Automated replacement of consumable parts using interfacing chambers

Abstract

The cluster tool assembly includes a vacuum transfer module and a process module having a first side connected to the vacuum transfer module. An isolation valve has a first side and a second side, and the first side of the isolation valve is coupled to the second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a parts buffer. The parts buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable the placement of consumable parts installed within the process module into an elevated position. The elevated position provides access to the exchange handler to enable the removal of consumable parts from the process module and storage within the compartments of the parts buffer. The exchange handler of the replacement station is configured to provide the replacement of consumable parts from the parts buffer back into the process module. The lift mechanism is configured to receive the consumable parts provided for replacement by the exchange handler and to lower the consumable parts to the installed position. Replacement by the exchange handler and the process module is performed while the process module and the replacement station are maintained under vacuum.

Description

Technology Field

[0001] The present embodiments relate to a cluster tool assembly used for manufacturing semiconductor wafers, and more specifically, to a cluster tool assembly that enables the removal and replacement of consumable parts within a process module placed in the cluster tool assembly. Background Technology

[0002] A typical cluster tool assembly used in the fabrication process for producing semiconductor wafers includes one or more process modules, each of which is used to perform specific fabrication operations such as cleaning, deposition, etching, rinsing, drying, etc. The chemicals and / or processing conditions used to perform these operations cause damage to some of the hardware components of the process module that are constantly exposed to harsh conditions within the process module. These damaged or worn hardware components need to be replaced immediately to ensure that the damaged hardware components do not expose other hardware components within the process module to harsh conditions, and to ensure the quality of the semiconductor wafer. For example, an edge ring positioned adjacent to the semiconductor wafer within the process module may frequently be damaged due to continuous exposure to ion bombardment from plasma generated within the process module during the etching operation and due to the position of the edge ring. The damaged edge ring needs to be replaced immediately to ensure that the damaged edge ring does not expose underlying hardware components, such as the chuck, to harsh process conditions. Replaceable hardware components are referred to as consumable parts in this specification.

[0003] The current process for replacing damaged consumable parts requires a skilled service technician to perform a series of steps. The technician must place the cluster tool assembly offline, pump / purge the cluster tool assembly to avoid exposure to toxic residues, open the cluster tool, remove the damaged consumable part, and replace the damaged consumable part with a new one. Once the damaged part is replaced, the technician must then clean the cluster tool, pump the cluster tool assembly into a vacuum, and condition the cluster tool assembly for wafer processing. In some cases, conditioning may involve certifying the cluster tool assembly by running a test process on a semiconductor wafer, taking cross-sections of the semiconductor wafer, and analyzing the cross-sections to ensure the quality of process operation. Replacing damaged consumable parts is a highly complex and time-consuming process that requires the cluster tool assembly to remain offline for a significant amount of time, thereby impacting the semiconductor manufacturer's profits.

[0004] Embodiments of the present invention occur in this context.

[0005] Embodiments of the present invention define a cluster tool assembly and an end-effector mechanism provided within the cluster tool assembly designed to remove and replace damaged hardware components of a process module placed within the cluster tool assembly without the need to break the vacuum (i.e., expose the cluster tool assembly to an ambient state). Damaged hardware components that can be replaced are also referred to herein as consumable parts. The cluster tool assembly comprises one or more process modules, each of which is configured to perform semiconductor wafer processing operations. When consumable parts within a process module are exposed to chemicals and process conditions, the consumable parts become damaged and need to be replaced in a timely manner. Damaged consumable parts may be replaced without opening the cluster tool assembly by mounting a replacement station on the cluster tool assembly. The replacement station includes a parts buffer having compartments used to store new consumable parts and used consumable parts. The replacement station and the process module(s) are coupled to a controller to enable the controller to coordinate access between the replacement station and the process module(s) while the process module(s) are maintained under vacuum, so as to allow replacement of consumable parts.

[0006] To provide easy access to a damaged consumable part, the process module may be designed to include a lift mechanism. When engaged, the lift mechanism is configured to move the consumable part to a raised position so that a robot available within the cluster tool assembly may be used to access the raised consumable part and retrieve the raised consumable part from the process module. A replacement consumable part is provided to the process module, and the lift mechanism is used to receive the consumable part and lower it to the position of the process module.

[0007] By providing a replacement station to access consumable parts, there is no need to open the cluster tool assembly to standby states to access damaged consumable parts. The replacement station is maintained under vacuum, and in some embodiments, this eliminates the risk of contamination during the replacement of consumable parts. As a result, the time required to recondition the process module to return it to an operational state after replacing damaged consumable parts is significantly reduced. Additionally, the robot and lift mechanism allow for the replacement of consumable parts without the risk of inadvertently damaging any hardware components of the process module during the retrieval and replacement of consumable parts.

[0008] Embodiments of the present disclosure provide a cluster tool assembly that can be used to remove and replace consumable parts from a process module without requiring the cluster tool assembly to be open to standby states. Because the cluster tool assembly is not open, the cluster tool assembly does not need to be purged or pumped. As a result, the time required to condition and authenticate the cluster tool assembly is significantly reduced.

[0009] The replacement station may be deployed in three different locations. In one location, the roll-up replacement station has the capability to vacuum pump and retract consumable parts directly from the process module, and is temporarily mounted directly onto the process module within the cluster tool assembly. New consumable parts are retrieved from the replacement station and placed directly into the process module. In this location, the replacement station will include a robot and a parts buffer to hold used and new consumable parts. The isolation valve will remain on the process module. This configuration is desirable because only the process module, rather than the entire cluster tool assembly, will be offline for this maintenance activity.

[0010] In the second position, the replacement station is permanently mounted on the vacuum transfer module (VTM), and a robot within the VTM is utilized to remove and replace consumable parts from the process module. In this position, the replacement station does not require a dedicated robot, but the end effector of the VTM robot will handle the movement of both the semiconductor wafers and the consumable parts.

[0011] In the third position, the replacement station is temporarily or permanently mounted on the atmospheric transfer module (ATM) and the robot of the ATM, and the robot of the vacuum transfer module (VTM) is used to remove and replace consumable parts from the process module. In this position, the replacement station will not require a dedicated robot arm, but the robot end effectors of the VTM and ATM, as well as the load lock chamber placed between the ATM and VTM, will handle both the semiconductor wafers and the consumable parts.

[0012] The process module includes a consumable part lift mechanism. The consumable part is typically a ring, such as an edge ring. The consumable part must be lifted so that the robot can easily access the consumable part and retrieve it. In one embodiment, the lift mechanism includes a vacuum-sealed actuator equipped with a lift pin. In another embodiment, the actuator is maintained under vacuum. Under normal operation, the lift is in a retracted state and does not make contact with the consumable part. When the consumable part needs to be replaced, the actuator extends the lift pin and raises the consumable part. The robot extends the end effector (e.g., a spatula-shaped part or a finger-shaped part attached to the robot) into the process module so that the end effector slides beneath the consumable part. The actuator then retracts the lift pin and places the consumable part onto the end effector. The consumable part is pulled back into the replacement station. The reverse sequence is used to place a new consumable part into the process module.

[0013] In one embodiment, an end effector mechanism connectable to a robot is disclosed. The end effector mechanism comprises a wrist plate, a mounting armset, a finger assembly, and a plurality of contact pads. The mounting armset is connected to the wrist plate. The mounting armset has an upper plate and a lower plate. The finger assembly is clamped between the upper plate and the lower plate of the mounting armset. The finger assembly includes a pair of fingers extending laterally from the mounting armset. The finger assembly has a proximal end adjacent to the mounting armset and a distal end at the tips of the pair of fingers. A first pair of disposable contact pads is disposed on the upper surface of the finger assembly and is located at the proximal end of the finger assembly. A second pair of disposable contact pads is disposed on the upper surface of the finger assembly and is located at the distal end of the finger assembly. A third pair of substrate contact pads is disposed on the top surface of the finger assembly adjacent to the first pair of consumable contact pads and between the first pair of consumable contact pads and the second pair of consumable contact pads. A fourth pair of substrate contact pads is disposed on the top surface of the finger assembly adjacent to the second pair of consumable contact pads and between the first pair of consumable contact pads and the second pair of consumable contact pads. The finger assembly is configured to transport a consumable part using the first pair of consumable contact pads and the second pair of consumable contact pads, and a substrate using the third pair of substrate contact pads and the fourth pair of substrate contact pads.

[0014] In another embodiment, a load lock chamber disposed within a cluster tool assembly used to process a substrate is disclosed. The cluster tool assembly includes an atmospheric transfer module (ATM), a vacuum transfer module (VTM), and a process module. The load lock chamber is disposed between the ATM and the VTM and provides an interface between the ATM and the VTM. The load lock chamber includes a support mechanism having a plurality of finger assemblies. Each of the plurality of finger assemblies includes an upper support finger and a lower support finger. The upper and lower support fingers have a first end and a second end. The upper surface of the lower support finger is adjacent to the second end and includes a defined indent between the first end and the second end. A spacer block is disposed between the lower support finger and the upper support finger at the first end. A second spacer block is disposed below the lower support finger at the first end. A substrate contact pad is placed on the upper surface of the upper and lower support fingers at a second end adjacent to the tips of the upper and lower support fingers. A consumable contact pad is placed between the first end of the lower support finger and the substrate contact pad placed within the lower support finger, and within the indent. Multiple finger assemblies are configured to transport both a consumable part using the consumable contact pad and a substrate using the substrate contact pad.

[0015] One aspect of the present invention will become apparent from the following detailed description, taken together with the accompanying drawings, which exemplify the principles of the present invention by example. Brief explanation of the drawing

[0016] The present invention may be best understood by referring to the following description taken together with the accompanying drawings. FIG. 1 illustrates a simplified block diagram of a cluster tool assembly including a replacement station mounted on a process module used for processing a semiconductor wafer in one embodiment of the present invention. FIG. 2 illustrates a simplified block diagram of a cluster tool assembly including a replacement station mounted on a vacuum transfer module of a cluster tool in an alternative embodiment of the present invention. FIG. 3 illustrates a simplified block diagram of a cluster tool assembly including a replacement station mounted on a standby transfer module of a cluster tool in an alternative embodiment of the present invention. FIG. 3a illustrates a simplified block diagram of a cluster tool assembly comprising robots having end effectors used to move consumable parts within a cluster tool in one embodiment of the present invention. FIG. 4 illustrates a simplified block diagram of a portion of a process module of a cluster tool assembly including an exemplary lift mechanism used to provide access to consumable parts in one embodiment of the present invention. FIG. 5a illustrates a simplified block diagram of a process module having a replacement station mounted to move consumable parts in one embodiment of the present invention, wherein the lift mechanism is in a disengaged mode. FIG. 5b illustrates a simplified block diagram of a process module having a mounted replacement station in one embodiment of the present invention, wherein the lift mechanism is in an engaged mode. FIG. 5c illustrates a simplified block diagram of a process module having a lift mechanism within the process module and a replacement station mounted on a vacuum transfer module, used to replace consumable parts within the process module in one embodiment of the present invention. FIG. 6a illustrates an end effector mechanism used within an ATM configured to accommodate a substrate in some embodiments of the present invention, and FIG. 6b, FIG. 6ba, and FIG. 6c illustrate an overhead view and a side view of an end effector mechanism placed within an atmospheric transfer module and / or a vacuum transfer module. FIGS. 7a through 7d illustrate a variable bottom surface profile of a consumable part accommodated using an end effector mechanism according to some embodiments of the present invention. FIG. 7e illustrates an exemplary end effector mechanism on a robot of VTM according to some embodiments of the present inventions. FIGS. 7fa and FIGS. 7fb illustrate an alternative contact pad concept used in an end effector mechanism on a robot of VTM and / or ATM for supporting consumable parts having different bottom profiles according to some embodiments of the present invention. FIGS. 8a and 8b illustrate exemplary end effector mechanisms used to deliver a substrate and a consumable part into a load lock chamber according to some embodiments of the present invention. FIGS. 9a and 9b illustrate an exemplary side view and a plan view of an end effector mechanism having a ring carrier used to deliver a consumable part to a load lock chamber, according to some embodiments of the present invention. FIGS. 10a through 10d illustrate an exemplary finger assembly used in a load lock chamber configured to accommodate a consumable part, according to some embodiments of the present invention. FIGS. 10e and FIGS. 10f illustrate drawings of a redesigned airlock chamber and a conventional airlock chamber including finger assemblies to accommodate consumable parts, according to some embodiments of the present invention. FIG. 11 illustrates an exemplary replacement station used to store consumable parts and ring carriers according to one embodiment of the present invention. FIG. 12 illustrates an exemplary drawing of a slot within a process module in which a consumable part or wafer is moved in and out of the process module in one embodiment of the present invention. FIG. 13 illustrates a control module (i.e., a controller) for controlling various aspects of a cluster tool according to one embodiment. Specific details for implementing the invention

[0017] Embodiments of the present disclosure define a cluster tool assembly used to process a semiconductor wafer. The cluster tool assembly includes a process module used to process a semiconductor wafer. A replacement station is mounted on the cluster tool assembly. The replacement station is maintained under vacuum to provide essential process conditions for replacing consumable parts without the risk of contaminating the process module or the cluster tool assembly. A dedicated robot within the replacement station or a robot available within the cluster tool assembly is used to recover used consumable parts from the process module and replace them with new consumable parts.

[0018] In some embodiments, the replacement station is mounted directly to the process module of the cluster tool assembly where consumable parts need to be replaced. In these embodiments, the replacement station is coupled directly to the process module. A robot formed in the replacement station is used to retrieve and replace consumable parts.

[0019] In some other embodiments, the replacement station may be mounted directly to the vacuum transfer module (VTM) within the cluster tool assembly. The replacement station is mounted to maintain the uniformity and symmetry of the cluster tool assembly. The robot of the VTM used to move semiconductor wafers in and out of the process modules is also used to retrieve and replace consumable parts placed in the process modules.

[0020] In some other embodiments, the replacement station may be mounted directly to the standby transfer module of the cluster tool assembly. In these embodiments, the robot of the standby transfer module operates in conjunction with the robot of the vacuum transfer module of the cluster tool assembly to access consumable parts from the process module and to replace consumable parts from the process module. The replacement station is mounted to different modules of the cluster tool assembly and is designed to enable the replacement of consumable parts without requiring the cluster tool assembly to be open to standby states to access the consumable parts.

