Self-diagnosis method of inspection device and inspection device

Abstract

The self-diagnosis method of the inspection device (80) according to the present disclosure includes a placement process, an irradiation process, a light reception process, and a process for determining an abnormality in the amount of light. The placement process involves moving a maintenance unit (400) which is provided with a diagnostic unit (700) having a light attenuation member (720) that attenuates light as a maintenance unit that maintains the outer periphery of a polymerization substrate (T), thereby placing the attenuation member between an illumination unit (610, 620) that irradiates light onto the polymerization substrate and an imaging unit (51, 520) that captures the polymerization substrate. The irradiation process involves irradiating light from the illumination unit at a set amount of light after the placement process. The light reception process involves receiving light that has been irradiated from the illumination unit and passed through the attenuation member after the irradiation process using an imaging unit. The process of determining an abnormality in the amount of light determines an abnormality in the amount of light irradiated from the illumination unit based on the amount of light received by the imaging unit after the light receiving process.

Description

Technology Field

[0001] The present disclosure relates to a self-diagnosis method for an inspection device and an inspection device. Background Technology

[0002] A bonding system is known that includes a bonding device for forming a polymerized substrate by bonding substrates such as semiconductor wafers together, and an inspection device for inspecting the polymerized substrate formed by the bonding device (see Patent Document 1). Prior art literature

[0003] Japanese Patent Publication No. 2011-187716 The problem to be solved

[0004] The present disclosure provides a technology that facilitates the maintenance of measurement precision of an inspection device. means of solving the problem

[0005] A self-diagnostic method of an inspection device according to one aspect of the present disclosure is a self-diagnostic method of an inspection device for inspecting a polymerized substrate in which a first substrate and a second substrate are bonded, comprising a placement process, an irradiation process, a light reception process, and a process for determining an abnormality in the amount of light. The placement process involves moving a holding part, which is a holding part that holds the outer periphery of the polymerized substrate, and a diagnostic part having a light-attenuating member that attenuates light, so that a lighting part is placed above or below the holding part and irradiates light onto the polymerized substrate held by the holding part, and an imaging part is placed at a position opposite to the lighting part in the other above or below the holding part and images the polymerized substrate held by the holding part. The irradiation process involves irradiating light from the lighting part at a set amount of light after the placement process. The light reception process involves receiving light irradiated from the lighting part and transmitted through the light-attenuating member using an imaging part after the irradiation process. The process of determining an abnormality in the amount of light determines an abnormality in the amount of light irradiated from the illumination unit based on the amount of light received by the imaging unit after the light receiving process. Effects of the invention

[0006] According to the present disclosure, it is possible to facilitate the maintenance of measurement precision of an inspection device. Brief explanation of the drawing

[0007] Figure 1 is a schematic diagram showing the configuration of a joining system according to an embodiment. FIG. 2 is a schematic diagram showing the state before bonding the first substrate and the second substrate according to an embodiment. Figure 3 is a schematic diagram showing the configuration of a bonding device according to an embodiment. Figure 4 is a schematic diagram showing the configuration of an inspection device according to an embodiment. FIG. 5 is a schematic diagram showing the configuration of the maintenance part of the inspection device according to an embodiment. Figure 6 is a figure showing an example of a method for capturing a measurement mark. Figure 7 is a figure showing an example of a measurement mark. FIG. 8 is a figure showing the configuration of a damping member according to an embodiment. Figure 9 is a figure showing an example of a correction mark formed on a damping member. FIG. 10 is a block diagram showing the configuration of a control device according to an embodiment. FIG. 11 is a flowchart showing an example of the sequence of processes performed by the bonding system until a polymerized substrate is formed by a bonding device. Figure 12 is a flowchart showing an example of the sequence of light quantity check processing. Figure 13 is a flowchart showing an example of the sequence of optical axis check processing. Specific details for implementing the invention

[0008] Hereinafter, a self-diagnosis method for an inspection device and an embodiment for implementing the inspection device according to the present disclosure (hereinafter referred to as "embodiment") will be described in detail with reference to the drawings. Furthermore, the self-diagnosis method and the inspection device according to the present disclosure are not limited by this embodiment. Additionally, each embodiment may be appropriately combined within a scope that does not contradict the processing contents. Furthermore, in each of the following embodiments, the same reference numerals are assigned to identical parts, and redundant descriptions are omitted.

[0009] In addition, in the embodiments described below, expressions such as 'constant,' 'orthogonal,' 'perpendicular,' or 'parallel' may be used; however, these expressions are not strictly required to be 'constant,' 'orthogonal,' 'perpendicular,' or 'parallel.' That is, each of the above expressions allows for errors, such as manufacturing precision or installation precision.

[0010] In addition, in each drawing referenced below, mutually orthogonal X-axis, Y-axis, and Z-axis directions are defined to make the explanation easier to understand, and an orthogonal coordinate system is shown with the Z-axis direction as the vertical upward direction. Also, the direction of rotation with the vertical axis as the center of rotation is sometimes referred to as the θ direction.

[0011] <Composition of the Joining System>

[0012] First, the configuration of the bonding system according to an embodiment will be described with reference to FIGS. 1 and FIG. 2. FIG. 1 is a schematic diagram showing the configuration of the bonding system according to an embodiment. FIG. 2 is also a schematic diagram showing the state before bonding the first substrate and the second substrate according to an embodiment.

[0013] The bonding system (1) shown in FIG. 1 forms a polymerized substrate (T) by bonding a first substrate (W1) and a second substrate (W2) (see FIG. 2).

[0014] The first substrate (W1) and the second substrate (W2) are substrates on which a plurality of electronic circuits are formed, for example, on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer. The first substrate (W1) and the second substrate (W2) have approximately the same diameter. Additionally, one of the first substrate (W1) and the second substrate (W2) may be a substrate on which electronic circuits are not formed, for example.

[0015] In the following, as shown in FIG. 2, the side of the first substrate (W1) that is bonded to the second substrate (W2) is described as the "bonding surface (W1j)," and the side of the plate opposite to the bonding surface (W1j) is described as the "non-bonding surface (W1n)." Additionally, the side of the second substrate (W2) that is bonded to the first substrate (W1) is described as the "bonding surface (W2j)," and the side of the plate opposite to the bonding surface (W2j) is described as the "non-bonding surface (W2n)."

[0016] As shown in FIG. 1, the joining system (1) is equipped with an incoming / outgoing station (2), a processing station (3), and an inspection station (4). The incoming / outgoing station (2) is positioned on the X-axis negative side of the processing station (3) and is integrally connected to the processing station (3). Additionally, the inspection station (4) is positioned on the X-axis forward side of the processing station (3) and is integrally connected to the processing station (3).

[0017] The incoming / outgoing station (2) is equipped with a placement platform (10) and a return area (20). The placement platform (10) is equipped with a plurality of placement plates (11). Each placement plate (11) has a cassette (C1 to C4) that accommodates a plurality of substrates (e.g., 25 substrates) in a horizontal state. Cassette (C1) can accommodate a plurality of first substrates (W1), cassette (C2) can accommodate a plurality of second substrates (W2), and cassette (C3) can accommodate a plurality of polymerized substrates (T). Cassette (C4) is, for example, a cassette for recovering a problematic substrate. In addition, the number of cassettes (C1 to C4) placed on the placement plate (11) is not limited to that shown.

