Home appliance and heat sinks installed therein

Abstract

A home appliance is disclosed. The disclosed home appliance forms a first air passage inside a heat sink and defines a second air passage on the lower side of the heat sink, thereby allowing air to flow efficiently into and out of the heat sink. Additionally, the home appliance can increase the contact area between the heat sink and the air by forming a plurality of heat dissipation members protruding downward on the wall surface of the second air passage. Furthermore, the home appliance forms a protrusion on at least one of the wall surface of the first air passage, the wall surface of the second air passage, the outer surface of the plurality of heat dissipation members, and the upper surface of the heat sink.

Description

Technology Field

[0001] The present invention relates to a home appliance and a heat sink installed therein. Background Technology

[0003] Various types of cooking appliances are used to heat food in homes and restaurants. These appliances include gas ranges that use gas and electric ranges that use electricity.

[0004] Electric ranges are broadly divided into resistance heating and induction heating methods.

[0005] The electric resistance method is a method of generating heat by applying an electric current to a metal resistance wire or a non-metallic heating element such as silicon carbide, and heating a workpiece (e.g., a cooking vessel such as a pot or frying pan) by radiating or conducting the generated heat.

[0006] Induction heating is a method of applying high-frequency power to a coil to generate a magnetic field around the coil, and using eddy currents generated from the generated magnetic field to heat a body made of metal components.

[0007] If we look at the basic heating principle of the induction heating method, when current is applied to the working coil or heating coil, heat is generated as the object to be heated undergoes induction heating, and the object to be heated is heated by the generated heat.

[0008] Meanwhile, the electric range is equipped with a driving circuit for driving a heating element, such as a working coil. The driving circuit is implemented in a plurality of electronic components, and the plurality of electronic components are installed on a printed circuit board.

[0009] At this time, heat is generated as the electronic components operate, causing the internal temperature of the electric range to rise. Additionally, the internal temperature of the electric range increases further due to the operation of the heating element. If the temperature of the electronic components themselves rises, the components may be damaged, and the electric range may malfunction. Therefore, a heat sink is mounted on the printed circuit board to cool the electronic components.

[0010] FIG. 1 is a perspective view of a heat sink equipped in a conventional home appliance.

[0011] FIG. 1 is an excerpt from FIG. 1 disclosed in EP 2,679,913 B1. The reference numerals in FIG. 1 are limited to the components of FIG. 1.

[0012] Referring to FIG. 1, a home appliance (10a) is equipped with an electronic unit (40a), a heat sink unit (20a), and a fan unit (20a) as an induction device. The electronic unit (40a) consists of two electronic circuit boards (42a, 44a) that generate high-frequency alternating current. Each electronic board (42a, 44a) includes five power components (46a).

[0013] The heat sink unit (20a) consists of two spaced-apart heat sinks (22a, 24a). The heat sinks (22a, 24a) are connected to one of the electronic circuit boards (42a, 44a). Each heat sink (22a, 24a) has five cooling fins arranged horizontally in a base shape with respect to the standard operational orientation of the appliance (10a). The base shape includes inclined receiving areas (23a, 25a) provided for thermal contact of the power component (46a).

[0014] The fan unit (30a) includes a radial fan (32a). The fan unit (30a) is surrounded by a heat sink unit (20a). The fan unit (30a) includes a fan cover (34a) that partially overlaps the heat sink (22a, 24a). The fan cover (34a) includes an intake opening (36a). The fan unit (30a) and the heat sink unit (20a) form two different cooling channels (60a, 62a). The fan unit (30a) and the heat sink unit (20a) are arranged radially symmetrically with respect to the rotation axis (38a) of the radial fan (32a). The cooling channels (60a, 62a) are formed facing each other.

[0015] Most of the air output from the fan unit (30a) flows into the interior of the heat sink unit (20a). The temperature of the heat sink unit (20a) is lowered by the air, and the temperature of the power component (46a) is lowered by the lowered temperature of the heat sink unit (20a). That is, the air output from the fan unit (30a) is not delivered directly to the power component (46a), and the power component (46a) is cooled indirectly.

[0016] However, the indirect cooling method used in the home appliance (10a) of Fig. 1 has the disadvantage of having lower cooling efficiency compared to the direct cooling method. The problem to be solved

[0018] The objective of the present invention is to provide a home appliance capable of increasing the cooling efficiency of an electronic component cooled by a heat sink.

[0019] In addition, the objective of the present invention is to provide a home appliance capable of increasing the contact area between the heat sink and the air.

[0020] In addition, the objective of the present invention is to provide a home appliance capable of directly cooling an electronic component attached to a heat sink.

[0021] In addition, the objective of the present invention is to provide a home appliance capable of controlling a plurality of heating units using a single driving circuit and a single heat sink.

[0022] The objectives of the present invention are not limited to those mentioned above, and other objectives and advantages of the present invention not mentioned may be understood from the following description and will be more clearly understood by the embodiments of the present invention. means of solving the problem

[0024] A home appliance according to one embodiment of the present invention forms a first air passage inside a heat sink and defines a second air passage on the lower side of the heat sink, thereby allowing air to flow efficiently into and out of the heat sink.

[0025] In addition, in a home appliance according to one embodiment of the present invention, a plurality of heat dissipation members are formed to protrude downward on the wall surface of a second air passage, thereby increasing the contact area between the heat sink and the air.

[0026] In addition, in a home appliance according to one embodiment of the present invention, the contact area between the heat sink and air can be further increased by forming a protrusion on at least one of the wall surface of the first air passage, the wall surface of the second air passage, the outer surface of a plurality of heat dissipation members, and the upper surface of the heat sink.

[0027] In addition, in a home appliance according to one embodiment of the present invention, air can come into direct contact with the electronic element by attaching the electronic element to the outer surface of the heat sink.

[0028] A home appliance according to another embodiment of the present invention includes a circuit board having a plurality of electronic components installed thereon and a heat sink mounted on the circuit board. Here, it includes a first portion having a first air passage formed in a hollow shape inside, a second portion connected to be inclined downward from a first side of the first portion, and a third portion connected to be inclined downward from a second side of the first portion. Additionally, the lower surface of the first portion, the inner inclined surface of the second portion, and the inner inclined surface of the third portion define a second air passage.

[0029] A home appliance according to one embodiment of the present invention comprises a case, a cover plate coupled to the top of the case, a plurality of heating elements disposed at the bottom of the cover plate, a circuit board having a driving circuit for driving the plurality of heating elements, a heat sink mounted on the circuit board, and a blower fan disposed spaced apart from the heat sink and providing air to the heat sink. Here, the heat sink has a cuboidal shape with a front and rear surface that are trapezoidal, and a first and second air passage is formed in the heat sink to provide a flow path for air discharged from the blower fan, the first air passage is formed below the second air passage, and a heat dissipation member disposed vertically is formed in the second air passage.

[0030] A heat sink according to one embodiment of the present invention is a heat sink mounted on a circuit board of a home appliance and comprises a first portion having a first air passage formed in a hollow shape inside, a second portion connected to be inclined downward from a first side of the first portion, and a third portion connected to be inclined downward from a second side of the first portion. Here, the lower surface of the first portion, the inner inclined surface of the second portion, and the inner inclined surface of the third portion define the second air passage. Effects of the invention

[0032] According to the present invention, the temperature of the heat sink can be reduced by efficiently allowing air to flow into and out of the heat sink through the first and second air passages.

[0033] In addition, according to the present invention, the cooling efficiency of the heat sink can be increased by increasing the contact area between the heat sink and the air.

[0034] According to the present invention, by allowing air to come into direct contact with an electronic device attached to a heat sink, the cooling efficiency of the electronic device can be further increased.

