Compound for forming metal-containing film, composition for forming metal-containing film, and patterning process

Abstract

The present invention aims to provide a compound for forming a metal-containing film that can contribute to sensitivity improvement while maintaining the LWR of an upper layer resist, a composition for forming a metal-containing film that includes the same, and a pattern forming method using the composition. This is achieved by a compound for forming a metal-containing film, wherein the compound for forming a metal-containing film comprises at least one metal atom (a) selected from the group consisting of Ti, Zr, and Hf, and a polydentate ligand coordinated to the metal atom (a), and furthermore, the polydentate ligand is substituted with a fluorine atom and is derived from a compound (b) having 1 to 50 carbon atoms that comprises one or more crosslinkable groups selected from allyl, allyloxy, ethynyl, propargyl, propargyloxy, epoxy, oxetanyl, nitrile, and vinylidene groups.

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