Measurement method, imprint apparatus, and article manufacturing method

Abstract

The present invention provides a measurement method comprising the steps of: driving a measurement target area on the surface of a substrate in a first direction with respect to a measurement unit, and obtaining first measurement information indicating the height of the measurement target area at each of a plurality of first measurement lines that are parallel to the first direction and different from each other by measuring each of said first measurement lines by the measurement unit; and driving the measurement target area in a second direction that intersects all of the plurality of first measurement lines with respect to the measurement unit, and obtaining second measurement information indicating the height of the measurement target area at the second measurement line by measuring one second measurement line parallel to the second direction by measuring the second measurement unit.

Description

Technology Field

[0001] The present invention relates to a measurement method, an imprint device, and a method for manufacturing an article. Background Technology

[0002] As the demand for miniaturization of semiconductor devices increases, microfabrication technology is attracting attention in addition to conventional photolithography technology. This technology involves forming fine protrusions and groove patterns formed in a mold onto a substrate by molding an imprint material on the substrate using a mold. This microfabrication technology, also known as imprint technology, can form fine patterns (structures) on the order of several nanometers on a substrate.

[0003] In imprint technology, one example of a method for curing the imprint material is photocuring. Photocuring forms a pattern of the imprint material on the substrate by irradiating light onto the imprint material while it is in contact with a mold, and then separating the mold from the cured imprint material.

[0004] In an imprint device employing imprint technology, when a mold is brought into contact with an imprint material on a substrate, if the pattern surface of the mold and the surface of the substrate are not parallel to each other, the pattern formed on the substrate may collapse or insufficient filling of the imprint material onto the mold may occur. Therefore, before bringing the mold and the imprint material on the substrate into contact, it is necessary to acquire the height distribution of the pattern surface of the mold and the height distribution of the surface of the substrate. It should be noted that acquiring the height distribution of the surface of the substrate is necessary not only in imprint devices but also in exposure devices using projection optical systems that require focus adjustment. Related technologies are proposed in Japanese Patent Publications No. 2006-156508 and No. 2018-22114, respectively.

[0005] Japanese Patent Publication No. 2006-156508 discloses a technique for pre-measuring the thickness distribution of a substrate and the height distribution of a supporting surface that holds and supports the substrate in an exposure device using a projection optical system, and obtaining the height distribution of the surface of the substrate held and supported by the supporting surface from the measurement results. Japanese Patent Publication No. 2018-22114 discloses a technique for reducing the time required to measure the height distribution of the surface of a substrate in an exposure device using a projection optical system by measuring the surface of the substrate in two different directions.

[0006] However, according to the relevant technology, if the driving method of a driving unit that drives a substrate holding support unit including a holding support surface for holding and supporting a substrate is an air levitation method, the levitation amount (height) of the substrate holding support unit changes due to pressure fluctuations, and this may affect the height measurement of the substrate surface. It should be noted that an example of a factor causing pressure fluctuation is, for instance, pressure fluctuation on the side of the factory equipment supplying air to the exposure device (driving unit). The problem to be solved

[0007] The present invention provides a technology advantageous for measuring the height distribution of a substrate surface. means of solving the problem

[0008] According to one aspect of the present invention, a measurement method is provided comprising: a step of obtaining first measurement information indicating the height of the measurement target area at each of the measurement lines by measuring each of the plurality of first measurement lines parallel to the first direction and different from each other by a driving unit configured to drive a holding support unit including a holding support surface configured to hold and support a substrate in a floating state; a step of obtaining second measurement information indicating the height of the measurement target area at the second measurement line by measuring one second measurement line parallel to the second direction by the driving unit while driving the measurement target area at the measurement unit in a second direction intersecting all of the plurality of first measurement lines; and a step of generating first distribution information indicating the height distribution of the measurement target area based on the first measurement information and the second measurement information.

[0009] Further aspects of the present invention will become clear from the following description of exemplary embodiments with reference to the accompanying drawings. Brief explanation of the drawing

[0010] FIG. 1 is a schematic diagram illustrating the configuration of an imprint device according to a first embodiment of the present invention. FIG. 2 is a schematic diagram showing an example of the configuration of a driving unit of an imprint device shown in FIG. 1. Figure 3 is a diagram showing the relationship between the measurement result of the first measurement unit and the amount of levitation of the driving unit. FIGS. 4a and FIGS. 4b are drawings for explaining a measurement method according to a first embodiment. FIGS. 5A and FIGS. 5B are drawings for explaining a measurement method according to a first embodiment. FIG. 6 is a flowchart illustrating a measurement method according to a first embodiment. FIG. 7 is a flowchart for explaining a measurement method according to a first embodiment. FIG. 8 is a schematic diagram illustrating the configuration of an imprint device according to a second embodiment of the present invention. FIGS. 9a and FIGS. 9b are drawings for explaining a measurement method according to a second embodiment. FIG. 10 is a flowchart for explaining a measurement method according to a second embodiment. FIG. 11 is a flowchart illustrating a measurement method according to a second embodiment. FIG. 12 is a schematic diagram illustrating the configuration of an imprint device according to a third embodiment of the present invention. FIG. 13 is a flowchart for explaining a method to replace the substrate holding support unit of the imprint device shown in FIG. 12. FIGS. 14a to 14f are drawings for explaining a method of manufacturing an article. Specific details for implementing the invention

[0011] Hereinafter, embodiments are described in detail with reference to the accompanying drawings. It should be noted that the following embodiments are not intended to limit the scope of the claimed invention. Although numerous features are described in the embodiments, the invention is not limited to the invention requiring all of these features, and numerous such features may be appropriately combined. Furthermore, in the accompanying drawings, identical or similar components are assigned the same reference number, and redundant descriptions thereof are omitted.

[0012] <First Embodiment>

[0013] FIG. 1 is a schematic diagram illustrating the configuration of an imprint device (101) according to a first embodiment of the present invention. The imprint device (101) is a lithography device that forms a pattern on a substrate and is employed in the lithography step, which is a manufacturing step for a device such as a semiconductor device, a liquid crystal display device, or a magnetic storage medium. The imprint device (101) contacts an uncured imprint material supplied on a substrate with a mold and applies curing energy to the imprint material to form a pattern of a cured material in which the pattern of the mold is transferred.

[0014] As an imprint material, a material that hardens upon receiving hardening energy (a curable composition) is used. Examples of hardening energy used include electromagnetic waves, heat, etc. As electromagnetic waves, for example, infrared, visible light, ultraviolet light, etc., selected from a wavelength range of 10 nm (inclusive) to 1 mm (inclusive) are used.

[0015] A curable composition is a composition that is cured by light irradiation or heating. A photocurable composition that is cured by light irradiation contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as needed. The non-polymerizable compound is at least one material selected from the group comprising sensitizers, hydrogen donors, internal release agents, surfactants, antioxidants, polymer components, etc.

[0016] The imprint material can be applied to a substrate in the form of a film by a spin coater or a slit coater. The imprint material can be applied to a substrate in the form of a droplet or an island or film formed by connecting multiple droplets using a liquid jet head. The viscosity of the imprint material (viscosity at 25°C) is, for example, 1 mPa·s (inclusive) to 100 mPa·s (inclusive).

[0017] As a substrate, glass, ceramic, metal, semiconductor, resin, etc. are used, and if necessary, a component made of a material different from the substrate may be formed on the surface of the substrate. More specifically, examples of substrates include silicon wafers, semiconductor compound wafers, silica glass, etc.

[0018] An imprint device (101) performs an imprint process using a mold to form a pattern of imprint material on a substrate. The imprint process includes a supply step, a contact step performed after the supply step, a curing step performed after the contact step, and a separation step performed after the curing step. In the supply step, an imprint material in the form of a droplet is supplied (placed) onto a shot area of ​​the substrate. In the contact step, the imprint material on a part of the shot area of ​​the substrate comes into contact with the pattern surface of the mold, and then the contact area between the imprint material and the pattern surface is expanded over the entire area of ​​the shot area. In the curing step, the imprint material on the shot area of ​​the substrate is cured while in contact with the pattern surface of the mold. In the separation step, the cured imprint material on the shot area of ​​the substrate is separated from the pattern surface of the mold.

[0019] As shown in FIG. 1, the imprint device (101) includes a substrate holding support unit (11) comprising a holding support surface (11A) for holding and supporting a substrate (1), and a driving unit (21) for driving the substrate holding support unit (11) to position the substrate (1). Additionally, the imprint device (101) includes a substrate transport unit (31) for transporting (loading) the substrate (1) to the substrate holding support unit (11), and a holding support unit transport unit (32) for transporting (loading) the substrate holding support unit (11) to the driving unit (21). The imprint device (101) further includes a first measurement unit (81) and a first control unit (91).

