Display appartus

Abstract

According to the concept of the present invention, a display device comprises a plurality of display modules and a frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form, and each of the plurality of display modules comprises a substrate including a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface, and the frame comprises a first frame layer that is in contact with the plurality of display modules and is made of a material having material properties similar to those of the substrate, a second frame layer disposed behind the first frame layer in the direction facing the mounting surface and having a metal material, and a third layer disposed between the first frame layer and the second frame layer in the direction facing the mounting surface and provided to bond the first frame layer and the second frame layer.

Description

Technology Field

[0001] The present invention relates to a display device that displays an image by combining modules in which self-luminous inorganic light-emitting elements are mounted on a substrate. Background Technology

[0002] A display device is a type of output device that visually displays data information, such as characters and shapes, as well as images.

[0003] Generally, liquid crystal panels requiring a backlight or organic light-emitting diode (OLED) panels, composed of films of organic compounds that emit light in response to an electric current, have been primarily used as display devices. However, liquid crystal panels have issues such as slow response times, high power consumption, and difficulty in miniaturization because they cannot emit light themselves and require a backlight. Additionally, while OLED panels do not require a backlight because they emit light themselves and can be made thin, they are susceptible to burn-in—a phenomenon where specific parts of the previous image remain visible even after a screen change—as the lifespan of subpixels expires when the same image is displayed for a long time.

[0004] Accordingly, micro light-emitting diode (microLED or μLED) display panels are being researched as new panels to replace them, in which inorganic light-emitting elements are mounted on a substrate and the inorganic light-emitting elements themselves are used as pixels.

[0005] A micro light-emitting diode display panel (hereinafter referred to as a micro LED panel) is one of flat panel display panels and is composed of a plurality of inorganic light-emitting diodes (inorganic LEDs) each having a size of 100 micrometers or less.

[0006] Although these LED panels are also self-emissive devices, they are inorganic light-emitting devices, so the burn-in phenomenon of OLEDs does not occur, and they offer excellent brightness, resolution, power consumption, and durability.

[0007] Compared to liquid crystal display (LCD) panels that require backlighting, microLED display panels offer better contrast, response time, and energy efficiency. While both organic light-emitting diodes (OLEDs) and inorganic light-emitting devices like microLEDs are energy-efficient, microLEDs offer higher brightness, luminous efficiency, and a longer lifespan than OLEDs.

[0008] In addition, by arranging LEDs on a circuit board in pixel units, it is possible to manufacture display modules at the board level, and it is easy to produce them in various resolutions and screen sizes to meet customer orders. The problem to be solved

[0009] The present invention relates to a display device, and in particular, aims to provide a display device in which the display performance of a portion of a screen is not degraded by heat generated by the display device, such that a screen displayed by a plurality of display modules is not degraded. means of solving the problem

[0010] According to the concept of the present invention, a display device comprises a plurality of display modules and a frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form, wherein each of the plurality of display modules comprises a substrate having a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface, and the frame comprises a first frame layer that is in contact with the plurality of display modules and is made of a material having material properties similar to the material properties of the substrate, a second frame layer disposed behind the first frame layer in the direction in which the mounting surface faces and having a metal material, and a third layer disposed between the first frame layer and the second frame layer in the direction in which the mounting surface faces and is provided to bond the first frame layer and the second frame layer.

[0011] In addition, the substrate and the first frame layer are each made of the same material.

[0012] In addition, the flexibility of the third frame layer is arranged to be greater than the flexibility of the first frame layer and the second frame layer.

[0013] In addition, the thermal expansion coefficient of the first frame layer is configured to be smaller than the thermal expansion coefficient of the second frame layer.

[0014] In addition, the third frame layer comprises a first adhesive layer bonded to the first frame layer, a second adhesive layer bonded to the second frame layer, and a highly flexible layer disposed between the first adhesive layer and the second adhesive layer in the direction toward the mounting surface, and configured to allow for deformation of thickness in the direction toward the mounting surface.

[0015] In addition, the thickness of the first frame layer in the direction facing the aforementioned mounting surface is thinner than the thickness of the second frame layer in the direction facing the aforementioned mounting surface.

[0016] In addition, the plurality of display modules each include a metal plate facing the rear surface of the substrate and dissipating heat generated from the substrate, and an adhesive member provided to allow the plurality of display modules to each be attached to the first frame layer.

[0017] In addition, the plurality of display modules further include an adhesive layer disposed between the rear surface of the substrate and the metal plate to bond the rear surface of the substrate and the metal plate, and the ductility of the adhesive layer is configured to be greater than the ductility of the substrate and the metal plate.

[0018] In addition, the adhesive member is placed on the metal plate so that the metal plate is adhered to the first frame layer.

[0019] In addition, the adhesive member is placed on the rear surface of the substrate so that the substrate is adhered to the first frame layer.

[0020] A display device according to the concept of the present invention comprises a plurality of display modules and a frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form, wherein each of the plurality of display modules comprises a substrate made of glass material having a mounting surface on which a plurality of inorganic light-emitting elements are mounted, and the frame comprises a glass layer made of glass material to which the plurality of display modules are bonded.

[0021] In addition, the frame includes a support layer positioned behind the glass layer in the direction facing the mounting surface and supporting the glass layer, and an adhesive layer positioned between the glass layer and the support layer in the direction facing the mounting surface and arranged to bond the glass layer and the support layer.

[0022] In addition, the coefficient of thermal expansion of the glass layer is provided to be smaller than the coefficient of thermal expansion of the support layer.

[0023] In addition, the support layer includes a metal material.

[0024] In addition, the ductility of the adhesive layer is arranged to be greater than the ductility of the glass layer and the support layer.

[0025] In addition, the adhesive layer comprises a first adhesive layer that is bonded to the glass layer, a second adhesive layer that is bonded to the support layer, and a highly flexible layer having a plurality of bubbles disposed between the first adhesive layer and the second adhesive layer in the direction toward the mounting surface and configured to allow for deformation of thickness in the direction toward the mounting surface. Effects of the invention

[0026] A display device according to an embodiment of the present invention includes a frame having a portion to which the substrates of a plurality of display modules are bonded, the frame having a material identical to that of the substrates of a plurality of display modules. When the substrates undergo thermal expansion due to heat generated in the display device, the portion of the frame to which the plurality of display modules are bonded expands thermally to the same level as the substrates, thereby maintaining the separation between the plurality of display modules at a certain level and preventing the amplification of seams that may occur between the plurality of display modules. Brief explanation of the drawing

[0027] FIG. 1 is a drawing illustrating a display device according to an embodiment of the present invention. FIG. 2 is a diagram showing the main components of the display device of FIG. 1 in disassembly. FIG. 3 is an enlarged cross-sectional view of a part of the configuration of the display module shown in FIG. 1. FIG. 4 is a rear perspective view of one display module of the display device shown in FIG. 1. FIG. 5 is an exploded perspective view of the frame of the display device of FIG. 1. FIG. 6 is an enlarged cross-sectional view of a part of the frame of the display device in FIG. 1. FIG. 7 is an enlarged cross-sectional view of a part of the display device in FIG. 1. Specific details for implementing the invention

[0028] The embodiments described in this specification are merely the most preferred embodiments of the present invention and do not represent all technical concepts of the present invention; therefore, it should be understood that various equivalents or modifications that can replace them at the time of filing this application are also included within the scope of the rights of the present invention.

[0029] Singular expressions used in the description may include plural expressions unless the context clearly indicates otherwise. In the drawings, the shapes and sizes of elements may be exaggerated to provide a clearer description.

