Isolated active EMI filter module and manufacturing method thereof

Abstract

The present invention relates to an independent active EMI filter module and a method for manufacturing the same, which can reduce the volume of each component constituting the EMI filter module, thereby enabling the realization of a single modular structure with a compact structure and improving EMI noise reduction performance.

Description

Technology Field

[0001] The embodiments relate to an independent active EMI filter module and a method for manufacturing the same. Background Technology

[0002] In general, electrical devices such as household and industrial appliances, as well as electric vehicles, emit noise during operation. For instance, noise can be generated due to switching operations within the electrical device. This noise is not only harmful to the human body but also causes malfunctions or failures in other connected electronic devices.

[0003] Electromagnetic interference caused by electronic devices to other devices is called EMI (Electromagnetic Interference), and among these, noise transmitted through wires and circuit board wiring is called Conducted Emission (CE) noise.

[0004] To ensure that electronic devices operate without causing failures in surrounding components or other equipment, the amount of EMI noise emitted from all electronic products is strictly regulated. Therefore, to satisfy regulations on noise emissions, most electronic products necessarily include electromagnetic noise reduction devices, such as EMI filters, to reduce EMI noise.

[0005] For example, current compensation devices are essential in white goods such as air conditioners, electric vehicles, aviation, and energy storage systems (ESS). Conventional current compensation devices use a common mode choke (CM choke) to reduce common mode (CM) noise among conducted emission (CE) noise.

[0006] However, common mode (CM) chokes have a problem in which noise reduction performance drops sharply due to magnetic saturation in high-power / high-current systems, and increasing the size or number of CM chokes to maintain noise reduction performance results in a significant increase in the size and cost of EMI filters.

[0007] Furthermore, because conventional EMI filters are bulky overall and have a structure where components are directly exposed to the external environment, when used in systems placed in the external environment, the components can easily degrade due to external shocks or environmental influences, which can significantly affect the characteristics of the filter. The problem to be solved

[0008] The embodiments of the present invention are intended to solve the problems and / or limitations mentioned above, and aim to provide an independent active EMI filter module that is independent of the external environment and capable of reducing volume, as well as a method for manufacturing the same. However, these objectives are exemplary and do not limit the scope of the present invention. means of solving the problem

[0009] To achieve the above objectives, one embodiment may provide an independent active EMI filter module comprising: a substrate including a first surface and a second surface facing each other; a first element group installed on at least one of the first surface or the second surface and configured to detect electromagnetic noise; a second element group installed on at least one of the first surface or the second surface and configured to generate a compensation signal for the electromagnetic noise; a support including an internal space and an opening connected to the space, configured to accommodate at least one of the substrate, the first element group, or the second element group in the space; a filling portion configured to fill at least a portion of the space; and a junction connected to the support.

[0010] It may include a pin group exposed to the outside of the above-mentioned filling portion and electrically connected to at least some of the first element group or the second element group.

[0011] It may further include a connecting part configured to be connected to the first surface and the second surface and configured not to interfere with at least one of the first element group or the second element group, and a connecting body located at the connecting part and connected to the filling part.

[0012] The above filling part may include a first filling part facing the first surface and a second filling part facing the second surface.

[0013] The apparatus further comprises a connecting portion configured to be connected to the first surface and the second surface and configured not to interfere with at least one of the first element group or the second element group, and a connecting member located at the connecting portion and connected to the filling portion, wherein the connecting member may be configured to connect the first filling portion and the second filling portion.

[0014] According to another embodiment, a method for manufacturing an independent active EMI filter module may be provided, comprising the steps of: installing a first element group configured to detect electromagnetic noise on at least one of the first or second surfaces of a substrate comprising a first surface and a second surface facing each other; installing a second element group configured to generate a compensation signal for the electromagnetic noise on at least one of the first or second surfaces; forming a connection portion configured to be connected to the first and second surfaces and configured not to interfere with at least one of the first element group or the second element group; preparing a support comprising an internal space portion and an opening connected to the space portion; accommodating at least one of the substrate, the first element group, or the second element group in the space portion; forming a filling portion configured to fill at least a portion of the space portion; and forming a junction portion connected to the support.

[0015] The method may include a step of exposing a pin group electrically connected to at least some of the first element group or the second element group to the outside of the filling portion.

[0016] The method may further include the steps of forming a connection portion configured to be connected to the first surface and the second surface and configured not to interfere with at least one of the first element group or the second element group, and forming a connection body located at the connection portion and connected to the filling portion.

[0017] The step of forming the above-mentioned filling portion may include the step of forming a first filling portion facing the first surface and the step of forming a second filling portion facing the second surface.

[0018] The method further includes the step of forming a connection portion configured to be connected to the first surface and the second surface and configured not to interfere with at least one of the first element group or the second element group, and the step of forming a connection body located at the connection portion and connected to the filling portion, wherein the step of forming the connection body may include the step of the connection body connecting the first filling portion and the second filling portion. Effects of the invention

[0019] According to the embodiments of the present invention as described above, the volume of each component constituting the EMI filter module can be reduced, thereby enabling a single modular structure with a compact structure and improving EMI noise reduction performance.

[0020] In addition, an independent structure separated from the external environment can be formed by the bag structure, thereby further improving durability.

[0021] By implementing a single modularity, it can be easily assembled and disassembled when installed in systems and / or other devices, and offers excellent performance in terms of maintenance.

[0022] A heat dissipation function can be optionally added to prevent degradation of device characteristics and improve durability.

[0023] Costs can be reduced by not using bulky CM chokes or by reducing the number of them.

[0024] The bag structure can be fixed more securely, and the durability of the bag structure can be improved.

[0025] The substrate can be more firmly fixed by the joint, and accordingly, the durability of the module can be further improved. Brief explanation of the drawing

[0026] FIG. 1 is a configuration diagram of an independent active EMI filter module according to one embodiment. FIG. 2 is a diagram illustrating a more specific configuration of an independent active EMI filter module according to one embodiment. FIG. 3 is a drawing illustrating a more specific configuration of an independent active EMI filter module according to another embodiment. FIG. 4 is a drawing illustrating a more specific configuration of an independent active EMI filter module according to another embodiment. FIG. 5 is a drawing illustrating a more specific configuration of an independent active EMI filter module according to another embodiment. FIG. 6 is a drawing illustrating a more specific configuration of an independent active EMI filter module according to another embodiment. FIG. 7 is a cross-sectional view of an independent active EMI filter module according to one embodiment. FIG. 8 is a cross-sectional view of an independent active EMI filter module according to another embodiment. FIG. 9 is a bottom view of an independent active EMI filter module according to one embodiment. FIG. 10 is a bottom view of an independent active EMI filter module according to another embodiment. FIG. 11 is a cross-sectional view of an independent active EMI filter module according to another embodiment. FIG. 12 is a cross-sectional view illustrating an embodiment of the connecting part and connecting body of FIG. 11. FIG. 13 is a cross-sectional view of an independent active EMI filter module according to another embodiment. FIGS. 14 to 21 are drawings illustrating the manufacturing process of an independent active EMI filter module according to embodiments. Specific details for implementing the invention

[0027] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention, and the methods for achieving them, will become clear by referring to the embodiments described below in detail together with the drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various forms.

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0029] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0030] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0031] In the following embodiments, when a part such as a film, region, or component is described as being on or above another part, it includes not only cases where it is directly on top of another part, but also cases where another film, region, or component is interposed in between.

[0032] Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description.

[0033] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the following embodiments are not necessarily limited to those illustrated.

[0034] FIG. 1 is a configuration diagram of an EMI filter module according to one embodiment.

[0035] An independent active EMI filter module (1) according to one embodiment may include a substrate (10), a first element group (11), a second element group (12), and a pin group installed on the substrate (10).