[0035] In addition to the effects described above, the specific effects of the present invention are described together with the specific details for implementing the invention below. Brief explanation of the drawing

[0036] FIG. 1 is a perspective view of a heat sink equipped in a conventional home appliance. FIG. 2 is a perspective view of an electric range according to one embodiment of the present invention. FIG. 3 is a perspective view showing some parts omitted in an electric range according to one embodiment of the present invention. FIG. 4 is a diagram showing an exploded perspective view of an electric range according to one embodiment of the present invention. FIG. 5 is a perspective view of a part of an electric range according to one embodiment of the present invention. Figure 6 is a plan view of Figure 5. FIG. 7 is a perspective view of an air guide according to one embodiment of the present invention, viewed from above. FIG. 8 is a perspective view of an air guide according to one embodiment of the present invention, viewed from below. FIG. 9 is a plan view of an air guide according to one embodiment of the present invention. FIG. 10 is a perspective view showing a printed circuit board equipped with a heat sink installed on a base bracket according to one embodiment of the present invention. Figure 11 is a plan view of Figure 10. Figure 12 is a cross-sectional view of Figure 10. FIG. 13 is a perspective view of a heat sink according to one embodiment of the present invention, viewed from above. FIG. 14 is a perspective view of a heat sink according to one embodiment of the present invention, viewed from below. FIG. 15 is a cross-sectional view of a heat sink according to one embodiment of the present invention. FIG. 16 is a perspective view of a heat sink with some electronic components attached thereto, according to one embodiment of the present invention. FIG. 17 is an exploded perspective view of a heat sink with some electronic components attached thereto, according to one embodiment of the present invention. FIG. 18 is a cross-sectional view of a heat sink to which some electronic elements are attached, according to one embodiment of the present invention. FIGS. 19 to 33 are drawings for explaining the simulation results of the present invention. Specific details for implementing the invention

[0037] The aforementioned objectives, features, and advantages are described in detail below with reference to the attached drawings, thereby enabling those skilled in the art to easily implement the technical concept of the present invention. In describing the present invention, detailed descriptions of known technologies related to the present invention are omitted if it is determined that such descriptions would unnecessarily obscure the essence of the invention. Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the attached drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

[0038] Although terms such as "first," "second," etc., are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used merely to distinguish one component from another, and unless specifically stated otherwise, the first component may also be the second component.

[0039] Throughout the specification, unless specifically stated otherwise, each component may be singular or plural.

[0040] As used in this specification, singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as “composed” or “comprising” should not be interpreted as necessarily including all of the various components or steps described in the specification, and should be interpreted as meaning that some of the components or steps may be omitted or additional components or steps may be included.

[0041] Throughout the specification, "A and / or B" means A, B, or A and B unless specifically stated otherwise, and "C to D" means C or more and D or less unless specifically stated otherwise.

[0042] Throughout the specification, "up-down direction" refers to the up-down direction of the electric range when it is installed for everyday use. "Left-right direction" refers to a direction orthogonal to the up-down direction, and "back-forward direction" refers to a direction orthogonal to both the up-down direction and the left-right direction. "Both-sided direction" or "side direction" has the same meaning as the left-right direction, and these terms may be used interchangeably in this specification.

[0043] In addition, in the coordinate axes shown in the drawing, the x-axis and -x-axis directions are represented as forward and backward, the y-axis and -y-axis directions as right and left, and the z-axis and -z-axis directions as upward and downward.

[0045] FIG. 2 is a perspective view of an electric range according to an embodiment of the present invention. FIG. 3 is a perspective view of an electric range according to an embodiment of the present invention with some parts omitted. FIG. 4 is an exploded perspective view of an electric range according to an embodiment of the present invention. FIG. 5 is a perspective view of some parts of an electric range according to an embodiment of the present invention. FIG. 6 is a plan view of FIG. 5.

[0046] Referring to FIGS. 2 to 6, an electric range according to one embodiment of the present invention may be a home appliance in which a heat sink (71) is mounted on a printed circuit board (70) on which a driving circuit is installed. Accordingly, the configuration of the electric range described below can be applied in the same way to a home appliance including a heat sink (71).

[0047] An electric range according to one embodiment of the present invention can heat a workpiece by means of induction heating. At this time, the workpiece may be a tableware containing a metal material such as stainless steel or iron.

[0048] Induction heating is a method of applying high-frequency power to a working coil (31) to generate a magnetic field around the working coil (31), and using an eddy current generated by the generated magnetic field to heat a body made of metal components.

[0049] That is, a magnetic field is generated around the working coil (31) by applying high-frequency power to the heating part (30), which has a structure adjacent to the ferrite core. When a body to be heated is placed within the region of the generated magnetic field, eddy currents are induced in the body to be heated by the magnetic field, and Joule's heat is generated by the eddy currents, so that the body to be heated can be heated. As the body to be heated is heated, food contained in the body to be heated can be heated.

[0050] An electric range according to an embodiment of the present invention may include a case (10), a cover plate (20), a heating unit (30), an upper bracket (40), and a base bracket (50).

[0051] The case (10) can protect the components that make up the electric range. For example, the case (10) may be made of aluminum, but is not limited thereto.

[0052] Meanwhile, the case (10) may be insulated to prevent heat generated by the working coil (31) from being released to the outside.

[0053] The case (10) can accommodate components forming an electric range, such as a heating unit (30), an upper bracket (40), and a control board (90). The top of the case (10) is open, but this open portion can be closed by a cover plate (20). The case (10) can be formed into a box shape by processing a plate-shaped material overall.

[0054] The case (10) may include a first casing (110), a second casing (120), and a third casing (130).

[0055] The first casing (110) can form the bottom surface of the case (10). The first casing (110) can support the internal components of the electric range described above.

[0056] The first casing (110) may be provided with at least one ventilation opening (111a, 111b). The at least one ventilation opening (111a, 111b) may allow air to flow in order to facilitate cooling of the printed circuit board (70) provided inside the first casing (110) and the circuit element or electronic element mounted on the printed circuit board (70).

[0057] The second casing (120) is formed to be bent from the first casing (110) and can form the side of the case (10). The second casing (120) can be bent in an upward and downward direction from the edge of the first casing (110) to become the side wall of the electric range.

[0058] A second casing (120) may be disposed on each side of a first casing (110) which is generally formed in a square shape. The second casing (120) can reinforce the rigidity of the entire case (10).

[0059] That is, in order to prevent the plate-shaped first casing (110) from bending or breaking due to the weight of the internal parts or external force, the second casing (120) may be formed by bending the first casing (110).

[0060] The second casing (120) is formed in a slit shape and may further include a plurality of exhaust holes (121). The exhaust holes (121) allow the inside and outside of the case (10) to communicate with each other. Accordingly, air can flow through the exhaust holes (121), and the parts housed inside the case (10) can be cooled.

[0061] The third casing (130) may be formed to be bent at a part of the second casing (120). The third casing (130) may support the upper bracket (40) together with the boss portion (513) to be described later. The third casing (130) may be placed on at least a part of the side of the first casing (110).

[0062] A first upper plate (41) forming the bottom surface of an upper bracket (40) can be seated on the upper surface of the third casing (130), and the first upper plate (41) and the third casing (130) can be joined together by a joining mechanism such as a bolt.

[0063] The cover plate (20) is attached to the top of the case (10), and a body to be heated can be placed on the upper surface. The cover plate (20) can protect the parts stored in the case (10) by closing the open top of the case (10).

[0064] A body to be heated is placed on the upper surface of the cover plate (20), and the magnetic field generated from the heating unit (30) can pass through the cover plate (20) and reach the body to be heated. The cover plate (20) may be provided with a material including, for example, ceramic, but is not limited thereto.

[0065] An input interface that receives input from a user may be installed on the upper surface of the cover plate (20). The input interface may be installed in a specific area of ​​the upper surface of the cover plate (20) and may display a specific image.

[0066] The input interface receives touch input from the user, and the electric range can be driven based on the received touch input.

[0067] For example, the input interface is a module for inputting the desired heating intensity or heating time by the user, and can be implemented as a physical button or touch panel.

[0068] For example, the input interface may be a TFT LCD (Thin Film Transistor Liquid Crystal Display), but is not limited thereto.

[0069] A control board (90) for inputting operation commands to an electric range may be provided at the bottom of the cover plate (20). The control board (90) is equipped with a plurality of key switches, and the user can control the operation of the electric range by inputting commands to the control board (90) through the key switches. The control board (90) may be mounted on a control board bracket (91), and the control board bracket (91) may be mounted on a first casing (110).

[0070] The upper surface of the control board (90) may be provided to be in close contact with the lower surface of the cover plate (20). At this time, the control board (90) may be positioned at a location corresponding to the input interface.

[0071] The control board (90) and the input interface can be connected to each other using a capacitive touch input method. Therefore, when a user inputs a control command into the input interface, the control command can be input into the control board (90).

[0072] A specific area on the upper surface of the cover plate (20) may be provided with a display showing the operating status of the electric range.

