Display module and display module testing method

Abstract

An electronic device according to one embodiment of the present invention may include a display panel defined with an active area including a first area and a second area adjacent to the first area in a first direction and a peripheral area adjacent to the active area, a plurality of first circuit films, a plurality of second circuit films, a first circuit board, a second circuit board, a first circuit cable, a second circuit cable, and a main circuit board, wherein the main circuit board may include a power generation unit that provides power to the display panel, a first power measurement unit electrically connected to the first circuit cable and the power generation unit and measuring a first current provided to the first area, a second power measurement unit electrically connected to the second circuit cable and the power generation unit and measuring a second current provided to the second area, and an overcurrent protection unit that cuts off the power based on each of the first current and the second current and a reference current.

Description

Technology Field

[0001] The present invention relates to an electronic device with improved reliability and a method for inspecting the electronic device. Background Technology

[0002] Various electronic devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles are being developed.

[0003] As the application fields of these electronic devices become more diverse, the types of display panels used to display images on these devices are also becoming more varied.

[0004] Recently, display panels include light-emitting display panels, and light-emitting display panels may include organic light-emitting display panels or quantum dot light-emitting display panels, etc. Prior art literature

[65535] Korean Publication: KR 2015-0095987 Korean Publication: KR 2014-0141276 Korean Publication: KR 2014-0082499 The problem to be solved

[0005] The present invention aims to provide an electronic device with improved reliability and a method for inspecting the electronic device. means of solving the problem

[0006] An electronic device according to an embodiment of the present invention comprises a display panel having an active area including a first area and a second area adjacent to the first area in a first direction, and a peripheral area adjacent to the active area; a plurality of first circuit films electrically connected to the first area; a plurality of second circuit films electrically connected to the second area; a first circuit board electrically connected to the plurality of first circuit films; a second circuit board electrically connected to the plurality of second circuit films; a first circuit cable electrically connected to the first circuit board; a second circuit cable electrically connected to the second circuit board; and a main circuit board electrically connected to the first circuit cable and the second circuit cable, receiving a video signal and outputting a protection signal. The main circuit board comprises a power generation unit that provides power to the display panel; a first power measurement unit electrically connected to the first circuit cable and the power generation unit and measuring a first current provided to the first area through the first circuit cable and the first circuit board; and a second circuit cable and the second circuit board electrically connected to the second circuit cable and the power generation unit and through the second circuit cable and the second circuit board It may include a second power measuring unit for measuring a second current provided in the second region, and an overcurrent protection unit for determining whether to output a protection signal to cut off the power based on each of the first current and the second current and a reference current output based on the image signal.

[0007] The first circuit cable includes a first power pad electrically connected to the power generation unit and a plurality of first pads spaced apart from the first power pad in the first direction, and the second circuit cable includes a second power pad electrically connected to the power generation unit and a second pad spaced apart from the second power pad in the first direction, and the display panel includes a power line electrically connected to the first power pad and the second power pad, and the power line may extend in the first direction.

[0008] The first current may be provided to the first power pad, and the second current may be provided to the second power pad.

[0009] It may further include a driving chip mounted on each of the plurality of first circuit films and the plurality of second circuit films.

[0010] The main circuit board may further include a total load calculation unit that receives a video signal, generates a current control signal for the first region and the second region based on the video signal, and calculates the total load based on the video signal; a first load calculation unit that receives the video signal and calculates a first load based on the video signal and the current control signal; and a second load calculation unit that receives the video signal and calculates a second load based on the video signal and the current control signal.

[0011] It may further include a target current setting unit that calculates a total target current provided to the display panel, a first target current provided to the first area, and a second target current provided to the second area based on the total load, the first load, and the second load, and provides the total target current, the first target current, and the second target current to the overcurrent protection unit.

[0012] The above overcurrent protection unit can output the reference current based on the above first target current and the above second target current.

[0013] The reference current can output a current value based on a lookup table between the first target current, the second target current, and the reference current that is stored in advance.

[0014] The above reference current may have a current value obtained by multiplying each of the above first target current and the above second target current by a predetermined ratio.

[0015] The first region may be half of the active region, and the second region may be the remaining half of the active region.

[0016] The above reference current may include a total reference current, a first reference current for the first region, and a second reference current for the second region.

[0017] The above reference current may be greater than the first current and the second current, respectively.

[0018] The overcurrent protection unit can output the protection signal when at least one of the first current or the second current is greater than the reference current.

[0019] The above overcurrent protection unit can determine whether the first circuit cable or the second circuit cable is connected.

[0020] An electronic device inspection method according to one embodiment of the present invention may include the steps of: providing an electronic device comprising a display panel defined with an active area including a first area and a second area adjacent to the first area in a first direction and a peripheral area adjacent to the active area, and a main circuit board that receives a video signal and provides a power including a first power and a second power to the display panel electrically connected to the display panel; providing the first power to the first area; providing the second power to the second area; measuring a first current of the first power; measuring a second current of the second power; and cutting off the power based on each of the first current and the second current and a reference current output based on the video signal.

[0021] The method may further include the step of receiving a video signal, generating a current control signal for the first region and the second region based on the video signal, and calculating the total load based on the video signal.

[0022] The method may further include the steps of receiving the image signal and calculating a first load based on the image signal and the current control signal, and receiving the image signal and calculating a second load based on the image signal and the current control signal.

[0023] The method further includes the step of calculating a total target current provided to the display panel based on the total load, a first target current provided to the first area based on the first load, and a second target current provided to the second area based on the second load, and the step of cutting off the power may include the step of calculating a reference current based on each of the total target current, the first target current, and the second target current.

[0024] The step of cutting off the power supply may include a step of not cutting off the power supply if the reference current is greater than each of the first current and the second current.

[0025] The step of cutting off the power supply may include cutting off the power supply when at least one of the first current or the second current is greater than the reference current. Effects of the invention

[0026] As described above, the electronic device can easily determine whether the current supplied to the display panel is an overcurrent. The overcurrent protection unit can determine whether to cut off the power supply by comparing a reference current with a first current and a second current measured in real time. The overcurrent protection unit can prevent an overcurrent from being supplied to the display panel. The overcurrent protection unit can prevent the power line from burning out and being damaged due to the overcurrent. In other words, the stability of the display panel can be ensured. Therefore, an electronic device with improved reliability can be provided. Brief explanation of the drawing

[0027] FIG. 1a is a perspective view of an electronic device according to one embodiment of the present invention. FIG. 1b is a cross-sectional view of an electronic device according to one embodiment of the present invention. FIG. 2a is a perspective view of an electronic device according to one embodiment of the present invention. FIG. 2b is a cross-sectional view of an electronic device according to one embodiment of the present invention. FIG. 3 is a plan view of an electronic device according to one embodiment of the present invention. FIG. 4 is a cross-sectional view taken along I-I' of FIG. 3 according to one embodiment of the present invention. FIG. 5 is a block diagram illustrating a main circuit board according to one embodiment of the present invention. Figure 6 shows a graph of load versus current according to one embodiment of the present invention. FIG. 7 is a plan view illustrating an electronic device according to one embodiment of the present invention. FIG. 8 illustrates a graph of load versus current according to one embodiment of the present invention. FIG. 9 is a plan view illustrating an electronic device according to one embodiment of the present invention. FIG. 10 illustrates a graph of load versus current according to one embodiment of the present invention. Specific details for implementing the invention

[0028] In this specification, where a component (or region, layer, part, etc.) is described as being “on,” “connected,” or “joined” another component, it means that it may be directly placed / connected / joined on the other component, or that a third component may be placed between them.

[0029] Identical reference numerals denote identical components. Additionally, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for the effective illustration of the technical content. “And / or” includes all one or more combinations that the associated components may define.

[0030] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0031] Additionally, terms such as “below,” “lower,” “above,” and “upper” are used to describe the relationships between the components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0032] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0033] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Furthermore, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an overly ideal or overly formal sense unless explicitly defined herein.

[0034] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0035] FIG. 1a is a perspective view of an electronic device according to one embodiment of the present invention, and FIG. 1b is a cross-sectional view of an electronic device according to one embodiment of the present invention.

[0036] Referring to FIGS. 1a and 1b, the electronic device (1000) may be a configuration that substantially generates an image. The electronic device (1000) may be a light-emitting electronic device or a light-receiving electronic device. For example, it may be any one of an organic light-emitting display, a quantum dot light-emitting display, a micro LED display, a nano LED display, a liquid crystal display, an electrophoretic display, an electrowetting display, and a MEMS display, and is not particularly limited.