[0018] The conveying area (20) is positioned adjacent to the X-axis forward side of the placement plate (10). The conveying area (20) is provided with a conveying path (21) extending in the Y-axis direction and a conveying device (22) movable along the conveying path (21). The conveying device (22) can move in the X-axis direction as well as the Y-axis direction and can also rotate around the Z-axis. The conveying device (22) conveys the first substrate (W1), the second substrate (W2), and the polymerization substrate (T) between the cassettes (C1 to C4) placed on the placement plate (11) and the third processing block (G3) of the processing station (3) described later.

[0019] For example, three processing blocks (G1, G2, G3) are provided in the processing station (3). The first processing block (G1) is positioned on the rear side (the Y-axis forward side of FIG. 1) of the processing station (3). Additionally, the second processing block (G2) is positioned on the front side (the Y-axis negative side of FIG. 1) of the processing station (3), and the third processing block (G3) is positioned on the side of the incoming / outgoing station (2) of the processing station (3) (the X-axis negative side of FIG. 1).

[0020] In the first processing block (G1), a surface modification device (30) is disposed for modifying the bonding surfaces (W1j, W2j) of the first substrate (W1) and the second substrate (W2). The surface modification device (30) modifies the bonding surfaces (W1j, W2j) so that they become easy to hydrophilize thereafter by cutting the bonds of SiO2 at the bonding surfaces (W1j, W2j) of the first substrate (W1) and the second substrate (W2) to form single-bonded SiO.

[0021] Specifically, in the surface modification device (30), oxygen gas or nitrogen gas, which is a processing gas, is excited and plasma-ized and ionized, for example, under a reduced pressure atmosphere. Then, these oxygen ions or nitrogen ions are irradiated onto the bonding surfaces (W1j, W2j) of the first substrate (W1) and the second substrate (W2), thereby plasma-processing and modifying the bonding surfaces (W1j, W2j).

[0022] Additionally, a surface hydrophilization device (40) is disposed in the first processing block (G1). The surface hydrophilization device (40) hydrophilizes the bonding surfaces (W1j, W2j) of the first substrate (W1) and the second substrate (W2) by, for example, pure water, and also cleans the bonding surfaces (W1j, W2j). Specifically, the surface hydrophilization device (40) supplies pure water onto the first substrate (W1) or the second substrate (W2) while rotating the first substrate (W1) or the second substrate (W2) held in, for example, a spin chuck. By doing so, the pure water supplied onto the first substrate (W1) or the second substrate (W2) diffuses onto the bonding surfaces (W1j, W2j) of the first substrate (W1) or the second substrate (W2), thereby hydrophilizing the bonding surfaces (W1j, W2j).

[0023] Here, an example is shown in which the surface modification device (30) and the surface hydrophilization device (40) are arranged in a horizontal arrangement, but the surface hydrophilization device (40) may be stacked on top of the surface modification device (30).

[0024] A bonding device (41) is disposed in the second processing block (G2). The bonding device (41) bonds the hydrophilized first substrate (W1) and the second substrate (W2) by intermolecular forces. The configuration of this bonding device (41) will be described later.

[0025] A conveying area (60) is formed in an area surrounded by a first processing block (G1), a second processing block (G2), and a third processing block (G3). A conveying device (61) is disposed in the conveying area (60). The conveying device (61) has a conveying arm that is movable, for example, in a vertical direction, a horizontal direction, and around a vertical axis. This conveying device (61) moves within the conveying area (60) and conveys a first substrate (W1), a second substrate (W2), and a polymerization substrate (T) to a designated device within the first processing block (G1), the second processing block (G2), and the third processing block (G3) adjacent to the conveying area (60).

[0026] An inspection device (80) is provided at the inspection station (4). The inspection device (80) performs an inspection of the polymerized substrate (T) formed by the bonding device (41).

[0027] In addition, the bonding system (1) is equipped with a control device (70). The control device (70) controls the operation of the bonding system (1). The configuration of the control device (70) will be described later.

[0028] <Composition of the Joining Device>

[0029] Next, the configuration of the joining device (41) will be explained with reference to FIG. 3. FIG. 3 is a schematic diagram showing the configuration of the joining device (41) according to an embodiment.

[0030] As shown in FIG. 3, the joining device (41) is equipped with a first retaining part (140), a second retaining part (141), and a striker (190).

[0031] The first retaining part (140) has a main body part (170). The main body part (170) is supported by a support member (180). A through hole (176) is formed in the support member (180) and the main body part (170) and penetrates the support member (180) and the main body part (170) in a vertical direction. The location of the through hole (176) corresponds to the center of the first substrate (W1) that is adsorbed and maintained by the first retaining part (140). A pressing pin (191) of a striker (190) is inserted and penetrates through the through hole (176).

[0032] The striker (190) is positioned on the upper surface of the support member (180) and is equipped with a pressing pin (191), an actuator part (192), and a linear mechanism (193). The pressing pin (191) is a cylindrical member extending along the vertical direction and is supported by the actuator part (192).

[0033] The actuator part (192) generates a constant pressure in a certain direction (here, vertically downward) by means of air supplied from, for example, an electric regulator (not shown). The actuator part (192) can control the pressing load applied to the center of the first substrate (W1) by contacting the center of the first substrate (W1) by means of air supplied from the electric regulator. In addition, the tip of the actuator part (192) is made to be able to move up and down in the vertical direction by inserting and passing through a through hole (176) by means of air from the electric regulator.

[0034] The actuator part (192) is supported by a linear motion mechanism (193). The linear motion mechanism (193) moves the actuator part (192) along the vertical direction by a driving part, for example, which has a motor built in.

[0035] The striker (190) controls the movement of the actuator part (192) by means of a linear motion mechanism (193) and controls the pressing load of the first substrate (W1) according to the pressing pin (191) by means of the actuator part (192). Accordingly, the striker (190) presses the center of the first substrate (W1) adsorbed and held by the first holding part (140) and brings it into contact with the second substrate (W2).

[0036] On the lower surface of the main body (170), a plurality of pins (171) are provided to contact the upper surface (non-bonding surface (W1n)) of the first substrate (W1). The plurality of pins (171) have, for example, a diameter of 0.1 mm to 1 mm and a height of several tens of μm to several hundred μm. The plurality of pins (171) are evenly spaced, for example, at intervals of 2 mm.

[0037] The first retaining part (140) is provided with a plurality of adsorption parts for adsorbing the first substrate (W1) in a portion of the area where the plurality of pins (171) are provided. Specifically, on the lower surface of the main body part (170) of the first retaining part (140), a plurality of outer adsorption parts (301) and a plurality of inner adsorption parts (302) for vacuum-evacuating and adsorbing the first substrate (W1) are provided. The plurality of outer adsorption parts (301) and the plurality of inner adsorption parts (302) have an arc-shaped adsorption area when viewed from a planar view. The plurality of outer adsorption parts (301) and the plurality of inner adsorption parts (302) have the same height as the pins (171).

[0038] A plurality of outer adsorption parts (301) are disposed on the outer periphery of the main body (170). A plurality of outer adsorption parts (301) are connected to a suction device not shown, such as a vacuum pump, and adsorb the outer periphery of the first substrate (W1) by vacuum exhaust.

