A type of semiconductor equipment and shaft control method

Abstract

The present invention provides a semiconductor equipment and a method for adjusting an axis. The semiconductor equipment comprises a bottom sheet plate for loading wafers; an axis connected to the base; and a measuring member installed at the end of the axis to measure an external force received when the axis is deviated relative to a centerline. The semiconductor equipment provided by the present invention is equipped with a measuring member, and the measuring member is capable of measuring an external force received when the axis is deviated relative to a centerline, thereby providing convenience when adjusting the position of the axis.

Description

Technology Field

[0001] The present invention relates to the field of semiconductor equipment technology, and in particular to a measuring member for an axis of a type of semiconductor equipment. Background Technology

[0002] In the semiconductor field, the results of the semiconductor process and the state of the process airflow field within the semiconductor equipment process chamber are closely related. Taking the epitaxial process as an example, when a wafer is placed on a base inside an epitaxial chamber, process gases related to the desired epitaxial layer are introduced into the chamber, and the corresponding epitaxial layer grows on the wafer surface under a constant temperature and pressure environment. To improve wafer quality and utilization, it is required that the epitaxial layer growing on the wafer surface achieve maximum uniformity. The most significant manifestation of this uniformity issue is the appearance of irregular eccentricity in the thickness of the epitaxial layer on the wafer surface. This eccentricity is caused by the centering of the chamber and the axis connected to the bait plate. Consequently, during the rotation process, the gap between the base and the preheating ring installed surrounding the base changes randomly, causing instability in the process gas flow field and further affecting the uniformity of film formation.

[0003] Therefore, in the prior art, a person skilled in the art adjusts the device to move the axis of the semiconductor equipment so as to align with the center of the chamber, but when using device adjustment in the prior art, the following problems still exist:

[0004] In the prior art, those skilled in the art could not avoid cases where excessive adjustment occurred because they judged solely by observation whether the axis had reached the desired position during the process of using the device adjustment. This phenomenon can lead to a situation where excessive stress is placed on the under dome of the chamber installed around the axis, and in more severe cases, may result in the under dome rupturing.

[0005] In summary, it is necessary to provide a device that determines whether a control device in semiconductor equipment has been adjusted to its proper position. The problem to be solved

[0006] The object of the present invention is to a semiconductor equipment and a method for adjusting an axis, wherein the semiconductor equipment is equipped with a measuring member and the measuring member can measure the external force received when the relative centerline of the axis is deviated, so that when adjusting the position of the axis, it is determined whether the axis has been adjusted to an accurate position based on the external force measured by the measuring member, and at the same time, the stress applied to the lower dome of the semiconductor equipment chamber surrounding the axis due to excessive adjustment can be avoided. means of solving the problem

[0007] To achieve the above objective, the present invention is realized through the following technical method:

[0008] In a type of semiconductor equipment,

[0009] Base used for loading wafers:

[0010] A shaft directly or indirectly connected to the above base;

[0011] It includes a measuring member installed at the end of the shaft to measure the external force received when the shaft is offset relative to the centerline.

[0012] Furthermore,

[0013] A bottom seat fixed at a position relative to the chamber position of a semiconductor facility; further comprising a positioning member installed on the bottom seat to adjust the position of the axis on a horizontal plane and connected to the measuring member,

[0014] The positioning member includes a fixing member that fixes the measuring member onto the positioning member.

[0015] Furthermore, the fixed member is installed on the upper side of the measuring member.

[0016] Furthermore, the measuring member is ring-shaped, and the ring shape includes a through hole that penetrates the upper and lower surfaces of the ring shape.

[0017] Furthermore, the cross-section of the above shaft is installed within the through hole and interposed between the upper surface and the lower surface of the measuring member.

[0018] Furthermore, the cross-section of the above shaft penetrates the through hole and extends beyond the lower surface of the ring.

[0019] Furthermore, the cross-section of the shaft is installed on the fixed member, and the cross-section of the shaft is located on the upper side of the measuring member.

[0020] Furthermore, the above-mentioned fixing member includes a hole, and the hole positions the axis.

[0021] Furthermore, the above hole is a through hole or a blind hole.

