Semi standard-based equipment data acquisition supporting device and session operation method thereof
Patent Information
- Application Number
- KR1020220153162
- Authority / Receiving Office
- KR · KR
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-11-16
- Publication Date
- 2026-08-11
- Estimated Expiration
- 2042-11-16
Smart Images

Figure R1020220153162_ABST
Abstract
Description
Technology Field
[0001] The present invention relates to a SEMI standard-based equipment data collection support device and a session operation method thereof, and more specifically, to a device for supporting a process in which a user collects data from semiconductor equipment in accordance with SEMI standards and a session operation method for equipment data collection. Background Technology
[0002] The following description merely provides background information related to an embodiment according to the present invention and does not constitute prior art.
[0003] Improving productivity through the automation of semiconductor processes and the optimization of data communication is emerging as a critical factor. Accordingly, to standardize data communication in semiconductor processes, the Equipment Automation Division of SEMI (Semiconductor Equipment and Materials International) is establishing the SECS (SEMI Equipment Communications Standard) protocol, a standard protocol for data communication for interfaces between semiconductor equipment and external computers. Through this, SEMI requires semiconductor equipment manufacturers to apply this as an option, ensuring that semiconductor production equipment adheres to the SECS protocol standard in terms of interfaces.
[0004] Furthermore, as semiconductor processes continue to advance and microfabrication becomes more prevalent, there is a growing demand to acquire and analyze high-resolution process data from equipment using more sensors. Consequently, SEMI has established a protocol dedicated to processing analysis data through a channel separate from the SECS protocol, defining this as the Equipment Data Acquisition Standard (hereinafter referred to as the EDA Standard).
[0005] The EDA standard provides a document describing the specification and, as a complimentary file, an XML Schema and WSDL (Web Service Description Language) required for SOAP message transmission.
[0006] The EDA standard consists of the following four parts, defining a series of services for equipment data collection and enabling the transmission of equipment data to an analysis system.
[0007] E120 : Common Equipment Model
[0008] It provides guidance on the Equipment Structure required to generate equipment metadata, and definitions for attribute values provided by each Equipment Node.
[0009] E125 : Equipment Self Description
[0010] The equipment manufacturer provides the parameters, event information (state machine, simple event), exceptions, and SEMI objects necessary for data collection from the equipment node. When metadata is revised, the equipment provides the client with a notification of the metadata change.
[0011] E132 : Authentication & Authorization
[0012] Through interface discovery, the client (system supervisor) receives the server's (equipment's) service URL. Access Control Lists (ACLs) are created and managed through the Security Admin. The created ACLs are managed using a session management service. When establishing a session, the client specifies the consumer's URL (HTTP End Point) to the equipment, and the equipment provides client services via that URL.
[0013] E134 : Data Collection Management
[0014] A Data Collection Plan (DCP) is created using metadata received from the equipment. The Data Collection Plan is configured with Event, Exception, and Trace, and data is transmitted from the moment the plan is activated. Prior art literature
[0015] KR2004-0105767 The problem to be solved
[0016] The present invention aims to provide a device for supporting the process of collecting data from semiconductor equipment in accordance with SEMI standards, and a method for operating a session for equipment data collection. means of solving the problem
[0017] A method for operating a session for equipment data collection according to an embodiment of the present invention for achieving the above-mentioned purpose may include the steps of: the equipment data collection support device connecting a user terminal session to a user terminal that intends to control data collection from semiconductor equipment; the equipment data collection support device receiving a request to activate a data collection plan corresponding to semiconductor equipment through the user terminal session; and the equipment data collection support device activating the data collection plan through an EDA session different from the user terminal session.
[0018] The step of connecting the above user terminal session may include the step of connecting a user terminal session to receive a first control command corresponding to the control of data collection from the user terminal and to provide first control result information, which is a response according to the first control command, to the user terminal.
[0019] The above method for operating a session for collecting equipment data may further include the step of an equipment data collection support device connecting an EDA session to semiconductor equipment, and the step of connecting the EDA session may include transmitting a second control command to semiconductor equipment, receiving second control result information which is a response to the second control command from semiconductor equipment, and connecting an EDA session in which an equipment data collection device collecting data from semiconductor equipment is set as an endpoint.
[0020] The step of connecting the above EDA session includes connecting the EDA session based on an Access Control List (ACL) corresponding to Equipment Engineering System (EES) designation information received from a user terminal, and the equipment data collection device can post-process data collected from semiconductor equipment and transmit it to the Equipment Engineering System.
[0021] Prior to the step of connecting the above EDA sessions, the equipment data collection support device further includes the step of loading information regarding EDA sessions connected to semiconductor equipment from a database and the step of the equipment data collection support device providing information regarding EDA sessions to a user terminal, and the step of connecting the EDA sessions may include the step of the equipment data collection support device connecting the EDA sessions such that the endpoints corresponding to the equipment engineering system designation information are not duplicated.
[0022] After the step of connecting the above EDA session, the equipment data collection support device further includes the step of loading metadata of semiconductor equipment and the step of providing metadata to a user terminal, wherein the step of loading metadata may include the step of the equipment data collection support device determining whether metadata exists in a database, if metadata does not exist in the database, the step of the equipment data collection support device loading metadata from semiconductor equipment and storing the loaded metadata in the database, and if metadata exists in the database, the step of the equipment data collection support device loading metadata from the database.
[0023] After the step of connecting the above EDA session, the equipment data collection support device may further include the step of loading status information of a data collection plan generated for semiconductor equipment from a database, and the step of the equipment data collection support device providing status information of the data collection plan to a user terminal.
[0024] The above data collection plan or metadata may be provided to the data collection device when the database is updated or when the data collection device is initialized.
[0025] The step of activating the above data collection plan may include activating the data collection plan through an EDA session corresponding to the endpoint included in the activation request of the data collection plan.
