Recyclable Mono-Material Pouch Packaging Film Having a Melting Point Difference Between Inner and Outer Surfaces and Method for Manufacturing Thereof

Abstract

The present invention relates to a recyclable single-material envelope-type packaging material having a difference in melting points between an inner surface and an outer surface, and a method for manufacturing the same. More specifically, the invention relates to a method for manufacturing a recyclable single-material envelope-type packaging material having a difference in melting points between an inner surface and an outer surface, wherein the upper and lower films are composed of a first and second multilayer PE layer mainly composed of polyethylene and a first and second heat-resistant printing substrate layer mainly composed of polyethylene, the heat resistance is improved by electron beam irradiation, and the edges are heated and compressed while the upper film and the lower film are laminated facing each other, thereby ensuring excellent recyclability with a single-material structure and securing a difference in melting points between the first and second printing layers and the first and second multilayer PE layers, thereby preventing packaging defects caused by overmelting of the sealing part or thermal damage to the printing layer during sealing.

Description

Technology Field

[0001] The present invention relates to a recyclable single-material envelope-type packaging material having a difference in melting points between an inner surface and an outer surface, and a method for manufacturing the same. More specifically, the invention relates to a method for manufacturing a recyclable single-material envelope-type packaging material having a difference in melting points between an inner surface and an outer surface, wherein the upper and lower films are composed of a first and second multilayer PE layer mainly composed of polyethylene and a first and second heat-resistant printing substrate layer mainly composed of polyethylene, the heat resistance is improved by electron beam irradiation, and the edges are heated and compressed while the upper film and the lower film are laminated facing each other, thereby ensuring excellent recyclability with a single-material structure and securing a difference in melting points between the first and second printing layers and the first and second multilayer PE layers, thereby preventing packaging defects caused by overmelting of the sealing part or thermal damage to the printing layer during sealing. Background Technology

[0003] Flexible packaging is a type of packaging material that is relatively thin and flexible, and is currently widely used for packaging various products such as food, pharmaceuticals, and household goods. However, since packaging materials are discarded after use, the recyclability of flexible packaging is emerging as a key challenge for realizing a sustainable circular economy.

[0004] In particular, in Europe, a joint declaration was adopted centered around the CEFLEX (Circular Economy for FLEXible Packaging) consortium to "aim at recycling all flexible packaging materials by 2025," and accordingly, the development of eco-friendly packaging materials based on single materials, primarily polyethylene (PE), is gaining attention.

[0006] Conventional non-recyclable flexible packaging materials were composed of a multilayer structure in which a film based on a high-melting-point resin, such as polyethylene terephthalate (PET) or nylon (NY), was used as the printing layer to ensure high functionality, and a low-melting-point resin layer with heat-sealability was placed on the inside. However, while this structure offered excellent printability and heat-sealing performance, it had limitations in that recyclability was reduced due to the composite structure of different materials.

[0007] Meanwhile, although eco-friendly flexible packaging materials could ensure recyclability by composing all layers with a PE base, there was a problem where sealing stability was significantly reduced when processed into bag-type packaging materials because there was almost no difference in the melting points of the inner and outer PE layers. For example, during the sealing process, heat required to bond the inner layer was transferred to the outer printing layer, causing overmelting or thermal damage to the printing layer, which frequently resulted in a deterioration of the appearance quality.

[0008] To solve these problems, there is an urgent need to develop packaging materials and manufacturing technologies that are composed of a single PE-based material to ensure recyclability while simultaneously satisfying sealing stability by ensuring a difference in melting points between the inner and outer layers. The problem to be solved

[0010] The present invention aims to provide a recyclable single-material envelope-type packaging material having a difference in melting points between the inner and outer surfaces, and a method for manufacturing the same, wherein the packaging material has excellent recyclability as a single-material structure and secures a difference in melting points between the first and second printing layers and the first and second multilayer PE layers, thereby preventing packaging defects caused by overmelting of the sealing part or thermal damage of the printing layer during sealing, by including upper and lower films composed of first and second printing layers, which are composed of polyethylene and have improved heat resistance through electron beam irradiation, and by heating and pressing the edges while the upper film and the lower film are laminated facing each other. means of solving the problem

[0012] In order to solve the above problems, one embodiment of the present invention comprises, as an envelope-type packaging material, a first multilayer PE layer comprising a plurality of PE layers comprising polyethylene (PE); a first printing layer comprising a first heat-resistant printing substrate layer comprising PE and having a printing area formed on an inner surface; an upper surface film; and a second PE multilayer comprising a plurality of PE layers comprising polyethylene (PE). A bottom film comprising: a second printing layer including a second heat-resistant printing substrate layer comprising PE and having a printing area formed on an inner surface; wherein the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer are each formed by irradiating an electron beam onto a printing substrate layer, and the melting point of each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer is 140 to 200°C, and the melting point of each of the first multilayer PE layer and the second multilayer PE layer is 105 to 125°C, and the envelope-type packaging material, in a state where the first printing layer, the first multilayer PE layer, the second multilayer PE layer, and the second printing layer are laminated, the edges are pressed with a heating member heated to a temperature lower than the melting point of each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer, so that the edge portions of the first multilayer PE layer and the second multilayer PE layer are thermally deformed and bonded, and the first printing layer and the Provides an envelope-type packaging material in which the edges of the second printed layer are not deformed.

[0013] In some embodiments of the present invention, the printing substrate layer may include either MDOPE (Machine Direction Oriented Polyethylene) or BOPE (Bi-axially Oriented Polyethylene).

[0014] In some embodiments of the present invention, the heat resistance of the first heat-resistant printing substrate layer is improved by irradiating an electron beam onto the printing substrate layer using an electron beam processing unit, and after electron beam irradiation, a printing area is formed on the inner surface of the first heat-resistant printing substrate layer, lamination is performed by applying an adhesive between the first printing layer and the first multilayer PE layer, a volatile solvent is removed, and the adhesive is cured, so that the first printing layer and the first multilayer PE layer can be formed as a single upper surface film.

[0015] In some embodiments of the present invention, the envelope-type packaging material is manufactured from a single packaging film formed in a state where a plurality of upper films and a plurality of lower films are alternately arranged continuously, and the packaging film is cut along the contact area between the upper edge of each upper film and the upper edge of the lower film adjacent to the upper edge of each upper film, and the lower edge of each upper film and the lower edge of the lower film adjacent to the lower edge of each upper film are not cut, and the upper film and the lower film adjacent to each upper film are folded so that they face each other, and the side edges of each upper film and the lower film stacked to face each upper film are heated and compressed using a sealing bar to manufacture an envelope-type shape.

[0016] In some embodiments of the present invention, the electron beam processing unit may irradiate the printing substrate layer with an electron beam of 30 to 150 kGy under a reference voltage of 120 to 150 mA while passing the printing substrate layer at a speed of 13 to 70 m / min.

[0017] In some embodiments of the present invention, each of the first multilayer PE layer and the second multilayer PE layer may comprise 95 to 99 weight% PE, 1 to 5 weight% EVOH, and 0.5 to 2 weight% of an additive including an anti-blocking agent and a slip agent, based on the total weight of each of the first multilayer PE layer and the second multilayer PE layer.

[0019] To solve the above problems, one embodiment of the present invention comprises: an envelope-type packaging material comprising: a first multilayer PE layer comprising a plurality of PE layers comprising polyethylene (PE); and a first printing layer comprising a first heat-resistant printing substrate layer comprising PE and having a printing area formed on an inner surface; an upper film comprising: a second PE multilayer comprising a plurality of PE layers comprising polyethylene (PE); and a second printing layer comprising a second heat-resistant printing substrate layer comprising PE and having a printing area formed on an inner surface; wherein the melting point of each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer is 140 to 200°C, and the melting point of each of the first multilayer PE layer and the second multilayer PE layer is 105 to 125°C; and the manufacturing method comprises an electron beam treatment step of forming the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer by irradiating an electron beam onto a printing substrate layer. A method for manufacturing an envelope-type packaging material is provided, comprising: a printing forming step of forming a first printing layer and a second printing layer by forming a printing area on each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer; a film lamination step of forming a packaging film by applying an adhesive between the first heat-resistant printing substrate layer and the first multilayer PE layer and between the second heat-resistant printing substrate layer and the second multilayer PE layer to perform lamination, and curing the adhesive by removing a volatile solvent contained in the adhesive; a cutting step of cutting the packaging film to a predetermined size; and a sealing step of forming an envelope shape by sealing the inner surfaces of the cut packaging film together.

[0021] In order to solve the above problems, one embodiment of the present invention is a method for manufacturing a bag-type packaging material using a bag-type packaging material manufacturing device, wherein the bag-type packaging material comprises: a first multilayer PE layer comprising a plurality of PE layers comprising polyethylene (PE); and a first printing layer comprising a first heat-resistant printing substrate layer comprising PE and having a printing area formed on an inner surface; an upper surface film comprising; and a second PE multilayer comprising a plurality of PE layers comprising polyethylene (PE). A bottom film comprising: a second printing layer comprising a second heat-resistant printing substrate layer having a printing area formed on its inner surface and including PE; wherein the melting point of each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer is 140 to 200°C, and the melting point of each of the first multilayer PE layer and the second multilayer PE layer is 105 to 125°C; and the envelope-type packaging material manufacturing device comprises: an electron beam processing unit that forms a first heat-resistant printing substrate layer and a second heat-resistant printing substrate layer with improved heat resistance characteristics by irradiating an electron beam onto a printing substrate layer; and a printing processing unit that forms a first printing layer by forming a printing area on the inner surface of the first heat-resistant printing substrate layer and forms a second printing layer by forming a printing area on the inner surface of the second heat-resistant printing substrate layer. A film manufacturing unit that forms a packaging film by applying an adhesive between the first heat-resistant printing substrate layer and the first multilayer PE layer and between the second heat-resistant printing substrate layer and the second multilayer PE layer to perform lamination, and by removing a volatile solvent contained in the adhesive to cure the adhesive; a cutting unit that cuts the packaging film to a predetermined size; and a sealing unit that includes the heating element and forms an envelope shape by sealing the inner surfaces of the packaging film cut by the cutting unit; wherein the manufacturing method comprises: an electron beam treatment step of forming the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer by irradiating an electron beam onto the printing substrate layer; and a printing formation step of forming the first printing layer and the second printing layer by forming a printing area on each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer.A method for manufacturing an envelope-type packaging material is provided, comprising: a film lamination step of forming a packaging film by applying an adhesive between the first heat-resistant printing substrate layer and the first multilayer PE layer and between the second heat-resistant printing substrate layer and the second multilayer PE layer to perform lamination, and curing the adhesive by removing a volatile solvent contained in the adhesive; a cutting step of cutting the packaging film to a predetermined size; and a sealing step of forming an envelope shape by sealing the inner surfaces of the cut packaging film together. Effects of the invention

[0023] According to one embodiment of the present invention, the envelope-type packaging material is composed of a first multilayer PE layer and a second multilayer PE layer, and a first printing layer and a second printing layer, all of which are made of polyethylene as the main component, and the auxiliary material in the printing layer is included in an amount of less than 5 weight%, thereby enabling the effect of being realized as a single material structure that is easy to recycle.

[0024] According to one embodiment of the present invention, the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer formed by irradiating an electron beam onto a printing substrate layer have an increased melting point, and accordingly, a difference in melting point between the first multilayer PE layer and the second multilayer PE layer is secured, thereby enabling the effect of preventing thermal deformation and over-melting of the printing layer during heat sealing.

[0025] According to one embodiment of the present invention, the first multilayer PE layer and the second multilayer PE layer are configured such that a plurality of PE layers and tie layers are symmetrically stacked around an EVOH layer, thereby enabling the effect of securing barrier properties against various gases such as oxygen, nitrogen, and carbon dioxide.

[0026] According to one embodiment of the present invention, the first multilayer PE layer and the second multilayer PE layer are composed of a plurality of PE layers including an anti-blocking agent and a slip agent, thereby improving the processability and handling of the packaging material and preventing adhesion during lamination or winding.

[0027] According to one embodiment of the present invention, an upper film and a lower film are alternately and continuously formed on a single packaging film, and subsequently, through cutting, folding, and sealing processes, a bag-shaped structure can be manufactured, thereby ensuring the continuity of the manufacturing process and improving productivity.

[0028] According to one embodiment of the present invention, the electron beam processing unit is configured to control the amount of irradiation by controlling the movement speed of the printing substrate layer, and accordingly, it is possible to achieve the effect of preventing film degradation caused by excessive irradiation while ensuring heat resistance.

[0029] According to one embodiment of the present invention, the printed layer with improved heat resistance by electron beam treatment does not deform even under high-temperature sealing conditions and stably maintains its appearance quality, thereby enabling the effect of improving the appearance finish of the envelope-type packaging material. Brief explanation of the drawing

[0031] FIG. 1 schematically illustrates the cross-sectional structure of an upper film of an envelope-type packaging material according to one embodiment of the present invention. FIG. 2 schematically illustrates the cross-sectional structure of a first multilayer PE layer or a second multilayer PE layer according to one embodiment of the present invention. FIG. 3 schematically illustrates a block diagram of a packaging material manufacturing device according to one embodiment of the present invention. FIG. 4 schematically illustrates the flow of a manufacturing process for an envelope-type packaging material according to one embodiment of the present invention. FIG. 5 illustrates examples of a printing substrate layer and a heat-resistant printing substrate layer according to one embodiment of the present invention as digital images. FIG. 6 schematically illustrates the steps of a change in molecular structure caused by electron beam irradiation according to one embodiment of the present invention. FIG. 7 exemplarily illustrates the process of forming an envelope-type packaging material performed by a packaging material manufacturing device according to one embodiment of the present invention. FIG. 8 illustrates the difference in the appearance of an envelope-type packaging material with and without electron beam treatment according to one embodiment of the present invention as a digital image. FIG. 9 schematically illustrates a method for manufacturing an envelope-type packaging material according to one embodiment of the present invention. FIG. 10 schematically illustrates a side view of an electron beam processing unit according to one embodiment of the present invention. FIG. 11 schematically illustrates a plan view of an electron beam processing unit according to one embodiment of the present invention. FIG. 12 schematically illustrates a side view and a plan view of a shear supply unit according to one embodiment of the present invention. FIGS. 13 to 15 schematically illustrate the process of replacing the work roll of a shear supply unit according to one embodiment of the present invention. FIG. 16 shows a digital image of the actual configuration of a shear supply unit according to one embodiment of the present invention. FIG. 17 schematically illustrates a side view of a shear transfer unit according to one embodiment of the present invention. FIG. 18 schematically illustrates a perspective view of an electron beam irradiation unit according to one embodiment of the present invention. FIG. 19 schematically illustrates the cross-sectional structure of an irradiation area unit of an electron beam irradiation unit according to one embodiment of the present invention. FIG. 20 schematically illustrates the steps of a continuous processing manufacturing method performed by an electron beam processing unit according to one embodiment of the present invention. FIG. 21 schematically illustrates the work roll replacement step performed by the shear supply unit and the shear transfer unit according to one embodiment of the present invention. Specific details for implementing the invention

[0032] Hereinafter, various embodiments and / or aspects are disclosed with reference to the drawings. For illustrative purposes, numerous specific details are disclosed in the following description to aid in a general understanding of one or more aspects. However, it will also be recognized by those skilled in the art that these aspects may be practiced without such specific details. The following description and the accompanying drawings describe specific exemplary aspects of one or more aspects in detail. However, these aspects are exemplary, and some of the various methods in the principles of the various aspects may be used, and the description is intended to include all such aspects and their equivalents.

