Top ring and grinding device of the grinding device

KR103000207B1Active Publication Date: 2026-08-05EBARA CORP
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Patent Information

Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
EBARA CORP
Filing Date
2022-06-30
Publication Date
2026-08-05

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Abstract

A technique is provided to prevent the fitting portion of a band from coming out of the groove when using a top ring. In the top ring (10) of a grinding device (100), a groove (15) is provided in which the fitting portion (71a, 71b) of a band (70) is fitted, on at least one of the outer wall (11) of a retainer member (30) and the outer wall (11) of a compression mechanism (40). The groove is a dovetail groove that, when viewed in cross-section, has a groove opening, a groove bottom facing the groove opening, a first groove side wall connecting the groove opening and the groove bottom, and a second groove side wall facing the first groove side wall while connecting the groove opening and the groove bottom, and is configured such that the gap between the first groove side wall and the second groove side wall widens as it approaches the groove bottom. When the fitting portion of the band is fitted into the dovetail groove, the fitting portion is configured to contact the first groove side wall and the second groove side wall.
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Description

Technology Field

[0001] The present invention relates to a top ring of a grinding device and a grinding device. The present application claims priority based on Japanese Patent Application No. 2021-118470 filed on July 19, 2021. All disclosures of Japanese Patent Application No. 2021-118470, including the specification, claims, drawings, and abstract, are incorporated herein by reference in their entirety. Background Technology

[0002] Conventionally, a polishing device for polishing a substrate is known, comprising a top ring that holds and supports the substrate and a polishing table that holds and supports a polishing pad for polishing the substrate (see, for example, Patent Document 1). Furthermore, the top ring of such a polishing device comprises a top ring body having a substrate support surface that supports the upper surface of the substrate, a retainer member arranged to surround the outer periphery of the substrate support surface and holds and supports the outer edge of the substrate, a compression mechanism arranged above the retainer member and configured to press the retainer member downward, and a band arranged extending from the outer wall of the retainer member to the outer wall of the compression mechanism. Additionally, grooves are provided in the outer wall of the retainer member and the outer wall of the compression mechanism, and a fitting part of the band (in Patent Document 1, a fitting part provided at both ends of the band) is fitted into these grooves. Prior art literature

[0003] Japanese Patent Publication No. 2020-19115 The problem to be solved

[0004] In the top ring of a conventional grinding device as described above, there was a risk that the band would slip out of the retainer member or compression mechanism when the top ring was in use.

[0005] The present invention has been made in consideration of the above, and one of its objectives is to provide a technology capable of preventing the band from slipping out of the retainer member or compression mechanism when using the top ring. means of solving the problem

[0006] (Mode 1)

[0007] To achieve the above objective, a top ring of a polishing device according to one embodiment of the present invention comprises: a top ring body having a substrate support surface that supports an upper surface of a substrate; a retainer member disposed to surround the outer periphery of the substrate support surface and retaining and supporting the outer edge of the substrate; a compression mechanism disposed above the retainer member and configured to press the retainer member downward; and a band having at least one fitting portion disposed from the outer periphery wall of the retainer member to the outer periphery wall of the compression mechanism, wherein a groove is provided in at least one of the outer periphery wall of the retainer member and the outer periphery wall of the compression mechanism into which the fitting portion of the band is fitted, and the groove, when viewed in cross-section, has a groove opening, a groove bottom facing the groove opening, a first groove side wall connecting the groove opening and the groove bottom, and a second groove side wall facing the first groove side wall while connecting the groove opening and the groove bottom, and the first groove side wall and the second The groove is a dovetail groove configured such that the gap between the groove sidewalls widens as it approaches the bottom of the groove, and when the fitting portion of the band is fitted into the dovetail groove, the fitting portion is configured to contact the first groove sidewall and the second groove sidewall.

[0008] According to this embodiment, since the groove into which the fitting portion of the band is fitted is a dovetail groove as described above, the degree of fit between the fitting portion of the band and the groove can be made more rigid compared to the case where the groove into which the fitting portion of the band is fitted is not a dovetail groove (for example, a groove with a rectangular cross-section where the spacing between a pair of groove sidewalls is constant). By doing so, the fitting portion of the band can be prevented from slipping out of the groove when using the top ring. As a result, the band can be prevented from slipping out of the retainer member or compression mechanism when using the top ring.

[0009] (Mode 2)

[0010] In the above embodiment 1, the fitting portion of the band has a first convex portion that contacts the side wall of the first groove and a second convex portion that contacts the side wall of the second groove, and a V-shaped groove with a cross-section V-shape may be provided between the first convex portion and the second convex portion.

[0011] (Mode 3)

[0012] In the above embodiment 1 or 2, a portion of the band may be provided with an elastic part capable of stretching in the vertical direction.

[0013] According to this embodiment, when the retainer member is displaced in the vertical direction, the elastic portion of the band can be stretched in the vertical direction, so the fitting portion of the band can be effectively prevented from coming out of the groove.

[0014] (Mode 4)

[0015] In any one of the above embodiments 1 to 3, the groove may be provided only on one of the outer wall of the retainer member and the outer wall of the compression mechanism.

