Multi layer ceramic capacitor package

Abstract

The present disclosure provides a multilayer ceramic capacitor package that minimizes mounting space while providing performance equivalent to or better than that of conventional multilayer ceramic capacitors. The multilayer ceramic capacitor package is configured to be bonded (soldered) to a substrate through a metal plate disposed on the bottom surface.

Description

Technology Field

[0001] The present invention relates to a capacitor, and more specifically, to a multilayer ceramic capacitor package mounted on electronic devices, automobiles, etc. Background Technology

[0002] Due to recent advancements in IT technology, the demand for Multi-Layer Ceramic Capacitors (MLCCs) is increasing significantly.

[0003] Multilayer ceramic capacitors are components that store electricity and stably supply the required amount to active components, such as semiconductors, enabling them to operate smoothly. Because multilayer ceramic capacitors prevent component damage by supplying a constant current, they are installed in most products containing electronic circuits.

[0004] Recently, multilayer ceramic capacitors are being installed in electric vehicles and hybrid electric vehicles. For example, electric vehicles and hybrid electric vehicles are equipped with an OBC (on-board charger) module that boosts external AC power and converts it to DC power during slow battery charging. In this process, multilayer ceramic capacitors are additionally installed in electric and hybrid electric vehicles to eliminate EMI (Electromagnetic Interference) noise generated at the power input of the OBC module.

[0005] However, automobiles generate vibrations during operation, and there is a problem where multilayer ceramic capacitors mounted in the vehicle crack due to these vibrations.

[0006] In addition, as the number of electronic components mounted on electric vehicles and hybrid electric vehicles increases, the automotive industry is demanding multilayer ceramic capacitors with minimized mounting area.

[0007] The matters described in the background technology above are intended to aid in understanding the background of the invention and may include matters that are not disclosed prior art. Prior art literature

[0008] Japanese Registered Patent No. 5536393 The problem to be solved

[0009] The present invention is proposed in consideration of the circumstances and aims to provide a multilayer ceramic capacitor package that prevents cracks caused by vibrations occurring during vehicle operation.

[0010] In addition, the present invention has another objective of providing a multilayer ceramic capacitor package that minimizes mounting space. means of solving the problem

[0011] To achieve the above-mentioned objective, a multilayer ceramic capacitor package according to an embodiment of the present invention comprises an electrode stack having a plurality of internal electrodes disposed therein, an upper surface, a lower surface, a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side, a first external electrode disposed on the third side of the electrode stack, a second external electrode disposed on the third side of the electrode stack and spaced apart from the first external electrode, a third external electrode disposed on the fourth side of the electrode stack, a fourth external electrode disposed on the fourth side of the electrode stack and spaced apart from the third external electrode, a first metal plate connected to the first external electrode and the third external electrode, and a second metal plate connected to the second external electrode and the fourth external electrode.

[0012] The electrode laminate comprises an electrode layer in which a plurality of dielectric sheets having internal electrodes formed thereon are laminated, and the electrode layer may include a first dielectric sheet, a first internal electrode disposed on a first surface of the first dielectric sheet, a second dielectric sheet disposed on a first surface of the first dielectric sheet, and a second internal electrode disposed on a first surface of the second dielectric sheet and interposed between the first dielectric sheet and the second dielectric sheet.

[0013] The first internal electrode is formed of a conductive substrate having a narrower area than the first dielectric sheet and includes a first main electrode disposed on the first surface of the first dielectric sheet, a first protruding electrode configured to extend from the first main electrode in the direction of the third side of the electrode stack and exposed to the third side of the electrode stack, and a second protruding electrode configured to extend from the first main electrode in the direction of the fourth side of the electrode stack and exposed to the fourth side of the electrode stack, and the first external electrode can be connected to the first protruding electrode exposed to the third side of the electrode stack, and the second external electrode can be connected to the second protruding electrode exposed to the fourth side of the electrode stack.