[0021] Conventional designs of cluster tool assemblies required the cluster tool assembly to be open to access and replace consumable parts within process modules. Opening the cluster tool assembly required taking the cluster tool assembly offline and purging it into a standby state to allow access to process modules. If the cluster tool assembly is open, a skilled technician would manually remove and replace consumable parts from the process modules. When replacing consumable parts, the cluster tool assembly had to be conditioned so that semiconductor wafers could be processed. Because semiconductor wafers are expensive products, extreme control had to be applied when conditioning the cluster tool assembly. Conditioning would require cleaning the cluster tool assembly, pumping the cluster tool assembly into a vacuum, conditioning the cluster tool assembly, and certifying the cluster tool assembly using test runs. Each of these steps requires significant time and effort. In addition to the time required at each step to condition the cluster tool assembly, additional delays may occur when problems are encountered at one or more of the steps during the conditioning process. Some of the problems commonly encountered during the conditioning of the cluster tool assembly may include misalignment of consumable parts during replacement, damage to new consumable parts when replacing damaged or used consumable parts, damage to other hardware components within the process module during the retrieval or replacement of consumable parts, cluster tool assemblies failing to achieve vacuum after pumping, cluster tool assemblies failing to achieve process performance, etc. Depending on the severity of each problem, additional time and effort may be required, causing further delays in bringing the cluster tool assembly online and directly impacting the manufacturer's profit.

[0022] Equipping the cluster tool assembly with a replacement station and accessing consumable parts through the replacement station saves a significant amount of time and effort required to maintain the cluster tool assembly. The risk of damage to consumable parts, process modules, and / or the cluster tool assembly is minimized by using a robot available within the cluster tool assembly to replace consumable parts, and the risk of contamination is minimized by maintaining the replacement station under vacuum, thereby avoiding the internal exposure of the cluster tool assembly to the external atmosphere. By using a robot, more precise alignment of consumable parts within the process module can be achieved while minimizing damage to other hardware components of the process module. As a result, the time required to condition the cluster tool assembly is significantly reduced. Timely replacement of consumable parts increases the quality and yield of semiconductor components formed on semiconductor wafers.

[0023] FIG. 1 illustrates a simplified schematic diagram of a cluster tool assembly (100) used to process a semiconductor wafer in one embodiment. The cluster tool assembly (100) includes a plurality of modules to allow the semiconductor wafer to be processed in a controlled environment with minimal exposure of the semiconductor wafer to the environment. In one embodiment, the cluster tool assembly (100) includes an ambient transfer module (ATM) (102), a common vacuum transfer module (VTM) (104), and one or more process modules (112 to 120). The ATM (102) operates under ambient (i.e., ambient) conditions and interfaces with a wafer loader (not shown) to transfer the semiconductor wafer into the integrated cluster tool assembly (100) for processing and to return the semiconductor wafer after processing. The ATM (102) may include a robot to move the semiconductor wafer from the wafer loader to the VTM (104). The robot may be part of the drying robot because the ATM (102) is in a standby state.

[0024] The VTM (104) is operated under vacuum to minimize the exposure of the semiconductor wafer surface to ambient air when the semiconductor wafer is moved from one process module to another. Because the VTM (104) is operated under vacuum and the ATM (102) is operated in an ambient state, a load lock chamber (110) is placed between the ATM (102) and the VTM (104). The load lock chamber (110) provides a controlled interface to allow the transfer of the semiconductor wafer from the ATM (102) to the VTM (104). In this embodiment, a robot in the ATM (102) may be used to deposit the semiconductor wafer into the load lock chamber (110). A separate robot may be provided in the VTM (104) to retrieve the semiconductor wafer from the load lock chamber (110) and to transfer the semiconductor wafer into and out of the process modules (112 to 120). Due to the location of the load lock chamber, in some embodiments, the load lock chamber is also referred to as an "interfacing chamber."

[0025] One or more process modules (112 to 120) are integrated with the VTM (104) to allow a semiconductor wafer to move from one process module to another process module in a controlled environment maintained by the VTM (104). In some embodiments, the process modules (112 to 120) may be uniformly distributed around the VTM (104) and used to perform distinct process operations. Some of the process operations that can be performed using the process modules (112 to 120) include etching operations, rinsing, cleaning, drying operations, plasma operations, deposition operations, plating operations, etc. For example, process module (112) may be used to perform a deposition operation, process module (114) may be used to perform a cleaning operation, process module (116) may be used to perform a second deposition operation, and process module (118) may be used to perform an etching or removal operation, etc. A VTM (104) with a controlled environment allows semiconductor wafers to be transported into and out of process modules (112 to 120) without risk of contamination, and a robot in the VTM (104) helps transport semiconductor wafers into and out of various process modules (112 to 120) integrated with the VTM (104).

[0026] In one embodiment, the replacement station (108) is mounted on a process module (e.g., any one of the process modules (112 to 120)) within the cluster tool assembly (100). In the exemplary embodiment illustrated in FIG. 1, the replacement station (108) is mounted on the process module (118). As consumable part(s) need to be replaced in each of the process modules (112 to 120), the replacement station may be configured to be mounted on any one of the other process modules (112 to 120). The process module (118) may be used, for example, to perform an etching operation. The replacement station (108) is used to recover and replace consumable parts used in the process module (118). When the replacement station (108) is mounted on the process module, it includes a mechanism (not shown), such as a pump mechanism, to pump and maintain the replacement station (108) under vacuum.

[0027] In one embodiment, the replacement station (108) may be coupled to a process module (i.e., any one of the process modules (112 to 120) via an isolation valve when a consumable part needs to be replaced in the process module (112 to 120), and may be decoupled from the process module (112 to 120) when the consumable part is successfully replaced. In this embodiment, the replacement station (108) is a movable modular unit designed to be temporarily mounted in the process module to complete a required operation (e.g., replacement of a consumable part), unmounted when the required operation in the process module is completed, and retracted or moved to a different process module where the required operation of replacing the consumable part is performed. For example, the isolation valve causes the replacement station (108) to be kept under vacuum.

[0028] The replacement station (108) includes a part buffer to receive and hold consumable parts. In some embodiments, the part buffer may include a plurality of compartments to receive used consumable parts recovered from the process module and new consumable parts to be delivered to the process module. In one embodiment, when the replacement station is mounted on an isolation valve, the opening within the replacement station (108) is sized to allow the movement of consumable parts into and out of the replacement station (108).

[0029] Consumable parts are hardware components within a process module that need to be replaced due to continuous exposure of the consumable parts to process conditions within the process module. As a result of continuous exposure of consumable parts to the harsh process conditions used during semiconductor wafer processing, consumable parts need to be closely monitored to determine when damage exceeds an acceptable level so that the consumable parts can be replaced immediately. For example, in an etching process module, an edge ring is positioned adjacent to the semiconductor wafer mounted on a chuck assembly to extend the process area of ​​the semiconductor wafer. During the etching operation, the edge ring is exposed to ion bombardment from the plasma used to form features on the surface of the semiconductor wafer. Over time, as a result of continuous exposure, the edge ring may become damaged. When the edge ring is damaged beyond an acceptable level, it needs to be replaced so that the damage to the edge ring does not expose other underlying components or otherwise negatively affect semiconductor wafer processing.

[0030] In a typical etching operation, ions from the plasma, when received by the process module, strike the semiconductor wafer surface at an angle perpendicular to the plasma sheath formed within a defined process zone on the semiconductor wafer. As the layers of the edge ring wear away due to ion impact, the edge of the semiconductor wafer is exposed, causing the plasma sheath to roll along the contour of the semiconductor wafer edge. Consequently, ions striking the semiconductor wafer surface follow the contour of the plasma sheath, thereby causing tilt features to form toward the edge of the semiconductor wafer surface. These tilt features will affect the overall yield of the semiconductor components formed on the semiconductor wafer. Additionally, because the layers of the edge ring wear away, underlying components, such as a chuck, may be exposed to ions and damage the chuck surface. To improve yield and avoid damage to any underlying components, the edge ring (i.e., a consumable part) needs to be replaced periodically.

[0031] A replacement station (108) mounted on a process module (118) will allow a consumable part (i.e., an edge ring) to be easily replaced without breaking the vacuum in the process module. In one embodiment, the replacement station (108) includes a dedicated robot configured to retrieve the consumable part that needs to be replaced and to extend an end effector into the process module (e.g., process module (118)) to deliver a new consumable part. A lift mechanism within the process module provides access to the consumable part. The robot of the replacement station (108) may operate to place the new consumable part on the lift pin of the lift mechanism, and the lift mechanism will install the new consumable part at that location within the process module.

[0032] In one embodiment, to assist in replacing consumable parts, a replacement station is mounted to a process module (e.g., any one or each of the process modules (112 to 120)) via a first isolation valve. A robot is used to access and retrieve consumable parts from the replacement station from the process module, move into a parts buffer formed within the replacement station, and provide replacement consumable parts from the parts buffer. In one embodiment, the first isolation valve may be operatively connected to a controller to coordinate the retrieval and replacement of consumable parts from the process module.

[0033] In addition to using a first isolation valve to mount a replacement station on the process module, the process module may also be coupled to a vacuum transfer module (VTM) of the cluster tool assembly (100) using a second isolation valve. When engaged, the second isolation valve is configured to isolate the process module (112 to 120) from the rest of the cluster tool assembly (100) so that replacement of consumable parts within the process module can be easily performed without affecting the operation of other process modules of the cluster tool assembly (100). Providing the second isolation valve causes a specific process module (any one of 112 to 120) to be taken offline instead of the entire cluster tool assembly (100), while the rest of the process modules (112 to 120) within the cluster tool assembly (100) may be allowed to continue processing the semiconductor wafer. Additionally, since only a specific process module (e.g., any one of 112 to 120) is offline to replace consumable parts(s), it will take significantly less time to restore the process modules (112 to 120) and the cluster tool assembly (100) to a full operational state. As a result, the time required to condition and certify the operation of the cluster tool assembly (100) is much shorter. The robot of the VTM (104) may also be used to move the semiconductor wafer in and out of the process modules (112 to 120) during semiconductor wafer processing.

[0034] The consumable parts must be easily accessible so that the robot of the replacement station (108) can retrieve the consumable parts from the process modules (112 to 120). In one embodiment, the process modules (112 to 120) include a lift mechanism that provides access to the consumable parts that need to be replaced. In some embodiments, the lift mechanism may include lift pins that can be extended to move the consumable parts to a raised position. At the replacement station (108), the robot's end effector extends into the process modules (112 to 120) and slides under the consumable parts. The lift mechanism then retracts the lift pins while the consumable parts are placed on the robot's end effector. The end effector, along with the consumable parts, is then retracted from the process modules (112 to 120) into the replacement station (108). A new consumable part is moved to a process module (112 to 120) using the robot's end effector, and the lift pins of the lift mechanism are extended to receive the new consumable part. The lift pins of the lift mechanism work together to align the new consumable part into the position of the process module (112 to 120). The process of retrieving and replacing the consumable part using the lift mechanism will be discussed in more detail with reference to FIG. 4.

[0035] In some embodiments, the entire cluster tool assembly (100) may need to be offline to replace consumable parts. This may occur, for example, when two or more consumable parts need to be replaced within two or more process modules (112 to 120). Even in these embodiments, the time to put the cluster tool assembly (100) offline, mount a replacement station on the process module(s) (112 to 120), remove and replace the consumable parts, and condition and certify the cluster tool assembly (100) may be much shorter because the replacement station and the process module(s) are kept under vacuum. As a result, the process conditions (i.e., vacuum) of the cluster tool assembly (100) are not negatively affected during the replacement of consumable parts. Additionally, because the replacement is performed using a robot, the retrieval and placement of consumable parts may be engineered more accurately, thereby avoiding the risk of damage to the consumable parts and / or process modules (112 to 120).

[0036] In some embodiments, the opening on the side of the process module where the replacement station is mounted may be sized so that consumable parts can be easily fitted through the opening. Additionally, the opening within the process module (112 to 120) may be designed to minimize all asymmetry issues that may occur in the process module (112 to 120) and the cluster tool assembly (100) overall.

[0037] The various embodiments and implementations discussed with reference to FIG. 1 allow a replacement station (108) to be temporarily mounted in the process modules (112 to 120) when consumable parts in the process modules (112 to 120) need to be replaced, and to be retracted when the replacement of consumable parts is completed. The replacement station (108) may include a single part buffer having two separate holding areas to receive and hold used consumable parts and new consumable parts, or alternatively, may have different part buffers separately for holding used consumable parts and new consumable parts. The robot provided in the part buffer(s) and the replacement station (108) allows for the direct transfer and retrieval of consumable parts into and out of the process modules (112 to 120). Isolation valves in the process modules (112 to 120) keep only the process modules (112 to 120) offline instead of the entire cluster tool assembly (100).

[0038] FIG. 2 illustrates an alternative embodiment of a cluster tool assembly (100), wherein a replacement station (108) is configured to be mounted on a vacuum transfer module (VTM) (104) placed in the cluster tool assembly (100) instead of process modules (112 to 118). The VTM (104) includes a robot used during the processing of a semiconductor wafer to move the semiconductor wafer from the load lock chamber (110) to the process modules (112 to 118) and to move it in and out of one or more process modules (112 to 118) integrated with the VTM (104). The robot includes an end effector used to receive, hold, and move the semiconductor wafer between different process modules. A separate opening is formed in the VTM (104) so ​​that the replacement station (108) is mounted to align with the opening formed in the VTM (104). In a location where symmetry is important, an opening within the VTM (104) is formed to preserve the uniformity and symmetry of the VTM (104) and the uniformity and symmetry of the cluster tool assembly (100). For example, a dummy opening with a dummy door may be formed in the VTM (104) opposite the opening to maintain uniformity and symmetry in the VTM (104). Alternatively, if a dummy opening already exists in the VTM (104) and the opening is large enough to move consumable parts, a replacement station (108) may be mounted in the dummy opening to continue maintaining the uniformity and symmetry of the cluster tool assembly (100).

[0039] Typically, the openings within the VTM (104) are sized to fit the carrier / robot and the semiconductor wafer used to move the semiconductor wafer in and out of the VTM (104). However, consumable parts larger than the semiconductor wafer cannot be fitted. For example, an edge ring positioned to surround the semiconductor wafer when accommodated in the process modules (112 to 118) is wider than the semiconductor wafer. In these cases, the edge ring may not be fitted through the opening designed to move the semiconductor wafer without re-engineering the opening. In some cases, re-engineering the openings of the VTM (104) may not be a feasible option because it may affect the symmetry of the cluster tool assembly. Therefore, instead of re-engineering the openings of the VTM (104) and causing asymmetry in the cluster tool assembly (100), segmented consumable parts may be used such that each segment may be fitted through the opening. For example, the edge ring used to surround a semiconductor wafer in a process module may be designed as a segmented edge ring consisting of two or more parts, each part being designed to be fitted through the openings of the replacement station (108) and VTM (104). In this example, the segmented edge ring may be extracted and replaced individually.