[0039] A plurality of inner adsorption portions (302) are arranged along the circumferential direction in the diameter direction of the main body portion (170) compared to a plurality of outer adsorption portions (301). A plurality of inner adsorption portions (302) are connected to a suction device not shown, such as a vacuum pump, and adsorb the area between the outer periphery and the center of the first substrate (W1) by vacuum exhaust.

[0040] The second retaining part (141) is described. The second retaining part (141) has a main body part (200) having the same diameter as the second substrate (W2) or a larger diameter than the second substrate (W2). Here, the second retaining part (141) having a larger diameter than the second substrate (W2) is shown. The upper surface of the main body part (200) is an opposing surface facing the lower surface (non-bonded surface (W2n)) of the second substrate (W2).

[0041] On the upper surface of the main body (200), a plurality of pins (201) are provided that contact the lower surface (non-bonding surface (Wn2)) of the second substrate (W2). For example, the plurality of pins (201) have a diameter of 0.1 mm to 1 mm and a height of several tens of μm to several hundred μm. The plurality of pins (201) are evenly spaced at intervals of, for example, 2 mm.

[0042] Additionally, on the upper surface of the main body (200), a lower rib (202) is provided in an annular shape on the outer side of a plurality of pins (201). The lower rib (202) is formed in an annular shape and supports the outer periphery of the second substrate (W2) over its entire circumference.

[0043] Additionally, the main body (200) has a plurality of lower suction ports (203). A plurality of lower suction ports (203) are provided in a suction area surrounded by a lower rib (202). A plurality of lower suction ports (203) are connected to an unillustrated suction device, such as a vacuum pump, via an unillustrated suction pipe.

[0044] The second holding member (141) reduces the pressure of the adsorption area by vacuum exhausting the adsorption area surrounded by the lower rib (202) from a plurality of lower suction ports (203). By doing so, the second substrate (W2) placed in the adsorption area is adsorbed and held by the second holding member (141).

[0045] Since the lower rib (202) supports the outer periphery of the lower surface of the second substrate (W2) over the entire circumference, the second substrate (W2) is properly vacuum-evacuated up to the outer periphery. By doing so, the front surface of the second substrate (W2) can be adsorbed and maintained. Additionally, since the lower surface of the second substrate (W2) is supported by a plurality of pins (201), when the vacuum evacuation of the second substrate (W2) is released, the second substrate (W2) is easily detached from the second holding part (141).

[0046] Additionally, although the city is omitted here, the bonding device (41) is equipped with a transition, an inversion mechanism, and a position adjustment mechanism, etc., at the front end of the first holding part (140) or the second holding part (141), etc. shown in FIG. 3. The transition temporarily arranges the first substrate (W1), the second substrate (W2), and the polymerization substrate (T). The position adjustment mechanism adjusts the horizontal direction of the first substrate (W1) and the second substrate (W2). The inversion mechanism inverts the front and back of the first substrate (W1).

[0047] <Configuration of the Inspection Device>

[0048] Next, the configuration of the inspection device will be described with reference to FIGS. 4 and FIG. 5. FIG. 4 is a schematic diagram showing the configuration of an inspection device according to an embodiment. FIG. 5 is a schematic diagram showing the configuration of a holding part of an inspection device according to an embodiment. FIG. 4 is a schematic diagram of the inspection device viewed from the side, and FIG. 5 is a schematic diagram of the holding part of the inspection device viewed from above.

[0049] As shown in FIG. 4, the inspection device (80) is equipped with a maintenance unit (400), an imaging unit (500), and an illumination unit (600). Additionally, as shown in FIG. 5, the inspection device (80) is equipped with a diagnostic unit (700).

[0050] As shown in FIGS. 4 and 5, the holding member (400) holds the polymerization substrate (T) horizontally. The holding member (400) has a main body (410) and a plurality of support members (420).

[0051] The main body (410) is a flat frame-shaped member having an opening (411) with a diameter larger than that of the polymerization substrate (T). The main body (410) is connected to a moving mechanism (440), and by the moving mechanism (440), it is possible to move in a horizontal direction (X-axis direction and Y-axis direction) and rotate around a vertical axis.

[0052] A plurality of support members (420) are provided in the main body (410) so as to extend toward the center of the opening (411). The outer periphery of the polymerization substrate (T) is supported at the leading edge of the plurality of support members (420). The leading edge of the plurality of support members (420) is connected to a suction device (480), such as a vacuum pump, via a suction pipe (460), and the outer periphery of the lower surface of the polymerization substrate (T) is adsorbed by vacuum exhaust.

[0053] The imaging unit (500) is equipped with a macro imaging section (510), a micro imaging section (520), a fixing section (530), and a lifting mechanism (540).

[0054] The macro imaging unit (510) and the micro imaging unit (520) are positioned above the holding unit (400). The macro imaging unit (510) is equipped with a camera lens (511) for macro imaging and an imaging element (512), such as a CCD image sensor or a CMOS image sensor. The micro imaging unit (520) is equipped with a camera lens (521) for micro imaging and an imaging element (522), such as a CCD image sensor or a CMOS image sensor. The magnification of the camera lens (511) equipped in the macro imaging unit (510) is, for example, 10 times. In addition, the magnification of the camera lens (521) equipped in the micro imaging unit (520) is, for example, 50 times.

[0055] The macro imaging unit (510) and the micro imaging unit (520) are fixed to the fixed unit (530) with the camera lenses (511, 521) facing vertically downward. The fixed unit (530) is connected to a lifting mechanism (540) and moves (lifts) along the vertical direction by the lifting mechanism (540). The imaging unit (500) can adjust the distance between the macro imaging unit (510) and the micro imaging unit (520) and the polymerization substrate (T) by lifting the fixed unit (530) using the lifting mechanism (540).

[0056] The lighting unit (600) is equipped with a macro lighting section (610), a micro lighting section (620), a fixed section (630), and a lifting mechanism (640).

[0057] The macro illumination unit (610) and the micro illumination unit (620) are positioned below the holding unit (400). Specifically, the macro illumination unit (610) is positioned opposite the macro imaging unit (510) with the polymerization substrate (T) held in the holding unit (400) in between. Additionally, the micro illumination unit (620) is positioned opposite the micro imaging unit (520) with the polymerization substrate (T) held in the holding unit (400) in between.

[0058] The macro lighting unit (610) is equipped with a light source (611) and a light collecting unit (612). The light source (611) emits near-infrared light of, for example, 1000 to 1200 nm. The light collecting unit (612) is, for example, a condensing lens and concentrates the light emitted from the light source (611) into a single point. The micro lighting unit (620) has the same configuration as the macro lighting unit (610). That is, the micro lighting unit (620) is equipped with a light source (621) and a light collecting unit (622), and these configurations are the same as the light source (611) and light collecting unit (612) equipped in the macro lighting unit (610).

[0059] Additionally, the light source (611, 621) may be placed outside the macro lighting unit (610) and the micro lighting unit (620). In this case, the light source (611, 621) may supply light to the inside of the macro lighting unit (610) and the micro lighting unit (620) by interposing optical fibers, etc.

[0060] The macro lighting unit (610) and the micro lighting unit (620) are fixed to the fixed unit (630) with their optical axes oriented in the vertical direction. The fixed unit (630) is connected to a lifting mechanism (640) and moves (lifts) along the vertical direction by the lifting mechanism (640). The lighting unit (600) can adjust the distance between the macro lighting unit (610) and the micro lighting unit (620) and the polymerization substrate (T) by lifting the fixed unit (630) using the lifting mechanism (640).