[0020] In this embodiment, the substrate holding support unit (11) is formed by a pin chuck and holds and supports the substrate (1) by vacuum adsorbing the substrate (1). The substrate (1) can maintain its loading position by being vacuum adsorbed by the substrate holding support unit (11). Note that the substrate holding support unit (11) is not limited to a pin chuck and can be formed by an electrostatic chuck.

[0021] The driving unit (21) holds and supports the substrate holding support unit (11), for example, by vacuum adsorption. The driving unit (21) employs an air levitation method as a driving method and drives in a horizontal direction while maintaining a state of being levitated about a few μm above the floor where the imprint device (101) is installed by spraying gas from the spraying unit (22). The gas sprayed from the spraying unit (22) is, for example, clean dry air and is supplied to the spraying unit (22) through a gas supply pipe, etc., from the factory equipment (PE) where the imprint device (101) is installed.

[0022] The substrate transport unit (31) includes a rotation mechanism (311) that rotates the substrate (1) around a vertical axis (i.e., rotates the substrate (1) by a predetermined angle) when transporting the substrate (1) to the substrate holding support unit (11). For example, the rotation mechanism (311) can be realized by rotating the link mechanism of a plurality of robot hands or by rotating the robot hands themselves. The rotation mechanism (311) includes a measuring instrument, an encoder, etc., that measures the rotation angle of the substrate (1) using a notch or cutout provided on the outer periphery of the substrate (1).

[0023] The holding support unit return unit (32) may have a function of returning the substrate holding support unit (11), in addition to a function of cleaning the substrate holding support unit (11), more specifically, the holding support surface (11A) of the substrate holding support unit (11).

[0024] The first measuring unit (81) has the function of measuring the distance to the substrate (1) held and supported by the substrate holding support unit (11) (the distance between the first measuring unit (81) and the surface of the substrate (1). By moving (scanning) the substrate holding support unit (11) that holds and supports the substrate (1) in a horizontal direction and measuring the distance to the substrate (1) by the first measuring unit (81), the height distribution of the entire substrate (1), more specifically the surface of the substrate (1), can be obtained. As the first measuring unit (81), a laser displacement meter, a spectroscopic interferometer, etc. are used, but the first measuring unit (81) is not limited to these, and any measuring instrument capable of measuring the distance to the substrate (1) with high precision (accurate) without contact can be used.

[0025] The first control unit (91) is formed by an information processing device (computer) including a CPU, memory, etc., and controls each unit of the imprint device (101) according to a program stored in a storage unit. For example, the first control unit (91) controls an imprint process that forms a pattern of an imprint material on a substrate using a mold. In this embodiment, the first control unit (91) also has the function of processing measurement results measured by the first measurement unit (81).

[0026] FIG. 2 is a schematic diagram showing an example of the arrangement of a driving unit (21) in the present embodiment. The driving unit (21) includes two guides parallel to mutually orthogonal directions, more specifically, an X-direction guide (23) and a Y-direction guide (24), and can be driven to any X-direction and Y-direction position. Each of the guides (23 and 24) is formed, for example, by a linear motor. The position of the driving unit (21) is measured, for example, using an encoder or scale provided on each of the guides (23 and 24), and the driving unit (21) is positioned under the control of the first control unit (91) based on the measurement result.

[0027] FIG. 3 is a diagram illustrating the relationship between the measurement result (Zm) obtained by measuring the distance to the surface of the substrate (1) by the first measurement unit (81) and the amount of levitation (Zs) of the driving unit (21) when measuring the distance to the surface of the substrate (1) by the first measurement unit (81). Here, the driving unit (21) measures a plurality of first measurement points set on each of a plurality of first measurement lines that are parallel to the Y direction and different from each other while driving the measurement target area of ​​the surface of the substrate (1) in the Y direction (first direction) with respect to the first measurement unit (81) (measurement field of view). In this embodiment, the direction in which the substrate (1) is driven (scanned) with respect to the first measurement unit (81) is the Y direction, but it should be noted that the present invention is not limited to this, and the direction may be the X direction or the diagonal direction.

[0028] In order to lift the drive unit (21), the pressure fluctuation of the gas supplied to the injection unit (22) through a gas supply pipe, etc., from the factory facility (PE) where the imprint device (101) is installed is denoted as P. The pressure fluctuation (P) of the gas supplied from the factory facility (PE) depends on the performance of the pump for generating force and exhibits long-period behavior. The range of the pressure fluctuation (P) (pressure fluctuation range) varies for each factory facility where the semiconductor manufacturing device, such as the imprint device (101), is installed, but is generally about tens of kPa. In the semiconductor manufacturing device, the pressure of the gas supplied from the factory facility is controlled to have a predetermined pressure value and a predetermined pressure fluctuation range through a pressure control valve, etc. For example, if high-precision pressure control is required, the pressure fluctuation range can be suppressed to about several kPa by using a precision pressure control valve, etc.

[0029] In the imprint device (101), for each shot area of ​​the substrate (1), a process is performed to control the orientation of at least one of the mold and the substrate (1) in order to set the surface of the substrate (1) to be parallel to the pattern surface of the mold. Accordingly, it is necessary to obtain the height distribution of the surface of the substrate (1) in nanometer units.

[0030] However, if the driving unit (21) has a structure that copes with pressure fluctuations (P), even if the pressure fluctuation range is suppressed to about several kPa by a precision pressure control valve, the levitation amount of the driving unit (21) may fluctuate by tens of nanometers in conjunction with the pressure fluctuations (P). In addition, the structure supporting the driving unit (21) and the first measuring unit (81) may also be levitized by an air-mounting method to mitigate the influence of vibration components from the floor, and the structure may be affected by the force fluctuation (pressure fluctuation (P)) of the factory equipment (PE). Even if the driving unit (21) and the first measuring unit (81) are supported by different structures in consideration of the influence of vibrations caused by the driving of the driving unit (21), either the driving unit (21) or the first measuring unit (81) may be affected by the force fluctuation of the factory equipment (PE).

[0031] Referring to FIG. 3, the relationship between the buoyancy amount (Zs) of the driving unit (21) and the pressure fluctuation (P) is expressed by the following equation (1), where t is the time term. Referring to equation (1), it can be seen that the buoyancy amount (Zs) of the driving unit (21) fluctuates in conjunction with the pressure fluctuation (P) that fluctuates over time.

[0032] Zs(t) ∝ P(t) ...(1)

[0033] The height distribution of the surface of the substrate (1) held and supported by the substrate holding support unit (11) (the holding support surface (11A)) is denoted as Zt, the height distribution of the surface of the substrate (1) (the substrate itself) is denoted as Zw, and the height distribution of the holding support surface (11A) of the substrate holding support unit (11) is denoted as Zc. In this case, the height distribution (Zt) of the surface of the substrate (1) held and supported by the substrate holding support unit (11) is expressed by the following equation (2). Note that in equation (2), x and y represent the x and y coordinates of the measurement point, respectively, and Zsi represents the ideal value (constant value) of the levitation amount of the driving unit (21).

[0034] Zt(x, y) = Zw(x, y) + Zc(x, y) + Zsi ...(2)

[0035] As described above, Zm represents the measurement result obtained by driving the substrate (1) (substrate holding support unit (11) that holds and supports the substrate (1)) relative to the first measurement unit (81) by the driving unit (21) and measuring the distance to the surface of the substrate (1) by the first measurement unit (81). In this case, the height distribution (Zt) of the surface of the substrate (1) held and supported by the substrate holding support unit (11) is expressed by the following equation (3):

[0036] Zm(x, y, t) = Zt(x, y) + Zs(t)

[0037] Zt(x, y) = Zm(x, y, t) - Zs(t) ...(3)

[0038] Since the amount of levitation (Zs) of the driving unit (21) is linked to the pressure fluctuation (P), for the measurement results within the line (results obtained by measuring multiple first measurement points set in one first measurement line) with a short measurement time, there is an approximate correlation as shown in FIG. 3, and the influence of the pressure fluctuation (P) is small. On the other hand, if the number of first measurement lines parallel to the Y direction (number of measurement lines) is increased in order to obtain the height distribution (Zt) of the surface of the substrate (1) with high precision, the measurement time becomes longer and the influence of the pressure fluctuation (P) increases. The surface of the substrate (1) and the holding support surface (11A) of the substrate holding support unit (11) each generally have a height distribution on the order of tens of nanometers. Therefore, if the amount of elevation (Zs) of the driving unit (21) fluctuates at the same level as this, it is necessary to measure the amount of elevation (Zs) of the driving unit (21) with another measuring instrument in order to obtain the height distribution (Zt) of the surface of the substrate (1).