[0022] Furthermore, the diameter of the shaft is the same as the diameter of the through hole of the measuring member, and the diameter of the shaft is the same as the diameter of the hole of the fixing member.

[0023] Furthermore, the fixed member is connected to the positioning member through a screw thread, bolt, or screw.

[0024] Furthermore, the positioning member includes a first direction positioning part and a second direction positioning part located on a horizontal plane, and the first direction positioning part and the second direction positioning part are installed in an intersecting manner, and the angle between the first direction and the second direction is α.

[0025] Furthermore, the above semiconductor equipment

[0026] It includes a control member connected to the bottom sheet and the positioning member, respectively, and

[0027] The above adjustment member includes a first direction adjustment part and a second direction adjustment part located on a horizontal plane, wherein the first direction adjustment part adjusts the relative position of the first direction positioning part with respect to the bottom sheet, and the second direction adjustment part adjusts the relative position of the second direction positioning part with respect to the bottom sheet.

[0028] Furthermore, the adjustment member further includes a connecting part, the connecting part is installed on a bottom sheet to fix the adjustment member onto the bottom sheet, and the first direction adjustment part and the second direction adjustment part are both micrometric screws, and the micrometric screw is fixed on the connecting part and is connected to the first direction positioning part and the second direction positioning part at one end.

[0029] Furthermore, the positioning member further includes a locking member to fix the positioning member relative to the bottom sheet at a position after adjustment.

[0030] Furthermore, the bottom sheet includes a central hole, and the locking member includes a plate and a bolt, the plate is installed on the lower side of the bottom sheet, and a threaded hole that matches the bolt is formed on the plate, and after the adjustment of the positioning member is completed, the bolt is passed through the positioning member and the central hole of the bottom sheet and connected to the threaded hole on the plate.

[0031] Furthermore, the shapes of the first direction positioning part and the second direction positioning part are both in the shape of a "[", and a protruding ring facing the bottom sheet direction is installed in the middle of the second direction positioning part, and a receiving groove that combines with the protruding ring is installed in the middle of the first direction positioning part, and the protruding ring is inserted into the receiving groove, and the first direction positioning part and the second direction positioning part can rotate relative to each other with the center of the protruding ring as centrifugal.

[0032] Furthermore, the internal diameter of the protruding ring is equal to or larger than the diameter of the through hole of the measuring member.

[0033] Furthermore, when the cross-section of the above shaft penetrates the through hole and extends beyond the lower surface of the ring, the diameter of the inner hole of the protruding ring is larger than the diameter of the through hole of the measuring member.

[0034] Furthermore, the above-mentioned measuring member is a shear force measuring sensor.

[0035] Furthermore, the above angle α is greater than 0° and less than 180°.

[0036] The present invention further provides a method for controlling an axis of a semiconductor facility, wherein the control method comprises the following steps:

[0037] S1, a step of adjusting the above axis relative to the position of the centerline;

[0038] S2, determine whether the force measured by the measuring member exceeds a preset threshold; if it exceeds, return to step S1, and if it does not exceed, perform the next step S3.

[0039] S3, a step of locking the position of the above axis. Effects of the invention

[0040] Compared to the prior art, the present invention has the following advantages:

[0041] 1. The semiconductor equipment provided by the present invention is equipped with a measuring member, and the measuring member measures the external force received by the axis relative to the centerline, so that when adjusting the axis position, it is possible to determine whether the axis has been adjusted to a desired position based on the external force measured by the measuring member, thereby improving reproducibility and convenience.

[0042] 2. At the same time, the problem of the lower dome rupturing due to excessive stress caused by over-regulation was avoided.

