Substrate handling device and substrate handling method

Abstract

A substrate handling device according to one or more embodiments may include: a base, a lifting unit connected to the base to freely rise and fall, an arm rotatably connected to the lifting unit, a disk provided on the arm, and a hand rotatably connected to the arm, wherein the hand is provided in a position to overlap with the arm, the disk is provided below the substrate pulled out by the hand.

Description

Technology Field

[0001] background

[0002] The present disclosure relates to a semiconductor manufacturing device, and in particular to a substrate handling device and a substrate handling method for handling a substrate including a semiconductor wafer and a liquid crystal substrate. Background Technology

[0003] In manufacturing semiconductor devices and liquid crystal devices, a plurality of manufacturing devices are used, including devices that perform process treatments such as forming devices on a substrate and substrate inspection devices. A substrate handling device is used to transport semiconductor wafers and liquid crystal substrates between these manufacturing devices. The substrate handling device includes industrial robots, and in particular, an industrial robot used in a cleanroom where semiconductor manufacturing devices are installed is called a clean robot. The clean robot removes a substrate from a Front Opening Unified Pod (FOUP) loaded with multiple substrates and transports the substrate to a predetermined position in a substrate storage unit included in the manufacturing device for the next process. During this transport, the substrate may be photographed by an imaging device, such as a camera, to recognize the position and orientation of the substrate. The substrate handling device adjusts the position and orientation of the substrate based on the image from the imaging device and transports the substrate to the semiconductor manufacturing device for the next process.

[0004] Japanese published patent application JP-H10-329064 (Iwata) discloses a technology for transporting a liquid crystal glass substrate by an industrial robot and recognizing the position of the liquid crystal glass substrate in a non-contact manner using a plurality of corresponding cameras. In the above document, Iwata discloses an industrial robot that transports a liquid crystal glass substrate and places the liquid crystal glass substrate at a position of a substrate holder; a plurality of fixed substrate holder cameras provided at positions above the substrate holder at code recognition locations for recognizing positioning codes provided on the substrate holder, and an upper illuminator; a plurality of fixed liquid crystal glass substrate cameras provided at positions above the liquid crystal glass substrate at position recognition locations for recognizing the position of the liquid crystal glass substrate, and a lower illuminator provided below the liquid crystal glass substrate; and a control unit that commands the industrial robot to recognize the gripping position of the liquid crystal glass substrate when the industrial robot grasps the liquid crystal glass substrate, and commands the industrial robot to perform an action to correct the difference between the positioning code recognition location of the substrate holder and the result of the gripping position recognition.

[0005] outline

[0006] A substrate handling device according to one or more embodiments may include: a base; an elevating unit connected to the base to freely rise and fall; a hand unit movably connected to the elevating unit to acquire a substrate; and a disk provided in a position where the hand can move the substrate.

[0007] A substrate handling method may include the steps of: extracting a substrate; returning the extracted substrate to a disk; capturing an image of the substrate with a camera; calculating the position of the substrate based on the captured image; and placing the substrate based on the calculated correction amount. Brief explanation of the drawing

[0008] A brief explanation of the drawings FIG. 1 is a perspective view showing a substrate handling device according to one or more embodiments. FIG. 2a is a plan view of a disk according to one or more embodiments, and FIG. 2b is a cross-sectional view AA of the disk shown in FIG. 2a. FIG. 3a is a plan view of a disk according to one or more embodiments of the present invention, and FIG. 3b is a cross-sectional view of the disk BB shown in FIG. 3a. FIG. 4 is a diagram showing a flowchart of the operation of a substrate handling device according to one or more embodiments. FIG. 5 is a drawing showing a perspective view of a substrate handling device according to one or more embodiments. FIG. 6 is a perspective view showing a state in which a substrate drawn out onto a disk provided to a substrate handling device is returned. Figure 7 is a plan view showing the state in which the withdrawn substrate is returned to a disk provided to the substrate handling device. FIG. 8 is a drawing showing a perspective view of a substrate handling device according to one or more embodiments. FIG. 9 is a drawing showing a perspective view of a substrate handling device according to one or more embodiments. FIG. 10 is a drawing showing a perspective view of a substrate handling device according to one or more embodiments. FIG. 11 is a drawing showing a perspective view of a substrate handling device according to one or more embodiments. Specific details for implementing the invention

[0009] details

[0010] A substrate handling device according to one or more embodiments will be described in detail with reference to the drawings. In the description of the drawings, identical or similar parts may be indicated by identical or similar reference numerals. The descriptions in the drawings are schematic, and the relationships between thickness and dimensions, and the ratios of the lengths and thicknesses of each part, are exemplary and do not limit the technical scope of the invention. The relationships between dimensions and the ratios of dimensions may differ between the drawings. In the following description, when explaining the positional relationships of each component, terms such as 'top', 'bottom', 'right', 'left', etc., are appropriately used depending on the direction of the referenced drawing, but these indications do not limit the technical scope of the invention. Expressions such as 'top', 'bottom', 'right', 'left', etc., may be used even when the parts are not touched. In the specification or drawings, "X-axis," "Y-axis," and "Z-axis" may be used to describe directions, and "XY-plane," "YZ-plane," and "ZX-plane" may be used in the specification or drawings to describe planes corresponding to the "X-axis," "Y-axis," and "Z-axis" in the drawings. "Length direction" may refer to the direction of the long side on the main surface of the member, and may refer to the X-direction or the direction opposite to the X-direction in the drawings. "Width direction" may refer to the direction of the short side on the main surface of the member, and may refer to the Y-direction or the direction opposite to the Y-direction in the drawings. "Height direction" and "vertical direction" may refer to the Z-direction or the direction opposite to the Z-direction in the drawings.

[0011] FIG. 1 is a drawing illustrating a perspective view of a substrate handling device (100) according to one or more embodiments. The substrate handling device (100) of FIG. 1 particularly illustrates a horizontal joint clean robot. The substrate handling device (100) includes a base (101) and a hand unit comprising an arm (120) and a hand (130). The base (101) supports a lifting unit (111). The base (101) is controlled to rise and fall by a controller (200) that controls the substrate handling device (100). The base (101) may be fixed to a floor surface where the substrate handling device (100) is installed, or it may be fixed to another semiconductor manufacturing facility. The lifting unit (111) raises the arm (120) in the Z-axis direction. The arm (120) is rotatably mounted on the lifting unit (111). The lifting unit (111) may be cylindrical or rectangular.

[0012] The arm (120) is mounted so as to be movable in a vertical direction by the lifting unit (111). The arm (120) is rotatably mounted on the lifting unit (111). The arm (120) may be a horizontally articulated arm. The arm (120) includes a first arm (121) and a second arm (122).