[0033] In addition, various aspects and features will be presented by a system that may include multiple devices, components and / or modules, etc. It should also be understood and recognized that various systems may include additional devices, components and / or modules, etc., and / or may not include all of the devices, components, modules, etc. discussed in relation to the drawings.

[0034] As used herein, terms such as "examples," "examples," "aspects," "examples," etc., may not be interpreted as implying that any aspect or design described is better or more advantageous than other aspects or designs.

[0035] Additionally, the terms “comprising” and / or “comprising” should be understood to mean that the relevant feature and / or component is present, but not to exclude the presence or addition of one or more other features, components and / or groups thereof.

[0036] Additionally, terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. Such terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and / or" includes a combination of a plurality of related described items or any of a plurality of related described items.

[0037] Furthermore, in the embodiments of the present invention, all terms used herein, including technical or scientific terms, unless otherwise defined, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the embodiments of the present invention.

[0039] Conventional eco-friendly flexible packaging materials are made of a single material and are easy to recycle, but because the difference in melting points between the inner and outer layers is small, heat damage and overmelting of the printed layer (2000) frequently occur during sealing, which limits the ability to ensure sealing stability and appearance quality.

[0040] To solve these difficulties, the present invention provides a single material envelope-type packaging material (2) comprising an electron beam-treated heat-resistant printing substrate layer (2100) and a multilayer PE layer (1000), and a method for manufacturing the same.

[0041] Specifically, in the present invention, a heat-resistant printing substrate layer (2100) with an increased melting point is formed by irradiating an electron beam onto a printing substrate layer (2100') made of BOPE or MDOPE, and a printing layer (2000) can be formed by providing a printing area on the inner surface thereof. Subsequently, by laminating the inner surface of the printing layer (2000) with a multilayer PE layer (1000), a packaging film (1) can be formed in which an upper film (1f) and a lower film (1b) are alternately and continuously formed. The upper film (1f) and the lower film (1b) can be manufactured into an envelope-type packaging material (2) through processes such as cutting, folding, and sealing.

[0042] That is, the packaging material of the present invention is composed of a single material whose main component is polyethylene (PE), so it not only has excellent recyclability, but also prevents thermal damage or overmelting of the outer printing layer (2000) during the sealing process by securing a difference in melting points between the printing layer (2000) and the multilayer PE layer (1000). In addition, stable sealing is possible without a separate high-heat resistant material, thereby simplifying the process and improving manufacturing efficiency.

[0044] In the following description, to comprehensively refer to packaging materials applicable in various forms, including flexible packaging films, they will be abbreviated as "packaging material" throughout the description of the present invention.

[0045] Meanwhile, the term "single material" as used in this specification refers to a structure based on a polyethylene (PE)-based resin, in accordance with the definition provided in the CEFLEX guidelines, and containing less than 5% by weight of auxiliary materials such as EVOH for a barrier function. Accordingly, the envelope-type packaging material (2) of the present invention may be a single material packaging material that satisfies international recycling standards.

[0047] Hereinafter, a bag-type packaging material (2) according to one embodiment of the present invention will be described in detail.

[0049] FIG. 1 schematically illustrates the cross-sectional structure of the upper film (1f) of an envelope-type packaging material (2) according to one embodiment of the present invention, and FIG. 2 schematically illustrates the cross-sectional structure of the first multilayer PE layer (1000f) or the second multilayer PE layer (1000b) according to one embodiment of the present invention.

[0051] According to one embodiment of the present invention, an envelope-type packaging material (2) may include: an upper film (1f) comprising a first multilayer PE layer (1000f) comprising a plurality of PE layers comprising polyethylene (PE); and a first printing layer (2000f) comprising a first heat-resistant printing substrate layer (2100f) comprising PE and having a printing area formed on an inner surface; a second PE multilayer comprising a plurality of PE layers comprising polyethylene (PE); and a lower film (1b) comprising a second printing layer (2000b) comprising a second heat-resistant printing substrate layer (2100) comprising PE and having a printing area formed on an inner surface.

[0052] At this time, the first heat-resistant printing substrate layer (2100f) and the second heat-resistant printing substrate layer (2100) are each formed by irradiating an electron beam onto a printing substrate layer (2100'), and the melting point of each of the first heat-resistant printing substrate layer (2100f) and the second heat-resistant printing substrate layer (2100) is 140 to 200°C, and the melting point of each of the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) may be 105 to 125°C.

[0053] In one embodiment of the present invention, the envelope-type packaging material (2) is in a state where the first printing layer (2000f), the first multilayer PE layer (1000f), the second multilayer PE layer (1000b), and the second printing layer (2000b) are laminated, and the edges are pressed with a member heated to a temperature lower than the melting point of each of the first heat-resistant printing substrate layer (2100f) and the second heat-resistant printing substrate layer (2100), so that the edges of the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) are thermally deformed and bonded, and the edges of the first printing layer (2000f) and the second printing layer (2000b) may not be deformed.

[0055] In addition, in one embodiment of the present invention, the printing substrate layer (2100') may include either MDOPE (Machine Direction Oriented Polyethylene) or BOPE (Bi-axially Oriented Polyethylene).

[0057] The upper surface film (1f) may have a structure in which the first printing layer (2000f) comprises a first multilayer PE layer (1000f) comprising a plurality of PE layers including PE, and a first heat-resistant printing substrate layer (2100f) comprising PE and having a printing area formed on its inner surface, and the first printing layer (2000f) is laminated and laminated on the outside of the first multilayer PE layer (1000f).

[0058] In addition, the above-mentioned lower film (1b) may have a structure in which a second multilayer PE layer (1000b) comprising a plurality of PE layers including PE, and a second printing layer (2000b) comprising a second heat-resistant printing substrate layer (2100) including PE and having a printing area formed on its inner surface, and the second printing layer (2000b) is laminated and laminated on the outside of the second multilayer PE layer (1000b).

[0059] That is, according to one embodiment of the present invention, the upper film (1f) and the lower film (1b) may have the same composition and structure, and the only difference may be that different printing may be performed on the printing area formed on the inner side of each of the first printing layer (2000f) and the second printing layer (2000b). Accordingly, the following description will focus on the first printing layer (2000f), which includes the first multilayer PE layer (1000f) and the first heat-resistant printing substrate layer (2100f), with the upper film (1f) as the center, thereby providing a combined description of the second printing layer (2000b), which includes the second multilayer PE layer (1000b) and the second heat-resistant printing substrate layer (2100) included in the lower film (1b).

[0061] The above-mentioned first multilayer PE layer (1000f) is disposed on the inner side of the envelope-type packaging material (2) and comes into direct contact with the contents to be packaged, and corresponds to a layered structure that substantially provides mechanical strength and barrier properties for the envelope-type packaging material (2).

[0063] Referring together with FIG. 2, the first multilayer PE layer (1000f) may be composed of 11 layers and may include a plurality of PE layers, tie layers, and EVOH layers (1006).

[0064] Specifically, the first multilayer PE layer (1000f) may have a structure in which the first PE layer (1001), second PE layer (1002), third PE layer (1003), fourth PE layer (1004), first tie layer (1005), EVOH layer (1006), second tie layer (1007), fifth PE layer (1008), sixth PE layer (1009), seventh PE layer (1010), and eighth PE layer (1011) are stacked sequentially from the top, and this may form an upper and lower symmetric stacking configuration centered on the EVOH layer (1006).

[0066] The above EVOH layer (1006) contains an ethylene vinyl alcohol polymer and functions as a blocking layer to suppress the permeation of oxygen-containing gas into and out of the first multilayer PE layer (1000f).

[0067] In one embodiment of the present invention, the first multilayer PE layer (1000f) includes the EVOH layer (1006) so that it has 5cc / m³ of oxygen. 2 It can have a transmittance of ·day. Preferably, the first multilayer PE layer (1000f) includes the EVOH layer (1006) to have a transmittance of 0.01 to 3 cc / m² with respect to oxygen. 2 It can have a transmittance of 1 / day, and more preferably, 0.01 to 1.5 cc / m³ with respect to oxygen. 2 It can have a transmittance of 1 / day. Meanwhile, in one embodiment of the present invention, the first multilayer PE layer (1000f) includes the EVOH layer (1006), thereby having a transmittance of 0.01 to 0.15 cc / m² with respect to nitrogen. 2 It can have a transmittance of 1 / day and 0.8 to 7.5 cc / m³ with respect to carbon dioxide. 2 It can have a transmittance of ·day.

[0068] That is, according to one embodiment of the present invention, the first multilayer PE layer (1000f) can secure excellent blocking characteristics against gases including oxygen, nitrogen, and carbon dioxide by including an EVOH layer (1006).

[0069] (In this case, in one embodiment of the present invention, the TEST METHOD of ASTM D 3985 was utilized to measure the permeability of the first multilayer PE layer (1000f) for various gases including oxygen.)

[0071] Meanwhile, the first PE layer (1001), the second PE layer (1002), the third PE layer (1003), the fourth PE layer (1004), the fifth PE layer (1008), the sixth PE layer (1009), the seventh PE layer (1010), and the eighth PE layer (1011) each contain 95 weight% or more of PE and can provide mechanical stability and moisture barrier properties to the first multilayer PE layer (1000f).

[0072] The above-mentioned fourth PE layer (1004), fifth PE layer (1008), sixth PE layer (1009), and seventh PE layer (1010) may be composed of a single PE component without separate additives and may serve as a base layer to form the overall thickness of the first multilayer PE layer (1000f) and to ensure durability.

[0073] The first PE layer (1001) and the eighth PE layer (1011) may each contain 95 to 97 weight percent of PE and 3 to 5 weight percent of an anti-blocking agent in terms of the total weight of each layer. In this configuration, the first multilayer PE layer (1000f) can prevent surface adhesion (blocking phenomenon) even when laminated together, thereby improving processability and handling.

[0074] The second PE layer (1002) and the third PE layer (1003) may each contain 97 to 99 weight percent of PE and 1 to 3 weight percent of a slip agent in terms of the total weight of each layer. In this configuration, the first multilayer PE layer (1000f) can induce slippage during processing, thereby improving handling performance in lamination processes, etc.

[0075] That is, in one embodiment of the present invention, the first multilayer PE layer (1000f) may have a transmittance of 0.01 to 8 g / m²·day, preferably 0.01 to 5 g / m²·day with respect to moisture (water vapor) by including the first PE layer (1001), the second PE layer (1002), the third PE layer (1003), the fourth PE layer (1004), the fifth PE layer (1008), the sixth PE layer (1009), the seventh PE layer (1010), and the eighth PE layer (1011).

[0077] Meanwhile, the first tie layer (1005) and the second tie layer (1007) are each placed on the upper and lower portions of the EVOH layer (1006) and can perform the function of improving the adhesion between the EVOH layer (1006) and the adjacent PE layer. Specifically, the first tie layer (1005) and the second tie layer (1007) may each contain 60 to 70 weight% of PE and 30 to 40 weight% of Tie Layer Resin in the total weight of the layer, and the Tie Layer Resin may be a functional resin that increases the interfacial adhesion between different polymer materials, such as PE and EVOH polymer.

[0079] The first multilayer PE layer (1000f) configured in this manner provides a structure capable of comprehensively securing physical properties such as gas and moisture barrier properties, mechanical stability, processability, and bonding stability, as the functional PE layer and the tie layer are compositely arranged around the EVOH layer (1006). Since the first multilayer PE layer (1000f) forms the inner structure of the upper film (1f), its physical properties can directly affect the overall performance of the upper film (1f). Meanwhile, the second multilayer PE layer (1000b) has substantially the same layered structure and material composition as the first multilayer PE layer (1000f) and forms the inner structure of the lower film (1b). Accordingly, the upper film (1f) and the lower film (1b) can maintain similar physical properties, and in a structure where the two films are laminated facing each other to form an envelope-type packaging material (2), the structural characteristics and functions of the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) can play an important role in securing the overall durability and barrier performance of the final envelope-type packaging material (2).

[0081] That is, according to one embodiment of the present invention, each of the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) may comprise 95 to 99 weight% of PE, 1 to 5 weight% of EVOH, and 0.5 to 2 weight% of an additive including an anti-blocking agent and a slip agent, based on the total weight of each of the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b).

[0082] Accordingly, the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) according to one embodiment of the present invention each have a structure in which polyethylene is the main component and functional additives are used minimally within a range that does not impair recyclability, and can satisfy the single material condition (less than 5% by weight of non-PE components) presented in international recycling guidelines such as CEFLEX.

[0083] Accordingly, the envelope-type packaging material (2) of the present invention can provide practical effects as an eco-friendly packaging material by securing functions such as oxygen barrier properties, processability, and bonding properties, while maintaining a single material structure that is recyclable.

[0085] The first printing layer (2000f) is structured such that a printing area is formed on the lower surface of a printing substrate layer (2100') which is composed mainly of PE, and the first heat-resistant printing substrate layer (2100f) may be configured such that a printing area is provided on the inner surface. In one embodiment of the present invention, the first heat-resistant printing substrate layer (2100f) may be formed by irradiating an electron beam onto a printing substrate layer (2100') made of MDOPE (Machine Direction Oriented Polyethylene) or BOPE (Bi-axially Oriented Polyethylene).

[0086] Here, MDOPE is a polyethylene film that is stretched in the machine direction during film manufacturing. Compared to unstretched polyethylene film, it has improved dimensional stability and flatness, which can provide excellent processability in printing and lamination processes. BOPE is a polyethylene film that is stretched biaxially in the machine direction and transverse direction during film manufacturing. Compared to unstretched polyethylene film, it has relatively superior heat resistance and stiffness and can have uniform tensile properties even at thin thicknesses.

[0087] In this configuration, the printing substrate layer (2100') is made of a single PE-based material and has excellent recyclability, and at the same time, it can be converted into a first heat-resistant printing substrate layer and a second heat-resistant printing substrate layer (2100) with an increased melting point through an electron beam irradiation process. In one embodiment of the present invention, a detailed description of the mechanism for improving heat resistance properties due to electron beam irradiation will be explained in more detail with reference to the drawings to be described later.

