Substrate Connector and Substrate for Substrate Connector

KR103000382B1Active Publication Date: 2026-08-05LS MTRON LTD
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Patent Information

Application Number
KR1020220142555
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-11-23
Filing Date
2022-10-31
Publication Date
2026-08-05
Estimated Expiration
2042-10-31

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Abstract

The present invention relates to a substrate for a substrate connector comprising: an outer grounding pattern; a first mounting area disposed inside the outer grounding pattern; a second mounting area disposed spaced apart from the first mounting area with respect to a first axis direction; and a mixed shielding pattern disposed between the first mounting area and the second mounting area with respect to the first axis direction, wherein the first mounting area includes a first RF mounting pattern for mounting a plurality of RF contacts and a first transmission mounting pattern for mounting a plurality of transmission contacts, and the second mounting area includes a second RF mounting pattern for mounting a plurality of RF contacts and a second transmission mounting pattern for mounting a plurality of transmission contacts, and wherein the first RF mounting pattern and the second RF mounting pattern are disposed offset from each other with respect to the first axis direction.
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Description

Technology Field

[0001] The present invention relates to a substrate on which a substrate connector, installed in an electronic device for electrical connection between substrates, is mounted. Background Technology

[0002] A substrate is a board on which electrical circuits are arranged. Connectors, which are provided in various electronic devices for electrical connection, can be mounted on such substrates. For example, connectors are installed in electronic devices such as mobile phones, computers, and tablet computers to electrically connect the individual substrates installed within the devices.

[0003] FIG. 1 is a schematic conceptual diagram of a wireless communication device (100) according to the prior art.

[0004] Referring to FIG. 1, a wireless communication device (100) according to the prior art may include a substrate (110), an antenna module (120), a connector (130), and a connection part (140). A plurality of connectors (130) may be installed in the wireless communication device (100) according to the prior art to transmit RF signals. In this case, the connectors (130) may be installed in accordance with the number of required RF signals. As shown in FIG. 1, the wireless communication device (100) according to the prior art may include a first connector (131), a second connector (132), a third connector (133), and a fourth connector (134). The connection part (140) may connect the connector (130) installed on the antenna module (120) and the connector (130) installed on the substrate (110). For example, the first connecting part (141) can connect the first connector (131) installed on the substrate (110) and the third connector (133) installed on the first antenna module (121). The second connecting part (142) can connect the second connector (132) installed on the substrate (110) and the fourth connector (134) installed on the second antenna module (122).

[0005] Here, in a wireless communication device (100) according to the prior art, a plurality of connectors (130) are installed on the substrate (110) for transmitting a plurality of RF signals. Accordingly, the wireless communication device (100) according to the prior art has a problem in that there is insufficient space to install other components other than the connectors (130) as the degree of integration increases due to performance improvement. In addition, the wireless communication device (100) according to the prior art has a problem in that the number of labors required for the coupling work to combine the connectors (130) increases. The problem to be solved

[0006] The present invention has been devised to solve the problems described above and relates to a substrate for a connector that minimizes the mounting area of ​​the substrate and enables a rapid coupling operation for coupling the connector. means of solving the problem

[0007] To solve the above problems, the present invention may include the following configuration.

[0008] It may include an outer grounding pattern; a first mounting area disposed inside the outer grounding pattern; a second mounting area disposed spaced apart from the first mounting area with respect to a first axis direction; and a mixed shielding pattern disposed between the first mounting area and the second mounting area with respect to the first axis direction. The first mounting area may include a first RF mounting pattern for mounting a plurality of RF contacts and a first transmission mounting pattern for mounting a plurality of transmission contacts. The second mounting area may include a second RF mounting pattern for mounting a plurality of RF contacts and a second transmission mounting pattern for mounting a plurality of transmission contacts. The first RF mounting pattern and the second RF mounting pattern may be disposed offset from each other with respect to the first axis direction.

[0009] The present invention may include an outer grounding pattern; a first mounting area disposed inside the outer grounding pattern; a second mounting area disposed spaced apart from the first mounting area with respect to a first axis direction; and a mixed shielding pattern disposed between the first mounting area and the second mounting area with respect to the first axis direction. The outer grounding pattern may include a first outer grounding pattern; a second outer grounding pattern disposed spaced apart from the first outer grounding pattern with respect to the first axis direction; a third outer grounding pattern connected to each of the first outer grounding pattern and the second outer grounding pattern; and a fourth outer grounding pattern disposed spaced apart from the third outer grounding pattern with respect to the second axis direction perpendicular to the first axis direction. The above mixed shielding pattern can be electrically connected to each of the third outer grounding pattern and the fourth outer grounding pattern to distinguish the first transmission area and the second transmission area based on the second axis direction.

[0010] The present invention may include an outer grounding pattern; a first mounting area disposed inside the outer grounding pattern; a second mounting area disposed spaced apart from the first mounting area with respect to a first axis direction; and an RF shielding pattern disposed between the first mounting area and the second mounting area with respect to the first axis direction. The first mounting area may include a first RF mounting pattern for mounting a plurality of RF contacts and a first transmission mounting pattern for mounting a plurality of transmission contacts. The second mounting area may include a second RF mounting pattern for mounting a plurality of RF contacts and a second transmission mounting pattern for mounting a plurality of transmission contacts. The RF shielding pattern may be disposed between the first RF mounting pattern and the second RF mounting pattern with respect to the first axis direction.

[0011] The present invention may include an outer grounding pattern; a first mounting area disposed inside the outer grounding pattern; a second mounting area disposed spaced apart from the first mounting area with respect to a first axis direction; and a transmission shielding pattern disposed between the first mounting area and the second mounting area with respect to the first axis direction. The first mounting area may include a first RF mounting pattern for mounting a plurality of RF contacts and a first transmission mounting pattern for mounting a plurality of transmission contacts. The second mounting area may include a second RF mounting pattern for mounting a plurality of RF contacts and a second transmission mounting pattern for mounting a plurality of transmission contacts. The transmission shielding pattern may be disposed between the first transmission mounting pattern and the second transmission mounting pattern with respect to the first axis direction. Effects of the invention

[0012] According to the present invention, the following effects can be achieved.

[0013] The present invention allows for the placement of many patterns for mounting RF contacts that transmit RF signals in a limited space, while ensuring shielding performance between components mounted on each pattern arranged on a substrate for an RF connector according to the present invention through shielding patterns. Accordingly, the present invention enables the transmission of various signals by placing RF mounting patterns in a limited space and can contribute to minimizing the area of ​​the mounted RF connector.