[0013] The first arm (121) is mounted between the lifting unit (111) and the second arm (122). The first end of the first arm (121) is provided to be movable in the Z direction by the lifting unit (111). The first arm (121) is mounted rotatably around the lifting unit (111) in the XY plane shown in the drawing. The second arm (122) is rotatably mounted to the second end of the first arm (121). The axis of rotation of the arm (120) may be provided around the center of the cross-section in the XY plane of the lifting unit (111).

[0014] The second arm (122) is mounted between the first arm (121) and the hand (130). The first end of the second arm (122) is rotatably mounted to the first arm (121) in the XY plane shown in the drawing. The hand (130) is rotatably mounted to the second end of the second arm (122).

[0015] The hand (130) includes a wrist (131) and a fork (132) and is rotatably mounted to the second arm (122) via the wrist (131). The wrist (131) is rotatably mounted to the second end of the second arm (122) in the XY plane. The hand (130) uses the fork (132) to withdraw a substrate (W) from a FOUP (Front Opening Unified Pod) loaded with a plurality of wafers, etc. Afterward, the hand (130) returns the withdrawn substrate (W) to a predetermined position within a substrate storage unit included in a manufacturing device.

[0016] The hand (130) illustrated in FIG. 1 is a vacuum hand type, and the fork (132) of the hand (130) has a branched structure and has suction units at its tips. The fork (132) conveys the substrate (W) by applying negative pressure to the surface of the substrate (W). A suction type hand includes, for example, a Bernoulli chuck.

[0017] The hand (130) is not limited to a vacuum hand type and may be a manual grip type or an edge grip type. A manual grip type hand is a grip that does not fix the substrate placed on the hand and may not have a pressure member. An edge grip type has an edge guide at each fork split end. A pressure member is provided near the list. The pressure member can slide along the surface of the hand by means of an actuator including a pneumatic cylinder. By sliding the pressure member while the substrate is placed on the fork, the substrate is held between the edge guide and the pressure member. In any configuration, the hand (130) has a configuration for supporting the substrate (W) and conveying the substrate (W).

[0018] Each of the lifting unit (111), the first arm (121), the second arm (122), and the hand (130) may be driven by a controller (200). Each of the lifting unit (111), the first arm (121), the second arm (122), and the hand (130) may be driven by an actuator not shown in the drawing. An actuator not shown in the drawing may include, for example, an electric motor. An encoder (not shown in the drawing) for detecting the rotational position of each of the first arm (121), the second arm (122), and the hand (130) may be installed at the arm joints located between the lifting unit (111) and the first arm (121), between the first arm (121) and the second arm (122), and between the second arm (122) and the hand (130). Additionally, the substrate handling device (100) may be provided with an encoder (not shown in the drawing) to detect a change in the position of the first arm (121) in the height direction, for example, the amount of lifting of the first arm (121) of the lifting unit (111). In this way, each joint of the arm (120) and the hand (130) is controlled to transport the substrate (W).

[0019] The controller (200) is connected to the base (101) and performs various controls, including arm position control of the substrate handling device (100). The controller (200) controls the operations of actuators that drive the lifting unit (111), the first arm (121), the second arm (122), and the hand (130), respectively. The control of these actuators may be performed based on position information, including the rotational position or height position of the first arm (121), the second arm (122), or the hand (130), detected by an encoder (not shown in the drawing). The controller (200) is a separate housing from the base (101), but the controller (200) and the base (101) may be in a single housing. Additionally, the controller (200) is required to perform various controls of the substrate handling device (100) and can perform controls by being connected to the substrate handling device (100) via a wired or wireless connection. The controller (200) does not need to be located near the substrate handling device (100) and, for example, can be connected via the Internet to perform various controls of the substrate handling device (100).

[0020] The controller (200) may be, for example, a computer including a CPU (Central Processing Unit), and the computer reads a computer program stored on a storage medium and performs various controls of the board handling device (100). The storage medium may be a non-transient computer-readable storage medium such as ROM (Read Only Memory), and tape, disk, card, semiconductor memory, programmable logic circuit, etc. may be used. In addition, to expand the program, the computer may be further provided with RAM (Random Access Memory), etc. In addition, the program may be supplied to the computer through any transmission medium (communication network, broadcast wave, etc.) capable of transmitting the program. In addition, the program may be implemented in the form of a data signal embedded in a carrier wave, where the program is implemented by electronic transmission.

[0021] The substrate handling device (100) includes a disk (140). The disk (140) is provided on the first end of the second arm (122). Considering the handling of the hand (130), the disk (140) may be provided at a predetermined distance from the rotation axis of the hand (130) (not shown in the drawing). The hand (130) takes out the substrate (W) and moves the substrate (W) onto the disk (140). After taking out the substrate (W), the hand (130) rotates and moves it in the XY plane shown in the drawing and moves it substantially parallel to the second arm (122). When the substrate (W) is moved onto the first end of the second arm (122), the disk (140) is positioned substantially below the substrate (W) in the Z-axis direction of the drawing. The shape of the disk (140) shown in FIG. 1 is circular, but is not limited thereto and can be implemented. The shape and dimensions of the disk (140) may be determined by considering the shape and dimensions of the substrate (W) to be returned, the environment in which the substrate handling device (100) is installed, etc. For example, the shape and dimensions of the disk (140) may be nearly identical to the shape and dimensions of the substrate (W) to be returned. If the shape of the substrate (W) is substantially circular, the disk (140) may be substantially circular. Regarding the dimensions of the disk, the diameter may be 50 mm or more and 500 mm or less, or 200 mm or more and 400 mm or less. Additionally, depending on the size of the substrate, 500 mm or more may be implemented. For example, if the substrate (W) is 300 mm, the disk may be 300 mm or more. Additionally, the substrate handling device (100) of FIG. 1 includes a 2-link arm having two arms, but is not limited thereto, and the number of arms may be one, three, four, or more. A disk may be provided at the end of an arm to which a hand is not connected. In the case of multiple arms, the arm may be connected to a hand, and a disk may be provided at the end opposite to the end connected to the hand along the length of the arm.That is, in the case of multiple arms, the arms may be connected to the hands, and the disk may be provided at the ends not connected to the hands. Additionally, the disk may be provided at the arms not connected to the hands. For example, in the substrate handling device (100) illustrated in FIG. 1, the disk (140) may be provided on the first arm (121). For example, the disk (140) may be provided near the first end of the first arm (121).