[0026] In addition, an equipment data collection support device according to one embodiment of the present invention includes a memory on which at least one program is recorded and a central processing unit (CPU) that executes the program, and the program may perform instructions for performing steps such as connecting a user terminal session to a user terminal that intends to control data collection from semiconductor equipment, receiving a request to activate a data collection plan corresponding to the semiconductor equipment through the user terminal session, and activating the data collection plan through an EDA session different from the user terminal session. Effects of the invention
[0027] According to the present invention, a device for supporting the process of collecting data from semiconductor equipment in accordance with SEMI standards and a method for operating a session for collecting equipment data can be provided. Brief explanation of the drawing
[0028] FIG. 1 is a diagram showing the network relationship between an equipment data collection support device according to one embodiment of the present invention and other entities transmitting and receiving data. FIG. 2 is a reference diagram showing a SEMI standard-based equipment data collection architecture according to one embodiment of the present invention. FIG. 3 is a block diagram showing the configuration of an equipment data collection support device according to one embodiment of the present invention. FIG. 4 is an operation flowchart illustrating a method for supporting equipment data collection according to an embodiment of the present invention. FIG. 5 is an operation flowchart illustrating a method for supporting equipment data collection according to another embodiment of the present invention. FIG. 6 is an operation flowchart illustrating a method for supporting equipment data collection according to another embodiment of the present invention. FIG. 7 is an operation flowchart illustrating a method for supporting equipment data collection according to another embodiment of the present invention. FIG. 8 is a reference diagram showing a session connection structure for SEMI standard-based equipment data collection according to one embodiment of the present invention. FIG. 9 is an operation flowchart illustrating a session operation method for collecting equipment data according to an embodiment of the present invention. FIG. 10 is an operation flowchart illustrating a session operation method for collecting equipment data according to another embodiment of the present invention. FIG. 11 is a block diagram showing the configuration of an equipment data collection device according to one embodiment of the present invention. FIG. 12 is an operation flowchart illustrating a method for ensuring the collection order of equipment data according to an embodiment of the present invention. FIG. 13 is an operation flowchart illustrating a method for ensuring the collection order of equipment data according to another embodiment of the present invention. FIG. 14 is a reference diagram showing the structure of processes executed in an equipment data collection device according to one embodiment of the present invention. FIG. 15 is an operation flowchart illustrating a process switching method in an equipment data collection device according to one embodiment of the present invention. FIG. 16 is an operation flowchart illustrating a process switching method in an equipment data collection device according to another embodiment of the present invention. FIG. 17 is an operation flowchart illustrating a process switching method in an equipment data collection device according to another embodiment of the present invention. FIG. 18 is a drawing showing a computer system according to one embodiment of the present invention. Specific details for implementing the invention
[0029] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.
[0030] Although terms such as "first" or "second" are used to describe various components, these components are not limited by such terms. Such terms may be used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of the present invention.
[0031] The terms used herein are for describing embodiments and are not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically stated otherwise in the text. As used in this specification, "comprises" or "comprising" implies that the mentioned component or step does not exclude the presence or addition of one or more other components or steps.
[0032] Unless otherwise defined, all terms used in this specification may be interpreted in a sense that is commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.
[0033] Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the attached drawings.
[0034] FIG. 1 is a diagram showing the network relationship between an equipment data collection support device (110) according to one embodiment of the present invention and other entities that transmit and receive data.
[0035] Referring to FIG. 1, an equipment data collection support device (110) according to one embodiment of the present invention can transmit and receive data with a user terminal (130) through a first interface and transmit and receive data with a semiconductor equipment (150) through a second interface.
[0036] The first interface may be an interface in which the equipment data collection support device (110) acts as a server and the user terminal (130) acts as a client, and the equipment data collection support device (110) receives a command from the user terminal (130) and responds to the received command.
[0037] The second interface may be an interface in which the semiconductor equipment (150) is an EDA server according to the Equipment Data Acquisition (EDA) standard, and the equipment data acquisition support device (110) is an EDA client, and the equipment data acquisition support device (110) transmits a command to the semiconductor equipment (150) and receives a response according to the command.
[0038] The equipment data collection support device (110) can perform the role of an integrated host application server (HAS) to provide equipment data collection services to a user terminal (130).
[0039] In the EDA standard, an EDA client is defined as being capable of performing the functions of both a host application server and a consumer server. The equipment data collection support device (110) of the present invention can be seen as a device that primarily performs the role of a host application server, excluding the functions performed by a consumer server among the functions performed by an EDA client.
[0040] The user terminal (130) can perform control related to data collection of semiconductor equipment (150) via the equipment data collection support device (110), and can obtain data from the semiconductor equipment (150) through the Equipment Engineering System (EES, 140).
[0041] The semiconductor equipment (150) can receive a control command related to data collection from a user terminal (130) via an equipment data collection support device (110) and transmit data to an equipment data collection device (120) in response to the received command.
[0042] In the EDA standard, an EDA client is defined as being able to perform the functions of both a host application server and a consumer server. The equipment data collection device (120) of the present invention can be seen as a device that primarily performs the functions of a consumer server among the functions performed by an EDA client.
[0043] For example, the equipment data collection device (120) can perform the function of a consumer server that collects data from semiconductor equipment (150), processes the data, and provides it to the equipment engineering system (140).
[0044] As an optional embodiment, the equipment data collection device (120) may be a server physically separated from the equipment data collection support device (110).
[0045] Through this, the session between the semiconductor equipment (150) and the equipment data collection device (120) can remain active independently of the connection state between the equipment data collection support device (110) and the semiconductor equipment (150), thereby providing an advantageous effect in that the equipment data collection device (120) can continuously collect data from the semiconductor equipment (150) without intervention from the equipment data collection support device (110).
[0046] Here, the user terminal (130) refers to a communication terminal capable of using a terminal application in a wired or wireless communication environment. Here, the communication terminal may be the user's personal computer, the user's portable terminal, or an Internet of Things (IoT) based terminal.
[0047] To explain this in more detail, it may include communication terminal computers (e.g., desktops, laptops, tablets, etc.), media computing platforms (e.g., cable, satellite set-top boxes, digital video recorders), handheld computing devices (e.g., PDAs, email clients, etc.), any form of mobile phone, and any form of other types of computing or communication platforms, but the present invention is not limited thereto.
[0048] The equipment data collection support device (110) can be connected to the user terminal (130) and the semiconductor equipment (150) through a communication network.
[0049] A communication network refers to a connection path for enabling data to be transmitted and received between the aforementioned entities. For example, a communication network may include wired networks such as LANs (Local Area Networks), WANs (Wide Area Networks), MANs (Metropolitan Area Networks), and ISDNs (Integrated Service Digital Networks), or wireless networks such as wireless LANs, CDMA, Bluetooth, and satellite communication, but the scope of communication networks applicable to the present invention is not limited thereto.
[0050] FIG. 2 is a reference diagram showing a SEMI standard-based equipment data collection architecture according to one embodiment of the present invention.
[0051] Referring to FIG. 2, the SEMI standard-based equipment data collection architecture may include an equipment data collection support device (110), equipment data collection devices (120-1, 120-2, 120-3), user terminals (130-1, 130-2), an equipment engineering system (140), semiconductor equipment (150-1, 150-2), and a database (160).
[0052] The equipment data collection support device (110) can transmit and receive data by connecting to user terminals (130-1, 130-2) in a one-to-many relationship through the first interface.