[0014] In the present invention, a mixed shielding pattern or a transmission shielding pattern may be arranged so that a first transmission area and a second transmission area are separated from each other. Accordingly, the present invention can prevent interference between RF signals in the first transmission area and RF signals in the second transmission area by completely shielding the first transmission area and the second transmission area through the mixed shielding pattern or the transmission shielding pattern. Brief explanation of the drawing

[0015] FIG. 1 is a schematic conceptual diagram of a wireless communication device according to the prior art. FIG. 2 is a schematic plan view showing an outer ground pattern in a substrate for a substrate connector according to the present invention. FIG. 3 is a schematic plan view showing a first transmission region and a second transmission region in a substrate for a substrate connector according to a first embodiment. FIG. 4 is a schematic plan view of a substrate for a substrate connector according to the first embodiment. FIG. 5 is a schematic plan view showing a first transmission region and a second transmission region in a substrate for a substrate connector according to a second embodiment. FIG. 6 is a schematic plan view of a substrate for a substrate connector according to a second embodiment. FIG. 7 is a schematic plan view showing a first transmission region and a second transmission region in a substrate for a substrate connector according to a third embodiment. FIG. 8 is a schematic plan view of a substrate for a substrate connector according to a third embodiment. FIG. 9 is a schematic plan view showing a first transmission region and a second transmission region in a substrate for a substrate connector according to a fourth embodiment. FIG. 10 is a schematic plan view of a substrate for a substrate connector according to a fourth embodiment. FIG. 11 is a schematic perspective view of a substrate connector according to the present invention. FIG. 12 is a schematic exploded view of a substrate connector according to the present invention. FIG. 13 is a schematic perspective view of a ground contact in a substrate connector according to the present invention. Specific details for implementing the invention

[0016] Hereinafter, an embodiment of a substrate (1) for a substrate connector according to the present invention will be described in detail with reference to the attached drawings. Meanwhile, the substrate (1) for a substrate connector according to the present invention will be described based on the assumption that a contact having at least 16 pins is mounted thereon.

[0017] Referring to FIGS. 2 to 6, an RF connector (not shown) is mounted on a substrate (1) for a substrate connector according to the present invention and can be installed in a mobile phone, computer, tablet, or electronic device (not shown).

[0018] Referring to FIGS. 2 to 10, a pin for transmitting RF (Radio Frequency) signals, signals, data, and power may be mounted on a substrate (1) for a substrate connector according to the present invention. Additionally, a pin responsible for grounding may be mounted on the substrate (1) for a substrate connector according to the present invention to prevent interference between each signal. Here, the pin may be defined as a contact, and depending on its use, it may be defined by terms such as an RF contact (not shown), a transmission contact (not shown), or a ground contact (not shown). A ground housing (not shown) may be coupled to the substrate (1) for a substrate connector according to the present invention for coupling with different substrates. In this case, the RF contact, the transmission contact, and the ground contact may each be mounted on the substrate (1) for a substrate connector according to the present invention by being placed inside the ground housing.

[0019] The grounding housing or the grounding contact may be mounted on the outer grounding pattern (2). The grounding housing or the grounding contact may be grounded by being mounted on the outer grounding pattern (2) and electrically connected. By mounting the grounding housing on the outer grounding pattern (2), it may be implemented to be shielded from the outside of the board connector.

[0020] The RF contact that transmits an RF (Radio Frequency) signal may be mounted on the RF mounting pattern (5). The RF contact may be mounted on the RF mounting pattern (5) and electrically connected. The outer grounding pattern (2) and the shielding pattern (7) for shielding the RF signal are arranged around the RF mounting pattern (5), so that the grounding housing or the grounding contact is mounted, thereby enabling complete shielding of the RF signal.

[0021] The transmission contact may be mounted on the transmission mounting pattern (6). The transmission contact may be mounted on the transmission mounting pattern (6) and electrically connected. The transmission mounting pattern (6) may include a first transmission mounting pattern (61) and a second transmission mounting pattern (62). The first transmission mounting pattern (61) and the second transmission mounting pattern (62) may be implemented to be consistent with each other in terms of function, differing only in their placement locations.

[0022] The grounding contact or the grounding housing may be mounted on the shielding pattern (7). The grounding housing or the grounding contact may be grounded by being mounted on the shielding pattern (7) and electrically connected. The shielding pattern (7) may be divided so that the RF mounting pattern (5) and the transmission mounting pattern (6) are placed in different areas. Accordingly, the grounding contact, etc., may be mounted on the shielding pattern (7) to shield the space between the RF contact mounted on the RF mounting pattern (5) and the transmission contact mounted on the transmission pattern. The shielding pattern (7) may include a first shielding pattern (71), a second shielding pattern (72), a mixed shielding pattern (73), an RF shielding pattern (74), and a transmission shielding pattern (75). Each of the above first shielding pattern (71), the above second shielding pattern (72), the above mixed shielding pattern (73), the above RF shielding pattern (74), and the above transmission shielding pattern (75) can be implemented in a manner consistent with each other in terms of function, differing only in the position where they are placed.

[0023] Referring to FIG. 2, the outer ground pattern (2) is printed on a substrate (1) for a substrate connector according to the present invention. The outer ground pattern (2) may have a closed loop structure. In this case, the outer ground pattern (2) may have a continuous band shape. The first mounting area (3), the second mounting area (4), and the shielding pattern (7) may be arranged inside the outer ground pattern (2). Although FIG. 2 shows the outer ground pattern (2) having a rectangular shape, it is not limited thereto and may have a shape such as a circle depending on the shape of the substrate connector being mounted.

[0024] As shown in FIG. 2, the outer grounding pattern (2) may include a first outer grounding pattern (21), a second outer grounding pattern (22), a third outer grounding pattern (23), and a fourth outer grounding pattern (24).

[0025] The first outer grounding pattern (21) and the second outer grounding pattern (22) may be arranged to face each other with respect to the second axis direction (Y-axis direction). The third outer grounding pattern (23) and the fourth outer grounding pattern (24) may be arranged to face each other with respect to the first axis direction (X-axis direction). The third outer grounding pattern (23) and the fourth outer grounding pattern (24) may be arranged between the first outer grounding pattern (21) and the second outer grounding pattern (22) with respect to the second axis direction (Y-axis direction). In this way, the first outer grounding pattern (21), the second outer grounding pattern (22), the third outer grounding pattern (23), and the fourth outer grounding pattern (24) can be connected to each other to form a single unit. In this case, the first mounting area (3) and the second mounting area (4) can be arranged on the inner side of the first outer grounding pattern (21), the second outer grounding pattern (22), the third outer grounding pattern (23), and the fourth outer grounding pattern (24).

[0026] Below, various embodiments of a substrate (1) for a substrate connector according to the present invention will be described in detail with reference to the attached drawings.

[0027] Referring to FIGS. 2, 3, and 4, a substrate (11) for a substrate connector according to the first embodiment may include the outer grounding pattern (2), the first mounting area (3), the second mounting area (4), and the mixed shielding pattern (73).

[0028] In the substrate (11) for a substrate connector according to the first embodiment, the first mounting area (3) and the second mounting area (4) may be formed inside the outer grounding pattern (2). The outer grounding pattern (2) may be arranged to surround the first mounting area (3) and the second mounting area (4). In this case, the first mounting area (3) and the second mounting area (4) may be arranged to be spaced apart from each other based on the first axis direction (X-axis direction).

