Apparatus of picking and transferring semiconductor packages

Abstract

The present invention relates to a picker device for a semiconductor package, comprising: a frame; a plurality of unit picker bodies arranged spaced apart in the transverse direction, each having a suction part installed to be movable in the vertical direction with respect to the frame and having a suction pressure applied to the lower end; a vertical movement drive unit that moves the plurality of unit picker bodies independently in the vertical direction with respect to the frame; a rotation drive unit that rotates the plurality of unit picker bodies collectively with respect to the frame; and a movement drive unit that moves the frame; thereby providing a picker device for a semiconductor package that picks up a semiconductor package generated by cutting a wafer, moves it to a deposition position, rotates it by an accurate rotation angle, and accurately places it at the deposition position.

Description

Technology Field

[0001] The present invention relates to a picker device for a semiconductor package, and more specifically, to a picker device for a semiconductor package in which a plurality of unit pickers pick up a semiconductor package without damage and accurately transfer it to a predetermined position. Background Technology

[0003] Recently, electronic devices are evolving to incorporate various semiconductor packages capable of simultaneously implementing diverse functions. For example, mobile phones implement various functions such as GPS, communication, and computational processing, and to achieve this, they are equipped with various types of semiconductor packages.

[0004] Here, semiconductor packages mounted on electronic devices generate electromagnetic waves while implementing their respective functions. However, since electromagnetic waves generated from one semiconductor package affect other semiconductor packages, they impair the reliability of implementing the respective functions of the semiconductor packages.

[0005] To prevent this, a process is performed to cover the surface of the manufactured semiconductor package with an EMI shield that blocks electromagnetic waves. Generally, multiple semiconductor packages are manufactured from a single wafer, the wafer is sawed to create multiple semiconductor packages, and the resulting packages are moved to a predetermined location, and an EMI shield is applied to the surface of the semiconductor package, excluding the bottom surface.

[0006] During the above process, a semiconductor package picker device is used to move the semiconductor package generated by cutting the wafer to a predetermined deposition position. However, there is a difference in that the position in which the semiconductor package must be placed for shielding film deposition is rotated by a predetermined angle compared to the position of the semiconductor package generated by cutting the wafer.

[0007] However, in conventional semiconductor package picker devices, deviations in the rotation angle of the semiconductor packages occurred during the process of cutting the wafer to move the generated semiconductor packages to the deposition location and rotating them by a predetermined angle to mount them, thereby hindering the process. Therefore, there is an urgent need for a method to pick up the semiconductor packages, move them, rotate them by a precise angle, and accurately mount them at the deposition location. The problem to be solved

[0009] To solve the above-mentioned problems, the present invention aims to provide a semiconductor package picker device that picks up a semiconductor package generated by cutting a wafer, moves it to a deposition location, rotates it by an accurate rotation angle, and accurately mounts it at the deposition location.

[0010] In addition, the present invention aims to accurately place a semiconductor package, which is held in the suction part of a unit picker, at a predetermined height at a deposition location, thereby accurately seating the semiconductor package at a predetermined location without distortion. means of solving the problem

[0012] To achieve the objectives of the present invention as described above, the present invention provides a picker device for a semiconductor package, comprising: a frame; a plurality of unit picker bodies arranged spaced apart in the transverse direction, each having a suction part installed to be movable in the vertical direction with respect to the frame and having a suction pressure applied to the lower end; a vertical movement drive unit that moves the plurality of unit picker bodies in the vertical direction independently of each other with respect to the frame; a rotation drive unit that rotates the plurality of unit picker bodies collectively with respect to the frame; and a movement drive unit that moves the frame.

[0013] Here, it may be configured to additionally include an upper and lower rack formed extending in the vertical direction and formed for each unit picker body; an upper and lower driving pinion that rotates by engaging with the upper and lower racks; and a driving motor that rotates the upper and lower driving pinion.

[0014] At this time, the upper and lower drive pinion and the drive motor are respectively provided on the upper and lower racks formed for each unit picker body, so that the unit picker body can be moved independently in the upper and lower directions by driving each of the drive motors.

[0015] Meanwhile, an upper and lower spring is installed to connect the frame and the unit picker body in the vertical direction. The upper and lower spring is installed with a set tensile or compressive displacement to eliminate height deviation caused by backlash of the unit picker body moving in the vertical direction.

