151c) placed in a third mounting groove and a third coil (1152c) placed on the side of the third substrate. The first angle (θ1) may be ±1° to ±3°. However, it is not limited thereto.

[0130] Referring to Fig. 7, X-axis tilt can be performed. That is, OIS can be implemented by rotating in the second direction (Y-axis direction).

[0131] OIS can be implemented by tilting or rotating (or tilting the X-axis) the mover (1130) in the Y-axis direction.

[0132] In an embodiment, the first magnet (1151a) and the second magnet (1151b) placed in the holder (1131) each form an electromagnetic force with the first coil (1152a) and the second coil (1152b) to tilt or rotate the rotation plate (1141) and the mover (1130) in the second direction (Y-axis direction).

[0133] The rotating plate (1141) can rotate or tilt (X-axis tilt) the first protrusion (PR1) in a second direction with the reference axis (or rotation axis).

[0134] For example, OIS can be implemented by rotating the mover (1130) by a second angle (θ2) in the Y-axis direction (Y1->Y1a, Y1b) by a second electromagnetic force (F2A, F2B) between the first and second magnets (1151a, 1151b) disposed in the first mounting groove and the first and second coils (1152a, 1152b) disposed on the side of the first and second substrate. The second angle (θ2) may be ±1° to ±3°. However, it is not limited thereto.

[0135] In this way, the first actuator according to the embodiment controls the rotation of the rotating plate (1141) and the mover (1130) in a first direction (X-axis direction) or a second direction (Y-axis direction) by means of the electromagnetic force between the first driving magnet in the holder and the first driving coil disposed in the housing, thereby minimizing the occurrence of decentration or tilt phenomena when implementing OIS and providing optimal optical characteristics. In addition, as described above, 'Y-axis tilt' can correspond to rotation or tilt in the first direction (X-axis direction). In addition, 'X-axis tilt' can correspond to rotation or tilt in the second direction (Y-axis direction).

[0136] FIG. 8 is a perspective view of a second camera actuator according to an embodiment, FIG. 9 is an exploded perspective view of a second camera actuator according to an embodiment, and FIG. 10 is a cross-sectional view cut along DD' in FIG. 8.

[0137] Referring to FIGS. 8 to 10, a second camera actuator (1200) according to an embodiment may include a lens portion (1220), a second housing (1230), a second driving portion (1250), a base portion (1260), a second substrate portion (1270), and a bonding member (1280). Furthermore, the second camera actuator (1200) may further include a second shield can (not shown), an elastic portion (not shown), and a bonding member (not shown).

[0138] A second shield can (not shown) may be positioned in a region (e.g., the outermost) of the second camera actuator (1200) to enclose the components described later (lens part (1220), second housing (1230), second driving part (1250), base part (1260), second substrate part (1270) and image sensor (IS)).

[0139] This second shield can (not shown) can block or reduce electromagnetic waves generated from the outside. Accordingly, the occurrence of malfunction in the second drive unit (1250) can be reduced.

[0140] The lens unit (1220) may be located within a second shield can (not shown). The lens unit (1220) may move along a third direction (Z-axis direction or optical axis direction). Accordingly, the above-described AF function or zoom function may be performed.

[0141] Additionally, the lens portion (1220) may be located within the second housing (1230). Accordingly, at least a portion of the lens portion (1220) may move along the optical axis direction or the third direction (Z-axis direction) within the second housing (1230).

[0142] Specifically, the lens portion (1220) may include a lens group (1221) and a moving assembly (1222).

[0143] First, the lens group (1221) may include at least one lens. Additionally, the lens group (1221) may be multiple, but the following description is based on one.

[0144] The lens group (1221) is combined with the moving assembly (1222) and can move in a third direction (Z-axis direction) by the electromagnetic force generated from the fourth magnet (1252a) and the fifth magnet (1252b) combined with the moving assembly (1222).

[0145] In an embodiment, the lens group (1221) may include a first lens group (1221a), a second lens group (1221b), and a third lens group (1221c). The first lens group (1221a), the second lens group (1221b), and the third lens group (1221c) may be arranged sequentially along the optical axis direction. Furthermore, the lens group (1221) may further include a fourth lens group (1221d). The fourth lens group (1221d) may be arranged behind the third lens group (1221c).

[0146] The first lens group (1221a) can be fixed in conjunction with the second-1 housing. In other words, the first lens group (1221a) may not move along the optical axis direction.

[0147] The second lens group (1221b) can be moved in conjunction with the first lens assembly (1222a) in a third direction or in the direction of the optical axis. Magnification can be performed by moving the first lens assembly (1222a) and the second lens group (1221b).

[0148] The third lens group (1221c) can be moved in conjunction with the second lens assembly (1222b) in a third direction or in the direction of the optical axis. Focus adjustment or autofocusing can be performed by moving the third lens group (1221).

[0149] However, the number of such lens groups is not limited, and the aforementioned fourth lens group (1221d) may be omitted, or additional lens groups other than the fourth lens group (1121d) may be arranged.

[0150] The moving assembly (1222) may include an opening area that encloses the lens group (1221). This moving assembly (1222) is used in combination with the lens assembly. The moving assembly (1222) may be combined with the lens group (1221) by various methods. Additionally, the moving assembly (1222) may include a groove on its side, and may be combined with the fourth magnet (1252a) and the fifth magnet (1252b) through the groove. A coupling member, etc., may be applied to the groove.

[0151] Additionally, the moving assembly (1222) may be coupled with an elastic member (not shown) at the top and rear ends. Accordingly, the moving assembly (1222) may be supported by the elastic member (not shown) while moving in a third direction (Z-axis direction). That is, the position of the moving assembly (1222) may be maintained while being maintained in the third direction (Z-axis direction). The elastic member (not shown) may be made of various elastic elements, such as a leaf spring.

[0152] The moving assembly (1222) is located within the second housing (1230) and may include a first lens assembly (1222a) and a second lens assembly (1222b).

[0153] The area where the third lens group is seated in the second lens assembly (1222b) may be located at the rear end of the first lens assembly (1222a). In other words, the area where the third lens group (1221c) is seated in the second lens assembly (1222b) may be located between the area where the second lens group (1221b) is seated in the first lens assembly (1222a) and the image sensor.

[0154] The first lens assembly (1222a) and the second lens assembly (1222b) may each face the first guide portion (G1) and the second guide portion (G2). The first guide portion (G1) and the second guide portion (G2) may be located on the first side and the second side of the second housing (1230), which will be described later. A detailed explanation thereof will be provided later.

[0155] And a second driving magnet may be mounted on the outer surface of the first lens assembly (1222a) and the second lens assembly (1222b). For example, a fifth magnet (1252b) may be mounted on the outer surface of the second lens assembly (1222b). A fourth magnet (1252a) may be mounted on the outer surface of the first lens assembly (1222a).