[0061] The inspection device (80) captures measurement marks formed on the first substrate (W1) and the second substrate (W2), respectively, using a micro imaging unit (520) and a micro illumination unit (620). FIG. 6 is a diagram showing an example of a method for capturing measurement marks. FIG. 7 is also a diagram showing an example of a measurement mark. In addition, the macro imaging unit (510) and the macro illumination unit (610) are used for a process to specify the location of the measurement mark, which will be described later.

[0062] As shown in FIG. 6, the micro illumination unit (620) is fixed to the fixing unit (630) (see FIG. 4) such that the optical axis (Ax) of the light emitted from the light source (621) is oriented in a vertical direction. Additionally, the micro imaging unit (520) is fixed to the fixing unit (530) (see FIG. 4) such that the optical axis (Ax) passes through the center of the camera lens (521) and also intersects perpendicularly with respect to the camera lens (521) and the imaging element (522). Furthermore, although an example is shown here in which the imaging unit (500) is positioned above the polymerization substrate (T) and the illumination unit (600) is positioned below the polymerization substrate (T), the illumination unit (600) may be positioned above the polymerization substrate (T) and the imaging unit (500) may be positioned below the polymerization substrate (T).

[0063] The distance between the micro imaging unit (520) and the micro lighting unit (620) is set to a distance where the focus of the camera lens (521) and the focus of the light collecting unit (622) coincide, for example, through a prior adjustment operation by a person's hand. The inspection device (80) raises the micro imaging unit (520) and the micro lighting unit (620) while maintaining a distance where the focus of the camera lens (521) and the focus of the light collecting unit (622) coincide, by linking the lifting mechanism (540) and the lifting mechanism (640).

[0064] The inspection device (80) raises the micro imaging unit (520) and the micro illumination unit (620) integrally using the fixed part (530) and the lifting mechanism (540), thereby positioning the focus of the camera lens (521) and the light collecting unit (622) on the measurement marks (M1, M2) formed on the polymerized substrate (T). Then, the inspection device (80) captures the measurement marks (M1, M2). Specifically, light irradiated vertically upward from the micro illumination unit (620) reaches the imaging element (522) of the micro imaging unit (520) via the second substrate (W2) and the first substrate (W1). That is, the micro imaging unit (520) captures the measurement marks (M1, M2) by the transmitted light that passes through the polymerized substrate (T). Image data captured by the micro-imaging unit (520) is output to the control device (70).

[0065] As shown in FIG. 7, the image data includes images of a measurement mark (M1) formed on a first substrate (W1) and a measurement mark (M2) formed on a second substrate (W2). The control device (70) obtains measurement results, such as the coordinates of the center points (G1, G2) of the measurement marks (M1, M2) and the amount of misalignment of the center points (G1, G2), by performing image recognition processing, such as edge detection, on the image data, and inspects the bonding state of the polymerization substrate (T) based on the obtained measurement results.

[0066] However, if the amount of light emitted from the light source (621) of the micro-illumination unit (620) changes, the thickness of the outline of the measurement mark (M1) or measurement mark (M2) included in the image data changes, and there is a risk that the position of the edge detected by edge detection changes. In this case, there is a risk that the measurement results, such as the coordinates of the center point (G1, G2) or the amount of misalignment of the center point (G1, G2), will be distorted. Therefore, in order to maintain the measurement precision of the inspection device (80), it is desirable that the amount of light emitted from the light source (621) of the micro-illumination unit (620) always remain constant.

[0067] However, the light source (621) provided by the micro lighting unit (620) gradually deteriorates with use, and consequently, the actual amount of light obtained becomes lower than the set amount of light. That is, the amount of light of the light source (621) provided by the micro lighting unit (620) changes (decreases) with use.

[0068] In addition, for example, even if the optical axis of the micro-illumination unit (620) is misaligned from the vertical direction, there is a risk that the measurement result of the inspection device (80) may be misaligned.

[0069] Accordingly, in the bonding system (1), a diagnostic unit (700) is provided in the inspection device (80), and the amount of light and the optical axis of the micro-illumination unit (620) are checked using this diagnostic unit (700).

[0070] As shown in FIG. 5, the diagnostic unit (700) is provided in the main body (410) of the holding unit (400) and has a mounting unit (710) extending toward the center of the opening (411) and a damping member (720) mounted on the front end of the mounting unit (710). The mounting unit (710) is positioned between two adjacent support members (420). The mounting unit (710) is shorter than the support members (420), and the damping member (720) is positioned at a location exposed from the polymerization substrate (T) supported by the plurality of support members (420) when viewed from a planar view. Accordingly, the inspection device (80) can perform light quantity checks and optical axis checks using the diagnostic unit (700) even when the polymerization substrate (T) is held in the holding unit (400).

[0071] FIG. 8 is a diagram showing the configuration of a damping member (720) according to an embodiment. FIG. 9 is a diagram showing an example of a correction mark formed on the damping member (720).

[0072] As shown in FIG. 8, the damping member (720) comprises a glass plate (721) and a plurality (here, two) of silicon plates (722). The glass plate (721) and the two silicon plates (722) are stacked in the order of silicon plates (722), glass plates (721), and silicon plates (722) from the bottom.

[0073] Light intensity check is performed by receiving light that is irradiated from a light source (621) and passes through an attenuation member (720) at a micro-imaging unit (520), and by checking the amount of light received. The amount of light from the light source (621) is set to a relatively high value to allow it to pass through the polymerization substrate (T). Therefore, when checking the amount of light, if the light emitted from the light source (621) is directly captured by the micro-imaging unit (520), there is a concern that the amount of light is too strong and a suitable image cannot be obtained. Accordingly, in the inspection device (80), the light emitted from the light source (621) is attenuated in the same way as the polymerization substrate (T) using a silicon plate (722). By doing so, the amount of light can be properly checked. Additionally, the attenuation member (720) only needs to be equipped with at least one silicon plate (722).

[0074] The inspection device (80) may perform a light quantity check whenever a predetermined time (e.g., 24 hours every day) arrives. Additionally, the inspection device (80) may perform a light quantity check whenever the number of processed polymerization substrates (T) or the number of processing lots reaches a predetermined number. Additionally, the inspection device (80) may perform a light quantity check at predetermined time intervals (e.g., every 12 hours). As described above, since the inspection device (80) can perform a light quantity check even when the polymerization substrate (T) is maintained in the holding part (400), it is easy to perform a regular light quantity check regardless of whether the polymerization substrate (T) is present or not.

[0075] A calibration mark (M3) is formed on the glass plate (721). The calibration mark (M3) is formed on the glass plate (721), for example, by deposition. In this way, by forming the calibration mark (M3) on the glass plate (721), the damping member (720) can be formed at a lower cost compared to, for example, forming the calibration mark (M3) on the silicon plate (722). Furthermore, the damping member (720) does not necessarily require the glass plate (721), and may have the calibration mark (M3) formed on the silicon plate (722).

[0076] As shown in FIG. 9, the correction mark (M3) includes, for example, a first square (M3a) and a second square (M3b). The first square (M3a) and the second square (M3b) have a square frame shape with a uniform thickness. The second square (M3b) is smaller than the first square (M3a) and is positioned inside the first square (M3a). Also, the position of the center (G3a) of the first square (M3a) and the position of the center (G3b) of the second square (M3b) coincide.