[0016] Above all, it is preferable to further include a horizontal rack formed to extend in the transverse direction and arranged with rack teeth in an upright state, a horizontal moving member formed to be movable in the transverse direction, and a rotary driving pinion integrally formed in the unit picker body and installed in a state engaged with the horizontal rack, so that the plurality of unit picker bodies rotate simultaneously by the same angle by the horizontal movement of the horizontal moving member.

[0017] Here, the orientation of the rack teeth is aligned with the vertical movement direction of the unit picker body, so that the rack teeth of the horizontal rack do not interfere with the vertical movement of the unit picker body.

[0018] In addition, the unit picker body may be installed on a moving block that moves up and down relative to the frame, and a torsion spring may be connected between the unit picker body and the moving block so that an elastic restoring force acts to rotate the unit picker body in one direction.

[0019] In this way, the picker device can be used to adsorb a semiconductor package cut from a wafer by the moving drive unit and move it to an adhesive polyimide film, and to attach the semiconductor package to the polyimide film by the up-and-down moving drive unit while the semiconductor package is rotated by a predetermined angle by the rotating drive unit.

[0020] Accordingly, even if the arrangement of the semiconductor package cut from the wafer and the arrangement of the semiconductor package attached to the polyimide film are different, it is possible to accurately attach the semiconductor package to the polyimide film at the deposition location in a predetermined position.

[0022] The terms 'longitudinal' and similar terms as used in this specification and claims are defined as referring to the z-axis direction as an up-and-down direction.

[0023] The terms 'transverse direction' and similar terms described in this specification and claims are defined as referring to the y-axis direction as the left-right direction.

[0024] The terms 'thickness direction' and similar terms described in this specification and claims are defined as referring to the x-axis direction as the front-rear direction. Effects of the invention

[0026] As described above, according to the present invention, an advantageous effect can be obtained in which a semiconductor package generated by cutting a wafer is picked up, moved to a deposition location, and rotated by an accurate rotation angle to be accurately mounted at the deposition location.

[0027] In other words, the present invention rotates a plurality of unit picker bodies by the same angle using a gear meshing method with a single horizontal rack, thereby obtaining the advantageous effect of accurately and uniformly controlling the rotation angle of the unit picker bodies.

[0028] In addition, the present invention provides an upper and lower spring with an elastic restoring force acting in the vertical direction between the frame and the unit picker body, thereby eliminating the vertical height deviation caused by backlash generated by the gap between the gear teeth while moving the unit picker body up and down, and thus accurately releasing the semiconductor package held in the suction part of the unit picker body at a predetermined height from the deposition position, thereby obtaining the advantageous effect of accurately seating the semiconductor package at a predetermined position without distortion.

[0029] In addition, the present invention provides a torsion spring with an elastic restoring force acting in the rotational direction between a moving block and a unit picker body, thereby eliminating the rotational angle deviation caused by backlash occurring between a horizontal rack and a rotary drive pinion while rotating the unit picker body, and thus obtaining the advantageous effect of accurately releasing a semiconductor package held in the suction part of the unit picker body while it is rotated to a predetermined rotational angle from the deposition position, thereby accurately seating the semiconductor package at a predetermined position without distortion. Brief explanation of the drawing

[0031] FIG. 1 is a flowchart of a process in which a picker device of a semiconductor package is used according to one embodiment of the present invention. FIG. 2 is a perspective view of a picker device of a semiconductor package of FIG. 1. Fig. 3 is a front view of Fig. 2, FIG. 4 is a right side view of FIG. 2, Fig. 5 is a plan view of Fig. 2, FIG. 6 is a longitudinal section along the cutting line XX of FIG. 4, FIGS. 7a to 7c are drawings illustrating a configuration for transferring a semiconductor package using the picker device of FIG. 2. Specific details for implementing the invention

[0032] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings, but the present invention is not limited or restricted by the embodiments. For reference, in this description, the same number refers to substantially the same element, and under this rule, descriptions may be made by citing content described in other drawings, and content that is deemed obvious to those skilled in the art or is repetitive may be omitted.