[0016] (Mode 5)

[0017] In any one of the above embodiments 1 to 3, the groove may be provided on both the outer wall of the retainer member and the outer wall of the compression mechanism.

[0018] (Mode 6)

[0019] In any one of the above embodiments 1 to 3, the groove is provided only on the outer wall of the retainer member among the outer wall of the retainer member and the outer wall of the compression mechanism, the top ring body has an upper member provided to cover the upper part of the compression mechanism, one end of the two ends of the band is fitted and supported on the upper member and the compression mechanism, and the fitting part of the band may be provided on the other end of the band.

[0020] According to this embodiment, since the fitting portion provided at the other end of the band is fitted into a groove (dovetail groove), the fitting portion can be prevented from coming out of the groove. In addition, since one end of the band is fitted and supported by the upper member and the compression mechanism, the one end of the band can also be prevented from coming out. Furthermore, according to this embodiment, for example, during maintenance of the top ring, the retainer member can be easily separated from the top ring by removing the fitting portion of the band from the groove. By doing so, the maintainability of the top ring can be improved.

[0021] (Mode 7)

[0022] In any one of the above embodiments 1 to 6, the groove opening may be provided with a recess for a machining tool to pass through when the tool is inserted from the groove opening into the groove.

[0023] According to this embodiment, a machining tool can be easily inserted into the interior of the groove from the groove opening in which the concave portion is formed, so the machining of the groove can be easily performed.

[0024] (Mode 8)

[0025] In any one of the above embodiments 1 to 7, the substrate may be a rectangular substrate.

[0026] (Mode 9)

[0027] To achieve the above objective, a top ring of a polishing device according to one embodiment of the present invention comprises: a top ring body having a substrate support surface that supports the upper surface of a substrate; a retainer member disposed to surround the outer periphery of the substrate support surface and retaining and supporting the outer edge of the substrate; a compression mechanism disposed above the retainer member and configured to press the retainer member downward; and a band having a fitting portion disposed extending from the outer periphery wall of the retainer member to the outer periphery wall of the compression mechanism, wherein a groove is provided in the outer periphery wall of the retainer member into which the fitting portion of the band is fitted; the top ring body has an upper member provided to cover the upper part of the compression mechanism, and among the two ends of the band, one end is fitted and supported by the upper member and the compression mechanism, and the fitting portion of the band is provided at the other end of the band.

[0028] According to this embodiment, since one end of the band is fitted and supported between the upper member and the compression mechanism, it is possible to prevent the one end of the band from slipping out of the compression mechanism when using the top ring. In other words, it is possible to prevent the band from slipping out of the compression mechanism when using the top ring.

[0029] (Mode 10)

[0030] To achieve the above objective, a polishing device according to one embodiment of the present invention has a top ring according to any one of embodiments 1 to 9 above, and a polishing table that holds and supports a polishing pad for polishing a substrate held and supported on the top ring.

[0031] According to this embodiment, when using the top ring, it is possible to prevent the band from slipping out of the retainer member or compression mechanism. Brief explanation of the drawing

[0032] Figure 1 (A) is a schematic diagram illustrating the main configuration of a polishing device according to an embodiment. Figure 1 (B) is a schematic plan view (top view) of the main body of the polishing device. FIG. 2 is a schematic perspective view of a top ring relating to an embodiment. FIG. 3 is a schematic cross-sectional view of a top ring according to an embodiment. Figure 4 is a schematic enlarged cross-sectional view of part B1 of Figure 3. Figure 5 (A) is a schematic enlarged cross-sectional view of parts B2 and B3 of Figure 4. Figure 5 (B) is a schematic exploded view of the configuration of part B2 of Figure 4. FIG. 6 is an enlarged cross-sectional view schematically illustrating a portion of the top ring of a grinding device according to a modified example 1 of the embodiment. FIG. 7 (A) is a schematic diagram showing the peripheral configuration of the groove of the compression mechanism of the top ring according to modified Example 2 of the embodiment, viewed from the front. FIG. 7 (B) is a schematic front view of the processing tool. FIG. 8 is a schematic diagram illustrating a portion of the outer wall of a top ring according to a modified example 2 of the embodiment, viewed from the -X direction. Specific details for implementing the invention

[0033] (Embodiment)

[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Furthermore, the drawings are schematically illustrated to facilitate understanding of the features, and the dimensional ratios of each component are not identical to the actual ones. Additionally, orthogonal coordinates of XYZ are shown in the drawings as needed. Among these orthogonal coordinates, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0035] FIG. 1 (A) is a schematic diagram illustrating the main configuration of a polishing device (100) according to the present embodiment. FIG. 1 (B) is a schematic plan view (top view) of a polishing device body (101). The polishing device (100) according to the present embodiment is a polishing device capable of performing Chemical Mechanical Polishing (CMP). Specifically, the polishing device (100) exemplified in FIG. 1 (A) is equipped with a polishing device body (101) and a control device (120).