[0040] When replacing consumable parts, particularly multi-part segmented consumable parts, each segment of the consumable part must be properly aligned and set within the process module so that no gaps are formed between the segments. In process operations such as high aspect ratio etching operations, it should be noted that gaps existing between any components of the etching process module will cause ions to flow through any underlying component and damage any underlying component. For example, in a high aspect ratio etching equipment module, a gap within the edge ring will cause high-energy ions to flow through the underlying chuck, where the edge ring may be placed on top, and will damage the surface of the chuck. To prevent the formation of gaps, the segmented consumable part may be designed to ensure that each segment fits tightly with other segments when installed in the process module. Thus, in some embodiments, the segmented or multi-part consumable part may be designed to have interlocking segments. Alternatively, the consumable part may be designed to have overlapping segments to prevent ions or processing gases / chemicals from finding a direct flow path to the lower component. For example, in some embodiments, the consumable part may consist of an inner part and an outer part that can be fitted wholly or partially through an opening formed between the VTM (104) and the replacement station, and one part may be installed overlappingly over another part in the process module, thereby preventing the formation of a gap. Other variations in the design of the consumable part may be implemented to enable the consumable part to move in and out of the VTM (104) without re-engineering the opening designed to maintain the symmetry of the cluster tool assembly.

[0041] In one embodiment, instead of using a dedicated robot at the replacement station (108), the robot used in the VTM (104) to move semiconductor wafers in and out of the process module may also be used for the retrieval and replacement of consumable parts. In some embodiments, the end effectors of the robot used to move semiconductor wafers between process modules are also used to receive, hold, and move consumable parts between process modules (112 to 118) and the replacement station (108). In other embodiments, the robot of the VTM (104) is designed to have different end effectors to move consumable parts and semiconductor wafers. An end effector is typically a part formed within the robot to retrieve, support, hold, pick, lift, move, or rotate a movable part, such as a semiconductor wafer or consumable part. The movable part may be held in any orientation plane. Separate end effectors may be provided to move consumable parts and semiconductor wafers separately to prevent contamination of the semiconductor wafer.

[0042] In an alternative embodiment, a dedicated robot in the replacement station (108) may operate in conjunction with a robot in the VTM (104) to extract and replace consumable parts from a process module. For example, a robot in the VTM (104) may be used to extract used consumable parts from a process module and to move the used consumable parts to an assembly area formed between the VTM (104) and the replacement station (108). A dedicated robot in the replacement station (108) may be used to move used consumable parts from the assembly area into a parts buffer. Similarly, a dedicated robot in the replacement station (108) may be used to move new consumable parts from the parts buffer of the replacement station (108) into the assembly area, and a robot in the VTM (104) may be used to move new consumable parts from the assembly area to a process module. In one embodiment, the assembly area may have a first area for receiving used consumable parts and a second area for receiving new consumable parts. In process modules (112 to 118), a lift mechanism is used to install new consumable parts in process modules (112 to 118).

[0043] The design of the replacement station (108) of the embodiment illustrated in FIG. 2 is similar to the design of the replacement station (108) discussed with reference to FIG. 1. For example, the replacement station (108) of FIG. 2 includes a mechanism such as a pump to maintain the replacement station (108) under vacuum when the replacement station (108) is mounted on the VTM (104). Maintaining the process conditions of the replacement station (108) similar to those of the VTM (104) (i.e., under vacuum) will ensure that the process conditions within the VTM (104) are not negatively affected during the replacement of consumable parts. One or more parts buffers are formed in the replacement station (108) to receive and hold used consumable parts and new consumable parts.

[0044] The design of the process module (118) illustrated in FIG. 2 is slightly different from the process module (118) defined in FIG. 1. That is, the process module illustrated in FIG. 2 does not include a second opening. For example, since the replacement station (108) is mounted directly to the VTM (104) and access from the replacement station (108) to the process module (118) is provided through the VTM (104), the process module (118) does not require a second opening for mounting the replacement station (108). Additionally, a single isolation valve is used to provide access to the process module (118) through the VTM (104) during the replacement of consumable parts and to isolate the process module during the processing of the semiconductor wafer. It should be noted that the replacement station (108) is kept under vacuum so that consumable parts can be easily replaced without negatively affecting the process conditions of the cluster tool assembly (100). As a result, conditioning and certifying the cluster tool assembly (100) to process the semiconductor wafer may be achieved in a shorter time because the purge / pump process is not required and other certification steps are performed in a shorter time. In some embodiments, the replacement station (108) may be permanently mounted on the VTM (104).

[0045] FIG. 3 illustrates another embodiment of a cluster tool assembly (100), in which a replacement station (108) is mounted on an air transfer module (ATM) (102). A robot within the ATM (102) of the cluster tool assembly (100), used to move a semiconductor wafer from a wafer loader, for example, to a load lock chamber (110), is also used to move consumable parts to and from the replacement station (108). In this embodiment, the replacement station (108) mounted on the ATM (102) is maintained in the same air state as the ATM (102). As a result, the replacement station (108) does not require a pump or similar mechanism to maintain the replacement station (108) under vacuum. In some embodiments, the replacement station (108) may be permanently mounted on the ATM (102).

[0046] In addition to the ATM (102), the cluster tool assembly (100) illustrated in FIG. 3 includes a vacuum transfer module (VTM) (104) and a plurality of process modules (112 to 120) integrated with the VTM (104). A load lock chamber (110) is formed between the ATM (102) and the VTM (104) while preserving the process conditions of the ATM (102) and the VTM (104), and serves as an interface to move a semiconductor wafer from the ATM (102) to the VTM (104).

[0047] The load lock chamber (110) of the cluster tool assembly (100) is designed to handle both semiconductor wafers and consumable parts. Separate gathering areas, such as compartments, may be provided in the load lock chamber (110) to accommodate semiconductor wafers and consumable parts to avoid contaminating the semiconductor wafers. The gathering area within the load lock chamber (110) designed to accommodate consumable parts may be further configured to provide separation of gathering areas for accommodating used consumable parts and new consumable parts. An opening formed within the load lock chamber (110) is designed to fit consumable parts and semiconductor wafers. Alternatively, when the opening is not designed to fit consumable parts, segmented consumable parts may be used such that each segment of the consumable part may be fitted through the opening formed in the load lock chamber (110).

[0048] In the embodiment illustrated in FIG. 3, the robot in the VTM (104) used to move a semiconductor wafer from the load lock chamber (110) to a process module (112 to 120) integrated into the VTM (104) or from one process module (112 to 120) to another process module is also used to move consumable parts between the load lock chamber (110) and the process modules (112 to 120).

[0049] In some embodiments, in addition to the robots of the ATM (102) and VTM (104), the replacement station (108) may include a dedicated robot configured to move consumable parts between the replacement station's part buffer and the ATM (102). In these embodiments, the robot of the ATM (102) may be used to move consumable parts and semiconductor wafers between the ATM (102) and the load lock chamber (110), and the robot of the VTM (104) may be used to move consumable parts and semiconductor wafers between the load lock chamber (110) and process modules (112 to 120). In one embodiment, a single end effector may be provided to the robots of the ATM (102) and VTM (104) which may be engaged at different times to move both semiconductor wafers and consumable parts. In another embodiment, separate end effectors may be provided to the robots of ATM (102) and VTM (104), one end effector is for moving a semiconductor wafer and the other end effector is for moving a consumable part. A lift mechanism is used to properly align and install a new consumable part in a suitable location within the process module (112 to 120).

[0050] FIG. 3a illustrates a more detailed version of a cluster tool assembly (100) that includes additional modules than those illustrated in FIG. 3 in one embodiment. As in FIG. 3, the embodiment illustrated in FIG. 3a shows a replacement station (108) coupled to a first side (101a) of an ATM (102) and uses robots of the VTM (104) and ATM (102) to replace consumable parts. In this embodiment, in addition to the replacement station (108) mounted on the first side (101a) of the ATM (102), one or more wafer loaders (115) are mounted on the first side (101a) of the standby transfer module (102). The wafer loader (115) may be a standard wafer loader, for example, a FOUP (front opening unified pod) designed to be coupled to the ATM (102), or a custom-made wafer loader. The replacement station (108) and wafer loader(s) (115) are configured to be temporarily or permanently coupled to the ATM (102) through specific load ports (not shown) defined on the first side (101a) of the ATM (102). Doors to the replacement station (108) and wafer loader(s) (both standard wafer loader and custom wafer loader) are designed to be compatible with the opening of the standard load port defined on the first side (101a) of the ATM (102). The wafer loader (115) includes a wafer buffer comprising a plurality of compartments for receiving and holding processed wafers or unprocessed wafers. It should be noted that wafers and substrates are used interchangeably in this application and refer to thin slices of semiconductor material used for the manufacture of electronic devices such as integrated circuits.In some embodiments, the replacement station (108) is similar in structure and design to a wafer loader (115) (e.g., FOUP) and includes a parts buffer (224) having a plurality of compartments (207) configured to receive and store new and / or used consumable parts (208).

[0051] In addition to the replacement station (108) and wafer loaders (115), one or more buffer stations (113) may be coupled to the ATM (102). The buffer stations (113) may include dynamic aligners commonly used to provide alignment inputs to a computer that is communically connected to the ATM (102). The alignment inputs are used to align the wafer when the wafer is transferred to the loadlock chamber (110). For example, a robot (103) within the ATM (102) may be used to move a wafer from one of the wafer loaders (115) onto a chuck located inside the dynamic aligner within the buffer station (113). The chuck is configured to spin the wafer. A sensor within the dynamic aligner is used to detect one or more notches provided along the edge of the wafer, off-center notches, and to provide this data, which is the alignment input, to the computer. The computer may provide alignment input to the robot so that the robot can use the alignment input to transfer the wafer from the dynamic aligner to the load lock chamber (110) so that the wafer is properly aligned when the wafer is transferred. In some embodiments, one or more dynamic aligners may be used to provide alignment input to the computer for the consumable part to ensure that the consumable part is properly aligned when the consumable part is transferred to the load lock chamber (110). It should be noted that the alignment input for aligning the wafer may be different from the alignment input for aligning the consumable part. In other embodiments, alignment of the consumable part may be performed within the replacement station. In these embodiments, there is no need to perform additional alignment when transferring the consumable part to the load lock chamber (110).

[0052] In some embodiments, the robot (103) in the ATM (102), designed to move the wafer, is also designed to move the consumable part (208) from the replacement station (108) to the load lock chamber (110). The conventional design of the robot (103) includes an end effector mechanism having "fingers" used to support the wafer. However, because the consumable part is generally larger in diameter than the wafer, the fingers on the end effector mechanism are designed to support the wafer and are therefore short and not designed to provide contact support to the consumable part. To reconcile this contradiction, in one embodiment, the fingers of the end effector mechanism of the robot (103) in the ATM (102) are extended to a length sufficient to allow the fingers to provide contact support to the consumable part (208). Although the end effector mechanism having extending fingers is described as being implemented in the robot (103) of the ATM (102), it should be noted that the end effector mechanism described herein may also be implemented in the robot (105) of the VTM (104).

[0053] In an alternative embodiment, the short fingers of the robot's end effector mechanism within the ATM (102) are used to support a ring carrier. The surface of the ring carrier is used to support consumable parts. The ring carrier may be in the form of a carrier plate that is stored within a housing within the replacement station (108) and retrieved when consumable parts need to be transported to the load lock chamber (110). In this embodiment, the fingers of the end effector do not need to be redesigned because the existing fingers of the end effector can be used to support the carrier plate. Details of the end effector mechanism used within the ATM (102) and / or VTM (104) will be described in detail with reference to FIGS. 6a through 6c. The carrier plate used to support and transport consumable parts will be described with reference to FIGS. 8a and 8b, and FIGS. 9a and 9b.

[0054] Replacing a consumable part in a process module (112) integrated into a cluster tool assembly (100) requires access to the process module (112) and access to the consumable part (208) within the process module (112). Access to the process module (112) has been discussed with reference to FIGS. 1 through 3, and the replacement station (108) is mounted directly to the process module (112 to 120) or is mounted to the vacuum transfer module (104) or the atmospheric transfer module (102) through which access is provided to the process module (112 to 118, 120). If the process module (112 to 120) is accessed, access to the consumable part needs to be provided so that the consumable part can be safely retrieved and replaced without damaging the consumable part or other hardware components of the process module (112 to 120).

[0055] FIG. 4 illustrates an exemplary embodiment of a lift mechanism that may be used within the process modules (112 to 120) of a cluster tool assembly (100) to provide access to a consumable part (208) that needs to be replaced. In some embodiments, the consumable part (208) is positioned over a bottom edge ring (236) and adjacent to a cover ring (232). The bottom edge ring (236) is positioned over a base ring (240) and, in some embodiments, next to a sleeve ring (238). An insulator ring (234) may be provided between the lift mechanism and the side wall of the chamber. The lift mechanism is configured to move the consumable part (208) to a raised position so that the consumable part (208) can be accessed. In some embodiments, the consumable part (208) is an edge ring positioned adjacent to a semiconductor wafer (150) housed in the process module during processing. The lift mechanism includes a plurality of lift pins (202) connected to a plurality of actuators (204). For example, the lift pins may be distributed along a plane to allow the lift pins to contact consumable parts at different points and move the consumable parts. In some embodiments, the lift pins distributed along the plane may be grouped into distinct sets, and each set of lift pins operates independently to access different consumable parts and lift different consumable parts. In some embodiments, the actuators (204) are vacuum-sealed actuators (204) having a plurality of lift pins (202).

[0056] The actuators (204) are driven by the actuator drive unit (206). In a disengaged mode, the lift pins (202) are retracted into the housing formed in the lift mechanism and do not come into contact with the consumable part (208). When the consumable part (208) needs to be replaced, the actuator (204) is powered through the actuator drive unit (206). The powered actuator (204) causes the lift pins (202) to extend outside the housing to come into contact with the consumable part (208) and move the consumable part (208) to a raised position. When the consumable part is raised, the consumable part is raised into the vacuum space (210) because the process module (e.g., 118) is maintained in a vacuum state. The robot of the VTM (104) or replacement station (108) extends the end effector into the process module (118) and causes the end effector to slide under the raised consumable part (208). In some embodiments, the end effector attached to the robot is shaped like a spatula that allows the end effector to support the raised consumable part. When the end effector slides to a specific position, the actuators (204) retract the lift pins (202) into the housing and cause the consumable part (208) to be placed on the end effector. The robot is then operated to pull the end effector back into the VTM (104) or replacement station (108) from above, depending on which robot is used to retrieve the consumable part (208), and the consumable part (208) is retrieved using the end effector. The reverse order occurs when a new consumable part (208) needs to be placed in the process module (e.g., 118).The lift mechanism of the process module (e.g., 118) is used to properly install consumable parts at appropriate locations within the process module (118) so that the process module (118) and the cluster tool assembly (100) are in operation.