[0029] The first mounting area (3) is positioned inside the outer grounding pattern (2). The first mounting area (3) may be positioned offset to one side from the inside of the outer grounding pattern (2). In this case, the first mounting area (3) may be positioned adjacent to the third outer grounding pattern (23). The first mounting area (3) may be a flat surface having a certain area. A first transmission area (31) and a first RF area (32) may be positioned in the first mounting area (3).

[0030] The second mounting area (4) is positioned so as to be spaced apart from the first mounting area (3) based on the first axis direction (X-axis direction). The first mounting area (3) may be positioned inside the outer grounding pattern (2). The second mounting area (4) may be positioned offset to one side from the inside of the outer grounding pattern (2). In this case, the second mounting area (4) may be positioned adjacent to the fourth outer grounding pattern (24). The second mounting area (4) may be a flat surface having a certain area. A second transmission area (41) and a second RF area (42) may be positioned in the second mounting area (4).

[0031] Referring to FIG. 4, in a substrate (11) for a substrate connector according to the first embodiment, the first mounting area (3) can be divided into the first transmission area (31) and the first RF area (32). The first transmission area (31) and the first RF area (32) can be arranged to be spaced apart from each other along the second axis direction (Y-axis direction).

[0032] Referring to FIG. 4, the first mounting area (3) may include a first transmission mounting pattern (61) and a first RF mounting pattern (51).

[0033] The first transmission mounting pattern (61) is intended for mounting the transmission contact (not shown). The first transmission mounting pattern (61) may be placed inside the first transmission area (31). If the substrate connector (not shown) includes a plurality of transmission contacts, a plurality of the first transmission mounting patterns (61) may be placed inside the first transmission area (31). Accordingly, the transmission contacts may be implemented to be mounted on the first transmission mounting patterns (61) and electrically connected.

[0034] The first RF mounting pattern (51) is intended for mounting the RF contact (not shown). The first RF mounting pattern (51) may be placed inside the first RF area (32). If the substrate connector (not shown) includes a plurality of the RF contacts, a plurality of the first RF mounting patterns (51) may be placed inside the first RF area (32). Accordingly, the RF contacts may be mounted on the first RF mounting patterns (51) and electrically connected.

[0035] Referring to FIG. 4, in a substrate (11) for a substrate connector according to the first embodiment, the second mounting area (4) can be divided into a second transmission area (41) and a second RF area (42). The first transmission area (31) and the first RF area (32) can be arranged to be spaced apart from each other along the second axis direction (Y-axis direction). Based on the first axis direction (X-axis direction), the second transmission area (41) can be arranged to face the first RF area (32). Based on the first axis direction (X-axis direction), the second RF area (42) can be arranged to face the first transmission area (31). In this case, the mixed shielding pattern (73) may be placed between the second transmission area (41) and the first RF area (32) and between the second RF area (42) and the first transmission area (31).

[0036] Referring to FIG. 4, the second mounting area (4) may include a second transmission mounting pattern (62) and a second RF mounting pattern (52).

[0037] The second transmission mounting pattern (62) is intended for mounting the transmission contact (not shown). The second transmission mounting pattern (62) may be placed inside the second transmission area (41). If the substrate connector (not shown) includes a plurality of transmission contacts, a plurality of the second transmission mounting patterns (62) may be placed inside the second transmission area (41). Accordingly, the transmission contacts may be implemented to be mounted on the second transmission mounting patterns (62) and electrically connected.

[0038] The second RF mounting pattern (52) is intended for mounting the RF contact (not shown). The second RF mounting pattern (52) may be placed inside the second RF area (42). If the substrate connector (not shown) includes a plurality of RF contacts, a plurality of the second RF mounting patterns (52) may be placed inside the second RF area (42). Accordingly, the RF contacts may be mounted on the second RF mounting patterns (52) and electrically connected. In the substrate (11) for the substrate connector according to the first embodiment, the first RF mounting pattern (51) and the first RF mounting pattern (51) may be arranged offset from each other with respect to the first axis direction (X-axis direction). Accordingly, the substrate (11) for the substrate connector according to the first embodiment can secure a distance that prevents interference between the RF signals transmitted by the RF contacts mounted on the first RF mounting pattern (51) and the second RF mounting pattern (52). Accordingly, the substrate (11) for the substrate connector according to the first embodiment can not only secure shielding performance between the RF contacts through the first RF mounting pattern (51) and the second RF mounting pattern (52), but also allow many RF mounting patterns (5) for mounting RF contacts that transmit RF signals in a limited space.

[0039] Referring to FIG. 4, in the substrate (11) for a substrate connector according to the first embodiment, the shielding pattern (7) may include a first shielding pattern (71), a second shielding pattern (72), and a mixed shielding pattern (73).

[0040] The first shielding pattern (71) is positioned between the first transmission area (31) and the first RF area (32) based on the second axis direction (Y-axis direction). The first shielding pattern (71) can be electrically connected to the outer grounding pattern (2). In this case, the first shielding pattern (71) can be electrically connected to the third outer grounding pattern (23).

[0041] The second shielding pattern (72) is positioned between the second transmission area (41) and the second RF area (42) based on the second axis direction (Y-axis direction). The second shielding pattern (72) can be electrically connected to the outer grounding pattern (2). In this case, the second shielding pattern (72) can be electrically connected to the fourth outer grounding pattern (24).

[0042] The above mixed shielding pattern (73) is positioned between the first mounting area (3) and the second mounting area (4) based on the second axis direction (Y-axis direction). The above mixed shielding pattern (73) can separate the first mounting area (3) and the second mounting area (4) along the second axis direction (Y-axis direction). The above mixed shielding pattern (73) can be electrically connected to surround the first transmission area (31) together with the outer grounding pattern (2). Additionally, the above mixed shielding pattern (73) can be electrically connected to surround the second transmission area (41) together with the outer grounding pattern (2).

[0043] As illustrated in FIG. 4, the substrate (11) for the substrate connector according to the first embodiment may include a plurality of the first RF mounting pattern (51), the second RF mounting pattern (52), the first transmission mounting pattern (61), and the second transmission mounting pattern (62) when the substrate connector includes a plurality of the transmission contact and the RF contact. In this case, the substrate (11) for the substrate connector according to the first embodiment may also include a plurality of the mixed shielding pattern (73). Accordingly, a plurality of the first RF mounting pattern (51), the second RF mounting pattern (52), the first transmission mounting pattern (61), the second transmission mounting pattern (62), and the mixed shielding pattern (73) may be arranged inside the outer grounding pattern (2).

[0044] The above mixed shielding pattern (73) may be positioned between the second transmission mounting pattern (62) and the first RF mounting pattern (51) with respect to the first axis direction (X-axis direction). In this case, the mixed shielding pattern (73) may be electrically connected to the first shielding pattern (71). Accordingly, the mixed shielding pattern (73), the first shielding pattern (71), and the third outer grounding pattern (23) may be positioned to surround four sides with respect to the first RF mounting pattern (51). Accordingly, the substrate (11) for the substrate connector according to the first embodiment can achieve complete shielding for the RF contact mounted on the first RF mounting pattern (51) by mounting a member that is grounded to the mixed shielding pattern (73), the first shielding patterns (71), and the third outer grounding pattern (23). Additionally, the first RF mounting pattern (51) can be positioned so as to be spaced apart from each of the mixed shielding pattern (73), the first shielding pattern (71), and the third outer grounding pattern (23) by the same distance. Accordingly, the substrate (11) for the substrate connector according to the first embodiment can achieve uniform shielding performance for the RF contact mounted on the first RF mounting pattern (51).