[0036] The polishing device body (101) mainly comprises a polishing table (102), a top ring (10), and a dresser (104). The polishing table (102) is configured to rotate while holding and supporting a polishing pad (Pd). Specifically, the polishing table (102) according to the present embodiment is composed of a disc-shaped member, and a polishing pad (Pd) is attached to its upper surface. The upper surface (surface) of the polishing pad (Pd) corresponds to the polishing surface. The polishing table (102) is connected to a table rotation axis (103). The polishing table (102) rotates as the table rotation axis (103) is driven by a driving mechanism (e.g., a rotary motor). During polishing, a substrate (Wf), which will be described later, is pressed against the polishing pad (Pd). As a result, the substrate (Wf) is polished. The rotational movement of the grinding table (102) is controlled by a control device (120). Also, “R1” shown in (B) of FIG. 1 is an example of the rotational direction of the grinding table (102).

[0037] The specific type of abrasive pad (Pd) is not particularly limited, and various abrasive pads can be used, such as hard foam type abrasive pads, non-woven fabric type abrasive pads, and suede type abrasive pads.

[0038] In the present embodiment, a rectangular substrate having corner portions is used as an example of the substrate (Wf). The number of corner portions of the rectangular substrate is not particularly limited as long as it is three or more, but in the present embodiment, it is four as an example. That is, the substrate (Wf) in the present embodiment is a rectangular substrate. However, the shape of the substrate (Wf) is not limited to such a rectangular shape, and may be, for example, a circular shape (including an ellipse) without corner portions.

[0039] The top ring (10) is a member for holding and supporting a substrate (Wf). The top ring (10) is configured to rotate while pressing the lower surface (i.e., the surface to be polished) of the substrate (Wf) against the polishing pad (Pd). Specifically, the top ring (10) is connected to a ring rotation axis (105). The top ring (10) rotates as the ring rotation axis (105) is driven by a driving mechanism (e.g., a rotary motor). Additionally, "R2" shown in (B) of FIG. 1 is an example of the rotation direction of the top ring (10).

[0040] In addition, the top ring (10) according to the present embodiment is configured to oscillate with respect to the polishing pad (Pd). Specifically, the ring rotation axis (105) of the top ring (10) is connected to the substrate oscillation axis (107) through the substrate oscillation arm (106). As the substrate oscillation axis (107) is oscillated by the driving mechanism, the substrate oscillation arm (106) oscillates to draw an arc around the substrate oscillation axis (107) (i.e., rotates clockwise and counterclockwise), and as a result, the top ring (10) also oscillates. The rotational or oscillating motion of the top ring (10) is controlled by the control device (120). Also, "SW1" shown in (B) of FIG. 1 is an example of the oscillation direction of the top ring (10).

[0041] The dresser (104) is a component for dressing the polished surface of a polishing pad (Pd). Abrasive particles (e.g., diamond) are arranged on the lower surface of the dresser (104). The dresser (104) is connected to a dresser rotation axis (108). The dresser (104) rotates as the dresser rotation axis (108) is driven by a driving mechanism (e.g., a rotary motor). Additionally, "R3" shown in (B) of FIG. 1 is an example of the rotation direction of the dresser (104).

[0042] Additionally, the dresser (104) according to the present embodiment is configured to oscillate with respect to the polishing pad (Pd). Specifically, the dresser rotation axis (108) of the dresser (104) is connected to the dresser oscillation axis (110) through the dresser oscillation arm (109). As the dresser oscillation axis (110) is oscillated by a driving mechanism (e.g., an oscillation motor), the dresser oscillation arm (109) oscillates around the dresser oscillation axis (110), and as a result, the dresser (104) also oscillates. The rotational or oscillating motion of the dresser (104) is controlled by a control device (120). Additionally, "SW2" shown in (B) of FIG. 1 is an example of the oscillation direction of the dresser (104).

[0043] The polishing device (100) is equipped with a slurry supply mechanism (not shown) for supplying a slurry (polishing slurry) to the polishing surface of a polishing pad (Pd). As the slurry, a solution containing abrasive particles such as silicon oxide, aluminum oxide, or cerium oxide may be used. The specific type of this slurry can be appropriately set according to the type of substrate (Wf). In addition, the slurry may be supplied from the upper side of the polishing pad (Pd), from the lower side, or from both the upper and lower sides. The polishing device (100) polishes the substrate (Wf) by rotating the polishing table (102) and the top ring (10) respectively in the presence of the slurry.

[0044] The control device (120) controls the operation of the polishing device (100) in an integrated manner. Specifically, the control device (120) according to the present embodiment is equipped with a microcomputer. This microcomputer is equipped with a CPU (Central Processing Unit) (121) as a processor and a memory device (122) as a non-temporary storage medium. In the control device (120), the CPU (121) as a processor controls the operation of the polishing device (100) by operating based on the instructions of a program stored in the memory device (122).