[0077] The optical axis check is performed by checking the degree of misalignment between the coordinates of the center (G3a) of the first square (M3a) and the coordinates of the center (G3b) of the second square (M3b), which are calculated based on image data captured by the micro imaging unit (520). That is, for example, if the optical axis of the micro illumination unit (620) is tilted, the thickness of the frames of the first square (M3a) and the second square (M3b) included in the image data becomes uneven, so the coordinates of the centers (G3a, G3b) do not match. The inspection device (80) can determine whether there is a tilt of the optical axis by checking the misalignment of the coordinates of the centers (G3a, G3b).

[0078] While the decrease in light intensity caused by the deterioration of the light source (621) occurs over time, the misalignment of the optical axis often occurs suddenly, such as when a person comes into contact with it during maintenance. For this reason, the inspection device (80) may perform the optical axis check less frequently than the light intensity check. For example, the inspection device (80) may perform the optical axis check once every time the light intensity check is performed multiple times. Additionally, the inspection device (80) may perform the optical axis check when the power is turned on.

[0079] <Configuration of the Control Device>

[0080] Next, the configuration of the control device (70) will be explained with reference to FIG. 10. FIG. 10 is a block diagram showing the configuration of the control device (70) according to an embodiment. FIG. 10 also shows the configuration related to the inspection device (80) among the configurations provided by the control device (70).

[0081] As shown in FIG. 10, the control device (70) comprises a control unit (71) and a memory unit (72). The control unit (71) comprises a measurement control unit (71a) and a diagnostic control unit (71b). Additionally, the memory unit (72) stores initial light quantity information (72a).

[0082] In addition, the control device (70) includes, for example, a computer and various circuits having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), HDD (Hard Disk Drive), input / output ports, etc.

[0083] The CPU of the computer functions as the measurement control unit (71a) and the diagnostic control unit (71b) of the control unit (71) by, for example, reading and executing a program stored in ROM. In addition, at least one or all of the measurement control unit (71a) and the diagnostic control unit (71b) may be composed of hardware such as an ASIC (Application Specific Integrated Circuit), a GPU (Graphics Processing Unit), or an FPGA (Field Programmable Gate Array).

[0084] Additionally, the memory unit (72) corresponds to, for example, RAM and HDD. RAM and HDD can store light quantity initial information (72a). Additionally, the control unit (70) may acquire the above-mentioned program and various information by connecting to another computer or portable recording medium via a wired or wireless network.

[0085] (Regarding the measurement control unit)

[0086] The measurement control unit (71a) sets a plurality of measurement points (e.g., 5 to 13 points) on the plate surface of the polymerization substrate (T) and causes the inspection device (80) to perform measurements of the polymerization substrate (T) at each measurement point.

[0087] Specifically, in the inspection device (80), the introduction of a polymerization substrate (T) is first performed. The polymerization substrate (T) is transported into the interior of the inspection device (80) by a transport device (61) (see FIG. 1). The inspection device (80) receives the polymerization substrate (T) from the transport device (61) using a lifter not shown, and moves the lifter to place the polymerization substrate (T) on a plurality of support members (420). Afterwards, the suction device (480) vacuum exhausts the polymerization substrate (T) through the suction pipe (460), thereby adsorbing and holding the polymerization substrate (T) on the holding part (400).

[0088] Next, the inspection device (80) performs θ alignment processing. The θ alignment processing is a process for adjusting the position in the rotation direction of the polymerization substrate (T). Specifically, the inspection device (80) captures a plurality of reference points existing on the polymerization substrate (T) (for example, a reference point located at the center of the polymerization substrate (T) and a reference point located next to it) using a macro imaging unit (510). Then, the inspection device (80) calculates the rotation angle of the polymerization substrate (T) from the obtained image and rotates the polymerization substrate (T) using a moving mechanism (440) so that this rotation angle becomes 0 degrees. These reference points are formed on the first substrate (W1) or the second substrate (W2) together with the pattern in each shot when a pattern is formed by exposure processing on the first substrate (W1) or the second substrate (W2), for example. That is, the inspection device (80) rotates the polymerization substrate (T) so that the arrangement direction of the pattern for each shot is always the same direction.

[0089] Next, a measurement process is performed in the inspection device (80). Specifically, the inspection device (80) positions the micro imaging unit (520) and the micro illumination unit (620) on the vertical line of the first measurement point by moving the holding unit (400) horizontally using the moving mechanism (440). Afterward, the inspection device (80) performs focus adjustment of the micro imaging unit (520) or position correction of the holding unit (400), and then takes an image of the measurement mark (M1, M2) located at the first measurement point using the micro imaging unit (520) and the micro illumination unit (620).

[0090] The inspection device (80) performs the same process for the remaining measurement points. That is, the inspection device (80) repeats the above-described process as many times as the number of measurement points.

[0091] The measurement control unit (71a) acquires image data as a measurement result from the inspection device (80). Then, the measurement control unit (71a) derives an inspection result including the amount of misalignment between the first substrate (W1) and the second substrate (W2) in the polymerization substrate (T) based on the acquired image data. Specifically, the measurement control unit (71a) calculates the X coordinate (x1) and Y coordinate (y1) of the measurement mark (M1) and the X coordinate (x2) and Y coordinate (y2) of the measurement mark (M2) at each measurement point by interpreting the image data. In addition, the measurement control unit (71a) calculates the amount of misalignment (Δx) of the X coordinate of the measurement mark (M1, M2) and the amount of misalignment (Δy) of the Y coordinate of the measurement mark (M1, M2). Then, the measurement control unit (71a) inputs the calculation results (x1, y1, x2, y2, Δx, Δy) corresponding to the number of first measurement points (here, 5 points) into a pre-prepared calculation model.

[0092] The calculation model is, for example, to decompose the amount of misalignment of the first substrate (W1) relative to the second substrate (W2) into each component of misalignment in the X-axis direction (X shift), misalignment in the Y-axis direction (Y shift), misalignment in the rotational direction around the vertical axis (rotate), and misalignment due to stretching (scaling). The measurement control unit (71a) uses this calculation model to obtain inspection results for each of the above components and stores the obtained inspection results in the memory unit (72).

[0093] (Regarding the diagnostic control unit)

[0094] The diagnostic control unit (71b) controls the operation of light quantity check and optical axis check according to the inspection device (80).

[0095] The light quantity initial information (72a) stored in the memory unit (72) is used for light quantity checking. The light quantity initial information (72a) is information indicating the relationship between the set light quantity of the light source (621) provided by the micro illumination unit (620) and the amount of light received when the micro imaging unit (520) receives light emitted from the light source (621) with the set light quantity through the attenuation member (720). The set light quantity is a command value of the amount of light output to the light source (621). For example, the light quantity initial information (72a) is said to be related to the set light quantity '100' of the light source (621) and the amount of light received '80' in the micro imaging unit (520).

[0096] The light quantity initial information (72a) is information indicating the initial relationship between the set light quantity of the light source (621) and the light quantity received by the micro imaging unit (520) before the light source (621) deteriorates, and is generated, for example, when the bonding system (1) starts or is used for the first time. If the light source (621) deteriorates due to use, even if a command is given to the light source (621) to emit light at a set light quantity of '100', the actual light quantity obtained, that is, the light quantity received by the micro imaging unit (520), will be lower than '80'.