[0053] The equipment data collection support device (110) can transmit and receive data by connecting to semiconductor equipment (150-1, 150-2) in a one-to-many relationship through a second interface.
[0054] The semiconductor equipment (150-1, 150-2) and the equipment data collection devices (120-1, 120-2, 120-3) are connected in a many-to-many relationship, and the semiconductor equipment (150-1, 150-2) can transmit data to the equipment data collection devices (120-1, 120-2, 120-3) in a push manner, and the equipment data collection devices (120-1, 120-2, 120-3) can transmit and receive data by calling back to the semiconductor equipment (150-1, 150-2).
[0055] Here, the equipment data collection devices (120-1, 120-2, 120-3) can serve as the endpoint of a session established for the semiconductor equipment (150-1, 150-2).
[0056] As an optional embodiment, the equipment data collection devices (120-1, 120-2, 120-3) may store data received from the semiconductor equipment (150-1, 150-2) in a storage with a queue structure so that the order of the received data is guaranteed.
[0057] As another optional embodiment, multiple applications are run in each of the equipment data collection devices (120-1, 120-2, 120-3), and one of the applications acts as a consumer. In the event of a failure in the application acting as a consumer, another running application may take over the role of consumer to overcome the failure of the consumer server. In this case, since the connection addresses of the consumer servers mapped to the semiconductor equipment remain unchanged, there is an advantageous effect in that the failure of the consumer server can be overcome without the intervention of the equipment data collection support device (110).
[0058] As another optional embodiment, semiconductor equipment (150-1, 150-2) and equipment data collection devices (120-1, 120-2, 120-3) are connected in a many-to-many relationship, so that if a failure occurs in any one of the equipment data collection devices (e.g., 120-1), a connection relationship conversion can be performed so that the semiconductor equipment connected to the equipment data collection device (120-1) is connected to another equipment data collection device. In this case, the connection addresses of consumer servers mapped to the semiconductor equipment can be newly mapped by the equipment data collection support device (110).
[0059] Equipment data collection devices (120-1, 120-2, 120-3) can receive data from semiconductor equipment (150-1, 150-2), convert the data, and transmit it to the equipment engineering system (140).
[0060] In semiconductor equipment (150-1, 150-2), messages in an EDA standard format (e.g., SOAP or XML) are collected as data, and equipment data collection devices (120-1, 120-2, 120-3) can convert the data into a message in a format required by the user or the equipment engineering system and provide it to the equipment engineering system (140).
[0061] The equipment engineering system (140) may include various equipment engineering systems including FDC (Fault Detection & Classification) and may provide converted data to user terminals (130-1, 130-2).
[0062] The database (160) may be a storage facility in which information including session information, metadata information and data collection plan information, and various information of semiconductor equipment is stored, so that information required by the equipment data collection support device (110), equipment data collection devices (120-1, 120-2, 120-3), and equipment engineering system (140) is managed in an integrated manner.
[0063] FIG. 3 is a block diagram showing the configuration of an equipment data collection support device (110) according to one embodiment of the present invention.
[0064] Referring to FIG. 3, an equipment data collection support device (110) according to one embodiment of the present invention may include a plurality of interfaces (111), a metadata management unit (112), a session management unit (113), a security management unit (114), and a data collection plan management unit (115).
[0065] A plurality of interfaces (111) may include a first interface for receiving a command from a user terminal and responding to the received command, and a second interface for transmitting a command to a semiconductor equipment and receiving a response to the command according to an Equipment Data Acquisition (EDA) standard.
[0066] The metadata management unit (112) can provide access to the metadata of the semiconductor equipment to the user terminal through the first interface.
[0067] The metadata management unit (112) can receive metadata from semiconductor equipment through the second interface and store it in a database or provide it to a user terminal through the first interface when a session is connected.
[0068] Here, metadata can be converted and stored in a tree or table format.
[0069] As an optional embodiment, the metadata management unit (112) can retrieve metadata from the database and provide it to the user terminal through the first interface when the default location for retrieving metadata when a session is connected is set to a database rather than a semiconductor device.
[0070] The session management unit (113) can register semiconductor equipment in the equipment list based on the connection address of the semiconductor equipment received from the user terminal through the first interface.
[0071] Here, the access address can be a Uniform Resource Locator (URL).
[0072] The session management unit (113) can map the connection address of a consumer server to a semiconductor equipment registered in the equipment list based on the connection address of the consumer server received from the user terminal through the first interface.
[0073] Here, the consumer server is a server physically separated from the equipment data collection support device (110), and the connection address of the consumer server may be a different address from the connection address of the equipment data collection support device (110).
[0074] The session management unit (113) can provide a session connection to a user terminal through the first interface based on an Access Control List (ACL) containing access rights information for semiconductor equipment.
[0075] When the session management unit (113) receives a session connection command from a user terminal through the first interface, it can connect a session in response based on an access control list item corresponding to the user of the user terminal.
[0076] The session can be divided into a user terminal session connected between the user terminal and the equipment data collection support device (110), an EDA session connected between the equipment data collection support device (110), the semiconductor equipment and the equipment data collection device (120), and an EES session connected between the analysis system server and the equipment engineering system.
[0077] EDA sessions can be established using access control lists and endpoint information corresponding to semiconductor equipment users in accordance with SEMI standards.
[0078] The session management unit (113) can manage the session active status by semiconductor equipment and by data collection plan.
[0079] The session management unit (113) receives session information from the semiconductor equipment and can verify the session information received from the semiconductor equipment using at least one of the data collection plans among the session and metadata managed by the equipment data collection support device.
[0080] The session management unit (113) can synchronize the parameters of the semiconductor equipment through the second interface so that the connection address of the consumer server mapped to the semiconductor equipment and the active state of the data collection plan defined for the semiconductor equipment can be applied to the semiconductor equipment.
[0081] The security management unit (114) can provide access to the access control list to the user terminal through the first interface.
[0082] The security management unit (114) can receive an ACL acquisition command (Get ACL) from a user terminal through the first interface and receive privilege items from the semiconductor equipment in response to this.
[0083] Next, the security management unit (114) receives an Add Role command from a user terminal through the first interface and can map role information to at least one of the authority items in response to this.
[0084] Next, the security management unit (114) receives an Add Principal command from a user terminal through the first interface and can map principal information to at least one of the authority items in response to this.
[0085] An access control list containing the mapping results as described above may include items in which role information or principal information is mapped to at least one of the authorization items for semiconductor equipment.
[0086] The security management department (114) can enable or disable session connections for specific users.
[0087] For example, the security management unit (114) can provide a list of active sessions to a user terminal through the first interface and disable the session in response to a deactivation command for a specific session received from the user terminal.