[0043] 3. In addition, a measuring member was installed at the end of the shaft to provide a more sensitive measurement of force in the connection between the fixed member and the shaft. Brief explanation of the drawing

[0044] To more clearly explain the technical method of the present invention, the drawings required in the description below are briefly introduced. The drawings described below represent one embodiment of the present invention, and it is obvious to those skilled in the art that other drawings can be obtained from these drawings without requiring creative labor. Figure 1 is a simplified diagram of the structure of a type of semiconductor facility provided by the present invention. FIG. 2 is an aerial view of the axis adjustment device provided in the present invention. FIG. 3 is a cross-sectional view in the second direction of the shaft adjustment device provided in the present invention. FIG. 4 is a simplified diagram of the structure of the axis, positioning member, and measuring member provided in the present invention. FIG. 5 is a simplified diagram of another structure of the axis, positioning member, and measuring member provided in the present invention. FIG. 6 is a simplified diagram of another structure of the axis, positioning member, and measuring member provided in the present invention. Specific details for implementing the invention

[0045] The technical solution submitted for the present invention will be explained in more detail below in conjunction with the drawings and specific embodiments. Based on the description below, the advantages and features of the present invention will become clearer. It should be noted that the drawings are provided in a highly simplified format and with imprecise proportions to assist in explaining the methods of implementation of the present invention in a simple and clear manner. Please refer to the drawings to understand the purpose, features, and advantages of the present invention more clearly and easily. Structures, proportions, sizes, etc., shown in the drawings attached to this specification are provided for the purpose of reading and understanding by those skilled in the art in conjunction with the content disclosed in this specification; they should not be understood as limitations on the implementation of the present invention and have no substantial technical significance. Any formulas of structures, alterations of proportional relationships, or adjustments of sizes regarding the drawings do not affect the effects produced by the present invention or the objectives achieved, and all fall within the scope covered by the technical content disclosed in the present invention.

[0046] FIG. 1 is a simplified structural diagram of a semiconductor facility provided by the present invention. As shown in FIG. 1, the present invention provides a semiconductor facility. Optionally, the semiconductor facility includes at least one of an epitaxial facility and a rapid thermal processing facility. The present invention is described by way of example using an epitaxial facility, wherein the epitaxial facility is used to deposit an epitaxial layer on a wafer surface, and the epitaxial layer comprises a silicon epitaxial layer, a silicon germanium epitaxial layer, or a doped silicon germanium epitaxial layer.

[0047] As shown in FIG. 1, the semiconductor equipment (100) provided in the present invention mainly comprises a chamber and a control device (200). The chamber is formed by sealing and connecting an upper dome (104), a lower dome (107), and a side wall (106), and the chamber (100) is installed symmetrically along the centerline (130) of the chamber, and the base usually rotates about the centerline (130) as an axis. The upper dome (104) is generally a protruding circular shape and includes a circular light-transmitting portion and a flange installed around the light-transmitting portion, and the lower dome (107) is generally umbrella-shaped, and both the upper dome (104) and the lower dome (107) are made of quartz material. The chamber fixes the upper dome (104) to the side wall (106) through an upper flange (103). An upper heating group (102) is installed on the upper side of the chamber, and a lower heating group (108) is installed on the lower side of the chamber. A gas inlet (116) is installed at one end of the chamber, and a gas outlet (105) is installed at the other end opposite the gas inlet (116). When a necessary process is performed inside the chamber, the process gas is introduced into the chamber through the gas inlet (116) and reaches the surface of the wafer (118). The upper heating group (102) and the lower heating group (108) heat the wafer (118) to the required temperature to react with the process gas, and the process gas, once the reaction is complete, is discharged from the chamber through the gas outlet (105). A wafer transfer port is also installed in the chamber in the vertical direction connecting the gas inlet and the gas outlet on the horizontal plane to transfer the wafer (118) into and out of the chamber. In order to facilitate understanding of the process temperature status of the wafer (118) inside the chamber, an upper thermometer (101) and a lower thermometer (112) are installed in the chamber, and the process temperature of the wafer (118) is measured in real time through the upper dome (104) and the lower dome (107), respectively, to control the process temperature.

[0048] As shown in FIG. 1, the semiconductor equipment further includes a base (117) for loading a wafer (118), a rotating support shaft (114), a support pin (115), a support frame (113), a shaft (120), and a rotating mechanism (109). The base (117) is connected to the rotating support shaft (114), and through the rotation of the rotating support shaft (114) and the vertical movement of the base (117), the base (117) and the wafer (118) are made to rotate around a centerline (130) or the base (117) is moved up and down so as to be integrated. The wafer support pin (115) is movably installed within the pinhole of the base, and after the rotary support shaft (114) moves the support pin (115) up and down, the support frame (113) pushes the support pin (115) to separate the wafer and the base (117), and the rotary mechanism (109) and the rotary support shaft (114) are connected to drive the rotary support shaft (114) to rotate during the process.