[0073] Specifically, a light display area may be formed on the upper surface of the cover plate (20). A light source unit (95) may be disposed on the lower surface of the cover plate (20), and light emitted from the light source unit (95) may be transmitted to the user through the light display area. At this time, the light display area and the light source unit (95) may be disposed at corresponding positions. If multiple light source units (95) are provided, the light display areas may also be provided on the upper surface of the cover plate (20) in the same number.

[0074] The heating unit (30) is provided in multiple units and is positioned below the cover plate (20), and can heat the object to be heated.

[0075] Referring to FIGS. 3 and 4, the electric range may include first, second, and third heating units (30). The first heating unit (30) may be positioned on the first side of the electric range, i.e., the right side, and may be a high-output heating unit. The second and third heating units (30) may be positioned on the second side of the electric range, i.e., the left side, and may be low-output heating units. The second and third heating units (30) may be positioned adjacently in the front and rear directions on the left side of the electric range.

[0076] As previously mentioned, the heating unit (30) can be implemented using an induction heating method. Meanwhile, according to another embodiment of the present invention, some of the plurality of heating units (30) may be implemented using an induction heating method, and the remainder may be implemented using an electric resistance heating method. That is, the electric range according to another embodiment of the present invention may be implemented as a highlight heating device or a hybrid electric range. Hereinafter, the embodiments described herein are described based on an electric range in which all of the plurality of heating units (30) are equipped using an induction heating method.

[0077] The temperature sensor (60) can detect the temperature of the cover plate (20). The temperature detected by the temperature sensor (60) can be used to estimate the temperature of the heating unit (30). The temperature sensor (60) can be installed in the center of the heating unit (30). The temperature sensor (60) can be electrically connected via a wire to a printed circuit board (70) provided on the lower side of the upper bracket (40).

[0078] The electric range may include a sensor bracket (61) for mounting a temperature sensor (60) in the center of the heating section (30). The sensor bracket (61) is mounted in the center of the heating section (30), and the temperature sensor (60) may be mounted inside the sensor bracket (61).

[0079] The heating unit (30) can be mounted on the upper bracket (40). According to the embodiments of FIGS. 3 and 4, two upper brackets (40) may be provided on the electric range. The upper bracket (40) provided on the first side of the electric range can support the high-output heating unit (30), and the upper bracket (40) provided on the second side of the electric range can support the low-output heating unit (30).

[0080] Of course, the number of heating units (30) and upper brackets (40) is not limited thereto. When multiple heating units (30) are provided, the upper brackets (40) supporting the heating units (30) may also be provided in any number as needed.

[0081] The heating unit (30) includes a working coil (31) and a core frame (32), and a ferrite core may be installed on the lower surface of the core frame (32). The working coil (31) may be wound spirally on the upper surface of the core frame (32). When high-frequency power is applied to the working coil (31), a magnetic field is formed around the ferrite core, and the formed magnetic field can generate eddy currents in the body to be heated.

[0082] The upper bracket (40) is positioned at the bottom of the heating unit (30) to support the heating unit (30). The upper bracket (40) may be referred to as the first bracket. The upper bracket (40) may be provided with, for example, aluminum, but is not limited thereto.

[0083] The upper bracket (40) may include a first upper plate (41) and a second upper plate (42).

[0084] The first upper plate (41) forms the bottom surface of the upper bracket (40) and can be equipped with a heating element (30). The first upper plate (41) can be provided to cover the printed circuit board (70) provided at the bottom in an up-and-down direction. If there are multiple upper brackets (40), depending on the area of ​​the printed circuit board (70), one first upper plate (41) or multiple first upper plates (41) can be combined with each other to cover the printed circuit board (70).

[0085] The first upper plate (41) can perform the role of shielding so that electromagnetic fields and electromagnetic waves generated from the heating unit (30) do not reach the printed circuit board (70) and the electronic components installed thereon. That is, the upper bracket (40) can perform the role of improving EMC (Electromagnetic Compatibility) and EMI (Electromagnetic Interference) with respect to the printed circuit board (70).

[0086] The second upper plate (42) can be formed by bending the first upper plate (41). At this time, the second upper plate (42) can be bent in the vertical direction of the electric range. That is, the second upper plate (42) can be formed to be bent in the vertical direction from the edge of the first upper plate (41). The second upper plate (42) can be placed on at least one side of the first upper plate (41), which is generally formed in a rectangular shape.

[0087] The second upper plate (42) can reinforce the rigidity of the entire upper bracket (40). That is, in order to prevent the plate-shaped first upper plate (41) from bending or breaking due to the weight of the internal part including the heating part (30) or external force, the second upper plate (42) can be formed to be bent from the first upper plate (41).

[0088] A light source unit (95) may be disposed on the upper bracket (40). For example, the light source unit (95) may be provided on a printed circuit board (70) disposed below the upper bracket (40), and an opening may be formed in the upper bracket (40) at a position corresponding to the light source unit (95). In another embodiment, the light source unit (95) may be disposed on the bracket, and the light source unit (95) may be electrically connected to the printed circuit board (70) below.

[0089] As described above, a light display area may be formed on the cover plate (20) at a portion corresponding to the light source unit (95).

[0090] The light source unit (95) may be provided, for example, in a form in which a plurality of LEDs are arranged in a row. The light source unit (95) may light up when the heating unit (30) is operating to inform the user whether the heating unit (30) is operating. Alternatively, the light source unit (95) may inform the user of the operating status of the electric range by changing the lighting shape, color, etc. of the plurality of LEDs.

[0091] The number of light source units (95) can be appropriately selected according to the number of heating units (30). FIGS. 3 and 4 illustrate a configuration in which three light source units (95) are provided for three heating units (30). However, the number of light source units (95) is not limited thereto.

[0092] The base bracket (50) may be referred to as the second bracket. The base bracket (50) is positioned below the upper bracket (40), and a printed circuit board (70) may be mounted thereon.

[0093] The base bracket (50) may include a bottom plate (51a, 51b) and a side plate (52).

[0094] The bottom plates (51a, 51b) form the bottom surface of the base bracket (50), and a printed circuit board (70) may be mounted on the upper surface of a portion (51a) of the bottom plate. A boss portion (513) may be formed on the other portion (51b) of the bottom plate. The boss portion (513) may support the upper bracket (40) together with the previously described third casing (130).

[0095] A portion (51a) of the bottom plate of the base bracket (50) may be formed on the right side (i.e., the first side) of the case (10). A portion (51a) of the bottom plate of the base bracket (50) may be positioned below the upper bracket (40) that supports the first heating unit (30). That is, a portion (51a) of the bottom plate of the base bracket (50) may be positioned below the right upper bracket (40).

[0096] Another part (51b) of the bottom plate of the base bracket (50) may be formed on the left side (i.e., the second side) of the case (10). A boss portion (513) is formed on the other part (51b) of the bottom plate of the base bracket (50), and the boss portion (513) may support a portion of the edge of the left upper bracket (40) and the right upper bracket (40).

[0097] The side plate (52) can be formed by folding from the bottom plate (51a, 51b). The side plate (52) can be formed to be folded in the up and down direction of the electric range. The side plate (52) can be formed to be folded in the up and down direction from the edge of the bottom plate (51). The side plate (52) can be placed on each side of the bottom plate (51), which is generally formed in a rectangular shape.

[0098] The side plate (52) can reinforce the rigidity of the entire base bracket (50). That is, in order to prevent the plate-shaped bottom plate (51) from bending or breaking due to the weight of internal components such as a circuit board or external force, the side plate (52) can be formed to be bent from the bottom plate (51).

[0099] The printed circuit board (70) can be configured to form a control unit, can receive power from an external power source, and can be configured to communicate with an external device via wired or wireless means.

[0100] The printed circuit board (70) can be electrically connected to the control board (90) and can receive commands entered by the user from the control board (90). The printed circuit board (70) can be electrically connected to the light source unit (95) and the working coil (31) to control their operation.

[0101] A plurality of electronic components may be installed on the printed circuit board (70). The plurality of electronic components may form a driving circuit. The driving circuit may perform the function of driving the heating unit (30).

[0102] A heat sink (71) may be mounted on the printed circuit board (70). For example, the heat sink (71) may be a cuboid with a trapezoidal shape on the front and back, i.e., a trapezoidal rectangular prism shape.

[0103] The heat sink (71) can cool the heat inside the case (10), and in particular, can cool the heat generated from some electronic components installed on the printed circuit board (70). Furthermore, the heat sink (71) can protect the components housed in the case (10).