[0045] FIG. 2 is a schematic perspective view of a top ring (10). The top ring (10) according to the present embodiment has, for example, a rectangular parallelepiped shape. The outer wall (11) of the top ring (10) has a plurality of corner portions (12) and a connecting wall (13) connecting adjacent corner portions (12). In the present embodiment, the number of corner portions (12) is four. However, the number of corner portions (12) is not limited to four, but may be three or five or more. Alternatively, the top ring (10) may have an external shape (such as a circle) without corner portions (12). Also, the corner portions (12) may have an R-shaped finish (in this case, the corner portions (12) are rounded). Also, the connecting wall (13) according to the present embodiment is, for example, composed of a flat surface. Additionally, the outer wall (11) of the top ring (10) includes the outer wall of the retainer member (30) of the top ring (10) described later or the outer wall of the compression mechanism (40).

[0046] FIG. 3 is a schematic cross-sectional view of a top ring (10), specifically schematically illustrating the cross-section along line A1-A1 of FIG. 2. FIG. 4 is a schematic enlarged cross-sectional view of part B1 of FIG. 3. With reference to FIG. 3 and FIG. 4, the top ring (10) according to the present embodiment comprises a top ring body (20), a retainer member (30), a compression mechanism (40), a guide mechanism (50), a seal member (60a), a seal member (60b), and a band (70).

[0047] As illustrated in FIGS. 3 and 4, the top ring body (20) according to the present embodiment comprises a lower member (21), an intermediate member (22) positioned above the lower member (21), an upper member (23) positioned above the intermediate member (22), and an elastic membrane (24) positioned below the lower member (21). The lower surface of the elastic membrane (24) corresponds to a "substrate support surface (24a)" that supports the upper surface of the substrate (Wf). The upper member (23), the intermediate member (22), and the lower member (21) are fastened together by bolts (not shown).

[0048] The elastic membrane (24) according to the present embodiment is configured to expand when gas is introduced, such as an airbag. By having such an elastic membrane (24), the substrate (Wf) can be pressed against the polishing pad (Pd) with equal pressure during polishing of the substrate (Wf). Furthermore, since the configuration of this top ring body (20) is the same as that of the top ring body of a known polishing device described in Patent Document 1, further detailed description is omitted.

[0049] As illustrated in FIG. 4, the retainer member (30) is positioned to surround the outer circumference of the substrate support surface (24a). Additionally, the retainer member (30) is configured to hold and support the outer edge of the substrate (Wf). Specifically, the retainer member (30) according to the present embodiment comprises, as an example, a first member (31), a second member (32) positioned above the first member (31), and a third member (33) positioned above the second member (32). The outer edge of the substrate (Wf) is held and supported by the inner wall of the first member (31).

[0050] The compression mechanism (40) is positioned above the retainer member (30). The compression mechanism (40) is a mechanism for compressing the retainer member (30) downward. While the specific configuration of the compression mechanism (40) is not particularly limited as long as it has this function, the compression mechanism (40) according to the present embodiment is equipped with a cylinder (41) and a piston (42) as an example.

[0051] The cylinder (41) is positioned to surround the outer circumference of the intermediate member (22) of the top ring body (20). The piston (42) protrudes downward from the cylinder (41). The piston (42) is displaced in the up and down direction relative to the cylinder (41). The lower end of the piston (42) is in contact with the upper surface of the third member (33) of the retainer member (30). By displaced downward, the retainer member (30) can be pressed downward. Additionally, by connecting the lower end of the piston (42) to the third member (33) of the retainer member (30), the configuration may be configured to drive the retainer member (30) in the up and down direction in conjunction with the up and down displacement of the piston (42).

[0052] The guide mechanism (50) is a mechanism for guiding the vertical displacement of the retainer member (30). While the specific configuration of the guide mechanism (50) is not particularly limited as long as it has this function, the guide mechanism (50) according to the present embodiment is, as an example, equipped with a guide roller (51), a guide pad (52), and a roller support member (53).

[0053] The guide roller (51) is rotatably supported by a roller support member (53). The roller support member (53) is connected to the lower member (21) via a bolt (14). The guide pad (52) is positioned on the inner circumference of the third member (33) of the retainer member (30). When the retainer member (30) is displaced, the guide pad (52) is guided in the up and down direction by the guide roller (51). By this, the displacement of the retainer member (30) is guided. Furthermore, since the configuration of this guide mechanism (50) is the same as the guide mechanism of a known grinding device described in Patent Document 1, further detailed description is omitted.

[0054] As illustrated in FIG. 4, the seal member (60a) is fitted and supported on the second member (32) and the third member (33) of the retainer member (30), and is also fitted and supported on the roller support member (53) and the lower member (21) of the top ring body (20). Additionally, the seal member (60a) may also be fixed to the second member (32) and / or the third member (33) by means of a bolt (not shown). The seal member (60a) is provided to prevent slurry from entering the guide roller (51) during polishing of the substrate (Wf).