[0022] FIGS. 2A and FIGS. 2B are drawings illustrating a disk according to one or more embodiments. In the disk (141) illustrated in FIG. 2A, a plurality of lights (143) are provided inside the disk (141). A plurality of lights (143) are provided on the surface of the disk (141). The plurality of lights (143) may be light-emitting, for example, LEDs (Light Emitted Diodes) or fluorescent lights. FIG. 2B is a drawing illustrating a cross-sectional view AA of the disk (141). A plurality of lights (143) are installed in the disk body (145) of the disk (141). A cover (147) is provided to cover the plurality of lights (143). The cover (147) is a transparent or translucent material and transmits or partially transmits light from the lights (143). This allows light from the plurality of lights (143) to be emitted to the outside of the disk (141). In the embodiment of FIG. 2a, the plurality of lights (143) are smaller than the disk (141), but are not limited thereto, and lights of approximately the same size as the disk (141) may be provided inside the disk body (145). This allows for uniform light intensity to be obtained. Additionally, the disk (141) is provided with a transparent or translucent cover (147), but is not limited thereto, and, for example, the lights may be exposed to the outside without a cover.

[0023] FIGS. 3A and FIGS. 3B are drawings illustrating a disk (142) according to one or more embodiments, respectively. In the disk (142) illustrated in FIG. 3A, a plurality of lights (143) are provided inside the disk (142). The plurality of lights (143) are provided on the surface of the disk (142) and are arranged along the periphery of the disk (142). The plurality of lights (143) may be light-emitting, for example, LEDs (Light Emitted Diodes) or fluorescent lights. FIG. 3B is a drawing illustrating a BB cross-sectional view of the disk (142). In the disk (142), a plurality of lights (143) are provided around the periphery of the disk body (148). A cover (149) is provided to cover the plurality of lights (143). The cover (149) is a transparent or translucent member and transmits or partially transmits light from the lights (143). This allows light from a plurality of lights (143) to be emitted to the outside of the disk (142). In the embodiment of FIG. 3a, the plurality of lights (143) are smaller than the disk (142), but are not limited thereto, and a light of approximately the same size as the disk (142) may be provided on the outer periphery of the disk body (148). This allows the outer periphery of the disk (142) to have a uniform amount of light. Additionally, the disk (142) is provided with a transparent or translucent cover (149), but is not limited thereto, and the light may be exposed to the outside, for example, without a cover.

[0024] Here, the lights (143) may be controlled to be on and off. That is, the lights (143) may be turned on only when the substrate (W) moves onto the disk (140) and is captured by a camera (not shown in the drawing), and the lights (143) may be turned off when the camera finishes capturing the image. By doing so, not only can low power consumption be achieved, but the degradation of the substrate caused by the lights (143) can also be mitigated. In addition, the light intensity of the lights (143) may be varied. This allows the camera to obtain a clear image without being affected by the environment of the substrate handling device (100). In addition, the color temperature of the lights (143) may be approximately 2600 K to 7100 K. Amber, warm white, warm white, white, day white, daylight color, etc., may be selected depending on the environment of the substrate handling device and the characteristics of the substrate used.

[0025] Next, the operation of the substrate handling device (100) is described with reference to the drawings. FIG. 4 is a flowchart showing the operation of the substrate handling device (100) according to one or more embodiments. The substrate handling device (100) first removes a substrate from a FOUP, etc. (step S101). A fork (132) provided on the hand (130) of the substrate handling device (100) is used to remove the substrate (W). Next, the removed substrate (W) is returned onto a disk (140) provided on the substrate handling device (100) (step S103). The disk (140) is provided on the arm (120) of the substrate handling device (100). The hand (130) that removed the substrate (W) is rotated, and the substrate (W) is moved onto the disk (140) provided on the arm (120) within the substrate handling device (100). Next, the substrate (W) is captured by a camera (not shown in the drawing) (step S105). During the capture, a light (not shown in the drawing) provided on the disk (140) is turned on to illuminate the substrate (W). This allows for obtaining a clearer image. The light (not shown in the drawing) may be turned on only when capturing the substrate (W) and may be turned off at other times. This can reduce power consumption and extend the lifespan of the light (not shown in the drawing). Additionally, it can reduce potential degradation of the substrate (W) caused by the light. The capture by the camera (not shown in the drawing) may be either a still image or a video. Here, the detection targets by the camera (not shown in the drawing) include the position of the substrate (W), the orientation of the substrate (W), the detection of defective substrates (W), and the recognition of the type of the substrate (W). Next, the position of the substrate (W) is calculated based on the captured image (step S107).To calculate the position of the substrate (W), for example, the positions of the notch and orientation flat of the substrate (W) are obtained from a captured image, and a correction amount for the position of the substrate (W) is calculated based on the position and orientation of the substrate (W) relative to the position and orientation of the fork (132). The measurement and correction of the misalignment of the substrate (W) is referenced with reference to U.S. Patent Publication No. 2021 / 0257242. Next, the substrate (W) is placed on a manufacturing device for the next process based on the calculated correction amount (step S109).

[0026] Accordingly, according to a substrate handling device (100) according to one or more embodiments, when acquiring an image of a substrate used to correct the position of the substrate, the substrate is transported onto a disk having a light that illuminates the substrate. Since the disk is provided on the arm of the substrate handling device, the travel distance of the disk can be shortened and the travel time of the disk can be reduced. In addition, the detection of the position and orientation of the substrate is improved because the imaging position is on the upper part of the arm.

[0027] FIG. 5 is a drawing illustrating a perspective view of a substrate handling device (300) according to one or more embodiments. The substrate handling device (300) of FIG. 5 particularly illustrates a horizontal joint clean robot. The substrate handling device (300) includes a base (301) and a hand unit comprising an arm (320) and a hand (330). The substrate handling device (300) may have a lifting unit. The arm (320) may be connected to the lifting unit so as to be vertically movable in the Z-axis direction illustrated in the drawing. The base (301) may be connected to a controller (not shown in the drawing) that controls the substrate handling device (300). The base (301) may be fixed to a floor surface where the substrate handling device (300) is installed, or fixed to another semiconductor manufacturing facility. The lifting unit (not shown in the drawing) raises the arm (320) to move the arm (320) in the Z-axis direction. The arm (320) is rotatably mounted on a lifting unit (not shown in the drawing). Here, if the substrate (W) does not require movement in the Z-axis direction shown in the drawing, the lifting unit (not shown in the drawing) is not required.

[0028] The arm (320) is attached so as to be movable in a vertical direction by a lifting unit (not shown in the drawing). The arm (320) is mounted rotatably in the XY plane shown in the drawing by a lifting unit (not shown in the drawing). The arm (320) may be a horizontal joint arm. The arm (320) includes a first arm (321) and a second arm (322).