[0036] The substrate (10) may be an insulating and / or conductive substrate having a conductive pattern formed on at least one surface, and according to one embodiment, may be a printed circuit board provided in a flat shape. The substrate (10) may be a rigid or flexible printed circuit board.

[0037] A first through line (21) and a second through line (22) pass through this substrate (10). The first through line (21) and the second through line (22) can be electrically connected to power lines, wherein the first through line (21) can be electrically connected to a live line and the second through line (22) can be electrically connected to a neutral line.

[0038] According to one embodiment, the first through line (21) and the second through line (22) may each be a conductive pattern formed to electrically pass through the substrate (10) from one end to the other. The conductive pattern is not necessarily limited to extending in a straight line, but may extend along a complex path.

[0039] The first through line (21) and the second through line (22), which are power lines as described above, can be electrically connected to a pin group, specifically, they can be electrically connected to a first pin group (14). According to one embodiment, the first pin group (14) may include first-1 pins (141) to first-4 pins (144).

[0040] The first-1 pin (141) is electrically connected to one end of the first through line (21), and the first-2 pin (142) can be electrically connected to the other end of the first through line (21).

[0041] The first-3 pin (143) is electrically connected to one end of the second through-line (22), and the first-4 pin (144) can be electrically connected to the other end of the second through-line (22).

[0042] According to one embodiment, the first-1 pin (141) and the first-3 pin (143) can be electrically connected to a first device (2) located outside the independent active EMI filter module (1).

[0043] The first device (2) may be of various forms for supplying power to an independent active EMI filter module (1) in the form of current and / or voltage. For example, the first device (2) may be a device that produces and supplies power, or a device that supplies power generated by another device (e.g., an electric vehicle charging device). Of course, the first device (2) may also be a device that supplies stored energy. However, this is merely illustrative, and the scope of the invention is not limited thereto.

[0044] According to one embodiment, the first-2 pin (142) and the first-4 pin (144) can be electrically connected to a second device (3) located outside the independent active EMI filter module (1).

[0045] The second device (3) may be various types of devices and / or loads that use power supplied by the first device (2). The second device (3) may be a load driven using power supplied by the first device (2). The second device (3) may be a load (e.g., at least one component of an electric vehicle) that stores energy using power supplied by the first device (2) and drives using the stored energy. However, this is illustrative and the scope of the invention is not limited thereto.

[0046] Each of the first penetration line (21) and the second penetration line (22) may be a path through which electromagnetic noise generated in the second device (3) is transmitted to the first device (2). At this time, the electromagnetic noise may be input in a common mode for each of the first penetration line (21) and the second penetration line (22).

[0047] The first element group (11) may include at least one element electrically connected to the first through line (21) and the second through line (22). According to one embodiment, the first element group (11) may include an element configured to detect electromagnetic noise generated from the second device (3).

[0048] The second element group (12) may include at least one element electrically connected to the first element group (11), the first through line (21), and the second through line (22).

[0049] According to one embodiment, the second element group (12) may include an active circuit part (121) and a compensation part (122).

[0050] According to one embodiment, the active circuit (121) can perform the role of an amplifier and can amplify the current corresponding to the electromagnetic noise detected through the first element group (11) at a certain ratio.

[0051] According to one embodiment, the active circuit (121) generates an amplified current that is equal in magnitude and opposite in phase to the current corresponding to electromagnetic noise, and can compensate for the noise by flowing it through the compensation unit (122) to the first through line (141) and / or the second through line (142).

[0052] That is, the current amplified through the active circuit (121) flows to the compensation section (122), and the compensation current from the compensation section (122) flows to the first through line (141) and / or the second through line (142).

[0053] More specific embodiments of the active circuit section (121) and the compensation section (122) will be described later.

[0054] Meanwhile, the first element group (11) and / or the second element group (12) can be electrically connected to the third device (4).

[0055] The third device (4) can be electrically connected to a pin group protruding outward from the substrate (10). Specifically, the third device (4) can be electrically connected to a first element group (11) and / or a second element group (12) through a second pin group (15).

[0056] According to one embodiment, this third device (4) may include a device that provides power to the active circuit (121). For example, the third device (4) may include a device that generates input power for the active circuit (121), and the input power may include DC power.

[0057] The second pin group (15) may include pins that are not directly connected to the first through line (141) and / or the second through line (142), which are power lines, and may include pins that are electrically connected to the third device (4) as described above and / or used for grounding purposes. Specific examples will be described later.

[0058] FIG. 2 illustrates a more specific example of the first element group (11) and the second element group (12) according to one embodiment.

[0059] According to one embodiment, a first penetration line (21) and a second penetration line (22) may be designed to pass through the substrate (10).

[0060] Both ends of the first through line (21) are connected to the first-1 pin (141) and the first-2 pin (142). And both ends of the second through line (22) are connected to the first-3 pin (143) and the first-4 pin (144). The first-1 pin (141) to the first-4 pin (144) can form a first pin group (14, see FIG. 1).

[0061] According to one embodiment, the first element group (11) may include a sensing transformer capable of sensing noise.

[0062] The above sensing transformer may include a first reference winding (111) and a second reference winding (112) electrically connected to a first through line (21) and a second through line (22), respectively, which are power lines, and a sensing winding (110) formed in the same core as the first and second reference windings (111) (112).

[0063] The first reference winding (111) and the second reference winding (112) above can be primary windings connected to a power line, and the sensing winding (110) can be a secondary winding.

[0064] The first reference winding (111) and the second reference winding (112) may each be in the form of a winding wound around a core, but are not necessarily limited thereto, and at least one of the first reference winding (111) or the second reference winding (112) may be structured to pass through the core.

[0065] The sensing winding (110) may be a structure that is wound at least once on a core through which the first reference winding (111) and the second reference winding (112) are wound.

[0066] These sensing windings (110) are electrically insulated from the primary winding, which is a power line, and noise current generated from the second device (3) is detected, and a current converted from the noise current at a certain ratio can be induced.

[0067] The above primary and secondary windings can be wound considering the direction of generation of magnetic flux and / or magnetic flux density.

[0068] For example, as a first current, which is noise, is input to the first reference winding (111), a first magnetic flux density can be induced in the core. Similarly, as a first current, which is noise, is input to the second reference winding (112), a second magnetic flux density can be induced in the core.

[0069] A first induced current can be induced in the second side sensing winding (110) by the induced first and second magnetic flux densities.

[0070] At this time, the sensing transformer is configured so that the first magnetic flux density and the second magnetic flux density induced by the first current can overlap (or reinforce each other), and can generate a first induced current corresponding to the first current in the second side, i.e., the sensing winding (110), which is insulated from the first through line (21) and the second through line (22).

[0071] Meanwhile, the number of first reference windings (111), second reference windings (112), and sensing windings (110) wound on the core can be appropriately determined according to the requirements of the system in which the independent active EMI filter module (1) is used.

[0072] For example, the winding ratio of the primary winding, which is the first reference winding (111) and the second reference winding (112), and the secondary winding, which is the sensing winding (110), is 1:N sen It can be. Also, the self-inductance of the primary winding of the sensing transformer is L sen If so, the secondary winding is N sen 2 ·L senIt can have a self-inductance. The primary and secondary windings of the sensing transformer (120) are k sen It can be coupled with the coupling coefficient of

[0073] Meanwhile, the aforementioned sensing transformer can be configured such that the magnetic flux density induced by the second current, which is a normal current flowing through each of the first through line (21) and the second through line (22), satisfies a predetermined magnetic flux density condition.

[0074] That is, a third magnetic flux density and a fourth magnetic flux density can be induced in the core by the second current flowing through the first reference winding (111) and the second reference winding (112), respectively. At this time, the third magnetic flux density and the fourth magnetic flux density may be in a condition where they cancel each other out.

[0075] In other words, the sensing transformer can make the second induced current induced in the secondary side sensing winding (120) by the second current, which is a normal current flowing in each of the first through line (21) and the second through line (22), less than a predetermined threshold size, and accordingly, the sensing transformer is configured so that the magnetic flux densities induced by the second current can cancel each other out, so that only the aforementioned first current can be detected.