[0088] The first printing layer (2000f), formed by creating a printing area on the inner surface of the first heat-resistant printing substrate layer (2100f) formed in this manner, can maintain stable printing quality without ink bleeding or damage to the printing layer (2000) even in high-temperature environments that may occur during the printing process, and has the effect of ensuring appearance and information transmission on the envelope-type packaging material (2). In addition, since the printing substrate layer (2100') is made of a single material of PE, it can have excellent compatibility between materials during the lamination process with the first multilayer PE layer (1000f), and can contribute to maintaining the single-material-based envelope-type packaging material (2).

[0090] Meanwhile, while single-material packaging is advantageous in terms of recyclability, structurally it is difficult to ensure a difference in melting points between the inner and outer layers, which can lead to the following problems during the sealing process. Generally, for stable sealing, only the inner layer must undergo selective thermal deformation while the outer layer remains undamaged. However, when both the inner and outer layers are composed of PE, the melting points of both layers are similar, so an over-melting phenomenon may occur during sealing, where the outer layer melts along with the inner layer when it fuses. Consequently, the appearance quality of the packaging material deteriorates, and it is difficult to ensure strength in the sealing area.

[0091] In contrast, conventional non-eco-friendly flexible packaging materials widely utilized a method of ensuring sealing stability by using PE for the inner layer and applying high-melting-point materials such as polyethylene terephthalate (PET) or nylon (NY) for the outer layer to secure a difference in melting points between the inner and outer layers. However, since this structure includes heterogeneous materials such as PET or NY, it was difficult to separate them during the recycling process and had the problem of not meeting the single-material requirement.

[0093] An envelope-type packaging material (2) according to one embodiment of the present invention can achieve the effect of securing a difference in melting points between a first multilayer PE layer (1000f) constituting an internal structure and a first printing layer (2000f) constituting an external structure within a single material range, as the first printing layer (2000f) includes a first heat-resistant printing substrate layer (2100f) and the first heat-resistant printing substrate layer (2100f) is formed in a structure in which the melting point is raised by electron beam irradiation.

[0094] Specifically, in one embodiment of the present invention, the first multilayer PE layer (1000f) may have a melting point of 105 to 125°C, and preferably a melting point of about 110°C to 120°C. Meanwhile, the first heat-resistant printing substrate layer (2100f) may have a melting point of 140°C to 200°C, and preferably a melting point of 160°C to 180°C, with improved heat resistance through electron beam irradiation. Accordingly, the difference in melting points between the first multilayer PE layer (1000f) and the first heat-resistant printing substrate layer (2100f) may be 15 to 95°C, and preferably 40 to 70°C.

[0096] Accordingly, while the first multilayer PE layer (1000f) is selectively thermally deformed and bonded in the sealing portion (500) during the sealing process, the first printed layer (2000f) can maintain its appearance without thermal damage, and can effectively prevent the problems of overmelting and appearance deformation that occurred in conventional single-material structures.

[0097] As a result, the envelope-type packaging material (2) according to one embodiment of the present invention provides the effect of simultaneously ensuring sealing stability and appearance quality while maintaining a single material, and can be utilized as an eco-friendly flexible packaging material.

[0099] Meanwhile, in the envelope-type packaging material (2) according to one embodiment of the present invention, the first printing layer (2000f) and the second printing layer (2000b) may each have a thickness of about 20 μm to 50 μm, and preferably may have a thickness of 30 μm to 40 μm. In addition, the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) may each be formed with a thickness of about 40 μm to 100 μm, and accordingly, the total thickness of the envelope-type packaging material (2) is preferably formed within the range of about 60 μm to 150 μm.

[0101] FIG. 3 schematically illustrates a block diagram of a packaging material manufacturing device according to one embodiment of the present invention, and FIG. 4 schematically illustrates the flow of a manufacturing process for an envelope-type packaging material (2) according to one embodiment of the present invention.

[0102] At this time, FIG. 4(a) schematically illustrates the flow up to the process of forming the upper film (1f) and the lower film (1b) during the manufacturing process of the envelope-type packaging material (2) according to one embodiment of the present invention, and FIG. 4(b) schematically illustrates the flow up to the process of manufacturing the envelope-type packaging material (2) from the upper film (1f) and the lower film (1b).

[0104] According to one embodiment of the present invention, the first heat-resistant printing substrate layer (2100f) improves heat resistance characteristics by irradiating an electron beam using an electron beam processing unit on a printing substrate layer (2100'), and after electron beam irradiation, a printing area is formed on the inner surface of the first heat-resistant printing substrate layer (2100f), and lamination is performed by applying an adhesive between the first printing layer (2000f) and the first multilayer PE layer (1000f), removing a volatile solvent, and curing the adhesive, so that the first printing layer (2000f) and the first multilayer PE layer (1000f) can be formed as a single upper surface film (1f).

[0105] Similarly, according to one embodiment of the present invention, the second heat-resistant printing substrate layer (2100) improves heat resistance characteristics by irradiating an electron beam using an electron beam processing unit on a printing substrate layer (2100'), and after electron beam irradiation, a printing area is formed on the inner surface of the second heat-resistant printing substrate layer (2100), and lamination is performed by applying an adhesive between the second printing layer (2000b) and the second multilayer PE layer (1000b), removing a volatile solvent, and curing the adhesive, so that the second printing layer (2000b) and the second multilayer PE layer (1000b) can be formed as a single bottom film (1b).

[0107] According to one embodiment of the present invention, the envelope-type packaging material (2) can be produced from a single packaging film (1) formed such that a plurality of upper films (1f) and a plurality of lower films (1b) are alternately arranged continuously.

[0108] In this case, the above envelope-shaped packaging material (2) can be manufactured into an envelope shape by cutting the packaging film (1) along the area where the upper edge of each upper film (1f) and the upper edge of the lower film (1b) adjacent to the upper edge of each upper film (1f) meet, while the lower edge of each upper film (1f) and the lower edge of the lower film (1b) adjacent to the lower edge of each upper film (1f) are not cut, and then folding the upper film (1f) and the lower film (1b) adjacent to each upper film (1f) so that they face each other, and then heating and pressing the side edges of the upper film (1f) and the lower film (1b) stacked to face each upper film (1f) using a sealing bar.

[0110] As shown in FIG. 3, an envelope-type packaging material (2) according to one embodiment of the present invention can be manufactured by an envelope-type packaging material manufacturing device (10).

[0111] Specifically, the envelope-type packaging material manufacturing device (10) comprises: an electron beam processing unit that forms a first heat-resistant printing substrate layer (2100f) and a second heat-resistant printing substrate layer (2100) with improved heat resistance properties by irradiating an electron beam onto a printing substrate layer (2100'); and a printing processing unit (200) that forms a first printing layer (2000f) by forming a printing area on the inner surface of the first heat-resistant printing substrate layer (2100f) and forms a second printing layer (2000b) by forming a printing area on the inner surface of the second heat-resistant printing substrate layer (2100). A film manufacturing unit (300) that forms a packaging film (1) by applying an adhesive between the first heat-resistant printing substrate layer (2100f) and the first multilayer PE layer (1000f) and between the second heat-resistant printing substrate layer (2100) and the second multilayer PE layer (1000b) to perform lamination, and by removing a volatile solvent contained in the adhesive to cure the adhesive; a cutting unit (400) that cuts the packaging film (1) to a predetermined size; and a sealing unit (500) that includes the heating element and forms an envelope shape by sealing the inner surfaces of the packaging film (1) cut by the cutting unit (400).

[0113] In one embodiment of the present invention, the envelope-type packaging material (2) may be manufactured in a structure in which a plurality of upper films (1f) and a plurality of lower films (1b) are alternately and continuously formed on a single packaging film (1). This configuration can increase the efficiency of the manufacturing process and provide the effect of facilitating the automation of subsequent cutting and sealing processes.

[0114] Hereinafter, instead of manufacturing the upper film (1f) and lower film (1b) individually, we will describe an exemplary process for manufacturing a packaging film (1) in which the upper film (1f) and lower film (1b) are continuously formed using a single printing substrate layer (2100') and a single multilayer PE layer (1000).

[0116] Specifically, when an electron beam is irradiated onto a printing substrate layer (2100') using an electron beam processing unit (100), the heat resistance performance of the printing substrate layer (2100') is improved, and a heat-resistant printing substrate layer (2100) can be formed.

[0117] These heat-resistant printing substrate layers (2100) can function as the first heat-resistant printing substrate layer (2100f) or the second heat-resistant printing substrate layer (2100), respectively, serving as the basis for the first printing layer (2000f) or the second printing layer (2000b), respectively, depending on the content of the printing area to be printed. For example, when the printing processing unit (200) prints a shape corresponding to the printing area of ​​the first printing layer (2000f) on a part of the heat-resistant printing substrate layer (2100), that part may form an upper film (1f), and when the printing processing unit (200) prints a shape corresponding to the printing area of ​​the second printing layer (2000b) on another part adjacent to a part of the heat-resistant printing substrate layer (2100), that part may form a lower film (1b). Accordingly, a printing layer (2000) may be provided in which a first printing layer (2000f) and a second printing layer (2000b) are alternately formed on a single long heat-resistant printing substrate layer (2100).

[0118] Additionally, the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) may be provided as a single continuous structure, and depending on the location where the first printing layer (2000f) or the second printing layer (2000b) is laminated thereon, it may function as the first multilayer PE layer (1000f) or the second multilayer PE layer (1000b).

[0119] Hereinafter, the first heat-resistant printing substrate layer (2100f) and the second heat-resistant printing substrate layer (2100) formed in a continuous form as described above are collectively referred to as the heat-resistant printing substrate layer (2100), and the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) formed in a continuous form are collectively referred to as the multilayer PE layer (1000).

[0121] Referring to FIG. 4(a), the printing substrate layer (2100') can be converted into a heat-resistant printing substrate layer (2100) by passing through an electron beam processing unit (100) and irradiating it with an electron beam, thereby improving the melting point of a PE-based film, which generally has a melting point of 105 to 125°C, to 140 to 200°C. The mechanism by which the molecular structure of PE changes due to electron beam irradiation and the resulting heat resistance improvement effect will be explained in detail through the drawings described later.

[0122] Subsequently, by the printing processing unit (200), printing areas of the first printing layer (2000f) and the second printing layer (2000b) can be formed on the inner surface of the heat-resistant printing substrate layer (2100), respectively. The printing processing unit (200) can operate, for example, according to a gravure printing method, and can provide one long printing layer (2000) by alternately printing the printing areas of the first printing layer (2000f) and the second printing layer (2000b) on the lower surface of the heat-resistant printing substrate layer (2100).

[0123] The printed layer (2000) and the multilayer PE layer (1000) formed in this manner can be laminated and bonded by the film manufacturing unit (300). At this time, an adhesive may be applied to the inner surface of the printed layer (2000) or the outer surface of the multilayer PE layer (1000), and the inner surface of the printed layer (2000) and the outer surface of the multilayer PE layer (1000) may be bonded together, thereby finally forming a packaging film (1) that is stably bonded by an adhesive.

[0124] The above packaging film (1) may have a structure in which a plurality of upper films (1f) and a plurality of lower films (1b) are alternately and continuously arranged. According to one embodiment of the present invention, when the packaging film (1) is extended in the left-right direction, the upper edge of the upper film (1f) may face to the left and the upper edge of the lower film (1b) may face to the right, so that the lower edges of each upper film (1f) and lower film (1b) may be arranged side by side. This configuration may serve as a structural prerequisite for effectively forming an envelope-shaped form in subsequent cutting, folding, and sealing processes.

[0126] Referring to FIG. 4(b), the packaging film (1) formed through FIG. 4(a) can be finally completed into an envelope-type packaging material (2) through subsequent processes of a cutting section (400) and a sealing section (500).

[0127] As described above, in one embodiment of the present invention, the packaging film (1) is formed in a structure in which a plurality of upper films (1f) and lower films (1b) are alternately arranged continuously, and may have a single continuous film structure extending in the left-right direction.

[0128] In this structure, the packaging film (1) can be cut by the cutting portion (400) at a portion where the upper edge of the upper film (1f) and the upper edge of the lower film (1b) are arranged parallel to each other, thereby forming a single envelope unit. The envelope unit can be arranged such that the inner surface is composed of a first multilayer PE layer (1000f) and a second multilayer PE layer (1000b), respectively, while maintaining a structure in which the lower edge of the upper film (1f) and the lower edge of the lower film (1b) arranged continuously therefrom are arranged parallel to each other.

[0129] Subsequently, the above envelope unit is folded so that the upper film (1f) and the lower film (1b) face each other, and the side edge areas of the upper film (1f) and the lower film (1b) are heated and compressed to be sealed into an envelope shape. At this time, the sealing is performed by a heating element included in the sealing part (500), and the heating element may be a linear sealing bar in the shape of a '1' or a border sealing bar in the shape of a 'ㅁ'. Preferably, the linear sealing bar is arranged in multiple numbers so as to be able to simultaneously compress the upper side of the upper film (1f) and the lower side of the lower film (1b).

[0130] The heating element is configured to apply heat to the edge portions of the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b), and the heating temperature is preferably lower than the melting point of the first heat-resistant printing substrate layer (2100f) and the second heat-resistant printing substrate layer (2100). Specifically, according to one embodiment of the present invention, since the first heat-resistant printing substrate layer (2100f) and the second heat-resistant printing substrate layer (2100) have a melting point of 140 to 200°C, the heating element is preferably heated to a temperature of 100 to 135°C. In particular, the heating element can stably melt the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) by having a heating temperature of 100°C or higher.

[0131] In this configuration, the area compressed by the heating element can be defined as a sealing area. In the sealing area, only the edge portions of the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) can be selectively thermally deformed and melted by heat to bond together, and accordingly, a strong thermal fusion bond can be formed in that area. On the other hand, in the sealing area, the temperature of the heating element is set lower than the melting point of the first printing layer (2000f) and the second printing layer (2000b) so that the first printing layer (2000f) and the second printing layer (2000b) are not affected by heat, so that the appearance of the first printing layer (2000f) and the second printing layer (2000b) can be maintained without thermal deformation.

[0132] Through this sealing method, the envelope-type packaging material (2) of the present invention maintains a single-material structure with excellent recyclability, and at the same time, by selectively sealing only the multilayer PE layer (1000) corresponding to the inner surface, it is possible to prevent problems such as damage, over-melting, and discoloration of the outer printing layer (2000) that may occur during the sealing process. Accordingly, the envelope-type packaging material (2) according to one embodiment of the present invention can simultaneously secure excellent sealing performance, printing quality, and stability of appearance.