[0057] In addition to providing power to actuators to operate lift pins to raise a consumable part (208), a power source connected to the actuator drive (206) of the lift mechanism may, in some embodiments, supply power to the consumable part through the lift pins. In these embodiments, the actuators (204) and the lift pins (202) may be made of a conductive material to supply power to the consumable part (208). In some embodiments, the surface area of ​​the lift pin that contacts the consumable part may serve as an electrical contact and may be used to supply power from the power source to the consumable part. In some embodiments, the power source is an RF power source that causes the lift pins (202) to supply RF (radio frequency) power to the consumable part (208). Additional details regarding powering a consumable part using an RF power source are further described in U.S. Provisional Application No. 62 / 191,817, jointly owned and jointly pending, filed July 13, 2015, and titled “Extreme Edge Sheath and Wafer Profile Tuning Through Edge-Localized Ion Trajectory Control and Plasma Operation,” which is incorporated herein by reference in its entirety. In some embodiments, the lift pins (202) may be switched. The switch may be used to control the amount of power supplied to the consumable part (208). In some embodiments, the switch may be used to supply different power to the consumable part (208). In some embodiments, the power supplied to the consumable part (208) may be used to heat the consumable part (208). For example, when the consumable part (208) is an edge ring, the power supplied by the power source may be used to provide a temperature-controlled edge ring.In some embodiments, power may be provided to the consumable part (208) through other means, such as through capacitive coupling. Additional details for providing power to the consumable part (208), such as the edge ring, using alternative means such as capacitive coupling are described in U.S. Provisional Application No. 62 / 206,753, jointly owned and jointly pending, filed August 15, 2015, and titled "Edge Ring Assembly for Improving Feature Profile Tilting at Extreme Edge of Wafer," which is incorporated herein by reference in its entirety. It should be noted that the different means for providing power to the consumable part (208) discussed herein are merely examples and other forms of providing power to the edge ring may also be employed. In some embodiments, the consumable part (208) (a single piece or different pieces of a multi-piece consumable part) may be aligned and installed at a specific location in the process module (e.g., 118) using one or more magnets. For example, a lift mechanism provided in the process module (e.g., 118) may include a surface on which the consumable part (208) is supported from above. One or more magnets may be placed on the underside of the surface of the lift mechanism on which the consumable part (208) is supported from above. The magnets placed in the lift mechanism may be used to align the consumable part at a specific location within the process module (e.g., 118).

[0058] In some embodiments, the lift mechanism may be connected to an air compressor or other compressed pressure source to cause the lift mechanism to operate pneumatically. In some embodiments, the lift mechanism may be used to provide electrostatic clamping to clamp a consumable part (208) at a specific location within a process module (e.g., 118). In these embodiments, the lift mechanism may be connected to a direct current (DC) power source to cause the lift pins (202) to provide DC power to clamp a consumable part (208) at a specific location within a process module (e.g., 118).

[0059] FIG. 5a illustrates an exemplary cluster tool assembly for identifying various components used to replace consumable parts within a process module (118) in one embodiment. The process module (118) may be an etching equipment module that can be used to generate a TCP (transformer coupled plasma) to perform conductive etching or a CCP (capacitively coupled plasma) to perform dielectric etching, or to perform PECVD (plasma enhanced chemical vapor deposition) or ALD (atomic layer deposition) or any other type of etching on a semiconductor wafer. Alternatively, the process module (118) may be used to perform any other process operation (e.g., deposition, plating, etc.) to form different features on a semiconductor wafer.

[0060] The replacement station (108) may include a parts buffer (224). In one embodiment, the parts buffer (224) includes a plurality of compartments (207) configured to accommodate used consumable parts (208) recovered from the process module and new consumable parts (208) that need to be transferred to the process module. Alternatively, separate parts buffers (224) may be used to store used consumable parts (208) and new consumable parts (208) separately. The exchange handler (214) within the replacement station (108) may be used to move new consumable parts (208) from the compartments (207) of the parts buffer (224) into the process module (118) and to recover used consumable parts (208) from the process module (118) and store them in the compartments (207) of the parts buffer (224). The exchange handler (214) includes a robot (215) configured to move laterally, vertically, and / or radially so that the end effector (213) of the exchange handler (214) can access the consumable part (208) from the part buffer (224) and the process module (118). The end effector may be configured to access, retrieve, and transfer the consumable part (208) to the part buffer (224) or the process module. In some embodiments, the end effector may be a special end effector designed to retrieve, pick, lift, support, hold, move, or rotate the consumable part in any plane. The end effector of the exchange handler (214) may be operated to extend and retract during operation so that the consumable part may be retrieved from the process module and stored in the part buffer (224). In some embodiments, the end effector may be configured to move radially, laterally, and / or vertically to provide greater flexibility during the retrieval operation.The exchange handler (214) is connected to a controller (220) to control the movement of the end effector (213) and the robot (215) of the exchange handler (214).

[0061] The replacement station (108) may also include a vacuum control module (231) connected to the pump (233) to manipulate process conditions within the replacement station (108). In some embodiments, the replacement station (108) is connected to a controller (220) to enable the adjustment operation or action of the pump (233) through the vacuum control module (231) during the replacement of consumable parts.

[0062] A first isolation valve (216) is provided between the replacement station (108) and the process module (118) to allow the replacement station (108) to be mounted on the process module (118). In some embodiments, the first isolation valve (216) may be a gate valve. The process module (118) includes a first side and a second side, the first side of the process module (118) is coupled to a vacuum transfer module (VTM) (104), and the second side of the process module (118) is coupled to the first side of the first isolation valve (216). The second side of the first isolation valve (216) is coupled to the replacement station (108). The coupling operates doors (217, 219) formed in the replacement station (108) and the process module (118), respectively, to allow a robot (215) in the replacement station (108) to access the process module (118). A first side of the second isolation valve (216') is coupled to the VTM (104), and a second side of the second isolation valve (216') is coupled to a first side of the process module (118). The coupling allows the operation of doors (227, 229) covering corresponding openings formed in the process module (118) and the VTM (104), respectively, to allow a robot in the VTM (104) to access the process module (118) during processing and to move semiconductor wafers in and out of the process module (118). The first isolation valve (216) and the second isolation valve (216') are connected to a controller (220) to coordinate the coupling of the process module (118) to the VTM (104) and the replacement station (108).

[0063] The process module (118) includes an upper electrode (218) that may be used to provide process chemicals to a process zone formed in the process module (118). The upper electrode (218) may be connected to a power source (not shown) to provide power to the process chemicals within the process zone, for example, to generate plasma. In some embodiments, the power source may be an RF power source connected to the upper electrode (218) through a matching network (not shown). Alternatively, the upper electrode may be electrically grounded.

[0064] The process module (118) also includes a lower electrode (230). In some embodiments, the lower electrode (230) is configured to receive a semiconductor wafer (150) during processing. In some embodiments, the lower electrode (230) is an electrostatic chuck. The lower electrode (230) may be coupled to a power source (not shown) to provide power to the lower electrode (230) during processing. Alternatively, the lower electrode (230) may be electrically grounded.

[0065] The process module (118) includes a lift mechanism (221) for enabling a consumable part (208) to be moved to a raised position. The lift mechanism (221) is similar to the lift mechanism discussed with reference to FIG. 4 and includes a plurality of lift pins (202) and actuators (204) for lifting the consumable part to a raised position, and an actuator drive (206) connected to the actuators (204) to provide power to drive the actuators (204). The actuator drive (206) may be coupled to a controller (220) to control the operation of the lift mechanism (221) during replacement of the consumable part.

[0066] The controller (220) includes a vacuum state control unit (223) and a transfer logic unit (225) to facilitate the adjustment operation of various components connected to the controller (220). In one embodiment, when a consumable part is replaced in the process module (118), the replacement station (108) contacts the first isolation valve (216). In response to the detection of the replacement station (108) by the first isolation valve (216), a signal is transmitted from the isolation valve (216) to the controller (220). The controller (220) then adjusts the coupling of the replacement station (108) to the process module (118) and the maintenance of the vacuum in the replacement station (108). For example, in response to a detection signal received from the first isolation valve (216), the vacuum state control unit (223) of the controller (220) may transmit a signal to the vacuum control unit (231) to start a process of coupling the replacement station (108) to the process module (118). In response to a signal received from the vacuum state control unit (223), the vacuum control unit (231) may operate the pump (233) to cause the replacement station to be placed in a vacuum state. When the replacement station (108) reaches a vacuum state, a signal is transmitted from the vacuum control unit (231) to the vacuum state control unit (223). Subsequently, the vacuum state control unit (223) transmits a signal to the first isolation valve (216) to couple the replacement station to the process module (118). In response, the first isolation valve (216) ensures that all intermediate zones of the first isolation valve (216) between the replacement station (108) and the process module (118) are kept under vacuum.When guaranteed, the first isolation valve (216) performs coupling of the process module (118) to the first side of the first isolation valve (216) and coupling of the replacement station (108) to the second side of the first isolation valve (216). Additional testing may be performed to ensure that the intermediate areas of the first isolation valve (216) and the replacement station (108) are in a vacuum before operating the doors (217, 219) to provide access to the process module (118).

[0067] As a component of the coupling operation, the vacuum state control unit (223) may also adjust the operation of the second isolation valve (216') to maintain the process module (118) and the doors (227, 229) covering the corresponding openings formed in the VTM (104) into which the process module (118) is integrated, closed, and sealed. During coupling, the lift mechanism (221) within the process module (118) is maintained in a disengaged mode with the consumable part (208) placed at the installation position of the lift mechanism and the lift pins (202) retracted into the housing of the lift mechanism (221). For example, the consumable part (208) is an edge ring. At the installation position of the lift mechanism, when a semiconductor wafer (150) is present within the process module (118), the edge ring is positioned adjacent to the semiconductor wafer (150) and substantially surrounds the semiconductor wafer (150).

[0068] Once the coupling process is completed, a signal is transmitted from the first isolation valve (216) and, in some embodiments, from the second isolation valve (216') to the controller (220). In response, the controller (220) activates the transfer logic unit (225). The transfer logic unit (225) is configured to coordinate the movement of the robot (215), the end effector (213) of the exchange handler (214) in the exchange station (108), and the actuator drive unit (206) of the lift mechanism (221) in the process module (118) so that the end effector (213) can retrieve a consumable part from the process module (118), move it into a compartment (224) in the part buffer (224) formed in the exchange station (108), and move the replacement part of the consumable part from the compartment (207) of the part buffer (224) back to the process module (118) for installation. The lift mechanism (221) is operated to install the replacement consumable part into a suitable location in the process module (118).

[0069] FIG. 5b illustrates a process for recovering a consumable part (208) from a process module (118) in one embodiment. The consumable part (208) is typically replaced before a semiconductor wafer is received into the process module (118) for processing. According to this embodiment, if a replacement station (108) is coupled to the process module (118) through a first isolation valve (216) and a second isolation valve (216') seals the doors (227, 229) to the VTM (104), the transfer logic unit (225) of the controller (220) is used to transmit signals to a replacement handler (214) and an actuator drive unit (206) to recover the consumable part from the process module and replace it with a new consumable part. The transfer logic unit (225) transmits signals to operate the robot (215) and the end effector (213) so that the end effector (213) extends into the process module (118) to retrieve the consumable part. At the same time, the transfer logic unit (225) operates the actuator drive unit (206) so that the actuators (204) move the lift pins (202) outside the housing formed in the lift mechanism (221), thereby moving the consumable part (208) from the installation position to a raised position as illustrated in FIG. 5b. The end effector (213) slides under the raised consumable part (208) which is substantially supported by the end effector. Then, the actuator drive unit (206) is operated so that the actuators (204) retract the lift pins (202) into the housing within the lift mechanism (221), which causes the raised consumable part (208) to be placed on the end effector (213) of the exchange handler (214).Next, the end effector (213) of the exchange handler (214) is operated to retract into the replacement station (108) that brings the consumable part (208) using the end effector (213). Next, the end effector (213) is operated to move the recovered consumable part (208) to the compartment (207) of the part buffer (224).

[0070] A new consumable part (208) is moved in a similar manner from a different compartment (207) of the part buffer (224) to the process module (118). When the new consumable part (208) is moved into the process module (118), the actuator drive unit (206) is operated to cause the actuators (204) to extend the lift pins (202) outside the housing to receive the new consumable part (208). The actuators (204) cause the lift pins (202) to lower so that the consumable part (208) is set in the installation position within the process module (118). During the replacement of the consumable part, the vacuum state control unit (223) continues to interact with the vacuum control unit (231) to ensure that the replacement station is kept under vacuum so that the pump (233) matches the vacuum state maintained within the process module (118).

[0071] If the consumable part (208) has been replaced, the controller (220) is used to coordinate the withdrawal of the replacement station (108) from the process module (118). Accordingly, the controller (220) signals the first isolation valve (216) to close the doors (217, 219) between the process module (118) and the replacement station (108), and signals the second isolation valve (216') to have the VTM (104) open the doors (227, 229) to access the process module (118).

[0072] In some embodiments, the process module (118) may be conditioned before returning the process module to actual operation. The conditioning operation may take a shorter time because the replacement of consumable parts was performed in a vacuum and only the process module (118) needs to be conditioned. Subsequently, a signal may be transmitted from the vacuum state control unit (223) to the vacuum control unit (231) to cause the pump (233) to purge the replacement station (108). Subsequently, the replacement station (108) may be unmounted from the process module (118).

[0073] FIG. 5c illustrates a process for replacing consumable parts in an embodiment of the cluster tool assembly exemplified in FIG. 2, where a replacement station (108) is mounted on the VTM (104) instead of the process module (118). In this embodiment, the replacement station (108) is mounted on the vacuum transfer module (VTM) (104) via the first isolation valve (216) such that the first side of the first isolation valve (216) is coupled to the first side of the VTM (104). The replacement station (108) is coupled to the second side of the first isolation valve (216). The second isolation valve (216') is positioned such that the first side of the second isolation valve (216') is coupled to the process module (118) and the second side of the second isolation valve (216') is coupled to the second side of the VTM (104). To enable a robot in the VTM (104) to access, retrieve, and move consumable parts between the compartment (207) in the part buffer (224) in the replacement station (108) and the process module (118), a first isolation valve (216) is configured to operate doors (237, 239) covering corresponding openings formed in the replacement station (108) and the VTM (104), respectively, and a second isolation valve (216') is configured to operate doors (227, 229) covering corresponding openings formed in the VTM (104) and the process module (118), respectively. The replacement station (108) illustrated in FIG. 5c does not include a dedicated exchange handler (214) having a robot (215) and an end effector (213). The robot (235) is operatively coupled to the controller (220) to allow the controller to adjust the operation of the robot (235).Additionally, the replacement station, the first isolation valve (216), the VTM (104), the second isolation valve (216'), and the process module (118) are coupled to a controller (220) to synchronize access between the replacement station and the process module during replacement of consumable parts while the process module (118), the VTM (104), and the replacement station (108) are kept under vacuum.