[0045] The above mixed shielding pattern (73) may be positioned between the first transmission mounting patterns (61) and the second RF mounting patterns (52) with respect to the first axis direction (X-axis direction). In this case, the mixed shielding pattern (73) may be electrically connected to the second shielding patterns (72). Accordingly, the mixed shielding pattern (73), the second shielding patterns (72), and the fourth outer grounding pattern (24) may be positioned to surround four sides with respect to the second RF mounting pattern (52). Accordingly, the substrate (11) for the substrate connector according to the first embodiment can achieve complete shielding for the RF contact mounted on the second RF mounting pattern (52) by mounting a member that is grounded to the mixed shielding pattern (73), the second shielding patterns (72), and the fourth outer grounding pattern (24). The mixed shielding patterns (73) can be arranged to be spaced apart from each other along the second axis direction (Y-axis direction). Accordingly, the substrate (11) for the substrate connector according to the first embodiment can minimize the member to be mounted on the mixed shielding patterns (73). Accordingly, the manufacturing cost of the substrate connector according to the first embodiment can be reduced. On the other hand, the mixed shielding patterns (73) may be electrically connected to each other and formed as a single unit. Accordingly, the substrate (11) for the substrate connector according to the first embodiment can separate the first mounting area (3) and the second mounting area (4) into independent areas through the mixed shielding patterns (73). Therefore, the substrate (11) for the substrate connector according to the first embodiment can achieve complete shielding of the first mounting area (3) and the second mounting area (4) through the mixed shielding patterns (73).

[0046] Referring to FIGS. 2, 3, and 4, a substrate (11) for a substrate connector according to the first embodiment may include a plurality of the first transmission area (31), the first RF area (32), the second transmission area (41), and the second RF area (42). The first transmission areas (31) and the first RF areas (32) may be arranged alternately and sequentially inside the first mounting area (3). For example, as shown in FIG. 3, the first transmission area (31) - the first RF area (32) - the first transmission area (31) - the first RF area (32) may be arranged in the order of the first transmission area (31) - the first RF area (32) - the first RF area (32) along the first axis direction (X-axis direction) inside the first mounting area (3). The first shielding pattern (71) of the first transmission area (31) and the first RF area (32) may be arranged. The second transmission areas (41) and the second RF areas (42) can be arranged alternately and sequentially inside the second mounting area (4). For example, as shown in FIG. 3, the second RF areas (42) - the second transmission area (41) - the second RF area (42) - the second transmission area (41) can be arranged in the order of the first axis direction (X-axis direction) inside the second mounting area (4). Since the second RF area (42) is arranged facing the first transmission area (31) based on the second axis direction (Y-axis direction), the second RF area (42) can be arranged offset from the first RF area (32).

[0047] Referring to FIGS. 2, FIGS. 5, and FIGS. 6, a substrate (12) for a substrate connector according to the second embodiment can be implemented as follows. The substrate (12) for a substrate connector according to the second embodiment may include an outer grounding pattern (2), a first mounting area (3), a second mounting area (4), an RF mounting pattern (5), a transmission mounting pattern (6), and a shielding pattern (7). In this case, since each of the outer grounding pattern (2), the first mounting area (3), the second mounting area (4), the RF mounting pattern (5), the transmission mounting pattern (6), and the shielding pattern (7) can be implemented to roughly correspond to each of the outer grounding pattern (2), the first mounting area (3), the second mounting area (4), the RF mounting pattern (5), the transmission mounting pattern (6), and the shielding pattern (7) in the substrate (11) for the substrate connector according to the first embodiment, a detailed description is omitted.

[0048] Referring to FIGS. 2, 5, and 6, a substrate (12) for a substrate connector according to the second embodiment may include the outer grounding pattern (2), the first mounting area (3), the second mounting area (4), and the mixed shielding pattern (73).

[0049] In the substrate (12) for the substrate connector according to the second embodiment, the mixed shielding pattern (73) may be formed integrally. For example, the mixed shielding pattern (73) may be formed as a single unit. The mixed shielding pattern (73) may be electrically connected to the third outer grounding pattern (23) and the fourth outer grounding pattern (24), respectively, to distinguish the first mounting area (3) and the second mounting area (4) based on the second axis direction (Y-axis direction). Accordingly, the substrate (12) for the substrate connector according to the second embodiment can prevent interference between the RF signal in the first mounting area (3) and the RF signal in the second mounting area by completely shielding the first mounting area (3) and the second mounting area (4) through the mixed shielding pattern (73).

[0050] Referring to FIGS. 2, 5, and 6, the mixed shielding pattern (73) can be electrically connected to the first shielding pattern (71) and the second shielding pattern (72). In this case, the mixed shielding pattern (73), the first shielding pattern (71), and the third outer grounding pattern (23) can be electrically connected to surround the first RF mounting pattern (51). Accordingly, the substrate (12) for the substrate connector according to the second embodiment can be implemented to transmit various signals by separating the first mounting area (3) and the second mounting area (4) through the mixed shielding pattern (73) and by arranging the first RF area (32) separated from the first transmission area (31). Additionally, the mixed shielding pattern (73), the second shielding pattern (72), and the fourth outer grounding pattern (24) can be electrically connected to surround the second RF mounting pattern (52). Accordingly, the substrate (12) for the substrate connector according to the second embodiment can be implemented to transmit various signals by separating the second mounting area (4) and the first mounting area (3) through the mixed shielding pattern (73) and by arranging the second RF area (42) which is separated from the second transmission area (41). The mixed shielding pattern (73) can be arranged to traverse along the second axis direction (Y-axis direction) as shown in FIG. 3. One side of the above mixed shielding pattern (73) is connected to the third outer grounding pattern (23), and the other side of the above mixed shielding pattern (73) can be connected to the fourth outer grounding pattern (24).

[0051] Referring to FIGS. 2, FIGS. 7, and FIGS. 8, a substrate (13) for a substrate connector according to the third embodiment can be implemented as follows. A substrate (12) for a substrate connector according to the second embodiment may include an outer grounding pattern (2), a first mounting area (3), a second mounting area (4), an RF mounting pattern (5), a transmission mounting pattern (6), and a shielding pattern (7). In this case, since each of the outer grounding pattern (2), the first mounting area (3), the second mounting area (4), the RF mounting pattern (5), the transmission mounting pattern (6), and the shielding pattern (7) can be implemented to roughly correspond to each of the outer grounding pattern (2), the first mounting area (3), the second mounting area (4), the RF mounting pattern (5), the transmission mounting pattern (6), and the shielding pattern (7) in the substrate (11) for the substrate connector according to the first embodiment, a detailed description is omitted.