[0134] FIG. 5 illustrates an example of a printing substrate layer (2100') and a heat-resistant printing substrate layer (2100) according to one embodiment of the present invention as a digital image, and FIG. 6 schematically illustrates the steps of a change in molecular structure caused by electron beam irradiation according to one embodiment of the present invention.

[0136] FIG. 5(a) illustrates, through a digital image, an example of a printing substrate layer (2100') wound into a roll before being irradiated with an electron beam, and FIG. 5(b) illustrates, through a digital image, an example of a printing substrate layer (2100') being converted into a heat-resistant printing substrate layer (2100) and wound into a roll after being irradiated with an electron beam.

[0137] The printing substrate layer (2100') shown in FIG. 5(a) may be BOPE or MDOPE, and may be a film manufactured with PE as the main component to be suitable for printing and lamination.

[0138] As shown in FIG. 5(b), the heat-resistant printing substrate layer (2100) corresponding after electron beam irradiation may appear yellowed in appearance compared to the printing substrate layer (2100'), and this may be a visual change due to a change in the polymer structure caused by electron beam irradiation. However, this change in appearance does not have a substantial effect on printability or the lamination process, and the heat-resistant printing substrate layer (2100) can function as a high-performance substrate layer with improved heat resistance due to electron beam irradiation.

[0140] As shown in FIG. 6, when the printing substrate layer (2100') is irradiated with an electron beam (E-beam) by the electron beam processing unit (100), high-speed electrons collide with the polymer structure, and in this process, hydrogen (H) atoms within the PE chains are detached, and as a result, a change in the molecular structure may occur in which new bonds are formed between the PE chains.

[0141] Specifically, as can be seen in steps 2 and 3, cross-linking is induced as carbon (C) bonds are formed at the locations where hydrogen (H) is removed, and this cross-linking structure can improve the thermal stability and structural strength of the film.

[0142] The final structure in which new crosslinking is formed in this way is illustrated in step 4 of FIG. 6, and this structure can enable the printing substrate layer (2100') to function as a heat-resistant printing substrate layer (2100) with improved heat resistance.

[0143] That is, in one embodiment of the present invention, the printing substrate layer (2100') is crosslinked by electron beam irradiation, and as a result, the thermal stability of the PE material is improved, and it can be converted into a heat-resistant printing substrate layer (2100) with an increased melting point.

[0144] According to one embodiment of the present invention, the melting point of the printing substrate layer (2100') is 105 to 125°C, but the heat-resistant printing substrate layer (2100) formed through electron beam treatment may have a melting point of 140 to 200°C, and accordingly, the heat-resistant printing substrate layer (2100) can ensure stability in the heat sealing process.

[0146] This heat-resistant printing substrate layer (2100) can form a first printing layer (2000f) (or a second printing layer (2000b)) by forming a printing area on the inner side by the printing processing unit (200), and subsequently can be formed into an upper film (1f) (or lower film (1b)) by laminating with a multilayer PE layer (1000).

[0148] As a result, the heat-resistant printing substrate layer (2100) formed by the electron beam irradiation can serve as a key component for simultaneously ensuring printing stability and lamination heat resistance in the manufacturing process of the envelope-type packaging material (2).

[0150] Meanwhile, according to one embodiment of the present invention, the electron beam processing unit can irradiate the printing substrate layer (2100') with an irradiation dose of 30 to 150 kGy under a reference voltage of 120 to 150 mA while passing the printing substrate layer (2100') at a speed of 13 to 70 m / min.

[0152] The amount of electron beam irradiated onto the printing substrate layer (2100') can be controlled according to the moving speed of the film, the irradiation current of the electron beam (based on the reference voltage), and other set conditions.

[0153] An electron beam processing unit according to one embodiment of the present invention can provide an electron beam irradiation dose in the range of 30 kGy to 150 kGy by maintaining a reference current of 120 to 150 mA under conditions of moving the printing substrate layer (2100') at a speed of 130 m / min to 70 m / min.

[0155] More specifically, when the printing substrate layer (2100') is transported at a relatively fast speed, a relatively low irradiation dose may be provided. For example, if the printing substrate layer (2100') is transported at a speed of 67 m / min, an electron beam irradiation dose of 30 kGy may be provided to the printing substrate layer (2100'). In addition, if the printing substrate layer (2100') is transported at a relatively slow speed, a relatively high irradiation dose may be provided. For example, if the printing substrate layer (2100') is transported at a speed of 13.5 m / min, an electron beam irradiation dose of 150 kGy may be provided to the printing substrate layer (2100').

[0156] In this way, by controlling the movement speed, the electron beam irradiation amount can be precisely controlled, thereby improving the heat resistance of the printing substrate layer (2100') to meet the required performance. For example, if the irradiation amount is insufficient, a sufficient crosslinking reaction does not occur, which may limit the improvement of heat resistance; conversely, if an excessive irradiation amount is applied, it may degrade the mechanical properties of the film or affect the surface quality. Therefore, by determining an appropriate irradiation amount according to the material and application of the target film, process stability and quality assurance can be ensured.

[0158] FIG. 7 illustrates an exemplary process of forming an envelope-type packaging material (2) performed by a packaging material manufacturing device according to one embodiment of the present invention, and FIG. 8 illustrates a digital image showing the difference in appearance of the envelope-type packaging material (2) depending on whether electron beam treatment is performed according to one embodiment of the present invention.

[0160] FIG. 7(a) illustrates an exemplary planar structure of a packaging film (1) composed of an upper film (1f) and a lower film (1b) arranged in a continuous manner.

[0161] In one embodiment of the present invention, a worker can obtain an envelope unit in which an upper film (1f) and a lower film (1b) form a pair by cutting along the area where the upper edge of each upper film (1f) and the upper edge of an adjacent lower film (1b) meet using a cutting part (400).

[0163] FIG. 7(b) illustrates a structure of a cut envelope unit viewed from the direction of the upper edge (direction of arrow A shown in FIG. 7(a)), and shows a state in which the upper film (1f) and the lower film (1b) are stacked so that they face each other as the areas arranged side by side with the lower edges of each of the upper film (1f) and the lower film (1b) are folded without being cut.

[0164] In this structure, the heating element moves along the direction of the arrow shown in FIG. 7(b) and can perform the operation of applying heat and compressing by contacting the left and right edge areas where the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) are arranged.

[0165] In one embodiment of the present invention, the heating member may be configured in a '1'-shaped or 'ㅁ'-shaped frame structure, and the temperature is preferably set to 100°C or higher, while being lower than the melting point of the first heat-resistant printing substrate layer (2100f) and the second printing substrate layer.

[0166] Under these conditions, the heating element contacts a portion of the outer surface of each of the first printed layer (2000f) and the second printed layer (2000b), but the first printed layer (2000f) and the second printed layer (2000b) can be maintained stably without thermal deformation or damage. On the other hand, the portion of the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) located on the inner side of the portion contacted by the heating element is selectively melted and compressed, thereby allowing them to be bonded together and enabling stable sealing.

[0168] FIG. 7(c) shows a cross-section of an envelope-shaped packaging material (2) with the sealing completed, and the sealing area marked M corresponds to an area where the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) are melted and compressed and bonded.

[0169] This structure can not only ensure the quality of the appearance but also prevent damage to the outer printing layer (2000) caused by heat, thereby improving the visual quality and durability of the final product.

[0171] FIG. 8(a) shows a digital image of an envelope-type packaging material (2) formed using a heat-resistant printing substrate layer (2100) irradiated with an electron beam according to one embodiment of the present invention, and FIG. 8(b) shows the appearance of a packaging material of a comparative example formed using a printing substrate layer (2100') not irradiated with an electron beam.

[0172] The example of FIG. 8(a) and the comparative example of FIG. 8(b) each applied the same multilayer PE layer (1000) and the same sealing conditions, but in the example of FIG. 8(a), it can be seen that no wrinkles or thermal deformation occurred in the printed layer (2000), whereas in the comparative example of FIG. 8(b), wrinkles and thermal deformation caused by overmelting occurred in the outer printed layer (2000).

[0173] In this way, the printing layer (2000) based on the heat-resistant printing substrate layer (2100) according to one embodiment of the present invention is a key component that can secure a difference in melting points between the inner and outer layers while maintaining a single material structure, and can prevent external damage during the sealing process while enabling the manufacture of a stable envelope-type packaging material (2).

[0175] In addition, according to one embodiment of the present invention, since the envelope-type packaging material (2) can respond to a high-temperature sealing process even without a separate high-heat-resistant material, the entire manufacturing process can be simplified and the quality can be stabilized.

[0177] FIG. 9 schematically illustrates a method for manufacturing an envelope-type packaging material (2) according to one embodiment of the present invention.

[0179] As described above, the envelope-type packaging material (2) comprises: a first multilayer PE layer (1000f) comprising a plurality of PE layers comprising polyethylene (PE); a first printing layer (2000f) comprising a first heat-resistant printing substrate layer (2100f) comprising PE and having a printing area formed on the inner surface; an upper surface film (1f); and a second PE multilayer comprising a plurality of PE layers comprising polyethylene (PE). A bottom film (1b) comprising: a second printing layer (2000b) comprising a second heat-resistant printing substrate layer (2100) having a printing area formed on an inner surface and including PE; wherein the melting point of each of the first heat-resistant printing substrate layer (2100f) and the second heat-resistant printing substrate layer (2100) is 140 to 200°C, and the melting point of each of the first multilayer PE layer (1000f) and the second multilayer PE layer (1000b) is 105 to 125°C; and according to one embodiment of the present invention, a manufacturing method for manufacturing an envelope-type packaging material (2) comprises an electron beam treatment step (S10) of forming the first heat-resistant printing substrate layer (2100f) and the second heat-resistant printing substrate layer (2100) by irradiating an electron beam onto a printing substrate layer (2100'); A printing forming step (S20) for forming a first printing layer (2000f) and a second printing layer (2000b) respectively by forming a printing area on each of the first heat-resistant printing substrate layer (2100f) and the second heat-resistant printing substrate layer (2100); a film lamination step (S30) for forming a packaging film (1) by applying an adhesive between the first heat-resistant printing substrate layer (2100f) and the first multilayer PE layer (1000f) and between the second heat-resistant printing substrate layer (2100) and the second multilayer PE layer (1000b) to perform lamination, and curing the adhesive by removing a volatile solvent contained in the adhesive; a cutting step for cutting the packaging film (1) to a predetermined size; and a sealing step (S40) for forming an envelope shape by sealing the inner surfaces of the cut packaging film (1) together.

[0181] In this case, in one embodiment of the present invention, the manufacturing step may utilize an envelope-type packaging material manufacturing device (10).

[0182] In one embodiment of the present invention, the envelope-type packaging material manufacturing device (10) comprises: an electron beam processing unit that forms a first heat-resistant printing substrate layer (2100f) and a second heat-resistant printing substrate layer (2100) with improved heat resistance characteristics by irradiating an electron beam onto a printing substrate layer (2100'); and a printing processing unit (200) that forms a first printing layer (2000f) by forming a printing area on the inner surface of the first heat-resistant printing substrate layer (2100f) and forms a second printing layer (2000b) by forming a printing area on the inner surface of the second heat-resistant printing substrate layer (2100). A film manufacturing unit (300) that forms a packaging film (1) by applying an adhesive between the first heat-resistant printing substrate layer (2100f) and the first multilayer PE layer (1000f) and between the second heat-resistant printing substrate layer (2100) and the second multilayer PE layer (1000b) to perform lamination, and by removing a volatile solvent contained in the adhesive to cure the adhesive; a cutting unit (400) that cuts the packaging film (1) to a predetermined size; and a sealing unit (500) that includes the heating element and forms an envelope shape by sealing the inner surfaces of the packaging film (1) cut by the cutting unit (400).

[0184] According to one embodiment of the present invention, the envelope-type packaging material is composed of a first multilayer PE layer and a second multilayer PE layer, and a first printing layer and a second printing layer, all of which are made of polyethylene as the main component, and the auxiliary material in the printing layer is included in an amount of less than 5 weight%, thereby enabling the effect of being realized as a single material structure that is easy to recycle.

[0185] According to one embodiment of the present invention, the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer formed by irradiating an electron beam onto a printing substrate layer have an increased melting point, and accordingly, a difference in melting point between the first multilayer PE layer and the second multilayer PE layer is secured, thereby enabling the effect of preventing thermal deformation and over-melting of the printing layer during heat sealing.

[0186] According to one embodiment of the present invention, the first multilayer PE layer and the second multilayer PE layer are configured such that a plurality of PE layers and tie layers are symmetrically stacked around an EVOH layer, thereby enabling the effect of securing barrier properties against various gases such as oxygen, nitrogen, and carbon dioxide.

[0187] According to one embodiment of the present invention, the first multilayer PE layer and the second multilayer PE layer are composed of a plurality of PE layers including an anti-blocking agent and a slip agent, thereby improving the processability and handling of the packaging material and preventing adhesion during lamination or winding.

[0188] According to one embodiment of the present invention, an upper film and a lower film are alternately and continuously formed on a single packaging film, and subsequently, through cutting, folding, and sealing processes, a bag-shaped structure can be manufactured, thereby ensuring the continuity of the manufacturing process and improving productivity.

[0189] According to one embodiment of the present invention, the electron beam processing unit is configured to control the amount of irradiation by controlling the movement speed of the printing substrate layer, and accordingly, it is possible to achieve the effect of preventing film degradation caused by excessive irradiation while ensuring heat resistance.

[0190] According to one embodiment of the present invention, the printed layer with improved heat resistance by electron beam treatment does not deform even under high-temperature sealing conditions and stably maintains its appearance quality, thereby enabling the effect of improving the appearance finish of the envelope-type packaging material.

[0192] FIG. 10 schematically illustrates a side view of an electron beam irradiation device according to one embodiment of the present invention, and FIG. 11 schematically illustrates a top view of an electron beam irradiation device according to one embodiment of the present invention.

[0194] According to one embodiment of the present invention, an electron beam processing unit (100) for packaging materials comprises: a shear supply unit (10000) that unfolds a printing substrate layer (F) from a packaging material roll and supplies it to the rear; a shear transfer unit (20000) that is subsequently arranged continuously in the shear supply unit (10000) and transfers the printing substrate layer (F) supplied from the shear supply unit (10000) to the rear side through a plurality of transfer unit transfer rolls; and an electron beam irradiation unit (30000) that is subsequently arranged continuously in the shear transfer unit (20000) and irradiates an electron beam corresponding to an accelerated electron onto the packaging material transferred by the shear transfer unit (20000). It may include: a rear end transfer unit (40000) that is subsequently arranged in succession to the electron beam irradiation unit (30000) and transfers a heat-resistant printing substrate layer (F') that has passed through the electron beam irradiation unit (30000) to the rear side through a plurality of transfer rolls; and a rear end winding unit (50000) that is subsequently arranged in succession to the rear end transfer unit (40000) and winds the heat-resistant printing substrate layer (F') transferred through the rear end transfer unit (40000).