[0104] At least one heat dissipation member may be formed in the heat sink (71). Cooling efficiency may be increased by at least one heat dissipation member.

[0105] The blower fan (80) can be mounted on the base bracket (50) and can perform the function of introducing external air into the interior of the case (10) to cool the case (10).

[0106] Referring to FIG. 4, a first through hole (511) may be formed in a specific area of ​​the base bracket (50), for example, the rear area, and a blower fan (80) may be installed above the first through hole (511). Also, the first through hole (511) may be positioned above the first ventilation opening (111a). Accordingly, external air may flow into the blower fan (80) through the first ventilation opening (111a) and the first through hole (511), and the air flowing into the blower fan (80) may be discharged by forced flow at the discharge port of the blower fan (80).

[0107] Air supplied from the blower fan (80) can flow to the printed circuit board (70). The blower fan (80) may be positioned at a specific distance from the heat sink (71), and some of the air discharged from the blower fan (80) may be supplied to the heat sink (71). The remaining portion of the air discharged from the blower fan (80) may be supplied to the outer area of ​​the heat sink (71).

[0108] The air guide (85) can guide air discharged from the blower fan (80). The air guide (85) can be mounted on the printed circuit board (70) to surround the heat sink (71). Thus, the air guide (85) can deliver air discharged from the blower fan (80) to the heat sink (71).

[0109] The first side of the air guide (85), for example, the rear side, can be connected to the discharge port of the blower fan (80), and the second side of the air guide (85), for example, the front side, can be connected to the front of the base bracket (50). At this time, a second through hole (512) can be formed on the front side of the base bracket (50), and the second through hole (512) can be positioned above the second ventilation port (111b). Accordingly, air that has cooled the heat sink (71) can flow to the second side of the air guide (85) and then be discharged to the outside of the case (10) through the second through hole (512) and the second ventilation port (111b).

[0110] Hereinafter, the shape of the air guide (85) will be described in more detail with further reference to FIGS. 7 to 9.

[0111] FIG. 7 is a perspective view of an air guide (85) according to an embodiment of the present invention viewed from the top. FIG. 8 is a perspective view of an air guide (85) according to an embodiment of the present invention viewed from the bottom. FIG. 9 is a plan view of an air guide (85) according to an embodiment of the present invention.

[0112] The air guide (85) can be positioned to communicate with the blower fan (80) and to surround the heat sink (71). The air guide (85) can provide a path for air flow to cool the heat sink (71).

[0113] The first side (85a) of the air guide (85) can be connected to the blower fan (80) and can guide air to flow in the lateral direction of the base bracket (50). At this time, the rear end of the heat sink (71) can be connected to the first side (85a) of the air guide (85). Air can flow in the front and rear directions of the electric range through the first side (85a) of the air guide (85). Air introduced into the first side (85a) of the air guide (85) can flow to the heat sink (71) to cool the heat sink (71).

[0114] The second side (85b) of the air guide (85) can be bent in the up and down direction of the base bracket (50) and can guide air to be discharged to the outside of the electric range. By forming the second side (85b) of the air guide (85) so as to face downward toward the electric range, the direction of air flow into the air guide (85) can be changed.

[0115] The air guide (85) can be detachably coupled to the base bracket (50). For example, the first side (85a) of the air guide (85) adjacent to the blower fan (80) can be coupled to the base bracket (50) by a coupling mechanism such as a screw bolt, and the second side (85b) of the air guide (85) through which air is discharged can be coupled to the base bracket (50) by a shape-fit method.

[0116] The air guide (85) may include a side wall (851) and a top wall (852). A flow space for air discharged from the blower fan (80) may be formed by the side wall (851) and the top wall (852). The side wall (851) may be provided as a pair, each positioned on both sides of the heat sink (71). The top wall (852) may be provided to cover the heat sink (71) by being coupled to the top of the pair of side walls (851).

[0117] The space formed by the side wall (851) and the top wall (852) becomes a flow space through which air discharged from the blower fan (80) flows, and a heat sink (71) is placed in the flow space. Accordingly, the heat sink (71) can be cooled by the air flowing through the flow space of the air guide (85).

[0118] The air guide (85) may be provided with a communication board mounting portion (853). The communication board mounting portion (853) may be positioned at a portion protruding laterally from the end of the upper bracket (40) when the air guide (85) is mounted on the electric range. The wireless communication unit mounted on the communication board mounting portion (853) may be positioned so as not to overlap with the upper bracket (40) made of metal material in the vertical direction. Accordingly, the wireless communication unit may be provided to communicate smoothly with an external device without being subject to radio interference by the upper bracket (40) made of metal material.

[0119] Hereinafter, the heat sink (71) placed inside the air guide (85) will be described in more detail with reference to FIGS. 10 to 18.

[0120] FIG. 10 is a perspective view showing a printed circuit board (80) equipped with a heat sink (71) installed on a base bracket (80) according to one embodiment of the present invention. FIG. 11 is a plan view of FIG. 10. FIG. 12 is a cross-sectional view of FIG. 10.

[0121] Referring to FIGS. 4, 10 to 12, a printed circuit board (70) can be mounted on a part (51a) of the bottom plate of a base bracket (50), and a heat sink (71) can be mounted on the printed circuit board (70).

[0122] The blower fan (80) can be mounted on the base bracket (50) spaced apart from the rear side (i.e., the third side) of the heat sink (71). The longitudinal direction (i.e., the front-rear direction) of the heat sink (71) can be parallel to the direction of air flow passing through the air guide (85). Accordingly, the contact area and contact time of the forced-flowing air with the heat sink (71) are increased, and the cooling efficiency of the heat sink (71) can be increased.

[0123] The discharge port (80a) of the blower fan (80) can be positioned at the rear of the heat sink (71). Accordingly, air discharged from the discharge port (80a) of the blower fan (80) can flow toward the rear of the heat sink (71).

[0124] A plurality of electronic components may be installed on the printed circuit board (70). The plurality of electronic components may form a driving circuit that controls the operation of a plurality of heating units (30). That is, the present invention can control a plurality of heating units (30) using one driving circuit and one heat sink (71).

[0125] Multiple electronic components may be installed on the right side (i.e., the first side) of the heat sink (71), on the left side (i.e., the second side) of the heat sink (71), and on the lower side of the heat sink (71). Meanwhile, air discharged from the blower fan (80) may be supplied to the heat sink (71), the electronic component installed on the right side of the heat sink (71), the electronic component installed on the left side of the heat sink (71), and the electronic component (763) installed on the lower side of the heat sink (71) through the air guide (85) and vane (514).

[0126] The driving circuit may include a rectifier, a DC link capacitor, an inverter, and a resonant capacitor.

[0127] The rectifier may be composed of rectifier elements (761a, 762a) and can convert AC power supplied from an external power source into DC power. As an example, the rectifier elements (761a, 762a) may include a bridge diode.

[0128] The DC link capacitor receives DC power from the rectifier elements (761a, 762a) and can reduce the ripple of the received DC power. The DC link capacitor may be, for example, a smoothing capacitor.

[0129] The DC voltage, which is rectified by the rectifier elements (761a, 762a) and has its ripple reduced by the DC link capacitor, can be supplied to the inverter.

[0130] The inverter may include a plurality of inverter switching elements (761b, 762b). The inverter switching elements (761b, 762b) may be alternately turned on or off by a switching signal to convert DC power into high-frequency alternating current (i.e., resonant current). The converted high-frequency alternating current may be supplied to the working coil (31).

[0131] As an example, the inverter switching element (761b, 762b) may include an IGBT (Insulated Gate Bipolar Transistor).

[0132] A plurality of resonant capacitors can be connected in parallel with each of the plurality of inverter switching elements (761b, 762b). When voltage is applied by the switching operation of the inverter, the resonant capacitor can start to resonate. Accordingly, the current flowing through the working coil (31) increases, and eddy currents are induced.

[0133] Some of the electronic components (761, 762) among the plurality of electronic components may be attached to the outer surface of the heat sink (71). That is, some of the electronic components (761, 762) may be attached to the outer inclined surface (720a, 730a, see FIG. 13, etc.) of the heat sink (71). As an example, some of the electronic components (761, 762) may be rectifier components (761a, 762a) and inverter switching components (761b, 762b). However, the present invention is not limited thereto, and various electronic components other than rectifier components (761a, 762a) and inverter switching components (761b, 762b) may be attached to the outer inclined surface (720a, 730a) of the heat sink (71). Hereinafter, for convenience of explanation, an embodiment in which rectifier elements (761a, 762a) and inverter switching elements (761b, 762b) are attached to a heat sink (71) is described.