[0074] The process of mounting the replacement station (108) on the VTM (104) is similar to the embodiment discussed with reference to FIG. 5a, except that the replacement station (108) is mounted on the VTM (104) instead of the process module (118). The process of replacing the consumable part (208) is similar to the embodiment discussed with reference to FIG. 5a, except that instead of using the end effector (213) and robot (215) of the replacement station (108) discussed in FIG. 5a to adjust it, the controller (220) adjusts it using the robot (235) of the VTM (104).

[0075] In an alternative embodiment, the replacement station (108) may include a replacement handler (214) (not shown) having a robot (215) and an end effector (213), and the replacement handler (214) is operatively connected to a controller (220). The controller (220) is used to control the coordination of the robot (215), the end effector (213), and the robot (235) during the replacement of consumable parts. In this embodiment, the robot (215) and the end effector (213) may be used to retrieve and move consumable parts between the part buffer (224) and the VTM (104), and the robot (235) of the VTM (104) may be used to move consumable parts between the VTM (104) and the process module (118).

[0076] In the embodiment illustrated in FIG. 5c, it should be noted that the second isolation valve (216') is not used to isolate the process module (118) from the rest of the cluster tool assembly (100) during the replacement of consumable parts. This is because, in this embodiment, access to the process module is provided through the VTM (104). Consequently, the second isolation valve (216') is configured to provide access when consumable parts need to be replaced, while enabling the selective isolation of the process module (118) during the processing of the semiconductor wafer. In this embodiment, conditioning of the cluster tool assembly (100) after the replacement of consumable parts will take a shorter time because the replacement station, the VTM (104), and the process module (118) are all kept under vacuum during the replacement of consumable parts.

[0077] FIG. 6a illustrates an end effector mechanism (70) used in a robot (103) of an ATM (102) to transfer a wafer between a wafer loader (115) and a load lock chamber (110). As illustrated in FIG. 6a, the end effector mechanism (70) includes a list plate (701) that is connectable to a robot (103) within the ATM (102) on one side and to a mounting armset on the other side. In some embodiments, the mounting armset is made of a single plate of stainless steel material. A finger assembly (705) is mounted on a second side of the mounting armset. In some embodiments, the finger assembly (705) is mounted to the mounting armset using a spring-loaded mount to provide a method of leveling adjustment of the finger assembly (705). The finger assembly (705) includes a pair of fingers (707) extending to a length sufficient to support the wafer but not sufficient to support the consumable part (208), as shown in FIG. 6a. In some embodiments, the finger assembly (705) and the wrist plate (701) of the end effector mechanism (70) are made of aluminum material. In some embodiments, the length (L1-a) of the finger assembly (705) is about 280 mm, and the length (L1-b) of the fingers (707) is about 103 mm.

[0078] The fingers (707) of the finger assembly (705) may be extended to accommodate consumable parts (208). However, if the fingers (707) of the finger assembly (705) are extended, the stainless steel material used in the end effector mechanism (70) of FIG. 6a will cause the fingers (707) to deflect from the wafer transfer plane due to an increase in payload caused by the extra material. The amount of deflection will make this end effector mechanism (70) less desirable to use in tight spaces, such as the space within a cluster tool assembly, where precision of the transfer plane is desired. Therefore, instead of redesigning the finger assembly (705) to extend the fingers (707), the original design of the finger assembly (705) is maintained. The original design of the finger assembly (705) is used to transport consumable parts by having the finger assembly (705) support a ring carrier. Eventually, the ring carrier is used to support consumable parts (208). Details of the ring carrier will be described with reference to FIGS. 8a and 8b.

[0079] FIGS. 6b, FIGS. 6ba, and FIGS. 6c illustrate an exemplary end effector mechanism (700) used in a robot within a cluster tool assembly (100) in some embodiments. FIG. 6b illustrates a top view, FIG. 6ba illustrates a side view, and FIG. 6c illustrates a side-angled view of an exemplary end effector mechanism (700) used to receive and transport consumable parts. The end effector mechanism (700) illustrated in FIGS. 6b, FIGS. 6ba, and FIGS. 6c is redesigned to enable the end effector mechanism (700) to transport consumable parts in addition to transporting wafers. It should be noted that the end effector mechanism (700) illustrated in FIG. 6b, FIG. 6ba, and FIG. 6c may be implemented as a robot (105) in a VTM (104) and / or a robot (103) in an ATM (102). The redesigned end effector mechanism (700) includes a list plate (702) that can be mounted on the robot at one end and on a mounting arm set (704) at the opposite end. The mounting arm set (704) is defined by an upper plate (704a) and a lower plate (704b), as illustrated in FIG. 6ba. In some embodiments, the upper plate (704a) of the mounting arm set (704) is made of stainless steel and the lower plate (704b) of the mounting arm set (704) is made of aluminum. Variations in the materials used for the upper plate and the lower plate may be implemented as long as the function of the mounting arm set is maintained. In some embodiments, the spring-loaded mounting may be effectuated between the top plate (704a) and the list plate (702).

[0080] A finger assembly (710) having a pair of fingers (706) is clamped between the top plate (704a) and the bottom plate (704b) of the mounting arm set (704) using a pair of fingers (706) extending outwardly from the mounting arm set (704). In some embodiments, the finger assembly (710) of the end effector mechanism (704) is made of a ceramic material. The ceramic material provides rigidity to the fingers (706) and the finger assembly (710), thereby reducing deflection from the ring transfer plane, particularly when supporting wafers and / or consumable parts. Additionally, the ceramic is lighter in weight and thus results in a reduced payload on the finger assembly (710). The clamping provides a stable mounting of the finger assembly (710) while ensuring that the clamping does not cause any stress cracking in the ceramic finger assembly (710). Additionally, the lightweight ceramic material allows the finger assembly (710) to be aligned substantially parallel to the ring transfer plane so that the consumable part can be smoothly transported in and out of the loadlock chamber (110). A first pair of consumable contact pads (708a) is defined at the proximal end of the finger assembly (710), and a second pair of consumable contact pads (708b) is defined at the distal end of the finger assembly (710) near the tips of the fingers (706) of the finger assembly (710). The length (L3-a) between the consumable contact pads (708a, 708b) is defined to be approximately 301 mm. Similarly, a third pair of substrate contact pads (708c) is positioned in proximity to a first pair of consumable contact pads (708a), and a fourth pair of substrate contact pads (708d) is positioned in proximity to a second pair of consumable contact pads (708b). The third and fourth pairs of substrate contact pads are positioned to be inside the first and second pairs of consumable contact pads.The length (L3-b) between the substrate contact pads (708c, 708d) is specified to be approximately 133 mm.

[0081] Now, referring to FIG. 6b, the finger assembly (710) has a proximal end (710a) defined adjacent to the mounting arm set (704) and a distal end defined at the tips of a pair of fingers (706). In some embodiments, the length (L2-a) is defined to cover at least the diameter of the consumable part (208) so that the consumable part is supported when received. For example, the length (L2-a) of the finger assembly (701) is defined to be at least about 360 mm, and the length (L2-b) of the pair of fingers (706) is defined to be at least 182 mm. The finger assembly (710) is used to receive and transport both the consumable part (208) and the wafer. For example, the finger assembly (710) is configured to transport a 300 mm wafer as well as consumable parts such as an edge ring surrounding the 300 mm wafer. In other embodiments, the finger assembly (710) is configured to transport a 200 mm wafer, or a 450 mm wafer, or a wafer of any other size, as well as consumable parts such as an edge ring surrounding each sized wafer. In these embodiments, the finger assembly (710) is sized to support the appropriately sized wafer and consumable parts.

[0082] To assist in transporting consumable parts (208) and wafers, a plurality of contact pads are provided on the top surface of the finger assembly (710) at varying distances to support consumable parts and wafers when receiving consumable parts and wafers. In some embodiments, separate sets of contact pads are provided so that consumable parts and wafers have separate contact surfaces on the finger assembly (710). This arrangement may be desirable to reduce contamination of the wafer by using the same finger assembly used to transport consumable parts. A first pair of consumable contact pads (708a) may be placed on the top surface of the finger assembly (710) and located at or near the proximal end (710a) close to the mounting arm set (704). A pair of second consumable contact pads (708b) is placed on the top surface of the finger assembly (710) and is located at or near the distal end (710b) close to the tips (706a) of a pair of fingers (706). The first (708a) and second (708b) pairs of consumable contact pads are used to transport consumable parts. Similarly, a third pair of substrate contact pads (708c) is placed on the top surface of the finger assembly (710) adjacent to the first pair of consumable contact pads and between the first and second pairs of consumable contact pads (708a, 708b). A pair of fourth substrate contact pads (708d) is positioned on the top surface of the finger assembly (710) adjacent to the pair of second consumable contact pads and between the first and second pairs of consumable contact pads (708a, 708b). The third and fourth pairs of substrate contact pads (708c, 708d) are used to transport a wafer.The consumable contact pads (708a, 708b) are placed outside the diameter of the wafer, and the substrate contact pads (708c, 708d) are placed inside the diameter of the wafer. This design allows for separation of the consumable part (208) on the finger assembly (710) and the receiving surface of the wafer to minimize contamination of the wafer.

[0083] In some embodiments, the contact pads are made of a non-skid material such as an elastomer material. The position of the consumable contact pads (708a, 708b) on the upper surface of the fingers (706) is such that when the robot's end effector mechanism (710) lifts the consumable part (208), the contact pads provide reliable contact support to the lower surface of the consumable part (208). In some embodiments, two or more sets of consumable contact pads (708a, 708b) may be provided at the proximal end (710a) and distal end (710b) of the finger assembly (710) so that two or more sets of consumable contact pads (708a, 708b) can provide reliable contact support. In some embodiments, additional consumable contact pads (708) may be placed to provide contact support on the bottom surface of a consumable part (208) having a distinct bottom surface profile that may require two or more contact points.

[0084] FIGS. 7a through 7d illustrate specific embodiments of a finger assembly (710) used in an end effector mechanism (700) for supporting consumable parts (208) having different bottom surface profiles. In some embodiments, the consumable part (208) may be, for example, an edge ring positioned adjacent to the wafer when the wafer is received within the process module (112). The edge ring may have different cross-sectional profiles on the bottom surface, and consumable contact pads (708) are positioned on the top surface of the finger assembly (710) to accommodate the different surface profiles of the consumable part (208).

[0085] FIG. 7a illustrates an embodiment in which the cross-section of the bottom surface edge of the consumable part (208) is substantially rectangular. In this embodiment, consumable contact pads (708) placed on the top surface of the finger assembly (710) provide a sufficient contact surface when the consumable part (208) is properly aligned and received on the finger assembly (710) of the end effector mechanism (700). In some embodiments, the consumable contact pads (708a, 708b) are spaced apart by a distance at least equal to the diameter of the consumable part. In the embodiment illustrated in FIG. 7a, the consumable contact pad (708) is positioned so that the consumable contact pad (708) contacts the bottom surface of the consumable part (208) at a mid-span.

[0086] FIG. 7b illustrates an alternative cross-sectional profile of the bottom surface of a consumable part (208) in one embodiment. The consumable part (208) includes a cut of the bottom surface at the outer diameter of the consumable part (208). The position of the consumable contact pad (708) placed on the top surface of the finger assembly (710) ensures that the consumable contact pad continues to provide contact support to the consumable part (208) and does not miss the bottom surface of the consumable part (208) as long as the alignment of the consumable part (208) on the fingers (706) is within predetermined position error limits.

[0087] FIG. 7ca illustrates a second alternative cross-sectional profile of the bottom surface of a consumable part (208) in one embodiment. The consumable part (208) includes a cut out in the middle of the bottom surface. If a consumable contact pad (708) placed at the distance illustrated in FIG. 7a and FIG. 7b is used, the contact pad (708) will not provide sufficient contact with the bottom surface of the consumable part (208) as illustrated in FIG. 7ca. This will cause the consumable part to be received on the top surface of the fingers (706) instead of the surface of the consumable contact pad (708). Since a pair of fingers (706) are made of a ceramic material having fine ends, there is a high possibility—a very undesirable result—that the consumable part (208) received on the pair of fingers (706) may be misaligned during transport of the consumable part (208). To prevent such misalignment from occurring, additional consumable contact pads may be provided on the finger assembly (710) at different distances to ensure that when the bottom surface of a consumable part (208) with a cut-out is received on the finger assembly (710), it makes sufficient contact with one or more consumable contact pads (708) placed on a pair of fingers (706). The consumable contact pads are positioned on the finger assembly (710) to support the consumable part (208) of the expected cross-section through a range of expected positional error, but also remain outside a range of expected wafer offset so that when a wafer is received, the wafer never touches the consumable contact pads. FIG. 7cb illustrates such an example in which a set of two consumable contact pads is provided on the finger assembly (710) at different distances to provide reliable contact support at the bottom of the consumable part (208). The distance between the two disposable contact pads (708) may be configured according to the width of the cutout.

[0088] FIG. 7d illustrates a third alternative cross-sectional profile of the bottom surface of a consumable part (208) in one embodiment. In this embodiment, the consumable part (208) includes a smaller inner diameter lip so that when the wafer is received within the process module, the wafer is received over the lip of the consumable part. In this embodiment, the bottom surface of the consumable part (208) has a larger surface area than the surface areas illustrated in FIG. 7a through 7c. As a result, the consumable contact pad (708) placed on the finger assembly (710) will provide sufficient contact support to the consumable part (208) during transport. Some embodiments may use a contact pad concept of a different type than that illustrated in FIG. 7a through 7d.

[0089] FIG. 7e illustrates an end effector mechanism (700) illustrated in a robot (105) within a VTM (102), and FIG. 7fa and FIG. 7fb illustrate details of an alternative contact pad concept used in the end effector mechanism (700) to enable the accommodation of consumable parts of variable lower profiles. The various components of the end effector mechanism (700) illustrated in FIG. 7e are similar to those discussed with reference to the end effector mechanism (700) illustrated in FIG. 6a.