[0195] In this configuration, when an electron beam is irradiated onto the packaging film (F) by the electron beam irradiation unit (30000), the heat resistance performance of the packaging film (F) can be improved by the detachment of hydrogen radicals and the formation of cross-linking between carbons in the packaging film (F).

[0197] The above electron beam processing unit (100) is a device that performs the function of improving heat resistance performance by irradiating an electron beam onto a packaging film (F), and may include a front supply unit (10000), a front transfer unit (20000), an electron beam irradiation unit (30000), a rear transfer unit (40000), and a rear winding unit (50000) arranged sequentially from the front end to the rear end.

[0199] According to one embodiment of the present invention, a printing substrate layer (F) can be drawn out from a packaging material roll by a shear supply unit (10000) and continuously supplied to a shear transport unit (20000) arranged in communication with the shear supply unit (10000). Subsequently, the printing substrate layer (F) can be transported backward while maintaining a constant tension and speed while passing through the shear transport unit (20000), and can be transported to an electron beam irradiation unit (30000) arranged continuously with the shear transport unit (20000).

[0200] The printing substrate layer (F) transferred to the electron beam irradiation unit (30000) can be irradiated with an accelerated electron beam on one side, and accordingly, cross-linking between polymer chains can be induced within the printing substrate layer (F). That is, the printing substrate layer (F) can be converted into a heat-resistant packaging film (F') with improved heat resistance performance by the electron beam irradiation unit (30000).

[0201] The heat-resistant packaging film (F') can be transported in the rearward direction through a rear-end transport unit (40000) arranged continuously with the electron beam irradiation unit (30000), and finally transported to a rear-end winding unit (50000) arranged continuously with the rear-end transport unit (40000). That is, in this configuration, the heat-resistant packaging film (F') can be wound into a roll shape by the rear-end winding unit (50000) and stored in a regular roll shape.

[0202] As illustrated in FIGS. 10 and 11, it is preferable that each component of the electron beam processing unit (100) of the present invention be arranged in series along the front-rear direction (process direction).

[0204] In particular, in one embodiment of the present invention, the shear supply unit (10000) may accommodate up to two packaging material rolls, one of which may be a work roll from which the printing material layer (F) is drawn, and the other may be a standby roll prepared for replacement. Hereinafter, the packaging material roll from which the printing material layer (F) is drawn will be referred to as the 'work roll', and the packaging material roll waiting for replacement will be referred to as the 'standby roll'.

[0205] According to one embodiment of the present invention, the shear supply unit (10000) can connect the end of the printing substrate layer (F) drawn from the work roll and the leading end of the printing substrate layer (F) drawn from the standby roll by a thermal bonding method, and can automatically perform a roll replacement process of replacing the standby roll with the work roll without stopping the operation of the electron beam processing unit (100). The specific configuration and operation method thereof will be described in detail with reference to the drawings described later.

[0207] Additionally, the shear transfer unit (20000) performs the function of stably transferring the printing substrate layer (F) transferred from the shear supply unit (10000) to the electron beam irradiation unit (30000) while maintaining a constant tension and speed. At the same time, it may include a tension maintenance configuration that can continuously maintain a constant tension and speed of the printing substrate layer (F) that was previously being continuously transferred through the shear transfer unit (20000), even when the transfer of the printing substrate layer (F) from the shear supply unit (10000) is interrupted while the roll replacement process is being performed by the shear supply unit (10000).

[0208] Since the amount of electron beam irradiation can be influenced by the movement speed and tension of the printing substrate layer (F), if the transport conditions are not maintained consistently, a deviation in the amount of irradiation may occur, which may degrade the quality of the heat-resistant packaging film (F'). Therefore, the shear transport unit (20000) is equipped with a tension-maintaining configuration to prevent transport instability and uneven tension of the printing substrate layer (F) even during the roll replacement process, and to maintain uniformity in the amount of electron beam irradiation, thereby enabling the effect of stably securing the quality of the heat-resistant packaging film (F').

[0209] The detailed configuration and control method related to the above tension maintenance configuration will be explained through the drawings described below.

[0211] Meanwhile, the electron beam irradiation unit (30000) can perform the function of irradiating one surface of the printing substrate layer (F) with an electron beam generated and accelerated through the electron beam generating unit (31000). Hereinafter, the electron particle beam generated and accelerated by the electron beam generating unit (31000) and irradiated onto the printing substrate layer (F) will be referred to as the "electron beam" for explanation. The electron beam can improve the melting point and heat resistance of the printing substrate layer (F) by inducing cross-linking between polymer chains constituting the printing substrate layer (F), and a more detailed explanation of the process of inducing cross-linking between polymer chains will be provided through the drawings described later.

[0213] According to one embodiment of the present invention, a shear supply unit (10000), a shear transfer unit (20000), an electron beam irradiation unit (30000), a rear transfer unit (40000), and a rear winding unit (50000) are arranged in series along the process direction, and each transfer and winding operation is controlled to maintain constant tension and speed, thereby allowing electron beam processing to be performed continuously without interruption of the transfer of the printing substrate layer (F), and thereby enabling the stable production of a heat-resistant printing substrate layer (F') with improved heat resistance performance.

[0214] In addition, according to one embodiment of the present invention, as the printing substrate layer (F) passes through the electron beam irradiation unit (30000), an accelerated electron beam is irradiated, thereby inducing hydrogen radical detachment and carbon-to-carbon cross-linking, and as a result, the heat resistance of the printing substrate layer (F) can be improved.

[0216] Meanwhile, according to one embodiment of the present invention, the front transfer unit (20000) and the rear transfer unit (40000) may have similar structures in terms of configuration and operation. However, there may be a difference in placement location in that the front transfer unit (20000) is positioned on the front side of the electron beam irradiation unit (30000) and the rear transfer unit (40000) is positioned on the rear side.

[0217] Accordingly, the configuration and operation of the front end transfer unit (20000) will be explained in detail below, and a repetitive explanation regarding the rear end transfer unit (40000), which has the same or similar structure, will be omitted.

[0219] FIG. 12 schematically illustrates a side schematic view and a plan schematic view of a shear supply unit (10000) according to one embodiment of the present invention.

[0220] FIG. 12(a) illustrates a side schematic view of a shear supply unit (10000) according to one embodiment of the present invention, and FIG. 12(b) illustrates a plan schematic view of a shear supply unit (10000) in a state where a work roll and a standby roll are not arranged according to one embodiment of the present invention. In FIG. 12(b), the work roll and the standby roll are not arranged, and a plurality of supply unit transfer rolls (16000), a front joining heating member (18000), and a rear joining heating member (17000) may be omitted.

[0221] Hereinafter, based on FIG. 12(a), the surface facing left (forward direction relative to the process direction) at the time of withdrawal from the printing substrate layer (F) is referred to as the upper surface of the printing substrate layer (F), and the surface facing right (backward direction relative to the process direction) based on FIG. 12(a) is referred to as the lower surface of the printing substrate layer (F).

[0223] According to one embodiment of the present invention, the shear supply unit (10000) comprises: a rotating bracket (11000) arranged to extend in the front-rear direction; a first roll shaft (14000) vertically connected to one side of the rotating bracket (11000); a second roll shaft (15000) vertically connected to the other side of the rotating bracket (11000); a plurality of supply unit transfer rolls (16000), each including an upper supply unit transfer roll (16000-1) located on the upper side of the rear end of the rotating bracket (11000) and a lower supply unit transfer roll (16000-2) located spaced apart in the lower direction from the upper supply unit transfer roll (16000-1); and a rear bonding heating member (17000) arranged between the upper supply unit transfer roll (16000-1) and the lower supply unit transfer roll (16000-2). and a front joining heating member (18000) located on the upper side of the front side of the rotating bracket (11000).

[0224] Additionally, according to one embodiment of the present invention, the shear supply unit (10000) may further include a bracket rotation shaft (12000) vertically connected to the center of the rotating bracket (11000); and a bracket motor (13000) that provides rotational power to the bracket rotation shaft (12000).

[0225] As described above, the shear supply unit (10000) is configured to support a work roll and a standby roll and to supply a printing substrate layer (F) to a shear transfer unit (20000). To this end, the shear supply unit (10000) may include a rotating bracket (11000), a bracket rotation shaft (12000), a bracket motor (13000), a first roll shaft (14000), a second roll shaft (15000), a plurality of supply transfer rolls (16000), a rear bonding heating member (17000), and a front bonding heating member (18000).

[0227] As illustrated in FIG. 12(a) and FIG. 12(b), the rotating bracket (11000) is a plate-shaped member extending along the process direction (front-rear direction), and a first roll axis (14000) may be vertically connected to one side and a second roll axis (15000) may be vertically connected to the other side. Additionally, a bracket rotation axis (12000) may be vertically connected to the center of the rotating bracket (11000), and a bracket motor (13000) may be connected to the bracket rotation axis (12000). Preferably, a pair of rotating brackets (11000) may be arranged spaced apart in the left-right direction, so that the first roll axis (14000), the second roll axis (15000), and the bracket rotation axis (12000) are each supported at both ends.

[0228] With this configuration, the bracket rotation shaft (12000) rotates by the rotational power of the bracket motor (13000), and accordingly, the rotation bracket (11000) rotates, thereby allowing the positions of the first roll shaft (14000) and the second roll shaft (15000) to be switched with each other.

[0229] For example, FIG. 12(a) illustrates an exemplary state in which the first roll axis (14000) is located on the rear side of the rotating bracket (11000) and the second roll axis (15000) is located on the front side of the rotating bracket (11000). However, when rotating counterclockwise with respect to the bracket rotation axis (12000) in the state of FIG. 12(a), the second roll axis (15000) may be located on the rear side of the rotating bracket (11000) and the first roll axis (14000) may be located on the front side of the rotating bracket (11000).

[0231] Meanwhile, in one embodiment of the present invention, preferably, among the two roll axes (14000, 15000) of the first roll axis (14000) and the second roll axis (15000), a work roll is placed on the roll axis (14000, 15000) positioned on the rear side of the rotating bracket (11000) (first roll axis (14000) based on FIG. 12(a)), and a standby roll is placed on the roll axis (14000, 15000) positioned on the front side of the rotating bracket (11000) (second roll axis (15000) based on FIG. 12(a)).

[0233] Meanwhile, a plurality of supply transfer rolls (16000) may be arranged on the upper rear end of the above-mentioned rotating bracket (11000). The plurality of supply transfer rolls (16000) are in the shape of rolls extended in the left and right directions and are each installed to be rotatable about a central axis, so as to perform the function of supporting the lower surface of the printing substrate layer (F) withdrawn from the work roll and guiding it in the rear direction (process direction).

[0234] Specifically, the plurality of supply conveyor rolls (16000) include an upper supply conveyor roll (16000-1) and a lower supply conveyor roll (16000-2), and the lower supply conveyor roll (16000-2) may be spaced apart in the downward direction with respect to the upper supply conveyor roll (16000-1).

[0236] At this time, the rear bonding heating member (17000) is positioned between the upper supply transfer roll (16000-1) and the lower supply transfer roll (16000-2), and can be installed in a position facing the lower surface of the printing substrate layer (F) drawn from the work roll.

[0237] Meanwhile, the front bonding heating member (18000) may be spaced apart from the rear bonding heating member (17000) in the front-rear direction and positioned on the upper front side of the rotating bracket (11000). In one embodiment of the present invention, the front bonding heating member (18000) can perform the function of heat-bonding the leading edge of the printing substrate layer (F) drawn from the waiting roll and fixing it flat. As shown in FIG. 12(a), the front bonding heating member (18000) can perform heat bonding by contacting the upper surface of the printing substrate layer (F) drawn from the waiting roll, thereby temporarily fixing the upper surface of the printing substrate layer (F) drawn from the waiting roll and maintaining the printing substrate layer (F) in a state ready for transport.

[0239] In this configuration, the shear supply unit (10000) according to one embodiment of the present invention is such that, in a state where the first roll axis (14000) is located on the rear side of the rotating bracket (11000) and the second roll axis (15000) is located on the front side of the rotating bracket (11000), when the first roll (R1) is positioned on the first roll axis (14000) and the second roll (R2) is positioned on the second roll axis (15000), the printing substrate layer (F) unfolded from the first roll (R1) passes continuously through the lower supply unit transfer roll (16000-2) and the upper supply unit transfer roll (16000-1) and is transferred to the shear transfer unit (20000), and the leading edge of the printing substrate layer (F) unfolded from the second roll (R2) is heated by the front bonding heating member (18000). When the printing substrate layer (F) of the first roll (R1) is fixed and the printing substrate layer (F) of the first roll (R1) is exhausted, the front bonding heating member (18000) moves backward so that the end of the printing substrate layer (F) drawn from the first roll (R1) and the leading end of the printing substrate layer (F) drawn from the second roll (R2) can be heat-bonded.

[0241] Specifically, as illustrated in FIG. 12(a), when the printing substrate layer (F) of the work roll located on the first roll axis (14000) is exhausted, the shear supply unit (10000) moves the front bonding heating member (18000) in the rearward direction at the time when the end of the printing substrate layer (F) withdrawn from the work roll passes the rear bonding heating member (17000) to heat bond the end of the printing substrate layer (F) withdrawn from the work roll and the front end of the printing substrate layer (F) withdrawn from the standby roll. In particular, this roll replacement process can be performed automatically without the intervention of a worker, thereby minimizing interruptions in the production process and improving work efficiency.

[0242] That is, according to one embodiment of the present invention, during the roll replacement process, the shear supply unit (10000) can perform the function of connecting the end of the printing substrate layer (F) drawn from the work roll and the leading end of the printing substrate layer (F) drawn from the standby roll by means of the front bonding heating member (18000) and the rear bonding heating member (17000). With this configuration, the supply of the printing substrate layer (F) can be maintained continuously without interruption, and accordingly, the effect of simultaneously improving the quality and productivity of the electron beam processing process can be achieved.

[0244] Meanwhile, according to one embodiment of the present invention, the work supply unit, in a state where the first roll axis (14000) is located on the rear side of the rotating bracket (11000) and the second roll axis (15000) is located on the front side of the rotating bracket (11000), a first roll (R1) is placed on the first roll axis (14000) and a second roll (R2) is placed on the second roll axis (15000), and when the printing substrate layer (F) of the first roll (R1) is exhausted, the front bonding heating member (18000) moves to the rear so that the end of the first roll (R1) and the front end of the second roll (R2) are heat-bonded, the rotating bracket (11000) rotates around the bracket rotation axis (12000) by the operation of the bracket motor (13000), thereby the The positions of the first roll axis (14000) and the second roll axis (15000) can be switched with each other.

