LIS PVD lapping Carrier coating device

Abstract

A lapping carrier coating apparatus is disclosed. According to the present disclosure, the apparatus comprises a vacuum chamber for deposition and a deposition coating apparatus within the chamber, wherein the apparatus comprises: a lapping carrier module formed to be capable of rotation and revolution and equipped with a plurality of lapping carriers; a jig and a chamber formed to be capable of forward and backward movement and to be coupled and supported to the lapping carrier module; a sputter coupled to the jig and chamber, which generates plasma by injecting ionized argon and a source gas to form a metal and metal carbide / nitride buffer film (Cr, CrC, CrN, W, WC, Ti, TiN, etc.) before DLC film coating; a linear ion gun for an inline deposition apparatus coupled to the jig and chamber, which forms an ion beam to maintain the deposition uniformity of the lapping carrier, which is a target object coupled to the lapping carrier module (1000), for surface modification and DLC film coating; and an exhaust module disposed on one side of the jig and chamber, which creates and maintains a vacuum in the internal environment of the chamber and discharges residual gases and by-products generated during the process. A wrapping carrier coating device including is provided.

Description

Technology Field

[0001] An embodiment of the present disclosure relates to an LIS PVD wrapping carrier coating apparatus. Background Technology

[0003] The Physical Vapor Deposition (PVD) method using a Linear Ion Source (LIS), which is one of the methods for forming DLC ​​thin film coatings over a large area, is a process that forms a DLC thin film by creating a reaction gas in the form of plasma inside an ion gun, emitting this plasma by the voltage of the ion gun, and depositing it onto a substrate. The LIS ion gun PVD process is a technology that forms a plasma in a high vacuum environment, separates the target material into atomic or molecular units, and then deposits it on the surface of a substrate using ion gun energy.

[0004] This ion gun PVD process offers several technical advantages compared to conventional PECVD (Plasma Enhanced Chemical Vapor Deposition). First, since the PVD process does not involve chemical reactions, it generates almost no process byproducts or impurities, enabling the formation of high-purity, low-defect thin films. Second, by precisely controlling process conditions such as plasma energy (ion gun voltage and current), substrate bias voltage, chamber pressure, and gas flow rate, physical properties such as film composition, thickness, density, stress, surface roughness, and refractive index can be precisely controlled. Third, because the thin films formed in the PVD process are created through physical collision and adhesion, they exhibit high adhesion to the substrate and excellent durability. Fourth, since the PVD process has low dependence on substrate temperature, high-quality thin films can be formed even on substrates where high-temperature processing is not possible.

[0005] However, since conventional ion gun PVD devices primarily perform coating on a single lapping carrier or a limited number of samples, there was a problem in that it was difficult to ensure uniformity of film thickness when processing multiple carriers simultaneously, as the deposition rate varied depending on the plasma distribution or deviation in the incident angle of the deposited particles. In particular, when performing double-sided coating by loading multiple carriers in a vertical direction, deviations in film thickness are likely to occur because the plasma density and particle flux differ on the front and back sides of each carrier, and there is a problem that the required chamber size increases depending on the size of the carrier.

[0006] Accordingly, there is a need to develop an ion gun PVD device and process technology with a carrier loading method and a carrier rotation structure capable of uniformly coating DLC ​​films on both sides simultaneously using multiple wrapping carriers while maintaining a uniform plasma distribution in a high vacuum environment.

[0007] The foregoing description is provided to aid in understanding the technical background of the present disclosure. Accordingly, the foregoing description should not be interpreted as reducing, limiting, or restricting the technical concept of the present disclosure. Furthermore, the contents described or suggested in the foregoing description do not necessarily constitute prior art. The foregoing description may include contents that do not constitute prior art. The problem to be solved

[0009] Some embodiments of the present disclosure may provide a wrapping carrier coating apparatus that achieves a uniform DLC coating on a plurality of wrapping carriers in a high vacuum LIS ion gun PVD environment.

