High-quality signal transmission high-frequency connection structure based on a dual floating structure

Abstract

The present disclosure discloses a high-quality signal transmission high-frequency connection structure based on a dual floating structure, comprising: a PCB board having a Pad for transmitting a high-frequency signal, wherein the Pad includes a high-frequency signal transmission area and a ground area, wherein the ground area is formed outside the high-frequency signal transmission area and there is a gap between the high-frequency signal transmission area and the ground area; and a high-frequency signal transmission assembly that contacts the Pad of the PCB board and includes an outer conductor assembly and an inner conductor assembly, wherein the outer conductor assembly contacts in correspondence with the ground area and the inner conductor assembly contacts in correspondence with the high-frequency signal transmission area, and the portions of the outer conductor assembly and the inner conductor assembly contacting the PCB board have floating properties so that the outer conductor assembly and the inner conductor assembly can be attached to the Pad simultaneously. The present disclosure improves high-frequency signal transmission conditions, eliminates air gaps in high-frequency transmission links, and prevents signal distortion and energy loss, thereby enabling the transmission speed of the high-frequency signal to reach 20 Gbps or more.

Description

Technology Field

[0001] Cross-reference of related applications

[0002] This application claims priority to a Chinese patent application filed with the National Intellectual Property Administration of China on March 31, 2022, with application number 202210344748.8 and title of the invention "High-quality signal transmission high-frequency connection structure based on a dual floating structure," the entire contents of said application are incorporated into the present invention by reference.

[0003] The present disclosure relates to the field of electrical component plugging technology, and in particular to connectors and links used for high-frequency signal transmission applied to chip test devices. Background Technology

[0004] Chip testing generally implements signal transmission through contact between a probe holder (a fan-shaped structure in Fig. 1) and a PCB board (a disk-shaped structure in Fig. 1), thereby testing various parameters of the chip and determining specific performance characteristics of the chip. The probe holder of a chip test device has many ports, and the number of ports is generally defined according to the test requirements of the chip. These ports are generally classified into high-frequency chip ports and low-frequency signal ports. Likewise, as shown in Fig. 1, the PCB board at the docking end of these ports is also equipped with a pad that contacts the high-frequency signal and the low-frequency signal.

[0005] In the related technology, as shown in FIG. 2, the chip test device includes a PCB board (1), a base (13), an upper cover (9), a plastic sheet (12), a low-frequency signal transmission assembly (10), a high-frequency signal transmission assembly (11), a low-frequency signal transmission cable (14), and a high-frequency signal transmission cable (15).

[0006] In actual chip tests, it was found that when the transmission speed does not exceed 2G, the high-frequency signal transmission assembly (11) generally does not have a negative effect on the high-frequency signal, but when the transmission speed exceeds 2G, the high-frequency signal generates crosstalk and distortion. The problem to be solved

[0007] Considering the shortcomings of related chip test devices, the present disclosure solves the problems of crosstalk and distortion in high-frequency signal transmission assemblies when the transmission speed exceeds 2G by providing a high-quality signal transmission high-frequency connection structure based on a dual floating structure. Specific technical solutions are as follows. means of solving the problem

[0008] The high-frequency signal transmission assembly (11) of the related chip test device is characterized by being divided into an inner conductor (20) and an outer conductor (21) as shown in FIG. 3. The outer conductor (21) is a fixed component and, since it has no floating function, does not come into contact with the PCB board (1), and is connected to an adjacent low-frequency signal transmission assembly (10) through a ground connection piece (22) to achieve elastic contact with the PCB board. The inventor accidentally discovered that when the gap between the outer conductor (21) and the PCB board is reduced, the transmitted high-frequency signal is improved to a certain degree, and through exploration and practice, proved that an air gap is created between the outer conductor (21) and the PCB board (1). The created air gap causes crosstalk and distortion of the high-frequency signal when the transmission speed exceeds 2G, and one of the technical objectives of the present disclosure is to remove the said air gap to prevent it from having a negative effect on the transmission of the high-frequency signal.

[0009] In a high-quality signal transmission high-frequency connection structure based on a double floating structure,

[0010] A PCB board having a pad for transmitting a high-frequency signal, wherein the pad includes a high-frequency signal transmission area and a ground area, wherein the ground area is formed outside the high-frequency signal transmission area and there is a gap between the high-frequency signal transmission area and the ground area; and

[0011] A high-quality signal transmission high-frequency connection structure based on a dual floating structure is provided, comprising: a high-frequency signal transmission assembly that contacts the Pad of the PCB board and includes an external conductor assembly and an internal conductor assembly, wherein the external conductor assembly contacts in correspondence with the ground area and the internal conductor assembly contacts in correspondence with the high-frequency signal transmission area, and the portions of the external conductor assembly and the internal conductor assembly contacting the PCB board have floating properties so that the external conductor assembly and the internal conductor assembly can be simultaneously attached to the Pad.

