Test handler for testing electronic component

Abstract

The present invention relates to a handler for testing electronic components. A handler for testing electronic components according to the present invention comprises: a vibration-damping frame provided spaced apart from a base plate and movable relative to the base plate to suppress the effect of vibration of the base plate on the electrical connection between the electronic component and the test socket; a vibration absorber placed between the vibration-damping frame and the base plate to minimize the transmission of vibration of the base plate to the vibration-damping frame; a connector installed on the vibration-damping frame and electrically connecting the electronic component and the test socket; a supplyer for supplying an electronic component to be tested to the test socket or for retrieving an electronic component after testing is completed; and a controller for controlling the connector and the supplyer; wherein the test socket is installed on the vibration-damping frame. According to the present invention, since the transmission of vibration is minimized, the electrical connection between the electronic component and the tester and the precision of the connection are maintained, ultimately improving the reliability of the test results.

Description

Technology Field

[0001] The present invention relates to a handler for testing electronic components. Background Technology

[0002] The manufactured electronic components are tested by a tester, then separated into good and defective products, and only the good ones are shipped.

[0003] The electrical connection between the tester and the electronic component is made by a handler, which is manufactured in various forms depending on the type of electronic component to be tested.

[0004] In general, the most important factors in testing electronic components are the precision of the electrical connection between the component and the tester and the stability of that connection. In other words, for the handler, it is crucial to establish a precise connection between the electronic component and the tester and to maintain that precise connection state.

[0005] However, during operation, vibrations occur in the handler due to the impact of various internal devices, and these vibrations affect the precise connection between the electronic components and the tester, or the state of that connection. For example, vibrations may prevent the terminals of the electronic components from making precise contact with the terminals of the test sockets on the tester.

[0006] Furthermore, even after the electronic component and the test socket make contact, vibration can adversely affect the connection, causing the electrical connection to become momentarily unstable and potentially leading to inaccurate test results. In other words, while the test must be conducted with the contact area and contact force between the electronic component terminals and the test socket terminals maintained at a constant level, vibration can cause these conditions to change instantaneously.

[0007] Vibrations in typical handlers occur due to the simultaneous operation of various internal devices during processes such as moving electronic components and sorting them based on test results. Furthermore, vibrations occurring in close proximity to electrical connections between electronic components and testers can be even more dangerous.

[0008] In particular, as in the applicant’s prior application No. 10-2016-0007710 (hereinafter referred to as the ‘prior application’), in a handler in which multiple test sites are arranged in multiple rows adjacent to each other in a multi-layered manner, vibrations generated by the independent operation of connectors that electrically connect electronic components and testers will have a significant impact on the adjacent test sites.

[0009] Meanwhile, the continuous development of the information industry has demanded the development of electronic components capable of detecting vibration, pressure, and orientation, and special electronic components have been developed to meet this demand. However, since existing handlers do not take into account the aforementioned vibrations, it is expected that testing the aforementioned special electronic components using existing handlers may lead to damage to the electronic components or inaccuracies in the test results. The problem to be solved

[0010] The present invention provides a technology for stabilizing the electrical connection between an electronic component and a test socket by suppressing or attenuating vibrations caused by the operation of various built-in devices in an electronic component test handler, or by minimizing their transmission. means of solving the problem

[0011] A handler for testing electronic components according to the present invention comprises: a vibration-damping frame provided to be spaced apart from a base plate and to be relatively movable with respect to the base plate so as to suppress the effect of vibration of the base plate on the electrical connection between the electronic component and the test socket; a vibration absorber placed between the vibration-damping frame and the base plate to minimize the transmission of vibration of the base plate to the vibration-damping frame; a connector installed on the vibration-damping frame and electrically connecting the electronic component and the test socket; a supplyer for supplying an electronic component to be tested to the test socket or for retrieving an electronic component for which testing is completed; and a controller for controlling the connector and the supplyer; wherein the test socket is installed on the vibration-damping frame.

[0012] The above includes a fixer for fixing the above anti-vibration frame; and the controller controls the fixer to fix the anti-vibration frame or release the fixing state.

[0013] The controller fixes the anti-vibration frame by the fixer when supplying electronic components to the test socket by the supplyer or retrieving electronic components from the test socket, and releases the fixing state of the anti-vibration frame by the fixer during testing.