[0010] However, the technical problems that the embodiments of the present disclosure aim to solve are not necessarily limited to the technical problems mentioned above. Other technical problems not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from other descriptions in the specification, such as the detailed description. means of solving the problem

[0012] According to one aspect of the present disclosure, a lapping carrier coating apparatus for deposition coating within a vacuum chamber is provided, comprising: a lapping carrier module formed to be capable of rotation and revolution and having a plurality of lapping carriers mounted thereon; a jig and a chamber formed to be coupled to and supported by the lapping carrier module and capable of forward and backward movement; a linear ion gun source (LIS) for an inline deposition apparatus coupled to the jig and chamber and forming an ion beam to modify the surface of an object coupled to the lapping carrier module to maintain deposition uniformity; a sputter coupled to the jig and chamber and generating plasma by injecting a gas such as ionized argon and colliding atoms with the object to form a metal and metal carbide / nitride buffer film (Cr, CrC, CrN, W, WC, Ti, TiN, etc.) on the object; and an exhaust module disposed on one side of the jig and chamber to create and maintain a vacuum in the internal environment of the chamber and to discharge residual gases and by-products generated during the process.

[0013] In some embodiments, the wrapping carrier module may have a loading plate positioned thereon that is formed in a shape such that a path and a gear can be engaged with a path corresponding to the outer circumference of the wrapping carrier.

[0014] In some embodiments, it may include a first rotation gear formed with a diameter smaller than that of the wrapping carrier and positioned close to the center side, which is the inner side of the wrapping carrier module; and a second rotation gear that meshes with the first rotation gear and is positioned at the center of the wrapping carrier module.

[0015] In some embodiments, the wrapping carrier module is formed such that a radially formed frame extends from the center, and the frame is equipped with a motor at the center to enable the orbital movement of the wrapping carrier.

[0016] In some embodiments, the second gear may be rotated by power generated from a motor configured to allow the frame to rotate.

[0017] In some embodiments, the wrapping carrier may have a loading plate formed on its outer circumference surface into which a coating target is inserted.

[0018] In some embodiments, the wrapping carrier module may further include an idler gear formed to be coupled to a frame and to close a portion of the loading plate.

[0019] In some embodiments, the ion gun and the sputter may be positioned on the orbital path of the wrapping carrier. Effects of the invention

[0021] Some embodiments of the present disclosure enable the formation of a uniform metal buffer layer and a DLC layer on multiple wrapping carriers in a single PVD process, thereby improving productivity.

[0022] In addition, some embodiments of the present disclosure can ensure uniform quality by minimizing variations in coating thickness due to orbital and rotational motions.

[0023] In addition, some embodiments of the present disclosure can implement a multiple carrier simultaneous processing and uniform coating structure that is differentiated from the prior art.

[0024] However, the technical effects obtainable through the embodiments of the present disclosure are not necessarily limited to the effects mentioned above. Other technical effects not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from other descriptions in the specification, such as the detailed description. Brief explanation of the drawing

[0026] FIG. 1 is a schematic perspective view of a wrapping carrier coating apparatus according to one embodiment of the present disclosure. FIG. 2 is a schematic view of a side of the wrapping carrier coating apparatus shown in FIG. 1. FIG. 3 is a schematic view of one side of the jig and chamber shown in FIG. 1. FIG. 4 is a schematic perspective view of a wrapping carrier module shown in FIG. 2. FIG. 5 is a diagram showing the operation of a wrapping carrier module according to one embodiment of the present disclosure. Specific details for implementing the invention

[0027] Embodiments of the present disclosure will be described below with reference to the drawings.

[0028] The following embodiments are provided to more faithfully and completely explain the technical concept of the present disclosure to those skilled in the art to which the present disclosure pertains. Accordingly, the technical concept of the present disclosure is not necessarily limited to the following embodiments. The present disclosure should be understood to broadly include various equivalents, substitutions, modifications, etc., that embody the technical concept to be described below.

[0029] The terms used in the following description are intended to describe specific embodiments more faithfully and completely in the same light as above. Accordingly, the terms used in the following description should not be interpreted to reduce, limit, or restrict the technical scope of the present disclosure.

[0030] In the following description, terms such as "first," "second," etc., may be used to refer to specific components to distinguish them from other components. However, such terms are used for clarity of explanation, and the technical concept of the present disclosure should not be interpreted as being limited by such terms.

[0031] In the following description, singular expressions may be interpreted to include the plural unless explicitly excluded by the context. Furthermore, in the following description, the expression "includes" means that the components, parts, actions, features, steps, numbers, etc. described in the description exist, and does not exclude the addition of one or more other components, parts, actions, features, steps, numbers, etc.