[0049] The shaft (120) and the base are connected directly or indirectly, and optionally the shaft (120) is connected to the base (117) through the rotation mechanism (109) and the rotation support shaft (114).

[0050] The above adjustment device (200) includes a measuring member (301), and as shown in FIG. 1, the measuring member is installed at the end of the shaft (120) to measure the external force received by the shaft (120) relative to the centerline (130).

[0051] The present invention provides a measuring member to measure the external force received by the shaft (120) relative to the centerline (130) and, when adjusting the shaft (120) using an adjustment device (200), determines whether the shaft (120) has been adjusted to a desired position based on the external force measured by the measuring member, thereby avoiding the problems of instability and time waste caused by adjusting the shaft position by experience.

[0052] FIG. 2 shows an overhead view of the control device (200) provided in the present invention. FIG. 3 shows a cross-sectional view of the control device (200) provided in the present invention in a second direction. As shown in FIG. 2 and FIG. 3, the control device (200) further includes a bottom sheet (205) and a positioning member. Among these, the position of the bottom sheet is fixed relative to the chamber of the semiconductor equipment, and optionally the bottom sheet (205) and the chamber of the semiconductor equipment are fixedly connected, or the bottom sheet (205) is fixedly connected to other position-fixing members. The positioning member is installed on the bottom sheet (205) and adjusts and fixes the position of the axis (120) on a horizontal plane, and the measuring member is connected to the positioning member; Optionally, the positioning member is installed on the upper side of the bottom sheet (205), and simultaneously, the measuring member (301) is installed on the positioning member; optionally, the measuring member (301) is installed on the upper surface of the positioning member, and the shaft (120) is installed on the upper or upper side of the positioning member. The positioning member further includes a fixing member (240) to fix the measuring member (301) on the positioning member; optionally, the fixing member (240) is installed on the upper side of the measuring member (301), and the fixing member (240) and the positioning member are detachably connected; optionally, the fixing member (240) is also used to position the shaft (120); Furthermore, optionally, the fixed member (240) withstands the force generated when the axis (120) is relatively unbalanced with respect to the centerline (130).

[0053] As shown in FIGS. 2 and 3, the positioning member includes a first direction positioning part (211) and a second direction positioning part (209) located on a horizontal plane, and the first direction positioning part (211) and the second direction positioning part (209) are installed intersectingly, and the first direction positioning part (211) extends along the first direction and the second direction positioning part (209) extends along the second direction, and the angle between the first direction and the second direction is α. The positioning member causes the axis (120) to move in the first direction or the second direction and fixes and positions the axis at a desired position.

[0054] Optionally, the adjustment device (200) further includes an adjustment member, and the adjustment member is connected to a bottom sheet (205) and a positioning member, respectively, and the adjustment member includes a first direction adjustment part (203) and a second direction adjustment part (207) located on a horizontal plane, the first direction adjustment part (203) adjusts the relative position of the first direction positioning part (211) with respect to the bottom sheet (205), and the second direction adjustment part (207) adjusts the relative position of the second direction positioning part (209) with respect to the bottom sheet (205).

[0055] Optionally, the adjustment member further includes a connecting part, the connecting part is installed on a bottom sheet to fix the adjustment member onto the bottom sheet (205), and the first direction adjustment part (203) and the second direction adjustment part (207) are both micrometric screws, and the micrometric screw is connected to the connecting part and is connected at one end to the first direction positioning part (211) and the second direction positioning part (209). Optionally, the connecting portion includes a first connecting portion (204) and a second connecting portion (206), and the first direction adjustment portion (203) is fixed on the first connecting portion (204) and one end thereof is connected to the first direction positioning portion (211), and the micrometric screw of the first direction adjustment portion (203) causes the first direction positioning portion (211) to move relative to the first connecting portion in the first direction through screwing and also causes it to rotate finely around the center (202) of the first connecting portion when moved; The second direction adjustment part (207) is fixed on the second connection part (206), and one end thereof is connected to the second direction positioning part (209). The micrometric screw of the second direction adjustment part (207) causes the second direction positioning part (209) to move relative to the second connection part in the second direction through screwing, and also causes it to rotate slightly toward the center (208) of the second connection part when moving. Among these, the shapes of the first direction positioning part (211) and the second direction positioning part (209) are both [ shape.