[0039] FIGS. 4a and 4b are drawings for explaining a measurement method for measuring the height distribution of the surface of a substrate (1) in the present embodiment. In FIGS. 4a and 4b, the entire surface area of ​​the substrate (1) is the measurement target area. FIG. 4a shows a plurality of first measurement points set on each of a plurality of first measurement lines that are different from each other and parallel to the Y direction (first direction). FIG. 4b shows a plurality of second measurement points set on one second measurement line that is parallel to the X direction (second direction) which is orthogonal to the Y direction. In the present embodiment, for each of the plurality of first measurement lines, a plurality of first measurement points and a plurality of second measurement points are set such that one of the plurality of first measurement points overlaps with one of the plurality of second measurement points.

[0040] Referring to FIG. 4a, in this embodiment, for each of a plurality of first measurement lines, the driving unit (21) drives the substrate (1) in the Y direction relative to the first measurement unit (81), and the first measurement unit (81) measures the distance to each measurement point (each first measurement point). Similarly, referring to FIG. 4b, in this embodiment, for one second measurement line, the driving unit (21) drives the substrate (1) in the X direction relative to the first measurement unit (81), and the first measurement unit (81) measures the distance to each measurement point (each second measurement point). In this embodiment, it is assumed that measurement is performed on a plurality of first measurement points (Fig. 4a) set on each of a plurality of first measurement lines, and then on a plurality of second measurement points (Fig. 4b) set on a second measurement line. However, measurement may be performed on a plurality of second measurement points set on a second measurement line, and then on a plurality of first measurement points set on each of a plurality of first measurement lines.

[0041] It should be noted that in FIGS. 4a and 4b, the first direction is the Y direction and the second direction is the X direction, but the present invention is not limited thereto. For example, the first direction may be the X direction and the second direction may be the Y direction, or the first direction may be the diagonal direction and the second direction may be a direction orthogonal to the diagonal direction. Additionally, the second direction is set to be a direction orthogonal to the first direction, but the present invention is not limited thereto, and the second direction may be any direction that intersects all of the plurality of first measurement lines. It should be noted that when the first direction and the second direction are parallel to the X direction guide (23) and the Y direction guide (24) of the driving unit (21), respectively, this is advantageous in terms of heat generation of the driving unit (21) and positional reproducibility. That is, the first direction is preferably a direction parallel to one of the two guides (23 and 24) (e.g., X-direction guide (23)), and the second direction is preferably a direction parallel to the other of the two guides (23 and 24) (e.g., Y-direction guide (24)).

[0042] As shown in FIG. 4a, the measurement result in the first measurement line (distance to the surface of the substrate (1) (first measurement point)) obtained by the first measurement unit (81) measuring each first measurement point while the driving unit (21) drives the substrate (1) in the Y direction is set to Zm1. Additionally, as shown in FIG. 4b, the measurement result in the second measurement line (distance to the surface of the substrate (1) (second measurement point)) obtained by the first measurement unit (81) measuring each second measurement point while the driving unit (21) drives the substrate (1) in the X direction is set to Zm2.

[0043] Here, for the measurement result (Zm1) from one first measurement line, the variation in the levitation amount (Zs) of the driving unit (21) can be ignored because the measurement time is short and the variation in the levitation amount (Zs) of the driving unit (21) is sufficiently small. Similarly, for the measurement result (Zm2) from the second measurement line, the variation in the levitation amount (Zs) of the driving unit (21) can be ignored because there is only one second measurement line. Therefore, for example at Y=0, since the same measurement point (part) on the substrate is measured as shown in FIG. 4a and FIG. 4b, the measurement result (Zm1(x, 0)) from the first measurement line and the measurement result (Zm2(x, 0)) from the second measurement line must match.

[0044] Accordingly, in this embodiment, at Y=0, the measurement result (Zm1(x, 0)) in the first measurement line is corrected so that the measurement result (Zm1(x, 0)) in the first measurement line becomes identical (match) with the measurement result (Zm2(x, 0)) in the second measurement line. That is, the measurement result (Zm1(x, 0)) in the first measurement line is corrected by using the measurement result (Zm2(x, 0)) in the second measurement line as a reference. In this case, the height distribution (Zt) of the surface of the substrate (1) in a state of being held and supported by the substrate holding and supporting unit (11) is expressed by the following equation (4):

[0045] Zt(x, y) ≒ Zm1(x, y) - Zm1(x, 0) + Zm2(x, 0) ...(4)

[0046] In this embodiment, measurement results at Y=0 are used, more specifically, measurement results at the first measurement line (Zm1(x, 0)) and measurement results at the second measurement line (Zm2(x, 0)), but the present invention is not limited thereto. For example, as long as one of the plurality of first measurement points set on each first measurement line overlaps with one of the plurality of second measurement points set on the second measurement line, the measurement points used are not limited to those at Y=0.

[0047] FIGS. 5A and 5B are drawings for explaining a measurement method for measuring the height distribution of each local area of ​​the surface of a substrate (1) in the present embodiment. In FIGS. 5A and 5B, a partial area of ​​the surface of the substrate (1), more specifically, a shot area, is the area to be measured. FIG. 5A shows a plurality of first measurement points set on each of a plurality of first measurement lines that are different from each other and parallel to the Y direction (first direction) in the shot area, which is a local area of ​​the surface of the substrate (1). FIG. 5B shows a plurality of second measurement points set on a single second measurement line that is parallel to the X direction (second direction) which is orthogonal to the Y direction in the shot area, which is a local area of ​​the surface of the substrate (1). It should be noted that it is preferable for the second measurement line to be set to pass through the center of each shot area of ​​the substrate (1).

[0048] As shown in FIG. 5a, the measurement result in the first measurement line (distance to the surface of the substrate (1) (first measurement point)) obtained by the driving unit (21) driving the substrate (1) in the Y direction and measuring each first measurement point by the first measurement unit (81) is denoted as Zn1. Additionally, in the shot area of ​​the substrate (1) at Y=y2, the measurement result in the first measurement line is denoted as Zn1(x, y2). Similarly, as shown in FIG. 5b, the measurement result in the second measurement line (distance to the surface of the substrate (1) (second measurement point)) obtained by the driving unit (21) driving the substrate (1) in the X direction and measuring each second measurement point by the first measurement unit (81) is denoted as Zn2. Additionally, in the shot area of ​​the substrate (1) at Y=y2, the measurement result in the second measurement line is denoted as Zn2(x, y2).

[0049] As described in FIGS. 4a and 4b, the height distribution (Zt1) of the shot area of ​​the substrate (1) held and supported by the substrate holding support unit (11) is expressed by the following equation (5).

[0050] Zt1(x, y) ≒ Zn1(x, y) - Zn1(x, y2) + Zn2(x, y2) ...(5)

[0051] When acquiring the height distribution of a local area (e.g., a shot area) on the surface of a substrate (1), the measurement method shown in FIGS. 5a and 5b can acquire the height distribution of the local area with higher precision (precision) than the measurement method shown in FIGS. 4a and 4b.

[0052] Referring to FIG. 6, a method for verifying the height distribution of the surface of a substrate (1), including a measurement method for measuring the height distribution of the surface of the substrate (1) in the present embodiment, is described. This method is executed by the first control unit (91) collectively controlling each unit of the imprint device (101).

[0053] In step S602, a substrate (1) is introduced into the imprint device (101). More specifically, the substrate (1) is introduced into the imprint device (101) through a substrate transport unit (31), and the substrate (1) is supported by the support surface (11A) of the substrate support unit (11). The types of substrates (1) include, for example, an unprocessed silicon wafer, an ultra-flat wafer, a substrate having a base coating, a substrate coated with a photosensitive material such as a resin material, etc.

[0054] In step S604, the driving unit (21) drives the substrate (1) in the Y direction with respect to the first measuring unit (81), and the first measuring unit (81) measures the distance to each measurement point for each of the plurality of first measuring lines, thereby obtaining the measurement result (Zm1) in the first measuring line. In this way, while driving the measurement target area on the surface of the substrate (1) in the first direction (Y direction) with respect to the first measuring unit (81), each of the plurality of first measuring lines that are parallel to the first direction and different from each other is measured by the first measuring unit (81). Through this operation, first measurement information (measurement result (Zm1)) indicating the height of the measurement target area on the surface of the substrate (1) at each of the plurality of first measuring lines is obtained.

[0055] In step S606, the driving unit (21) drives the substrate (1) in the X direction relative to the first measuring unit (81), and the distance to each measuring point for one second measuring line is measured by the first measuring unit (81), thereby obtaining the measurement result (Zm2) in the second measuring line. In this way, while driving the measurement target area on the surface of the substrate (1) in the second direction (X direction) relative to the first measuring unit (81), one second measuring line parallel to the second direction is measured by the first measuring unit (81). Through this operation, second measurement information (measurement result (Zm2)) indicating the height of the measurement target area on the surface of the substrate (1) in the second measuring line is obtained.