[0030] In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not excluding in advance the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0031] Furthermore, in this specification, the meaning of "identical" includes items that are similar in attributes or similar within a certain range. Additionally, "identical" means "substantially identical." It should be understood that "substantially identical" means that numerical values ​​corresponding to a manufacturing error range or differences within a range that do not hold significance relative to a reference value are included within the scope of being "identical."

[0032] Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the attached drawings.

[0033] FIG. 1 is a drawing illustrating a display device according to an embodiment of the present invention, FIG. 2 is a drawing illustrating the main configuration of the display device of FIG. 1 in disassembly, FIG. 3 is an enlarged cross-sectional view of a part configuration of a display module shown in FIG. 1, and FIG. 4 is a rear perspective view of a display module of the display device shown in FIG. 1.

[0034] Some components of the display device (1), including the plurality of inorganic light-emitting elements (50) shown in the drawing, are micro-sized components with a size of several μm to several hundred μm. For convenience of explanation, the scale of some components (multiple inorganic light-emitting elements (50), black matrix (58), etc.) has been exaggerated.

[0035] A display device (1) is a device that displays information, data, etc., in the form of characters, shapes, graphs, images, etc., and can be implemented as a TV, PC, mobile, digital signage, etc.

[0036] According to an embodiment of the present invention, as shown in FIGS. 1 and 2, a display device (1) may include a display panel (20) for displaying images, a power supply unit (not shown) for supplying power to the display panel (20), a main board (25) for controlling the overall operation of the display panel (20), a frame (100) for supporting the display panel (20), and a rear cover (10) for covering the rear of the frame (100).

[0037] The display panel (20) may include a plurality of display modules (30A-30P), a driving board (not shown) for driving each of the display modules (30A-30P), and a TOCN board (Timing controller board) for generating timing signals required for controlling each of the display modules (30A-30P).

[0038] The rear cover (10) can support the display panel (20). The rear cover (10) can be installed on the floor via a stand (not shown) or on the wall via a hanger (not shown), etc.

[0039] Multiple display modules (30A-30P) can be arranged vertically and horizontally so as to be adjacent to each other. Multiple display modules (30A-30P) can be arranged in an M * N matrix form. In this embodiment, 16 multiple display modules (30A-30P) are provided and arranged in a 4 * 4 matrix form, but there are no restrictions on the number or arrangement method of the multiple display modules (30A-30P).

[0040] A plurality of display modules (30A-30P) can be installed on the frame (100). The plurality of display modules (30A-30P) can be installed on the frame (100) through various known methods, such as magnetic force using a magnet, a mechanical fitting structure, or adhesive. A rear cover (10) is attached to the rear of the frame (100), and the rear cover (10) can form the rear exterior of the display device (1).

[0041] The rear cover (10) may include a metal material. Accordingly, heat generated from the plurality of display modules (30A-30P) and the frame (100) can be easily conducted to the rear cover (10), thereby increasing the heat dissipation efficiency of the display device (1).

[0042] As will be described later, the frame (100) and the plurality of display modules (30A-30P) can be bonded by a second adhesive layer (90) provided as an adhesive tape placed at the rear of the plurality of display modules (30A-30P).

[0043] The rear side of a plurality of display modules (30A-30P) can be supported on the frame (100) by the second adhesive layer (90).

[0044] In this way, the display device (1) according to the embodiment of the present invention can realize a large screen by tiling a plurality of display modules (30A-30P).

[0045] Unlike the embodiment of the present invention, each of the plurality of display modules (30A-30P) can be applied to a display device. That is, the display module (30A-30P) can be installed and applied as a single unit to electronic products or battlefields requiring various displays, such as wearable devices, portable devices, handheld devices, and various other displays, and can be applied to display devices such as PC (personal computer) monitors, high-resolution TVs, signage, and electronic displays through a plurality of assembled arrangements in a matrix type, as in the embodiment of the present invention.

[0046] Multiple display modules (30A-30P) may have the same configuration. Therefore, the description of any one display module described below may be applied equally to all other display modules.

[0047] As an example, among the plurality of display modules (30A-30P), the first display module (30A) can be formed in a quadrangle shape. The first display module (30A) can be provided in a rectangular shape or a square shape.

[0048] Accordingly, the first display module (30A) may include edges (31, 32, 33, 34) formed in the up, down, left, and right directions relative to the first direction (X) which is the front.

[0049] As illustrated in FIG. 3, a plurality of display modules (30A-30P) may each include a substrate (40) and a plurality of inorganic light-emitting elements (50) mounted on the substrate (40). The plurality of inorganic light-emitting elements (50) may be mounted on a mounting surface (41) of the substrate (40) facing a first direction (X). In FIG. 3, for convenience of explanation, the thickness of the substrate (40) in the first direction (X) is depicted as exaggeratedly thick.

[0050] The substrate (40) can be formed in a quadrangle shape. As described above, a plurality of display modules (30A-30P) can each be provided in a quadrangle shape, and the substrate (40) can be formed in a quadrangle shape to correspond to this.

[0051] The substrate (40) can be provided in a rectangular (Rectangle type) or square (Square type) shape.

[0052] Accordingly, with the first display module (30A) as an example, the substrate (40) may include four borders corresponding to the borders (31, 32, 33, 34) of the first display module (30A) formed in the up, down, left, and right directions with respect to the first direction (X) which is the front.

[0053] The substrate (40) may include a base substrate (42), a mounting surface (41) forming one side of the base substrate (42), a rear surface (43) forming the other side of the base substrate (42) and positioned opposite to the mounting surface (41), and a side surface (45) positioned between the mounting surface (41) and the rear surface (43).

[0054] The substrate (40) may include a TFT layer (Thin Film Transistor, 44) formed on a base substrate (42) to drive inorganic light-emitting elements (50). The base substrate (42) may include a glass substrate. That is, the substrate (40) may include a COG (Chip on Glass) type substrate. The substrate (40) may have first and second pad electrodes (44a, 44b) formed thereon so that the inorganic light-emitting elements (50) are electrically connected to the TFT layer (44).

[0055] The TFT (Thin Film Transistor) constituting the TFT layer (44) is not limited to a specific structure or type and can be composed of various embodiments. That is, the TFT of the TFT layer (43) according to one embodiment of the present invention can be implemented as an LTPS (Low Temperature Poly Silicon) TFT, oxide TFT, Si (poly silicon, or a-silicon) TFT, as well as an organic TFT, graphene TFT, etc.

[0056] Additionally, the TFT layer (44) can be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type, n-type MOSFET, or p-type MOSFET transistor when the base substrate (42) of the substrate (40) is provided as a silicon wafer.

[0057] A plurality of inorganic light-emitting elements (50) are formed from an inorganic material and may include inorganic light-emitting elements having a width, length, and height of several μm to several tens of μm, respectively. Micro inorganic light-emitting elements may have a short side length of 100 μm or less among the width, length, and height. That is, the inorganic light-emitting elements (50) can be picked up from a wafer formed of sapphire or silicon material and directly transferred onto a substrate (40). The plurality of inorganic light-emitting elements (50) can be picked up and transferred using an electrostatic method using an electrostatic head or a stamp method using an elastic polymer material such as PDMS or silicon as a head.

[0058] A plurality of inorganic light-emitting elements (50) may be light-emitting structures comprising an n-type semiconductor (58a), an active layer (58c), a p-type semiconductor (58b), a first contact electrode (57a), and a second contact electrode (57b).

[0059] Although not shown in the drawing, one of the first contact electrodes (57a) may be electrically connected to the second contact electrode (57b) n-type semiconductor (58a) and the other may be electrically connected to the p-type semiconductor (58b).