[0056] Optionally, the positioning member further includes a locking member to fix the positioning member relative to the bottom sheet (205) at a position after adjustment.

[0057] Furthermore, optionally, the bottom sheet (205) includes a middle hole (212) and the locking member includes a plate (221) and a bolt (219), the plate (221) is installed on the lower side of the bottom sheet (205), and a threaded hole that is coupled with the bolt (219) is installed on the plate (221), and after the positioning member adjustment is completed, the bolt (219) is passed through the positioning member and the middle hole (212) of the bottom sheet to connect with the threaded hole on the plate.

[0058] Optionally, a protruding ring (210) facing the direction of the bottom sheet (205) is installed in the middle of the second direction positioning part (209), and a receiving groove (225) that combines with the protruding ring (210) is installed in the middle of the first direction positioning part (211), and the protruding ring is inserted into the receiving groove, and the first direction positioning part (211) and the second direction positioning part (209) rotate relative to each other with the center of the protruding ring (210) as centrifugal.

[0059] In the method of connecting the shaft and the positioning member, specifically, a mounting groove is installed on the upper surface of the positioning member, and the measuring member (301) and the fixing member (240) are installed within the mounting groove. The shape of the mounting groove is matched with the outer shape of the measuring member (301) and the fixing member (240). The mounting groove is a cylindrical groove, and a stepped portion is installed within the cylindrical groove. The measuring member (301) is ring-shaped, and the ring-shaped measuring member (301) further includes a through hole penetrating the upper and lower surfaces of the ring shape. Optionally, the fixing member (240) is ring-shaped or similar ring-shaped and is in close contact with the lower surface of the fixing member (240) and the upper surface of the measuring member (301). The fixing member (240) includes a hole, and the shaft (120) is installed within the hole to position the shaft. The hole is a through hole or a blind hole. The measuring member (301) is installed on the bottom of the cylindrical groove, and the fixing member (240) is installed on the stepped portion of the cylindrical groove; preferably, the radius of the fixing member (240) is larger than the radius of the measuring member (301) to provide a more stable contact surface for receiving force; of course, optionally, the radius of the fixing member (240) may be equal to the radius of the measuring member (301); preferably, the upper surface of the fixing member (240) is higher than the upper surface of the positioning portion so that the measuring member (301) can conveniently measure force, and of course, optionally, the upper surface of the fixing member (240) is equal to or lower than the upper surface of the fixing portion. The diameter of the shaft (120) is equal to the diameter of the through hole of the measuring member so that it is convenient for measuring force, and the diameter of the shaft (120) and the diameter of the hole of the fixing member are equal so that the shaft (120) is positioned.A vertical hole is installed at the bottom of the mounting groove, and the diameter of the vertical hole is greater than or equal to the diameter of the shaft (120); optionally, a protruding ring is installed in the vertical hole, that is, forming an internal hole of the protruding ring, and of course optionally, the vertical hole may not be installed within the protruding ring but may be installed at other locations of the positioning member, and in such a manner, the protruding ring is a projection. Specifically, as follows:

[0060] FIGS. 4-6 each show simplified structural diagrams of different embodiments of the axis, positioning member, and measuring member provided in the present invention.

[0061] In a certain embodiment, as shown in FIG. 4, the cross-section of the shaft (120) is installed within the through hole and interposed between the ring-shaped upper surface and the lower surface, and the hole of the fixing member (240) is a through hole. The cross-section of the shaft (120) first penetrates the hole of the fixing member (240) and continues downward to reach the through hole of the measuring member (301). In the corresponding embodiment, the hole of the fixing member (240) can position the shaft (120) within the hole; The inner surface of the through hole of the measuring member (301) and the shaft (120) are in contact, and at the same time, the inner surface of the hole of the fixing member (240) is also in contact with the shaft (120). When the shaft (120) is deviated relative to the center line (130), the shaft simultaneously applies a force on a horizontal plane to the inner surface of the hole of the fixing member (240) and the inner surface of the through hole of the measuring member (301). The measuring member (301) can measure the force received by the shaft due to the relative deviation relative to the center line, and the greater the relative deviation of the shaft (120) relative to the center line, the greater the measurement value of the measuring member (301).