[0034] As illustrated in the drawing, the picker device (100) of a semiconductor package according to the present invention comprises a frame (101), a moving drive unit (M) for moving the frame (101), a pickup unit (110) for selectively picking up semiconductor packages (Pk) by arranging a plurality of unit picker bodies (111) for picking up semiconductor packages (Pk) one by one in a lateral direction (y-axis direction), a rotation drive unit (120) for rotating a plurality of unit picker bodies (111) collectively with respect to the frame (101), an up-and-down movement drive unit (130) for moving a plurality of unit picker bodies (111) independently in an up-and-down direction (z-axis direction) with respect to the frame (101), an up-and-down movement spring (140) for applying an elastic restoring force (Fk) to the unit picker bodies (111) in an up-and-down direction by means of an elastic restoring force between the frame (101) and the unit picker bodies (111), and an elastic unit picker body (111) for rotational movement. It is configured to include a torsion spring (150) that applies a restoring force (Ft).

[0036] The above frame (101) is installed so that it can be moved (100d) by a moving drive unit (M) from a sawing position (P1 in FIG. 7a) of a wafer (W) to a deposition position (P2 in FIG. 7c) for depositing a shielding film for an EMI shield.

[0037] The frame (101) is generally formed of a material having high rigidity, and, for example, can be formed of steel.

[0039] The above pickup unit (110) is formed by arranging a plurality of unit picker bodies (111) in the transverse direction. Each unit picker body (111) has a suction part (111a) formed at the bottom end to which suction pressure is applied, and is formed to be able to move up and down and rotate with respect to the frame (101).

[0040] Specifically, the unit picker body (111) is installed so as to be rotatable (110r) on the moving block (119) and moves up and down together with the moving block (119). Then, a suction block (114) is formed in the front part of the moving block (119) with a suction passage (113p) and a suction chamber (113c) formed inside so that suction pressure (55) can be applied to the suction part (111a) of the unit picker body (111). A suction pipe (113) is formed in the suction block (114) and connected to an external suction pump (P), and accordingly, as shown in FIG. 6, suction pressure (55) is applied to the suction part (111) through the suction pipe (113), the suction passage (113p), the suction chamber (113c), and the hollow part (111x) of the unit picker body (111).

[0041] Here, since the unit picker body (111) is formed to be capable of vertical movement and rotation, the opening (xx) of the unit picker body (111) connected to the suction passage (113a) can be formed in the shape of an elongated hole in the rotational direction.

[0043] The above rotary drive unit (120) includes a horizontal moving member (121) formed to be movable in a lateral direction with respect to a frame (101), a rotary drive pinion (123) engaged with a drive rack (121a) having rack teeth arranged along the lateral direction on the upper surface of the horizontal moving member (121), and a rotary drive motor (125) that rotates the rotary drive pinion (123) in a forward or reverse direction.

[0044] Here, on the upper surface of the horizontal moving member (121), a drive rack (121a) is provided, with rack teeth facing upward and arranged along the transverse direction. Accordingly, when the rotary drive motor (125) rotates in the forward or reverse direction, the drive rack (121a) moves in the left and right transverse directions according to the rotation of the rotary drive pinion (123).

[0045] Additionally, a horizontal rack (121b) is provided on the front of the horizontal moving member (121), with rack teeth facing forward and arranged along the transverse direction. Although the drawing illustrates a configuration in which the rack teeth of the horizontal rack (121b) face forward, according to another embodiment of the present invention, the rack teeth of the horizontal rack (121b) may be configured to face backward. Furthermore, a driven gear (112) formed as a spur gear is installed on the upper part of a plurality of unit picker bodies (111) in a state of being engaged with the horizontal rack (121b).

[0046] Accordingly, when a single rotary drive motor (125) rotates in the forward or reverse direction, the rotary drive pinion (121) coupled to the end of the motor shaft rotates in the forward or reverse direction, and the drive rack (121a) engaged with the rotary drive pinion (121) moves in the left and right directions together with the horizontal moving member (121) (121d). Then, since the horizontal rack (121b) also moves in the left and right directions, the driven gear (112) engaged with the horizontal rack (121b) all rotate by the same angle of rotation, so the unit picker body (111) that rotates integrally with the driven gear (112) all rotate by the same angle of rotation (110r).

[0047] At this time, since the rack teeth of the horizontal rack (121b) are formed in an upright shape in the vertical direction, the unit picker body (111) is allowed to move up and down relative to the horizontal rack (121b) and can rotate by the horizontal rack (121b). That is, the vertical extension direction of the rack teeth of the horizontal rack (121b) is formed to coincide with the vertical movement direction of the unit picker body (111).