[0097] In addition, the specific sequence of light quantity check processing and optical axis check processing will be described later using FIGS. 12 and FIGS. 13.

[0098] <Specific Operation of the Junction System>

[0099] Next, the specific operation of the bonding system (1) will be described. First, the processing sequence until the polymerization substrate (T) is formed by the bonding device (41) will be described with reference to FIG. 11. FIG. 11 is a flowchart showing an example of the processing sequence until the polymerization substrate (T) is formed by the bonding device (41) during the processing performed by the bonding system (1). The various processes shown in FIG. 11 are executed based on control by the control device (70).

[0100] First, a cassette (C1) containing multiple first substrates (W1), a cassette (C2) containing multiple second substrates (W2), and an empty cassette (C3) are placed on a designated placement plate (11) of an incoming / outgoing station (2). Afterward, the first substrate (W1) inside the cassette (C1) is extracted by a return device (22) and returned to a transition device placed in a third processing block (G3).

[0101] Next, the first substrate (W1) is transported by a transport device (61) to a surface modification device (30) of the first processing block (G1). In the surface modification device (30), under a predetermined reduced pressure atmosphere, oxygen gas, which is a processing gas, is excited, plasma-formed, and ionized. These oxygen ions are irradiated onto the bonding surface of the first substrate (W1), and the bonding surface is plasma-treated. As a result, the bonding surface of the first substrate (W1) is modified (step (S101)).

[0102] Next, the first substrate (W1) is returned by the return device (61) to the surface hydrophilization device (40) of the second processing block (G1). In the surface hydrophilization device (40), pure water is supplied onto the first substrate (W1) while rotating the first substrate (W1) held in the spin chuck. As a result, the bonding surface of the first substrate (W1) becomes hydrophilized. Additionally, the bonding surface of the first substrate (W1) is cleaned by the pure water (step (S102)).

[0103] Next, the first substrate (W1) is returned by the return device (61) to the bonding device (41) of the second processing block (G2). The first substrate (W1) brought into the bonding device (41) is returned to the position adjustment mechanism via a transition, and its horizontal direction is adjusted by the position adjustment mechanism (step (S103)).

[0104] After this, the first substrate (W1) is transferred from the position adjustment mechanism to the inversion mechanism, and the front and back surfaces of the first substrate (W1) are inverted by the inversion mechanism (step (S104)). Specifically, the bonding surface (W1j) of the first substrate (W1) is oriented downward.

[0105] Afterwards, the first substrate (W1) is transferred from the inversion mechanism to the first holding part (140). The first substrate (W1) is adsorbed and held on the first holding part (140) with the notch portion facing in a predetermined direction (step (S105)).

[0106] Processing of the second substrate (W2) is performed in overlap with the processing of steps (S101 to S105) for the first substrate (W1). First, the second substrate (W2) in the cassette (C2) is ejected by the transport device (22) and transported to a transition device placed in the third processing block (G3).

[0107] Next, the second substrate (W2) is returned to the surface modification device (30) by the return device (61), and the bonding surface (W2j) of the second substrate (W2) is modified (step (S106)). Afterwards, the second substrate (W2) is returned to the surface hydrophilization device (40) by the return device (61), and the bonding surface (W2j) of the second substrate (W2) is hydrophilized and the bonding surface is also cleaned (step (S107)).

[0108] Afterward, the second substrate (W2) is returned to the bonding device (41) by the return device (61). The second substrate (W2) brought into the bonding device (41) is returned to the position adjustment mechanism via a transition. Then, the horizontal direction of the second substrate (W2) is adjusted by the position adjustment mechanism (step (S108)).

[0109] Afterwards, the second substrate (W2) is returned to the second holding part (141) and is adsorbed and held in the second holding part (141) with the notch portion facing a predetermined direction (step (S109)).

[0110] Next, horizontal position adjustment is performed between the first substrate (W1) held in the first holding part (140) and the second substrate (W2) held in the second holding part (141) (step (S110)).

[0111] Next, the vertical position of the first substrate (W1) held in the first holding part (140) and the second substrate (W2) held in the second holding part (141) is adjusted (step (S111)). Specifically, a moving part not shown moves the second holding part (141) vertically upward, thereby bringing the second substrate (W2) closer to the first substrate (W1).

[0112] Next, after releasing the adsorption holding of the first substrate (W1) by the plurality of inner adsorption parts (302) (step (S112)), the center of the first substrate (W1) is pressed by lowering the pressing pin (191) of the striker (190) (step (S113)).

[0113] When the center of the first substrate (W1) comes into contact with the center of the second substrate (W2), and the center of the first substrate (W1) and the center of the second substrate (W2) are pressed by a force determined by a striker (190), bonding is initiated between the pressed center of the first substrate (W1) and the center of the second substrate (W2). That is, since the bonding surface (W1j) of the first substrate (W1) and the bonding surface (W2j) of the second substrate (W2) are each modified in steps (S101, S109), first, a van der Waals force (intermolecular force) is generated between the bonding surfaces (W1j, W2j), and the bonding surfaces (W1j, W2j) are bonded to each other. In addition, since the bonding surface (W1j) of the first substrate (W1) and the bonding surface (W2j) of the second substrate (W2) are each hydrophilized in steps (S102, S110), the hydrophilic groups between the bonding surfaces (W1j, W2j) form hydrogen bonds, thereby strongly bonding the bonding surfaces (W1j, W2j) to each other. In this way, a bonding region is formed.

[0114] Afterwards, between the first substrate (W1) and the second substrate (W2), a bonding wave is generated in which the bonding area expands from the center of the first substrate (W1) and the second substrate (W2) toward the outer periphery. Afterwards, the adsorption holding of the first substrate (W1) by a plurality of outer adsorption parts (301) is released (step (S114)). As a result, the outer periphery of the first substrate (W1) that was adsorbed and held by the outer adsorption parts (301) drops. As a result, the bonding surface (W1j) of the first substrate (W1) and the bonding surface (W2j) of the second substrate (W2) come into contact on the entire surface, and a polymerized substrate (T) is formed.

[0115] Afterwards, the pressing pin (191) is raised to the first holding part (140) to release the adsorption holding of the second substrate (W2) by the second holding part (141). Afterwards, the polymerized substrate (T) is removed from the bonding device (41) by the transport device (61). In this way, the series of bonding processes is completed.

[0116] Next, the sequence of light quantity check processing in the inspection device (80) will be explained with reference to FIG. 12. FIG. 12 is a flowchart showing an example of the sequence of light quantity check processing. In addition, as an example, the sequence of processing is shown here when checking the light quantity of the micro-illumination unit (620), but the light quantity check of the macro-illumination unit (610) may be performed in the same sequence of processing. The light quantity check processing is performed according to control by the diagnostic control unit (71b).

[0117] As shown in FIG. 12, in the inspection device (80), first, the moving mechanism (440) (see FIG. 4) moves the diagnostic unit (700) so that the attenuation member (720) of the diagnostic unit (700) is positioned above the micro-illumination unit (620) (below the micro-imaging unit (520)) (step (S201)).

[0118] Next, in the inspection device (80), after performing focus adjustment of the micro imaging unit (520), the light source (621) of the micro illumination unit (620) emits light at a set amount of light (step (S202)). The light emitted from the light source (621) passes through the attenuation member (720) and is received by the imaging element (522) of the micro imaging unit (520).