[0088] The data collection plan management unit (115) can provide access to a data collection plan (DCP) of semiconductor equipment defined based on metadata to a user terminal through the first interface.
[0089] The data collection plan management unit (115) can receive a list of data collection plans defined in the semiconductor equipment through the second interface when a session is connected and provide it to the user terminal through the first interface.
[0090] The data collection plan management unit (115) can receive a data collection plan refresh command from a user terminal through a first interface, receive a data collection plan list defined in the semiconductor equipment through a second interface in response to this, and provide it to the user terminal through the first interface.
[0091] The data collection plan management unit (115) receives a data collection plan creation (Define DCP) command from a user terminal through the first interface, which includes the type of data collection plan to be created and the setting values of the data collection plan, and can create a data collection plan of the type specified by the user in response to this.
[0092] Here, the types of data collection plans may include at least one of trace, event, exception, and combination.
[0093] If the type of data collection plan is tracking, data may be collected from semiconductor equipment or collection may be stopped depending on whether there is an event or alarm specified in the start or stop trigger.
[0094] The data collection plan management unit (115) receives an activation command or a deactivation command for a specific data collection plan from a user terminal through the first interface, and in response to this, can activate or deactivate a data collection plan specified by the user.
[0095] The data collection plan management unit (115) can receive a deletion command for a specific data collection plan from a user terminal through the first interface and delete the data collection plan specified by the user in response to this.
[0096] The data collection plan management unit (115) can define a data collection plan by utilizing metadata stored in a database to prevent duplicate metadata from the same semiconductor equipment from being collected per user and per session.
[0097] The data collection plan management unit (115) can perform a duplicate check of the data collection plan to prevent duplicate data collection plans from being created for the same semiconductor equipment.
[0098] FIG. 4 is an operation flowchart illustrating a method for supporting equipment data collection according to an embodiment of the present invention.
[0099] Referring to FIG. 4, a method for supporting equipment data collection according to one embodiment of the present invention first allows an equipment data collection support device to add an access control list (ACL) containing access rights information for semiconductor equipment (S410).
[0100] Here, the equipment data collection support device receives a privilege list from semiconductor equipment and can generate an access control list including items in which at least one of the privileges included in the privilege list is mapped to a role or principal.
[0101] Next, the equipment data collection support device can connect a session to the semiconductor equipment based on an item corresponding to the user of the user terminal among the items included in the access control list (S420).
[0102] Here, the equipment data collection support device can disable another user's session connection at the user's request.
[0103] For example, the equipment data collection support device provides a list of active sessions to the user terminal and can disable the corresponding session in response to a disable command for a specific session received from the user terminal.
[0104] Next, the equipment data collection support device can load metadata from the session-connected semiconductor equipment (S430).
[0105] Here, the equipment data collection support device can store the metadata of the semiconductor equipment in a database or provide it to a user terminal.
[0106] Next, the equipment data collection support device can generate a data collection plan (DCP) for semiconductor equipment based on metadata (S440).
[0107] Here, the equipment data collection support device can perform a duplication check to determine whether the new data collection plan overlaps with the existing data collection plan.
[0108] Next, the equipment data collection support device can activate the generated data collection plan (S450).
[0109] FIG. 5 is an operation flowchart illustrating a method for supporting equipment data collection according to another embodiment of the present invention.
[0110] In particular, FIG. 5 is an operation flowchart illustrating the process of registering a user of an equipment data collection support device, a semiconductor device that is an EDA server, and a consumer server that is the target of an EDA client service.
[0111] Referring to FIG. 5, an equipment data collection support method according to another embodiment of the present invention may register other users to connect to the equipment data collection support device based on information about other users received from a user terminal (S510).
[0112] Next, the equipment data collection support device can register semiconductor equipment to be managed by the equipment data collection support device based on the connection address of the semiconductor equipment received from the user terminal (S520).
[0113] Here, when there is an interface search command from a user terminal, the equipment data collection support device connects to the semiconductor equipment using the connection address of the semiconductor equipment, and receives the Equipment Name and EDA Web Service URL from the semiconductor equipment and maps them to the semiconductor equipment.
[0114] Next, the equipment data collection support device can register consumer servers to collect data from semiconductor equipment based on the connection address to the consumer server received from the user terminal (S530).
[0115] Here, the equipment data collection support device can map the connection address of a consumer server, which is the target of the EDA client service, to the semiconductor equipment.
[0116] FIG. 6 is an operation flowchart illustrating a method for supporting equipment data collection according to another embodiment of the present invention.
[0117] In particular, Fig. 6 is a flowchart illustrating the process of creating and managing a data collection plan in an equipment data collection support device.
[0118] Referring to FIG. 6, in another embodiment of the present invention, a method for supporting equipment data collection can receive a list of data collection plans defined in the semiconductor equipment when the equipment data collection support device loads metadata from the session-connected semiconductor equipment (S610).
[0119] Next, the equipment data collection support device can receive real-time parameter values, events, and alarms corresponding to the new data collection plan (S620).
[0120] The equipment data collection support device provides real-time parameter values corresponding to a new data collection plan to a user terminal, thereby enabling real-time data collection testing according to the new data collection plan.
[0121] Through this, the equipment data collection support device generates a new data collection plan that does not overlap with the list of existing data collection plans predefined in the semiconductor equipment, and has the advantageous effect of enabling real-time testing of whether data is being collected properly according to the new data collection plan.
[0122] FIG. 7 is an operation flowchart illustrating a method for supporting equipment data collection according to another embodiment of the present invention.
[0123] In particular, FIG. 7 is an operation flowchart illustrating the process of applying a data collection plan generated in an equipment data collection support device to a semiconductor device and collecting data.
[0124] Referring to FIG. 7, an equipment data collection support method according to another embodiment of the present invention can activate a newly generated data collection plan by an equipment data collection support device (S450).
[0125] Here, the new data acquisition plan is configured such that the status value in the equipment data acquisition support device indicates an active state, and the new data acquisition plan or the active state of the new data acquisition plan may not be synchronized with the semiconductor equipment.
[0126] Next, the equipment data collection support device can redefine the data collection plan of the semiconductor equipment as a new data collection plan and synchronize the active state of the new data collection plan so that real-time data can be collected from the semiconductor equipment to the consumer server (S710).
[0127] As an optional embodiment, the equipment data collection support device may display real-time data collected by a consumer server on a user interface provided through a user terminal, with different visual effects applied according to the type of data collection plan corresponding to the real-time data.
[0128] FIG. 8 is a reference diagram showing a session connection structure for SEMI standard-based equipment data collection according to one embodiment of the present invention.