[0060] The first contact electrode (57a) and the second contact electrode (57b) may be in the form of a flip chip arranged horizontally and facing the same direction (opposite direction of light emission).

[0061] When mounted on the mounting surface (41), the inorganic light-emitting element (50) has a light-emitting surface (54) positioned toward the first direction (X), a side surface (55), and a bottom surface (56) positioned opposite the light-emitting surface (54), and a first contact electrode (57a) and a second contact electrode (57b) can be formed on the bottom surface (56).

[0062] That is, the contact electrodes (57a, 57b) of the inorganic light-emitting element (50) are positioned on the opposite side of the light-emitting surface (54) and thus can be positioned on the opposite side of the direction in which light is irradiated.

[0063] Contact electrodes (57a, 57b) are arranged to face the mounting surface (41) and are electrically connected to the TFT layer (44), and a light-emitting surface (54) that irradiates light in a direction opposite to the direction in which the contact electrodes (57a, 57b) are arranged may be arranged.

[0064] Therefore, when light generated from the active layer (58c) is irradiated in the first direction (X) through the light-emitting surface (54), the light can be irradiated toward the first direction (X) without interference from the first contact electrode (57a) or the second contact electrode (57b).

[0065] That is, the first direction (X) can be defined as the direction in which the light-emitting surface (54) is positioned to irradiate light.

[0066] The first contact electrode (57a) and the second contact electrode (57b) can be electrically connected to the first pad electrode (44a) and the second pad electrode (44b), respectively, formed on the mounting surface (41) side of the substrate (40).

[0067] As will be described later, the inorganic light-emitting element (50) can be directly connected to the pad electrodes (44a, 44b) through a bonding configuration such as an anisotropic conductive layer (47) or solder.

[0068] An anisotropic conductive layer (47) may be formed on the substrate (40) to mediate electrical connection between contact electrodes (57a, 57b) and pad electrodes (44a, 44b). The anisotropic conductive layer (47) may have a structure in which an anisotropic conductive adhesive is attached to a protective film and conductive balls (47a) are dispersed in an adhesive resin. The conductive balls (47a) are conductive spheres surrounded by a thin insulating film, and can electrically connect conductors to each other as the insulating film breaks under pressure.

[0069] The anisotropic conductive layer (47) may include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

[0070] Accordingly, when a plurality of inorganic light-emitting elements (50) are mounted on a substrate (40), if pressure is applied to the anisotropic conductive layer (47), the insulating film of the conductive ball (47a) is broken so that the contact electrodes (57a, 57b) of the inorganic light-emitting elements (50) and the pad electrodes (44a, 44b) of the substrate (40) can be electrically connected.

[0071] However, although not shown in the drawing, a plurality of inorganic light-emitting elements (50) may be mounted on the substrate (40) via solder (not shown) instead of an anisotropic conductive layer (47). After the inorganic light-emitting elements (50) are aligned on the substrate (40), the inorganic light-emitting elements (50) may be bonded to the substrate (40) through a reflow process.

[0072] A plurality of inorganic light-emitting elements (50) may include a red light-emitting element (51), a green light-emitting element (52), and a blue light-emitting element (53). The light-emitting elements (50) may be mounted on the mounting surface (41) of a substrate (40) by forming a series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53) as a single unit. A series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53) may form a single pixel. At this time, the red light-emitting element (51), green light-emitting element (52), and blue light-emitting element (53) may each form a sub-pixel.

[0073] The red light-emitting element (51), the green light-emitting element (52), and the blue light-emitting element (53) may be arranged in a line at predetermined intervals as in the embodiment of the present invention, or they may be arranged in other shapes such as a triangular shape.

[0074] The substrate (40) may include a light-absorbing layer (44c) to absorb external light and improve contrast. The light-absorbing layer (44c) may be formed on the entire mounting surface (41) of the substrate (40). The light-absorbing layer (44c) may be formed between the TFT layer (44) and the anisotropic conductive layer (47).

[0075] A plurality of display modules (30A-30P) may further include a black matrix (48) formed between a plurality of inorganic light-emitting elements (50).

[0076] The black matrix (48) can perform the function of complementing the light absorption layer (44c) formed entirely on the mounting surface (41) side of the substrate (40). That is, the black matrix (48) can improve the contrast of the screen by absorbing external light and making the substrate (40) appear black.

[0077] The black matrix (48) can preferably have a black color.

[0078] In this embodiment, the black matrix (48) is formed to be placed between pixels formed by a series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53). However, unlike this embodiment, it may be formed more finely to partition each of the light-emitting elements (51, 52, 53) which are subpixels.

[0079] The black matrix (48) can be formed in a grid shape having horizontal and vertical patterns to be placed between pixels.

[0080] The black matrix (48) can be formed by applying a light-absorbing ink onto an anisotropic conductive layer (47) and then curing it through an ink-jet process, or by coating a light-absorbing film onto an anisotropic conductive layer (46).

[0081] That is, in the anisotropic conductive layer (47) formed entirely on the mounting surface (41), a black matrix (48) can be formed between a plurality of inorganic light-emitting elements (50) that are not mounted.

[0082] Each of the plurality of display modules (30A-30P) may include a front cover (49) disposed on the mounting surface (41) in a first direction (X) to cover the mounting surface (41) of each of the plurality of display modules (30A-30P).

[0083] The front cover (49) may be provided in multiple numbers so as to be formed on each of the multiple display modules (30A-30P) in the first direction (X).

[0084] The front cover (49) may include a film (not shown). The front cover (49) may include an adhesive layer (not shown) provided so that the front cover (49) is bonded to the mounting surface (41) of the substrate (40).

[0085] The film (not shown) of the front cover (49) can be provided as a functional film having optical performance.

[0086] The front cover (49) is provided to cover the substrate (40) and can protect the substrate (40) from external forces.

[0087] Typically, the adhesive layer (not shown) of the front cover (49) may be provided to have a height greater than a predetermined height in the first direction (X) toward the mounting surface (41) or the light-emitting surface (54). This is to sufficiently fill the gap that may be formed between the front cover (49) and the plurality of inorganic light-emitting elements (50) when the front cover (49) is placed on the substrate (40).

[0088] Each of the multiple display modules (30A-30P) may include a metal plate (60) provided on the rear surface (43) of the substrate (40) to dissipate heat generated from the substrate (40).

[0089] Additionally, a plurality of display modules (30A-30P) may each include a first adhesive layer (70) disposed between the rear surface (43) and the metal plate (60) to bond the rear surface (43) of the substrate (40) and the metal plate (60).

[0090] A plurality of inorganic light-emitting elements (50) can be electrically connected to a pixel driving wiring (not shown) formed on a mounting surface (41) and an upper surface wiring layer (not shown) formed by the pixel driving wiring (not shown) and extending through the side (45) of the substrate (40).

[0091] An upper wiring layer (not shown) may be formed on the lower side of an anisotropic conductive layer (47). The upper wiring layer (not shown) may be electrically connected to a side wiring (not shown) formed on the side (45) of the substrate (40). The side wiring (not shown) may be provided in the form of a thin film.

[0092] The upper wiring layer (not shown) can be connected to the side wiring (not shown) by an upper connecting pad (not shown) formed on the edge side of the substrate (41).

[0093] Side wiring (not shown) can be extended along the side (45) of the substrate (40) and connected to a rear wiring layer (43b) formed on the rear surface (43).

[0094] An insulating layer (43c) covering the rear wiring layer (43b) can be formed on the rear wiring layer (43b) in the direction in which the rear side of the substrate (40) faces.