[0156] The second housing (1230) may be positioned between the lens portion (1220) and the second shield can (not shown). The second housing (1230) may be positioned to surround the lens portion (1220).

[0157] The second housing (1230) may include a second-1 housing (1231) and a second-2 housing (1232). The second-1 housing (1231) may be coupled with the first lens group (1221a) and may also be coupled with the first camera actuator described above. The second-1 housing (1231) may be located in front of the second-2 housing (1232).

[0158] And the second-2 housing (1232) can be located at the rear end of the second-1 housing (1231). A lens part (1220) can be seated inside the second-2 housing (1232).

[0159] A second housing (1230) (or a second-2 housing (1232)) may have a hole formed on its side. A fourth coil (1251a) and a fifth coil (1251b) may be disposed in the hole. The hole may be positioned to correspond to a groove of the aforementioned moving assembly (1222).

[0160] In an embodiment, the second housing (1230) (particularly, the second-2 housing (1232)) may include a first side (1232a) and a second side (1232b). The first side (1232a) and the second side (1232b) may be positioned correspondingly to each other. For example, the first side (1232a) and the second side (1232b) may be arranged symmetrically with respect to a third direction. A second driving coil (1251) may be located on the first side (1232a) and the second side (1232b). And a second substrate portion (1270) may be seated on the outer surface of the first side (1232a) and the second side (1232b). In other words, a first substrate (1271) may be located on the outer surface of the first side (1232a), and a second substrate (1272) may be located on the outer surface of the second side (1232b).

[0161] Furthermore, the first guide portion (G1) and the second guide portion (G2) may be located on the first side (1232a) and the second side (1232b) of the second housing (1230) (particularly, the second-2 housing (1232)).

[0162] The first guide section (G1) and the second guide section (G2) may be positioned corresponding to each other. For example, the first guide section (G1) and the second guide section (G2) may be positioned opposite each other with respect to the third direction (Z-axis direction). Additionally, at least a portion of the first guide section (G1) and the second guide section (G2) may overlap each other in the second direction (Y-axis direction).

[0163] The first guide portion (G1) and the second guide portion (G2) may include at least one groove (e.g., guide groove) or recess. A first ball (B1) or a second ball (B2) may be seated in the groove or recess. Accordingly, the first ball (B1) or the second ball (B2) may move in a third direction (Z-axis direction) within the guide groove of the first guide portion (G1) or the guide groove of the second guide portion (G2).

[0164] Alternatively, the first ball (B1) or the second ball (B2) may move in a third direction along a rail formed on the inner side of the first side (1232a) of the second housing (1230) or a rail formed on the inner side of the second side (1232b) of the second housing (1230).

[0165] Thus, the first lens assembly (1222a) and the second lens assembly (1222b) can move in a third direction.

[0166] According to an embodiment, the first ball (B1) may be positioned on the upper side of the first lens assembly (1222a) or the second lens assembly (1222b). The second ball (B2) may be positioned on the lower side of the first lens assembly (1222a) or the second lens assembly (1222b). For example, the first ball (B1) may be positioned on the upper side of the second ball (B2). Accordingly, depending on the position, the first ball (B1) may overlap at least partially with the second ball (B2) along the first direction (X-axis direction).

[0167] Additionally, the first guide portion (G1) and the second guide portion (G2) may include a first guide groove (GG1a, GG2a) facing the first recess (RS1). Additionally, the first guide portion (G1) and the second guide portion (G2) may include a second guide groove (GG1b, GG2b) facing the second recess (RS2). The first guide groove (GG1a, GG2a) and the second guide groove (GG1b, GG2b) may be grooves extended in a third direction (Z-axis direction). Furthermore, the first guide groove (GG1a, GG2a) and the second guide groove (GG1b, GG2b) may be grooves of different shapes. For example, the first guide groove (GG1a, GG2a) may be a groove with a slanted side, and the second guide groove (GG1b, GG2b) may be a groove with a side perpendicular to the bottom surface.

[0168] The fifth magnet (1252b) may be positioned facing the fifth coil (1251b). Additionally, the fourth magnet (1252a) may be positioned facing the fourth coil (1251a).

[0169] The elastic member (not shown) may include a first elastic member (not shown) and a second elastic member (not shown). The first elastic member (not shown) may be coupled to the upper surface of the moving assembly (1222). The second elastic member (not shown) may be coupled to the lower surface of the moving assembly (1222). Additionally, the first elastic member (not shown) and the second elastic member (not shown) may be formed as plate springs as described above. Furthermore, the first elastic member (not shown) and the second elastic member (not shown) may provide elasticity for the movement of the moving assembly (1222). However, the elastic member may be placed at various locations, not limited to the locations described above.

[0170] And the second driving unit (1250) can provide a driving force to move the lens unit (1220) in a third direction (Z-axis direction). This second driving unit (1250) may include a second driving coil (1251) and a second driving magnet (1252). Furthermore, the second driving unit (1250) may further include a second Hall sensor unit. The second Hall sensor unit (1253) includes at least one fourth Hall sensor (1253a) and may be located inside or outside the second driving coil (1251).

[0171] The moving assembly can move in a third direction (Z-axis direction) by the electromagnetic force formed between the second driving coil (1251) and the second driving magnet (1252).

[0172] The second driving coil (1251) may include a fourth coil (1251a) and a fifth coil (1251b). The fourth coil (1251a) and the fifth coil (1251b) may be placed within a hole formed on the side of the second housing (1230). Additionally, the fourth coil (1251a) and the fifth coil (1251b) may be electrically connected to the second substrate portion (1270). Accordingly, the fourth coil (1251a) and the fifth coil (1251b) may receive current, etc., through the second substrate portion (1270).

[0173] And the second driving coil (1251) can be coupled to the second substrate part (1270) through a yoke, etc. Furthermore, in an embodiment, the second driving coil (1251) is a fixed element together with the second substrate part (1270). In contrast, the second driving magnet (1252) is a moving element that moves in the optical axis direction (Z-axis direction) together with the first and second assemblies.

[0174] The second driving magnet (1252) may include a fourth magnet (1252a) and a fifth magnet (1252b). The fourth magnet (1252a) and the fifth magnet (1252b) may be placed in the aforementioned groove of the moving assembly (1222) and may be positioned to correspond to the fourth coil (1251a) and the fifth coil (1251b). Additionally, the second driving magnet (1252) may be combined with the first and second lens assemblies (or moving assemblies) together with the yoke described later.

[0175] The base portion (1260) may be positioned between the lens portion (1220) and the image sensor (IS). Components such as filters may be fixed to the base portion (1260). Additionally, the base portion (1260) may be arranged to surround the aforementioned image sensor. With this configuration, the image sensor is free from foreign substances, etc., thereby improving the reliability of the device. However, this is omitted from some drawings below for explanation purposes.