[0062] In a certain embodiment, as shown in FIG. 5, the cross-section of the shaft (120) passes through the through hole and extends beyond the lower surface of the ring, and the hole of the fixing member (240) is a through hole. Among them, the diameter of the bottom vertical hole of the mounting groove is larger than the diameter of the through hole of the measuring member, that is, the diameter of the inner hole of the protruding ring is larger than the diameter of the through hole of the measuring member. The cross-section of the shaft first passes through the hole of the fixing member (240) and continues downward to pass through the through hole of the measuring member (301), and stops when the cross-section of the shaft (120) is lower than the lower surface of the measuring member (301). In the corresponding embodiment, the hole of the fixed member (240) can position the shaft (120) in the hole, and the inner surface of the through hole of the measuring member (301) and the inner surface of the hole of the fixed member (240) are in contact with the shaft (120). When the shaft (120) is deviated relative to the center line (130), the shaft applies a force on a horizontal plane simultaneously to the inner surface of the hole of the fixed member (240) and the inner surface of the through hole of the measuring member (301). The measuring member (301) measures the force received by the shaft due to its relative deviation relative to the center line, and the greater the relative deviation of the shaft (120) relative to the center line, the greater the measurement value measured by the measuring member (301). In the corresponding embodiment, since the shaft is extended deeper downward, the hole of the positioning member can perform a better positioning action with respect to the shaft, and also, since the diameter of the vertical hole (inner hole of the protruding ring) is larger than the diameter of the shaft, the shaft does not touch the inner surface of the vertical hole, and the measuring member (301) can measure a larger and more sensitive force.

[0063] In another type of embodiment, as shown in FIG. 6, the cross-section of the shaft is installed in the fixing member (240) and the cross-section of the shaft is located above the upper surface of the measuring member. Specifically, the shaft is located within the hole of the fixing member (240) and is interposed between the upper surface and the lower surface of the fixing member (240). In this embodiment, the hole of the fixing member (240) may be a through hole or a blind hole. The cross-section of the shaft (120) first penetrates the upper surface of the fixing member (240) and continues downward to reach the hole of the fixing member (240). In this embodiment, the hole of the fixing member (240) can position the shaft (120) within the hole; The inner surface of the hole of the fixed member (240) and the shaft (120) are in contact, but the inner surface of the measuring member (301) and the shaft (120) are not in contact. When the shaft (120) is deviated relative to the centerline (130), the shaft applies a force on the horizontal plane to the inner surface of the hole of the fixed member (240). Due to the equilibrium of forces and the interaction of forces, the measuring member (301) receives the force applied by the fixed member (240). Therefore, the measuring member (301) measures the force received when the shaft is deviated relative to the centerline, and the greater the relative deviation of the shaft (120) relative to the centerline, the greater the measurement value measured by the measuring member (301).

[0064] Optionally, the fixing member (240) is connected to the positioning member through a screw thread, a bolt, or a screw. Specifically, a male screw is installed on the side wall of the fixing member (240), and a female screw that matches the male screw is installed in the mounting groove of the positioning member to realize a detachable connection between the fixing member (240) and the positioning member; or a hole or threaded hole is installed around the fixing member (240) or at other locations, and the fixing member is detachably fixed to the positioning member through the combination of a bolt or screw and the hole or threaded hole. Although the connection method has been described as an example, it is not specifically limited.

[0065] Optionally, the measuring member (301) is a shear force measuring sensor.

[0066] Optionally, the angle α between the first direction and the second direction is greater than 0° and less than 180°, and preferably, the angle α is greater than 80° and less than 100°.

[0067] In addition, the semiconductor equipment further comprises a controller and an interactive terminal, wherein the controller and the measuring member are electrically connected and the controller and the interactive terminal are electrically connected, the measuring member transmits a signal regarding the received force to the controller, the controller processes the received signal and transmits the signal after processing to the interactive terminal, and the interactive terminal displays the signal after processing so that an operator can view the signal after processing through the interactive terminal. Optionally, the controller is an upper computer and the interactive terminal is a monitor.