[0029] The hand (330) is rotatably attached to the second arm (322) via a list (331). The list (331) is rotatably attached to the second end of the second arm (322) in the XY plane shown in the drawing. The hand (330) takes a substrate (W), such as a wafer, out of a Front Opening Unified Pod (FOUP) in which a plurality of substrates are mounted, and returns the substrate (W) to a predetermined position in a substrate storage section included in a manufacturing device. The hand (330) includes suction units (333A and 333B) for suctioning the substrate (W), the substrate (W) is sucked onto the fork (332) by the suction units, and the hand (330) includes a vacuum hand for moving the substrate. The vacuum hand can reduce the blockage of light from the disk (340) more than the edge gripping hand. To reduce light blockage, the fork (332) of the hand (330) may be equipped with a light (not shown in the drawing). When the disk (340) is used as a backlight to illuminate the substrate (W), the fork blocks the light. A light (333) is provided on the fork (332), and the light illuminates the substrate. This allows the light from the light to compensate for the light from the disk (340) even when the fork blocks the light.

[0030] A disk (340) is provided on the upper part of the first end of the second arm (322). The disk (340) may use, for example, the disk illustrated in FIG. 2a, FIG. 2b, FIG. 3a, and FIG. 3b.

[0031] Next, the operation of the substrate handling device (300) will be described in detail with reference to the drawings. As illustrated in FIG. 5, the substrate handling device (300) first extracts a substrate (Wp) from a FOUP (not shown in the drawing), etc. When the substrate (W) is extracted, the substrate handling device (300) performs position control of the hand (330) and moves the hand (330) to a predetermined position of the FOUP (not shown in the drawing) to extract the substrate. Next, the extracted substrate (W) is returned onto a disk (340) provided to the substrate handling device (300).

[0032] FIG. 6 is a perspective view showing a substrate (W) being transported on a disk (340) provided to a substrate handling device (300). A hand (330) rotates in the XY plane and moves the substrate (W) onto the disk (340). As illustrated in the drawing, the substrate (W) is placed substantially on the top of the disk (340). Next, the substrate (W) is captured using a camera (350). During the capture, a light (not shown in the drawing) provided to the disk (340) is turned on to illuminate the substrate. This allows a clearer image to be obtained. The light may be turned on only when capturing the substrate and turned off at other times. This can reduce power consumption and extend the lifespan of the light (not shown in the drawing). The camera (350) may capture either a still image or a video. Here, the detection targets of the camera (350) include the position of the substrate, the orientation of the substrate, the detection of defective substrates, and the recognition of the type of substrate. Next, the position of the substrate is calculated based on the captured image. To calculate the position of the substrate, for example, the positions of the notch or orientation flat of the substrate are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate relative to the position and orientation of the fork. Next, based on the calculated correction amount, the substrate is placed in the substrate housing of the manufacturing device in the next process. Additionally, the position of the camera (350) may be any position where the substrate (W) can be captured. The camera (350) may be provided above the movement range of the disk (340). By doing so, the movement of the disk can be minimized. Thus, the time required to move the disk can be minimized, thereby improving the throughput of the substrate transport.

[0033] FIG. 7 is a plan view showing a state in which a substrate (W) drawn out onto a disk (340) provided to a substrate handling device (300) is returned. An example in FIG. 6 shows an example where the hand (330) and the second arm (322) overlap and the substrate (W) is moved to the upper surface of the disk (340). An example in FIG. 7 shows an example where the hand (330), the second arm (322), and the first arm (321) overlap and the substrate (W) is moved to the upper surface of the disk (340). For example, the hand (330) rotates in the XY plane to move the substrate (W) onto the disk (340). Then, the second arm (322) moves onto the first arm (321). As illustrated in the drawing, the substrate (W) is substantially placed on the upper surface of the disk (340). When the light (not shown in the drawing) of the disk (340) is turned on and the first arm (321) is in the same position, an image of the substrate (W) is captured by a camera (not shown in the drawing). The position of the disk (340) according to the arrangement illustrated in FIG. 6 and the position of the disk (340) illustrated in FIG. 7 are in the same position. Thus, the degree of freedom in the camera array is increased, and furthermore, the camera can be provided near the substrate handling device (300). This can increase the degree of freedom of the floor plan.

[0034] According to a substrate handling device according to one or more embodiments, by positioning a camera (350) at a predetermined position on the upper part of a disk (340) to recognize the position and orientation of the substrate (W), the procedure of moving the substrate (W) to a station where the camera is installed, for example, becomes unnecessary. This reduces the time required to place the substrate (W) in the hand, recognize its position and orientation, and move the substrate (W) to a designated device, thereby maintaining high throughput. In addition, since there is no need to provide a separate station where the camera is installed, it can contribute to saving space. Furthermore, since there is no need to install a station, the clean room environment can be improved. Also, by installing a disk containing a light on an arm, the degree of design freedom is improved, and the camera can be positioned close to the substrate handling device.

[0035] FIG. 8 is a perspective view of a substrate handling device (400) according to one or more embodiments. The substrate handling device (400) of FIG. 8 represents a horizontal joint clean robot, and in particular represents a part of a clean robot in which the lifting axis is of the column type. The substrate handling device (400) includes a lifting column (401), a lifting unit (411), and a hand unit including an arm (420) and a hand (430). The lifting column (401) supports the lifting unit (411) so that it can be raised and lowered. The lifting unit (411) is controlled to be raised and lowered by a controller (not shown in the drawing) that controls the substrate handling device (400). The lifting column (401) may be fixed to a floor surface where the substrate handling device (400) is installed, or it may be fixed to other semiconductor manufacturing equipment (not shown in the drawing). The lifting unit (411) lifts the arm (420) in a vertical direction (Z-axis direction) along a groove provided in the lifting column (401). The arm (420) is rotatably attached to the lifting unit (411). Considering the rotation of the arm (420), the rotation axis of the arm (420) (not shown in the drawing) and the lifting column (401) have a predetermined distance. The lifting column (401) of FIG. 8 has a structure in which a groove is formed in a rectangular body through which the lifting unit (411) can move, but is not limited thereto. For example, the structure may have a groove in a cylindrical shape through which the lifting unit (411) can move.

[0036] The lifting unit (411) moves up and down to move in a vertical direction (Z-axis direction), and the arm (420) is mounted to be movable vertically. The arm (420) is rotatably attached to the lifting unit (411). The arm (420) may be a horizontal joint arm. The arm (420) includes a first arm (421) and a second arm (422). The axis of rotation of the arm (420) may be provided at the approximate center of the arm (420). This avoids contact with the lifting column (401) caused by the rotational movement of the arm (420) and can minimize the distance between the arm (420) and the lifting column (401).

[0037] The first arm (421) is mounted between the lifting unit (411) and the second arm (422). The first end of the first arm (421) is provided to be movable in the Z-direction as shown in the drawing by the lifting unit (411). The first arm (421) is mounted rotatably in the XY-plane as shown in the drawing. At the second end of the first arm (421), the second arm (422) is attached.

[0038] The second arm (422) is mounted between the first arm (421) and the hand (430). The first end of the second arm (422) is rotatably attached to the first arm (421) in the XY plane shown in the drawing. At the second end of the second arm (422), the hand (430) is attached.