[0090] FIGS. 7fa and FIGS. 7fb illustrate an alternative contact pad concept used in an end effector mechanism (700) for receiving a consumable part in some embodiments. FIG. 7fb shows an enlarged view of a portion (A-1) of a finger (706) within a finger assembly (710), where an alternative contact pad concept is defined. In these embodiments, a ring-shaped contact structure (709) may be used instead of consumable contact pads (708). In some embodiments, the ring-shaped contact structure (709) may be in the form of an o-ring made of an elastomer material. Using an o-ring or a ring-shaped contact structure (709) allows for a ring-shaped line contact over a larger range of the consumable part radius. It also addresses the bottom profile variation issues of the consumable parts described with reference to FIGS. 7a through 7d and provides a greater tolerance for positional error on the end effector mechanism (700). In some embodiments, the consumable contact pads or ring-shaped contact structures and wafer contact pads are defined to be permanent parts of the end effector mechanism (700). In these embodiments, the contact pads (consumable, wafer contact pads) and / or contact structures may be made of ceramic material or any other metal suitable for the environment defined within the ATM (102) or VTM (104). In other embodiments, the consumable, wafer contact pads or contact structures may be made of a replaceable, consumable material such as an elastomer or other similar type of material.

[0091] Referring again to FIGS. 6b through 6c, the end effector mechanism (700) illustrated in FIGS. 6b through 6c may be employed by a robot (105) within a vacuum transfer module (104), and also in some embodiments by a robot (103) within an ATM (102). In alternative embodiments, the end effector mechanism (700) of FIGS. 6b through 6c may be employed by a robot (105) of a VTM (104), but a configuration of the end effector mechanism (70) illustrated in FIG. 6a or a redesigned end effector mechanism (70 or 700) may be implemented in a robot (103) of an ATM (102).

[0092] FIGS. 8a and 8b illustrate plan views of different end effector mechanisms used in robots within ATM (102) and VTM (104) in some embodiments of the present invention. As previously mentioned, the robot (103) within ATM (102) may use a conventional end effector mechanism (70) having short fingers and a carrier plate, or a modified end effector mechanism (700) having extended fingers to move wafers as well as consumable parts. FIG. 8a illustrates a plan view of a conventional end effector mechanism (70) integrated into the robot (103) of ATM (102) that is typically used to transfer wafers to a load lock chamber (110). The conventional end effector mechanism (70) may also be used to transfer consumable parts to a load lock chamber (110). As can be seen in FIG. 8a, a pair of fingers (707) defined within the end effector mechanism (70) are designed to provide contact support to a wafer (not shown) and are not designed to provide contact support to a consumable part (208) having a radius larger than that of the wafer. A ring carrier fixture is used so that the end effector mechanism (70) is used to support and transport the consumable part.

[0093] FIG. 8b illustrates an exemplary embodiment in which a ring carrier fixture is used with an end effector mechanism (70) within a robot (103) of an ATM (102) to transport consumable parts (208) between a replacement station (108) and a load lock chamber (110). The ring carrier fixture may be in the form of a carrier plate (1104). In some embodiments, the carrier plate (1104) is made of carbon fiber material. Carbon fiber is ideal because it is lightweight and minimizes the increase in payload on the finger assembly (705). Carbon fiber also provides sufficient stiffness to minimize deflection.

[0094] In some embodiments, the carrier plate (1104) is configured to have a triangular shape and is sized so that the distance of the vertices (1104a, 1104b, 1104c) from the center 1104m of the carrier plate (1104) is at least equal to the radius of the consumable part (208). The triangular shape design of the carrier plate has many advantages. For example, the triangular shape of the carrier plate allows the carrier plate (1104) with the consumable part (208) accommodated on top to move easily in and out of the load lock chamber (110) without interfering with any components defined within the load lock chamber (110). This is possible because the vertices (1104a to 1104c) enable the carrier plate (1104) to move easily between the finger assemblies (902) defined within the load lock chamber (110), for example, while maintaining sufficient spacing. Additionally, since the vertices (1104a to 1104c) are distributed at equal distances from the center of gravity 1104m defined at the center of the triangular carrier plate (1104), the consumable part (208) can be properly supported at the vertices without providing excessive stress on any one side.

[0095] In one embodiment, the carrier plate (1104) is stored in a replacement station (108) and retrieved by the robot (103) of the ATM (102) using an end effector mechanism (70). In some embodiments, the end effector mechanism (70) provided in the robot (103) of the ATM (102) may be configured to provide sufficient suction force when picking the carrier plate (1104) so ​​that the carrier plate (1104) can be safely received and transported on the end effector mechanism (70). In some embodiments, different carrier plates (1104) may be used to transport used consumable parts and new consumable parts separately. For example, a first carrier plate may be used to transport used consumable parts and a second carrier plate may be used to transport new consumable parts.

[0096] Using an end effector mechanism (70) having a ring carrier in the form of a carrier plate (1104) has advantages. For example, an existing end effector mechanism (70) may be used, and there is no need to redesign the existing end effector mechanism (70). Redesigning the end effector mechanism (70) to support the ring may require shape changes that could interfere with wafer supports or other hardware at various wafer hand-off positions. These spacing issues may be addressed by changing the robot arm trajectories of the robot within the ATM, but trajectory changes may increase wafer transfer times, which reduces system throughput. The alternative use of a ring carrier allows the use of current trajectories for wafer transfer without any changes to wafer throughput. If necessary, specific trajectories of the ring transfer can be defined without changing the wafer transfer trajectories. Additionally, it has less impact on existing firmware. In some embodiments, the ring carrier (in the form of a carrier plate (1104)) may increase the payload, which may contribute to deflection from the ring transport plane. However, for the ring carrier, by using a suitable light-weight material such as carbon fiber, any increase in payload and the resulting deflection may be substantially minimized.

[0097] FIGS. 9a and 9b illustrate a side view and a top view of an exemplary end effector mechanism (70) used with a ring carrier (1104) to transport a consumable part (208) into a load lock chamber (110) in some embodiments. The end effector mechanism (70) includes a list plate (701) attachable to a robot (103) at one end and to a mounting armset (703) at the opposite end. A finger assembly (705) is attached to a second end of the mounting armset (703). The finger assembly (705) includes a pair of fingers (707) extending outwardly from the mounting armset (703). The finger assembly (705) has a proximal end (705a) adjacent to the mounting armset (703). The distal end (705b) of the finger assembly (705) is defined at the finger tips (707a) of a pair of fingers (707). A first carrier contact pad (721a) is placed on the top surface of the finger assembly (705) near the center of a fork (723) formed on the base of the fingers (707). A pair of second carrier contact pads (721b) is placed on the top surface of the finger assembly (70) and positioned near the distal end (705b) of the finger assembly (705). A carrier plate (1104) is supported on the finger assembly (705) using the pair of first carrier contact pads (721a) and the pair of second carrier contact pads (721b). The finger assembly (705) is also configured to transport a substrate or wafer.It should be noted that in some embodiments, the conventional end effector mechanism (70) having a ring carrier (in the form of a carrier plate (1104)) may be used only by using the robot of the ATM (102) because it is convenient to store and retrieve the carrier plate (1104) from the replacement station (108) and there is no need to re-engineer any other modules to store the carrier plate (1104). The carrier plate (1104) includes consumable contact pads (708) disposed at each of the vertices (1104a to 1104c) at a distance from the center of the carrier plate (1104) outside the radius of the substrate. In some embodiments, the distance of the consumable contact pads (708) from the center of the carrier plate (1104) is at least the radius of the consumable part (208) to provide a non-slip contact surface to the consumable part when the consumable part is accommodated on the vertices of the carrier plate (1104). As discussed with reference to the embodiments illustrated in FIGS. 7a through 7d, the consumable contact pads (708) may be provided at different distances from the vertices of the carrier plate (1104). In some embodiments, each vertex may include a pair of consumable contact pads (708) disposed at an equidistant distance from each of the vertices (1104a through 1104c). In alternative embodiments, a plurality of consumable contact pads (708) may be defined at different distances from each of the vertices (1104a to 1104c) so that the contact pads provide a reliable contact surface to a consumable part (208) having different bottom surface profiles.

[0098] In addition to including a modified end effector mechanism (700) within the robot of the ATM (102) and / or VTM (104), additional modifications may be provided to the load lock chamber (110) so that the consumable part is accommodated inside during replacement operation.

[0099] FIGS. 10a through 10f provide various drawings and details of a support mechanism engaged within a load lock chamber (110) to receive and support a consumable part in some embodiments. FIG. 10a illustrates a simplified load lock chamber (110) interfacing between an ATM (102) and a VTM (104) within a cluster tool assembly (100) in one embodiment where a consumable part (208) needs to be replaced. The load lock chamber (110) includes a support mechanism (901) for receiving the consumable part (208). The support mechanism (901) includes a plurality of finger assemblies (902) that provide a contact surface on which the consumable part is received. The finger assemblies (902) are positioned at fixed locations within the load lock chamber (110). In some embodiments, as described in the following paragraphs, the finger assemblies (902) are configured to have mutually exclusive contact points for accommodating wafers and consumable parts. It should be noted that the contact points may be at different heights or radial distances to achieve exclusive separation within the predicted wafer or consumable part position error.

[0100] FIG. 10b illustrates a conventional finger assembly (903) within a load lock chamber (110) designed to accommodate a wafer. Each finger assembly (903) includes an upper support finger (903a) and a lower support finger (903b). As illustrated, the upper surfaces of both the upper support finger (903a) and the lower support finger (903b) are designed to include a downwardly inclined portion (911). When the wafer is accommodated, a contact pad (912) is formed near the tips of the upper support finger (903a) and the lower support finger (903b) to provide a non-slip contact surface for the wafer. A spacer block is formed to support the upper support finger (903a) and the lower support finger (903b). The thickness of the spacer block is designed to provide sufficient clearance to accommodate the wafer. However, the spacing provided by the spacer block of FIG. 10b is not sufficient to accommodate a consumable part having a radius larger than the wafer. To accommodate the consumable part, the finger assembly within the loadlock chamber is redesigned to prevent interference with the components of the loadlock chamber when accommodating the consumable part.

[0101] FIG. 10c illustrates an exemplary redesigned finger assembly (902) of a support mechanism (901) used within a load lock chamber (110) to accommodate a consumable part at the top in one embodiment of the present invention. The support mechanism (901) comprises a plurality of finger assemblies (902). In one embodiment illustrated in FIG. 10a, the support mechanism comprises three finger assemblies distributed equidistant from each other along the circumference of a circle. Each of the plurality of finger assemblies (902) comprises an upper support finger (902a) and a lower support finger (902b). In one embodiment, the upper surface of the lower support finger is designed to include an indent (908) adjacent to the second end of the lower support finger (902b), while the spacer block is positioned between the upper support finger (902a) and the lower support finger (902b) at the first end. To fully accommodate the consumable part, the spacer block (905) is redesigned to provide sufficient spacing so that the consumable part (208) is fully accommodated on the finger assembly (902). In the embodiment illustrated in FIG. 10c, the spacer block (905) is shown to be moved further away from the center of the load lock chamber (110) and closer to the side wall of the load lock chamber (110) so as not to interfere with the transport path of the consumable part. A second spacer block (905) may be positioned below the lower support finger (902b) at the first end, and may be the same size as the redesigned spacer block (905), or thicker or thinner. In one embodiment, instead of providing a spacer block (905), the finger assembly includes a finger support for supporting the upper support finger and the lower support finger while providing a gap between the lower support finger and the upper support finger.Additionally, in one embodiment illustrated in FIG. 10c, the lower support finger (902b) within each of the finger assemblies (902) in the load lock chamber (110) is redesigned to include an indentation (908) on the upper surface at a distance equal to the radius of the consumable part. In one embodiment, the size of the indentation (908) is designed to be at least the width of the consumable part. When the wafer and the consumable part are received, one or more contact pads are formed on the surface of the finger assemblies (902) to provide a non-slip contact support surface for the wafer as well as the consumable part (208). For example, a substrate contact pad (904) is placed on the upper surface of the upper support finger (902a) and the lower support finger (902b) at a second end of the finger assembly adjacent to the tips of the upper support finger (902a) and the lower support finger (902b). In some embodiments, substrate contact pads (904) are formed at a distance from the center of the support mechanism, such as the radius of the wafer, to provide a contact support surface for the wafer when the wafer is received. Additionally, consumable contact pads (906) are formed within the indentation (908) of the bottom support finger (902b) to provide contact support for the consumable part (208). Based on the bottom surface profile of the consumable part, additional consumable contact pads (906) may be formed within the indentation (908).

[0102] In some embodiments, substrate contact pads (904) on the upper support finger (902a) may be used to receive a wafer, while consumable contact pads within the indent may be used to receive a consumable part. In alternative embodiments, the upper support finger (902a) may include an indent (908) having a consumable contact pad (906) for receiving a consumable part (208), while substrate contact pads (904) on the surface of the lower support finger (902b) may be used to receive a wafer. In an alternative embodiment, an indent (908) may be provided on both the upper support finger (902a) and the lower support finger (902b). In this embodiment, both the upper support finger (902a) and the lower support finger (902b) are configured to receive a consumable part (208) and a wafer. It should be noted that the consumable part (208) and the wafer are not simultaneously received on the finger assembly. In some embodiments, however, it may be possible to simultaneously receive the consumable part and the wafer by using the upper support fingers (902a) to receive the wafer while the consumable part is received on the lower support fingers (902b), or vice versa. In these embodiments, the positions of the wafer contact pads and the consumable contact pads are designed so that the contact surface for receiving the consumable part (208) is kept separated from the contact surface used to receive the wafer to prevent cross-contamination. It should be noted that the wafer contact pad positions are defined so that a wafer received at the extreme end of the allowed position error does not come into contact with the consumable contact pads. Similarly, a consumable part received at the extreme end of the allowed position error should not come into contact with the wafer contact pads. The separation of the contact receiving surfaces is intended to prevent cross-contamination of the wafer when the wafer is received on the finger assembly.In some embodiments, instead of using distinct contact pads, a ring-shaped contact structure may be placed within an indentation (908) formed within the lower support fingers (902b) and / or the upper support fingers (902a). The ring-shaped contact structure may be made of an elastomer material and may be an o-ring. The contact surface provided by the ring-shaped contact structure spans a larger range of the consumable part radius.

[0103] Consumable parts, such as edge rings placed close to the wafer within the process module, are exposed to harsh processing conditions within the process module to which the wafer is exposed. As a result, some of the processing chemicals may settle on the surface of the consumable part, along with contaminants. When a consumable part is replaced within the process module, the used consumable part containing contaminants is removed from the process module and received into the load lock chamber (110), and a new consumable part is transferred from the load lock chamber (110) to the process module. Since the load lock chamber (110) is used to transfer both the consumable part and the wafer into and out of the process modules, if the contact support surface is common to receiving both the consumable part and the wafer, there is a high probability that contaminants from the used consumable part may contaminate the surface of the wafer. To prevent the occurrence of such contaminants, one solution is to use separate load lock chambers (110) to transfer the wafer and the consumable part separately. Although this method may be feasible, it may severely affect wafer throughput because only one of the two load lock chambers (110) will be available to move the wafer.