[0176] Additionally, the second camera actuator (1200) may be a zoom actuator or an AF (Auto Focus) actuator. For example, the second camera actuator may support one or more lenses and move the lenses according to a control signal from a predetermined control unit to perform an auto-focusing function or a zoom function.

[0177] And the second camera actuator may be a fixed zoom or a continuous zoom. For example, the second camera actuator may provide movement of the lens group (1221).

[0178] In addition, the second camera actuator may be composed of a plurality of lens assemblies. For example, in addition to the first lens assembly (1222a) and the second lens assembly (1222b), at least one of a third lens assembly (not shown) and a guide pin (not shown) may be disposed in the second camera actuator. The above description may apply to this. Accordingly, the second camera actuator can perform a high-magnification zooming function through the second driving unit. For example, the first lens assembly (1222a) and the second lens assembly (1222b) may be moving lenses that move through the second driving unit and the guide pin (not shown), and the third lens assembly (not shown) may be a fixed lens, but is not limited thereto. For example, the third lens assembly (not shown) can perform the function of a focuser that forms light at a specific location, and the first lens assembly can perform the function of a variationr that re-forms the image formed by the third lens assembly (not shown), which acts as a focuser, at a different location. Meanwhile, the first lens assembly may be in a state where the magnification change is large because the distance to the subject or the image distance changes significantly, and the first lens assembly, which acts as a variationr, can play an important role in the change of focal length or magnification of the optical system. Meanwhile, the image formed by the first lens assembly, which acts as a variationr, may differ slightly depending on the location. Accordingly, the second lens assembly can perform a position compensation function for the image formed by the variationr. For example, the second lens assembly can perform the function of a compensator that accurately forms the image formed by the second lens assembly (1222b), which acts as a variationr, at the actual image sensor location. However, the configuration of the present embodiment will be described based on the drawings below.

[0179] The image sensor may be located inside or outside the second camera actuator. In an embodiment, as illustrated, the image sensor may be located outside the second camera actuator. For example, the image sensor may be located on a circuit board. The image sensor may receive light and convert the received light into an electrical signal. Additionally, the image sensor may be composed of a plurality of pixels in an array form. Furthermore, the image sensor may be located on an optical axis.

[0180] The second substrate portion (1270) may come into contact with the side of the second housing. For example, the second substrate portion (1270) is located on the outer surface (first side) of the first side and the outer surface (second side) of the second side of the second housing, particularly the second-2 housing, and may come into contact with the first side and the second side.

[0181] In addition, in the camera device according to the embodiment, the second driving unit may provide a driving force (F3A, F3B, F4A, F4B) that moves the first lens assembly (1222a) and the second lens assembly (1222b) of the lens unit (1220) along a third direction (Z-axis direction). As described above, this second driving unit may include a second driving coil (1251) and a second driving magnet (1252). The lens unit (1220) may move along the third direction (Z-axis direction) by the electromagnetic force formed between the second driving coil (1251) and the second driving magnet (1252).

[0182] At this time, the fourth coil (1251a) and the fifth coil (1251b) may be placed in a hole formed in the side of the second housing (1230) (e.g., the first side and the second side). The fifth coil (1251b) may be electrically connected to the first substrate (1271). The fourth coil (1251a) may be electrically connected to the second substrate (1272). Accordingly, the fourth coil (1251a) and the fifth coil (1251b) may receive a driving signal (e.g., current) from a driving driver on the circuit board of the circuit board (1300) through the second substrate portion (1270).

[0183] At this time, the first lens assembly (1222a) on which the fourth magnet (1252a) is mounted can move along the third direction (Z-axis direction) by means of the electromagnetic force (F3A, F3B) between the fourth coil (1251a) and the fourth magnet (1252a). Additionally, the second lens group (1221b) mounted on the first lens assembly (1222a) can also move along the third direction.

[0184] And, due to the electromagnetic force (F4A, F4B) between the fifth coil (1251b) and the fifth magnet (1252b), the second lens assembly (1222b) on which the fifth magnet (1252b) is mounted can move along the third direction (Z-axis direction). Additionally, the third lens group (1221c) mounted on the second lens assembly (1222b) can also move along the third direction.

[0185] Accordingly, as described above, the focal length or magnification of the optical system can be changed by moving the second lens group (1221b) and the third lens group (1221c). In an example, the magnification can be changed by moving the second lens group (1221b). In other words, zooming can be performed. Additionally, the focus can be adjusted by moving the third lens group (1221c). In other words, auto-focusing can be performed. With this configuration, the second camera actuator can be a fixed zoom or a continuous zoom.

[0186] FIG. 11 is a perspective view illustrating a circuit board according to an embodiment, FIG. 12 is a perspective view of a circuit board and a second camera actuator according to an embodiment, FIG. 13 is an exploded perspective view of a circuit board according to an embodiment, FIG. 14 is a perspective view of a circuit board and an image sensor according to an embodiment, FIG. 15 is a view taken by cutting along II' in FIG. 11, FIG. 16 is a view taken by cutting along JJ' in FIG. 11, and FIG. 17 is a view taken by cutting along KK' in FIG. 11.

[0187] Referring to FIGS. 11 to 14, the circuit board (1300) according to the embodiment may be placed on the outside of the second camera actuator (1200). The circuit board (1300) according to the embodiment is referred to as a 'main board' and will be described using this term below.

[0188] And the main substrate (1300) can be positioned at the rear end of the second camera actuator (1200) along the optical axis direction. Accordingly, the first camera actuator, the second camera actuator (1200), and the main substrate (1300) can be positioned sequentially along the optical axis direction.

[0189] The main substrate (1300) according to the embodiment may include a central substrate portion (1310) and a side substrate portion (1320). The central substrate portion (1310) may overlap with the second camera actuator in the optical axis direction (Z-axis direction). An image sensor (IS) may be disposed on the central substrate portion (1310). The central substrate portion (1310) and the image sensor (IS) may be electrically connected. A detailed explanation thereof will be provided later.

[0190] Additionally, the side substrate portion (1320) may be located on the side of the first and second camera actuators. In particular, the side substrate portion (1320) is connected to the central substrate portion (1310) and may extend from the central substrate portion (1310) to the side of the second camera actuator (1200) or the side of the first camera actuator. In the drawing, the side substrate portion (1320) may extend to the first camera actuator. Furthermore, there may be multiple side substrate portions (1320). For example, multiple side substrate portions may be positioned correspondingly (e.g., facing each other) with respect to the second camera actuator or the optical axis. Additionally, the side substrate portion (1320) may be in contact with the first side or the second side of the second camera actuator. For example, the second substrate portion according to the embodiment may be placed on the side of the second camera actuator. For example, the second substrate portion may come into contact with the side of the second camera actuator. And the first substrate portion according to the embodiment may be disposed on the side of the first camera actuator. For example, the first substrate portion may come into contact with the side of the first camera actuator.