[0037] The electronic device (1000) may include a display panel (DP). The display panel (DP) may include a first substrate (100, or lower display substrate) and a second substrate (200, or upper display substrate) spaced apart from and facing the first substrate (100). A predetermined cell gap may be formed between the first substrate (100) and the second substrate (200). The cell gap may be maintained by a sealant (SLM) that joins the first substrate (100) and the second substrate (200). An insulating material may be filled in the cell gap.

[0038] A grayscale display panel for image generation may be disposed between the base substrate of the first substrate (100) and the base substrate of the second substrate (200). Depending on the type of electronic device (1000), the grayscale display panel may include a liquid crystal layer, an organic light-emitting layer, an inorganic light-emitting layer (e.g., a quantum dot light-emitting layer, an LED light-emitting layer), or an electrophoretic layer.

[0039] The electronic device (1000) can display an image through a display surface (IS). The outer surface (200-OS) of the second substrate (200) shown in FIG. 1b can be defined as the display surface (IS) of FIG. 1.

[0040] The display surface (IS) may be parallel to the surface defined by the first direction (DR1) and the second direction (DR2). The display surface (IS) may include an active area (AA) and a peripheral area (NA). Pixels (PX) may be placed in the active area (AA), and pixels (PX) may not be placed in the peripheral area (NA). The peripheral area (NA) may be defined along the border of the display surface (IS). The peripheral area (NA) may surround the active area (AA). In one embodiment of the present invention, the peripheral area (NA) may be omitted or placed only on one side of the active area (AA).

[0041] The normal direction of the display surface (IS), that is, the thickness direction of the electronic device (1000), can be indicated by the third direction (DR3). The front (or top) and back (or bottom) surfaces of each layer or unit described below can be distinguished by the third direction (DR3).

[0042] In one embodiment of the present invention, an electronic device (1000) having a planar display surface (IS) is illustrated, but is not limited thereto. The electronic device (1000) may include a curved display surface or a three-dimensional display surface. The three-dimensional display surface may include a plurality of display areas indicating different directions.

[0043] FIG. 2a is a perspective view of an electronic device according to an embodiment of the present invention. FIG. 2b is a cross-sectional view of a display panel according to an embodiment of the present invention. In describing FIG. 2a, similar reference numerals are used for components described through FIG. 1a, and descriptions thereof are omitted.

[0044] Referring to FIGS. 2a and 2b, the electronic device (1000-1) can display an image through a display surface (IS-1). The display surface (IS-1) may be parallel to the plane defined by the first direction (DR1) and the second direction (DR2). The display surface (IS-1) may include an active area (AA-1) and a peripheral area (NA-1).

[0045] A display panel (DP-1) may include a base layer (BL), a circuit element layer (DP-CL), a display element layer (DP-LED), and an optical structure layer (OSL). The base layer (BL) may include a synthetic resin substrate or a glass substrate. The circuit element layer (DP-CL) includes at least one insulating layer and a circuit element. The circuit element includes signal lines, pixel driving circuits, etc. The circuit element layer (DP-CL) may be formed through a process of forming an insulating layer, a semiconductor layer, and a conductive layer by coating, deposition, etc., and a patterning process of the insulating layer, semiconductor layer, and conductive layer by photolithography. The display element layer (DP-LED) includes at least a display element. The optical structure layer (OSL) may convert the color of light provided from the display element. The optical structure layer (OSL) may include a light control pattern and a structure for increasing the light conversion efficiency.

[0046] FIG. 3 is a plan view of an electronic device according to one embodiment of the present invention.

[0047] Referring to FIG. 3, a display panel (DP) may include a plurality of signal lines (GL1-GLn, DL1-DLm), a power line (PL), and pixels (PX11-PXnm). The planar arrangement relationship of the plurality of signal lines (GL1-GLn, DL1-DLm), the power line (PL), and pixels (PX11-PXnm) is illustrated. The plurality of signal lines (GL1-GLn, DL1-DLm) may include a plurality of gate lines (GL1-GLn) and a plurality of data lines (DL1-DLm).

[0048] The display panel (DP) may include an active area (AA) and a peripheral area (NA) adjacent to the active area (AA). The active area (AA) and the peripheral area (NA) may be distinguished by the presence or absence of a plurality of pixels (PX11-PXnm). A plurality of pixels (PX11-PXnm) may be placed in the active area (AA) and may not be placed in the peripheral area (NA).

[0049] Each of the plurality of pixels (PX11-PXnm) may be connected to a corresponding gate wire among the plurality of gate wires (GL1-GLn) and a corresponding data wire among the plurality of data wires (DL1-DLm). Each of the plurality of pixels (PX11-PXnm) may be electrically connected to a power line (PL). Each of the plurality of pixels (PX11-PXnm) may include a pixel driving circuit and a display element. Depending on the configuration of the pixel driving circuit of the plurality of pixels (PX11-PXnm), more types of signal wires may be provided in the electronic device (1000).

[0050] The scan drive circuit (GDC) and a plurality of pads (PD) can be placed in the peripheral area (NA). The scan drive circuit (GDC) can be formed through the same process as the circuits within the electronic device (1000). Some of the plurality of pads (PD) can be electrically connected to a plurality of data lines (DL1-DLm). Other of the plurality of pads (PD) can be electrically connected to a power line (PL).

[0051] The active area (AA) may include a first area (AR1) and a second area (AR2). The first area (AR1) and the second area (AR2) may be spaced apart from each other in a first direction (DR1). The first area (AR1) may be half of the active area (AA). The second area (AR2) may be the remaining half of the active area (AA). However, this is exemplary, and the area of ​​each of the first area (AR1) and the second area (AR2) according to one embodiment of the present invention is not limited thereto. For example, one of the first area (AR1) and the second area (AR2) may be larger than the area of ​​the other.

[0052] A plurality of first circuit films (311) may be electrically connected to a first region (AR1). A plurality of first circuit films (311) may be connected to a plurality of pads (PD) disposed in a peripheral region (NA). A plurality of first circuit films (311) may provide electrical signals to a display panel (DP) for driving the display panel (DP). A plurality of first circuit films (311) may be electrically connected to the display panel (DP) through a plurality of pads (PD). In one embodiment of the present invention, each of the plurality of first circuit films (311) is illustrated as a flexible circuit film.

[0053] A plurality of second circuit films (312) may be electrically connected to a second region (AR2). A plurality of second circuit films (312) may be connected to a plurality of pads (PD) disposed in a peripheral region (NA). A plurality of second circuit films (312) may provide electrical signals to a display panel (DP) for driving the display panel (DP). A plurality of second circuit films (312) may be electrically connected to the display panel (DP) through a plurality of pads (PD). In one embodiment of the present invention, each of the plurality of second circuit films (312) is illustrated as a flexible circuit film.

[0054] The driving chip (320) may be mounted on each of the plurality of first circuit films (311) and the plurality of second circuit films (312). For example, the driving chip (320) may be mounted on each of the plurality of first circuit films (311) and the plurality of second circuit films (312) in a chip-on-film (COF) manner. The driving chip (320) may be a driving chip that transmits an electrical signal to a display panel (DP). The data driving circuit may be a part of the circuit configured in the driving chip (320). The driving chip (320) may be electrically connected to a plurality of pixels (PX11-PXnm) through pads (PD) placed in the peripheral area (NA).

[0055] The first circuit board (330) can be electrically connected to a plurality of first circuit films (311). The first circuit board (330) can transmit signals transmitted from the main circuit board (370) to the plurality of first circuit films (311). In one embodiment of the present invention, the first circuit board (330) is shown as a printed circuit board.

[0056] The second circuit board (340) can be electrically connected to a plurality of second circuit films (312). The second circuit board (340) can transmit signals transmitted from the main circuit board (370) to the plurality of second circuit films (312). In one embodiment of the present invention, the second circuit board (340) is shown as a printed circuit board.

[0057] The first circuit cable (350) can be electrically connected to the first circuit board (330). The first circuit cable (350) can be positioned between the first circuit board (330) and the main circuit board (370) to electrically connect the first circuit board (330) and the main circuit board (370). In one embodiment of the present invention, the first circuit cable (350) is illustrated as a flat flexible cable (FFC). The first circuit cable (350) may include a first power pad (PD1-1), a second power pad (PD2-1), and a plurality of pads (PD3-1). The plurality of pads (PD3-1) may be positioned between the first power pad (PD1-1) and the second power pad (PD2-1). The plurality of pads (PD3-1) may be spaced apart from the first power pad (PD1-1) and the second power pad (PD2-1) in a first direction (DR1).