[0095] That is, a plurality of inorganic light-emitting elements (50) can be electrically connected sequentially to an upper wiring layer (not shown), a side wiring layer (not shown), and a rear wiring layer (43b).

[0096] Additionally, as illustrated in FIG. 4, the display module (30A) may include a driving circuit board (80) provided to electrically control a plurality of inorganic light-emitting elements (50) mounted on a mounting surface (41). The driving circuit board (80) may be formed as a printed circuit board. The driving circuit board (80) may be placed on the rear surface (43) of the substrate (40) in a first direction (X). Although to be described in detail later, it may be placed on a metal plate (60) that is adhered to the rear surface (43) of the substrate (40).

[0097] The display module (30A) may include a flexible film (81) connecting the driving circuit board (80) and the rear wiring layer (43b) so that the driving circuit board (80) is electrically connected to a plurality of inorganic light-emitting elements (50).

[0098] More specifically, one end of the flexible film (81) can be placed on the rear surface (43) of the substrate (40) and connected to a rear connection pad (43d) that is electrically connected to a plurality of inorganic light-emitting elements (50).

[0099] The rear connection pad (43d) can be electrically connected to the rear wiring layer (43b). Accordingly, the rear connection pad (43a) can electrically connect the rear wiring layer (43b) and the flexible film (81).

[0100] The flexible film (81) can transmit power and a signal from the driving circuit board (80) to a plurality of inorganic light-emitting elements (50) as it is electrically connected to the rear connection pad (43d).

[0101] The flexible film (81) can be formed from an FFC (Flexible Flat cable) or COF (Chip On Film), etc.

[0102] The flexible film (81) may include a first flexible film (81a) and a second flexible film (81b) respectively arranged in the up and down directions with respect to the first direction (X) which is the front.

[0103] The first and second flexible films (81a, 81b) are not limited thereto and may be arranged in the left and right directions with respect to the first direction (X), or arranged in at least two directions respectively in the up, down, left, and right directions.

[0104] The second flexible film (81b) may be provided in multiple numbers. However, it is not limited thereto, and the second flexible film (81b) may be provided as a single unit, and the first flexible film (81a) may also be provided in multiple numbers.

[0105] The first flexible film (81a) can transmit a data signal from the driving circuit board (80) to the board (40). The first flexible film (81a) can be provided as a COF.

[0106] The second flexible film (81b) can transmit power from the driving circuit board (80) to the board (40). The second flexible film (81b) can be made of FFC.

[0107] However, not limited to this, the first and second flexible films (81a, 81b) may be formed opposite to each other.

[0108] The driving circuit board (80) may be electrically connected to the main board (25, see FIG. 2), although not shown in the drawing. The main board (25) may be placed on the rear side of the frame (100), and the main board (25) may be connected to the driving circuit board (80) via a cable (not shown) at the rear of the frame (100).

[0109] As described above, the metal plate (60) can be arranged to be in contact with the substrate (40). The metal plate (60) and the substrate (40) can be bonded by an adhesive tape (70) placed between the rear surface (43) of the substrate (40) and the metal plate (60).

[0110] The metal plate (60) can be formed from a metal material with high thermal conductivity. For example, the metal plate (60) can be made of aluminum.

[0111] Heat generated from a plurality of inorganic light-emitting elements (50) and a TFT layer (44) mounted on a substrate (40) can be transferred to a metal plate (60) through a first adhesive layer (70) along the back surface (43) of the substrate (40).

[0112] Accordingly, heat generated from the substrate (40) is easily transferred to the metal plate (60), and the substrate (40) can be prevented from rising above a certain temperature.

[0113] Multiple display modules (30A-30P) can be arranged in various positions in the form of an M * N matrix. Each display module (30A-30P) is provided to be movable individually. At this time, each display module (30A-30P) individually includes a metal plate (60) so that a certain level of heat dissipation performance can be maintained regardless of where each display module (30A-30P) is placed.

[0114] Multiple display modules (30A-30P) can form screens of various sizes of the display device (1) in the form of various M * N matrices. Accordingly, rather than heat dissipation through a single metal plate provided for heat dissipation, as in one embodiment of the present invention, each display module (30A-30P) includes an independent metal plate (60) so that each display module (30A-30P) dissipates heat individually, which can improve the heat dissipation performance of the entire display device (1).

[0115] When a single metal plate is placed inside the display device (1), a portion of the metal plate may not be placed at a position corresponding to where a display module is placed based on the front-rear direction, and a metal plate may be placed at a position where a display module is not placed, so the heat dissipation efficiency of the display device (1) may be reduced.

[0116] That is, through the metal plate (60) placed on each display module (30A-30P), all display modules (30A-30P) can self-dissipate heat through each metal plate (60) regardless of where each display module (30A-30P) is placed, thereby improving the heat dissipation performance of the entire display device (1).

[0117] The metal plate (60) can be provided in a rectangular shape that corresponds approximately to the shape of the substrate (40).

[0118] The area of ​​the substrate (40) may be at least equal to or larger than the area of ​​the metal plate (60). When the substrate (40) and the metal plate (60) are arranged side by side in the first direction (X), the four edges of the rectangular substrate (40) may be formed to correspond to the four edges of the metal plate (60) based on the center of the substrate (40) and the metal plate (60), or may be arranged to be positioned further outward from the center of the substrate (40) and the metal plate (60) than the four edges of the metal plate (60).

[0119] Preferably, the four edges of the substrate (40) may be arranged to be positioned further outward than the four edges of the metal plate (60). That is, the area of ​​the substrate (40) may be arranged to be larger than the area of ​​the metal plate (60).

[0120] As will be described later, when heat is transferred to each display module (30A-30P), the substrate (40) and the metal plate (60) may undergo thermal expansion. Since the metal plate (60) has a higher thermal expansion rate than the substrate (40), the expansion of the metal plate (60) is higher than the expansion of the substrate (40).

[0121] At this time, when the four edges of the substrate (40) correspond to the four edges of the metal plate (60) or are positioned further inward, the edges of the metal plate (60) may protrude outward from the substrate (40).

[0122] Accordingly, the spacing length of the gap formed between each display module (30A-30P) may be irregularly formed due to the thermal expansion of the metal plate (60) of each module (30A-30P), and as a result, the visibility of some parts may increase, and the sense of unity of the screen of the display panel (20) may be reduced.

[0123] However, when the four edges of the substrate (40) are arranged to be positioned further outward than the four edges of the metal plate (60), even if the substrate (40) and the metal plate (60) undergo thermal expansion, the metal plate (60) does not protrude outward from the four edges of the substrate (40), and accordingly, the spacing length of the gap formed between each display module (30A-30P) can be maintained at a constant level.

[0124] Additionally, in order to maintain a constant spacing of the gap formed between each display module (30A-30P), the frame (100) supporting each display module (30A-30P) may include a first frame layer (110) having material properties similar to those of the substrate (40). This will be described in detail later.

[0125] According to one embodiment of the present invention, the area of ​​the substrate (40) and the area of ​​the metal plate (60) can be arranged to correspond approximately. Accordingly, heat generated from the substrate (40) can be uniformly dissipated over the entire area of ​​the substrate (40) without being isolated in some areas.

[0126] The metal plate (60) can be arranged to be adhered to the back surface (43) of the substrate (40) by the first adhesive layer (70).

[0127] The first adhesive layer (70) can be provided with a size corresponding to that of the metal plate (60). That is, the area of ​​the first adhesive layer (70) can be provided to correspond to the area of ​​the metal plate (60). The metal plate (60) can be provided in a roughly rectangular shape, and the first adhesive layer (70) can be provided in a rectangular shape to correspond thereto.