[0014] The above fixing device includes a fixing pin for fixing the above-mentioned anti-vibration frame; and a moving member that moves the fixing pin and is fixed to the base plate side; and the above-mentioned anti-vibration frame has a fixing hole formed therein to fix the above-mentioned anti-vibration frame in a fixed state or release the fixed state by inserting or removing the fixing pin.

[0015] The above fixing device includes a fixing pin for fixing the above anti-vibration frame; and a moving member that moves the fixing pin and is fixed to the side of the above anti-vibration frame; and a fixing hole is formed on the side of the base plate to fix the above anti-vibration frame in a fixed state or release the fixed state by inserting or removing the fixing pin.

[0016] The above-mentioned vibration-damping frame has a movement-limiting element that limits excessive movement of the vibration-damping frame when the vibration-damping frame is fixed to the base plate side.

[0017] The above movement limiting element is provided in a plate shape, thereby making surface contact with the base plate.

[0018] The above movement limiting element has a correction pin that corrects the position of the vibration-damping frame when the vibration-damping frame is fixed to the base plate side, and the base plate side has a correction hole into which the correction pin can be inserted.

[0019] The above anti-vibration frame has a detachable rail for detaching a socket board having a test socket.

[0020] The above detachable rail is provided at a height that creates a gap through which various wiring can pass between the socket board and the base plate when the above anti-vibration frame is fixed to the base plate side.

[0021] The above-mentioned dustproof frame and the above-mentioned connector are provided in multiple numbers, and the above-mentioned multiple connectors each operate independently. Effects of the invention

[0022] According to the present invention, vibrations generated by the operation of surrounding internal devices are minimized from being transmitted to mutually electrically connected electronic components and test sockets, and operational shocks generated during the electrical connection process between the electronic components and test sockets in the relevant area are minimized from being transmitted to the surroundings. Consequently, the electrical connection between the electronic components and the tester and the precision of that connection are maintained, ultimately improving the reliability of the test results.

[0023] In addition, according to the present invention, damage to an electronic component or a test socket that may occur due to unstable electrical contact between an electronic component and a test socket can be prevented. Brief explanation of the drawing

[0024] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to an embodiment of the present invention. Figure 2 is a schematic diagram of the structure of the test site applied to the handler of Figure 1. FIG. 3 is a perspective view of a feature portion according to a first embodiment that can be applied to the handler of FIG. 1. Figure 4 is an excerpt of a portion of the characteristic area of ​​Figure 3. Figure 5 is a reference diagram for explaining the operation of the characteristic part of Figure 3. FIGS. 6 to 8 are perspective views of a feature portion according to a second embodiment that can be applied to the handler of FIG. 1. FIGS. 9 and FIGS. 10 are perspective views of a feature portion according to a third embodiment that can be applied to the handler of FIG. 1. Specific details for implementing the invention

[0025] Preferred embodiments according to the present invention are described with reference to the accompanying drawings, provided that for the sake of brevity, descriptions of redundant or substantially identical components are omitted or compressed as much as possible.

[0026] <핸들러에 대한 개략적인 설명>

[0027] FIG. 1 is a conceptual plan view of an electronic component test handler (100, hereinafter abbreviated as 'handler') according to an embodiment in which the present invention can be most preferably applied.

[0028] As shown in FIG. 1, the handler according to the present invention includes three loading stackers (LS), two loading plates (110), four unloading plates (120), four loading tables (130), four movers (141 to 144), a first pick-and-place (150), four second pick-and-places (160), sixteen connectors (170), three unloading stackers (US), a transfer (TA), and a controller (CA).

[0029] Before describing each of the above components, the test sites (TS) of the handler (100) will be described first. The handler (100) of FIG. 1 has a total of four test sites (TS) at the rear.