[0012] Optionally, the high-frequency signal transmission region is a solid dot, and the gap between the high-frequency signal transmission region and the ground region may be a circular ring surrounding the outside of the high-frequency signal transmission region.

[0013] Optionally, the grounding region may have a circular or arc-shaped inner boundary that is at least concentric with the high-frequency signal transmission region.

[0014] Optionally, the grounding area may have a four-leaf clover shape or a rhombus shape.

[0015] Optionally, the high-frequency signal transmission area may be located at the four branches of the four-leaf clover shape or at the four corners of the rhombus shape.

[0016] Optionally, the outer conductor assembly comprises a support ring, a spring, a lower outer conductor, an upper outer conductor, and a clamping ring, wherein the upper outer conductor is fixedly mounted to the end of the lower outer conductor, the support ring is installed over the outside of the upper outer conductor, the support ring is slidable axially with respect to the upper outer conductor, and the spring supporting the support ring is installed over the outer wall of the lower outer conductor, and the other end of the spring may be supported by a stepped surface opened in the outer wall of the lower outer conductor.

[0017] Optionally, the extension end of the upper outer conductor may be provided with a position limiting flange that protrudes radially relative to the support ring.

[0018] Optionally, a stepped surface that fits with the position limiting flange may be installed at the end of the support ring.

[0019] Optionally, the clamping ring may be installed between the support ring and the lower outer conductor.

[0020] Optionally, the internal conductor assembly comprises a pin, a small spring, a metal inner shell, and a metal outer shell, wherein the pin presses the small spring into the metal inner shell to form a combination member, the combination member is mounted on the metal outer shell, and the head portion of the pin extends from the metal inner shell to enable axial floating through the small spring.

[0021] Optionally, the internal conductor assembly is a spring pin, and the spring pin can contact the PCB board by the elastic force of the pin.

[0022] Optionally, an insulating medium may be installed between the inner conductor assembly and the outer conductor assembly.

[0023] Optionally, the inner conductor assembly and the outer conductor assembly are both floating structures, and the floating direction may follow the axial direction of the high-frequency signal transmission assembly. Effects of the invention

[0024] The beneficial effects of the present disclosure are as follows: (1) The present disclosure enables a high-frequency port of a chip test device to transmit a 20G high-frequency signal and ensures that the high-frequency signal transmission quality is the same as that of an RF connector of the same type. The chip test device is connected to a pad on a PCB board through an elastic contact member, and there is no limit to the number of ports, and the port density can reach approximately 2 mm. (2) The present disclosure adds a floating function to the outer conductor of the high-frequency signal transmission port and improves the shape of the pad that contacts the high-frequency port on the PCB board so that both the inner and outer conductors of the high-frequency port can make elastic contact with the PCB board. It enables simultaneous ground shielding and signal transmission of the high-frequency port, improves the high-frequency signal transmission conditions, eliminates the air gap of the high-frequency transmission link, and prevents signal distortion and energy loss, thereby enabling the transmission speed of the high-frequency signal to reach 20 Gbps or more. It improves the usability of the device, increases the application scenarios of the device, and indirectly shortens the device replacement time, thereby significantly improving the device utilization rate. (3) The present disclosure also facilitates easy replacement of the internal conductor of the high-frequency port and the contact member of the low-frequency port, thereby solving the problem of difficult maintenance and inability to replace the contact member after it has become ineffective due to damage during use, wear after repeated use, or environmental corrosion. This results in significantly reduced maintenance time, reduced maintenance costs, and improved lifespan of the device. Brief explanation of the drawing

[0025] Figure 1 is a schematic diagram of the fitting structure of a probe holder and a PCB board in the relevant technology. Figure 2 is a schematic diagram of the overall structure of a chip test device in the prior art. Figure 3 is a schematic diagram of the structure of a high-frequency signal transmission assembly of a chip test device in the prior art. FIG. 4 is a schematic diagram of a pad shape in contact with a high-frequency signal transmission assembly (11) on a PCB board according to an embodiment of the present disclosure. FIG. 5 is a schematic diagram of a fitting on a PCB board of a high-frequency signal transmission assembly according to an embodiment of the present disclosure. FIG. 6 is a schematic diagram of the structure of an external conductor assembly (1) according to an embodiment of the present disclosure. FIG. 7 is a schematic diagram of the structure of an internal conductor assembly (1) according to an embodiment of the present disclosure. FIG. 8 is a schematic diagram of the overall structure of a high-frequency signal transmission assembly according to an embodiment of the present disclosure. Figure 9 is a schematic diagram of the structure of a PCB board (1). FIG. 10 is another shape of a Pad in contact with a high-frequency signal transmission assembly (11) on a PCB board according to an embodiment of the present disclosure. Specific details for implementing the invention