[0032] In the following description, terms related to direction, such as "beneath," "above," "lower," and "upper," may be used to facilitate understanding of the components. However, such terms are provided to facilitate understanding of the present disclosure based on various operations and usage conditions, and should not be interpreted to reduce, limit, or restrict the technical scope of the present disclosure. For example, terms related to direction may be determined from a relative perspective.

[0033] Meanwhile, in the drawings below, the depiction of each component may be exaggerated or omitted for the convenience and clarity of explanation.

[0034] FIG. 1 is a schematic perspective view of a wrapping carrier coating apparatus according to one embodiment of the present disclosure.

[0035] Figure 2 is a schematic diagram showing the side view of the wrapping carrier coating device illustrated in Figure 1.

[0036] FIG. 3 is a schematic diagram showing one side of the jig and chamber illustrated in FIG. 1.

[0037] Referring to FIGS. 1 to 3, the present disclosure comprises a vacuum chamber for deposition and a lapping carrier coating apparatus for deposition coating inside the chamber, wherein the apparatus comprises: a lapping carrier module (1000) formed to be capable of rotation and revolution and having a plurality of lapping carriers (1100) mounted thereon; a jig and chamber (2000) formed to be coupled to and supported by the lapping carrier module (1000) and capable of forward and backward movement; a linear ion gun (4000) for an inline deposition apparatus coupled to the jig and chamber (2000) and forming an ion beam to modify the surface of the lapping carrier (1100), which is an object coupled to the lapping carrier module (1000), in order to maintain the deposition uniformity of the lapping carrier; a sputter (3000) coupled to the jig and chamber (2000) and generating plasma by injecting a gas such as ionized argon to the plasma and colliding atoms with the object to form a film on the object; and a chamber disposed on one side of the jig and chamber (2000). It may include an exhaust module (5000) that creates and maintains a vacuum in the internal environment and discharges residual gases and by-products generated during the process.

[0038] Each configuration will be explained in detail below with reference to the drawings.

[0039] FIG. 4 is a schematic perspective view of the wrapping carrier module illustrated in FIG. 2.

[0040] Referring to FIGS. 1 to 4, a wrapping carrier coating device according to one embodiment of the present disclosure may include a wrapping carrier module.

[0041] The wrapping carrier module (1000) according to the present embodiment is a component formed in a structure in which a target object is placed to deposit a DCL film of the wrapping carrier (1100). The wrapping carrier module (1000) may be supported and placed on a jig, a chamber (2000), and a column extending from the floor, and the installation form may be variable if the present embodiment can be implemented. Such a wrapping carrier module (1000) may include a wrapping carrier (1100), an idler gear (1200), a first rotation gear (1300), and a second rotation gear (1400). Additionally, since the wrapping carrier module (1000) is structured to allow a plurality of wrapping carriers (1100) to be placed, the idler gear (1200) and the second rotation gear (1400) connected below may be provided in a corresponding number. Additionally, the wrapping carrier module (1000) may have wrapping carriers (1100) arranged radially. Accordingly, the wrapping carrier module (1000) may be formed such that a formed frame (1500) extends radially from the center, and a plurality of wrapping carriers (1100) are arranged at the end portions of the frame (1500). Furthermore, the frame (1500) may be equipped with a motor (not shown) that generates rotational power at the center and may rotate. Such rotation of the frame (1500) may cause the wrapping carriers (1100) to revolve.

[0042] Such a wrapping carrier module (1000) may include a wrapping carrier (1100).