[0014] The second internal electrode is formed of a conductive substrate having a narrower area than the second dielectric sheet and includes a second main electrode disposed on the first surface of the second dielectric sheet, a third protruding electrode configured to extend from the second main electrode in the direction of the third side of the electrode stack and exposed to the third side of the electrode stack, and a fourth protruding electrode configured to extend from the second main electrode in the direction of the fourth side of the electrode stack and exposed to the fourth side of the electrode stack, and the third external electrode is connected to the third protruding electrode exposed to the third side of the electrode stack, and the fourth external electrode can be connected to the fourth protruding electrode exposed to the fourth side of the electrode stack.

[0015] The second main electrode is positioned so as to overlap with the first main electrode of the first internal electrode within the electrode stack, and the third protruding electrode and the fourth protruding electrode may be positioned so as not to overlap with the first protruding electrode and the second protruding electrode of the first internal electrode.

[0016] The electrode stack may further include at least one dielectric layer among a first dielectric layer disposed on the upper side of the electrode layer and a second dielectric layer disposed on the lower side of the electrode layer.

[0017] The first metal plate is connected to the first internal electrode through the first external electrode and the third external electrode, and the second metal plate can be connected to the second internal electrode through the second external electrode and the fourth external electrode.

[0018] The first metal plate is positioned so as to be spaced apart from the second metal plate on the lower surface of the electrode laminate, extends to the third and fourth sides of the electrode laminate, and is positioned so as to be offset toward the first side of the electrode laminate to be connected to the first external electrode and the third external electrode.

[0019] The second metal plate is positioned so as to be spaced apart from the first metal plate on the lower surface of the electrode stack, extends to the third and fourth sides of the electrode stack, and is positioned so as to be offset toward the second side of the electrode stack to be connected to the second external electrode and the fourth external electrode.

[0020] The first metal plate and the second metal plate may be U-shaped with respect to the first side of the electrode laminate.

[0021] A multilayer ceramic capacitor package according to an embodiment of the present invention may further include a first conductive adhesive interposed between a first external electrode and a first metal plate, a second conductive adhesive interposed between a third external electrode and a first metal plate, a third conductive adhesive interposed between a second external electrode and a second metal plate, and a fourth conductive adhesive interposed between a fourth external electrode and a second metal plate. In this case, the first to fourth conductive adhesives may be one of a lead-based adhesive and an Ag epoxy. Effects of the invention

[0022] According to the present invention, a multilayer ceramic capacitor package has the effect of minimizing size while providing performance equivalent to or better than that of a conventional multilayer ceramic capacitor.

[0023] In addition, the multilayer ceramic capacitor package is configured to be bonded to a substrate through a metal plate placed on the bottom surface, thereby having the effect of minimizing mounting space compared to conventional multilayer ceramic capacitors that are bonded to a substrate through the side. Brief explanation of the drawing

[0024] FIG. 1 is a perspective view of a multilayer ceramic capacitor package according to an embodiment of the present invention. FIG. 2 is a view of the first side of the multilayer ceramic capacitor package of FIG. 1. FIG. 3 is a second side view of the multilayer ceramic capacitor package of FIG. 1. FIG. 4 is a third side view of the multilayer ceramic capacitor package of FIG. 1. FIG. 5 is an exploded perspective view of the electrode stack shown in FIG. 11. FIG. 6 is an exploded perspective view of the electrode layer shown in FIG. 5. FIG. 7 is a drawing for explaining the first electrode sheet shown in FIG. 6. FIG. 8 is a drawing for explaining the second electrode sheet shown in FIG. 6. FIG. 9 is a cross-sectional view of a multilayer ceramic capacitor package according to an embodiment of the present invention, cut along A-A'. FIG. 10 is a cross-sectional view of a multilayer ceramic capacitor package according to an embodiment of the present invention, cut along B-B'. FIG. 11 is a drawing for comparing a multilayer ceramic capacitor package according to an embodiment of the present invention with a conventional multilayer ceramic capacitor. FIG. 12 is a drawing illustrating a modified example of a multilayer ceramic capacitor package according to an embodiment of the present invention. Specific details for implementing the invention

[0025] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0026] The embodiments are provided to more fully explain the invention to those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the invention is not limited to the following embodiments. Rather, these embodiments are provided to make the disclosure more faithful and complete and to fully convey the spirit of the invention.