[0055] In this embodiment, a space (25) is provided inside the top ring body (20). Additionally, the upper member (23) of the top ring body (20) is provided to cover the upper part of the cylinder (41) of the compression mechanism (40). A seal member (60b) is fitted and supported on the upper member (23) and the cylinder (41). Additionally, the seal member (60b) may also be fixed to the cylinder (41) and / or the upper member (23) by means of a bolt (not shown). The seal member (60b) is provided to prevent slurry from entering the space (25) inside the top ring body (20) through the gap between the upper member (23) and the cylinder (41). Furthermore, since the configuration of the seal member (60a) and the seal member (60b) is the same as the seal member of a known polishing device described in Patent Document 1, further detailed description is omitted.

[0056] Next, the surrounding configuration of the band (70) will be described. (A) of FIG. 5 is a schematic enlarged cross-sectional view of parts B2 and B3 of FIG. 4. (B) of FIG. 5 is an exploded view schematically illustrating the configuration of part B2 of FIG. 4 in an exploded state.

[0057] Referring to FIGS. 4, FIGS. 5 (A), and FIGS. 5 (B), the band (70) is positioned from the outer wall (11) of the retainer member (30) to the outer wall (11) of the compression mechanism (40). Specifically, the band (70) according to the present embodiment is positioned from the outer wall (11) of the third member (33) of the retainer member (30) to the outer wall (11) of the cylinder (41) of the compression mechanism (40). Additionally, as shown in FIGS. 2 or FIGS. 3, the band (70) is positioned entirely along the circumferential direction of the outer wall (11). As shown in FIGS. 4, the band (70) is positioned to cover the gap (26) between the retainer member (30) and the compression mechanism (40). The band (70) is provided primarily to prevent slurry from entering the space (25) from the gap (26) during polishing of the substrate (Wf). Additionally, the band (70) according to the present embodiment has an overall rectangular ring-shaped external shape.

[0058] The band (70) has at least one "fitting part" for fitting into the groove (15) described later. Specifically, as shown in FIG. 5 (A) and FIG. 5 (B), the band (70) according to the present embodiment has a fitting part (71a) and a fitting part (71b) located above the fitting part (71a). The fitting part (71b) according to the present embodiment is provided at one end (specifically the upper end) of the two ends of the band (70). In addition, the fitting part (71a) according to the present embodiment is provided at the other end (specifically the lower end) of the two ends of the band (70).

[0059] In addition, at least the fitting portion of the band (70) according to the present embodiment is composed of an elastic member such as rubber. Specifically, the band (70) according to the present embodiment is composed of an elastic member not only of the fitting portion but also of a portion other than the fitting portion. That is, the band (70) according to the present embodiment is composed entirely of an elastic member.

[0060] Referring to FIG. 5 (A) and FIG. 5 (B), at least one of the outer wall (11) of the retainer member (30) and the outer wall (11) of the compression mechanism (40) has a groove (15) for fitting a band (70). That is, the groove (15) may be provided only on the outer wall (11) of the retainer member (30), only on the outer wall (11) of the compression mechanism (40), or on both the outer wall (11) of the retainer member (30) and the outer wall (11) of the compression mechanism (40).

[0061] In this embodiment, the number of fitting portions of the band (70) and the number of grooves (15) are equal. Since the number of fitting portions of the band (70) in this embodiment is two, the grooves (15) are also provided in two locations. Specifically, the grooves (15) in this embodiment are provided on both the outer wall (11) of the retainer member (30) and the outer wall (11) of the compression mechanism (40). The fitting portion (71b) of the band (70) is fitted into the groove (15) provided on the outer wall (11) of the compression mechanism (40) (specifically, the cylinder (41)), and the fitting portion (71a) of the band (70) is fitted into the groove (15) provided on the outer wall (11) of the retainer member (30) (specifically, the third member (33)).

[0062] In addition, in this embodiment, the configuration of the groove (15) provided on the outer wall (11) of the retainer member (30) is the same as the configuration of the groove (15) provided on the outer wall (11) of the compression mechanism (40). Therefore, the details of the groove (15) will be explained by giving the groove (15) provided on the outer wall (11) of the compression mechanism (40) as a specific example.

[0063] As shown in FIG. 5 (B), the groove (15), when viewed in cross-section, has a groove opening (15a), a groove bottom (15b) facing the groove opening (15a), and a pair of groove side walls (first groove side wall (15c) and second groove side wall (15d)) connecting the groove opening (15a) and the groove bottom (15b). The first groove side wall (15c) and the second groove side wall (15d) face each other.

[0064] The first groove sidewall (15c) and the second groove sidewall (15d) are configured such that the gap d1 (i.e., “groove width”) between the first groove sidewall (15c) and the second groove sidewall (15d) widens as it approaches the bottom of the groove (15b). That is, the groove (15) in this embodiment is a “dovetail groove.”

[0065] When the fitting portions (fitting portion (71b) and fitting portion (71a)) of the band (70) are fitted into the groove (15), the fitting portions are configured to contact the first groove side wall (15c) and the second groove side wall (15d).