[0076] The sensing transformer may be configured such that the magnitude of the first and second magnetic flux densities induced by the first current, which is a noise current in the first frequency band (e.g., a band having a range of 150KHz to 30MHz), is greater than the magnitude of the third and fourth magnetic flux densities induced by the second current, which is a normal current in the second frequency band (e.g., a band having a range of 50Hz to 60Hz).

[0077] In the present invention, the statement that component A is configured to do B may mean that the design parameters of component A are set to be appropriate for doing B. For example, the statement that a sensing transformer is configured such that the magnitude of the magnetic flux induced by a current in a specific frequency band is large may mean that parameters such as the size of the sensing transformer, the diameter of the core, the number of turns, the magnitude of the inductance, and the magnitude of the mutual inductance are appropriately set so that the magnitude of the magnetic flux induced by a current in a specific frequency band becomes strong.

[0078] The sensing winding (110), which is the secondary side of the sensing transformer, can be placed on a path connecting the input terminal of the active circuit (121) and the reference potential of the active circuit (121) as shown in FIG. 2 in order to supply the first induced current to the active circuit (121).

[0079] According to one embodiment, the active circuit portion (121) may be a means for generating an amplified current by amplifying a first induced current generated by a sensing transformer.

[0080] According to one embodiment, the sensing winding (110) can be differentially connected to the input terminal of the active circuit (121).

[0081] In the present invention, amplification by the active circuit (121) may mean adjusting the size and / or phase of the amplification target. For example, the active circuit (121) can change the phase of the first induced current by 180 degrees and increase the size by k times (k>=1) to generate an amplified current.

[0082] The active circuit (121) can be designed to generate an amplified current by taking into account the voltage transformation ratio of the sensing transformer described above and the voltage transformation ratio of the compensation transformer (1221) described later. For example, if the sensing transformer of the first element group (11) converts the first current, which is a noise current, into a first induced current with a magnitude of 1 / F1 times, and the compensation transformer (1221) converts the amplified current into a compensation current with a magnitude of 1 / F2 times, the active circuit (121) can generate an amplified current that is F1xF2 times the magnitude of the first induced current.

[0083] At this time, the active circuit (121) can generate an amplified current such that the phase of the amplified current is opposite to the phase of the first induced current.

[0084] The active circuit (121) can be implemented by various means, and according to one embodiment, the active circuit (121) may include an OP AMP. According to another embodiment, the active circuit (121) may include a plurality of passive components such as resistors and capacitors in addition to the OP AMP. According to yet another embodiment, the active circuit (121) may include a BJT (Bipolar Junction Transistor) and / or a plurality of passive components such as resistors and capacitors. However, it is not necessarily limited thereto, and the means for amplification described in the present invention may be used without limitation as the active circuit (121) of the present invention.

[0085] The active circuit (121) can generate an amplified current by amplifying a first induced current by receiving power from a separate third device (4, see FIG. 1) that is distinct from the first device (2) and / or the second device (3). At this time, the third device (4) may be a device that generates an input power for the active circuit (121) by receiving power from a power source unrelated to the first device (2) and the second device (3). Additionally, the third device (4) may be a device that generates an input power for the active circuit (121) by receiving power from either the first device (2) or the second device (3). The active circuit (121) may be electrically connected to the third device (4) through a second-1 pin (151) coupled to the substrate (10).

[0086] The above amplification current flows through the compensation unit (122) to the first through line (141) and / or the second through line (142) to compensate for noise.

[0087] According to one embodiment, the compensation unit (122) may include a compensation transformer (1221) and a compensation capacitor unit (1222).

[0088] The above compensation transformer (1221) may include a primary winding located at the output of the active circuit section (121) and a secondary winding electrically connected to the compensation capacitor section (1222). The secondary winding of the compensation transformer (1221) is electrically connected to the first through line (21) and the second through line (22), which are power lines, with the compensation capacitor section (1222) interposed therein. Accordingly, the active circuit section (121) can be insulated from the power lines, and thus the active circuit section (121) can be protected.

[0089] The compensation transformer (1221) may be a means for generating a compensation current on the side of the first through line (21) and the second through line (22) (or on the secondary side described later) based on an amplification current, while being insulated from and / or isolated from the first through line (21) and the second through line (22) described above.

[0090] More specifically, the compensation transformer (1221) can generate a compensation current on the secondary side based on the magnetic flux density induced by the amplification current generated by the active circuit (121) on the primary side, which is positioned on the path connecting the output terminal of the active circuit (121) and the reference potential of the active circuit (121). The reference potential (reference potential 2) of the active circuit (121) can be grounded through the second-2 pin (152).

[0091] At this time, the secondary side may be placed on the path connecting the compensation capacitor section (1222) described later and the reference potential (reference potential 1) of the independent active EMI filter module (1). The reference potential (reference potential 1) of the independent active EMI filter module (1) may be grounded through the second-third pin (153).

[0092] In this way, the compensation transformer (1221) can transmit the amplified current generated by the active circuit (121) to the first through line (21) and the second through line (22) in an isolated and / or independent state.

[0093] Meanwhile, according to another embodiment, the primary side of the compensation transformer (1221), the active circuit section (121), and the sensing winding (110) may be connected to a reference potential (reference potential 2) that is distinct from the remaining components of the independent active EMI filter module (1). That is, the reference potential (reference potential 2) of the aforementioned active circuit section (121) and the reference potential (reference potential 1) of the independent active EMI filter module (1) may be distinct potentials from each other.

[0094] As such, according to one embodiment of the present invention, a reference potential different from that of the remaining components is used for the component generating the compensation current, and by using a separate power source, the component generating the compensation current can be made to operate in an isolated state, thereby improving the reliability of the independent active EMI filter module (1).

[0095] As described above, the compensation transformer (1221) can convert the current flowing on the primary side of the compensation transformer (1221), which is amplified by the active circuit (121), into a constant ratio and induce it on the secondary side of the compensation transformer (1221).

[0096] For example, in a compensating transformer (1221), the winding ratio of the primary side to the secondary side is 1:N inj It can be. Also, the self-inductance of the primary side of the compensation transformer (1221) is L inj If so, the secondary side of the compensation transformer is N inj 2 ·L inj It can have a self-inductance. The primary and secondary sides of the compensation transformer (1221) are k inj It can be coupled with a coupling coefficient. The current converted through the compensation transformer (1221) is compensated by a compensation current (I) to the power lines, specifically the first through line (21) and the second through line (22), through the compensation capacitor section (1222). comp It can be injected as ).

[0097] The compensation capacitor section (1222) may be a means for providing a path through which the current generated by the compensation transformer (1221) flows to each of the first through line (21) and the second through line (22).

[0098] The compensation capacitor section (1222) may include at least two compensation capacitors that connect the reference potential (reference potential 1) of the independent active EMI filter module (1) to the first through line (21) and the second through line (22), respectively. Each of the compensation capacitors may include a Y-capacitor (Y-cap). One end of each compensation capacitor shares a node connected to the secondary side of the compensation transformer (1221), and the other end may have a node connected to the first through line (21) and the second through line (22), respectively.

[0099] The compensation capacitor section (1222) may be configured such that the current flowing between the first through line (21) and the second through line (22) through at least two compensation capacitors satisfies a predetermined first current condition. At this time, the predetermined first current condition may be a condition in which the magnitude of the current is less than a predetermined first threshold magnitude.

[0100] Additionally, the compensation capacitor section (1222) may be configured such that the current flowing between the first through line (21) and the second through line (22), respectively, and the reference potential (reference potential 1) of the independent active EMI filter module (1) satisfies a predetermined second condition through at least two compensation capacitors. In this case, the predetermined second condition may be a condition in which the magnitude of the current is less than a predetermined second threshold magnitude.