[0027] The terms used herein are for describing specific embodiments and are not intended to limit the invention. Additionally, the singular form in this specification may include the plural form unless the context clearly indicates otherwise.

[0028] In the description of the embodiments, where each layer (film), region, pattern, or structure is described as being formed "on" or "under" the substrate, each layer (film), region, pad, or pattern, "on" and "under" include both being formed "directly" and "indirectly" through another layer. In addition, the reference for the top or bottom of each layer is, in principle, based on the drawings.

[0029] The drawings are intended solely to facilitate an understanding of the concept of the present invention and should not be interpreted as limiting the scope of the invention. Additionally, relative thicknesses, lengths, or sizes in the drawings may be exaggerated for convenience and clarity of explanation.

[0030] Referring to FIGS. 1 to 4, a multilayer ceramic capacitor package according to an embodiment of the present invention comprises an electrode stack (100), a first external terminal (220), a second external terminal (240), a third external terminal (260), a fourth external terminal (280), a first metal frame (320), and a second metal frame (340).

[0031] The electrode laminate (100) is formed as a rectangular parallelepiped having an upper surface, a lower surface, a first side (S1), a second side (S2), a third side (S3), and a fourth side (S4). At this time, the first side (S1) corresponds to the front side in the drawing and is opposite to the second side (S2), which corresponds to the rear side in the drawing. The third side (S3) corresponds to the right side in the drawing and is opposite to the fourth side (S4), which corresponds to the left side in the drawing.

[0032] The electrode laminate (100) may be composed of a laminate in which a plurality of dielectric sheets are laminated. In this case, internal electrodes are formed in some of the dielectric sheets among the plurality of dielectric sheets. Accordingly, the electrode laminate (100) is composed of a laminate in which a plurality of internal electrodes are arranged inside.

[0033] The first external electrode is positioned outside the electrode stack (100) and is positioned on the third side (S3) of the electrode stack (100). The first external electrode is positioned adjacent to the first side (S1) of the electrode stack (100), but is positioned so as to be spaced apart from the first side (S1) of the electrode stack (100) by a predetermined distance.

[0034] The first external electrode is formed only on the third side (S3) of the electrode stack (100). The first external electrode may also be formed to extend to the upper surface and / or lower surface of the electrode stack (100).

[0035] The second external electrode is positioned outside the electrode stack (100) and is positioned on the third side (S3) of the electrode stack (100). The second external electrode is positioned adjacent to the second side (S2) of the electrode stack (100) but spaced apart from the first external electrode by a predetermined distance. The second external electrode is positioned adjacent to the second side (S2) of the electrode stack (100) on the third side (S3) of the electrode stack (100), but spaced apart from the second side (S2) of the electrode stack (100) by a predetermined distance.

[0036] The second external electrode is formed only on the third side (S3) of the electrode stack (100). The first external electrode may also be formed to extend to the upper surface and / or lower surface of the electrode stack (100).

[0037] The third external electrode is disposed outside the electrode stack (100) and is disposed on the fourth side (S4) of the electrode stack (100). The third external electrode is disposed adjacent to the first side (S1) of the electrode stack (100) on the fourth side (S4) of the electrode stack (100), but is disposed at a predetermined distance from the first side (S1) of the electrode stack (100). The electrode stack (100) is disposed between the first external electrode and the third external electrode, and the third external electrode may be disposed facing the first external electrode with the electrode stack (100) in between.

[0038] The third external electrode is formed only on the fourth side (S4) of the electrode stack (100). The third external electrode may also be formed to extend to the upper surface and / or lower surface of the electrode stack (100).

[0039] The fourth external electrode is positioned on the fourth side (S4) of the electrode stack (100) and spaced apart from the third external electrode by a predetermined distance. The fourth external electrode is positioned adjacent to the second side (S2) of the electrode stack (100) on the fourth side (S4) of the electrode stack (100), and spaced apart from the second side (S2) of the electrode stack (100) by a predetermined distance. The electrode stack (100) is positioned between the second external electrode and the fourth external electrode, and the fourth external electrode may be positioned to face the second external electrode with the electrode stack (100) in between.