[0066] As described above, according to the present embodiment, since the groove (15) into which the fitting part of the band (70) is fitted is a dovetail groove, the degree of fitting between the fitting part of the band (70) and the groove (15) can be made stronger compared to the case where the groove into which the fitting part of the band is fitted is not a dovetail groove (for example, a groove with a rectangular cross-section where the spacing between a pair of groove side walls is constant). By doing so, the fitting part of the band (70) can be prevented from coming out of the groove (15) when using the top ring (10). As a result, the band (70) can be prevented from coming out of the retainer member (30) or the compression mechanism (40) when using the top ring (10). Specifically, as in the present embodiment, when dovetail grooves are provided on both sides of the retainer member (30) and the compression mechanism (40), the band (70) can be prevented from coming off the retainer member (30) and the compression mechanism (40) when the top ring (10) is used.

[0067] Additionally, as illustrated in FIG. 5 (B), the fitting portion (71b) and the fitting portion (71a) of the present embodiment each have a first convex portion (72) (in other words, the first "bump") that contacts the first groove side wall (15c) and a second convex portion (73) (in other words, the second "bump") that contacts the second groove side wall (15d). Furthermore, between the first convex portion (72) and the second convex portion (73), a V-shaped groove (74) with a cross-sectional V shape is provided. Specifically, the V-shaped groove (74) is configured such that, when viewed in cross-section, the spacing d2 (i.e., "groove width") of the V-shaped groove (74) widens as it faces the leading edge of the first convex portion (72) and the second convex portion (73).

[0068] In addition, the width d3 of the first convex portion (72) and the second convex portion (73) in this embodiment is pre-set such that the first convex portion (72) contacts the first groove side wall (15c) and the second convex portion (73) contacts the second groove side wall (15d). In addition, the maximum value of the width d3 of the first convex portion (72) and the second convex portion (73) in this embodiment is greater than the minimum value of the gap d1 between the first groove side wall (15c) and the second groove side wall (15d) (i.e., the size of the groove opening (15a)).

[0069] Additionally, referring to the enlarged view of section B4 of FIG. 4, a portion of the band (70) in this embodiment is provided with an extendable section (75) that can be extended in the vertical direction.

[0070] According to this configuration, when the retainer member (30) is displaced in the up and down direction, the expansion portion (75) can expand in the up and down direction, so the fitting portion of the band (70) can be effectively prevented from coming out of the groove (15).

[0071] In addition, in this embodiment, the dovetail groove is provided along the entire circumference in the perimeter direction of the outer wall (11) (i.e., provided in the connecting wall (13) and the corner portion (12), but is not limited to this configuration. For example, the dovetail groove may not be provided in the corner portion (12) of the outer wall (11) and may be provided only in the connecting wall (13). In this case, instead of the dovetail groove, a groove with a rectangular cross-section (a groove with a constant distance between the first groove side wall (15c) and the second groove side wall (15d) extending from the groove opening (15a) to the groove bottom (15b)) may be provided in the corner portion (12).

[0072] Additionally, when comparing the compression mechanism (40) and the retainer member (30), the compression mechanism (40) tends to be more susceptible to liquids such as cleaning fluid (e.g., cleaning fluid for cleaning the top ring (10)) or polishing slurry entering through the dovetail groove portion. Therefore, when only one of the dovetail grooves of the compression mechanism (40) and the retainer member (30) is provided over the entire circumference of the outer wall (11), for example, the dovetail groove of the compression mechanism (40) is provided over the entire circumference of the outer wall (11), and the dovetail groove of the retainer member (30) is not provided over the entire circumference of the outer wall (11). In this case, the retainer member (30) may be provided with a groove having a rectangular cross-section.

[0073] Next, variations of the embodiments described above will be explained. Additionally, in the following description, components identical to or corresponding to the embodiments described above are denoted by the same reference numerals, and descriptions are appropriately omitted.

[0074] (Variation Example 1)

[0075] FIG. 6 is an enlarged cross-sectional view schematically illustrating a portion of the top ring (10A) of the grinding device (100) according to a modified example 1 of the embodiment. Specifically, FIG. 6 schematically illustrates an enlarged portion of the same location (part B1) as in FIG. 4 above. The top ring (10A) according to this modified example differs from the top ring (10) shown in FIG. 4 above in that it is equipped with a compression mechanism (40A) instead of a compression mechanism (40) and has a band (70A) instead of a band (70).

[0076] The compression mechanism (40A) according to the present variation differs from the compression mechanism (40) exemplified in FIG. 4 in that it does not have a groove (15).

[0077] The band (70A) according to the present modification example differs from the band (70) illustrated in FIG. 4 in that, among the two ends of the band (70A), one end (76) is fitted and supported between the upper member (23) and the compression mechanism (40A). Specifically, the band (70A) has a region facing the other end of the band (70A) by a predetermined distance from the one end (76) fitted and supported between the upper member (23) and the upper surface of the cylinder (41) of the compression mechanism (40A). In other words, the one end (76) of the band (70A) according to the present modification example is fixed to the upper surface of the cylinder (41). Additionally, the band (70A) may also be fixed to the upper surface of the cylinder (41) by means of a bolt.

[0078] In addition, the other end of the band (70A) in the present modification example is formed by the aforementioned fitting part (71a), and this fitting part (71a) is fitted into the groove (15) (dovetail groove) of the retainer member (30).