[0101] The compensation current flowing along the compensation capacitor section (1222) to the first through line (21) and the second through line (22), respectively, can cancel out the first current on the first through line (21) and the second through line (22), thereby preventing the first current from being transmitted to the aforementioned second device (2). At this time, the first current and the compensation current may be currents of the same magnitude but opposite in phase.

[0102] Thus, an independent active EMI filter module (1) according to one embodiment of the present invention actively compensates for a first current, which is a noise current input in a common mode to each of the first through-line (21) and the second through-line (22), which are at least two high-current paths connected to the first device (2), thereby suppressing the noise current emitted to the first device (2). Through this, malfunction or damage to the second device (3) and / or other devices connected to the first device (2) can be prevented.

[0103] In the structure as described above, the second pin group (15) may include a second-1 pin (151), a second-2 pin (152), and a second-3 pin (153). The second-1 pin (151) may electrically connect the active circuit portion (121) to the third device (4). The second-2 pin (152) may be electrically connected to the reference potential (reference potential 2) of the active circuit portion (121), and the second-3 pin (153) may be electrically connected to the reference potential (reference potential 1) of the independent active EMI filter module (1). According to one embodiment, the second-2 pin (152) and the second-3 pin (153) may be grounded.

[0104] The independent active EMI filter module (1) illustrated in FIG. 2 represents a current-sense current-compensation (CSCC) independent active EMI filter module that detects current and compensates for current. In particular, the independent active EMI filter module (1) of FIG. 2 may be a feedforward type compensation filter that compensates for noise input from the second device (3) at the front end, which is the power supply side. That is, in the independent active EMI filter module (1), a first element group (11) which is a sensing transformer may be placed on the EMI source side, and a compensation capacitor section (1222) may be placed on the power supply side. Furthermore, the independent active EMI filter module (1) can realize an isolated structure by using a compensation transformer (1221) and / or by using the first element group (11) which is a sensing transformer, even though it compensates for current using the compensation capacitor section (1222). That is, an independent active EMI filter module (1) according to one embodiment of the present invention may have an isolated feedforward CSCC structure.

[0105] As described above, in the independent active EMI filter module (1), the compensation current (I comp ) is noise current (I nIt may have the same magnitude as ) and opposite phase. That is, the noise current (I) input to the independent active EMI filter module (1) n Compensation current (I) relative to ) comp The active circuit section (121), the first element group (11), and the compensation transformer (1221) can be designed so that the current gain ratio representing ) is -1. Through this, the noise current (I generated from the EMI source) n An independent active EMI filter module (1) can be provided that can reduce EMI noise by canceling out )

[0106] An independent active EMI filter module (1) according to another embodiment of the present invention may not include a Common Mode (CM) choke. Since a CM choke functions as a passive filter, it must have a very large inductance to prevent noise current from leaking out. Therefore, the CM choke has a large number of windings and a very large core size. Unlike such a CM choke, the first element group (11), which is a sensing transformer included in the independent active EMI filter module (1) according to an embodiment of the present invention, does not need to have a large impedance because its purpose is to sense noise current. The sensing transformer may have an impedance of one-thousandth to one-hundredth of the impedance of the CM choke. Therefore, the size of the sensing transformer can be much smaller than the size of the CM choke. The independent active EMI filter module (1) according to an embodiment of the present invention can operate independently without parasitic on the CM choke. Accordingly, the size and weight can be reduced by manufacturing it in a modular form corresponding to the size of the substrate (10), and thereby, the encapsulation by the encapsulation structure (13) can be easily performed.

[0107] The present invention is not necessarily limited thereto, and according to other embodiments, the independent active EMI filter module (1) may be operated in combination with an independent external separate CM choke.

[0108] FIG. 3 illustrates a more specific example of the first element group (11) and the second element group (12) according to another embodiment.

[0109] Referring to FIG. 3, an independent active EMI filter module (1) according to another embodiment may include a first element group (11) and a second element group (12) installed on a substrate (10), through which a first through line (21) and a second through line (22) pass.

[0110] Unlike the embodiment illustrated in FIG. 2 described above, the first element group (11) is electrically connected to the first-1 pin (141) and the first-3 pin (143) on the power side of the first device (2). The second element group (12) is electrically connected to the first-2 pin (142) and the first-4 pin (144) on the second device (3). Thus, the embodiment illustrated in FIG. 3 represents a feedback-type CSCC active EMI filter that detects noise current going out to the first device (2) and compensates for it with current on the second device (3).

[0111] The first element group (11), active circuit section (121), compensation transformer (1221), and compensation capacitor section (1222), which are sensing transformers shown in FIG. 3, can each perform the same function as the elements shown in FIG. 2 described above. In addition, the independent active EMI filter module (1) shown in FIG. 3 can also realize an isolated structure.

[0112] FIG. 4 illustrates a more specific example of the first element group (11) and the second element group (12) according to another embodiment.

[0113] Referring to FIG. 4, an independent active EMI filter module (1) according to another embodiment may include a first element group (11) and a second element group (12) installed on a substrate (10), through which a first through line (21) and a second through line (22) pass.

[0114] According to the embodiment illustrated in FIG. 4, the first element group (11) may include a sensing capacitor section (116). The second element group (12) may include an active circuit section (121) and a compensation capacitor section (1222). Accordingly, the independent active EMI filter module (1) according to the embodiment illustrated in FIG. 4 represents a Voltage-Sense Current-Compensation (VSCC) active EMI filter that detects noise voltage using the sensing capacitor section (116) and compensates for current using the compensation capacitor section (1222). In a VSCC structure such as the active EMI filter (1) according to this embodiment, feedforward and feedback may not be distinguished in terms of operating principle. That is, in the independent active EMI filter module (1) illustrated in FIG. 4, there may be no distinction between the input and output sections. In addition, the independent active EMI filter module (1) according to the embodiment may also have an isolated structure by using a compensation transformer (1221) and a sensing transformer (115).

[0115] The sensing capacitor section (116) can detect noise voltage input to the first through line (21) and the second through line (22), which are power lines. The sensing capacitor section (116) may include two sensing capacitors, each sensing capacitor may include a Y-cap. One end of each of the two sensing capacitors may be electrically connected to the first through line (21) and the second through line (22), and the other end may share a node connected to the primary side of the sensing transformer (115). The primary side of the sensing transformer (115) may be electrically connected to the first through line (21) and the second through line (22), which are power lines, through the sensing capacitor section (116). The primary winding of the sensing transformer (115) may be electrically connected to the second-4 pin (154) of the second pin group (15) which is coupled to the substrate (10).

[0116] The sensing transformer (115) may include a primary side connected to the power line side and a secondary side connected to the active circuit section (121) to sense noise flowing in the power line. The secondary side of the sensing transformer (115) may be differentially connected to the input terminal of the active circuit section (121).

[0117] The sensing transformer (115), active circuit section (121), compensation transformer (1221), and compensation capacitor section (1222) included in the independent active EMI filter module (1) according to the embodiment shown in FIG. 4 can each perform an operation corresponding to the sensing transformer, active circuit section (121), compensation transformer (1221), and compensation capacitor section (1222) of the aforementioned embodiments.

[0118] Although not illustrated in the drawings, in the embodiments described above, the active circuit (121) may further include a high-pass filter (not shown) between the active circuit (121) and the compensation transformer (1221) to block the active circuit (121) from operating at low frequencies below the frequency band to be reduced.

[0119] FIG. 5 illustrates the configuration of an independent active EMI filter module (1) according to another embodiment.

[0120] The embodiment shown in FIG. 5 is an independent active EMI filter module (1) with a three-phase three-wire structure, unlike the single-phase embodiment shown in FIG. 2.