[0030] Four test sites (TS) are positioned side by side in the left-right direction at the rear and have the same structure. Fig. 2 shows a schematic structure for one test site (TS). As shown in Fig. 2, the test site (TS) has four test positions (TP) arranged in two vertical tiers and two horizontal columns. To this end, each test site (TS) is constructed with an installation frame (IF) and a base plate (BP) in two vertical tiers. Additionally, a test socket (S) is installed at each test position (TP) to electrically connect electronic components to a tester. Thus, a total of four electronic components can be tested at one test site (TS). That is, electronic components can be placed on each of the four test sockets (S) installed at the four test positions (TP) by the second pick-and-place (160), and the electronic components and the tester are electrically connected by four connectors (170) pressing the electronic components they are responsible for toward the test sockets (S). Of course, depending on the implementation, a structure in which multiple test sockets (S) are provided at a single test location (TP) and a single connector (170) connects multiple electronic components to multiple test sockets (S) at once can also be considered.

[0031] Next, each of the previously mentioned components will be explained.

[0032] Three loading stackers (LS) are provided on the left front and accommodate customer trays (CT) loaded with electronic components to be tested.

[0033] Two loading plates (110) are provided side by side in the left-right direction on the right side of the loading stacker (LS), and customer trays (CT) from the loading stacker (LS) are placed on them.

[0034] Four unloading plates (120) are arranged side by side in the left-right direction on the right side of the loading plate (110), and a customer tray (CT) for loading electronic components that have been tested is placed thereon.

[0035] Four loading tables (130) are configured to move loaded electronic components and are located between two loading plates (110) and four unloading plates (120) in the front and four test sites (TS) in the rear.

[0036] Four movers (141 to 144) each move the loading table (130) they are responsible for between a first position (P1) adjacent to the loading plate (110) or unloading plate (120) and a second position (P2, which is rearward from the first position) adjacent to the test site (TS).

[0037] The first pick-and-place (150) moves electronic components to be tested from a customer tray (CT) placed on a loading plate (110) to a loading table (130) at a first position (P1), or moves electronic components that have been tested from a loading table (130) at a first position (P1) to customer trays (CT) placed on unloading plates (120) while classifying them according to the test results.

[0038] Four second pick-and-place (160) move electronic components to be tested from a loading table (130) at a second location (P2) to a test site (TS), or move electronic components that have been tested from a test site (TS) to a loading table (130) at a second location (P2). That is, electronic components are ultimately supplied to a test socket (S) at a test site (TS) or electronic components are recovered from a test socket (S) by the second pick-and-place (160).

[0039] The movement of electronic components between one test site (TS) and one loading table (130) is exclusively handled by one second pick-and-place (160). Therefore, four second pick-and-places (160) can operate independently of each other to move electronic components individually.

[0040] Sixteen connectors (170) are arranged in a 2x2 matrix, with four per test site (TS), so that one connector (170) corresponds vertically to one test position (TP) in each of the four test sites (TS). Each connector (170) allows an electronic component located at the test position (TP) to be electrically connected to the tester by applying pressure to the test socket (S), and this is explained in more detail in a separate section.

[0041] Three unloading stackers (US) receive customer trays (CT) loaded with electronic components that have been tested from the unloading plate (120) on the left.

[0042] The transfer (TA) is responsible for the movement of customer trays (CT) between the loading stacker (LS), the loading plate (110), the unloading plate (120), and the unloading stacker (US).

[0043] The controller (CA) controls the operation of four movers (141 to 144), a first pick-and-place (150), four second pick-and-places (160), 16 connectors (170), a transfer (TA), and a fixer, etc., which will be described later, by changing the order.

[0044] Next, the operation of the handler (100) having the configuration described above will be explained in a general manner. Since each of the test sites (TS), each of the loading tables (130), and each of the second pick-and-place (160) have the same configuration, for the sake of brevity of the explanation, the description of the other parts will be replaced by describing only one test site (TS), one loading table (130), and one second pick-and-place (160).

[0045] First, when the customer tray (CT) is moved from the loading stacker (LS) to the loading plate (110) by the transfer (TA), the first pick and place (150) moves the electronic components to be tested from the customer tray (CT) placed on the loading plate (110) to the loading table (130) at the first position (P1). Then, the movers (141 to 144) move the loading table (130) to the second position (P2), and the second pick and place (160) picks up the electronic components from the loading table (130) and supplies them to any one of the four test sockets (S) at the test site (TS) that is empty. Then, the connector (170) electrically and stably connects the electronic component and the test socket (S), and when the test of the electronic component is completed, the second pick-and-place (160) retrieves the electronic component from the test socket (S) and moves it to the loading table (130). Then, the mover (141 to 144) moves the loading table (130) to the first position (P1), and the first pick-and-place (150) grasps the electronic component that has completed testing from the loading table (130) at the first position (P1) and moves it to the customer tray (CT) on the unloading plate (120).