[0039] The hand (430) includes a list and a fork, and is rotatably attached to the second arm (422) via the list in the XY plane shown in the drawing. The list is rotatably attached to the second end of the second arm (422) in the XY plane shown in the drawing. The hand (430) uses the fork to obtain a substrate (W) from a FOUP (Front Opening Unified Pod) loaded with a plurality of wafers, etc. Then, the hand (430) returns the withdrawn substrate (W) to a predetermined position in a substrate storage unit included in a manufacturing device.

[0040] The fork of the hand (430) illustrated in FIG. 8 may be an edge-grabbing type having a branching structure as illustrated in FIG. 5, for example. Additionally, the hand (430) is not limited to an edge-grabbing type and may be a manual gripping type or a suction type. The hand (430) supports the substrate (W) and conveys the substrate (W).

[0041] The lifting unit (411), the first arm (421), the second arm (422), and the hand (430) are each controlled by a controller (not shown in the drawing). Each of the lifting unit (411), the first arm (421), the second arm (422), and the hand (430) may be driven by an actuator (not shown in the drawing). The actuator (not shown in the drawing) may include, for example, an electric motor. An encoder (not shown in the drawing) for detecting the rotational position of each of the first arm (421), the second arm (422), and the hand (430) may be installed at the arm joints located between the lifting unit (411) and the first arm (421), between the first arm (421) and the second arm (422), and between the second arm (422) and the hand (430). Additionally, in the substrate handling device (400), an encoder (not shown in the drawing) may be provided to detect a change in the position of the first arm (421) in the height direction, for example, the amount of lifting of the first arm (421) of the lifting unit (411). In this way, each joint of the arm (420) and the hand (430) is controlled to transport the substrate.

[0042] The substrate handling device (400) includes a disk (440). The disk (440) is provided on the upper part of the first end of the first arm (421). The disk (440) may be provided at a predetermined distance from the axis of rotation of the second arm (not shown in the drawing) in consideration of handling by the arm (420) and the hand (430). After the substrate (W) is removed, the hand (430) rotates and moves about the axis of rotation of the second end of the second arm (422) in the XY-plane shown in the drawing, and the first arm (421) rotates in the XY-plane shown in the drawing so that the substrate (W) is placed substantially on the disk (440) in the Z-axis direction shown in the drawing. The shape of the disk (440) illustrated in FIG. 8 is circular, but is not limited thereto and may be implemented. The shape and dimensions of the disk (440) may be the same as those of the embodiments described above. Additionally, the substrate handling device (400) of FIG. 8 includes a 2-link arm having two arms, but is not limited thereto, and the number of arms may be one, three, four, or more. A disk may be provided at the end of the arm to which the hand is not connected. In the case of multiple arms, the disk may be provided on the arm connected to the hand, on the side opposite to the end connected to the hand along the length of the arm. That is, in the case of multiple arms, the disk may be provided on the arm connected to the hand, on the end not connected to the hand. Additionally, the disk may be provided to a lifting unit.

[0043] Next, the operation of the substrate handling device (400) is described. The substrate handling device (400) may operate as illustrated in the flowchart of FIG. 4. That is, the substrate handling device (400) first extracts a substrate (W) from a FOUP, etc. (step S101). The substrate (W) is extracted using a fork provided on the hand (430) of the substrate handling device (400). Next, the extracted substrate (W) is returned onto a disk (440) provided on the substrate handling device (400) (step S102). The disk (440) is provided on the first arm (421) of the substrate handling device (400). The hand (430) from which the substrate (W) was extracted rotates in the XY plane illustrated in the drawing and moves the substrate (W) onto the disk (440) provided on the first arm (421). Next, the substrate (W) is captured by a camera (not shown in the drawing) (step S105). During the capture, a light (not shown in the drawing) provided to the disk (440) may be turned on to illuminate the substrate (W). The light provided to the disk (440) and the camera may be the same as in the previously described embodiments. Next, the position of the substrate (W) is calculated based on the captured image (step S107). To calculate the position of the substrate (W), for example, the positions of the notch and orientation flat of the substrate (W) are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate (W) relative to the position and orientation of the fork. For the measurement and correction of the position misalignment of the substrate (W), refer to U.S. Patent Publication No. 2021 / 0257242. Next, the substrate is placed in a manufacturing device for the next process based on the calculated correction amount (step S109).

[0044] Accordingly, according to a substrate handling device (400) according to one or more embodiments, when acquiring an image of a substrate used for position correction of a substrate (W), the substrate is transported onto a disk having a light that illuminates the disk. Since the disk is provided to the arm of the substrate handling device, the travel distance of the disk can be shortened and the travel time of the disk can be reduced. In addition, since the imaging position is the upper part of the arm, the detection of the position and orientation of the substrate is improved.

[0045] FIG. 9 is a drawing illustrating a perspective view of a substrate handling device (500) according to one or more embodiments. The substrate handling device (500) of FIG. 9 represents a horizontal joint clean robot, and in particular represents a part of a clean robot in which the lifting axis is of the column type. The substrate handling device (500) includes a lifting column (501), a lifting unit (511), and a hand unit including an arm (520) and a hand (530). The lifting column (501) supports the lifting unit (511) so that it can be raised and lowered in the Z-axis direction shown in the drawing. The lifting unit (511) is controlled to be raised and lowered by a controller (not shown in the drawing) that controls the substrate handling device (500). The lifting column (501) may be fixed to a floor surface where the substrate handling device (500) is installed, or it may be fixed to other semiconductor manufacturing equipment (not shown in the drawing). The lifting unit (511) raises and lowers the arm (520) along the groove provided in the lifting column (501) in the Z-axis direction as illustrated in the drawing. The arm (520) is rotatably attached to the lifting unit (511). The lifting column (501) of FIG. 9 is a structure in which a rectangular body has a groove for the lifting unit (511) to move, but is not limited thereto. For example, the structure may have a groove for the lifting unit (511) to move in a cylindrical shape.

[0046] The lifting unit (511) moves up and down in a vertical direction, and the arm (520) is mounted to be movable vertically. The arm (520) is rotatably attached to the lifting unit (511). The arm (520) may be a horizontal joint arm. The arm (520) includes a first arm (521) and a second arm (522).

[0047] The first arm (521) is mounted between the lifting unit (511) and the second arm (522). The first end of the first arm (521) is rotatably attached to the lifting unit (511) in the XY plane shown in the drawing. The second end of the first arm (521) is attached to the second arm (522).

[0048] The second arm (522) is mounted between the first arm (521) and the hand (530). The first end of the second arm (522) is rotatably attached to the second end of the first arm (521) in the XY plane shown in the drawing. The hand (530) is attached to the second end of the second arm (522).