[0068] The present invention further provides a method for controlling the axis of the semiconductor equipment:

[0069] S1, the above axis is adjusted relative to the centerline position;

[0070] Specifically, the first direction control unit (203) and / or the second direction control unit (207) are controlled, that is, the micrometric screw is screwed, to adjust the relative positions of the first direction positioning unit (211) and the second direction positioning unit (209) with respect to the bottom sheet (205), thereby causing the axis (120) to move in the first direction and / or the second direction and to move until the axis is aligned with the centerline.

[0071] S2, determine whether the force measured by the measuring member exceeds a predetermined threshold; if it exceeds, return to step S1; if it does not exceed, perform the next step S3;

[0072] Specifically, the controller compares the force received by the axis measured by the measuring member relative to the centerline with the predetermined threshold and the force received by the axis through observation of the processing result displayed by the interactive terminal. If the force received by the axis exceeds the predetermined threshold, the controller continues to perform step S1, that is, continues to adjust the position of the axis, and if the force received by the axis does not exceed the predetermined threshold, the controller stops the adjustment.

[0073] S3, locks the position of the above axis.

[0074] Specifically, after the adjustment is completed, the bolt (219) is passed through the positioning member and the middle hole (212) of the bottom sheet to connect with the threaded hole on the plate, thereby fixing the positioning member relative to the bottom sheet (205), that is, fixing the position of the shaft (120) relative to the position of the bottom sheet (205).

[0075] The semiconductor equipment provided in this invention is equipped with a measuring member, and the measuring member measures the force received by the axis being relatively offset from the centerline. By determining whether the axis has been adjusted to a desired position based on the external force measured by the measuring member during axis position adjustment, convenience is enhanced, and the problem of the lower dome rupturing due to excessive stress caused by excessive adjustment of the axis is avoided.

[0076] It must be explained that in this specification, related terms of classes such as, for example, first and second, are used merely to distinguish one entity or operation from other entities or operations and do not require or imply any actual relationship or order existing between such entities or operations. Also, the terms “include,” “include,” or any other variations thereof are intended to include a non-exclusive inclusion, such that a process, method, article, or apparatus of a series of elements includes not only these elements but also other elements not explicitly enumerated, or elements inherent to such process, method, article, or apparatus. Unless further limitation is given, an element limited by the phrase “...includes one” does not exclude other identical elements among the process, method, article, or apparatus of such element. Furthermore, in this specification, the term “connection” indicates that A and B are directly connected or that A and B are indirectly connected, and an indirect connection may be, for example, A and B connected through C, or even connected through more members such as C and D. The connection between A and B may be integral or separate, detachable or fixed. In this specification, the term "selectable" indicates that the applicable technical features and any features of the specification may be combined or not combined.

[0077] Although the present invention has been described in detail through the above-described preferred embodiments, it is obvious to those skilled in the art that the above description should not be understood as a limitation on the present invention. It is obvious to those skilled in the art that various modifications and substitutions can be made to the present invention after reading the above. Accordingly, the scope of the claims of the present invention is limited by the appended claims.