[0040] The fourth external electrode is formed only on the fourth side (S4) of the electrode stack (100). The fourth external electrode may also be formed to extend to the upper surface and / or lower surface of the electrode stack (100).

[0041] A first metal frame (320) is formed across the lower surface, third side (S3), and fourth side (S4) of the electrode stack (100). The first metal frame (320) is positioned adjacent to the first side (S1) of the electrode stack (100), but spaced apart from the first side (S1) of the electrode stack (100) by a predetermined distance. On the third side (S3) of the electrode stack (100), a portion of the first external electrode is interposed between the first metal frame (320) and the electrode stack (100). On the fourth side (S4) of the electrode stack (100), a portion of the third external electrode is interposed between the first metal frame (320) and the electrode stack (100).

[0042] The second metal frame (340) is formed across the lower surface, the third side (S3), and the fourth side (S4) of the electrode stack (100). The second metal frame (340) is spaced apart from the first metal frame (320) and positioned adjacent to the second side (S2) of the electrode stack (100), but is positioned so as to be spaced apart from the second side (S2) of the electrode stack (100) by a predetermined distance. On the third side (S3) of the electrode stack (100), a portion of the second external electrode is interposed between the second metal frame (340) and the electrode stack (100). On the fourth side (S4) of the electrode stack (100), a portion of the fourth external electrode is interposed between the second metal frame (340) and the electrode stack (100).

[0043] Based on the view looking toward the first side (S1) direction (or the second side (S2) direction) of the electrode stack (100), the first metal frame (320) and the second metal frame (340) are formed in a U shape. Accordingly, the multilayer ceramic capacitor package according to the embodiment of the present invention can reduce the mounting area compared to a conventional multilayer ceramic capacitor in which metal plates are disposed on the first side (S1) and the second side (S2) of the electrode stack (100).

[0044] Thus, the multilayer ceramic capacitor package according to the embodiment of the present invention is configured such that external electrodes are formed only on two sides of the electrode stack (100) and the two opposing external electrodes are connected through a metal frame, thereby allowing the product size to be reduced compared to a conventional multilayer ceramic capacitor that includes external terminals formed on the upper and lower surfaces, the first side (S1), the third side (S3), and the fourth side (S4), and external terminals formed on the upper and lower surfaces, the second side (S2), the third side (S3), and the fourth side (S4).

[0045] In addition, the multilayer ceramic capacitor package according to an embodiment of the present invention can minimize the mounting area by reducing the product size compared to a conventional multilayer ceramic capacitor.

[0046] Referring to FIG. 5, the electrode stack (100) may be configured to include an electrode layer (120), a first dielectric layer (140), and a second dielectric layer (160).

[0047] The electrode layer (120) is formed by stacking dielectric sheets having internal electrodes formed thereon. The electrode layer (120) includes a plurality of internal electrodes stacked so as to be spaced apart at a predetermined distance vertically in the drawing.

[0048] Referring to FIG. 6, the electrode layer (120) is configured by alternately stacking a plurality of first dielectric sheets (121) and a plurality of second dielectric sheets (123).

[0049] The first dielectric sheet (121) is composed of a plate-shaped ceramic sheet. A first internal electrode (122) is formed on the upper surface of the first dielectric sheet (121).

[0050] For example, referring to FIG. 7, a first internal electrode (122) including a first main electrode (122a), a first protruding electrode (122b), and a second protruding electrode (122c) is formed on the upper surface of the first dielectric sheet (121). As an example, the first internal electrode (122) is an inverted T shape including the first main electrode (122a), the first protruding electrode (122b), and the second protruding electrode (122c). In the following, the first side is a side that is parallel to or aligned with the first side (S1) of the electrode stack (100), the second side is a side that is parallel to or aligned with the first side (S1) of the electrode stack (100), the third side is a side that is parallel to or aligned with the third side (S3) of the electrode stack (100), and the fourth side is a side that is parallel to or aligned with the fourth side (S4) of the electrode stack (100).