[0104] To maintain wafer throughput and prevent potential wafer contamination, an alternative solution in one embodiment is to allow available load lock chambers (110) within the cluster tool assembly (100) to be used to move new and used consumable parts (208), as well as wafers before processing and wafers after processing. For example, in one embodiment, the upper support finger (902a) and the lower support finger (902b) may provide separate receiving areas for the consumable parts and the wafers. In this embodiment, a plurality of contact pads provided in the finger assemblies allow the contact surface of the wafer to be maintained at a height separated from the contact surface of the consumable part. In the case of a consumable part in the form of a ring (i.e., an edge ring), wafer surface contamination can be prevented or minimized by maintaining the contact surface of the ring at a height different from the wafer contact surface.

[0105] FIG. 10d illustrates an enlarged view of a finger assembly (902) within a load lock chamber (110) used to support both a wafer and a consumable part in one embodiment. An indentation (908) is formed on the upper surface of a lower support finger (902b). One or more consumable contact pads (906) are placed within the indentation (908) to receive a consumable part (208), and one or more substrate contact pads (904) are placed near the tips of the support fingers (902a, 902b) to receive a wafer. On the lower support finger (902b), in one embodiment, consumable contact pads (906) for receiving a consumable part are positioned at a distance equal to the radius of at least the consumable part (208) from the center of the support mechanism, and substrate contact pads (904) for receiving a wafer are positioned at a distance equal to the radius of at least the wafer from the center of the support mechanism. The consumable contact pads (906) positioned within the indent (908) of the plurality of finger assemblies (902) form a ring receiving plane (911) for receiving the consumable part (208), and the substrate contact pads (904) positioned on the finger assemblies (902) form a wafer receiving plane (913) for receiving the wafer. The indent (908) causes the ring receiving plane (911) to be positioned at a different height from the wafer receiving plane (913) and separates the contact supporting surface for the wafer from the contact supporting surface of the consumable part. This separation of the contact supporting surface is designed to protect the surface of the wafer from contamination by preventing the wafer from coming into contact with any part of the contact supporting surface used to receive the consumable part. In one embodiment, the ring receiving plane (911) is at a lower height (h1) than the wafer receiving plane (913) (h2) (i.e., height h1 < h2). In one embodiment, the difference between h2 and h1 is at least greater than the height of the consumable part (208).In another embodiment, the height is h1 > h2 such that the wafer is received at a lower height and the consumable part is received at a higher height while separating the wafer receiving surface from the consumable part receiving surface.

[0106] Of course, the finger assembly design illustrated in FIG. 10c and FIG. 10d is an example of keeping the contact surfaces of the wafer and the consumable part separated. Other designs may be adopted, including a finger assembly design where the height h1 > h2. In this design, cut-outs may be formed on the tips of the top surfaces of the support fingers (902a, 902b). The surface formed by the cut-outs may be used to accommodate substrate contact pads (904) for supporting the wafer, while the consumable part may be accommodated on consumable contact pads (906) formed within an indent (908) on the top surface of the bottom support finger (902b). In one embodiment, a wafer receiving surface for receiving a wafer at a distance from the center of the support mechanism (901), such as the radius of the wafer, may be defined, and a cut-out may be formed on the upper support finger and / or lower support finger (902a, 902b) so that substrate contact pads (904) may be provided on top to provide a reliable contact support surface for the wafer. Similarly, consumable contact pads provided within an indent (908) formed within the upper surface of the support fingers (902a, 902b) provide a contact support surface for consumable parts.

[0107] FIGS. 10e and FIGS. 10f illustrate exemplary airlock chambers before and after the redesign of the support mechanism (901) in some embodiments. The support mechanism (901) includes a plurality of finger assemblies redesigned to accommodate the transport of wafers as well as consumable parts. The redesigned finger assemblies provide a simple, easy, and cost-effective solution because they allow the consumable part (208) to be accommodated within the loadlock chamber (110) without the need to completely redesign the loadlock chamber (110). As illustrated in FIG. 10e, in order to fully accommodate the consumable part (208) on the lower support finger (902b) of the finger assembly within the support mechanism (901), the spacer block (905') must be redesigned to move away from the transport path of the consumable part. The conventional design illustrated in FIG. 10e shows a spacer block (905') that interferes when accommodating a consumable part on the lower support finger (902b). FIG. 10f illustrates an exemplary embodiment in which a redesigned spacer block (905) is engaged. The redesigned spacer block (905) is shown to be moved further away from the center of the airlock and closer to the side wall. As previously mentioned, the upper support finger and the lower support finger may be supported and separated by the redesigned spacer block (905) or alternatively by a finger support (not shown) that provides sufficient spacing for the consumable part to be fully accommodated in the lower support finger.

[0108] To fully accommodate the consumable part (208) on the upper support finger (902a), there must be sufficient vertical spacing to prevent interference caused by the inner edge radius of the load lock chamber (110), which may be experienced when the consumable part moves in and out of the load lock chamber (110). Finger assemblies are designed with these limitations in mind by providing at least a minimum spacing between the "exclusion zone" of the consumable part and the upper slot corner and lower slot corner of the load lock chamber. As used herein, the exclusion zone refers to a peripheral offset representing the stacking of the cross-section and tolerances of the largest consumable part design (e.g., outer diameter and height). The tolerance stacking includes positional error effects due to flattening, end effector deflection, robot arm trajectory, robot training, and other tolerance factors. The upper slot corner and lower slot corner are defined as the respective regions on the edges of the upper support finger and lower support finger of the support mechanism within the load lock chamber where the consumable part is accommodated. In some embodiments, the minimum gap defined between the exclusion zone and the slot edge is about 0.01" to about 0.03". In other embodiments, the minimum gap is about 0.025".

[0109] Finger assemblies (902) are designed so that there is at least a minimum nominal gap between the consumable part accommodated on the finger assemblies and the side wall (110a) of the load lock chamber (110). In some embodiments, the minimum nominal gap is designed to be about 5 mm to about 6 mm. In other embodiments, the minimum gap is about 5.4 mm. In some embodiments, the minimum nominal gap for the sides of the load lock chamber (110) is defined to account for a position offset or consumable part misplacement that can be corrected by the VTM robot using dynamic alignment input.

[0110] Additionally, the height of the spacer blocks (905) within the finger assemblies (902) should be defined to provide sufficient vertical spacing between the upper support finger (902a) and the lower support finger (902b) so that the consumable part received on the lower support finger (902b) may move in and out of the load lock chamber (110) without any interference. In some embodiments, the spacer blocks (905) within the finger assemblies (902) are designed to provide a minimum gap between the upper surface of the consumable part received on the lower support finger (902b) and the lower surface of the upper support finger (902a) to form a ring transfer plane for the consumable part to move accordingly. In some embodiments, the minimum gap is about 4 mm to 5 mm. In some embodiments, the vertical spacing defined by the gap is about 4.6 mm. In some embodiments, the vertical gap between the upper support finger and the lower support finger is designed to provide a minimum gap of at least about 2 mm to about 3 mm above and below the consumable part when transported in and out of the load lock chamber (110). In another embodiment, the vertical gap between the upper support finger and the lower support finger is designed to be at least about 2.3 mm above and below the consumable part to enable transport. In some embodiments, the vertical gap is defined to account for all payload deflection present in the end effector mechanism during transport.

[0111] In one embodiment, a high-level operation for replacing consumable parts within a cluster tool assembly (100) will now be discussed. As described with reference to FIGS. 3 and 3a, the cluster tool assembly (100) comprises one or more load ports on which a wafer loader (115) or a replacement station (108) is permanently or temporarily mounted, an ATM having a first robot for moving consumable parts and wafers, a load lock chamber, a VTM having a second robot, and one or more process modules. Consumable parts are placed within the process module and may need to be replaced periodically to effectively enable wafer processing.

[0112] In one embodiment, when a consumable part needs to be replaced within a process module, all process modules integrated with the VTM become idle. This means that there are no wafers in the cluster tool assembly except where a closed wafer loader is engaged. If a replacement station is temporarily mounted, at least one load port in the ATM is kept free without accommodating the replacement station (108). In this embodiment, the cluster tool assembly (100) is not configured for simultaneous handling of wafer processing and replacement of consumable parts. In an alternative embodiment, the cluster tool assembly may be configured to simultaneously handle both replacement of consumable parts and wafer processing. In this embodiment, access to various modules is coordinated to allow for the effective movement of consumable parts and wafers.

[0113] In one embodiment, a replacement station (108) having replacement consumable parts is mounted in a free load port within a cluster tool assembly (100). In one embodiment, this mounting is performed manually. In an alternative embodiment, this mounting is performed using a robot. In the embodiment illustrated in FIG. 3a, the FOUP type replacement station may be transferred in an automated manner using an AGV (Automatic Guided Vehicle) which may be part of an OHT (Overhead Hoist Transfer) or AMHS (Automated Material Handling System). In one embodiment, the AMHS is installed within a host manufacturing facility. In some embodiments, the AMHS may include an automated stocker in which the FOUP type replacement station and / or wafer loader is stored. To allow the appropriate replacement station or wafer loader to be retrieved from the stocker and mounted in a free load port within the cluster tool assembly, the AMHS may include tracking software to guide the OHT or AGV to the appropriate replacement station or wafer loader. In some embodiments, to pinpoint the location of a replacement station or wafer loader within the AMHS stocker, the OHT or AGV may be equipped with RFID (radio frequency identifier) ​​tag readers or barcode readers. In some embodiments, the stocker may include rows of replacement stations and / or wafer loaders. In these embodiments, software may guide the OHT or AGV to the appropriate row, and barcode readers or RFID tag readers may be used to identify a specific replacement station or wafer loader to retrieve from the row.In one example, therefore, the OHT or AGV may retrieve the replacement station and automatically mount it to an empty load port specified on the first side of the ATM of the cluster tool assembly.

[0114] When the replacement station (108) is mounted, a transfer sequence is initiated on the user interface of a computer that is communically connected to the cluster tool assembly. The transfer sequence causes the replacement station (108) to be loaded into the cluster tool assembly. In some embodiments, when the replacement station is loaded, consumable parts mapping is performed by the ATM robot (103). Mapping may be performed to provide dynamic alignment input so that the consumable parts can be aligned when moved into the load lock chamber.

[0115] Simultaneously or sequentially, the VTM robot (105) removes used consumable parts from the process module (112) within the cluster tool assembly (100) and transfers the used consumable parts (208) into the load lock chamber (110). The VTM robot (105) moves the consumable parts (208) using planar transfer by adjusting the lift pin motion within the process module (112). More information regarding the lift pin mechanism for removing consumable parts from the process module has been discussed with reference to FIG. 4. The VTM robot (105) places the used consumable parts (208) within the lower support finger (902b) of the finger assemblies (902). In some embodiments, both the upper support finger (902a) and the lower support finger (902b) may be used to transport used or new consumable parts (208). In one embodiment, the lower support finger (902b) may be used to receive only the used consumable part (208), and the upper support finger (902a) may be used to receive only the new consumable part (208), or vice versa. In other embodiments, the reception of the used consumable parts and the new consumable parts is not limited to a specific support finger among the support fingers, but may be received in either the upper support finger or the lower support finger (902a, 902b). Dynamic alignment is active within the load lock chamber (110) during the replacement of the consumable part (208).

[0116] Once the used consumable part (208) is placed within the support mechanism (901) of the load lock chamber (110), the airlocks vent the load lock chamber (110) to an environmental condition. Subsequently, the ATM robot (103) is activated to remove the consumable part (208) from the load lock chamber (110) and transfer the consumable part to the replacement station (108). In one embodiment, this may include the ATM robot (103) retrieving a ring carrier (i.e., carrier plate (1104)) from the replacement station (108) and using the ring carrier to retrieve the used consumable part from the load lock chamber (110). Subsequently, the ATM robot (103) picks a new consumable part (208) from the replacement station (108) and transfers it to the load lock chamber (110). After receiving a new consumable part (208), the load lock chamber (110) is pumped under vacuum. To pump the load lock chamber (110) under vacuum, in one embodiment, the load lock chamber (110) is coupled to be pumped through a vacuum control module (not shown) that interfaces with a controller. The controller is used to adjust the operation of the pump so that the load lock chamber (110) is pumped under vacuum when the new consumable part (208) is moved into the process module (112) through the VTM (104). Once the load lock chamber (110) is set to a vacuum state, the VTM robot (105) is operated to pick the consumable part (208) from the load lock chamber (110) and transport it to the process module (112). In one embodiment, access to the load lock chamber (110) is controlled through a gate valve interfacing between the VTM (104) and the load lock chamber (110).Similarly, access to the process module (112) via the VTM (104) may be controlled via a second gate valve, such as an isolation valve, as discussed with reference to FIG. 5c. The second gate valve may be operated using a sensor mechanism. Since dynamic alignment is active during the replacement of the consumable part (208), when the VTM robot (105) picks the consumable part (208) from the load lock chamber (110), the robot uses dynamic alignment correction to pick the consumable part (208) and place the consumable part inside the process module (112). The lift pin mechanism inside the process module (112) extends the lift pins to receive the consumable part (208), positions the consumable part (208) in an installed state, and then retracts the lift pins into a housing (e.g., a lift pin housing). In one embodiment, the replacement of consumable parts (208) in two or more process modules (112 to 120) (alternatively referred to as "process chambers") may be handled sequentially, one at a time, using this process.

[0117] FIG. 11 illustrates an exemplary replacement station (108) used to store new consumable parts and used consumable parts (208) in one embodiment. In one embodiment, the replacement station (108) may resemble the structure of a wafer loader and may include a part buffer (224) having a plurality of compartments (207) to store consumable parts (208). In one embodiment, the part buffer includes a "clean" or "new" consumable part section (1206) for receiving and storing new consumable parts (208), and a "dirty" or "worn" consumable part section (1208) for receiving and storing used and worn, possibly contaminated, consumable parts (208). A separator plate (1202) may be provided at a replacement station (108) to separate a clean consumable part section (1206) and a dirty consumable part section (1208). In one embodiment, a ring carrier in the form of a carrier plate (1104) may be stored in a housing provided within the replacement station. In one embodiment, the housing for the carrier plate (1104) may be provided within a clean or new consumable part section (1206). The housing for the carrier plate (1104) may be provided at the bottom, at the top, or somewhere between the bottom and top of the clean or new consumable part section (1206). In an alternative embodiment, the carrier plate (1104) may be housing within a dirty or worn consumable part section (1208). The housing for the carrier plate (1104) may be provided at the bottom, at the top, or somewhere between the bottom and top of the dirty or worn consumable part section (1208).In some embodiments, the replacement station (108) may house two carrier plates (1104)—a carrier plate in a clean or new consumable part section (1206) and another carrier plate in a dirty or worn consumable part section (1208)—so that new consumable parts and used consumable parts may be transported separately between the replacement station and the load lock chamber (110). In alternative embodiments, instead of or in addition to the replacement station (108), one or more sections may be defined within the ATM (102) to store used consumable parts and new consumable parts. In these embodiments, consumable parts may be transferred and removed from the ATM (102) using a robot within the ATM (102) and the replacement station (108), or using other means of transfer and removal.