[0026] In order to further clarify the purpose, technical solution, and advantages of the embodiments of the present disclosure, the technical solution of the present invention is described below in combination with the embodiments in a clear and complete manner.

[0027] Example:

[0028] In this embodiment, to solve the aforementioned high-frequency signal crosstalk and distortion problems, the connection structure between the PCB board (1) and the high-frequency signal transmission assembly (11) is redesigned, and the design includes the following two parts.

[0029] In the first part, there is a pad that contacts a high-frequency signal transmission assembly (11) distributed on a PCB board (1). The PCB board (1) mainly includes two types, circular and rectangular, and a circular PCB board (1) is shown in FIG. 1, and the number of layers of the PCB board (1) is designed according to usage requirements. Pads are distributed thereon to contact a docked low-frequency signal transmission assembly (10) and a high-frequency signal transmission assembly (11) to implement signal transmission. As shown in FIG. 9, there is a schematic diagram of the structure of the PCB board (1), and contact pads (2) and welding holes (5) are distributed on the PCB board (1). The contact pads (2) are divided into high-frequency transmission pads (3) and low-frequency transmission pads (4), which contact the high-frequency signal transmission assembly (11) and the low-frequency signal transmission assembly (10), respectively, and the welding holes (5) correspond one-to-one with the contact pads (2) and are used to connect to cables or other connectors to output signals.

[0030] As illustrated in FIG. 4, in this embodiment, the Pad shape in contact with the high-frequency signal transmission assembly (11) on the PCB board (1) is schematic. The Pad includes a high-frequency signal transmission area (6) and a ground area (7). The ground area (7) is formed outside the high-frequency signal transmission area (6), and a gap is provided between the high-frequency signal transmission area (6) and the ground area (7). The high-frequency signal transmission area (6) is a solid dot, and the diameter is determined according to the size of the pin diameter of the high-frequency signal transmission assembly (11). The ground area (7) is a circular ring, and the width of the circular ring is determined according to the size of the outer conductor assembly (16) of the high-frequency signal transmission assembly (11) contacting the circular ring. The outer conductor assembly (16) of the high-frequency signal transmission assembly (11) is in contact with the ground area (7) to implement shielding and grounding functions, and the inner conductor (17) of the high-frequency signal transmission assembly (11) is in contact with the high-frequency signal transmission area (6) to implement high-frequency signal transmission functions.

[0031] In the second part, there is a high-frequency signal transmission assembly (11) corresponding to the Pad. As illustrated in FIG. 5, the high-frequency signal transmission assembly (11) includes an outer conductor assembly (16) and an inner conductor assembly (17), both of which are floating structures, and the floating direction follows the axial direction of the high-frequency signal transmission assembly (11). The outer conductor assembly (16) contacts the PCB board (1) by means of an elastic force provided through a spring, and the inner conductor assembly (17) is a spring pin (pogo pin) and contacts the PCB board (1) through the elastic force of the pin. The floating range of the outer conductor assembly (16) and the inner conductor assembly (17) is designed according to actual requirements.

[0032] Figure 6 shows in detail the structure of the external conductor assembly (16). The outer conductor assembly (16) comprises a support ring (23), a spring (24), a lower outer conductor (25), an upper outer conductor (26), and a clamping ring (27). The upper outer conductor (26) is mounted on the top of the lower outer conductor (25) and is in elastic contact with the lower outer conductor (25). The support ring (23) is installed over the outside of the upper outer conductor (26) and can slide axially with respect to the upper outer conductor (26). A spring (24) that supports the support ring (23) is installed over the outer wall of the lower outer conductor (25). The other end of the spring (24) is supported by a stepped surface opened in the outer wall of the lower outer conductor (25). The extended end of the upper outer conductor (26) is provided with a flange protruding radially, and the end of the support ring (23) is fitted with a flange. A stepped surface is installed to push the upper outer conductor (26) to the top position through the support ring (23); a clamping ring (27) is added between the support ring (23) and the lower outer conductor (25) to prevent the support ring (23) from sliding out of the lower outer conductor (25). A flange is designed on the bottom side of the upper outer conductor (26) to make elastic contact with the inner circular surface of the lower outer conductor (25), and two slots are added on the bottom side of the upper outer conductor (26) to ensure elastic contact.