[0051] The first main electrode (122a) is a plate-shaped conductive substrate formed in a rectangular shape. The first main electrode (122a) is formed in a rectangular shape having a narrower area than the first dielectric sheet (121). The outer circumference of the first main electrode (122a) is spaced apart from the outer circumference of the first dielectric sheet (121) by a predetermined distance, and the first main electrode (122a) forms an island pattern disposed on the upper surface of the first dielectric sheet (121).

[0052] The first protruding electrode (122b) is a plate-shaped conductive substrate formed in a rectangular shape. The first protruding electrode (122b) extends from the third side of the first main electrode (122a) to the third side of the first dielectric sheet (121).

[0053] The first protruding electrode (122b) is positioned so as to be offset toward the first side of the first main electrode (122a), and the first side of the first protruding electrode (122b) is positioned in alignment with the first side of the first main electrode (122a). The third side of the first protruding electrode (122b) has a shorter length than the third side of the first main electrode (122a). The third side of the first protruding electrode (122b) is positioned in alignment with the third side of the first dielectric sheet (121). Accordingly, the first protruding electrode (122b) is exposed to the third side (S3) of the electrode stack (100) and is connected (contacted) with the first external terminal (220).

[0054] The first side of the first protruding electrode (122b) is spaced apart from the first side of the first dielectric sheet (121), and the second side of the first protruding electrode (122b) is spaced apart from the second side of the first dielectric sheet (121). At this time, as the first protruding electrode (122b) is positioned so as to be offset toward the first side of the first main electrode (122a), the gap between the first side of the first protruding electrode (122b) and the first side of the first dielectric sheet (121) is formed to be narrower than the gap between the second side of the first protruding electrode (122b) and the second side of the first dielectric sheet (121).

[0055] The second protruding electrode (122c) is a plate-shaped conductive substrate formed in a rectangular shape. The second protruding electrode (122c) extends from the fourth side of the first main electrode (122a) to the fourth side of the first dielectric sheet (121).

[0056] The second protruding electrode (122c) is positioned so as to be offset toward the first side of the first main electrode (122a), and the first side of the second protruding electrode (122c) is positioned in alignment with the first side of the first main electrode (122a). The fourth side of the second protruding electrode (122c) has a shorter length than the fourth side of the first main electrode (122a). The fourth side of the second protruding electrode (122c) is positioned in alignment with the fourth side of the first dielectric sheet (121). Accordingly, the first protruding electrode (122b) is exposed to the fourth side (S4) of the electrode stack (100) and is connected (contacted) with the third external terminal (260).

[0057] The first side of the second protruding electrode (122c) is spaced apart from the first side of the first dielectric sheet (121), and the second side of the second protruding electrode (122c) is spaced apart from the second side of the first dielectric sheet (121). At this time, as the second protruding electrode (122c) is positioned so as to be offset toward the first side of the first main electrode (122a), the gap between the first side of the second protruding electrode (122c) and the first side of the first dielectric sheet (121) is formed to be narrower than the gap between the second side of the second protruding electrode (122c) and the second side of the first dielectric sheet (121).

[0058] The second dielectric sheet (123) is composed of a plate-shaped ceramic sheet. A second internal electrode (124) is formed on the upper surface of the second dielectric sheet (123).

[0059] For example, referring to FIG. 8, a second internal electrode (124) is formed on the upper surface of the second dielectric sheet (123), comprising a second main electrode (124a), a third protruding electrode (124b), and a fourth protruding electrode (124c). As an example, the second internal electrode (124) is T-shaped, comprising the second main electrode (124a), the third protruding electrode (124b), and the fourth protruding electrode (124c).

[0060] The second main electrode (124a) is a plate-shaped conductive substrate formed in a rectangular shape. The second main electrode (124a) is formed in a rectangular shape having a narrower area than the second dielectric sheet (123). The outer circumference of the second main electrode (124a) is spaced apart from the outer circumference of the second dielectric sheet (123) by a predetermined distance, and the second main electrode (124a) forms an island pattern disposed on the upper surface of the second dielectric sheet (123).

[0061] The third protruding electrode (124b) is a plate-shaped conductive substrate formed in a rectangular shape. The third protruding electrode (124b) extends from the third side of the second main electrode (124a) to the third side of the second dielectric sheet (123).

