AEC Integrated X-ray Detector

Abstract

The present disclosure provides an AEC integrated X-ray detector comprising an X-ray detector unit that detects X-rays incident from an X-ray source and generates X-ray image data, and an automatic exposure detection board located below the X-ray detector unit and generating an X-ray sensing signal for automatic exposure control based on residual X-rays that have passed through the X-ray detector unit.

Description

Technology Field

[0001] The present invention relates to an AEC integrated X-ray detector, and more specifically, to an AEC integrated X-ray detector that detects X-rays irradiated onto a subject, generates X-ray image data, and generates an X-ray sensing signal for automatic exposure control. Background Technology

[0002] When taking X-rays, an Automatic Exposure Control (AEC) system is used to adjust the X-ray dose based on the subject's gender, age, and body part.

[0003] In conventional X-ray imaging systems, the irradiated X-rays enter the X-ray detector after passing through the automatic exposure control device. Consequently, there is a problem in which the sensors of the automatic exposure control device appear as afterimages in the X-ray image.

[0004] In addition, since the automatic exposure control device and the X-ray detector exist separately, there is a problem requiring additional equipment to maintain a constant position of each other during X-ray imaging.

[0005] Therefore, there is a growing need to integrate the automatic exposure control device with the X-ray detector. The problem to be solved

[0006] The problem that the present disclosure aims to solve is to provide an AEC-integrated X-ray detector that prevents sensors of an automatic exposure control device, etc., from appearing as afterimages in X-ray images.

[0007] The problem that the present disclosure aims to solve is to provide an AEC integrated X-ray detector that eliminates the need for additional equipment to maintain a constant position of the automatic exposure control device and the X-ray detector.

[0008] The problem that the present disclosure aims to solve is to provide an AEC integrated X-ray detector with enhanced portability by enabling X-ray image data and X-ray sensing signals for automatic exposure control to be transmitted to an external device via wireless communication. means of solving the problem

[0009] An AEC integrated X-ray detector according to an embodiment of the present disclosure includes an X-ray detection unit that detects X-rays incident from an X-ray source and generates X-ray image data, and an automatic exposure detection board located below the X-ray detection unit and generating an X-ray sensing signal for automatic exposure control based on residual X-rays that have passed through the X-ray detection unit. Effects of the invention

[0010] According to an embodiment of the present disclosure, an AEC integrated X-ray detector can be provided that prevents sensors of an automatic exposure control device, etc., from appearing as afterimages in X-ray images.

[0011] According to an embodiment of the present disclosure, an AEC integrated X-ray detector can be provided that does not require additional equipment to maintain the positions of the automatic exposure control device and the X-ray detector at a constant level.

[0012] According to an embodiment of the present disclosure, an AEC integrated X-ray detector with enhanced portability can be provided by enabling X-ray image data and X-ray sensing signals for automatic exposure control to be transmitted to an external device via wireless communication. Brief explanation of the drawing

[0013] Figure 1 is a diagram illustrating a conventional X-ray imaging system. FIG. 2 is a drawing for explaining an X-ray imaging system according to one embodiment of the present disclosure. FIG. 3 is a drawing for explaining the stacked structure of an AEC integrated X-ray detector according to one embodiment of the present disclosure. FIG. 4 is a drawing for explaining the stacked structure of an upper frame portion according to one embodiment of the present disclosure. FIG. 5 is a drawing for explaining a direct type X-ray detector according to one embodiment of the present disclosure. FIG. 6 is a drawing for explaining an indirect X-ray detection unit according to one embodiment of the present disclosure. FIG. 7 is a drawing for explaining an automatic exposure detection board according to one embodiment of the present disclosure. FIG. 8 is a block diagram illustrating an automatic exposure detection board according to one embodiment of the present disclosure. Specific details for implementing the invention

[0014] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components, regardless of drawing symbols, are assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, in describing embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted. Additionally, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification; the technical concept disclosed in this specification is not limited by the attached drawings, and it should be understood that they include all modifications, equivalents, and substitutions that fall within the concept and technical scope of this disclosure.

[0015] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0016] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0017] Figure 1 is a diagram illustrating a conventional X-ray imaging system.