[0056] In step S608, the height distribution (Zt) of the surface of the substrate (1) held and supported by the substrate holding and supporting unit (11) is calculated based on the measurement result (Zm1) from the first measurement line obtained in step S604 and the measurement result (Zm2) from the second measurement line obtained in step S606. More specifically, as described above, the height distribution (Zt) of the surface of the substrate (1) is calculated by correcting the measurement result (Zm1) from the first measurement line so that the measurement result (Zm1) from the first measurement line matches the measurement result (Zm2) from the second measurement line. Thus, in step S608, based on the first measurement information (measurement result (Zm1)) and the second measurement information (measurement result (Zm2)), first distribution information (height distribution (Zt) of the surface of the substrate (1)) representing the height distribution of the measurement target area of ​​the surface of the substrate (1) is generated.

[0057] In step S610, it is determined whether the height distribution (Zt) of the surface of the substrate (1) calculated in step S608 falls within an allowable range. If the height distribution (Zt) of the surface of the substrate (1) does not fall within an allowable range, the process proceeds to step S612 and a notification is given. For example, the user is notified that the height distribution (Zt) of the surface of the substrate (1) does not fall within an allowable range by issuing a warning from the imprint device (101). On the other hand, if the height distribution (Zt) of the surface of the substrate (1) falls within an allowable range, the process proceeds to step S614 and a notification is given. For example, the user is notified that the height distribution (Zt) of the surface of the substrate (1) falls within an allowable range through the display of the imprint device (101).

[0058] In this way, according to the present embodiment, even when the amount of buoyancy of the driving unit (21) fluctuates, the effect is reduced and the height distribution of the surface of the substrate (1) can be measured with high precision.

[0059] Referring to FIG. 7, a method for verifying the height distribution of the holding support surface (11A) of a substrate holding support unit (11), including a measurement method for measuring the height distribution of the holding support surface (11A) of the substrate holding support unit (11) in the present embodiment, is described. This method is executed by the first control unit (91) collectively controlling each unit of the imprint device (101).

[0060] In step S702, a substrate (1) is introduced into the imprint device (101). More specifically, the substrate (1) is rotated to a first angle by the rotation mechanism (311) of the substrate transport unit (31), and in this state, is held and supported by the holding support surface (11A) of the substrate holding support unit (11). That is, the angle of the substrate (1) on the holding support surface (11A) of the substrate holding support unit (11) is set to the first angle. The value of the first angle is an arbitrary value. In this embodiment, the first angle is 0° as an example.

[0061] Steps S704, S706, and S708 are similar to steps S604, S606, and S608 shown in FIG. 6, respectively, so a detailed description thereof is omitted here. By going through steps S704, S706, and S708, the height distribution (Zt1) of the surface of the substrate (1) is calculated when the angle of the substrate (1) on the holding support surface (11A) of the substrate holding support unit (11) is set to the first angle.

[0062] In step S710, the substrate (1) is removed from the imprint device (101). More specifically, the substrate (1) is removed from the substrate holding support unit (11) (holding support surface (11A)) to the outside of the imprint device (101) through the substrate transport unit (31).

[0063] In step S712, a substrate (1) is introduced into the imprint device (101). More specifically, the substrate (1) is rotated to a second angle by the rotation mechanism (311) of the substrate transport unit (31), and in this state, is held and supported by the holding support surface (11A) of the substrate holding support unit (11). That is, the angle of the substrate (1) on the holding support surface (11A) of the substrate holding support unit (11) is set to the second angle. The second angle may be different from the first angle, and may be, for example, 90° or 180°. In this embodiment, the second angle is 90°. Therefore, the angle difference between the first angle and the second angle is 90° in this embodiment.

[0064] Steps S714, S716, and S718 are similar to steps S604, S606, and S608 shown in FIG. 6, respectively, so a detailed description thereof is omitted here. By going through steps S714, S716, and S718, the height distribution (Zt2) of the surface of the substrate (1) is calculated when the angle of the substrate (1) on the holding support surface (11A) of the substrate holding support unit (11) is set to a second angle.

[0065] In step S720, the height distribution (Zt) of the surface of the substrate (1) in a state of being held and supported by the substrate holding support unit (11) is calculated based on the height distribution (Zt1) of the surface of the substrate (1) calculated in step S708 and the height distribution (Zt2) of the surface of the substrate (1) calculated in S718. For example, the average of the height distribution (Zt1) of the surface of the substrate (1) and the height distribution (Zt2) of the surface of the substrate (1) can be used as the height distribution (Zt) of the surface of the substrate (1). Alternatively, either of the height distribution (Zt1) of the surface of the substrate (1) and the height distribution (Zt2) of the surface of the substrate (1) can be used as the height distribution (Zt) of the surface of the substrate (1).

[0066] In step S722, the height distribution of the surface of the substrate (1) calculated in step S708 (Zt1) and the height distribution of the surface of the substrate (1) calculated in step S718 (Zt2) are used to calculate the height distribution of the holding support surface (11A) of the substrate holding support unit (11). In this way, second distribution information representing the height distribution of the holding support surface (11A) is generated based on the first measurement information and second measurement information obtained in steps S704 and S706, respectively, and the first measurement information and second measurement information obtained in steps S714 and S716, respectively.

[0067] Here, the height distribution of the surface of the substrate (1) (the substrate itself) at the first angle is set to Zw_0, the height distribution of the surface of the substrate (1) (the substrate itself) at the second angle is set to Zw_90, and the height distribution of the holding support surface (11A) of the substrate holding support unit (11) is set to Zc. In this case, if the rotation matrix when rotated 90° around a vertical axis passing through the center of the substrate (1) is set to R_90, then the following equations (6), (7), and (8) hold:

[0068] Zt1 = Zw_0 + Zc ...(6)

[0069] Zt2 = Zw_90 + Zc ...(7)

[0070] Zw_90 = R_90 × Zw_0 ...(8)

[0071] From equations (6), (7), and (8), the height distribution (Zc) of the support surface (11A) of the substrate support unit (11) is expressed by the following equation (9). Note that in equation (9), E represents the identity matrix and R_90' represents the inverse matrix of R_90.

[0072] Zc = (E - R_90) × (Zt1 - R_90' × Zt2) ...(9)

[0073] In step S722, the height distribution of the holding support surface (11A) of the substrate holding support unit (11) is calculated by performing calculation processing using the above-described formula.

[0074] In step S724, it is determined whether the height distribution of the holding support surface (11A) of the substrate holding support unit (11) calculated in step S722 falls within an allowable range. If the height distribution of the holding support surface (11A) of the substrate holding support unit (11) does not fall within an allowable range, the process proceeds to step S726 and a notification is given. For example, by issuing a warning from the imprint device (101), the user is notified that the height distribution of the holding support surface (11A) of the substrate holding support unit (11) does not fall within an allowable range. In the imprint device (101), depending on the content of the warning, the substrate holding support unit (11) is returned to a cleaning device or replaced through the holding support unit return unit (32). Meanwhile, if the height distribution of the holding support surface (11A) of the substrate holding support unit (11) falls within an allowable range, the process proceeds to step S728 and a notification is given. For example, the user is notified through the display of the imprint device (101) that the height distribution of the holding support surface (11A) of the substrate holding support unit (11) falls within an allowable range.

[0075] In this way, according to the present embodiment, the height distribution of the holding support surface (11A) of the substrate holding support unit (11) can be measured with high precision. In particular, when the substrate holding support unit (11) is a pin chuck, the measurement method according to the present embodiment is useful because it is difficult to directly measure the height of the holding support surface (11A). In the present embodiment, it should be noted that the height distribution (Zw) of the surface of the substrate (1) (the substrate itself) can also be calculated from the above-described formula.

[0076] <Second Embodiment>

[0077] FIG. 8 is a schematic diagram illustrating the configuration of an imprint device (102) in a second embodiment of the present invention. The imprint device (102) brings an uncured imprint material supplied on a substrate into contact with a mold and applies curing energy to the imprint material to form a pattern of a cured material in which the pattern of the mold is transferred.

[0078] As shown in FIG. 8, the imprint device (102) includes a substrate holding support unit (11) and a driving unit (21). Additionally, the imprint device (102) includes a mold holding support unit (51) comprising a holding support surface (51A) for holding and supporting a mold (41), a mold driving unit (61) for driving the mold holding support unit (51) in the Z direction (height direction), and a mold transport unit (71) for transporting (loading) the mold (41) to the mold holding support unit (51). The imprint device (102) further includes a second measurement unit (82) and a second control unit (92).

[0079] In this embodiment, the mold holding support unit (51) holds and supports the mold (41) by vacuum adsorbing the mold (41). The mold (41) can maintain its loading position by being vacuum adsorbed by the mold holding support unit (51). Note that the mold holding support unit (51) can hold and support the mold (41) by an electrostatic method or by physically restraining the end surface of the mold (41).