[0191] Additionally, the main board (1300) can be electrically connected to the first camera actuator or the second camera actuator (1200) through the side board portion (1320).

[0192] Additionally, the main board (1300) may include a circuit board having a wiring pattern that can be electrically connected, such as a rigid printed circuit board (Rigid PCB), a flexible printed circuit board (Flexible PCB), or a rigid-flexible printed circuit board (Rigid Flexible PCB). However, it is not limited to these types. A detailed explanation thereof will be provided later.

[0193] The main board (1310) may further include a connector (CN) that is electrically connected to an external electronic device. Through the connector (CN), the camera device or circuit board may be electrically connected to an external electronic device. For example, the connector (CN) may be electrically connected to a processor, etc., of an electronic device such as a terminal. Additionally, the main board (1300) may be electrically connected to another camera module within the terminal or to a processor of the terminal. Through this, the camera actuator and the camera device including it described above can transmit and receive various signals within the terminal.

[0194] Furthermore, the central substrate portion (1310) of the main substrate (1300) may be bent along the optical axis direction. Additionally, the central substrate portion (1310) may be extended along the optical axis direction. The following description will be based on the central substrate portion (1310), excluding the side substrate portion (1320). Therefore, the central substrate portion (1310) will be described interchangeably as the 'main substrate'.

[0195] And the main board (1310) may include a first main board (SA1) on which an image sensor is mounted, a second main board (SA2) spaced apart from the first main board, and a connecting board (SA3) positioned between the first main board (SA1) and the second main board (SA2). Accordingly, the connecting board (SA3) may be connected to the first main board (SA1) and the second main board (SA2). In an embodiment, the image sensor (IS) may be located between the camera actuator (particularly the second camera actuator) and the main board (1300), as described above. Additionally, the image sensor (IS) may overlap at least partially with the second camera actuator and the main board (1300) in the optical axis direction (Z-axis direction).

[0196] Since the first main board (SA1) has an image sensor (IS) mounted on it, it can overlap with the image sensor (IS) in the optical axis direction. Furthermore, the area of ​​the first main board (SA1) may be larger than the area of ​​the image sensor (IS). Here, the area may be the area with respect to the plane (XY).

[0197] In an embodiment, the first main substrate (SA1) may include a first surface (S1) and a second surface (S2) facing each other. An image sensor (IS) may be mounted on the first surface (S1). The second surface (S2) may be an outer surface facing the second main substrate (SA2) or the connecting substrate (SA3). Additionally, the first surface (S1) and the second surface (S2) may be surfaces facing each other. Furthermore, the first surface (S1) and the second surface (S2) may overlap at least partially in the optical axis direction (Z-axis direction).

[0198] Additionally, the first and third rigid substrates (RP1, RP3) described below may include a first surface (S1). And the second and fourth rigid substrates (RP2, RP4) may include a second surface (S2).

[0199] In addition, the first main board (SA1) and the second main board (SA2) may be spaced apart in the direction of the optical axis (Z-axis direction). In addition, a flexible (or flexible) circuit board and a rigid circuit board may be positioned on the first main board (SA1) and the second main board (SA2) in the central board portion (1310). At this time, the stacking direction between the flexible circuit board and the rigid circuit board in the first main board (SA1) may be different from the stacking direction between the flexible circuit board and the rigid circuit board in the second main board (SA2). For example, the stacking direction between the flexible circuit board and the rigid circuit board in the first main board (SA1) may be perpendicular to the stacking direction between the flexible circuit board and the rigid circuit board in the second main board (SA2). Furthermore, the stacking direction between the flexible circuit board and the rigid circuit board in the first main board (SA1) may correspond to the direction of the optical axis. And in the second main board (SA2), the stacking direction between the flexible circuit board and the rigid circuit board can correspond to the first direction.

[0200] Furthermore, the first main board (SA1) may include a groove (GV) disposed on the opposite side (M2) of the side (M1) facing the second camera actuator. That is, the groove (GV) may be located on the second rigid board described later.

[0201] According to the embodiment, the main board (1300, 1310) may include a flexible circuit board and a rigid circuit board. In this specification, the flexible circuit board of the main board (1300, 1310) is described as a 'flexible board', and the rigid circuit board of the main board (1310) is described as a 'rigid board' (e.g., a first rigid board, etc.).

[0202] First, the flexible substrate (FP) can be placed on the first main substrate (SA1), the second main substrate (SA2), and the connecting substrate (SA3). In other words, the flexible substrate (FP) can be a common element in each area of ​​the main substrate (1310). In an embodiment, the flexible substrate (FP) can be integral or separate. For example, the ease of manufacturing and assembly can be improved by using an integral flexible substrate (FP).

[0203] Additionally, the flexible substrate (FP) may be placed between the first rigid substrate (RP1) and the second rigid substrate (RP2). Additionally, the flexible substrate (FP) may be placed between the third rigid substrate (RP3) and the fourth rigid substrate (RP4).

[0204] Additionally, the flexible substrate (FP) can be folded from the first main substrate (SA1) to the connecting substrate (SA3) (or the second main substrate).

[0205] And the main board (1310) may include a first rigid board (RP1) disposed on the surface (first surface, S1) facing the second camera actuator on the first main board (SA1), and a second rigid board (RP2) corresponding to the first rigid board (RP1) with respect to the flexible board (FP). In other words, the first rigid board (RP1) may be located inside the flexible board (FP), and the second rigid board (RP2) may be located outside the flexible board (FP).

[0206] Additionally, the main substrate (1310) may include a third rigid substrate (RP3) located on the inner or lower side relative to the flexible substrate (FP) on the second main substrate (SA2), and a fourth rigid substrate (RP4) corresponding to the third rigid substrate (RP3) relative to the flexible substrate (FP). In other words, the third rigid substrate (RP3) may be located on the lower side of the flexible substrate (FP), and the fourth rigid substrate (RP4) may be located on the upper side of the flexible substrate (FP). Furthermore, the third rigid substrate (RP3), the flexible substrate (FP), and the fourth rigid substrate (RP4) may be sequentially stacked in the first direction on the second main substrate (SA2). Additionally, the main substrate (1310) may include a first rigid substrate section (RP1, RP3), a second rigid substrate section (RP2, RP4), and a flexible substrate (FP) disposed between the first rigid substrate section and the second rigid substrate section. The first rigid substrate section may include a first rigid substrate (RP1) and a third rigid substrate (RP3). The second rigid substrate section may include a second rigid substrate (RP2) and a fourth rigid substrate (RP4).