[0049] The hand (530) includes a list and a fork. The hand (530) is rotatably attached to the second end of the second arm (522) via the list in the XY plane shown in the drawing. The hand (530) uses the fork to acquire a substrate (W) from a FOUP (Front Opening Unified Pod) loaded with a plurality of wafers, etc. The hand (530) returns the acquired substrate (W) to a predetermined position in a substrate storage unit included in a manufacturing device.

[0050] The fork of the hand (530) illustrated in FIG. 9 may be an edge grip type having a branching structure as illustrated in FIG. 5, for example. Additionally, the hand (530) is not limited to an edge grip type and may be a manual grip type or a suction type. The hand (530) supports the substrate (W) and conveys the substrate (W).

[0051] Each of the lifting unit (511), the first arm (521), the second arm (522), and the hand (530) is controlled when operated by a controller (not shown in the drawing). Each of the lifting unit (511), the first arm (521), the second arm (522), and the hand (530) may be driven by an actuator (not shown in the drawing). The actuator (not shown in the drawing) may include, for example, an electric motor. An encoder (not shown in the drawing) for detecting the rotational position of each of the first arm (521), the second arm (522), and the hand (530) may be attached to the arm joints located between the lifting unit (511) and the first arm (521), between the first arm (521) and the second arm (522), and between the second arm (522) and the hand (530). Additionally, the substrate handling device (500) may provide an encoder (not shown in the drawing) for detecting a change in position in the height direction of the first arm (521), for example, the amount of lifting of the first arm (521) of the lifting unit (511). In this way, the respective joints of the arm (520) and the hand (530) are controlled to transport the substrate.

[0052] The substrate handling device (500) includes a disk (540). The disk (540) is provided on the upper part of the lifting unit (511). Considering the handling of the arm (520) and the hand (530), the disk (540) may be provided at a predetermined interval from the rotation axis of the arm (520). The hand (530) pulls out the substrate (W) and moves the substrate (W) onto the disk (540). For example, after pulling out the substrate (W), the hand (530) rotates and moves in the XY plane shown in the drawing and moves substantially parallel to the upper part of the second arm (522). The second arm (522) rotates and moves in the XY plane shown in the drawing and moves substantially parallel to the upper part of the first arm (521). The first arm (521) rotates and moves in the XY plane shown in the drawing and moves substantially parallel to the upper part of the lifting unit (511). When the substrate (W) moves onto the lifting unit (511), the disk (540) is positioned so that it is substantially located below the substrate (W) in the Z-axis direction as illustrated in the drawing. The shape of the disk (540) illustrated in FIG. 9 is circular, but is not limited thereto and can be implemented in various ways. The shape and dimensions of the disk (540) may be the same as those of the embodiments described above. Additionally, the substrate handling device (500) of FIG. 9 includes a 2-link arm having two arms, but is not limited thereto, and the number of arms may be one, three, four, or more. The disk (540) is provided to the lifting unit (511), but is not limited thereto. The disk may be provided to the end of the arm to which the hand is not connected. In the case of multiple arms, the disk may be provided to the end of the arm connected to the hand on the opposite side of the end connected to the hand along the length of the arm. That is, in the case of multiple arms, the disk may be provided on the arm connected to the hand, or on the end not connected to the hand.

[0053] Next, the operation of the substrate handling device (500) is described. The substrate handling device (500) may operate as illustrated in the flowchart of FIG. 4. That is, the substrate handling device (500) first extracts a substrate (W) from a FOUP, etc. (step S101). The substrate (W) is extracted using a fork provided on the hand (530) of the substrate handling device (500). Next, the extracted substrate (W) is transported onto a disk (540) provided on the substrate handling device (500) (step S102). A disk (540) is provided on the lifting unit (511). The hand (530) from which the substrate (W) was extracted is rotated, and the substrate (W) is moved onto the disk (540) provided on the lifting unit (511) of the substrate handling device (500). Next, the substrate (W) is captured by a camera (not shown in the drawing) (step S105). During imaging, a light (not shown in the drawing) provided to the disk (540) may be turned on to illuminate the substrate (W). The light provided to the disk (540) and the camera may be the same as that in the previously described embodiments. Next, the position of the substrate (W) is calculated based on the captured image (step S107). To calculate the position of the substrate (W), for example, the positions of the notch and orientation flat of the substrate (W) are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate (W) relative to the position and orientation of the fork. For the measurement and correction of misalignment of the substrate (W), U.S. Patent Publication No. 2021 / 0257242 is incorporated herein by reference. Next, the substrate is placed in a manufacturing device for the next process based on the calculated correction amount (step S109).

[0054] Accordingly, according to one or more embodiments of the substrate handling device (500), when acquiring an image of the substrate used to correct the position of the substrate, the substrate is transported onto a disk having a light that illuminates the substrate. Since the disk is provided on the arm of the substrate handling device, the travel distance of the disk can be shortened and the travel time of the disk can be reduced. In addition, since the imaging position is on the upper part of the arm, the detection of the position and orientation of the substrate is improved. In addition, by providing the disk (540) to the lifting unit (511), an unexpected effect can be obtained in which the amount of light visible from the substrate (W) is stabilized.

[0055] FIG. 10 is a perspective view of a substrate handling device (600) according to one or more embodiments. The substrate handling device (600) of FIG. 10 represents a horizontal joint clean robot, specifically a part of a clean robot in which the lifting column (601) is of the column type and the hand (630) is directly connected to the lifting unit (611). The substrate handling device (600) includes the lifting column (601), the lifting unit (611), and the hand (630). The lifting column (601) supports the lifting unit (611). The lifting unit (611) is controlled to rise and fall by a controller (not shown in the drawing) that controls the substrate handling device (600). The lifting column (601) may be fixed to a floor surface where the substrate handling device (600) is installed, or it may be fixed to other semiconductor manufacturing equipment (not shown in the drawing). The lifting unit (611) lifts the hand (630) in a vertical direction (Z-axis direction) along a groove provided in the lifting column (601). The hand (630) is rotatably attached to the lifting unit (611) in the XY plane shown in the drawing. The lifting column (601) of FIG. 10 has a rectangular structure in which a groove is formed for the lifting unit (611) to move, but is not limited thereto. For example, the structure may have a groove for the lifting unit (611) to move in a cylindrical shape.

[0056] The lifting unit (611) moves up and down in a vertical direction, and the hand (630) is mounted to be movable vertically. The hand (630) is rotatably attached to the lifting unit (611) in the XY plane shown in the drawing.

[0057] The hand (630) includes a list and a fork, and is rotatably mounted on the lifting unit (611) in the XY plane shown in the drawing via the list. The hand (630) uses the fork to acquire a substrate (W) from a FOUP (Front Opening Unified Pod) loaded with a plurality of wafers, etc. Then, the hand (630) returns the acquired substrate (W) to a predetermined position in the substrate storage section included in the manufacturing device.