[0080] The mold conveying unit (71) includes a rotation mechanism (711) that rotates the mold (41) around a vertical axis (i.e., rotates the mold (41) by a predetermined angle) when conveying the mold (41) to the mold holding support unit (51). For example, the rotation mechanism (711) can be realized by rotating a link mechanism of a plurality of robot hands or by rotating the robot hands themselves. In addition to the function of conveying the mold (41), the mold conveying unit (71) may have a function of cleaning the mold holding support unit (51), more specifically, the holding support surface (51A) of the mold holding support unit (51).

[0081] The second measuring unit (82) is provided to the driving unit (21) and has the function of measuring the distance to the mold (41) held and supported by the mold holding support unit (51) (the distance between the second measuring unit (82) and the pattern surface (41A) of the mold (41). By driving (scanning) the driving unit (21) provided with the second measuring unit (82) in a horizontal direction and measuring the distance to the pattern surface (41A) of the mold (41) by the second measuring unit (82), the height distribution of the pattern surface (41A) of the mold (41) can be obtained. As the second measuring unit (82), a laser displacement meter, a spectroscopic interferometer, etc. are used, but the second measuring unit (82) is not limited to these, and any measuring instrument capable of measuring the distance to the pattern surface (41A) of the mold (41) with high precision (accurate) without contact can be used.

[0082] The second control unit (92) is formed by an information processing device (computer) including a CPU, memory, etc., and controls each unit of the imprint device (102) according to a program stored in a storage unit. For example, the second control unit (92) controls an imprint process that forms a pattern of an imprint material on a substrate using a mold. In addition, in this embodiment, the second control unit (92) has the function of processing measurement results measured by the second measurement unit (82).

[0083] FIGS. 9A and 9B are drawings for explaining a measurement method for measuring the height distribution of the pattern surface (41A) of the mold (41) in the present embodiment. In FIGS. 9A and 9B, the pattern surface (41A) of the mold (41) is the measurement target area. FIG. 9A shows a plurality of first measurement points set on each of a plurality of first measurement lines that are different from each other and parallel to the Y direction (first direction). FIG. 9B shows a plurality of second measurement points set on a single second measurement line that is parallel to the X direction (second direction) which is orthogonal to the Y direction. In the present embodiment, for each of the plurality of first measurement lines, a plurality of first measurement points and a plurality of second measurement points are set such that one of the plurality of first measurement points overlaps with one of the plurality of second measurement points.

[0084] Referring to FIG. 9a, in this embodiment, for each of a plurality of first measurement lines, a driving unit (21) drives a second measurement unit (82) in the Y direction relative to the mold (41) and measures the distance to each measurement point (each of the first measurement points) using the second measurement unit (82). Similarly, referring to FIG. 9b, in this embodiment, for one second measurement line, a driving unit (21) drives a second measurement unit (82) in the X direction relative to the mold (41) and measures the distance to each measurement point (each of the second measurement points) using the second measurement unit (82). In this embodiment, it is assumed that measurement is performed on a plurality of first measurement points (Fig. 9a) set on each of a plurality of first measurement lines, and then on a plurality of second measurement points (Fig. 9b) set on a second measurement line. However, measurement can be performed on a plurality of second measurement points set on a second measurement line, and then on a plurality of first measurement points set on each of a plurality of first measurement lines.

[0085] It should be noted that in FIGS. 9a and 9b, the first direction is the Y direction and the second direction is the X direction, but the present invention is not limited thereto. For example, the first direction may be the X direction and the second direction may be the Y direction, or the first direction may be the diagonal direction and the second direction may be a direction orthogonal to the diagonal direction. Additionally, the second direction is set to be a direction orthogonal to the first direction, but the present invention is not limited thereto, and the second direction may be any direction that intersects all of the plurality of first measurement lines.

[0086] As shown in FIG. 9a, the measurement result in the first measurement line (distance to the pattern surface (41A) (first measurement point) of the mold (41)) obtained by the driving unit (21) driving the second measurement unit (82) in the Y direction and measuring each first measurement point by the second measurement unit (82) is set to Tm1. Additionally, as shown in FIG. 9b, the measurement result in the second measurement line (distance to the pattern surface (41A) (second measurement point) of the mold (41)) obtained by the driving unit (21) driving the second measurement unit (82) in the X direction and measuring each second measurement point by the second measurement unit (82) is set to Tm2.

[0087] As in the first embodiment, for the measurement result (Tm1) from one first measurement line, the measurement time is short and the variation in the amount of buoyancy (Zs) of the driving unit (21) is sufficiently small, so the variation in the amount of buoyancy (Zs) of the driving unit (21) can be ignored. Similarly, for the measurement result (Zm2) from the second measurement line, since there is only one second measurement line, the variation in the amount of buoyancy (Zs) of the driving unit (21) can be ignored. Therefore, for example, at Y=0, the measurement result (Tm1(x, 0)) from the first measurement line and the measurement result (Tm2(x, 0)) from the second measurement line must match because they measure the same measurement point (part) on the pattern surface of the mold (41).

[0088] Accordingly, in this embodiment, at Y=0, the measurement result (Tm1(x, 0)) in the first measurement line is corrected so that it becomes identical (matches) with the measurement result (Tm2(x, 0)) in the second measurement line. That is, the measurement result (Tm1(x, 0)) in the first measurement line is corrected by using the measurement result (Tm2(x, 0)) in the second measurement line as a reference. In this case, the height distribution (Tt) of the pattern surface (41A) of the mold (41) in a state of being held and supported by the mold holding and supporting unit (51) is expressed by the following equation (10):

[0089] Tt(x, y) ≒ Tm1(x, y) - Tm1(x, 0) + Tm2(x, 0) ...(10)

[0090] In this embodiment, the measurement result at Y=0, more specifically the measurement result at the first measurement line (Tm1(x, 0)) and the measurement result at the second measurement line (Tm2(x, 0)), are used, but the present invention is not limited thereto. For example, as long as one of the plurality of first measurement points set on each first measurement line overlaps with one of the plurality of second measurement points set on the second measurement line, the measurement point used is not limited to Y=0.

[0091] Referring to FIG. 10, a method for verifying the height distribution of the pattern surface (41A) of a mold (41), including a measurement method for measuring the height distribution of the pattern surface (41A) of the mold (41) in the present embodiment, is described. This method is executed by the second control unit (92) collectively controlling each unit of the imprint device (102).

[0092] In step S1002, a mold (41) is introduced into the imprint device (102). More specifically, the mold (41) is introduced into the imprint device (102) through a mold transport unit (71), and the mold (41) is held and supported by the holding support surface (51A) of the mold holding support unit (51). The types of molds (41) include, in addition to molds with a pattern surface formed inside, molds without a pattern surface formed inside, for example, molds having a concave structure on the surface side of the mold to be held and supported.

[0093] In step S1004, the driving unit (21) drives the second measuring unit (82) in the Y direction relative to the mold (41), and the distance to each measuring point for each of the plurality of first measuring lines is measured by the second measuring unit (82), thereby obtaining the measurement result (Tm1) in the first measuring line. In this way, while driving the second measuring unit (82) in the first direction (Y direction) relative to the mold (41), each of the plurality of first measuring lines that are parallel to the first direction and different from each other is measured by the second measuring unit (82). Through this operation, first measurement information (measurement result (Tm1)) indicating the height of the pattern surface (41A) of the mold (41) at each of the plurality of first measuring lines is obtained.

[0094] In step S1006, the driving unit (21) drives the second measuring unit (82) in the X direction relative to the mold (41), and the distance to each measuring point for one second measuring line is measured by the second measuring unit (82), thereby obtaining the measurement result (Tm2) in the second measuring line. In this way, while driving the second measuring unit (82) in the second direction (X direction) relative to the mold (41), one second measuring line parallel to the second direction is measured by the second measuring unit (82). Through this operation, second measuring information (measurement result (Tm2)) indicating the height of the pattern surface (41A) of the mold (41) in the second measuring line is obtained.

[0095] In step S1008, the height distribution (Tt) of the pattern surface (41A) of the mold (41) held and supported by the mold holding support unit (51) is calculated based on the measurement result (Tm1) from the first measurement line obtained in step S1004 and the measurement result (Tm2) from the second measurement line obtained in step S1006. More specifically, as described above, the height distribution (Tt) of the pattern surface (41A) of the mold (41) is calculated by correcting the measurement result (Tm1) from the first measurement line so that the measurement result (Tm1) from the first measurement line matches the measurement result (Tm2) from the second measurement line. In this way, in step S1008, based on the first measurement information (measurement result (Tm1)) and the second measurement information (measurement result (Tm2)), distribution information (height distribution of the pattern surface (41A) of the mold (41)) representing the height distribution of the pattern surface (41A) of the mold (41) is generated.