[0121] Referring to FIG. 5, a first through-line (21), a second through-line (22), and a third through-line (23) pass through the substrate (10), and both ends of these may be electrically connected to the first-1 pin (141) to the first-6 pin (146), respectively. According to one embodiment, the first through-line (21) may be a power line of the R phase, the second through-line (22) may be a power line of the S phase, and the third through-line (23) may be a power line of the T phase.

[0122] The first element group (11) may include a sensing transformer capable of sensing noise, wherein the sensing transformer may include a first reference winding (111) to a third reference winding (113) each connected to a first through line (21) to a third through line (23), and a sensing winding (110) formed in the same core as the first reference winding (111) to the third reference winding (113).

[0123] The first reference winding (111) to the third reference winding (113) can be primary windings connected to a power line, and the sensing winding (110) can be secondary windings.

[0124] The first reference winding (111) to the third reference winding (113) may each be in the form of a winding wound around a core, but are not necessarily limited thereto, and at least one of the first reference winding (111), the second reference winding (112), or the third reference winding (113) may be structured to pass through the core.

[0125] The sensing winding (110) may be a structure that is wound at least once on a core through which the first reference winding (111) to the third reference winding (113) are wound and / or pass.

[0126] The sensing winding (110) is isolated from the power line, just as in the embodiment of FIG. 2 described above, and can detect noise current generated from the second device (3). As in the embodiment of FIG. 2, the primary winding and the secondary winding can be wound considering the direction of generation of magnetic flux and / or magnetic flux density.

[0127] The sensing winding (110) supplies an induced current to the active circuit (121), and the active circuit (121) amplifies it to generate an amplified current. The active circuit (121) may be designed to generate an amplified current by considering the voltage transformation ratio of the sensing transformer described above and the voltage transformation ratio of the compensation transformer (1221) described later. The active circuit (121) may be implemented by various means, and according to one embodiment, the active circuit (121) may include an OP AMP. According to another embodiment, the active circuit (121) may include a plurality of passive components such as resistors and capacitors in addition to the OP AMP. According to yet another embodiment, the active circuit (121) may include a BJT (Bipolar Junction Transistor) and / or a plurality of passive components such as resistors and capacitors. However, it is not necessarily limited thereto, and the means for amplification described in the present invention may be used without limitation as the active circuit (121) of the present invention. The active circuit (121) is electrically connected to the third device (4) through the second-1 pin (151) coupled to the substrate (10).

[0128] The above amplification current flows through the compensation unit (122) to the first through line (21), the second through line (22) and / or the third through line (23) to compensate for noise.

[0129] The above compensation unit (122) may include a compensation transformer (1221) and a compensation capacitor unit (1222), and the specific configuration and function may be applied in the same way as the embodiment shown in FIG. 2 described above. Each capacitor of the compensation capacitor unit (1222) is connected at one end to the compensation transformer (1221) and at the other end is connected to the first through line (21) to the third through line (23), respectively.

[0130] The embodiment illustrated in FIG. 5 is based on the embodiment illustrated in FIG. 2 and is represented as a three-phase three-wire structure, but the present invention is not necessarily limited thereto, and the embodiment illustrated in FIG. 5 can be equally applied to the embodiments illustrated in FIG. 3 and FIG. 4.

[0131] FIG. 6 illustrates the configuration of an independent active EMI filter module (1) according to another embodiment.

[0132] The embodiment shown in FIG. 6 is an independent active EMI filter module (1) with a three-phase four-wire structure, unlike the single-phase embodiment shown in FIG. 2 and the three-phase three-wire embodiment shown in FIG. 5.

[0133] Referring to FIG. 6, a first through-line (21), a second through-line (22), a third through-line (23), and a fourth through-line (24) pass through the substrate (10), and both ends of these may be electrically connected to the first-1 pin (141) to the first-8 pin (148), respectively. According to one embodiment, the first through-line (21) may be a power line of the R phase, the second through-line (22) may be a power line of the S phase, the third through-line (23) may be a power line of the T phase, and the fourth through-line (24) may be a power line of the N phase.

[0134] The first element group (11) may include a sensing transformer capable of sensing noise, wherein the sensing transformer may include a first reference winding (111) to a fourth reference winding (114) each connected to a first through line (21) to a fourth through line (24), and a sensing winding (110) formed in the same core as the first reference winding (111) to the fourth reference winding (114).

[0135] The first reference winding (111) to the fourth reference winding (114) can be primary windings connected to a power line, and the sensing winding (110) can be secondary windings.

[0136] The first reference winding (111) to the fourth reference winding (114) may each be in the form of a winding wound around a core, but are not necessarily limited thereto, and at least one of the first reference winding (111), the second reference winding (112), the third reference winding (113), or the fourth reference winding (114) may be structured to pass through the core.

[0137] The sensing winding (110) may be a structure that is wound at least once on a core through which the first reference winding (111) to the fourth reference winding (114) are wound and / or pass.

[0138] The sensing winding (110) is isolated from the power line, just as in the embodiments of FIGS. 2 and 5 described above, and can detect noise current generated from the second device (3). As in the embodiments of FIGS. 2 and 5, the primary winding and the secondary winding can be wound considering the direction of generation of magnetic flux and / or magnetic flux density.

[0139] The sensing winding (110) supplies an induced current to the active circuit (121), and the active circuit (121) amplifies it to generate an amplified current. The active circuit (121) can be designed to generate an amplified current by considering the voltage transformation ratio of the sensing transformer described above and the voltage transformation ratio of the compensation transformer (1221) described later. The active circuit (121) can be implemented by various means, and according to one embodiment, the active circuit (121) may include an OP AMP. According to another embodiment, the active circuit (121) may include a plurality of passive components such as resistors and capacitors in addition to the OP AMP. According to yet another embodiment, the active circuit (121) may include a BJT (Bipolar Junction Transistor) and / or a plurality of passive components such as resistors and capacitors. However, it is not necessarily limited thereto, and the means for amplification described in the present invention can be used without limitation as the active circuit (121) of the present invention. The active circuit (121) is electrically connected to the third device (4) through the second-1 pin (151) coupled to the substrate (10).

[0140] The above amplification current flows through the first through-line (21), second through-line (22), third through-line (23) and / or fourth through-line (24) through the compensation unit (122) to compensate for noise.

[0141] The above compensation unit (122) may include a compensation transformer (1221) and a compensation capacitor unit (1222), and the specific configuration and function may be applied in the same way as the embodiment shown in FIG. 2 and FIG. 5 described above. One end of each capacitor of the compensation capacitor unit (1222) is connected to the compensation transformer (1221), and the other end is connected to the first through line (21) to the fourth through line (24), respectively.

[0142] The embodiment illustrated in FIG. 6 is based on the embodiment illustrated in FIG. 2 and is represented as a three-phase four-line structure, but the present invention is not necessarily limited thereto, and the embodiment illustrated in FIG. 6 can, of course, be applied in the same way to the embodiments illustrated in FIG. 3 and FIG. 4.

[0143] The independent active EMI filter module (1) of the embodiments shown in FIGS. 2 to 6, as described above, can be implemented with a sealed structure isolated from the outside through a sealing structure (13) as shown in FIG. 7 and can be made into a single module.

[0144] According to one embodiment illustrated in FIG. 7, a third element group (103) may be installed on a first surface (101) of a substrate (10), and a fourth element group (104) may be installed on a second surface (102) of a substrate (10). According to one embodiment, the third element group (103) may include various transformers and capacitor sections of FIG. 2 to FIG. 6 described above. More specifically, the third element group (103) may include a sensing transformer, a compensation transformer (1221), and a compensation capacitor section (1222), which are the first element group (11).

[0145] In the case of the embodiment illustrated in FIG. 4, the third element group (103) may include at least one of the sensing capacitor part (116) or the sensing transformer (115) of the first element group (11), in addition to the compensation transformer (1221) and the compensation capacitor part (1222). If the third element group (103) includes the sensing capacitor part (116) or the sensing transformer (115) of the first element group (11), the other element may be included in the fourth element group (14).