[0134] Although not shown in the drawing, a thermal pad may be placed between the outer inclined surface (720a, 730a) of the rectifier element (761a, 762a) and the heat sink (71), and a thermal pad may also be placed between the outer inclined surface (720a, 730a) of the inverter switching element (761b, 762b) and the heat sink (71).

[0135] Meanwhile, the heat sink (71) may have a trapezoidal rectangular prism shape, and the temperatures of the two sides (720 730, see FIG. 13, etc.) of the heat sink (71) may differ due to heat generated from some electronic components (761, 762). Therefore, to minimize the temperature difference between the outer inclined surfaces (720a, 730a), vanes (514) may be formed, and a mounting structure for the blower fan (80) may be established. Here, the mounting structure for the blower fan (80) may include the rotation direction of the blower fan (80), the left and right distance of the blower fan (80) relative to the heat sink (71), and the angle of the discharge port (80a) of the blower fan (80).

[0136] A vane (514) can be formed between the discharge port (80a) of the blower fan (80) and the rear side of the heat sink (71). Air discharged from the blower fan (80) can have its flow path divided into two by the vane (514) positioned adjacent to the inlet of the air guide (85), and its flow direction can be guided so that it can flow into the flow space inside the air guide (85).

[0137] The vane (514) may include first and second vanes (514a, 514b). The first and second vanes (514a, 514b) may be formed to protrude toward the heat sink (71) and may be provided to be spaced apart from each other as they move toward the arrangement direction of the heat sink (71). That is, the first vane (514a) may be provided to protrude toward the heat sink (71), and the second vane (514b) may be provided to protrude toward the heat sink (71) separated from the first vane (514a), and the distance between the first vane (514a) and the second vane (514b) may be provided to become longer as they move toward the heat sink (71). Due to this structure, the forced-flowing air can be separated into two flow portions by the first and second vanes (514a, 514b).

[0138] Referring to FIGS. 10 and 11, the vane (514) may be formed on the base bracket (50). However, the present invention is not limited thereto. According to another embodiment of the present invention, the vane (514) may be formed integrally with the air guide (85) at the inlet of the air guide (85) (formed on the first side (85a)). According to yet another embodiment of the present invention, the vane (514) may be formed integrally with the blower fan (80) at the discharge port (80a) of the blower fan (80).

[0139] The structure for minimizing the temperature difference between the outer inclined surfaces (720a, 730a) will be described in more detail below.

[0140] Hereinafter, the structure of the heat sink (71) will be described in more detail with reference to FIGS. 13 to 15.

[0141] FIG. 13 is a perspective view of a heat sink (71) according to an embodiment of the present invention viewed from the top. FIG. 14 is a perspective view of a heat sink (71) according to an embodiment of the present invention viewed from the bottom. FIG. 15 is a cross-sectional view of a heat sink (71) according to an embodiment of the present invention.

[0142] Referring to FIGS. 12 to 15, the heat sink (71) may include a first part (710), a second part (720), and a third part (730).

[0143] The first part (710) may constitute the main body of the heat sink (71). The first part (710) may generally have a rectangular shape.

[0144] A hollow first air passage (711) may be formed inside the first part (710). The first air passage (711) may be formed by extending in the longitudinal direction (i.e., the front-rear direction) of the heat sink (71).

[0145] The first air passage (711) can provide a flow path for air discharged from the blower fan (80). That is, some of the air discharged from the blower fan (80) may flow into the rear side of the first air passage (711) and then flow out to the front side of the first air passage (711). By forming the first air passage (711), the contact area between the heat sink (71) and the air can be increased. According to the inventor's simulation results, considering the shape of the air guide (85), the height of the first air passage (711) may be 6 mm.

[0146] The second part (720) may be connected to slope downward from the right side (i.e., the first side) of the first part (710). The second part (720) may generally have a triangular prism shape. The second part (720) may include an outer sloped surface (720a), an inner sloped surface (720b), and a bottom surface (720c).

[0147] The outer slope (720a) of the second part (720) can be connected downward from the upper surface of the first part (710) according to a preset angle. The inner slope (720b) ​​of the second part (720) can be connected downward from the lower surface of the first part (710) according to a preset angle. The lower surface (720c) of the second part (720) can horizontally connect the lower end of the outer slope (720a) and the lower end of the inner slope (720b). Accordingly, the lower surface (720c) of the second part (720) may be lower in height than the lower surface of the first part (710).

[0148] The third part (730) may be connected to the left side (i.e., the second side) of the first part (710) so as to slope downward. The third part (730) may generally have a triangular prism shape. The third part (730) may include an outer inclined surface (730a), an inner inclined surface (730b), and a bottom surface (730c).

[0149] The outer slope (730a) of the third part (730) can be connected downward from the upper surface of the first part (710) according to a preset angle. The inner slope (730b) of the third part (730) can be connected downward from the lower surface of the first part (710) according to a preset angle. The lower surface (730c) of the third part (730) can horizontally connect the lower end of the outer slope (730a) and the lower end of the inner slope (730b). Accordingly, the lower surface (730c) of the third part (730) may be lower in height than the lower surface of the first part (710).

[0150] The second part (720) and the third part (730) have the same shape and can be positioned opposite each other on the first part (710). That is, the second part (720) and the third part (730) can be symmetric with respect to the first part (710).

[0151] A coupling member (750) may be formed in the longitudinal direction of the heat sink (71) on the lower surface of the second and third parts (720, 730). The coupling member (750) may be in the shape of a plate protruding downward from the lower surface of the second and third parts (720, 730). The coupling member (750) may be formed to mount the heat sink (71) to a printed circuit board (70).

[0152] According to the inventor's simulation results, when considering the shape of the air guide (85), the inclination angle of the second and third parts (720, 730) may be 40°.

[0153] A second air passage (740) may be formed in the heat sink (710). The second air passage (740) may be formed on the lower side of the first air passage (711). The second air passage (740) may be defined by the lower surface of the first part (710), the inner inclined surface (720b) ​​of the second part (720), and the inner inclined surface (730b) of the third part (730). That is, the lower surface of the first part (710) and the inner inclined surfaces (720b, 730b) of the second and third parts (720, 730) may correspond to the wall surface of the second air passage (740). Accordingly, the second air passage (740) may be in the shape of a trapezoidal rectangular column without a lower surface.

[0154] The second air passage (740) may be formed by extending along the length of the heat sink (71). The second air passage (740) may provide a flow path for air discharged from the blower fan (80). That is, a portion of the air discharged from the blower fan (80) may flow into the rear side of the second air passage (740) and then flow out to the front side of the second air passage (740). By forming the second air passage (740), the contact area between the heat sink (71) and the air may be increased.

[0155] A plurality of heat dissipation members (741) may be formed in the second air passage (740). The heat dissipation members (741) may be plate-shaped protruding downward from the wall surface of the second air passage (740). The heat dissipation members (741) may be formed extending in the longitudinal direction of the heat sink (71). By forming a plurality of heat dissipation members (741), the contact area between the heat sink (71) and the air may be increased.

[0156] A plurality of heat dissipation members (741) may be spaced apart at a predetermined interval. For example, a plurality of heat dissipation members (741) may be spaced apart at equal intervals. Each of the lower ends of the plurality of heat dissipation members (741) may have the same distance from the printed circuit board (70). That is, each of the lower ends of the plurality of heat dissipation members (741) may be formed to be in contact with the virtual lower surface of the second air passage (740).

[0157] Referring to FIG. 13, an electronic component (763) may be installed in close contact with a printed circuit board (70), and a second air passage (740) may be placed on the upper side of the electronic component (763). At this time, the greater the height of the heat dissipation member (741), the greater the contact area between the heat sink (71) and the air. Therefore, to further increase the contact area, a plurality of heat dissipation members (741) may be formed to have a maximum height that does not interfere with the electronic component (763) installed on the lower side of the heat sink (71).

[0158] Meanwhile, a plurality of protrusions (7111, 712, 7411) may be further formed on the heat sink (71). The plurality of protrusions (7111, 712, 7411) may be formed to increase the contact area between the heat sink (71) and air.