[0079] In this modified example as well, since the fitting portion (71a) of the band (70A) is fitted into the groove (15) (dovetail groove), the fitting portion (71a) can be prevented from coming out of the groove (15). As a result, the band (70A) can be prevented from coming out of the retainer member (30) when using the top ring (10). In addition, since the end portion (76) of the band (70A) is fitted and supported between the upper member (23) and the compression mechanism (40A), the end portion (76) can also be prevented from coming out. As a result, the band (70A) can be prevented from coming out of the compression mechanism (40A) when using the top ring (10).

[0080] In addition, according to the present modification, for example, during maintenance of the top ring (10A), the retainer member (30) can be easily separated from the top ring (10A) by removing the fitting portion (71a) of the band (70A) from the groove (15). Specifically, the retainer member (30) and the member positioned next to the retainer member (30) (specifically, the lower member (21) and the guide mechanism (50)) (hereinafter referred to as "retainer member (30), etc.") can be easily disassembled from the top ring body (20).

[0081] Specifically, in this case, the fitting portion (71a) of the band (70A) can be removed from the groove (15) to facilitate flipping the band (70A) so that the fitting portion (71a) is placed on, for example, the upper surface of the upper member (23). By doing so, the band (70A) does not interfere when disassembling the retainer member (30), etc., and thus the retainer member (30), etc. can be easily disassembled. That is, according to this modified example, the maintainability of the top ring (10A) can be improved.

[0082] In addition, in this modified example, the groove (15) may be configured to be a non-dovetail groove. Specifically, in this case, the groove (15) may be a "rectangular cross-section groove." Even in this case, since the end portion (76) of the band (70A) is fitted and supported between the upper member (23) and the compression mechanism (40A), the end portion (76) can be prevented from slipping out. As a result, the band (70A) can be prevented from slipping out of the compression mechanism (40A) when using the top ring (10).

[0083] (Variation Example 2)

[0084] FIG. 7 (A) is a schematic diagram showing the peripheral configuration of the groove (15) of the compression mechanism (40) of the top ring (10B) according to a modified embodiment 2, viewed from the front. FIG. 7 (B) is a schematic front view of a machining tool (200) for machining a dovetail groove. The machining tool (200) exemplified in FIG. 7 (B) is equipped with a rotation axis (201) and a machining part (202) (a part for machining a dovetail groove) connected to the end of the rotation axis (201). When machining with the machining tool (200), the machining part (202) rotates as the rotation axis (201) rotates. The machining tool (200) according to the modified embodiment is, for example, a cutting tool. Accordingly, the machining part (202) is composed of a cutting edge. The processing section (202) has a shape similar to the shape of the groove side wall of the dovetail groove. Specifically, the processing section (202) has a shape in which the diameter of the processing section (202) increases as it moves toward the tip of the processing section (202).

[0085] As illustrated in FIG. 7 (A), the top ring (10B) according to the present modification has a recess (16) provided in the groove opening (15a) of the groove (15) (dovetail groove) of the compression mechanism (40). This recess (16) is a recess for the processing tool (200), specifically the processing part (202), to pass through when inserted from the groove opening (15a). Specifically, the recess (16) according to the present modification is provided to increase the opening area of ​​a part of the groove opening (15a) so that the processing part (202) can be inserted from the groove opening (15a) into the interior of the groove (15). In the processing tool (200) according to the present modification, the maximum diameter of the processing part (202) is larger than the size of the groove opening (15a) (the size of the part other than the recess (16) in the groove opening (15a). For this reason, by providing at least one such concave portion (16) in the groove opening (15a), the size of the groove opening (15a) is partially enlarged so that the processing portion (202) of the processing tool (200) can be easily inserted into the groove (15).

[0086] In addition, the specific shape of the concave portion (16) is not specifically limited, but the concave portion (16) in the present modified example has an arc shape as an example. In addition, the concave portion (16) in the present modified example is provided to be concave downwardly in a part of the groove opening (15a) when viewed from the front of the groove opening (15a), as shown in (A) of FIG. 7.

[0087] In addition, the top ring (10B) according to the present modification example has a recess (16) in the groove (15) of the retainer member (30) similar to (A) in FIG. 7 (see FIG. 8 described later).

[0088] FIG. 8 is a schematic diagram illustrating a portion of the outer wall (11) of the top ring (10B) according to the present modification example, viewed from the -X direction. Also, in FIG. 8, the band (70) is omitted from the illustration. In the top ring (10B) according to the present modification example, a position alignment mark (17) is provided on the outer wall (11) of the top ring body (20) and on the outer wall (11) of the retainer member (30), respectively. Specifically, a position alignment mark (17) is provided on the outer wall (11) of the upper member (23) of the top ring body (20). Additionally, a position alignment mark (17) is provided on the first member (31) and the second member (32) of the retainer member (30), respectively. This position alignment mark (17) is a mark that serves as an indicator for aligning the position of the constituent member when assembling and mounting the constituent member of the top ring (10B).