[0207] In an embodiment, a groove (GV) may be formed on one side of the first main substrate (SA1). For example, a groove may be formed on the lower surface of the first main substrate (SA1). A connecting substrate (SA3) may be located within or in the groove (GV). Furthermore, the first main substrate (SA1) may include an overlapping area (OEA) in which a portion of the first surface (S1) and the groove overlap each other in a direction from the second surface (S2) toward the first surface (S1). In other words, the overlapping area (OEA) may be an area where the second groove (A2) overlaps with the first surface (S1) in the optical axis direction (Z-axis direction). Accordingly, the first rigid substrate part or the first rigid substrate may include an overlapping area (OEA). At this time, the overlapping area (OEA) may include the first area described later. Accordingly, the connecting substrate (SA3) may be spaced apart from the first region (or overlapping region (OEA)) within the groove (GV).

[0208] In other words, the first rigid substrate portion or the first rigid substrate (RP1) may include an overlapping area (OEA) or a first area, which is a protrusion protruding toward the groove (GV), unlike the second rigid substrate portion or the second rigid substrate (RP2). That is, the overlapping area (OEA) may correspond to the protrusion or the first area.

[0209] In an example, in the overlapping area (OEA), the first surface may not overlap with the second surface (S2) in the direction from the second surface (S2) toward the first surface (S1). That is, in the overlapping area (OEA), the first surface (S!) and the second surface (S2) may not overlap each other.

[0210] Additionally, one side of the overlapping area (OEA) may be positioned on the same line or plane as the first surface (S1), which is one side of the first main substrate. Alternatively, one side of the overlapping area (OEA) may form the same plane as the first surface (S1), which is one side of the first main substrate. The direction from the second surface (S2) toward the first surface (S1) may be parallel to the optical axis direction or the third direction. Additionally, the direction from the second surface (S2) toward the first surface (S1) may correspond to the opposite direction of the optical axis direction or the third direction.

[0211] In addition, the horizontal width (W3) of the first surface (S1) on the first main board may be larger than the vertical width (L1, L2).

[0212] Additionally, the area of ​​the first surface (S1) of the first main substrate may be larger than the area of ​​the second surface (S2). This is due to the overlapping area (OEA) described above.

[0213] Additionally, the flexible substrate (FP) may include a first exposed area (EA1) exposed by a groove (GV) on the first main substrate (SA1). Here, the first exposed area (EA1) may be an area where the flexible substrate (FP) is exposed. In an embodiment, the groove (GV) may be located on the first rigid substrate (RP1) and the second rigid substrate (RP2). In particular, the groove (GV) may be positioned along the edges of the first rigid substrate (RP1) and the second rigid substrate (RP2).

[0214] In an embodiment, the length (W3) in the second direction (Y-axis direction) of the second rigid substrate (RP2) may be greater than the length (L1, L2) in the first direction (X-axis direction). Accordingly, the groove (GV) may be placed on the long side of the second rigid substrate (RP2). With this configuration, the length in the first direction of the main substrate (1310) may not be deformed according to the width of the connecting substrate (SA3). As a result, the length in the first direction of the main substrate (1310) may not increase. Furthermore, the length in the first direction of the camera module or camera device according to the embodiment may be minimized. Moreover, the thickness of the electronic device, such as a terminal on which the camera module is mounted, may also be minimized.

[0215] Additionally, the main substrate (1300) may have a maximum length (L1) in the first direction (X-axis direction) that is greater than the length (L2) in the first direction (X-axis direction) in the area where the groove (GV) is formed.

[0216] Additionally, the groove (GV) may correspond to the first rigid substrate (RP1) based on the flexible substrate (FP). Furthermore, the first exposed area (EA1) may overlap with a portion of the first rigid substrate (RP1) in the direction of the optical axis.

[0217] In addition, the first rigid substrate (RP1) may also have a surface in contact with the flexible substrate (FP) exposed by the groove (GV). As an example, the first rigid substrate (RP1) may include a second exposed area (EA2) exposed by the groove (GV). The second exposed area (EA2) is an area where the first rigid substrate (RP1) is exposed, and it is identical to the first exposed area (EA1) described above with respect to the first main substrate (SA1). The first exposed area (EA1) and the second exposed area (EA2) may be arranged offset along the optical axis direction. That is, the first exposed area (EA1) and the second exposed area (EA2) may not overlap each other along the optical axis direction.

[0218] The connecting board (SA3) can be formed integrally with or connected to the flexible board (FP) on the first main board (SA1).

[0219] And in the first main board, the width (W3) of the flexible board (FP) may be larger than the width (W5) of the connecting board (SA3). Width refers to the length in the second direction.

[0220] Furthermore, due to the groove (GV) described above, the area of ​​the first rigid substrate (RP1) may be larger than the area of ​​the second rigid substrate (RP2). Additionally, the groove (GV) may be located on the opposite side of the image sensor (IS) relative to the flexible substrate (FP). That is, the groove (GV) may be located on the second rigid substrate (RP2), rather than the first rigid substrate (RP1), which is electrically connected to the image sensor via a wire (W), etc. With this configuration, the flexible substrate (FP) can be easily bent or folded while facilitating the securing of space for the connection of the wire (W), etc., between the image sensor (IS) and the first rigid substrate (RP1). At this time, the curvature portion generated as the flexible substrate (FP) is bent is located within the groove (GV), so the length in the first direction (X-axis direction) of the circuit board can be avoided. Furthermore, the length in the first direction of the main board (1300) can be minimized. Therefore, the thickness of electronic devices such as terminals can also be minimized.

[0221] In addition, the width (W1) of the flexible substrate (FP) in the first exposed area (EA1) may be smaller than the width (W2) of the groove (GV). This allows space to be easily secured for bending or folding the flexible substrate (FP). Furthermore, a connection board (SA3) for connecting to an external electronic device can be secured through the groove (GV) in a single bend. This simplifies the process for bending the flexible substrate (FP), thereby improving the productivity of the main board. Moreover, the number of bends or folds is reduced, thereby decreasing the tolerance associated with bending and improving assembly.

[0222] In addition, the width (W3) in the second direction (Y-axis direction) of the first main board (SA1) may be larger than the width (W4) in the second direction (Y-axis direction) of the second main board (SA2).

[0223] Additionally, the width of the flexible substrate (FP) may decrease as it moves from the first exposed area (EA1) toward the second main substrate (SA2). For example, the width of the flexible substrate (FP) may increase as it moves toward the first direction (X-axis direction). Accordingly, bending or flexing of the flexible substrate (FP) can be easily achieved.

[0224] Furthermore, the main board (1300) may be composed of multiple layers depending on the region. And the main board (1300) may be composed of holes or multiple layers for circuit patterns inside each region.