[0058] When viewed in a planar view, the area of ​​each of the first power pad (PD1-1) and the second power pad (PD2-1) may be larger than the area of ​​each of the plurality of pads (PD3-1). The first power pad (PD1-1) may provide power to the display panel (DP). The power may be provided to the power line (PL). The second power pad (PD2-1) may provide a common power to the display panel (DP). The common power may have a voltage level lower than the power. The plurality of pads (PD3-1) may transmit an electrical signal transmitted from the main circuit board (370) to the display panel (DP). The electrical signal may be a signal for driving the display panel (DP). The electrical signal may have a voltage level lower than the power and the common voltage.

[0059] Unlike the present invention, if the area of ​​each of the first power pad (PD1-1) and the second power pad (PD2-1) is smaller than or equal to that of the plurality of pads (PD3-1), it may not be possible to easily transmit the power and the common power having a higher voltage and high current than the electrical signal. However, according to the present invention, the area of ​​each of the first power pad (PD1-1) and the second power pad (PD2-1) for transmitting the power and the common power to the display panel (DP) may be larger than that of the plurality of pads (PD3-1). That is, the first power pad (PD1-1) and the second power pad (PD2-1) can easily transmit the power and the common power having a high current to the display panel (DP), respectively. Thus, an electronic device (1000) with improved reliability can be provided.

[0060] The second circuit cable (360) can be electrically connected to the second circuit board (340). The second circuit cable (360) can be positioned between the second circuit board (340) and the main circuit board (370) to electrically connect the second circuit board (340) and the main circuit board (370). In one embodiment of the present invention, the second circuit cable (360) is illustrated as a flat flexible cable. The second circuit cable (360) may include a first power pad (PD1-2), a second power pad (PD2-2), and a plurality of pads (PD3-2). The plurality of pads (PD3-2) may be positioned between the first power pad (PD1-2) and the second power pad (PD2-2). The plurality of pads (PD3-2) may be spaced apart from the first power pad (PD1-2) and the second power pad (PD2-2) in a first direction (DR1).

[0061] When viewed in a planar view, the area of ​​each of the first power pad (PD1-2) and the second power pad (PD2-2) may be larger than the area of ​​each of the plurality of pads (PD3-2). The first power pad (PD1-2) may provide power to the display panel (DP). The power may be provided to the power line (PL). The second power pad (PD2-2) may provide a common power to the display panel (DP). The common power may have a lower voltage level than the power. The plurality of pads (PD3-2) may transmit an electrical signal transmitted from the main circuit board (370) to the display panel (DP). The electrical signal may be a signal for driving the display panel (DP). The electrical signal may have a lower voltage level than the power and the common voltage.

[0062] According to the present invention, the area of ​​each of the first power pad (PD1-2) and the second power pad (PD2-2) for transmitting the power and the common power to the display panel (DP) may be larger than the area of ​​the plurality of pads (PD3-2). That is, the first power pad (PD1-2) and the second power pad (PD2-2) can each easily transmit the power and the common power having high current to the display panel (DP). Thus, an electronic device (1000) with improved reliability can be provided.

[0063] The main circuit board (370) can be electrically connected to the first circuit cable (350) and the second circuit cable (360). In one embodiment of the present invention, the main circuit board (370) is shown as a printed circuit board.

[0064] The main circuit board (370) may include a power generation unit (371), a first power measurement unit (372), and a second power measurement unit (373). The power generation unit (371) may generate the power and / or the common power. The power generation unit (371) may provide the power and / or the common power to a display panel (DP). The first power measurement unit (372) may be positioned between the first circuit cable (350) and the power generation unit (371) and may be electrically connected to the first circuit cable (350) and the power generation unit (371). The second power measurement unit (373) may be positioned between the second circuit cable (360) and the power generation unit (371) and may be electrically connected to the second circuit cable (360) and the power generation unit (371). The main circuit board (370) will be described later.

[0065] Each of the plurality of first circuit films (311) and the plurality of second circuit films (312) according to one embodiment of the present invention can be bent toward the back of the display panel (DP). Accordingly, the first circuit board (330), the second circuit board (340), the first circuit cable (350), the second circuit cable (360), and the main circuit board (370) can face toward the back of the display panel (DP).

[0066] FIG. 4 is a cross-sectional view taken along I-I' of FIG. 3 according to one embodiment of the present invention.

[0067] Referring to FIGS. 3 and 4, the electronic device (1000) may include a first substrate (100) and a second substrate (200) spaced apart from and facing the first substrate (100). A predetermined cell gap (GAP) may be formed between the first substrate (100) and the second substrate (200). The cell gap (GAP) may be maintained by a sealant that joins the first substrate (100) and the second substrate (200). The sealant may be placed in the peripheral area (NA, see FIG. 1) shown in FIG. 1. In one embodiment of the present invention, a synthetic resin material may be placed in the cell gap (GAP). However, this is exemplary and the structure of the electronic device (1000) according to one embodiment of the present invention is not limited thereto. For example, a part of the second substrate (200) may be placed directly on the first substrate (100) to form the display panel (DP-1) of FIG. 2b.

[0068] A first pixel area (PXA1), a second pixel area (PXA2), a third pixel area (PXA3), and an surrounding area (NPXA) may be defined in the display panel (DP).

[0069] The first substrate (100) may include a first base substrate (BS1, or base substrate), a circuit layer (CCL), a display element layer (EL), and a thin film encapsulation layer (TFE). The circuit layer (CCL) may be disposed on the first base substrate (BS1). The circuit layer (CCL) may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The display element layer (EL) may be disposed on the circuit layer (CCL). The thin film encapsulation layer (TFE) is disposed on the display element layer (EL) and may seal the display element layer (EL).

[0070] The first base substrate (BS1) may be a silicon substrate, a plastic substrate, a glass substrate, an insulating film, or a laminated structure comprising a plurality of insulating layers.

[0071] The circuit layer (CCL) may include a plurality of transistors and a plurality of insulating layers (IL1, IL2, IL3, IL4). In FIG. 4, one driving transistor (TD) is illustrated as an example. The plurality of insulating layers (IL1, IL2, IL3, IL4) may include a first insulating layer (IL1), a second insulating layer (IL2), a third insulating layer (IL3), and a fourth insulating layer (IL4).

[0072] A first insulating layer (IL1) is disposed on a first base substrate (BS1), and a driving transistor (TD) may be disposed on the first insulating layer (IL1). The driving transistor (TD) may include an active (AD), a source (SD), a drain (DD), and a gate (GD).

[0073] The active (AD), source (SD), and drain (DD) may be regions distinguished according to the doping concentration or conductivity of the semiconductor pattern. The active (AD), source (SD), and drain (DD) may be placed on the first insulating layer (IL1). The active (AD), source (SD), and drain (DD) may have higher adhesion to the first insulating layer (IL1) than to the first base substrate (BS1).

[0074] The first insulating layer (IL1) may be a barrier layer that protects the lower surfaces of the active (AD), source (SD), and drain (DD). In this case, the first insulating layer (IL1) may block contamination or moisture entering through the first base substrate (BS1) itself or through the first base substrate (BS1) from penetrating into the active (AD), source (SD), and drain (DD). Alternatively, the first insulating layer (IL1) may be a light-blocking layer that blocks external light incident through the first base substrate (BS1) from entering the active (AD). In this case, the first insulating layer (IL1) may further include a light-blocking material.

[0075] A second insulating layer (IL2) is placed on top of a first insulating layer (IL1) and can cover an active (AD), a source (SD), and a drain (DD). The second insulating layer (IL2) may include an inorganic material. The inorganic material may include at least one of silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide.

[0076] A gate (GD) may be placed on the second insulating layer (IL2). A third insulating layer (IL3) may be placed on the second insulating layer (IL2) and may cover the gate (GD). The third insulating layer (IL3) may be composed of a single layer or multiple layers. For example, the single layer may include an inorganic layer. The multiple layers may include an organic layer and an inorganic layer.

[0077] The fourth insulating layer (IL4) may be placed on the third insulating layer (IL3). The fourth insulating layer (IL4) may be composed of a single layer or multiple layers. For example, the single layer may include an organic layer. The multiple layers may include an organic layer and an inorganic layer. The fourth insulating layer (IL4) may be a flattening layer that provides a flat surface on top.