[0159] Specifically, the plurality of protrusions (7111, 712, 7411) may include a first protrusion (712), a second protrusion (7111), and a third protrusion (7411). Also, although not shown in the drawing, the plurality of protrusions (7111, 712, 7411) may further include a fourth protrusion and a fifth protrusion.

[0160] The first protrusion (712) may be formed on the upper surface of the first part (710). The first protrusion (712) may be formed extending along the length of the heat sink (71) on the upper surface of the first part (710). Referring to FIG. 15, the first protrusion (712) may be formed by being recessed on the upper surface of the first part (710).

[0161] The second protrusion (7111) may be formed on the wall surface of the first air passage (711). The second protrusion (7111) may be formed extending along the length of the heat sink (71) on the wall surface of the first air passage (711). Meanwhile, although FIGS. 13 to 15 show that the second protrusion (7111) is formed on the entire wall surface of the first air passage (711), the second protrusion (7111) may be formed only on a part of the wall surface of the first air passage (711).

[0162] The third protrusion (7411) may be formed on the outer surface of the heat dissipation member (741). Meanwhile, although FIGS. 13 to 15 show that the third protrusion (7411) is formed on all of the plurality of heat dissipation members (741), the third protrusion (7411) may be formed on only some of the heat dissipation members (741).

[0163] The fourth protrusion may be formed on the wall of the second air passage (740). That is, the fourth protrusion may be formed on the lower surface of the first part (710) and on the inner inclined surface (720b, 730b) of the second and third parts (720, 730). The fourth protrusion may be formed extending along the length of the heat sink (71) on the wall of the second air passage (740).

[0164] The fifth projection may be formed on the outer surface of the coupling member (750) protruding from the inner inclined surfaces (720b, 730b) of the second and third parts (720, 730). The fifth projection may be formed extending along the length of the heat sink (71) on the outer surface of the coupling member (750). The fifth projection may be formed on the portion of the coupling member (750) that is not coupled to the printed circuit board (70).

[0165] Meanwhile, as previously mentioned, some electronic components (761, 762) constituting the driving circuit may be attached to the outer surface of the heat sink (71). Hereinafter, the shape of the heat sink (71) with some electronic components (761, 762) attached will be described in more detail with reference to FIGS. 16 to 18.

[0166] FIG. 16 is a perspective view of a heat sink (71) to which some electronic elements (761, 762) are attached, according to an embodiment of the present invention. FIG. 17 is an exploded perspective view of a heat sink (71) to which some electronic elements (761, 762) are attached, according to an embodiment of the present invention. FIG. 18 is a cross-sectional view of a heat sink (71) to which some electronic elements (761, 762) are attached, according to an embodiment of the present invention.

[0167] Referring to FIGS. 16 to 18, some electronic components (761, 762) may be attached to the outer inclined surfaces (720a, 730a) of the heat sink (71).

[0168] Specifically, some electronic components (761, 762) may be divided into a first electronic component group (761) and a second electronic component group (762). The first electronic component group (761) may be attached to the outer inclined surface (720a) of the second part (720) of the heat sink (71). The second electronic component group (762) may be attached to the outer inclined surface (730a) of the third part (730) of the heat sink (71).

[0169] The first electronic device group (761) may be a group of electronic devices for driving some of the heating parts (30). Here, some of the heating parts may be the first heating parts (30) positioned on the right side (i.e., the first side) of the case (10). Hereinafter, some of the heating parts will be described by assuming they are the first heating parts (30).

[0170] The first electronic device group (761) may include a first rectifier element (761a) and four first inverter switching elements (761b) for driving a first heating unit (30) of high output. That is, the first electronic device group (761) is attached to the right inclined surface (720a) of the heat sink (71) and can be used to drive the first heating unit (30) positioned on the right.

[0171] The second electronic device group (762) may be a group of electronic devices for driving the remaining portion of the heating parts among the plurality of heating parts (30). Here, the remaining portion of the heating parts may be the second and third heating parts (30) placed on the left side (i.e., the second side) of the case (10). Hereinafter, the remaining portion of the heating parts will be described as being the second and third heating parts (30).

[0172] The second electronic device group (762) may include a second rectifier element (762a) and four second inverter switching elements (762b) for driving the second and third heating units (30) of low power. That is, the second electronic device group (762) is attached to the left inclined surface (730a) of the heat sink (71) and can be used to drive the second and third heating units (30) positioned on the left.

[0173] Meanwhile, according to one embodiment of the present invention, the attachment position of some electronic elements (761, 762) on the outer surface of the heat sink (71) can be set based on the heat resistance temperature of the electronic elements.

[0174] Specifically, electronic devices have a heat resistance temperature, and each type of electronic device has a different heat resistance temperature. For example, an IGBT, which is an inverter switching device (761b, 762b), has a heat resistance temperature of 180°C, and a bridge diode, which is a rectifier device (761a, 761b), has a heat resistance temperature of 150°C.

[0175] Also, referring to FIGS. 5, 6, 10 and 11, since the blower fan (80) is spaced apart from the heat sink (71), the part of the heat sink (71) that is close to the blower fan (80) has a lower temperature than the other part of the heat sink (71) that is far from the blower fan (80). That is, the rear side of the heat sink (71) that is close to the blower fan (80) has a lower temperature than the front side of the heat sink (71) that is far from the blower fan (80).

[0176] Accordingly, to further prevent damage to electronic components due to temperature, according to one embodiment of the present invention, an electronic component with a low heat resistance temperature may be attached to a portion of the heat sink (71) with a relatively low temperature, and an electronic component with a high heat resistance temperature may be attached to a portion of the heat sink (71) with a relatively high temperature. That is, each of the electronic components (761, 762) may be attached closer to the blower fan (80) as the heat resistance temperature is lower. For example, a bridge diode, which is a rectifier element (761a, 762a), may be attached closer to the blower fan (80) than an IGBT, which is an inverter switching element (761b, 762b).

[0177] Hereinafter, the features of an electric range according to one embodiment of the present invention will be specifically described with reference to the description of the drawings above.

[0178] Referring to FIGS. 13 and 15, the heat sink (71) may have first and second air passages (711, 740) formed on the inside and outside. Additionally, a heat dissipation member (741) may be formed downwardly on the wall surface of the second air passage (711, 740). Furthermore, protrusions may be formed on the wall surface of the first and second air passages (711, 740), the outer surface of the heat dissipation member (741), and the outer surface of the coupling member (750).

[0179] Due to this structure, the contact area between the air and the heat sink (71) is increased. Accordingly, the cooling efficiency of the heat sink (71) is increased, and the temperature of the heat sink (71) can be lowered.

[0180] Additionally, some electronic components (761, 762) may be attached to the outer inclined surfaces (720a, 730a) of the heat sink (71). Accordingly, the cooling efficiency of some electronic components (761, 762) may be increased by the lowered temperature of the heat sink (71).

[0181] In particular, according to one embodiment of the present invention, the cooling efficiency of some electronic components (761, 762) can be further increased by further using an air guide (85) and a blower fan (80).

[0182] Specifically, referring to FIGS. 4, 5 and 10, a heat sink (71) to which some electronic elements (761, 762) are attached is placed inside an air guide (85), and a blower fan (80) supplies air into the air guide (85). Accordingly, the supplied air can flow from the rear side to the front side inside the air guide (85).

[0183] At this time, the air inside the air guide (85) flows into the first and second air passages (711, 740) of the heat sink (71), and at the same time flows into the space between the outer inclined surface (720a, 730a) of the heat sink (71), the side wall and the upper wall (851, 852) of the air guide (85). The air flowing into the space between comes into contact with some electronic elements (761, 762).

[0184] Accordingly, some electronic components (761, 762) are cooled by the lowered temperature of the heat sink (71), and further cooled by the contact of air flowing through the space between them. That is, some electronic components (761, 762) are cooled twice by the surface temperature of the heat sink (71) and the discharge air of the blower fan (80) inside the air guide (85), thereby increasing cooling efficiency. Accordingly, malfunction of the electric range can be prevented.

[0185] In particular, since the area of ​​the space between the above is small, the air flowing into the space between the above has a high speed according to Bernoulli's theorem. Therefore, some electronic components (761, 762) can be rapidly cooled by the air flowing at a high speed.

[0186] In addition, vanes (514) may be formed to minimize the temperature difference between the outer sloped surfaces (720a, 730a) of the heat sink (71).