[0225] For example, the main board (1300), the first side board section (1320), and the second side board section (1330) may have a plurality of layers of rigid printed circuit boards and flexible (flexible) printed circuit boards. For example, the main board (1300) may have a structure in which a flexible printed circuit board, a rigid printed circuit board, and a flexible printed circuit board are sequentially stacked. In addition, a reinforcing material or a reinforcing plate may be additionally disposed in the area where the flexible printed circuit board is disposed in the main board (1300), the first side board section (1320), and the second side board section (1330). For example, a reinforcing plate may be additionally disposed on the upper or lower part of the main board (1300).

[0226] Additionally, in this specification, the first side substrate portion or the second side substrate portion may be made of a flexible printed circuit board. A rigid printed circuit board may be disposed on the inside and / or outside of the flexible printed circuit board in the first side substrate portion or the second side substrate portion. In this case, the first side region and the second side region may correspond to the region where the rigid printed circuit board is disposed in the first side substrate portion or the second side substrate portion.

[0227] And the second substrate portion (1270) may include a first substrate and a second substrate. The first substrate faces the side substrate portion and may partially contact the side substrate portion. Alternatively, the second substrate faces the side substrate portion and may partially contact the second side substrate portion.

[0228] Referring to FIGS. 15 to 17, the flexible substrate (FP) according to the embodiment may be located in common on the first main substrate (SA1), the second main substrate (SA2), and the connecting substrate (SA3) as described above. Additionally, the first rigid substrate (RP1) may be located on one side of the flexible substrate (FP) on the first main substrate (SA1). Furthermore, the second rigid substrate (RP2) may be located on the other side of the flexible substrate (FP) on the first main substrate (SA1).

[0229] Due to the groove (GV), the length in the first direction of the first rigid substrate (RP1) from the first main substrate (SA1) may be greater than the length in the first direction of the second rigid substrate (RP2). For example, the length in the first direction of the groove (GV) from the first main substrate (SA1) to the second rigid substrate (RP2) may correspond to the length in the first direction of the first rigid substrate (RP1).

[0230] In an example, the flexible substrate (FP) may be a printed circuit board made of a flexible or flexible material. Additionally, the flexible substrate (FP) may be composed of multiple layers. For example, the flexible substrate (FP) may be composed of a base layer and a coverlay layer. For example, the flexible substrate (FP) may have a structure in which a coverlay layer, a base layer, and a coverlay layer are sequentially stacked in a first direction (in a second main board or a connecting board). The base layer may be composed of a metal layer and a film layer, etc. For example, the film layer may be made of polyimide, and the metal layer may be made of copper (Cu). Additionally, the base layer may have a structure in which a metal layer, a film layer, and a metal layer are sequentially stacked in a first direction. Furthermore, the coverlay layer may be composed of an adhesive layer disposed on a surface in contact with the base layer and a film layer corresponding to the base layer with the adhesive in between.

[0231] The first rigid substrate (RP1) and the second rigid substrate (RP2) may also be composed of multiple layers. The first rigid substrate (RP1) and the second rigid substrate (RP2) may have the same or different thicknesses. Furthermore, the first rigid substrate (RP1) and the second rigid substrate (RP2) may be composed of different layers or the same layer.

[0232] For example, the first rigid substrate (RP1) may include a first bonding layer (BL1) in contact with the flexible substrate (FP). The first bonding layer (BL1) is one layer of the first rigid substrate (RP1) and may be positioned closest to the flexible substrate (FP).

[0233] Additionally, the first bonding layer (BL1) may be positioned offset along the groove (GV) and the optical axis direction. Alternatively, the first bonding layer (BL1) may not overlap along the groove (GV) and the optical axis direction.

[0234] The first bonding layer (BL1) may be made of various bonding materials. Additionally, the first bonding layer (BL1) may be an insulating material, but is not limited thereto.

[0235] In addition, the first rigid substrate (RP1) may further include a base layer, a plating layer, a bonding layer, a metal layer, a plating layer, a protective layer, etc., which are sequentially disposed on the first bonding layer (BL1) in a direction opposite to the optical axis direction. As described above, the base layer may consist of a film layer and a metal layer. The metal layer may consist of copper foil.

[0236] Additionally, the second rigid substrate (RP2) may include a second bonding layer (BL2) in contact with the flexible substrate (FP). The second bonding layer (BL2) is one layer of the second rigid substrate (RP2). The second bonding layer (BL2) may be positioned closest to the flexible substrate (FP). Furthermore, the second bonding layer (BL2) may be made of various bonding materials. Additionally, the second bonding layer (BL2) may be an insulating material, but is not limited thereto.

[0237] In addition, a first fixing part (ST1) may be further disposed on the second rigid substrate (RP2). The first fixing part (ST1) may be a reinforcing plate. Through this, the rigidity of the first main substrate (SA1) of the main substrate can be improved.

[0238] Furthermore, a third rigid substrate (RP3) may be positioned on one side of the flexible substrate (FP) on the second main substrate (SA2). The third rigid substrate (RP3) may have the same or different structure as the first rigid substrate (RP1).

[0239] Additionally, a fourth rigid substrate (RP4) may be located on the other side of the flexible substrate (FP) on the second main substrate (SA2). The fourth rigid substrate (RP4) may have the same or different structure as the second rigid substrate (RP2). Accordingly, the first rigid substrate (RP1), the second rigid substrate (RP2), the third rigid substrate (RP3), and the fourth rigid substrate (RP4) may all have different or the same thickness (or structure) among at least two or more of them.

[0240] In addition, a second fixing part (ST2) may be further disposed on the fourth rigid substrate (RP4). The second fixing part (ST2) may be a reinforcing plate. Through this, the rigidity of the first main substrate (SA1) of the main substrate can be improved.

[0241] Additionally, as an embodiment, the flexible substrate (FP) may be spaced apart from the first rigid substrate (RP1) in the optical axis direction (Z-axis direction) within the groove (GV). In other words, the flexible substrate (FP) may be spaced apart from the first rigid substrate (RP1) by a predetermined distance (dd1) in the optical axis direction within the groove (GV). Furthermore, the first bonding layer (BL1) may be placed only in a portion of the flexible substrate (FP) on the first main substrate (SA1). With this configuration, the bending of the flexible substrate (FP) may not be hindered by the first bonding layer (BL1) in the groove (GV). Accordingly, the occurrence of assembly errors in the circuit board or main board according to the embodiment is suppressed, and the productivity of the main board can be improved.

[0242] In addition, at least one of the flexible substrate (FP), the first rigid substrate (RP1), the second rigid substrate (RP2), the third rigid substrate (RP3), and the fourth rigid substrate (RP4) in the main substrate may be composed of a plurality of layers and may have holes or grooves for circuit patterns inside each substrate area.

[0243] Additionally, only a flexible substrate (FP) may be placed on the connecting substrate (RA3). That is, the first rigid substrate (RP1) to the fourth rigid substrate (RP4) may not be placed on the connecting substrate (RA3).