[0089] In addition, the position alignment marks (17) and the concave portion (16) of the groove opening (15a) are arranged so that their positions in the vertical direction match. Accordingly, the concave portion (16) in this modified example also functions as a position alignment mark.

[0090] According to the present modification example as described above, since a recess (16) is provided in the groove opening (15a), a machining tool (200) can be easily inserted into the interior of the groove (15) from the groove opening (15a) where the recess (16) is provided. By doing so, machining of the groove (15) can be easily performed.

[0091] Although embodiments and variations of the present invention have been described in detail above, the present invention is not limited to these specific embodiments or variations, and various modifications and changes are possible within the scope of the present invention as described in the claims. Explanation of the symbols

[0092] 10: Top ring 11: Outer wall 15: Home (Dovetail Home) 15a: Home opening 15b: Home bottom 15c: First groove sidewall 15d: Second groove sidewall 20: Top ring body 23: Upper member 24a: Substrate support surface 30: Retainer absence 40: Compression device 70: Band 71a, 71b: Fitting parts 72: First convex part 73: Second convex part 74: V-shaped groove 75: New construction part 76: First part 100: Grinding device 102: Grinding Table 200: Machining tools Wf: Substrate Pd: Polishing pad

Claims

Claim 1 A top ring body having a substrate support surface that supports the upper surface of a substrate; a retainer member disposed to surround the outer periphery of the substrate support surface and retaining and supporting the outer edge of the substrate; a compression mechanism disposed above the retainer member and configured to press the retainer member downward; and a band having a fitting portion disposed from the outer wall of the retainer member to the outer wall of the compression mechanism and having a groove provided in the outer wall of the retainer member into which the fitting portion of the band is fitted; the groove is a dovetail groove that, when viewed in cross-section, has a groove opening, a groove bottom facing the groove opening, a first groove sidewall connecting the groove opening and the groove bottom, and a second groove sidewall connecting the groove opening and the groove bottom and facing the first groove sidewall, wherein the gap between the first groove sidewall and the second groove sidewall widens as it approaches the groove bottom, and the fitting portion of the band A top ring of a grinding device, wherein, when fitted into the above dovetail groove, the fitting portion is configured to contact the first groove sidewall and the second groove sidewall, the top ring body has an upper member provided to cover the upper part of the compression mechanism, one end of the two ends of the band is fitted and supported by the upper member and the compression mechanism, and the fitting portion of the band is provided at the other end of the band. Claim 2 A top ring of a grinding device according to claim 1, wherein the fitting portion of the band has a first convex portion that contacts the side wall of the first groove and a second convex portion that contacts the side wall of the second groove, and a V-shaped groove with a V-shaped cross section is provided between the first convex portion and the second convex portion. Claim 3 A top ring of a grinding device according to claim 1, wherein a portion of the band is provided with an elastic portion capable of being stretchable in the vertical direction. Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 A top ring of a grinding device according to claim 1, wherein the groove opening is provided with a recess for a machining tool to pass through when the tool is inserted from the groove opening into the groove. Claim 8 In claim 1, the substrate is a square substrate, and is the top ring of a polishing device. Claim 9 A top ring of a polishing device, comprising: a top ring body having a substrate support surface that supports the upper surface of a substrate; a retainer member arranged to surround the outer periphery of the substrate support surface and retain and support the outer edge of the substrate; a compression mechanism arranged above the retainer member and configured to press the retainer member downward; and a band having a fitting portion arranged extending from the outer periphery wall of the retainer member to the outer periphery wall of the compression mechanism, wherein a groove is provided in the outer periphery wall of the retainer member into which the fitting portion of the band is fitted; the top ring body has an upper member arranged to cover the upper part of the compression mechanism; and among the two ends of the band, one end is fitted and supported by the upper member and the compression mechanism, and the fitting portion of the band is provided at the other end of the band. Claim 10 A polishing device having a top ring described in claim 1 or 9, and a polishing table that holds and supports a polishing pad for polishing the substrate held and supported on the top ring. Claim 11 In paragraph 2, the top ring of a grinding device having a gap between the bottom of the groove and the fitting portion when the fitting portion of the band is fitted into the dovetail groove. Claim 12 A top ring of a grinding device according to claim 1 or 9, wherein the upper member and the one end portion fitted and supported by the compression mechanism are configured to cover the upper surface of the compression mechanism entirely. Claim 13 A top ring of a grinding device according to claim 7, wherein a first position alignment mark is provided on the outer wall of the top ring body, a second position alignment mark is provided on the outer wall of the retainer member, and the concave portion provided in the groove opening, the first position alignment mark, and the second position alignment mark are arranged so as to be aligned in the vertical direction.

Citation Information

Patent Citations

  • Substrate holding apparatus and substrate polishingapparatus

    KR1020020010881A

  • Substrate holding apparatus, grinding apparatus and grinding method

    KR1020130088804A

  • Top ring for holding a substrate and substrate processing apparatus

    KR1020200015390A

  • Dovetail groove machining method and substrate treatment apparatus

    KR1020200137999A

  • Substrate retaining device and polishing device with the substrate retaining device

    JP2002113653A