[0128] Based on the center of the metal plate (60) and the first adhesive layer (70), the edges of the rectangular metal plate (60) and the edges of the first adhesive layer (70) can be formed to correspond.

[0129] Accordingly, the metal plate (60) and the first adhesive layer (70) can be easily manufactured as a single combined configuration, thereby increasing the manufacturing efficiency of the entire display device (1).

[0130] That is, when the metal plate (60) is cut into a unit number from one plate, the first adhesive layer (70) is pre-adhered to one plate before the metal plate (60) is cut, and the first adhesive layer (70) and the metal plate (60) are cut into a unit number simultaneously, so that the process can be reduced.

[0131] Heat generated from the substrate (40) can be transferred to the metal plate (60) through the first adhesive layer (70). Accordingly, the first adhesive layer (70) can be configured to attach the metal plate (60) to the substrate (40) and at the same time transfer the heat generated from the substrate (40) to the metal plate (60).

[0132] Accordingly, the first adhesive layer (70) may include a material with high heat dissipation performance.

[0133] Basically, the first adhesive layer (70) may include an adhesive material to bond the substrate (40) and the metal plate (60).

[0134] Additionally, the first adhesive layer (70) may include a material with higher heat dissipation performance than a material with general adhesive properties. Accordingly, heat can be efficiently transferred between the substrate (40) and the metal plate (60) to each component.

[0135] In addition, the adhesive material of the first adhesive layer (70) can be formed from a material with higher heat dissipation performance than the adhesive material constituting a general adhesive.

[0136] Materials with high heat dissipation performance refer to materials that have high thermal conductivity, high heat transfer, and low specific heat, enabling effective heat transfer.

[0137] For example, the first adhesive layer (70) may include a graphite material. However, it is not limited thereto, and the first adhesive layer (70) may generally be made of a material with high heat dissipation performance.

[0138] The ductility of the adhesive layer (70) can be provided to be greater than the ductility of the substrate (40) and the ductility of the metal plate (60). Accordingly, the first adhesive layer (70) can be provided with a material having adhesiveness and heat dissipation properties while having high ductility. The first adhesive layer (70) can be formed with a double-sided tape without a substrate. As described above, since the first adhesive layer (70) is formed with a tape without a substrate, it can be formed as a single layer without a substrate supporting the one side and the other side between the one side that is adhered to the substrate (40) and the other side that is adhered to the metal plate (60).

[0139] Since the first adhesive layer (70) does not contain a substrate, it does not contain a material that hinders heat conduction, and thus the heat dissipation performance can be improved. However, the first adhesive layer (70) is not limited to a substrate-free double-sided tape and can be provided as a heat dissipation tape with better heat dissipation performance than a general double-sided tape.

[0140] As described above, the substrate (40) is made of glass and the metal plate (60) is made of metal. Since the material properties of each component are different, the degree to which the materials deform under the same heat may differ. That is, when heat is generated in the substrate (40), the substrate (40) and the metal plate (60) may each expand by different sizes due to the heat. Consequently, a problem may occur in which the display module (30A) is damaged.

[0141] This is because, while the substrate (40) and the metal plate (60) are fixed to each other, the substrate (40) and the metal plate (60) have different expansion values ​​at the same temperature, so the substrate (40) and the metal plate (60) expand to different sizes, and stress may be generated in each component.

[0142] In particular, among the material properties, the coefficient of thermal expansion of each material is different, so the degree to which the material is physically deformed by heat varies. In particular, since the coefficient of thermal expansion of metal material is generally greater than that of glass, when the same amount of heat is transferred to the substrate (40) and the metal plate (60), the metal plate (60) may expand and deform more than the substrate (40).

[0143] Conversely, even when heat generation in the substrate (40) ends and the substrate (40) and the metal plate (60) are cooled respectively, the metal plate (60) may shrink and deform more than the substrate (40).

[0144] Since the substrate (40) and the metal plate (60) are bonded to each other by the first adhesive layer (70), an external force can be transmitted to the substrate (40) when the metal plate (60) is deformed more than the substrate (40).

[0145] Conversely, an external force may be transmitted to the metal plate (60) by the substrate (40), but the substrate (40) may be damaged because the rigidity of the glass substrate (40) is lower than the rigidity of the metal plate (60).

[0146] The first adhesive layer (70) can be provided to absorb external forces transmitted from different configurations as the substrate (40) and the metal plate (60) expand to different sizes between the substrate (40) and the metal plate (60).

[0147] Accordingly, external force is transmitted to the substrate (40) and the metal plate (60), and in particular, the substrate (40) can be prevented from being damaged.

[0148] The first adhesive layer (70) may be made of a highly ductile material to absorb external forces transmitted from the substrate (40) and the metal plate (60). Specifically, the ductility of the first adhesive layer (70) may be greater than that of the substrate (40) and the metal plate (60).

[0149] Accordingly, when an external force generated from the size change of the substrate (40) and the metal plate (60) is transmitted to the first adhesive layer (70), the first adhesive layer (70) itself is deformed, thereby preventing the external force from being transmitted to different configurations.

[0150] The first adhesive layer (70) may have a predetermined thickness in the first direction (X). When heat is transferred to the metal plate (60) and it expands or contracts due to cooling, the metal plate (60) may expand or contract not only in the first direction (X) but also in a direction orthogonal to the first direction (X), and accordingly, an external force may be transferred to the substrate (40).

[0151] Even if the metal plate (60) expands or contracts in a direction orthogonal to the first direction (X), the thickness of the first adhesive layer (70) changes, and the transmission of external force to the substrate (40) can be prevented. Additionally, the thermal expansion coefficient of the first adhesive layer (70) can be provided differently from the thermal expansion coefficient of the substrate (40) and the thermal expansion coefficient of the metal plate (60).

[0152] Preferably, the thermal expansion coefficient of the first adhesive layer (70) can be provided to be greater than the thermal expansion coefficient of the substrate (40) and smaller than the thermal expansion coefficient of the metal plate (60).

[0153] Accordingly, at the same temperature, it is not deformed in the same way as either the substrate (40) or the metal plate (60), and can buffer the deformation of each configuration between the substrate (40) and the metal plate (60).

[0154] Therefore, the first adhesive layer (70) is placed between the substrate (40) and the metal plate (60) and can easily absorb external forces generated by the difference in thermal expansion rates between the substrate (40) and the metal plate (60) through deformation.

[0155] The thickness (t1) of the substrate (40) can preferably be formed to be at least twice as thick as the thickness (t2) of the metal plate (60). (Refer to FIG. 3)

[0156] As described above, since the rigidity of the metal plate (60) is higher than that of the substrate (40), this is intended to reduce the external force that can be transmitted to the substrate (40) when temporary warping occurs in the display module (30A) due to thermal expansion.

[0157] In addition, the substrate (40) is formed of glass material and the metal plate (60) is formed of metal material, and the degree of flatness of the glass plate completed through manufacturing can be made more uniform than the degree of flatness of the metal plate.

[0158] Accordingly, the substrate (40) and the metal plate (60) may differ slightly in the degree of flatness. Since the substrate (40) and the metal plate (60) are contact-bonded as described above, stress may be generated in each component depending on the degree of flatness.

[0159] In particular, because the rigidity of the substrate (40) is low, the substrate (40) may be damaged, and in order to reduce the external force transmitted to the substrate (40), the thickness (t1) of the substrate (40) may preferably be formed to be at least twice as thick as the thickness (t2) of the metal plate (60).

[0160] However, this is a desirable value, and the thickness (t2) of the metal plate (60) may be made thicker than half the thickness (t1) of the substrate (40).