[0078] The display element layer (EL) may be disposed on the fourth insulating layer (IL4). The display element layer (EL) may include a light-emitting element (OLED) and a pixel defining layer (PDL). In the present embodiment, the light-emitting element (OLED) may be an organic light-emitting diode, but is not limited thereto. For example, the light-emitting element (OLED) may be a micro LED element or a nano LED element. The pixel defining layer (PDL) may be an organic layer.

[0079] A light-emitting element (OLED) may include a first electrode (AE3, hereinafter referred to as the third pixel electrode), a hole control layer (HCL), a light-emitting layer (EML), an electronic control layer (ECL), and a second electrode (CE, or a common electrode). The third pixel electrode (AE3) may be provided separately for each pixel. The light-emitting element (OLED) may include a first light-emitting element overlapping with a first pixel area (PXA1), a second light-emitting element overlapping with a second pixel area (PXA2), a third light-emitting element overlapping with a third pixel area (PXA3), and a fourth light-emitting element overlapping with a fourth pixel area (PXA4). In FIG. 4, a first pixel electrode (AE1) included in the first light-emitting element, a second pixel electrode (AE2) included in the second light-emitting element, and a third pixel electrode (AE3) included in the third light-emitting element are illustrated as examples.

[0080] A first pixel electrode (AE1) may be positioned corresponding to a first pixel area (PXA1), a second pixel electrode (AE2) may be positioned corresponding to a second pixel area (PXA2), and a third pixel electrode (AE3) may be positioned corresponding to a third pixel area (PXA3). Here, "corresponds" means that the two configurations overlap when viewed from the thickness direction (DR3) of the electronic device (1000) and are not limited to the same area.

[0081] The first pixel electrode (AE1), the second pixel electrode (AE2), and the third pixel electrode (AE3) may be disposed on the fourth insulating layer (IL4). Each of the first pixel electrode (AE1), the second pixel electrode (AE2), and the third pixel electrode (AE3) may be electrically connected directly or indirectly to a corresponding driving transistor. For example, the second pixel electrode (AE2) may be connected directly or indirectly to the driving transistor (TD) shown in FIG. 4. In FIG. 4, the connection structure between the second pixel electrode (AE2) and the driving transistor (TD) is not shown.

[0082] The pixel defining film (PDL) may expose a portion of each of the first pixel electrode (AE1), the second pixel electrode (AE2), and the third pixel electrode (AE3). For example, light-emitting openings (OP) may be defined in the pixel defining film (PDL). A portion of each of the first pixel electrode (AE1), the second pixel electrode (AE2), and the third pixel electrode (AE3) may be exposed by the light-emitting openings (OP).

[0083] A first light-emitting region (EA1), a second light-emitting region (EA2), and a third light-emitting region (EA3) can each be defined by light-emitting openings (OP). Additionally, the first light-emitting region (EA1) can be defined corresponding to a first pixel region (PXA1), the second light-emitting region (EA2) can be defined corresponding to a second pixel region (PXA2), and the third light-emitting region (EA3) can be defined corresponding to a third pixel region (PXA3). Here, "corresponds" means that the two configurations overlap when viewed in the thickness direction (DR3) of the electronic device (1000) and are not limited to the same area.

[0084] The hole control layer (HCL), the light-emitting layer (EML), the electronic control layer (ECL), and the second electrode (CE) may be commonly disposed in the first pixel region (PXA1), the second pixel region (PXA2), the third pixel region (PXA3), and the surrounding region (NPXA). The hole control layer (HCL) includes a hole transport layer and may further include a hole injection layer.

[0085] The emitting layer (EML) may have a single-layer structure or a tandem structure. The emitting layer (EML) may generate blue light as a source light. The blue light may include wavelengths ranging from 410 nm (nanometer) to 480 nm. The emission spectrum of the blue light may have a peak wavelength in the range of 440 nm to 460 nm. The emitting layer (EML) may be commonly disposed in the first to third pixel regions (PXA1, PXA2, PXA3) or disposed independently. Being disposed independently means that the emitting layer (EML) is separated for each of the first to third pixel regions (PXA1, PXA2, PXA3).

[0086] The electronic control layer (ECL) includes an electron transport layer and may further include an electron injection layer. A second electrode (CE) may be disposed on the electronic control layer (ECL). The second electrode (CE) may be disposed in common on a plurality of pixels (PX, see FIG. 1).

[0087] A thin film encapsulation layer (TFE) may be placed on a second electrode (CE). For example, the thin film encapsulation layer (TFE) may be placed directly on a display element layer (EL). The thin film encapsulation layer (TFE) may include a first inorganic encapsulation layer (ITL1), an organic encapsulation layer (OTL), and a second inorganic encapsulation layer (ITL2) that are sequentially stacked. The organic encapsulation layer (OTL) may be placed between the first inorganic encapsulation layer (ITL1) and the second inorganic encapsulation layer (ITL2). The first inorganic encapsulation layer (ITL1) and the second inorganic encapsulation layer (ITL2) may be formed by depositing an inorganic material, and the organic encapsulation layer (OTL) may be formed by depositing, printing, or coating an organic material.

[0088] The first inorganic encapsulation layer (ITL1) and the second inorganic encapsulation layer (ITL2) protect the display element layer (EL) from moisture and oxygen, and the organic encapsulation layer (OTL) protects the display element layer (EL) from foreign substances such as dust particles. The first inorganic encapsulation layer (ITL1) and the second inorganic encapsulation layer (ITL2) may include at least one of silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide. The organic encapsulation layer (OTL) may include a polymer, for example, an acrylic-based organic layer. However, this is exemplary and is not limited thereto.

[0089] FIG. 4 illustrates, by way of example, that the thin film encapsulation layer (TFE) comprises two inorganic layers and one organic layer, but is not limited thereto. For example, the thin film encapsulation layer (TFE) may comprise three inorganic layers and two organic layers, in which case the inorganic and organic layers may have an alternating stacked structure. Although not illustrated, the electronic device (1000) may further include a refractive index control layer on the upper side of the thin film encapsulation layer (TFE) to improve light emission efficiency.

[0090] A second display substrate (200) may be placed on a first display substrate (100). The second display substrate (200) may include a second base substrate (BS2, or cover base substrate), a first color filter (CF1), a second color filter (CF2), a third color filter (CF3), a first light control pattern (WC1), a second light control pattern (WC2), a third light control pattern (WC3), a partition wall (BW), and a plurality of insulating layers (200-1, 200-2, 200-3).

[0091] The second base substrate (BS2) may be a silicon substrate, a plastic substrate, a glass substrate, an insulating film, or a laminated structure comprising a plurality of insulating layers. The lower surface (BS2-B) of the second base substrate (BS2) may be flat.

[0092] A plurality of color filters (CF1, CF2, CF3) may be disposed on one side of the second base substrate (BS2). For example, a plurality of color filters (CF1, CF2, CF3) may be disposed on the lower surface of the second base substrate (BS2). The first color filter (CF1) may be disposed overlapping the first light-emitting region (EA1), the second color filter (CF2) may be disposed overlapping the second light-emitting region (EA2), and the third color filter (CF3) may be disposed overlapping the third light-emitting region (EA3).

[0093] A second color filter (CF2) may be placed in a second pixel area (PXA2) and a surrounding area (NPXA). Multiple apertures may be defined in the second color filter (CF2). The multiple apertures may define a first pixel area (PXA1) and a third pixel area (PXA3). The first color filter (CF1) may be placed overlapping the first pixel area (PXA1), and the third color filter (CF3) may be placed overlapping the third pixel area (PXA3).

[0094] A third color filter (CF3) may be placed on the partition wall (BW) in the surrounding area (NPXA). A first color filter (CF1) may be placed on the third color filter (CF3). A second color filter (CF2) may be placed on the first color filter (CF1).

[0095] Each of the first to third color filters (CF1, CF2, CF3) transmits light within a specific wavelength range and blocks light outside that wavelength range. Each of the first to third color filters (CF1, CF2, CF3) comprises a base resin and a dye and / or pigment dispersed in the base resin. The base resin is a medium in which the dye and / or pigment is dispersed and may consist of various resin compositions that can generally be referred to as a binder.

[0096] A first color filter (CF1) transmits a first color light, a second color filter (CF2) transmits source light provided from an emitting layer (EML), and a third color filter (CF3) transmits a third color light. For example, the first color filter (CF1) may be a red color filter, the second color filter (CF2) may be a blue color filter, and the third color filter (CF3) may be a green color filter. In one embodiment of the present invention, the first color filter (CF1) and the third color filter (CF3) may be yellow color filters. In this case, the first color filter (CF1) and the third color filter (CF3) may be connected to each other.