[0146] The above-mentioned fourth element group (104) may include an active circuit portion (121). Accordingly, the above-mentioned fourth element group (104) may have a smaller volume compared to the third element group (103).

[0147] According to one embodiment, the bag structure (13) may include a support (131) and a filling portion (132).

[0148] The support (131) is formed of an insulating material and includes an internal space (1310). The space (1310) of the support (131) may be defined by an opening (1311) and a bottom (1312). In some cases, the support (131) may be formed of a heat-transferable material. In this case, a heat dissipation mechanism, such as a heat sink, may be additionally installed on the support (131), thereby allowing heat dissipation by the support (131) to be facilitated.

[0149] The aforementioned substrate (10) is accommodated in the space portion (1310) of the support (131). At this time, the edge of the substrate (10) is formed to correspond to the side size of the space portion (1310), so that the edge of the substrate (10) can be in close contact with the side of the space portion (1310). Accordingly, the space portion (1310) can be divided into two spaces centered on the substrate (10).

[0150] The substrate (10) may be positioned such that the first surface (101) faces the bottom (1312) of the support (131), and the second surface (102) faces the opening (1311) of the support (131). At this time, the first distance (t1) between the bottom (1312) and the first surface (101) of the substrate (10) may be greater than half the distance between the bottom (1312) and the opening (1311). According to one embodiment, the first distance (t1) between the bottom (1312) and the first surface (101) of the substrate (10) may be greater than the second distance (t2) between the opening (1311) and the second surface (102) of the substrate (10). Accordingly, the length of the pin group exposed to the outside of the support (131) through the opening (1311) on the second side (102) can be designed to be small, which can provide structural stability when the independent active EMI filter module (1) is installed.

[0151] Meanwhile, according to one embodiment, the independent active EMI filter module (1) may include a filling portion (132) provided to fill at least a portion of the space portion (1310).

[0152] The above filling portion (132) can be filled between at least the substrate (10) and the bottom (1312), and the substrate (10) can be fixedly bonded to the inner wall of the support (131) by the filling portion (132).

[0153] The above-mentioned filling portion (132) may be provided with a heat-resistant and / or insulating resin material. According to one embodiment, the above-mentioned filling portion (132) may include an epoxy resin and may further include a curing agent.

[0154] In the above-described structure of the independent active EMI filter module (1), the second surface (102) of the substrate (10) on which the pins (14) protrude can form the bottom surface (133) of the module (1).

[0155] According to one embodiment, the independent active EMI filter module (1) may include at least one junction (134) connected to at least a support (131). According to the embodiment illustrated in FIG. 7, the junction (134) may be joined to a second surface (102) of the substrate (10) and an inner surface of the support (131). A second distance (t2) from the second surface (102) of the substrate (10) to the opening (1311) may be sufficient to allow the junction (134) to be installed. The second distance (t2) may be defined as a margin that allows the junction (134) to be installed. The substrate (10) may be more firmly joined to the support (131) by the junction (134), and the junction (134) may prevent the substrate (10) from being separated from the support (131). The joint (134) may be provided with an inclined surface in a portion that is not in contact with the substrate (10) and the support (131), thereby minimizing the space in which the joint (134) exists and minimizing interference between the joint (134) and other members.

[0156] The joint portion (134) may be formed of the same material as the filling portion (132). However, it is not necessarily limited thereto, and the joint portion (134) may include a material different from that of the filling portion (132).

[0157] According to one embodiment, the substrate (10) may have a gap spaced apart from the support (131) at least a portion of its edge, and due to this gap, a portion of the filling portion (132) may protrude toward the second surface (102) of the substrate (10). The protruding portion of the filling portion (132) may spread outward from the gap to form a joint (134). In this case, the joint (134) may also be connected to the filling portion (132), thereby allowing the substrate (10) to be fixed more firmly.

[0158] The above independent active EMI filter module (1) can be simply installed on various devices and, because it has a structure independent of external devices, the third element group (103) can be protected from external stimuli and / or shocks, and damage to the independent active EMI filter module (1) itself can be prevented. This can improve the durability of the entire equipment requiring the independent active EMI filter module (1). In addition, the third element group (103) can be protected from contaminated environments such as external dust. Furthermore, if the support (131) and / or the filling part (132) includes a heat dissipation material, heat emitted from the third element group (103) can be dissipated to the outside, thereby preventing the third element group (103) from deteriorating.

[0159] FIG. 8 is an independent active EMI filter module (1) according to another embodiment, in which, unlike the embodiment shown in FIG. 7, the filling portion (132) may include a first filling portion (1321) and a second filling portion (1322). The first filling portion (1321) may face the first surface (101) of the substrate (10), and the second filling portion (1322) may face the second surface (102) of the substrate (10). The opening (1311) may be closed by the second filling portion (1322) as described above, and the second filling portion (1322) may form the bottom surface (133) of the module. The second filling portion (1322) is provided to completely cover the fourth element group (104), and accordingly, the pins (14) may be structured to protrude to the outside of the module through the second filling portion (1322). The second filling portion (1322) may be formed with a thickness of a third distance (t3) from the second surface (102) of the substrate (10). The third distance (t3) may be the distance from the second surface (102) of the substrate (10) to the bottom surface (133).

[0160] According to one embodiment, the independent active EMI filter module (1) may include at least one joint (134) connected to at least a support (131). According to the embodiment illustrated in FIG. 8, the joint (134) may be joined to the inner surface of the second filling portion (1322) and the support (131).

[0161] The second distance (t2) at which the second surface (102) of the substrate (10) is spaced apart from the opening (1311) may be greater than the third distance (t3) from the second surface (102) of the substrate (10) to the bottom surface (133) of the second filling portion (1322). Thus, the second distance (t2) can be made sufficient to secure the third distance (t3) and to install the joint portion (134). The second distance (t2) can be defined as a margin that allows the second filling portion (1322) and the joint portion (134) to be installed. Thus, it is possible to prevent the second filling portion (1322) from being formed to protrude beyond the opening (1311).

[0162] As can be seen in FIG. 8, the end of the joint portion (134) may be provided to be in contact with the opening (1311), but is not necessarily limited thereto and may be positioned spaced apart from the opening (1311) in the direction of the substrate (10). When the end of the joint portion (134) is positioned spaced apart from the opening (1311), the size of the joint portion (134) can be sufficiently formed, and when the joint portion (134) is formed integrally with the second filling portion (1322), it is sufficiently prevented that the second filling portion (1322) protrudes beyond the opening (1311).

[0163] By means of the joint (134) as described above, the substrate (10) can be more firmly bonded to the support (131), and the joint (134) can prevent the substrate (10) from being separated from the support (131). The joint (134) may be provided with an inclined surface in the second filling portion (1322) and other portions not in contact with the support (131), thereby minimizing the space in which the joint (134) exists and minimizing interference between the joint (134) and other members.

[0164] The joint portion (134) may be formed of at least the same material as the second filling portion (1322). According to one embodiment, the joint portion (134) may include a portion that extends and protrudes from the second filling portion (1322) to the inner wall of the support (131) by surface tension. The joint portion (134) may be formed integrally with the bottom surface (133) without interference with the member forming the bottom surface (133).

[0165] Since the independent active EMI filter module (1) according to this embodiment has a structure independent of external devices, the third element group (103) and the fourth element group (104) can be protected from external stimuli and / or shocks, and damage to the independent active EMI filter module (1) itself can be prevented. This can improve the durability of the entire equipment requiring the independent active EMI filter module (1). In addition, the third element group (103) and the fourth element group (104) can be protected from contaminated environments such as external dust. Furthermore, if the support (131) and / or the filling part (132) includes a heat dissipation material, heat emitted from the third element group (103) and / or the fourth element group (104) can be dissipated to the outside, thereby preventing the third element group (103) and / or the fourth element group (104) from deteriorating.