[0018] A conventional X-ray imaging system (10) may include a system controller (101), a high-voltage generator (102), an X-ray tube (103), an Automatic Exposure Control (AEC, 104), and an X-ray detector (106). Meanwhile, the Automatic Exposure Control (104) may include an Automatic Exposure Control (AEC) sensor (104) and an AEC amplification circuit (105). The Automatic Exposure Control (AEC, 104) may prevent excessive exposure of the subject.

[0019] Meanwhile, the system controller (101), high-voltage generator (102), X-ray tube (130), AEC (Automatic Exposure Control) sensor (104), and AEC amplifier circuit (105) can transmit and receive data via wired communication. Additionally, the system controller (101) and the X-ray detector (106) can transmit and receive data via wired or wireless communication.

[0020] The system controller (101) can set X-ray irradiation conditions. The system controller (10) can set X-ray irradiation conditions including tube voltage, tube current, and X-ray irradiation time. The system controller (10) can transmit the set X-ray irradiation conditions to the high-voltage generator (102).

[0021] Additionally, the system controller (101) can select an AEC sensing area of ​​the automatic exposure control device (104) and transmit the selected AEC sensing area information to the automatic exposure control device (104).

[0022] The high voltage generating device (102) can apply tube voltage and tube current to the X-ray tube (103) for a set irradiation time based on the set X-ray irradiation conditions.

[0023] The X-ray tube (103) is supplied with tube voltage and tube current from a high-voltage generator (102) and can irradiate X-rays toward an X-ray detector (106).

[0024] When X-rays are incident on the AEC sensor (104), a current is generated, and the AEC sensor can transmit an X-ray sensing signal corresponding to the generated current to an AEC amplification circuit (106).

[0025] The amplification circuit (106) for AEC can amplify the X-ray sensing signal and transmit it to the high-voltage generator (102).

[0026] The high voltage generator (102) can determine whether the dose of X-rays currently being incident exceeds a critical dose based on the amplified X-ray sensing signal. If the dose of X-rays exceeds the critical dose, the tube voltage and tube current applied to the X-ray tube (103) can be stopped.

[0027] The X-ray detector (107) generates an electrical signal corresponding to the dose of transmitted X-rays and can generate X-ray image data. The X-ray detector (107) can transmit the X-ray image data to the system controller (101).

[0028] Meanwhile, in a conventional X-ray imaging system (10), X-rays pass through an AEC sensor (105) and then enter an X-ray detector (107). Therefore, a problem may occur where the AEC sensor (150) appears as an afterimage in the X-ray image. Additionally, there is a problem requiring additional equipment (e.g., a bucky) to maintain the positions of the automatic exposure control device (104) and the X-ray detector (107) constant. Furthermore, due to the problem of transmitting the X-ray sensing signal of the automatic exposure control device (104) to the system controller (101) or high-voltage generator (102) via wired communication, a separate wired cable is required, making it difficult to apply to a portable X-ray imaging system.

[0029] Therefore, there is a need to integrate the automatic exposure control device (104) and the X-ray detector (107).

[0030] FIG. 2 is a drawing for explaining an X-ray imaging system according to one embodiment of the present disclosure.

[0031] The X-ray imaging system (20) may include a system controller (200), a high-voltage generator (300), an X-ray tube (400), and an AEC (Automatic Exposure Control) integrated X-ray director (500). The AEC integrated X-ray director (500) is an X-ray director with an integrated automatic exposure control device (AEC), and may include an AEC sensor and an AEC amplification circuit, etc.

[0032] The system controller (200) can set X-ray irradiation conditions. The system controller (200) can set X-ray irradiation conditions including tube voltage, tube current, and X-ray irradiation time. The system controller (200) can transmit the set X-ray irradiation conditions to the high-voltage generator (300).

[0033] Additionally, the system controller (200) can select an AEC sensing area and transmit the selected AEC sensing area information to the AEC integrated X-ray director (500).

[0034] The high voltage generating device (300) can apply tube voltage and tube current to the X-ray tube (400) for a set irradiation time based on the set X-ray irradiation conditions.