[0244] Additionally, the groove (GV) may include a first groove (A1) of the first rigid substrate part and a second groove (A2) of the second rigid substrate part. The first groove (A1) may be located between the first rigid substrate (RP1) and the third rigid substrate (RP3). The second groove (A2) may be located between the second rigid substrate (RP2) and the fourth rigid substrate (RP4). The first groove (A1) and the second groove (A2) may overlap at least partially in the direction of the optical axis. Accordingly, the first groove (A1) may correspond at least partially to the second groove (A2). Furthermore, the above-described protrusion (OEA) protrudes toward the first groove (A1). The protrusion (OEA) and the flexible substrate (FP) may be spaced apart from each other in the direction of the optical axis and arranged to face each other. In addition, the flexible substrate (FP) may be exposed by the second groove (A2) as described below, and may have a second flexible region.

[0245] And the depth of the first groove (A1) (length in the third direction) may be less than or equal to the depth of the second groove (A2) (length in the third direction).

[0246] Furthermore, the flexible substrate (FP) may include a first flexible region (A1) and a second flexible region (A2). The second flexible region (A2) of the flexible substrate (FP) may be exposed from the second rigid substrate (RP2) or the second rigid substrate portion. That is, the second flexible region corresponds to the second groove (A2) and is referred to interchangeably as 'A2'. Additionally, the first flexible region (A1) of the flexible substrate (FP) may be exposed from the first rigid substrate (RP1) or the second rigid substrate portion. Accordingly, the first flexible region corresponds to the first hole (A!) and is referred to interchangeably as 'A1'.

[0247] The second flexible region (A2) may overlap or be superimposed with a part of the first rigid substrate (RP1) in the direction from the second rigid substrate (RP2) toward the first rigid substrate (RP1) (opposite to the third direction).

[0248] The exposed first flexible region (A1) or second flexible region (A2) of the flexible substrate (FP) may form a gap between it and the first rigid substrate (RP1). For example, the first flexible region (A1) of the flexible substrate (FP) may be spaced apart from the first region (OEA) in the optical axis direction. Additionally, the second flexible region (A2) may also form a gap with the second rigid substrate (RP2). Accordingly, a portion of the second flexible region (A2) may be spaced apart from the second rigid substrate (RP2) in the optical axis direction.

[0249] Furthermore, the width of the second flexible region (A2) of the flexible substrate may be larger than the width of the first flexible region (A1).

[0250] And the first rigid substrate (RP1) may be exposed at least partially by the first groove (A1).

[0251] Additionally, the flexible substrate (FP) can be extended from the bottom surface of the second groove (A2).

[0252] Additionally, as an example, the flexible substrate (FP) may be spaced apart from the first rigid substrate (RP1) in at least a portion of the optical axis direction. This may correspond to the details described in the protrusion or overlapping area (OEA) above.

[0253] FIG. 18 is a cross-sectional view of a circuit board according to another embodiment.

[0254] A circuit board or main board according to another embodiment may include a first main board (SA1), a second main board (SA2), and a connecting board (SA3) as described above. Additionally, the main board may include a flexible board (FP), a first rigid board (RP1), a second rigid board (RP2), a third rigid board (RP3), and a fourth rigid board (RP4). That is, the above description may be applied identically, except for the details described below.

[0255] In a main substrate according to another embodiment, the first bonding layer (BL1) of the first rigid substrate (RP1) may be spaced apart from the groove (GV) or the first exposed area (EA1) by a predetermined distance (dd2). That is, the area of ​​the first rigid substrate (RP1) may be greater than the sum of the area of ​​the first exposed area and the area of ​​the first bonding layer (BL1). Additionally, the length in the second direction of the first rigid substrate (RP1) may be greater than the sum of the length in the second direction of the first exposed area and the length in the second direction of the first bonding layer (BL1).

[0256] The first main substrate (SA1) may have a first bonding layer (BL1). The first bonding layer (BL1) may be in contact with the first rigid substrate (RP1) and the flexible substrate (FP). Each layer may be bonded to each other by the first bonding layer (BL1).

[0257] In addition, the first bonding layer may not be disposed in the gap space in the optical axis direction between the flexible substrate (FP) and the first rigid substrate (RP1). In other words, the overlapping area (OEA) and the first bonding layer (BL1) may not be in contact and may not overlap in the optical axis direction. Furthermore, at least a portion of the first bonding layer (BL1) may not overlap with the first groove (A1) in the optical axis direction (Z-axis direction). With this configuration, bending of the flexible substrate (FP) can be easily achieved.

[0258] Additionally, the sidewall of the groove (GV) and the first bonding layer (BL1) may be offset along the optical axis direction. Furthermore, the sidewall of the groove (GV) and the first bonding layer (BL1) may be offset from each other in a first direction.

[0259] In addition, in a main substrate according to another embodiment, the second bonding layer (BL2) of the second rigid substrate (RP2) may be spaced apart from the groove (GV) or the first exposed area (EA1) by a predetermined distance (dd3). That is, the area of ​​the second rigid substrate (RP2) may be greater than the sum of the area of ​​the first exposed area and the area of ​​the second bonding layer (BL2). Also, the length in the second direction of the second rigid substrate (RP2) may be greater than the sum of the length in the second direction of the first exposed area and the length in the second direction of the second bonding layer (BL2).

[0260] Additionally, the sidewall of the groove (GV) and the second bonding layer (BL2) may be offset along the optical axis direction. Also, the sidewall of the groove (GV) and the second bonding layer (BL2) may be offset from each other in the first direction.

[0261] With this configuration, the phenomenon of the first bonding layer (BL1) spreading into the first exposed area (EA1) due to pressure such as pressing can be suppressed. Furthermore, the phenomenon of the second bonding layer (BL2) spreading into the first exposed area (EA1) due to pressure such as pressing can also be suppressed. Accordingly, the problem of the curvature increasing due to bending of the flexible substrate (FP) by the first bonding layer (BL1) or the second bonding layer (BL2) can be reduced. Furthermore, bending of the flexible substrate (FP) can be easily performed, which can reduce the occurrence of cracks during mounting. In addition, the reliability of the camera module can be improved.

[0262] FIG. 19 is a perspective view of a mobile terminal with a camera device applied according to an embodiment.

[0263] Referring to FIG. 19, the mobile terminal (1500) of the embodiment may include a camera device (1000), a flash module (1530), and an autofocus device (1510) provided on the rear.

[0264] The camera device (1000) may include an image capturing function and an autofocus function. For example, the camera device (1000) may include an autofocus function using an image.

[0265] The camera device (1000) processes still image or video frame obtained by an image sensor in shooting mode or video call mode.

[0266] The processed image frame may be displayed on a designated display unit and stored in memory. A camera (not shown) may also be placed on the front of the mobile terminal body.