[0033] FIG. 7 illustrates in detail the structure of an internal conductor assembly (17). The internal conductor assembly (17) comprises a pin (29), a small spring (30), a metal inner shell (31), and a metal outer shell (32), wherein the pin (29) presses the small spring (30) into the metal inner shell (31) to form a single combined member and is mounted entirely on the metal outer shell (32), and the head portion of the pin (29) extends from the metal inner shell (31) to enable axial floating through the small spring (30). If the pin is damaged or worn out during use and contact cannot be trusted, it can be removed from the metal outer shell (32) and replaced, facilitating maintenance and extending the service life of the internal conductor.

[0034] As shown in FIG. 8, the structure is schematic after the inner conductor assembly (17) and the outer conductor assembly (16) are assembled, and during the assembly process, an insulating medium is installed between the metal outer shell (32) and the lower outer conductor (25) to achieve an insulating effect.

[0035] As illustrated in FIG. 10, there are different shapes of pads that contact the high-frequency signal transmission assembly (11) on the PCB board (1). In figure (a), the high-frequency signal transmission area (6) is a solid dot, the inner boundary of the ground area (7) is a circle concentric with the high-frequency signal transmission area (6), and the outer boundary is a rectangle, specifically a square; in figure (b), the high-frequency signal transmission area (6) is a solid dot, the inner boundary of the ground area (7) is a circle concentric with the high-frequency signal transmission area (6), the ground area (7) is a four-leaf clover shape overall, and the high-frequency signal transmission area (6) is located at the four branches of the four-leaf clover shape; in figure (c), the high-frequency signal transmission area (6) is a solid dot, the inner boundary of the ground area (7) is a circle concentric with the high-frequency signal transmission area (6), the ground area (7) is a rhombus shape overall, and the high-frequency signal transmission area (6) is located at the four corners, i.e., the center, of the rhombus shape. In addition, it should be noted that the shape and location of the high-frequency signal transmission area (6) and the ground area (7) are not limited thereto, and in particular, the shape of the ground area (7) can be any shape provided that the external conductor assembly (16) of the high-frequency signal transmission assembly (11) is connected to the ground area (7).

[0036] The above embodiments are used merely to illustrate the technical methods of the present disclosure and are not intended to limit them.

[0037] Industrial applicability

[0038] The beneficial effects of the high-quality signal transmission high-frequency connection structure based on a dual floating structure provided in this application are as follows: (1) The high-frequency port of a chip test device can transmit 20G high-frequency signals, and the high-frequency signal transmission quality is guaranteed to be the same as that of an RF connector of the same type. The chip test device is connected to a Pad on a PCB board through an elastic contact member, and there is no limit to the number of ports, and the port density can reach approximately 2mm. (2) A floating function is added to the outer conductor of the high-frequency signal transmission port, and the shape of the Pad contacting the high-frequency port on the PCB board is improved so that both the inner and outer conductors of the high-frequency port can make elastic contact with the PCB board. This enables simultaneous ground shielding and signal transmission of the high-frequency port, improves the high-frequency signal transmission conditions, eliminates the air gap of the high-frequency transmission link, and prevents signal distortion and energy loss, thereby enabling the transmission speed of the high-frequency signal to reach 20Gbps or more. This improves the usability of the device, increases the application scenarios of the device, and indirectly shortens the device replacement time, thereby significantly improving the device utilization rate. (3) In addition, the internal conductor of the high-frequency port and the contact member of the low-frequency port can be easily replaced. This solves the problem of being unable to replace the contact member after it is damaged during use, worn out after repeated use, or damaged after environmental corrosion, and thus the maintenance time is significantly reduced, maintenance costs are reduced, and the lifespan of the device is improved.

[0039] In addition, it can be understood that the high-quality signal transmission high-frequency connection structure based on the double floating structure of the present application is reproducible and capable of various industrial applications. For example, the high-quality signal transmission high-frequency connection structure based on the double floating structure of the present application can be used in the field of electrical component plugging technology. Explanation of the symbols

[0040] 1: PCB board; 6: Transmission area; 7: Ground area; 9: Top cover; 10: Low-frequency signal transmission assembly; 11: High-frequency signal transmission assembly; 12: Plastic sheet; 13: Base; 14: Low-frequency signal transmission cable; 15: High-frequency signal transmission cable; 16: Outer conductor assembly; 17: Inner conductor assembly; 20: Inner conductor; 21: Outer conductor; 22: Ground connection piece; 23: Support ring; 24: Spring; 25: Lower outer conductor; 26: Upper outer conductor; 27: Clamping ring; 29: Pin; 30: Small spring; 31: Metal inner shell; 32: Metal outer shell.