[0049] Meanwhile, as illustrated in FIGS. 2 and 4, a torsion spring (150) may be installed between the unit picker body (111) and the movable block (119). Here, the movable block (119) does not rotate together with the unit picker body (111) but moves up and down together with the unit picker body (111). The torsion spring (150) is installed so that a tensile displacement of a predetermined amount occurs so that an elastic restoring force (Ft) acts in the rotational direction (either forward or reverse) of the unit picker body (111).

[0050] Through this, one side of the tooth of the driven gear (112) installed at the upper part of the unit picker body (111) is in contact with the rack tooth of the horizontal rack (121b) in one direction by the elastic restoring force (Ft) of the torsion spring (150), thereby eliminating backlash between the driven gear (112) and the horizontal rack (121b). Therefore, since the unit picker body (111) is not affected by backlash between the driven gear (112) and the horizontal rack (121b), multiple unit picker bodies (111) rotate simultaneously by the same rotation angle in proportion to the lateral movement distance of the horizontal rack (121b).

[0052] The above-described vertical movement drive unit (130) includes an upper / lower rack (132) having rack teeth facing one side in the transverse direction arranged along the upper / lower direction on the rear of a moving block (119) formed to be movable in the vertical direction relative to the frame (101), a linear drive pinion (not shown) formed as a spur gear that meshes with the upper / lower rack (132), and a vertical movement drive motor (125) that rotates the linear drive pinion in the forward or reverse direction.

[0053] Although the drawing illustrates a shape in which the rack teeth of the upper and lower racks (132) face one side in the transverse direction, according to another embodiment of the present invention, the rack teeth of the upper and lower racks (132) may be configured to face the other side in the transverse direction, and some of the rack teeth facing the upper and lower racks (132) installed on each unit picker body (111) may be configured to face one side in the transverse direction and other parts may face the other side in the transverse direction.

[0054] Here, as the rack teeth of the upper and lower racks (132) are all formed facing one side in the transverse direction, the upper and lower drive motor (135) can be installed in a state where the motor shaft is arranged parallel to the rotary drive motor (125) and is engaged with the upper and lower racks (132) by a linear drive pinion, and the rotational control of the upper and lower drive motors (135) can be controlled collectively in the same direction.

[0055] Accordingly, when the vertical movement drive motor (135) rotates in the forward or reverse direction, the linear drive pinion rotates in the forward or reverse direction, and when the vertical rack (132) engaged with the linear drive pinion moves in the vertical direction, the moving block (119) formed integrally with the vertical rack (132) also moves in the vertical direction, and accordingly, the unit picker body (111) also moves in the vertical direction.

[0056] Since the upper and lower racks (132), linear drive pinions, and linear movement drive motors (135) are formed for each unit picker body (111), multiple unit picker bodies (111) can move up and down independently of each other relative to the frame (101). Through this, even if there is a height difference in the semiconductor package (Pk) formed by sawing the wafer (W) or a height difference in the deposition location (P2) for forming the EMI shielding film, the semiconductor package (Pk) can be mounted in an accurate position by individually adjusting the height for each unit picker body (111).

[0058] Meanwhile, as illustrated in FIG. 3, an up-and-down spring (140) may be installed between the frame (101) and the movable block (119). Here, the up-and-down spring (140) may be formed as a coil spring as illustrated in the drawing, or various other types of springs may be applied so that a force is applied to push the movable block (119) upward or downward relative to the frame (101) by means of an elastic restoring force.

[0059] To this end, the vertical movement spring (140) is installed with a predetermined amount of tensile displacement or compressive displacement set so that an elastic restoring force (Fk) acts in the vertical movement direction (either upward or downward) of the unit picker body (111).

[0060] Through this, the upper and lower rack (132) installed on the rear side of the moving block (119) of the unit picker body (111) is in close contact with the linear moving pinion, which is rotated by the linear moving drive motor (135), so that backlash between the linear moving pinion and the upper and lower rack (132) can be eliminated. Therefore, since the unit picker body (111) is not affected by backlash between the linear moving pinion and the upper and lower rack (132), multiple unit picker bodies (111) move up and down by the same distance in proportion to the vertical movement distance of the upper and lower rack (132).