[0058] The fork of the hand (630) illustrated in FIG. 10 may be an edge-grabbing type having a branching structure as illustrated in FIG. 5, for example. Additionally, the hand (630) is not limited to an edge-grabbing type and may be a manual gripping type or a suction type. The hand (630) supports the substrate (W) and conveys the substrate (W).

[0059] Each of the lifting unit (611) and the hand (630) is controlled by a controller when in operation. Additionally, the lifting unit (611) and the hand (630) may each be driven by an actuator (not shown in the drawing). The actuator (not shown in the drawing) may include, for example, an electric motor. An encoder may be installed in the arm joint located between the lifting unit (611) and the hand (630) to detect each rotational position of the hand (630). Additionally, the substrate handling device (600) may be provided with an encoder (not shown in the drawing) to detect a change in the position of the hand (630) in the height direction, for example, the lifting amount of the hand (630) of the lifting unit (611). In this way, the joint of the hand (630) is controlled to transport the substrate.

[0060] The substrate handling device (600) includes a disk (640). The disk (640) is provided on the upper part of the lifting unit (611). Considering the handling of the hand (630), the disk (640) may be provided at a predetermined interval from the hand rotation axis (not shown in the drawing). The hand (630) pulls out the substrate (W) and moves the substrate (W) onto the disk (640). For example, after pulling out the substrate (W), the hand (630) rotates and moves along the XY plane shown in the drawing and moves substantially parallel to the upper part of the lifting unit (611). When the substrate (W) moves onto the lifting unit (611), the disk (640) is positioned approximately below the substrate (W) in the Z-axis direction shown in the drawing. The shape of the disk (640) illustrated in FIG. 10 is circular, but is not limited thereto and can be implemented. The shape and dimensions of the disk (640) may be the same as those of the embodiments described above.

[0061] Next, the operation of the substrate handling device (600) is described. The substrate handling device (600) may operate as illustrated in the flowchart of FIG. 4. That is, the substrate handling device (600) first extracts a substrate (W) from a FOUP, etc. (step S101). The substrate (W) is extracted using a fork provided on the hand (630) of the substrate handling device (600). Next, the extracted substrate (W) is returned onto a disk (640) provided on the substrate handling device (600) (step S102). The disk (640) is provided on a lifting unit (611). The hand (630) from which the substrate (W) was extracted is rotated, and the substrate (W) is returned onto the disk (640) provided on the lifting unit (611) of the substrate handling device (600). Next, the substrate (W) is captured by a camera (not shown in the drawing) (step S105). During imaging, a light (not shown in the drawing) provided to the disk (640) may be turned on to illuminate the substrate (W). The light provided to the disk (640) and the camera may be the same as that in the previously described embodiments. Next, the position of the substrate (W) is calculated based on the captured image (step S107). To calculate the position of the substrate (W), for example, the positions of the notch and orientation flat of the substrate (W) are obtained from the captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate (W) relative to the position and orientation of the fork. For the measurement and correction of misalignment of the substrate (W), U.S. Patent Publication No. 2021 / 0257242 is referenced together with the support. Next, the substrate is placed in a manufacturing device for the next process based on the calculated correction amount (step S109).

[0062] Accordingly, according to one or more embodiments of the substrate handling device (600), when acquiring an image of the substrate used to correct the position of the substrate, the substrate is transported onto a disk having a light that illuminates the substrate. Since the disk is provided on the substrate handling device (600), the travel distance of the disk can be shortened and the travel time of the disk can be reduced. In addition, since the imaging position is the upper part of the arm, the detection of the position and orientation of the substrate is improved. In addition, by providing the disk (640) to the lifting unit (611), an unexpected effect can be obtained in which the amount of light visible from the substrate (W) is stabilized. For examples of the structure and operation of the embodiment illustrated in FIG. 10, Patent No. US8746631 and Patent No. US10083851 are incorporated herein by reference.

[0063] FIG. 11 is a drawing illustrating a perspective view of a substrate handling device (700) according to one or more embodiments. The substrate handling device (700) of FIG. 11 represents a horizontal joint clean robot, and in particular, illustrates a part of a clean robot in which a lifting column (701) is of the column type and a hand (730) is directly connected to a first lifting unit (711). The substrate handling device (700) is similar to the substrate handling device (600) illustrated in FIG. 10, but the substrate handling device (700) differs in that a disk (740) is held in a disk holder (712). The disk holder (712) is connected to a groove provided in the lifting column (701), and the disk (740) is provided at a predetermined distance from the lifting column (701). The disc holder (712) is provided at a lower position than the first lifting unit (711), but is not limited thereto, and the disc holder (712) may be provided at a higher position than the first lifting unit (711). Additionally, the disc holder (712) is provided near the first lifting unit (711). The disc holder (712) may be raised in the Z-axis direction illustrated in the drawing as the first lifting unit (711) moves.

[0064] Each of the first lifting unit (711) and the hand (730) is controlled by a controller (not shown in the drawing). Additionally, the first lifting unit (711) and the hand (730) may each be driven by an actuator (not shown in the drawing). The actuator (not shown in the drawing) may include, for example, an electric motor. An encoder for detecting each rotational position of the hand (730) may be attached to the arm joint located between the lifting unit (711) and the hand (730). Additionally, in the substrate handling device (700), an encoder may be provided for detecting a change in the position of the hand (730) in the height direction, for example, the lifting amount of the hand (730) of the lifting unit (711). In this way, the joint of the hand (730) is controlled to transport the substrate. Additionally, the disk holder (712) may be fixed to the lifting column (701) and its operation may be controlled by a controller (not shown in the drawing). Additionally, the disk holder (712) may be driven by an actuator (not shown in the drawing). Furthermore, in the substrate handling device (700), an encoder may be provided to detect a change in the position of the disk holder (712) in the height direction, for example, the amount of lifting of the disk (740) of the disk holder (712).

[0065] The substrate handling device (700) includes a disk (740). The disk (740) is provided on a disk holder (712). The disk (740) may be provided in consideration of the position of the substrate (W) held by the hand (730). The hand (730) pulls out the substrate (W) and moves the substrate (W) onto the disk (740). For example, after pulling out the substrate (W), the hand (730) rotates and moves in the XY plane shown in the drawing, moving the substrate (W) onto the disk (740) along the Z-axis. The lifting unit (711) moves in the Z-axis direction shown in the drawing, for example, downward, to move the substrate (W) substantially over the disk (740). By doing so, the disk (740) is positioned so that the disk (740) is substantially below the substrate (W). The shape of the disk (740) shown in FIG. 11 is circular, but is not limited thereto and can be implemented in various ways. The shape and dimensions of the disk (740) may be the same as those of the previously described embodiment.