[0046] Meanwhile, when the customer tray (CT) on the unloading plate (120) is filled, the transfer (TA) moves the customer tray (CT) to the unloading stacker (US).

[0047] The above four loading tables (130), four moving machines (141 to 144), the first pick and place (150), four second pick and place (160), and the transfer (TA) can be collectively referred to as a receiving machine that supplies electronic components to be tested to the test socket (S) and then retrieves the electronic components after testing is complete, and can be provided in various configurations or forms depending on the type of handler.

[0048] <특징 부위의 제1 실시예에 대한 설명>

[0049] FIG. 3 illustrates the characteristic parts of the handler (100) according to FIG. 1 above. For reference, four characteristic parts of FIG. 3 are provided in each test site (TS).

[0050] Looking at FIG. 3, the handler (100) according to the present embodiment further includes a vibration-damping frame (180), a fixing device (190), and four vibration absorbers (VA).

[0051] The anti-vibration frame (180) is not directly fixed to the installation frame (IF), but is fixed only to the base plate (BP) with four vibration absorbers (VA) placed thereon. Therefore, the anti-vibration frame (180) moves relatively with respect to the base plate (BP), so that the vibration of the installation frame (IF) and the base plate (BP) can ultimately suppress the effect of vibration on the electrical connection between the electronic component and the test socket (S). Here, the installation plate (181) forming the bottom plate of the anti-vibration frame (180) has two fixing holes (FH, see FIG. 4) formed therein, and on the lower side thereis, a pair of locking parts (JP) bent in an L-shape are symmetrically arranged in the left and right directions.

[0052] And corresponding to the catch portion (JP), the base plate (BP) has a pair of stopper portions (SP) bent into an L-shape on its upper side, symmetrically arranged in the left and right directions. As will be described later, the catch portion (JP) and the stopper portion (SP) function as movement limiting elements that restrict excessive movement of the anti-vibration frame (180).

[0053] And a connector (170) is fixedly installed on the anti-vibration frame (180). Unlike the technology of the prior application, since the connector (170) is integrally connected only to the anti-vibration frame (180) and not to the installation frame (IF), it moves relatively with respect to the base plate (BP) together with the anti-vibration frame (180).

[0054] In addition, unlike the technology of the prior application, the test socket (S) is fixedly installed on the mounting plate (181), so the test socket (S) is also movable relative to the base plate (BP) together with the anti-vibration frame (180).

[0055] A fixing device (190) is installed to be fixed to a base plate (BP) and is provided to fix a dustproof frame (180) to the base plate (BP) or to release the fixed state. As referenced in FIG. 4, this fixing device (190) includes a fixing member (191) equipped with a fixing pin (FP) and a moving member (192).

[0056] A fixing member (191) equipped with a fixing pin (FP) is provided to press the mounting plate (181) upward or to release the pressure. Here, by inserting or removing two fixing pins (FP) into the fixing holes (FH) of the mounting plate (181), the front-rear and left-right positions of the anti-vibration frame are fixed or released. That is, when the fixing member (191) rises, the fixing member (191) presses the mounting plate (181), thereby fixing the vertical position of the mounting plate (181), and at the same time, the fixing pin (FP) is inserted into the fixing hole (FH) to fix the position of the mounting plate (181) in the front-rear and left-right directions. Meanwhile, when the fixed member (191) rises and pushes the mounting plate (181) up to some extent, as shown in FIG. 5, the catch portion (JP) catches on the stopper portion (SP), thereby preventing excessive upward movement of the fixed member (191) and the mounting plate (181). In addition, the mounting plate (181) can be firmly fixed to the base plate (BP) so that no movement or upward movement occurs in the front-back-left-right directions of the mounting plate (181) due to mutual pressure between the fixed member (191) and the mounting plate (181) and mutual pressure between the catch portion (JP) and the stopper portion (SP).