[0129] Referring to FIG. 8, the entities for collecting SEMI standard-based equipment data according to one embodiment may have an equipment data collection support device (110), an equipment data collection device (120), semiconductor equipment (150), and a database (160) located on the semiconductor factory (FAB) side, and a user terminal (130) and an equipment engineering system (140) located on the office side.
[0130] Semiconductor factories (FABs) and offices can be geographically distant and located in different areas.
[0131] The equipment data collection support device (110) receives a control command for data collection control from a plurality of user terminals (130) that want to control data collection from the semiconductor equipment (150), and can provide control result information to the user terminals (130) in response to this.
[0132] The equipment data collection support device (110) can transmit a second control command corresponding to a first control command received from a plurality of user terminals (130) to the semiconductor equipment (150), and provide first control result information corresponding to second control result information received from the semiconductor equipment (150) to the user terminals (130).
[0133] Here, the connection between the equipment data collection support device (110) and the user terminal (130) is made through a user terminal session, and the connection between the equipment data collection support device (110) and the semiconductor equipment (150) can be made through an EDA session.
[0134] The equipment data collection support device (110) can set the equipment data collection device (120) to collect data from the semiconductor equipment as an endpoint to establish an EDA session with the semiconductor equipment (150).
[0135] That is, since all user terminals (130) are not directly connected to the semiconductor equipment (150) that the user intends to control, but are connected to an equipment data collection support device (110) that performs the role of a HAS server, network traffic between the factory (FAB) side and the user terminals (130) can occur only between the equipment data collection support device (110) and the user terminals (130).
[0136] Additionally, since the equipment engineering systems (140) do not collect data directly from the semiconductor equipment (150) but collect data from the equipment data collection device (120) or the analysis system server downstream of the equipment data collection device (120), network traffic between the factory (FAB) and the equipment engineering systems (140) may occur only between the equipment data collection device (120) and the equipment engineering systems (140), or only between the analysis system server and the equipment engineering systems (140).
[0137] Accordingly, network traffic between the factory (FAB) side and the office side can be managed through a first firewall setting to allow user terminals (130) to access the equipment data collection support device (110) and a second firewall setting to allow equipment engineering systems (140) to access the equipment data collection device (120) or the analysis system server.
[0138] FIG. 9 is an operation flowchart illustrating a session operation method for collecting equipment data according to an embodiment of the present invention.
[0139] Referring to FIG. 9, a method for operating a session for equipment data collection according to one embodiment of the present invention first allows an equipment data collection support device to connect a user terminal session to a user terminal that wants to control data collection from semiconductor equipment (S910).
[0140] Here, the user terminal session may be a session for the equipment data collection support device to receive a first control command corresponding to the control of data collection from the user terminal and to provide first control result information, which is a response according to the first control command, to the user terminal.
[0141] Although not illustrated in FIG. 9, the equipment data collection support device can connect the semiconductor equipment and the EDA session after connecting the user terminal session, or provide information regarding the already connected EDA session to the user terminal through the user terminal session.
[0142] Here, the EDA session may be a session in which an equipment data collection support device transmits a second control command to semiconductor equipment and receives second control result information, which is a response to the second control command, from semiconductor equipment.
[0143] The equipment data collection support device can load information about EDA sessions connected to semiconductor equipment from a database before connecting an EDA session, and provide information about the EDA sessions to the user terminal.
[0144] The equipment data collection support device connects an EDA session based on an Access Control List (ACL) corresponding to Equipment Engineering System (EES) designation information received from a user terminal, and the equipment data collection device can post-process data collected from semiconductor equipment and transmit it to the Equipment Engineering System.
[0145] When an EDA session is connected, an equipment data collection device that collects data from semiconductor equipment can be set as an endpoint.
[0146] The equipment data collection support device can connect EDA sessions so that the access control list corresponding to the user's equipment engineering system designation information is not duplicated.
[0147] After connecting an EDA session, the equipment data collection support device can load the metadata of the semiconductor equipment and provide the metadata to the user terminal.
[0148] The equipment data collection support device determines whether metadata exists in the database, and if metadata does not exist in the database, loads metadata from the semiconductor equipment and stores the loaded metadata in the database, and if metadata exists in the database, it can load metadata from the database.
[0149] After connecting an EDA session, the equipment data collection support device can load status information of a data collection plan generated for semiconductor equipment from a database and provide the status information of the data collection plan to a user terminal.
[0150] The above data collection plan or metadata may be provided to the data collection device when the database is updated or when the data collection device is initialized.
[0151] Next, the equipment data collection support device can receive an activation request for a data collection plan corresponding to the semiconductor equipment through a user terminal session (S920).
[0152] Next, the equipment data collection support device can activate the data collection plan through the EDA session (S930).
[0153] The data collection plan can be activated through an EDA session corresponding to the endpoint included in the activation request of the equipment data collection support device data collection plan.
[0154] FIG. 10 is an operation flowchart illustrating a session operation method for collecting equipment data according to another embodiment of the present invention.
[0155] Referring to FIG. 10, a session operation method for collecting equipment data according to another embodiment of the present invention first, when a first user terminal (130-1) requests an EDA session connection to an equipment data collection support device (110), the equipment data collection support device (110) can connect an EDA session with a first semiconductor equipment (150-1) and store EDA session information in a database (160).
[0156] In the initial state, since metadata of the first semiconductor equipment (150-1) is not stored in the equipment data collection support device (110) or the database (160), the equipment data collection support device (110) can directly receive metadata from the first semiconductor equipment (150-1), provide it to the first user terminal (130-1), and store it in the database (160).
[0157] Next, when the first user terminal (130-1) requests the equipment data collection support device (110) to generate a DCP, the equipment data collection support device (110) requests the first semiconductor equipment (150-1) to generate a DCP using an EDA session connected to the first semiconductor equipment (150-1), and can store the requested DCP information in the database (160).
[0158] Next, when the first user terminal (130-1) requests DCP activation from the equipment data collection support device (110), the equipment data collection support device (110) may request DCP activation in the first semiconductor equipment (150-1) using an EDA session connected to the first semiconductor equipment (150-1) and store status information indicating that the DCP is active in the database (160).
[0159] In this way, upon a request received from the first user terminal (130-1), an EDA session is established between the equipment data collection support device (110) and the first semiconductor equipment (150-1), so that metadata is stored once, a DCP is generated, and status information is generated, then relevant information can be provided so that the second user terminal (130-2) that connects thereafter can utilize it.