[0066] Next, the operation of the substrate handling device (700) is described. The substrate handling device (700) may operate as illustrated in the flowchart of FIG. 4. That is, the substrate handling device (700) first removes the substrate (W) from the FOUP, etc. (step S101). The substrate (W) is removed using the fork provided on the hand (730) of the substrate handling device (700). Next, the removed substrate (W) is returned onto the disk (740) provided on the substrate handling device (700) (step S102). The disk (740) is provided on the disk holder (712). The hand (730) that removed the substrate (W) is moved, and the substrate (W) is moved onto the disk (740) provided on the disk holder (712) of the substrate handling device (700). Here, when the removed substrate (W) is returned to the disk (740) provided to the substrate handling device (700), the lifting unit (711) may move the substrate (W) onto the disk holder (712), and the disk holder (712) may move the disk (740) under the substrate (W). Next, the substrate (W) is captured by a camera (not shown in the drawing) (step S105). During the capture, a light (not shown in the drawing) provided to the disk (740) may be turned on to illuminate the substrate (W). The light provided to the disk (740) and the camera may be the same as in the previously described embodiments. Next, the position of the substrate (W) is calculated based on the captured image (step S107). To calculate the position of the substrate (W), for example, the positions of the notch and orientation flat of the substrate (W) are obtained from a captured image, and a correction amount for the substrate position is calculated based on the position and orientation of the substrate (W) relative to the position and orientation of the fork. The measurement and correction of the misalignment of the substrate (W) is disclosed in US Patent Publication No. 2021 / 0257242, the full contents of which are incorporated herein by reference. Next, based on the calculated correction amount, the substrate is placed in a manufacturing device for the next process (step S109).

[0067] Accordingly, according to a substrate handling device (700) according to one or more embodiments, when acquiring an image of a substrate used to correct the position of a substrate (W), the substrate is transported onto a disk (740) having a light to illuminate the substrate. Since the disk (740) is provided to the substrate handling device (700), the travel distance of the disk can be shortened and the travel time of the disk can be shortened. Examples of the structure and operation of the embodiments are disclosed in FIG. 11 of U.S. Patent No. US 8,746,631 and U.S. Patent No. US 10,083,851, the full contents of which are incorporated herein by reference.

[0068] Conventionally, the substrate was placed on the hand of a substrate handling device and moved to the imaging location. Additionally, it was necessary to place an aligner near the substrate handling device to adjust the orientation of the substrate. As a result, the travel distance and travel time of the disk increased, affecting throughput. Furthermore, additional equipment was required when installing, for example, a dedicated station for imaging or an aligner, which resulted in constraints on the floor plan. Moreover, the floor plan had to be designed taking into account the movement of the arm of the substrate handling device.

[0069] According to a substrate handling device according to one or more embodiments, a disk is provided to the substrate handling device, and the substrate is imaged on the disk. As a result, the movement of the disk can be minimized. Therefore, since the movement time of the disk can be minimized, the throughput of substrate transport can be improved. In addition, the disk has a light that illuminates the substrate during imaging. Here, the camera is provided on the substrate, and the disk is provided below the substrate. That is, during imaging, the disk acts as a backlight, allowing the image of the substrate to be obtained more clearly.

[0070] In addition, according to a substrate handling device according to one or more embodiments, a correction amount regarding the position and orientation of the substrate is calculated, and the substrate is placed on a semiconductor manufacturing device in the next process based on the correction amount. In this case, the substrate is placed at a predetermined position and orientation by a placement operation based on the correction amount. Therefore, since there is no need to place an aligner in the substrate handling device as in the past, the degree of freedom of floor planning is improved.

[0071] One or more embodiments described in this specification may be combined with one another to the extent feasible within the scope of the intended embodiments. The foregoing embodiments should be regarded as exemplary in all respects and are not limiting. The embodiments illustrated and described may be extended to include other embodiments in addition to those specifically described without departing from the intended scope of the invention. The scope of the invention is not determined by the foregoing description, but by the claims in light of the specification, including equivalents. Accordingly, all configurations including those included within the equivalent scope of the claims are intended to be included in the invention. Accordingly, all configurations including those included in the equivalents of the claims are intended to be included in the invention.

Claims

Claim 1 A substrate handling device comprising: a base; a lifting unit connected to the base to move freely up and down; a hand unit for acquiring a substrate, wherein the hand unit comprises a first arm movably connected to the lifting unit and a second arm having a first end rotatably mounted on the first arm and a second end rotatably mounted on the hand; a camera positioned on the hand unit; and a disk positioned on the first end of the second arm, wherein the disk is present at a position where the hand unit moves the substrate, and wherein the substrate is positioned such that the substrate overlaps the disk between the camera and the disk for imaging the substrate from above by the camera, and the disk comprises a light for illuminating the substrate for imaging. Claim 2 A substrate handling device according to claim 1, wherein the arm is rotatably connected to the lifting unit, and the hand is movably connected to the arm to acquire the substrate. Claim 3 In paragraph 2, the above disk is positioned on the arm, forming a substrate handling device. Claim 4 In claim 1, the above disk is positioned on the base, forming a substrate handling device. Claim 5 A substrate handling device according to paragraph 2, wherein when the hand is positioned to overlap with the arm, the disk is positioned below the substrate acquired by the hand. Claim 6 delete Claim 7 A substrate handling device according to claim 1, wherein the disk comprises a plurality of lights that illuminate the substrate. Claim 8 A substrate handling device according to claim 7, wherein the plurality of lights are arranged on the entire surface of the disk. Claim 9 In claim 7, the plurality of lights are arranged in the periphery of the disk, a substrate handling device. Claim 10 A substrate handling device according to claim 1, wherein the light is turned on when the disk is imaged. Claim 11 A substrate handling device according to claim 1, wherein the first arm is rotatably connected to the lifting unit. Claim 12 A substrate handling device according to claim 1, wherein the hand comprises a suction hand including a suction portion. Claim 13 delete Claim 14 A substrate handling method comprising: a step of withdrawing the substrate; a step of returning the withdrawn substrate to be placed on a disk; a step of illuminating the substrate placed on the disk for imaging; a step of capturing the entire substrate with a camera when the substrate is placed on the disk; a step of calculating the position of the substrate based on the captured image; and a step of placing the substrate in a substrate storage unit based on the calculated correction amount. Claim 15 A substrate handling method according to claim 14, wherein the step of imaging the entire substrate comprises the step of turning on a light to image the substrate and the step of imaging the entire substrate. Claim 16 A substrate handling method according to claim 15, wherein the step of imaging the entire substrate further includes the step of turning off the light after imaging the entire substrate is completed.

Images