[0187] Specifically, the outer inclined surfaces (720a, 730a) of the heat sink (71) may be provided as a pair. In this case, when the vanes (514) are not formed, air of different flow rates may flow on each of the outer inclined surfaces (720a, 730a) of the heat sink (71) due to the rotation direction of the blower fan (80) and the position of the blower fan (80) relative to the heat sink (71). As a result, a situation may occur where some electronic components (761, 762) attached to one inclined surface (720a, 730a) of the heat sink (71) have high cooling efficiency, while some electronic components (761, 762) attached to the other inclined surface (720a, 730a) of the heat sink (71) have low cooling efficiency.

[0188] Accordingly, vanes (514) may be positioned to guide the air supplied to each of the outer inclined surfaces (720a, 730a) of the heat sink (71) to flow uniformly. That is, the vanes (514) are formed between the discharge port (80a) of the blower fan (80) and the rear side of the heat sink (71) and include first and second vanes (514a, 514b) connected at a predetermined angle. Depending on the position and shape of these vanes (514), the air discharged from the blower fan (80) is separated into two flow portions, and due to the two separated flow portions, the air flows uniformly to each of the outer inclined surfaces (720a, 730a) of the heat sink (71). Accordingly, all of the electronic components (761, 762) attached to each of the outer inclined surfaces (720a, 730a) of the heat sink (71) can be efficiently cooled.

[0189] In addition, the mounting structure of the blower fan (80) can be efficiently set up to minimize the temperature difference between the outer inclined surfaces (720a, 730a) of the heat sink (71).

[0190] Specifically, when the blower fan (80) rotates clockwise, more air can be supplied to the second outer inclined surface (720a) of the heat sink (71), and when the blower fan (80) rotates counterclockwise, more air can be supplied to the third outer inclined surface (730a) of the heat sink (71). Additionally, when the blower fan (80) is positioned toward the right side of the heat sink (71), more air can be supplied to the second outer inclined surface (720a), and when the blower fan (80) is positioned toward the left side of the heat sink (71), more air can be supplied to the third outer inclined surface (730a). In this case, a situation may occur where some electronic components (761, 762) attached to one inclined surface (720a, 730a) of the heat sink (71) have high cooling efficiency, and some electronic components (761, 762) attached to the other inclined surface (720a, 730a) of the heat sink (71) have low cooling efficiency.

[0191] Accordingly, the rotation direction of the blower fan (80) and the left and right distance of the blower fan (80) relative to the heat sink (71) can be set so that the temperature difference between the second part (720) and the third part (730) of the heat sink (71) is minimized. Accordingly, all of the electronic components (761, 762) attached to each of the outer inclined surfaces (720a, 730a) of the heat sink (71) can be efficiently cooled.

[0192] In particular, depending on the shape of the vane (514), the discharge port (80a) of the blower fan (80) can be positioned at a predetermined angle relative to the rear end of the heat sink (71). That is, referring to FIG. 11, the placement positions of the first and second vanes (514a, 514b) are not symmetrical, and the angle between the rear end of the heat sink (71) and the second vane (514b) is smaller than the angle between the rear end of the heat sink (71) and the first vane (514a). Therefore, in order to equalize the air flow of the two flow sections separated by the first and second vanes (514a, 514b), the discharge port (80a) of the blower fan (80) can be positioned at a predetermined angle relative to the rear end of the heat sink (71).

[0193] Additionally, a first part (710) of the heat sink (71) may be positioned such that a first air passage (711) is formed between the second part (720) and the third part (730) of the heat sink (71). Accordingly, the temperature of the heat sink (71) is lowered based on the air flowing through the first air passage (711), and the temperature difference between the second and third parts (720, 730) of the heat sink (71) can be minimized by the first part (710) of the heat sink (71).

[0194] Additionally, hot air that has come into contact with some electronic components (761, 762) is discharged to the outside of the case (10) through the second side (85b) of the air guide (85). Thus, the hot air does not come into contact with some electronic components (761, 762) again, and some electronic components (761, 762) can be efficiently cooled.

[0195] Hereinafter, with reference to FIGS. 19 to 33, the simulation results of the temperature distribution of the heat sink (71) of the present invention will be described in detail.

[0196] At this time, the electric range used in the simulation is equipped with three heating elements, one heat sink, and one blower fan. The blower fan rotates clockwise for 1200 minutes at a speed of 2100 rpm. Also, no vanes are formed, and the discharge port of the blower fan is positioned parallel to the rear end of the heat sink. Also, throughout FIGS. 19 to 33, "Left" refers to the heating element positioned on the left, "Right" refers to the heating element positioned on the right, and "x%" refers to the driving rate of the heating element.

[0197] FIG. 19 is a plan view of a heat sink (71) used in this simulation. Referring to FIG. 19, one bridge diode and four IGBTs are attached to each of the inclined sides of the heat sink (71). Here, "W" represents the power consumed by the electronic components. Also, the unit of length is mm.

[0198] FIGS. 20 and FIGS. 21 illustrate the results of the first simulation of the present invention.

[0199] In the first simulation of the present invention, two types of heat sinks are used. That is, with reference to FIG. 20, in the first simulation of the present invention, a vertical heat sink (vertical type) in which a heat dissipation member is formed at the bottom and a horizontal heat sink (horizontal type) in which a heat dissipation member is formed on the left and right sides are used.

[0200] Referring to Figures 20 and 21, it can be seen that the horizontal heat sink has better cooling efficiency compared to the vertical heat sink. Additionally, it can be seen that the closer the distance between the blower fan and the heat sink, the better the cooling efficiency of the heat sink.

[0201] Figures 22 and 23 illustrate the results of the second simulation of the present invention.

[0202] Referring to FIGS. 22 and 23, a second simulation was performed with 7 cases. The 7 cases are as follows.

[0204] - Default Case: Horizontal heat sink of the first simulation

[0205] - Case 1: In the Default Case, add the number of heat dissipation components

[0206] - Case 2: In the default case, increase the length of the heat dissipation member

[0207] - Case 3: In the default case, the length of the heat dissipation member is standardized.

[0208] - Case 4: In Case 1, unify the length of the heat dissipation member

[0209] - Case 5: In the default case, place the heat sink inside the air guide.

[0210] - Case 6: In Case 4, place the heat sink inside the air guide.

[0212] Referring to FIGS. 22 and FIGS. 23, it can be seen that the cooling efficiency of the electronic device is improved in the Default Case for all Cases 1 to 6.

[0213] In addition, in Case 2, it can be confirmed that there is a large temperature difference between the left and right sides of the heat sink. Also, in Case 3, since the left and right heat dissipation elements are connected to each other, heat generated from an electronic component attached to one side is effectively transferred to the opposite side, so it can be confirmed that there is a small temperature difference between the left and right sides of the heat sink.

[0214] In addition, in Case 4, it can be seen that the internal temperature of the heat sink was lowered because the length of the heat dissipation elements was standardized. Also, in Cases 5 and 6, it can be seen that the cooling efficiency of the electronic components attached to the heat sink was increased because an air guide was used.

[0215] FIGS. 24 to 27 illustrate the results of the third simulation of the present invention.

[0216] Referring to FIGS. 24 and FIGS. 27, a third simulation was performed with six cases. The six cases are as follows.

[0218] - Default Case: Horizontal heat sink of the first simulation

[0219] - Case 1: From the default case, move the blower fan 10mm to the left.

[0220] - Case 2: From the Default Case, move the blower fan 10mm to the right.

[0221] - Case 3: From the Default Case, move the blower fan 20mm to the right.

[0222] - Case 4: In the default case, separate the upper side of the heat sink

[0223] - Case 5: In the default case, separate the lower side of the heat sink

[0225] Referring to Figures 24 and 27, it can be seen that the temperature of the electronic device in Cases 1 and 2 is lower than in the Default Case. Also, it can be seen that the average temperature of the electronic device in Case 2 is lower than in Case 1. However, in the case of Case 3, it can be seen that the temperature of the electronic device is higher than in the Default Case.

[0226] In addition, in Cases 4 and 5, compared to the Default Case, it can be observed that the temperature of the electronic device decreases at the separation end but increases at the separation end. This is because the air flowing into the heat sink is lost at the separation end.

[0227] Figures 28 and 29 illustrate the results of the fourth simulation of the present invention.

[0228] Referring to FIGS. 28 and 29, the fourth simulation was performed with three cases. The four cases are as follows.

[0230] - Default Case: Horizontal heat sink of the first simulation

[0231] - Case 1: Change in the shape of the heat dissipation element in the default case

[0232] - Case 2: First and second air passages are formed, and a heat dissipation member is formed below the second air passage.