[0062] The third protruding electrode (124b) is positioned so as to be offset toward the second side of the second main electrode (124a), and the second side of the third protruding electrode (124b) is positioned in alignment with the second side of the second main electrode (124a). The third side of the third protruding electrode (124b) has a shorter length than the third side of the second main electrode (124a). The third side of the third protruding electrode (124b) is positioned in alignment with the third side of the second dielectric sheet (123). Accordingly, the third protruding electrode (124b) is exposed to the third side (S3) of the electrode stack (100) and is connected (contacted) with the second external terminal (240).

[0063] The first side of the third protruding electrode (124b) is spaced apart from the first side of the second dielectric sheet (123), and the second side of the third protruding electrode (124b) is spaced apart from the second side of the second dielectric sheet (123). At this time, as the third protruding electrode (124b) is positioned so as to be offset toward the second side of the second main electrode (124a), the gap between the second side of the third protruding electrode (124b) and the second side of the second dielectric sheet (123) is formed to be narrower than the gap between the first side of the third protruding electrode (124b) and the first side of the second dielectric sheet (123).

[0064] The fourth protruding electrode (124c) is a plate-shaped conductive substrate formed in a rectangular shape. The fourth protruding electrode (124c) extends from the fourth side of the second main electrode (124a) to the fourth side of the second dielectric sheet (123).

[0065] The fourth protruding electrode (124c) is positioned so as to be offset toward the second side of the second main electrode (124a), and the second side of the fourth protruding electrode (124c) is positioned in alignment with the second side of the second main electrode (124a). The fourth side of the fourth protruding electrode (124c) has a shorter length than the fourth side of the second main electrode (124a). The fourth side of the fourth protruding electrode (124c) is positioned in alignment with the fourth side of the second dielectric sheet (123). Accordingly, the fourth protruding electrode (124c) is exposed to the fourth side (S4) of the electrode stack (100) and is connected (contacted) with the fourth external terminal (280).

[0066] The first side of the fourth protruding electrode (124c) is spaced apart from the first side of the second dielectric sheet (123), and the second side of the fourth protruding electrode (124c) is spaced apart from the second side of the second dielectric sheet (123). At this time, as the fourth protruding electrode (124c) is positioned so as to be offset toward the second side of the second main electrode (124a), the gap between the second side of the fourth protruding electrode (124c) and the second side of the second dielectric sheet (123) is formed to be narrower than the gap between the first side of the fourth protruding electrode (124c) and the first side of the second dielectric sheet (123).

[0067] The first dielectric layer (140) is disposed on top of the electrode layer (120). The first dielectric layer (140) is composed of a dielectric and is composed of a plate-shaped substrate having a predetermined thickness (or height). The first dielectric layer (140) may be formed by stacking a plurality of dielectric sheets. In this case, the first dielectric layer (140) is formed by stacking a plurality of ceramic sheets as an example.

[0068] The second dielectric layer (160) is disposed below the electrode layer (120). The second dielectric layer (160) is composed of a dielectric and is composed of a plate-shaped substrate having a predetermined thickness (or height). The second dielectric layer (160) may be formed by stacking a plurality of dielectric sheets. In this case, the second dielectric layer (160) is formed by stacking a plurality of ceramic sheets as an example.

[0069] Referring to FIG. 9, the electrode laminate (100) is formed by sintering the electrode layer (120), the first dielectric layer (140), and the second dielectric layer (160) in a stacked state.

[0070] The cross-sectional area (A-A') of the electrode stack (100) is in a state where a plurality of first internal electrodes (122) and a plurality of second internal electrodes (124) are alternately stacked. The first internal electrodes (122) and the second internal electrodes (124) are spaced apart by a predetermined distance (e.g., the thickness of a dielectric sheet). A capacitance is formed between the first internal electrodes (122) and the second internal electrodes (124). At this time, the number of first internal electrodes (122) and second internal electrodes (124) can be determined according to the capacitance of the multilayer ceramic capacitor.