[0160] For example, when the second user terminal (130-2) connects to the equipment data collection support device (110), the equipment data collection support device (110) obtains session information, metadata, and DCP information stored in a database and provides them to the second user terminal (130-2), thereby allowing the user of the second user terminal (130-2) to confirm that an EDA session has been created for the first user terminal (130-1) and that a DCP has been created and is active.
[0161] When the second user terminal (130-2) requests DCP deactivation from the equipment data collection support device (110), the equipment data collection support device (110) may request DCP deactivation in the first semiconductor equipment (150-1) using an EDA session connected to the first semiconductor equipment (150-1) and store status information indicating that the DCP is in an inactive state in the database (160).
[0162] FIG. 11 is a block diagram showing the configuration of an equipment data collection device (120) according to one embodiment of the present invention.
[0163] Referring to FIG. 11, an equipment data collection device (120) according to one embodiment of the present invention may include a web application server driving unit (121) and a message order guarantee support unit (122).
[0164] The semiconductor equipment (150) can transmit the collected data in the form of a message to the equipment data collection device (120) according to the activated data collection plan.
[0165] The web application server drive unit (121) can assign a thread to each of the messages in the order in which messages are received from the semiconductor equipment (150), and run a web application server (WAS) to receive the messages through the thread.
[0166] Here, when the web application server receives a packet from semiconductor equipment through the connection unit, it determines from the header of the packet whether the packet format corresponds to the HTTP protocol and can allocate one of the threads registered in the thread pool to receive the payload of the packet.
[0167] A thread is allocated to perform the entire process of receiving, objectifying, and post-processing a single message; in other words, one thread can be dedicated to handling a single message.
[0168] The web application server can manage the message order guarantee support unit (122) through the management unit.
[0169] For example, the management unit is a servlet handler in the case of Java, and the message order guarantee support unit (122) may be a servlet managed by the servlet handler.
[0170] A thread can perform various steps, including logging, according to the interceptor chain included in the servlet, and upon completion of receiving a message, it can call a function among the various functions included in the interceptor chain to determine the processing order and perform post-processing.
[0171] As an optional embodiment, a CXF servlet may be used to perform the role of a message order guarantee support unit (122).
[0172] In this case, the CXF servlet is executed with the One Way Processor Interceptor of the interceptor chain disabled, thereby preventing a new thread from being allocated to execute the function called in the interceptor chain.
[0173] Through this, when a function for determining the processing order and performing post-processing is called in the interceptor chain included in the CXF servlet, the thread that received the message is not changed to another thread, and the function for determining the processing order and performing post-processing can be executed by the thread that received the message.
[0174] Here, the message order guarantee support unit (122) can queue the identification information of threads in the order of thread allocation in a queue created in correspondence with the semiconductor equipment.
[0175] Here, the identification information may be an IP (Internet Protocol) address or a combination of an IP address and a port.
[0176] The thread can queue identification information into the semiconductor equipment-thread mapping queue, receive the full message, and objectify it.
[0177] A semiconductor equipment-thread mapping queue is created for each semiconductor equipment, and there can be a one-to-one correspondence between the semiconductor equipment and the semiconductor equipment-thread mapping queues.
[0178] Here, objectification may refer to converting the full text of a message transmitted by semiconductor equipment into an objectified data format (e.g., XML or JSON format) in accordance with EDA standards.
[0179] Here, the message order guarantee support unit (122) can determine the processing order of a message using the identification information of a thread and the semiconductor equipment-thread mapping queue when a thread has finished receiving a message.
[0180] The message order guarantee support unit (122) can perform post-processing on the messages in the order in which the messages are received.
[0181] Here, post-processing may refer to converting the form of a message into a format required by the Equipment Engineering System (EES).
[0182] Here, the message order guarantee support unit (122) can dequeue the identification information of the thread corresponding to the message whose processing order has arrived from the semiconductor equipment-thread mapping queue.
[0183] FIG. 12 is an operation flowchart illustrating a method for ensuring the collection order of equipment data according to an embodiment of the present invention.
[0184] Referring to FIG. 12, a method for ensuring the order of equipment data collection according to one embodiment of the present invention first allows an equipment data collection device to allocate a first thread for receiving a first message from semiconductor equipment (S1210).
[0185] Here, the equipment data collection device can assign one thread to each of the messages in the order in which the first packet of the message is received.
[0186] Next, the equipment data collection device can store the reception order of the first message using the first identification information of the first thread (S1220).
[0187] Here, the equipment data collection device can store the reception order of the first message by queuing the first identification information into a semiconductor equipment-thread mapping queue created in correspondence with the semiconductor equipment.
[0188] Next, the equipment data collection device can determine the processing order of the second message using the second identification information of the second thread that has received the second message and the order of receipt of the messages (S1230).
[0189] Here, the equipment data collection device may determine that the processing order of the second message has arrived when the second identification information and the first item of the semiconductor equipment-thread mapping queue correspond.
[0190] More specifically, the equipment data collection device calls a function for determining the processing order and performing post-processing through a second thread that has completed receiving a second message, which is one of the messages, compares the second identification information of the second thread that called the function with the first item of the semiconductor equipment-thread mapping queue, and if the second identification information and the first item of the semiconductor equipment-thread mapping queue correspond, it can be determined that the processing order of the second message received by the second thread has arrived.
[0191] Here, the equipment data acquisition device can repeatedly compare the second identification information and the first item of the semiconductor equipment-thread mapping queue during a pre-set life cycle of the second thread.
[0192] If there is no correspondence when comparing the second identification information with the first item of the semiconductor equipment-thread mapping queue during the pre-configured life cycle, the processing of the second message can be skipped.
[0193] Next, the equipment data collection device can perform post-processing on the second message in the processing order (S1240).
[0194] Here, the equipment data acquisition device can dequeue the front item of the semiconductor equipment-thread mapping queue.
[0195] FIG. 13 is an operation flowchart illustrating a method for ensuring the collection order of equipment data according to another embodiment of the present invention.
[0196] In particular, FIG. 13 is an operation flowchart showing the process of determining the processing order of messages received by a thread.
[0197] Referring to FIG. 13, a method for ensuring the collection order of equipment data according to another embodiment of the present invention first allows an equipment data collection device to call a function for determining the processing order and performing post-processing through a thread that receives one of the messages (S1310).
[0198] Next, the equipment data acquisition device can compare the identification information of the thread that called the function with the first item of the semiconductor equipment-thread mapping queue (S1320).
[0199] Here, the equipment data collection device can determine whether the identification information of the thread and the first item of the semiconductor equipment-thread mapping queue correspond (S1330).
[0200] If the identification information of the thread and the first item of the semiconductor equipment-thread mapping queue correspond as a result of the determination, the equipment data collection device may determine that the processing order of the message received by the thread has arrived (S1340).