[0052] Referring to FIGS. 2, 7, and 8, a substrate (13) for a substrate connector according to the third embodiment may include the outer ground pattern (2), the first mounting area (3), the second mounting area (4), and the RF shielding pattern (74).

[0053] The RF shielding pattern (74) may be positioned between the first RF mounting pattern (51) and the second RF mounting pattern (52) with respect to the first axis direction (X-axis direction). In this case, the RF shielding pattern (74) may be electrically connected to the outer grounding pattern (2) and the first shielding pattern (71). Accordingly, the RF shielding pattern (74), the first outer grounding pattern (21), the third outer grounding pattern (23), and the first shielding pattern (71) may be positioned to surround four sides with respect to the first RF mounting pattern (51). Accordingly, the substrate (13) for the substrate connector according to the third embodiment can achieve complete shielding of the RF contact mounted on the first RF mounting pattern (51) by mounting a member that is grounded to the RF shielding pattern (74), the first outer grounding pattern (21), the third outer grounding pattern (23), and the first shielding pattern (71).

[0054] Additionally, the RF shielding pattern (74) can be electrically connected to the outer grounding pattern (2) and the second shielding pattern (72). Accordingly, the RF shielding pattern (74), the first outer grounding pattern (21), the fourth outer grounding pattern (24), and the second shielding pattern (72) can be arranged to surround four sides based on the second RF mounting pattern (52). Thus, the substrate (13) for the substrate connector according to the third embodiment can achieve complete shielding of the RF contact mounted on the first RF mounting pattern (51) by mounting a member that is grounded to the RF shielding pattern (74), the first outer grounding pattern (21), the fourth outer grounding pattern (24), and the second shielding pattern (72).

[0055] Based on the first axis direction (X-axis direction), the distance at which the first RF mounting pattern (51) is separated from the outer grounding pattern (2) may be shorter than the distance at which it is separated from the first shielding pattern (71). For example, as shown in FIG. 8, the distance (L1) at which the first RF mounting pattern (51) is separated from the first shielding pattern (71) based on the first axis direction (X-axis direction) may be shorter than the distance (L2) at which it is separated from the second outer grounding pattern (22). That is, the first RF mounting pattern (51) may be positioned so as to be offset toward the first shielding pattern (71). The reason for forming it short is that L1 is formed short because space must be secured, as large terminals for power terminals may be formed at both ends of the connector.

[0056] Referring to FIGS. 2, FIGS. 9, and FIGS. 10, a substrate (14) for a substrate connector according to the fourth embodiment can be implemented as follows. A substrate (13) for a substrate connector according to the third embodiment may include an outer grounding pattern (2), a first mounting area (3), a second mounting area (4), an RF mounting pattern (5), a transmission mounting pattern (6), and a shielding pattern (7). In this case, since each of the outer grounding pattern (2), the first mounting area (3), the second mounting area (4), the RF mounting pattern (5), the transmission mounting pattern (6), and the shielding pattern (7) can be implemented to roughly correspond to each of the outer grounding pattern (2), the first mounting area (3), the second mounting area (4), the RF mounting pattern (5), the transmission mounting pattern (6), and the shielding pattern (7) in the substrate (13) for the substrate connector according to the third embodiment, a detailed description is omitted.

[0057] Referring to FIGS. 2, FIGS. 9, and FIGS. 10, a substrate (14) for a substrate connector according to the fourth embodiment may include the outer ground pattern (2), the first mounting area (3), the second mounting area (4), and the transmission shielding pattern (75).

[0058] The transmission shielding pattern (75) may be positioned between the first transmission housing pattern (61) and the second transmission housing pattern (62) based on the first axis direction (X-axis direction). The transmission shielding pattern (75) may be positioned to space the first transmission housing patterns (61) and the second transmission housing patterns (62) apart from each other along the first axis direction (X-axis direction).

[0059] A substrate (14) for a substrate connector according to the fourth embodiment may include the RF shielding pattern (74). The RF shielding pattern (74) may be arranged in multiple numbers on the inner side of the outer grounding pattern (2). The RF shielding patterns (74) may be arranged between the first RF mounting patterns (51) and the second RF mounting patterns (52) with respect to the first axis direction (X-axis direction). The transmission shielding pattern (75) may be arranged between the RF shielding patterns (74) with respect to the first axis direction (X-axis direction). In this case, the transmission shielding pattern (75) may be electrically connected to the RF shielding patterns (74). In this case, the transmission shielding pattern (75), the first shielding patterns (71), and the third outer grounding pattern (23) can be electrically connected to surround the transmission mounting pattern (6). Accordingly, in the substrate (14) for the substrate connector according to the fourth embodiment, the transmission shielding pattern (75) can be arranged along the second axis direction (Y-axis direction) so that the first transmission area (31) and the second transmission area (41) are separated. Thus, the substrate (14) for the substrate connector according to the fourth embodiment can prevent interference between the RF signal in the first mounting area (3) and the RF signal in the second mounting area (4) by completely shielding the first mounting area (3) and the second mounting area (4) through the transmission shielding pattern (75). The transmission shielding pattern (75) can be arranged to traverse along the second axis direction (Y-axis direction) as shown in FIG. 10.

[0060] Meanwhile, the following substrate connector (100) may be mounted on the substrate for the substrate connector (100) according to the present invention.

[0061] A substrate connector (100) according to the present invention comprises a plurality of contacts (110), an insulating part (130) supporting the contacts (110) arranged in two rows based on a first axial direction (X-axis direction), a grounding housing (120) to which the insulating part (130) is coupled, and a grounding contact (140) coupled to the insulating part (130) and arranged along a second axial direction (Y-axis direction) perpendicular to the first axial direction (X-axis direction), wherein the grounding contact (140) is arranged between the contacts (110) based on the first axial direction (X-axis direction) to shield the space between the contacts (110). Accordingly, the substrate connector (100) according to the present invention can achieve the following effects.

[0062] In the substrate connector (100) according to the present invention, the ground contact (140) may be arranged to cross between the contacts (110) arranged in two rows based on the first axis direction (X-axis direction). Accordingly, the substrate connector (100) according to the present invention can achieve complete shielding by enhancing the shielding function for the contacts (110) using the ground contact (140).

[0063] The substrate connector (100) according to the present invention is implemented such that the ground contact (140) is positioned at the center of the substrate connector (100), compared to a comparative example in which the ground contact (140) is positioned only at both ends along the second axis direction (Y-axis direction), thereby improving the shielding performance for the contacts (110) compared to the comparative example.

[0064] Below, the contact (110), the insulating part (130), the grounding housing (120), and the grounding contact (140) are described in detail with reference to the attached drawings.

[0065] Referring to FIG. 4 and FIG. 11 to 13, the contact (110) is coupled to the insulating part (130). The contact (110) may perform the function of transmitting RF (Radio Frequency) signals, signals, data, etc. The contacts (110) may include an RF contact (114) for transmitting RF signals and a transmission contact (113) for transmitting signals or data. The RF contact (114) may be connected to the RF mounting pattern (5) and electrically connected to the substrate. The transmission contact (113) may be connected to the transmission mounting pattern and electrically connected to the substrate. The contacts (110) may be coupled to the insulating part (130) through an assembly process. The above contacts (110) can be joined to the insulating part (130) through injection molding. The contacts (110) can be arranged in two rows along the first axial direction (X-axis direction). In this case, the contacts (110) may include a first row contact (111) and a second row contact (112). The first row contact (111) and the second row contact (112) can be arranged spaced apart along the first axial direction (X-axis direction).