[0057] The moving member (192) raises and lowers the fixed member (191) so that the fixed member (191) moves toward the mounting plate (181) or away from the mounting plate (181). While it is preferable for this moving member (192) to be provided as a cylinder in terms of production cost, it may also be provided as a motor depending on the implementation.

[0058] To elaborate, in this embodiment, the fixing device (190) is fixedly installed on the base plate (BP) and the fixing hole (FH) is formed in the mounting plate (181), but depending on the implementation, it may also be considered that the fixing device is fixedly installed on the mounting plate and the fixing hole is formed in the base plate (BP).

[0059] The vibration absorber (VA) is placed between the anti-vibration frame (180) and the base plate (BP) to support the anti-vibration frame (180) with respect to the base plate (BP), thereby suppressing the transmission of vibrations from the base plate (BP) to the anti-vibration frame (180) and minimizing the transmission of vibrations caused by the operation of surrounding equipment. This vibration absorber may be provided as a commercially available spring damper-type mount with a built-in spring. However, depending on the implementation, the vibration absorber (VA) may be provided as a pneumatic cylinder capable of self-driving and elastically supporting the anti-vibration frame (180). In this way, as long as the vibration absorber (VA) is capable of elastic compression and expansion, it may be provided as any elastic body, without being limited to its driving method or form. In addition, the vibration absorber (VA) can be considered as a means to suppress vibration generation throughout the handler (100) by minimizing the transmission of vibrations generated by the operation of the connector (170) to the surroundings, thereby causing localized vibrations generated in the connector (170) to dissipate on their own and minimize transmission to the surroundings.

[0060] For reference, the symbol C in FIG. 3 is a camera for checking the flatness of the mounting plate (181), whether electronic components are supplied to the test socket (S), and the loading status of electronic components.

[0061] Next, the function and characteristic operation of the above characteristic parts will be explained.

[0062] When supplying electronic components to the test socket (S) by the second pick-and-place (160), it is necessary to fix the position of the anti-vibration frame (180). Therefore, the controller (CA) operates the fixer (190) to move the fixing member (191) upward. Accordingly, the fixing member (191) contacts the mounting plate (181) and presses the mounting plate (181) upward, causing the mounting plate (181) to rise. When the catch portion (JP) comes into contact with the stopper portion (SP) and catches, the vertical position of the mounting plate (181) relative to the base plate (BP) is fixed. At the same time, the fixing pin (FP) is inserted into the fixing hole (FH), and the front-rear and left-right positions of the mounting plate (181) are also corrected and fixed. Here, the statement that the mounting plate (181) rises is equivalent to the anti-vibration frame equipped with the mounting plate (181) rising.

[0063] When an electronic component is supplied to the test socket (S) by the second pick-and-place (160) in the state shown in FIG. 5, the connector (170) operates to press the electronic component toward the test socket (S), thereby electrically connecting the electronic component and the test socket (S). When the electrical connection between the electronic component and the test socket (S) is completed by the connector (170), the controller (CA) operates the fixer (190) to move the fixing member (191) downward, thereby releasing the fixing state of the anti-vibration frame (180) by the fixer (190), and a test of the electronic component is performed in this state. Therefore, during the test, vibrations generated from surrounding devices and transmitted through the installation frame (IF) and base plate (BP) to the electronic component and the test socket (S) are minimized.

[0064] Meanwhile, when the second pick-and-place (170) retrieves the electronic component from the test socket (S) after the test is finished, accurate gripping is important, so the retrieval of the electronic component by the second pick-and-place (170) is performed with the position of the dustproof frame (180) fixed as shown in FIG. 5.

[0065] <특징 부위의 제2 실시예에 대한 설명>

[0066] In the first embodiment above, the moving source of the fixer (190) is installed directly on the base plate (BP), so that the anti-vibration frame (180) is raised when the anti-vibration frame (180) is fixed to the base plate (BP).