[0097] The first color filter (CF1) may be placed adjacent to the second color filter (CF2). The third color filter (CF3) may overlap with the first color filter (CF1) and the second color filter (CF2). The area where all of the multiple color filters (CF1, CF2, CF3) overlap may block light. In this case, it may not include a black mattress (not shown) containing a light-blocking material. The area where all of the multiple color filters (CF1, CF2, CF3) overlap may correspond to a surrounding area (NPXA) and may correspond to a partition wall (BW). "Corresponds" means that the two configurations overlap when viewed in the thickness direction (DR3) of the display panel (DP) and are not limited to the same area.

[0098] The first insulating layer (200-1) is positioned below the first color filter (CF1), the second color filter (CF2), and the third color filter (CF3), and can cover the first color filter (CF1), the second color filter (CF2), and the third color filter (CF3). The second insulating layer (200-2) covers the first insulating layer (200-1) and can provide a flat surface on the lower side. The first insulating layer (200-1) may be an inorganic film, and the second insulating layer (200-2) may be an organic film. However, this is exemplary, and the second insulating layer (200-2) according to one embodiment of the present invention may be omitted.

[0099] The partition wall (BW) may be disposed below the second insulating layer (200-2). The partition wall (BW) may be disposed in the surrounding area (NPXA). A plurality of first openings (BW-OP1) may be defined in the partition wall (BW). The partition wall (BW) may include a material having a transmittance of less than or equal to a predetermined value. For example, the partition wall (BW) may include a light-blocking material, and for example, may include a conventional black component. The partition wall (BW) may include a black dye or black pigment mixed in a base resin. For example, the partition wall (BW) may include at least one of propylene glycol methyl ether acetate, 3-methoxy-n-butyl acetate, acrylate monomer, acryl320 monomer, organic pigment, and acrylate ester.

[0100] The lower surface (BW-B) of the partition wall (BW) can be defined on the surface facing the thin film encapsulation layer (TFE).

[0101] A plurality of first openings (BW-OP1) may correspond to a first pixel area (PXA1), a second pixel area (PXA2), and a third pixel area (PXA3), respectively. A plurality of first openings (BW-OP1) may correspond to a first light-emitting area (EA1), a second light-emitting area (EA2), and a third light-emitting area (EA3), respectively. "Corresponds" means that the two configurations overlap when viewed in the thickness direction (DR3) of the display panel (DP) and are not limited to the same area.

[0102] A first light control pattern (WC1) is positioned on the inner side of one of the plurality of first openings (BW-OP1) and can convert source light into first color light. A second light control pattern (WC2) is positioned on the inner side of one of the plurality of first openings (BW-OP1) and can transmit source light. A third light control pattern (WC3) is positioned on the inner side of one of the plurality of first openings (BW-OP1) and can convert source light into second color light.

[0103] Each of the first light control pattern (WC1), the second light control pattern (WC2), and the third light control pattern (WC3) can be formed by an inkjet process. Compositions can be provided into each of the plurality of first openings (BW-OP1) in the space defined by the partition wall (BW) to form the first light control pattern (WC1), the second light control pattern (WC2), and the third light control pattern (WC3).

[0104] Each of the first light control pattern (WC1) and the third light control pattern (WC3) may include a base resin, a quantum dot, and a scattering particle, and the second light control pattern (WC2) may include a base resin and a scattering particle. However, this is exemplary, and each of the first light control pattern (WC1), the second light control pattern (WC2), and the third light control pattern (WC3) according to one embodiment of the present invention may include a base resin and a scattering particle, and at least two of the first light control pattern (WC1), the second light control pattern (WC2), and the third light control pattern (WC3) may include a quantum dot. In one embodiment of the present invention, the scattering particle may be omitted from any one of the first light control pattern (WC1), the second light control pattern (WC2), and the third light control pattern (WC3).

[0105] The base resin serves as a medium in which quantum dots or scattering particles are dispersed and may be composed of various resin compositions that can generally be referred to as binders. However, it is not limited thereto, and any medium capable of dispersing quantum dots in this specification may be referred to as a base resin regardless of its name, additional functions, constituent materials, etc. The base resin may be a polymer resin. For example, the base resin may be an acrylic resin, a urethane resin, a silicone resin, an epoxy resin, etc. The base resin may be a transparent resin.

[0106] The scattering particles may be titanium oxide (TiO2) or silica-based nanoparticles, etc. The scattering particles can scatter incident light to increase the amount of light provided to the outside. In one embodiment of the present invention, at least one of the first light control pattern (WC1) and the third light control pattern (WC3) may not include scattering particles.

[0107] Quantum dots can be particles that convert the wavelength of incident light. Quantum dots are materials with a crystal structure of several nanometers in size, composed of hundreds to thousands of atoms; due to their small size, they exhibit a quantum confinement effect in which the energy band gap becomes larger. When light with a wavelength higher in energy than the band gap is incident on a quantum dot, the dot absorbs the light to become excited, and then returns to the ground state while emitting light of a specific wavelength. The emitted wavelength of light has a value corresponding to the band gap. By controlling the size and composition of quantum dots, the luminescence characteristics resulting from the quantum confinement effect can be controlled.

[0108] The core of each quantum dot can be selected from group II-VI compounds, group III-V compounds, group III-VI compounds, group I-III-VI compounds, group IV-VI compounds, group IV elements, group IV compounds, and combinations thereof.

[0109] Group II-VI compounds are diatomic compounds selected from the group consisting of CdSe, CdTe, CdS, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, and mixtures thereof; ternary compounds selected from the group consisting of CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, and mixtures thereof; and may be selected from the group consisting of four-element compounds selected from the group consisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and mixtures thereof.

[0110] Group III-VI compounds may include binary compounds such as In2S3, In2Se3, etc.; ternary compounds such as InGaS3, InGaSe3, etc.; or any combination thereof.

[0111] Group I-III-VI compounds may be selected from ternary compounds selected from the group consisting of AgInS, AgInS2, CuInS, CuInS2, AgGaS2, CuGaS2CuGaO2, AgGaO2, AgAlO2, and mixtures thereof, or from quaternary compounds such as AgInGaS2 and CuInGaS2.

[0112] III-V group compounds may be selected from the group consisting of diatomic compounds selected from the group consisting of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, and mixtures thereof; ternary compounds selected from the group consisting of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InAlP, InNP, InNAs, InNSb, InPAs, InPSb, and mixtures thereof; and quaternary compounds selected from the group consisting of GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, and mixtures thereof. Meanwhile, III-V group compounds may further include a group II metal. For example, InZnP, etc., can be selected as a Group III-II-V compound.

[0113] Group IV-VI compounds may be selected from the group consisting of SnS, SnSe, SnTe, PbS, PbSe, PbTe, and mixtures thereof; ternary compounds selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, and mixtures thereof; and quaternary compounds selected from the group consisting of SnPbSSe, SnPbSeTe, SnPbSTe, and mixtures thereof. Group IV elements may be selected from the group consisting of Si, Ge, and mixtures thereof. Group IV compounds may be ternary compounds selected from the group consisting of S320, SiGe, and mixtures thereof.

[0114] In this case, the binary, ternary, or quaternary compounds may exist within the particle at a uniform concentration, or they may exist within the same particle with concentration distributions partially divided into different states. Additionally, the structure may have a core / shell configuration where one quantum dot surrounds another. The interface between the core and the shell may have a concentration gradient in which the concentration of the element present in the shell decreases towards the center.

[0115] In some embodiments, the quantum dots may have a core-shell structure comprising a core containing the aforementioned nanocrystal and a shell surrounding the core. The shell of the quantum dots may serve as a protective layer to maintain semiconductor properties by preventing chemical degradation of the core and / or as a charging layer to impart electrophoretic properties to the quantum dots. The shell may be a single layer or a multilayer. The interface between the core and the shell may have a concentration gradient in which the concentration of elements present in the shell decreases toward the center. Examples of the shell of the quantum dots include metal or non-metal oxides, semiconductor compounds, or combinations thereof.

[0116] For example, the oxide of the metal or nonmetal mentioned above may be exemplified as a binary compound such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, NiO, or a ternary compound such as MgAl2O4, CoFe2O4, NiFe2O4, CoMn2O4, but the present invention is not limited thereto.