[0161] The thickness (t3) of the first adhesive layer (70) can be provided to be greater than the minimum length at which the first adhesive layer (70) can be maintained without additional external force being applied to the substrate (40) when the first adhesive layer (70) is deformed by the thermal expansion of the metal plate (60) and the substrate (40).

[0162] The display module (30A) may include a second adhesive layer (90) provided to allow the frame (100) and the display module (30A) to be combined.

[0163] A second adhesive layer (90) may be placed on the back surface of the metal plate (60) so that the metal plate (60) is adhered to the frame (100).

[0164] As described above, the metal plate (60) is formed to have a size corresponding to that of the substrate (40) and is arranged to cover the entire rear surface (43) of the substrate (40), and the second adhesive layer (90) can be placed on the rear surface of the metal plate (60).

[0165] However, the second adhesive layer (90) is not limited thereto and may be arranged to be placed on the rear surface (43) of the substrate (40). At this time, the substrate (40) may be directly attached to the frame (100) through the second adhesive layer (90).

[0166] Unlike one embodiment of the present invention, the metal plate (60) may be provided to cover only a portion of the rear surface (43) of the substrate (40), and a second adhesive layer (90) may be provided to be adhered to an area on the rear surface (43) of the substrate (40) that is not covered by the metal plate (60).

[0167] Accordingly, display modules (30A-30P) can be directly bonded to the front surface of the first frame layer (110) forming the front surface of the frame (100) by the second bonding layer (90). That is, display modules (30A-30P) having a substrate (40) formed of glass material can be directly bonded to the first frame layer (110) formed of glass material through the second bonding layer (90), thereby minimizing the gap between the display modules (30A-30P) that may additionally occur due to thermal expansion. This will be described in detail later.

[0168] Below, a frame (100) according to one embodiment of the present invention will be described in detail.

[0169] FIG. 5 is an exploded perspective view of the frame of the display device of FIG. 1, FIG. 6 is an enlarged cross-sectional view of a part of the frame of the display device of FIG. 1, and FIG. 7 is an enlarged cross-sectional view of a part of the display device of FIG. 1.

[0170] As described above, the display panel (20) can display an image using a plurality of display modules (30A-30P). At this time, the integrity of the image may be reduced by a seam formed by the gap between the plurality of display modules (30A-30P).

[0171] Accordingly, to minimize the perception of the depth of the display panel (20), a plurality of display modules (30A-30P) may be arranged on the frame (100) to form a certain gap. This is because if the gap formed by the plurality of display modules (30A-30P) is not uniform, the perception of the depth caused by some gaps may be amplified.

[0172] In addition, a general cover (49) may be provided to absorb light irradiated or reflected through the gaps between multiple display modules (30A-30P) in order to minimize the perception of the display panel (20).

[0173] In the case of conventional display devices, the frame supporting the display panel is made of metal. Multiple display modules can be tiled on the metal frame.

[0174] As the display device is operated, the substrate forming the plurality of display modules (30A-30P) may undergo thermal expansion due to heat generated from the display panel. As described above, the plurality of display modules (30A-30P) are supported by a metal frame, and due to the thermal expansion of the substrate and the thermal expansion of the frame, gaps between the plurality of display modules (30A-30P) may be irregularly formed, which may cause a problem in which the perception of the depth is amplified.

[0175] That is, the substrates of the multiple display modules (30A-30P) are all made of glass material so that each substrate can undergo thermal expansion to a certain degree, but due to the thermal expansion of the metal frame supporting each substrate, the width of some of the gaps between the multiple display modules (30A-30P) may be formed irregularly. This is because the physical properties of the metal material and the physical properties of the glass material are different.

[0176] The material properties of the material may differ depending on the coefficient of thermal expansion, specific heat, thermal conductivity, etc. In particular, the degree of thermal expansion of the substrate and the frame may differ due to the difference between the coefficient of thermal expansion of the metal material and the coefficient of thermal expansion of the glass.

[0177] In addition to the thermal expansion of the substrates of the plurality of display modules (30A-30P), the frame itself to which the plurality of display modules (30A-30P) are bonded expands thermally, so the spacing between the plurality of display modules (30A-30P) may change irregularly.

[0178] In order to prevent irregular gaps between the multiple display modules (30A-30P) due to thermal expansion as the multiple display modules (30A-30P) are arrayed on a metal frame as described above, the frame (100) of the display device (1) according to one embodiment of the present invention may include a first frame layer (110) to which the multiple display modules (30A-30P) are bonded and which is formed with material properties similar to the material properties of the substrate (40) of the multiple display modules (30A-30P).

[0179] The first frame layer (110) can be positioned in front of the frame (100) in the first direction (X) toward which the actual surface (41) faces.

[0180] Multiple display modules (30A-30P) may be arranged to be attached to the first frame layer (110) of the frame (100).

[0181] The meaning that it is formed with material properties similar to the material properties of the substrate (40) described above may include the meaning that the coefficient of thermal expansion, specific heat, and thermal conductivity of the substrate (40) are similar. In particular, according to one embodiment of the present invention, it can be interpreted to mean that the coefficient of thermal expansion of the substrate (40) corresponds to the coefficient of thermal expansion of the first frame layer (110).

[0182] More specifically, the substrate (40) and the first frame layer (110) may be arranged to expand to corresponding lengths when the same heat is transferred to the substrate (40) and the first frame layer (110) in a second direction (Y) or a third direction (Z) that is orthogonal to the first direction (X).

[0183] The first frame layer (110) may be provided with a material having a thermal expansion coefficient value similar to that of the substrate (40). Preferably, the thermal expansion coefficient of the first frame layer (110) and the thermal expansion coefficient of the substrate (40) may each be formed with a material having the same value.

[0184] The first frame layer (110) and the substrate (40) can each be formed of glass material. Accordingly, the coefficients of thermal expansion of the substrate (40) and the first frame layer (110) can each be provided to be the same.

[0185] The first frame layer (110) is formed from glass material and can be named the glass layer (110), but below it will be named the first frame layer (110).

[0186] Accordingly, when the substrate (40) of a plurality of display modules (30A-30P) undergoes thermal expansion due to heat generated during operation of the display device (1), the first frame layer (110) can undergo thermal expansion to the same value as the substrate (40).

[0187] As the first frame layer (110), which is the base surface to which the plurality of display modules (30A-30P) are bonded, is thermally expanded by the same amount as the substrate (40) of the plurality of display modules (30A-30P), the spacing of the gap formed between the plurality of display modules (30A-30P) can be maintained equally.

[0188] Accordingly, the gap formed between the multiple display modules (30A-30P) can maintain a gap spacing distance identical to the state in which the substrate (40) is not thermally expanded, thereby maintaining a certain level of seam and maintaining the integrity of the screen of the display panel (20).

[0189] Therefore, even if heat generated by the operation of the display device (1) is supplied to the substrate (40) of the plurality of display modules (30A-30P), the gap distance between the plurality of display modules (30A-30P) is maintained at a constant, thereby preventing the phenomenon in which some of the cores are amplified and the integrity of the screen is reduced.

[0190] As illustrated in FIG. 5, the frame (100) may include a first frame layer (110) made of a glass material having a thermal expansion coefficient equal to that of a substrate (40) and in contact with a plurality of display modules (30A-30P); a second frame layer (130) positioned behind the first frame layer (110) in the direction facing the mounting surface (41) and supporting the first frame layer (110); and a third frame layer (120) positioned between the first frame layer (110) and the second frame layer (130) in the direction facing the mounting surface (41) and arranged to bond the first frame layer (110) and the second frame layer (130).