Claims

Claim 1 A semiconductor facility comprising: a chamber; a base located inside the chamber and loaded with a wafer; a shaft directly or indirectly connected to the base; a measuring member installed at the end of the shaft to measure an external force received when the shaft is deviated relative to the centerline of the chamber; a bottom sheet whose position is fixed relative to the position of the chamber of the semiconductor facility; and a positioning member installed on the bottom sheet to adjust the position of the shaft on a horizontal plane and connected to the measuring member; wherein the positioning member includes a fixing member, and the fixing member fixes the measuring member onto the positioning member. Claim 2 A semiconductor facility according to claim 1, characterized in that the fixing member is installed on the upper side of the measuring member. Claim 3 A semiconductor facility according to paragraph 2, characterized in that the measuring member is ring-shaped and the ring shape includes a through hole penetrating the upper and lower surfaces of the ring shape. Claim 4 A semiconductor apparatus characterized in that, in paragraph 3, the cross-section of the shaft is installed within the through hole and interposed between the upper surface and the lower surface of the measuring member. Claim 5 A semiconductor facility characterized in that, in paragraph 3, the cross-section of the shaft penetrates the through hole and extends beyond the lower surface of the ring shape. Claim 6 A semiconductor facility according to paragraph 3, characterized in that the cross-section of the shaft is installed on the fixed member and the cross-section of the shaft is located on the upper side of the trademark surface of the measuring member. Claim 7 A semiconductor facility according to claim 6, wherein the fixed member includes a hole and the hole positions the axis. Claim 8 A semiconductor facility characterized in that, in claim 7, the hole is a through hole or a blind hole. Claim 9 A semiconductor apparatus according to claim 8, characterized in that the diameter of the shaft is the same as the diameter of the through hole of the measuring member and the diameter of the shaft is the same as the diameter of the hole of the fixing member. Claim 10 A semiconductor facility according to claim 1, characterized in that the fixing member is connected to the positioning member through a screw thread, a bolt, or a screw. Claim 11 A semiconductor facility according to claim 1, wherein the positioning member comprises a first direction positioning part and a second direction positioning part located on a horizontal plane, the first direction positioning part and the second direction positioning part are installed intersectingly, and the angle between the first direction and the second direction is α. Claim 12 In claim 11, the semiconductor equipment further comprises a control member connected to each a bottom sheet and a positioning member, wherein the control member comprises a first direction control part and a second direction control part located on a horizontal plane, and wherein the first direction control part controls the relative position of the first direction positioning part with respect to the bottom sheet, and the second direction control part controls the relative position of the second direction positioning part with respect to the bottom sheet. Claim 13 A semiconductor facility according to claim 12, wherein the adjustment member further comprises a connecting part, the connecting part is installed on a bottom sheet to fix the adjustment member on the bottom sheet, and the first direction adjustment part and the second direction adjustment part are both micromatic screws, and the micromatic screw is fixed on the connecting part and one end is connected to the first direction positioning part and the second direction positioning part. Claim 14 A semiconductor facility according to claim 13, characterized in that the positioning member further includes a locking member and is used to fix the positioning member relative to the bottom sheet at a position after adjustment. Claim 15 A semiconductor facility according to claim 14, wherein the bottom sheet includes a central hole and the locking member includes a plate and a bolt, the plate is installed on the lower side of the bottom sheet and a threaded hole that is coupled with the bolt is installed on the plate, and after the adjustment of the positioning member is completed, the bolt is passed through the positioning member and the central hole of the bottom sheet to connect to the threaded hole on the plate. Claim 16 A semiconductor facility according to claim 11, wherein the shape of the first direction positioning part and the second direction positioning part are both [ shape, and a protruding ring facing the bottom sheet direction is installed in the middle of the second direction positioning part, and a receiving groove that is combined with the protruding ring is installed in the middle of the first direction positioning part, and the protruding ring is inserted into the receiving groove, and the first direction positioning part and the second direction positioning part can rotate relatively centrifugally around the center of the protruding ring. Claim 17 A semiconductor apparatus characterized in that, in claim 16, the diameter of the inner hole of the protruding ring is greater than or equal to the diameter of the through hole of the measuring member. Claim 18 A semiconductor apparatus according to claim 17, wherein the measuring member is ring-shaped, and when the cross-section of the shaft penetrates the through hole and exceeds the lower surface of the ring shape, the diameter of the inner hole of the protruding ring is larger than the diameter of the through hole of the measuring member. Claim 19 A semiconductor facility according to claim 1, characterized in that the measuring member is a shear force measuring sensor. Claim 20 A semiconductor facility according to claim 11, characterized in that the angle α is greater than 0° and less than 180°. Claim 21 A method for controlling an axis of a semiconductor facility according to any one of claims 1 to 20, comprising: S1, a step of controlling the relative position of the axis with respect to the centerline of the chamber; S2, a step of determining whether a force measured by a measuring member exceeds a predetermined threshold, and if it exceeds, returning to step S1, and if it does not exceed, performing the following step S3; S3, a step of locking the position of the axis; characterized by comprising. Claim 22 delete

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