[0117] In addition, the above semiconductor compounds may be examples of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, etc., but the present invention is not limited thereto.

[0118] Quantum dots can have a full width of half maximum (FWHM) of the emission wavelength spectrum of about 45 nm or less, preferably about 40 nm or less, and more preferably about 30 nm or less, and color purity or color reproducibility can be improved in this range. In addition, since the light emitted through these quantum dots is emitted in all directions, the wide viewing angle can be improved.

[0119] In addition, the shape of the quantum dots is not specifically limited to shapes commonly used in the field, but more specifically, shapes such as spherical, pyramidal, multi-arm, or cubic nanoparticles, nanotubes, nanowires, nanofibers, and nanoplate particles may be used.

[0120] Quantum dots can control the color of the light they emit depending on their particle size, and accordingly, they can have various emission colors such as blue, red, and green.

[0121] The third insulating layer (200-3) can cover the split partition (BW), the first light control pattern (WC1), the second light control pattern (WC2), and the third light control pattern (WC3). For example, the third insulating layer (200-3) may be an inorganic film that seals the split partition (BW), the first light control pattern (WC1), the second light control pattern (WC2), and the third light control pattern (WC3).

[0122] FIG. 5 is a block diagram illustrating a main circuit board according to one embodiment of the present invention.

[0123] Referring to FIGS. 3 and 5, the main circuit board (370) may include a power generation unit (371), a first power measurement unit (372), a second power measurement unit (373), a total load calculation unit (374), a first load calculation unit (375), a second load calculation unit (376), a target current setting unit (377), and an overcurrent protection unit (378).

[0124] The power generation unit (371) can generate power (ELVDD). The power generation unit (371) can provide power (ELVDD) to the display panel (DP).

[0125] The first power measuring unit (372) can be electrically connected to the first circuit cable (350) and the power generating unit (371). The first power measuring unit (372) can measure the first current (RSC) of the power supplied to the first area (AR1). The first current (RSC) can be supplied to the power line (PL) through the first power pad (PD1-1).

[0126] The second power measuring unit (373) can be electrically connected to the second circuit cable (360) and the power generating unit (371). The second power measuring unit (373) can measure the second current (LSC) of the power supplied to the second area (AR2). The second current (LSC) can be supplied to the power line (PL) through the first power pad (PD1-2).

[0127] Unlike the present invention, when power (ELVDD) is transmitted to a power line (PL) through a single wire, a high current may flow through the wire due to the high voltage level of the power (ELVDD). As a result, the wire may be damaged. Power (ELVDD) may be transmitted to the power line (PL) through the wire. Consequently, the power line (PL) may be damaged. However, according to the present invention, power (ELVDD) can be divided into a first current (RSC) and a second current (LSC) in parallel and supplied to the power line (PL). The first current (RSC) can be transmitted to the power line (PL) through a first circuit cable (350), a first circuit board (330), and a plurality of first circuit films (311). The second current (LSC) can be transmitted to the power line (PL) through a second circuit cable (360), a second circuit board (340), and a plurality of second circuit films (312). When power (ELVDD) is delivered to the power line (PL) by dividing it into a first current (RSC) and a second current (LSC), power (ELVDD) can be delivered to the display panel (DP) with a lower current compared to when it is delivered to the power line (PL) through a single wire. That is, damage to the wiring and power wiring (PL) of each of the plurality of first circuit films (311), plurality of second circuit films (312), first circuit board (330), second circuit board (340), first circuit cable (350), second circuit cable (360), and main circuit board (370) can be prevented. Thus, an electronic device (1000) with improved reliability can be provided.

[0128] The total load calculation unit (374) can receive an image signal (RGB). The total load calculation unit (374) can output a load of the display panel (DP) based on the image signal (RGB). At this time, the load may refer to the ratio of pixels emitting light from the display panel (DP). For example, if the display panel (DP) emits full white light, the load may be set to 100%. The total load calculation unit (374) can calculate a total load (TL) based on the image signal (RGB).

[0129] The total load calculation unit (374) may receive a limiting signal (NPC) from the outside. The electronic device (1000) may limit the current flowing through the display panel (DP) in response to the load of the video signal (RGB) to minimize power consumption. The current may be limited based on the limiting signal (NPC). This may be referred to as Net Power Control. The limiting signal (NPC) may be arbitrarily set and provided by the user to calculate a current control signal (SF) for scaling the current. The limiting signal (NPC) may be set to a value greater than 0 and equal to or lower than 1. For example, the limiting signal (NPC) may be provided as 0.2 (20%). However, this is exemplary and the limiting signal (NPC) according to one embodiment of the present invention is not limited thereto.

[0131] The total load calculation unit (374) can control the bits of the data of the image signal (RGB) so that the amount of current of the display panel (DP) is limited in correspondence with the total load (TL) of the image signal (RGB). This may be referred to as data scaling. The total load calculation unit (374) can generate a current control signal (SF) based on the total load (TL) of the image signal (RGB) and a limiting signal (NPC). The current control signal (SF) may have a value between 0 and 1, and if the generated current control signal (SF) is equal to 1 or greater than 1, the current control signal (SF) may be limited to 1. The limiting signal (NPC) is provided as a constant by the user, and the total load (TL) and the current control signal (SF) may be inversely proportional to each other. For example, if the limiting signal (NPC) is 0.2 and the load is 1.0 (100%), the current control signal (SF) may be 0.2 (20%). In this case, when the maximum panel brightness proportional to the current is 600 nits, the maximum load luminous brightness can be 120 nits by the current control signal (SF). However, this is exemplary and the current control signal (SF) according to one embodiment of the present invention is not limited thereto.

[0132] The first load calculation unit (375) can receive an image signal (RGB) and a current control signal (SF). The first load calculation unit (375) can calculate a first load (RL) based on the image signal and current control signal (SF) for a first area (AR1) among the image signals (RGB). The first load (RL) can provide a load for the first area (AR1). The second load calculation unit (376) can receive an image signal (RGB) and a current control signal (SF). The second load calculation unit (376) can calculate a second load (LL) based on the image signal and current control signal (SF) for a second area (AR2) among the image signals (RGB). The second load (LL) can provide a load for the second area (AR2). For example, if the second load calculation unit (376) determines from the image signal (RGB) that the total load (TL) is 1.0 (100%) and the first load (RL) is 0.5 (50%), it can output the second load (LL) as 0.5 (50%) based on the image signal and current control signal (SF) for the second area (AR2). Alternatively, if the second load calculation unit (376) determines from the image signal (RGB) that the total load (TL) is 0.2 (20%) and the first load (RL) is 0.19 (19%), it can output the second load (LL) as 0.01 (1%) based on the image signal and current control signal (SF) for the second area (AR2). The target current setting unit (377) can receive the total load (TL), the first load (RL), and the second load (LL). The target current setting unit (377) can select the total target current (TTC), the first target current (RTC), and the second target current (LTC) based on the total load (TL), the first load (RL), and the second load (LL). The total target current (TTC) may refer to the current provided to the display panel (DP). The target current setting unit (377) can select the total target current (TTC) based on a lookup table between the total load (TL) and the total target current (TTC) that is stored in advance.The first target current (RTC) may refer to the current provided to the first region (AR1). The target current setting unit (377) may select the first target current (RTC) based on a lookup table between the first load (RL) and the first target current (RTC) that is stored in advance. The second target current (LTC) may refer to the current provided to the second region (AR2). The target current setting unit (377) may select the second target current (LTC) based on a lookup table between the second load (LL) and the second target current (LTC) that is stored in advance.

[0133] The overcurrent protection unit (378) can output a reference current (OCP) based on the first target current (RTC) and the second target current (LTC).

[0134] For example, the reference current (OCP) is stored in the form of a lookup table in an external memory, etc., and the overcurrent protection unit (378) can correspond to the reference current (OCP) suitable for the situation based on the target current (TTC), the first target current (RTC), and the second target current (LTC).

[0135] Alternatively, the reference current (OCP) can be calculated by multiplying the first target current (RTC) and the second target current (LTC), respectively, by a predetermined ratio. For example, the overcurrent protection unit (378) can set the margin of the reference current (OCP) to 20%. In this case, the overcurrent protection unit (378) can set the reference current (OCP) to a current corresponding to 120% of the first target current (RTC) and the second target current (LTC), respectively.

[0136] However, this is exemplary, and the method for calculating the reference current (OCP) according to one embodiment of the present invention is not limited thereto. For example, the reference current (OCP) may have a predetermined current value regardless of the first target current (RTC) and the second target current (LTC). For example, the reference current (OCP) may be set to 4 mA (milliampere).