[0191] The third frame layer (120) may be named an adhesive layer. However, to prevent confusion in naming with the first adhesive layer (70) and the second adhesive layer (90) described above, it may be named the 'third adhesive layer'. However, below it will be named the third frame layer (120).

[0192] Also, the second frame layer (130) may be named the support layer (130). However, below it will be named the second frame layer (130).

[0193] The frame (100) is configured to support the display panel (20) and may be configured to have a rigidity greater than a predetermined size. At this time, since it is difficult to secure a certain level of rigidity when the frame (100) is formed only with the first frame layer (110) described above, it may additionally include a second frame layer (130) that supports the first frame layer (110).

[0194] The second frame layer (130) may include a metal material to ensure rigidity.

[0195] The second frame layer (130) may be formed only of a metal material, but may be formed of a combination of a metal plate formed of a metal material and a foam member bonded to the metal plate.

[0196] To ensure the rigidity of the frame (100), the thickness of the first frame layer (110) in the direction facing the mounting surface may be thinner than the thickness of the second frame layer (130). This is because the first frame layer (110) is configured to maintain the spacing between the plurality of display modules (30A-30P), and the second frame layer (130) is configured to support the plurality of display modules (30A-30P), so greater rigidity must be ensured.

[0197] The frame (100) can secure the rigidity of the first frame layer (110), which is formed of a glass material with low rigidity, by the second frame layer (130), thereby stably supporting the display panel (20).

[0198] The second frame layer (130) may be formed thicker than the first frame layer (110) in the direction facing the mounting surface (41) to ensure a certain level of rigidity.

[0199] Each layer (110, 120, 130) can be arranged sequentially in the order of the first frame layer (110), the third frame layer (120), and the second frame layer (130) based on the direction in which the actual surface (41) faces.

[0200] The coefficient of thermal expansion of the first frame layer (110) can be made smaller than the coefficient of thermal expansion of the second frame layer (130). This is because, as described above, the first frame layer (110) is formed of a material corresponding to the substrate (40), and the second frame layer (130) includes a metal material to support the first frame layer (110).

[0201] Generally, the substrate of the display module is formed of glass material, and since the first frame layer (110) is provided with glass material and the second frame layer (130) includes metal material to ensure rigidity, the first frame layer (110) can be provided to have a lower coefficient of thermal expansion than the second frame layer (130).

[0202] Since the first frame layer (110) and the second frame layer (130) are bonded to each other by the third frame layer (120), an external force can be transmitted to the first frame layer (110) when the second frame layer (130) is deformed more than the first frame layer (110). This is because when heat is supplied to the frame (100), the second frame layer (130), which contains a metal material, expands more than the first frame layer (110), which is formed of a glass material.

[0203] Conversely, an external force may be transmitted to the second frame layer (130) by the first frame layer (110), but the first frame layer (110) may be damaged because the rigidity of the first frame layer (110) made of glass material is lower than the rigidity of the second frame layer (130) made of metal material.

[0204] The third frame layer (120) may be provided to absorb external forces transmitted from different configurations as the first frame layer (110) and the second frame layer (130) expand to different sizes between the first frame layer (110) and the second frame layer (130).

[0205] Accordingly, external force is transmitted to the first frame layer (110) and the second frame layer (130), and in particular, damage to the first frame layer (110) can be prevented.

[0206] The third frame layer (120) may be made of a material with high ductility. Specifically, the ductility of the third frame layer (120) may be greater than that of the first frame layer (110) and the second frame layer (130).

[0207] This is to prevent external forces generated by changes in size due to thermal expansion of the first frame layer (110) and the second frame layer (130) from being transmitted to the first frame layer (110) and the second frame layer (130), respectively.

[0208] That is, the external force generated by the first frame layer (110) and the second frame layer (130) is transmitted to each configuration through the third frame layer (120) placed between the first frame layer (110) and the second frame layer (130).

[0209] As described above, the flexibility of the third frame layer (120) is formed to be greater than the flexibility of the first frame layer (110) and the second frame layer (130). Accordingly, the third frame layer (120) itself is deformed by the external force transmitted to the third frame layer (120), and due to the deformation of the third frame layer (120), the external force transmitted to the third frame layer (120) is not transmitted to the first frame layer (110) and the second frame layer (130), respectively.

[0210] The third frame layer (120) may have a predetermined thickness (t6) in the first direction (X). (See FIG. 7) When heat is transferred to the second frame layer (130) and it expands or contracts due to cooling, the metal plate (60) of the second frame layer (130) may expand or contract not only in the first direction (X) but also in a direction orthogonal to the first direction (X), and accordingly, an external force may be transferred to the substrate (40).

[0211] Even if the second frame layer (130) expands or contracts in a direction orthogonal to the first direction (X), the third frame layer (120) has a predetermined thickness (t6) in the first direction (X), so the thickness (t6) of the third adhesive layer (130) changes in the first direction (X), and the transmission of external force to the first frame layer (110) can be prevented.

[0212] In addition, even if the second frame layer (130) undergoes thermal expansion and warping occurs, causing a portion of the second frame layer (130) to expand in the first direction (X), the third frame layer (120) has a predetermined thickness (t6) in the first direction (X), so the thickness (t6) of the third adhesive layer (130) changes in the first direction (X), thereby counteracting the warping of the second frame layer (130) and preventing external force from being transmitted to the first frame layer (110).

[0213] Additionally, the thermal expansion coefficient of the third frame layer (120) may be different from the thermal expansion coefficient of the first frame layer (110) and the thermal expansion coefficient of the second frame layer (130).

[0214] Therefore, the third frame layer (120) is positioned between the first frame layer (110) and the second frame layer (130) and can easily absorb external forces generated by the difference in thermal expansion rates between the first frame layer (110) and the second frame layer (130) through deformation.

[0215] More specifically, as illustrated in FIG. 6, the third frame layer (120) may include a first adhesive layer (121) that is bonded to the first frame layer (110), a second adhesive layer (122) that is bonded to the second frame layer (130), and a highly flexible layer (123) that is disposed between the first adhesive layer (121) and the second adhesive layer (122) in the direction toward the mounting surface (41) and is configured to allow for deformation of thickness in the direction toward the mounting surface (41).

[0216] The first and second adhesive layers (121, 122) can each be made of the same material and configured to bond the first frame layer (110) and the second frame layer (130).

[0217] The highly flexible layer (123) can be made of polyurethane.

[0218] The highly flexible layer (123) may be provided as a foam layer containing a plurality of bubbles (124). The highly flexible layer (123) may be provided to have great flexibility due to the plurality of bubbles (124) inside.

[0219] The highly flexible layer (123) can be easily deformed by a plurality of internal bubbles (124) in a direction in which the mounting surface (41) faces or in a direction orthogonal to the direction in which the mounting surface (41) faces. This is because a void space is formed inside the highly flexible layer (123) by the plurality of bubbles (124), making flow through the void space easy.

[0220] Accordingly, when heat is supplied to the frame (100), the first frame layer (110) and the second frame layer (130) undergo thermal expansion at different values ​​due to thermal expansion, and when the external force generated from the resulting size change is transmitted to the third frame layer (120), the third frame layer (120) itself is easily deformed by the high-ductility layer (123), thereby preventing the external force from being transmitted to different configurations.

[0221] Therefore, even if the first frame layer (110) and the second frame layer (130) have different coefficients of thermal expansion, heat is supplied to the frame (100) by the third frame layer (120), and the first frame layer (110), which has weaker rigidity than the second frame layer (130), can be prevented from being damaged.