[0067] However, the second embodiment referenced in FIG. 6 is implemented to lower the anti-vibration frame (280) when fixing the anti-vibration frame (280) to the base plate (BP). To this end, the movable member (292) is fixedly installed on the upper plate (UP), which is integrally combined with the base plate (BP) by placing the installation frame (IF), and the fixing pin (FP) protrudes downward as shown in the excerpt of FIG. 7. The fixing hole (FH) is formed on the coupling plate (CP) for connecting the connector (270) to the anti-vibration frame (280), and is ultimately formed on the base plate (BP) side. Of course, depending on the implementation, the fixing hole may be formed in the fixing member (291) and the fixing pin may be provided in the coupling plate (CP).

[0068] In addition, in this embodiment, an installation plate (281) for installing a socket board (SB) equipped with four task sockets (TS) makes surface contact with the base plate (BP) when the anti-vibration frame (280) is lowered, thereby limiting the excessive downward movement of the anti-vibration frame (280). That is, in this embodiment, when the anti-vibration frame (280) is lowered to fix the anti-vibration frame (280) to the base plate (BP), the plate-shaped installation plate (281) makes surface contact with the base plate (BP) and functions as a movement limiting element that limits the excessive downward movement of the anti-vibration frame (280).

[0069] Meanwhile, referring to FIG. 8, the lower surface of the mounting plate (281) has correction pins (RP) protruding downward, and the base plate (BP) has a correction hole (RH) into which the correction pins (RP) can be inserted. Thus, when the anti-vibration frame (280) is lowered, the correction pins (RP) are inserted into the correction hole (RH), and a correction operation is performed to precisely position the anti-vibration frame (280), and furthermore, horizontal movement of the anti-vibration frame (280) in all directions is prevented. That is, in this embodiment, the fixing pin (FP) and the correction pin (RP) form a pair to perform the role of fixing or positioning the anti-vibration frame (280).

[0070] For reference, as can be seen in FIGS. 6 and 7, this embodiment has a structure in which four pushers (PS) having four test sockets (S) apply pressure at once.

[0072] <특징 부위의 제3 실시예에 대한 설명>

[0073] The third embodiment differs from the second embodiment in that it has a separate pair of detachable rails (30R).

[0074] According to the present embodiment, as referenced in FIG. 9, two detachable rails (381R, 381L) are fixedly installed on both sides of the anti-vibration frame (380) and spaced apart from each other so as to protrude inward, and have rail grooves (RG) that are open toward the inside. Thus, a socket board (SB) equipped with four task sockets (TS) is mounted on the detachable rails (381R, 381L) by sliding and inserting its ends into the rail grooves (RG) while moving in the forward and backward directions, and is removed from the detachable rails (381R, 381L) by sliding in the reverse direction. That is, in the present embodiment, the detachable rails (381R, 381L) take over the role of the mounting plate (181, 281) in the first or second embodiment. And these detachable rails (381R, 381L) are provided at a height that creates a gap between the socket board (SB) and the base plate (BP) through which various wiring can pass even when the anti-vibration frame (380) is lowered and fixed to the base plate (BP). By providing the detachable rails (381R, 381L) in this manner, according to the present embodiment, the detachment of the socket board (SB) is easy, and the handling of various wiring connected to the socket board (SB) can also be easily performed.

[0075] In addition, in this embodiment, unlike the second embodiment as referenced in FIG. 10, the moving member (392) is fixedly installed on the coupling plate (CP), and ultimately, a fixing hole (FH) is formed in the additional member (AE) separately added to the installation frame (IF) on the base plate (BP) side. Accordingly, according to this example, when the moving member (392) is operated, the fixing pin (FP) of the fixing member (391) is inserted into the fixing hole (FH), and the fixing member (391) and the additional member (AE) come into contact, and when the coupling plate (CP) is subjected to downward pressure due to the continued operation of the moving member (392), the anti-vibration frame (380) is lowered.

[0076] And the downward movement of the anti-vibration frame (380) is terminated when the movement limiting plate (SP), which forms the bottom plate of the anti-vibration frame (380), comes into surface contact with the base plate (BP). That is, the movement limiting plate (SP) in this embodiment functions as a movement limiting element. Here, the movement limiting plate (SP) has a correction pin on its lower surface, similar to the installation plate (281) in the second embodiment, and accordingly, a correction hole is formed in the base plate (BP).