[0201] If, as a result of the determination, the identification information of the thread and the first item of the semiconductor equipment-thread mapping queue do not correspond, the equipment data collection device can determine whether time equal to the pre-set life cycle of the thread has elapsed (S1335).
[0202] If, as a result of the judgment, time equal to the pre-set life cycle of the thread has not elapsed, the equipment data collection device can repeatedly compare the second identification information with the first item of the semiconductor equipment-thread mapping queue (S1320).
[0203] If, as a result of the judgment, time equal to the pre-set lifecycle of the thread has elapsed, the equipment data collection device may not determine that the processing order of the message has arrived, and the data collection device handles the message according to the processing order in a subsequent step (e.g., S1240), thereby allowing the processing of the message to be skipped.
[0204] FIG. 14 is a diagram showing the structure of processes executed in an equipment data collection device according to one embodiment of the present invention.
[0205] Referring to FIG. 14, in an equipment data collection device (120) according to one embodiment of the present invention, monitoring target processes including an operation management maintenance process (123), an operation management maintenance sub-process (124), and a consumer process pair (125) can be executed.
[0206] The execution status of the operation management maintenance sub-process (124) is monitored by the operation management maintenance process (123), and the operation management maintenance process (123) is monitored by the operation management maintenance sub-process (124), so that the operation management maintenance process (123) and the operation management maintenance sub-process (124) may be structured to mutually monitor each other.
[0207] Additionally, the execution status of the consumer process pair (125) is monitored by the operation management maintenance process (123), and the active status between the two consumer processes (125-1, 125-2) forming the consumer process pair (125) may be switched (switched over).
[0208] The operation management maintenance process (123) can terminate the activated consumer process (125-1) and activate the waiting consumer process (125-2) when the execution status of the activated consumer process (125-1) is abnormal. In this case, the operation management maintenance process (123) can execute a new consumer process (not shown) in a waiting state and include it in the consumer process pair (125) for management.
[0209] Here, the consumer process pair (125) may be a group of two consumer processes (125-1, 125-2) in which the port address for collecting data from semiconductor equipment is set identically, only one consumer process among the consumer process pair is activated at the same time, and the port address is actually occupied by the activated consumer process.
[0210] For example, a switchover can be performed in which only one of the two consumer processes (125-1, 125-2) forming a consumer process pair (125) is activated and the other, the second consumer process (125-2), is in standby mode, and then the first consumer process (125-1) is deactivated and the second consumer process (125-2) is activated by an operation management maintenance process (123).
[0211] In this case, the two consumer processes (125-1, 125-2) are configured with the same IP address and port address, so that the IP address and port address are occupied by the first consumer process (125-1) before the switchover is performed, and then the IP address and port address can be occupied by the second consumer process (125-2) after the switchover is performed.
[0212] Through this, the semiconductor equipment can transmit data without interruption while maintaining the EDA session with the same IP address and port address set to the same in both consumer processes (125-1, 125-2) as the destination, and the equipment data collection device (120) can also receive data from the semiconductor equipment without interruption.
[0213] Through this, the equipment data collection device (120) can provide a switch-over function that prevents consumer process functions, such as receiving data from specific semiconductor equipment, from being interrupted.
[0214] As an optional embodiment, the operation management maintenance process (123) may terminate the activated consumer process (125-1) and activate the waiting consumer process (125-2) as needed, even if the execution status of the activated consumer process (125-1) is not abnormal.
[0215] For example, when an operation management maintenance process (123) requires an update to be applied to a consumer process, it applies the update to a waiting consumer process (125-2), terminates the activated consumer process (125-1), and activates the waiting consumer process (125-2), thereby allowing the update to be applied without interrupting consumer process functions such as receiving data from semiconductor equipment.
[0216] FIG. 15 is an operation flowchart illustrating a process switching method in an equipment data collection device according to one embodiment of the present invention.
[0217] Referring to FIG. 15, a process switching method in an equipment data collection device according to an embodiment of the present invention first allows the equipment data collection device to check the execution status of monitoring target processes through an operation management maintenance process (S1510).
[0218] Here, the processes subject to monitoring may include equipment data collection processes, i.e., consumer processes.
[0219] As an optional embodiment, the monitored processes may include an operation management maintenance sub-process paired with an operation management maintenance process. The operation management maintenance sub-process may check the execution status of the operation management maintenance process and terminate or re-execute the operation management maintenance process.
[0220] The equipment data acquisition device can determine whether the execution status is normal based on whether the monitored processes respond within a reference time or status messages received from the monitored processes.
[0221] Here, the equipment data collection device may determine that the execution status of the monitored process is abnormal when it receives a status message indicating an abnormal state, or when the monitored process is down or does not respond for a preset time (hang or deadlock, etc.).
[0222] Next, the equipment data collection device can terminate or restart the monitored processes through an operation management maintenance process to maintain the monitored processes in a normal running state (S1520).
[0223] The equipment data collection device can terminate processes that are running but in an abnormal state. Additionally, the equipment data collection device can execute processes that are not running or have been terminated.
[0224] Next, the equipment data collection device can switch the activation target processes so that one of the first processes included in the monitoring target processes is deactivated and the other of the second processes is activated through the operation management maintenance process (S1530).
[0225] Here, the equipment data acquisition device checks whether the monitored processes are active through an operation management maintenance process and can activate monitored processes that are not active.
[0226] FIG. 16 is an operation flowchart illustrating a process switching method in an equipment data collection device according to another embodiment of the present invention.
[0227] Referring to FIG. 16, a process switching method in an equipment data collection device according to another embodiment of the present invention first allows the equipment data collection device to identify a process that is not running or has been terminated among the processes to be monitored (S1511).
[0228] The equipment data collection device can re-execute processes that are not running or have been terminated among the monitored processes (S1521).
[0229] Next, the equipment data collection device can identify processes that are running or have not terminated among the monitored processes and identify processes with an abnormal execution status (S1512).
[0230] The equipment data collection device can terminate processes among the monitored processes that have an abnormal execution state (S1522).
[0231] FIG. 17 is an operation flowchart illustrating a process switching method in an equipment data collection device according to another embodiment of the present invention.
[0232] Referring to FIG. 17, a process switching method in an equipment data collection device according to another embodiment of the present invention first allows the equipment data collection device to check whether there is a consumer process that is activated in units of consumer process pairs included in the monitored processes through an operation management maintenance process (S1531).
[0233] Next, if there is no active consumer process in any consumer process pair, the equipment data collection device can check whether there is an unactive consumer process in any consumer process pair through an operation management maintenance process (S1532).
[0234] Next, the equipment data collection device can activate a consumer process that is not activated through an operation management maintenance process (S1533).