[0137] The reference current (OCP) may include a total reference current, a first reference current, and a second reference current. The first reference current may be a reference current calculated for a first region (AR1). The second reference current may be a reference current calculated for a second region (AR2). The reference current (OCP) may provide a criterion for determining whether the first current (RSC) or the second current (LSC) is in an overcurrent state.

[0138] The overcurrent protection unit (378) can determine whether to cut off the power supply (ELVDD) based on the first current (RSC) and the second current (LSC), respectively, and the reference current (OCP). The overcurrent protection unit (378) can determine whether there is an overcurrent by comparing the reference current (OCP), provided based on the first target current (RTC) and the second target current (LTC) to be provided to the first area (AR1) and the second area (AR2) of the display panel (DP), respectively, with the actually measured first current (RSC) and second current (LSC), and determine whether to cut off the power supply (ELVDD). If the power supply (ELVDD) needs to be cut off, the overcurrent protection unit (378) can generate a protection signal (PS). The protection signal (PS) can prevent overcurrent from being applied to the display panel (DP) by cutting off the power supply (ELVDD) generated by the power generation unit (371). The electronic device (1000) can protect the display panel (DP) through a protection signal (PS).

[0139] Figure 6 shows a graph of load versus current according to one embodiment of the present invention.

[0140] Referring to FIGS. 5 and 6, the overcurrent protection unit (378) can compare the reference current (OCP), the total target current (TTC), the first current (RSC), and the second current (LSC).

[0141] In a steady state, the reference current (OCP) may be greater than the first current (RSC) and the second current (LSC), respectively. For example, the total target current (TTC) may be the sum of the first current (RSC) and the second current (LSC). The reference current (OCP) may be greater than the total target current (TTC). The reference current (OCP) may be greater than the sum of the first current (RSC) and the second current (LSC).

[0142] The overcurrent protection unit (378) may not cut off the power supply (ELVDD) if the reference current (OCP) is greater than the first current (RSC) and the second current (LSC), respectively.

[0143] According to the present invention, an electronic device (1000) can easily determine whether the current supplied to a display panel (DP) is an overcurrent. An overcurrent protection unit (378) can determine whether to cut off the power supply (ELVDD) by comparing the reference current (OCP) with the first current (RSC) and the second current (LSC) measured in real time. The overcurrent protection unit (378) can prevent an overcurrent from being supplied to the display panel (DP). The overcurrent protection unit (378) can prevent the power line (PL) from being burned out due to the overcurrent. That is, the stability of the power line (PL) can be ensured. Therefore, an electronic device (1000) with improved reliability can be provided.

[0144] FIG. 7 is a plan view illustrating an electronic device according to an embodiment of the present invention, and FIG. 8 is a graph illustrating a load versus current according to an embodiment of the present invention. FIG. 7 illustrates, by way of example, a state in which a second circuit cable (360) is incorrectly connected to a second circuit board (340). In describing FIG. 7, the same reference numerals are used for components described through FIG. 3, and descriptions thereof are omitted.

[0145] Referring to FIGS. 5, 7, and 8, the power (ELVDD) generated by the power generation unit (371) may include a first power and a second power.

[0146] In the manufacturing process of the electronic device (1000), if the second circuit cable (360) is incorrectly connected to the second circuit board (340), the resistance of the first power pad (PD1-2) of the second circuit cable (360) may increase.

[0147] The above first power source can be supplied to the first area (AR1) through the first circuit cable (350). The amount of the first current (RSC-1) flowing to the first circuit board (330), which has relatively low resistance, can be increased.

[0148] The above second power source can be provided to the second area (AR2) through the second circuit cable (360). The amount of current of the second current (LSC-1) flowing to the second circuit board (340), which has relatively high resistance, can be reduced.

[0149] That is, due to the incorrect connection of the second circuit cable (360), the current of the flexible circuit film that transmits power (ELVDD) may be abnormally diverted to the first circuit cable (350).

[0150] The first power measuring unit (372) can measure the first current (RSC-1). For example, the first current (RSC, see FIG. 3) of the electronic device (1000) in a normal state is 0.8 A (ampere), but the first current (RSC-1) of the electronic device (1000) in a misconnected state can increase up to 10.8 A.

[0151] The second power measuring unit (373) can measure the second current (LSC-1).

[0152] The overcurrent protection unit (378) can receive the first current (RSC-1) and the second current (LSC-1) from the first power measurement unit (372) and the second power measurement unit (373), respectively. The overcurrent protection unit (378) can determine whether to cut off the power supply (ELVDD) based on the first current (RSC-1) and the second current (LSC-1), respectively, and the reference current (OCP).

[0153] The overcurrent protection unit (378) can compare the reference current (OCP), the total target current (TTC), the first current (RSC-1), and the second current (LSC-1).

[0154] With the second circuit cable (360) incorrectly connected, the first current (RSC-1) may be greater than the reference current (OCP).

[0155] The overcurrent protection unit (378) can generate a protection signal (PS) when at least one of the first current (RSC-1) or the second current (LSC-1) is greater than the reference current (OCP). The protection signal (PS) can cut off the power (ELVDD) generated by the power generation unit (371). The overcurrent protection unit (378) can prevent an overcurrent (IEL1) from being applied to the display panel (DP).

[0156] The overcurrent protection unit (378) can determine whether the first circuit cable (350) and the second circuit cable (360) are connected based on whether there is an overcurrent (IEL1).

[0157] According to the present invention, an electronic device (1000) can easily determine whether the current supplied to a display panel (DP) is an overcurrent. An overcurrent protection unit (378) can determine whether to cut off the power supply (ELVDD) by comparing the reference current (OCP) with the first current (RSC-1) and the second current (LSC-1) measured in real time. The overcurrent protection unit (378) can cut off the power supply (ELVDD) of the power generation unit (371) through a protection signal (PS). The overcurrent protection unit (378) can prevent an overcurrent (IEL1) from being supplied to the display panel (DP). The overcurrent protection unit (378) can prevent the phenomenon of a plurality of pads (PD) and power lines (PL) being burned due to the overcurrent (IEL1). That is, the phenomenon of damage occurring in the region (AA) where an overcurrent (IEL1) can flow between the first region (AR1) and the second region (AR2) can be prevented. Therefore, an electronic device (1000) with improved reliability can be provided.

[0158] Additionally, according to the present invention, the overcurrent protection unit (378) can determine whether an overcurrent (IEL1) is applied during the inspection phase of the electronic device (1000). The overcurrent protection unit (378) can determine whether the first circuit cable (350) and the second circuit cable (360) are connected based on whether an overcurrent (IEL1) is present and provide this information to the user. If the second circuit cable (360) is incorrectly connected to the second circuit board (340) during the manufacturing process of the electronic device (1000), the overcurrent protection unit (378) can easily determine this during the inspection process of the electronic device (1000). The user can easily detect the incorrect connection of the second circuit cable (360) and the second circuit board (340) and resolve the issue so that the second circuit cable (360) and the second circuit board (340) can be properly connected. The user can reconnect the second circuit cable (360) and the second circuit board (340) and control the electronic device (1000) to operate normally. Thus, an electronic device (1000) with improved reliability can be provided.

[0159] FIG. 9 is a plan view illustrating an electronic device according to an embodiment of the present invention, and FIG. 10 is a graph illustrating a load versus current according to an embodiment of the present invention. FIG. 9 illustrates, by way of example, a state in which the first circuit cable (350) is incorrectly connected to the first circuit board (330). In describing FIG. 9, the same reference numerals are used for components described through FIG. 3 and FIG. 7, and descriptions thereof are omitted.

[0160] Referring to FIGS. 5, 9, and 10, if the first circuit cable (350) is incorrectly connected to the first circuit board (330) during the manufacturing process of the electronic device (1000), the resistance of the first power pad (PD1-1) of the first circuit cable (350) may increase.

[0161] The first power supply of the power supply (ELVDD) can be supplied to the first area (AR1) through the first circuit cable (350). The amount of the first current (RSC-2) flowing to the first circuit board (330), which has relatively high resistance, can be reduced.

[0162] The second power supply of the power supply (ELVDD) can be supplied to the second area (AR2) through the second circuit cable (360). The amount of the second current (LSC-2) flowing to the second circuit board (340), which has relatively low resistance, can be increased.

[0163] That is, due to the incorrect connection of the first circuit cable (350), the current of the flexible circuit film that transmits power (ELVDD) may be abnormally diverted to the second circuit cable (360).