[0062] A picker device (100) of a semiconductor package according to one embodiment of the present invention configured as above can be applied to a process of forming an EMI shield film on the surface of a semiconductor package (Pk).

[0063] That is, the process (S1) of forming an EMI shield film on the surface of a semiconductor package (Pk) can be applied as follows to the process (S50) of forming a plurality of semiconductor packages (Pk) by sawing a wafer (W) as shown in FIG. 1 (S10), transferring the semiconductor packages (Pk) by a picker device (100) and attaching them to a polyimide (PI) film prepared on a tray at a deposition location (P2) (S20), tamping the semiconductor packages (Pk) onto the PI film so that no gap is formed between the PI film and the semiconductor packages (Pk) (S30), depositing and forming an EMI shield film on the semiconductor packages (Pk) on the PI film (S40), removing burrs from the EMI shield film formed along the edges of the semiconductor packages, and inspecting the formation state of the EMI shield film.

[0064] First, the picker device (100) is moved to the sawing position (P1) shown in FIG. 7a by the moving drive unit (M), and the semiconductor package (Pk) cut from the wafer (W) is picked up by the suction part (111a) of the plurality of unit picker bodies (111).

[0065] Then, as shown in FIG. 7b, the semiconductor package (Pk) is picked up and moved by the moving drive unit (M) to a deposition location (P2) where an EMI shielding film is applied (100d). Here, at the deposition location (P2), trays (T1, T2) are prepared with an adhesive polyimide (PI) film prepared to attach the bottom surface of the semiconductor package (Pk) in order to apply an EMI shielding film to the surface of the semiconductor package (Pk).

[0066] When the position in which the semiconductor package (Pk) is mounted at the deposition position (P2) is rotated by a predetermined angle (ang) relative to the sawing position (P1), the picker device (100) moved to the deposition position (P2) rotates the unit picker body (111) uniformly by the predetermined angle (ang) required at the deposition position (P2) by the rotation drive unit (120). At this time, since the unit picker body (111) has its backlash removed from the horizontal rack (121b) by the torsion spring (150), they all rotate by the same angle of rotation.

[0067] Then, as illustrated in FIG. 7c, the picker device (100) is equipped with eight unit picker bodies (111), whereas the tray (T1, T2) on which the semiconductor packages (Pk) are to be mounted may require four semiconductor packages (Pk) in a 2*2 array.

[0068] In this case, only two unit picker bodies (111) among the unit picker bodies (111) of the picker device (100) are moved downward by the vertical movement drive unit (130), and the suction pressure (55) is removed from the suction part (111a) of the downwardly moved unit picker bodies (111), so that the semiconductor package (Pk) is placed on the polyimide film of the first tray (T1) in a position rotated by a predetermined angle (ang) at two upper positions of the first tray (T1) of the deposition position (P2). Next, the other two unit picker bodies (111) among the unit picker bodies (111) of the picker device (100) are moved downward by the vertical movement drive unit (130), and the suction pressure (55) is removed from the suction part (111a) of the downwardly moved unit picker bodies (111) so that the semiconductor package (Pk) is placed on the polyimide film of the first tray (T1) in a position rotated by a predetermined angle (ang) at the lower two positions of the first tray (T1) of the deposition position (P2).

[0069] Next, by means of the vertical movement drive unit (130), only two other unit picker bodies (111) among the unit picker bodies (111) of the picker device (100) are moved downward, and the suction pressure (55) is removed from the suction part (111a) of the downwardly moved unit picker bodies (111), so that the semiconductor package (Pk) is placed on the polyimide film of the second tray (T1) in a position rotated by a predetermined angle (ang) at two upper positions of the second tray (T1) of the deposition position (P2). Next, the upper and lower moving drive unit (130) moves only two other unit picker bodies (111) among the unit picker bodies (111) of the picker device (100) downward, and removes the suction pressure (55) from the suction part (111a) of the downwardly moved unit picker bodies (111) so that the semiconductor package (Pk) is positioned in a position rotated by a predetermined angle (ang) at two lower positions of the second tray (T1) of the deposition position (P2).

[0070] Through this, even if the arrangement of the semiconductor package (Pk) cut from the wafer (W) at the sawing position (P1) and the arrangement of the semiconductor package scheduled on the polyimide film at the deposition position (P2) are different, the vertical movement drive unit (130) moves up and down individually so that it can be accurately attached to the polyimide film of the tray (T1, T2).