[0096] In step S1010, it is determined whether the height distribution (Tt) of the pattern surface (41A) of the mold (41) calculated in step S1008 falls within the allowable range. If the height distribution (Tt) of the pattern surface (41A) of the mold (41) does not fall within the allowable range, the process proceeds to step S1012 and a notification is given. For example, the user is notified that the height distribution (Tt) of the pattern surface (41A) of the mold (41) does not fall within the allowable range by issuing a warning from the imprint device (102). On the other hand, if the height distribution (Tt) of the pattern surface (41A) of the mold (41) falls within the allowable range, the process proceeds to step S1014 and a notification is given. For example, the user is notified that the height distribution (Tt) of the pattern surface (41A) of the mold (41) falls within the allowable range through the display of the imprint device (102).

[0097] In this way, according to the present embodiment, even when the amount of buoyancy of the driving unit (21) fluctuates, the effect is reduced and the height distribution of the pattern surface (41A) of the mold (41) can be measured with high precision.

[0098] With reference to FIG. 11, a method for verifying the height distribution of the holding support surface (51A) of a mold holding support unit (51) in this embodiment is described, which includes a measurement method for measuring the height distribution of the holding support surface (51A) of the mold holding support unit (51) in this embodiment. This method is executed by the second control unit (92) collectively controlling each unit of the imprint device (102).

[0099] In step S1102, a mold (41) is introduced into the imprint device (102). More specifically, the mold (41) is rotated to a first angle by the rotation mechanism (711) of the mold transport unit (71), and in this state, is held and supported by the holding support surface (51A) of the mold holding support unit (51). That is, the angle of the mold (41) on the holding support surface (51A) of the mold holding support unit (51) is set to the first angle. The first angle is limited by the structure of the mold holding support unit (51) and the mold driving unit (61), and is generally 0°, 90°, 180°, or 270°. In this embodiment, the first angle is 0° as an example.

[0100] Steps S1104, S1106, and S1108 are similar to steps S1004, S1006, and S1008 shown in FIG. 10, respectively, so a detailed description thereof is omitted here. By going through steps S1104, S1106, and S1108, the height distribution (Tt1) of the pattern surface (41A) of the mold (41) is calculated when the angle of the mold (41) on the holding support surface (51A) of the mold holding support unit (51) is set to the first angle.

[0101] In step S1110, the mold (41) is removed from the imprint device (102). More specifically, the mold (41) is removed from the mold holding support unit (51) (holding support surface (51A)) to the outside of the imprint device (102) through the mold return unit (71).

[0102] In step S1112, a mold (41) is introduced into the imprint device (102). More specifically, the mold (41) is rotated to a second angle by the rotation mechanism (711) of the mold transport unit (71), and in that state, is held and supported by the holding support surface (51A) of the mold holding support unit (51). That is, the angle of the mold (41) on the holding support surface (51A) of the mold holding support unit (51) is set to the second angle. The second angle only needs to be different from the first angle. In this embodiment, the second angle is 90° as an example. Therefore, the angle difference between the first angle and the second angle is 90° in this embodiment.

[0103] Steps S1114, S1116, and S1118 are similar to steps S1004, S1006, and S1008 shown in FIG. 10, respectively, so a detailed description thereof is omitted here. By going through steps S1114, S1116, and S1118, the height distribution (Tt2) of the pattern surface (41A) of the mold (41) is calculated when the angle of the mold (41) on the holding support surface (51A) of the mold holding support unit (51) is set to a second angle.

[0104] In step S1120, the height distribution (Tt) of the pattern surface (41A) of the mold (41) in a state of being held and supported by the mold holding support unit (51) is calculated based on the height distribution (Tt1) of the pattern surface (41A) of the mold (41) calculated in step S1108 and the height distribution (Tt2) of the pattern surface (41A) of the mold (41) calculated in step S1118. For example, the average of the height distribution (Tt1) of the pattern surface (41A) of the mold (41) and the height distribution (Tt2) of the pattern surface (41A) of the mold (41) can be used as the height distribution (Tt) of the pattern surface (41A) of the mold (41). Alternatively, either of the height distribution (Tt1) of the pattern surface (41A) of the mold (41) and the height distribution (Tt2) of the pattern surface (41A) of the mold (41) can be used as the height distribution (Tt) of the pattern surface (41A) of the mold (41).

[0105] In step S1122, the height distribution of the support surface (51A) of the mold (41) is calculated based on the height distribution (Tt1) of the pattern surface (41A) of the mold (41) calculated in step S1108 and the height distribution (Tt2) of the pattern surface (41A) of the mold (41) calculated in step S1118. In this way, distribution information representing the height distribution of the support surface (51A) is generated based on the first measurement information and the second measurement information obtained in steps S1104 and S1106, respectively, and the first measurement information and the second measurement information obtained in steps S1114 and S1116, respectively.

[0106] Here, the height distribution of the pattern surface (41A) (pattern surface itself) of the mold (41) at the first angle is set to Tw_0, the height distribution of the pattern surface (41A) (pattern surface itself) of the mold (41) at the second angle is set to Tw_90, and the height distribution of the holding support surface (51A) of the mold holding support unit (51) is set to Tc. In this case, if the rotation matrix when rotated 90° around a vertical axis passing through the center of the pattern surface (41A) of the mold (41) is set to R_90, then the following equations (11), (12), and (13) hold:

[0107] Tt1 = Tm_0 + Tc ...(11)

[0108] Tt2 = Tm_90 + Tc ...(12)

[0109] Tw_90 = R_90 × Tm_0 ...(13)

[0110] From equations (11), (12), and (13), the height distribution (Tc) of the holding support surface (51A) of the mold holding support unit (51) is expressed by the following equation (14). Note that in equation (14), E represents the identity matrix and R_90' represents the inverse matrix of R_90.

[0111] Tc = (E - R_90) × (Tt1 - R_90' × Tt2) ...(14)

[0112] In step S1122, the height distribution (Tc) of the holding support surface (51A) of the mold holding support unit (51) is calculated by performing calculation processing using the above-described formula.

[0113] In step S1124, it is determined whether the height distribution of the holding support surface (51A) of the mold holding support unit (51) calculated in step S1122 falls within an allowable range. If the height distribution of the holding support surface (51A) of the mold holding support unit (51) does not fall within an allowable range, the process proceeds to step S1126 and a notification is given. For example, by issuing a warning from the imprint device (102), the user is notified that the height distribution of the holding support surface (51A) of the mold holding support unit (51) does not fall within an allowable range. Depending on the content of the warning, the imprint device (102) may perform cleaning on the holding support surface (51A) of the mold holding support unit (51) through the mold return unit (71). Meanwhile, if the height distribution of the holding support surface (51A) of the mold holding support unit (51) falls within the allowable range, the process proceeds to step S1128 and a notification is given. For example, the user is notified through the display of the imprint device (102) that the height distribution of the holding support surface (51A) of the mold holding support unit (51) falls within the allowable range.

[0114] In this way, according to the present embodiment, the height distribution of the holding support surface (51A) of the mold holding support unit (51) can be measured with high precision. In the present embodiment, it should be noted that the height distribution (Tw) of the pattern surface (41A) (pattern surface itself) of the mold (41) can also be calculated from the above-described formula.

[0115] <Third Embodiment>

[0116] FIG. 12 is a schematic diagram illustrating the configuration of an imprint device (103) in a third embodiment of the present invention. The imprint device (103) contacts an uncured imprint material supplied on a substrate with a mold and applies curing energy to the imprint material to form a pattern of a cured material in which the pattern of the mold is transferred.

[0117] As shown in FIG. 12, the imprint device (103) includes a substrate holding support unit (11), a driving unit (21), a substrate transport unit (31), a holding support unit transport unit (32), a mold holding support unit (51), a mold driving unit (61), and a mold transport unit (71). Additionally, the imprint device (103) includes a first measurement unit (81), a second measurement unit (82), a first control unit (91), a second control unit (92), and a main control unit (93).

[0118] The main control unit (93) is formed by an information processing device (computer) including a CPU, memory, etc., and controls each unit of the imprint device (103) in cooperation with the first control unit (91) and the second control unit (92) or independently according to a program stored in a storage unit. The main control unit (93) controls an imprint process that forms a pattern of imprint material on a substrate using a mold. For example, the main control unit (93) controls the orientation of at least one of the mold (41) and the substrate (1) so that the pattern surface (41A) of the mold (41) and the surface of the substrate (1) become parallel to each other, based on the height distribution of the surface of the substrate (1) and the height distribution of the pattern surface (41A) of the mold (41). The orientation of the mold (41) and the orientation of the substrate (1) can be controlled through a mold driving unit (61) that drives the mold (41) and a driving unit (21) that drives the substrate (1), respectively. In addition, it is noted that it is also possible to control at least one position of the mold (41) and the substrate (1) by the first control unit (91) and the second control unit (92).

[0119] A series of operations in the imprint device (103), namely the imprint process, will be described. First, a mold (41) is introduced into the imprint device (103) through the mold transport unit (71), and the mold (41) is held and supported by the holding support surface (51A) of the mold holding support unit (51). Next, the height distribution of the pattern surface (41A) of the mold (41) is measured using the measurement method described in the second embodiment.