[0071] Referring to FIG. 10, the cross-section (B-B') of the electrode stack (100) has the first protruding electrode (122b) of the first internal electrode (122) and the third protruding electrode (124b) of the second internal electrode (124) arranged thereon. At this time, the first protruding electrode (122b) is exposed to the third side (S3) of the electrode stack (100) and is connected (contacted) with the first external electrode, and the third protruding electrode (124b) is exposed to the third side (S3) of the electrode stack (100) and is connected (contacted) with the second external electrode.

[0072] At this time, although not illustrated in the drawing, the second protruding electrode (122c) of the first internal electrode (122) and the fourth protruding electrode (124c) of the second internal electrode (124) are exposed to the fourth side (S4) of the electrode stack (100) and are connected (contacted) to the third external electrode and the fourth external electrode, respectively.

[0073] Through this, external terminals are formed on the third side (S3) and the fourth side (S4) of the multilayer ceramic capacitor package according to an embodiment of the present invention. Accordingly, the multilayer ceramic capacitor package according to an embodiment of the present invention can reduce the mounting area by reducing the length in the direction of the first side (S1) and the second side (S2) compared to a conventional multilayer ceramic capacitor in which external terminals are formed on the first side (S1) and the second side (S2).

[0074] Referring to FIG. 11, in a conventional multilayer ceramic capacitor (10), an external terminal (12, or metal plate) is placed on the first side (S1) and the second side (S2) of the electrode stack (100), so a soldering area (S) is formed in the external area of ​​the multilayer ceramic capacitor. Accordingly, the conventional multilayer ceramic capacitor (10) requires a mounting area larger than the size of the multilayer ceramic capacitor (10) due to the external soldering area (S).

[0075] In contrast, in the multilayer ceramic capacitor package according to the embodiment of the present invention, a metal plate (320, 340) is disposed on the lower surface of the multilayer ceramic capacitor, so a soldering area (S) is formed on the lower surface of the metal plate (320, 340) of the multilayer ceramic capacitor. Accordingly, since the multilayer ceramic capacitor package according to the embodiment of the present invention requires a mounting area equal to the size of the multilayer ceramic capacitor, the mounting area can be reduced compared to the multilayer ceramic capacitor (10) which requires an additional mounting area.

[0076] Meanwhile, cracks may occur between the external terminal and the metal plate in a multilayer ceramic capacitor package due to vibrations generated during vehicle operation. Accordingly, in order to prevent the occurrence of cracks between the external terminal and the metal plate in the multilayer ceramic capacitor package according to an embodiment of the present invention, the external terminal and the metal plate are bonded using a conductive adhesive.

[0077] For example, referring to FIG. 12, the multilayer ceramic capacitor package further includes a conductive adhesive (400) interposed between an external terminal (200) and a metal plate (300). In this case, the conductive adhesive (400) is exemplified as an adhesive containing lead components or an adhesive containing Ag epoxy.

[0078] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by these embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention. Explanation of the symbols

[0079] 100: Electrode laminate 120: Electrode layer 121: First dielectric sheet 122: First internal electrode 122a: First main electrode 122b: First protruding electrode 122c: Second protruding electrode 123: Second dielectric sheet 124: Second internal electrode 124a: Second main electrode 124b: Third protruding electrode 124c: Fourth protruding electrode 140: 1st dielectric layer 160: 2nd dielectric layer 220: 1st external terminal 240: 2nd external terminal 260: 3rd external terminal 280: 4th external terminal 320: 1st Metal Frame 340: 2nd Metal Frame 400: Conductive adhesive