[0119] Next, the diagnostic control unit (71b) calculates the amount of light received in the micro-imaging unit (520) based on image data captured by the micro-imaging unit (520) (step (S203)). In addition, the diagnostic control unit (71b) calculates the difference between the calculated amount of light received and the amount of light received included in the light amount initial information (72a) (hereinafter referred to as the "initial amount of light received") (step (S204)). Then, the diagnostic control unit (71b) determines whether the difference between the amount of light received and the initial amount of light received is less than a threshold value (hereinafter referred to as the "light amount threshold") (step (S205)).

[0120] In step (S205), if the difference between the measured amount of received light and the initial amount of received light is greater than or equal to the light amount threshold (step (S205), No), that is, if the amount of light from the light source (621) is not normal, the diagnostic control unit (71b) determines whether the current mode is an automatic adjustment mode (step (S206)). In step (S206), if it is determined that the mode is automatic adjustment mode (step (S206), Yes), the diagnostic control unit (71b) changes the set amount of light from the light source (621) (step (S207)). Specifically, the diagnostic control unit (71b) increases the set amount of light from the light source (621). For example, the diagnostic control unit (71b) may increase the set amount of light by the difference between the measured amount of received light and the initial amount of received light. Additionally, the diagnostic control unit (71b) may increase the set amount of light by a predetermined amount. When the processing of step (S206) is finished, the diagnostic control unit (71b) returns to step (S202) and emits light from the light source (621) with the set amount of light after the change.

[0121] Meanwhile, in step (S206), if the automatic adjustment mode is not active (step (S206), No), the diagnostic control unit (71b) performs a notification process (step (S208)). For example, as a notification process, the diagnostic control unit (71b) may transmit information to a higher device connected to the bonding system (1) via a network that indicates that the amount of light from the light source (621) has decreased. Additionally, as a notification process, the diagnostic control unit (71b) may activate an unillustrated alarm device (alarm or lamp, etc.) provided in the bonding system (1).

[0122] When the processing of step (S208) is finished, or when, in step (S205), the difference between the measured amount of light received and the initial amount of light received is less than the amount of light threshold (step (S205), Yes), that is, when the amount of light from the light source (621) is normal, the diagnostic control unit (71b) finishes the amount of light check processing.

[0123] Next, the sequence of optical axis check processing in the inspection device (80) will be explained with reference to FIG. 13. FIG. 13 is a flowchart showing an example of the sequence of optical axis check processing.

[0124] As shown in FIG. 13, in the inspection device (80), first, the moving mechanism (440) (see FIG. 4) moves the diagnostic unit (700) so that the attenuation member (720) of the diagnostic unit (700) is positioned above the micro-illumination unit (620) (below the micro-imaging unit (520)) (step (S301)).

[0125] Next, in the inspection device (80), after focusing the micro imaging unit (520), the light source (621) of the micro illumination unit (620) emits light at a set amount (step (S302)). Then, in the inspection device (80), the micro imaging unit (520) captures the correction mark (M3) formed on the attenuation member (720) (step (S303)).

[0126] Next, the diagnostic control unit (71b) calculates the distance between the center (G3a) of the first angle (M3a) and the center (G3b) of the second angle (M3b) as a mark measurement value based on image data captured by the micro imaging unit (520) (step (S304)). In addition, the diagnostic control unit (71b) calculates the difference between the calculated mark measurement value and the normal value of the distance between the centers (G3a, G3b) (hereinafter referred to as 'Ref value') (step (S305)). In addition, in this embodiment, the case where the Ref value is 0, that is, the case where the center (G3a) and the center (G3b) coincide, was explained as an example, but the Ref value does not necessarily have to be 0.

[0127] Next, the diagnostic control unit (71b) determines whether the difference between the mark measurement value and the Ref value is less than a threshold (hereinafter referred to as the 'optical axis threshold') (step (S306)). In this process, if the difference between the mark measurement value and the Ref value is not less than the optical axis threshold (step (S306), No), the diagnostic control unit (71b) performs a notification process (step (S307)). For example, as a notification process, the diagnostic control unit (71b) may transmit information to a higher device connected to the bonding system (1) via a network that indicates that the optical axis of the light source (621) is tilted. Additionally, as a notification process, the diagnostic control unit (71b) may activate an alarm device (alarm or lamp, etc.) not shown provided in the bonding system (1).

[0128] When the processing of step (S307) is finished, or, in step (S306), when the difference between the mark measurement value and the Ref value is less than the optical axis threshold (step (S306), Yes), the diagnostic control unit (71b) finishes the optical axis check processing.

[0129] As described above, the self-diagnosis method of an inspection device (as an example, an inspection device (80)) according to an embodiment is a self-diagnosis method of an inspection device for inspecting a polymerized substrate (as an example, a polymerized substrate (T)) in which a first substrate (as an example, a first substrate (W1)) and a second substrate (as an example, a second substrate (W2)) are bonded, and includes a process of placement, a process of irradiation, a process of receiving light, and a process of determining an abnormality in the amount of light. The placement process involves moving a holding part (a holding part (400)) which is provided with a diagnostic part (a diagnostic part (700)) having a light attenuation member (an example, a light attenuation member (720)) that attenuates light, thereby placing a light attenuation member between a lighting part (an example, a macro lighting part (610) or a micro lighting part (620)) which is placed above or below the holding part and irradiates light onto the polymer substrate held in the holding part, and an imaging part (an example, a macro imaging part (510) or a micro imaging part (520)) which is placed in a position opposite to the lighting part above or below the holding part and images the polymer substrate held in the holding part. The irradiation process involves irradiating light from the lighting part with a set amount of light after the placement process. The light receiving process receives light that has been irradiated from the illumination unit and passed through the attenuation member after the irradiation process, using an imaging unit. The process of determining an abnormality in the amount of light determines an abnormality in the amount of light irradiated from the illumination unit based on the amount of light received by the imaging unit after the light receiving process.

[0130] According to the self-diagnosis method of the inspection device according to the embodiment, the light intensity of the illumination unit can be easily checked by using a diagnostic unit embedded in the inspection device. Accordingly, it is possible to easily maintain the measurement precision of the inspection device.

[0131] The process of determining an abnormality in light quantity may be calculated by calculating the difference between the initial light quantity stored in advance as the amount of light received by the imaging unit after passing through the attenuation member and being irradiated from the lighting unit with a set amount of light (for example, the initial amount of light received included in the light quantity initial information (72a)) and the amount of light received by the imaging unit during the light receiving process (for example, the measured amount of light received), and if the difference is greater than or equal to a light quantity threshold, it may be determined that the amount of light irradiated from the lighting unit is abnormal. By doing so, deterioration due to the use of the light source of the lighting unit can be easily detected.

[0132] The self-diagnosis method of an inspection device according to an embodiment may further include a process of changing a set light amount when it is determined that the amount of light irradiated from a lighting unit is abnormal in the process of determining an abnormality in the amount of light. By doing so, the amount of light emitted from the lighting unit can be easily maintained in a constant state.

[0133] The attenuation member may have a calibration mark. In this case, the self-diagnosis method of the inspection device according to the embodiment may further include an imaging process and a process for determining the tilt of the optical axis. The imaging process involves capturing the calibration mark using an imaging unit after the irradiation process. The process for determining the tilt of the optical axis involves determining the tilt of the optical axis of the illumination unit based on the calibration mark captured by the imaging unit after the imaging process. Accordingly, the tilt of the optical axis can also be checked using a diagnostic unit for performing a light quantity check.