[0043] The lapping carrier (1100) is a component that provides a space for a wafer, which is a target for polishing. Additionally, the lapping carrier (1100) can be a target for depositing a DLC film in the lapping carrier coating device of the present disclosure. Such a lapping carrier (1100) can be formed in the shape of a circular gear. Additionally, the lapping carrier (1100) may have a circular placement space (1110) provided on the inside so that a target for polishing, i.e., a wafer, can be placed in the inner part. Furthermore, the lapping carrier (1100) may have a rotation axis formed at the center, and the rotation axis may be coupled to and supported by a frame (1500). Accordingly, the lapping carrier (1100) may have a rotatable structure. Additionally, a plurality of lapping carriers (1100) may be arranged symmetrically in the lapping carrier module (1000). Additionally, a plurality of wrapping carriers (1100) may be spaced apart from each other at a uniform interval. Additionally, a plurality of wrapping carriers (1100) may be arranged so that they can be simultaneously positioned at the linear ion gun (4000) and the sputter (3000) during rotation. More specifically, when one wrapping carrier (1100) is positioned at the location where the linear ion gun (4000) is positioned, one wrapping carrier (1100) may be positioned at the location of the sputter (3000). Here, the coating target placed on the wrapping carrier (1100) that has reached the location of the linear ion gun (4000) and the sputter (3000) may undergo a coating process. For example, a process of modifying the surface of an object coupled to the wrapping carrier module can be carried out by forming an ion beam from a wrapping carrier (1100) passing in the left direction relative to the central axis of a wrapping carrier module (1000) in which a linear ion gun (4000) is placed, in order to maintain the deposition uniformity of the object. Here, the coating process can be a process formed by the operation of the linear ion gun (4000) and the sputter (3000).In another embodiment, when the process by the linear ion gun (4000) is formed on the left side relative to the central axis of the lapping carrier module (1000), the process by the sputter (3000) can be carried out simultaneously on the right side relative to the central axis of the lapping carrier module (1000). In this way, when the process is divided into left and right sides, the process for depositing the lapping carrier (1100) by the linear ion gun (4000) and the sputter (3000) can be carried out simultaneously, thereby reducing the process time.

[0044] Additionally, a cover frame (1120) formed to cover a part of an object may be formed on one side of the placement space (1110) formed in the wrapping carrier (1100). The cover frame (1120) is not formed in a shape that completely closes one side of the placement space (1110), but can be formed in a shape that supports a part of the object to be coated. Accordingly, gas can freely pass through the placement space (1110), and the cover frame (1120) can be formed to support a part of the object to be coated formed as a solid so that it does not fall off. The shape of such a cover frame (1120) is not limited to that shown in the drawings and can be varied into any shape that can implement this embodiment.

[0045] Meanwhile, the outer circumferential surface (1130) of the wrapping carrier (1100) may be formed in a shape that can mesh with a gear. The outer circumferential surface formed in the wrapping carrier (1100) in a shape that meshes with a gear may be a part for receiving power from a connected gear so that the wrapping carrier (1100) can rotate. In this way, the outer circumferential surface (1130) may be coupled and interlocked with a first rotation gear (1300) positioned on one side in a meshed manner.

[0046] In one embodiment, a loading plate (1140) may be positioned on the wrapping carrier (1100) in a shape that allows gears to mesh in a shape corresponding to the outer circumferential surface (1130). The loading plate (1140) may be formed in the shape of a circular ring with the outer circumferential surface (1130) of the wrapping carrier (1100) as a path. Power to rotate the wrapping carrier (1100) may be transmitted through such a loading plate (1140).

[0047] A wrapping carrier module (1000) according to one embodiment of the present disclosure may include an idler gear (1200). The idler gear (1200) is a component arranged to allow the wrapping carrier (1100), which rotates and revolves, to rotate stably. The idler gear (1200) may be fixed and supported on a frame (1500). The idler gear (1200) may be formed in a cylindrical shape and may be formed in a shape that surrounds the outer side of a loading plate (1140) at its center. Such an idler gear (1200) is coupled to the frame (1500), and a projection may come into rolling contact with the outer side of the loading plate (1140), thereby suppressing vibration of the wrapping carrier (1100), which rotates and revolves, and facilitating rotational movement.

[0048] A wrapping carrier module (1000) according to one embodiment of the present disclosure may include a first rotation gear (1300). The first rotation gear (1300) may be a gear positioned to allow the wrapping carrier (1100) to rotate. The first rotation gear (1300) may be a gear shape formed with a diameter smaller than that of the wrapping carrier (1100). Additionally, the first rotation gear (1300) may mesh with the wrapping carrier (1100). Furthermore, the first rotation gear (1300) may be positioned closer to the center side, which is the inner side of the wrapping carrier module (1000), than the wrapping carrier (1100). Additionally, the rotation axis of the first rotation gear (1300) may be coupled to and supported by a frame (1500). When such a first gear (1300) is rotated, it can rotate in conjunction with the wrapping carrier (1100).

[0049] A wrapping carrier module (1000) according to one embodiment of the present disclosure may include a second rotating gear (1400). The second rotating gear (1400) may be formed at the center of the wrapping carrier module (1000). Additionally, the second rotating gear (1400) may be rotated by power generated from a motor provided to allow the frame (1500) to rotate. The second rotating gear (1400) may be formed in a gear shape with a larger diameter than the first rotating gear (1300). Additionally, the second rotating gear (1400) may be formed to mesh with the first rotating gear (1300). When such a second rotating gear (1400) is rotated by a motor, it may act in conjunction with the first rotating gear (1300). Here, the actuated first rotating gear (1300) may rotate the wrapping carrier (1100). Accordingly, the wrapping carrier (1100) rotates with the central axis as the rotation axis, and rotational motion can be formed.