[0164] The first power measuring unit (372) can measure the first current (RSC-2).

[0165] The second power measuring unit (373) can measure the second current (LSC-2). For example, the second current (LSC, see FIG. 3) of the electronic device (1000) in a normal state may be 0.8A, and the second current (LSC-2) of the electronic device (1000) in a misconnected state may increase up to 10.8A.

[0166] The overcurrent protection unit (378) can receive the first current (RSC-2) and the second current (LSC-2) respectively from the first power measurement unit (372) and the second power measurement unit (373). The overcurrent protection unit (378) can determine whether to cut off the power supply (ELVDD) based on the first current (RSC-2) and the second current (LSC-2) respectively and the reference current (OCP).

[0167] The overcurrent protection unit (378) can compare the reference current (OCP), the total target current (TTC), the first current (RSC-2), and the second current (LSC-2).

[0168] With the second circuit cable (360) incorrectly connected, the first current (RSC-2) may be greater than the reference current (OCP).

[0169] The overcurrent protection unit (378) can generate a protection signal (PS) when at least one of the first current (RSC-2) or the second current (LSC-2) is greater than the reference current (OCP). The protection signal (PS) can cut off the power (ELVDD) generated by the power generation unit (371). The overcurrent protection unit (378) can prevent an overcurrent (IEL2) from being applied to the display panel (DP).

[0170] According to the present invention, an electronic device (1000) can easily determine whether the current supplied to a display panel (DP) is an overcurrent. An overcurrent protection unit (378) can determine whether to cut off the power supply (ELVDD) by comparing the reference current (OCP) with the first current (RSC-2) and the second current (LSC-2) measured in real time. The overcurrent protection unit (378) can cut off the power supply (ELVDD) of the power generation unit (371) through a protection signal (PS). The overcurrent protection unit (378) can prevent an overcurrent (IEL2) from being supplied to the display panel (DP). The overcurrent protection unit (378) can prevent the phenomenon of a plurality of pads (PD) and power lines (PL) being burned due to the overcurrent (IEL2). That is, the phenomenon of damage occurring in the region (AA) where an overcurrent (IEL2) can flow between the first region (AR1) and the second region (AR2) can be prevented. Therefore, an electronic device (1000) with improved reliability can be provided.

[0171] Additionally, according to the present invention, the overcurrent protection unit (378) can determine whether there is an overcurrent (IEL2) during the inspection phase of the electronic device (1000). The overcurrent protection unit (378) can determine whether the first circuit cable (350) and the second circuit cable (360) are connected based on whether the overcurrent (IEL2) is applied and provide this information to the user. If the first circuit cable (350) is incorrectly connected to the first circuit board (330) during the manufacturing process of the electronic device (1000), the overcurrent protection unit (378) can easily determine this during the inspection process of the electronic device (1000). The user can easily detect the incorrect connection of the first circuit cable (350) and the first circuit board (330) and resolve the issue so that the first circuit cable (350) and the first circuit board (330) are properly connected. The user can reconnect the first circuit cable (350) and the first circuit board (330) and control the electronic device (1000) to operate normally. Thus, an electronic device (1000) with improved reliability can be provided.

[0172] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the relevant technical field will understand that various modifications and changes can be made to the invention without departing from the spirit and technical scope of the invention as set forth in the claims below. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims. Explanation of the symbols

[0173] 1000: Electronic device DP: Display panel 370: Main circuit board 371: Power generation unit 372: 1st power measurement unit 373: 2nd power measurement unit RSC: 1st current LSC: 2nd current 378: Overcurrent Protection OCP: Reference Current PS: Protection signal

Claims

Claim 1 A display panel defined having an active area including a first area and a second area adjacent to the first area in a first direction, and a peripheral area adjacent to the active area; a plurality of first circuit films electrically connected to the first area; a plurality of second circuit films electrically connected to the second area; a first circuit board electrically connected to the plurality of first circuit films; a second circuit board electrically connected to the plurality of second circuit films; a first circuit cable electrically connected to the first circuit board; and a second circuit cable electrically connected to the second circuit board. and includes a main circuit board electrically connected to the first circuit cable and the second circuit cable, receiving a video signal and outputting a protection signal, wherein the main circuit board comprises: a power generation unit that provides power to the display panel; a first power measurement unit electrically connected to the first circuit cable and the power generation unit and measuring a first current provided to the first area through the first circuit cable and the first circuit board; and a second power measurement unit electrically connected to the second circuit cable and the power generation unit and measuring a second current provided to the second area through the second circuit cable and the second circuit board. The device includes an overcurrent protection unit that determines whether to output a protection signal to cut off the power based on a reference current output based on each of the first current and the second current and the image signal, and the first circuit cable includes a first power pad electrically connected to the power generation unit and a plurality of first pads spaced apart from the first power pad in the first direction, and the second circuit cable includes a second power pad electrically connected to the power generation unit and a second pad spaced apart from the second power pad in the first direction, and the display panel includes a power line electrically connected to the first power pad and the second power pad, and the power line is an electronic device extended in the first direction. Claim 2 delete Claim 3 An electronic device according to claim 1, wherein the first current is provided to the first power pad and the second current is provided to the second power pad. Claim 4 An electronic device according to claim 1, further comprising a driving chip mounted on each of the plurality of first circuit films and the plurality of second circuit films. Claim 5 An electronic device according to claim 1, wherein the main circuit board further comprises: a total load calculation unit that receives an image signal, generates a current control signal for the first region and the second region based on the image signal, and calculates the total load based on the image signal; a first load calculation unit that receives the image signal and calculates a first load based on the image signal and the current control signal; and a second load calculation unit that receives the image signal and calculates a second load based on the image signal and the current control signal. Claim 6 An electronic device according to claim 5, further comprising a target current setting unit that calculates a total target current provided to the display panel, a first target current provided to the first area, and a second target current provided to the second area based on the total load, the first load, and the second load, and provides the total target current, the first target current, and the second target current to the overcurrent protection unit. Claim 7 In claim 6, the overcurrent protection unit is an electronic device that outputs the reference current based on the first target current and the second target current. Claim 8 In claim 7, the reference current is an electronic device in which a current value is output based on a lookup table between the first target current, the second target current, and the reference current that is stored in advance. Claim 9 In claim 7, the electronic device wherein the reference current has a current value obtained by multiplying each of the first target current and the second target current by a predetermined ratio. Claim 10 An electronic device according to claim 1, wherein the first region is half of the active region and the second region is the remaining half of the active region. Claim 11 An electronic device according to claim 1, wherein the reference current comprises a total reference current, a first reference current for the first region, and a second reference current for the second region. Claim 12 In claim 1, the reference current is greater than the first current and the second current, respectively, in an electronic device. Claim 13 In claim 1, the overcurrent protection unit is an electronic device that outputs a protection signal when at least one of the first current and the second current is greater than the reference current. Claim 14 In claim 1, the overcurrent protection unit is an electronic device that determines whether the first circuit cable or the second circuit cable is connected. Claim 15 A method for inspecting an electronic device comprising: a display panel defined with a first region and a second region adjacent to the first region in a first direction, and a peripheral region adjacent to the active region, and a main circuit board that receives a video signal and provides a power including a first power and a second power to the display panel electrically connected to the display panel; a step of providing the first power to the first region; a step of providing the second power to the second region; a step of measuring a first current of the first power; a step of measuring a second current of the second power; and a step of cutting off the power based on each of the first current and the second current and a reference current output based on the video signal, and further comprising the steps of receiving a video signal, generating a current control signal for the first region and the second region based on the video signal, and calculating a total load based on the video signal. Claim 16 delete Claim 17 An electronic device inspection method according to claim 15, further comprising the steps of: receiving the image signal and calculating a first load based on the image signal and the current control signal; and receiving the image signal and calculating a second load based on the image signal and the current control signal. Claim 18 An electronic device inspection method according to claim 17, further comprising the step of calculating a total target current provided to the display panel based on the total load, a first target current provided to the first area based on the first load, and a second target current provided to the second area based on the second load, wherein the step of cutting off the power includes the step of calculating a reference current based on each of the total target current, the first target current, and the second target current. Claim 19 In claim 15, the step of cutting off the power includes the step of not cutting off the power if the reference current is greater than each of the first current and the second current. Claim 20 In claim 15, the step of cutting off the power supply includes the step of cutting off the power supply when at least one of the first current or the second current is greater than the reference current.

Images