[0066] In the substrate connector (100) according to the present invention, the first row contact (111) may be implemented such that the RF contact (114) and the transmission contact (113) are alternately arranged along the second axis direction (Y-axis direction). For example, the first row contact (111) may have the RF contact (114) arranged after the transmission contact (113) is arranged in a predetermined number along the second axis direction (Y-axis direction). Then, the transmission contact (113) may be arranged in a predetermined number. In this way, they may be arranged along the second axis direction (Y-axis direction) in the order of transmission contacts (113) → RF contact (114) → transmission contact (113) → RF contact (114). This order is merely illustrative, and the order in which the transmission contacts (113) and the RF contacts (114) are arranged may be changed. The second row contact (112) may be implemented such that the RF contacts (114) and the transmission contacts (113) are arranged alternately along the second axis direction (Y-axis direction). In this case, the RF contacts (114) of the second row contact (112) may be arranged to be positioned diagonally opposite to the RF contacts (114) of the first row contact (111). That is, the RF contacts (114) of the second row contact (112) and the RF contacts (114) of the first row contact (111) may be arranged so as not to overlap along the first axis direction (X-axis direction) to secure a minimum distance for shielding of RF signals.

[0067] On the other hand, in the substrate connector according to the present invention, the RF contact (114) may be arranged first, and then a predetermined number of the transmission contacts (113) may be arranged along the second axis direction (Y-axis direction). Then, the RF contact (114) may be arranged. That is, the RF contact (114) may be arranged on both sides along the second axis direction (Y-axis direction), and a plurality of transmission contacts (113) may be arranged between the RF contacts (114). In this way, the RF contact (114) and the transmission contact (113) may be arranged in various ways according to the required specifications in the substrate connector (100) according to the present invention.

[0068] Referring to FIGS. 11 to 13, the grounding housing (120) is combined with the insulating part (130). The grounding housing (120) can be grounded by being mounted on a substrate. Accordingly, the grounding housing (120) can implement a shielding function for signals, electromagnetic waves, etc., to the RF contacts (114). In this case, the grounding housing (120) can prevent electromagnetic waves generated from the RF contacts (114) from interfering with signals of circuit components located around the electronic device, and can prevent electromagnetic waves generated from circuit components located around the electronic device from interfering with RF signals transmitted by the RF contacts (114).

[0069] The grounding housing (120) may be positioned to surround the side of the inner space. A portion of the insulating part (130) may be located in the inner space. The RF contacts (114) and the transmission contacts (113) may be located in the inner space. Accordingly, the grounding housing (120) can achieve complete shielding by implementing a shielding wall for the RF contacts (114), thereby enhancing the shielding function for the RF contacts (114).

[0070] The grounding housing (120) may be positioned to surround all sides based on the inner space. The inner space may be positioned inside the grounding housing (120). If the grounding housing (120) is formed in the shape of a square ring overall, the inner space may be formed in the shape of a rectangular body. In this case, the grounding housing (120) may be positioned to surround four sides based on the inner space.

[0071] Referring to FIGS. 11 to 13, the insulating part (130) supports the contacts (110) arranged in two rows along the first axis direction (X-axis direction). The RF contacts (114) and the transmission contacts (113) can be coupled to the insulating part (130). The insulating part (130) can be formed of an insulating material. The insulating part (130) can be coupled to the grounding housing (120) so that the RF contacts (114) and the transmission contacts (113) are located in the inner space.

[0072] Referring to FIGS. 11 to 13, the substrate connector (100) according to the present invention may include a ground contact (140).

[0073] The ground contact (140) is coupled to the insulating part (130). The ground contact (140) may be positioned along the second axis direction (Y-axis direction). In this case, the ground contact (140) may be positioned perpendicular to the contacts (110). The ground contact (140) may be positioned between the contacts (110) with respect to the first axis direction (X-axis direction) to shield the space between the contacts (110). In this case, the ground contact (140) may be positioned between the RF contacts (114) with respect to the first axis direction (X-axis direction) to shield the space between the RF contacts (114). Accordingly, the substrate connector (100) according to the present invention may be configured such that the ground contact (140) crosses between the RF contacts (114) arranged in two rows along the first axis direction (X-axis direction). Accordingly, the substrate connector (100) according to the present invention can achieve complete shielding by enhancing the shielding function for the RF contacts (114) using the ground contact (140). The first ground contact (141) may be grounded by being mounted on the substrate. The ground contact (140) may be coupled to the insulating part (130) through an assembly process. The ground contact (140) may also be integrally molded with the insulating part (130) through injection molding.

[0074] Referring to FIGS. 11 to 13, the grounding contact (140) may include a first grounding contact (141) and a second grounding contact (142).

[0075] The first ground contact can be coupled to the insulating part (130). The second ground contact (142) can be coupled to the insulating part (130). The second ground contact (142) can be positioned adjacent to the first ground contact (141). In this case, the second ground contact (142) can be positioned on an extension line of the direction in which the first ground contact (141) is positioned. Accordingly, the first ground contact (141) and the second ground contact (142) can be positioned to cross the substrate connector (100) along the second axis direction (Y-axis direction). Additionally, the first ground contact (141) and the second ground contact (142) may be arranged to surround the RF contact (114) among the contacts (110) together with the ground housing (120). For example, the first ground contact (141) and the second ground contact (142) may be arranged at the center of the inner space with respect to the first axial direction (X-axis direction). Thus, the first ground contact (141) and the second ground contact (142) may be arranged to surround the first row contact (111) together with a part of the ground housing (120). Additionally, the first ground contact (141) and the second ground contact (142) may be arranged to surround the second row contact (112) together with a part of the ground housing (120). Accordingly, the substrate connector (100) according to the present invention can not only implement a shielding function for the RF contact (114) of the first row contact (111) but also for the RF contact (114) of the second row contact (112) by the first ground contact (141), the second ground contact (142), and the ground housing (120).Accordingly, the substrate connector (100) according to the present invention prevents the RF signal of the RF contact (114) of the first row contact (111) and the RF signal of the RF contact (114) of the second row contact (112) from interfering with each other through the first ground contact (141) and the second ground contact (142), and the ground housing (120) can shield signal interference from the outside. Accordingly, the shielding performance of the substrate connector (100) according to the present invention can be improved by implementing complete shielding of the RF signal.

[0076] Referring to FIGS. 2 to 6 and FIGS. 11 to 13, the first grounding contact (141) may include a first mounting member (1411), a first fixing member (1412), a first shielding plate (1413), and a first connecting member (1414).

[0077] The first mounting member (1411) is intended to be mounted on the substrate. The first ground contact (141) can be electrically connected to the substrate by mounting the first mounting member (1411) on the substrate. The first mounting member (1411) can be mounted on the outer ground pattern (2).