[0050] A wrapping carrier coating apparatus according to one embodiment of the present disclosure may include a jig and a chamber. The jig and chamber (2000) is a component formed to be coupled to and supported by a wrapping carrier module (1000) and capable of moving forward and backward. The jig and chamber (2000) may include a first jig and chamber (2100) to which the wrapping carrier module (1000) is coupled. Additionally, the jig and chamber (2000) may include a second jig and chamber (2200) to which a linear ion gun (4000) and a sputter (3000) are disposed.

[0051] A jig and chamber (2000) according to one embodiment of the present disclosure may include a first jig and chamber (2100). The first jig and chamber (2100) may be a portion to which a wrapping carrier module (1000) is coupled and disposed. The first jig and chamber (2100) may be formed in the shape of a rectangular plate so that one side faces the second jig and chamber (2200). Additionally, the wrapping carrier module (1000) may be disposed in front of the first jig and chamber (2100). Furthermore, the first jig and chamber (2100) may be formed in a structure that allows it to move back and forth in the direction of the second jig and chamber (2200) via a rail (2300) provided on the lower side. Here, the front of the first jig and chamber (2100) may be a direction facing the second jig and chamber (2200). Additionally, a first cylinder (2110) may be coupled to the rear of the first jig and chamber (2100). The first cylinder (2110) may be a cylinder that operates to allow the first jig and chamber (2100) to move forward and backward. Such forward and backward movement of the first jig and chamber (2100) may result in the movement of the connected wrapping carrier module (1000).

[0052] The jig and chamber (2000) according to the present embodiment may include a second jig and chamber (2200). The second jig and chamber (2200) may be a portion where a linear ion gun (4000) and a sputter (3000) are placed. The second jig and chamber (2200) may be formed in the shape of a square plate and may be formed to face the first jig and chamber (2100) on one side. Additionally, the second jig and chamber (2200) may be formed with a structure capable of moving back and forth via a rail provided on the lower side. Here, the front may be the direction facing the first jig and chamber (2100). Furthermore, a second cylinder (2210) may be coupled to the rear of the second jig and chamber (2200). The second cylinder (2210) may be a cylinder that operates to allow the first jig and chamber (2100) to move back and forth via a rail provided on the lower side. Such movement of the second jig and chamber (2200) may result in the movement of the linear ion gun (4000) and sputter (3000) coupled to one side.

[0053] Additionally, a linear ion gun (4000) and a sputter (3000) may be positioned on one side of the second jig and chamber (2200) facing the first jig and chamber (2100). At this time, the position where the linear ion gun (4000) and the sputter (3000) are positioned may be on the left or right side of the center of the wrapping carrier module (1000). Furthermore, the position where the linear ion gun (4000) and the sputter (3000) are positioned may be a path along which the wrapping carrier (1100) revolves.

[0054] Additionally, the second jig and chamber (2200) may have a plurality of exhaust holes (2220) formed therein. The exhaust holes (2220) may be through holes formed so that the environment of the part being processed can be formed into a vacuum by the operation of the exhaust module (5000). Additionally, the exhaust holes (2220) may be through holes formed so that residual gas and by-products generated during the process can be discharged through the exhaust module (5000).

[0055] A wrapping carrier coating device according to one embodiment of the present disclosure may include an exhaust module (5000).

[0056] The exhaust module (5000) can be a device for discharging residual gas and by-products generated during the process. The exhaust module (5000) is positioned on one side of the jig and chamber (2000) and can draw in and discharge air through the exhaust port (2220). Such an exhaust module (5000) can be provided in a form that connects the inside and outside of the chamber (not shown).

[0057] FIG. 5 is a drawing showing the operation of a wrapping carrier module according to one embodiment of the present disclosure.