[0222] The third adhesive layer (130) may be provided as a double-sided adhesive tape having the aforementioned plurality of layers (121, 122, 123).

[0223] As shown in FIG. 7, the second frame layer (130) may be formed of a metal layer (131) formed of a metal material and a foamed resin layer (132) formed of a foamed resin.

[0224] As described above, the second frame layer (130) may be formed as a single metal plate, but the support layer (1310) may include the metal layer (131) and the foamed resin layer (132) when a certain level of rigidity is maintained by a combination of a metal layer (131) having a predetermined thickness and a foamed resin layer (123).

[0225] When the second frame layer (130) includes a foamed resin layer (132), the amount of metal material used in forming the second frame layer (130) is reduced, and accordingly, the weight of the second frame layer (130) itself is reduced, and the production cost of the second frame layer (130) can be reduced.

[0226] As described above, the thickness (t1) of the substrate (40), specifically the base substrate (42), can be approximately twice as thick as the thickness (t2) of the metal plate (60).

[0227] In addition, the thickness (t3) of the first adhesive layer (70) may be provided to be greater than the minimum length at which the first adhesive layer (70) can be maintained without additional external force being applied to the substrate (40) when the first adhesive layer (70) is deformed due to thermal expansion of the metal plate (60) and the substrate (40).

[0228] The thickness (t4) of the second adhesive layer (90) that bonds the display module (30A) and the frame (100) can be greater than the minimum thickness at which the bond between the display module (30A) and the frame (100) is maintained.

[0229] The thickness (t7) of the second frame layer (130) may be made thicker than the thickness (t5) of the first frame layer (110) and the thickness (t6) of the third adhesive layer (120). This is to ensure the rigidity of the second frame layer (130).

[0230] When a number of display modules greater than the plurality of display modules (30A-30P) of one embodiment of the present invention is supported by the frame (100), the thickness (t7) of the second frame layer (130) and the thickness (t5) of the first frame layer (110) may be made thicker.

[0231] In addition, the area of ​​the second frame layer (130) and the glass layer (110) can be formed wide enough to correspond to the area of ​​a larger number of display modules than the number of display modules (30A-30P).

[0232] This is because when a number of display modules greater than the number of display modules (30A-30P) are supported by the frame (100), the weight of the display panel (20) increases, requiring additional rigidity of the frame (100).

[0233] That is, as the screen size of the display panel (20) increases, the thickness (t7) of the second frame layer (130) and the thickness (t5) of the first frame layer (110) can be made thicker.

[0234] The thickness (t6) of the third frame layer (120) can be provided to be greater than the minimum length at which the third frame layer (120) can be maintained without additional external force being applied to the first frame layer (110) when the third frame layer (120) is deformed by the thermal expansion of the first frame layer (110) and the second frame layer (130).

[0235] The thickness (t6) of the third frame layer (120) can be formed to various lengths depending on the materials of the first and second adhesive layers (121, 122) and the high flexibility layer (123). That is, according to one embodiment of the present invention, the thickness (t6) of the third frame layer (120) is formed to be approximately corresponding to or thinner than the thickness (t5) of the first frame layer (110), but is not limited thereto and can be provided to a length less than or equal to half the thickness (t5) of the first frame layer (110) depending on the materials of the first and second adhesive layers (121, 122) and the high flexibility layer (123).

[0236] Although the technical concept of the present invention has been explained above through specific embodiments, the scope of the present invention is not limited to these embodiments. Various embodiments that can be modified or varied by those skilled in the art within the scope that does not deviate from the gist of the technical concept of the present invention as specified in the claims shall also be considered to fall within the scope of the present invention. Explanation of the symbols

[0237] 1 : Display device 10 : Rear cover 20: Display panel 30, 30A - 30P: Display module 40 : Substrate 41 : Mounting surface 42 : Base board 43 : Rear 44: TFT layer 50, 51, 52, 53: Inorganic light-emitting diode 60: Metal plate 70: First adhesive layer 80: Driving circuit board 90: Second adhesive layer 100 : Frame 110 : 1st Frame Layer 120: 3rd frame layer 121: Adhesive layer 122 : Highly flexible layer 130 : Second frame layer

Claims

Claim 1 A display device comprising: a plurality of display modules; a frame supporting the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form; wherein each of the plurality of display modules includes a substrate having a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite to the mounting surface; and wherein the frame includes a first frame layer provided with a material having the same material property as the material property of the substrate and in contact with the plurality of display modules; a second frame layer disposed behind the first frame layer in the direction in which the mounting surface faces and having a metal material; and a third frame layer disposed between the first frame layer and the second frame layer in the direction in which the mounting surface faces and provided to bond the first frame layer and the second frame layer. Claim 2 A display device according to claim 1, wherein the substrate and the first frame layer are each made of the same material. Claim 3 A display device according to claim 1, wherein the flexibility of the third frame layer is greater than the flexibility of the first frame layer and the second frame layer. Claim 4 A display device according to paragraph 3, wherein the thermal expansion coefficient of the first frame layer is smaller than the thermal expansion coefficient of the second frame layer. Claim 5 A display device according to claim 1, wherein the third frame layer comprises a first adhesive layer bonded to the first frame layer, a second adhesive layer bonded to the second frame layer, and a highly flexible layer disposed between the first adhesive layer and the second adhesive layer in the direction toward the mounting surface and configured to allow deformation of thickness in the direction toward the mounting surface. Claim 6 A display device according to claim 1, wherein the thickness of the first frame layer in the direction in which the mounting surface faces is thinner than the thickness of the second frame layer in the direction in which the mounting surface faces. Claim 7 A display device according to claim 1, wherein each of the plurality of display modules dissipates heat generated from the substrate and further comprises a metal plate facing the rear surface of the substrate and an adhesive member provided to allow each of the plurality of display modules to be adhered to the first frame layer. Claim 8 A display device according to claim 7, wherein each of the plurality of display modules further comprises an adhesive layer disposed between the rear surface of the substrate and the metal plate to bond the rear surface of the substrate and the metal plate, and wherein the ductility of the adhesive layer is greater than the ductility of the substrate and the metal plate. Claim 9 In claim 7, the adhesive member is a display device disposed on the metal plate so that the metal plate is adhered to the first frame layer. Claim 10 In claim 7, the adhesive member is a display device disposed on the rear surface of the substrate so that the substrate is adhered to the first frame layer. Claim 11 A display device comprising: a plurality of display modules; a frame supporting the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form; wherein each of the plurality of display modules includes a substrate made of glass material having a mounting surface on which a plurality of inorganic light-emitting elements are mounted; the frame includes a glass layer made of glass material to which the plurality of display modules are bonded; a support layer disposed behind the glass layer in the direction in which the mounting surface faces and supporting the glass layer; and an adhesive layer disposed between the glass layer and the support layer in the direction in which the mounting surface faces and provided to bond the glass layer and the support layer; wherein the adhesive layer includes a first adhesive layer bonded to the glass layer and a second adhesive layer bonded to the support layer, and a highly flexible layer disposed between the first adhesive layer and the second adhesive layer in the direction in which the mounting surface faces and having a plurality of bubbles so as to enable deformation of thickness in the direction in which the mounting surface faces. Claim 12 delete Claim 13 A display device according to claim 11, wherein the coefficient of thermal expansion of the glass layer is smaller than the coefficient of thermal expansion of the support layer. Claim 14 In paragraph 13, the support layer comprises a metal material and is a display device. Claim 15 A display device according to claim 11, wherein the ductility of the adhesive layer is greater than the ductility of the glass layer and the support layer. Claim 16 delete

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