[0246] In this configuration, the shear supply unit (10000) can automatically perform the operation of switching the positions of the finished work roll and the standby roll by rotating the rotating bracket (11000) around the bracket rotation axis (12000) through the operation of the bracket motor (13000).

[0247] Specifically, the front roll axis (14000, 15000) (the second roll axis (15000) based on FIG. 12(a)), where the existing waiting roll is located, is moved to the rear side to function as a new work roll, and the rear roll axis (14000, 15000) (the first roll axis (14000) based on FIG. 12(a)), where the existing work roll is located, is moved to the front side to be replaced. Since this process is performed automatically without separate intervention by a worker, the supply of the printing substrate layer (F) can be maintained continuously without interruption.

[0248] In particular, according to one embodiment of the present invention, since the leading edge of the printing substrate layer (F) is already heat-bonded by the front bonding heating member (18000) and the rear bonding heating member (17000) to the standby roll, the transfer of the printing substrate layer (F) can be smoothly continued even at the moment when the positions between the work roll and the standby roll are switched, and no sudden change in tension and transfer speed can occur.

[0249] Therefore, after the positions of the work roll and the standby roll are switched, the operator only needs to perform the task of removing the worn-out roll located on the front roll axis (14000, 15000) and installing a new standby roll, so the burden on the operator in the entire process can be significantly reduced. In addition, since the transport of the printing substrate layer (F) is not interrupted during the roll replacement process, the irradiation quality in the electron beam irradiation unit (30000) can be maintained consistently, and as a result, the quality of the heat-resistant packaging film (F') can be prevented and production efficiency and product consistency can be greatly improved.

[0251] Below, the roll replacement process performed by the shear supply unit (10000) will be explained in more detail through FIGS. 13 to 15.

[0253] FIGS. 13 to 15 schematically illustrate the process of replacing the work roll of a shear supply unit (10000) according to one embodiment of the present invention.

[0255] FIG. 13(a) illustrates a case where the printing substrate layer (F) of the first roll (R1) is exhausted, in a state where the first roll (R1) is placed as a work roll on the first roll axis (14000) and the second roll (R2) is placed as a standby roll on the second roll axis (15000).

[0256] As shown in FIG. 13(a), a printing substrate layer (F) is drawn out from a second roll (R2) corresponding to a standby roll, and the leading edge of the printing substrate layer (F) drawn out from the second roll (R2) may be heat-bonded to a front bonding heating member (18000). At this time, when the first roll (R1) corresponding to a work roll is exhausted and the end side of the printing substrate layer (F) drawn out from the first roll (R1) passes through a rear bonding heating member (17000), the front bonding heating member (18000) may move backward in the direction of the arrow shown in FIG. 13(a).

[0258] FIG. 13(b) illustrates a case where the front bonding heating member (18000) moves to the rear side from the state of FIG. 13(a), and FIG. 14(a) illustrates an exemplary state where the rear bonding heating member (17000) moves forward from the state of FIG. 13(b) so that the end of the printing substrate layer (F) drawn from the work roll and the front end of the printing substrate layer (F) drawn from the standby roll are connected to each other.

[0259] As shown in FIG. 13(b), when the front bonding heating member (18000) moves to the rear, the leading edge of the printing substrate layer (F) drawn from the second roll (R2) can move to the rear side and be positioned to face the end of the printing substrate layer (F) drawn from the first roll (R1). Subsequently, when the rear bonding heating member (17000) moves in the direction of the arrow shown in FIG. 13(b), the end of the first roll (R1) and the leading edge of the second roll (R2) can be thermally bonded to each other as shown in FIG. 14(a).

[0260] This process can be performed automatically without the intervention of a worker, and in particular, when the first roll (R1) and the second roll (R2) include a polyethylene-based printing substrate layer (F), it is preferable that the front bonding heating member (18000) and the rear bonding heating member (17000) each be maintained in a state heated to a temperature of 100°C or higher.

[0261] Afterwards, as shown in FIG. 14(a), the front joining heating member (18000) and the rear joining heating member (17000) can each return to their original positions.

[0263] FIG. 14(b) illustrates a case where the rotating bracket (11000) rotates from the state of FIG. 14(a) so that the position of the first roll axis (14000) and the position of the second roll axis (15000) are switched with each other.

[0264] Specifically, in the state shown in FIG. 14(a), the rotating bracket (11000) rotates 180 degrees counterclockwise by driving the bracket motor (13000), thereby allowing the first roll (R1) (existing work roll) positioned on the first roll axis (14000) to move forward, and the second roll (R2) (existing standby roll) positioned on the second roll axis (15000) to move backward. Accordingly, the second roll (R2) is converted into a work roll, allowing the supply of the printing substrate layer (F) to be performed continuously.

[0265] In one embodiment of the present invention, the supply of the printing substrate layer (F) from the shear supply unit (10000) to the shear transfer unit (20000) may be temporarily interrupted while the rotating bracket (11000) is rotating, and the supply of the printing substrate layer (F) may be resumed after the rotation is completed.

[0266] At this time, even in sections where the printing substrate layer (F) is not additionally supplied, the shear transfer unit (20000) can stably maintain tension and transfer speed for the printing substrate layer (F) being transferred to the electron beam irradiation unit (30000). A detailed explanation of this tension maintenance configuration will be provided more specifically through the drawings described later.

[0268] FIG. 15(a) illustrates a state in which, after FIG. 14(b), the front bonding heating member (18000) and the rear bonding heating member (17000) return to their original positions, and the second roll (R2) supplies the printing substrate layer (F) as a work roll. As shown in FIG. 15(a), the exhausted first roll (R1) may still be placed on the first roll axis (14000), and the operator can achieve the state of FIG. 15(b) by removing the exhausted first roll (R1) from the first roll axis (14000) and mounting the third roll (R3).

[0269] Specifically, FIG. 15(b) illustrates a state in which the packaging material roll operates as a work roll and the third roll (R3) operates as a standby roll. As shown in FIG. 15(b), the operator can withdraw the printing material layer (F) from the third roll (R3) and heat-bond the leading edge to the front bonding heating member (18000) to temporarily fix it.

[0270] Through this preparation process, even if the second roll (R2) is exhausted, the third roll (R3) can be immediately switched to the work roll, and the continuity of the process and work efficiency can be improved.

[0272] FIG. 16 shows a digital image of the actual configuration of a shear supply unit (10000) according to one embodiment of the present invention.

[0273] At this time, in the state of Fig. 16, the shear supply unit (10000) corresponds to a digital image that captures the scene in which the printing substrate layer (F) is being transported while the work roll and the standby roll are installed simultaneously.

[0275] As illustrated in FIG. 16, a first roll (R1) corresponding to the working roll at this point in time may be installed on the first roll axis (14000), and a second roll (R2) corresponding to the waiting roll at this point in time may be installed on the second roll axis (15000). At this time, the printing substrate layer (F) withdrawn from the working roll can be continuously transported to the rear side through a plurality of supply transfer rolls (16000), and the printing substrate layer (F) withdrawn from the waiting roll can be seen to be in a waiting state with its leading end heat-bonded to the front bonding heating member (18000) and fixed.

[0277] In one embodiment of the present invention, as shown in FIG. 16, since a bracket rotation axis (12000) is connected to a rotating bracket (11000), the positions of the first roll axis (14000) and the second roll axis (15000) can be switched with each other by rotating the bracket rotation axis (12000) by rotating the bracket (11000) by the operation of the bracket motor (13000).

[0279] The plurality of supply transfer rolls (16000) may include an upper supply transfer roll (16000-1) and a lower supply transfer roll (16000-2), each of which can stably support the lower surface of the printing substrate layer (F). At this time, a rear bonding heating member (17000) may be disposed between the upper supply transfer roll (16000-1) and the lower supply transfer roll (16000-2).

[0280] In one embodiment of the present invention, when the printing substrate layer (F) drawn from the work roll is completely exhausted, the front bonding heating member (18000) moves backward to move the leading edge of the printing substrate layer (F) drawn from the standby roll to the rear side, and at the same time, the rear bonding heating member (17000) moves forward to heat-bond the printing substrate layer (F) between the work roll and the standby roll. Subsequently, by rotating the rotating bracket (11000) around the bracket rotation axis (12000), the positions of the existing work roll and the standby roll are swapped, the standby roll is converted into a new work roll, and the new standby roll can be mounted on the first roll axis (14000).

[0282] As a result, the shear supply unit (10000) in the digital image shown in FIG. 16 is an example of implementing the automated work roll replacement structure and non-stop continuous process maintenance function of the shear supply unit (10000) described above through FIG. 13 to 15 at the actual equipment level, and can be visually confirmed that tension maintenance and roll replacement are stably performed even during the process of continuously supplying the printing substrate layer (F).

[0284] FIG. 17 schematically illustrates a side view of a shear transfer unit (20000) according to one embodiment of the present invention.

[0286] According to one embodiment of the present invention, the shear transfer unit (20000) may include: an upper support structure (21000) extending in the front-rear direction and located on the upper side; a lower support structure (22000) extending in the front-rear direction and located on the lower side; a plurality of upper transfer unit transfer rolls (23000) rotatably supported by the upper support structure (21000) and each spaced apart from each other along the front-rear direction; and a plurality of lower transfer unit transfer rolls (24000) rotatably supported by the lower support structure (22000) and each spaced apart from each other along the front-rear direction.

[0287] A shear transfer unit (20000) having such a configuration can operate in any one of the following modes: a normal transfer mode in which a packaging material unfolded from the shear supply unit (10000) is transferred to an electron beam irradiation unit (30000) at a preset tension and transfer speed by moving along the plurality of upper transfer unit transfer rolls (23000) and the plurality of lower transfer unit transfer rolls (24000); and a tension maintenance mode in which, while the unfolding of the printing substrate layer (F) from the shear supply unit (10000) is interrupted, the upper support structure (21000) moves downward and the lower support structure (22000) moves upward, thereby shortening the transfer path of the printing substrate layer (F) and transferring the packaging material to an electron beam irradiation unit (30000) at a preset tension and transfer speed.

[0289] FIG. 17(a) is a diagram exemplarily illustrating the shear transfer unit (20000) according to one embodiment of the present invention when it is in a normal transfer mode, and FIG. 17(b) is a diagram exemplarily illustrating the shear transfer unit (20000) according to one embodiment of the present invention when it is in a tension maintenance mode.

[0291] As described above, the shear transfer unit (20000) is configured to transfer a printing substrate layer (F) supplied from the shear supply unit (10000) to an electron beam irradiation unit (30000) with a constant tension and transfer speed. To this end, the shear transfer unit (20000) may include an upper support structure (21000), a lower support structure (22000), a plurality of upper transfer unit transfer rolls (23000), and a plurality of lower transfer unit transfer rolls (24000).

[0292] As illustrated in FIGS. 17(a) and FIGS. 17(b), the upper support structure (21000) may be a support frame that extends in the front-rear direction and is positioned on the upper side. Preferably, the upper support structure (21000) is positioned as a pair spaced apart from left to right. Additionally, the lower support structure (22000) may be a support frame positioned on the lower side at a position opposite to the upper support structure (21000). Preferably, the lower support structure (22000) is positioned as a pair spaced apart from left to right.

[0293] As illustrated in FIG. 17(a) and FIG. 17(b), each of the plurality of upper transfer rollers (23000) may be spaced apart by a predetermined interval along the front-rear direction of the upper support structure (21000), and each of the plurality of lower transfer rollers (24000) may be spaced apart by a predetermined interval along the front-rear direction of the lower support structure (22000).

[0294] With this structure, when the shear transfer unit (20000) operates in a normal transfer mode, the printing substrate layer (F) continuously supplied from the shear supply unit (10000) can be stably transferred to the electron beam irradiation unit (30000) located at the rear side while maintaining a preset tension and transfer speed as it alternately passes through the plurality of upper transfer unit transfer rolls (23000) and the plurality of lower transfer unit transfer rolls (24000).

[0295] At this time, the vertical distance between the upper support member and the lower support member in the normal transfer mode as shown in Fig. 17(a) can be referred to as the normal distance.

[0297] Meanwhile, FIG. 17(b) illustrates an exemplary state in which the shear transfer unit (20000) operates in a tension-maintaining mode. The tension-maintaining mode may be a mode performed by the shear transfer unit (20000) when the supply of the printing substrate layer (F) is temporarily interrupted due to reasons such as a roll replacement process in the shear supply unit (10000). In one embodiment of the present invention, in the tension-maintaining mode, the upper support structure (21000) moves downward and the lower support structure (22000) moves upward, so that the path along which the printing substrate layer (F) is transferred can be shortened.

[0299] The vertical distance between the upper support member and the lower support member in the tension maintenance mode as shown in FIG. 17(b) can be referred to as the tension gap, and it is preferable that the tension gap be narrower than the normal gap.

[0300] Even if the supply of the printing substrate layer (F) from the shear supply unit (10000) to the shear transfer unit (20000) is temporarily interrupted, the principle that the shear transfer unit (20000) can maintain tension and transfer speed may be that the loss of tension can be structurally compensated as the total travel path length of the printing substrate layer (F) is shortened.

[0302] Specifically, in a normal transfer mode, the printing substrate layer (F) moves along a relatively long transfer path while crossing a plurality of upper transfer rollers (23000) and a plurality of lower transfer rollers (24000) vertically, and at this time, the printing substrate layer (F) can be transferred under constant tension and transfer speed.

[0303] However, when the packaging material roll (work roll) to which the printing substrate layer (F) is supplied is exhausted, the supply of the printing substrate layer (F) can be temporarily stopped while switching the positions of the work roll and the standby roll by rotating the rotating bracket (11000) in the shearing supply unit (10000). If the existing transport path is maintained in this state, the printing substrate layer (F) will be pulled along the same length of the transport path without additional supply, causing the tension to rise rapidly, and there is a risk that the film will break or the transport speed will become unstable.

[0304] Accordingly, in one embodiment of the present invention, by switching the shear transfer unit (20000) to a tension transfer mode, the upper support structure (21000) is moved downward and at the same time the lower support structure (22000) is moved upward, thereby gradually shortening the transfer path through which the printing substrate layer (F) passes.

[0305] With this structural adjustment, the printing substrate layer (F) is transported over a shorter transport distance than before, so the consumption of the printing substrate layer (F) is reduced during the same period of time, and even when the supply of the printing substrate layer (F) is interrupted, the transport of the printing substrate layer (F) can be maintained at a constant level without sudden fluctuations in tension and speed.