[0058] Referring to FIGS. 1 to 5, first, the frame (1500) and the second rotation gear (1400) can be rotated by the operation of a motor provided at the center of the frame (1500). At this time, the wrapping carrier (1100) arranged radially can be rotated by the rotation of the frame (1500). Such rotation of the wrapping carrier (1100) can be revolution. The revolutionizing wrapping carrier (1100) can be rotated by forming a circular path. At this time, a linear ion gun (4000) and a sputter (3000) can be placed on the circular path where the wrapping carrier (1100) is rotated. Next, the rotating second rotation gear (1400) can be rotated in conjunction with the meshed first rotation gear (1300). Since the first rotation gear (1300) is a gear coupled between the wrapping carrier (1100) and the second rotation gear (1400), the wrapping carrier (1100) can be linked. Accordingly, the wrapping carrier (1100) rotates, and such rotation of the wrapping carrier (1100) can be rotation.

[0059] The above description is merely an example of applying the principles of the present disclosure, and other configurations may be included without departing from the scope of the present disclosure.

[0060] Although embodiments of the present disclosure have been described above, those skilled in the art may modify or change the present disclosure in various ways by adding, changing, deleting, or adding components without departing from the technical spirit of the present disclosure as described in the claims, and such modifications or changes shall also be deemed to be included within the scope of the rights of the present disclosure. Explanation of the symbols

[0062] 1000 : Wrapping Carrier Module 1100 : Wrapping Carrier 1130 : Circumference 1140 : Loading Plate 1200: Idle Gear 1300: 1st Rotating Gear 1400: 2nd Bicycle Gear 1500: Frame 2000: Jig and chamber 4000: Linear ion gun 3000 : Sputter 5000 : Exhaust Module

Claims

Claim 1 An apparatus for deposition coating within a vacuum chamber, comprising: a lapping carrier module (1000) formed to be capable of rotation and revolution and having a plurality of lapping carriers (1100) mounted radially; a jig and chamber (2000) formed to be coupled to and supported by the lapping carrier module (1000) and capable of moving forward and backward; a sputter (3000) coupled to the jig and chamber (2000), positioned on the revolution path of the lapping carrier (1100), and generating plasma by injecting a gas such as ionized argon to form a metal and metal carbide / nitride buffer film (Cr, CrC, CrN, W, WC, Ti, TiN, etc.); and an inline deposition apparatus coupled to the jig and chamber (2000), positioned on the revolution path of the lapping carrier (1100), and forming an ion beam to modify the surface of an object coupled to the lapping carrier module (1000) to maintain deposition uniformity and to coat a DLC film. A lapping carrier coating device comprising: a linear ion gun (4000) for the device; and an exhaust module (5000) disposed on one side of the jig and chamber (2000) to create and maintain a vacuum inside the chamber and to discharge residual gas and by-products generated during the process, wherein the sputter (3000) and the linear ion gun (4000) are arranged such that, according to the orbital movement of the lapping carrier (1100), the formation of a metal or metal carbide / nitride buffer film, surface modification, and DLC film coating are sequentially performed on the lapping carrier (1100). Claim 2 A wrapping carrier coating device according to claim 1, wherein the wrapping carrier module (1000) is formed in a shape such that a loading plate (1140) is positioned so that a path corresponding to the outer circumference of the wrapping carrier (1100) and a gear can be engaged. Claim 3 A wrapping carrier coating device according to claim 2, comprising: a first rotating gear (1300) formed with a diameter smaller than that of the wrapping carrier (1100) and having an outer shape formed as a gear, positioned close to the center side which is the inner side of the wrapping carrier module (1000); and a second rotating gear (1400) meshing with the first rotating gear (1300) and positioned at the center of the wrapping carrier module (1000). Claim 4 A wrapping carrier coating device according to claim 3, wherein the wrapping carrier module (1000) is formed such that a radially formed frame (1500) extends from the center, and the frame (1500) is equipped with a motor at the center to form the orbital motion of the wrapping carrier (1100). Claim 5 In claim 3, the second rotary gear (1400) is a wrapping carrier coating device that is rotated by power generated from a motor configured to allow the frame (1500) to rotate. Claim 6 In claim 4, the wrapping carrier (1100) is a wrapping carrier coating device having a loading plate (1140) formed on the outer circumference surface (1130) into which a coating object is inserted. Claim 7 A wrapping carrier coating device according to claim 5, further comprising: an idler gear (1200) which is coupled to the frame (1500) and makes rolling contact with the outer side of the loading plate (1140). Claim 8 In claim 3, the linear ion gun (4000) and the sputter (3000) are a wrapping carrier coating device disposed on the orbital path of the wrapping carrier (1100).

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