[0166] FIG. 9 shows the bottom surface of an independent active EMI filter module (1) according to one embodiment. As can be seen in FIG. 9, the joint portion (134) is positioned opposite to the corner of the support (131) and can be joined to each corner of the support (131).

[0167] According to this structure, the fixing force to the support (131) of the substrate (10) can be secured while minimizing positional interference with the members that the joint (134) is exposed to the bottom surface (133).

[0168] FIG. 10 shows the bottom surface of an independent active EMI filter module (1) according to another embodiment. An embodiment of the joint (134) shown in FIG. 10 is formed to form a closed loop and is positioned opposite to the corners and sides of the support (131), so as to be joined to the entire inner surface of the support (131).

[0169] According to this structure, the bonding portion (134) can further increase the fixing force to the support (131) of the substrate (10). It goes without saying that the embodiment illustrated in FIGS. 9 and FIGS. 10 can be equally applied to other embodiments of the present specification.

[0170] FIG. 11 is a cross-sectional view showing an independent active EMI filter module (1) according to another embodiment. The independent active EMI filter module (1) according to the embodiment shown in FIG. 11 may further include a connecting part (105) and a connecting body (106) in addition to the embodiment shown in FIG. 8. Description of parts that overlap with the embodiment shown in FIG. 8 is omitted.

[0171] The above-mentioned connecting portion (105) is connected to the first surface (101) and the second surface (102) of the substrate (10). According to one embodiment, as can be seen in FIG. 12, it may include the shape of a hole penetrating the first surface (101) and the second surface (102) of the substrate (10). The shape of the hole may have a circular or polygonal planar shape, and may include a conventional structure or a structure having a step in cross-section.

[0172] The above connecting portion (105) may be positioned so as not to interfere with at least one of the first element group (11) or the second element group (12). When the connecting portion (105) has the shape of a hole formed in the substrate (10), the connecting portion (105) may be provided so as not to interfere with the third element group (103) and the fourth element group (104).

[0173] According to one embodiment, the connecting portion (105) may be located at a plurality of locations on the substrate (10) so as not to interfere with the third element group (103) and the fourth element group (104).

[0174] The above connector (106) is located within the above connector (105) and can be provided to be connected to the above bag structure (13).

[0175] The above connector (106) may be provided with a filler capable of filling at least a portion of the hole of the connecting part (105). The filler may be exposed to at least one of the first surface (101) or the second surface (102) and connected to the filler (132).

[0176] According to one embodiment, the connector (106) may be formed of the same material as the filling portion (132) forming the bag structure (13), and may optionally be formed integrally with the filling portion (132).

[0177] The filling portion (132) may communicate across the substrate (10) through the connecting portion (105). According to one embodiment, at least a portion of the filling portion (132) communicating through the connecting portion (105) may form a connector (106).

[0178] Specifically, as illustrated in FIG. 12, the connector (106) may be configured to connect the first filling part (1321) and the second filling part (1322) to each other. Since the first filling part (1321) and the second filling part (1322) can be connected to each other by the connector (106), the first filling part (1321) and the second filling part (1322) may not be separated, and the structural stability and durability of the entire filling part (13) may be improved. Accordingly, the first filling part (1321) and the second filling part (1322) may not be separated from each other even if the filling part (13) deteriorates due to heat dissipation.

[0179] According to one embodiment, the connector (105) may further include a separate material different from the filling portion (13) and thus may be connected to the sewing structure (13). Optionally, according to one embodiment, the connector (105) may include an adhesive material. This allows the first filling portion (1321) and the second filling portion (1322) adjacent to the connector (105) to be joined together to firmly secure the filling portion (132).

[0180] FIG. 13 is an independent active EMI filter module (1) according to another embodiment, wherein the independent active EMI filter module (1) according to the embodiment shown in FIG. 13 may further include a connecting part (105) and a second connecting body (107) in addition to the embodiment shown in FIG. 7. The description of parts that overlap with the embodiment shown in FIG. 7 is omitted.

[0181] According to one embodiment, a pin-shaped second connector (107) may be coupled to the connection portion (105). One end of the second connector (107) may be inserted into the filling portion (132), and the other end may be exposed to the outside. The second connector (107) may be formed of a conductive material, thereby serving as a path to dissipate heat from inside the filling portion (132). Optionally, the second connector (107) may be connected to a ground wire to improve the electrical stability of the independent active EMI filter module (1). Although not illustrated in the drawings, such a second connector (107) may also be applied to the embodiment illustrated in FIG. 11.

[0182] In this embodiment, the joint (134) can be formed so as not to interfere with the position of the second connector (107).

[0183] In the above-described independent active EMI filter module (1), a plurality of pins are exposed through the bottom surface (133). At this time, the first-1 pin (141), first-2 pin (142), first-3 pin (143), and first-4 pin (144) of the first pin group (14) electrically connected to the power line are each placed at the corners of the bottom surface (133), and the second-1 pin (151), second-2 pin (152), and second-3 pin (153) of the second pin group (15) are placed at the positions between each corner. The pins of the first pin group (14) electrically connected to the power line can be formed to be relatively thicker than the pins of the second pin group (15). By placing these pins of the first pin group (14) at the corners of the bottom surface (133), structural stability can be provided when the independent active EMI filter module (1) is mounted on another device. In addition, since the pins of the first pin group (14) are mainly electrically connected to a bulky transformer, the transformers (11, 1221) in the third element group (103) can be placed at the edges to distribute the weight of the entire module and provide stability when installed. In a structure designed for the third element group (103) in this way, a design margin can be obtained by placing the pins of the first pin group (14) at the corners of the bottom surface (133). Meanwhile, since the pins of the second pin group (15) can be placed relatively freely after the pins of the first pin group (14) are placed, they can be installed in various ways in the area between the pins of the first pin group (14).

[0184] Meanwhile, the pins of the first pin group (14) are not necessarily installed at the corners of the bottom surface (133), and at least some of the pins of the first pin group (14) may be installed at a position spaced inward from the corners of the bottom surface (133) to a certain extent. However, even in this case, structural stability can be ensured by ensuring that the distance from the corner does not exceed about 1 / 4 of the side. According to one embodiment, the first-1 pin (141) and the first-2 pin (142) are installed at a position spaced a certain distance from the corners of the bottom surface (133), and in this case, the second-3 pin (153) may be installed at one corner of the bottom surface (133). The second-3 pin (153) becomes a line electrically connected to the reference potential of the compensation transformer (1221), and therefore the thickness of the pin may be as thick as the pins of the first pin group (14). By placing such a thick second-third pin (153) at the corner of the bottom surface (133), structural stability can be secured.

[0185] At least one of the above-mentioned connecting portion (105) and / or connecting body (106) may be positioned so as not to interfere with passive components and / or active components formed on the substrate (10) and may be installed at a location where various wirings are not formed. Specifically, the above-mentioned connecting portion (105) and / or connecting body (106) may be installed at multiple locations along the edge of the substrate (10), approximately in the center of the substrate (10).

[0186] The above independent active EMI filter module (1) can be manufactured in the following way.

[0187] First, as can be seen in FIG. 14, a substrate (10) is prepared having a first surface (101) and a second surface (102) facing each other, and a first element group (11) and a second element group (12) are installed on the substrate (10). As described above, the first element group (11) is an element group equipped to detect electromagnetic noise, and the second element group (12) is an element group equipped to generate a compensation signal for electromagnetic noise.

[0188] These first element group (11) and second element group (12) are installed on the first surface (101) and / or second surface (102) of the substrate (10), and are further classified into a third element group (103) with a larger volume and a fourth element group (104) with a smaller volume, taking into account the volume of the elements constituting each element group.

[0189] According to one embodiment, the third element group (103) is composed of transformer elements and a capacitor section, and may include a sensing transformer of the first element group (11), a compensation transformer (1221) and a compensation capacitor section (1222) of the second element group (12). The fourth element group (104) may include an active circuit section (121).