[0235] FIG. 18 is a drawing showing a computer system according to one embodiment of the present invention.
[0236] The equipment data collection support device (110) or equipment data collection device (120) of the present invention may be implemented in a computer system (1000), such as a computer-readable recording medium.
[0237] Referring to FIG. 18, a computer system (1000) may include one or more processors (1010), memory (1030), user interface input device (1040), user interface output device (1050), and storage (1060) that communicate with each other via a bus (1020). Additionally, the computer system (1000) may further include a network interface (1070) connected to a network (1080). The processor (1010) may be a central processing unit or a semiconductor device that executes processing instructions stored in memory (1030) or storage (1060). Memory (1030) and storage (1060) may be various forms of volatile or non-volatile storage media. For example, memory may include ROM (1031) or RAM (1032).
[0238] The specific embodiments described in this invention are examples and do not limit the scope of the invention in any way. For the sake of brevity of the specification, descriptions of prior electronic configurations, control systems, software, and other functional aspects of said systems may be omitted. Additionally, the connections of lines or connecting members between components shown in the drawings are illustrative of functional connections and / or physical or circuit connections, and may be replaced or additionally represented as various functional connections, physical connections, or circuit connections in actual devices. Furthermore, unless specifically stated as “essential,” “importantly,” etc., a component may not be strictly necessary for the application of the invention.
[0239] Accordingly, the scope of the present invention should not be limited to the embodiments described above, and all scopes equivalent to or equivalently modified from the claims set forth below, as well as the claims set forth below, shall be considered to fall within the scope of the concept of the present invention. Explanation of the symbols
[0240] 110: Equipment data collection support device 111: Interface 112: Metadata Management Department 113: Session Management Department 114: Security Management Department 115: Data Collection Plan Management Department 120, 120-1, 120-2, 120-3: Equipment data acquisition device 121: Web Application Server 122: Message Order Guarantee Support 123: Operational Management Maintenance Process 124: Operations Management Maintenance Sub-process 125, 125-1, 125-2: Equipment Data Collection Process 130, 130-1, 130-2: User terminal 140: Equipment Engineering System 150, 150-1, 150-2: Semiconductor Equipment 160: Database 1000: Computer System 1010: Processor 1020: Bus 1030: Memory 1031: Rome 1032: RAM 1040: User interface input device 1050: User interface output device 1060: Storage 1070: Network Interface 1080: Network
Claims
Claim 1 A step in which an equipment data collection support device connects a user terminal session to a user terminal that intends to control data collection from semiconductor equipment; a step in which the equipment data collection support device receives an activation request for a data collection plan corresponding to the semiconductor equipment through the user terminal session; A method for operating a session for equipment data collection, wherein the equipment data collection support device includes the step of activating the data collection plan through an EDA session different from the user terminal session, and the equipment data collection support device further includes the step of connecting an EDA session to the semiconductor equipment, wherein the step of connecting the EDA session includes transmitting a second control command to the semiconductor equipment, receiving second control result information which is a response to the second control command from the semiconductor equipment, and connecting an EDA session in which an equipment data collection device collecting data from the semiconductor equipment is set as an endpoint, and wherein the step of connecting the EDA session includes the step of connecting the EDA session based on an Access Control List (ACL) corresponding to Equipment Engineering System (EES) designation information received from the user terminal, and wherein the equipment data collection device post-processes the data collected from the semiconductor equipment and transmits it to the Equipment Engineering System. Claim 2 A method for operating a session for equipment data collection according to claim 1, wherein the step of connecting the user terminal session includes the step of connecting a user terminal session for receiving a first control command corresponding to the control of data collection from the user terminal and providing a first control result information, which is a response according to the first control command, to the user terminal. Claim 3 delete Claim 4 delete Claim 5 A method for operating a session for equipment data collection according to claim 1, wherein, prior to the step of connecting the EDA session, the equipment data collection support device further comprises the step of loading information regarding EDA sessions connected to the semiconductor equipment from a database; and the equipment data collection support device further comprises the step of providing information regarding the EDA sessions to the user terminal, wherein the step of connecting the EDA session includes the equipment data collection support device connecting the EDA session such that the access control list corresponding to the equipment engineering system designation information is not duplicated. Claim 6 A method for operating a session for equipment data collection according to claim 1, wherein, after the step of connecting the EDA session, the equipment data collection support device further comprises: a step of loading metadata of the semiconductor equipment; and a step of the equipment data collection support device providing the metadata to the user terminal, wherein the step of loading the metadata includes: a step in which the equipment data collection support device determines whether the metadata exists in a database; if the metadata does not exist in the database, the equipment data collection support device loads the metadata from the semiconductor equipment and stores the loaded metadata in the database; and if the metadata exists in the database, the equipment data collection support device loads the metadata from the database. Claim 7 A method for operating a session for equipment data collection according to claim 6, further comprising, after the step of connecting the EDA session, the step of the equipment data collection support device loading status information of a data collection plan generated for the semiconductor equipment from the database; and the step of the equipment data collection support device providing the status information of the data collection plan to the user terminal. Claim 8 In claim 7, the data collection plan or metadata is provided to the data collection device when the database is updated or when the data collection device is initialized, a method for operating a session for equipment data collection. Claim 9 A method for operating a session for equipment data collection according to claim 1, wherein the step of activating the data collection plan includes the step of activating the data collection plan through an EDA session corresponding to an endpoint included in the activation request of the data collection plan. Claim 10 A memory on which at least one program is recorded; and a central processing unit (CPU) that executes said program, wherein said program includes the steps of: connecting a user terminal session to a user terminal that intends to control data collection from semiconductor equipment; and receiving an activation request for a data collection plan corresponding to said semiconductor equipment through said user terminal session. The equipment data collection support device includes instructions for performing the step of activating the data collection plan through an EDA session different from the user terminal session, and the program further includes instructions for the equipment data collection support device to perform the step of connecting the EDA session to the semiconductor equipment, wherein the step of connecting the EDA session includes transmitting a second control command to the semiconductor equipment, receiving second control result information which is a response to the second control command from the semiconductor equipment, and connecting the EDA session to which the equipment data collection device collecting data from the semiconductor equipment is set as an endpoint, and wherein the step of connecting the EDA session includes connecting the EDA session based on an Access Control List (ACL) corresponding to Equipment Engineering System (EES) designation information received from the user terminal, and wherein the equipment data collection device post-processes the data collected from the semiconductor equipment and transmits it to the Equipment Engineering System.
Citation Information
Patent Citations
Apparatus for Interfacing, Semiconductor Manufacturing System and Management Method
KR1020190031385A