[0118] FIG. 12 illustrates an exemplary slot view into a process module in which a consumable part is accommodated in one embodiment. The consumable part is accommodated, for example, along a ring transfer plane (RTP) (1301) located over a set of chamber interface pins (1308) within the process module (112). In some embodiments, the RTP (1301) is defined to be located over the chamber interface pins (CIPs) (1308). In certain embodiments, the height of the consumable part above the top surface of an electrostatic chuck (ESC) placed within the process module (112) is defined to allow sufficient clearance for the consumable part to move in and out of the process module (112) without any interference. In these embodiments, the clearance ensures that the consumable part, an end effector mechanism with an arm set, can be fitted through the slot opening of the process module (112). Since the slot opening is designed for wafer transfers, the size of the consumable part may be limited by the slot size. When a wider consumable part is transported, instead of redesigning the slot opening, the segmented consumable part may be used to fit into the existing slot opening of the process module (112). In certain examples, the relative height of the ESC biases the consumable part toward the top of the slot. Due to the specific size of the slot corner radius, there may be a trade-off between the height and diameter of the consumable part. To ensure that sufficient gaps are found throughout, tolerance zones may be defined around the consumable part and the robot to represent the combined volume during transport. The tolerance zones must account for load bias effects, robot arm trajectory errors, flattening error effects, and other factors. In some embodiments, the gaps above, below, and on the sides of the nominal ring transport path may be as small as a few millimeters.

[0119] In some embodiments, the RTP is different from the WTP (wafer transfer plane). In these embodiments, the WTP is defined to be on the CIPs (1308) and the RTP when the wafer is transferred in and out of the process module (112). In some embodiments, the minimum gap is defined between the inner corner radius (1306) of the opening into the process module (112) into which the wafer and consumable parts are transported and the exclusion zone (1304) of the consumable parts (208). In some embodiments, the minimum gap may be several millimeters in size. This minimum gap allows the consumable parts to be moved in and out of the process module (112) without any part of the process module (112) interfering with the transfer of the consumable parts.

[0120] Various embodiments are described defining end effector mechanisms employed within the robots of ATM (102) and VTM (104) used to transport wafers in order to also transport consumable parts. In some embodiments, the end effector mechanism is redesigned so that the finger assembly extends beyond the edge of the wafer to allow support of consumable parts. In alternative embodiments, the conventional end effector mechanism is used to transport consumable parts. In these embodiments, a fixture in the middle of the shape of the ring carrier is temporarily used during consumable part transport to support consumable parts, since the conventional end effector mechanism is not designed to support consumable parts. The finger assemblies within the load lock chamber are redesigned to support consumable parts. The redesigned end effector mechanism and finger assembly have multiple contact pads to define mutually exclusive contact points for consumable parts and wafers to prevent cross-contamination. Contact pads (consumable contact pads, wafer contact pads) may be designed to provide contact points at different heights or radial distances to achieve exclusive separation within the expected wafer or consumable part position error.

[0121] Consumable parts may often exceed the wafer's diameter, thickness, and weight. Therefore, the addition of consumable part transfer to tools not originally designed for such transfer is limited by the gaps within the existing hardware. Additional payload-induced deflection further reduces these gaps. Thus, to accommodate increased payload and reduce deflection, the end effector mechanism may be made of higher stiffness materials, such as ceramics, to limit increases in deflection or thickness while reducing the total payload on the robot using a redesigned end effector mechanism. Various contact pads (wafer, consumable contact pads) are defined on the surface of the finger assembly within the end effector mechanism to support consumable parts within expected positional error ranges and possibly with variable bottom surface profiles. The same alignment inputs used to center wafers may also be used to position and center consumable parts. Consumable parts are transferred to the cluster tool assembly via a standard wafer FOUP load port defined within the ATM and removed from the cluster tool assembly. The replacement station used to deliver and remove consumable parts is designed to be similar to the FOUP design used to deliver wafers. The replacement station can be temporarily mounted to the load port of the ATM either manually or by an automated system, such as an overhead track FOUP delivery system. This temporary mounting allows for the replacement of consumable parts without displace or consuming other wafer storage units or processing hardware on the ATM (i.e., wafer buffers, cooling stations, integrated instrumentation, etc.).In alternative embodiments, consumable parts may be received into the ATM via a replacement station, temporarily stored within the ATM separated from the load port, and retrieved when the consumable parts need to be replaced. The various embodiments described herein provide an efficient and cost-effective method for replacing consumable parts within a cluster tool assembly without destroying the vacuum seal, thereby enabling the cluster tool assembly to have shorter downtime. The reduced downtime of the cluster tool assembly will result in improved wafer throughput.

[0122] FIG. 13 illustrates a control module (also referred to as a “controller”) (220) for controlling the cluster tool assembly described above. In one embodiment, the controller (220) may include some exemplary components such as a processor, memory and one or more interfaces. The controller (220) may be employed to control devices within the cluster tool assembly (100) based partially on sensed values. Only for example, the controller (220) may control one or more of valves (602) (including isolation valves (216, 216’) of FIG. 5a, FIG. 5b, FIG. 5c), filter heaters (604), pumps (606) (including pump (233)), and other devices (608) based on sensed values ​​and other control parameters. The controller (220) receives values ​​sensed from, for example, pressure manometers (610), flow meters (612), temperature sensors (614), and / or other sensors (616). The controller (220) may also be employed to control process conditions during precursor delivery and film deposition. The controller (220) will typically include one or more memory devices and one or more processors.

[0123] The controller (220) may control the activities of the precursor delivery system and the deposition apparatus. The controller (220) executes computer programs including sets of instructions for controlling process timing, delivery system temperature, pressure differences across filters, valve positions, robots and end effectors, mixtures of gases, chamber pressure, chamber temperature, wafer temperature, RF power levels, wafer chuck or pedestal positions, and other parameters of a specific process. The controller (220) may also monitor pressure differences and automatically switch vapor precursor delivery from one or more paths to one or more other paths. Other computer programs stored on memory devices associated with the controller (220) may be employed in some embodiments.

[0124] Typically, there will be a user interface associated with a controller (220). The user interface may include a display (618) (e.g., a display screen of device and / or process conditions and / or graphic software displays) and user input devices (620) such as pointing devices, keyboards, touch screens, microphones, etc.

[0125] Computer programs for controlling the transfer, deposition, and other processes of precursors in a process sequence may be written in any conventional computer-readable programming language, such as assembly language, C, C++, Pascal, Fortran, or others. Compiled object code or scripts are executed by a processor to perform tasks identified within the program.

[0126] The parameters of the control module (i.e., controller) relate to plasma conditions such as filter pressure differences, process gas composition and flow rates, temperature, pressure, RF power levels and low-frequency RF frequencies, cooling gas pressure, and process conditions such as chamber wall temperature.

[0127] System software may be designed or configured in many different ways. For example, various chamber component subroutines or control objects may be written to control the operation of chamber or process module components necessary to perform the deposition processes of the present invention. Examples of programs or sections of programs for this purpose include substrate positioning code, process gas control code, pressure control code, heater control code, plasma control code, lift mechanism control code, robot position code, end effector position code, and valve position control code.

[0128] A substrate positioning program may include program code for controlling chamber components used to load a substrate onto a pedestal or chuck and to control the gap between the substrate and other parts of the chamber, such as a gas inlet and / or target. A process gas control program may include code for controlling gas composition and flow rates, and for selectively flowing gas into the chamber prior to deposition to stabilize pressure within the chamber. A filter monitoring program includes code for comparing measured difference(s) with predetermined value(s) and / or code for switching paths. A pressure control program may include code for controlling pressure within the chamber, for example, by adjusting a throttle valve in the chamber's exhaust system. A heater control program may include code for controlling current to heating units to heat components within the precursor delivery system, the substrate, and / or other parts of the system. Alternatively, a heater control program may control the delivery of a heat transfer gas, such as helium, to the wafer chuck. Valve position control code may include code for controlling access to a process module or cluster tool assembly by controlling isolation valves that provide access to the process module or cluster tool, for example. Lift mechanism control code may include code for operating an actuator drive unit to cause actuators to move lift pins, for example. Robot position code may include code for manipulating the position of robot(s), including manipulation of the robot to move along a lateral, vertical, or radial axis, for example. End effector position code may include code for manipulating the position of an end effector, including manipulation of the robot to extend, retract, or move along a lateral, vertical, or radial axis, for example.

[0129] Examples of sensors that may be monitored during deposition include, but are not limited to, mass flow control modules, pressure sensors such as pressure manometers (610), and thermocouples, pedestals, or chucks (e.g., temperature sensors (614)) located within the delivery system. Appropriately programmed feedback and control algorithms may be used in conjunction with data from these sensors to maintain targeted process conditions. The foregoing describes embodiments of the invention in a single or multi-chamber semiconductor processing tool.

[0130] The various embodiments described herein allow consumable parts to be replaced in a rapid and efficient manner without opening the cluster tool assembly to standby states. As a result, the time required to replace consumable parts, as well as any risk of contaminating the chamber during replacement, is significantly reduced, thereby bringing the cluster tool assembly online more quickly. Additionally, the risk of unintended damage to the process module, the consumable parts, and other hardware components within the process module is significantly reduced.

[0131] The foregoing description of the embodiments is provided for illustrative and technical purposes only. It is not intended to exhaustively or limit the invention. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but may be interchangeable or used in selected embodiments where applicable, even if not specifically illustrated or described. The same may also be varied in many ways. Such variations are not to be considered deviations from the invention, and all such modifications are intended to be included within the scope of the invention.

[0132] Although the foregoing embodiments are described in some detail for the sake of clarity of understanding, it will be apparent that specific changes and modifications may be made within the scope of the appended claims. Accordingly, the embodiments are to be considered as exemplary rather than restrictive, and are not limited to the details given herein, but may be modified within the scope and equivalents of the claims.

Claims

Claim 1 A front opening ring pod (FORP) for holding consumable parts used in a processing tool, comprising: a plurality of compartments for holding consumable parts in a vertically stacked orientation within the FORP; a plurality of ledges disposed along the inner side walls of the FORP, wherein the plurality of ledges provide shelves for supporting the consumable parts in the vertically stacked orientation; and a separator plate disposed within the FORP, wherein the separator plate provides a horizontal plane dividing the inner region of the FORP into an upper region and a lower region such that each of the upper region and the lower region comprises a group of the shelves for holding the consumable parts. Claim 2 A front-opening ring pod according to claim 1, wherein the side wall of the FORP comprises an opening having a door frame, said opening configured to receive a door and said opening sized to provide in and out access to said consumable parts. Claim 3 A front-opening ring pod according to claim 1, wherein the upper region is configured to store consumable parts to be delivered to one or more process modules of the processing tool, and the lower region is configured to store consumable parts recovered from the one or more process modules of the processing tool. Claim 4 In claim 1, the FORP is a front-opening ring pod defined by a shell. Claim 5 In claim 4, the plurality of regs are a front-open ring pod disposed within the inner side walls of the shell of the FORP. Claim 6 In claim 1, a front-opening ring pod, wherein each of the consumable parts is an edge ring configured to surround a substrate support of one or more process modules of the processing tool. Claim 7 In claim 1, the FORP is a front-opening ring pod configured to interface with a load port coupled to a standby transfer module of the processing tool. Claim 8 A front-opening ring pod according to claim 1, further comprising a carrier plate receiving structure defined on the upper surface of the separator plate, wherein the carrier plate receiving structure is configured to store a carrier plate used to move the consumable parts into and out of the FORP. Claim 9 In claim 8, the group of shelves along the inner sides of the upper region is positioned starting at a height greater than the height of the carrier plate receiving structure, in a front-opening ring pod. Claim 10 In claim 8, a front-opening ring pod further comprising a second carrier plate receiving structure defined on the upper surface of the base of the FORP, wherein the second carrier plate receiving structure is configured to store a second carrier plate used to move the consumable parts into the FORP. Claim 11 In claim 10, the group of shelves along the inner sides of the lower region is positioned starting at a height greater than the height of the second carrier plate receiving structure, in a front-opening ring pod. Claim 12 A front opening ring pod (FORP) for holding consumable parts used in a processing tool, comprising: a plurality of compartments for holding consumable parts in a vertically stacked orientation within the FORP; a plurality of regs arranged vertically along the inner lateral sidewalls and inner rear sidewalls of the FORP and defining shelves for supporting consumable parts in the vertically stacked orientation; an opening having a door frame provided on the front sidewall of the FORP, wherein the opening is configured to receive a door and the opening is sized to provide inward and outward access to the consumable parts held within the FORP; and a separator plate disposed within the FORP, wherein the separator plate provides a horizontal plane dividing the inner area of ​​the FORP into an upper area and a lower area, and each of the upper area and the lower area includes a group of shelves for holding the consumable parts. Claim 13 delete Claim 14 In claim 12, each of the consumable parts is an edge ring configured to surround a substrate support of one or more process modules of the processing tool, a front-opening ring pod. Claim 15 A front-open ring pod, wherein the rear sidewall of the FORP is contoured, and the contour is defined by a rear portion oriented parallel to the front sidewall of the FORP and an angled portion extending between each of the lateral sidewalls and the rear portion. Claim 16 In claim 12, a front-opening ring pod further comprising a carrier plate receiving structure disposed within the upper region used to store consumable parts to be transferred to one or more process modules within the processing tool, wherein the carrier plate receiving structure is configured to store a carrier plate used to move the consumable parts from the FORP. Claim 17 In claim 16, the carrier plate receiving structure is a front-open ring pod disposed on the upper surface of the separator plate or on the lower surface of the upper surface of the FORP. Claim 18 A front-opening ring pod according to claim 16, further comprising a second carrier plate receiving structure disposed within the lower region used to store consumable parts recovered from one or more process modules, wherein the second carrier plate receiving structure is configured to store a second carrier plate used to move the consumable parts into the FORP. Claim 19 In claim 18, the second carrier plate receiving structure is a front-open ring pod disposed on the upper surface of the base of the FORP or on the lower surface of the separator plate. Claim 20 In claim 12, the FORP is defined by a shell, and the plurality of regs are disposed within the inner lateral sidewalls and the inner rear sidewall of the shell of the FORP, a front-open ring pod.

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