[0078] The first fixing member (1412) is fixed to the insulating member (130). The first fixing member (1412) is coupled to the insulating member (130) to support the first ground contact (141). Accordingly, the substrate connector (100) according to the present invention can prevent the first ground contact (141) from being pushed, deformed, or damaged during the coupling process through the first fixing member (1412). The first fixing member (1412) can be placed between the first connecting member (1414) and the first mounting member (1411). In this case, the first fixing member (1412) can be coupled to each of the first connecting member (1414) and the first mounting member (1411) to connect the first connecting member (1414) and the first mounting member (1411).

[0079] The first shielding plate (1413) may be formed to extend toward the center of the insulating portion (130). The first shielding plate (1413) may be positioned between the contacts (110) with respect to the second axis direction (Y-axis direction). Accordingly, the substrate connector (100) according to the present invention may shield the space between the contacts (110) positioned on both sides of the first shielding plate (1413) with respect to the second axis direction (Y-axis direction). The first shielding plate (1413) may be positioned to face perpendicularly to the substrate and coupled to the insulating portion (130). In this case, the first shielding plate (1413) may be coupled to the seating projection (131) of the insulating portion (130). The first shielding plate (1413) can be formed at a height approximately similar to the height of the insulating part (130). Accordingly, the first shielding plate (1413) can be formed at a height approximately similar to the height of the seating protrusion (131).

[0080] The first connecting member (1414) is coupled to each of the fixing member and the first shielding plate (1413). The first connecting member (1414) is positioned between the fixing member and the first shielding plate (1413) to connect the first fixing member (1412) and the first shielding plate (1413). The first connecting member (1414) may be formed to be bent through a bending process. Accordingly, the positioning direction of the first fixing member (1412) and the first shielding plate (1413) may be changed. The first connecting member (1414) may be positioned to be spaced apart from the contact (110).

[0081] The first shielding plate (1413) may extend from the first connecting member (1414). In this case, the first shielding plate (1413) may extend from the first connecting member (1414) so ​​as to be spaced apart from the contact (110). Accordingly, the substrate connector according to the present invention may be arranged so that the first shielding plate (1413) is separated from the contact (110) to prevent interference with the signal applied to the contact (110).

[0082] Referring to FIGS. 11 to 13, the second grounding contact (142) may include a second mounting member (1421), a second fixing member (1422), a second shielding plate (1423), and a second connecting member (1424). In this case, the second fixing member (1422), the second mounting member (1421), the second shielding plate (1423), and the second connecting member (1514) may be formed to correspond approximately with each of the first fixing member (1412), the first mounting member (1411), the first shielding plate (1413), and the first connecting member (1414), so a detailed description thereof is omitted.

[0083] It will be obvious to those skilled in the art that the invention described above is not limited to the aforementioned embodiments and attached drawings, and that various substitutions, modifications, and changes are possible within the scope of the technical concept of the invention. Explanation of the symbols

[0084] 1: Substrate for a substrate connector according to the present invention 11: Substrate for a substrate connector according to the first embodiment 12: Substrate for a substrate connector according to the second embodiment 13: Substrate for a substrate connector according to the third embodiment 14: Substrate for a substrate connector according to the fourth embodiment 2: Outer grounding pattern 21: 1st outer grounding pattern 22: Second outer grounding pattern 23: Third outer grounding pattern 24: 4th outer grounding pattern 3: 1st Director's Area 31: First transmission area 32: 1st RF Area 4: Second Director's Area 41: Second transmission area 42: 2nd RF Area 5: RF mounting pattern 51: 1st RF mounting pattern 52: 2nd RF mounting pattern 6: Transmission Mount Pattern 61: 1st transmission unit pattern 62: Second transmission unit pattern 7: Shielding pattern 71: First shielding pattern 72: Second shielding pattern 73: Mixed shielding pattern 74: RF shielding pattern 75: Transmission shielding pattern 100: Substrate connector according to the present invention 110: Contact 120: Grounding housing 130: Insulation part 140: Grounding contact