Claims

Claim 1 An electrode stack having an upper surface, a lower surface, a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side, with a plurality of internal electrodes disposed therein; a first external electrode disposed on the third side of the electrode stack and positioned adjacent to the first side of the electrode stack; a second external electrode disposed on the third side of the electrode stack and positioned adjacent to the second side of the electrode stack, spaced apart from the first external electrode; a third external electrode disposed on the fourth side of the electrode stack and positioned adjacent to the first side of the electrode stack; a fourth external electrode disposed on the fourth side of the electrode stack and positioned adjacent to the second side of the electrode stack, spaced apart from the third external electrode; and a first metal plate disposed on the lower surface of the electrode stack and connected to the first external electrode and the third external electrode. A multilayer ceramic capacitor package comprising a second metal plate that is spaced apart from the first metal plate on the lower surface of the electrode stack and connected to the second external electrode and the fourth external electrode, wherein the first metal plate is positioned so as to be offset in the direction of the first side of the electrode stack and extends to the third and fourth sides of the electrode stack, and the second metal plate is positioned so as to be offset in the direction of the second side of the electrode stack and extends to the third and fourth sides of the electrode stack, and a soldering region is formed at the lower portion of the area among the first metal plate and the second metal plate that is positioned on the lower surface of the electrode stack. Claim 2 A multilayer ceramic capacitor package according to claim 1, wherein the electrode laminate comprises an electrode layer in which a plurality of dielectric sheets having internal electrodes formed thereon are laminated, and the electrode layer comprises: a first dielectric sheet; a first internal electrode disposed on a first surface of the first dielectric sheet; a second dielectric sheet disposed on a first surface of the first dielectric sheet; and a second internal electrode disposed on a first surface of the second dielectric sheet and interposed between the first dielectric sheet and the second dielectric sheet. Claim 3 A multilayer ceramic capacitor package according to claim 2, wherein the first internal electrode is formed of a conductive substrate having an area narrower than that of the first dielectric sheet and comprises: a first main electrode disposed on a first surface of the first dielectric sheet; a first protruding electrode configured to extend from the first main electrode in a third lateral direction of the electrode stack and be exposed to the third lateral side of the electrode stack; and a second protruding electrode configured to extend from the first main electrode in a fourth lateral direction of the electrode stack and be exposed to the fourth lateral side of the electrode stack. Claim 4 A multilayer ceramic capacitor package according to claim 3, wherein the first external electrode is connected to the first protruding electrode exposed to the third side of the electrode stack, and the second external electrode is connected to the second protruding electrode exposed to the fourth side of the electrode stack. Claim 5 A multilayer ceramic capacitor package according to claim 2, wherein the second internal electrode is formed of a conductive substrate having a narrower area than the second dielectric sheet and comprises: a second main electrode disposed on a first surface of the second dielectric sheet; a third protruding electrode configured to extend from the second main electrode in a third lateral direction of the electrode stack and exposed to the third lateral side of the electrode stack; and a fourth protruding electrode configured to extend from the second main electrode in a fourth lateral direction of the electrode stack and exposed to the fourth lateral side of the electrode stack. Claim 6 A multilayer ceramic capacitor package according to claim 5, wherein the third external electrode is connected to the third protruding electrode exposed to the third side of the electrode stack, and the fourth external electrode is connected to the fourth protruding electrode exposed to the fourth side of the electrode stack. Claim 7 A multilayer ceramic capacitor package according to claim 5, wherein the second main electrode is positioned to overlap with the first main electrode of the first internal electrode within the electrode stack, and the third protruding electrode and the fourth protruding electrode are positioned not to overlap with the first protruding electrode and the second protruding electrode of the first internal electrode. Claim 8 In paragraph 2, the electrode laminate further comprises at least one dielectric layer among a first dielectric layer disposed on top of the electrode layer and a second dielectric layer disposed on bottom of the electrode layer, in a multilayer ceramic capacitor package. Claim 9 A multilayer ceramic capacitor package according to paragraph 2, wherein the first metal plate is connected to the first internal electrode through the first external electrode and the third external electrode, and the second metal plate is connected to the second internal electrode through the second external electrode and the fourth external electrode. Claim 10 delete Claim 11 delete Claim 12 In claim 1, the first metal plate and the second metal plate are U-shaped with respect to the first side of the electrode laminate, forming a multilayer ceramic capacitor package. Claim 13 A multilayer ceramic capacitor package according to claim 1, further comprising: a first conductive adhesive interposed between the first external electrode and the first metal plate; a second conductive adhesive interposed between the third external electrode and the first metal plate; a third conductive adhesive interposed between the second external electrode and the second metal plate; and a fourth conductive adhesive interposed between the fourth external electrode and the second metal plate. Claim 14 In claim 13, the first to fourth conductive adhesives are a multilayer ceramic capacitor package that is one of a lead-based adhesive and an Ag epoxy.

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