[0120] When the measurement of the height distribution of the pattern surface (41A) of the mold (41) is completed, the substrate (1) is brought into the imprint device (103) through the substrate transport unit (31), and the substrate (1) is held and supported by the holding support surface (11A) of the substrate holding support unit (11). Subsequently, the height distribution of the surface of the substrate (1) is measured using the measurement method described in the first embodiment. It should be noted that regarding the measurement of the height distribution of the surface of the substrate (1), the measurement method can be changed between the first substrate included in the lot and the second and subsequent substrates. For example, for the first substrate, the height distribution of the surface of the substrate (1) is measured with high precision using the measurement method described in the first embodiment. Then, for the second and subsequent substrates, only a few representative points are measured, and the height distribution of each of the second and subsequent substrates is obtained by performing interpolation using the height distribution of the surface of the first substrate.

[0121] When the measurement of the height distribution on the surface of the substrate (1) is completed, the driving unit (21) that holds and supports the substrate holding support unit (11) is driven so that the substrate (1) (the shot area) faces the pattern surface (41A) of the mold (41) (the substrate (1) is located directly below the mold (41)). For example, the imprint material can be supplied to the substrate (1) in advance using a coater developer provided outside the imprint device (103), or the imprint material can be supplied using a dispenser (not shown) provided in the imprint device (103).

[0122] After positioning the substrate (1) toward the pattern surface (41A) of the mold (41), the imprint material on the substrate is brought into contact with the pattern surface (41A) of the mold (41) to form the imprint material on the substrate using the mold (41). At this time, as described above, based on the height distribution of the surface of the substrate (1) and the height distribution of the pattern surface (41A) of the mold (41), the orientation of at least one of the mold (41) and the substrate (1) is controlled so that the pattern surface (41A) of the mold (41) and the surface of the substrate (1) become parallel to each other. Note that the amount of orientation control (inclination amount) of each of the mold (41) and the substrate (1) required to make the pattern surface (41A) of the mold (41) and the surface of the substrate (1) parallel to each other is different for each shot area of ​​the substrate (1).

[0123] After bringing the imprint material on the substrate into contact with the pattern surface (41A) of the mold (41), light such as ultraviolet light is irradiated onto the imprint material on the substrate through the mold (41) to cure the imprint material. Then, by separating the mold (41) from the cured imprint material on the substrate, a pattern of the imprint material on the substrate is formed.

[0124] After performing this imprint processing on all shot areas of the substrate (1), the substrate (1) is removed from the substrate holding support unit (11) (holding support surface (11A)) to the outside of the imprint device (103) through the substrate return unit (31).

[0125] Referring to FIG. 13, a method for replacing the substrate holding support unit (11) of the imprint device (103) is described. In the substrate holding support unit (11), foreign matter may adhere to the holding support surface (11A) or wear (scratching) may occur as the imprint process is repeated. Therefore, regarding the substrate holding support unit (11), it is desirable to periodically measure the height distribution of the holding support surface (11A) to determine whether to replace the substrate holding support unit (11).

[0126] First, in steps S1302, S1304, S1306, S1308, S1310, S1312, S1314, S1316, S1318, and S1320, the height distribution of the holding support surface (11A) of the substrate holding support unit (11) is calculated. Since steps S1302, S1304, S1306, S1308, S1310, S1312, S1314, S1316, S1318, and S1320 are similar to steps S704, S706, S708, S710, S712, S714, S716, S718, and S722 shown in FIG. 7, a detailed description thereof is omitted here.

[0127] In step S1322, it is determined whether the height distribution of the holding support surface (11A) of the substrate holding support unit (11) calculated in step S1320 falls within an allowable range. If the height distribution of the holding support surface (11A) of the substrate holding support unit (11) does not fall within an allowable range, the process proceeds to step S1324. On the other hand, if the height distribution of the holding support surface (11A) of the substrate holding support unit (11) falls within an allowable range, the process proceeds to step S1346.

[0128] In step S1324, the substrate holding support unit (11) is replaced. More specifically, the substrate holding support unit (11) whose height distribution of the holding support surface (11A) does not fall within the allowable range is removed from the driving unit (21) to the outside of the imprint device (103) via the holding support unit return unit (32), and a new substrate holding support unit (11) is held by the driving unit (21). Note that the substrate holding support unit (11) that needs to be replaced may be limited to those that cannot be expected to be restored even by cleaning, etc.

[0129] In steps S1326, S1328, S1330, S1332, S1334, S1336, S1338, S1340, S1342, and S1344, the height distribution of the holding support surface (11A) of the new substrate holding support unit (11) is calculated. Since steps S1326, S1328, S1330, S1332, S1334, S1336, S1338, S1340, S1342, and S1344 are similar to steps S704, S706, S708, S710, S712, S714, S716, S718, and S722 shown in FIG. 7, a detailed description thereof is omitted here.

[0130] In step S1346, when using a new substrate holding support unit (11), the attitude control amount (tilt amount) of each of the mold (41) and the substrate (1) required to make the pattern surface (41A) of the mold (41) and the surface of the substrate (1) parallel to each other is determined. More specifically, the height distribution of the holding support surface (11A) of the substrate holding support unit (11) calculated in step S1320 is compared with the height distribution of the holding support surface (11A) of the new substrate holding support unit (11) calculated in step S1344, and the difference is reflected in the previous control amount.

[0131] <Fourth Embodiment>

[0132] The pattern of the cured product formed using an imprint device (101, 102, or 103) is used permanently on at least a part of various articles or temporarily when manufacturing various articles. The articles are electrical circuit elements, optical elements, MEMS, recording elements, sensors, molds, etc. Examples of electrical circuit elements are volatile and non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor devices such as LSI, CCD, image sensors, and FPGAs. Examples of molds are imprint molds.

[0133] The pattern of the cured product is used as is as a component of at least part of the above-described article or is used temporarily as a resist mask. After etching or ion implantation is performed during the substrate processing step, the resist mask is removed.

[0134] Next, a specific manufacturing method of the article is described. As shown in FIG. 14a, a substrate such as a silicon wafer is prepared, on which a workpiece such as an insulator is formed on the surface. Subsequently, an imprint material is applied to the surface of the workpiece by an inkjet method or the like. Here, the state in which the imprint material is applied to the substrate as a plurality of droplets is shown.

[0135] As shown in FIG. 14b, the side of the imprint mold on which the protrusions and groove patterns are formed is oriented toward the imprint material on the substrate. As shown in FIG. 14c, the substrate to which the imprint material is applied is brought into contact with the mold, and pressure is applied. The imprint material fills the gap between the mold and the workpiece. In this state, when light as curing energy is irradiated onto the imprint material through the mold, the imprint material is cured.

[0136] As shown in FIG. 14d, after curing the imprint material, the mold is separated from the substrate. Thus, a pattern of the cured imprint material is formed on the substrate. In the pattern of the cured material, the grooves of the mold correspond to the protrusions of the cured material, and the protrusions of the mold correspond to the grooves of the cured material. That is, the protrusion and groove patterns of the mold are transferred to the imprint material.

[0137] As shown in FIG. 14e, when etching is performed using the pattern of the cured material as an etching mask, the portion of the surface of the workpiece where the cured material is absent or thinly remaining is removed to form a groove. As shown in FIG. 14f, when the pattern of the cured material is removed, an article with a groove formed on the surface of the workpiece can be obtained. Here, the pattern of the cured material is removed, but the pattern is not removed even after processing and can be used as an insulating film between layers, such as in semiconductor devices, for example, i.e., as a constituent member of an article.

[0138] The present invention is not limited to the above embodiments, and various changes and modifications may be made within the spirit and scope of the invention. Accordingly, the following claims are formulated to disclose the scope of the invention to the public.

[0139] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims should be interpreted in the broadest sense to include structures and functions equivalent to all such variations.