[0306] That is, the shear transfer unit (20000) can buffer changes in tension and transfer speed of the printing substrate layer (F) by only shortening the transfer path of the printing substrate layer (F) even when there is no temporary supply of additional printing substrate layer (F), thereby preventing breakage of the printing substrate layer (F) and suppressing wrinkle formation during transfer, so that the electron beam irradiation amount is kept constant, thereby producing the effect of maintaining the quality of the heat-resistant packaging film (F').

[0308] In addition, preferably, the transition from normal transfer mode to tension maintenance mode is not made abruptly, but is made slowly at a constant speed.

[0309] This may be intended to suppress a rapid increase in tension and minimize the tensile stress applied to the printing substrate layer (F) to prevent film damage and quality degradation. In one embodiment of the present invention, the goal may be to control the switching speed to the tension maintenance mode so that the rate of change in tension becomes below a preset threshold value.

[0311] Meanwhile, referring to FIG. 10, the upper support structure (21000) and the lower support structure (22000) are shown in close contact with each other in both the front transfer section (20000) and the rear transfer section (40000) in FIG. 10, but this is a schematic diagram of a closed state for convenience of explanation. That is, in the actual process operation state, it is preferable that the upper support structure (21000) and the lower support structure (22000) be spaced apart at a certain distance, and this may be so that the distance between the support structures is adjusted to a normal distance or a tension distance, respectively, in the normal transfer mode or the tension maintenance mode, thereby stably maintaining the transfer tension and speed of the printing substrate layer (F).

[0313] FIG. 18 schematically illustrates a perspective view of an electron beam irradiation unit (30000) according to one embodiment of the present invention, and FIG. 19 schematically illustrates a cross-sectional structure of an irradiation area unit (32000) of an electron beam irradiation unit (30000) according to one embodiment of the present invention.

[0315] According to one embodiment of the present invention, the electron beam irradiation unit (30000) may include: an electron beam generating unit (31000) that generates and accelerates an electron beam; an irradiation area unit (32000) that induces the electron beam generated by the electron beam generating unit (31000) to be irradiated onto a packaging material; and a vacuum maintaining unit (33000) that maintains the inside of the irradiation area unit (32000) in a vacuum state.

[0316] At this time, the above-mentioned irradiation area unit (32000) may include: a shielding module (32100) for shielding the irradiation area of ​​the electron beam from the outside; a plurality of outer transfer rolls (32300) disposed on the outside of the shielding module (32100) and supporting and guiding the entry and exit of the printing substrate layer (F); a plurality of inner transfer rolls (32400) disposed on the inside of the shielding module (32100) and guiding the packaging material to move along the irradiation area; and an irradiation guide plate (32500) that assists in uniformly irradiating the electron beam onto the surface of the packaging material.

[0318] As described above, the electron beam irradiation unit (30000) is configured to irradiate an electron beam onto one surface of a printing substrate layer (F) to induce cross-linking in the polymer chain structure of the printing substrate layer (F), thereby improving the heat resistance performance of the printing substrate layer (F). Hereinafter, the printing substrate layer (F) with improved heat resistance performance by the electron beam irradiation unit (30000) will be referred to as a heat-resistant packaging film (F'). In one embodiment of the present invention, the electron beam irradiation unit (30000) receives the printing substrate layer (F) from a front-end transfer unit (20000) positioned at the front end of the process direction, irradiates an electron beam onto the printing substrate layer (F) to convert it into a heat-resistant packaging film (F'), and then discharges it to a rear-end transfer unit (40000) positioned at the rear end of the process direction.

[0320] In one embodiment of the present invention, the electron beam irradiation unit (30000) may include an electron beam generating unit (31000), an irradiation area unit (32000), a vacuum maintaining unit (33000), a thermal management unit (34000), and a platform unit (35000).

[0321] The platform unit (35000) may include a platform spaced upward from the ground and parallel to the floor, and a ladder that allows a worker to go up or down to the platform. The platform unit (35000) may provide a space for the electron beam generating unit (31000), irradiation area unit (32000), vacuum maintenance unit (33000), and heat management unit (34000) included in the electron beam irradiation unit (30000) to be placed and supported.

[0323] The electron beam generating unit (31000) performs the role of generating and accelerating an electron beam to be irradiated onto a printing substrate layer (F). More specifically, the electron beam generating unit (31000) may include a high-voltage power supply (31100), a high-voltage control box (31200), an acceleration chamber (31300), and an electrical control box (31400). The high-voltage power supply (31100) provides a high voltage required for electron beam acceleration, and the high-voltage control box (31200) can perform the function of finely adjusting the applied voltage. Additionally, the acceleration chamber (31300) provides a physical space for accelerating the electron beam at high speed, and the electrical control box (31400) can perform the function of controlling and monitoring the entire electron beam generating unit (31000).

[0324] In particular, the electron beam generating unit (31000) may include a scan box (31500). The scan box (31500) may be connected to the bottom of the acceleration chamber (31300) and may be configured in a box shape to supply the accelerated electron beam to the irradiation area unit (32000). Additionally, the scan box (31500) may perform the function of scanning the electron beam to uniformly distribute the accelerated electron beam to the irradiation area.

[0326] The above-mentioned irradiation area corresponds to a configuration that provides a space for directly irradiating an electron beam onto one surface of a printing substrate layer (F). The above-mentioned irradiation area may include a shielding module (32100), a shielding lifting module (32200), a plurality of outer transfer rolls (32300), a plurality of inner transfer rolls (32400), and an irradiation guide plate (32500).

[0327] Specifically, the shielding module (32100) can perform the function of physically shielding the irradiation area so that the electron beam does not leak to the outside. In addition, the shielding lifting module (32200) corresponds to a configuration that raises or lowers the position of the shielding modules.

[0328] Additionally, the plurality of outer transfer rolls (32300) may be configured to be positioned on the outside of the shielding module (32100) to support a printing substrate layer (F) introduced into the inside of the shielding module (32100) or a heat-resistant packaging film (F') discharged to the outside of the shielding module (32100). Likewise, the plurality of inner transfer rolls (32400) may be configured to be positioned on the inside of the shielding module (32100) to support a printing substrate layer (F) on the inside of the shielding module (32100).

[0329] The above irradiation guide plate (32500) can be positioned so as to be aligned with the area where the electron beam is directly irradiated inside the shielding module (32100). By positioning the irradiation guide plate (32500) along the transport path of the printing substrate layer (F), it can assist in maintaining the surface where the electron beam is irradiated flat and perform the function of inducing the electron beam irradiation area to be uniformly distributed over the entire printing substrate layer (F). Through this, it is possible to prevent the phenomenon where only a part of the printing substrate layer (F) is excessively irradiated with the electron beam or where some parts are not irradiated with the electron beam, and the heat resistance of the printing substrate layer (F) can be uniformly improved.

[0330] Through such a configuration, the irradiation area unit (32000) according to one embodiment of the present invention maintains a safe environment without external leakage even while the printing substrate layer (F) is irradiated, can transport the printing substrate layer (F) under uniform tension and path, and can stably secure the quality of heat resistance characteristics by ensuring that the electron beam is uniformly irradiated over the entire printing substrate layer (F).

[0332] The above vacuum maintenance unit (33000) performs the function of maintaining a vacuum state inside the irradiation area and the acceleration chamber (31300). Specifically, the vacuum maintenance unit (33000) may include a valve plate (33100), a molecular pump (33200), and a mechanical pump (33400). This configuration operates in stages to lower the pressure inside the irradiation area and maintain a vacuum environment so that a high-speed moving electron beam can be stably irradiated onto one side of the printing substrate layer (F) without colliding with air.

[0334] The above thermal management unit (34000) can perform the function of controlling heat generated throughout the electron beam irradiation unit (30000) and maintaining the internal temperature stably. In one embodiment of the present invention, the thermal management unit (34000) may include a blower (34100), an exhaust fan (34200), an exhaust pipe (34300), an air supply pipe (34400), and a cooling water pump (34500). The blower (34100) and the exhaust fan (34200) can discharge heat around the irradiation unit to the outside, the exhaust pipe (34300) and the air supply pipe (34400) can induce the circulation of external air, and the cooling water pump (34500) can prevent overheating caused by heating and support the stable operation of the device by circulating cooling water to high-temperature components around the acceleration chamber (31300) and the electron beam generating unit.

[0336] Meanwhile, in one embodiment of the present invention, the electron beam irradiation unit (30000) preferably has the following irradiation conditions.

[0337] Specifically, the electron beam can be accelerated with a current of about 0 to 150 mA and irradiated to have an irradiation width of 100 to 1400 mm. In addition, the irradiation area unit (32000) of the electron beam irradiation unit (30000) is approximately 8.0 x 10 -5 It can be maintained in a vacuum state of Pa or less, and the amount of radiation leakage to the printing substrate layer (F) passing through the irradiation area can be limited to 2.5 μSv / h or less. The entire system can be operated under conditions of AC 380V, 60Hz, and the pump and control unit can be operated according to AC 220V or 3A standards.

[0338] According to one embodiment of the present invention, more preferably, the electron beam has an energy of about 150 keV, is irradiated with a current of 120 to 150 mA, and can be irradiated onto a printing substrate layer (F) under a transport speed of 13.5 to 67 m / min. In this case, the amount of electron beam irradiation can be adjusted to 30 to 150 kGy depending on the transport speed of the printing substrate layer (F), and the tension applied to the printing substrate layer (F) can be set to a range of 10 to 50 kg.

[0339] Most preferably, the electron beam is accelerated to 150 keV and approximately 135 mA, irradiated onto a printing substrate layer (F) with a width of 1000 mm, and the irradiation dose can be maintained in the range of 50 to 70 kGy. In this case, the irradiation area is approximately 5.0 x 10 -5 By operating under conditions of a vacuum of Pa and a radiation leakage of about 2.0 μSv / h or less, the heat resistance performance of the printing substrate layer (F) can be improved stably and uniformly.

[0341] FIG. 20 schematically illustrates the steps of a continuous processing manufacturing method performed by an electron beam processing unit (100) according to one embodiment of the present invention.

[0343] As described above, the electron beam processing unit (100) comprises: a shear supply unit (10000) that unfolds a printing substrate layer (F) from a packaging material roll and supplies it to the rear; a shear transfer unit (20000) that is subsequently arranged continuously in the shear supply unit (10000) and transfers the printing substrate layer (F) supplied from the shear supply unit (10000) to the rear side through a plurality of transfer unit transfer rolls; an electron beam irradiation unit (30000) that is subsequently arranged continuously in the shear transfer unit (20000) and irradiates an electron beam corresponding to an accelerated electron onto the packaging material transferred by the shear transfer unit (20000); and a rear transfer unit (40000) that is subsequently arranged continuously in the electron beam irradiation unit (30000) and transfers the printing substrate layer (F) that has passed through the electron beam irradiation unit (30000) to the rear side through a plurality of transfer rolls. and may include a rear winding unit (50000) that is subsequently and continuously arranged in the rear transfer unit (40000) and winds the printing material layer (F) transferred through the rear transfer unit (40000).

[0344] In this configuration, a method for manufacturing a continuous processing of a printing substrate layer (F) using an electron beam processing unit (100) for packaging materials comprises: a unfolding step (S100) in which the printing substrate layer (F) is unfolded from a packaging material roll by the shear supply unit (10000); a first transfer step (S200) in which the printing substrate layer (F) unfolded from the shear supply unit (10000) is transferred by the shear transfer unit (20000); an electron beam irradiation step (S300) in which an electron beam is irradiated onto the printing substrate layer (F) transferred from the shear transfer unit (20000) by the electron beam irradiation unit (30000); and a second transfer step (S400) in which the printing substrate layer (F) that has passed through the electron beam irradiation unit (30000) is transferred by the rear transfer unit (40000). and a winding step (S500) for winding the printing material layer (F) transferred from the rear transfer unit (40000) by the rear winding unit (50000).

[0345] According to this manufacturing method, when an electron beam is irradiated onto the printing substrate layer (F) by the electron beam irradiation step (S300), the heat resistance performance of the printing substrate layer (F) can be improved by the detachment of hydrogen radicals and the formation of cross-linking between carbons in the printing substrate layer (F).

[0347] According to one embodiment of the present invention, through the manufacturing method, a cross-linking bond that improves the heat resistance performance of the printing substrate layer (F) can be stably formed, and continuous transfer and processing are possible throughout the entire process, thereby enabling the simultaneous achievement of productivity and quality stability.

[0349] FIG. 21 schematically illustrates a work roll replacement step performed by a shear supply unit (10000) and a shear transfer unit (20000) according to one embodiment of the present invention.

[0351] According to one embodiment of the present invention, the invention relates to a continuous processing method performed in conjunction in a shear supply unit (10000) and a shear transfer unit (20000) of an electron beam processing unit (100) for packaging materials, wherein the method comprises a normal transfer step in which a first roll (R1) is placed on a roll axis (14000, 15000) located on the rear side of a rotating bracket (11000), a printing substrate layer (F) is drawn out from the first roll (R1) and unfolded through the shear supply unit (10000), and the shear transfer unit (20000) is operated in a normal transfer mode to transfer the printing substrate layer (F) to an electron beam irradiation unit (30000); A packaging material preparation step in which a second roll (R2) is placed on a roll axis (14000, 15000) located on the front side of a rotating bracket (11000), and the leading edge of a printing substrate layer (F) drawn out from the second roll (R2) is thermally fixed to a front bonding heating member (18000); and a packaging material bonding step in which, at the point when the printing substrate layer (F) of the first roll (R1) is exhausted, the end of the first printing substrate layer (F) and the leading edge of the second printing substrate layer (F) are thermally bonded using a rear bonding heating member (17000) and a front bonding heating member (18000). The process may include: a step in which the rotating bracket (11000) rotates so that the second roll (R2) moves to the rear side and the first roll (R1) moves to the front side, and during rotation, the unfolding of the printing substrate layer (F) from the shear supply unit (10000) is temporarily stopped, and at the same time, the shear transfer unit (20000) switches to a tension maintenance mode to maintain the transfer speed and tension of the printing substrate layer (F); a transfer resumption step in which the rotation of the rotating bracket (11000) is completed so that the printing substrate layer (F) is withdrawn from the second roll (R2) and supplied to the shear transfer unit (20000) through the shear supply unit (10000), and the shear transfer unit (20000) returns from the tension maintenance mode to the normal transfer mode; and a process repetition step in which the process from the normal transfer step to the transfer resumption step is repeatedly performed.

[0353] According to one embodiment of the present invention, a printing substrate layer (F) is drawn out and unfolded from a work roll by a shear supply unit (10000), and a normal transfer step (S1000) is performed in which the unfolded printing substrate layer (F) is operated in a normal transfer mode by a shear transfer unit (20000).