[0035] The X-ray tube (400) is supplied with tube voltage and tube current from a high-voltage generator (300) and can irradiate X-rays toward an AEC integrated X-ray detector (500).

[0036] The AEC integrated X-ray director (500) can generate an X-ray sensing signal corresponding to the current generated when X-rays are incident, and amplify the generated X-ray sensing signal and transmit it to a high-voltage generator (300). The X-ray sensing signal may be a signal for monitoring the X-ray irradiation dose.

[0037] The high voltage generator (300) can determine whether the dose of X-rays currently being incident exceeds a critical dose based on the amplified X-ray sensing signal. If the dose of X-rays exceeds the critical dose, the tube voltage and tube current applied to the X-ray tube (400) can be stopped.

[0038] The AEC integrated X-ray detector (500) generates an electrical signal corresponding to the dose of transmitted X-rays and can generate X-ray image data. The AEC integrated X-ray detector (500) can transmit the X-ray image data to the system controller (200).

[0039] Meanwhile, the system controller (200), the high-voltage generator (300), and the X-ray tube (400) can transmit and receive data via wired communication. Additionally, the system controller (200), the high-voltage generator (300), and the AEC integrated X-ray detector (500) can transmit and receive data via wired or wireless communication.

[0040] Meanwhile, unlike conventional X-ray imaging systems, the X-ray imaging system (20) can solve the problem where X-rays appear as afterimages in the X-ray image due to the AEC sensor. Additionally, additional equipment is not required to maintain the positions of the automatic exposure control device and the X-ray detector at a constant level. Furthermore, the system controller (200), the high-pressure generator (300), and the AEC integrated X-ray detector (500) can transmit and receive data via wireless communication, thereby enabling the construction of a movable X-ray imaging system.

[0041] FIG. 3 is a drawing for explaining the stacked structure of an AEC integrated X-ray detector according to one embodiment of the present disclosure.

[0042] Referring to FIG. 3, the AEC integrated X-ray detector (500) may include an upper frame part (510), an X-ray detector part (520), an electromagnetic wave absorption sheet part (530), a scattering prevention sheet part (540), a driving circuit fixing plate (550), an automatic exposure detector part (AED, 560), a battery part (570), and a lower frame part (580).

[0043] The upper frame portion (510) can protect the internal components of the AEC integrated X-ray detector (500) and absorb external shocks.

[0044] FIG. 4 is a drawing for explaining the stacked structure of an upper frame portion according to one embodiment of the present disclosure.

[0045] Referring to FIG. 4, the upper frame portion (510) may include a deco sheet (511), a plate (512), and a pad (513). The deco sheet (511) may include a pattern that allows the center of X-ray irradiation to be controlled. The deco sheet (511) may be provided on the upper part of the plate (512). Additionally, the plate (512) may be a carbon fiber reinforced plastic (CFRP) plate, but is not limited thereto and may be a plate made of melamine or polycarbonate material. The plate (512) may protect the lower X-ray detector (520). Additionally, the pad (513) may be a high-density polyethylene (HDPE) pad. The pad (513) may reduce impact to protect the lower X-ray detector (520).

[0046] Meanwhile, the X-ray detector (520) can detect X-rays using a direct conversion method or an indirect conversion method. The X-ray detector (520) can generate X-ray image data for a subject based on the detected X-rays.

[0047] The direct conversion method is a method that directly converts incident X-ray photons into electrical signals through a photoconductor material.

[0048] FIG. 5 is a drawing for explaining a direct type X-ray detector according to one embodiment of the present disclosure.

[0049] Referring to FIG. 5, the direct X-ray detector (520) may include a photoconductor (521) and a Thin-Film Transistor (TFT, 522). The photoconductor (521) generates electron-hole pairs when it absorbs X-rays. Meanwhile, the photoconductor (521) may include at least one compound of amorphous selenium, perovskite, cadmium telluride (CdTe), and cadmium zinc telluride (CdZnTe). Additionally, the TFT (522) may detect the dose of incident X-rays as an electrical signal based on the generated electron-hole pairs.

[0050] Meanwhile, the indirect conversion method is a method of detecting X-rays by converting incident X-rays into visible light and then converting them into electrical signals.