Claims

Claim 1 A high-quality signal transmission high-frequency connection structure based on a double floating structure, wherein a Pad for transmitting a high-frequency signal is provided, the Pad includes a high-frequency signal transmission area (6) and a ground area (7), the ground area (7) is formed outside the high-frequency signal transmission area (6), and a PCB board having a gap between the high-frequency signal transmission area (6) and the ground area (7); A high-frequency signal transmission assembly (11) that is in contact with the Pad of the PCB board and includes an outer conductor assembly (16) and an inner conductor assembly (17), wherein the outer conductor assembly (16) is in contact corresponding to the ground area (7) and the inner conductor assembly (17) is in contact corresponding to the high-frequency signal transmission area (6), and the portions of the outer conductor assembly (16) and the inner conductor assembly (17) in contact with the PCB board are provided with floating properties so that the outer conductor assembly (16) and the inner conductor assembly (17) can be attached to the Pad simultaneously; wherein the outer conductor assembly (16) includes a support ring (23), a spring (24), a lower outer conductor (25), an upper outer conductor (26), and a clamping ring (27), wherein the upper outer conductor (26) is mounted on the upper end of the lower outer conductor (25), and the upper outer conductor (26) is the A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that it is elastically in contact with a lower outer conductor (25), the support ring (23) is installed over the outside of the upper outer conductor (26), the upper end of the lower outer conductor (25) is slidably mounted within the support ring (23), the support ring (23) is slidably axially with respect to the upper outer conductor (26), the spring (24) that supports the support ring (23) is installed over the outer wall of the lower outer conductor (25), and the other end of the spring (24) is supported by a stepped surface opened in the outer wall of the lower outer conductor (25). Claim 2 A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that, in claim 1, the high-frequency signal transmission area (6) is a solid dot, and the gap between the high-frequency signal transmission area (6) and the ground area (7) is a circular ring surrounding the outside of the high-frequency signal transmission area (6). Claim 3 A high-quality signal transmission high-frequency connection structure based on a double floating structure, wherein, in claim 1, the grounding area (7) has a circular or arc-shaped inner boundary that is at least concentric with the high-frequency signal transmission area (6). Claim 4 A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that, in claim 1, the grounding area (7) is in the shape of a four-leaf clover or a rhombus. Claim 5 A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that, in paragraph 4, the high-frequency signal transmission area (6) is located at the four branches of the four-leaf clover shape or at the four corners of the rhombus shape. Claim 6 delete Claim 7 A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that, in the first aspect, the extension end of the upper outer conductor (26) is provided with a position limiting flange that protrudes radially relative to the support ring (23). Claim 8 A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that, in claim 7, a stepped surface that fits with the position limiting flange is installed at the end of the support ring (23). Claim 9 A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that, in claim 1, the clamping ring (27) is installed between the support ring (23) and the lower outer conductor (25). Claim 10 A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that, in the first paragraph, a flange is installed on the bottom side of the upper outer conductor (26) to elastically contact the inner circular surface of the lower outer conductor (25), and two slots are installed on the bottom side of the upper outer conductor (26). Claim 11 A high-quality signal transmission high-frequency connection structure based on a double floating structure, wherein, in claim 1, the inner conductor assembly (17) comprises a pin (29), a small spring (30), a metal inner shell (31), and a metal outer shell (32), and the pin (29) presses the small spring (30) into the metal inner shell (31) to form a combination member, the combination member is mounted on the metal outer shell (32), and the head portion of the pin (29) extends from the metal inner shell (31) to enable axial floating through the small spring (30). Claim 12 A high-quality signal transmission high-frequency connection structure based on a double floating structure, wherein, in claim 1, the internal conductor assembly (17) is a spring pin, and the spring pin contacts the PCB board by the elastic force of the pin. Claim 13 A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that, in claim 1, an insulating medium is installed between the inner conductor assembly (17) and the outer conductor assembly (16). Claim 14 A high-quality signal transmission high-frequency connection structure based on a double floating structure, characterized in that, in any one of claims 1 to 5 and 7 to 13, the inner conductor assembly (17) and the outer conductor assembly (16) are both floating structures, and the floating direction follows the axial direction of the high-frequency signal transmission assembly (11).

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