Claims

Claim 1 A measurement method comprising: a step of acquiring first measurement information representing the height of the measurement target area on each of the first measurement lines by measuring each of the plurality of first measurement lines parallel to the first direction and distinct from each other by means of a driving unit configured to drive a holding support unit, which includes a holding support surface configured to hold and support a substrate, in a floating state; a step of acquiring second measurement information representing the height of the measurement target area on the second measurement line by driving the measurement target area by means of the driving unit in a second direction intersecting all of the plurality of first measurement lines relative to the measurement unit, by measuring one second measurement line parallel to the second direction by means of the measurement unit; and a step of generating first distribution information representing the height distribution of the measurement target area based on the first measurement information and the second measurement information, wherein the first measurement information is acquired in a state in which the substrate is rotated around the vertical axis of the substrate such that the angle of the substrate on the holding support surface is set to a first angle, and the first measurement information acquired in the step of acquiring the second measurement information A measurement method further comprising the steps of: acquiring the first measurement information while the substrate is rotated around the vertical axis of the substrate such that the angle of the substrate on the holding support surface is set to a second angle different from the first angle, and generating second distribution information representing the height distribution of the holding support surface based on the first measurement information and the second measurement information acquired in the step of acquiring the second measurement information. Claim 2 A measurement method according to claim 1, wherein a plurality of first measurement points to be measured by the measurement unit are set in each of the plurality of first measurement lines, and a plurality of second measurement points to be measured by the measurement unit are set in the second measurement line, and for each of the plurality of first measurement lines, the plurality of first measurement points and the plurality of second measurement points are set such that one of the plurality of first measurement points overlaps with one of the plurality of second measurement points. Claim 3 A measurement method according to claim 1, wherein the first direction and the second direction are orthogonal to each other. Claim 4 A measurement method according to paragraph 3, wherein the driving unit comprises two guides parallel to two mutually orthogonal directions, the first direction is a direction parallel to one of the two guides, and the second direction is a direction parallel to the other of the two guides. Claim 5 A measurement method according to claim 1, wherein, in the step of generating the first distribution information, the first distribution information is used as a reference to correct the first measurement information. Claim 6 delete Claim 7 A measurement method according to claim 1, wherein the angle difference between the first angle and the second angle is one of 90° and 180°. Claim 8 A measurement method according to claim 1, wherein the measurement target area is the entire area of ​​the surface of the substrate. Claim 9 A measurement method according to claim 1, wherein the measurement target area is a partial area of ​​the surface of the substrate. Claim 10 A measurement method comprising: a step of acquiring first measurement information representing the height of the pattern surface of the mold at each of the first measurement lines by measuring each of a plurality of first measurement lines that are parallel to the first direction and are different from each other by a driving unit configured to drive a holding support unit that holds and supports the measurement unit in a floating state; a step of acquiring second measurement information representing the height of the pattern surface of the mold at the second measurement line by measuring one second measurement line parallel to the second direction by the measurement unit while driving the measurement unit by the driving unit in a second direction that intersects all of the plurality of first measurement lines with respect to the pattern surface of the mold by a driving unit; and a step of generating first distribution information representing the height distribution of the pattern surface of the mold based on the first measurement information and the second measurement information, wherein the first measurement information is acquired in a state in which the mold is rotated around the vertical axis of the mold such that the angle of the mold at the holding support surface configured to hold and support the mold is set to a first angle, and the second A measurement method further comprising the step of acquiring the first measurement information and the second measurement information acquired in the step of acquiring measurement information, and the step of acquiring the first measurement information while the mold is rotated around the vertical axis of the mold such that the angle of the mold on the holding support surface is set to a second angle different from the first angle, and the step of generating second distribution information representing the height distribution of the holding support surface based on the first measurement information and the second measurement information acquired in the step of acquiring the second measurement information. Claim 11 A measurement method according to claim 10, wherein a plurality of first measurement points to be measured by the measurement unit are set in each of the plurality of first measurement lines, a plurality of second measurement points to be measured by the measurement unit are set in each of the second measurement lines, and for each of the plurality of first measurement lines, the plurality of first measurement points and the plurality of second measurement points are set such that one of the plurality of first measurement points overlaps with one of the plurality of second measurement points. Claim 12 In item 10, the above first direction and the above second direction are orthogonal to each other in the measurement method. Claim 13 A measurement method according to claim 12, wherein the driving unit comprises two guides parallel to two mutually orthogonal directions, the first direction is a direction parallel to one of the two guides, and the second direction is a direction parallel to the other of the two guides. Claim 14 In claim 10, a measurement method is generated by using the first distribution information as a reference to correct the first measurement information in the step of generating the first distribution information. Claim 15 delete Claim 16 A measurement method according to claim 10, wherein the angle difference between the first angle and the second angle is one of 90° and 180°. Claim 17 In item 10, the above first distribution information is a measurement method representing the height distribution of the entire area of ​​the pattern surface of the mold. Claim 18 A measurement method comprising: a step of acquiring first measurement information representing the height of the measurement target area on each of the first measurement lines by measuring each of a plurality of first measurement lines parallel to the first direction and distinct from each other by means of a driving unit configured to drive a holding support unit, which includes a holding support surface configured to hold and support a substrate, in a floating state; a step of acquiring second measurement information representing the height of the measurement target area on the second measurement line by measuring a single second measurement line parallel to the second direction by means of the driving unit, while driving the measurement target area by means of the driving unit in a second direction intersecting all of the plurality of first measurement lines relative to the measurement unit; and a step of acquiring the first measurement information and the second measurement information acquired in the step of acquiring the second measurement information, wherein the angle of the substrate on the holding support surface is set to a first angle and the angle of the substrate on the holding support surface is set to a second angle different from the first angle. A measurement method comprising the steps of acquiring the first measurement information and generating distribution information representing the height distribution of the retaining support surface based on the first measurement information and the second measurement information acquired in the step of acquiring the second measurement information, wherein the substrate is rotated around the vertical axis of the substrate to be set. Claim 19 An imprint device for forming a pattern of imprint material on a substrate using a mold, wherein the device comprises: a holding support unit including a holding support surface configured to hold and support the substrate; a driving unit configured to drive the holding support unit in a floating state; and a measuring unit configured to measure the height of the substrate held and supported by the holding support surface.The control unit is configured to perform a process for controlling the orientation of at least one of the mold and the substrate so that the pattern surface of the mold and the surface of the substrate become parallel to each other, wherein the process comprises: a step of acquiring first measurement information representing the height of the measurement target area at each of the first measurement lines by measuring each of a plurality of first measurement lines that are parallel to the first direction and are different from each other by the measurement unit while driving the measurement target area of ​​the surface of the substrate by the driving unit in a first direction relative to the measurement unit; a step of acquiring second measurement information representing the height of the measurement target area at the second measurement line by measuring one second measurement line parallel to the second direction by the measurement unit while driving the measurement target area by the driving unit in a second direction that intersects all of the plurality of first measurement lines relative to the measurement unit; and a step of generating distribution information representing the height distribution of the measurement target area based on the first measurement information and the second measurement information, wherein the substrate is rotated around the vertical axis of the substrate so that the angle of the substrate on the holding support surface is set to a first angle, and each An imprint device comprising the steps of: acquiring first measurement information and acquiring second measurement information; generating distribution information representing the height distribution of a holding support surface based on the first measurement information and second measurement information acquired in the step of acquiring second measurement information, wherein the first measurement information and second measurement information are acquired in a state in which the substrate is rotated around the vertical axis of the substrate such that the angle of the substrate on the holding support surface is set to a second angle different from the first angle; and acquiring the first measurement information and second measurement information acquired in the step of acquiring second measurement information. Claim 20 An imprint device for forming a pattern of an imprint material on a substrate using a mold, wherein the device comprises: a holding support unit including a holding support surface configured to hold and support the substrate; a driving unit configured to drive the holding support unit in a floating state; and a measuring unit provided to the driving unit and configured to measure the height of the pattern surface of the mold.The apparatus includes a control unit configured to perform a process for controlling the posture of at least one of the mold and the substrate such that the pattern surface of the mold and the surface of the substrate become parallel to each other, wherein the process comprises: a step of obtaining first measurement information indicating the height of the pattern surface of the mold at each of the first measurement lines by measuring each of a plurality of first measurement lines that are parallel to the first direction and are different from each other by the measurement unit while driving the measurement unit in a first direction with respect to the pattern surface of the mold by the driving unit; a step of obtaining second measurement information indicating the height of the pattern surface of the mold at the second measurement line by measuring one second measurement line parallel to the second direction by the measurement unit while driving the measurement unit in a second direction that intersects all of the plurality of first measurement lines with respect to the pattern surface of the mold by the driving unit; and a step of generating distribution information indicating the height distribution of the pattern surface of the mold based on the first measurement information and the second measurement information, wherein the angle of the mold at a holding support surface configured to hold and support the mold is set to a first angle. An imprint device further comprising the step of acquiring the first measurement information and the second measurement information acquired in the step of acquiring the second measurement information while the mold is rotated around the vertical axis of the mold, wherein the first measurement information and the second measurement information are acquired in the step of acquiring the first measurement information and the second measurement information respectively while the mold is rotated around the vertical axis of the mold such that the angle of the mold on the holding support surface is set to a second angle different from the first angle, and wherein the first measurement information and the second measurement information are acquired in the step of acquiring the second measurement information respectively. Claim 21 A method for manufacturing an article, comprising the steps of: forming a pattern on a substrate using an imprint device specified in claim 19; processing the substrate on which the pattern is formed in the forming step; and manufacturing an article from the processed substrate. Claim 22 A method for manufacturing an article, comprising the steps of: forming a pattern on a substrate using an imprint device specified in claim 20; processing the substrate on which the pattern is formed in the forming step; and manufacturing an article from the processed substrate.

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