Claims

Claim 1 An outer grounding pattern (2); a first mounting area (3) positioned on the inner side of the outer grounding pattern (2); a second mounting area (4) positioned spaced apart from the first mounting area (3) based on the first axis direction (X-axis direction); A substrate for a substrate connector, comprising a mixed shielding pattern (73) disposed between the first mounting area (3) and the second mounting area (4) based on the first axis direction (X-axis direction), wherein the first mounting area (3) comprises a first RF mounting pattern (51) for mounting a plurality of RF contacts and a first transmission mounting pattern (61) for mounting a plurality of transmission contacts, and the second mounting area (4) comprises a second RF mounting pattern (52) for mounting a plurality of RF contacts and a second transmission mounting pattern (62) for mounting a plurality of transmission contacts, wherein the first RF mounting pattern (51) and the second RF mounting pattern (52) are disposed offset from each other based on the first axis direction (X-axis direction). Claim 2 In claim 1, the first mounting area (3) is a first transmission area (31) in which the first transmission mounting pattern (61) is arranged; A substrate for a substrate connector, comprising a first RF area (32) arranged to be spaced apart from the first transmission area (31) based on a second axis direction (Y-axis direction) perpendicular to the first axis direction (X-axis direction), wherein the second mounting area (4) comprises a second transmission area (41) on which the second transmission mounting pattern (62) is arranged, and a second RF area (42) arranged to be spaced apart from the second transmission area (41) based on the second axis direction (Y-axis direction), wherein, based on the first axis direction (X-axis direction), the first transmission area (31) is arranged to face the second RF area (42), and based on the first axis direction (X-axis direction), the second transmission area (41) is arranged to face the first RF area (32). Claim 3 A substrate for a substrate connector according to claim 1, wherein the mixed shielding pattern (73) is positioned between the first transmission mounting pattern (61) and the second RF mounting pattern (52) based on the first axis direction (X-axis direction). Claim 4 A substrate for a substrate connector according to claim 2, wherein the first transmission area (31) includes a plurality of first shielding patterns (71) arranged between the first RF mounting pattern (51) and the first transmission mounting pattern (61) based on the second axis direction (Y-axis direction), and the outer grounding pattern (2), the mixed shielding pattern (73), and the first shielding patterns (71) are electrically connected to each other to surround the first RF mounting pattern (51). Claim 5 A substrate for a substrate connector according to claim 1, wherein a plurality of mixed shielding patterns (73) are arranged on the inner side of the outer grounding pattern (2), and the mixed shielding patterns (73) are arranged to be spaced apart from each other along a second axis direction (Y-axis direction) perpendicular to the first axis direction (X-axis direction). Claim 6 The outer grounding pattern (2); a first mounting area (3) disposed on the inner side of the outer grounding pattern (2); a second mounting area (4) disposed spaced apart from the first mounting area (3) based on the first axis direction (X-axis direction); and a mixed shielding pattern (73) disposed between the first mounting area (3) and the second mounting area (4) based on the first axis direction (X-axis direction), wherein the outer grounding pattern (2) comprises: a first outer grounding pattern (21); a second outer grounding pattern (22) disposed spaced apart from the first outer grounding pattern (21) based on the first axis direction (X-axis direction); and a third outer grounding pattern (23) connected to each of the first outer grounding pattern (21) and the second outer grounding pattern (22). A substrate for a substrate connector, comprising a fourth outer grounding pattern (24) arranged to be spaced apart from the third outer grounding pattern (23) based on a second axis direction (Y-axis direction) perpendicular to the first axis direction (X-axis direction), wherein the mixed shielding pattern (73) is electrically connected to each of the first outer grounding pattern (21) and the second outer grounding pattern (22) to distinguish the first mounting area (3) and the second mounting area (4) based on the second axis direction (Y-axis direction). Claim 7 A substrate for a substrate connector according to claim 6, wherein the first mounting area (3) comprises a first transmission area (31) having a first transmission mounting pattern (61) for mounting a plurality of RF contacts; and a first RF area (32) arranged to be spaced apart from the first transmission area (31) based on a second axis direction (Y-axis direction) perpendicular to the first axis direction (X-axis direction), and wherein the first transmission area (31) and the first RF area (32) are arranged alternately and sequentially inside the first mounting area (3) based on the first axis direction (X-axis direction). Claim 8 An outer grounding pattern (2); a first mounting area (3) positioned on the inner side of the outer grounding pattern (2); a second mounting area (4) positioned spaced apart from the first mounting area (3) based on the first axis direction (X-axis direction); A substrate for a substrate connector, comprising an RF shielding pattern (74) disposed between the first mounting area (3) and the second mounting area (4) based on the first axis direction (X-axis direction), wherein the first mounting area (3) comprises a first RF mounting pattern (51) for mounting a plurality of RF contacts and a first transmission mounting pattern (61) for mounting a plurality of transmission contacts, and the second mounting area (4) comprises a second RF mounting pattern (52) for mounting a plurality of RF contacts and a second transmission mounting pattern (62) for mounting a plurality of transmission contacts, and wherein the RF shielding pattern (74) is disposed between the first RF mounting pattern (51) and the second RF mounting pattern (52) based on the first axis direction (X-axis direction). Claim 9 A substrate for a substrate connector according to claim 8, comprising a first transmission area (31) disposed inside the first mounting area (3), wherein the first transmission area (31) comprises a plurality of first shielding patterns (71) disposed between the first RF mounting pattern (51) and the first transmission mounting pattern (61) based on a second axis direction (Y-axis direction) perpendicular to the first axis direction (X-axis direction), and wherein the first shielding pattern (71), the RF shielding pattern (74), and the outer grounding pattern (2) are electrically connected to each other to surround the first RF mounting pattern (51). Claim 10 A substrate for a substrate connector according to claim 9, wherein the outer grounding pattern (2) comprises: a first outer grounding pattern (21); a second outer grounding pattern (22) arranged to be spaced apart from the first outer grounding pattern (21) with respect to the first axis direction (X-axis direction); a third outer grounding pattern (23) connected to each of the first outer grounding pattern (21) and the second outer grounding pattern (22); and a fourth outer grounding pattern (24) arranged to be spaced apart from the third outer grounding pattern (23) with respect to the second axis direction (Y-axis direction) perpendicular to the first axis direction (X-axis direction), and wherein, with respect to the first axis direction (X-axis direction), the distance at which the first RF mounting pattern (51) is spaced apart from the first shielding pattern (71) is shorter than the distance at which it is spaced apart from the outer grounding pattern (2). Claim 11 A substrate for a substrate connector according to claim 9, wherein the first transmission area (31) includes a first shielding pattern (71) disposed between the first RF mounting pattern (51) and the first transmission mounting pattern (61) based on the first axis direction (X-axis direction), and the first shielding pattern (71), the RF shielding pattern (74), and the outer grounding pattern (2) are electrically connected to each other to surround the first RF mounting pattern (51). Claim 12 An outer grounding pattern (2); a first mounting area (3) positioned on the inner side of the outer grounding pattern (2); a second mounting area (4) positioned spaced apart from the first mounting area (3) based on the first axis direction (X-axis direction); A substrate for a substrate connector, comprising a transmission shielding pattern (75) disposed between the first mounting area (3) and the second mounting area (4) based on the first axis direction (X-axis direction), wherein the first mounting area (3) comprises a first RF mounting pattern (51) for mounting a plurality of RF contacts and a first transmission mounting pattern (61) for mounting a plurality of transmission contacts, and the second mounting area (4) comprises a second RF mounting pattern (52) for mounting a plurality of RF contacts and a second transmission mounting pattern (62) for mounting a plurality of transmission contacts, and wherein the transmission shielding pattern (75) is disposed between the first transmission mounting pattern (61) and the second transmission mounting pattern (62) based on the first axis direction (X-axis direction). Claim 13 A substrate for a substrate connector according to claim 12, comprising a plurality of RF shielding patterns (74) arranged between the first RF mounting patterns (51) and the second RF mounting patterns (52) based on the first axis direction (X-axis direction), wherein the transmission shielding pattern (75) is arranged between the RF shielding patterns (74) to electrically connect the RF shielding patterns (74). Claim 14 A substrate connector comprising: a plurality of contacts (110); an insulating part (130) supporting the contacts (110) arranged in two rows with respect to a first axial direction; a grounding housing (120) to which the insulating part (130) is coupled; and a grounding contact (140) coupled to the insulating part (130) and arranged along a second axial direction perpendicular to the first axial direction, wherein the grounding contact (140) is arranged between the contacts (110) with respect to the first axial direction to shield between the contacts (110). Claim 15 A substrate connector characterized in that, in claim 14, the grounding contact (140) comprises a first grounding contact (141) coupled to the insulating part (130) and a second grounding contact (142) disposed adjacent to the first grounding contact (141), and the first grounding contact (141), the second grounding contact (142), and the grounding housing (120) are disposed to surround the RF contact (114) among the contacts (110) to shield the RF signal of the RF contact (114). Claim 16 In claim 15, the first ground contact (141) comprises a first mounting member (1411) for mounting on the substrate, a first fixing member (1412) coupled to the insulating part (130), a first shielding plate (1413) disposed between the contacts (110) along the second axial direction, and a first connecting member (1414) coupled to each of the first fixing member (1412) and the first shielding plate (1413), wherein the first fixing member (1412) is disposed between the first connecting member (1414) and the first mounting member (1411) to connect the first connecting member (1414) and the first mounting member (1411), and the first shielding plate (1413) is formed to extend toward the center of the insulating part (130), characterized in that it is a substrate connector. Claim 17 A substrate connector according to claim 15, wherein the first ground contact (141) comprises a first mounting member (1411) for mounting on the substrate, a first fixing member (1412) coupled to the insulating part (130), a first shielding plate (1413) disposed between the contacts (110) along the second axial direction, and a first connecting member (1414) coupled to each of the first fixing member (1412) and the first shielding plate (1413), and wherein the first shielding plate (1413) is formed to extend from the first connecting member (1414) so ​​as to be spaced apart from the contact (110).

Citation Information

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