[0190] The classified third element group (103) and fourth element group (104) are installed on the first surface (101) and second surface (102) of the substrate (10), respectively. At this time, the transformers of the third element group (103), namely the sensing transformer of the first element group (11) and the compensation transformer (1221) of the second element group (12), are placed on both edges of the first surface (101), and a compensation capacitor (1222) is placed between the sensing transformer and the compensation transformer (1221), thereby achieving weight balance.

[0191] Next, the substrate (10) on which the components are mounted as described above is sealed.

[0192] According to one embodiment, for the bag, a support (131) is prepared, as can be seen in FIG. 15.

[0193] The support (131) is formed of an insulating material and includes an internal space (1310). The space (1310) of the support (131) may be defined by an opening (1311) and a bottom (1312).

[0194] As can be seen in FIG. 16, a filling liquid (130) is introduced into the space (1310) through the opening (1311) of the support (131). The filling liquid (130) is preferably in a liquid state and may include a liquid epoxy resin and may further include a curing agent. The amount of the filling liquid (130) is sufficient to submerge the third element group (103) installed on the substrate (10).

[0195] Next, as can be seen in FIG. 17, the aforementioned substrate (10) is accommodated in the space (1310) in which the filling liquid (130) is contained. At this time, the first surface (101) of the substrate (10) is positioned so that it faces the bottom (1312) of the space (1310), thereby allowing the third element group (103) mounted on the first surface (101) to be sufficiently submerged in the filling liquid (130).

[0196] With the third element group (103) submerged in the filling liquid (130), the upper portion of the third element group (103) may be spaced apart from the bottom (1312) of the space portion (1310) by a certain distance. In this state, the second surface (102) of the substrate (10) is not sufficiently submerged in the filling liquid (130).

[0197] When the above filling liquid (130) is cured, the filling portion (132) of the independent active EMI filter module (1) as shown in FIG. 7 can be completed.

[0198] According to one embodiment, the joint (134) can be formed. The joint (134) can be formed by applying a material identical to the filling liquid (130) between the second surface (102) of the substrate (10) and the inner wall of the support (131) and curing it. According to one embodiment, the substrate (10) may have a gap spaced apart from the support (131) at least a portion of its edge, and due to this gap, a portion of the filling liquid (130) may protrude toward the second surface (102) of the substrate (10). A portion of the protruding filling liquid (132) spreads outward from the gap, and the joint (134) can be formed by the curing of the filling liquid (130). The curing of the joint (134) is not necessarily performed simultaneously with the formation of the filling liquid (132), but may be performed after the formation of the filling liquid (132). Additionally, the joint (134) is not limited to being formed from the same material as the filling portion (132), but can be formed from a separate material between the second surface (102) of the substrate (10) and the inner wall of the support (131).

[0199] According to another embodiment, as can be seen in FIG. 18, a filling liquid (130) is additionally filled between the opening (1311) of the support (131) and the second surface (102) of the substrate (10). The filling liquid (130) is used to completely submerge the fourth element group (104), and then the filling liquid (130) is cured to form a filling portion (132). At this time, the filling portion (132) includes a first filling portion (1321) located between the substrate (10) and the bottom (1312), and a second filling portion (1322) covering the fourth element group (104) of the substrate (10). The pins (14) have a structure that protrudes to the outside of the module through the second filling portion (1322). And the above joint (134) can be joined to the inner surface of the second filling part (1322) and the support (131).

[0200] If the above joint (134) is formed of the same material as the filling part (132), the above joint (134) can be cured simultaneously with the curing of the second filling part (1322).

[0201] Meanwhile, as can be seen in FIG. 19, at least one connection part (105) can be formed on the substrate (10) as described above. The connection part (105) can be formed in the shape of a hole penetrating the substrate (10), positioned so as not to interfere with passive components and / or active components formed on the substrate (10), and installed at a location where various wirings are not formed. Specifically, the connection part (105) can be installed at multiple locations approximately in the center of the substrate (10) and / or along the edge of the substrate (10).

[0202] Although not illustrated in the drawings, according to another embodiment, a connector (106) may be pre-formed in at least one of the connecting portions (105). The connector (106) may include a heat dissipation material, a heat transfer material and / or an adhesive material, and may be selected according to the required function.

[0203] When such a substrate (10) is immersed in the filling liquid (130) shown in FIG. 16, since a connection portion (105) is formed in at least one area of ​​the substrate (10), the filling liquid (130) can pass through the connection portion (105) in the direction from the first surface (101) of the substrate (10) to the second surface (102). Thus, the filling liquid (130) penetrating the connection portion (105) can cause the fourth element group (104) installed on the second surface (102) of the substrate (10) to be completely submerged in the filling liquid (130). Afterward, the filling liquid (130) is cured to form a filling portion (132) as can be seen in FIG. 20. According to one embodiment, the filling liquid (133) penetrating the connection portion (105) can form a connector (106). And a joint (134) can be formed by the filling liquid (130), and the joint (134) can be hardened when the filling liquid (130) hardens.

[0204] FIG. 21 illustrates a manufacturing method according to another embodiment, wherein a substrate (10) is immersed in a filling liquid (130) filled in the space (1310) of the support (131) in FIG. 16.

[0205] A plurality of connection parts (105) are formed on the substrate (10), and a second connector (107) may be connected to at least some of them. The amount of the filling liquid (130) is sufficient to submerge the third element group (103) installed on the substrate (10).

[0206] At this time, when the substrate (10) is immersed, the second surface (102) of the substrate (10) is not sufficiently submerged in the filling liquid (130). When the filling liquid (130) is cured in this state, the filling portion (132) of the independent active EMI filter module (1) as shown in FIG. 13 can be completed. In this structure, the independent active EMI filter module (1) does not have all components enclosed by the filling portion (132), and the active circuit portion (121) is exposed, but the third component group (103) can be enclosed by the filling portion (132) and sufficiently protected. In addition, if the substrate (10) is a metal PCB, heat dissipation through the substrate (10) becomes possible, so the durability of the independent active EMI filter module (1) according to the embodiment can be further improved.

[0207] In the above structure, the second connector (107) may not be connected to a part of the connection portion (105), and thus the filling liquid may penetrate the substrate (10) through the part of the connection portion (105) that is not connected to the second connector (107) to encapsulate the fourth element group (104).

[0208] Thus, the present invention can simply implement an independent active EMI filter module (1) that is provided in a modular form, and by incorporating various materials into the filling liquid (130) during the manufacturing process, the independent active EMI filter module (1) can be made to implement enhanced functions. For example, additional configurations related to cooling can be implemented by adding insulating, heat transfer, and / or heat dissipation materials to the filling liquid (130).

[0209] In addition, the support (131) provided in the form of a hard case can provide physical protection for internal components, and in some cases, additional heat dissipation mechanisms such as a heat sink can be installed on the support (131), thereby allowing heat dissipation by the support (131) to be carried out smoothly.

[0210] All embodiments described in this specification may be applied in combination with one another.

[0211] The present invention has been described with reference to an embodiment illustrated in the accompanying drawings, but this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true scope of protection of the present invention should be determined only by the appended claims.

Claims

Claim 1 An independent active EMI filter module comprising: a support having a space defined by an opening and a bottom; a substrate accommodated inside the space such that the first surface and the second surface face each other, the first surface facing the bottom and the second surface facing the opening; a filling portion provided to fill at least a portion of the space; a bonding portion joined to at least an inner surface of the support; at least two through lines formed as a conductive pattern on the substrate; a sensing transformer installed on the first surface of the substrate and covered by the filling portion, provided to detect electromagnetic noise of the through lines and generate an induced current; an active circuit portion installed on the second surface of the substrate and amplifying the induced current to generate an amplified current; and a compensation transformer installed on the first surface of the substrate and covered by the filling portion, generating a compensation current based on the amplified current.

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