[0267] For example, the camera device (1000) may include a first camera device (1000A) and a second camera device (1000B), and the first camera device (1000A) may enable the implementation of AF or zoom functions along with OIS. Additionally, AF, zoom, and OIS functions may be performed by the second camera device (1000B). At this time, since the first camera device (1000A) includes both the first camera actuator and the second camera actuator described above, the miniaturization of the camera device can be easily achieved through changing the light path.

[0268] The flash module (1530) may include a light-emitting element that emits light inside. The flash module (1530) may be operated by the operation of the camera of the mobile terminal or by the control of the user.

[0269] The autofocus device (1510) may include one of the packages of surface light-emitting laser elements as a light-emitting part.

[0270] The autofocus device (1510) may include an autofocus function using a laser. The autofocus device (1510) may be mainly used in conditions where the autofocus function using the image of the camera device (1000) is degraded, such as in a close distance of 10m or less or in a dark environment.

[0271] The autofocus device (1510) may include a light-emitting part comprising a vertical cavity surface-emitting laser (VCSEL) semiconductor device and a light-receiving part that converts light energy into electrical energy, such as a photodiode.

[0272] FIG. 20 is a perspective view of a vehicle equipped with a camera device according to an embodiment.

[0273] For example, FIG. 20 is an exterior view of a vehicle equipped with a vehicle driving assistance device to which a camera device (1000) according to an embodiment is applied.

[0274] Referring to FIG. 20, the vehicle (700) of the embodiment may be equipped with wheels (13FL, 13FR) that rotate by a power source and a predetermined sensor. The sensor may be a camera sensor (2000), but is not limited thereto.

[0275] The camera (2000) may be a camera sensor to which the camera device (1000) according to the embodiment is applied. The vehicle (700) of the embodiment may acquire image information through a camera sensor (2000) that captures a front image or a surrounding image, and may determine a situation where a lane is not identified using the image information and generate a virtual lane when it is not identified.

[0276] For example, a camera sensor (2000) captures the front of a vehicle (700) to obtain a front image, and a processor (not shown) can obtain image information by analyzing objects included in the front image.

[0277] For example, if objects such as a median strip, curb, or roadside tree corresponding to a lane, adjacent vehicle, driving obstruction, and indirect road marking are captured in an image captured by a camera sensor (2000), the processor can detect these objects and include them in the image information. At this time, the processor can obtain distance information with respect to the objects detected through the camera sensor (2000) to further supplement the image information.

[0278] The image information may be information about an object captured in the image. Such a camera sensor (2000) may include an image sensor and an image processing module.

[0279] The camera sensor (2000) can process still images or videos obtained by an image sensor (e.g., CMOS or CCD).

[0280] The image processing module can process still images or videos acquired through an image sensor to extract necessary information and transmit the extracted information to a processor.

[0281] At this time, the camera sensor (2000) may include a stereo camera to improve the measurement accuracy of the object and to obtain more information such as the distance between the vehicle (700) and the object, but is not limited thereto.

[0282] Although the invention has been described above with reference to embodiments, this is merely illustrative and does not limit the invention. Those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments may be modified and implemented. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the invention as defined in the appended claims.

Claims

Claim 1 A camera device comprising: a camera actuator; a main substrate; and an image sensor disposed between the camera actuator and the main substrate along an optical axis direction; wherein the main substrate comprises: a first main substrate including a first surface on which the image sensor is mounted and a second surface opposite to the first surface; and a connecting substrate connected to the first main substrate; wherein a groove is formed on the second surface of the first main substrate, a part of the connecting substrate is disposed in the groove, and the first main substrate includes an overlapping area in which the first surface and a part of the groove overlap each other in a direction toward the first surface from the second surface. Claim 2 In claim 1, the connecting substrate is a camera device spaced apart from the overlapping area within the groove. Claim 3 A camera device according to claim 1, wherein the overlapping area of ​​the first surface does not overlap with the second surface in the direction toward the first surface from the second surface. Claim 4 A camera device according to claim 1, wherein one side of the overlapping area is positioned on the same line as one side of the first main substrate. Claim 5 A camera device according to claim 1, wherein the width of the first surface of the first main board is greater than the height. Claim 6 A camera device according to claim 1, wherein the area of ​​the first surface of the first main board is larger than the area of ​​the second surface. Claim 7 In claim 1, the camera device wherein the connecting substrate is integrally formed with the flexible substrate of the first main substrate. Claim 8 In claim 7, a camera device in which the width of the flexible substrate of the first main substrate is greater than the width of the connecting substrate. Claim 9 A camera device comprising: a camera actuator; a main substrate; and an image sensor disposed between the camera actuator and the main substrate along an optical axis direction; wherein the main substrate comprises a first rigid substrate, a second rigid substrate, and a flexible substrate disposed between the first rigid substrate and the second rigid substrate, the flexible substrate comprises a first flexible region and a second flexible region, the second flexible region of the flexible substrate is exposed from the second rigid substrate, and the second flexible region overlaps with a portion of the first rigid substrate in a direction from the second rigid substrate toward the first rigid substrate. Claim 10 In claim 9, the camera device in which the exposed first flexible region or second flexible region of the flexible substrate has a gap formed between it and the first rigid substrate. Claim 11 A camera device according to claim 9, wherein the width of the second flexible region of the exposed flexible substrate is greater than the width of the first flexible region. Claim 12 A camera device comprising: a camera actuator; a main substrate; and an image sensor disposed between the camera actuator and the main substrate along the optical axis direction; wherein the main substrate comprises a first rigid substrate, a second rigid substrate, and a flexible substrate disposed between the first rigid substrate and the second rigid substrate, the image sensor is disposed on the first rigid substrate, the first rigid substrate comprises a first groove, the second rigid substrate comprises a second groove that corresponds at least partially to the first groove, the first rigid substrate comprises a protrusion protruding toward the first groove, the protrusion and the flexible substrate are disposed facing each other with spaced apart, and the flexible substrate is exposed by the second groove. Claim 13 A camera device according to claim 12, wherein the first rigid substrate comprises a first surface and the second rigid substrate comprises a second surface facing the first surface. Claim 14 In claim 12, the first rigid substrate is a camera device in which at least a portion is exposed by the first groove. Claim 15 In paragraph 12, the flexible substrate is a camera device extending from the bottom surface of the second groove. Claim 16 In claim 12, the flexible substrate is a camera device that is spaced at least partially apart from the first rigid substrate in the optical axis direction. Claim 17 In claim 12, the camera device comprises a main substrate including a first bonding layer in contact with the first rigid substrate and the flexible substrate. Claim 18 A camera device according to claim 17, wherein the first bonding layer is not disposed in the spaced-apart space located between the flexible substrate and the first rigid substrate in the direction of the optical axis. Claim 19 In claim 17, the camera device wherein at least a portion of the first bonding layer does not overlap with the first groove and the optical axis direction.

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