[0354] Subsequently, a waiting roll may be installed on the second roll axis (15000), and a waiting packaging material preparation step (S2000) may be performed in which the leading edge of the printing material layer (F) drawn from the waiting roll is thermally attached to the front bonding heating member (18000). In one embodiment of the present invention, the waiting packaging material preparation step (S2000) may be performed manually by an operator. In one embodiment of the present invention, the step performs the function of preventing a decrease in productivity when replacing rolls by preparing the next work roll in advance.

[0355] Subsequently, a packaging material bonding step (S3000) may be performed to maintain a continuous flow of the printing material layer (F) by heat-bonding the end of the printing material layer (F) drawn from the work roll and the leading end of the printing material layer (F) drawn from the standby roll. In one embodiment of the present invention, when the printing material layer (F) is a PE-based single material, it is preferable that the front and rear bonding heating members be maintained at a temperature of 100°C or higher.

[0356] Afterward, the shear supply unit (10000) may temporarily stop the unfolding of the printing substrate layer (F) and perform a switching stop step (S4000) by rotating the rotating bracket (11000) to switch the positions of the work roll and the standby roll. At this time, the shear transfer unit (20000) may switch to a tension maintenance mode and perform an operation to maintain the tension and transfer speed of the printing substrate layer (F) at a constant level.

[0357] When the position switching between the first roll (R1) and the second roll (R2) is completed by the above switching stop step (S4000), the shear supply unit (10000) resumes the unfolding of the printing substrate layer (F) from the second roll (R2), and the shear transfer unit (20000) returns from the tension maintenance mode to the normal transfer mode, thereby performing a transfer resumption step (S5000). As a result, the transfer of the printing substrate layer (F) returns to a normal state.

[0358] Afterwards, a process repetition step (S60000) of continuously transporting and processing the printing substrate layer (F) by repeating the above series of steps can be performed.

[0360] That is, in one embodiment of the present invention, the process of switching the packaging material roll from the waiting roll to the work roll is performed automatically by the method described above, and at this time, the tension and transfer speed of the printing substrate layer (F) can be maintained at a constant level.

[0361] As described above, since the amount of electron beam irradiation applied to the printing substrate layer (F) can be determined by the tension and transport speed of the printing substrate layer (F), maintaining the tension and transport speed of the printing substrate layer (F) constant can be very important in determining the quality of the heat-resistant packaging film (F').

[0362] That is, according to one embodiment of the present invention, the electron beam processing unit (100) performs a continuous processing method in conjunction with the aforementioned shear supply unit (10000) and shear transfer unit (20000), thereby ensuring process continuity even when changing rolls, and stably maintaining tension and transfer speed when transferring the printing substrate layer (F), so that quality uniformity of the heat-resistant packaging film (F') can be ensured.

[0364] According to one embodiment of the present invention, as the packaging film passes through the electron beam irradiation unit, an accelerated electron beam is irradiated, thereby inducing hydrogen radical detachment and carbon-to-carbon cross-linking, and as a result, the heat resistance of the packaging film can be improved.

[0365] According to one embodiment of the present invention, the packaging film is configured to be continuously processed and wound while sequentially passing through a shear supply unit, a shear transfer unit, an electron beam irradiation unit, a rear transfer unit, and a rear winding unit, thereby enabling the effect of improving the stability of the production process and production efficiency.

[0366] According to one embodiment of the present invention, the shear supply unit is configured to automatically bond the leading edge and the trailing edge using a front bonding heating member and a rear bonding heating member even when the packaging roll is replaced, thereby enabling the continuous maintenance of the packaging film transport without interruption.

[0367] According to one embodiment of the present invention, the front end transfer unit and the rear end transfer unit include a plurality of transfer rolls and support structures, and by supporting a tension maintenance mode, the tension of the packaging film can be stably controlled, thereby enabling the effect of maintaining uniform quality during electron beam irradiation.

[0368] According to one embodiment of the present invention, the electron beam irradiation unit includes a shielding module and a vacuum maintenance unit to shield the irradiation area of ​​the electron beam and maintain a stable irradiation environment, thereby preventing radiation leakage to the outside and improving the efficiency of electron beam irradiation.

[0369] According to one embodiment of the present invention, the electron beam irradiation unit is configured to adjust the irradiation amount for packaging films of various thicknesses and materials, thereby enabling the effect of ensuring applicability to packaging materials of various specifications.

[0370] According to one embodiment of the present invention, the entire process is configured to be continuous in a roll-to-roll manner so that packaging film can be processed at high speed, thereby improving manufacturing productivity and reducing production costs.

[0372] Although the embodiments have been described above with reference to limited examples and drawings, those skilled in the art can make various modifications and variations from the description above. For example, suitable results may be achieved even if the described techniques are performed in a different order than described, and / or if the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents. Therefore, other implementations, other embodiments, and equivalents to the claims below are also within the scope of the claims. Explanation of the symbols

[0374] 1: Packaging film 1f: Top film 1b: Bottom film 1000: Multilayer PE layer 1000f: First multilayer PE layer 1000b: 2nd multilayer PE layer 1001: 1st PE layer 1002: 2nd PE layer 1003: 3rd PE layer 1004: 4th PE Layer 1005: 1st Tie Layer 1006: EVOH layer 1007: Second tie layer 1008: 5th PE layer 1009: 6th PE layer 1010: 7th PE layer 1011: 8th PE layer 2000: Print layer 2000f: First print layer 2000b: Second printing layer 2100: Heat-resistant printing substrate layer 2100f: First heat-resistant printing substrate layer 2100': Printing substrate layer 2: Envelope-type packaging 10: Envelope-type packaging material manufacturing device 100: Electron beam processing unit 200: Printing processing unit 300: Film Manufacturing Department 400: Cutting Department 500: Sealing part 10000: Shear supply unit 11000: Rotating bracket 12000: Bracket rotation axis 13000: Bracket motor 14000: 1st Roll Axis 15000: 2nd Roll Axis 16000: Multiple feed section transfer rolls 16000-1: Upper feed section transfer roll 16000-2: Lower supply section transfer roll 17000: Rear joining heating member 18000: Front joining heating member 20000: Shear transfer part 21000: Upper support structure 22000: Lower support structure 23000: Multiple upper transfer section transfer rolls 24000: Multiple lower transfer section transfer rolls 30000: Electron beam irradiation unit 31000: Electron beam generation unit 31100: High-voltage power supply 31200: High-voltage regulator 31300: Acceleration Chamber 31400: Electrical Control Box 31500: Scan Box 32000: Inspection Area 32100: Shielding Module 32200: Shielding Lift Module 32300: Outer transfer roll 32400: Inner transfer roll 32500: Irradiation guide plate 33000: Vacuum maintenance unit 33100: Valve plate 33200: Molecular pump 33300: Ion pump 33400: Mechanical pump 34000: Thermal management unit 34100: Blower 34200: Exhaust fan 34300: Exhaust pipe 34400: Supply pipe 34500: Cooling water pump 35000: Platform Unit 40000: Rear Transfer Unit 50000: Rear winding attachment R1: First Roll R2: The 2nd Roll R3: The 3rd Roll S10: Electron beam processing step S20: Print forming step S30: Film lamination step S40: Sealing step S100: Deployment phase S200: First transfer phase S300: Investigation Phase S400: Second Transfer Phase S500: Winding stage S1000: Normal transfer stage S2000: Waiting packaging material preparation stage S3000: Packaging material joining stage S4000: Switching stop stage S5000: Transfer resumption step S6000: Process repetition step

Claims

Claim 1 An envelope-type packaging material comprising: a first multilayer PE layer comprising a plurality of PE layers comprising polyethylene (PE); and a first printing layer comprising a first heat-resistant printing substrate layer comprising PE and having a printing area formed on an inner surface; an upper film comprising; and a second multilayer PE comprising a plurality of PE layers comprising polyethylene (PE). A bottom film comprising: a second printing layer including a second heat-resistant printing substrate layer comprising PE and having a printing area formed on an inner surface; wherein the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer are each formed by irradiating an electron beam onto a printing substrate layer, and the melting point of each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer is 140 to 200°C, and the melting point of each of the first multilayer PE layer and the second multilayer PE layer is 105 to 125°C, and the envelope-type packaging material, in a state where the first printing layer, the first multilayer PE layer, the second multilayer PE layer, and the second printing layer are laminated, the edges are pressed with a heating member heated to a temperature lower than the melting point of each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer, so that the edge portions of the first multilayer PE layer and the second multilayer PE layer are thermally deformed and bonded, and the first printing layer and the An envelope-type packaging material wherein the edges of the second printed layer are not deformed, and each of the first multilayer PE layer and the second multilayer PE layer comprises 95 to 99 weight% PE, 1 to 5 weight% EVOH, and 0.5 to 2 weight% of an additive including an anti-blocking agent and a slip agent based on the total weight of each of the first multilayer PE layer and the second multilayer PE layer, wherein the total sum of the EVOH and additive components is less than 5 weight%, and the remainder excluding the EVOH and additives from the 100 weight% is made of PE. Claim 2 The envelope-type packaging material according to claim 1, wherein the printing substrate layer comprises either MDOPE (Machine Direction Oriented Polyethylene) or BOPE (Bi-axially Oriented Polyethylene). Claim 3 An envelope-type packaging material according to claim 1, wherein the first heat-resistant printing substrate layer improves heat resistance characteristics by irradiating an electron beam using an electron beam processing unit on a printing substrate layer, forms a printing area on the inner surface of the first heat-resistant printing substrate layer after electron beam irradiation, performs lamination by applying an adhesive between the first printing layer and the first multilayer PE layer, removes a volatile solvent, and cures the adhesive, thereby forming the first printing layer and the first multilayer PE layer into a single upper surface film. Claim 4 In claim 3, the envelope-type packaging material is manufactured from a single packaging film formed in a state where a plurality of upper films and a plurality of lower films are alternately arranged continuously, and the packaging film is cut along the contact area between the upper edge of each upper film and the upper edge of the lower film adjacent to the upper edge of each upper film, and the lower edge of each upper film and the lower edge of the lower film adjacent to the lower edge of each upper film are not cut, and the upper film and the lower film adjacent to each upper film are folded in a stacked state so as to face each other, and the side edges of each upper film and the lower film stacked to face each upper film are heated and compressed using a sealing bar to manufacture an envelope-type packaging material. Claim 5 An envelope-type packaging material according to claim 3, wherein the electron beam processing unit irradiates the printing substrate layer with an electron beam of 30 to 150 kGy under a reference voltage of 120 to 150 mA while passing the printing substrate layer at a speed of 13 to 70 m / min. Claim 6 delete Claim 7 A method for manufacturing an envelope-type packaging material, wherein the envelope-type packaging material comprises: a first multilayer PE layer comprising a plurality of PE layers comprising polyethylene (PE); and a first printing layer comprising a first heat-resistant printing substrate layer comprising PE and having a printing area formed on an inner surface; an upper surface film comprising; and a second PE multilayer comprising a plurality of PE layers comprising polyethylene (PE). A bottom film comprising: a second printing layer comprising a second heat-resistant printing substrate layer having a printing area formed on an inner surface and including PE; wherein the melting point of each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer is 140 to 200°C, and the melting point of each of the first multilayer PE layer and the second multilayer PE layer is 105 to 125°C, and each of the first multilayer PE layer and the second multilayer PE layer comprises 95 to 99 weight% PE, 1 to 5 weight% EVOH, and 0.5 to 2 weight% of an additive including an anti-blocking agent and a slip agent based on the total weight of each of the first multilayer PE layer and the second multilayer PE layer, wherein the total sum of the EVOH and additive components is less than 5 weight%, and the remainder excluding the EVOH and additives from the 100 weight% is composed of PE, and the manufacturing method comprises irradiating an electron beam onto a printing substrate layer, thereby the first heat-resistant printing substrate layer and A method for manufacturing an envelope-type packaging material, comprising: an electron beam treatment step for forming a second heat-resistant printing substrate layer; a printing formation step for forming a first printing layer and a second printing layer by forming a printing area on each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer; a film lamination step for forming a packaging film by applying an adhesive between the first heat-resistant printing substrate layer and the first multilayer PE layer and between the second heat-resistant printing substrate layer and the second multilayer PE layer to perform lamination, and curing the adhesive by removing a volatile solvent contained in the adhesive; a cutting step for cutting the packaging film to a predetermined size; and a sealing step for forming an envelope shape by sealing the inner surfaces of the cut packaging film together. Claim 8 A method for manufacturing a bag-type packaging material using a bag-type packaging material manufacturing device, wherein the bag-type packaging material comprises: a first multilayer PE layer comprising a plurality of PE layers comprising polyethylene (PE); and a first printing layer comprising a first heat-resistant printing substrate layer comprising PE and having a printing area formed on an inner surface; an upper surface film comprising; and a second PE multilayer comprising a plurality of PE layers comprising polyethylene (PE). A bottom film comprising: a second printing layer comprising a second heat-resistant printing substrate layer having a printing area formed on an inner surface and including PE; wherein the melting point of each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer is 140 to 200°C, the melting point of each of the first multilayer PE layer and the second multilayer PE layer is 105 to 125°C, and each of the first multilayer PE layer and the second multilayer PE layer comprises 95 to 99 weight% PE, 1 to 5 weight% EVOH, and 0.0% of an additive including an anti-blocking agent and a slip agent, based on the total weight of each of the first multilayer PE layer and the second multilayer PE layer.A bag-type packaging material manufacturing device comprises: an electron beam processing unit that forms a first heat-resistant printing substrate layer and a second heat-resistant printing substrate layer with improved heat resistance properties by irradiating an electron beam onto a printing substrate layer; a printing processing unit that forms a first printing layer by forming a printing area on the inner surface of the first heat-resistant printing substrate layer and forms a second printing layer by forming a printing area on the inner surface of the second heat-resistant printing substrate layer to perform lamination by applying an adhesive between the first heat-resistant printing substrate layer and the first multilayer PE layer and between the second heat-resistant printing substrate layer and the second multilayer PE layer, and forms a packaging film by curing the adhesive by removing a volatile solvent contained in the adhesive; and a cutting unit that cuts the packaging film to a preset size. The manufacturing method comprises: an electron beam treatment step of forming a first heat-resistant printing substrate layer and a second heat-resistant printing substrate layer by irradiating an electron beam onto a printing substrate layer; a printing formation step of forming a first printing layer and a second printing layer by forming a printing area on each of the first heat-resistant printing substrate layer and the second heat-resistant printing substrate layer; a film lamination step of forming a packaging film by applying an adhesive between the first heat-resistant printing substrate layer and the first multilayer PE layer and between the second heat-resistant printing substrate layer and the second multilayer PE layer to perform lamination, and curing the adhesive by removing a volatile solvent contained in the adhesive; and a cutting step of cutting the packaging film to a predetermined size. A method for manufacturing an envelope-shaped packaging material, comprising: a sealing step of forming an envelope shape by sealing the inner surfaces of the cut packaging film together.

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