[0134] Additionally, an inspection device according to an embodiment (as an example, an inspection device (80)) is an inspection device for inspecting a polymerized substrate (as an example, a polymerized substrate (T)) in which a first substrate (as an example, a first substrate (W1)) and a second substrate (as an example, a second substrate (W2)) are bonded, and comprises a holding unit (as an example, a holding unit (400)), an illumination unit (as an example, a macro illumination unit (610) or a micro illumination unit (620)), an imaging unit (as an example, a macro imaging unit (510) or a micro imaging unit (520)), a moving mechanism (as an example, a moving mechanism (440)), and a diagnostic unit (as an example, a diagnostic unit (700)). The holding unit holds the outer periphery of the polymerized substrate. The illumination unit is positioned above or below the holding unit and irradiates light onto the polymerized substrate held by the holding unit. The imaging unit is positioned opposite the illumination unit in the other of the upper and lower sides of the holding unit and images the polymerization substrate held in the holding unit. The moving mechanism moves the holding unit. The diagnostic unit is provided in the holding unit and has an attenuation member (as an example, an attenuation member (720)) that attenuates light irradiated from the illumination unit.

[0135] According to the inspection device of the embodiment, the light intensity of the illumination unit can be easily checked by using a diagnostic unit built into the inspection device. Accordingly, it is possible to easily maintain the measurement precision of the inspection device.

[0136] The attenuation member may include silicon (for example, a silicon plate (722)). By using silicon to attenuate the light emitted from the lighting unit in the same way as the polymer substrate, the amount of light can be properly checked.

[0137] The damping member may include silicon, glass laminated to the silicon (for example, a glass plate (721)), and a calibration mark formed on the glass (for example, a calibration mark (M3)). By forming a calibration mark on the glass, the damping member can be formed at a lower cost compared to, for example, forming a calibration mark on the silicon.

[0138] The retaining part may be provided with a main body part (for example, a main body part (410)) and a plurality of support members (for example, support members (420)). The main body part has an opening (for example, an opening (411)) with a diameter larger than that of the polymerization substrate. The plurality of support members are provided in the main body part, extend toward the center of the opening, and support the outer periphery of the polymerization substrate at their tip. In this case, the diagnostic part may be placed between two adjacent support members. By doing so, the size of the inspection device (80) can be suppressed.

[0139] The diagnostic unit may be equipped with a mounting unit (for example, a mounting unit (710)) and a damping member (for example, a damping member (720)). The mounting unit is provided in the holding unit and extends toward the center of the opening. The damping member is mounted at the tip of the mounting unit. In this case, the damping member may be positioned so as to be exposed from the polymerization substrate when viewed from a plane in which the inspection device is viewed from a direction perpendicular to the plate surface of the polymerization substrate (for example, FIG. 5). By doing so, self-diagnosis using the diagnostic unit can be performed even when the polymerization substrate is held in the holding unit.

[0140] In addition, in the above-described embodiment, a bonding device was described as an example in which the center of the first substrate is pressed by a striker to contact the second substrate, and the first substrate and the second substrate are bonded using the intermolecular force generated between the bonding surfaces of the first substrate and the second substrate, which have modified surfaces. The bonding device is not limited thereto, and, for example, may be a bonding device of the type that bonds the first substrate and the second substrate by interposing an adhesive.

[0141] The embodiments disclosed herein should be considered as not being limited to examples in all respects. Indeed, the above-described embodiments may be implemented in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and intent of the appended claims. Explanation of the symbols delete

Claims

Claim 1 A self-diagnostic method for an inspection device for inspecting a polymerized substrate having a first substrate and a second substrate bonded together, comprising: a step of placing the attenuating member between a light source positioned above or below the retaining member and irradiating light onto the polymerized substrate held by the retaining member by moving the retaining member, wherein the retaining member is provided with a diagnostic unit having an attenuating member that attenuates light; a step of placing the attenuating member between a light source positioned above or below the retaining member and irradiating light onto the polymerized substrate held by the retaining member, and an imaging unit positioned opposite the light source positioned above or below the retaining member and imaging the polymerized substrate held by the retaining member; a step of irradiating light from the light source with a set amount of light after the step of placing the attenuating member, a step of receiving light irradiated from the light source and transmitted through the attenuating member using the imaging unit after the step of receiving the light, and a step of determining an abnormality in the amount of light irradiated from the light source based on the amount of light received by the imaging unit after the step of receiving the light. The attenuating member A self-diagnosis method of an inspection device comprising: having a calibration mark; a process of capturing the calibration mark using the imaging unit after the above-mentioned investigation process; and a process of determining the tilt of the optical axis of the illumination unit based on the calibration mark captured by the imaging unit after the above-mentioned imaging process. Claim 2 A self-diagnosis method of an inspection device according to claim 1, wherein the process of determining an abnormality in the amount of light comprises calculating the difference between an initial amount of light received that is stored in advance as the amount of light received by the imaging unit after being irradiated from the illumination unit with the set amount of light and passing through the attenuation member, and the amount of light received by the imaging unit during the light receiving process, and determining that the amount of light irradiated from the illumination unit is abnormal if the difference is greater than or equal to a light amount threshold. Claim 3 A self-diagnosis method of an inspection device according to claim 1 or 2, further comprising a process of changing the set light amount when it is determined that the amount of light irradiated from the lighting unit is abnormal in the process of determining an abnormality in the amount of light. Claim 4 An inspection device for inspecting a polymerized substrate having a first substrate and a second substrate bonded together, comprising: a holding member that holds the outer periphery of the polymerized substrate; an illumination member disposed above or below the holding member and irradiating light onto the polymerized substrate held by the holding member; an imaging member disposed opposite to the illumination member in the other above or below the holding member and imaging the polymerized substrate held by the holding member; a moving mechanism for moving the holding member; and a diagnostic member provided in the holding member and having an attenuation member that attenuates light irradiated from the illumination member, wherein the attenuation member comprises silicon. Claim 5 In claim 4, the damping member comprises the silicon, glass laminated to the silicon, and a calibration mark formed on the glass, forming an inspection device. Claim 6 An inspection device for inspecting a polymerized substrate having a first substrate and a second substrate bonded together, comprising: a holding part that holds the outer periphery of the polymerized substrate; an illumination part disposed in one of the upper and lower sides of the holding part and irradiating light onto the polymerized substrate held in the holding part; an imaging part disposed in the other of the upper and lower sides of the holding part at a position opposite to the illumination part and imaging the polymerized substrate held in the holding part; a moving mechanism for moving the holding part; and a diagnostic part provided in the holding part and having an attenuation member that attenuates light irradiated from the illumination part. The holding part comprises a main body part having an opening with a diameter larger than that of the polymerized substrate and a plurality of support members provided in the main body part, extending toward the center of the opening and supporting the outer periphery of the polymerized substrate at a tip end. The diagnostic part is disposed between two adjacent support members. Claim 7 In claim 6, the diagnostic part is provided in the retaining part and has a mounting part extending toward the center of the opening and a damping member mounted on the tip of the mounting part, and the damping member is positioned at a location exposed from the polymerization substrate when viewed in a plane in which the inspection device is viewed from a direction perpendicular to the plate surface of the polymerization substrate. Claim 8 delete Claim 9 delete

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