[0234] Referring to Figures 28 and 29, it can be seen that the cooling efficiency of the heat sink is increased in both Case 1 and 2 compared to the Default Case. Additionally, it can be seen that the cooling efficiency of the heat sink is higher in the order of Case 2 > Case 1 > Default.

[0235] FIGS. 30 to 32 illustrate the results of the fifth simulation of the present invention.

[0236] Referring to FIGS. 30 to 32, the fifth simulation was performed with six cases. The six cases are as follows.

[0238] - Default Case: Horizontal heat sink of the first simulation

[0239] - Case 1: In Case 2 of the first simulation, the height of the first air passage is formed to be 6mm.

[0240] - Case 2: In Case 2 of the first simulation, the height of the first air passage is formed to be 7mm.

[0241] - Case 3: In Case 2 of the first simulation, the height of the first air passage is formed to be 8mm.

[0242] - Case 5: In Case 1, remove 2 heat dissipation components

[0243] - Case 6: In Case 1, remove 4 heat dissipation components

[0245] Referring to FIGS. 30 to 32, it can be seen that the temperature of the electronic component is lowest in Case 1. Also, it can be seen that the higher the height of the first air passage, the lower the cooling efficiency of the heat sink. In addition, it can be seen that the smaller the number of heat dissipation elements, the lower the cooling efficiency.

[0246] Figure 33 illustrates the results of the sixth simulation of the present invention.

[0247] Referring to Fig. 33, the 6th simulation was performed with 2 cases. The 6 cases are as follows.

[0249] - Default Case: Horizontal heat sink of the first simulation

[0250] - Case 1: Case 1 of the 5th simulation

[0252] Referring to Fig. 33, it can be seen that Case 1 has better cooling efficiency than the Default Case.

[0253] Accordingly, the heat sink (71) according to one embodiment of the present invention corresponds to the heat sink of Case 1 of the 6th simulation.

[0255] In summary, an electric range according to one embodiment of the present invention forms a first air passage (711) inside a heat sink (71) and defines a second air passage (740) on the lower side of the heat sink (71), thereby allowing air to flow efficiently inside and outside the heat sink (71). Accordingly, the temperature of the heat sink (71) can be reduced.

[0256] In addition, in an electric range according to one embodiment of the present invention, a plurality of heat dissipation members (741) are formed to protrude downwardly from the wall surface of the second air passage (740), thereby increasing the contact area between the heat sink (71) and the air. Furthermore, by forming a protrusion on at least one of the wall surface of the first air passage, the wall surface of the second air passage, the outer surface of the plurality of heat dissipation members, and the upper surface of the heat sink, the contact area between the heat sink and the air can be further increased. Accordingly, the cooling efficiency of the heat sink (71) can be increased.

[0257] In addition, an electric range according to one embodiment of the present invention can have cooling air directly contact the electronic elements (761, 762) by attaching electronic elements (761, 762) to the outer surface of a heat sink (71). Specifically, the electric range can have electronic elements (761, 762) attached to the outer inclined surface (720a, 730b) of the heat sink, arrange an air guide to surround the heat sink (71) to which the electronic elements (761, 762) are attached, and use a blower fan (80) to flow air inside the air guide (85). Accordingly, the flowed air can directly contact the electronic elements (761, 762), and the cooling efficiency of the electronic elements (761, 762) can be increased.

[0258] In addition, an electric range according to one embodiment of the present invention can set the position of an electronic element (761, 762) to be attached to the outer surface of a heat sink (71) based on the heat resistance temperature of the electronic element. Accordingly, the electronic element (761, 762) can be prevented from exceeding the heat resistance temperature, and consequently, damage to the electronic element (761, 762) can be prevented.

[0259] In addition, in an electric range according to one embodiment of the present invention, the mounting structure of the blower fan (80) can be set based on the temperature difference between both sides of the heat sink (71). Accordingly, the temperature can be evenly distributed across the entire area of ​​the heat sink (71).

[0260] In addition, an electric range according to one embodiment of the present invention forms a first air passage (711) inside a heat sink (71), thereby allowing air to flow efficiently into the interior of the heat sink (71) and at the same time minimizing the temperature difference between the two sides of the heat sink (711).

[0262] As described above, the present invention has been explained by specific details such as specific components, limited embodiments, and drawings; however, this is provided merely to aid in the overall understanding of the invention, and the invention is not limited to the above embodiments. A person skilled in the art to which the invention pertains can make various modifications and variations from this description. Therefore, the scope of the invention should not be limited to the described embodiments, and all things equivalent to or having equivalent variations to the claims set forth below, as well as the claims themselves, shall be considered to fall within the scope of the concept of the invention.

Claims

Claim 1 A home appliance comprising: a circuit board having a plurality of electronic components installed thereon; a heat sink mounted on the circuit board; and a blower fan for discharging air toward the heat sink; wherein the heat sink comprises a first portion having an internal hollow and second and third portions connected to be inclined downward at a first side and a second side of the first portion, respectively, the internal hollow defines a first air passage inside the heat sink, and the lower surface of the first portion and the inner inclined surface of each of the second and third portions define a second air passage outside the heat sink, and the discharged air flows through the upper surface of the first portion, the outer inclined surface of each of the second and third portions, and the first and second air passages. Claim 2 A home appliance according to claim 1, wherein the lower surface of the first part is higher in height than the lower surface of the second part and the lower surface of the third part. Claim 3 A home appliance according to claim 1, wherein a first protrusion is formed on the upper surface of the first part in the longitudinal direction of the heat sink. Claim 4 A home appliance according to claim 1, wherein a second projection is formed in the longitudinal direction of the heat sink on at least a portion of the wall surface of the first air passage. Claim 5 A home appliance according to claim 1, further comprising a plurality of heat dissipation members formed to protrude downward from the wall surface of the second air passage, wherein the wall surface of the second air passage corresponds to the lower surface of the first part, the inner inclined surface of the second part, and the inner inclined surface of the third part. Claim 6 In paragraph 5, each of the plurality of heat dissipation members is formed by extending in the longitudinal direction of the heat sink, in a home appliance. Claim 7 A home appliance according to claim 5, wherein a third protrusion is formed on the outer surface of at least some of the heat dissipation members among the plurality of heat dissipation members. Claim 8 A home appliance according to claim 5, wherein a fourth projection is formed on the wall surface of the second air passage in the longitudinal direction of the heat sink. Claim 9 A home appliance according to claim 5, wherein the plurality of heat dissipation members are spaced apart at preset intervals. Claim 10 In paragraph 5, a home appliance in which the lower portion of each of the plurality of heat dissipation members has the same distance from the circuit board. Claim 11 A home appliance according to claim 5, wherein the plurality of heat dissipation members have a maximum height that does not interfere with an electronic element installed below the heat sink among the plurality of electronic elements. Claim 12 A home appliance according to claim 1, wherein a coupling member is formed on each of the lower surface of the second part and the lower surface of the third part, the heat sink is mounted on the circuit board based on the coupling member, and a fifth protrusion is formed on the outer surface of the coupling member. Claim 13 A home appliance according to claim 1, wherein the second part and the third part have the same shape and are positioned opposite to the first part. Claim 14 A home appliance according to claim 1, wherein the inclination angle of the second and third parts is 40 degrees and the height of the first air passage is 6 mm. Claim 15 A home appliance according to claim 1, wherein some of the plurality of electronic elements are attached to the outer inclined surfaces of the second and third parts of the heat sink. Claim 16 A home appliance according to claim 1, further comprising a base bracket on which the circuit board is mounted; wherein the blower fan is mounted on the base bracket spaced apart from the heat sink. Claim 17 A home appliance according to claim 16, further comprising an air guide mounted on the circuit board to surround the heat sink and guiding air provided from the blower fan. Claim 18 delete Claim 19 A heat sink mounted on a circuit board of a home appliance and receiving air through a blower fan, comprising: a first part having an internal hollow; a second part connected to be inclined downward from a first side of the first part; and a third part connected to be inclined downward from a second side of the first part; wherein the internal hollow defines a first air passage inside the heat sink, and the lower surface of the first part and the inner inclined surfaces of each of the second and third parts define a second air passage outside the heat sink, and the air provided through the blower fan flows through the upper surface of the first part, the outer inclined surfaces of each of the second and third parts, and the first and second air passages.

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