[0051] FIG. 6 is a drawing for explaining an indirect X-ray detection unit according to one embodiment of the present disclosure.

[0052] Referring to FIG. 6, the indirect X-ray detector (520) may include a scintillator (523), a photodiode (524), and a Thin-Film Transistor (TFT, 525). The scintillator (523) can convert incident X-rays into visible light. The scintillator (523) may include at least one compound selected from gadolinium oxysulfide (GoS), cesium iodide (CsI), and perovskite.

[0053] Perovskite may include perovskite compounds represented by the following chemical formula 1.

[0054] [Chemical Formula 1]

[0055] MAPbX3, FA-MA-CsPbX3 (X = I, Br, Cl)

[0056] A photodiode (524) can detect visible light converted by a scintillator (523). The photodiode (524) can convert visible light into an electrical signal. A TFT (525) can output the electrical signal converted by the photodiode (524).

[0057] Referring again to FIG. 3, the electromagnetic wave absorbing sheet portion (530) may be located below the X-ray detector portion (520). The electromagnetic wave absorbing sheet portion (530) can protect the TFTs (522, 525) of the X-ray detector portion (520) from the influence of an external magnetic field.

[0058] Meanwhile, the scattering prevention sheet portion (540) may include a sheet that prevents backscattering of X-rays. The scattering prevention sheet portion (540) may include a PE / PB sheet.

[0059] Meanwhile, the driving circuit fixing plate (550) can fix the driving circuit of the AEC integrated X-ray detector (500). The driving circuit may include a photodiode for detecting X-rays, a communication unit for transmitting the detected X-ray sensing signal to an external device (e.g., a system controller (200) or a high-voltage generator (300)), and a processor for controlling them.

[0060] Meanwhile, the Automatic Exposure Detection (AED, 560) performs Automatic Exposure Control (AEC) functions to prevent excessive exposure of the subject. The Automatic Exposure Detection (560) can detect residual X-rays remaining after passing through the X-ray detection unit (520). For example, the dose of X-rays incident on the Automatic Exposure Detection (560) can be about 2% of the dose of X-rays emitted from the X-ray tube (400).

[0061] FIG. 7 is a drawing for explaining an automatic exposure detection board according to one embodiment of the present disclosure.

[0062] The automatic exposure detection board (560) may include a scintillator (561), a photodiode (562), and a TFT (563).

[0063] The scintillator (561) can convert incident X-rays into visible light. The scintillator (561) may include at least one compound of gadolinium oxysulfide (GoS), cesium iodide (CsI), and perovskite.

[0064] Perovskite may include perovskite compounds represented by the following chemical formula 2.

[0065] [Chemical Formula 2]

[0066] MAPbX3, FA-MA-CsPbX3 (X = I, Br, Cl)

[0067] The photodiode (562) can detect visible light converted by the scintillator (561). The photodiode (562) can convert visible light into an electrical signal. The TFT (563) may include an amplification circuit that amplifies the electrical signal converted by the photodiode (562) and can output the amplified electrical signal.

[0068] FIG. 8 is a block diagram illustrating an automatic exposure detection board according to one embodiment of the present disclosure.

[0069] The automatic exposure detection board (560) may include a processor (564) that acquires an amplified electrical signal as an X-ray sensing signal. Additionally, the processor (564) may transmit the acquired X-ray sensing signal to a system controller (200) or a high-voltage generator (300) through a communication unit (565).

[0070] The processor (564) can determine at least one executable operation of the automatic exposure detection board (560) and can perform the determined operation by controlling each component of the automatic exposure detection board (560).

[0071] The communication technologies used by the communication department (565) include GSM (Global System for Mobile communication), CDMA (Code Division Multi Access), LTE (Long Term Evolution), 5G, WLAN (Wireless LAN), Wi-Fi (Wireless-Fidelity), Bluetooth (Bluetooth™), RFID (Radio Frequency Identification), Infrared Data Association (IrDA), ZigBee, NFC (Near Field Communication), etc.

[0072] Referring again to FIG. 3, the battery unit (570) may include a battery that supplies power necessary for the operation of the AEC integrated X-ray detector (500).