[0071] The semiconductor package picker device (100) according to the present invention configured as described above can pick up a semiconductor package generated by cutting a wafer, move it from a sawing position (P1) to a deposition position (P2) (100d), and then uniformly rotate a plurality of unit picker bodies (111) by an accurate rotation angle in a state where backlash is removed, and move them up and down independently to attach them to an accurate planned position, thereby obtaining an advantageous effect.

[0073] As described above, although the present invention has been explained with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the invention as set forth in the following claims. Explanation of the symbols

[0075] 100: Picker device for semiconductor package 101: Frame 110: Pickup section 111: Unit picker set 111a: Intake part 112: Driven gear 114: Suction Block 119: Moving Block 120: Rotary drive unit 125: Rotary drive motor 130: Up-and-down movement drive unit 140: Up-and-down spring 150: Torsion spring Pk: Semiconductor package W: Wafer P1: Sawing position P2: Deposition location

Claims

Claim 1 A picker device for a semiconductor package comprises: a frame; a plurality of unit picker bodies arranged spaced apart in the transverse direction, each having a suction part installed to be movable in the vertical direction with respect to the frame and having a suction pressure applied to its lower end; a moving block installed to move in the vertical direction together with each unit picker body and to enable rotation of the unit picker bodies without rotating together with the unit picker bodies; and a vertical movement drive unit that moves the plurality of unit picker bodies independently in the vertical direction, each having an upper / lower rack having rack teeth arranged along the vertical direction, a linear drive pinion engaged with the upper / lower rack, and a vertical movement drive motor that rotates the linear drive pinion. A horizontal moving member formed to extend laterally and arranged with a horizontal rack along the horizontal direction and configured to be movable laterally, and a driven gear integrally formed on the unit picker body and installed in a state engaged with the horizontal rack, wherein a plurality of unit picker bodies are configured to rotate simultaneously by the same angle by the horizontal movement of the horizontal moving member; a vertical moving spring installed between the frame and the moving block with a set tensile displacement or compressive displacement, so as to apply a force that pushes the moving block upward or downward relative to the frame in the vertical direction by an elastic restoring force to eliminate a height deviation caused by backlash between the linear driving pinion and the vertical rack; a torsion spring installed between the unit picker body and the moving block, which eliminates a rotation angle deviation caused by backlash between the horizontal rack and the driven gear by applying an elastic restoring force that rotates the unit picker body in one direction; and a moving driving unit for moving the frame.A picker device for a semiconductor package, characterized in that the upright direction of the rack teeth of the horizontal rack coincides with the up-and-down movement direction of the unit picker body, so that the rack teeth of the horizontal rack do not interfere during the up-and-down movement of the unit picker body, and the meshing state between the horizontal rack and the driven gear is maintained even during the up-and-down movement of the unit picker body. Claim 2 A picker device for a semiconductor package according to claim 1, wherein the rotary drive unit further comprises: a drive rack arranged along a transverse direction on a surface other than the surface on which the horizontal rack is formed on the horizontal moving member; a rotary drive pinion engaged with the drive rack and driven by a rotary drive motor; and a rotary drive motor that drives the rotary drive pinion in a forward or reverse direction, wherein the horizontal moving member moves in a transverse direction by driving the rotary drive motor. Claim 3 A picker device for a semiconductor package according to claim 1, characterized in that the torsion spring is installed with a set tensile displacement, thereby maintaining a state in which the teeth of the driven gear are in unidirectional contact with the rack teeth of the horizontal rack, so that backlash between the driven gear and the horizontal rack is eliminated. Claim 4 A semiconductor package picker device according to claim 1, characterized in that a semiconductor package cut from a wafer is adsorbed and moved to an adhesive polyimide film by the moving drive unit, and the semiconductor package is attached to the polyimide film by the vertical moving drive unit while the semiconductor package is rotated by the rotation drive unit by a predetermined angle. Claim 5 A semiconductor package picker device according to claim 4, characterized in that the arrangement of the semiconductor package cut from the wafer and the arrangement of the semiconductor package attached to the polyimide film are different from each other. Claim 6 delete Claim 7 delete Claim 8 delete Claim 9 delete Claim 10 delete Claim 11 delete

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