[0077] For reference, in the second and third embodiments above, to prevent surface damage caused by contact between the mounting plate (281) and the base plate (BP), and between the movement limiting plate (SP) and the base plate (BP), it may be considered desirable to attach a thin sheet of synthetic resin or rubber material to the lower surface of the mounting plate (281) and the movement limiting plate (SP) and the upper surface of the base plate (BP). Additionally, depending on the implementation, a correction hole may be formed in the mounting plate (281) and the movement limiting plate (SP), and a correction protrusion may be provided on the base plate (BP).

[0078] As described above, the present invention is characterized by having a separate vibration-damping frame that is relatively movable from the installation frame forming the basic framework of the handler, and if a structure capable of having such characteristics is required, the present invention can be appropriately applied to any handler. In particular, the present invention can be very preferably applied to a handler having a structure in which a plurality of connectors (170, 270, 370) are provided adjacent to each other, and each connector (170, 270, 370) operates independently so that they can be affected by mutual vibration due to operating shocks occurring sequentially in each connector (170, 270, 370).

[0079] Accordingly, as described above, the specific description of the present invention has been made through embodiments with reference to the attached drawings, but since the above-described embodiments are merely preferred examples of the present invention, the present invention should not be understood as being limited only to the above-described embodiments, and the scope of the rights of the present invention should be understood as the claims and equivalents described below. Explanation of the symbols

[0080] 100 : Handler for testing electronic components 130 : Loading table 141 to 144: Movers 150 : First Pick and Place 160 : Second Pick and Play 170 : Connector 180: Anti-vibration frame FH: Fixing hole 190 : Fixer FP : Fixed pin 192 : Moving source VA: Vibration absorber CA: Controller

Claims

Claim 1 A vibration isolation frame provided spaced apart from a base plate and movable relative to the base plate to suppress the effect of vibration of the base plate on the electrical connection between the electronic component and the test socket; a vibration absorber interposed between the vibration isolation frame and the base plate to minimize the transmission of vibration of the base plate to the vibration isolation frame; a connector installed on the vibration isolation frame and electrically connecting the electronic component and the test socket; a supply unit that supplies electronic components to be tested to the test socket or retrieves electronic components for which testing is completed; a controller that controls the connector and the supply unit; and a fixer that fixes the vibration isolation frame to the base plate; wherein the test socket is installed on the vibration isolation frame, and the fixer comprises a fixing member having a fixing pin for fixing the vibration isolation frame; and a moving source fixed to a coupling plate coupled to the vibration isolation frame, which raises and lowers the fixing member. An electronic component test handler comprising: an additional member attached to an installation frame on the base plate side, having a fixing hole into which the fixing pin can be inserted; wherein the controller controls the moving source to raise and lower the fixing member so that the fixing pin is inserted into or removed from the fixing hole, thereby fixing or releasing the fixing state of the anti-vibration frame, and controls the fixer to fix the anti-vibration frame when supplying electronic components to the test socket or retrieving electronic components from the test socket by the supplyer. Claim 2 In claim 1, the controller is an electronic component test handler that releases the fixed state of the anti-vibration frame by the fixer during testing. Claim 3 In claim 1, the anti-vibration frame is a handler for testing electronic components having a movement limiting element that limits excessive movement of the anti-vibration frame when the anti-vibration frame is fixed to the base plate side. Claim 4 In claim 3, the movement limiting element is provided in a plate shape so as to make surface contact with the base plate, thereby forming an electronic component test handler. Claim 5 An electronic component test handler according to claim 4, wherein the movement limiting element has a correction pin for correcting the position of the anti-vibration frame when the anti-vibration frame is fixed to the base plate side, and the base plate side has a correction hole into which the correction pin can be inserted. Claim 6 In claim 1, the above-mentioned dustproof frame is an electronic component test handler having a detachable rail for detaching a socket board having a test socket. Claim 7 In claim 6, the detachable rail is an electronic component test handler provided at a height that creates a gap between the socket board and the base plate through which various wirings can pass when the anti-vibration frame is fixed to the base plate side. Claim 8 An electronic component test handler according to claim 1, wherein the above-mentioned dustproof frame and the above-mentioned connector are provided in a plurality of units, and the above-mentioned plurality of connectors each operate independently.

Images