[0073] In addition, the lower frame portion (580) can protect the internal components of the AEC integrated X-ray detector (500) and absorb external shocks.

[0074] The above description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention.

[0075] Accordingly, the embodiments disclosed in this invention are intended to explain, not limit, the technical concept of the invention, and the scope of the technical concept of the invention is not limited by these embodiments.

[0076] The scope of protection of the present invention shall be interpreted by the claims below, and all technical ideas within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

Claims

Claim 1 X-ray detection unit that detects X-rays incident from an X-ray source and generates X-ray image data; The apparatus further includes an automatic exposure detection board located below the X-ray detection unit and generating an X-ray sensing signal for automatic exposure control based on residual X-rays that have passed through the X-ray detection unit, an electromagnetic wave absorption sheet portion located between the X-ray detection unit and the automatic exposure detection board to absorb X-ray energy to protect the internal configuration of the X-ray detection unit, a scattering prevention sheet portion located below the electromagnetic wave absorption sheet portion to prevent backscattering of the X-rays, and a driving circuit fixing plate that fixes the driving circuit of the automatic exposure detection board and at least one X-ray sensor, wherein the electromagnetic wave absorption sheet portion, the scattering prevention sheet portion, and the driving circuit fixing plate are stacked and arranged in the order of the electromagnetic wave absorption sheet portion, the scattering prevention sheet portion, and the driving circuit fixing plate between the X-ray detection unit and the automatic exposure detection board based on the X-ray incidence direction, wherein the electromagnetic wave absorption sheet portion protects the TFT of the X-ray detection unit from the influence of an external magnetic field, and the driving circuit fixing plate is positioned on the X-ray incidence side of the automatic exposure detection board to support the driving circuit of the automatic exposure detection board and the X-ray sensor, and Fixed, AEC integrated X-ray detector. Claim 2 An AEC integrated X-ray detector according to claim 1, wherein the X-ray detector comprises: a photoconductor that absorbs the incident X-ray to generate an electron-hole pair; and a TFT that detects the dose of the incident X-ray as an electrical signal based on the electron-hole pair. Claim 3 In paragraph 2, the photoconductor comprises at least one compound selected from amorphous selenium, perovskite, cadmium telluride (CdTe), and cadmium zinc telluride (CdZnTe), forming an AEC integrated X-ray detector. Claim 4 In claim 1, the X-ray detector comprises: a first scintillator that converts the incident X-ray into visible light; and a first photodiode that converts the visible light into an electrical signal, an AEC integrated X-ray detector. Claim 5 In claim 4, the first scintillator comprises at least one compound selected from gadolinium oxysulfide (GoS), cesium iodide (CsI), and perovskite, an AEC integrated X-ray detector. Claim 6 An AEC integrated X-ray detector according to claim 5, wherein the perovskite is a compound represented by the following chemical formula 1. [Chemical Formula 1] MAPbX3, FA-MA-CsPbX3(X = I, Br, Cl) Claim 7 In claim 1, the automatic exposure detection board comprises: a second scintillator that converts the residual X-rays into visible light; a second photodiode that converts the visible light into an electrical signal; and a TFT, AEC integrated X-ray detector that amplifies the electrical signal and outputs the amplified electrical signal. Claim 8 In claim 7, the automatic exposure detection board comprises: a processor that acquires the amplified electrical signal as an X-ray sensing signal; and a communication unit that wirelessly transmits the X-ray sensing signal to a system controller or a high-voltage generator, an AEC integrated X-ray detector. Claim 9 An AEC integrated X-ray detector according to claim 1, further comprising an upper frame disposed above the X-ray detector, wherein the upper frame comprises a deco sheet having a pattern for controlling the center at which the X-ray is irradiated; a carbon fiber reinforced polymer (CFRP) plate; and a high-density polyethylene pad. Claim 10 delete Claim 11 delete Claim 12 An AEC integrated X-ray detector according to claim 1, further comprising a battery unit located at the bottom of the automatic exposure detection board and for supplying power to the AEC integrated X-ray detector. Claim 13 An AEC integrated X-ray detector according to claim 12, further comprising a lower frame portion located at the bottom of the battery portion.

Images